High-power solid-state power amplifier remote automation test system, test method and consistency adjustment method

Abstract

The application discloses a high-power solid-state power amplifier remote automation test system, a test method and a consistency adjustment method, and relates to the technical field of test systems.The system comprises a solid-state power amplifier module, a signal link module, a test and control module and a temperature monitoring module; the solid-state power amplifier module comprises a microwave drive module and a microwave power amplifier module; the signal link module comprises a wave converter and a waveguide directional coupler; the wave converter converts microwave signals output by the microwave power amplifier module into waveguide signals for transmission; the waveguide directional coupler completes waveguide signal coupling and sends the coupled signals into the test and control module; the test and control module generates test control signals according to preset test parameters, remotely sends test signals to the microwave drive module and collects the coupled signals, and completes data processing and analysis; and the temperature monitoring module monitors the temperature of the power amplifier components of the microwave power amplifier module.The application can realize remote automation test and temperature state monitoring of high-power solid-state power amplifiers, and improves test efficiency, safety and debugging reliability.

Description

Technical Field

[0001] This invention relates to the field of solid-state power amplifier technology, and in particular to a remote automated testing system, testing method, and consistency adjustment method for high-power solid-state power amplifiers. Background Technology

[0002] High-power solid-state power amplifiers are key electronic devices that amplify high-power microwave signals using solid-state components. They are widely used in communications, radar, and other high-power microwave applications. As output power levels continue to increase, higher requirements are placed on the safety, testing efficiency, and consistency control of high-power solid-state power amplifier modules during debugging, testing, and multi-module applications.

[0003] First, the power amplifier debugging process involves impedance matching optimization, which may lead to space microwave energy leakage due to impedance mismatch. When the power reaches hundreds of watts or even higher, close-range manual debugging not only increases operational risks but also reduces the safety of the testing process. Therefore, remote monitoring and control methods are needed to reduce the need for personnel to directly contact the high-power testing environment. Simultaneously, impedance mismatch or improper debugging may cause abnormal temperature rises in critical components such as matching capacitors and filter capacitors during transient or steady-state operation, further leading to performance degradation or even failure, affecting the reliable operation of the power amplifier module. Second, existing high-power solid-state power amplifier testing methods are insufficient in terms of automation, data acquisition capabilities, and condition monitoring. This results in significant discrepancies between the actual performance of high-power power amplifiers and theoretical simulations, heavily relying on repeated debugging and verification based on manual experience. Especially in thermal management, manual intermittent monitoring of localized areas using handheld thermal imaging equipment is typically required. This makes continuous temperature monitoring of critical component areas difficult, hindering timely detection and handling of abnormal temperature rises. Furthermore, for application systems composed of multiple solid-state power amplifier modules, existing methods typically employ manual debugging and matching of each module individually. This process is complex, time-consuming, and makes it difficult to guarantee the amplitude and phase consistency between multiple modules. Moreover, traditional manual adjustment methods cannot quickly obtain the response characteristics of modules under different control parameters, which is also not conducive to consistent adjustment of multiple modules.

[0004] In summary, existing high-power solid-state amplifier testing and synthesis methods suffer from problems such as high safety risks, insufficient remote automation capabilities, poor testing efficiency, inadequate monitoring of critical states, and limited ability to ensure consistency across multiple modules. Summary of the Invention

[0005] The purpose of this invention is to provide a remote automated testing system, testing method, and multi-module consistency adjustment method for high-power solid-state power amplifiers, enabling remote measurement and control, status monitoring, and multi-module consistency adjustment during the testing process of high-power solid-state power amplifier modules, thereby improving testing efficiency, safety, and debugging reliability.

[0006] To achieve the above objectives, the present invention provides a remote automated testing system for high-power solid-state power amplifiers, including a solid-state power amplifier module, a signal link module, a measurement and control module, and a temperature monitoring module; The solid-state power amplifier module includes a microwave driver module and a microwave power amplifier module, wherein the microwave driver module is used to provide a drive signal to the microwave power amplifier module. The signal link module includes a wave-to-wave converter and a waveguide directional coupler; wherein, the wave-to-wave converter is used to convert the microwave signal from the microwave power amplifier module into a waveguide signal for transmission; the waveguide directional coupler is used to couple the waveguide signal and transmit the coupled signal to the measurement and control module; The measurement and control module is used to generate test control signals according to preset test parameters, remotely output test signals to the microwave drive module, collect the coupling signals of the waveguide directional coupler, and perform data processing and analysis based on the test signals and the coupling signals. The temperature monitoring module is used to monitor the temperature of the power amplifier component area of ​​the microwave power amplifier module.

[0007] Optionally, the signal link module further includes a coaxial coupler, which is used to couple the coupled signal of the waveguide directional coupler and output the processed signal to the measurement and control module.

[0008] Optionally, the high-power solid-state power amplifier remote automated testing system further includes a water load and a water chiller. The water chiller is used to provide circulating coolant to the water load and maintain the thermal balance of the solid-state power amplifier module and the signal link module through the heat dissipation of the water load.

[0009] Optionally, the measurement and control module includes a vector network analyzer, a signal conversion unit, a data processing unit, and a spectrum analyzer; The data processing unit is connected to the temperature monitoring module, the vector network analyzer, the signal conversion unit, and the spectrum analyzer, respectively. It is used to generate a test control sequence according to preset test parameters, and control the vector network analyzer and the signal conversion unit to complete the test signal output and control parameter loading according to the test control sequence. It receives the measurement data acquired by the temperature monitoring module, the vector network analyzer, and the spectrum analyzer, processes the measurement data, and associates and records the measurement data with the corresponding test parameters. The vector network analyzer is used to output microwave test signals and receive measurement signals transmitted through the signal link module; The signal conversion unit is used to convert the digital control signal from the data processing unit into an analog drive signal, and output the analog drive signal to the microwave drive module; The spectrum analyzer is used to perform spectrum analysis on the coupled signal output from the coaxial coupler and upload the analysis results to the data processing unit.

[0010] Optionally, the microwave driving module includes a driving circuit, which includes a π-type attenuation circuit for adjusting interstage attenuation to adjust the output power response curve characteristics of the microwave power amplifier module as the attenuation voltage changes.

[0011] Optionally, the power amplifier component area includes the power amplifier chip, matching capacitor, and filter capacitor of the microwave power amplifier module.

