Semiconductor shunt pipeline flow balance system and method based on temperature and pressure double parameters

Abstract

The application provides a semiconductor shunt pipeline flow balance system and method based on temperature and pressure double parameters, which comprises a liquid inlet main pipeline and at least two liquid outlet branches. Each liquid outlet branch is respectively provided with a temperature detection member to detect the fluid temperature of the corresponding liquid outlet branch. Each liquid outlet branch is respectively provided with a pressure detection member to detect the fluid pressure of the corresponding liquid outlet branch. Each liquid outlet branch is respectively provided with an adjusting member to adjust the flow resistance of the corresponding liquid outlet branch. Each temperature detection member, each pressure detection member and each adjusting member are in communication connection with a control unit. The control unit is configured to cross compare the temperature signal and the pressure signal of each liquid outlet branch to calculate the flow deviation between the liquid outlet branches, control the adjusting member to adjust the flow resistance of the corresponding liquid outlet branch according to the flow deviation, and form a closed loop flow balance control. The application automatically detects and adjusts, does not need manual detection and valve adjustment, reduces the downtime maintenance time, improves the machine operation rate, and improves the flow judgment accuracy.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor shunt pipeline flow balancing system and method based on temperature and pressure dual parameters. Background Technology

[0002] In semiconductor wafer wet cleaning, wet etching, coating, and developing processes, it is necessary to simultaneously supply equal amounts of high-purity chemicals to both sides of the cleaning machine via a liquid supply pipeline to ensure that the wafer processing on both sides is completely consistent. Currently, the mainstream liquid supply pipeline solution in the industry is to use a 1-inch PFA main pipeline to uniformly deliver the chemicals, and then use an integrated tee connector to evenly distribute the flow into two identical 3 / 4-inch PFA branches with mirrored layouts. Theoretically, the resistance of the two mirrored branches should be completely identical, and the outflow rates should be completely equal. However, the actual resistance of the mirrored pipeline cannot be completely identical, resulting in inherent uneven flow distribution. Even if the two PFA pipelines are perfectly mirrored in size and layout, the inherent friction resistance and local resistance of the two branches will always deviate due to factors such as the wall thickness tolerance of the PFA pipe extrusion process, the coaxiality error of the tee connector assembly, the bending deformation during pipeline installation, and the difference in clamp tightness. This naturally leads to flow deviations after the tee splits the flow, making it impossible to achieve self-balancing through structural symmetry.

[0003] Current flow balance adjustment methods typically involve manual back pressure regulation. Maintenance personnel periodically use external flow meters to measure the flow rates of the two branches, manually rotating the back pressure valve knob at the end to change the pipeline back pressure resistance and manually calibrate the flow rates of the two branches to maintain consistency. However, manual calibration is unreliable, and flow drift occurs repeatedly: after a single manual calibration, with long-term operation, the PFA pipeline slowly ages and deforms, slight impurities in the solution adhere to the pipe wall causing changes in roughness, and environmental temperature fluctuations affect the viscosity of the solution. This causes the resistance of the two pipelines to continuously differ, and the originally calibrated flow rates will quickly shift again, requiring frequent shutdowns for manual re-inspection and adjustment, significantly consuming equipment operating time.

[0004] In view of this, it is necessary to propose a semiconductor shunt pipeline flow balancing system and method based on temperature and pressure dual parameters to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor shunt pipeline flow balancing system and method based on temperature and pressure dual parameters, in order to improve the problems of low efficiency, low accuracy of flow judgment, and impact on production time in existing manual pipeline flow balancing.

[0006] This invention provides a semiconductor shunt pipeline flow balancing system based on temperature and pressure dual parameters, comprising: a main inlet pipeline; at least two outlet branches connected to the main inlet pipeline via shunt components; each outlet branch is equipped with a temperature sensor to detect the fluid temperature of the corresponding outlet branch; each outlet branch is equipped with a pressure sensor to detect the fluid pressure of the corresponding outlet branch; each outlet branch is equipped with an adjustment component to adjust the flow resistance of the corresponding outlet branch; each temperature sensor, each pressure sensor, and each adjustment component is communicatively connected to a control unit, which is configured to perform dual-parameter cross-comparison of the temperature and pressure signals of each outlet branch to calculate the flow deviation between the outlet branches, and control the adjustment component to adjust the flow resistance of the corresponding outlet branch according to the flow deviation, thereby forming a closed-loop flow balancing control.

