A substrate inspection method

Abstract

The application provides a detection substrate, which is aligned and attached to a temporary substrate in a detection stage. The temporary substrate comprises a plurality of light emitting devices, and each light emitting device comprises a plurality of bonding electrodes. The plurality of bonding electrodes of the same light emitting device comprises a first bonding electrode and a second bonding electrode. The detection substrate comprises a plurality of detection electrodes and a plurality of main electrodes. A single main electrode is electrically connected to a plurality of detection electrodes. The plurality of detection electrodes comprises a first type of electrode and a second type of electrode. In the detection stage, the first bonding electrode is electrically connected to the first type of electrode, and the second bonding electrode is electrically connected to the second type of electrode. At least part of the first type of electrode is electrically connected to the same main electrode, and at least part of the second type of electrode is electrically connected to the same main electrode. The main electrode to which the first type of electrode is electrically connected is different from the main electrode to which the second type of electrode is electrically connected. The design of the application is beneficial to reducing the number of electrodes that need to be pierced by a detection probe in the detection process, thereby greatly reducing the detection time and improving the detection efficiency.

Description

Technical Field

[0001] This application relates to the field of device testing, specifically to a testing substrate. Background Technology

[0002] The functional integrity of the light-emitting devices on the display panel is considered one of the important factors affecting the display effect. In related technologies, before placing the light-emitting devices on the substrate of the display panel, it is usually necessary to test the working status of the light-emitting devices. Common testing measures include: using a test substrate to supply power to the light-emitting devices and testing whether the light-emitting state of the devices meets the expected standards.

[0003] It should be noted that in the process of using a detection substrate for detection in related technologies, the design of the internal structure of the existing detection substrate is difficult to rapidly detect a large number of light-emitting devices, and the detection efficiency needs to be improved. Summary of the Invention

[0004] This application provides a detection substrate to improve the above-mentioned detection efficiency.

[0005] In view of this, this application provides a detection substrate in which the detection substrate and a temporary substrate are aligned and bonded during the detection stage.

[0006] The temporary substrate includes multiple light-emitting devices, and each light-emitting device includes multiple bonding electrodes; the multiple bonding electrodes of the same light-emitting device include a first bonding electrode and a second bonding electrode.

[0007] The detection substrate includes detection electrodes and main electrodes; a single main electrode is electrically connected to multiple detection electrodes; the multiple detection electrodes include a first type of electrode and a second type of electrode.

[0008] During the detection phase, the first binding electrode is electrically connected to the first type of electrode, and the second binding electrode is electrically connected to the second type of electrode.

[0009] Among them, at least some of the first type electrodes are electrically connected to the same main electrode, and at least some of the second type electrodes are electrically connected to the same main electrode. The main electrodes electrically connected to the first type electrodes and the main electrodes electrically connected to the second type electrodes are different.

[0010] Compared with the prior art, the detection substrate provided by the present invention achieves at least the following beneficial effects: In this embodiment, all first-type electrodes and all second-type electrodes can be electrically connected to a single main electrode. During the detection phase, the detection probe can be used to supply power only to the first and second contacts, thus powering all detection electrodes. This design reduces the number of electrodes the detection probe needs to pierce during the detection process, thereby significantly reducing detection time and improving detection efficiency. Attached Figure Description

[0011] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a top view of a partial structure of a detection substrate provided in this application; Figure 2 This is a schematic diagram of some steps involved in testing a light-emitting device using the testing substrate described in this application; Figure 3 This is a cross-sectional view of a portion of the structure after the temporary substrate and the detection substrate are bonded together. Figure 4 This is a top view of part of the structure after the temporary substrate and the detection substrate are bonded together; Figure 5 This is a cross-sectional view of a portion of the structure after the temporary substrate and the detection substrate are bonded together. Figure 6 This is a top view of part of the structure after the temporary substrate and the detection substrate are bonded together; Figure 7 This is a cross-sectional view of a portion of the structure after the temporary substrate and the detection substrate are bonded together. Figure 8 This is a cross-sectional view of a portion of the structure after the temporary substrate and the detection substrate are bonded together. Figure 9 A top view schematic diagram of a portion of the structure of the detection substrate provided in this application; Figure 10 for Figure 9 The diagram shows the connection between the detection substrate and the external circuit board. Figure 11 This is a top view of a portion of the structure of the detection substrate provided in this application. Detailed Implementation

