Light source module, backlight module and display device

Abstract

The application discloses a light source module, a backlight module and a display device, and relates to the technical field of display. The light source module comprises a plurality of light emitting devices, a plurality of light scattering microstructures and a light-transmitting cover layer. The light scattering microstructures are arranged between the light emitting devices, and each light scattering microstructure comprises a main body and scattering particles distributed in the main body. The main body is composed of a light-transmitting resin. The light-transmitting cover layer covers the surface of each light scattering microstructure. The application can effectively improve the brightness of the backlight, relieve the boundary color deviation problem caused by the light cliff drop, and improve the display quality and visual uniformity.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a light source module, a backlight module, and a display device. Background Technology

[0002] MiniLED (sub-millimeter light-emitting diode) technology typically uses multi-zone controlled LED panels or strips as backlights, along with optical films to provide backlight illumination for LCD panels. Thanks to dynamic zone control technology, MiniLED backlights can independently adjust the brightness of each zone according to the brightness distribution of the displayed image, thereby achieving ultra-high contrast and smooth transitions between light and dark areas. As industry technology continues to advance, increasing the array spacing of light-emitting devices has become a mainstream technological development trend in order to reduce zone control costs and system power consumption.

[0003] However, in small-window or regional display scenarios, only some backlight zones are typically illuminated during the display process, while the rest are completely off. In this case, the boundary of the display area lies precisely at the intersection of the illuminated and off zones. Because the light emitted by the LEDs in the illuminated zones cannot easily cross the boundary area to reach the off zone side horizontally, and the boundary area lacks light energy supply from the off zone, the backlight intensity at the display boundary drops sharply. Insufficient backlight substrate energy directly leads to an imbalance in the spectral energy distribution of the boundary area, resulting in a noticeable yellowish tint in that area, severely impacting the overall display quality and visual experience. Summary of the Invention

[0004] The main purpose of this application is to provide a light source module, a backlight module, and a display device. This application can effectively improve backlight brightness, alleviate the boundary color shift problem caused by the precipitous drop in light, and improve display quality and visual uniformity.

[0005] To achieve the above objectives, this application provides a light source module, the light source module comprising: Multiple light-emitting devices; Multiple light-scattering microstructures are disposed between each of the light-emitting devices. Each light-scattering microstructure includes a main body and scattering particles distributed within the main body. The main body is composed of a light-transmitting resin. A light-transmitting coating layer is applied to the surface of each of the light-scattering microstructures.

[0006] In one embodiment, the light-emitting devices are arranged in a matrix in the light source module, and the light-scattering microstructure is disposed on the line connecting two adjacent light-emitting devices along the row or column direction of the matrix.

[0007] In one embodiment, the lateral dimension of the light-scattering microstructure is negatively correlated with the distance from the light-scattering microstructure to the midpoint of its two adjacent light-emitting devices.

[0008] In one embodiment, the lateral dimension of the light scattering microstructure is 100~500 μm.

[0009] In one embodiment, the roughness of the scattering particles is 8–50 nm.

[0010] In one embodiment, the light source module further includes: A protective layer is disposed around the light-emitting device; The difference between the refractive index of the light-transmitting covering layer and the refractive index of the protective layer is less than or equal to 0.03.

[0011] In one embodiment, the scattering particles include at least one of BaSO4, ZnO, porous gas-phase SiO2, and TiO2.

[0012] In one embodiment, the height of the light-transmitting cover layer is less than or equal to half the height of the light-emitting device.

[0013] In one embodiment, the light source module further includes: A reflective film is disposed on top of the light-emitting device and the light-transmitting cover layer; the reflective film is provided with a first through hole and a second through hole, the first through hole being disposed at the corresponding position of the light-emitting device, and the second through hole being disposed at the corresponding position of the light-scattering microstructure.

[0014] In addition, to achieve the above objectives, this application also proposes a backlight module, which includes the light source module as described above.

[0015] In addition, to achieve the above objectives, this application also proposes a display device, which includes a light source module as described above, or a backlight module as described above.

