Wafer inspection machine switching device and application method

Abstract

The application relates to the technical field of detection equipment, and provides a wafer inspection machine switching device and an application method, wherein the switching device is installed in a wafer inspection machine, the wafer inspection machine is provided with detection cameras and a mechanical hand, the detection cameras are provided in two groups and are located above and below the switching device respectively, the switching device comprises a receiving mechanism, a switching mechanism, a lifting and pushing mechanism and a suction mechanism; the receiving mechanism is arranged in the wafer inspection machine and located between the two groups of detection cameras, a receiving seat for placing a wafer is slidably connected to the receiving mechanism; the switching mechanism is installed on the receiving mechanism and located outside the detection range of the detection cameras, and drives the receiving seat to move along the receiving mechanism; the suction mechanism is arranged on the receiving mechanism and connected with the receiving seat, a plurality of suction holes are arranged on the receiving seat, and the suction mechanism provides negative pressure suction on the wafer. The application has the effects of being more convenient for wafer inspection and obtaining more accurate detection data.

Description

Technical Field

[0001] This application relates to the field of testing equipment technology, and in particular to a wafer inspection machine switching device and its application method. Background Technology

[0002] A wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. The wafer fabrication process involves operations such as slicing, coding, cutting, and inspection. Among these, the inspection process is crucial, as it often affects the reliability and accuracy of the wafer in subsequent use.

[0003] Therefore, wafers are generally inspected using inspection machines or testing devices to reduce the occurrence of stains or scratches on the wafer surface. However, typical inspection machines or testing devices use a robotic arm to place the aligned wafer on a receiving platform and fix it in place. First, a camera takes a picture of one side of the wafer. Then, the robotic arm removes the wafer, and a flipping mechanism flips the wafer over. After re-alignment, the robotic arm puts the wafer back on the receiving platform for fixation and takes a picture of the other side of the wafer. Since the wafer needs to be aligned after each flip, i.e., to verify whether the position of the wafer after flipping is accurate, the inspection process and operation are very cumbersome and the inspection efficiency is low. Summary of the Invention

[0004] To address the aforementioned issues, this application provides a wafer inspection machine switching device and its application method.

[0005] The technical solution provided in this application for a wafer inspection machine switching device and its application method is as follows: A wafer inspection machine switching device is installed inside a wafer inspection machine, which includes an inspection camera and a robotic arm. Two sets of inspection cameras are located above and below the switching device, respectively. The switching device includes a receiving mechanism, a switching mechanism, a lifting and pushing mechanism, and an adsorption mechanism. The receiving mechanism is located inside the wafer inspection machine between the two sets of inspection cameras, and a receiving seat for placing wafers is slidably connected to the receiving mechanism. The switching mechanism is installed on the receiving mechanism but outside the inspection range of the inspection cameras, and drives the receiving seat to move along the receiving mechanism. The adsorption mechanism is located on the receiving mechanism and connected to the receiving seat, and the receiving seat has several adsorption holes, providing negative pressure adsorption for the wafer. The lifting and pushing mechanism is located below the receiving mechanism, and when the adsorption mechanism is closed, the pushing end rises and pushes the wafer away from the receiving seat. After the switching device drives the receiving seat to move, it returns the wafer to the receiving seat, and the inspection cameras collect wafer image data before and after the receiving seat moves.

[0006] By adopting the above technical solution, after the robotic arm places the wafer on the receiving seat, the adsorption mechanism adsorbs the wafer to stabilize it on the receiving seat. The detection camera acquires the wafer's image detection data. The adsorption mechanism is then closed, and the lifting and pushing mechanism pushes the wafer away from the receiving seat. After the switching device drives the receiving seat to move, the previously blocked area is opened. The lifting and pushing mechanism sends the wafer back to the receiving seat, where it is adsorbed and fixed by the adsorption mechanism. The detection camera collects the wafer's image data, and then the two or more sets of acquired wafer image data are compared to obtain complete and accurate wafer image data. This method does not require the robotic arm to flip the wafer to capture images from both sides, ensuring that the wafer is always in the same axial position. It eliminates the need for repeated position verification, providing a more convenient detection process and accurate detection data.

[0007] Optionally, the receiving mechanism includes a fixed platform, a receiving platform, and a connecting ring; the fixed platform is connected to the wafer inspection machine, the receiving platform is installed on the fixed platform, and the receiving platform has an inspection port for the inspection camera to take pictures; an annular groove is formed on the inner wall of the inspection port, and a connecting ring is slidably connected in the annular groove; the receiving seat is inserted into the annular groove and connected to the connecting ring; the switching mechanism drives the connecting ring to rotate along the annular groove and simultaneously changes the position of the receiving seat.

[0008] By adopting the above technical solution, when the wafer is located on the receiving seat, the inspection camera takes inspection data of the wafer. Subsequently, after the receiving seat loses the negative pressure of the adsorption mechanism, the lifting and pushing mechanism pushes the wafer upward to detach it from the receiving seat. The switching mechanism drives the connecting ring to rotate along the annular slide groove, and simultaneously changes the position of the receiving seat, so that the position originally blocked by the receiving seat is offset. The inspection camera can then take inspection data of the unblocked area. Then, the two or more sets of inspection data are combined and compared to obtain complete inspection data.