[0013] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0014] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0015] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0016] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0017] Figure 1 This is a top view schematic diagram of a partial structure of a detection substrate provided in this application. Figure 2 This diagram illustrates some steps involved in testing a light-emitting device using the testing substrate described in this application. For ease of understanding, Figure 2 The document illustrates some steps of detecting the luminescence state of the light-emitting device using a detection substrate before transferring the light-emitting device onto the substrate of the display panel.

[0018] To improve the detection efficiency for light-emitting devices, this application provides a detection substrate 10, combined with... Figure 1 and Figure 2 During the detection phase, the detection substrate 10 and the temporary substrate 20 are aligned and bonded together. This alignment and bonding process can be assisted by a high-magnification lens device to adjust the relative position between the temporary substrate 20 and the detection substrate 10. The temporary substrate 20 can be a wafer structure that carries the light-emitting devices 21. In the initial stage of the display panel fabrication process, multiple light-emitting devices 21 can be concentrated and attached to the temporary substrate 20. To confirm whether the functional completeness of the light-emitting devices 21 meets the standards, the detection substrate 10 can provide a detection signal (current) to the light-emitting devices 21 attached to the temporary substrate 20, and the functional completeness can be judged by the light-emitting state of the light-emitting devices 21. Therefore, by aligning and bonding the detection substrate 10 and the temporary substrate 20, the light-emitting devices 21 on the temporary substrate 20 can receive detection signals through a portion of the structure on the detection substrate 10, thereby realizing the detection process.

[0019] like Figure 2 As shown, the temporary substrate 20 includes a plurality of light-emitting devices 21, and each light-emitting device 21 includes a plurality of bonding electrodes 211. The light-emitting device 21 can be at least one of a micro light-emitting diode, a mini light-emitting diode, etc.

[0020] The multiple bonding electrodes 211 of the same light-emitting device 21 include a first bonding electrode 211a and a second bonding electrode 211b. One of the first bonding electrode 211a and the second bonding electrode 211b is used to receive an electrical signal (detection signal) provided by the detection substrate 10, and the other is used to output an electrical signal to the detection substrate 10. This allows the electrical signal to pass through the light-emitting body 212 of the light-emitting device 21, thus enabling the light-emitting device 21 to emit light. During the detection process, a high-magnification lens can be used to collect data such as the luminous brightness and frequency of the light-emitting device 21, thereby enabling the detection of the light-emitting function of the light-emitting device 21.

[0021] The inventors of this application have discovered through research that, during the testing of light-emitting devices 21, due to the large number of light-emitting devices 21 attached to the temporary substrate 20 (wafer structure), the existing scheme for powering and testing light-emitting devices 21 using a testing substrate is difficult to completely detect the luminous state of a large number of light-emitting devices 21 in a short time. The reasons include: the layout of the power supply structure on the existing testing substrate is not ideal; and when using a pin-based design to achieve power supply, the detection probe cannot quickly provide detection signals to a large number of power supply structures.

[0022] To improve this type of problem, this application has made the following design for some structures on the detection substrate 10.

[0023] like Figure 1 As shown, the detection substrate 10 includes detection electrodes 131 and main electrodes 13. A single main electrode 13 is electrically connected to multiple detection electrodes 131, so the main electrode 13 can transmit the electrical signals it receives to the multiple detection electrodes 131. The multiple detection electrodes 131 include a first type electrode 31a and a second type electrode 31b.

