A transient conducted compatibility evaluation method, device, equipment and medium

Abstract

The application relates to the technical field of automobile electronics, and discloses a transient conduction compatibility evaluation method, device, equipment and medium, wherein the method comprises the following steps: obtaining a transient conduction emission waveform of an interference source device, and extracting a characteristic parameter of the transient conduction emission waveform; generating a test interference signal based on the transient conduction emission waveform or the characteristic parameter, and applying the test interference signal to a target adversary device to obtain a critical tolerance threshold of the target adversary device when the target adversary device reaches a preset condition; determining a reference amplitude margin based on the characteristic parameter and the critical tolerance threshold, and correcting the reference amplitude margin to generate an equivalent comprehensive margin; and determining a comprehensive compatibility index based on the equivalent comprehensive margin, in combination with a functional safety level of the target adversary device and a weighted coefficient corresponding to a failure mode, so as to determine a compatibility level of the target adversary device with respect to the interference source device. The technical scheme provided by the application can quantitatively evaluate the tolerance of the adversary device in the case that the interference source exceeds the standard.

Description

Technical Field

[0001] This application relates to the field of automotive electronics technology, and in particular to a transient conduction compatibility assessment method, apparatus, device, and medium. Background Technology

[0002] In recent years, with the evolution of new energy vehicles towards high-voltage and domain-centralized electrical architectures, the deployment density of on-board electronic devices has increased significantly, leading to increasingly common scenarios where conducted emissions from interference sources exceed standards and cannot be rectified. Current mainstream electromagnetic compatibility (EMC) assessment systems are built on the ideal premise of "interference source compliance" and "standard waveforms covering actual operating conditions," directly creating assessment blind spots when facing real-world scenarios with excessive interference. Existing alternatives such as standard compliance assessments, empirical subjective inferences, vehicle-level testing, and simulation predictions all suffer from common defects, including reliance on general waveforms rather than actual excessive waveforms, the inability to quantify real failure thresholds using binary judgments, and the lack of scientific judgment criteria combining functional safety levels and failure modes. Their technical logic is systematically disconnected from the real engineering needs of scenarios with excessive interference sources, failing to meet the requirement for accurate prediction of device compatibility in the early stages of development.

[0003] Therefore, how to quantitatively assess the tolerance of hand components in scenarios where interference sources exceed the standard is a technical problem that urgently needs to be solved. Summary of the Invention

[0004] This application provides a transient conduction compatibility assessment method, apparatus, device, and medium, which achieves the technical effect of quantitatively assessing the tolerance of hand components in scenarios where interference sources exceed the standard.

[0005] To achieve the above objectives, the main technical solutions adopted in this application include: In a first aspect, embodiments of this application provide a transient conduction compatibility assessment method, the method comprising: Acquire the transient conducted emission waveform of the interference source device, and extract the characteristic parameters of the transient conducted emission waveform; A test interference signal is generated based on the transient conducted emission waveform or the characteristic parameters, and the test interference signal is applied to the target opponent to obtain the critical tolerance threshold when the target opponent reaches the preset conditions. A baseline amplitude margin is determined based on the characteristic parameters and the critical tolerance threshold, and the baseline amplitude margin is corrected to generate an equivalent comprehensive margin. Based on the equivalent comprehensive margin, and combined with the weighted coefficients corresponding to the functional safety level and failure mode of the target device, a comprehensive compatibility index is determined to assess the compatibility level of the target device with respect to the interference source device.

[0006] In one implementation, generating the test interference signal includes: The transient conducted emission waveform is exported as a digital waveform file, and the digital waveform file is imported into a waveform generator to reconstruct and output the test interference signal through the waveform generator.

[0007] In one implementation, generating the test interference signal includes: The characteristic parameters are analyzed to obtain the maximum amplitude, rise time, pulse width, repetition frequency, and decay oscillation frequency of the transient conducted emission waveform; Based on the maximum amplitude, the rise time, the pulse width, the repetition frequency, and the decaying oscillation frequency, a test interference signal is generated using the waveform editing function of the waveform generator.

[0008] In one embodiment, applying the test interference signal to the target adversary to obtain the critical tolerance threshold of the target adversary when it reaches a preset condition includes: Starting from a preset initial stress level, the test interference signal is applied to the target hand component, and the stress level of the test interference signal is gradually increased. At each stress level, the test interference signal is maintained for a preset duration, and the working status of the target component is monitored simultaneously. The current stress level when the operating state is the first indication function failure, or the maximum stress level when the termination condition is met, is determined as the critical tolerance threshold.

[0009] In one implementation, determining the reference amplitude margin based on the characteristic parameters and the critical tolerance threshold includes: Extract the maximum amplitude of the transient conducted emission waveform from the characteristic parameters; Determine the ratio between the critical tolerance threshold and the maximum amplitude value; Perform a logarithmic operation on the ratio to convert it into a decibel value, and determine the decibel value as the reference amplitude margin.

[0010] In one implementation, the step of correcting the reference amplitude margin to generate an equivalent composite margin includes: The waveform energy equivalence coefficient is determined based on the aforementioned characteristic parameters, and the failure time sensitivity coefficient is determined based on the obtained failure response time. The waveform energy equivalent coefficient is converted into a first logarithmic value, and the failure time sensitivity coefficient is calculated with a preset time dimension conversion coefficient to obtain a second logarithmic value; The first logarithmic value and the second logarithmic value are subtracted sequentially from the reference amplitude margin to generate the equivalent comprehensive margin.

[0011] In one implementation, determining the comprehensive compatibility index includes: Obtain a preset good compatibility benchmark value, and determine the first calculation result based on the sum of the equivalent comprehensive margin and the good compatibility benchmark value; Obtain the pre-configured functional safety level of the target device and match it with the first weighting coefficient corresponding to the functional safety level; Obtain the failure mode of the target component under the action of the test interference signal, and match the second weighting coefficient corresponding to the failure mode; The second calculation result is determined based on the product of the compatibility benchmark value, the first weighting coefficient, and the second weighting coefficient. The comprehensive compatibility index is determined based on the ratio of the first calculation result to the second calculation result.

[0012] In one embodiment, determining the compatibility level of the target device with respect to the interfering source device includes: Obtain the preset compatibility judgment threshold; The comprehensive compatibility index is compared with the compatibility judgment threshold; Based on the comparison results, the compatibility level of the target device with respect to the interference source device is determined.

[0013] Secondly, embodiments of this application provide a transient conduction compatibility evaluation device, the device comprising: The waveform acquisition and feature extraction unit is used to acquire the transient conducted emission waveform of the interference source device and extract the feature parameters of the transient conducted emission waveform; The signal application and threshold acquisition unit is used to generate a test interference signal based on the transient conducted emission waveform or the characteristic parameters, and apply the test interference signal to the target opponent to obtain the critical tolerance threshold when the target opponent reaches the preset conditions. The margin determination and correction unit is used to determine the reference amplitude margin based on the feature parameters and the critical tolerance threshold, and to correct the reference amplitude margin to generate an equivalent comprehensive margin. The index determination and level determination unit is used to determine the comprehensive compatibility index based on the equivalent comprehensive margin and the weighted coefficients corresponding to the functional safety level and failure mode of the target counterpart, so as to determine the compatibility level of the target counterpart for the interference source device.

