A thermal-vibration-four-point bending coupling loading device for a circuit board

Abstract

The application relates to the field of test experiments of electronic package reliability, and discloses an experimental device for thermal-vibration-four-point bending coupling loading of a circuit board. The device mainly comprises a thermal loading system, a vibration loading system and a four-point bending loading system. The thermal loading system is used to provide a stable temperature test environment for the experiment, is mainly composed of a heat preservation box, a temperature controller and the like, and can be used to realize adjustment and control of the experimental temperature; the vibration loading system is composed of a vibration instrument and a vibration table, and can apply a vibration load to the circuit board; the four-point bending loading system adopts mechanical connection modes such as bolts and nuts to complete assembly of various components, can adapt to circuit boards of different sizes, and can apply corresponding four-point bending loads. The experimental device can realize coupling loading of thermal-vibration-four-point bending loads, has the characteristics of compact structure, convenient installation, strong applicability and the like, and can be used for reliability testing of the circuit board under a multi-field coupling environment.

Description

Technical Field

[0001] This invention relates to the field of electronic packaging reliability testing experiments, specifically to a thermal-vibration-four-point bending coupling loading device for circuit boards. Background Technology

[0002] As electronic devices increasingly move towards higher integration, miniaturization, and multifunctionality, the reliability of circuit boards, as crucial carriers for electronic component mounting and signal transmission, has become a major concern during long-term service. In practical applications, electronic devices often operate in complex environments, and circuit boards are typically affected by a combination of factors, including temperature cycling, mechanical vibration, and structural deformation. Among these, the combined effect of thermal stress and mechanical loads is one of the key factors influencing the reliability of circuit boards and interconnect structures such as solder joints.

[0003] Related studies have found that the failure behavior of interconnect structures such as solder joints under the combined effects of multiple thermal and mechanical loads exhibits significant coupling characteristics, rather than being a simple accumulation of damage caused by various single loads. Temperature changes lead to thermal expansion mismatch in materials, altering internal stress distribution and mechanical properties; while vibration and bending loads further increase structural fatigue, promoting crack initiation and propagation. When multiple environmental loads act together over a long period, circuit board interconnect structures are more prone to fatigue degradation, thereby affecting the service life and operational reliability of electronic devices.

[0004] Currently, the devices used for conducting multiphysics coupling reliability tests still have certain limitations. Some relatively simple test devices struggle to apply different loads simultaneously, while larger, more sophisticated test equipment often suffers from high costs, complex structures, and insufficient operational flexibility. Furthermore, there is room for improvement in terms of sample size adaptability and test repeatability. Therefore, it is necessary to design a coupled loading test device capable of simultaneously applying thermal, vibrational, and four-point bending loads to a circuit board, while also considering the device's versatility, ease of assembly, and ease of operation, to meet the needs of reliability testing and performance evaluation under multiphysics coupling environments on circuit boards. Summary of the Invention

[0005] This invention addresses the problem that existing simple experimental devices cannot simulate the thermal-vibration-four-point bending coupling conditions of actual service. It provides a thermal-vibration-four-point bending coupling loading device for circuit boards, which can load four-point bending on circuit board test samples under complex thermal and vibration conditions, and is used to carry out reliability tests on circuit boards under thermal-vibration-four-point bending coupling conditions.

[0006] The technical solution adopted in this invention is:

[0007] A thermal-vibration-four-point bending coupled loading device for circuit boards includes a thermal loading system, a vibration loading system, and a four-point bending loading system.

[0008] The heat loading system is used to regulate the temperature of the entire experimental environment, the vibration loading system is used to provide a vibration environment for the circuit board experimental sample, and the four-point bending loading system is used to apply bending load to the circuit board experimental sample.

