Optoelectronic device testing function module, apparatus and method

Abstract

The application discloses a photoelectric device test function module, equipment and method, the photoelectric device test function module includes a clamp, a test module and a control module, the test module includes a current voltage test unit, a temperature control test unit and a light source excitation test unit, the clamp is used for bearing a device to be tested, the current voltage test unit is electrically connected with the device to be tested on the clamp, and is used for carrying out current voltage test on the device to be tested, the temperature control test unit includes a temperature adjusting assembly arranged correspondingly to the clamp, the temperature adjusting assembly is used for the control module to heat or cool the device to be tested, the light source excitation test unit includes an illumination assembly arranged correspondingly to the clamp, and the illumination assembly is used for the control module to generate a light signal with a set intensity to the device to be tested. The photoelectric device test function module forms a modular design, which is helpful to simplify the test process, and at the same time, the number of modules can be conveniently and flexibly expanded, so as to adapt to different scale test requirements.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic device technology, and in particular to an optoelectronic device testing functional module, equipment, and method. Background Technology

[0002] Current testing of optoelectronic devices requires covering various core aspects such as current and voltage detection, light source excitation, and temperature control to obtain the optoelectronic properties and aging resistance of optoelectronic device materials, thereby evaluating the stability and lifespan of optoelectronic devices made from these materials. Traditional testing methods require breaking down each test item into separate tests using different equipment, resulting in a cumbersome and inefficient testing process that impacts R&D efficiency and increases testing costs. Summary of the Invention

[0003] In view of this, the present invention provides a testing module, device and method for optoelectronic devices, which solves the problem in the prior art that different testing items of optoelectronic devices require different testing equipment to be tested separately.

[0004] On one hand, this application provides a test module for optoelectronic devices, including a fixture, a test module and a control module. The test module includes a current and voltage test unit, a temperature control test unit and a light source excitation test unit. The current and voltage test unit, the temperature control test unit and the light source excitation test unit are respectively electrically connected to the control module. The fixture is used to carry the device under test (DUT). The current and voltage testing unit is electrically connected to the DUT located on the fixture and is used to perform current and voltage tests on the DUT. The temperature control testing unit includes a temperature control component corresponding to the fixture and is used to heat or cool the DUT under the control of the control module. The light source excitation testing unit includes an illumination component corresponding to the fixture and is used to generate a light signal of a set intensity to the DUT under the control of the control module.

[0005] On the other hand, this application also provides an optoelectronic device testing equipment, including a cabinet and the optoelectronic device testing functional modules as described above, wherein multiple optoelectronic device testing functional modules are respectively installed in the cabinet and arranged in rows and columns.

[0006] On the other hand, this application also provides a method for testing optoelectronic devices, applied to the optoelectronic device testing equipment described above, the testing method comprising: S11: Control the current and voltage testing unit to output a preset intensity voltage to the device under test, and read the current signal on the device under test corresponding to the preset intensity voltage; S12: Control the light source excitation test unit to output a preset intensity light, and under the preset intensity light condition, repeat S11 to obtain the current signal of the device under test corresponding to the preset intensity voltage under the preset intensity light. S13: Control the temperature control component to heat or cool the device under test. After the temperature of the device under test or the temperature of the test environment stabilizes to a preset value, repeat S11 to obtain the current signal of the device under test corresponding to the preset intensity voltage at the preset temperature. Alternatively, after the temperature of the device under test or the temperature of the test environment stabilizes to a preset value, repeat S12 to obtain the current signal of the device under test corresponding to the preset intensity voltage at the preset temperature and preset light intensity. S14. Based on the current signals obtained in S11, S12, and S13, determine the electrical performance of the device under test.

[0007] The optoelectronic device testing module provided in this embodiment of the invention includes a current and voltage testing unit, a temperature control testing unit, and a light source excitation testing unit. The current and voltage testing unit performs current and voltage tests on the device under test (DUT), the temperature control testing unit performs temperature tests, and the light source excitation testing unit performs light source excitation tests. This modular design integrates different testing functions, allowing different test items for the optoelectronic device to be executed by the same module. This simplifies the testing process, improves efficiency, and reduces costs. Furthermore, the modular design allows for flexible expansion of the number of testing modules to meet varying testing needs. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of an optoelectronic device testing function module provided in an embodiment of the present invention.

[0009] Figure 2 This is a schematic diagram of a specific structure of an optoelectronic device testing function module provided in an embodiment of the present invention.

[0010] Figure 3 for Figure 2 The diagram shows the optoelectronic device testing module with part of its casing removed.

[0011] Figure 4 for Figure 3 The diagram shows the assembly of the fixture, test module, heat pipe, heat sink, and cooling fan.

[0012] Figure 5 for Figure 4 The diagram shows an exploded view of the fixture and test module.

[0013] Figure 6 for Figure 5 The diagram shows an exploded view of the support component, heat-conducting component, temperature-regulating component, and temperature sensor.

[0014] Figure 7 for Figure 6 The diagram shows an exploded view of the support, heat-conducting component, and temperature-regulating component from another perspective.

[0015] Figure 8 for Figure 2 The diagram shows a cross-sectional view of the optoelectronic device testing function module.

[0016] Figure 9 for Figure 2 The image shows a cross-sectional view of the optoelectronic device testing module from another direction.

[0017] Figure 10 for Figure 2 The diagram shows a partially enlarged view of the optoelectronic device testing function module.

[0018] Figure 11 This is a schematic diagram of the structure of an optoelectronic device testing device provided in an embodiment of the present invention.

[0019] Figure 12 This is a flowchart of a testing method for optoelectronic devices provided in an embodiment of the present invention.