[0014] Thirdly, embodiments of this application provide a computer device, including: The system includes a memory and a processor, which are interconnected. The memory stores computer instructions, and the processor executes these computer instructions to perform the transient conduction compatibility assessment method described above.

[0015] Fourthly, embodiments of this application provide a computer-readable storage medium storing computer instructions, which are used to cause a computer to execute the transient conduction compatibility assessment method described above.

[0016] The technical solutions provided by one or more embodiments of this application, by capturing the transient conducted emission waveform of the interference source device and extracting key characteristic parameters such as maximum amplitude, rise time, pulse width, repetition frequency, and decay oscillation frequency, can realistically restore the high-frequency details of transient interference and completely and accurately obtain the actual conducted emission characteristics of the interference source. Based on this, by exporting the transient conducted emission waveform as a digital file or parametrically reconstructing it based on characteristic parameters, a test interference signal equivalent to the transient conducted emission waveform in terms of time-domain morphology, amplitude characteristics, and spectral distribution is generated. This signal is then used in a step-stress test method to progressively approach the failure threshold of the target device, thereby using the actual out-of-specification waveform instead of the standard general waveform as the test input to accurately quantify and obtain the critical withstand capability when the target device first experiences functional failure. The system is first assessed by setting a threshold. Then, a dynamic correction is performed by combining the baseline amplitude margin with the waveform energy equivalence coefficient and the failure time sensitivity coefficient. This not only considers the static amplitude difference of the interference waveform but also comprehensively incorporates the waveform energy distribution characteristics and the response characteristics of the target component to the interference duration, generating an equivalent comprehensive margin that more comprehensively and accurately reflects the compatibility status under real operating conditions. Finally, by combining the equivalent comprehensive margin with the functional safety level and failure mode weights of the target component, a comprehensive compatibility index is calculated. This not only quantifies the equivalent comprehensive margin of the device but also comprehensively incorporates the influence of functional safety objectives and the severity of failure consequences. This allows for a scientific and intuitive determination of the compatibility level of the target component under real operating conditions, providing a clear basis for vehicle electromagnetic compatibility design and rectification decisions. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 A flowchart illustrating a transient conduction compatibility assessment method provided in this application embodiment; Figure 2 A flowchart for obtaining the critical tolerance threshold provided in this application embodiment; Figure 3 The diagram shown is a schematic diagram of step stress application according to an embodiment of this application; Figure 4 A flowchart for determining the reference amplitude margin based on characteristic parameters and critical tolerance threshold provided in this application embodiment; Figure 5 A flowchart for correcting the reference gain margin to generate an equivalent comprehensive margin, provided for embodiments of this application; Figure 6 A flowchart for determining the comprehensive compatibility index provided in this application embodiment; Figure 7 A flowchart for determining the compatibility level of a target device with respect to an interfering source device, provided for embodiments of this application; Figure 8 A block diagram of a transient conduction compatibility evaluation device provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a computer device provided in an embodiment of this application. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] In recent years, with the evolution of new energy vehicles towards high-voltage, domain-centralized electrical architectures, the deployment density of on-board power electronic devices and high-speed communication devices has increased significantly. This has led to more complex coupling paths and higher interference intensity for conducted interference. In engineering development, scenarios where conducted emissions from interference source devices exceed standards and cannot be eliminated through rectification are becoming increasingly common. The current industry assessment system for the electromagnetic compatibility of on-board electronic devices is adapted to the early development model of "vehicle-defined requirements and supplier-divided R&D." Its core logic is divide-and-conquer: after the vehicle manufacturer clarifies the system requirements, it separately commissions suppliers to develop interference source devices and sensitive devices (opposite components) affected by interference. During the assessment, on the one hand, conducted emission tests are conducted on interference sources according to standards such as ISO 7637-2 to verify that their emission intensity does not exceed the standard limits; on the other hand, immunity tests are conducted on sensitive devices according to standards such as ISO 7637-3 to verify that they can operate normally under the general interference levels specified in the standards. The operation of this system is based on two core premises: first, the conducted emissions of interference source devices always meet the standard limits; and second, the immunity tests of sensitive devices cover all possible actual interference conditions they may encounter.

[0021] As more and more scenarios of interference sources exceeding the standard and being unable to be rectified occur in engineering development, the two core premises mentioned above often fail simultaneously: on the one hand, due to rigid constraints such as design finalization, insufficient PCB layout space, and project cost control, it is no longer possible to add conducted interference suppression measures for interference sources, and the actual conducted emissions far exceed the standard limits; on the other hand, the existing evaluation system only uses the general waveforms specified in the standard as test inputs, which cannot reflect the response performance of sensitive devices under real excessive interference, nor can it give quantitative system compatibility judgments, directly forming an evaluation blind spot in scenarios where interference sources exceed the standard.

[0022] To address this blind spot, the industry currently offers four main alternative solutions, but all of them suffer from inherent flaws that make them difficult to adapt to real-world engineering needs: Standard compliance assessment: Its core logic is to verify whether the device under test (DUT) conforms to general standard limits. It uses only the general waveforms specified in standards such as ISO 7637 as test inputs to verify whether the sensitive device meets the standard immunity requirements. This type of solution is only applicable to conventional scenarios where the interference source does not exceed the limit. Since the test input is not the actual excessive waveform generated by the interference source, even if the sensitive device passes the standard immunity test, its ability to withstand interference under real excessive operating conditions cannot be extrapolated, making it completely unsuitable for scenarios where the interference source exceeds the limit.

[0023] Empirical subjective inference: Engineers judge the failure risk of sensitive components based on the magnitude of the interference source exceeding the standard and their own project experience. This method lacks reproducible quantitative evidence. Engineers with different experience backgrounds may reach completely opposite conclusions for the same exceeding standard scenario. They may misjudge it as safe, leaving potential failure hazards, or they may misjudge it as dangerous, causing unnecessary over-design. The reliability of the decision is extremely low.

[0024] Vehicle-level electromagnetic compatibility testing: After installing the interference source and sensitive devices in the vehicle, system-level testing is conducted to verify their compatibility under actual operating conditions. However, this method can only be implemented in the later stages of development. Once a problem is discovered, the coupling paths of each subsystem need to be investigated one by one. Fault location is difficult, the rectification cycle is long, and the cost is high. It cannot provide predictive support for the early device selection and interface definition, and cannot adapt to the decision-making needs in the early stages of development.

[0025] Simulation prediction method: By building equivalent circuit models of interference sources, wiring harness coupling paths, and sensitive devices, tools such as SPICE are used to simulate the transmission of transient interference and the response of sensitive devices. However, automotive electronic systems contain a large number of nonlinear devices such as port protection diodes, ferrite beads, and DC-DC switching power supply input stages. Their actual responses under high-amplitude transient pulses are extremely difficult to model accurately, and the simulation results often have a non-negligible deviation from actual tests, resulting in insufficient prediction reliability.

