A compact perfluorohexanone concentration detection device, corrosion protection coating, and processing device

Abstract

The application provides a small perfluorohexanone concentration detection device, an anticorrosive coating and a processing device, comprising an NDIR sensor for detecting perfluorohexanone water vapor concentration in air, the NDIR sensor comprises a gas chamber for flowing perfluorohexanone water vapor, a plurality of heating pipes are arranged on the outer side wall of the gas chamber; an anticorrosive coating is arranged on the surface of the detection device; the processing device comprises a drill tool in the form of internal chip removal, the drill tool comprises a drill bit for drilling a deep hole and a chip removal pipe for removing chips, an oil delivery device is movably sleeved on the middle section of the chip removal pipe, one end of the chip removal pipe away from the drill bit is fixedly connected with a front nozzle and a left wall of a chip extractor, and a rear nozzle is fixedly installed on the right wall of the chip extractor. The small perfluorohexanone detection device can be used in a fire extinguishing site, has a long service life and high detection accuracy.

Description

Technical Field

[0001] This invention relates to the field of perfluorohexanone concentration detection technology, specifically to a small perfluorohexanone concentration detection device, an anti-corrosion coating, and processing equipment. Background Technology

[0002] In mechanical manufacturing, a cylindrical hole with a depth exceeding 10 times its diameter is generally referred to as a deep hole. Deep holes are classified according to the ratio of their depth (L) to their diameter (D) (L / D), and are typically categorized into three types: general deep holes, medium deep holes, and special deep holes. (Note: A larger L / D ratio indicates greater machining difficulty.) Currently, the detection of perfluorohexanone concentration during fire extinguishing using perfluorohexanone (PFH) fire extinguishing agents in China is challenging using conventional methods, and there are no standardized products available on the market. Current technologies for measuring PPH include thermal conductivity and non-dispersive infrared spectroscopy.

[0003] Currently, the common application of these two technologies in the market is limited by their principles, roughly as follows: 1) The most accurate application of the thermal conductivity principle is in measuring the concentration of either component in a binary medium environment. However, the products generated by perfluorohexanone fire extinguishing agents during the extinguishing process are not only perfluorohexanone and background air, but also many other fluorinated VOC gases such as tetrafluoroethylene, octafluoropropane, hexafluoropropylene, decafluorobutane, octafluorobutene, perfluoroisobutylene, perfluoroisopentane, hydrogen fluoride, etc., which are generated at high temperatures during the extinguishing process.

[0004] The components of fire extinguishing products are complex, and data on the vapor thermal conductivity of each component, including the vapor thermal conductivity of the analyte perfluorohexanone, is currently unavailable. Therefore, detection devices based on this principle cannot solve the accuracy problem associated with perfluorohexanone.

[0005] 2) Non-dispersive spectroradiometric infrared (NDIR) technique. This technique utilizes the characteristic infrared absorption spectrum of perfluorohexanone (PFH) vapor to determine its concentration. However, this technique is limited by the availability of standard gas for PFH vapor, achieving an accuracy of ≤±5%FS and an absolute error of <±5000ppm across the entire range. The concentrations of the other most abundant impurities mentioned above are at most <3000ppm, within the tolerance of the actual instrument. Therefore, although some byproducts overlap with the absorption spectrum of PFH, this technique is still suitable for detecting PFH vapor concentration.

[0006] Furthermore, in practical field applications, the common applications of nondispersive infrared spectroscopy are limited by the specific field conditions, mainly in the following aspects: 1) Conventional infrared data in actual field applications will drift excessively; 2) Conventional mass-produced infrared structures may result in the loss of equipment detection signals during use; 3) Excessive dust can cause blockages in the field application of conventional infrared sensor detection equipment; 4) The casing of conventional infrared sensor detection equipment is easily corroded by high concentrations of hydrogen fluoride gas, a byproduct of fire extinguishing.

[0007] The above four points mean that conventional infrared perfluorohexanone detection equipment cannot meet the actual application requirements on site. Summary of the Invention

[0008] In view of this, the problem to be solved by the present invention is to provide a small perfluorohexanone concentration detection device, an anti-corrosion coating and processing equipment, a small perfluorohexanone detection device that can be used at fire extinguishing sites, with a long service life and high detection accuracy.

[0009] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A small perfluorohexanone concentration detection device includes an NDIR sensor for detecting the concentration of perfluorohexanone water vapor in the air. The NDIR sensor includes a gas chamber for the passage of perfluorohexanone water vapor, and several heating tubes are arranged on the outer wall of the gas chamber to reduce the probability of perfluorohexanone water vapor liquefaction.

[0010] Furthermore, an air pump is installed at the air inlet of the gas chamber to shorten the residence time of perfluorohexanone water vapor in the gas chamber.

[0011] Furthermore, a replaceable dust filter plug is provided at the air inlet of the air chamber to reduce the dust content in the perfluorohexanone water vapor.

