Intelligent temperature control and heat dissipation high-power optical module

Abstract

The application discloses a high-power optical module with intelligent temperature control and heat dissipation, and belongs to the technical field of optical modules. The heat dissipation transmission assembly is used to quickly dissipate the heat of the heat exhaust end face of the semiconductor refrigeration sheet to the outside. When the rotating roller rotates, the V-shaped groove drives the sliding column slidingly arranged in the V-shaped groove to make reciprocating linear motion. The sliding column drives the toothed rod to make reciprocating linear motion through the sliding block. The reciprocating motion of the single toothed rod can drive all the toothed rods to make synchronous reciprocating motion. The toothed rod and the gear fixed to one end of the rotating rod are in meshing engagement. The reciprocating linear motion of the toothed rod is converted into the forward and reverse alternating rotation of the gear, thereby driving the rotating rod to make synchronous forward and reverse alternating rotation. When the rotating rod rotates, the heat dissipation fins at the bottom are continuously swung. In the swinging process, the dead zone of the accumulated hot air around the heat dissipation fins is broken, the air flow speed is accelerated, the contact area of the heat dissipation fins and the air is increased, the heat dissipation efficiency is remarkably improved, the heat exhausted by the semiconductor refrigeration sheet is quickly dissipated, and the heat accumulation is avoided to cause the cooling effect to decrease.

Description

Technical Field

[0001] This invention relates to the field of optical module technology, specifically to a high-power optical module with intelligent temperature control and heat dissipation. Background Technology

[0002] With the explosive growth of cloud computing, AI large-scale model training, data center interconnection, and metropolitan area network construction, high-power optical modules have become core components supporting computing power transmission and long-distance communication. They are widely used in intelligent computing centers, backbone networks, metropolitan area networks, and high-end communication equipment, and are essential components for the development of the digital economy. The core working principle of optical modules is to realize the mutual conversion between electrical signals and optical signals. They integrate precision optoelectronic devices such as lasers, detectors, DSP chips, and silicon photonics chips. These devices are extremely sensitive to operating temperature, and temperature stability directly determines the transmission quality and service life of optical modules.

[0003] Currently, most heat dissipation solutions for high-power optical modules are passive or semi-active, lacking intelligent temperature control and adjustment capabilities. They cannot dynamically adjust the heat dissipation power according to the real-time power consumption and operating temperature of the optical module, resulting in wasted heat dissipation resources or insufficient heat dissipation. When the module is in a low-power operating state, the heat dissipation system still maintains high load operation, increasing overall energy consumption. When the module suddenly experiences high power consumption or a sudden increase in local hot spots, the heat dissipation system cannot respond in time.

[0004] Moreover, the heat dissipation fins of existing high-power optical modules are all fixed structures. Even when paired with air-cooling or liquid-cooling systems, the heat dissipation method of fixed fins is passive heat dissipation. Heat can only be carried away by natural conduction or airflow in a fixed direction. In the compact packaging space of high-power optical modules, dead zones of hot air accumulation are easily formed around the fins, resulting in low heat exchange efficiency and an inability to quickly dissipate the large amount of heat generated by the core components, leading to excessively high local hot spot temperatures. Summary of the Invention

[0005] The purpose of this invention is to provide a high-power optical module with intelligent temperature control and heat dissipation, in order to solve the problem mentioned in the background art that the heat dissipation fins of existing high-power optical modules are all fixed structures. Even when paired with air cooling or liquid cooling systems, the heat dissipation method of fixed fins is passive heat dissipation. Heat can only be carried away by natural conduction or airflow in a fixed direction. In the compact packaging space of high-power optical modules, dead zones of hot air accumulation are easily formed around the fins, resulting in low heat exchange efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A high-power optical module with intelligent temperature control and heat dissipation includes an optical module body. One end of the optical module body is equipped with gold fingers, and the other end has two transceiver interfaces and a handle. A laser head is installed inside each of the two transceiver interfaces. A sealing and protective component is installed inside each transceiver interface corresponding to the outer side of the laser head. A support plate is fixedly connected to the bottom of the optical module. The support plate has a U-shaped design and several heat dissipation holes on its bottom. A sliding frame is slidably installed inside the support plate. Sliding grooves are formed on the front and rear sides of the sliding frame. A cooling component is slidably connected inside the two sliding grooves. The cooling component is mounted on a temperature control module within the sliding frame. The top of the cooling component and the temperature control module are in contact with the heat-conducting surface of the bottom of the optical module body. Several heat dissipation transmission components are mounted on the bottom of the cooling component. One side of one of the heat dissipation transmission components is fixedly connected to a drive component. A sliding hole is opened on one side of the sliding frame. One end of the drive component slides through the sliding hole. A fixing box is installed outside the drive component. One side of the fixing box is fixed to the sliding frame. Limiting components are fixedly installed at both ends of the fixing box. The end of the limiting component is engaged in a locking hole opened on one side of the inside of the tray.