[0016] One or more technical solutions proposed in this application have at least the following technical effects: A light source module is provided, which forms an optical compensation unit by setting multiple light-scattering microstructures containing scattering particles and a transparent resin body between adjacent light-emitting devices, and cooperating with a transparent covering layer covering the surface of the light-scattering microstructures. This optical compensation unit can convert the ineffective transverse guided light emitted from the side of the light-emitting device, which was originally trapped within the transparent covering layer due to total internal reflection, into an upward-emitting usable surface light source through the strong scattering effect of the scattering particles, thereby breaking the total internal reflection condition and resetting its propagation direction to a small angle that can be emitted, thus achieving secondary recovery and utilization of light energy. When the light-scattering microstructure is located inside the display area, it can effectively improve backlight brightness; when the light-scattering microstructure is located at the boundary of the display area, it can perform directional light compensation in the boundary area, thereby alleviating the boundary color shift problem caused by the abrupt drop in light, and improving display quality and visual uniformity. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a conventional display device; Figure 2 This is a schematic diagram of the partitioned backlight control plane in a non-full-screen display scenario. Figure 3 This is a curve showing the blue light intensity distribution of a screen displayed on a conventional display device. Figure 4 This is a schematic diagram of the structure of the light source module involved in the embodiments of this application. Figure 1 ; Figure 5 This is a process flow diagram of the light scattering microstructure involved in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of the light source module involved in the embodiments of this application. Figure 2 ; Figure 7 This is a schematic diagram of the structure of the light source module involved in the embodiments of this application. Figure 3 ; Figure 8 This is a lateral size distribution curve of the light scattering microstructure involved in the embodiments of this application; Figure 9 This is a schematic diagram of the structure of the display device involved in the embodiments of this application; Figure 10 This is a blue light intensity distribution curve of the display screen in the display device involved in the embodiments of this application.

[0018] Explanation of reference numerals in the attached figures 10. Light source module; 11. Light-emitting device; 12. Illuminated area; 13. Unlit area; 14. PCB board; 15. Light scattering microstructure; 16. Light-transmitting cover layer; 17. Protective layer; 18. Reflective film; 20. Liquid crystal panel; 21. Display area; 22. Screen boundary area; 23. Back panel; 31. White oil layer; 32. Mold.

[0019] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0021] The following detailed description, with appropriate reference to the accompanying drawings, specifically discloses embodiments of the light source module, backlight module, and display device of this application. However, unnecessary detailed descriptions may be omitted. For example, detailed descriptions of well-known matters and repetitive descriptions of essentially the same structures may be omitted. This is to avoid unnecessarily lengthy descriptions and to facilitate understanding by those skilled in the art. Furthermore, the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand this application and are not intended to limit the subject matter of the claims.

[0022] The "range" disclosed in this application is defined by a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, which define the boundaries of a particular range. Ranges defined in this way can include or exclude endpoints and can be arbitrarily combined; that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60~120 and 80~110 are listed for a specific parameter, it is also expected that ranges of 60~110 and 80~120 are also included. Furthermore, if minimum range values ​​of 1 and 2 are listed, and if maximum range values ​​of 3, 4, and 5 are listed, then the following ranges are all expected: 1~3, 1~4, 1~5, 2~3, 2~4, and 2~5. In this application, unless otherwise stated, the numerical range "a~b" represents a shortened representation of any combination of real numbers between a and b, where a and b are real numbers. For example, the numerical range "0~5" indicates that all real numbers between "0~5" have been listed in this article; "0~5" is simply a shortened representation of these numerical combinations. Furthermore, when a parameter is stated as an integer ≥2, it is equivalent to disclosing that the parameter is, for example, an integer such as 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0023] Unless otherwise specified, all embodiments and optional embodiments of this application can be combined to form new technical solutions.

[0024] Unless otherwise specified, all steps of this application may be performed sequentially or randomly, preferably sequentially. For example, if the method includes steps (a) and (b), it means that the method may include steps (a) and (b) performed sequentially, or it may include steps (b) and (a) performed sequentially. For example, if the method may also include step (c), it means that step (c) may be added to the method in any order. For example, the method may include steps (a), (b), and (c), or it may include steps (a), (c), and (b), or it may include steps (c), (a), and (b), etc.