[0007] The beneficial effects of the semiconductor diversion pipeline flow balancing system based on temperature and pressure dual parameters provided by this invention are as follows: the system provides real-time monitoring and automatic micro-compensation adjustment, eliminating the need for periodic manual on-site inspections and valve adjustments, thus reducing equipment downtime for maintenance and improving machine uptime. This invention utilizes two inherent fluid physical characteristics during fluid flow: the velocity-temperature coupling relationship and the flow rate-pipeline pressure loss coupling relationship. The control unit achieves dual-parameter cross-validation and mutual error correction by comprehensively comparing signals from both temperature and pressure dimensions, significantly improving the accuracy of flow rate judgment and avoiding erroneous adjustments.

[0008] In one possible embodiment, the temperature sensor is non-contactly disposed on the outer wall of the liquid outlet branch; and / or, the temperature sensor is disposed close to the diverter.

[0009] Its advantages are as follows: non-contact installation avoids direct contact between the temperature sensor and the fluid, eliminating the risk of metal ion release and particulate contamination at the source. Placing the temperature sensor close to the flow split point can capture temperature changes caused by the initial flow rate difference to the greatest extent, resulting in a highly sensitive response.

[0010] In one possible embodiment, the pressure sensing element is a built-in corrosion-resistant pressure sensor; and / or, the pressure sensing element is disposed away from the shunt element.

[0011] Its advantages are as follows: the built-in corrosion-resistant pressure sensor can withstand long-term immersion corrosion in high-purity chemical solutions, meeting the stringent chemical environment requirements of semiconductor wet processes. By placing the pressure sensor at the far end of the branch, the measured pressure signal is the integral result of all friction losses and local resistance losses along the entire branch, comprehensively reflecting the overall impedance of the pipeline. In one possible embodiment, the regulating element is a back pressure valve; and / or, the regulating element is located at the end of the liquid outlet branch.

[0012] Its beneficial effect is that the flow resistance of the branch can be precisely adjusted by changing the valve opening. By placing the regulating element at the end of the branch, the resulting flow field disturbance is minimized.

[0013] The present invention also provides a method for regulating the flow balance of a semiconductor shunt pipeline based on temperature and pressure dual parameters, employing a semiconductor shunt pipeline flow balance system based on temperature and pressure dual parameters as described in any of the above embodiments, wherein the regulation method includes: S11: The temperature detection element collects temperature signals in real time and transmits them to the control unit; the pressure detection element collects pressure signals in real time and transmits them to the control unit. S12: The control unit performs a two-parameter cross-comparison based on the temperature and pressure signals of each liquid outlet branch to calculate the flow deviation between each liquid outlet branch; S13: The control unit controls the regulating element to adjust the flow resistance of the corresponding liquid outlet branch according to the flow deviation, so as to reduce the flow deviation; S14: Repeat steps S11 to S13 to continuously and automatically balance the flow rate of each of the liquid outlet branches. In one possible embodiment, step S13 specifically includes: When the real-time temperature difference between the liquid outlet branches exceeds the first temperature difference threshold or the real-time pressure difference between the liquid outlet branches exceeds the first pressure difference threshold, the control unit controls and locks the current opening of each of the regulating components, stops the adjustment, and triggers an alarm. When the real-time temperature difference between the liquid outlet branches exceeds the second temperature difference threshold but does not exceed the first temperature difference threshold, or when the real-time pressure difference between the liquid outlet branches exceeds the second pressure difference threshold but does not exceed the first pressure difference threshold, the control unit controls and adjusts the opening of the adjusting element, thereby adjusting the flow resistance of the corresponding liquid outlet branch. Wherein, the first temperature difference threshold is greater than the second temperature difference threshold, and the first pressure difference threshold is greater than the second pressure difference threshold.

[0014] Its beneficial effect lies in dividing the system response strategy into three regions by setting two threshold levels. The first temperature difference threshold and the first pressure difference threshold are protection lockout thresholds, used to define severe abnormal operating conditions that require triggering hard protection; the second temperature difference threshold and the second pressure difference threshold are activation adjustment thresholds, used to define ordinary deviation operating conditions that require fine-tuning correction. When the temperature difference or pressure difference is lower than the second threshold, the system is in an inertial dead zone, maintaining the valve status and avoiding frequent operation.