[0009] Optionally, at least two sets of receiving seats are provided, and each set is connected to the inner wall of the connecting ring.

[0010] By adopting the above technical solution, multi-point load-bearing can be achieved using at least two sets of support seats to ensure the stable placement of the wafer.

[0011] Optionally, the switching mechanism includes a switching drive, a linkage gear, and a linkage ring; the switching drive is mounted on a fixed platform, and the linkage gear is connected to the drive end of the switching drive; the linkage ring is sleeved on a connecting ring, and the receiving platform has a connection port, where the linkage gear and the linkage ring mesh at the connection port.

[0012] By adopting the above technical solution, when it is necessary to switch the position of the receiving seat to open the original obstructed position, the switching drive unit drives the linkage gear to rotate, the linkage gear drives the linkage ring to rotate, thereby causing the linkage gear to drive the connecting ring to rotate along the annular slide groove. The receiving seat is connected to the connecting ring, so it moves synchronously along the rotation trajectory of the connecting ring to offset the original obstructed position and open up space for the detection camera to acquire and capture detection data.

[0013] Optionally, the length of the receiving seat is less than the radius of the detection port, the lifting and pushing mechanism is located below the detection port and at the axis of the detection port; one corner of the receiving platform is located within the detection range of the detection camera, so that the detection range of the detection camera is staggered from the pushing position of the lifting and pushing mechanism.

[0014] By adopting the above technical solution, the length of the receiving seat is less than the radius of the detection port to separate the space for the lifting and pushing mechanism to lift. At the same time, one corner of the receiving platform is located within the detection range of the detection camera, so that the detection camera will capture the detection data of one corner each time, and the position is staggered from that of the lifting and pushing mechanism, so as not to affect the lifting and pushing mechanism.

[0015] Optionally, the lifting and pushing mechanism includes a pushing drive and a pushing seat; the pushing drive is located below the detection port, and the pushing seat is connected to the driving end of the pushing drive and drives the pushing seat to move in the vertical direction.

[0016] By adopting the above technical solution, when it is necessary to change the position of the receiving seat and lift the wafer, the adsorption mechanism stops the negative pressure adsorption, and the push drive drives the push seat to rise. The push seat rises from the axis of the detection port and fits with the bottom of the wafer. Continuing to rise will lift the wafer. After the wafer separates from the receiving seat, the receiving seat can be driven by the switching mechanism to rotate and change its position.

[0017] Optionally, the lifting and pushing mechanism also includes a moving drive and an extension; the moving drive is located inside the wafer inspection machine and outside the inspection range of the inspection camera; the extension is connected to the driving end of the moving drive, and the pushing drive is installed at the end of the extension away from the moving drive.

[0018] By adopting the above technical solution, the moving drive component drives the push drive component to move to the axis of the detection port or rotate out of the detection port and out of the detection range of the detection camera through the extension component, so as to ensure that when the detection camera is taking detection data, the push drive component and the push seat are out of the detection range, thus ensuring the accuracy of the detection data.

[0019] Optionally, the moving drive unit is also provided with a positioning component, which is located at the initial point of the moving path of the extension component. When the extension component is located at the initial point, the pusher is located at the axis of the detection port.

[0020] By adopting the above technical solution, when the extension moves to the initial point, it abuts against the positioning component, preventing the extension from moving further. This ensures the accuracy of the extension's movement path and allows the pusher seat to be precisely positioned at the axis of the detection port.

[0021] Optionally, the adsorption mechanism includes a negative pressure generating element, a delivery pipe, and a closing ring; the closing ring is installed in an annular groove, and the connecting ring extends downward so that the closing ring is offset from the linkage toothed ring; the connecting ring has several negative pressure ports at preset arc intervals, and the closing ring has an air inlet; when any negative pressure port rotates with the connecting ring to the air inlet, the air inlet connects with the negative pressure port; all negative pressure ports are connected to the adsorption holes; the negative pressure generating element is set on a fixed platform and connected to a delivery pipe, the end of which connects to the air inlet.

[0022] By adopting the above technical solution, when the connecting ring drives the receiving seat to rotate, it simultaneously drives the negative pressure port to rotate. When any negative pressure port rotates to the air inlet, the negative pressure generator is activated, and negative pressure is supplied to the air inlet through the delivery pipe. This causes the suction holes on the receiving seat to generate negative pressure to hold the wafer in place, thus ensuring the stability of the wafer. By connecting the negative pressure port to the air inlet, other negative pressure ports that are not connected to the air inlet can be blocked by the closing ring to ensure the stable delivery of negative pressure.

[0023] A method for applying a switching device in a wafer inspection machine includes the following steps: Initial reset of the switching device: Set the switching angle of the switching mechanism's single drive of the receiving seat, and set the number of times to capture and detect data; Wafer placement: The robotic arm places the wafer on the receiving seat, and the adsorption mechanism generates negative pressure to adsorb the wafer; First set of shooting and inspection data acquisition: The inspection camera is located above and below the receiving base, and simultaneously acquires the first set of shooting and inspection data above and below the wafer; Receiver switching: The adsorption mechanism stops supplying negative pressure, the lifting and pushing mechanism rises to lift the wafer and separate it from the receiver, the switching mechanism drives the receiver to rotate a preset angle, the lifting and pushing mechanism descends to place the wafer on the receiver, and the adsorption mechanism generates negative pressure adsorption again. Second set of shooting and inspection data acquisition: Inspection camera, simultaneously acquires the second set of shooting and inspection data of the wafer; If a third or more sets of shooting and detection data are set up, repeat the receiver switching steps until all detection data are acquired; Data comparison: All captured detection data are compared and overlapped to form complete detection data; Material handling: The negative pressure adsorption of the adsorption mechanism is stopped, and the robotic arm clamps and discharges the wafer.