[0009] Furthermore, the heat loading system includes an insulated chamber and a temperature controller. The insulated chamber includes a door, a threaded hole at the bottom, and small holes on both sides. The threaded hole at the bottom is used to install clamps to secure the circuit board experimental sample. One of the small holes on each side is used to connect to an external wire; after connection, the hole is sealed with a rubber plug to reduce heat loss within the chamber. The other hole is used to connect to the temperature controller to control the experimental environment temperature. The temperature controller includes a control panel and three buttons. The temperature inside the chamber can be adjusted by manipulating the control panel, thus achieving precise control of the experimental environment temperature. The three buttons are a power button, an emergency stop / reset button, and a start button.

[0010] Furthermore, the vibration loading system includes a vibrator, two excitation hammers, a vibration platform, two vibration motors, eight spring devices, and a support frame. The vibration motors are bolted to the bottom of the vibration platform, and there are eight spring devices between the vibration platform and the support frame. The vibrator is connected to the vibration platform via the two excitation hammers and includes a control panel and three buttons. Different vibration curves can be input into the control panel, and the two motors and eight spring devices can be controlled by the excitation hammers to apply vibrations of different frequencies to the circuit board experimental sample.

[0011] Furthermore, the four-point bending loading system mainly consists of a bending mounting plate, a micrometer, an adapter plate, a bending support plate, a side support plate, right-angle fasteners, a semi-cylindrical support, rollers, a base, and fasteners. The bending support plate and the semi-cylindrical support constitute a bending support platform; the bending mounting plate, bending support plate, side support plate, base, and bending support plate are connected by right-angle fasteners, bolts, and nuts; the micrometer, adapter plate, and two rollers are connected by fasteners and bolts to form the four-point bending loading assembly.

[0012] Furthermore, the circuit board experimental sample was placed on a bending support platform consisting of a bending support plate and a semi-cylindrical support. The four-point bending load was applied through a four-point bending loading assembly consisting of a micrometer, an adapter plate, two rollers, fasteners, and bolts.

[0013] The device provided by this invention modularly integrates a thermal loading system, a vibration loading system, and a four-point bending loading system, realizing the simultaneous application of thermal load, vibration load, and four-point bending load to circuit board test samples. It overcomes the technical defects of existing single or dual-field loading devices that cannot realistically simulate complex service conditions, and is suitable for reliability testing of circuit boards under thermal-vibration-four-point bending coupled loading conditions. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a thermal-vibration-four-point bending coupling loading device for a circuit board according to the present invention.

[0015] Figure 2 This is a front view of the thermal-vibration-four-point bending coupling loading device for circuit boards according to the present invention.

[0016] Figure 3 This is a schematic diagram of the hot-loading system structure;

[0017] Figure 4 This is a schematic diagram of a four-point bending loading system.

[0018] Figure 5 This is a schematic diagram of the vibration loading system.

[0019] In the diagram: 1. Heat loading system 2. Vibration loading system 3. Four-point bending loading system 4. Rubber plug 1-1. External connection hole 1-2. Temperature controller 1-3. Gas exchange channel 1-4. Control panel 1-5. Button 1-6. Insulation box door 1-7. Threaded hole 1-8. Insulation box 2-1. Bending mounting plate 2-2. Micrometer 2-3. Fastener 2-4. Adapter plate 2-5, 2-12 and 2-13. Bending support plate 2-6. Side support plate 2-7. Right angle fastener 2-8. Semi-cylindrical support 2-9. Roller 2-10. Circuit board 2-11. Base 3-1. Vibrator 3-2. Excitation hammer 3-3. Vibration platform 3-4. Support 3-5. Spring 3-6. Vibration motor 3-7. Control panel 3-8. Button. Detailed Implementation

[0020] The present invention will be described in detail below through specific embodiments. Those skilled in the art can understand the technical solution and implementation effects of the present invention based on this content. Unless otherwise specified, the names and numbers of each component in the accompanying drawings correspond one-to-one.