[0015] In one possible embodiment, the amplitude of a single adjustment of the adjusting element does not exceed 0.5% of the total opening of the adjusting element. The advantage is that by limiting the amplitude of a single adjustment and using a gradual, small-step adjustment, even if the cumulative deviation is large, the equilibrium point can be gradually approached through multiple small adjustments, avoiding water hammer impact and disturbance to the hydraulic pressure supplied to the process chamber caused by a single large-amplitude adjustment.

[0016] In one possible embodiment, when the real-time temperature difference value deviates N times consecutively and exceeds the first temperature difference threshold, or when the real-time pressure difference value deviates N times consecutively and exceeds the first pressure difference threshold, the opening degree of the corresponding regulating element is locked, and subsequent compensation adjustment is terminated, where N is a positive integer greater than 2.

[0017] Its beneficial effects are as follows: by introducing the judgment condition of multiple consecutive over-limits, it can effectively distinguish between instantaneous spike interference and continuous serious faults, avoid permanent lockout triggered by a single abnormal fluctuation, and ensure reliable execution of safety protection when a serious fault does exist.

[0018] In one possible embodiment, after performing an adjustment action, a preset duration is locked and the judgment and adjustment actions are stopped.

[0019] Its beneficial effect is that by adjusting and forcing a delay, the flow field in the pipeline is allowed to return to a steady state before the next round of sampling and judgment is carried out, thus preventing the collection of distorted dynamic data during the flow field transition process and thus preventing secondary erroneous adjustments.

[0020] In one possible embodiment, when the number of liquid outlet branches is greater than 2, one of them is used as the reference branch, and the temperature difference and pressure difference of the remaining branches are compared with the reference branch to adjust the flow rate of the remaining branches and achieve flow balance of all the liquid outlet branches.

[0021] Its beneficial effects are: by using a benchmark following strategy, the dual-branch balancing logic can be extended to a multi-branch system to meet the needs of multi-station synchronous liquid supply for different machines. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the semiconductor shunt pipeline flow balancing system based on temperature and pressure parameters according to the present invention.

[0023] Figure 2 This is a flowchart of the semiconductor shunt pipeline flow balance adjustment method based on temperature and pressure dual parameters according to the present invention.

[0024] Figure 3 This is a flowchart of an example of the semiconductor shunt pipeline flow balance regulation method based on temperature and pressure dual parameters of the present invention.

[0025] Explanation of reference numerals in the attached diagram: 21. Main inlet pipe; 22. Flow divider; 23. Outlet branch pipe; 24. Temperature sensor; 25. Pressure sensor; 26. Regulator; 27. Control unit; 28. Process chamber. Detailed Implementation To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] To address the problems existing in the prior art, embodiments of the present invention provide a semiconductor shunt pipeline flow balancing system based on temperature and pressure dual parameters. Please refer to [link to relevant documentation]. Figure 1 The flow balancing system includes a main inlet pipe 21 and at least two outlet branches 23 connected to the main inlet pipe 21 via a diverter 22. Two outlet branches 23 are shown as an example in the figure. In this case, the diverter 22 can be a tee connector, but the number of outlet branches 23 is not limited to this. The outlet branches 23 are connected to the process chamber 28.

[0027] Please see Figure 1 Each outlet branch 23 is equipped with a temperature sensor 24 to detect the fluid temperature of the corresponding outlet branch 23. The temperature sensor 24 is positioned close to the flow divider 22 to sensitively capture the initial flow rate difference during the flow division. In some embodiments, the temperature sensor 24 is installed on the outer wall of the outlet branch 23 in a non-contact manner to avoid direct contact between the temperature sensor 24 and the liquid, thus preventing contamination. The temperature sensor 24 is not specifically limited here and can be flexibly configured according to process requirements, such as using a thermocouple, thermistor, or infrared temperature probe.

[0028] Please see Figure 1 Each outlet branch 23 is equipped with a pressure sensor 25 to detect the fluid pressure in the corresponding outlet branch 23. The pressure sensor 25 is located away from the diverter 22, at the far end of the outlet branch 23. Specifically, the pressure sensor 25 is a built-in corrosion-resistant pressure sensor that can withstand long-term immersion corrosion from high-purity chemical liquids.