[0026] The common flaws of the above four types of solutions are essentially due to a systematic disconnect between their technical logic and the actual engineering requirements under scenarios where interference sources exceed standards. This collectively points to a clear technical gap: From the perspective of evaluation input, all solutions use standard-specified general waveforms as input, rather than the actual excessive waveforms generated by the interference sources, making the evaluation conclusions completely incompatible with real-world operating conditions. From the perspective of testing logic, all solutions employ a single-level "pass / fail" binary judgment, only obtaining the device's immunity performance at discrete points, unable to plot continuous tolerance curves, and therefore unable to determine the device's true failure threshold and safety margin. From the perspective of judgment indicators, the outputs of all solutions are qualitative descriptions, lacking quantitative judgment criteria that uniformly incorporate waveform characteristics, time response characteristics, and safety levels, resulting in a lack of reproducible scientific basis for engineering decisions. From the perspective of safety correlation logic, none of the solutions establish a correlation with the functional safety level (ASIL) of the device under test, using a uniform judgment standard for devices of different safety levels, violating the fundamental principle of functional safety that "the higher the level, the higher the robustness requirement."

[0027] In conclusion, how to quantitatively assess the tolerance of hand components in scenarios where interference sources exceed the standard is a technical problem that urgently needs to be solved.

[0028] According to an embodiment of this application, a transient conduction compatibility assessment method embodiment is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0029] This embodiment provides a transient conduction compatibility assessment method. Figure 1 A flowchart of a transient conduction compatibility assessment method provided in this application embodiment is shown below. Figure 1 As shown, the process includes the following steps: Step S1: Obtain the transient conducted emission waveform of the interference source device and extract the characteristic parameters of the transient conducted emission waveform.

[0030] Specifically, transient conducted emission data is acquired for interfering devices under typical operating conditions. Typical operating conditions include, but are not limited to, operating states that can induce maximum transient interference, such as when the interfering device is at maximum power output or in the mode with the most frequent switching operations. Specifically, an oscilloscope is used as the data acquisition device, and a voltage probe is used to capture the transient conducted emission waveform W(t) at the power or signal line ports of the interfering device. To ensure the integrity and accuracy of the acquired data, the oscilloscope's acquisition bandwidth should be no less than five times the highest frequency component of the interfering signal, and the sampling rate must satisfy the Nyquist sampling theorem to ensure that the high-frequency details of the transient interference can be accurately reproduced.

[0031] Time-domain feature analysis was performed on the acquired transient conducted emission waveform W(t) to extract its characteristic parameters. These characteristic parameters include one or more of the following: Maximum amplitude V max , that is, the voltage peak value of the transient conducted emission waveform over the entire time domain, used to characterize the energy intensity of transient interference; Ascent time t r The time taken for the transient conducted emission waveform to rise from 10% to 90% of its peak value is used to characterize the steepness of transient interference. Pulse width t w_stress The duration of transient conducted emission waveform is the time span during which it remains at 50% of its peak value, and is used to characterize the duration of transient interference. repetition frequency f stress If the acquired transient conducted emission waveform is a pulse group waveform, the frequency of pulse repetition is recorded to characterize the time-domain distribution characteristics of transient interference. The frequency of the damped oscillation is f osc If the transient conducted emission waveform exhibits damped oscillation characteristics, the dominant frequency of the oscillation is recorded to characterize the frequency domain characteristics of the transient interference.

[0032] Step S3: Generate a test interference signal based on the transient conducted emission waveform or characteristic parameters, and apply the test interference signal to the target device to obtain the critical tolerance threshold when the target device reaches the preset conditions.

[0033] Specifically, by analyzing the characteristic parameters (such as maximum amplitude, rise time, and pulse width) of the transient conducted emission waveform of the interference source device, and utilizing the parameterized reconstruction function of the waveform generator, a test interference signal that is highly consistent with the transient conducted emission waveform in the time domain is accurately synthesized. Subsequently, this test interference signal is injected into the target device through an adapted coupling network, and a step-stress testing strategy is adopted, progressively increasing the interference intensity starting from a preset initial stress level. At each stress level, a preset holding time is maintained to ensure sufficient interference conduction, while simultaneously monitoring the operating status of the target device. Through this progressive approximation method, the critical stress level at which the target device first experiences functional failure (such as Class C functional degradation or Class D permanent damage) can be accurately captured, thereby quantifying its critical tolerance threshold and providing reliable data support for subsequent calculations of compatibility margins.

[0034] In a preferred embodiment, generating a test interference signal includes: exporting a transient conducted emission waveform as a digital waveform file and importing the digital waveform file into a waveform generator to reconstruct the output test interference signal through the waveform generator.

[0035] Specifically, after acquiring and extracting the characteristic parameters of the transient conducted emission waveform W(t) of the interference source device, the captured transient conducted emission waveform W(t) is exported as a digital waveform file F. The digital waveform file F completely records the discrete sampling points of the transient conducted emission waveform in the form of time-amplitude data pairs. The file format includes, but is not limited to, common formats such as .csv, .txt, and .wfm, ensuring that the waveform data is not truncated or loses accuracy during the export process.

[0036] Subsequently, the digital waveform file F is imported into any waveform generator. The waveform generator possesses high-speed digital-to-analog conversion capabilities and programmable waveform editing functions. It can read time-amplitude data pairs from the digital waveform file F and reconstruct the corresponding analog voltage signal (i.e., the test interference signal) according to the original sampling timing sequence. During the reconstruction process, the waveform generator recovers the continuous-time waveform using an interpolation algorithm based on the imported data point sequence, and outputs a test interference signal at its analog output port that is equivalent to the transient conducted emission waveform W(t) in terms of time-domain morphology, amplitude characteristics, and spectral distribution.

[0037] In this way, this embodiment can use the actual out-of-standard waveform generated by the interference source device as the test input, rather than relying on the general waveform specified by the standard. This ensures that the test interference signal applied to the target device truly reflects the transient conducted interference characteristics under actual working conditions, and provides a reliable signal source guarantee for accurately obtaining the critical tolerance threshold of the target device.

[0038] In a preferred embodiment, generating a test interference signal includes: parsing characteristic parameters to obtain the maximum amplitude, rise time, pulse width, repetition frequency, and decaying oscillation frequency of the transient conducted transmitted waveform; and generating the test interference signal based on the maximum amplitude, rise time, pulse width, repetition frequency, and decaying oscillation frequency using the waveform editing function of a waveform generator.

[0039] Specifically, after completing the time-domain characteristic analysis of the transient conducted emission waveform W(t) of the interference source device, characteristic parameters characterizing the key properties of the waveform have been obtained. This embodiment uses a parametric reconstruction method to generate the test interference signal, that is, it does not directly rely on the complete sampling data of the original transient conducted emission waveform, but synthesizes the waveform based on the extracted characteristic parameters.

[0040] First, analyze the feature parameters extracted in the preceding steps, specifically including: the maximum amplitude V. max Used to determine the voltage peak value of the reconstructed waveform; rise time t r Used to determine the steepness of the leading edge of the reconstructed waveform; pulse width t w_stress Used to determine the duration of the reconstructed waveform near its peak; repetition frequency f stress Used to determine whether the reconstructed waveform is a single pulse or a pulse group; the decaying oscillation frequency f osc It is used to determine whether the reconstructed waveform contains a damped oscillation component and its oscillation frequency.