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the technical solution of this application is further described below in conjunction with the accompanying drawings and embodiments. However, this application is not limited to the listed embodiments, but should also include any other well-known modifications within the scope of the claims made in this application.

[0026] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0027] In the field of display technology, refer to Figure 1 The array of light-emitting devices 11 (e.g., MiniLED blue light chips) on the light panel or light strip adopts a multi-zone control architecture. When the display scene is not a full-screen image, the system precisely controls the backlight according to a logic algorithm, so that the area of ​​the light source module 10 corresponding to the screen display area 21 of the LCD panel 20 is the lit area 12, and the non-screen display area corresponds to the off area 13, thus optimizing the viewing experience through the significant difference between the bright and dark areas. (Refer to...) Figure 2 In a specific scenario, the illuminated area 12 corresponding to the display area 21 can normally emit light (taking blue light as an example). This light can excite the quantum dot material in this area to generate red and green light, which mixes into pure white light, providing a stable backlight for the display. However, the light supply to the image boundary area 22 has a structural defect. It can only receive unidirectional light radiation from the illuminated area 12, while the non-display area has no light supply at all because the lights are off, resulting in a precipitous drop in blue light intensity from the display area 21 to the image boundary area 22. Figure 3 As shown in the blue light intensity distribution curve, the horizontal axis represents the spatial position from one side of the screen boundary area 22 through the center of the screen to the other side of the screen boundary area 22, and the vertical axis corresponds to the relative value of the blue light intensity. Within the illuminated area 12 corresponding to the screen display area 21 (i.e., Figure 3During the plateau segment of the curve, the blue light intensity remains at a high and stable level, providing sufficient excitation energy for the quantum dot materials. However, as the position moves towards the edge area 22 of the screen, the lack of additional blue light supplementation due to the blackout of the non-display area means that only unidirectional radiation from the lit area can be relied upon. Consequently, the blue light intensity rapidly decays, forming a noticeable intensity trough at the screen edge. This precipitous drop in blue light intensity from the lit area to the edge results in insufficient excitation of the quantum dots in the edge area 22, ultimately presenting an abnormal dark yellow color and severely damaging the uniformity and visual consistency of the image quality.

[0028] Based on this, the first aspect of the embodiments of this application provides a light source module 10, referring to... Figure 4 The light source module 10 includes: Multiple light-emitting devices 11; Multiple light-scattering microstructures 15 are disposed between each light-emitting device 11. Each light-scattering microstructure 15 includes a main body and scattering particles distributed within the main body. The main body is composed of a light-transmitting resin. A light-transmitting coating layer 16 covers the surface of each light-scattering microstructure 15.

[0029] Optionally, the light-emitting device 11 includes at least one of LED and miniLED.

[0030] Optionally, the light-emitting device 11 can be a blue light chip (B-Chip).

[0031] Optionally, the light-emitting devices 11 can be arranged in an array on the PCB board 14 (printed circuit board), and the design of the array spacing is related to the mixing distance (OD) of the backlight module.

[0032] Optionally, the array spacing of the light-emitting device 11 can be set to 1.5 to 3 times the mixing distance OD. For example, when the design value of the mixing distance OD is 20 mm, the array spacing of the light-emitting device 11 can be set to 30 to 60 mm, for example, 45 mm or 50 mm can be used as typical design values ​​to achieve a good balance between mixing uniformity and zone control accuracy.

[0033] Optionally, the light-emitting device 11 can be soldered onto the corresponding pad of the PCB board 14 using a surface mount process, with its light-emitting surface facing away from the PCB board 14, so that the blue light it emits is emitted upward to provide a basic light source for backlight illumination.