[0012] A highly corrosion-resistant anti-corrosion coating includes a substrate for plating the anti-corrosion coating, wherein the anti-corrosion coating on the surface of the substrate consists of, from the inside out, a first copper layer, a nickel layer, a second copper layer, a semi-bright nickel layer, a semi-bright nickel layer, and a chromium layer. The first copper layer and nickel layer are both dry-plated ion plating processes used to fill cracks on the substrate surface to improve smoothness. The second copper layer, semi-bright nickel layer, semi-bright nickel layer and chromium layer are all electroless plating processes used to make the electroplating pores smaller than the diameter of halogen acid molecules.

[0013] A deep hole machining apparatus includes a drill bit with internal chip removal, the drill bit including a drill bit for drilling deep holes and a chip removal tube for discharging drilling chips, the drill bit including a base body with a through hole communicating with the chip removal tube and a cutting block for cutting workpieces, the end of the chip removal tube being sealed and fixedly connected to the base body. The sidewall and top surface of the substrate are jointly provided with a first chip discharge port that communicates with the chip discharge pipe. A first main cutting block is installed on one sidewall of the first chip discharge port. The cutting edge of the first main cutting block is positioned higher than the top surface of the substrate, part of the cutting edge extends out of the sidewall of the substrate, and the cutting edge is set along the radial direction of the substrate. Cutting fluid flows continuously on the outside of the chip removal pipe. The cutting fluid enters the chip removal pipe through the first chip removal port, which facilitates the discharge of chips cut by the first main cutting block through the first chip removal port.

[0014] Furthermore, several secondary cutting blocks are installed at intervals on the sidewall of the substrate. The cutting edge of the secondary cutting block is positioned higher than the sidewall of the substrate and runs along the length of the sidewall of the substrate, in order to improve the smoothness of the deep hole.

[0015] Furthermore, a second main cutting block is fixedly installed on the top surface of the substrate. The cutting edge of the second main cutting block is positioned higher than the top surface of the substrate. A second chip discharge port communicating with a chip discharge pipe is opened on the top surface of the substrate. A drainage groove is opened on the top surface of the substrate near the outer side of the second main cutting block to connect the second chip discharge port with the side wall of the substrate, so as to facilitate the discharge of the chips cut by the second main cutting block through the second chip discharge port.

[0016] Furthermore, the middle section of the chip removal pipe is movably connected to an oil conveyor, and the oil conveyor is provided with an oil conveying chamber. The left wall of the oil conveyor is connected to the chip removal pipe at intervals through an oil inlet sleeve, so as to connect the oil conveying chamber with the deep hole of the workpiece. The outer diameter of the extended end of the oil inlet sleeve is set smaller than the outer diameter of the drill bit so that the cutting fluid can smoothly enter the deep hole drilled in the workpiece.

[0017] Furthermore, the end of the chip removal pipe away from the drill bit is fixedly connected to the left wall of the chip extractor via a front nozzle, the right wall of the chip extractor is fixedly installed with a rear nozzle, and a chip extraction chamber is provided inside the chip extractor. The front nozzle and the rear nozzle are coaxial and opposite to each other. The right end of the front nozzle is fitted into the left end of the rear nozzle, and the gap between the front nozzle and the rear nozzle is a gradually narrowing funnel shape, so that the chip extraction chamber, the front nozzle and the rear nozzle are interconnected.

[0018] Furthermore, the oil delivery chamber is connected to the main pipeline via a first branch pipeline, and the chip extraction chamber is connected to the main pipeline via a second branch pipeline. A first pressure gauge and a first flow limiting valve are installed on the first branch pipeline, a second pressure gauge and a second flow limiting valve are installed on the second branch pipeline, and a third pressure gauge is installed on the main pipeline.

[0019] The advantages and positive effects of this invention are: By fixing several heating tubes to the outer wall of a small-volume gas chamber, the temperature of perfluorohexanone vapor entering the chamber is ensured to be no lower than its vaporization temperature. An air pump is installed at the inlet to reduce the residence time of perfluorohexanone vapor within the chamber, thus lowering the probability of liquefaction. Simultaneously, a dust filter plug is installed at the inlet to reduce the probability of dust entering the chamber and adhering to the inner wall due to perfluorohexanone vapor liquefaction. This allows the small perfluorohexanone detection device to be used at fire scenes and improves the detection accuracy and lifespan of the NDIR sensor.

[0020] By applying an anti-corrosion coating to the surface of the testing equipment, the first copper and nickel layers of the coating are achieved using a dry ion plating process. The first copper layer can fill cracks and protrusions on the surface of the testing equipment, but its adhesion is weak, requiring an additional nickel layer to improve its adhesion strength. The second copper layer, semi-bright nickel layer, semi-bright nickel layer, and chromium layer are all applied using a chemical plating process, ensuring that the electroplating pores of each layer are smaller than halogen acid molecules such as HF. This results in excellent corrosion resistance in media such as acids, alkalis, salts, ammonia, and seawater, enabling the outer shell of the testing equipment to withstand corrosion from high concentrations of hydrogen fluoride gas, a byproduct of fire extinguishing.

