A method and device for detecting the glue thickness of a chip-on-board packaging module and related equipment

Abstract

The application provides a glue coating thickness detection method and device for a chip-on-board packaging module and related equipment. According to the technical solution of the application, the laser transmitter is controlled to emit laser at the initial position of the circuit board to be detected, and the circuit board to be detected is controlled to move to the target position, so that the image data of the circuit board to be detected is collected to obtain a collection image. Thus, the glue layer thickness corresponding to each glue coating layer on the circuit board to be detected is calculated based on the collection image, so that each glue coating layer can be regulated and controlled according to the glue layer thickness, and accurate control of the glue layer thickness on the circuit board to be detected is achieved.

Description

Technical Field

[0001] This application relates to the field of display panel manufacturing technology, specifically to a method, apparatus, and related equipment for detecting the coating thickness of chip packaging modules on a board. Background Technology

[0002] With technological breakthroughs and reduced mass production costs, global light-emitting diode (LED) display technology is rapidly developing towards higher density. While chip-on-board (COB) direct-view displays offer advantages such as high density, high protection, high adaptability, high image quality, long lifespan, and low operating costs, they also face challenges including high technical difficulty, difficulty in yield control, poor ink color consistency, complex inspection and rework, and high manufacturing costs. Furthermore, as LED chip sizes continue to shrink, welding strength decreases accordingly, severely impacting the stability of subsequent product production. To address this issue, existing technologies typically employ a primer coating process, where transparent adhesive is sprayed between LED chips (in the channel area) / on the surface to enhance chip fixation strength. However, this process generally suffers from uneven adhesive layer thickness, localized missed coatings, or adhesive buildup, making precise control of adhesive amount and uniformity difficult. Summary of the Invention

[0003] This application provides a method, apparatus, and related equipment for detecting the adhesive coating thickness of on-board chip packaging modules, which solves the problem in related technologies that the adhesive coating thickness of on-board chip packaging modules cannot be accurately controlled.

[0004] To solve the above problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application provide a method for detecting the adhesive coating thickness of a chip packaging module on an on-board assembly, the method comprising:

[0006] A circuit board to be tested is obtained, the circuit board to be tested is provided with multiple LED chips and multiple adhesive layers, the multiple adhesive layers are disposed between any two LED chips;

[0007] The laser emitter is controlled to emit a detection laser towards the initial position of the circuit board to be tested, and the circuit board to be tested is controlled to move so that the detection laser irradiates the target position of the circuit board to be tested, thereby obtaining an image. The image includes image data received by the camera from the laser reflected by the circuit board to be tested during the movement of the detection laser.

[0008] Based on the acquired images, the thickness of the adhesive layers of the plurality of coating layers is calculated to obtain a plurality of adhesive layer thickness values, and the plurality of adhesive layer thickness values ​​correspond one-to-one with the plurality of coating layers.

[0009] Optionally, the calculation of the adhesive layer thickness of the plurality of adhesive layers based on the acquired image to obtain a plurality of adhesive layer thickness values ​​includes:

[0010] Based on the laser emitter, the circuit board to be tested, and the camera, calculation data is obtained. The calculation data includes a distance value, an incident angle, an observation angle, and a focal length. The distance value is the reference distance between the laser emitter and the camera. The incident angle is the angle between the laser and the circuit board to be tested. The observation angle is the angle between the laser and the circuit board to be tested after reflection on the circuit board. The focal length is the focal length of the camera.

[0011] The adhesive layer thickness of the multiple coating layers is calculated based on the calculated data and the acquired images to obtain multiple adhesive layer thickness values.

[0012] Optionally, the step of calculating the adhesive layer thickness of the plurality of adhesive layers based on the calculated data and the acquired image to obtain a plurality of adhesive layer thickness values ​​includes:

[0013] Based on the acquired image, a plurality of pixel offsets corresponding to the plurality of adhesive layers are determined, wherein the pixel offsets are used to represent the pixel distance corresponding to each adhesive layer;

[0014] Based on the multiple pixel offsets and the calculated data, the thickness of the adhesive layers of the multiple coating layers is calculated by triangulation to obtain multiple adhesive layer thickness values.

[0015] Optionally, determining the pixel offsets corresponding to the multiple adhesive layers based on the acquired image includes:

[0016] The acquired image is preprocessed to obtain the target image. The preprocessing includes at least one of the following: noise removal processing, contrast enhancement processing, and grayscale processing.

[0017] Based on the Gaussian fitting algorithm and / or the centroid algorithm, the center position corresponding to the laser is determined, and the center position coordinates are obtained.

[0018] Using the center position coordinates as a reference, determine the pixel offsets corresponding to the multiple adhesive layers in the target image.

[0019] Optionally, after calculating the adhesive layer thickness of the plurality of adhesive layers based on the acquired image to obtain multiple adhesive layer thickness values, the method further includes:

[0020] A 3D point cloud map corresponding to the circuit board to be tested is generated based on the multiple adhesive layer thickness values.

[0021] Based on the 3D point cloud map, generate multiple adhesive height maps corresponding to the multiple adhesive layers;

[0022] Based on the multiple adhesive height maps, defect detection is performed on the multiple adhesive layers to determine the target adhesive layer, which is the adhesive layer among the multiple adhesive layers that has adhesive defects;

[0023] The target adhesive layer is processed according to the defect type of the target adhesive layer.

[0024] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0025] If, among the plurality of adhesive height maps, there is a first target adhesive height map whose height is less than a first preset threshold, the adhesive layer corresponding to the first target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is a leak defect.

[0026] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0027] Calculate the volume of adhesive missing from the target adhesive layer;

[0028] Based on the missing volume of the target adhesive layer, the target adhesive layer is replenished with adhesive.

[0029] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0030] If, among the plurality of adhesive height maps, there is a second target adhesive height map whose height is greater than a second preset threshold, the adhesive layer corresponding to the second target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is an accumulation defect.

[0031] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0032] Calculate the adhesive volume of the target adhesive layer;

[0033] Based on the volume of adhesive deposited in the target adhesive layer, the target adhesive layer is removed.