[0034] Optionally, the light source module 10 includes: a plurality of light-emitting devices 11 and an optical compensation unit; the optical compensation unit is disposed between each light-emitting device 11, and includes a plurality of light-scattering microstructures 15 and a light-transmitting cover layer 16 disposed on the top of the light-scattering microstructures 15. The light-scattering microstructures 15 include a main body and scattering particles distributed in the main body, and the main body is composed of light-transmitting resin.

[0035] In this embodiment, a light source module 10 is provided. An optical compensation unit is formed by setting multiple light-scattering microstructures 15, each containing scattering particles and a transparent resin body, between adjacent light-emitting devices 11, and cooperating with a transparent covering layer 16 covering the surface of the light-scattering microstructures 15. This optical compensation unit can convert the ineffective transverse guided light emitted from the side of the light-emitting device 11, which was originally trapped within the transparent covering layer 16 due to total internal reflection, into an upward-emitting usable surface light source through the strong scattering effect of the scattering particles, thus restoring its propagation direction to a small angle suitable for emission. This achieves secondary recovery and utilization of light energy. When the light-scattering microstructure 15 is located inside the display area, it can effectively improve backlight brightness; when the light-scattering microstructure 15 is located at the boundary of the display area, it can provide directional light compensation for the boundary area, thereby alleviating the boundary color shift problem caused by the abrupt drop in light intensity and improving display quality and visual uniformity.

[0036] In one feasible implementation, refer to Figure 4 The light source module 10 also includes: A protective layer 17 is disposed around the light-emitting device 11; The difference between the refractive index of the light-transmitting cover layer 16 and the refractive index of the protective layer 17 is less than or equal to 0.03.

[0037] In one feasible embodiment, a protective layer 17 is provided around the light-emitting device 11, which completely covers the light-emitting surface and sides of the light-emitting device 11, and is used to protect the light-emitting device 11 and its internal gold wires from mechanical stress and environmental corrosion.

[0038] Optionally, the material of the protective layer 17 is selected from encapsulation materials with high light transmittance, appropriate flexibility, and good heat resistance. The refractive index of the material of the protective layer 17 is matched with the refractive index of the material of the light-emitting device 11 (e.g., a refractive index of 1.41 to 1.55) to ensure that the interface reflection loss of light emanating from the light-emitting device 11 to the protective layer 17 is minimized.

[0039] Optionally, the material of the protective layer 17 includes at least one of silicone, transparent epoxy resin, and silicone-epoxy hybrid resin.

[0040] For example, the light-emitting device 11 is a blue light chip, which is wrapped with a protective layer 17 by silicone dispensing. The protective layer 17 is hemispherical with a height of 0.3~0.5mm and a bottom diameter of 1.5~2.0mm.

[0041] Optionally, a light-transmitting capping layer 16 covers the surface of the light-scattering microstructure 15, and is used to work in conjunction with the light-scattering microstructure 15 to confine and extract the transverse guided wave light. In order to reduce the interface reflection loss when light enters the light-transmitting capping layer 16 from the protective layer 17 above the light-emitting device 11, and to ensure the efficient transmission of transverse guided wave light energy, the difference Δn between the refractive index of the light-transmitting capping layer 16 and the refractive index of the protective layer 17 is ≤0.03.

[0042] Optionally, the material of the light-transmitting cover layer 16 includes at least one of silicone, transparent epoxy resin, silicone-epoxy hybrid resin and transparent acrylic resin.

[0043] Optionally, the light-transmitting cover layer 16 and the protective layer 17 are made of the same material, so that the light-transmitting cover layer 16 and the protective layer 17 can be integrally formed.

[0044] Alternatively, the materials of the light-transmitting cover layer 16 and the protective layer 17 may be different.

[0045] In this embodiment, when the difference Δn between the refractive index of the light-transmitting cover layer 16 and the refractive index of the protective layer 17 is ≤0.03, the interface reflection loss is small. This means that after light is emitted from the light-emitting device 11, it passes through the protective layer 17 and enters the light-transmitting cover layer 16, and the light energy is retained to the maximum extent. The laterally propagating blue light can be uniformly diffused to the boundary area far away from the light-emitting device 11, providing sufficient light energy supply for the light-scattering microstructure 15. Conversely, if the refractive index difference between the light-transmitting cover layer 16 and the protective layer 17 is too large, the interface reflection loss increases significantly. Some light is reflected back into the protective layer 17 or scattered in a non-target direction at the interface, which not only reduces the light energy utilization rate but may also lead to insufficient lateral guided wave light energy available in the area far away from the light-emitting device 11, weakening the compensation effect of the light-scattering microstructure 15 and thus affecting the degree of improvement of the boundary yellowing problem.