[0012] To achieve the above objectives, the present invention also provides a high-power solid-state power amplifier testing method, applied to the remote automated testing system for high-power solid-state power amplifiers as described in any of the preceding claims, comprising: With the solid-state power amplifier module in an unsealed state, a test signal is input to the corresponding microwave power amplifier module. By monitoring the output power of the microwave power amplifier module and the temperature change of the power amplifier component area, the matching capacitor of the microwave power amplifier module is adjusted. In the unsealed state, the adjusted microwave power amplifier module is operated at a preset first power for a first preset duration to monitor the output power stability and the temperature of the power amplifier component area; In the unsealed state, the test power steps are set according to the preset power level, and the output power is increased step by step to the preset operating power range. The test power is run for a second preset duration at each power step to monitor the output power stability and the temperature of the power amplifier component area. In the unsealed state, the microwave power amplifier module is operated at full power for a third preset duration; After sealing the solid-state power amplifier module, the microwave power amplifier module is run for a fourth preset time, and the temperature of the output interface and output cable of the microwave power amplifier module is monitored.

[0013] To achieve the above objectives, the present invention also provides a method for pre-synthesis consistency adjustment of a high-power solid-state power amplifier module, applied to the remote automated testing system for high-power solid-state power amplifiers as described in any of the preceding claims, comprising: For N solid-state power amplifier modules to be synthesized, under a fixed phase-shift control voltage, the output power response curve of each microwave power amplifier module is obtained by changing the attenuation voltage. Based on the output power response curve, the parameters of the π-type attenuation network in the corresponding microwave drive module are adjusted so that the output power response curves of the N microwave power amplifier modules to be synthesized meet the consistency requirements. After the output power response curves of the N microwave power amplifier modules to be synthesized meet the consistency requirements, under the same phase-shift control voltage conditions, the phase response curves of each microwave power amplifier module are obtained, and the phase curve with the median value is selected from the multiple phase response curves as the reference curve. Adjust the phase-shift control voltage of N-1 microwave power amplifier modules to be synthesized, excluding the microwave power amplifier module corresponding to the reference curve, so that the corresponding phase response curve matches the reference curve within a preset power range, thereby achieving phase consistency adjustment of the N microwave power amplifier modules to be synthesized.

[0014] Optionally, during the process of adjusting the π-type attenuation network parameters in the corresponding microwave drive module according to the output power response curve, and during the process of adjusting the phase-shift control voltage of the N-1 microwave power amplifier modules to be synthesized (excluding the microwave power amplifier module corresponding to the reference curve), the temperature of the power amplifier component area of ​​the N microwave power amplifier modules to be synthesized is monitored by a temperature monitoring module to ensure that the adjustment process is within a preset safe temperature range.

[0015] Optionally, the step of monitoring the temperature of the power amplifier component areas of the N microwave power amplifier modules to be synthesized via a temperature monitoring module includes: When the temperature of the power amplifier component area of ​​the microwave power amplifier module to be synthesized exceeds the preset temperature safety threshold, the adjustment process is paused and a warning message is fed back through the measurement and control module. When the temperature of the power amplifier component area drops below the preset temperature safety threshold, the adjustment process is resumed.

[0016] Compared with existing technologies, this invention provides a remote automated testing system, testing method, and multi-module consistency adjustment method for high-power solid-state power amplifiers. Through a measurement and control module, it achieves remote automation of the high-power solid-state power amplifier module testing process, including test parameter configuration, test signal output, measurement data acquisition, and data processing and analysis. A temperature monitoring module monitors the temperature of key component areas of the microwave power amplifier module, enabling timely detection of abnormal temperature rises and improving the safety and reliability of the testing process. A wave-to-same converter and waveguide directional coupler in the signal link module enable high-power microwave signal transmission and status detection. Based on the output power response and output phase response data acquired during testing, amplitude and phase consistency adjustment is achieved before combining multiple solid-state power amplifier modules. This invention improves the testing efficiency, safety, and multi-module consistency adjustment capabilities of high-power solid-state power amplifiers. Attached Figure Description

[0017] To more clearly illustrate the technical solution of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a structural block diagram of a remote automated testing system for high-power solid-state power amplifiers provided in an embodiment of the present invention; Figure 2 This is another structural block diagram of a high-power solid-state power amplifier remote automated testing system provided in this embodiment of the invention; Figure 3 This is a flowchart of a high-power solid-state power amplifier module testing method provided in an embodiment of the present invention; Figure 4 This is a flowchart of a method for adjusting the consistency of a high-power solid-state power amplifier module before synthesis, provided by an embodiment of the present invention; Figure 5a This is an output power curve of the microwave power amplifier module provided in this embodiment of the invention when the input power is -11dBm; Figure 5b This is an output power curve of the microwave power amplifier module provided in this embodiment of the invention when the input power is -10dBm; Figure 5c This is an output power curve of the microwave power amplifier module provided in this embodiment of the invention when the input power is -9dBm; Figure 5d This is an output power curve of the microwave power amplifier module provided in this embodiment of the invention when the input power is -8dBm; Figure 6a This is an output power curve diagram of multiple microwave power amplifier modules before consistency adjustment provided in the embodiments of the present invention; Figure 6b This is an output power curve diagram of multiple microwave power amplifier modules after consistency adjustment provided in the embodiments of the present invention; Figure 7 This is an amplitude control voltage-output phase curve diagram of multiple microwave power amplifier modules provided in the embodiments of the present invention; Figure 8 This is an amplitude control voltage-output phase curve diagram of a single microwave power amplifier module after phase adjustment, provided in an embodiment of the present invention. Figure 9 This is an amplitude control voltage-output phase curve diagram of multiple microwave power amplifier modules after adjustment, provided in an embodiment of the present invention. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] See Figure 1 , Figure 1 This is a structural block diagram of a high-power solid-state power amplifier remote automated testing system provided by an embodiment of the present invention. The high-power solid-state power amplifier remote automated testing system includes a solid-state power amplifier module 1, a signal link module 2, a measurement and control module 3, and a temperature monitoring module 4. The solid-state power amplifier module 1 includes a microwave driver module 101 and a microwave power amplifier module 102. The microwave driver module 101 is used to provide a drive signal to the microwave power amplifier module 102. The signal link module 2 includes a wave-to-wave converter 201 and a waveguide directional coupler 202; wherein, the wave-to-wave converter 201 is used to convert the microwave signal from the microwave power amplifier module 102 into a waveguide signal for transmission; the waveguide directional coupler 202 is used to couple the waveguide signal and transmit the coupled signal to the measurement and control module 3; The measurement and control module 3 is used to generate test control signals according to preset test parameters, remotely output test signals to the microwave drive module 101, collect the coupling signals output by the waveguide directional coupler 202, and perform data processing and analysis based on the test signals, the coupling signals, and temperature monitoring data; the temperature monitoring module 4 is used to monitor the temperature of the power amplifier component area of ​​the microwave power amplifier module 102.