[0034] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0035] If the difference between the height of the third target adhesive height map and the average height of the multiple adhesive height maps is greater than a third preset threshold, the adhesive layer corresponding to the third target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is non-uniformity.

[0036] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0037] Analyze the height distribution data of the target adhesive layer;

[0038] Based on the height distribution data, the target adhesive layer is smoothed.

[0039] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0040] If the height gradient of the fourth target adhesive height map is greater than the fourth preset threshold among the multiple adhesive height maps, the adhesive layer corresponding to the fourth target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is adhesive breakage.

[0041] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0042] Locate the break point of the target adhesive layer;

[0043] Based on the location of the missing adhesive in the target adhesive layer, the target adhesive layer is repaired with adhesive.

[0044] Secondly, embodiments of this application also provide a device for detecting the adhesive coating thickness of an on-board chip packaging module, the device comprising:

[0045] An acquisition module is used to acquire a circuit board to be tested, the circuit board to be tested being provided with multiple LED chips and multiple adhesive layers, the multiple adhesive layers being disposed between any two of the LED chips;

[0046] The control module is used to control the laser emitter to emit a detection laser towards the initial position of the circuit board to be tested, and to control the circuit board to be tested to move so that the detection laser irradiates the target position of the circuit board to be tested, thereby obtaining an image. The image includes image data received by the camera from the detection laser as it passes through the circuit board to be tested during the movement of the circuit board to be tested.

[0047] The calculation module is used to calculate the adhesive thickness of the multiple adhesive layers based on the acquired image, and obtain multiple adhesive thickness values, wherein each of the multiple adhesive thickness values ​​corresponds one-to-one with the multiple adhesive layers.

[0048] Thirdly, this application also provides an electronic device, including a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the steps of the method described in the first aspect above.

[0049] Fourthly, this application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the method described in the first aspect above.

[0050] Fifthly, this application also provides a computer program product, including computer instructions that, when executed by a processor, implement the steps of the method described in the first aspect above.

[0051] This application provides a method, apparatus, and related equipment for detecting the adhesive coating thickness of an on-board chip packaging module. The method includes: acquiring a circuit board to be tested, the circuit board to be tested having multiple LED chips and multiple adhesive coating layers, the multiple adhesive coating layers being disposed between any two LED chips; controlling a laser emitter to emit a detection laser towards an initial position of the circuit board to be tested, and controlling the circuit board to be tested to move so that the detection laser irradiates a target position of the circuit board to be tested, obtaining an acquired image, the acquired image including image data of the laser reflected by the circuit board to be tested as the detection laser moves through the circuit board to be tested; calculating the adhesive coating thickness of the multiple adhesive coating layers based on the acquired image to obtain multiple adhesive coating thickness values, the multiple adhesive coating thickness values ​​corresponding one-to-one with the multiple adhesive coating layers.

[0052] The embodiments of this application have the following beneficial effects:

[0053] The technical solution of this application controls a laser emitter to emit a laser at an initial position on the circuit board to be tested, and controls the circuit board to be tested to move to a target position, thereby acquiring image data of the circuit board to be tested and obtaining an image. Then, the thickness of each adhesive layer on the circuit board to be tested is calculated based on the acquired image. Thus, the thickness of each adhesive layer can be adjusted according to the adhesive layer thickness, thereby achieving accurate control of the adhesive layer thickness on the circuit board to be tested. Attached Figure Description

[0054] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0055] Figure 1 This is a flowchart illustrating the method for detecting the adhesive thickness of the chip packaging module on the board in an embodiment of this application;

[0056] Figure 2 This is a schematic diagram illustrating the formation of the adhesive layer by the primer in an embodiment of this application;

[0057] Figure 3 This is a schematic diagram of scanning the thickness of the adhesive layer in an embodiment of this application;

[0058] Figure 4 This is a schematic diagram of the adhesive thickness detection device for the chip packaging module on the board in this application embodiment;

[0059] Figure 5 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0060] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0061] The terms "first," "second," etc., used in the embodiments of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices. Additionally, the use of "and / or" in this application indicates at least one of the connected objects, such as A and / or B and / or C, representing seven possibilities: including A alone, B alone, C alone, and the presence of both A and B, both B and C, both A and C, and the presence of A, B, and C.

[0062] This application addresses the problem in related technologies where the adhesive coating thickness of on-board chip packaging modules cannot be precisely controlled, by providing a method for detecting the adhesive coating thickness of on-board chip packaging modules, such as... Figure 1 As shown, the steps of this method include:

[0063] Step 101: Obtain the circuit board to be tested. The circuit board to be tested is provided with multiple LED chips and multiple adhesive layers. The multiple adhesive layers are disposed between any two LED chips.

[0064] In this embodiment, the circuit board to be tested is a printed circuit board (PCB), on which multiple LED chips are spaced apart. To ensure the stability and efficiency of module production, the soldering between the LED chips and the PCB substrate must be strong and reliable. Therefore, in related technologies, a primer coating process is generally used, such as... Figure 2 As shown, Figure 2 This is a schematic diagram of the formation of the adhesive layer by the base coat adhesive in this embodiment. Transparent adhesive is sprayed on the gap (i.e., the channel area) / surface of the LED chips to enhance the chip fixing strength, thereby forming multiple adhesive layers, that is, each adhesive layer is set between any two LED chips.

[0065] Step 102: Control the laser emitter to emit a detection laser towards the initial position of the circuit board to be tested, and control the circuit board to be tested to move so that the detection laser irradiates the target position of the circuit board to be tested, thereby obtaining an image. The image includes image data of the detection laser reflected by the circuit board to be tested as the detection laser moves.

[0066] In this embodiment, as Figure 3 As shown, Figure 3 This is a schematic diagram of scanning the thickness of the adhesive coating. In this diagram, the laser emitter and the camera are positioned differently. The laser emitter emits a detection laser towards the initial position of the circuit board to be tested and controls the circuit board to be tested to move horizontally, so that the laser can scan each adhesive coating layer on the circuit board to be tested. Finally, the circuit board to be tested is moved so that the detection laser irradiates the target position of the circuit board to be tested, thereby obtaining a complete image.