[0020] In the diagram: 1. Optoelectronic device testing equipment; 100. Optoelectronic device testing functional module; 200. Cabinet; 300. Device under test; 10. Fixture; 12. Test module; 14. Control module; 16. Current and voltage testing unit; 18. Temperature control testing unit; 20. Light source excitation testing unit; 22. Conductive component; 24. Channel interface; 26. Test circuit board; 28. Storage space; 30. Support component; 32. Clamping component; 34. Clearance hole; 36. Handle position; 38. First clamping part; 40. Second clamping part; 42. Receiving slot; 44. Temperature control component; 46. Temperature sensor; 48. Heat-conducting component; 50. Mounting slot; 52. Main body 54. Protrusion; 56. Groove; 58. Mounting hole; 60. Wiring hole; 62. Heat pipe; 64. Cooling fan; 66. Heat sink; 68. Light source; 70. Photoelectric sensor; 72. Light source interface; 74. Current and voltage control unit; 76. Temperature control unit; 78. Light source excitation control unit; 80. Housing; 81. First partition; 82. First chamber; 83. Second chamber; 84. Second partition; 85. Sub-chamber; 86. Top plate; 87. Bottom plate; 88. First side plate; 89. Second side plate; 90. First fixing part; 91. First fixing part; 92. Locking structure; 93. Second fixing part; 94. Second movable part. Detailed Implementation

[0021] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, inside, outside, top, bottom, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship between the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0023] It should also be noted that when a component is referred to as "fixed to" or "set on" another component, the component may be directly on the other component or there may be an intervening component present. When a component is referred to as "connected to" another component, it may be directly connected to the other component or there may be an intervening component present.

[0024] Please see Figures 1 to 3 An embodiment of the present invention provides a photoelectric device testing module 100, including a fixture 10, a testing module 12, and a control module 14. The fixture 10 is used to support a device under test (DUT) 300, and the control module 14 is used to control the testing module 12 to perform corresponding tests on the DUT 300 on the fixture 10. Optionally, the DUT 300 includes a material for preparing the photoelectric device, and the testing object of the testing module 12 is the material for preparing the photoelectric device. The characteristics of the material will directly affect the characteristics of the prepared photoelectric device, and the characteristics of the photoelectric device are indirectly obtained by testing the characteristics of the material. In an optional example, the material is a photosensitive material.

[0025] The test module 12 includes a current-voltage testing unit 16, a temperature control testing unit 18, and a light source excitation testing unit 20, all of which are electrically connected to the control module 14. The current-voltage testing unit 16 is electrically connected to the device under test (DUT) 300 on the fixture 10 to perform current-voltage tests on the DUT 300, thereby determining the electrical performance of the optoelectronic device. The temperature control testing unit 18 includes a temperature-regulating component corresponding to the fixture 10, which is controlled by the control module 14 to heat or cool the DUT 300, thereby performing temperature tests on the DUT 300 and determining the thermal performance of the optoelectronic device. The light source excitation testing unit 20 includes an illumination component corresponding to the fixture 10, which is controlled by the control module 14 to generate a light signal of a set intensity to the DUT 300, thereby performing a light source excitation test on the DUT 300 and subsequently obtaining the optical performance of the optoelectronic device.

[0026] It should be noted that the current and voltage testing unit 16 can be used to test the static electrical performance of the device under test 300, that is, when the temperature control testing unit 18 and the light source excitation testing unit 20 are not working, the current and voltage testing unit 16 can test the electrical performance of the device under test 300 independently, and it can also cooperate with the temperature control testing unit 18 and the light source excitation testing unit 20 to test the electrical performance of the device under test 300 under specific temperature and lighting conditions.

[0027] The optoelectronic device testing module 100 of this embodiment includes a current and voltage testing unit 16, a temperature control testing unit 18, and a light source excitation testing unit 20. The current and voltage testing unit 16 performs current and voltage tests to obtain the electrical performance of the optoelectronic device; the temperature control testing unit 18 performs temperature tests to obtain the thermal performance of the optoelectronic device; and the light source excitation testing unit 20 performs light source excitation tests to obtain the optical performance of the optoelectronic device. The optoelectronic device testing module 100 integrates testing functions for different items, forming a modular design. This allows the module to cover various core testing items of the optoelectronic device. Multiple testing items can be performed by the same module 100, eliminating the need for different testing equipment. This simplifies the testing process, improves testing efficiency, and reduces testing costs. Furthermore, the modular design allows users to flexibly expand the number of optoelectronic device testing modules 100 according to actual needs, adapting to different scales of testing requirements.

[0028] Please see Figures 3 to 5 In one embodiment, the current and voltage testing unit 16 includes a test path assembly disposed on a fixture 10 and used to electrically connect with the device under test (DUT) 300 on the fixture 10 to form a current and voltage testing path. The test path assembly includes a conductive element 22, a channel interface 24 electrically connected to the conductive element 22, and a wire (not shown) connecting the channel interface 24 to a control module 14. The conductive element 22 and the channel interface 24 are respectively mounted on the fixture 10, and the conductive element 22 is used to contact the DUT 300 on the fixture 10 to form an electrical connection. The channel interface 24 is electrically connected to the conductive element 22 and electrically connected to the control module 14 via the wire, thereby realizing the electrical connection between the control module 14 and the DUT 300. The control module 14 can apply a current or voltage of a specific intensity to the DUT 300 to obtain the electrical performance of the optoelectronic device through the DUT 300.

[0029] Optionally, the test path assembly also includes a test circuit board 26, which is mounted on the fixture 10. The conductive element 22 and the channel interface 24 are respectively disposed on the test circuit board 26 to achieve electrical connection. In an optional example, the conductive element 22 and the channel interface 24 are respectively disposed on opposite sides of the test circuit board 26 in the thickness direction. During testing, the test circuit board 26 is positioned above the device under test (DUT) 300. The conductive element 22 is disposed on the lower surface of the test circuit board 26 to contact the DUT 300, and the channel interface 24 is disposed on the upper surface of the test circuit board 26 and near its periphery for connection with wires.