[0024] During the detection phase, the first bonding electrode 211a is electrically connected to the first type electrode 31a, and the second bonding electrode 211b is electrically connected to the second type electrode 31b. When the light-emitting device 21 emits light, a potential difference may exist between the first type electrode 31a and the second type electrode 31b, meaning that the electrical signal supplied to the main electrode 13 corresponding to the first type electrode 31a and the electrical signal supplied to the main electrode 13 corresponding to the second type electrode 31b may be different.

[0025] Among them, such as Figure 1 As shown, at least a portion of the first type of electrode 31a is electrically connected to the same main electrode 13 (which can be the first contact A), and at least a portion of the second type of electrode 31b is electrically connected to the same main electrode 13 (which can be the second contact B). The main electrode 13 to which the first type of electrode 31a is electrically connected and the main electrode 13 to which the second type of electrode 31b is electrically connected are different. That is, the electrical signals received by the first contact A and the second contact B can be different.

[0026] In this embodiment, all first-type electrodes 31a and all second-type electrodes 31b can be electrically connected to a single main electrode 13. During the detection phase, the detection probe can be used to supply power only to the first contact A and the second contact B, thus powering all detection electrodes 131. This design reduces the number of electrodes the detection probe needs to pierce during the detection process, thereby significantly reducing detection time and improving detection efficiency.

[0027] Furthermore, one of the first type electrode 31a and the second type electrode 31b can be a cathode and the other can be an anode. For the first type electrode 31a and the second type electrode 31b corresponding to the same light-emitting device 21, the spacing between them can be adaptively adjusted according to the spacing between the two bonding electrodes 211 of the light-emitting device 21 on the temporary substrate 20 to ensure the effectiveness of the electrical connection between the detection electrode 131 and the bonding electrode 211.

[0028] Figure 3 This is a cross-sectional view of a portion of the structure after the temporary substrate and the detection substrate are bonded together.

[0029] In some embodiments of this application, combined with Figure 2 and Figure 3 The detection electrode 131 has a protrusion 30 on the side near the temporary substrate 20. The protrusion 30 can be regarded as a conductive structure that protrudes relative to the surface of the detection electrode 131. The detection electrode 131 can be electrically connected to a part of the structure on the temporary substrate 20 through the protrusion 30.

[0030] During the detection phase, the protrusion 30 contacts the bonding electrode 211, meaning that the bonding electrode 211 can be electrically connected to the detection electrode 131 through the protrusion 30.

[0031] In this embodiment, the protrusion 30 can be regarded as a conductive medium structure between the detection electrode 131 and the bonding electrode 211. The protrusion 30 helps to enhance the electrical connection between the detection electrode 131 and the bonding electrode 211, and avoids affecting the light emission effect of the light-emitting device 21 due to the poor connection between the detection electrode 131 and the bonding electrode 211.

[0032] In one possible implementation, the protrusion 30 can be integrated with the detection electrode 131.

[0033] Figure 4 This is a top view of part of the structure after the temporary substrate and the detection substrate are bonded together. For ease of understanding, this is a schematic diagram. Figure 4 The layout of the conductive buffer, protrusions, detection electrodes, and bonding electrodes is shown from a top-down perspective.

[0034] In some embodiments of this application, combined with Figure 3 and Figure 4 The detection substrate 10 also includes a conductive buffer portion 40, the orthographic projection of which at least partially surrounds the orthographic projection of the protrusion 30. During the detection phase, at least a portion of the conductive buffer portion 40 is located between the bonding electrode 211 and the detection electrode 131 along the thickness direction Z of the detection substrate 10, and the conductive buffer portion 40 overlaps with both the detection electrode 131 and the bonding electrode 211. Considering that the orthographic projection of the conductive buffer portion 40 at least partially surrounds the orthographic projection of the protrusion 30, the area of ​​the portion of the bonding electrode 211 that overlaps with the conductive buffer portion 40 can be larger than the area of ​​the portion that overlaps with the protrusion 30. Therefore, after the temporary substrate 20 and the detection substrate 10 are aligned and bonded, the contact area between the bonding electrode 211 and the conductive buffer portion 40 can be larger than the contact area between the bonding electrode 211 and the protrusion 30.