[0041] Subsequently, the aforementioned characteristic parameters are input into the waveform editing function of the waveform generator. The waveform generator possesses parametric waveform synthesis capabilities, enabling it to construct corresponding simulated interference signals (i.e., test interference signals) based on the input characteristic parameters using a built-in waveform generation algorithm. For example, for transient waveforms containing damped oscillation characteristics, the waveform generator can be based on the maximum amplitude V... max The damped oscillation frequency f osc And a sinusoidal oscillating signal with an exponentially decaying envelope is synthesized based on a preset attenuation coefficient; for rectangular pulse waveforms, the maximum amplitude V can be used as the basis. max Rise time t r and pulse width t w_stress Synthesize a pulse signal with a specified rising edge and width.

[0042] Through the parametric reconstruction method described above, this embodiment can generate a test interference signal equivalent to the original transient conducted transmission waveform based on key characteristic parameters without relying on complete waveform sampling data. This method not only reduces the requirements for data storage and transmission, but also facilitates independent adjustment and optimization of specific parameters during waveform editing, thereby providing a flexible signal generation method for subsequent evaluation of the compatibility of the target device under different interference conditions.

[0043] It is important to note that during the reconstruction process, the test interference signal generated by the waveform generator should maintain a high degree of consistency with the original transient conducted emission waveform W(t) in terms of time-domain characteristics. Specifically, the time-domain characteristic parameters of the reconstructed signal (including maximum amplitude, rise time, pulse width, repetition frequency, and decaying oscillation frequency) should deviate from the corresponding parameters of the original transient conducted emission waveform W(t) by no more than ±5%, to ensure that the test interference signal can truly reflect the time-domain characteristics of the original interference.

[0044] Step S5: Determine the reference amplitude margin based on the characteristic parameters and the critical tolerance threshold, and correct the reference amplitude margin to generate the equivalent comprehensive margin.

[0045] Specifically, based on the maximum amplitude of the transient conducted emission waveform and the critical tolerance threshold of the target device, a baseline amplitude margin is determined through logarithmic ratio calculation, thereby quantifying the tolerance margin of the target device in the static amplitude dimension. Subsequently, a waveform energy equivalence coefficient and a failure time sensitivity coefficient are introduced to dynamically correct the baseline amplitude margin. The waveform energy equivalence coefficient quantifies the impact of energy distribution differences under different waveform morphologies on the failure of the target device by comparing the pulse width and repetition frequency of the transient conducted emission waveform with a standard waveform; the failure time sensitivity coefficient reflects the sensitivity of the target device to the duration of interference based on the failure response time recorded in the step test. Finally, the logarithmic values ​​corresponding to the above two coefficients are successively subtracted from the baseline amplitude margin to generate an equivalent comprehensive margin. This equivalent comprehensive margin not only considers the static amplitude differences of the interference waveform but also comprehensively incorporates the waveform energy distribution characteristics and time response characteristics, thus reflecting the compatibility status of the target device under real operating conditions more comprehensively and accurately.

[0046] Step S7: Based on the equivalent comprehensive margin, and combined with the weighted coefficients corresponding to the functional safety level and failure mode of the target device, determine the comprehensive compatibility index to determine the compatibility level of the target device against the interference source device.

[0047] Specifically, the obtained equivalent comprehensive margin is summed with a preset good compatibility benchmark value to obtain the numerator reflecting the basic compatibility capability of the target component. Then, a functional safety level coefficient and failure mode weight are introduced as correction factors for the denominator. By comparing the numerator and denominator, the comprehensive compatibility index (CI) is generated. This index not only quantifies the equivalent comprehensive margin of the device but also comprehensively incorporates the influence of functional safety objectives and the severity of failure consequences. Therefore, based on preset multi-level judgment criteria, it can scientifically and intuitively output the compatibility level of the target component under real-world operating conditions, providing a clear basis for subsequent vehicle electromagnetic compatibility design and rectification decisions.

[0048] This embodiment provides a transient conducted compatibility assessment method. By capturing the transient conducted emission waveform of the interference source device and extracting key characteristic parameters such as maximum amplitude, rise time, pulse width, repetition frequency, and decay oscillation frequency, it can realistically restore the high-frequency details of transient interference and completely and accurately obtain the actual conducted emission characteristics of the interference source. Based on this, by exporting the transient conducted emission waveform as a digital file or parametrically reconstructing it based on the characteristic parameters, a test interference signal equivalent to the transient conducted emission waveform in terms of time domain morphology, amplitude characteristics, and spectral distribution is generated. A step-stress test method is used to progressively approach the failure critical point of the target device, thereby using the actual out-of-specification waveform instead of the standard general waveform as the test input to accurately quantify and obtain the critical withstand capability when the target device first experiences functional failure. The system is first assessed by setting a threshold. Then, a dynamic correction is performed by combining the baseline amplitude margin with the waveform energy equivalence coefficient and the failure time sensitivity coefficient. This not only considers the static amplitude difference of the interference waveform but also comprehensively incorporates the waveform energy distribution characteristics and the response characteristics of the target component to the interference duration, generating an equivalent comprehensive margin that more comprehensively and accurately reflects the compatibility status under real operating conditions. Finally, by combining the equivalent comprehensive margin with the functional safety level and failure mode weights of the target component, a comprehensive compatibility index is calculated. This not only quantifies the equivalent comprehensive margin of the device but also comprehensively incorporates the influence of functional safety objectives and the severity of failure consequences. This allows for a scientific and intuitive determination of the compatibility level of the target component under real operating conditions, providing a clear basis for vehicle electromagnetic compatibility design and rectification decisions.

[0049] Figure 2 The flowchart for obtaining the critical tolerance threshold provided in this application embodiment may include the following steps: Step S331: Starting from a preset initial stress level, apply the test interference signal to the target workpiece and gradually increase the stress level of the test interference signal.

[0050] Specifically, the target device (i.e., the sensitive device) is connected to the test circuit via a coupling / decoupling network. The selection of the coupling network is determined based on the type of interference, including but not limited to: direct coupling, capacitive coupling, inductive coupling, or power line impedance stabilization network coupling, to ensure that the test interference signal can be accurately and effectively injected into the designated port of the target device.

[0051] Secondly, the initial parameters for the step stress test are set, specifically including: Initial stress level L0: Set as the maximum amplitude V of the transient conducted emission waveform. max 30%-50%, that is, L0=(0.3-0.5)×V max The basis for this value range is that: below 30% may not trigger the nonlinear response region of the device, and above 50% may skip the critical state range of the device, which is not conducive to accurately locating the tolerance limit; Step increment ∆L: Set as the maximum amplitude V of the transient conducted emission waveform. max 10% of , that is ΔL=0.1×V max Alternatively, it can be set to a fixed value (e.g., 5V) based on the required test accuracy. The 10% increment is based on balancing test efficiency and threshold positioning accuracy, ensuring that the positioning error is within an acceptable range for engineering purposes. Duration T hold The duration of each stress level shall be no less than 3 pulse cycles (for pulse group interference) or no less than 10 seconds (for continuous waveforms) to ensure that the interference is fully conducted inside the component and a steady-state response is established. Termination condition: When the interference level L exceeds the maximum amplitude V of the transient conducted emission waveform. max Twice (i.e., L>2×V) max When the output capacity limit of the test equipment is reached, the step application is terminated.