[0024] By adopting the above technical solution and application method, the wafer does not need to be flipped. Multiple sets of camera data can be acquired simply by moving the mounting bracket in place, improving accuracy. Furthermore, the elimination of flipping and position calibration removes multiple steps, thus increasing inspection efficiency. In summary, this application includes at least one of the following beneficial technical effects: 1. After the robotic arm places the wafer on the receiving base, the adsorption mechanism adsorbs the wafer to secure it on the receiving base. The detection camera acquires the wafer's image detection data. The adsorption mechanism is then closed, and the lifting and pushing mechanism pushes the wafer away from the receiving base. After the switching device drives the receiving base to move, the previously blocked area is opened. The lifting and pushing mechanism sends the wafer back to the receiving base, where it is adsorbed and fixed by the adsorption mechanism. The detection camera collects the wafer's image data, and then the two or more sets of wafer image data are compared to obtain complete and accurate wafer image data. This method does not require the robotic arm to flip the wafer to capture images from both sides, ensuring that the wafer is always in the same axial position. It eliminates the need for repeated position verification, providing a more convenient detection process and accurate detection data. 2. When the wafer is on the receiving seat, the inspection camera takes inspection data of the wafer. After the receiving seat loses the negative pressure of the adsorption mechanism, the lifting and pushing mechanism pushes the wafer upward to detach it from the receiving seat. The switching mechanism drives the connecting ring to rotate along the annular slide groove, and at the same time changes the position of the receiving seat, so that the position originally blocked by the receiving seat is offset. The inspection camera can then take inspection data of the unblocked area. Then, the two or more sets of inspection data are combined and compared to obtain complete inspection data. 3. When it is necessary to switch the position of the receiving seat to open the original obstructed position, the switching drive unit drives the linkage gear to rotate, the linkage gear drives the linkage ring to rotate, thereby causing the linkage gear to drive the connecting ring to rotate along the annular slide groove. The receiving seat is connected to the connecting ring, so it moves synchronously along the rotation trajectory of the connecting ring to offset the original obstructed position and open up space for the detection camera to acquire and capture detection data. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural schematic diagram of the switching device in some embodiments of this application; Figure 2 This is a three-dimensional structural diagram of the receiving platform in some embodiments of this application; Figure 3 This is a three-dimensional structural diagram of the connecting ring and the closed ring in a separated state in some embodiments of this application; Figure 4 This is a cross-sectional structural schematic diagram of the switching mechanism in some embodiments of this application; Figure 5 This is a front view schematic diagram of the connecting ring and the closing ring in some embodiments of this application; Figure 6 This is a three-dimensional structural schematic diagram of the lifting and pushing mechanism in some embodiments of this application; The labels in the attached diagram are as follows: 1. Detection camera; 2. Receiving mechanism; 21. Receiving seat; 211. Adsorption hole; 22. Fixed platform; 23. Receiving platform; 231. Annular groove; 232. Connecting port; 234. Detection port; 24. Connecting ring; 241. Negative pressure port; 3. Switching mechanism; 31. Switching drive component; 32. Linkage gear; 33. Linkage gear ring; 4. Lifting and pushing mechanism; 41. Pushing drive component; 42. Pushing seat; 43. Moving drive component; 44. Extension component; 45. Positioning component; 5. Adsorption mechanism; 51. Negative pressure generating component; 52. Delivery pipe; 53. Closing ring; 531. Air inlet. Detailed Implementation

[0026] The following specific examples illustrate the implementation methods of this application. Those skilled in the art can easily understand other advantages and effects of this application from the information disclosed herein. This application can also be implemented or applied through other different specific embodiments, and various details in this application can be modified or changed according to different viewpoints and application systems without departing from the spirit of this application. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0027] The embodiments of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily implement the application. This application may be embodied in many different forms and is not limited to the embodiments described herein.

[0028] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics represented in connection with that embodiment or example, which are included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics represented may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate different embodiments or examples represented in this application, as well as features of different embodiments or examples.

[0029] Furthermore, the terms "first" and "second" are used only to indicate an objective and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the representation of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0030] Throughout this specification, when it is said that a device is "connected" to another device, this includes not only "direct connection" but also "indirect connection" by placing other components in between. Furthermore, when it is said that a device "comprises" a certain constituent element, unless otherwise stated otherwise, this does not exclude other constituent elements, but rather implies that other constituent elements may be included.

[0031] The following is in conjunction with the appendix Figure 1 - Appendix Figure 6 This application will be described in further detail below.

[0032] This application discloses a wafer inspection machine switching device and its application method.