[0008] As a further embodiment of the present invention, the sealing and protection assembly includes a sealing air cushion cover, which is disposed inside the transceiver interface and located outside the laser head. The sealing air cushion cover has an air cavity inside, and the cross-sectional shape of the air cavity is C-shaped.

[0009] As a further embodiment of the present invention, the cooling component includes a semiconductor cooling chip, which is fixedly installed inside the sliding frame. A flexible thermally conductive base is mounted on the semiconductor cooling chip, and a thermally conductive sheet is mounted on the semiconductor cooling chip through the flexible thermally conductive base. The top of the thermally conductive sheet is attached to the thermally conductive surface at the bottom of the optical module body, and the two sides of the thermally conductive sheet are designed with bevels. The temperature control module is mounted on the thermally conductive sheet.

[0010] As a further embodiment of the present invention, ear plates are fixed on both sides of the flexible heat-conducting base. The ear plates are slidably connected in the groove. Two guide rods slide through the ear plates. The two ends of the guide rods are fixed inside the groove. A first spring is sleeved on the guide rod. The two ends of the first spring are fixed to the bottom of the inner wall of the groove and the bottom of the ear plate, respectively.

[0011] As a further embodiment of the present invention, the heat dissipation transmission assembly includes a rotating rod, the two ends of which penetrate the bottom of the thermoelectric cooler and are rotatably connected to both sides of the inner wall of the sliding frame via bushings. The rotating rod is made of aluminum and its exterior is attached to the heat dissipation end face of the bottom of the thermoelectric cooler. Heat dissipation fins are fixed at the lower position outside the rotating rod. Scrapers are attached to both sides of the heat dissipation fins. Guide blocks are fixed at both ends of the scrapers. Arc-shaped grooves are formed on the front and rear sides of the bottom of the thermoelectric cooler corresponding to the positions of the guide blocks. Arc-shaped springs are fixed between the top of the inner wall of the arc-shaped groove and the guide blocks.

[0012] As a further embodiment of the present invention, one end of the rotating rod passes through the semiconductor cooling chip and is fixed with a gear. The gear is externally meshed with a toothed rod, and a fixed shell is attached to the bottom of the toothed rod. The fixed shell is fixed to one side inside the sliding frame. A connecting rod is fixedly connected between two adjacent toothed rods, and the connecting rod slides through the end of the fixed shell.

[0013] As a further embodiment of the present invention, the driving component includes a micro motor, which is fixedly installed inside a fixed box. A rotating roller is fixed on the output shaft of the micro motor. Several V-shaped grooves are formed on the outside of the rotating roller, and two adjacent V-shaped grooves are interconnected. The several V-shaped grooves surround the rotating roller. A sliding column is slidably installed in one of the V-shaped grooves. A slider is fixed at the bottom of the sliding column. The slider slides inside the fixed box. One side of the slider passes through a sliding hole and is fixed to one side of one of the toothed rods. A sliding rod passes through the slider and slides through it. The two ends of the sliding rod are fixed to both sides inside the fixed box.

[0014] As a further embodiment of the present invention, the limiting component includes a stop frame, a sliding block is slidably connected inside the stop frame, a locking rod is fixed to one side of the sliding block, one end of the locking rod passes through the stop frame and is engaged in a locking hole on one side of the inside of the support plate, a second spring is sleeved on the locking rod, the two ends of the second spring are fixed to the sliding block and one side of the inner wall of the stop frame, a slide rail is provided in the stop frame corresponding to the position of the sliding block, and one side of the sliding block passes through the slide rail and is fixed with a handle.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This invention rapidly dissipates heat from the heat dissipation end face of the thermoelectric cooler to the outside through a heat dissipation transmission assembly. The rotating rod is externally attached to the heat dissipation end face of the thermoelectric cooler, which can quickly absorb the heat dissipated by the thermoelectric cooler and transfer the heat to the externally fixed heat dissipation fins. The heat dissipation fins contact the outside air through the heat dissipation holes at the bottom of the support plate to achieve heat dissipation. To further improve the heat dissipation effect, a micro motor is started, driving the rotating roller on the output shaft to rotate. When the rotating roller rotates, the V-groove drives the internally sliding column to perform reciprocating linear motion. The column drives the bottom slider to slide along the sliding rod, and the reciprocating motion of the slider drives the toothed rod to perform reciprocating motion. The linear motion, with the connecting rod sliding through the end of the fixed shell, allows the reciprocating motion of a single rack to drive the synchronous reciprocating motion of all racks. The rack meshes with the gear fixed at one end of the rotating rod, converting the reciprocating linear motion of the rack into the alternating forward and reverse rotation of the gear, which in turn drives the rotating rod to rotate synchronously in alternating forward and reverse directions. When the rotating rod rotates, it causes the heat dissipation fins at the bottom to swing continuously. During the swing, the dead zone of hot air accumulation around the heat dissipation fins is broken, the airflow speed is accelerated, and the contact area between the heat dissipation fins and the air is increased, significantly improving the heat dissipation efficiency and ensuring that the heat dissipated by the semiconductor cooling chip is quickly dissipated, avoiding heat accumulation that would reduce the cooling effect.