[0035] The compressive modulus of the material constituting the conductive buffer portion 40 is lower than that of the material constituting the detection electrode 131. Specifically, the material constituting the conductive buffer portion 40 may include conductive polyurethane elastomer, polyaniline, polythiophene, polypyrrole, polyacetylene, poly(ethylenedioxythiophene):dextran sulfonate, etc.

[0036] In this embodiment, the conductive buffer portion 40 helps to buffer the electrode by utilizing its low compressive modulus, thus preventing electrode damage caused by pressure friction between the bonding electrode 211 and the detection electrode 131. Furthermore, the conductivity of the conductive buffer portion 40 also ensures the electrical connection between the bonding electrode 211 and the detection electrode 131.

[0037] In some embodiments of this application, the conductivity of the material constituting the protrusion 30 is higher than that of the material constituting the conductive buffer portion 40.

[0038] Among them, such as Figure 3 As shown, the height m1 of the protrusion 30 is greater than the thickness m2 of the conductive buffer portion 40.

[0039] In this embodiment, the design where m1 > m2 can be considered as a structure in which the protrusion 30 protrudes from the conductive buffer portion 40 and preferentially contacts the bonding electrode 211. Considering the high conductivity of the protrusion 30, this design is beneficial to enhance the conductive medium role played by the protrusion 30 in realizing the electrical connection between the bonding electrode 211 and the detection electrode 131. Thus, when the contact area between the conductive buffer portion 40 and the bonding electrode 211 is large, the electrical connection effect between the bonding electrode 211 and the detection electrode 131 is further enhanced.

[0040] Figure 5 This is a cross-sectional view of part of the structure after the temporary substrate and the detection substrate are bonded together. Figure 6This is a top view of part of the structure after the temporary substrate and the detection substrate are bonded together.

[0041] In some embodiments of this application, combined with Figure 3 and Figure 5 The detection substrate 10 also includes a first substrate 101, and the detection electrode 131 is located on the alignment side of the first substrate 101. During the detection stage, the alignment side is the surface of the first substrate 101 facing the temporary substrate 20.

[0042] The temporary substrate 20 includes a second substrate 201, and the light-emitting device 21 is attached to the second substrate 201.

[0043] Combination Figure 2 and Figure 6 The temporary substrate 20 includes a first region S1 and a second region S2. During the detection stage, along the thickness direction Z of the detection substrate 10, the distance between the portion of the second substrate 201 corresponding to the first region S1 and the first substrate 101 is h1, and the distance between the portion of the second substrate 201 corresponding to the second region S2 and the first substrate 101 is h2, where h1 > h2.

[0044] Combination Figure 2 and Figure 3 The second region S2 can surround at least a portion of the first region S1. In this case, the temporary substrate 20 can be regarded as a "turtle-shaped" structure in which the edge region is relatively bent towards the detection substrate 10.

[0045] Combination Figure 5 and Figure 6 The first region S1 can surround at least a portion of the second region S2, and the temporary substrate 20 can be regarded as a "bowl-shaped" structure in which the edge region is relatively bent away from the detection substrate 10.

[0046] The inventors of this application have discovered through research that the structural feature of h1 > h2 is formed by the deformation of the temporary substrate 20 due to stress. This deformation causes the spacing between the light-emitting device 21 and the detection substrate 10 in different areas of the temporary substrate 20 to be different. Therefore, when the temporary substrate 20 and the detection substrate 10 are aligned and bonded, a "virtual connection" phenomenon is likely to occur, where the contact effect between some bonding electrodes 211 and detection electrodes 131 is poor, which affects the light-emitting state of the light-emitting device 21 and interferes with the detection effect.

[0047] Based on this problem, the following measures have been taken to improve the situation.