[0021] The gas chamber is a tube with a deep hole structure. To reduce the size of the testing equipment, the gas chamber is a small-sized deep hole. To reduce the probability of perfluorohexane water vapor adhering to the inner wall of the gas chamber and liquefying, the deep hole has a high smoothness. By setting up a deep hole processing equipment that includes a drill, an oil pump and a chip extractor, it is possible to process small-diameter, high-curvature deep holes, thereby reducing the size of the testing equipment. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a front view of a small perfluorohexanone concentration detection device according to the present invention; Figure 2 This is a right view of a small perfluorohexanone concentration detection device according to the present invention; Figure 3 This is a three-dimensional schematic diagram of the gas chamber in a small perfluorohexanone concentration detection device of the present invention; Figure 4 This is a cross-sectional view of the anti-corrosion coating on the surface of a small perfluorohexanone concentration detection device according to the present invention; Figure 5 This is a front view of a deep hole machining equipment according to the present invention; Figure 6 This is a front sectional view of a drill bit in a deep hole machining device according to the present invention; Figure 7This is a top view of a drill bit in a deep hole machining device according to the present invention.

[0023] In the diagram: 1. Oil feeder; 2. Chip extractor; 301. Chip removal pipe; 302. Drill bit; 321. First main cutting block; 322. Secondary cutting block; 323. Second main cutting block; 324. Drainage channel; 325. Second chip removal port; 326. First chip removal port; 4. Main pipeline; 5. First branch pipeline; 501. First pressure gauge; 502. First flow restrictor valve; 6. Second branch pipeline; 601. Second flow restrictor valve; 602. Second pressure gauge; 7. Front nozzle; 8. Rear nozzle; 9. Oil inlet sleeve; 10. Workpiece; 11. Housing; 12. NDIR sensor; 121. Air chamber; 122. Heating tank; 13. Dust filter plug; 14. Air pump; 15. Temperature control unit; 16. Remote transmission unit; 17. Air outlet. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] This invention provides a small-scale perfluorohexanone concentration detection device, such as... Figure 1 and 2 The device shown includes a corrosion-resistant and high-temperature-resistant housing 11, within which are encapsulated an NDIR sensor 12, an air pump 14, a temperature acquisition unit, and a temperature control unit 15. The air pump 14 draws in air containing perfluorohexanone water vapor, directing the air through the NDIR sensor 12. The NDIR sensor 12 uses non-dispersive infrared spectroscopy to detect the concentration of perfluorohexanone water vapor in the flowing air. The temperature acquisition unit detects the temperature data of the air entering the NDIR sensor 12. The temperature control unit 15 receives the temperature data to adjust the temperature of the air flowing within the NDIR sensor 12, reducing the probability of exothermic liquefaction of perfluorohexanone water vapor within the NDIR sensor 12.

[0027] The NDIR sensor 12 includes a tubular air chamber 121 for air containing perfluorohexanone water vapor to circulate. An infrared light emitting device and an infrared light receiving device are provided in the middle section of the air chamber 121. Based on the data from the above two devices and non-dispersive infrared technology, the concentration of perfluorohexanone water vapor in the air chamber 121 is determined.

[0028] like Figure 3 As shown, heating grooves 122 are formed on several outer walls of the gas chamber 121. Heating rods are fixedly installed in the heating grooves 122 to heat the gas chamber 121, preventing the gas chamber 121 from becoming too cold and causing the perfluorohexanone water vapor to directly liquefy upon entering the gas chamber 121, resulting in a reduction in the content of perfluorohexanone water vapor in the air and affecting the accuracy of detection. Perfluorohexanone water vapor can also cause dust to adhere to the inner wall of the gas chamber 121 or the infrared light emitting or receiving device, blocking the air inlet or outlet 17 of the gas chamber 121, or affecting the accuracy of the NDIR sensor 12.

[0029] A temperature sensor is installed at the air inlet of the air chamber 121 to monitor the temperature at the air inlet. The temperature sensor is electrically connected to the temperature control unit 15, which is electrically connected to the heating rod. The temperature sensor adjusts the operating power of the heating rod according to the air temperature at the air inlet of the air chamber 121 to reduce the probability of perfluorohexanone water vapor liquefaction in the air chamber 121.

[0030] When the temperature of the gas being detected is different, the detection results of conventional infrared sensors will drift. In addition, the air temperature difference varies greatly in the fire extinguishing environment. In order to improve the accuracy of the detection results of the detection equipment, the temperature control unit 15 is equipped with a PID constant temperature control module to improve the stability of the air temperature in the gas chamber 121.