[0033] A wafer inspection machine switching device, reference Figure 1 As shown, it is installed inside a wafer inspection machine. The wafer inspection machine is equipped with an inspection camera 1 and a robotic arm. There are two sets of inspection cameras 1, located above and below the switching device, respectively, so that the camera data of the wafer can be acquired simultaneously from both the top and bottom directions. The inspection camera 1 is equipped with a cover plate, which is used to block light and dust to prevent excessive light or dust from affecting the image data. If it does not affect the light, a transparent cover plate can also be used to provide dust protection. The robotic arm is used to place the wafer in or remove it from the switching device. Since the robotic arm is an existing structure and is not part of the switching device, it is not limited in detail here.

[0034] The wafer inspection machine is divided into a macroscopic station and a microscopic station. The switching device is mainly located in the macroscopic station, while the microscopic station is the data acquisition station of another set of microscopic inspection cameras 1. Therefore, the microscopic station will not be described in detail here.

[0035] The wafer inspection machine is equipped with a controller to control the operation of the entire machine. Therefore, the switching device will also be operated under the control of the wafer inspection machine's controller.

[0036] The switching device includes a receiving mechanism 2, a switching mechanism 3, an adsorption mechanism 5, and a lifting and pushing mechanism 4. The receiving mechanism 2 is located inside the wafer inspection machine and between two sets of inspection cameras 1. A receiving seat 21 for placing wafers is slidably connected to the receiving mechanism 2.

[0037] The switching mechanism 3 is installed on the receiving mechanism 2 and is located outside the detection range of the inspection camera 1. Therefore, it will not enter the detection range and block the wafer, affecting the accuracy of the detection data. At the same time, the switching mechanism 3 can provide a driving force to drive the receiving seat 21 to move along the receiving mechanism 2. The purpose of the moving receiving seat 21 is that, as a wafer placement structure, the receiving seat 21 will block the wafer when the inspection camera 1 is collecting and shooting detection data. Therefore, when the receiving seat 21 is driven by the switching mechanism 3 to move along the receiving mechanism 2, the originally blocked position is opened, and the inspection camera 1 can obtain the shooting detection data of the originally blocked position again.

[0038] The adsorption mechanism 5 is located on the receiving mechanism 2 and connected to the receiving seat 21. The receiving seat 21 is provided with a number of adsorption holes 211. In order to prevent the wafer from being unstable in position on the receiving seat 21, the adsorption mechanism 5 provides negative pressure adsorption for the wafer, so that the wafer is firmly held by the adsorption holes 211 on the receiving seat 21, thereby ensuring the stable placement of the wafer.

[0039] The lifting and pushing mechanism 4 is located below the receiving mechanism 2. The lifting and pushing mechanism 4 is used to push the wafer up or down. When the wafer is lifted, the wafer is separated from the receiving seat 21, so that the receiving seat 21 can be driven by the switching mechanism 3 to move along the receiving mechanism 2. At the same time, the receiving seat 21 does not contact the wafer when moving, so it will not scratch the wafer.

[0040] Specifically, after the robotic arm places the wafer on the receiving base 21, the adsorption mechanism 5 provides negative pressure adsorption to stably fix the wafer on the receiving base 21. The detection camera 1 acquires the wafer's image detection data. Then, to avoid the obstruction of the receiving base 21, the adsorption mechanism 5 is closed, the lifting and pushing mechanism 4 pushes the wafer away from the receiving base 21, and the switching device drives the receiving base 21 to move along the receiving mechanism 2, opening the original obstruction. Then, the lifting and pushing mechanism descends again to send the wafer back to the receiving base 21. After the receiving base 21 is adsorbed by the negative pressure provided by the adsorption mechanism 5, the detection camera 1 collects the wafer image data. Then, the two or more sets of wafer image data are compared to obtain complete and accurate wafer image data. This method does not require the use of a robotic arm to flip the wafer to capture images from both sides, and the wafer can always be in the same axial position. There is no need to repeatedly verify the position accuracy, which provides a more convenient detection process and accurate detection data.

[0041] Further reference Figure 1 As shown, the receiving mechanism 2 includes a fixed platform 22, a receiving platform 23, and a connecting ring 24. The fixed platform 22 is connected to the wafer inspection machine. The fixed platform 22 can be composed of a fixed plate and a fixed frame. The fixed plate can be fixedly installed on the inner wall of the wafer inspection machine, and the fixed frame can be installed at the bottom of the fixed plate to provide support. If the bearing capacity of the fixed plate is sufficient, the fixed frame may not be used.

[0042] The receiving platform 23 is installed on the fixed platform 22. The receiving platform 23 has a detection port 234 for the detection camera 1 to take pictures. The receiving platform 23 can be a circular platform with the detection port 234 in the middle. The detection port 234 is the same as the axis of the circular platform. The receiving seat 21 is also located inside the detection port 234 to provide wafer receiving.

[0043] refer to Figure 2 and Figure 3 As shown, an annular groove 231 is provided on the inner wall of the detection port 234. A connecting ring 24 is slidably connected in the annular groove 231. The annular groove 231 can be an inverted convex groove, that is, the cross-section of the annular groove 231 is inverted convex. The style of the connecting ring 24 matches the style of the annular groove 231, that is, the cross-section is an inverted convex annular structure. The connecting ring 24 can rotate along the annular groove 231. The receiving seat 21 is inserted into the annular groove 231 and connected to the connecting ring 24. The switching mechanism 3 can drive the connecting ring 24 to rotate along the annular groove 231 and simultaneously change the position of the receiving seat 21. Thus, the position that was originally blocked by the receiving seat 21 is offset due to the response of the receiving seat 21 to the connecting ring 24. The detection camera 1 can then capture detection data of the unblocked area.