[0067] It should be noted that the initial position in this embodiment is generally set at the rightmost position of the circuit board to be tested, for example... Figure 3 The rightmost LED chip is located at the far right end of the circuit board to be tested. The target position is usually set at the far left of the circuit board to be tested, for example... Figure 3 The leftmost LED chip is located at the left end. Therefore, by setting the initial and target positions, the laser can scan each coating layer, enabling the detection of each coating layer.

[0068] Specifically, 2. A laser emitter projects a red linear beam of light across the LED channel area onto the PCB surface. When the laser shines on the adhesive surface at different heights, the reflected light will produce different positional shifts. A tilted linear scan camera continuously captures images of this laser line at a high frequency, while the PCB moves at a constant speed. Each time the camera captures height information, the pixel offset is converted into the actual height value through the principle of triangulation. As the PCB moves, the system scans and records data line by line to obtain the acquired images.

[0069] Step 103: Calculate the adhesive thickness of the multiple adhesive layers based on the acquired image to obtain multiple adhesive thickness values, and the multiple adhesive thickness values ​​correspond one-to-one with the multiple adhesive layers.

[0070] In this embodiment, the acquired image is the image reflected by the circuit board to be inspected received by the camera. A heat map of adhesive layer thickness distribution can be generated based on the acquired image. Therefore, the heat map of adhesive layer thickness distribution can accurately identify defective areas such as missed coating, thin coating, and adhesive buildup. Based on the deviation information fed back by the heat map, the dispensing path, dispensing speed, and dispensing amount of subsequent modules are automatically adjusted, thereby achieving a significant improvement in the uniformity of the base coating and precise control of the adhesive amount.

[0071] The technical solution of this application controls a laser emitter to emit a laser at an initial position on the circuit board to be tested, and controls the circuit board to be tested to move to a target position, thereby acquiring image data of the circuit board to be tested and obtaining an image. Then, the thickness of each adhesive layer on the circuit board to be tested is calculated based on the acquired image. Thus, the thickness of each adhesive layer can be adjusted according to the adhesive layer thickness, thereby achieving accurate control of the adhesive layer thickness on the circuit board to be tested.

[0072] In some embodiments, optionally, the calculation of the adhesive layer thickness of the plurality of adhesive layers based on the acquired image to obtain a plurality of adhesive layer thickness values ​​includes:

[0073] Based on the laser emitter, the circuit board to be tested, and the camera, calculation data is obtained. The calculation data includes a distance value, an incident angle, an observation angle, and a focal length. The distance value is the reference distance between the laser emitter and the camera. The incident angle is the angle between the laser and the circuit board to be tested. The observation angle is the angle between the laser and the circuit board to be tested after reflection on the circuit board. The focal length is the focal length of the camera.

[0074] The adhesive layer thickness of the multiple coating layers is calculated based on the calculated data and the acquired images to obtain multiple adhesive layer thickness values.

[0075] In this embodiment, during the calculation of the adhesive layer thickness of multiple coating layers, it is necessary to first obtain relevant calculation data. This data includes distance values, incident angle, observation angle, and focal length. Specifically, the distance value is the reference distance between the laser emitter and the camera, i.e. Figure 3 The distance from the laser emission point to the camera after reflection is the distance the laser travels. The angle of incidence is the angle between the laser and the circuit board under test, i.e., the angle between the laser after emission and the PCB circuit board (taken as an acute angle). The observation angle is the angle between the laser after reflection on the circuit board and the circuit board under test, i.e., the angle between the reflected laser and the PCB circuit board (taken as an acute angle). The focal length is the camera's focal length.

[0076] After obtaining the calculation data, a distribution heat map is generated by converting the calculation data and the acquired image. The thickness of the adhesive layer for each of the multiple coating layers is then calculated to obtain the adhesive layer thickness value for each coating layer.

[0077] Optionally, the step of calculating the adhesive layer thickness of the plurality of adhesive layers based on the calculated data and the acquired image to obtain a plurality of adhesive layer thickness values ​​includes:

[0078] Based on the acquired image, a plurality of pixel offsets corresponding to the plurality of adhesive layers are determined, wherein the pixel offsets are used to represent the pixel distance corresponding to each adhesive layer;

[0079] Based on the multiple pixel offsets and the calculated data, the thickness of the adhesive layers of the multiple coating layers is calculated by triangulation to obtain multiple adhesive layer thickness values.

[0080] In this embodiment, when calculating the thickness of the adhesive layer of multiple coating layers based on the calculated data and the acquired images, it is also necessary to determine the pixel offset corresponding to each coating layer based on the acquired images. The pixel offset is used to represent the pixel distance corresponding to each coating layer, such as the pixel distance corresponding to each coating layer in the heat map.

[0081] Specifically, based on the laser incident angle and the parameters of the tilted linear array camera, a triangulation formula adapted to the dense arrangement of micro LED chips was designed to convert the sub-pixel offset of the laser stripes into the corresponding adhesive layer height, thereby realizing micron-level three-dimensional height calculation.

[0082] Height calculation: ≈ .

[0083] Where: L = reference distance (distance from laser to camera), =Laser incident angle, =Camera viewing angle, Z =Height of measurement point =Pixel offset, f =Focal length;

[0084] This embodiment uses the principle of laser triangulation, which uses a linear array camera to capture the reflection offset of the laser line on the adhesive surface in real time, and obtains the three-dimensional height distribution data of the adhesive layer, so as to achieve full-area quantitative detection with micron-level precision.

[0085] Optionally, determining the pixel offsets corresponding to the multiple adhesive layers based on the acquired image includes:

[0086] The acquired image is preprocessed to obtain the target image. The preprocessing includes at least one of the following: noise removal processing, contrast enhancement processing, and grayscale processing.

[0087] Based on the Gaussian fitting algorithm and / or the centroid algorithm, the center position corresponding to the laser is determined, and the center position coordinates are obtained.