[0031] An air pump 14 is provided at the air inlet of the air chamber 121. The air pump 14 provides kinetic energy to the air, shortens the residence time of the air in the air chamber 121, and reduces the probability of perfluorohexanone water vapor liquefaction in the air chamber 121.

[0032] A first through hole is provided on the side wall of the outer casing 11, which is directly connected to the air inlet of the air pump 14. A second through hole is provided on the side wall of the outer casing 11, which is connected to the air outlet 17 of the air chamber 121, so that external air enters the air chamber 121 through the first through hole and then exits through the second through hole. In one embodiment of this application, the air outlet 17 of the air chamber 121 is located close to the second through hole, and the air inlet of the air pump 14 is located close to the first through hole, thereby shortening the air flow path and the residence time of the air in the outer casing 11.

[0033] A dust filter plug 13 is installed at the first through hole. Replacing the dust filter plug 13 regularly reduces the probability of dust entering the gas chamber 121. Even in extreme cases, if a small amount of perfluorohexanone water vapor liquefies and adheres to the gas chamber 121, the liquid perfluorohexanone will re-vaporize, and no dust will adhere, reducing the probability of blockage in the gas chamber 121.

[0034] The top surface of the housing 11 is provided with a remote transmission unit 16. The remote transmission unit 16 receives data from the NDIR sensor 12 and transmits it to the host computer over a long distance. The host computer then displays the detection results remotely.

[0035] One embodiment of this application is as follows: the 1047A acts as a temperature acquisition device, collecting the actual temperature at the air inlet. The 1047A outputs a voltage signal, and the microcontroller in the temperature control unit 15 receives the analog voltage and converts it into temperature information.

[0036] When an indoor fire occurs, the fire alarm controls the simultaneous activation of the perfluorohexanone (PFH) fire extinguisher and the PFH concentration detection equipment. The PPH extinguisher sprays liquid PPH onto the fire source, and the PPH vaporizes, absorbing heat and completing the fire extinguishing process. The detection equipment collects ambient air data during the fire extinguishing process.

[0037] The air movement path is as follows: ambient air passes through dust filter plug 13 to remove most of the dust, flows through air pump 14 and enters air chamber 121. Air pump 14 makes ambient air flow quickly through air chamber 121, and the residence time in air chamber 121 is no more than 1 second.

[0038] The temperature control unit 15 controls the heating rod to adjust the air temperature based on the voltage signal output by 1047A, so that the air temperature in the air chamber 121 is stable and not lower than the vaporization temperature of perfluorohexanone water vapor, thereby reducing the probability of the infrared sensor's detection result drifting and reducing the probability of perfluorohexanone water vapor liquefaction.

[0039] The NDIR sensor 12 continuously detects the content of perfluorohexanone and transmits it to the host computer via the remote transmission unit 166. The host computer then displays the changes in the concentration of perfluorohexanone during the fire extinguishing process.

[0040] The control method within the PID constant temperature control module is as follows: Set a preset temperature, collect the temperature of perfluorohexanone water vapor before it enters the gas chamber 121, and determine whether the difference between the preset temperature and the collected temperature is less than the temperature threshold. If yes, use the PID control algorithm to adjust the pulse width of the PWM pulse and control the heating temperature of the heating tube through the PWM pulse; otherwise, adjust the pulse width of the PWM pulse through a proportional algorithm and control the heating temperature of the heating tube through the PWM pulse.

[0041] One embodiment of this application is as follows: the preset temperature is 70 degrees Celsius, and the temperature threshold is 10 degrees Celsius. The preset temperature is much higher than the boiling point of perfluorohexanone, which can rapidly raise the temperature of the perfluorohexanone water vapor entering the gas chamber, reducing the probability of perfluorohexanone water vapor liquefying in the gas chamber.

[0042] PID control is a combination of proportional, integral, and derivative algorithms used in linear control to obtain the output. The control deviation e(t) is obtained by subtracting the desired preset temperature r(t) of the temperature control unit from the sampled temperature y(t) of the controlled object. The formula is as follows: e(t) = r(t) - y(t) Then, the proportional, integral, and derivative of the deviation e(t) are added to the controlled object (heating tube) through linear addition. The PID algorithm takes the deviation value e(t), and after PID operation, obtains the output value u(t) of the PID controller. u(t) is used as the output quantity for the controlled object.

[0043] Then there is

[0044] Where: Kp is the proportionality coefficient, Ti is the integral time constant, and Td is the differential time constant.

[0045] Applying the Laplace transform to the above, we can obtain its transfer function as follows:

[0046] With the rapid development of microcontroller technology, replacing analog PID controllers with digital PID controllers using microcontrollers has become a major trend. Since computer control cannot provide continuous output control, time discretization is necessary before applying it to microcontroller sampling control. In the process of converting analog algorithms to digital algorithms, proportional gain can be used directly, but the derivative and integral must be discretized. The sampling point Kt represents time t, and the derivative and integral are replaced by incremental and summative expressions, respectively. The conversion formula is shown below.