[0030] The wires connecting the control module 14 and the channel interface 24 can be 2-coaxial or 3-coaxial shielded cables to reduce signal attenuation and interference during signal transmission and ensure signal transmission stability.

[0031] The optoelectronic device testing function module 100 may include one or more test modules 12 and fixtures 10. In an optional example, the optoelectronic device testing function module 100 includes multiple test modules 12 and multiple fixtures 10, with each test module 12 and fixture 10 corresponding to one another. Each fixture 10 can be used to hold the device under test 300, and the corresponding test module 12 performs the test operation. The optoelectronic device testing function module 100 can test multiple devices under test 300 at the same time, which can improve testing efficiency.

[0032] Each test module 12's current and voltage test unit 16 includes multiple test path components, each electrically connected to the control module 14. Each test path component includes a conductive element 22, a channel interface 24, and a wire. The device under test (DUT) 300 has multiple different test areas, and the multiple test path components are used to perform current and voltage tests on these different test areas respectively. Optionally, multiple test path components of the same test module 12 share a single temperature control component and illumination component, meaning multiple test areas of the same DUT 300 share a single temperature control component and illumination component. A single optoelectronic device test function module 100 has multiple test modules 12, allowing simultaneous testing of multiple DUTs 300. Each test module 12 also has multiple test channels, enabling testing of multiple test areas on a single DUT 300. This modular + multi-test-channel architecture supports flexible expansion of the number of modules and channels, adapting to different test scale requirements and significantly improving test efficiency, thus meeting the parallel testing needs of multiple devices in a single batch.

[0033] In an optional example, the device under test 300 includes a substrate and multiple test areas disposed on the substrate, the multiple test areas being spaced apart. The substrate, for example, is a glass plate, used to support the test areas. The test areas are material coatings formed from the material used to fabricate the optoelectronic device, and conductive elements 22 are used to contact the corresponding material coatings to form electrical connections. Specifically, there are four test areas, arranged in pairs opposite each other. Each test area includes a positive electrode and a negative electrode. The conductive elements 22 include two conductive monomers, which respectively contact the positive and negative electrodes of the test areas.

[0034] Please see Figure 4 and Figure 5 In one embodiment, the fixture 10 is recessed with a storage space 28 for accommodating the device under test (DUT) 300 to enhance the stability of the DUT 300 on the fixture 10. A temperature control component and an illumination component are disposed corresponding to the storage space 28. Conductive elements 22 of multiple test path components are arranged at circumferential intervals along the storage space 28, with one end of each conductive element 22 extending into the storage space 28.

[0035] The fixture 10 includes a support member 30 and a clamping member 32 rotatably connected to the support member 30. The support member 30 is used to support the device under test 300. The clamping member 32 is stacked on top of the support member 30 and is used to press the device under test 300 onto the support member 30. Optionally, a storage space 28 is recessed on the side of the support member 30 near the clamping member 32. A clearance hole 34 is provided on the clamping member 32 corresponding to the storage space 28, so that light can pass through the clearance hole 34 and irradiate the device under test 300.

[0036] A temperature control component is mounted on the support 30 and is used to transfer heat to the device under test (DUT) 300 within the storage space 28. This transfer can be direct or indirect, via the support 30. A test path assembly is mounted on the clamp 32. Rotation of the clamp 32 relative to the support 30 causes the test path assembly to move relative to the DUT 300. When the clamp 32 rotates away from the support 30, the storage space 28 is exposed, allowing the DUT 300 to be removed or inserted. When the clamp 32 rotates towards the support 30, a conductive element 22 is inserted into the storage space 28, pressing the DUT 300 against the support 30.

[0037] The inner wall of the storage space 28 is recessed to form a handle 36, allowing the tester to insert their fingers or tools into the handle 36 to press against the edge of the device under test 300, so as to remove the device under test 300 from the storage space 28. Optionally, the storage space 28 is rectangular, and the four inner walls of the storage space 28 are recessed to form handles 36.

[0038] The clamping member 32 includes a first clamping part 38 and a second clamping part 40 stacked together. The first clamping part 38 is located between the second clamping part 40 and the support member 30. The clearance hole 34 passes through the first clamping part 38 and the second clamping part 40. The test path assembly includes a conductive member 22, a channel interface 24, wires, and a test circuit board 26. The conductive member 22 and the channel interface 24 are respectively located on opposite sides of the test circuit board 26. The test circuit board 26 is located between the first clamping part 38 and the second clamping part 40. The clearance hole 34 passes through the test circuit board 26.

[0039] A receiving groove 42 is formed between the first clamping part 38 and the second clamping part 40. The test circuit board 26 and the channel interface 24 are located in the receiving groove 42. The conductive element 22 extends through the first clamping part 38 into the receiving space 28. The receiving groove 42 extends to the outer surface of the clamping member 32 to form an opening. The channel interface 24 is exposed to the clamping member 32 through the opening for connection with wires. Optionally, the two ends of the receiving groove 42 extend to opposite sides of the clamping member 32, thereby forming openings on opposite sides of the clamping member 32. The test path assembly includes four channel interfaces 24 for corresponding testing of four test areas of the device under test 300. Two channel interfaces 24 are exposed to one side of the clamping member 32 through one opening, and the other two channel interfaces 24 are exposed to the opposite side of the clamping member 32 through another opening.