[0048] Among them, combined Figure 3 and Figure 5The plurality of protrusions 30 include a first type of protrusion 301 and a second type of protrusion 302. The first type of protrusion 301 overlaps with the first region S1, and the second type of protrusion 302 overlaps with the second region S2. The relative height c1 of the first type of protrusion 301 is greater than the relative height c2 of the second type of protrusion 302. At this time, in the thickness direction Z of the detection substrate 10, the distance between the first type of protrusion 301 and the second substrate 201 is smaller than the distance between the second type of protrusion 302 and the second substrate 201, that is, the first type of protrusion 301 is closer to the second substrate 201.

[0049] In the thickness direction Z of the detection substrate 10, the distance between the side of the protrusion 30 away from the first substrate 101 and the first substrate 101 is the relative height.

[0050] In this embodiment, under stress, the distance between the light-emitting device 21 located in the first region S1 and the first substrate 101 can be greater than the distance between the light-emitting device 21 located in the second region S2 and the first substrate 101. To avoid the bonding electrode 211 of the light-emitting device 21 in the first region S1 being loosely connected to the detection electrode 131, this embodiment sets c1 > c2 to relatively reduce the distance between the first type of protrusion 301 and the bonding electrode 211 of the light-emitting device 21 in the first region S1, thereby compensating for the influence caused by the stress deformation of the temporary substrate 20 and enhancing the effectiveness of the electrical connection between the bonding electrode 211 of the light-emitting device 21 and the detection electrode 131 in the first region S1.

[0051] In some embodiments of this application, combined with Figure 3 and Figure 5 The relative height c1 of the first type of protrusion 301 and the relative height c2 of the second type of protrusion 302 satisfy the following condition: 0 < c1 - c2 ≤ 5 μm.

[0052] In this embodiment, 0 < c1 - c2 ≤ 5 μm allows the relative height difference between the two types of protrusions 30 to be limited to within 5 μm. This design can reduce the risk of a loose connection in the first region S1 by utilizing the relative height difference between the two types of protrusions 30, while avoiding a loose connection in the second region S2 due to an excessively large relative height difference. This ensures the electrical connection effect of the bonding electrodes 211 and the detection electrodes 131 in each region after the temporary substrate 20 and the detection substrate 10 are aligned and bonded.

[0053] Figure 7 This is a cross-sectional view of part of the structure after the temporary substrate and the detection substrate are bonded together. Figure 8 This is a cross-sectional view of a portion of the structure after the temporary substrate and the detection substrate are bonded together.

[0054] In some embodiments of this application, combined with Figure 7 and Figure 8 The plurality of protrusions 30 include a first protrusion 30a and a second protrusion 30b, wherein the height m11 of the first protrusion 30a is the same as the height m12 of the second protrusion 30b.

[0055] The plurality of detection electrodes 131 includes a first type of electrode 311 and a second type of electrode 312. The first type of electrode 311 overlaps with the first region S1, and the first protrusion 30a overlaps with the first type of electrode 311. The second type of electrode 312 overlaps with the second region S2, and the second protrusion 30b overlaps with the second type of electrode 312.

[0056] Among them, the thickness w1 of the first electrode 311 is greater than the thickness w2 of the second electrode 312.

[0057] In this embodiment, the sum of the thickness of the detection electrode 131 and the height of the protrusion 30 can be regarded as the relative height of the protrusion 30. Considering that the temporary substrate 20 deforms under stress, the design of m11=m12 and w1>w2 means that in this embodiment, the difference in the relative height of the protrusion 30 in different regions is achieved by adjusting the thickness difference of the detection electrode 131, so as to adapt to the morphological characteristics of the temporary substrate 20 after deformation and ensure the electrical connection effect between the detection electrode 131 and the bonding electrode 211.

[0058] In some embodiments of this application, combined with Figure 1 and Figure 2 The main electrode 13 includes a needle part p. During the detection phase, the needle part p contacts the detection probe D, and the detection probe D provides a detection signal to the detection electrode 131 through the main electrode 13.