[0044] The annular opening inside the connecting ring 24 is also a detection port 234, which can be the same size as or slightly smaller than the detection port 234 of the receiving platform 23.

[0045] Specifically, when the wafer is on the receiving seat 21, the inspection camera 1 takes inspection data of the wafer. After the receiving seat 21 loses the negative pressure of the adsorption mechanism 5, the lifting and pushing mechanism 4 pushes the wafer upward to detach it from the receiving seat 21. The switching mechanism 3 drives the connecting ring 24 to rotate along the annular slide groove 231, and simultaneously changes the position of the receiving seat 21, so that the position originally blocked by the receiving seat 21 is offset. The inspection camera 1 can then take inspection data of the unblocked area. The two or more sets of inspection data are then combined and compared to obtain complete inspection data.

[0046] Among them, reference Figure 1 As shown, at least two sets of support seats 21 are provided, and each set is connected to the inner wall of the connecting ring 24. By using at least two sets of support seats 21, multi-point load-bearing can be achieved to ensure the stable placement of the wafer.

[0047] In some embodiments, reference Figure 4 and Figure 5As shown, the switching mechanism 3 includes a switching drive 31, a linkage gear 32, and a linkage gear ring 33. The switching drive 31 is mounted on the fixed platform 22. The linkage gear 32 is connected to the drive end of the switching drive 31. The switching drive 31 can be a switching drive motor. The linkage gear 32 is connected to the drive shaft of the drive motor. The switching drive 31 can drive the linkage gear 32 to rotate.

[0048] The linkage gear ring 33 is sleeved on the connecting ring 24. The receiving platform 23 has a connection port. The linkage gear 32 and the linkage gear ring 33 are meshed at the connection port. The linkage gear ring 33 is specifically located in the upper half of the connecting ring 24. The connecting ring 24 adopts an inverted convex ring structure, so it is divided into upper and lower concave layers. The middle convex part is used to fit into the annular slide groove 231 to provide a limit. The linkage gear ring 33 is connected to the upper concave part. Similarly, the connection port of the receiving platform 23 is also opened on the side of the upper concave part near the fixed platform 22.

[0049] Specifically, when it is necessary to switch the position of the receiving seat 21 to open the original obstructed position, the switching drive 31 drives the linkage gear 32 to rotate, the linkage gear 32 drives the linkage ring 33 to rotate, thereby causing the linkage gear 32 to drive the connecting ring 24 to rotate along the annular slide groove 231. The receiving seat 21 is connected to the connecting ring 24, so they move synchronously along the rotation trajectory of the connecting ring 24 to offset the original obstructed position and open up space for the detection camera 1 to acquire and capture detection data.

[0050] Further reference Figure 1 As shown, the length of the receiving seat 21 is less than the radius of the detection port 234, resulting in a certain distance between the receiving seat 21 and the axis of the detection port 234. Therefore, a space is left empty. The lifting and pushing mechanism 4 is located below the detection port 234 and at the axis of the detection port 234, so that the lifting and pushing mechanism 4 can extend or retract from the empty space to lift the wafer from the receiving seat 21 or place it on the receiving seat 21. At the same time, since the length of the receiving seat 21 cannot extend to the axis of the detection port 234, the receiving seat 21 will not contact the lifting and pushing mechanism 4 located at the axis of the detection port 234 when it rotates.

[0051] One corner of the receiving platform 23 is located within the detection range of the inspection camera 1, thus offsetting the detection range of the inspection camera 1 from the pushing position of the lifting and pushing mechanism 4. This method allows the inspection camera 1 to inspect only one corner of the wafer during inspection, so that when all corners are inspected, the data of all corners are superimposed and compared. At the same time, the offset position from the lifting and pushing mechanism 4 will not affect the lifting and pushing mechanism 4. That is, if the inspection camera 1 and the lifting and pushing mechanism 4 are located on the same axis, then the lifting and pushing mechanism will be within the detection range of the inspection camera 1 and will not block the inspection camera 1. When the inspection camera 1 only takes pictures of one corner of the receiving platform 23, it will not affect the lifting and pushing mechanism 4 or be blocked.

[0052] Specifically, in this embodiment, three support seats 21 are provided, so each support seat 21 is set at a 120° interval. That is, a set of support seats 21 is set at a 120° angle with the axis of the detection port 234. The connecting ring 24 rotates 60°-180° along the axis each time, which can stagger the support seats 21. The acquisition of shooting detection data is different depending on the rotation angle. For example, at 180°, only two shots are needed.

[0053] In some embodiments, the lifting and pushing mechanism 4 includes a pushing drive 41 and a pushing seat 42. The pushing drive 41 is disposed below the detection port 234. The pushing drive 41 can be a pushing cylinder or an electric push rod. The pushing seat 42 is connected to the driving end of the pushing drive 41 and drives the pushing seat 42 to move in the vertical direction. The pushing seat 42 is designed to increase the contact area with the wafer. The surface can be provided with rubber or a suction cup to increase the friction with the wafer without damaging the wafer surface.