[0029] Please see Figure 1 Each outlet branch 23 is equipped with an adjusting element 26 to adjust the flow resistance of the corresponding outlet branch 23. The adjusting element 26 is located at the end of the outlet branch 23. In one example, the adjusting element 26 is a back pressure valve, which changes the local resistance of the outlet branch 23 by changing the valve opening, thereby adjusting the flow distribution ratio of the outlet branch 23. Of course, the adjusting element 26 can also be an electric needle valve or an electric regulating diaphragm valve.

[0030] Please see Figure 1 Each temperature sensor 24, each pressure sensor 25, and each regulator 26 is communicatively connected to a control unit 27. The control unit 27 receives temperature and pressure signals from each outlet branch 23, executes preset control logic, and outputs opening adjustment commands to the regulator 26, forming a closed-loop flow balance control circuit. The control unit 27 is not specifically limited here and can be flexibly configured according to process requirements, such as using a programmable logic controller, embedded microprocessor, or industrial personal computer.

[0031] Temperature sensor 24 detects the flow velocity differences near the outlet branches 23 by sensing the fluid temperature. Higher flow velocities result in shorter heat retention time of the liquid within the pipe, less heat exchange with the pipe wall and environment, and thus a relatively higher detected temperature; conversely, lower flow velocities result in a relatively lower detected temperature. Pressure sensor 25 detects the overall resistance changes of each outlet branch 23 by sensing the fluid pressure. According to fluid mechanics principles, a larger flow rate in the outlet branch 23 leads to a greater sum of friction loss and local pressure loss along the entire pipe, resulting in lower residual pressure at the distal end. Conversely, a smaller flow rate results in higher pressure at the distal end. Control unit 27 performs dual-parameter cross-validation by comprehensively comparing signals from both temperature and pressure dimensions, effectively filtering out misjudgments based on a single parameter and improving detection accuracy. Overall fluctuations in ambient temperature cause synchronous temperature changes in each outlet branch 23, but the temperature difference remains essentially constant; fluctuations in the upstream supply pressure cause synchronous pressure changes in each outlet branch 23, but the pressure difference remains essentially constant. These common-mode interferences can be effectively filtered out, significantly reducing the probability of erroneous adjustments.

[0032] This invention also provides a method for regulating the flow balance of a semiconductor shunt pipeline based on dual temperature and pressure parameters, employing a semiconductor shunt pipeline flow balance system based on dual temperature and pressure parameters as described in any of the above embodiments. Please refer to [link to relevant documentation]. Figure 2 The adjustment method includes: S11: Temperature sensor 24 collects temperature signals in real time and transmits them to control unit 27; pressure sensor 25 collects pressure signals in real time and transmits them to control unit 27. Control unit 27 synchronously receives temperature signals output by temperature sensor 24 and pressure signals output by pressure sensor 25 in each liquid outlet branch 23. Synchronous acquisition ensures that temperature and pressure data are aligned in time, avoiding distortion in the calculation of temperature and pressure differences due to timing misalignment.

[0033] S12: The control unit 27 performs a two-parameter cross-comparison based on the temperature and pressure signals of each outlet branch 23 to calculate the flow deviation between each outlet branch 23. The control unit 27 performs difference calculation on the synchronously acquired temperature signal to obtain the real-time temperature difference value; and performs difference calculation on the pressure signal to obtain the real-time pressure difference value. The use of two-parameter mutual error correction and cross-validation improves the accuracy of detection and judgment.

[0034] S13: The control unit 27 controls the regulating element 26 to adjust the flow resistance of the corresponding outlet branch 23 according to the flow deviation, so as to reduce the flow deviation. The control unit 27 analyzes the direction and magnitude of the deviation, generates a corresponding valve opening compensation amount, and sends a fine-tuning control command to the corresponding regulating element 26. By changing the opening of the regulating element 26, the local resistance of the branch is changed, thereby adjusting the flow distribution ratio.

[0035] S14: Repeat steps S11 to S13 to continuously and automatically balance the flow rate of each outlet branch 23. After each adjustment is completed, return to step S102 to start a new round of data acquisition and judgment, forming a continuous closed-loop automatic balancing control.