[0021] like Figure 1 and Figure 2As shown, a thermal-vibration-four-point bending coupled loading device for circuit boards includes a thermal loading system 1, a vibration loading system 2, a four-point bending loading system 3, and a rubber stopper 4. The thermal loading system is fixed above the vibration loading system 2 by screws, and the four-point bending loading system 3 is fixed to the threaded holes 1-7 at the bottom of the insulation box by screws, thereby realizing thermal-vibration-four-point bending coupled loading on the circuit board experimental sample 2-10.

[0022] like Figure 3 As shown, the heat loading system 1 includes an insulated box 1-8, an external connection hole 1-1, a temperature controller 1-2, a gas exchange channel 1-3, a control panel 1-4, buttons 1-5, an insulated box door 1-6, and threaded holes 1-7. Small holes are located on both sides of the insulated box. The external connection hole 1-1 is used to connect to external wires. After connection, the small hole is sealed with a rubber stopper 4 to reduce temperature loss inside the insulated box. The other hole connects to the temperature controller 1-2 through the gas exchange channel 1-3 to control the experimental environment temperature. The temperature controller 1-2 includes a control panel 1-4 and three buttons 1-5. The temperature inside the insulated box can be adjusted by operating the control panel, thereby achieving precise control of the experimental environment temperature. The three buttons are the power on / off button, the emergency stop / reset button, and the start button, which can control the heat loading system and prevent safety accidents.

[0023] like Figure 4As shown, the four-point bending loading system includes a bending mounting plate 2-1, a micrometer 2-2, fasteners 2-3, an adapter plate 2-4, bending support plates 2-5, 2-12, and 2-13, a side support plate 2-6, a right-angle fastener 2-7, a semi-cylindrical support 2-8, a roller 2-9, a circuit board 2-10, and a base 2-11. The bending mounting plate 2-1, bending support plates 2-5, 2-12, and 2-13, side support plate 2-6, base 2-11, and bending support plates are detachably and securely connected by right-angle fasteners, bolts, and nuts, forming a stable structure. The bending support plate 2-12 and the semi-cylindrical support 2-8 together constitute a bending support platform for placing the circuit board test sample. The micrometer 2-2, the adapter plate 2-4, and the two rollers 2-9 are connected by fasteners 2-3 and bolts to form a four-point bending loading assembly. The circuit board test sample 2-10 is placed on the bending support platform, and the four-point bending load is applied to the circuit board sample through the four-point bending loading assembly. The base 2-11 is provided with two parallel guide rails, and the two side support plates 2-6 are slidably installed on the guide rails. This structural design allows the side support plate to move freely along the base guide rail, thereby enabling flexible adjustment of the circuit board support span and the loading span of the circuit board experimental sample to accommodate circuit boards of different lengths. The bending mounting plate 2-1 is also equipped with a guide rail, on which a four-point bending loading assembly consisting of a micrometer 2-2, an adapter plate 2-4, fasteners 2-3, and two rollers 2-9 is mounted and can be moved along the guide rail, thus adjusting the overall position of the loading assembly. The adapter plate 2-4 has a guide rail, on which the two rollers 2-9 are mounted with screws. The guide rail allows for free adjustment of the distance between the two loading rollers, enabling flexible adjustment of the loading span in the four-point bending experiment to meet the span requirements of different testing standards and experimental schemes.

[0024] like Figure 5 As shown, the vibration loading system 3 includes a vibrator 3-1, two excitation hammers 3-2, a vibration platform 3-3, two vibration motors 3-6, eight spring devices 3-5, and a support 3-4. The vibration motors 3-6 are bolted to the bottom of the vibration platform 3-3, and there are eight spring devices 3-5 between the vibration platform 3-3 and the support 3-4. The vibrator 3-1 is connected to the vibration platform 3-3 through the two excitation hammers 3-2, and includes a control panel and three buttons. Different vibration curves can be input into the control panel 3-7, and the two motors 3-6 and eight spring devices 3-5 are controlled by the excitation hammers 3-2 to apply vibrations of different frequencies to the circuit board experimental sample 2-10.