[0088] Using the center position coordinates as a reference, determine the pixel offsets corresponding to the multiple adhesive layers in the target image.

[0089] In this embodiment, after obtaining the acquired image, it is necessary to preprocess the acquired image to obtain the target image. The original acquired image has problems such as noise, low contrast, and color redundancy. Preprocessing is to improve the recognizability of laser features and provide a clean input for subsequent center positioning.

[0090] The preprocessing includes noise removal, contrast enhancement, and grayscale processing. Specifically, noise removal eliminates sensor noise, ambient light interference, and random speckles, and can be achieved through Gaussian filtering, median filtering, and bilateral filtering. Contrast enhancement increases the grayscale difference between the laser area and the background, making the laser stand out more, and can be achieved through gamma correction and linear stretching. Grayscale processing converts the RGB color image to a single-channel grayscale image, reducing computational load, and can be performed using methods such as weighted averaging.

[0091] In the preprocessed image, the sub-pixel-level center coordinates of the laser are accurately located. This can be achieved, for example, by using a Gaussian fitting algorithm and / or a centroid algorithm to determine the center position of the laser. Specifically, the Gaussian fitting algorithm fits the gray-level distribution of the laser spot to a two-dimensional Gaussian function and calculates the peak center using the fitting parameters. The centroid algorithm calculates the average coordinates of each pixel within the laser region based on its gray-level value.

[0092] After determining the center coordinates of the laser, the positional deviation of the adhesive layer is converted into a pixel offset in the image coordinate system. Using the laser center as a reference point, the magnitude and inversion of the pixel offset corresponding to each adhesive layer can be used to determine whether the adhesive coating meets the requirements.

[0093] Specifically, the process is explained in detail below. Initialization is performed, pre-defined process parameters are loaded, and the laser emitter, linear scan camera, and motion control module are started sequentially. This ensures that all modules work collaboratively in a unified sequence, avoiding data loss or equipment conflicts due to incorrect startup order, and improving the stability and repeatability of system startup. Hardware self-testing verifies the functionality of key components such as laser power output, camera signal acquisition, and motion axis response, promptly detecting hardware anomalies and intercepting unqualified states to prevent false or missed detections due to equipment failure, ensuring the reliability of subsequent test data. After successful self-testing, the system automatically executes a calibration procedure, using standard samples to obtain calibration parameters, precisely adjusting the spatial geometric relationship between the laser and camera, establishing an accurate measurement benchmark, eliminating system errors introduced by installation deviations or temperature drift between the laser and camera, maintaining height measurement accuracy at the micrometer level, and providing a reliable geometric reference for subsequent point cloud computing. Once the PCB is positioned in the scanning area, the laser projects a linear beam onto the PCB surface at a preset angle. The linear array camera synchronously captures the reflected image of the laser stripes according to the set exposure time and sampling frequency, achieving continuous and complete scanning of the entire PCB area. This effectively avoids the coverage blind spot problem that exists in the point measurement method and provides complete raw data for full-field 3D reconstruction.

[0094] After image acquisition, the system uses image processing algorithms to extract the sub-pixel center positions of the laser stripes. Combined with a pre-calibrated triangulation geometric model, the two-dimensional pixel coordinates are converted into three-dimensional point cloud data of the PCB surface. Using the XYZ three-dimensional point cloud data, and considering the actual characteristics of the micro-pitch and large-scale arrangement of MLED chips, an efficient data processing and heatmap generation algorithm is designed to ensure accurate identification of adhesive layer defects among densely packed micro-particles, achieving high-resolution detection adaptable to complex arrangements.

[0095] Optionally, after calculating the adhesive layer thickness of the plurality of adhesive layers based on the acquired image to obtain multiple adhesive layer thickness values, the method further includes:

[0096] A 3D point cloud map corresponding to the circuit board to be tested is generated based on the multiple adhesive layer thickness values.

[0097] Based on the 3D point cloud map, generate multiple adhesive height maps corresponding to the multiple adhesive layers;

[0098] Based on the multiple adhesive height maps, defect detection is performed on the multiple adhesive layers to determine the target adhesive layer, which is the adhesive layer among the multiple adhesive layers that has adhesive defects;

[0099] The target adhesive layer is processed according to the defect type of the target adhesive layer.

[0100] In this embodiment, after calculating the thickness of each adhesive layer, it is possible to determine whether each adhesive layer meets the coating requirements based on its thickness value, thereby enabling the detection of defective adhesive layers. A 3D point cloud map is generated based on multiple adhesive layer thickness values. This involves upscaling the thickness measurement data on a two-dimensional plane into a three-dimensional point cloud model, thus restoring the true three-dimensional morphology of the adhesive layer. Each measurement point can be converted into a three-dimensional coordinate point (x, y, z), where z = thickness value, and the set of all points constitutes the point cloud.

[0101] After obtaining the 3D point cloud map, the point cloud data is visualized / structured into an independent height map for each adhesive layer, facilitating subsequent defect detection algorithm processing. After obtaining the height map corresponding to each adhesive layer, each height map is scanned to identify the target adhesive layers with defects. The number of target adhesive layers is not specifically limited; for example, it can be zero or multiple. For instance, a threshold algorithm can be used to set upper and lower thickness limits; exceeding these limits indicates a defect. Alternatively, statistical analysis methods can be used to calculate the mean, standard deviation, skewness, etc., and compared with a standard model to determine defects.

[0102] After determining the defect type of the target adhesive layer, the target adhesive layer is treated according to different defect types. For example, if the adhesive is insufficient, it can be replenished; if the adhesive is excessive, it can be removed. In this embodiment, based on the defect detection results, the process parameters such as dispensing path, dispensing speed and dispensing pressure are automatically calculated and adjusted, and a PID controller is introduced to achieve smooth adjustment.

[0103] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0104] If, among the plurality of adhesive height maps, there is a first target adhesive height map whose height is less than a first preset threshold, the adhesive layer corresponding to the first target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is a leak defect.

[0105] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0106] Calculate the volume of adhesive missing from the target adhesive layer;

[0107] Based on the missing volume of the target adhesive layer, the target adhesive layer is replenished with adhesive.