[0054] Specifically, when it is necessary to change the position of the receiving seat 21 and lift the wafer, the adsorption mechanism 5 stops the negative pressure adsorption, and the push drive 41 drives the push seat 42 to rise. The push seat 42 rises from the axis of the detection port 234 and fits against the bottom of the wafer. The wafer can be lifted by continuing to rise. After the wafer is separated from the receiving seat 21, the receiving seat 21 can be driven by the switching mechanism 3 to rotate and change its position.

[0055] After the position of the receiving seat 21 is switched, the push drive 41 drives the push seat 42 to descend, so that the wafer is put back on the receiving seat 21, and the adsorption mechanism 5 resupplyes negative pressure to stabilize the wafer on the receiving seat 21.

[0056] Further reference Figure 4 and Figure 6 As shown, in order to ensure that the lifting and pushing mechanism 4 does not obstruct the inspection camera 1, the lifting and pushing mechanism 4 also includes a moving drive component 43 and an extension component 44; the moving drive component 43 is disposed inside the wafer inspection machine and is located outside the inspection range of the inspection camera 1. The moving drive component 43 can be a moving drive motor or a drive cylinder. In this embodiment, a drive motor is used as an example.

[0057] The extension member 44 is connected to the drive end of the moving drive member 43. The push drive member 41 is installed on the end of the extension member 44 away from the moving drive member 43. The extension member 44 can be an extension frame. The extension frame is connected to the drive shaft of the drive motor, so that the drive motor can drive the extension member 44 to rotate into the detection port 234 or rotate out of the detection port 234. The push drive member 41 is set on the extension frame, so that the extension frame can drive the push drive member 41 to move to the axis of the detection port 234 or rotate out of the detection port 234 to get out of the detection range of the detection camera 1.

[0058] Specifically, the moving drive 43 drives the push drive 41 to move to the axis of the detection port 234 or rotate out of the detection port 234 to get out of the detection range of the detection camera 1 through the extension 44, so as to ensure that when the detection camera 1 is taking detection data, the push drive 41 and the push seat 42 are out of the detection range, thus ensuring the accuracy of the detection data.

[0059] Furthermore, refer to Figure 6 As shown, the moving drive component 43 is also provided with a positioning component 45. The positioning component 45 is located at the initial point of the moving path of the extension component 44. The positioning component 45 can be a positioning post, which is used to restrict the moving path of the extension component 44 so that the extension component 44 cannot continue to move when it moves to the positioning component 45. When the extension component 44 is at the initial point, the push seat 42 is located at the axis of the detection port 234. Therefore, when the extension component 44 drives the push drive component 41 to move, it is blocked by the positioning component 45, that is, it is located at the axis of the detection port 234, so that there is no need to slowly move the push drive component 41, thus achieving rapid positioning and accurate movement position.

[0060] Specifically, when the extension 44 moves to the initial point, it abuts against the positioning member 45, preventing the extension 44 from moving further, thereby ensuring the accuracy of the movement path of the extension 44 and ensuring that the position of the pusher 42 is accurately located at the axis of the detection port 234.

[0061] In some embodiments, reference Figure 3 and Figure 4 As shown, the adsorption mechanism 5 includes a negative pressure generating element 51, a delivery pipe 52, and a closing ring 53. The negative pressure generating element 51 can be a negative pressure generator or an air pump. The required negative pressure equipment can be selected according to the needs. The closing ring 53 is installed in the annular groove 231. The connecting ring 24 extends downward so that the closing ring 53 is offset from the linkage toothed ring 33. That is, the connecting ring 24 adopts an inverted convex annular structure. The linkage toothed ring 33 is connected to the upper concave part, while the closing ring 53 is located in the lower concave part. However, the closing ring 53 is not fixedly connected to the connecting ring 24, but is connected to the inner wall of the annular groove 231. It can be in contact with the lower concave part of the connecting ring 24.

[0062] The connecting ring 24 has several negative pressure ports 241 spaced at preset arc intervals, and the closing ring 53 has an air inlet 531. When any negative pressure port 241 rotates with the connecting ring 24 to the air inlet 531, the air inlet 531 aligns with the negative pressure port 241, that is, the closing ring 53 and the connecting ring 24 are in contact and connected, so that all negative pressure ports 241 are in a closed state by the closing ring 53, that is, all negative pressure ports 241 are blocked. However, the closing ring 53 has an air inlet 531, and all negative pressure ports 241 are connected to the adsorption hole 211. Therefore, when any negative pressure port 241 on the connecting ring 24 aligns with the air inlet 531, the negative pressure provided by the negative pressure generator 51 can be connected to the adsorption hole 211 through the air inlet 531 and the corresponding negative pressure port 241 to adsorb the wafer. The other negative pressure ports 241 that are not aligned with the air inlet 531 are blocked by the closing ring 53 and cannot provide negative pressure or allow gas to flow.

[0063] The negative pressure generator 51 is set on the fixed platform 22 and connected to the delivery pipe 52. The delivery pipe 52 passes through the receiving platform 23 and connects to the air inlet 531. The passage method can be to open a passage in the receiving platform 23 for the delivery pipe 52 to pass through, and supply negative pressure to the air inlet 531 through the delivery pipe 52.

[0064] There is an airflow channel between the negative pressure port 241 and the adsorption hole 211, so that the negative pressure port 241 and the adsorption hole 211 are connected.