[0025] In the actual experiment, the operator first fixed the four-point bending loading system to the bottom of the insulation box 1-8 with screws, then placed the circuit board experimental sample 2-10 horizontally on the bending support platform, and applied the four-point bending load to the circuit board experimental sample 2-10 by adjusting the micrometer 2-2. After closing the insulation box door 1-6, the operator applied the vibration load and thermal load by operating the vibrator 3-1 and the temperature controller 1-2, thereby realizing the coupled loading of heat-vibration-four-point bending.

[0026] The device of this invention is easy to operate and has a simple structure, and can be applied to reliability tests of thermal-vibration-four-point bending coupling loading on circuit boards of different sizes.

Claims

1. A thermal-vibration-four-point bending coupling loading device for circuit boards, characterized in that, Includes a heat loading system 1, a vibration loading system 3, a four-point bending loading system 2, and a rubber stopper 4; The heat loading system 1 is used to regulate the temperature of the entire experimental environment, the vibration loading system 3 is used to provide a vibration environment for the circuit board experimental sample, and the four-point bending loading system 2 is used to apply bending load to the circuit board experimental sample.

2. The thermal-vibration-four-point bending coupling loading device for a circuit board according to claim 1, characterized in that, The heat loading system 1 mainly includes an insulation box 1-8 and a temperature controller 1-2; The insulated box 1-8 includes an insulated box door 1-6, a threaded hole 1-7 at the bottom of the insulated box, and small holes on both sides of the insulated box. The threaded hole at the bottom of the insulated box can be used to install clamps to fix the circuit board experimental sample; one of the small holes on both sides is used to connect to the outside wires. After the connection is completed, the small hole is sealed with a rubber plug 4 to reduce the temperature loss inside the insulated box. The other hole is connected to the temperature controller 1-2 through the gas exchange channel 1-3 to control the temperature of the experimental environment. The temperature controller 1-2 includes a control panel 1-4 and three buttons 1-5. The temperature inside the incubator can be adjusted by operating the control panel, thereby achieving precise control of the experimental environment temperature; the three buttons are the power on / off button, the emergency stop / reset button, and the start button.

3. The thermal-vibration-four-point bending coupling loading device for a circuit board according to claim 1, characterized in that, The vibration loading system includes a vibrator 3-1, two excitation hammers 3-2, a vibration platform 3-3, two vibration motors 3-6, eight spring devices 3-5, and a support 3-4; the vibration motors are bolted to the bottom of the vibration table, and there are a total of eight spring devices between the vibration table and the support. The vibrator is connected to the vibration platform via two excitation hammers. The vibrator includes a control panel and three buttons. The control panel allows input of different vibration curves, which, through the excitation hammers, control two motors and eight spring devices to apply vibrations of different frequencies to the circuit board experimental sample.

4. The thermal-vibration-four-point bending coupling loading device for a circuit board according to claim 1, characterized in that, The four-point bending loading system mainly consists of a bending mounting plate 2-1, a micrometer 2-2, fasteners 2-3, an adapter plate 2-4, bending support plates 2-5, 2-12, and 2-13, a side support plate 2-6, a right-angle fastener 2-7, a semi-cylindrical support 2-8, two rollers 2-9, and a base 2-11. The bending support plate and the semi-cylindrical support form a bending support platform. The bending mounting plate, bending support plate, side support plate, base, and bending support plate are connected by right-angle fasteners, bolts, and nuts. The micrometer, adapter plate, and two rollers are connected by fasteners and bolts to form a four-point bending loading assembly.

5. The thermal-vibration-four-point bending coupling loading device for a circuit board according to claim 1, characterized in that, The circuit board experimental sample is placed on a bending support platform consisting of a bending support plate 2-12 and a semi-cylindrical support 2-6. The four-point bending load is applied through a four-point bending loading assembly consisting of a micrometer 2-2, an adapter plate 2-4, two rollers 2-9, fasteners 2-13, and bolts.

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