[0040] Please see Figures 5 to 7 In one embodiment, the temperature control assembly includes a temperature control element 44 and a temperature sensor 46 mounted on the fixture 10. Both the temperature control element 44 and the temperature sensor 46 are electrically connected to the control module 14. The temperature control element 44 generates heat under the control of the control module 14 and conducts the heat to the device under test 300 to heat or cool the device under test 300 to a predetermined temperature, providing the temperature environment required for thermal performance testing. The temperature sensor 46 detects the temperature of the device under test 300 and transmits the temperature information to the control module 14. When the temperature information received by the control module 14 is inconsistent with the predetermined temperature, the control module 14 can control the heat generated by the temperature control element 44 in real time according to the temperature information. For example, when the temperature detected by the temperature sensor 46 is lower than the predetermined temperature, the control module 14 can control the temperature control element 44 to appropriately increase its power to generate more heat; when the temperature detected by the temperature sensor 46 is higher than the predetermined temperature, the control module 14 can control the temperature control element 44 to appropriately decrease its power to reduce the amount of heat generated. By setting a temperature sensor 46 on the fixture 10 to detect the temperature of the object 300 in real time, the control module 14 controls the temperature of the temperature regulating component 44 in real time according to the temperature information transmitted by the temperature sensor 46, realizing PID temperature closed-loop control, stabilizing the test temperature at the predetermined value, and ensuring the stability of the test environment temperature and the accuracy of the test data.

[0041] The specific type of the temperature regulating member 44 is not limited. For example, it may be a ceramic heating sheet, or may be a TEC (i.e., a semiconductor cooling sheet), and the heat generated by the temperature regulating member 44 may be directly conducted to the device under test 300, or may be indirectly conducted to the device under test 300 via the heat conducting member 48.

[0042] Optionally, the temperature regulating assembly further comprises a heat conducting member 48, the heat conducting member 48 is fixedly mounted to the fixture 10 and attached to the device under test 300, the temperature regulating member 44 and the temperature sensor 46 are respectively fixed on the heat conducting member 48, and form a heat conduction connection with the device under test 300 via the heat conducting member 48. After the temperature regulating member 44 generates heat, the heat can be conducted to the product under test via the heat conducting member 48. Specifically, the heat conducting member 48 is mounted on the support member 30 of the fixture 10.

[0043] The fixture 10 is provided with an accommodation space 28 and a mounting groove 50, the accommodation space 28 is used for accommodating the device under test 300, and the mounting groove 50 is located below the accommodation space 28 and communicates with the accommodation space 28. Optionally, the accommodation space 28 and the mounting groove 50 are arranged on the support member 30 of the fixture 10, the accommodation space 28 is arranged on a side of the support member 30 close to the clamping member 32, and the mounting groove 50 is arranged on a side of the support member 30 away from the clamping member 32. The heat conducting member 48 is mounted to the mounting groove 50, and passes through the mounting groove 50 to attach to the device under test 300 in the accommodation space 28.

[0044] The heat conducting member 48 comprises a main body portion 52 and a protruding portion 54 arranged on one side of the main body portion 52, the main body portion 52 is located in the mounting groove 50 and relatively fixed with the fixture 10, and the protruding portion 54 is located on a side of the main body portion 52 close to the accommodation space 28 and is used for contacting the device under test 300. Optionally, the length of the main body portion 52 is greater than the length of the protruding portion 54, and in the length direction, the protruding portion 54 is arranged at the middle position of the main body portion 52, so that the overall heat conducting member 48 is in a convex shape. The shape of the mounting groove 50 is adapted to the shape of the heat conducting member 48, the mounting groove comprises a first groove body and a second groove body, the second groove body is located between the first groove body and the accommodation space 28 and communicates the first groove body with the accommodation space 28, the main body portion 52 is located in the first groove body, and the protruding portion 54 is located in the second groove body, so as to enhance the compactness of the structure.

[0045] A side of the main body portion 52 away from the protruding portion 54 is provided with a groove 56, a groove wall of the groove 56 is provided with a mounting hole 58, and one end of the mounting hole 58 extends into the protruding portion 54. The temperature regulating member 44 is mounted in the groove 56, and the temperature sensor 46 is mounted to the mounting hole 58, so as to further enhance the compactness of the structure, and at the same time shorten the distance between the temperature sensor 46 and the device under test 300, thereby improving the accuracy of the temperature sensor 46 in detecting the temperature of the device under test 300.

[0046] Understandably, the mounting hole 58 can be a through hole or a blind hole, that is, the temperature sensor 46 can be exposed on the heat-conducting component 48 or embedded inside the heat-conducting component 48.

[0047] The main body 52 has a wiring hole 60, which is connected to the mounting hole 58 and the groove 56. One end of the wiring hole 60 extends to the outer surface of the main body 52. ​​The wire connected to the temperature sensor 46 can extend out of the heat conductor 48 through the wiring hole 60 so as to be electrically connected to the control module 14.

[0048] In an optional example, temperature sensor 46 is a PT1000 platinum resistance thermometer, which can use dedicated leads and a three-wire connection to eliminate testing errors caused by wire resistance. The PT1000 platinum resistance thermometer acquires the temperature of the test environment and the device under test 300 in real time, providing data support for PID closed-loop temperature control. Control module 14 can use an FPGA as the control core and integrate a PID closed-loop control algorithm.

[0049] Please see Figure 4 and Figure 10 In one embodiment, the optoelectronic device testing module 100 further includes a heat pipe 62 and a cooling fan 64. The heat pipe 62 has a heat-absorbing end and a heat-dissipating end. The heat-absorbing end is thermally connected to the fixture 10, and the cooling fan 64 is installed on the heat-dissipating end of the heat pipe 62. The heat-absorbing end of the heat pipe 62 can absorb heat from the fixture 10 and transfer the heat to the heat-dissipating end, and then dissipate it from the heat-dissipating end. When the cooling fan 64 is not activated, the heat dissipation effect of the heat pipe 62 is limited, and the temperature control element 44 will continuously generate heat to maintain the temperature environment required for testing. Therefore, the heat pipe 62 will not affect the thermal performance testing. However, when the cooling fan 64 is activated, it can accelerate the airflow at the heat-dissipating end, thereby enhancing the heat dissipation effect of the heat-dissipating end and thus improving the heat dissipation effect of the heat pipe 62. When the test is completed and the device under test 300 needs to be removed, the cooling fan 64 can be turned on to enhance the heat dissipation effect of the heat pipe 62, thereby enhancing the heat dissipation effect of the heat pipe 62 on the fixture 10, so that the fixture 10 and the device under test 300 on the fixture 10 can be cooled quickly so that the device under test 300 can be removed quickly.