[0065] Specifically, when the connecting ring 24 drives the receiving seat 21 to rotate, it simultaneously drives the negative pressure port 241 to rotate. When any negative pressure port 241 rotates to the air inlet 531, the negative pressure generator 51 is activated and provides negative pressure to the air inlet 531 through the delivery pipe 52. This causes the adsorption holes 211 on the receiving seat 21 to generate negative pressure and hold the wafer in place, thus ensuring the stability of the wafer. By connecting the negative pressure port 241 with the air inlet 531, other negative pressure ports 241 that are not connected to the air inlet 531 can be blocked by the closing ring 53 to ensure the stable delivery of negative pressure.

[0066] This application also provides an application method for a wafer inspection machine switching device, which, for the switching device in the above embodiments, includes the following steps: Initial reset of the switching device: The switching angle of the switching mechanism 3 single drive of the receiving seat 21 needs to be set through the controller of the wafer inspection machine, and the number of times to capture and detect data needs to be set to ensure the accuracy of the data.

[0067] Wafer placement: The robotic arm places the wafer on the receiving seat 21, and the adsorption mechanism 5 generates negative pressure to adsorb the wafer.

[0068] The adsorption mechanism 5 delivers negative pressure to the air inlet 531 through the delivery pipe 52. Depending on the position of the rotating connecting ring 24, different negative pressure ports 241 are switched to the air inlet 531 to ensure that negative pressure can be supplied every time the connecting ring 24 rotates.

[0069] First set of shooting and detection data acquisition: The detection camera 1 is located above and below the receiving base 21, and simultaneously acquires the first set of shooting and detection data above and below the wafer. The first set of shooting and detection data will be partially blocked by the receiving base 21.

[0070] The detection camera 1 acquires video detection data in the following way: a nine-square grid shooting method. That is, the detection camera 1 is connected to a mobile device and can move along a predetermined nine-square grid path. When it moves to a point in the nine-square grid, it takes a picture to acquire data. Therefore, a single set of shooting detection data can be data from multiple shots.

[0071] Switching of receiving seat 21: The adsorption mechanism 5 stops supplying negative pressure, the lifting and pushing mechanism 4 rises to lift the wafer and separates it from the receiving seat 21, the switching mechanism 3 drives the receiving seat 21 to rotate a preset angle, the lifting and pushing mechanism 4 descends to place the wafer on the receiving seat 21, and the adsorption mechanism 5 generates negative pressure adsorption again.

[0072] In this process, after the negative pressure generator 51 of the adsorption mechanism 5 stops supplying negative pressure, the push drive 41 drives the push seat 42 to rise and lift the wafer to separate the receiving seat 21 from the wafer. Then, the switching drive 31 drives the linkage gear 32 to rotate, so that the connecting ring 24 rotates along the annular slide groove 231 through the meshing linkage gear ring 33, causing the connecting ring 24 to move the position of the receiving seat 21, freeing up the position that was originally blocked by the receiving seat 21. At the same time, another negative pressure port 241 is aligned with the air inlet 531. Then, the push drive 41 drives the push seat 42 to descend and put the wafer back on the receiving seat 21. The negative pressure generator 51 generates negative pressure and sucks the wafer through the adsorption hole 211 of the receiving seat 21.

[0073] If a moving drive 43 is provided, after the pusher 42 separates from the wafer, the moving drive 43 drives the extension 44 to rotate the pusher 41 and the pusher 42 out of the detection range of the detection camera 1 to avoid obstruction.

[0074] Second set of shooting and detection data acquisition: Detection camera 1 synchronously acquires the second set of shooting and detection data of the wafer, and fills in the part that was originally blocked by the support 21.

[0075] If a third or more sets of shooting and detection data are set to be acquired, repeat the switching steps of the receiver 21 until all detection data are acquired.

[0076] Data comparison: All captured inspection data are compared and overlapped to form complete inspection data, thereby detecting whether the wafer surface is intact and identifying defective or finished products.

[0077] Material handling: Stop the negative pressure adsorption of adsorption mechanism 5, and the robot arm clamps and discharges the wafer.

[0078] According to the above application method, the wafer does not need to be flipped. Multiple sets of camera data can be acquired simply by raising and lowering the position of the receiving seat 21 in place. This improves accuracy, eliminates the need for flipping and position calibration, saves multiple steps, and improves detection efficiency.

[0079] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer inspection machine switching device, installed inside a wafer inspection machine, the wafer inspection machine being equipped with an inspection camera (1) and a robotic arm, the inspection camera (1) being provided in two sets, located above and below the switching device respectively, characterized in that, The switching device includes a receiving mechanism (2), a switching mechanism (3), a lifting and pushing mechanism (4), and an adsorption mechanism (5); the receiving mechanism (2) is located inside the wafer inspection machine and between two sets of inspection cameras (1), and a receiving seat (21) for placing wafers is slidably connected on the receiving mechanism (2); the switching mechanism (3) is installed on the receiving mechanism (2) and is located outside the detection range of the inspection camera (1), and drives the receiving seat (21) to move along the receiving mechanism (2); the adsorption mechanism (5) is located on the receiving mechanism (2) and connected to the receiving seat (21), and the receiving seat (21) is provided with several adsorption holes (211), and the adsorption mechanism (5) provides negative pressure adsorption for the wafer; The lifting and pushing mechanism (4) is located below the receiving mechanism (2). When the adsorption mechanism (5) is closed, the pushing end rises and pushes the wafer away from the receiving seat (21). After the switching device drives the receiving seat (21) to move, the wafer is sent back to the receiving seat (21). The detection camera (1) collects wafer imaging data before and after the receiving seat (21) moves.