[0052] Subsequently, step-by-step testing begins, with the current stress level L starting from the initial stress level L0. For example... Figure 3 The diagram shown is a schematic diagram of step stress application according to an embodiment of this application.

[0053] Step S333: Under each stress level, maintain the application time of the test interference signal for a preset holding time, and simultaneously monitor the working status of the target component.

[0054] Specifically, at each current stress level, the test interference signal is applied for a preset duration (e.g., no less than 3 pulse cycles or no less than 10 seconds) to ensure that the interference is fully conducted within the target device and establishes a steady-state response. Simultaneously, the operating status parameters of the target device (such as communication error frame rate, voltage / current deviation, control signal logic state, etc.) are continuously collected, and the device is judged in real time whether it has experienced functional failure based on preset failure classification standards (e.g., Level A: Completely Normal; Level B: Minor Disturbance; Level C: Functional Degradation / Reset; Level D: Permanent Damage).

[0055] The target components include, but are not limited to, communication devices, analog / power supply devices, or execution / control devices. Functional failures are determined according to the classification criteria defined in the table below: Step S335: Determine the current stress level when the working state is the first indication function failure, or the maximum stress level when the termination condition is met, as the critical tolerance threshold.

[0056] Specifically, during the step-by-step application process, if the target component is detected to have experienced a Class C or Class D functional failure for the first time, the current stress level L is immediately recorded. f As a critical tolerance threshold, failure mode M (level C or level D) and its specific manifestations are recorded simultaneously.

[0057] If no Class C or Class D functional failure occurs, the current stress level is incremented by one step: L = L f +ΔL, and return to the above operation to continue testing.

[0058] If no functional failure occurs during the gradual increase of stress levels until the preset termination condition is reached (e.g., the interference level exceeds twice the maximum amplitude or the equipment output limit is reached), then the maximum stress level at the end of the test is recorded as the critical tolerance threshold value.

[0059] This embodiment connects the target device to the test loop via a coupling network adapted to the type of interference and sets an initial stress level. This allows for the accurate and effective injection of the test interference signal into the target device with scientifically and rationally configured parameters, progressively increasing the stress level. Based on this, by maintaining the test interference signal at each stress level for a preset duration, the operating status of the target device is continuously and synchronously acquired, and the occurrence of functional failure is determined in real time. This ensures that the interference is fully propagated within the target device and a steady-state response is established, while simultaneously achieving accurate monitoring and classification of different types of failure states of the target device. Subsequently, by recording the current stress level when the target device's operating status first indicates functional failure as the critical tolerance threshold and simultaneously recording the failure mode and its specific manifestations, or by continuing incremental testing when no failure occurs and using the maximum stress level as the recorded value when the termination condition is reached without failure, the critical tolerance limit of the target device is accurately captured, providing reliable threshold data for subsequent compatibility margin calculations.

[0060] Figure 4 The flowchart provided for determining the reference amplitude margin based on characteristic parameters and critical tolerance threshold in the embodiments of this application may include the following steps: Step S511: Extract the maximum amplitude of the transient conducted emission waveform from the characteristic parameters.

[0061] Specifically, from the characteristic parameters of the transient conducted emission waveform extracted in the aforementioned steps, the peak voltage value of the transient conducted emission waveform over the entire time domain is obtained, i.e., the maximum amplitude value. This maximum amplitude value characterizes the intensity level of transient conducted interference generated by the interference source device under actual operating conditions.

[0062] Step S513: Determine the ratio between the critical tolerance threshold and the maximum amplitude value.

[0063] Specifically, the critical tolerance threshold L of the target handpiece determined in the aforementioned step test is obtained. f And calculate the critical tolerance threshold and the extracted maximum amplitude V. max The ratio between the two. This ratio reflects the target's tolerance to the actual emission intensity of the interference source relative to the amplitude dimension.

[0064] Step S515: Perform a logarithmic operation on the comparison value to convert the ratio into a decibel value, and determine the decibel value as the reference amplitude margin.

[0065] Specifically, a logarithmic operation with base 10 is performed on the determined ratio, and the result is multiplied by 20 to convert the linear ratio into a decibel (dB) value. This decibel value is then determined as the reference amplitude margin M. base In this embodiment, the calculation of the reference amplitude margin follows the formula: M base=20×log 10 (L f / V max (Unit: dB).

[0066] This embodiment extracts the voltage peak value, i.e., the maximum amplitude value, of the transient conducted emission waveform across the entire time domain from the characteristic parameters, which can accurately characterize the intensity level of transient conducted interference generated by the interference source device under actual operating conditions. Based on this, by determining the ratio between the critical tolerance threshold and the maximum amplitude value, the tolerance capability of the target device relative to the actual emission intensity of the interference source in the amplitude dimension can be reflected. Subsequently, by performing a logarithmic operation on this ratio, the linear ratio is converted into a decibel value and determined as the reference amplitude margin, thereby accurately quantifying the tolerance margin of the target device in the static amplitude dimension in decibel form.

[0067] Figure 5 The flowchart provided for the embodiments of this application for correcting the reference gain margin to generate an equivalent comprehensive margin may include the following steps: Step S531: Determine the waveform energy equivalent coefficient based on the characteristic parameters, and determine the failure time sensitivity coefficient based on the obtained failure response time.

[0068] Specifically, the waveform energy equivalence coefficient α is determined based on characteristic parameters. The waveform energy equivalence coefficient α is used to convert the energy difference between the actual transient conducted emission waveform and the standard waveform into a correction factor for the margin. Its calculation follows the formula: Among them, t w_stress The pulse width of the transient conducted transmit waveform is derived from characteristic parameters extracted from actual measurements; t w_standard The reference pulse width for the standard test waveform is derived from the specified value in the corresponding standard (such as ISO 7637-2); f stress The repetition frequency of the transient conducted emission waveform is derived from the characteristic parameters extracted from actual measurements; f standard The reference repetition frequency for the standard test waveform is derived from the specified value in the corresponding standard.

[0069] When the actual transient conducted emission waveform matches the standard test waveform, α=1, with no correction; when the actual transient conducted emission waveform has a wider pulse width or a higher frequency, α>1, resulting in a corresponding correction.

[0070] The failure time sensitivity coefficient β is determined based on the obtained failure response time. The dynamic tolerance characteristics of the device are extracted from the step test, and the failure time sensitivity coefficient β is calculated according to the following formula: Among them, T holdTo maintain the duration, i.e., the preset duration for each stress level; T failure λ represents the failure response time from the application of the test interference signal at the start of the current step to the occurrence of functional failure; λ is the time sensitivity coefficient, which is determined according to the failure level, with 0.3 for level C failure and 0.6 for level D failure; β reflects the time sensitivity of the target component to the test interference signal. If the target component fails rapidly in the early stages of the step, β>1, resulting in additional correction to the margin.

[0071] Step S533: Convert the waveform energy equivalent coefficient into a first logarithmic value, and calculate the failure time sensitivity coefficient with the preset time dimension conversion coefficient to obtain a second logarithmic value.