[0050] A heat sink 66 is installed at the heat dissipation end of the heat pipe 62, and the heat sink 66 forms a heat conduction connection with the heat pipe 62. A cooling fan 64 is installed on the heat sink 66. When the heat on the clamp 10 is transferred to the heat dissipation end of the heat pipe 62, the heat can be conducted from the heat dissipation end to the heat sink 66. The heat sink 66 can increase the contact area with the air, which helps to improve the heat dissipation effect of the heat pipe 62.

[0051] Optionally, the heat sink 66 is a finned heat sink 66, which includes multiple heat dissipation fins facing the cooling fan 64 to increase the contact area between the heat sink 66 and the air, thereby increasing the heat dissipation area. The cooling fan 64 is mounted on the heat dissipation fins. When the cooling fan 64 is started, it can accelerate the airflow across the heat dissipation fins, thereby improving the heat dissipation effect.

[0052] Optionally, a base is provided below the clamp 10 to support the clamp 10, and the base and the clamp 10 are stacked. One end of the heat pipe 62 is located between the base and the clamp 10 and forms a heat conduction connection with the support member 30 of the clamp 10, and the other end extends to the outside of the base for the heat sink 66 to be installed.

[0053] Please see Figure 4 and Figure 8 In one embodiment, the illumination assembly includes a light source 68 and a photoelectric sensor 70, which are electrically connected to the control module 14. The light source 68 is spaced apart from the fixture 10 and is used to generate illumination directed towards the device under test (DUT) 300, providing the illumination environment required for optical performance testing. The photoelectric sensor 70 is mounted on the fixture 10 and is used to detect the intensity of the illumination directed towards the DUT 300, so as to stabilize the illumination intensity at a predetermined value and ensure the accuracy of the test results.

[0054] When the current light intensity detected by the photoelectric sensor 70 is different from the predetermined light intensity, the photoelectric device test function module 100 can issue an alarm message, such as flashing lights or voice, to alert the tester that there is an abnormality in the current light intensity and terminate the test operation.

[0055] Optionally, the light source 68 is located above the fixture 10, and it can generate downward illumination to direct light onto the device under test 300 on the fixture 10 below. The light source 68 can be located directly above the device under test 300 or diagonally above the device under test 300.

[0056] The photoelectric sensor 70 is disposed on the test circuit board 26 and is located at least in the receiving groove 42 between the first clamping part 38 and the second clamping part 40, and faces the clearance hole 34. When the light emitted by the light source 68 passes through the clearance hole 34 and acts on the device under test 300, the photoelectric sensor 70 can detect the intensity of the light passing through the clearance hole 34.

[0057] The test circuit board 26 is provided with a light source interface 72, which is exposed to the fixture 10 through an opening. The light source 68 is electrically connected to the test circuit board 26 through the light source interface 72, thereby realizing the electrical connection between the light source 68 and the photoelectric sensor 70.

[0058] Optionally, the light source 68 can be an LED, laser diode, or other suitable source that is compatible with visible light (400-760nm) and invisible light (such as UV and infrared). It can be connected using low-noise copper core wires. When the control module 14 confirms that the deviation between the current light intensity and the predetermined light intensity exceeds the preset range, it can trigger an alarm and send feedback to the host computer.

[0059] Please see Figure 9 In one embodiment, the control module 14 includes a current and voltage control unit 74, a temperature control unit 76, and a light source excitation control unit 78. The current and voltage testing unit 16 is electrically connected to the current and voltage control unit 74, thereby performing electrical performance tests under the control of the current and voltage control unit 74. The temperature control testing unit 18 is electrically connected to the temperature control unit 76, thereby performing thermal performance tests under the control of the temperature control unit 76. The light source excitation testing unit 20 is electrically connected to the light source excitation control unit 78, thereby performing optical performance tests under the control of the light source excitation control unit 78.

[0060] Optionally, there may be multiple test modules 12, with multiple test modules 12 sharing a single control module 14. Specifically, each test module 12 includes a current and voltage testing unit 16, a temperature control testing unit 18, and a light source excitation testing unit 20. The current and voltage testing units 16 of the multiple test modules 12 are electrically connected to the current and voltage control unit 74, the temperature control testing units 18 of the multiple test modules 12 are electrically connected to the temperature control unit 76, and the light source excitation testing units 20 of the multiple test modules 12 are electrically connected to the light source excitation control unit 78.

[0061] Please participate Figures 8 to 10 In one embodiment, the optoelectronic device testing function module 100 further includes a housing 80, in which the fixture 10, the testing module 12, and the control module 14 are all located within the housing 80 to provide protection and reduce the interference of external ambient temperature and light on the temperature and light of the testing environment.

[0062] The housing 80 has a first partition 81 inside, which divides the internal space of the housing 80 into a first chamber 82 and a second chamber 83. The control module 14 is located in the first chamber 82, and the fixture 10 and the control module 14 are located in the second chamber 83. The first partition 81 separates the control module 14 from the test module 12 to avoid the influence of the ambient temperature and light when the test module 12 is working on the control module 14.

[0063] Optionally, the heat sink 66 and cooling fan 64 are located on the outside of the housing 80 to allow for heat dissipation through contact with the external space. The light source 68 is located within the second chamber 83 and is mounted on top of the housing 80.