[0021] The preset test parameters are used to determine the test conditions and test process of the microwave power amplifier module, and may include one or more of the following: test frequency, input power or output power, power operation duration, power steps, and temperature monitoring thresholds. For example, the test frequency, initial test power, multiple test power steps, the operation duration corresponding to each power step, and the temperature threshold of the power amplifier component area can be preset according to test requirements. The measurement and control module generates test control signals based on the above parameters and controls the microwave power amplifier module to operate according to the preset test process.

[0022] It should be noted that, in this embodiment of the invention, the high-power solid-state power amplifier remote automated testing system includes at least one solid-state power amplifier module. One solid-state power amplifier module includes a microwave driver module and a microwave power amplifier module. When used for testing multiple solid-state power amplifier modules, multiple signal link modules can be configured accordingly to acquire test data from multiple modules.

[0023] It should be noted that high-power solid-state power amplifiers typically use 7 / 16DIN coaxial connectors for their output interfaces. However, traditional air-cooled attenuators or load structures are not only bulky and space-consuming, but their power handling capacity is usually limited to around 1kW, making it difficult to meet the testing requirements of higher power signals. To solve this problem, this embodiment adopts a waveguide-type power transmission structure, which has a significantly higher power handling capacity than the coaxial structure. A waveguide-to-coaxial converter converts the conventional coaxial output form to a waveguide form to achieve efficient transmission of high-power signals. For example, the waveguide-to-coaxial converter can use a 7 / 16DIN connector to BJ22 waveguide conversion structure, or it can be replaced with a DIN connector to BJ26 waveguide conversion structure depending on the power level or frequency requirements.

[0024] For example, the coupling port of the waveguide directional coupler 202 can be an N-type or SMA-type interface.

[0025] It should be noted that in the initial testing phase of high-power amplifiers, there are often significant differences between theoretical simulations and actual test results for high-power microwave amplifiers. Simulations are typically only useful for trend assessment, and actual performance still needs to be optimized through repeated adjustments. This process requires close monitoring of the results of each adjustment, and attention must be paid to high-risk situations such as transient capacitor failure or damage to the amplifier chip, posing significant safety hazards.

[0026] Therefore, the temperature monitoring module in this embodiment of the invention performs remote online real-time monitoring of the temperature of key power amplifier components. This method can obtain the thermal status information of key components in real time, reducing safety risks during high-power debugging.

[0027] In one alternative embodiment, the power amplifier component area includes the power amplifier chip, matching capacitor, and filter capacitor of the microwave power amplifier module 102.

[0028] It should be noted that a high-power microwave power amplifier module consists of at least two power amplifier stages. The power amplifier chip, matching capacitor, and filter capacitor are the key areas that need to be monitored in real time.

[0029] For example, the temperature monitoring module can use an A600-Series online infrared thermal imager to achieve real-time, non-contact temperature distribution detection of the microwave power amplifier module. The online infrared thermal imager has high sensitivity and high frame rate characteristics, and can monitor the heat distribution status and dynamic response during the operation of the power amplifier.

[0030] For example, the system sends a test signal to the microwave drive module 101 of the solid-state power amplifier module 1 through the measurement and control module 3. The microwave drive module 101 provides a drive signal to the microwave power amplifier module 102. The microwave signal output by the microwave power amplifier module 102 is converted into a waveguide signal by the wave-to-wave converter 201 of the signal link module 2, and then coupled back to the measurement and control module 3 after being coupled by the waveguide directional coupler 202. Combined with the real-time monitoring data of the power amplifier component area by the temperature monitoring module 4, the data processing and analysis are completed.

[0031] It should be noted that the data processing and analysis includes: associating the test parameters with the amplitude and phase measurement data acquired by the vector network analyzer 301 to form output power response data and output phase response data; processing the spectrum data acquired by the spectrum analyzer 304 to obtain fundamental, harmonic, and spurious signal information; performing threshold comparison and abnormal state marking on the temperature data acquired by the temperature monitoring module 4; and associating and storing the above test parameters and processing results to generate test records and response curves.

[0032] In summary, this invention, through the inclusion of a waveguide-to-coaxial converter in the signal link module, converts the coaxial signal output from the microwave power amplifier module into a waveguide signal with higher power carrying capacity, and, in conjunction with a waveguide directional coupler, achieves effective transmission and detection of high-power signals. The temperature monitoring module performs real-time temperature monitoring of key component areas of the microwave power amplifier module, enabling timely acquisition of thermal state changes and reducing safety risks during high-power debugging. The measurement and control module handles test parameter configuration, test signal output, measurement data acquisition, and data processing and analysis, improving the automation level and data acquisition capabilities of the testing process. This invention provides a reliable data foundation for performance testing of high-power solid-state power amplifier modules and for consistency adjustment before combining multiple high-power solid-state power amplifier modules, improving testing efficiency, safety, and reliability.