[0072] Specifically, the waveform energy equivalence coefficient α is converted into the first logarithmic value, i.e., 20 × log 10 (α). At the same time, the failure time sensitivity coefficient β is calculated with the preset time dimension conversion coefficient η to obtain the second logarithmic value, namely (β-1)×η.

[0073] Step S535: Subtract the first logarithmic value and the second logarithmic value from the reference magnitude margin in sequence to generate the equivalent comprehensive margin.

[0074] Specifically, the calculation of the equivalent comprehensive margin follows the formula: M eff =M base -20×log 10 (α)-(β-1)×η, where M eff For equivalent comprehensive margin; M base This is the baseline amplitude margin.

[0075] Through the above correction process, under standard waveform and standard response conditions (i.e., α=1, β=1), the equivalent synthesis margin M eff Equal to the reference amplitude margin M base In scenarios where the target device fails rapidly, by introducing the waveform energy equivalent coefficient and the failure time sensitivity coefficient, the impact of energy distribution and time response characteristics on device compatibility can be more comprehensively reflected, thereby generating an equivalent comprehensive margin that is more in line with actual working conditions.

[0076] This embodiment compares the pulse width and repetition frequency of the transient conducted emission waveform with the reference pulse width and reference repetition frequency specified in the corresponding standard, and determines the waveform energy equivalence coefficient based on the comparison results. This quantifies the energy difference between the real transient conducted emission waveform and the standard test waveform. Simultaneously, based on the ratio of the failure response time to the holding time from the application of the test interference signal at the start of the step test, combined with the time sensitivity coefficient determined according to the failure level, a failure time sensitivity coefficient reflecting the target device's time sensitivity to the test interference signal is determined. Furthermore, the waveform energy equivalence coefficient is converted into a first logarithm. The first logarithmic value is obtained by calculating the failure time sensitivity coefficient with the preset time dimension conversion coefficient, realizing the quantitative conversion of energy difference and time sensitivity into margin correction amount. Then, by subtracting the first logarithmic value and the second logarithmic value from the reference amplitude margin in turn, the equivalent comprehensive margin is generated, so that the equivalent comprehensive margin is equal to the reference amplitude margin under standard waveform and standard response conditions. However, in scenarios where the actual waveform energy is higher or the target device fails quickly, the equivalent waveform energy coefficient and the failure time sensitivity coefficient are introduced to comprehensively incorporate the influence of waveform energy distribution characteristics and failure time response characteristics on device compatibility, generating an equivalent comprehensive margin that is more in line with the actual working conditions.

[0077] Figure 6 The flowchart for determining the comprehensive compatibility index provided in this application embodiment may include the following steps: Step S711: Obtain a preset good compatibility benchmark value, and determine the first calculation result based on the sum of the equivalent comprehensive margin and the good compatibility benchmark value.

[0078] Specifically, obtain the preset, well-compatible baseline value M. ref In this embodiment, the compatibility benchmark value M is used. ref The preferred value is 6dB, which represents the baseline margin required for good compatibility between the target component and the peer under standard test conditions. Subsequently, the equivalent comprehensive margin M calculated in the preceding steps is... eff With good compatibility benchmark value M ref Perform a summation operation to obtain the first calculation result, i.e., (M) eff +M ref ).

[0079] Step S713: Obtain the pre-configured functional safety level of the target device and match the first weighting coefficient corresponding to the functional safety level.

[0080] Specifically, the pre-configured functional safety level (ASIL level) of the target device is obtained, and the corresponding first weighting coefficient K is matched according to the level. s Functional safety level and first weighting coefficient K sThe correspondence is as follows: When the functional safety level is ASIL A, K s =1.0; When the functional safety level is ASIL B, K s =1.2; When the functional safety level is ASIL C, K s =1.5; When the functional safety level is ASIL D, K s =2.0.

[0081] The first weighting coefficient K s The basis for this setting is that the higher the functional safety level, the more stringent the robustness requirements for systemic failures, thus requiring a larger compatibility margin. ASIL D, as the highest safety level, has a margin requirement that is twice that of ASIL A, reflecting the differentiated risk management requirements in functional safety standards.

[0082] Step S715: Obtain the failure mode of the target component under the action of the test interference signal, and match the second weighting coefficient corresponding to the failure mode.

[0083] Specifically, the failure modes (i.e., failure levels) of the target component recorded in the aforementioned step test are obtained, and the corresponding second weighting coefficient W is matched. m Failure mode and second weighting coefficient W m The correspondence is as follows: When the failure mode is Class C failure (functional degradation / reset), W m =0.8; When the failure mode is Class D failure (permanent damage), W m =1.0.

[0084] The second weighting coefficient W m The logic for setting Class D failure is as follows: Class D failure signifies that the physical tolerance boundary of the target component has been breached, reflecting a lower robustness limit for the target component itself. Therefore, it is given a higher weight, making the judgment of Class D failure target components more stringent under the same margin conditions. It is important to note the failure mode weight coefficient W. m It is only enabled when the functional failure level reaches level C or D. Levels A and B are not considered failures and do not trigger compatibility judgment, so they are not involved in the weighting coefficient.

[0085] Step S717: Determine the second calculation result based on the product of the compatibility benchmark value, the first weighting coefficient, and the second weighting coefficient.

[0086] Specifically, the benchmark value M with good compatibility ref First weighting coefficient K sand the second weighting coefficient W m The product of the three is performed to obtain the second calculation result, namely (M). ref ×K s ×W m ).

[0087] Step S719: Determine the comprehensive compatibility index based on the ratio of the first calculation result and the second calculation result.

[0088] Specifically, the first calculation result is divided by the second calculation result to obtain the comprehensive compatibility index (CI). The calculation of the comprehensive compatibility index (CI) follows the formula: Through the above calculation method, this embodiment not only considers the equivalent comprehensive margin of the target component, but also comprehensively incorporates the influence of functional safety level and failure mode on compatibility judgment, thereby generating a comprehensive compatibility index that can more comprehensively and rigorously reflect the actual compatibility status of the target component, providing a scientific and quantitative basis for subsequent compatibility judgment and rectification decisions.

[0089] This embodiment quantifies the basic compatibility capability of the target component by summing the equivalent comprehensive margin with a preset good compatibility benchmark value and incorporates the benchmark margin requirements under standard test conditions. Based on this, by obtaining the pre-configured functional safety level of the target component and matching the corresponding first weighting coefficient, it reflects the differentiated risk management requirements in functional safety standards, ensuring that a higher functional safety level corresponds to stricter robustness requirements for systemic failures. Simultaneously, by obtaining the failure modes of the target component under test interference signals and matching the corresponding second weighting coefficient, and then by multiplying the good compatibility benchmark value, the first weighting coefficient, and the second weighting coefficient, a second calculation result comprehensively reflecting the functional safety objective and the severity of failure consequences is generated.

[0090] Figure 7 The flowchart for determining the compatibility level of a target device with respect to an interfering source device, provided in the embodiments of this application, may include the following steps: Step S731: Obtain the preset compatibility judgment threshold.