[0059] In the embodiments of this application, the design of at least some of the same type of detection electrodes 131 being electrically connected to the same main electrode 13 helps to meet the power supply requirements of a large number of detection electrodes 131 with a smaller number of needle portions P on the main electrode 13. The reduction in the number of needle portions P helps to save the time required to supply power through the detection probe D, making it easier to complete the detection process of a large number of light-emitting devices 21 within a limited time, thereby helping to improve detection efficiency.

[0060] Figure 9 This is a top view schematic diagram of a portion of the structure of the detection substrate provided in this application. Figure 10 for Figure 9 The diagram shows the connection between the test substrate and the external circuit board.

[0061] In some embodiments of this application, such as Figure 9As shown, the multiple main electrodes 13 include multiple external main electrodes 130, and the same external main electrode 130 is electrically connected to multiple first-type electrodes 31a or multiple second-type electrodes 31b. That is, multiple first-type electrodes 31a can receive detection signals through the same external main electrode 130, and multiple second-type electrodes 31b can receive detection signals through the same external main electrode 130.

[0062] Combination Figure 9 and Figure 10 The external main electrode 130 is bonded to the external circuit board 50, which includes an external pin portion 501. During the detection phase, the external pin portion 501 contacts the detection probe D, and the detection probe D provides a detection signal to the external main electrode 130 through the external pin portion 501. It should be noted that, relative to the detection substrate 10, the space available for setting the device structure on the external circuit board 50 can be larger. Therefore, the size of the external pin portion 501 on the external circuit board 50 can be larger than the size of the main electrode 13 on the detection substrate 10. The aforementioned size can refer to the width, diameter, etc., of the structure's projection.

[0063] Compared to setting a pin-punching area on the main electrode 13 of the detection substrate 10, the design of using the external main electrode 130 of the external circuit board 50 as the pin-punching area in this embodiment can give full play to the advantage of the larger size of the external pin-punching part 501 on the external circuit board 50, increase the area of ​​the pin-punching area, and thus help reduce the difficulty of pin-punching power supply through the detection probe D, thereby improving detection efficiency.

[0064] Figure 11 This is a top view of a portion of the structure of the detection substrate provided in this application.

[0065] In some embodiments of this application, such as Figure 11 As shown, the detection substrate 10 includes multiple detection zones S3. Within the same detection zone S3, at least some of the detection electrodes 131 of the same type are connected in series.

[0066] The multiple detection zones S3 include a first zone S31 and a second zone S32. Among the multiple detection electrodes 131 of the same type, the detection electrode 131 of the same type located in the first zone S31 and the detection electrode 131 of the same type located in the second zone S32 are connected in parallel to the same external main electrode 130.

[0067] In this embodiment, the design effectively divides the multiple detection electrodes 131 on the detection substrate 10 into multiple zones. Detection electrodes 131 of the same type within the same zone are connected in series, which helps ensure that the detection signals (driving currents) received by the light-emitting devices 21 within that zone are the same or similar. Under this design, multiple light-emitting devices 21 within the same zone can emit light under the drive of similar or identical detection signals. This facilitates the differentiation of different light-emitting devices 21 within the same zone based on their luminous properties (including luminous wavelength, brightness uniformity, etc.), thereby helping to subsequently screen out light-emitting devices 21 with similar luminous properties. This also helps to meet the design requirements for arranging the light-emitting devices 21 according to their luminous performance when transferring them to the substrate of the display panel.

[0068] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

Claims

1. A detection substrate, characterized in that, During the testing phase, the testing substrate and the temporary substrate are aligned and bonded together; The temporary substrate includes multiple light-emitting devices, and each light-emitting device includes multiple bonding electrodes; the multiple bonding electrodes of the same light-emitting device include a first bonding electrode and a second bonding electrode. The detection substrate includes a detection electrode and a main electrode; a single main electrode is electrically connected to a plurality of detection electrodes; the plurality of detection electrodes includes a first type of electrode and a second type of electrode. During the detection phase, the first bonding electrode is electrically connected to the first type of electrode, and the second bonding electrode is electrically connected to the second type of electrode; Wherein, at least a portion of the first type of electrodes are electrically connected to the same main electrode, and at least a portion of the second type of electrodes are electrically connected to the same main electrode, wherein the main electrode to which the first type of electrodes are electrically connected and the main electrode to which the second type of electrodes are electrically connected are different.