[0017] 2. In this invention, pulling the two handles causes the sliding block to slide along the slide rail of the retainer. The sliding block compresses the second spring and causes the locking rod to disengage from the locking hole, releasing the limit. At this time, the sliding frame can be pulled along the support plate to separate the sliding frame from the support plate, facilitating the disassembly of the sliding frame. When installing the sliding frame, squeezing the two handles causes the two sliding blocks to drive the two locking rods closer to each other. Then, the sliding frame is pushed into the support plate at the bottom of the optical module body. After releasing the two handles, the elastic force of the second spring supports the sliding block, pushing the sliding block to move the locking rod towards the support plate, causing the end of the locking rod to lock. The sliding frame is fixed to the tray by the snap-fit ​​holes inside the tray. At the same time, the ear plates on both sides of the flexible heat-conducting base are slidably connected to the sliding grooves of the sliding frame. The guide rods that slide through the ear plates are used to limit the movement direction of the ear plates, prevent the cooling components from shifting, and ensure the contact accuracy between the heat-conducting sheet and the heat-conducting surface of the optical module body. The first spring that is sleeved on the guide rod can adaptively compensate for the gap between the heat-conducting sheet and the optical module body through elastic expansion and contraction. At the same time, it buffers the slight vibrations generated during the operation of the optical module, avoids poor heat conduction or device damage caused by rigid contact, and further improves the heat conduction efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 This is a partial bottom-view structural diagram of the present invention;

[0021] Figure 3 This is a schematic diagram of a partial cross-section of the optical module body of the present invention;

[0022] Figure 4 This is a schematic diagram of the cross-sectional structure of the sealing and protection component of the present invention;

[0023] Figure 5 This is a schematic diagram of the connection between the sliding frame and the support plate of the present invention;

[0024] Figure 6 This is a schematic diagram of the sliding frame structure of the present invention viewed from below;

[0025] Figure 7 This is a schematic diagram of the cross-sectional structure of the limiting component of the present invention;

[0026] Figure 8 This is a schematic diagram of the cross-sectional structure of the sliding frame of the present invention;

[0027] Figure 9 This is a partial cross-sectional view of the sliding frame structure of the present invention;

[0028] Figure 10 This is a schematic diagram of the connection between the drive component and the heat dissipation transmission component of the present invention;

[0029] Figure 11 This is a schematic diagram of the structure of the driving component of the present invention;

[0030] Figure 12 This is a schematic diagram of the heat dissipation transmission assembly of the present invention;

[0031] Figure 13 For the present invention Figure 6 Enlarged structural diagram at point A;

[0032] Figure 14 This is a schematic diagram of the guide block and the arc spring of the present invention.

[0033] The attached diagram lists the components represented by each number as follows:

[0034] 1. Optical module body; 2. Gold fingers; 3. Handle; 4. Transceiver interface; 5. Sealing and protection assembly; 501. Sealing air cushion cover; 502. Air cavity; 6. Laser head; 7. Support plate; 8. Heat dissipation hole; 9. Sliding frame; 10. Cooling assembly; 101. Semiconductor cooling chip; 102. Flexible thermally conductive base; 103. Thermally conductive sheet; 104. Ear plate; 105. Guide rod; 106. First spring; 11. Temperature control module; 12. Slide groove; 13. Heat dissipation transmission assembly; 131. Rotating rod; 132. Heat dissipation fins ; 133. Gear; 134. Tooth rack; 135. Fixed housing; 136. Connecting rod; 14. Sliding hole; 15. Drive assembly; 151. Micro motor; 152. Rotary roller; 153. V-groove; 154. Sliding column; 155. Sliding block; 16. Fixed box; 17. Sliding rod; 18. Limiting assembly; 181. Stop; 182. Sliding block; 183. Locking rod; 184. Second spring; 185. Handle; 186. Slide rail; 19. Scraper; 20. Guide block; 21. Arc spring; 22. Arc groove. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Please see Figures 1-14 The present invention provides a technical solution:

[0037] A high-power optical module with intelligent temperature control and heat dissipation includes an optical module body 1. One end of the optical module body 1 is equipped with a gold finger 2, and the other end of the optical module body 1 is provided with two transceiver interfaces 4 and a handle 3. Laser heads 6 are installed in the two transceiver interfaces 4 respectively. The gold finger 2 is used to realize electrical connection with external devices and transmit electrical signals. The two transceiver interfaces 4 at the other end are used for transmitting and receiving optical signals. The laser heads 6 installed inside realize the conversion of electrical signals to optical signals and optical signals to electrical signals. The handle 3 facilitates the plugging and unplugging of the optical module for maintenance, meeting the module pluggable standard.