[0036] In one embodiment, step S13 specifically includes: when the real-time temperature difference between the liquid outlet branches 23 exceeds a first temperature difference threshold or the real-time pressure difference between the liquid outlet branches 23 exceeds a first pressure difference threshold, the control unit 27 controls to lock the current opening of each of the regulating members 26, stops the adjustment, and triggers an alarm; when the real-time temperature difference between the liquid outlet branches 23 exceeds a second temperature difference threshold but does not exceed the first temperature difference threshold, or the real-time pressure difference between the liquid outlet branches 23 exceeds the second pressure difference threshold but does not exceed the first pressure difference threshold, the control unit 27 controls to adjust the opening of the regulating member 26, thereby adjusting the flow resistance of the corresponding liquid outlet branch 23; wherein, the first temperature difference threshold is greater than the second temperature difference threshold, and the first pressure difference threshold is greater than the second pressure difference threshold.

[0037] When making adjustment decisions, the control unit 27 employs a two-level threshold grading judgment mechanism. First, it performs a first-level judgment: whether the real-time temperature difference exceeds the first temperature difference threshold, or whether the real-time pressure difference exceeds the first pressure difference threshold. If either of these two conditions is met, a serious deviation is determined. When the first-level judgment result indicates a serious deviation, a protection mechanism is triggered. The control unit 27 sends a lock-up command to each regulator 26, locking the current opening of each regulator 26, stopping all automatic adjustment actions, and outputting an abnormal alarm signal through the alarm module to notify maintenance personnel to intervene.

[0038] When the first-level judgment result is that no serious deviation has occurred, i.e., the protection lockout threshold has not been triggered, the second-level judgment is initiated: whether the real-time temperature difference exceeds the second temperature difference threshold, or whether the real-time pressure difference exceeds the second pressure difference threshold. If either of these two conditions is met, a deviation to be adjusted is determined to exist. When the second-level judgment result indicates a deviation to be adjusted, the control unit 27 generates a valve opening compensation amount and outputs a fine-tuning control command based on the deviation direction of the real-time temperature difference and real-time pressure difference. When the second-level judgment result indicates no deviation to be adjusted, i.e., the real-time temperature difference does not exceed the second temperature difference threshold and the real-time pressure difference does not exceed the second pressure difference threshold, the system is determined to be in the adjustment dead zone, maintaining the current opening of each regulating component 26 unchanged. The two operating conditions are basically consistent; minor fluctuations do not require adjustment, and maintaining the current valve status is sufficient to reduce mechanical wear caused by frequent valve operations. Then, the process returns to step S11 to continue periodic monitoring.

[0039] Furthermore, the amplitude of a single adjustment of the adjusting member 26 does not exceed 0.5% of the total opening of the adjusting member 26. By adopting a gradual adjustment with small steps, even if the cumulative deviation is large, the equilibrium point is gradually approached through multiple small adjustments, avoiding water hammer impact and disturbance to the hydraulic pressure supplied to the process chamber 28 caused by a single large adjustment.

[0040] Specifically, when the real-time temperature difference value deviates N times consecutively and exceeds the first temperature difference threshold, or the real-time pressure difference value deviates N times consecutively and exceeds the first pressure difference threshold, it is determined that the abnormality is not a transient interference, but a persistent fault. At this time, the control unit 27 locks the opening of the corresponding regulating element 26, terminates subsequent compensation adjustment, and triggers an alarm, where N is a positive integer greater than 2. For example, it can be set to 3 times, 5 times, or 8 times. By introducing the judgment condition of multiple consecutive over-limits, transient spike interference and persistent serious faults can be effectively distinguished. A single signal spike may be caused by factors such as electromagnetic interference or transient bubbles, and should not trigger permanent lockout; while multiple consecutive over-limits indicate that there is indeed a serious fault in the system, and automatic adjustment must be stopped to ensure safety.

[0041] In one embodiment, after performing an adjustment action, a preset time is locked and the judgment and adjustment actions are stopped. Specifically, the preset time is locked for 60 seconds. After the delay ends, the process returns to step S102 to begin a new round of data acquisition and judgment. Waiting for the preset time allows the fluid fluctuations in the pipeline to fully subside and reach a new steady-state equilibrium. If sampling is performed again immediately after adjustment, the acquired data will be dynamic and chaotic, and the calculations of temperature and pressure differences will be completely inaccurate, easily triggering secondary and tertiary erroneous adjustments. The forced delay gives the pipeline fluid sufficient time to complete the steady-state transition of flow, temperature, and pressure.