[0033] See Figure 2 , Figure 2 This is another structural block diagram of a remote automated testing system for high-power solid-state power amplifiers provided in an embodiment of the present invention. For example... Figure 2 As shown, in one optional embodiment, the measurement and control module 3 includes a vector network analyzer 301, a signal conversion unit 302, a data processing unit 303, and a spectrum analyzer 304; The data processing unit 303 is connected to the temperature monitoring module 4, the vector network analyzer 301, the signal conversion unit 302, and the spectrum analyzer 304, respectively. It generates a test control sequence based on preset test parameters and controls the vector network analyzer 301 and the signal conversion unit 302 to output test signals and load control parameters according to the test control sequence. It receives measurement data acquired by the temperature monitoring module 4, the vector network analyzer 301, and the spectrum analyzer 304, processes the measurement data, and associates and records the measurement data with the corresponding test parameters. The vector network analyzer 301 outputs microwave test signals and receives measurement signals transmitted via the signal link module 2. The signal conversion unit 302 is used to convert the digital control signal from the data processing unit 303 into an analog drive signal, and output the analog drive signal to the microwave drive module 101. The spectrum analyzer 304 is used to perform spectrum analysis on the coupled signal output from the coaxial coupler 203 and upload the analysis results to the data processing unit 303. For example, the vector network analyzer can be an E5071C series vector network analyzer, which supports a wide frequency range of 300kHz–20GHz and can achieve high-precision amplitude, phase, and impedance characteristic measurements, providing accurate data support for S-parameter testing of power amplifier units and systems.

[0034] Figure 2 In this configuration, the vector network analyzer uses communication port 1 (Port1) as the signal output and communication port 2 (Port2) as the signal input. First, the microwave signal output from Port1 is connected to the microwave driver module. The output of the microwave driver module is connected to the input of the microwave power amplifier module. The output of the microwave power amplifier module is connected to Port2 via a high-power phase-stable cable after a wave-to-coaxial converter and a coaxial coupler. This transforms the microwave interface from a coaxial interface to a waveguide interface with greater power capacity. Simultaneously, the output coupling port of the waveguide directional coupler is connected to a coaxial single-ended coupler. The coupling end of the coaxial coupler is connected to the spectrometer via a cable for frequency observation.

[0035] For example, the signal conversion unit may include a multi-functional I / O module with analog output function and a signal interface module. For instance, a PXIe-6259 multi-functional I / O module can be used in conjunction with a BNC-2090A junction box. The analog output channel of the PXIe-6259 is used to generate corresponding analog control voltages according to the digital control commands output by the data processing unit. The BNC-2090A is used for analog signal output, wiring, and interface connection with external devices, thereby realizing the transmission of control signals between the measurement and control module and the microwave drive module.

[0036] For example, the data processing unit may include a PXI / PXIe controller, a PXIe-6259 multi-function I / O module, and a PXIe-1062Q PXI Express chassis. The PXIe-1062Q is used to install and connect the PXI / PXIe functional module, the PXIe-6259 is used for analog input / output and digital signal acquisition and control, and the PXI / PXIe controller is used for test parameter configuration, test process control, measurement data processing and storage, thereby realizing automatic measurement and control and data processing during the power amplifier testing process.

[0037] For example, the spectrum analyzer can be a 4051C signal / spectrum analyzer, which covers a frequency range of 3Hz–13.2GHz. It can analyze the spectral characteristics, harmonic components and spurious indices of the output signal, providing an important basis for power amplifier performance evaluation and system debugging.

[0038] like Figure 2 As shown, in an optional embodiment, the solid-state power amplifier testing and synthesis system further includes a water load 5 and a water chiller 6. The water chiller 6 is used to provide circulating coolant to the water load 5, and the heat dissipation of the water load 5 maintains the thermal balance of the solid-state power amplifier module 1 and the signal link module 2.

[0039] It is important to note that water temperature is one of the key factors affecting the output power stability of solid-state power amplifier modules. When testing multiple solid-state power amplifier modules under test, the temperature control accuracy of the water chiller directly affects the accuracy and consistency of the test results. A high-precision temperature control system can effectively maintain the stable operating temperature of the solid-state power amplifier modules, reduce performance drift caused by temperature fluctuations, and thus ensure that each module is in a consistent thermal state during testing, improving the reliability and comparability of measurement data. Therefore, using high-precision temperature-controlled water cooling equipment is of great significance for improving the accuracy of multi-amplifier system testing.

[0040] For example, the water chiller can be an AC2600B model with a rated cooling capacity of 2600W. This equipment features high-efficiency cooling capacity and excellent temperature control sensitivity, enabling precise adjustment and real-time feedback control of the coolant temperature, maintaining temperature stability within a small fluctuation range. Through a highly sensitive temperature control mechanism, thermal drift generated by the power amplifier module during high-power operation can be effectively suppressed, ensuring that each power amplifier unit operates in a stable thermal equilibrium state, thereby improving output consistency and long-term system reliability.

[0041] It is worth noting that the converted microwave signal is transmitted to the water-cooled load via a waveguide. The water load has excellent heat exchange performance and can efficiently absorb high-power microwave energy. It can adopt a liquid-cooled structure design as a whole, which is small in size and has excellent heat dissipation performance, thereby achieving safe consumption of high-power signals and system thermal balance.

[0042] like Figure 2 As shown, in one optional embodiment, the signal link module further includes a coaxial coupler 203. The coaxial coupler 203 is used to couple the coupled signal output by the waveguide directional coupler 202 and output the processed signal to the vector network analyzer 301 and the spectrum analyzer 304, respectively. The coupling processing refers to using the coaxial coupler 203 to further couple, distribute power, match interfaces, and attenuate the signal output by the waveguide directional coupler 202, converting the original coupled signal with excessive power into a standard test signal adapted to the vector network analyzer 301 and the spectrum analyzer 304, thereby reducing the impact of the transmission link on the measurement results.

[0043] It is worth noting that although a waveguide directional coupler is provided between the waveguide converter and the water load to extract the signal under test, considering that excessive waveguide coupling may lead to a decrease in test accuracy, this embodiment of the invention adds a coaxial coupling structure after the waveguide directional coupler to achieve power distribution and interface conversion of the coupled signal, meeting the input requirements of different measurement devices. After processing by the coaxial coupler, one coupled signal is transmitted to a vector network analyzer via a coaxial interface for output power and phase characteristic detection; the other coupled signal is transmitted to a spectrum analyzer for spectral characteristic and spurious signal analysis, thereby realizing high-power microwave signal status monitoring and performance evaluation.

[0044] It should be noted that the power capacity of coaxial interfaces and high-power microwave cables is closely related to the operating frequency. For example, 7 / 16 type connectors and relatively flexible semi-flexible cables can typically only withstand power of no more than 1kW in the frequency band below 3GHz. If higher power transmission is required, a very sophisticated heat dissipation system must be equipped, which will significantly increase system complexity and commissioning costs. In contrast, the embodiment of this invention uses a coaxial-to-waveguide conversion structure, where the waveguide-to-coaxial converter is sequentially connected to the waveguide directional coupler and the water load. The water load is equipped with a dedicated water chiller to meet the cooling capacity requirements, which is a more cost-effective solution. Therefore, in actual system design, the conversion from coaxial transmission to the waveguide structure should be completed over the shortest possible distance to balance performance and cost-effectiveness.