[0038] A sealing and protective component 5 is installed inside the transceiver interface 4 at a position corresponding to the outside of the laser head 6. The sealing and protective component 5 includes a sealing air cushion cover 501. The sealing air cushion cover 501 is located inside the transceiver interface 4 and outside the laser head 6. An air cavity 502 is provided inside the sealing air cushion cover 501. The cross-sectional shape of the air cavity 502 is C-shaped.

[0039] During operation, as the external connector is inserted into the laser head 6 inside the transceiver interface 4, the sealing gas cushion 501 is compressed, and its internal C-shaped air cavity 502 undergoes elastic deformation, further tightly fitting between the outer wall of the external connector, the inner wall of the transceiver interface 4, and the laser head 6, forming an all-round, gapless sealing barrier. This effectively prevents external impurities from entering without damaging the laser head 6 and the external connector due to rigid contact. At the same time, it does not affect the normal docking of the laser head 6 and the external connector, as well as the transmission and reception of optical signals, ensuring the communication stability of the optical module.

[0040] As a further embodiment of the present invention, a support plate 7 is fixedly connected to the bottom of the optical module. The support plate 7 has a U-shaped design and several heat dissipation holes 8 at the bottom. A sliding frame 9 is slidably installed inside the support plate 7 and is inserted into a slot on the front side of the support plate 7 so that the sliding frame 9 can be removed or placed from the slot on the front side of the support plate 7. Sliding grooves 12 are respectively opened on the front and rear sides inside the sliding frame 9. A cooling component 10 is slidably connected inside the two sliding grooves 12. The cooling component 10 slides inside the sliding frame 9. A temperature control module 11 is installed on the cooling component 10, and the top of the cooling component 10 and the temperature control module 11 are in contact with the heat-conducting surface at the bottom of the optical module body 1.

[0041] The cooling component 10 includes a thermoelectric cooler 101, which is fixedly installed inside the sliding frame 9. A flexible heat-conducting base 102 is installed on the thermoelectric cooler 101, and a heat-conducting plate 103 is installed on the thermoelectric cooler 101 through the flexible heat-conducting base 102. The top of the heat-conducting plate 103 is attached to the bottom heat-conducting surface of the optical module body 1, and the two sides of the heat-conducting plate 103 are designed with bevels. The temperature control module 11 is installed on the heat-conducting plate 103.

[0042] During operation, the heat generated by the internal components of the optical module is transferred to the heat-conducting sheet 103 through the heat-conducting surface of the optical module body 1. The heat-conducting sheet 103 evenly transfers the heat to the flexible heat-conducting base 102, and then from the flexible heat-conducting base 102 to the cooling end face of the semiconductor cooling chip 101. After the semiconductor cooling chip 101 is powered on, the cooling end face quickly absorbs heat, achieving initial cooling of the heat and controlling the temperature of the optical module body 1 within a reasonable range.

[0043] Because the temperature control module 11 is installed on the heat-conducting sheet 103, it can collect the temperature of the heat-conducting sheet 103 in real time, indirectly reflecting the temperature of the core device of the optical module body 1, and convert the temperature signal into an electrical signal and transmit it to the semiconductor cooling chip 101. When the temperature is higher than the set threshold, the temperature control module 11 controls the semiconductor cooling chip 101 to increase the cooling power. When the temperature drops to the set normal range, the temperature control module 11 controls the semiconductor cooling chip 101 to reduce the cooling power, thereby achieving a dynamic balance between heat dissipation efficiency and energy consumption.

[0044] As a further embodiment of the present invention, ear plates 104 are fixed on both sides of the flexible heat-conducting base 102. The ear plates 104 are slidably connected in the slide groove 12. Two guide rods 105 slide through the ear plates 104. The two ends of the guide rods 105 are fixed inside the slide groove 12. A first spring 106 is sleeved on the guide rods 105. The two ends of the first spring 106 are fixed to the bottom of the inner wall of the slide groove 12 and the bottom of the ear plate 104, respectively.

[0045] During operation, the ear plates 104 on both sides of the flexible heat-conducting base 102 are slidably connected in the grooves 12 of the sliding frame 9. The guide rod 105 through which the ear plates 104 slides is used to limit the movement direction of the ear plates 104, prevent the cooling component 10 from shifting, and ensure the contact accuracy between the heat-conducting sheet 103 and the heat-conducting surface of the optical module body 1. The first spring 106, which is sleeved on the guide rod 105, can adaptively compensate for the gap between the heat-conducting sheet 103 and the optical module body 1 through elastic extension and contraction, and at the same time buffer the slight vibration generated during the operation of the optical module to avoid poor heat conduction or device damage caused by rigid contact.

[0046] As a further embodiment of the present invention, a plurality of heat dissipation transmission components 13 are installed at the bottom of the cooling component 10. The heat dissipation transmission component 13 includes a rotating rod 131. The two ends of the rotating rod 131 pass through the bottom of the semiconductor cooling chip 101 and are rotatably connected to both sides of the inner wall of the sliding frame 9 through bushings. The rotating rod 131 is made of aluminum and is externally attached to the heat dissipation end face of the bottom of the semiconductor cooling chip 101. Heat dissipation fins 132 are fixed at the lower position of the outside of the rotating rod 131.

