Semiconductor temperature control device and control method thereof

Abstract

The application discloses a kind of semiconductor temperature control equipment and control method thereof, it is related to semiconductor field.The equipment includes: refrigerant circulation system, including compressor, first heat exchanger, throttling valve and second heat exchanger, first heat exchanger has first refrigerant flow channel, cooling water flow channel and first cold carrier flow channel, second heat exchanger has second refrigerant flow channel and second cold carrier flow channel, compressor, first refrigerant flow channel, throttling valve and second refrigerant flow channel are sequentially connected by pipeline;Cold carrier circulation system includes process chamber, first control valve and second control valve, process chamber, first control valve, first cold carrier flow channel and second cold carrier flow channel are sequentially connected;Two ends of second control valve are connected to the upstream of first control valve and the downstream of first cold carrier flow channel respectively;Plant cooling water system is connected with cooling water flow channel.The semiconductor temperature control equipment provided by the application can meet the diversified temperature control requirements, and the energy consumption is lower, and the service life is longer.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and more specifically, to a semiconductor temperature control device and its control method. Background Technology

[0002] In semiconductor manufacturing processes, such as thin film deposition and etching, a large amount of heat is released, requiring specialized temperature control equipment to perform high-precision temperature regulation of the process chamber through a coolant circuit.

[0003] Currently, most temperature control devices on the market rely solely on a single refrigerant circulation system for heat exchange with the refrigerant. This limited operating mode makes it difficult to meet the diverse temperature control requirements of process chambers at different stages of the process. Furthermore, the compressors in these refrigeration systems typically need to run continuously, leading to high energy consumption and shortening the equipment's lifespan. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor temperature control device that can meet the diverse temperature control requirements of process chambers, and can also effectively reduce energy consumption and extend service life.

[0005] Another objective of this invention is to provide a semiconductor temperature control device control method that can meet the diverse temperature control requirements of process chambers, and can also effectively reduce energy consumption and extend service life.

[0006] An embodiment of the present invention provides a technical solution: A semiconductor temperature control device, comprising: A refrigerant circulation system includes a compressor, a first heat exchanger, a throttling valve, and a second heat exchanger. The first heat exchanger has a first refrigerant flow channel, a cooling water flow channel, and a first refrigerant flow channel. The second heat exchanger has a second refrigerant flow channel and a second refrigerant flow channel. The compressor, the first refrigerant flow channel, the throttling valve, and the second refrigerant flow channel are connected in sequence through pipelines to form a loop for refrigerant flow. A refrigerant circulation system includes a process chamber, a first control valve, and a second control valve. The process chamber, the first control valve, the first refrigerant channel, and the second refrigerant channel are sequentially connected by pipelines to form a loop for refrigerant flow. One end of the second control valve is connected to the pipeline section between the process chamber and the first control valve, and the other end is connected to the pipeline section between the first refrigerant channel and the second refrigerant channel. The plant cooling water system is connected to the cooling water channel and is used to transport cooling water through the cooling water channel to absorb the heat of the refrigerant in the first refrigerant channel and / or the refrigerant in the first coolant channel.

[0007] The semiconductor temperature control device provided in this invention features a dual-system heat exchanger in its refrigerant circulation system. This heat exchanger comprises a first refrigerant channel, a cooling water channel, and a first refrigerant channel. The first refrigerant channel participates in forming a refrigerant flow loop, the cooling water channel is connected to the plant cooling water system, and the first refrigerant channel is connected to the refrigerant circulation system. In practical applications, the first control valve in the refrigerant circulation system can be closed while the second control valve is open, allowing the refrigerant in the refrigerant circulation system to exchange heat with the refrigerant in the refrigerant circulation system in the second heat exchanger, thus meeting the first temperature control requirement of the process chamber. Alternatively, the first control valve can be opened while the second control valve is closed, allowing the refrigerant to exchange heat only with the cooling water in the plant cooling water system within the first heat exchanger, meeting the second temperature control requirement of the process chamber. In this case, the compressor in the refrigerant circulation system can remain shut down, reducing energy consumption and extending equipment lifespan. It can also control the opening of the first control valve, the closing of the second control valve, and the operation of the compressor, so that the refrigerant exchanges heat with the cooling water in the first heat exchanger and with the refrigerant in the second heat exchanger, thus meeting the third temperature control requirement of the process chamber.