[0091] Specifically, a multi-level judgment threshold is preset for evaluating the compatibility of the target component. In this embodiment, the compatibility judgment threshold includes a first threshold of 1.0 and a second threshold of 0.7, which are used to divide the comprehensive compatibility index (CI) into three compatibility level ranges.

[0092] Step S733: Compare the comprehensive compatibility index with the compatibility judgment threshold.

[0093] Specifically, if CI ≥ 1.0, it is judged to be of good compatibility, indicating that the target device can work reliably under real excessive interference without the need for additional protection; If 0.7≤CI<1.0, it is judged as critically compatible, indicating that the target component has a certain risk of functional failure under real excessive interference. It is recommended to make a comprehensive decision based on the whole vehicle-level risk assessment and functional safety objectives, and add additional protective measures if necessary. If CI < 0.7, it is considered incompatible, indicating that the target component has a high risk of functional failure under actual excessive interference, and design changes or additional interference suppression measures must be taken.

[0094] Step S735: Based on the comparison results, determine the compatibility level of the target device against the interfering source device.

[0095] Specifically, based on the above comparison results, the compatibility level of the target component is determined as one of "good compatibility", "critically compatible" or "incompatible", and a corresponding evaluation conclusion is generated.

[0096] In addition, after completing the compatibility level determination, this embodiment also generates a test report. The test report includes at least the following: the original out-of-specification waveform diagram, the step stress application curve, the failure threshold label, the failure mode description, the calculated margin values ​​for each dimension (including the baseline amplitude margin, the waveform energy equivalence coefficient, the failure time sensitivity coefficient, and the equivalent comprehensive margin), the comprehensive compatibility index CI, the final determination conclusion, and recommendations.

[0097] This embodiment uses a pre-set compatibility judgment threshold to divide the comprehensive compatibility index into multiple clear compatibility level ranges. Based on this, by comparing the comprehensive compatibility index with the above threshold, the compatibility level of the target component is determined to be one of good compatibility, critical compatibility, or incompatibility according to the comparison results. A test report is generated that includes at least the original out-of-specification waveform diagram, step stress application curve, failure threshold label, failure mode description, margin calculation values ​​for each dimension, comprehensive compatibility index, and final judgment conclusion and recommendations. This provides a clear and quantitative basis for the electromagnetic compatibility design and rectification decisions of the whole vehicle.

[0098] Accordingly, please refer to Figure 8 A block diagram of a transient conduction compatibility evaluation device provided in this application embodiment, the device comprising: The waveform acquisition and feature extraction unit 101 is used to acquire the transient conducted emission waveform of the interference source device and extract the feature parameters of the transient conducted emission waveform; The signal application and threshold acquisition unit 103 is used to generate a test interference signal based on the transient conducted transmission waveform or characteristic parameters, and apply the test interference signal to the target opponent to obtain the critical tolerance threshold when the target opponent reaches the preset conditions. The margin determination and correction unit 105 is used to determine the reference amplitude margin based on the characteristic parameters and the critical tolerance threshold, and to correct the reference amplitude margin to generate an equivalent comprehensive margin. The index determination and rating unit 107 is used to determine the comprehensive compatibility index based on the equivalent comprehensive margin and the weighted coefficients corresponding to the functional safety level and failure mode of the target device, so as to determine the compatibility level of the target device against the interference source device.

[0099] In some optional implementations, the signal application and threshold acquisition unit 103 includes: Export the transient conducted emission waveform as a digital waveform file, and import the digital waveform file into the waveform generator to reconstruct the output test interference signal through the waveform generator.

[0100] In some optional implementations, the signal application and threshold acquisition unit 103 includes: Analyze the characteristic parameters to obtain the maximum amplitude, rise time, pulse width, repetition frequency, and decay oscillation frequency of the transient conducted emission waveform; Based on the maximum amplitude, rise time, pulse width, repetition frequency, and decaying oscillation frequency, a test interference signal is generated using the waveform editing function of the waveform generator.

[0101] In some optional implementations, the signal application and threshold acquisition unit 103 includes: Starting from a preset initial stress level, the test interference signal is applied to the target workpiece, and the stress level of the test interference signal is increased step by step. At each stress level, the test interference signal is applied for a preset duration, and the working status of the target component is monitored simultaneously. The current stress level when the operating status is the first indication function failure, or the maximum stress level when the termination condition is met, is determined as the critical tolerance threshold.

[0102] In some optional implementations, the margin determination and correction unit 105 includes: Extract the maximum amplitude of the transient conducted emission waveform from the characteristic parameters; Determine the ratio between the critical tolerance threshold and the maximum amplitude; The comparison values ​​are logarithmically calculated to convert the ratios into decibel values, and these decibel values ​​are then used as the baseline amplitude margin.

[0103] In some optional implementations, the margin determination and correction unit 105 includes: The waveform energy equivalent coefficient is determined based on the characteristic parameters, and the failure time sensitivity coefficient is determined based on the obtained failure response time. The waveform energy equivalent coefficient is converted into the first logarithmic value, and the failure time sensitivity coefficient is calculated with the preset time dimension conversion coefficient to obtain the second logarithmic value; The first and second logarithmic values ​​are subtracted sequentially from the baseline magnitude margin to generate the equivalent composite margin.

[0104] In some optional implementations, the index determination and grade determination unit 107 includes: Obtain a preset benchmark value with good compatibility, and determine the first calculation result based on the sum of the equivalent comprehensive margin and the benchmark value with good compatibility; Obtain the pre-configured functional safety level of the target device and match it with the first weighting coefficient corresponding to the functional safety level; Obtain the failure modes of the target component under the action of the test interference signal, and match the second weighting coefficients corresponding to the failure modes; The second calculation result is determined by multiplying the compatibility benchmark value, the first weighting coefficient, and the second weighting coefficient. The comprehensive compatibility index is determined based on the ratio of the first calculation result to the second calculation result.

[0105] In some optional implementations, the index determination and grade determination unit 107 includes: Obtain the preset compatibility judgment threshold; The overall compatibility index is compared with the compatibility judgment threshold; Based on the comparison results, the compatibility level of the target device with respect to the interfering source device is determined.

[0106] Further functional descriptions of the above modules and units are the same as those in the corresponding embodiments described above, and will not be repeated here.

[0107] In this embodiment, a transient conduction compatibility assessment device is presented in the form of a functional unit. Here, a unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that execute one or more software or fixed programs, and / or other devices that can provide the above functions.

[0108] Please see Figure 9 , Figure 9 This application provides a schematic diagram of the structure of a computer device, as shown in the embodiment of the present application. Figure 9As shown, the computer device includes one or more processors 10, memory 20, and interfaces for connecting the components, including high-speed interfaces and low-speed interfaces. The components communicate with each other via different buses and can be mounted on a common motherboard or otherwise installed as needed. The processors can process instructions executed within the computer device, including instructions stored in or on memory to display graphical information of a GUI on external input / output devices (such as display devices coupled to the interfaces). In some alternative implementations, multiple processors and / or multiple buses can be used with multiple memories and multiple memory modules, if desired. Similarly, multiple computer devices can be connected, each providing some of the necessary operations (e.g., as a server array, a group of blade servers, or a multiprocessor system). Figure 9 Take a processor 10 as an example.