[0047] During operation, the aluminum rotating rod 131 has excellent thermal conductivity, and the outside of the rotating rod 131 is attached to the heat dissipation end face of the semiconductor cooling chip 101. It can quickly absorb the heat dissipated by the semiconductor cooling chip 101 and transfer the heat to the externally fixed heat dissipation fins 132. The heat dissipation fins 132 are in contact with the outside air through the heat dissipation holes 8 at the bottom of the support plate 7 to dissipate heat.

[0048] The heat dissipation fins 132 are connected to the two sides of the scraper 19, and the two ends of the scraper 19 are respectively fixed with guide blocks 20. The front and rear sides of the bottom of the semiconductor cooling chip 101 are provided with arc grooves 22 corresponding to the positions of the guide blocks 20. An arc spring 21 is fixed between the top of the inner wall of the arc groove 22 and the guide block 20.

[0049] During operation, when the heat dissipation fins 132 swing, they exert a slight lateral force on the scraper 19, causing the guide block 20 to slide synchronously along the arc groove 22. The arc spring 21 then adapts by extending and retracting to buffer this lateral force and prevent excessive friction between the scraper 19 and the heat dissipation fins 132. The two sides of the heat dissipation fins 132 slide relative to the scraper 19. Under the elastic force of the arc spring 21, the scraper 19 remains in close contact with the surface of the heat dissipation fins 132, removing dust and debris adsorbed on the surface of the heat dissipation fins 132 in real time. This prevents impurities from accumulating in the gaps between the heat dissipation fins 132, ensuring that the contact area between the heat dissipation fins 132 and the air is not affected, thus guaranteeing stable heat dissipation efficiency.

[0050] As a further embodiment of the present invention, one end of the rotating rod 131 passes through the semiconductor cooling chip 101 and is fixed with a gear 133. The gear 133 is externally meshed with a toothed rod 134. The bottom of the toothed rod 134 is attached to a fixed shell 135. The fixed shell 135 is fixed to one side inside the sliding frame 9. A connecting rod 136 is fixedly connected between two adjacent toothed rods 134, and the connecting rod 136 slides through the end of the fixed shell 135.

[0051] During operation, since two adjacent racks 134 are fixedly connected by a connecting rod 136, and the connecting rod 136 slides through the end of the fixed shell 135, the reciprocating motion of a single rack 134 can drive all racks 134 to reciprocate synchronously. The rack 134 meshes with the gear 133 fixed at one end of the rotating rod 131. The reciprocating linear motion of the rack 134 is converted into the forward and reverse alternating rotation of the gear 133, which in turn drives the rotating rod 131 to rotate synchronously in forward and reverse alternating directions. When the rotating rod 131 rotates, it drives the heat dissipation fins 132 at the bottom to swing continuously, which accelerates the dissipation of heat in the heat dissipation fins 132.

[0052] As a further embodiment of the present invention, a drive component 15 is fixedly connected to one side of a heat dissipation transmission component 13, a sliding hole 14 is provided on one side of a sliding frame 9, one end of the drive component 15 slides through the sliding hole 14, and a fixing box 16 is installed outside the drive component 15, with one side of the fixing box 16 fixed to the sliding frame 9.

[0053] The drive assembly 15 includes a micro motor 151, which is fixedly installed inside the fixed box 16. A rotating roller 152 is fixed on the output shaft of the micro motor 151. Several V-grooves 153 are opened on the outside of the rotating roller 152. Two adjacent V-grooves 153 are interconnected. The several V-grooves 153 surround the rotating roller 152. A sliding column 154 is slidably installed in one of the V-grooves 153. A slider 155 is fixed at the bottom of the sliding column 154. The slider 155 slides inside the fixed box 16. One side of the slider 155 passes through the sliding hole 14 and is fixed to one side of one of the toothed rods 134. A sliding rod 17 slides through the slider 155. The two ends of the sliding rod 17 are fixed to the two sides inside the fixed box 16.

[0054] During operation, the micro motor 151 starts, driving the roller 152 on the output shaft to rotate. Several interconnected V-shaped grooves 153 on the outside of the roller 152 form an annular guide structure. When the roller 152 rotates, the V-shaped grooves 153 drive the internally slidably mounted sliding column 154 to perform reciprocating linear motion. The sliding column 154 drives the bottom slider 155 to slide along the sliding rod 17. The sliding rod 17 is used to limit the movement direction of the slider 155 and ensure motion stability. Since one side of the slider 155 passes through the sliding hole 14 of the sliding frame 9 and is fixedly connected to one of the toothed rods 134, the reciprocating motion of the slider 155 drives the toothed rod 134 to perform reciprocating linear motion.