[0064] The second chamber 83 is provided with multiple second partitions 84, which are respectively connected to the first partition 81. The multiple second partitions 84 are arranged at intervals and divide the second chamber 83 into multiple sub-chambers 85. Each sub-chamber 85 is equipped with a test module 12 and a fixture 10. The multiple test modules 12 are separated by the second partitions 84 to avoid mutual interference between the test modules 12.

[0065] Optionally, the housing 80 is generally rectangular, having a length direction and a width direction. A first partition 81 divides the internal space of the housing 80 into a first chamber 82 and a second chamber 83 in the length direction, that is, the first chamber 82 and the second chamber 83 are located on both sides of the first partition 81 in the length direction. A plurality of second partitions 84 are arranged at intervals in the width direction, and the second partitions 84 are perpendicular to the first partitions 81. The second partitions 84 divide the second chamber 83 into a plurality of sub-chambers 85 in the width direction.

[0066] The first partition 81 has multiple through holes, and each sub-chamber 85 is connected to the first chamber 82 through one or more corresponding through holes. The wires connecting the test module 12 and the control module 14 can pass through the through holes and extend into the first chamber 82.

[0067] The housing 80 is also provided with heat dissipation holes and wire outlet holes. Both the heat dissipation holes and wire outlet holes are connected to the first chamber 82. The heat dissipation holes can be used for heat dissipation. The heat generated by the control module 14 when it is working can be dissipated to the external environment through the heat dissipation holes. The wires connected to the control module 14 can extend out of the housing 80 through the wire outlet holes to be electrically connected to external components.

[0068] The housing 80 includes a top plate 86, a bottom plate 87 spaced apart from the top plate 86, and two first side plates 88 and two second side plates 89 located between the top plate 86 and the bottom plate 87. The two first side plates 88 are spaced apart from each other, and the two second side plates 89 are spaced apart from each other. Each second side plate 89 is connected to the two first side plates 88 at both ends.

[0069] The first partition 81 is spaced between the two first side plates 88 and connected to the two second side plates 89 at both ends. The first chamber 82 is located between the first partition 81 and one of the first side plates 88. The second chamber 83 is located between the second partition 84 and the other first side plate 88. The distance between the first side plate 88 closer to the second chamber 83 and the first partition 81 is less than the distance between the side plate closer to the first chamber 82 and the first partition 81, that is, the volume of the second chamber 83 is smaller than the volume of the first chamber 82. The second partition 84 is located between the first partition 81 and one of the first side plates 88 (i.e., the first side plate 88 closer to the first chamber 82), and multiple second partitions 84 are spaced apart along the arrangement direction of the two second side plates 89.

[0070] The first side plate 88 near the second chamber 83 includes a first fixed part 90 and a first movable part 91. The first fixed part 90 is fixed on the base plate 87. One end of the first movable part 91 is rotatably connected to the first fixed part 90. The other end of the first movable part 91 is provided with a locking structure 92 between it and the top plate 86. In the locked state, the first movable part 91 and the first fixed part 90 and the top plate 86 are kept relatively fixed. In the unlocked state, the first movable part 91 can rotate relative to the first fixed part 90 and the top plate 86 to expose the clamp 10 in the second chamber 83, so as to complete the picking and placing of the device under test 300.

[0071] The top plate 86 includes a second fixed part 93 and a second movable part 94. The second fixed part 93 is located above the first chamber 82 and is connected to the first partition 81 and another first side plate 88. The second movable part 94 is located above the second chamber 83, with one end rotatably connected to the second fixed part 93 and the other end engaging with the first movable part 91 via a locking structure 92. When the locking structure 92 is in the locked state, the first movable part 91 and the second movable part 94 remain relatively fixed, and neither the first movable part 91 nor the second movable part 94 can rotate. When the locking structure 92 is in the unlocked state, the first movable part 91 and the second movable part 94 can separate. At this time, the first movable part 91 can rotate relative to the first fixed part 90, and the second movable part 94 can rotate relative to the second fixed part 93. At this time, one side and the top of the second chamber 83 are open, facilitating the placement and removal of the device under test 300.

[0072] Optionally, the first movable part 91 is movably connected to the first fixed part 90 via a hinge structure, and the second movable part 94 is movably connected to the second fixed part 93 via a hinge structure. The locking structure 92 includes a locking part provided on the first movable part 91 and a fixed seat provided on the second movable part 94. The locking part can rotate relative to the first movable part 91 to connect or disconnect from the fixed seat. When the locking part is connected to the fixed seat, the locking structure 92 is in a locked state; when the locking part is separated from the fixed seat, the locking structure 92 is in an unlocked state.

[0073] The optoelectronic device testing module 100 in this application is uniformly controlled by a host computer during the execution of the testing process. It controls the collaborative work of each module according to predetermined test items, supporting both individual and combined testing. In an optional example, the specific testing steps are as follows: 1. Individual current test: Fix the device under test 300 on the fixture 10 and start the host computer; output the test signal according to the single-point voltage or voltage curve set in the program, and synchronously read the current corresponding data of the device under test 300 to complete the electrical performance test.

[0074] 2. Light Addition Test: The host computer or slave computer controls the control module to drive the power supply to output a light signal of a set intensity; the light signal intensity is detected in real time by the photoelectric sensor 70 to ensure that the light source 68 is working properly; repeat the current and voltage test process in step 1 to obtain the electrical performance of the device under test 300 under specific light excitation.

[0075] 3. Heating or cooling test: The temperature control component 44 is controlled by the host computer or slave computer to start temperature regulation; through PID real-time feedback closed-loop control, the test environment temperature is stabilized to the set value; after the temperature reaches the standard, step 1 or step 2 can be repeated to complete the combined scenario test of temperature-current, temperature-light-current, etc.

[0076] 4. Cooling: After the test is completed, turn on the cooling fan 64 to quickly cool the device under test 300 on the fixture 10 to room temperature, making it easier to remove the device under test 300.