[0046] In one feasible embodiment, the height of the light-transmitting cover layer 16 is less than or equal to half the height of the light-emitting device 11.

[0047] In this embodiment, the height of the light-transmitting cover layer 16 is less than or equal to half the height of the light-emitting device 11. This allows the light-scattering microstructure 15 to be located within the main transverse waveguide channel of the side-emitted light from the light-emitting device 11, enabling it to capture and extract transversely propagating light energy with maximum efficiency. Simultaneously, the light-transmitting cover layer 16 is always located below the light-emitting surface of the light-emitting device 11, avoiding obstruction and interference with the main emitted light path and ensuring that the backlight brightness in the main emission direction is unaffected. Furthermore, it shortens the transmission path of the main emitted light within the cover layer material, reducing light absorption loss.

[0048] In one feasible embodiment, the roughness of the scattering particles is 8–50 nm. For example, the roughness of the scattering particles is 8 nm, 9 nm, 10 nm, 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm, 50 nm, etc.

[0049] Optionally, the roughness of the scattering particles refers to the nanoscale unevenness of the particle surface, which can be characterized by the arithmetic mean roughness Ra of a single particle surface measured using atomic frequency microscopy (AFM). A higher Ra value indicates stronger diffuse scattering at the particle-transparent resin interface, resulting in greater damage to the total internal reflection of blue light within the silicone layer. The formula for calculating roughness Ra is as follows: ; Where L represents the sampling scan length of a single particle surface, and Z(x) represents the height deviation of any position on the particle surface relative to the reference centerline.

[0050] In this embodiment, when the surface roughness Ra of the scattering particles is in the range of 8–50 nm, the particle surface has an appropriate micro-undulation morphology. This morphology can effectively diffuse the transverse guided light incident on the particle surface, causing the light to undergo multiple random reflections and refractions on the particle surface, thereby significantly changing the propagation direction of the light. At the same time, this roughness range ensures sufficient scattering intensity to break the total internal reflection condition and allow the confined light to exit from the top of the light-transmitting cover layer 16, while avoiding severe backscattering or light energy absorption loss due to excessive roughness. Thus, the transverse guided light entering the light-transmitting cover layer 16 can be efficiently extracted and converted into effective upward-emitting light energy, achieving light energy compensation for the image boundary region 22 and improving the boundary color shift problem caused by the precipitous drop in light energy.

[0051] In one feasible embodiment, the scattering particles include at least one of BaSO4, ZnO, porous gas phase SiO2, and TiO2.

[0052] Optionally, the Ra values ​​of BaSO4 are 8–32 nm, those of ZnO are 10–45 nm, those of porous gas-phase SiO2 are 11–42 nm, and those of TiO2 are 12–40 nm.

[0053] For example, refer to Figure 5 The light scattering microstructure 15 can be formed by pressing a white oil layer 31 on the surface of a PCB board 14 with a mold 32. The white oil layer 31 includes an epoxy resin main body and TiO2 scattering particles dispersed in the epoxy resin main body. Before pressing, the white oil layer 31 is in the form of a semi-fluid dynamic ink. After being pressed onto the surface of the PCB board 14 by a mold 32 with a predetermined microstructure cavity, it is cured by heating to form a three-dimensional microstructure consistent with the shape of the cavity of the mold 32.

[0054] In one feasible implementation, refer to Figure 6 The light-emitting devices 11 are arranged in a matrix in the light source module 10, and the light scattering microstructures 15 are disposed on the line connecting two adjacent light-emitting devices 11 along the row or column direction of the matrix.