[0055] As a further embodiment of the present invention, limiting components 18 are fixedly installed at both ends of the fixing box 16, and the ends of the limiting components 18 are engaged in the locking holes opened on one side of the tray 7. The limiting components 18 include a stop 181, a sliding block 182 is slidably connected inside the stop 181, a locking rod 183 is fixed on one side of the sliding block 182, one end of the locking rod 183 passes through the stop 181 and is engaged in the locking holes on one side of the tray 7, a second spring 184 is sleeved on the locking rod 183, both ends of the second spring 184 are fixed to the sliding block 182 and one side of the inner wall of the stop 181, a slide rail 186 is opened in the stop 181 corresponding to the position of the sliding block 182, and one side of the sliding block 182 passes through the slide rail 186 and is fixed with a handle 185;

[0056] During operation, by pulling the two handles 185, the sliding block 182 is driven to slide along the slide rail 186 of the baffle 181. The sliding block 182 compresses the second spring 184 and drives the locking rod 183 to disengage from the locking hole, thus releasing the limit. At this time, the sliding frame 9 can be pulled to slide along the support plate 7, so that the sliding frame 9 is separated from the support plate 7, making it convenient to disassemble the sliding frame 9.

[0057] When installing the sliding frame 9, by squeezing the two handles 185, the two sliding blocks 182 respectively drive the two locking rods 183 to move closer to each other. Then, the sliding frame 9 is pushed into the tray 7 at the bottom of the optical module body 1. After releasing the two handles 185, the sliding block 182 is supported by the elastic force of the second spring 184. The sliding block 182 is pushed to drive the locking rod 183 to move towards the tray 7, so that the end of the locking rod 183 is engaged in the locking hole inside the tray 7. This makes it easier to install the sliding frame 9 and the internal heat dissipation structure in the optical module body 1, improving the ease of operation.

[0058] Working principle of this invention:

[0059] The high-power optical module has a gold finger 2 at one end for electrical connection with external devices and transmission of electrical signals, and two transceiver interfaces 4 at the other end for transmission and reception of optical signals. The internally installed laser head 6 is used to convert electrical signals to optical signals and vice versa. The handle 3 facilitates the insertion and removal of the optical module for maintenance, meeting the module pluggable standard. During the process of inserting the external connector into the laser head 6 in the transceiver interface 4, the sealing air cushion 501 will be compressed, and the C-shaped air cavity 502 inside it will undergo elastic deformation, further tightly fitting between the outer wall of the external connector, the inner wall of the transceiver interface 4 and the laser head 6, forming an all-round, gapless sealing barrier, which can effectively prevent external impurities from entering, and will not damage the laser head 6 and the external connector due to rigid contact.

[0060] When the optical module is working, the heat generated by its internal components is transferred to the heat-conducting sheet 103 through the heat-conducting surface of the optical module body 1. The heat-conducting sheet 103 evenly transfers the heat to the flexible heat-conducting base 102, and then from the flexible heat-conducting base 102 to the cooling end face of the semiconductor cooling chip 101. After the semiconductor cooling chip 101 is powered on, the cooling end face quickly absorbs heat, achieving initial cooling. The ear plates 104 on both sides of the flexible heat-conducting base 102 are slidably connected in the sliding groove 12 of the sliding frame 9. The guide rod 105 through which the ear plates 104 slide is used to limit the movement direction of the ear plates 104, prevent the cooling component 10 from shifting, and ensure the fitting accuracy between the heat-conducting sheet 103 and the heat-conducting surface of the optical module body 1. The first spring 106 on the outer sleeve of the guide rod 105 can adaptively compensate for the gap between the heat-conducting sheet 103 and the optical module body 1 through elastic extension and contraction, and at the same time buffer the slight vibration generated during the operation of the optical module.

[0061] Because the temperature control module 11 is installed on the heat-conducting sheet 103, it can collect the temperature of the heat-conducting sheet 103 in real time, indirectly reflecting the temperature of the core device of the optical module body 1, and convert the temperature signal into an electrical signal, which is transmitted to the semiconductor cooling chip 101 and the driving component 15. When the collected temperature is higher than the set threshold, the temperature control module 11 controls the semiconductor cooling chip 101 to increase the cooling power, and at the same time starts the driving component 15 to accelerate the heat dissipation efficiency of the heat dissipation transmission component 13. When the temperature drops to the set normal range, the temperature control module 11 controls the semiconductor cooling chip 101 to reduce the cooling power.