[0108] In this embodiment, the first preset threshold is the minimum height. If the height of the first target adhesive coating height map is less than the first preset threshold among multiple adhesive coating height maps, it means that the adhesive layer corresponding to the first target adhesive coating height map has a leak defect. Therefore, the volume of adhesive missing in the target adhesive layer can be calculated based on the standard adhesive layer height. Specifically, the adhesive volume is calculated as: V=∫∫h(x,y)dxdy, discretized as: V≈Σ .

[0109] in: =Height of the i-th pixel =Single pixel area= × .

[0110] After obtaining the volume of missing adhesive in the target adhesive layer, the target adhesive layer is repaired by adding adhesive to complete the defect compensation.

[0111] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0112] If, among the plurality of adhesive height maps, there is a second target adhesive height map whose height is greater than a second preset threshold, the adhesive layer corresponding to the second target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is an accumulation defect.

[0113] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0114] Calculate the adhesive volume of the target adhesive layer;

[0115] Based on the volume of adhesive deposited in the target adhesive layer, the target adhesive layer is removed.

[0116] In this embodiment, the first preset threshold is the maximum height. If, among multiple adhesive coating height maps, the height of the second target adhesive coating height map exceeds the second preset threshold, then the adhesive layer corresponding to the second target adhesive coating height map has an accumulation defect. Therefore, based on the standard adhesive layer height, the excess adhesive volume of the target adhesive layer can be calculated to obtain the accumulated adhesive volume. Specifically, the adhesive volume is calculated as: V = ∫∫h(x,y)dxdy, discretized as: V ≈ Σ .

[0117] in: =Height of the i-th pixel =Single pixel area= × .

[0118] After obtaining the accumulated adhesive volume, the accumulated adhesive volume in the target adhesive layer can be removed to complete the defect compensation.

[0119] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0120] If the difference between the height of the third target adhesive height map and the average height of the multiple adhesive height maps is greater than a third preset threshold, the adhesive layer corresponding to the third target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is non-uniformity.

[0121] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0122] Analyze the height distribution data of the target adhesive layer;

[0123] Based on the height distribution data, the target adhesive layer is smoothed.

[0124] In this embodiment, the third preset threshold is the standard deviation of multiple adhesive layers. If the difference between the height of the third target adhesive height map and the average height of the multiple adhesive height maps is greater than the third preset threshold, the defect type of the adhesive layer corresponding to the third target adhesive height map is uneven adhesive application.

[0125] Therefore, the height distribution of all adhesive layers is analyzed, and a dynamic velocity curve is generated, thereby smoothing the target adhesive layer and maintaining its uniformity.

[0126] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0127] If the height gradient of the fourth target adhesive height map is greater than the fourth preset threshold among the multiple adhesive height maps, the adhesive layer corresponding to the fourth target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is adhesive breakage.

[0128] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0129] Locate the break point of the target adhesive layer;

[0130] Based on the location of the missing adhesive in the target adhesive layer, the target adhesive layer is repaired with adhesive.

[0131] In this embodiment, the fourth preset threshold is the height gradient value. If the height gradient of the fourth target adhesive height map is greater than the fourth preset threshold in multiple adhesive height maps, the defect type of the adhesive layer corresponding to the fourth target adhesive height map is adhesive breakage. Therefore, it is necessary to determine the location of adhesive breakage and perform adhesive replenishment on the target adhesive layer according to the location of adhesive breakage.

[0132] In some other implementations, 3-5 parallel laser lines can be simultaneously projected onto the PCB surface, combined with an area scan camera to capture the height information of multiple channels at once. The spacing between each laser line is fixed, and different laser lines are distinguished using time-division multiplexing or wavelength multiplexing technology. Advantages: Increased scanning speed, larger area coverage in a single scan, suitable for rapid inspection of large-size PCBs, significantly improved system throughput, and the ability to achieve true online real-time monitoring without affecting production cycle time.

[0133] In other implementations, a DLP projector can be used to project sinusoidal stripes or Gray code structured light onto the PCB surface, and height information can be calculated using a phase demodulation algorithm. By projecting stripe patterns with different phases, the camera captures the data and calculates the height of each pixel using Fourier transform or phase-shifting algorithms. Advantages: Full-field height information can be obtained in a single measurement without scanning motion; measurement speed is fast; area array data provides richer 3D information for easier identification of complex defects; higher sensitivity for detecting minute defects (such as bubbles and pinholes); and the ability to simultaneously measure the surface morphology and roughness of adhesive.

[0134] The technical solution of this application controls a laser emitter to emit a laser at an initial position on the circuit board to be tested, and controls the circuit board to be tested to move to a target position, thereby acquiring image data of the circuit board to be tested and obtaining an image. Then, the thickness of each adhesive layer on the circuit board to be tested is calculated based on the acquired image. Thus, the thickness of each adhesive layer can be adjusted according to the adhesive layer thickness, thereby achieving accurate control of the adhesive layer thickness on the circuit board to be tested.

[0135] See Figure 4 , Figure 4 This is a structural diagram of the adhesive thickness detection device for on-board chip packaging modules provided in this application embodiment, as shown below. Figure 4 As shown, the adhesive coating thickness detection device 400 for the chip packaging module on the board includes:

[0136] Acquisition module 410 is used to acquire a circuit board to be tested, the circuit board to be tested is provided with multiple LED chips and multiple adhesive layers, the multiple adhesive layers are disposed between any two LED chips;

[0137] The control module 420 is used to control the laser emitter to emit a detection laser towards the initial position of the circuit board to be tested, and to control the circuit board to be tested to move so that the detection laser irradiates the target position of the circuit board to be tested, thereby obtaining an image. The image includes image data received by the camera from the detection laser as it passes through the circuit board to be tested during the movement of the circuit board to be tested.

[0138] The calculation module 430 is used to calculate the adhesive thickness of the multiple adhesive layers based on the acquired image, and obtain multiple adhesive thickness values, wherein the multiple adhesive thickness values ​​correspond one-to-one with the multiple adhesive layers.