[0042] In other embodiments, when the number of liquid outlet branches 23 is greater than 2, one of them is used as a reference branch, and the temperature difference and pressure difference of the remaining branches are compared with the reference branch to adjust the flow rate of the remaining branches and achieve flow balance of all liquid outlet branches 23.

[0043] Specifically, the remaining branches are treated as follower branches. The real-time temperature difference and real-time pressure difference between the follower branches and the reference branch are calculated. According to the above-mentioned graded threshold judgment and fine-tuning compensation logic, the regulating component 26 of the follower branch is adjusted so that its flow rate is consistent with that of the reference branch. By sequentially performing the above adjustment process on each follower branch, the overall flow rate of all liquid outlet branches 23 is finally balanced, adapting to more dual-sided, multi-station synchronous liquid supply semiconductor devices.

[0044] It should be noted that there are several ways to select the reference branch: In one example, the liquid outlet branch 23 with the middle flow rate value is selected as the reference branch. This strategy can make the adjustment range of each following liquid outlet branch 23 relatively balanced; In another example, the liquid outlet branch 23 with a preset number is selected as the reference branch.

[0045] In one embodiment, the adjustment method further includes: storing temperature data and pressure data for each of the liquid outlet branches 23; analyzing the resistance change rate of each of the liquid outlet branches 23 based on the temperature data and pressure data; and determining that the corresponding liquid outlet branch 23 has scaling or aging when the resistance change rate exceeds a preset health threshold, triggering a pipeline abnormality warning.

[0046] Based on the long-term stored historical temperature and pressure data of the two channels, the rate of change of branch resistance is analyzed: if the pressure and temperature of a certain branch continue to rise, it is determined that the inner wall of the PFA pipeline of that branch is covered with liquid scale and the pipeline is severely bent and aged. The system will actively report the pipeline abnormality warning and remind the operation and maintenance personnel to replace the pipeline in advance to avoid pipeline blockage affecting production.

[0047] Please see Figure 3 The following section uses two liquid outlet branches 23 as an example to explain in detail the process of the semiconductor shunt pipeline flow balance regulation method based on temperature and pressure dual parameters.

[0048] S101: Perform system initialization operation. Complete the calibration of reference temperature and reference pressure to establish reference benchmarks for the fluid conditions of the two branches; at the same time, preset the first temperature difference threshold and the first pressure difference threshold to form a first-level protection judgment, preset the second temperature difference threshold and the second pressure difference threshold to form a second-level fine-tuning judgment, and further set the preset stabilization time for the condition settling buffer after each fine-tuning operation.

[0049] S102: Conduct periodic data acquisition, simultaneously acquiring temperature and pressure data from both branches. This synchronous acquisition method ensures consistent sampling timing for both branches, avoiding calculation errors in temperature and pressure differences caused by timing discrepancies.

[0050] S103: Calculate the real-time temperature difference and real-time pressure difference between the two branches based on the collected temperature and pressure measurement data.

[0051] S104: Determine whether the current real-time temperature difference exceeds the first temperature difference threshold or the real-time pressure difference exceeds the first pressure difference threshold. If the determination result is yes, proceed to step S105; if the determination result is no, proceed to step S107.

[0052] S105: Trigger protection mechanism: Lock the current opening degree of the electric back pressure valves on both sides, stop automatic adjustment, output an abnormal alarm signal, and execute step S106.

[0053] S106: Determine whether the control unit 27 has received a reset command or whether the abnormal state has been automatically eliminated. If the determination result is no, the valve lock-up state and alarm output state set in step S105 will continue to be maintained. If the determination result is yes, the protection phase ends and the execution returns to step S102 to start a new round of periodic data acquisition.

[0054] S107: Determine whether the real-time temperature difference is greater than the second temperature difference threshold or whether the real-time pressure difference is greater than the second pressure difference threshold. If the determination result is no, proceed to step S108; if the determination result is yes, proceed to step S109.

[0055] S108: If the system is found to be in the adjustment dead zone, the existing opening of the electric back pressure valves on both sides will not be adjusted to reduce the mechanical wear caused by frequent valve start-stop. After the process is completed, the process returns to step S102 to continue monitoring.

[0056] S109: Based on the deviation direction of the real-time temperature difference and real-time pressure difference, calculate the appropriate valve opening compensation amount, output the corresponding fine-tuning control command, and execute step S110.