[0045] In one optional embodiment, the microwave driving module includes an RF input terminal, an RF output terminal, and a driving circuit connected between the RF input terminal and the RF output terminal. The driving circuit is provided with a π-type attenuation circuit for adjusting the interstage attenuation, so as to adjust the output power response curve characteristics of the microwave power amplifier module as the attenuation voltage changes.

[0046] Specifically, the π-type attenuation circuit is disposed in the RF transmission channel of the microwave driver module, including a series attenuation branch and a parallel attenuation branch. It is used to change the inter-stage attenuation by adjusting the resistance value of each attenuation branch, thereby achieving controllable attenuation of the drive link, improving the isolation between the preceding and following stages, and enhancing the impedance matching between the microwave driver module and the microwave power amplifier module. By adjusting the parameters of the π-type attenuation circuit, the drive power range of the microwave power amplifier module and its output power response characteristics to attenuation voltage changes can be altered, providing a hardware basis for consistent output power adjustment of multiple microwave power amplifier modules.

[0047] In one embodiment, the driving circuit further includes an amplitude control circuit and a phase shifting circuit, which are used to adjust the amplitude and phase of the output driving signal according to the amplitude control voltage and the phase shifting control voltage, respectively.

[0048] Specifically, in a high-power solid-state power amplifier remote automated testing system, the microwave driver module can be configured in two ways: integrated into the power amplifier or existing as a standalone module. For high-frequency, high-power applications, the microwave driver module can be designed independently. This architecture helps isolate spatial electromagnetic crosstalk that may occur during the small-signal amplification stage, preventing it from affecting the high-power link. It also facilitates later system maintenance and module replacement, significantly improving the overall system reliability and operability.

[0049] In summary, this embodiment of the invention converts the output signal of the microwave power amplifier module into a waveguide signal with stronger power carrying capacity by setting a waveguide-to-wave converter in the signal link module, and realizes the transmission and detection of high-power microwave signals in conjunction with a waveguide directional coupler; the temperature monitoring module performs real-time temperature monitoring of key component areas of the microwave power amplifier module, which can timely obtain information on thermal state changes and reduce safety risks during high-power testing; the measurement and control module realizes test parameter configuration, test signal output, measurement data acquisition, and data processing and analysis, which improves the automation level and data acquisition capability of the high-power solid-state power amplifier testing process, and provides a reliable data foundation for subsequent multi-module consistency adjustment.

[0050] It should be noted that, in this embodiment of the invention, the microwave power amplifier module is a physical circuit component for amplifying microwave signals, comprising at least a power amplifier chip, an input matching network, an output matching network, a DC blocking capacitor, and a bias filter circuit. The input matching network is connected between the microwave signal input terminal and the input terminal of the power amplifier chip, and the output matching network is connected between the output terminal of the power amplifier chip and the output interface of the microwave power amplifier module, used to achieve impedance matching of the RF transmission path; the DC blocking capacitor is disposed in the RF transmission path requiring DC bias isolation; the bias filter circuit is connected to the bias terminal of the power amplifier chip, used to provide operating bias for the power amplifier chip and suppress power supply disturbances. The matching capacitor, DC blocking capacitor, and filter capacitor respectively constitute key components in the input matching network, output matching network, DC isolation path, and bias filter circuit. The power amplifier chip, input matching network, output matching network, DC blocking capacitor, and bias filter circuit are disposed on a microwave circuit board, which is mounted in a metal cavity or heat sink.

[0051] Therefore, in the research and development and production of microwave power amplifier modules, it is crucial to conduct performance testing and reliability verification of the aforementioned key components and corresponding areas. Traditional testing methods typically focus on measuring electrical parameters such as gain, efficiency, and output power of the module under specific, steady-state power conditions. However, these methods often fail to capture the module's actual thermal state during testing, making it difficult to effectively expose performance drift or potential failures caused by internal heat accumulation during long-term, high-power operation. Furthermore, they lack a systematic evaluation process for the complete evolution of the module from the "unsealed" commissioning stage to the "sealed" finished product stage. In particular, after the module is sealed, its heat dissipation path changes, and output interfaces, cables, and other components may become new thermal bottlenecks. Relying solely on testing during the commissioning stage cannot guarantee the long-term reliability of the final product.

[0052] Therefore, based on the above-mentioned high-power solid-state power amplifier remote automated testing system, this embodiment of the invention also provides a solid-state power amplifier module testing method to fully screen and ensure the electrothermal stability and inherent reliability of each module before the solid-state power amplifier module is delivered or used for power synthesis.

[0053] See Figure 3 , Figure 3 This is a flowchart of a testing method for a high-power solid-state power amplifier module provided by an embodiment of the present invention. Figure 3 As shown, the solid-state power amplifier module testing method, applied to the high-power solid-state power amplifier remote automated testing system described in any of the above embodiments, includes steps S201 to S205: Step S201: With the solid-state power amplifier module in an unsealed state, input a test signal to the corresponding microwave power amplifier module, and adjust the matching capacitor of the microwave power amplifier module by monitoring the output power of the microwave power amplifier module and the temperature change of the power amplifier component area. The unsealed state refers to the solid-state power amplifier module's metal cavity base being assembled with all internal components, but the cavity cover and sealing cover are not assembled, not glued, and not locked, leaving the internal heating components completely exposed and without airtight isolation, with the cavity in an open, empty state. Conversely, the sealed state refers to the solid-state power amplifier module's internal circuit being debugged, with the metal cover and sealing strip assembled into the cavity, sealant applied, and fasteners locked to achieve an airtight seal.

[0054] For example, when the solid-state power amplifier module is in an unsealed state, a test signal is input to the corresponding microwave power amplifier module, and the output power and temperature information of the power amplifier component area of ​​the corresponding microwave power amplifier module are obtained through the remote automated test system. The matching status of the microwave power amplifier module is determined based on the obtained output power and temperature information, and the parameters and / or positions of the matching capacitors that affect the matching characteristics of the microwave power amplifier module are adjusted.