[0047]

[0048]

[0049]

[0050] Where T is the sampling period. When discretizing, the sampling time must be small enough. For ease of expression, e(kT) is simplified to e(k) to obtain: or

[0051] The PID control algorithm uses the incremental PID algorithm, and the formula is as follows:

[0052]

[0053] The output of the incremental PID control algorithm can be seen from the above formula. It only depends on the deviations of the last three values. Therefore, the incremental PID control algorithm does not need to calculate all previous accumulated values; the incremental output is related to the last three deviation values. If the calculation fails, the impact on the system is relatively small. The output of the incremental PID is the difference between the current output and the previous output. When the output is positive, the control input needs to be increased based on the previous control result. When the output is negative, the control input needs to be decreased based on the previous control result.

[0054] To ensure more accurate temperature data, a filtering algorithm was incorporated into the temperature control unit 15 to discard temperatures that differ significantly from the previous sampled temperature. The sampled temperature data is then processed by a positional PID algorithm, and the output is fed into a timer. The timer then generates a PWM wave from the output value, which is applied to the heating element to adjust its power.

[0055] To reduce the computational burden, when the difference between the target temperature and the actual temperature is greater than 10°C, only proportional calculations are retained. This allows for a rapid heating of perfluorohexanone water vapor to 70°C, reducing the probability of perfluorohexanone water vapor liquefaction. When the temperature difference is less than 10°C, integral and differential calculations are added to precisely control the temperature of the perfluorohexanone water vapor, reducing the probability of temperature drift in the NDIR sensor 12.

[0056] A corrosion-resistant coating with high corrosion resistance When the detection equipment is exposed to a perfluorohexanone fire extinguishing environment, the high concentration of hydrogen fluoride gas produced can easily corrode the surface of the housing 11, causing damage to the housing 11 and resulting in corrosion of the electronic equipment inside the housing 11. This renders conventional infrared perfluorohexanone detection equipment unsuitable for on-site use.

[0057] Therefore, the outer casing 11 of the detection equipment needs to be coated with an anti-corrosion coating so that the detection equipment can be used for a long time in a high-concentration HF environment, thus extending the service life of the detection equipment.

[0058] like Figure 4 As shown, the outer shell 11 serves as the substrate, and its material can be 6061 aluminum. The anti-corrosion coating on the surface of the substrate consists of, from the inside out, a first copper layer, a nickel layer, a second copper layer, a semi-bright nickel layer, a semi-bright nickel layer, and a chromium layer.

[0059] The corrosion caused by high-concentration HF is likely due to the fact that halogen acid molecules, under high humidity conditions, can penetrate the coatings of traditional anodizing or electroplating processes, corroding the underlying metal. Ion plating, on the other hand, produces a dense, pinhole-free, bubble-free, and uniformly thick coating; even facets and grooves can be uniformly plated without forming metal nodules. Ion plating can repair minor cracks and pitting defects on the surface of workpieces, effectively improving the surface quality and physical and mechanical properties of the plated parts.

[0060] Both the first copper layer and the nickel layer are applied using a dry ion plating process. The first copper layer can repair defects in the adhesion of the substrate. Since the first copper layer has weak adsorption on the substrate surface, a nickel layer with strong adsorption is plated on the surface of the first copper layer to improve the strength of the substrate surface.

[0061] The second copper layer, semi-bright nickel layer, semi-bright nickel layer, and chromium layer are applied using a chemical plating process. Copper has good adhesion to various metal elements, while nickel and zinc have relatively poor adhesion. Therefore, the second copper layer can improve the strength between the semi-bright nickel layers and the nickel layers.

[0062] The two semi-bright nickel layers together constitute a double-layer nickel structure. The semi-bright nickel layer contains less than 0.005% sulfur, while the outer layer is bright nickel with a sulfur content greater than 0.04%, typically around 0.05%. Because the bright nickel layer with higher sulfur content has a lower corrosion potential, the corrosion potential difference between the bright and semi-bright nickel layers is usually 120–160 mV. Once corrosion occurs, the bright nickel layer with higher sulfur content becomes the anode, and the bottom semi-bright nickel layer becomes the cathode. The bright nickel layer corrodes preferentially, causing the corrosion to develop laterally within the bright nickel layer and preventing it from penetrating deeper. This provides electrochemical protection to the semi-bright nickel layer, effectively improving the overall protective performance of the double-layer nickel structure against the steel substrate.