[0062] The heat dissipation transmission assembly 13 is used to quickly dissipate the heat from the heat dissipation end face of the thermoelectric cooler 101 to the outside. The aluminum rotating rod 131 has excellent thermal conductivity, and the outside of the rotating rod 131 is attached to the heat dissipation end face of the thermoelectric cooler 101. It can quickly absorb the heat dissipated by the thermoelectric cooler 101 and transfer the heat to the externally fixed heat dissipation fins 132. The heat dissipation fins 132 are in contact with the outside air through the heat dissipation holes 8 at the bottom of the support plate 7 to achieve heat dissipation. After the temperature control module 11 transmits a signal, the micro motor 151 starts and drives the rotating roller 152 on the output shaft to rotate. The rotating roller 152 has several interconnected V-shaped grooves 153 on its outside, forming an annular guide structure. When the rotating roller 152 rotates, the V-shaped grooves 153 drive the internally slidably mounted sliding column 154 to perform reciprocating linear motion. The sliding column 154 drives the bottom slider 155 to slide along the sliding rod 17. The sliding rod 17 is used to limit the movement direction of the slider 155 and ensure the stability of the movement. Since one side of the slider 155 passes through the sliding hole 14 of the sliding frame 9 and is fixedly connected to one of the toothed rods 134, the reciprocating motion of the slider 155 drives the toothed rod 134 to perform reciprocating linear motion.

[0063] Since two adjacent racks 134 are fixedly connected by a connecting rod 136, and the connecting rod 136 slides through the end of the fixed shell 135, the reciprocating motion of a single rack 134 can drive all racks 134 to reciprocate synchronously. The rack 134 meshes with the gear 133 fixed at one end of the rotating rod 131. The reciprocating linear motion of the rack 134 is converted into the forward and reverse rotation of the gear 133, which in turn drives the rotating rod 131 to rotate synchronously in the forward and reverse directions. When the rotating rod 131 rotates, it drives the heat dissipation fins 132 at the bottom to swing continuously. During the swing, the dead zone of hot air accumulation around the heat dissipation fins 132 is broken, the air flow speed is accelerated, and the contact area between the heat dissipation fins 132 and the air is increased, which significantly improves the heat dissipation efficiency.

[0064] When the drive assembly 15 drives the rotating rod 131 to rotate alternately in both directions, the rotating rod 131 drives the heat dissipation fins 132 to swing alternately in both directions in sync, and the swing angle matches the curvature of the arc groove 22. At this time, the two sides of the heat dissipation fins 132 slide relative to the scraper 19. Under the elastic force of the arc spring 21, the scraper 19 always fits tightly against the surface of the heat dissipation fins 132, and removes the dust and debris adsorbed on the surface of the heat dissipation fins 132 in real time, so as to avoid the accumulation of impurities in the gaps of the heat dissipation fins 132, and ensure that the contact area between the heat dissipation fins 132 and the air is not affected, thus ensuring stable heat dissipation efficiency. At the same time, when the heat dissipation fins 132 swing, it will generate a slight lateral force on the scraper 19, which will drive the guide block 20 to slide synchronously in an arc along the arc groove 22. The arc spring 21 will then adapt and extend to buffer the lateral force and avoid excessive friction between the scraper 19 and the heat dissipation fins 132.

[0065] When removing the sliding frame 9 and its internal structure from the optical module body 1, the sliding block 182 is slid along the slide rail 186 of the baffle 181 by pulling the two handles 185. The sliding block 182 compresses the second spring 184 and causes the locking rod 183 to disengage from the locking hole, releasing the limit. At this time, the sliding frame 9 can be pulled along the support plate 7 to separate the sliding frame 9 from the support plate 7, completing the disassembly of the sliding frame 9. When installing the sliding frame 9, the two handles 185 are squeezed to cause the two sliding blocks 182 to drive the two locking rods 183 to move closer to each other. Then, the sliding frame 9 is pushed into the support plate 7 at the bottom of the optical module body 1. After releasing the two handles 185, the sliding block 182 is supported by the elastic force of the second spring 184, pushing the sliding block 182 to move the locking rod 183 towards the support plate 7, so that the end of the locking rod 183 is locked in the locking hole inside the support plate 7, thus fixing the sliding frame 9 to the support plate 7.

Claims

1. A high-power optical module with intelligent temperature control and heat dissipation, comprising an optical module body (1), characterized in that: One end of the optical module body (1) is equipped with a gold finger (2), and the other end of the optical module body (1) is provided with two transceiver interfaces (4) and a handle (3). A laser head (6) is installed in each of the two transceiver interfaces (4). A sealing and protective component (5) is installed inside the transceiver interface (4) corresponding to the outer side of the laser head (6). A support plate (7) is fixedly connected to the bottom of the optical module. The support plate (7) is U-shaped and has several heat dissipation holes (8) at the bottom. A sliding frame (9) is slidably installed inside the support plate (7). Sliding grooves (12) are opened on the front and back sides of the sliding frame (9). A cooling component (10) is slidably connected inside the two sliding grooves (12). The cooling component (10) slides in the sliding frame (9). The cooling component (10) is on A temperature control module (11) is installed, and the top of the cooling component (10) and the temperature control module (11) are in contact with the heat-conducting surface of the bottom of the optical module body (1). Several heat dissipation transmission components (13) are installed at the bottom of the cooling component (10). A drive component (15) is fixedly connected to one side of one of the heat dissipation transmission components (13). A sliding hole (14) is opened on one side of the sliding frame (9). One end of the drive component (15) slides through the sliding hole (14). A fixing box (16) is installed outside the drive component (15). One side of the fixing box (16) is fixed to the sliding frame (9). Limiting components (18) are fixedly installed at both ends of the fixing box (16). The end of the limiting component (18) is snapped into the snap hole opened on one side of the tray (7).