[0055] Step S202: In the unsealed state, the adjusted microwave power amplifier module is run at a preset first power (power ≤ 500W) for a first preset time (e.g., 10 minutes), and the output power stability and the temperature of the power amplifier component area are monitored. The output power stability refers to the degree to which the output power fluctuates over time. Step S203: In the unsealed state, set the test power step according to the preset power level (for example, starting from 500W, the power step is 100W), and increase the output power step by step to the preset working power range. Run for a second preset time (such as 10 minutes) at each power step, and monitor the output power stability and the temperature of the power amplifier component area; preferably, focus on observing the temperature of the DC blocking capacitor and the filter electrolytic capacitor.

[0056] The preset operating power range is determined based on the rated output power of the microwave power amplifier module under test and the test requirements. For example, for a microwave power amplifier module with a rated output power of 1000 W, the preset operating power range can be set to 500 W to 1000 W. During testing, 500 W is used as the initial test power, and the output power is increased step by step in 100 W increments, i.e., it is operated sequentially at power steps of 500 W, 600 W, 700 W, 800 W, 900 W, and 1000 W, and the output power stability and the temperature of the power amplifier component area are monitored at each power step.

[0057] Step S204: In the unsealed state, the microwave power amplifier module is operated at full power for a third preset duration (e.g., 100 minutes). Step S205: After sealing the solid-state power amplifier module, allow the microwave power amplifier module to age for a fourth preset time (time ≥ 30 minutes), and monitor the temperature of the output interface and output cable of the microwave power amplifier module.

[0058] This invention provides a testing method for solid-state power amplifier modules. By monitoring the temperature of key areas of the power amplifier components, abnormal temperature rises can be detected in a timely manner, reducing the risk of thermal failure during debugging. By simultaneously monitoring output power stability and temperature changes, the electrothermal stability of the power amplifier module under different operating conditions can be evaluated. By conducting tests separately during the unsealed debugging stage and the sealed operation stage, the reliability of the power amplifier module under actual operating conditions can be evaluated more comprehensively. Furthermore, this testing method can provide a stable data foundation for subsequent consistency adjustments of multiple solid-state power amplifier modules.

[0059] See Figure 4 , Figure 4 This is a flowchart illustrating a method for adjusting the consistency of multiple modules before combining high-power solid-state power amplifier modules, as provided in an embodiment of the present invention. For high-power solid-state power amplifier modules participating in higher-power combining, the amplitude and phase consistency among the N power amplifier modules is crucial. Deviations in amplitude or phase will directly lead to decreased combining efficiency, output power loss, and increased spurious emissions and distortion. Therefore, before system assembly, each power amplifier module is individually adjusted and calibrated using a test platform to ensure that its output characteristics maintain a high degree of consistency in amplitude and phase. Figure 4 As shown, the high-power solid-state power amplifier module pre-synthesis consistency adjustment method, applied to the solid-state power amplifier testing and synthesis system described in any of the above embodiments, includes steps S301 to S303: Step S301, Amplitude Consistency Adjustment: For N solid-state power amplifier modules to be synthesized, under the condition of fixed phase-shift control voltage, the output power response curve of each microwave power amplifier module is obtained by changing the attenuation voltage. The π-type attenuation network parameters in the corresponding microwave drive module are adjusted according to the output power response curve to make the output power response curves of the N microwave power amplifier modules to be synthesized meet the consistency requirements.

[0060] For example, assuming N=8, that is, 8 solid-state power amplifier modules to be synthesized, including 8 independent microwave driver modules and 8 microwave power amplifier modules to be synthesized, the solid-state power amplifier module pre-synthesis consistency adjustment method aims to make the 8 solid-state power amplifier modules participating in the synthesis highly consistent in amplitude (output power) and phase.

[0061] First, each of the eight solid-state power amplifier modules to be synthesized underwent basic functional testing and aging screening, as well as the solid-state power amplifier testing steps described in the above embodiments, to ensure that each microwave power amplifier module functions normally. Then, the power output curves were optimized, with the goal of ensuring that the "attenuation voltage-output power" curve of each microwave power amplifier module has a gentle slope and a wide dynamic range (e.g., the output power changes linearly and smoothly within the attenuation voltage range of 2V to 7V), to facilitate precise control during subsequent synthesis.

[0062] The phase control voltage of the microwave driver module corresponding to each microwave power amplifier module is set to a fixed low value (e.g., 2V). Under the control of the measurement and control module, the attenuation voltage of the microwave driver module (range 0-10V) is changed in minimum steps (e.g., 0.01V), while a series of microwave signals from small to large (e.g., from -11dBm to -8dBm) are input to the microwave driver module. The output power response data under different control parameters is obtained through the test system.

[0063] Taking one of the solid-state power amplifier modules as an example, the phase voltage was set to a fixed 2V, and the attenuation voltage was set to 1.5V-10V (below 1.5V, the power is very low, less than 0.5W), with input power of -11dBm, -10dBm, -9dBm, and -8dBm. The output power response data under different control parameters was obtained through the test system, as shown in Table 1.

[0064] Table 1 Test Data of Solid State Power Amplifier Module Furthermore, based on the data in Table 1, the "input power - output power" curves for each microwave power amplifier module were fitted for input power of -11dBm, -10dBm, -9dBm, and -8dBm, as shown below. Figure 5a , Figure 5b , Figure 5c and Figure 5d As shown. From Figure 5a , Figure 5b , Figure 5c and Figure 5d As shown in the curves, the output power curve begins to distort when the input power is ≥ -9dBm. Therefore, it can be determined that the safe input power range that will not cause significant distortion of the output power curve is less than -9dBm. When the input power is too high, the microwave power amplifier module may exhibit a steep output power curve, even accompanied by a sudden drop in output power. Even if this sudden drop is avoided, it can still be observed from the output curve that when the attenuation voltage is less than 6V, the output power is already close to its maximum value, resulting in a small dynamic adjustment range and excessive sensitivity of the output power to changes in the attenuation voltage, i.e., a large local slope in the output power response curve. This characteristic increases the control difficulty and data acquisition speed requirements in power combining applications, which is detrimental to stable system operation.