[0139] Optionally, the computing module 430 includes:

[0140] The acquisition submodule is used to acquire calculation data based on the laser emitter, the circuit board to be tested, and the camera. The calculation data includes distance value, incident angle, observation angle, and focal length. The distance value is the reference distance between the laser emitter and the camera. The incident angle is the angle between the laser and the circuit board to be tested. The observation angle is the angle between the laser and the circuit board to be tested after reflection on the circuit board to be tested. The focal length is the focal length of the camera.

[0141] The calculation submodule is used to calculate the adhesive layer thickness of the multiple adhesive layers based on the calculation data and the acquired image, and obtain multiple adhesive layer thickness values.

[0142] Optionally, the computation submodule includes:

[0143] The determining unit is used to determine, based on the acquired image, multiple pixel offsets corresponding to the multiple adhesive layers, wherein the pixel offsets are used to represent the pixel distance corresponding to each adhesive layer;

[0144] The calculation unit is used to perform triangulation calculation on the adhesive layer thickness of the multiple adhesive layers based on the multiple pixel offsets and the calculation data, so as to obtain multiple adhesive layer thickness values.

[0145] Optionally, the determining unit includes:

[0146] A processing subunit is used to preprocess the acquired image to obtain a target image. The preprocessing includes at least one of the following: noise removal processing, contrast enhancement processing, and grayscale processing.

[0147] The first determining subunit is used to determine the center position corresponding to the laser based on the Gaussian fitting algorithm and / or the centroid algorithm, and obtain the center position coordinates;

[0148] The second determining subunit is used to determine, based on the center position coordinates, multiple pixel offsets corresponding to the multiple adhesive layers in the target image.

[0149] Optional, also includes:

[0150] The first generation module is used to generate a 3D point cloud map corresponding to the circuit board to be tested based on the multiple adhesive layer thickness values.

[0151] The second generation module is used to generate multiple adhesive height maps corresponding to the multiple adhesive layers based on the 3D point cloud map.

[0152] The determination module is used to perform defect detection on the multiple adhesive layers based on the multiple adhesive height maps, and determine the target adhesive layer, wherein the target adhesive layer is the adhesive layer among the multiple adhesive layers that has adhesive defects.

[0153] The processing module is used to process the target adhesive layer according to the defect type of the target adhesive layer.

[0154] Optionally, the determination module includes:

[0155] The first determining submodule is used to determine the adhesive layer corresponding to the first target adhesive height map as the target adhesive layer when the height of the first target adhesive height map is less than the first preset threshold among the plurality of adhesive height maps, and the defect type of the target adhesive layer is a leak defect.

[0156] The processing module includes:

[0157] The first calculation submodule is used to calculate the volume of adhesive missing from the target adhesive layer;

[0158] The second processing submodule is used to perform glue replenishment processing on the target adhesive layer based on the missing adhesive volume of the target adhesive layer.

[0159] Optionally, the determination module includes:

[0160] The second determining submodule is used to determine the coating layer corresponding to the second target coating height map as the target coating layer when the height of the second target coating height map is greater than the second preset threshold among the plurality of coating height maps, and the defect type of the target coating layer is an accumulation defect.

[0161] The processing module includes:

[0162] The second calculation submodule is used to calculate the adhesive volume of the target adhesive layer accumulation;

[0163] The second processing submodule is used to remove the target adhesive layer based on the adhesive volume of the target adhesive layer accumulation.

[0164] Optionally, the determination module includes:

[0165] The third determining submodule is used to determine the coating layer corresponding to the third target coating height map as the target coating layer when the difference between the height of the third target coating height map and the average height of the multiple coating height maps is greater than a third preset threshold. The defect type of the target coating layer is non-uniformity.

[0166] The processing module includes:

[0167] The analysis submodule is used to analyze the height distribution data of the target adhesive layer;

[0168] The third processing submodule is used to smooth the target adhesive layer based on the height distribution data.

[0169] Optionally, the determination module includes:

[0170] The fourth determination submodule is used to determine the coating layer corresponding to the fourth target coating height map as the target coating layer when the height gradient of the fourth target coating height map is greater than the fourth preset threshold among the multiple coating height maps, and the defect type of the target coating layer is glue breakage.

[0171] The processing module includes:

[0172] The positioning submodule is used to locate the break point of the target adhesive layer;

[0173] The fourth processing submodule is used to perform glue replenishment processing on the target adhesive layer based on the location of the missing glue break in the target adhesive layer.

[0174] The technical solution of this application controls a laser emitter to emit a laser at an initial position on the circuit board to be tested, and controls the circuit board to be tested to move to a target position, thereby acquiring image data of the circuit board to be tested and obtaining an image. Then, the thickness of each adhesive layer on the circuit board to be tested is calculated based on the acquired image. Thus, the thickness of each adhesive layer can be adjusted according to the adhesive layer thickness, thereby achieving accurate control of the adhesive layer thickness on the circuit board to be tested.

[0175] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application, such as... Figure 5 As shown, the electronic device 500 includes a memory 510 and a processor 520. The number of processors 520 in the electronic device 500 can be one or more. Figure 5 Taking a processor 520 as an example; the memory 510 and processor 520 in the server can be connected via a bus or other means. Figure 5 Taking the example of a connection between China and Israel via a bus.

[0176] The memory 510, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as the program instructions / modules corresponding to the title generation method in the embodiments of this application. The processor 520 executes various functional applications and data processing of the server / terminal / server by running the software programs, instructions, and modules stored in the memory 510, thereby realizing the above-mentioned method for detecting the coating thickness of the chip packaging module on the board.

[0177] The processor 520 is used to run the computer program stored in the memory 510, and performs the following steps:

[0178] A circuit board to be tested is obtained, the circuit board to be tested is provided with multiple LED chips and multiple adhesive layers, the multiple adhesive layers are disposed between any two LED chips;

[0179] The laser emitter is controlled to emit a detection laser towards the initial position of the circuit board to be tested, and the circuit board to be tested is controlled to move so that the detection laser irradiates the target position of the circuit board to be tested, thereby obtaining an image. The image includes image data received by the camera from the laser reflected by the circuit board to be tested during the movement of the detection laser.