[0057] S110: After executing the fine-tuning control command, start the timer and wait for the preset stabilization time to allow the fluid fluctuations inside the pipeline to fully subside; after the settling time is completed, return to step S102 to start the next sampling cycle.

[0058] The technical effects of the semiconductor shunt pipeline flow balancing system and method based on temperature and pressure parameters of the present invention will be explained in detail below.

[0059] 1. Innovative indirect flow detection without flowmeters: It is the first to utilize the thermal retention effect of fluid flow and the pressure loss effect along the pipeline. Without the need for any intrusive flowmeters in series, the flow rate is indirectly calculated by relying on the two basic process parameters of temperature and pressure. This completely eliminates the risk of flowmeter contamination of high-purity liquids and is perfectly adapted to semiconductor clean processes.

[0060] 2. Innovative layout of near-end temperature and far-end pressure zones: The temperature sensor is close to the flow divider 22 to capture the initial flow velocity difference of the liquid outlet branch 23, with a fast response speed; the pressure sensor is arranged at the far end of the pipeline to reflect the comprehensive resistance difference of the entire pipeline, with complete detection coverage, and the combination of near and far sensors can comprehensively capture pipeline flow deviations.

[0061] 3. Dual-parameter collaborative redundancy verification mechanism: Single parameters are easily affected by environmental interference. This invention adopts bidirectional trend cross-verification of temperature and pressure. Temperature determines flow rate and pressure determines overall resistance. They correct each other and greatly improve the accuracy of flow rate judgment, avoiding erroneous adjustment.

[0062] 4. End back pressure resistance compensation adjustment logic: Without changing the throttling structure in the middle of the pipeline, only the end back pressure is adjusted to change the resistance of the entire branch. The adjustment linearity is good, the flow field disturbance is small, and no fluid turbulence or bubbles are generated, ensuring the stability of the supply fluid.

[0063] 5. Adaptive long-term balancing mechanism: In response to the slow resistance drift caused by pipeline aging, pipe wall scaling, and environmental temperature changes, the system monitors continuously 24 hours a day and automatically adjusts with micro-compensation to solve the industry problem of flow re-deviation after manual adjustment.

[0064] 6. Zero liquid contamination, suitable for harsh semiconductor operating conditions: The temperature sensor can be installed on the outer wall without contact, with no metal parts entering the liquid, no ion precipitation, and no flow field disturbance, fully meeting the cleanliness requirements of high-purity liquid supply for semiconductors.

[0065] 7. No manual maintenance required, reducing downtime losses: One-time installation results in permanent automatic balancing, eliminating the need for periodic manual inspections and valve adjustments, reducing equipment downtime and improving machine uptime.

[0066] 8. Strong anti-interference capability and higher adjustment accuracy: Dual-parameter complementary verification avoids interference caused by fluctuations in ambient temperature and front-end liquid supply pressure, and the flow balance accuracy can reach ±1%, which is far higher than the accuracy of manual adjustment.

[0067] 9. Minimal modification required, extremely high compatibility: No cutting or modification of existing PFA pipelines is required. All sensors and valves can be directly fitted with adapters. It is compatible with all existing PFA supply pipelines of all specifications of tee-type diversion. Both new and old equipment can be quickly modified.

[0068] 10. Good operational stability and no liquid supply shock: The small-amplitude progressive adjustment logic is adopted, and the valve does not have large-amplitude opening and closing actions, which will not cause water hammer or pressure shock in the pipeline, ensuring the stable operation of the front-end liquid supply pump and the back-end process chamber.

[0069] In the description of this invention, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0070] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0071] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0072] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the present invention. Furthermore, the present invention described herein may have other embodiments and can be implemented or carried out in various ways. Unless otherwise defined, the technical or scientific terms used herein should be understood in their ordinary sense by one of ordinary skill in the art to which this invention pertains.