[0077] The optoelectronic device testing module 100 in this application has at least the following beneficial effects: 1. Modular design: Different test items such as current and voltage testing, temperature control, and light source excitation are integrated into a single module, eliminating the need for separate operations and simplifying the testing process.

[0078] 2. High scalability: It adopts a modular + multi-channel architecture, which supports flexible expansion of the number of modules and channels to adapt to different test scale requirements.

[0079] 3. High flexibility: Supports free switching between individual testing and combined testing, and allows customization of test items and processes according to R&D needs.

[0080] 4. Precise and controllable: The photoelectric sensor 70 detects the light intensity in real time, and the temperature sensor 46 detects the temperature of the device under test 300 in real time, realizing PID temperature closed-loop control, ensuring the stability of the test environment and the accuracy of data, while reducing the operation intensity of the operator.

[0081] Please see Figure 11 An embodiment of the present invention also provides an optoelectronic device testing device 1, including a cabinet 200 and optoelectronic device testing functional modules 100 as described in the above embodiments. The number of optoelectronic device testing functional modules 100 is multiple, and these modules are respectively installed in the cabinet 200. Optionally, the multiple optoelectronic device testing functional modules 100 are arranged in rows and columns on the cabinet 200. The specific structure of the optoelectronic device testing functional modules 100 can be referred to the description in the above embodiments. Since the optoelectronic device testing device 1 uses the optoelectronic device testing functional modules 100 as described in the above embodiments, it possesses at least all the beneficial effects brought by the optoelectronic device testing functional modules 100 in the above embodiments, which will not be elaborated further here.

[0082] The optoelectronic device testing equipment 1 includes multiple optoelectronic device testing function modules 100, and each optoelectronic device testing function module 100 includes multiple testing modules 12, and each testing module 12 includes multiple testing channels. Multiple testing channels are integrated into a standardized function module, and the modules are seamlessly cascaded through a standardized bus interface. A single optoelectronic device testing equipment 1 can support the parallel expansion of multiple function modules. The test channel allocation strategy can be configured with one click through the host computer software. This can meet the needs of parallel testing of multiple devices in a single batch, or different configurations can be set to achieve independent testing of different types of devices, adapting to the debugging needs of multi-specification samples in the R&D stage.

[0083] In one optional example, eight optoelectronic device test function modules 100 are installed on the rack 200. The eight optoelectronic device test function modules are arranged in a four-row, two-column configuration, that is, multiple optoelectronic device test function modules 100 are arranged in rows and columns. Each optoelectronic device test function module 100 includes four test modules 12, and each test module 12 includes four test channels.

[0084] The housing 80 of the optoelectronic device testing module 100 can adopt a standardized 4U chassis design to be compatible with industrial cabinet 200 installation. The cabinet 200 is equipped with guide rails, and the optoelectronic device testing module 100 is positioned by the guide rails, thus installing in the corresponding position in the cabinet 200, which significantly improves the convenience of operation and maintenance.

[0085] Please see Figure 12 An embodiment of the present invention also provides a method for testing optoelectronic devices, which uses the optoelectronic device testing equipment described in the above embodiment to test multiple devices under test; the testing method includes: S11: Control the current and voltage testing unit to output a preset intensity voltage to the device under test, and read the current signal on the device under test corresponding to the preset intensity voltage.

[0086] The current-voltage testing unit 16 can output a voltage of a preset intensity under the control of the control module 14. When the voltage passes through the device under test 300, a corresponding current will be generated on the device under test 300. The control module 14 can acquire the current signal on the device under test 300 and determine the electrical performance of the optoelectronic device under normal operating conditions by using the relative relationship between voltage and current. Optionally, the current-voltage testing unit 16 can output multiple voltages of different intensities sequentially to generate multiple currents of different intensities on the device under test 300, thereby improving the accuracy of the test results.

[0087] S12: Control the light source excitation test unit to output a preset intensity light, and under the preset intensity light condition, repeat S11 to obtain the current signal of the device under test corresponding to the preset intensity voltage under the preset intensity light.

[0088] The light source excitation test unit 20 can output a preset intensity of light under the control of the control module 14, and then repeat step S11 to obtain the current signal of the device under test 300 under a specific light intensity, so as to detect the effect of light intensity on the operation of the optoelectronic device.

[0089] S13: Control the temperature control test unit to heat or cool the device under test. After the temperature of the device under test or the temperature of the test environment stabilizes to a preset value, repeat S11 to obtain the current signal of the device under test corresponding to the preset intensity voltage at the preset temperature. Alternatively, after the temperature of the device under test or the temperature of the test environment stabilizes to a preset value, repeat S12 to obtain the current signal of the device under test corresponding to the preset intensity voltage at the preset temperature and preset light intensity.

[0090] The temperature control test unit 18, under the control of the control module 14, can heat or cool the device under test 300 or the ambient temperature of the environment in which the device under test 300 is located to a preset value. After the temperature reaches the preset value, if S11 is repeated, the current signal of the device under test 300 at a specific temperature can be acquired to detect the effect of temperature on the operation of the optoelectronic device. After the temperature reaches the preset value, if S12 is repeated, the current signal of the device under test 300 at a specific temperature and light intensity can be acquired to detect the combined effect of temperature and light on the operation of the optoelectronic device.

[0091] S14. Based on the current signals obtained in S11, S12, and S13, determine the electrical performance of the device under test.

[0092] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A testing functional module for optoelectronic devices, characterized in that, The system includes a fixture (10), a test module (12), and a control module (14). The test module (12) includes a current and voltage test unit (16), a temperature control test unit (18), and a light source excitation test unit (20). The current and voltage test unit (16), the temperature control test unit (18), and the light source excitation test unit (20) are electrically connected to the control module (14). The fixture (10) is used to carry the device under test (300). The current and voltage testing unit (16) is electrically connected to the device under test (300) located on the fixture (10) and is used to perform current and voltage testing on the device under test (300). The temperature control testing unit (18) includes a temperature control component corresponding to the fixture (10). The temperature control component is used to heat or cool the device under test (300) under the control of the control module (14). The light source excitation testing unit (20) includes an illumination component corresponding to the fixture (10). The illumination component is used to generate a light signal of a set intensity to the device under test (300) under the control of the control module (14).