2. The high-power optical module with intelligent temperature control and heat dissipation according to claim 1, characterized in that: The sealing and protective assembly (5) includes a sealing air cushion cover (501), which is disposed inside the transceiver interface (4) and located outside the laser head (6). The sealing air cushion cover (501) has an air cavity (502) inside, and the cross-sectional shape of the air cavity (502) is C-shaped.

3. A high-power optical module with intelligent temperature control and heat dissipation according to claim 1, characterized in that: The cooling component (10) includes a thermoelectric cooler (101), which is fixedly installed inside the sliding frame (9). A flexible heat-conducting base (102) is installed on the thermoelectric cooler (101), and a heat-conducting plate (103) is installed on the thermoelectric cooler (101) through the flexible heat-conducting base (102). The top of the heat-conducting plate (103) is attached to the bottom heat-conducting surface of the optical module body (1). The two sides of the heat-conducting plate (103) are designed with bevels. The temperature control module (11) is installed on the heat-conducting plate (103).

4. A high-power optical module with intelligent temperature control and heat dissipation according to claim 3, characterized in that: The flexible heat-conducting base (102) has ear plates (104) fixed on both sides. The ear plates (104) are slidably connected in the groove (12). Two guide rods (105) slide through the ear plates (104). The two ends of the guide rods (105) are fixed inside the groove (12). The guide rods (105) are sleeved with a first spring (106). The two ends of the first spring (106) are fixed to the bottom of the inner wall of the groove (12) and the bottom of the ear plate (104) respectively.

5. A high-power optical module with intelligent temperature control and heat dissipation according to claim 4, characterized in that: The heat dissipation transmission assembly (13) includes a rotating rod (131). The two ends of the rotating rod (131) pass through the bottom of the semiconductor cooling chip (101) and are rotatably connected to both sides of the inner wall of the sliding frame (9) through bushings. The rotating rod (131) is made of aluminum and is externally attached to the heat dissipation end face of the bottom of the semiconductor cooling chip (101). A heat dissipation fin (132) is fixed at the lower position of the outside of the rotating rod (131). A scraper (19) is attached to both sides of the heat dissipation fin (132). A guide block (20) is fixed at both ends of the scraper (19). An arc groove (22) is opened on the front and rear sides of the bottom of the semiconductor cooling chip (101) corresponding to the position of the guide block (20). An arc spring (21) is fixed between the top of the inner wall of the arc groove (22) and the guide block (20).

6. A high-power optical module with intelligent temperature control and heat dissipation according to claim 5, characterized in that: One end of the rotating rod (131) passes through the semiconductor cooling chip (101) and is fixed with a gear (133). The gear (133) is externally meshed with a rack (134). The bottom of the rack (134) is attached to a fixed shell (135). The fixed shell (135) is fixed to one side inside the sliding frame (9). A connecting rod (136) is fixedly connected between two adjacent racks (134), and the connecting rod (136) slides through the end of the fixed shell (135).

7. A high-power optical module with intelligent temperature control and heat dissipation according to claim 6, characterized in that: The drive assembly (15) includes a micro motor (151), which is fixedly installed inside the fixed box (16). A rotating roller (152) is fixed on the output shaft of the micro motor (151). Several V-shaped grooves (153) are opened on the outside of the rotating roller (152). Two adjacent V-shaped grooves (153) are connected to each other. Several V-shaped grooves (153) surround the rotating roller (152) around. A sliding column (154) is slidably installed in one of the V-shaped grooves (153). A slider (155) is fixed at the bottom of the sliding column (154). The slider (155) slides inside the fixed box (16). One side of the slider (155) passes through a sliding hole (14) and is fixed to one side of one of the toothed rods (134). A sliding rod (17) slides through the slider (155). The two ends of the sliding rod (17) are fixed to both sides inside the fixed box (16).

8. A high-power optical module with intelligent temperature control and heat dissipation according to claim 1, characterized in that: The limiting component (18) includes a stop (181), a sliding block (182) is slidably connected inside the stop (181), a locking rod (183) is fixed on one side of the sliding block (182), one end of the locking rod (183) passes through the stop (181) and is locked in a locking hole on one side of the inside of the tray (7), a second spring (184) is sleeved on the locking rod (183), both ends of the second spring (184) are fixed to one side of the inner wall of the sliding block (182) and the stop (181), a slide rail (186) is provided in the stop (181) corresponding to the position of the sliding block (182), one side of the sliding block (182) passes through the slide rail (186) and is fixed with a handle (185).

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