[0180] Based on the acquired images, the thickness of the adhesive layers of the plurality of coating layers is calculated to obtain a plurality of adhesive layer thickness values, and the plurality of adhesive layer thickness values ​​correspond one-to-one with the plurality of coating layers.

[0181] Optionally, the calculation of the adhesive layer thickness of the plurality of adhesive layers based on the acquired image to obtain a plurality of adhesive layer thickness values ​​includes:

[0182] Based on the laser emitter, the circuit board to be tested, and the camera, calculation data is obtained. The calculation data includes a distance value, an incident angle, an observation angle, and a focal length. The distance value is the reference distance between the laser emitter and the camera. The incident angle is the angle between the laser and the circuit board to be tested. The observation angle is the angle between the laser and the circuit board to be tested after reflection on the circuit board. The focal length is the focal length of the camera.

[0183] The adhesive layer thickness of the multiple coating layers is calculated based on the calculated data and the acquired images to obtain multiple adhesive layer thickness values.

[0184] Optionally, the step of calculating the adhesive layer thickness of the plurality of adhesive layers based on the calculated data and the acquired image to obtain a plurality of adhesive layer thickness values ​​includes:

[0185] Based on the acquired image, a plurality of pixel offsets corresponding to the plurality of adhesive layers are determined, wherein the pixel offsets are used to represent the pixel distance corresponding to each adhesive layer;

[0186] Based on the multiple pixel offsets and the calculated data, the thickness of the adhesive layers of the multiple coating layers is calculated by triangulation to obtain multiple adhesive layer thickness values.

[0187] Optionally, determining the pixel offsets corresponding to the multiple adhesive layers based on the acquired image includes:

[0188] The acquired image is preprocessed to obtain the target image. The preprocessing includes at least one of the following: noise removal processing, contrast enhancement processing, and grayscale processing.

[0189] Based on the Gaussian fitting algorithm and / or the centroid algorithm, the center position corresponding to the laser is determined, and the center position coordinates are obtained.

[0190] Using the center position coordinates as a reference, determine the pixel offsets corresponding to the multiple adhesive layers in the target image.

[0191] Optionally, after calculating the adhesive layer thickness of the plurality of adhesive layers based on the acquired image to obtain multiple adhesive layer thickness values, the method further includes:

[0192] A 3D point cloud map corresponding to the circuit board to be tested is generated based on the multiple adhesive layer thickness values.

[0193] Based on the 3D point cloud map, generate multiple adhesive height maps corresponding to the multiple adhesive layers;

[0194] Based on the multiple adhesive height maps, defect detection is performed on the multiple adhesive layers to determine the target adhesive layer, which is the adhesive layer among the multiple adhesive layers that has adhesive defects;

[0195] The target adhesive layer is processed according to the defect type of the target adhesive layer.

[0196] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0197] If, among the plurality of adhesive height maps, there is a first target adhesive height map whose height is less than a first preset threshold, the adhesive layer corresponding to the first target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is a leak defect.

[0198] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0199] Calculate the volume of adhesive missing from the target adhesive layer;

[0200] Based on the missing volume of the target adhesive layer, the target adhesive layer is replenished with adhesive.

[0201] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0202] If, among the plurality of adhesive height maps, there is a second target adhesive height map whose height is greater than a second preset threshold, the adhesive layer corresponding to the second target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is an accumulation defect.

[0203] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0204] Calculate the adhesive volume of the target adhesive layer;

[0205] Based on the volume of adhesive deposited in the target adhesive layer, the target adhesive layer is removed.

[0206] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0207] If the difference between the height of the third target adhesive height map and the average height of the multiple adhesive height maps is greater than a third preset threshold, the adhesive layer corresponding to the third target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is non-uniformity.

[0208] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0209] Analyze the height distribution data of the target adhesive layer;

[0210] Based on the height distribution data, the target adhesive layer is smoothed.

[0211] Optionally, the step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes:

[0212] If the height gradient of the fourth target adhesive height map is greater than the fourth preset threshold among the multiple adhesive height maps, the adhesive layer corresponding to the fourth target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is adhesive breakage.

[0213] The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes:

[0214] Locate the break point of the target adhesive layer;

[0215] Based on the location of the missing adhesive in the target adhesive layer, the target adhesive layer is repaired with adhesive.

[0216] The technical solution of this application controls a laser emitter to emit a laser at an initial position on the circuit board to be tested, and controls the circuit board to be tested to move to a target position, thereby acquiring image data of the circuit board to be tested and obtaining an image. Then, the thickness of each adhesive layer on the circuit board to be tested is calculated based on the acquired image. Thus, the thickness of each adhesive layer can be adjusted according to the adhesive layer thickness, thereby achieving accurate control of the adhesive layer thickness on the circuit board to be tested.

[0217] Those skilled in the art will understand that all or part of the steps of the methods described in the above embodiments can be implemented by hardware related to program instructions, and the program can be stored in a readable medium.

[0218] This disclosure also provides a readable storage medium storing a computer program, which, when executed by a processor, can perform the above-described functions. Figure 1 Any step in the corresponding method embodiment can achieve the same technical effect, and will not be repeated here to avoid repetition.

[0219] The computer-readable storage medium of this disclosure can be any combination of one or more computer-readable media. The computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. For example, a computer-readable storage medium can be an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0220] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of sending, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.

[0221] The program code contained on the storage medium can be transmitted using any suitable medium, including but not limited to wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0222] Computer program code for performing the operations of this disclosure can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or terminal. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0223] The above description represents the preferred embodiments of this disclosure. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles described herein, and these improvements and modifications should also be considered within the scope of protection of this disclosure.