2. The wafer inspection machine switching device according to claim 1, characterized in that, The receiving mechanism (2) includes a fixed platform (22), a receiving platform (23), and a connecting ring (24). The fixed platform (22) is connected to the wafer inspection machine, and the receiving platform (23) is installed on the fixed platform (22). The receiving platform (23) has an inspection port (234) for the inspection camera (1) to take pictures. The inner wall of the inspection port (234) has an annular groove (231). The connecting ring (24) is slidably connected in the annular groove (231). The receiving seat (21) is inserted into the annular groove (231) and connected to the connecting ring (24). The switching mechanism (3) drives the connecting ring (24) to rotate along the annular groove (231) and simultaneously changes the position of the receiving seat (21).

3. The wafer inspection machine switching device according to claim 2, characterized in that, The receiving seat (21) is provided in at least two sets, and each set is connected to the inner wall of the connecting ring (24).

4. A wafer inspection machine switching device according to claim 2, characterized in that, The switching mechanism (3) includes a switching drive (31), a linkage gear (32), and a linkage ring (33); the switching drive (31) is set on the fixed platform (22), and the linkage gear (32) is connected to the drive end of the switching drive (31); the linkage ring (33) is sleeved on the connecting ring (24), and the receiving platform (23) has a connection port, and the linkage gear (32) and the linkage ring (33) mesh at the connection port.

5. A wafer inspection machine switching device according to claim 2, characterized in that, The length of the receiving seat (21) is less than the radius of the detection port (234). The lifting and pushing mechanism (4) is located below the detection port (234) and at the center of the detection port (234). One corner of the receiving platform (23) is located within the detection range of the detection camera (1), so that the detection range of the detection camera (1) is offset from the pushing position of the lifting and pushing mechanism (4).

6. A wafer inspection machine switching device according to claim 4, characterized in that, The lifting and pushing mechanism (4) includes a pushing drive (41) and a pushing seat (42); the pushing drive (41) is located below the detection port (234), and the pushing seat (42) is connected to the driving end of the pushing drive (41) and drives the pushing seat (42) to move in the vertical direction.

7. A wafer inspection machine switching device according to claim 6, characterized in that, The lifting and pushing mechanism (4) also includes a moving drive (43) and an extension (44); the moving drive (43) is located inside the wafer inspection machine and outside the detection range of the inspection camera (1); the extension (44) is connected to the driving end of the moving drive (43), and the pushing drive (41) is installed at the end of the extension (44) away from the moving drive (43).

8. A wafer inspection machine switching device according to claim 7, characterized in that, The moving drive (43) is also provided with a positioning element (45), which is located at the initial point of the moving path of the extension (44). When the extension (44) is located at the initial point, the push seat (42) is located at the axis of the detection port (234).

9. A wafer inspection machine switching device according to claim 8, characterized in that, The adsorption mechanism (5) includes a negative pressure generating element (51), a delivery pipe (52), and a closing ring (53); the closing ring (53) is installed in an annular groove (231), and the connecting ring (24) extends downward so that the closing ring (53) is offset from the linkage toothed ring (33); a number of negative pressure ports (241) are opened at preset arc intervals on the connecting ring (24), and an air inlet (531) is opened on the closing ring (53). When any negative pressure port (241) rotates with the connecting ring (24) to the air inlet (531), the air inlet (531) is connected to the negative pressure port (241); all negative pressure ports (241) are connected to the adsorption hole (211); the negative pressure generating element (51) is set on a fixed platform (22) and connected to a delivery pipe (52), and the end of the delivery pipe (52) is connected to the air inlet (531).

10. An application method of a wafer inspection machine switching device, characterized in that, The wafer inspection machine switching device according to any one of claims 1-9 comprises the following steps: Initial reset of the switching device: Set the switching angle of the switching mechanism (3) driving the receiving seat (21) once, and set the number of times to capture and detect data; Wafer placement: The robotic arm places the wafer on the receiving seat (21), and the adsorption mechanism (5) generates negative pressure to adsorb the wafer; First set of shooting and detection data acquisition: The detection camera (1) is located above and below the support (21), and simultaneously acquires the first set of shooting and detection data above and below the wafer; Switching of receiving seat (21): The adsorption mechanism (5) stops the negative pressure supply, the lifting and pushing mechanism (4) rises and lifts the wafer and separates it from the receiving seat (21), the switching mechanism (3) drives the receiving seat (21) to rotate a preset angle, the lifting and pushing mechanism (4) descends and places the wafer on the receiving seat (21), and the adsorption mechanism (5) generates negative pressure adsorption again; Second set of shooting and detection data acquisition: Detection camera (1) synchronously acquires the second set of shooting and detection data of the wafer; If a third or more sets of shooting detection data are set, repeat the switching steps of the receiving seat (21) until all detection data are acquired; Data comparison: All captured detection data are compared and overlapped to form complete detection data; Material handling: Stop the negative pressure adsorption of the adsorption mechanism (5) and the robot arm clamps the wafer to discharge the material.

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