[0055] Optionally, matrix arrangement refers to the regular grid-like distribution of multiple light-emitting devices 11 in a plane parallel to the surface of the PCB board 14, along a first orthogonal direction (row direction) and a second orthogonal direction (column direction).

[0056] Optionally, in the row direction, the spacing between any two adjacent light-emitting devices 11 is equal; in the column direction, the spacing between any two adjacent light-emitting devices 11 is also equal, thereby forming multiple rectangular grid units, with a light-emitting device 11 disposed at each of the four vertices of each grid unit.

[0057] Optionally, based on the matrix arrangement of the light-emitting devices 11, a plurality of light-scattering microstructures 15 are disposed on the line connecting two adjacent light-emitting devices 11 along the row direction (i.e., the horizontal direction) and on the line connecting two adjacent light-emitting devices 11 along the column direction (i.e., the vertical direction).

[0058] In this embodiment, in the matrix-arranged array of light-emitting devices 11, the row and column directions are the directions with the shortest distance between adjacent light-emitting devices 11, and also the directions with the most concentrated transverse guided wave light energy transmission. When the light emitted by the light-emitting devices 11 propagates laterally along the row and column directions within the cover layer, it can reach the line connecting adjacent light-emitting devices 11 with the shortest path. Setting the light-scattering microstructure 15 at this location can capture transverse guided wave light energy to the maximum extent, achieving efficient light extraction and boundary compensation. At the same time, the light-scattering microstructures 15 in the row and column directions form a regular grid-like compensation network, which is uniformly distributed along the row and column directions. This also ensures that the backlight compensation effect of the liquid crystal panel 20 is consistent in the horizontal and vertical directions, avoiding local bright spots or dark areas caused by uneven distribution of compensation points, and ensuring backlight uniformity.

[0059] Optionally, the light scattering microstructure 15 can adopt a variety of three-dimensional geometries. For example, the longitudinal cross-sectional shape of the light scattering microstructure 15 can be selected from at least one of hemispherical, pyramidal, prismal, trapezoidal or arbitrary irregular curved surface.

[0060] For example, when a hemispherical shape is used, the light scattering microstructure 15 presents as a convex structure with a circular bottom and a spherical top; when a pyramidal shape is used, it presents as a pointed cone structure with a polygonal bottom and a top converging at a point; when a prism shape is used, it presents as a columnar structure with polygonal bottom and top connected by sidewalls; when a trapezoidal shape is used, it presents as a truncated cone structure with a bottom dimension larger than a top dimension. The light scattering microstructures 15 of different shapes can all be integrally formed on the PCB surface using a molding process 32.

[0061] It should be noted that the above-mentioned shapes are merely illustrative examples of this application, and those skilled in the art can select any suitable three-dimensional shape according to actual process conditions and optical design requirements.

[0062] In one feasible embodiment, the lateral dimension of the light scattering microstructure 15 is negatively correlated with the distance from the light scattering microstructure 15 to the midpoint of its two adjacent light-emitting devices 11. That is, the closer the light scattering microstructure 15 is to the midpoint, the larger its lateral dimension; conversely, the farther the light scattering microstructure 15 is from the midpoint (i.e., the closer it is to a certain light-emitting device 11), the smaller its lateral dimension.

[0063] Optionally, the lateral dimension of the light scattering microstructure 15 refers to the maximum span of the light scattering microstructure 15 in a direction parallel to the PCB board 14. The lateral dimension determines the cross-sectional area of ​​the interaction between the scattering microstructure and the laterally propagating light.

[0064] Optionally, for the hemispherical light scattering microstructure 15, the lateral dimension is the diameter of the hemispherical bottom surface.

[0065] Optionally, refer to Figure 7 A rectangular coordinate system was established with the midpoint O of the line connecting the centers of two adjacent light-emitting devices 11 as the origin. The horizontal axis X represents the horizontal distance from the light-scattering microstructure 15 to the midpoint O of its two adjacent light-emitting devices 11, used to define the relative position of the light-scattering microstructure 15 on the PCB board 14; the vertical axis Y represents the lateral dimension of the light-scattering microstructure 15 itself. (Refer to...) Figure 8 The graph shows the lateral size distribution of the light scattering microstructure 15. The lateral size of the microstructure is the largest at the midpoint O, and its size gradually decreases as it extends towards the light-emitting devices 11 on both sides.