Claims

1. A method for detecting the adhesive coating thickness of a chip packaging module on an on-board substrate, characterized in that, The method includes: A circuit board to be tested is obtained, the circuit board to be tested is provided with multiple LED chips and multiple adhesive layers, the multiple adhesive layers are disposed between any two LED chips; The laser emitter is controlled to emit a detection laser towards the initial position of the circuit board to be tested, and the circuit board to be tested is controlled to move so that the detection laser irradiates the target position of the circuit board to be tested, thereby obtaining an image. The image includes image data received by the camera from the laser reflected by the circuit board to be tested during the movement of the detection laser. Based on the acquired images, the thickness of the adhesive layers of the plurality of coating layers is calculated to obtain a plurality of adhesive layer thickness values, and the plurality of adhesive layer thickness values ​​correspond one-to-one with the plurality of coating layers.

2. The method according to claim 1, characterized in that, The calculation of the adhesive layer thickness of the multiple adhesive layers based on the acquired image yields multiple adhesive layer thickness values, including: Based on the laser emitter, the circuit board to be tested, and the camera, calculation data is obtained. The calculation data includes a distance value, an incident angle, an observation angle, and a focal length. The distance value is the reference distance between the laser emitter and the camera. The incident angle is the angle between the laser and the circuit board to be tested. The observation angle is the angle between the laser and the circuit board to be tested after reflection on the circuit board. The focal length is the focal length of the camera. The adhesive layer thickness of the multiple coating layers is calculated based on the calculated data and the acquired images to obtain multiple adhesive layer thickness values.

3. The method according to claim 2, characterized in that, The calculation of the adhesive layer thickness of the multiple adhesive layers based on the calculated data and the acquired image yields multiple adhesive layer thickness values, including: Based on the acquired image, a plurality of pixel offsets corresponding to the plurality of adhesive layers are determined, wherein the pixel offsets are used to represent the pixel distance corresponding to each adhesive layer; Based on the multiple pixel offsets and the calculated data, the thickness of the adhesive layers of the multiple coating layers is calculated by triangulation to obtain multiple adhesive layer thickness values.

4. The method according to claim 3, characterized in that, The step of determining the pixel offsets corresponding to the multiple adhesive layers based on the acquired image includes: The acquired image is preprocessed to obtain the target image. The preprocessing includes at least one of the following: noise removal processing, contrast enhancement processing, and grayscale processing. Based on the Gaussian fitting algorithm and / or the centroid algorithm, the center position corresponding to the laser is determined, and the center position coordinates are obtained. Using the center position coordinates as a reference, determine the pixel offsets corresponding to the multiple adhesive layers in the target image.

5. The method according to any one of claims 1-4, characterized in that, After calculating the adhesive layer thickness of the multiple adhesive layers based on the acquired image to obtain multiple adhesive layer thickness values, the method further includes: A 3D point cloud map corresponding to the circuit board to be tested is generated based on the multiple adhesive layer thickness values. Based on the 3D point cloud map, generate multiple adhesive height maps corresponding to the multiple adhesive layers; Based on the multiple adhesive height maps, defect detection is performed on the multiple adhesive layers to determine the target adhesive layer, which is the adhesive layer among the multiple adhesive layers that has adhesive defects; The target adhesive layer is processed according to the defect type of the target adhesive layer.

6. The method according to claim 5, characterized in that, The step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes: If, among the plurality of adhesive height maps, there is a first target adhesive height map whose height is less than a first preset threshold, the adhesive layer corresponding to the first target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is a leak defect. The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes: Calculate the volume of adhesive missing from the target adhesive layer; Based on the missing volume of the target adhesive layer, the target adhesive layer is replenished with adhesive.

7. The method according to claim 5, characterized in that, The step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes: If, among the plurality of adhesive height maps, there is a second target adhesive height map whose height is greater than a second preset threshold, the adhesive layer corresponding to the second target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is an accumulation defect. The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes: Calculate the adhesive volume of the target adhesive layer; Based on the volume of adhesive deposited in the target adhesive layer, the target adhesive layer is removed.

8. The method according to claim 5, characterized in that, The step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes: If the difference between the height of the third target adhesive height map and the average height of the multiple adhesive height maps is greater than a third preset threshold, the adhesive layer corresponding to the third target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is non-uniformity. The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes: Analyze the height distribution data of the target adhesive layer; Based on the height distribution data, the target adhesive layer is smoothed.

9. The method according to claim 5, characterized in that, The step of performing defect detection on the multiple adhesive layers based on the multiple adhesive height maps to determine the target adhesive layer includes: If the height gradient of the fourth target adhesive height map is greater than the fourth preset threshold among the multiple adhesive height maps, the adhesive layer corresponding to the fourth target adhesive height map is determined as the target adhesive layer, and the defect type of the target adhesive layer is adhesive breakage. The step of processing the target adhesive layer according to the defect type of the target adhesive layer includes: Locate the break point of the target adhesive layer; Based on the location of the missing adhesive in the target adhesive layer, the target adhesive layer is repaired with adhesive.

10. A device for detecting the coating thickness of a chip packaging module on an on-board substrate, characterized in that, The device includes: An acquisition module is used to acquire a circuit board to be tested, the circuit board to be tested being provided with multiple LED chips and multiple adhesive layers, the multiple adhesive layers being disposed between any two of the LED chips; The control module is used to control the laser emitter to emit a detection laser towards the initial position of the circuit board to be tested, and to control the circuit board to be tested to move so that the detection laser irradiates the target position of the circuit board to be tested, thereby obtaining an image. The image includes image data received by the camera from the detection laser as it passes through the circuit board to be tested during the movement of the circuit board to be tested. The calculation module is used to calculate the adhesive thickness of the multiple adhesive layers based on the acquired image, and obtain multiple adhesive thickness values, wherein each of the multiple adhesive thickness values ​​corresponds one-to-one with the multiple adhesive layers.

11. An electronic device, characterized in that, include: A processor, a memory, and a program stored in the memory and executable on the processor, wherein the program, when executed by the processor, implements the steps of the method as described in any one of claims 1 to 9.

12. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the method as described in any one of claims 1 to 9.

13. A computer program product, characterized in that, Includes computer instructions that, when executed by a processor, implement the steps of the method as described in any one of claims 1 to 9.

Images