[0065] Therefore, it is necessary to optimize the output power curve of each microwave power amplifier module as a function of attenuation voltage within a safe input power range. Based on the measured output power response curve, the parameters of the π-type attenuation network in the microwave driver module are adjusted, and the test is repeated until the output power response curve meets the consistency requirements.

[0066] Taking the solid-state power amplifier module in the example above as a reference, the data after N adjustments is automatically recorded as shown in Table 2.

[0067] Table 2. Data Record of Output Power Adjustment as Attenuation Voltage Changes The power curves of the initial state and the output power after N adjustments as a function of the decaying voltage are shown below. Figure 6a and Figure 6b As shown, compared to Figure 6a ,from Figure 6b It can be seen that after N adjustments, the output power curve is flatter, and the dynamic adjustment range of the attenuation voltage has changed from 2-5V to 2-7V. Ultimately, the output power response curves of the eight microwave power amplifier modules are basically consistent in terms of overall shape, slope characteristics, and dynamic adjustment range, thus meeting the consistency requirements.

[0068] Step S302, Phase reference establishment: After the output power response curves of the N microwave power amplifier modules to be synthesized meet the consistency requirements, under the same phase shift control voltage conditions, the phase response curve of each microwave power amplifier module is obtained, and the median phase curve is selected as the reference curve from the multiple phase response curves. Specifically, firstly, for the N microwave power amplifier modules participating in the synthesis, the same phase-shifting voltage and a unified output power curve standard are set to ensure that the output characteristics of each module are consistent under the same control conditions. For example, an output power of approximately 600W corresponds to an attenuation voltage of 4V, and approximately 1000W corresponds to an attenuation voltage of 8V. By establishing and calibrating this unified power curve standard, the output power curves of the N microwave power amplifier modules are made essentially consistent.

[0069] Then, the vector network analyzer is controlled by the measurement and control module to synchronously measure and record the output phase value of each microwave module at different attenuation voltage points, as shown in Table 3. An "attenuation voltage-output phase" curve, i.e., the phase curve, is then automatically fitted and generated. Figure 7 As shown in the figure, numbers 1-8 represent the phase curves corresponding to the eight microwave power amplifier module channels.

[0070] Table 3 Output phase values ​​of each microwave module at different attenuation voltage points. From the fitting results and Figure 7 As can be seen, the phase response curve corresponding to number 4 in the legend is located in the middle region of the phase response curves of all modules. Therefore, this curve is selected as the reference curve, and the phase consistency of the remaining microwave power amplifier modules is adjusted accordingly. Thus, the phase information corresponding to this microwave power amplifier module is selected as the reference benchmark, and the phases of the other 7 microwave power amplifier modules are adjusted to align with it, thereby achieving overall phase consistency.

[0071] Step S303, Phase Consistency Adjustment: Adjust the phase shift control voltage of the N-1 microwave power amplifier modules to be synthesized, excluding the microwave power amplifier module corresponding to the reference curve, so that the corresponding phase response curve matches the reference curve within a preset power range, thereby achieving phase consistency adjustment of the N microwave power amplifier modules to be synthesized.

[0072] Taking the adjustment of microwave power amplifier module 1 as an example, after changing the phase voltage and making multiple adjustments, a phase curve consistent with that of microwave power amplifier module 4 was obtained. The adjusted phase data is shown in Table 4.

[0073] Table 4 Phase Adjustment Data Record of Microwave Power Amplifier Module Based on the adjusted phase data, a phase curve is fitted as a function of the decaying voltage, such as... Figure 8 As shown.

[0074] Depend on Figure 8 It can be seen that the phase curve of microwave power amplifier module 1 at a phase voltage of 2.83V basically coincides with that of the reference microwave power amplifier module 4. Therefore, the phase-locked voltage of microwave power amplifier module 1 can be determined to be 2.83V.

[0075] Similarly, adjust the remaining six microwave power amplifier modules sequentially until the phase curves of the microwave power amplifier modules coincide with the reference curve within the preset power range, such as... Figure 9 As shown in Table 5, the final adjusted phase-locked voltage of each microwave power amplifier module is obtained.

[0076] Table 5 shows the adjusted phase-locked voltage data for each microwave power amplifier module. In one alternative embodiment, during the process of adjusting the π-type attenuation network parameters in the corresponding microwave drive module according to the output power response curve, and during the process of adjusting the phase-shift control voltage of the N-1 microwave power amplifier modules to be synthesized (excluding the microwave power amplifier module corresponding to the reference curve), the temperature of the power amplifier component area of ​​the N microwave power amplifier modules to be synthesized is monitored by a temperature monitoring module to ensure that the adjustment process is within a preset safe temperature range.

[0077] In one optional embodiment, the step of monitoring the temperature of the power amplifier component areas of the N microwave power amplifier modules to be synthesized via a temperature monitoring module includes: When the temperature of the power amplifier component area of ​​the microwave power amplifier module to be synthesized exceeds the preset temperature safety threshold, the adjustment process is paused and a warning message is fed back through the measurement and control module. When the temperature of the power amplifier component area drops below the preset temperature safety threshold, the adjustment process is resumed.

[0078] It should be noted that the preset temperature safety threshold is used to characterize the highest safe operating temperature of the power amplifier component area. Its specific value can be set according to the temperature resistance characteristics of components such as the power amplifier chip, matching capacitor, and filter capacitor in the microwave power amplifier module, as well as the actual operating conditions. For example, in one embodiment, the preset temperature safety threshold can be set to 80°C. When the temperature exceeds this threshold, the power amplifier component area is considered to be in an abnormal temperature rise state.

[0079] It is worth noting that during the process of adjusting the π-type attenuation network parameters in the microwave driver module according to the output power response curve, and adjusting the phase shift control voltages of N-1 microwave power amplifier modules to achieve phase consistency, the temperature monitoring module continuously monitors the temperature of key components such as the power amplifier chip and matching capacitors of each microwave power amplifier module to be synthesized. When the monitored temperature exceeds the preset temperature safety threshold, the monitoring and control module outputs a warning message and suspends subsequent adjustment operations; after the temperature drops below the preset temperature safety threshold, the consistency adjustment process resumes. Through the above temperature monitoring mechanism, the risk of device damage caused by heat accumulation during high-power adjustment can be reduced, and the safety and stability of the consistency adjustment process can be improved.