[0063] Furthermore, the second copper layer, semi-bright nickel layer, semi-bright nickel layer, and chromium layer are all electroless plated, resulting in an extremely uniform surface. The plating pores are smaller than halogen acid molecules such as HF, preventing them from penetrating the semi-bright nickel layer, semi-bright nickel layer, and chromium layer, thus providing high corrosion resistance. The electroless plating process also results in strong adhesion between layers, generally higher than that of electroplated layers, making them less prone to peeling and extending the service life of the anti-corrosion coating. Additionally, the electroless plating process produces high surface hardness and good wear resistance, leading to improved wear resistance and a longer service life for the treated mechanical parts.

[0064] One embodiment of this application: First copper layer - 8µm, nickel layer - 6µm, second copper layer - 1µm, semi-bright nickel layer - 10µm, semi-bright nickel layer - 6µm, chromium layer - 0.3µm. The product produced by this process is completely resistant to HF corrosion in practical applications.

[0065] A deep hole machining equipment To reduce the size of the detection equipment, the size of the NDIR sensor 12 needs to be reduced as much as possible. Since the infrared light emitting device and the infrared light receiving device are standard parts, only the size of the gas chamber 121 needs to be reduced. One embodiment of this application is as follows: the diameter of the gas chamber 121 is 8mm, the depth is 100mm, the standard tolerance is 0.15mm, and the corresponding tolerance grade needs to be ≤IT9 (i.e., H9); the tolerance of the small hole opening is 0.1mm, and the corresponding tolerance grade needs to be ≤IT7 (i.e., H7) to meet the requirements; the surface roughness Ra is 0.05um, corresponding to an N2 level glossy surface, and the polishing requirements are very high.

[0066] like Figure 5 As shown, the tool includes a drill bit 302 for drilling deep holes. The left end of the drill bit is a drill bit 302, and the right end is a chip removal pipe 301. Chips generated during drilling by the drill bit 302 are discharged through the chip removal pipe 301. In one embodiment of this application, the chip removal pipe 301 is a circular tube structure. The drill bit 302 includes a cutting block for cutting and a base for mounting the cutting block. The base is cylindrical, and one end of the base is fixedly connected to a seal.

[0067] like Figure 6 and Figure 7 As shown, the sidewall and top surface of the substrate are jointly provided with a first chip discharge port 326 that communicates with the chip discharge pipe 301. A first main cutting block 321 is fixedly installed on the sidewall of the first chip discharge port 326. The cutting edge at the upper end of the first main cutting block 321 is higher than the top surface of the substrate. The left side of the first main cutting block 321 and the left end of the cutting edge both extend out of the sidewall of the substrate. The cutting edge is set along the radial direction of the substrate.

[0068] During actual drilling: the workpiece 10 rotates along the axis and approaches the drill bit 302. The first main cutting block 321 on the drill bit 302 cuts the workpiece 10, creating a deep hole. To ensure timely removal of the cut chips, cutting fluid is continuously introduced into the deep hole. The cutting fluid flows sequentially through the outer side of the substrate, the first chip removal port 326, and the chip removal pipe 301. When the cutting fluid flows through the first chip removal port 326, it carries the chips cut by the first main cutting block 321 into the chip removal pipe 301, completing internal chip removal.

[0069] The left side of the first main cutting block 321 is also provided with a cutting edge, which cuts the sidewall of the deep hole a second time, thereby improving the smoothness of the deep hole. Several secondary cutting blocks 322 are installed at intervals on the sidewall of the substrate. The secondary cutting blocks 322 are also used to cut the sidewall of the deep hole, thereby improving the smoothness of the deep hole.

[0070] One embodiment of this application is as follows: the cutting edge of the secondary cutting block 322 is positioned higher than the side wall of the substrate, and the cutting edge is arranged along the length direction of the side wall of the substrate to facilitate the flow of cutting fluid and carry away debris.

[0071] To facilitate the discharge of chips generated by the secondary cutting block 322 through the first chip discharge port 326, the edge of the top surface of the substrate is chamfered; either a rounded corner or a right angle can be used. Chips generated at the sidewall of the substrate can be more easily carried to the top surface of the substrate by the cutting fluid and then discharged through the first chip discharge port 326.

[0072] One embodiment of this application is as follows: a drainage groove 324 is formed on the top surface of the substrate, and a second main cutting block 323 is fixedly installed on the bottom surface of the drainage groove 324. The top surface of the second main cutting block 323 is higher than the top surface of the substrate, and each side of the second main cutting block 323 is provided with a cutting edge, which can efficiently cut deep holes.

[0073] A second chip discharge port 325, which communicates with the chip discharge pipe 301, is provided on the top surface of the substrate. The second chip discharge port 325 is used to discharge the chips generated by the second main cutting block 323. The drainage channel 324 communicates with the second chip discharge port 325, and there is a gap between the second main cutting block 323 and the side wall of the drainage channel 324, which increases the flow space of the chips and reduces the probability of chip blockage.