2. The optoelectronic device testing function module according to claim 1, characterized in that, The current and voltage testing unit (16) includes a test path assembly, which includes a conductive element (22), a channel interface (24) electrically connected to the conductive element (22), and a wire connecting the channel interface (24) to the control module (14). The conductive element (22) and the channel interface (24) are mounted on the fixture (10), and the conductive element (22) is used to contact the device under test (300) to form an electrical connection. The conductive element (22), the channel interface (24), and the wire together with the device under test (300) constitute a current and voltage testing path.

3. The optoelectronic device testing function module according to claim 2, characterized in that, The test module (12) and the fixture (10) are provided in multiple ways. The multiple test modules (12) and the multiple fixtures (10) correspond one-to-one. The current and voltage test unit (16) of each test module (12) includes multiple test path components. The multiple test path components are electrically connected to the control module (14) respectively to perform current and voltage tests on multiple different test areas of the device under test (300).

4. The optoelectronic device testing function module according to claim 3, characterized in that, The fixture (10) has a recessed storage space (28) for accommodating the device under test (300), and the conductive elements (22) of the plurality of test path components are arranged at circumferential intervals along the storage space (28).

5. The optoelectronic device testing function module according to claim 1, characterized in that, The temperature control assembly includes a temperature control element (44) and a temperature sensor (46) mounted on the fixture (10). Both the temperature control element (44) and the temperature sensor (46) are electrically connected to the control module (14). The temperature control element (44) is used to generate heat, and the temperature sensor (46) is used to detect the temperature of the device under test (300). The control module (14) controls the heat generated by the temperature control element (44) in real time according to the temperature information detected by the temperature sensor (46).

6. The optoelectronic device testing function module according to claim 5, characterized in that, The fixture (10) is provided with a storage space (28) and a mounting slot (50). The storage space (28) is used to accommodate the device under test (300). The mounting slot (50) is located below the storage space (28) and is connected to the storage space (28). A heat-conducting element (48) is provided in the mounting slot (50). The heat-conducting element (48) is used to contact the device under test (300). The temperature regulating element (44) and the temperature sensor (46) are mounted on the heat-conducting element (48).

7. The optoelectronic device testing function module according to claim 6, characterized in that, The heat-conducting component (48) includes a main body (52) and a protrusion (54). The main body (52) is located in the mounting groove (50) and fixed relative to the clamp (10). The protrusion (54) is located on the side of the main body (52) near the storage space (28) and is used to contact the device under test (300). The side of the main body (52) away from the protrusion (54) is provided with a groove (56). The groove wall of the groove (56) is provided with a mounting hole (58). One end of the mounting hole (58) extends into the protrusion (54). The temperature regulating component (44) is installed in the groove (56), and the temperature sensor (46) is installed in the mounting hole (58).

8. The optoelectronic device testing function module according to claim 5, characterized in that, It also includes a heat pipe (62) and a cooling fan (64), wherein the heat-absorbing end of the heat pipe (62) is connected to the clamp (10), and the cooling fan (64) is installed on the heat-dissipating end of the heat pipe (62).

9. The optoelectronic device testing function module according to claim 1, characterized in that, The illumination component includes a light source (68) and a photoelectric sensor (70). The light source (68) and the photoelectric sensor (70) are electrically connected to the control module (14). The light source (68) is arranged at intervals relative to the fixture (10) and is used to generate illumination directed toward the device under test (300). The photoelectric sensor (70) is mounted on the fixture (10) and is used to detect the intensity of the illumination directed toward the device under test (300).

10. The optoelectronic device testing functional module according to any one of claims 1-9, characterized in that, The optoelectronic device testing module further includes a housing (80) and a first partition (81) located inside the housing (80). The first partition (81) divides the interior of the housing (80) into a first chamber (82) and a second chamber (83). The control module (14) is located in the first chamber (82). The second chamber (83) is provided with a plurality of second partitions (84). The plurality of second partitions (84) are arranged at intervals and divide the second chamber (83) into a plurality of sub-chambers (85). Each sub-chamber (85) is equipped with a test module (12) and a fixture (10).

11. A testing device for optoelectronic devices, characterized in that, It includes a cabinet (200) and a plurality of optoelectronic device testing function modules (100) as described in any one of claims 1-10, wherein the plurality of optoelectronic device testing function modules (100) are respectively installed in the cabinet (200) and the plurality of optoelectronic device testing function modules (100) are arranged in rows and columns.

12. A method for testing optoelectronic devices, characterized in that, The testing method using the optoelectronic device testing equipment as described in claim 11 includes: S11: Control the current and voltage testing unit to output a preset intensity voltage to the device under test, and read the current signal on the device under test corresponding to the preset intensity voltage; S12: Control the light source excitation test unit to output a preset intensity light, and under the preset intensity light condition, repeat S11 to obtain the current signal of the device under test corresponding to the preset intensity voltage under the preset intensity light. S13: Control the temperature control test unit to heat or cool the device under test. After the temperature of the device under test or the temperature of the test environment stabilizes to a preset value, repeat S11 to obtain the current signal of the device under test corresponding to the preset intensity voltage at the preset temperature. Alternatively, after the temperature of the device under test or the temperature of the test environment stabilizes to a preset value, repeat S12 to obtain the current signal of the device under test corresponding to the preset intensity voltage at the preset temperature and preset light intensity. S14. Based on the current signals obtained in S11, S12, and S13, determine the electrical performance of the device under test.

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