2. The detection substrate according to claim 1, characterized in that, The detection electrode has a protrusion on the side near the temporary substrate; during the detection phase, the protrusion contacts the bonding electrode.

3. The detection substrate according to claim 2, characterized in that, The detection substrate further includes a conductive buffer portion, the orthographic projection of which at least partially surrounds the orthographic projection of the protrusion. During the detection phase, along the thickness direction of the detection substrate, at least a portion of the conductive buffer portion is located between the bonding electrode and the detection electrode, and the conductive buffer portion overlaps with both the detection electrode and the bonding electrode. The compressive modulus of the material constituting the conductive buffer is lower than that of the material constituting the detection electrode.

4. The detection substrate according to claim 3, characterized in that, The conductivity of the material constituting the protrusion is higher than that of the material constituting the conductive buffer portion. The height of the protrusion is greater than the thickness of the conductive buffer portion.

5. The detection substrate according to claim 2, characterized in that, The detection substrate further includes a first substrate, and the detection electrode is located on the alignment side of the first substrate; during the detection stage, the alignment side is the surface of the first substrate facing the temporary substrate; The temporary substrate includes a second substrate, and the light-emitting device is attached to the second substrate; The temporary substrate includes a first region and a second region; During the detection stage, along the thickness direction of the detection substrate, the distance between the portion of the second substrate corresponding to the first region and the first substrate is h1, and the distance between the portion of the second substrate corresponding to the second region and the first substrate is h2, where h1 > h2; The plurality of protrusions include a first type of protrusion and a second type of protrusion, wherein the first type of protrusion overlaps with the first region, and the second type of protrusion overlaps with the second region; the relative height of the first type of protrusion is greater than the relative height of the second type of protrusion. In the thickness direction of the detection substrate, the distance between the side of the protrusion away from the first substrate and the first substrate is the relative height.

6. The detection substrate according to claim 5, characterized in that, The relative height c1 of the first type of protrusion and the relative height c2 of the second type of protrusion satisfy the following condition: 0 < c1 - c2 ≤ 5 μm.

7. The detection substrate according to claim 5, characterized in that, The plurality of protrusions includes a first protrusion and a second protrusion, wherein the height of the first protrusion is the same as the height of the second protrusion; The plurality of detection electrodes includes a first type of electrode and a second type of electrode; the first type of electrode overlaps with the first region, and the first protrusion overlaps with the first type of electrode; the second type of electrode overlaps with the second region, and the second protrusion overlaps with the second type of electrode; The thickness of the first type of electrode is greater than the thickness of the second type of electrode.

8. The detection substrate according to claim 1, characterized in that, The main electrode includes a needle insertion section. During the detection phase, the needle insertion section contacts the detection probe, and the detection probe provides a detection signal to the detection electrode through the main electrode.

9. The detection substrate according to claim 1, characterized in that, The plurality of main electrodes includes a plurality of external main electrodes, and the same external main electrode is electrically connected to a plurality of first-type electrodes or a plurality of second-type electrodes; The external main electrode is bonded to an external circuit board, and the external circuit board includes an external needle insertion section; During the detection phase, the external needle portion contacts the detection probe, and the detection probe provides a detection signal to the external main electrode through the external needle portion.

10. The detection substrate according to claim 9, characterized in that, The detection substrate includes multiple detection zones, and within the same detection zone, at least some of the detection electrodes of the same type are connected in series with each other. The plurality of detection zones include a first zone and a second zone; among the plurality of detection electrodes of the same type, the detection electrode of that type located in the first zone and the detection electrode of that type located in the second zone are connected in parallel to the same external main electrode.

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