[0074] The middle section of the chip removal pipe 301 is movably connected to the oil supply device 1. The oil supply device 1 has an oil supply chamber for storing cutting fluid and is used to continuously and stably supply cutting fluid into the deep hole. An oil inlet sleeve 9 is fixedly installed on the side wall of the oil supply device 1, and an oil inlet hole is formed on the oil inlet sleeve 9. The chip removal pipe 301 passes through the oil inlet hole. A gap exists between the chip removal pipe 301 and the oil inlet hole to facilitate the flow of cutting fluid from the oil supply chamber.

[0075] The outer diameter of the protruding end (left end) of the oil inlet sleeve 9 is set to be smaller than the maximum outer diameter of the drill bit 302 so that the protruding end of the oil inlet sleeve 9 can be fitted into the deep hole, and the cutting fluid can smoothly enter the deep hole opened by the workpiece 10.

[0076] The end of the chip removal pipe 301 away from the drill bit 302 is sealed and fixedly connected to the left wall of the chip extractor 2 through the front nozzle 7. The rear nozzle 8 is fixedly installed on the right wall of the chip extractor 2. The chip extractor 2 is provided with a chip extraction chamber, which is used to store cutting fluid.

[0077] The front nozzle 7 and the rear nozzle 8 are coaxial and oppositely arranged, with the right end of the front nozzle 7 inserted into the left end of the rear nozzle 8. The gap between the front nozzle 7 and the rear nozzle 8 forms a gradually narrowing funnel shape, with the narrowing end of the funnel closer to the rear nozzle 8. During chip removal, the pressure of the cutting fluid in the chip extraction chamber is greater than the pressure in the front nozzle 7 and the rear nozzle 8. The cutting fluid in the chip extraction chamber will enter the rear nozzle 8 along the funnel gap, carrying the liquid flowing out of the front nozzle 7 into the rear nozzle 8 quickly. This creates a pressure difference between the right and left ends of the front nozzle 7, pushing the cutting fluid at the left end of the front nozzle 7 (or the chip removal pipe 301) to the right. In one embodiment of this application, the pressure difference across the two ends of the chip removal pipe 301 can also draw the cutting fluid in the oil delivery chamber into the deep hole, improving chip removal efficiency.

[0078] The oil supply chamber is connected to the main pipeline 4 via a first branch pipe 5, which supplies cutting fluid. The first branch pipe 5 is equipped with a first pressure gauge 501 and a first flow-limiting valve 502 to control the flow rate and pressure of the cutting fluid in the oil supply chamber, thereby directing the cutting fluid into the deep hole. The chip extraction chamber is connected to the main pipeline 4 via a second branch pipe 6, which is equipped with a second pressure gauge 602 and a second flow-limiting valve 601. The main pipeline 4 is equipped with a third pressure gauge to adjust the flow rate and pressure in the chip extraction chamber.

[0079] The operation process of the deep hole machining equipment is as follows: The workpiece 10, which is a cylindrical structure, is clamped using a fixture. The workpiece 10 and the drill bit are placed coaxially and opposite to each other. When the workpiece 10 is close to the drill bit 302, the fixture rotates along the central axis with the workpiece 10, and the fixture gradually approaches the drill bit 302. When drilling, the moving speed of the fixture is adjusted according to the amount of chips generated and the chip removal capacity.

[0080] As the end face of the workpiece 10 gradually approaches the protruding end of the oil inlet sleeve 9, when it reaches a preset position, cutting fluid with sufficient pressure and flow rate is introduced into the oil supply device 1. The cutting fluid enters the deep hole through the oil inlet sleeve 9. The oil supply device 1 moves synchronously with the fixture, sliding on the chip removal pipe 301, causing the drill bit 302 to continue approaching the fixture until the deep hole is drilled. The preset position can be defined as: the distance between the protruding end of the oil inlet sleeve 9 and the workpiece 10 is less than a preset value, allowing all or most of the cutting fluid ejected from the oil inlet sleeve 9 to enter the deep hole.

[0081] The chips generated by the first main cutting block 321, the second main cutting block 323 and the secondary cutting block 322 on the drill bit 302 enter the chip removal pipe 301 through the first chip removal port 326, the second chip removal port 325 and the cutting fluid, respectively, and are then discharged through the front nozzle 7 and the rear nozzle 8.

[0082] The embodiments of the present invention have been described in detail above, but the content described is only a preferred embodiment of the present invention and should not be considered as limiting the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of this patent.

Claims

1. A small-scale perfluorohexanone concentration detection device, characterized in that, The device includes an NDIR sensor (12) for detecting the concentration of perfluorohexanone water vapor in the air. The NDIR sensor (12) includes a gas chamber (121) for the passage of perfluorohexanone water vapor. Several heating tubes are provided on the outer wall of the gas chamber (121) to reduce the probability of perfluorohexanone water vapor liquefaction and improve the temperature stability inside the gas chamber (121).