[0066] Optionally, the lateral dimensions of the light scattering microstructure 15 between two adjacent light-emitting devices 11 are uniformly and gradually varied, arranged in a Gaussian curve.

[0067] In one feasible embodiment, the lateral dimension of the light scattering microstructure 15 is 100~500 μm. For example, the lateral dimension of the light scattering microstructure 15 is 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, etc.

[0068] In this embodiment, the scattering intensity of the light-scattering microstructure 15 is positively correlated with its lateral size; that is, the larger the lateral size, the larger the surface area of ​​the light-scattering microstructure 15, the larger the cross-sectional area of ​​its interaction with the lateral guided wave light, the stronger the local scattering intensity, and the stronger its ability to disrupt the total internal reflection condition. Therefore, the light-scattering microstructure 15 located in the middle region of the line connecting adjacent light-emitting devices 11 has the greatest scattering capability. This location is precisely the region farthest from the two light-emitting devices 11, and also the region where the lateral guided wave light attenuates most severely and has the lowest light energy density after long-distance transmission, requiring the most strong scattering. The region closer to the light-emitting device 11 itself has sufficient blue light energy, and the lateral guided wave light has not yet undergone significant attenuation; therefore, a smaller microstructure is sufficient to meet the scattering requirements. Therefore, this embodiment of the application achieves precise matching between the spatial distribution of scattering intensity and the spatial distribution of guided wave light energy by establishing a negative correlation between the size that is closer to the midpoint and the size that is larger. The strongest scattering is set in the region with the weakest light energy and the weakest scattering is set in the region with the strongest light energy, thereby achieving the optimal light energy extraction and boundary compensation effect with the least amount of structural material. This avoids the double waste of insufficient extraction in the weak light region by small-sized microstructures and excessive scattering in the strong light region by large-sized microstructures.

[0069] In one feasible embodiment, the light source module 10 further includes: A reflective film 18 is disposed on top of the light-emitting device 11 and the light-transmitting cover layer 16. The reflective film 18 is provided with a first through hole and a second through hole. The first through hole is disposed at the corresponding position of the light-emitting device 11, and the second through hole is disposed at the corresponding position of the light-scattering microstructure 15, so that the reflective film 18, while covering the upper surface of the light-transmitting cover layer 16, forms a structural avoidance of the positions where the light-emitting device 11 and the light-scattering microstructure 15 are located.

[0070] In this embodiment, the reflective film 18 in the light source module 10 can reflect the escape light emitted at a large angle from the top of the light-transmitting cover layer 16 back to the light-emitting direction, thereby improving the secondary utilization rate of light energy. The setting of the first through hole and the second through hole can ensure that the main light path of the light-emitting device 11 and the scattering light path of the light scattering microstructure 15 are not blocked, thus realizing that the main light path is unobstructed and the stray light recovery does not interfere with each other.

[0071] A second aspect of this application provides a backlight module, which includes the light source module 10 as described above.

[0072] Optionally, refer to Figure 9 The backlight module includes: The back plate 23 is the basic support structure of the entire backlight module. It can be bent in an F-shape to form an accommodating space for installing other components in the backlight module. The back plate 23 can provide mechanical support and protect the internal components in the backlight module. The light source module 10 described in the above embodiment is disposed at the bottom of the accommodating space formed by the back plate 23, providing the necessary light source for the backlight module; The reflective film 18 is located on the inner side of the back plate 23 and on top of the light-emitting device 11 and the light-transmitting cover layer 16 in the light source module 10. It is used to reflect the light inside the backlight module back and improve the light utilization efficiency.