[0109] Processor 10 may be a central processing unit, a network processor, or a combination thereof. Processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof. The programmable logic device may be a complex programmable logic device (CAMP), a field-programmable gate array (FPGA), a general-purpose array logic (GDA), or any combination thereof.

[0110] The memory 20 stores instructions executable by at least one processor 10 to cause the at least one processor 10 to perform the method shown in the above embodiments.

[0111] The memory 20 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the computer device. Furthermore, the memory 20 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some alternative embodiments, the memory 20 may optionally include memory remotely located relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0112] The memory 20 may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk or solid-state drive; the memory 20 may also include a combination of the above types of memory.

[0113] The computer device also includes a communication interface 30 for communicating with other devices or communication networks.

[0114] This application also provides a computer-readable storage medium. The methods described in this application can be implemented in hardware or firmware, or implemented as recordable on a storage medium, or implemented as computer code downloaded over a network and originally stored on a remote storage medium or a non-transitory machine-readable storage medium and subsequently stored on a local storage medium. Thus, the methods described herein can be processed by software stored on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. The storage medium can be a magnetic disk, optical disk, read-only memory, random access memory, flash memory, hard disk, or solid-state drive, etc.; further, the storage medium can also include combinations of the above types of memory. It is understood that computers, processors, microprocessor controllers, or programmable hardware include storage components capable of storing or receiving software or computer code. When the software or computer code is accessed and executed by the computer, processor, or hardware, the methods shown in the above embodiments are implemented.

[0115] The apparatus and units described in the above embodiments can be implemented by a computer chip or physical entity, or by a product with a certain function. A typical implementation device is a computer. Specifically, a computer can be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smartphone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or any combination of these devices.

[0116] For ease of description, the above devices are described separately by function as various units. Of course, in implementing this application, the functions of each unit can be implemented in one or more software and / or hardware.

[0117] Those skilled in the art will understand that the embodiments of this application can be provided as methods or apparatus. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0118] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus, and devices according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0119] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0120] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0121] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0122] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the device embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0123] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

[0124] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A transient conduction compatibility assessment method, characterized in that, The method includes: Acquire the transient conducted emission waveform of the interference source device, and extract the characteristic parameters of the transient conducted emission waveform; A test interference signal is generated based on the transient conducted emission waveform or the characteristic parameters, and the test interference signal is applied to the target opponent to obtain the critical tolerance threshold when the target opponent reaches the preset conditions. A baseline amplitude margin is determined based on the characteristic parameters and the critical tolerance threshold, and the baseline amplitude margin is corrected to generate an equivalent comprehensive margin. Based on the equivalent comprehensive margin, and combined with the weighted coefficients corresponding to the functional safety level and failure mode of the target device, a comprehensive compatibility index is determined to assess the compatibility level of the target device with respect to the interference source device.

2. The method according to claim 1, characterized in that, The generation of the test interference signal includes: The transient conducted emission waveform is exported as a digital waveform file, and the digital waveform file is imported into a waveform generator to reconstruct and output the test interference signal through the waveform generator.

3. The method according to claim 1, characterized in that, The generation of the test interference signal includes: The characteristic parameters are analyzed to obtain the maximum amplitude, rise time, pulse width, repetition frequency, and decay oscillation frequency of the transient conducted emission waveform; Based on the maximum amplitude, the rise time, the pulse width, the repetition frequency, and the decaying oscillation frequency, a test interference signal is generated using the waveform editing function of the waveform generator.

4. The method according to claim 1, characterized in that, The step of applying the test interference signal to the target adversary to obtain the critical tolerance threshold of the target adversary when it reaches a preset condition includes: Starting from a preset initial stress level, the test interference signal is applied to the target hand component, and the stress level of the test interference signal is gradually increased. At each stress level, the test interference signal is maintained for a preset duration, and the working status of the target component is monitored simultaneously. The current stress level when the operating state is the first indication function failure, or the maximum stress level when the termination condition is met, is determined as the critical tolerance threshold.

5. The method according to claim 1, characterized in that, The determination of the baseline amplitude margin based on the characteristic parameters and the critical tolerance threshold includes: Extract the maximum amplitude of the transient conducted emission waveform from the characteristic parameters; Determine the ratio between the critical tolerance threshold and the maximum amplitude value; Perform a logarithmic operation on the ratio to convert it into a decibel value, and determine the decibel value as the reference amplitude margin.

6. The method according to claim 1, characterized in that, The step of correcting the reference amplitude margin to generate an equivalent comprehensive margin includes: The waveform energy equivalence coefficient is determined based on the aforementioned characteristic parameters, and the failure time sensitivity coefficient is determined based on the obtained failure response time. The waveform energy equivalent coefficient is converted into a first logarithmic value, and the failure time sensitivity coefficient is calculated with a preset time dimension conversion coefficient to obtain a second logarithmic value; The first logarithmic value and the second logarithmic value are subtracted sequentially from the reference amplitude margin to generate the equivalent comprehensive margin.

7. The method according to claim 1, characterized in that, The determination of the comprehensive compatibility index includes: Obtain a preset good compatibility benchmark value, and determine the first calculation result based on the sum of the equivalent comprehensive margin and the good compatibility benchmark value; Obtain the pre-configured functional safety level of the target device and match it with the first weighting coefficient corresponding to the functional safety level; Obtain the failure mode of the target component under the action of the test interference signal, and match the second weighting coefficient corresponding to the failure mode; The second calculation result is determined based on the product of the compatibility benchmark value, the first weighting coefficient, and the second weighting coefficient. The comprehensive compatibility index is determined based on the ratio of the first calculation result to the second calculation result.

8. The method according to claim 1, characterized in that, The determination of the compatibility level of the target device with respect to the interference source device includes: Obtain the preset compatibility judgment threshold; The comprehensive compatibility index is compared with the compatibility judgment threshold; Based on the comparison results, the compatibility level of the target device with respect to the interference source device is determined.

9. A transient conduction compatibility assessment device, characterized in that, The device includes: The waveform acquisition and feature extraction unit is used to acquire the transient conducted emission waveform of the interference source device and extract the feature parameters of the transient conducted emission waveform; The signal application and threshold acquisition unit is used to generate a test interference signal based on the transient conducted emission waveform or the characteristic parameters, and apply the test interference signal to the target opponent to obtain the critical tolerance threshold when the target opponent reaches the preset conditions. The margin determination and correction unit is used to determine the reference amplitude margin based on the feature parameters and the critical tolerance threshold, and to correct the reference amplitude margin to generate an equivalent comprehensive margin. The index determination and level determination unit is used to determine the comprehensive compatibility index based on the equivalent comprehensive margin and the weighted coefficients corresponding to the functional safety level and failure mode of the target counterpart, so as to determine the compatibility level of the target counterpart for the interference source device.

10. A computer device, characterized in that, include: A memory and a processor are communicatively connected, the memory storing computer instructions, and the processor executing the computer instructions to perform the transient conduction compatibility assessment method according to any one of claims 1 to 8.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing a computer to perform the transient conduction compatibility assessment method according to any one of claims 1 to 8.

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