[0080] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A remote automated testing system for high-power solid-state power amplifiers, characterized in that, This includes a solid-state power amplifier module, a signal link module, a measurement and control module, and a temperature monitoring module; The solid-state power amplifier module includes a microwave driver module and a microwave power amplifier module, wherein the microwave driver module is used to provide a drive signal to the microwave power amplifier module. The signal link module includes a wave-to-wave converter and a waveguide directional coupler; wherein, the wave-to-wave converter is used to convert the microwave signal from the microwave power amplifier module into a waveguide signal for transmission; the waveguide directional coupler is used to couple the waveguide signal and transmit the coupled signal to the measurement and control module; The measurement and control module is used to generate test control signals according to preset test parameters, remotely output test signals to the microwave drive module, collect the coupling signals of the waveguide directional coupler, and perform data processing and analysis based on the test signals and the coupling signals. The temperature monitoring module is used to monitor the temperature of the power amplifier component area of ​​the microwave power amplifier module.

2. The high-power solid-state power amplifier remote automated testing system as described in claim 1, characterized in that, The signal link module further includes a coaxial coupler, which is used to couple the coupled signal of the waveguide directional coupler and output the processed signal to the measurement and control module.

3. The high-power solid-state power amplifier remote automated testing system as described in claim 1, characterized in that, It also includes a water load and a water chiller, the water chiller being used to provide circulating coolant to the water load, and to maintain the thermal balance of the solid-state power amplifier module and the signal link module through the heat dissipation of the water load.

4. The high-power solid-state power amplifier remote automated testing system as described in claim 2, characterized in that, The measurement and control module includes a vector network analyzer, a signal conversion unit, a data processing unit, and a spectrum analyzer; The data processing unit is connected to the temperature monitoring module, the vector network analyzer, the signal conversion unit, and the spectrum analyzer, respectively. It is used to generate a test control sequence according to preset test parameters, and control the vector network analyzer and the signal conversion unit to complete the test signal output and control parameter loading according to the test control sequence. It receives the measurement data acquired by the temperature monitoring module, the vector network analyzer, and the spectrum analyzer, processes the measurement data, and associates and records the measurement data with the corresponding test parameters. The vector network analyzer is used to output microwave test signals and receive measurement signals transmitted through the signal link module; The signal conversion unit is used to convert the digital control signal from the data processing unit into an analog drive signal, and output the analog drive signal to the microwave drive module; The spectrum analyzer is used to perform spectrum analysis on the coupled signal output from the coaxial coupler and upload the analysis results to the data processing unit.

5. The high-power solid-state power amplifier remote automated testing system as described in any one of claims 1 to 3, characterized in that, The microwave drive module includes a drive circuit, which includes a π-type attenuation circuit for adjusting interstage attenuation to adjust the output power response curve characteristics of the microwave power amplifier module as the attenuation voltage changes.

6. The high-power solid-state power amplifier remote automated testing system as described in claim 1, characterized in that, The power amplifier component area includes the power amplifier chip, matching capacitor, and filter capacitor of the microwave power amplifier module.

7. A testing method for a high-power solid-state power amplifier, characterized in that, The system is applied to the remote automated testing system for high-power solid-state power amplifiers as described in any one of claims 1 to 6, comprising: With the solid-state power amplifier module in an unsealed state, a test signal is input to the corresponding microwave power amplifier module. By monitoring the output power of the microwave power amplifier module and the temperature change of the power amplifier component area, the matching capacitor of the microwave power amplifier module is adjusted. In the unsealed state, the adjusted microwave power amplifier module is operated at a preset first power for a first preset duration to monitor the output power stability and the temperature of the power amplifier component area; In the unsealed state, the test power steps are set according to the preset power level, and the output power is increased step by step to the preset operating power range. The test power is run for a second preset duration at each power step to monitor the output power stability and the temperature of the power amplifier component area. In the unsealed state, the microwave power amplifier module is operated at full power for a third preset duration; After sealing the solid-state power amplifier module, the microwave power amplifier module is run for a fourth preset time, and the temperature of the output interface and output cable of the microwave power amplifier module is monitored.

8. A method for consistency adjustment before synthesis of a high-power solid-state power amplifier module, characterized in that, The system is applied to the remote automated testing system for high-power solid-state power amplifiers as described in any one of claims 1 to 6, comprising: For N solid-state power amplifier modules to be synthesized, under a fixed phase-shift control voltage, the output power response curve of each microwave power amplifier module is obtained by changing the attenuation voltage. Based on the output power response curve, the parameters of the π-type attenuation network in the corresponding microwave drive module are adjusted so that the output power response curves of the N microwave power amplifier modules to be synthesized meet the consistency requirements. After the output power response curves of the N microwave power amplifier modules to be synthesized meet the consistency requirements, under the same phase-shift control voltage conditions, the phase response curves of each microwave power amplifier module are obtained, and the phase curve with the median value is selected from the multiple phase response curves as the reference curve. Adjust the phase-shift control voltage of N-1 microwave power amplifier modules to be synthesized, excluding the microwave power amplifier module corresponding to the reference curve, so that the corresponding phase response curve matches the reference curve within a preset power range, thereby achieving phase consistency adjustment of the N microwave power amplifier modules to be synthesized.

9. The method for consistency adjustment of high-power solid-state power amplifier modules before synthesis as described in claim 8, characterized in that, During the process of adjusting the π-type attenuation network parameters in the corresponding microwave drive module according to the output power response curve, and during the process of adjusting the phase shift control voltage of the N-1 microwave power amplifier modules to be synthesized (excluding the microwave power amplifier module corresponding to the reference curve), the temperature of the power amplifier component area of ​​the N microwave power amplifier modules to be synthesized is monitored by the temperature monitoring module to ensure that the adjustment process is within a preset safe temperature range.

10. The method for consistency adjustment of high-power solid-state power amplifier modules before synthesis as described in claim 9, characterized in that, The temperature monitoring of the power amplifier component areas of the N microwave power amplifier modules to be synthesized via a temperature monitoring module includes: When the temperature of the power amplifier component area of ​​the microwave power amplifier module to be synthesized exceeds the preset temperature safety threshold, the adjustment process is paused and a warning message is fed back through the measurement and control module. When the temperature of the power amplifier component area drops below the preset temperature safety threshold, the adjustment process is resumed.

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