2. The small-scale perfluorohexanone concentration detection device according to claim 1, characterized in that, An air pump (14) is provided at the air inlet of the air chamber (121) to shorten the residence time of perfluorohexanone water vapor in the air chamber (121).

3. The small-scale perfluorohexanone concentration detection device according to claim 1, characterized in that, The air inlet of the air chamber (121) is provided with a replaceable dust filter plug (13) to reduce the dust content in the perfluorohexanone water vapor.

4. A corrosion-resistant coating with high corrosion resistance, characterized in that, The substrate includes a substrate for plating an anti-corrosion coating, wherein the anti-corrosion coating on the surface of the substrate consists of, from the inside out, a first copper layer, a nickel layer, a second copper layer, a semi-bright nickel layer, a semi-bright nickel layer, and a chromium layer. The first copper layer and nickel layer are both dry-plated ion plating processes used to fill cracks on the substrate surface to improve smoothness. The second copper layer, semi-bright nickel layer, semi-bright nickel layer and chromium layer are all electroless plating processes used to make the electroplating pores smaller than the diameter of halogen acid molecules.

5. A deep hole machining equipment, characterized in that, The drilling tool includes an internal chip removal type, the drilling tool includes a drill bit (302) for drilling deep holes and a chip removal tube (301) for removing chips, the drill bit (302) includes a base with a through hole communicating with the chip removal tube (301) and a cutting block for cutting workpiece (10), the end of the chip removal tube (301) is sealed and fixedly connected to the base; The sidewall and top surface of the substrate are jointly provided with a first chip discharge port (326) communicating with the chip discharge pipe (301). A first main cutting block (321) is installed on one sidewall of the first chip discharge port (326). The cutting edge of the first main cutting block (321) is positioned higher than the top surface of the substrate, part of the cutting edge extends out of the sidewall of the substrate, and the cutting edge is set along the radial direction of the substrate. Cutting fluid flows continuously on the outside of the chip removal pipe (301). The cutting fluid enters the chip removal pipe (301) through the first chip removal port (326) so that the chips cut by the first main cutting block (321) can be discharged through the first chip removal port (326).

6. The deep hole machining equipment according to claim 5, characterized in that, The substrate sidewall is equipped with several secondary cutting blocks (322) at intervals. The cutting edge of the secondary cutting block (322) is positioned higher than the sidewall of the substrate and runs along the length of the sidewall of the substrate, which is used to improve the smoothness of the deep hole.

7. A deep hole machining apparatus according to claim 5, characterized in that, A drainage groove (324) is provided on the top surface of the substrate. A second main cutting block (323) is fixedly installed on the bottom surface of the drainage groove (324). The cutting edge of the second main cutting block (323) is higher than the top surface of the substrate. A second chip discharge port (325) is provided on the top surface of the substrate and communicates with the chip discharge pipe (301). The opening of the second chip discharge port (325) is connected to the drainage groove (324) so ​​as to connect the second chip discharge port (325) with the side wall of the substrate, so as to facilitate the discharge of the chips cut by the second main cutting block (323) through the second chip discharge port (325).

8. A deep hole machining apparatus according to any one of claims 5-7, characterized in that, The middle section of the chip removal pipe (301) is movably connected to the oil delivery device (1). The oil delivery device (1) is provided with an oil delivery chamber. The left wall of the oil delivery device (1) is connected to the chip removal pipe (301) at intervals through the oil inlet sleeve (9) so as to connect the oil delivery chamber with the deep hole of the workpiece (10). The outer diameter of the protruding end of the oil inlet sleeve (9) is set smaller than the outer diameter of the drill bit (302) so that the cutting fluid can smoothly enter the deep hole drilled in the workpiece (10).

9. A deep hole machining apparatus according to claim 8, characterized in that, The end of the chip removal pipe (301) away from the drill bit (302) is fixedly connected to the left wall of the chip extractor (2) through the front nozzle (7), and the rear nozzle (8) is fixedly installed on the right wall of the chip extractor (2). A chip extraction chamber is provided inside the chip extractor (2). The front nozzle (7) and the rear nozzle (8) are coaxial and opposite to each other. The right end of the front nozzle (7) is inserted into the left end of the rear nozzle (8), and the gap between the front nozzle (7) and the rear nozzle (8) is a gradually narrowing funnel shape so that the chip extraction chamber, the front nozzle (7) and the rear nozzle (8) are interconnected.

10. The deep hole machining equipment according to claim 9, characterized in that, The oil delivery chamber is connected to the main pipeline (4) through a first branch pipeline (5), and the chip extraction chamber is connected to the main pipeline (4) through a second branch pipeline (6). A first pressure gauge (501) and a first flow limiting valve (502) are provided on the first branch pipeline (5), a second pressure gauge (602) and a second flow limiting valve (601) are provided on the second branch pipeline (6), and a third pressure gauge is provided on the main pipeline (4).

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