Claims

1. A semiconductor shunt pipeline flow balancing system based on temperature and pressure dual parameters, comprising: The liquid inlet main pipeline and at least two liquid outlet branches connected to the liquid inlet main pipeline via a diverter are characterized in that... Each of the aforementioned liquid outlet branches is equipped with a temperature detection element to detect the fluid temperature of the corresponding liquid outlet branch; Each of the aforementioned liquid outlet branches is equipped with a pressure detection element to detect the fluid pressure of the corresponding liquid outlet branch; Each of the liquid outlet branches is equipped with an adjusting element to adjust the flow resistance of the corresponding liquid outlet branch; Each of the temperature sensors, pressure sensors, and regulators is communicatively connected to a control unit. The control unit is configured to perform a two-parameter cross-comparison of the temperature and pressure signals of each outlet branch to calculate the flow deviation between the outlet branches. Based on the flow deviation, the control unit adjusts the flow resistance of the corresponding outlet branch to form a closed-loop flow balance control.

2. The semiconductor shunt pipeline flow balancing system based on temperature and pressure dual parameters according to claim 1, characterized in that, The temperature sensor is non-contactly disposed on the outer wall of the liquid outlet branch; and / or, the temperature sensor is disposed close to the diverter.

3. The semiconductor shunt pipeline flow balancing system based on temperature and pressure dual parameters according to claim 1, characterized in that, The pressure sensing element is a built-in corrosion-resistant pressure sensor; and / or, the pressure sensing element is located away from the shunt element.

4. The semiconductor shunt pipeline flow balancing system based on temperature and pressure dual parameters according to claim 1, characterized in that, The regulating element is a back pressure valve; and / or, the regulating element is located at the end of the liquid outlet branch.

5. A method for flow balance regulation of a semiconductor shunt pipeline based on temperature and pressure dual parameters, characterized in that, The flow balancing system for a semiconductor shunt pipeline based on dual temperature and pressure parameters as described in any one of claims 1-4, wherein the adjustment method includes: S11: The temperature detection element collects temperature signals in real time and transmits them to the control unit; the pressure detection element collects pressure signals in real time and transmits them to the control unit. S12: The control unit performs a two-parameter cross-comparison based on the temperature and pressure signals of each liquid outlet branch to calculate the flow deviation between each liquid outlet branch; S13: The control unit controls the regulating element to adjust the flow resistance of the corresponding liquid outlet branch according to the flow deviation, so as to reduce the flow deviation; S14: Repeat steps S11 to S13 to continuously and automatically balance the flow rate of each of the liquid outlet branches.

6. The method for regulating the flow balance of a semiconductor shunt pipeline based on dual temperature and pressure parameters according to claim 5, characterized in that, Step S13 specifically includes: When the real-time temperature difference between the liquid outlet branches exceeds the first temperature difference threshold or the real-time pressure difference between the liquid outlet branches exceeds the first pressure difference threshold, the control unit controls and locks the current opening of each of the regulating components, stops the adjustment, and triggers an alarm. When the real-time temperature difference between the liquid outlet branches exceeds the second temperature difference threshold but does not exceed the first temperature difference threshold, or when the real-time pressure difference between the liquid outlet branches exceeds the second pressure difference threshold but does not exceed the first pressure difference threshold, the control unit controls and adjusts the opening of the adjusting element, thereby adjusting the flow resistance of the corresponding liquid outlet branch. Wherein, the first temperature difference threshold is greater than the second temperature difference threshold, and the first pressure difference threshold is greater than the second pressure difference threshold.

7. The method for regulating the flow balance of a semiconductor shunt pipeline based on dual temperature and pressure parameters according to claim 6, characterized in that, The amplitude of a single adjustment of the adjusting element shall not exceed 0.5% of the total opening of the adjusting element.

8. The method for regulating the flow balance of a semiconductor shunt pipeline based on dual temperature and pressure parameters according to claim 6, characterized in that, When the real-time temperature difference value deviates N times consecutively and exceeds the first temperature difference threshold, or when the real-time pressure difference value deviates N times consecutively and exceeds the first pressure difference threshold, the opening degree of the corresponding regulating component is locked, and subsequent compensation adjustment is terminated. N is a positive integer greater than 2.

9. The method for flow balance regulation of semiconductor shunt pipelines based on temperature and pressure dual parameters according to claim 5, characterized in that, After performing an adjustment action, lock the preset duration and stop the judgment and adjustment actions.

10. The method for regulating the flow balance of a semiconductor shunt pipeline based on dual temperature and pressure parameters according to claim 5, characterized in that, When the number of liquid outlet branches is greater than 2, one of them is used as the reference branch, and the temperature difference and pressure difference of the remaining branches are compared with the reference branch to adjust the flow rate of the remaining branches and achieve flow balance of all liquid outlet branches.

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