[0073] Optionally, the backlight module may also include: a diffuser plate (not shown in the figure), located on the light-emitting side of the light source module 10, which is used to homogenize the light, make the light softer and more uniform, and reduce light spots and shadows; an optical functional film (not shown in the figure), located on the light-emitting side of the diffuser plate; the optical functional film may include: a brightness enhancement film, a prism sheet, etc., used to enhance the brightness of the light and improve the display effect.

[0074] The beneficial effects of the backlight module provided in this application embodiment are the same as those of the light source module 10 provided in the above embodiment, and other technical features in the backlight module are the same as those disclosed in the method of the above embodiment, and will not be repeated here.

[0075] A third aspect of this application provides a display device, which includes a light source module 10 as described above, or a backlight module as described above.

[0076] Optionally, the display device includes a backlight module and an LCD panel 20.

[0077] Optionally, the LCD panel 20 is located on the light-emitting side of the optical functional film in the backlight module and is the final display part of the display device, used to display images and text.

[0078] Optionally, refer to Figure 9 When the display scene is not full-screen, the system precisely controls the backlight according to a logic algorithm, so that the area of ​​the display area 21 of the LCD panel 20 corresponding to the light source module 10 is the lit area 12, and the non-display area 21 corresponds to the off area 13. The viewing experience is optimized through the significant difference between the bright and dark areas. By setting the light source module 10 as described in the above embodiment in the backlight module, a small portion of the light in the display area 21 is transmitted to the screen boundary area 22, so that the blue light distribution from the display area 21 to the screen boundary area 22 presents a gradual decrease (e.g., Figure 10 As shown in the image, the brightness gradually dims at the edge of the screen, which alleviates the color shift problem at the edge caused by the sharp drop in light and improves the display quality and visual uniformity.

[0079] The beneficial effects of the display device provided in this application embodiment are the same as those of the light source module 10 provided in the above embodiment, and other technical features in the display device are the same as those disclosed in the method of the above embodiment, and will not be repeated here.

[0080] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the patent protection scope of this application.

Claims

1. A light source module, characterized in that, The light source module includes: Multiple light-emitting devices; Multiple light-scattering microstructures are disposed between each of the light-emitting devices. Each light-scattering microstructure includes a main body and scattering particles distributed within the main body. The main body is composed of a light-transmitting resin. A light-transmitting coating layer is applied to the surface of each of the light-scattering microstructures.

2. The light source module as described in claim 1, characterized in that, The light-emitting devices are arranged in a matrix in the light source module, and the light-scattering microstructure is disposed on the line connecting two adjacent light-emitting devices along the row or column direction of the matrix.

3. The light source module as described in claim 1, characterized in that, The lateral dimension of the light-scattering microstructure is negatively correlated with the distance from the light-scattering microstructure to the midpoint of its two adjacent light-emitting devices.

4. The light source module as described in claim 1 or 3, characterized in that, The lateral dimensions of the light-scattering microstructure are 100~500 μm.

5. The light source module as described in claim 1, characterized in that, The roughness of the scattering particles is 8–50 nm.

6. The light source module as described in claim 1, characterized in that, The light source module also includes: A protective layer is disposed around the light-emitting device; The difference between the refractive index of the light-transmitting covering layer and the refractive index of the protective layer is less than or equal to 0.

03.

7. The light source module as described in claim 1, characterized in that, The scattering particles include at least one of BaSO4, ZnO, porous gas phase SiO2, and TiO2.

8. The light source module as described in claim 1, characterized in that, The height of the light-transmitting cover layer is less than or equal to 1 / 2 of the height of the light-emitting device.

9. The light source module as described in claim 1, characterized in that, The light source module also includes: A reflective film is disposed on top of the light-emitting device and the light-transmitting cover layer; the reflective film is provided with a first through hole and a second through hole, the first through hole being disposed at the corresponding position of the light-emitting device, and the second through hole being disposed at the corresponding position of the light-scattering microstructure.

10. A backlight module, characterized in that, The backlight module includes a light source module as described in any one of claims 1 to 9.

11. A display device, characterized in that, The display device includes a light source module as described in any one of claims 1 to 9, or a backlight module as described in claim 9.

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