[0008] As can be seen, the semiconductor temperature control device provided in this embodiment of the invention can meet the diverse temperature control requirements of the process chamber, and can also effectively reduce energy consumption and extend service life.

[0009] In an optional embodiment, the refrigerant circulation system further includes a heater disposed on a pipe section between the second refrigerant channel and the process chamber.

[0010] The heater is installed on the pipe section before the second refrigerant flow channel and the refrigeration chamber. After the first heat exchanger and / or the second heat exchanger cool the refrigerant in the refrigerant circulation system, the heater can also heat the refrigerant before it enters the process chamber, so as to precisely adjust the temperature of the refrigerant and achieve more precise temperature control of the process chamber.

[0011] In an optional embodiment, the refrigerant circulation system further includes a proportional valve, one end of which is connected to a pipe section between the process chamber and the first control valve, and the connection position is upstream of the connection position of the second control valve; the other end of which is connected to a pipe section between the second refrigerant flow channel and the heater.

[0012] By setting a proportional valve, the refrigerant with a higher temperature before entering the first heat exchanger can be selectively mixed into the refrigerant with a lower temperature after exiting the second heat exchanger, thereby achieving temperature regulation through hot and cold mixing and reducing the energy consumption of the heater.

[0013] In an optional embodiment, the input terminal of the heater is provided with a first temperature detection device; and / or, A second temperature detection device is provided at the input end of the process chamber.

[0014] By setting up a first temperature detection device to accurately detect the inlet temperature of the heater, and a second temperature detection device to accurately detect the actual liquid supply temperature of the process chamber, the two parameters are combined as the basis for heater control, which can further improve the accuracy of temperature control.

[0015] In an optional embodiment, the refrigerant circulation system further includes a one-way valve, which is disposed on the pipe section between the first refrigerant flow channel and the second refrigerant flow channel, and is located upstream of the connection position of the second control valve.

[0016] By installing a check valve between the first refrigerant channel and the connection point of the second control valve, the refrigerant flowing through the second control valve can be prevented from flowing back into the first refrigerant channel, thus improving the temperature control effect.

[0017] In an optional embodiment, the refrigerant circulation system further includes a water pump and a water tank, the water pump being disposed on a pipe section between the process chamber and the first control valve, and the water tank being selectively connected to the input end of the water pump.

[0018] As the power source for the circulation of refrigerant in the refrigerant circulation system, the water pump allows the water tank to replenish the refrigerant to the system as needed, driven by the pump.

[0019] An embodiment of the present invention also provides a semiconductor temperature control device control method, applied to the aforementioned semiconductor temperature control device, the semiconductor temperature control device control method comprising: When the target liquid supply temperature in the process chamber is less than or equal to the first preset temperature, the compressor is started, and the first control valve is closed and the second control valve is opened. When the target liquid supply temperature is greater than the first preset temperature and less than or equal to the second preset temperature, the compressor is started, and the first control valve is opened and the second control valve is closed. If the target liquid supply temperature is greater than the second preset temperature, the compressor is stopped, and the first control valve is opened and the second control valve is closed.

[0020] When the target supply temperature is less than or equal to the first preset temperature, it indicates that the process chamber requires a lower temperature refrigerant. The first control valve is closed and the second control valve is opened, allowing the refrigerant to exchange heat with the refrigerant in the second heat exchanger. When the target supply temperature is greater than the second preset temperature, it indicates that the process chamber requires a higher temperature refrigerant. The first control valve is opened and the second control valve is closed, and the compressor is shut down, allowing the refrigerant to exchange heat only with the cooling water in the plant system, reducing energy consumption and extending equipment lifespan. When the target supply temperature is greater than the first preset temperature but less than or equal to the second preset temperature, the first control valve is opened and the second control valve is closed, and the compressor is operated, allowing the refrigerant to exchange heat with the cooling water first and then with the refrigerant, achieving precise control of the refrigerant temperature.

[0021] As can be seen, the semiconductor temperature control device control method provided in the embodiments of the present invention can meet the diverse temperature control requirements of the process chamber, and can also effectively reduce energy consumption and extend service life.

[0022] In an optional implementation, the semiconductor temperature control device control method further includes: Obtain the inlet temperature of the heater; Select a preset temperature difference corresponding to the target liquid supply temperature and the initial opening degree of the proportional valve; If the inlet temperature is less than the difference between the target supply temperature and the preset temperature difference, the proportional valve is controlled to open at the initial opening degree, and the heater is controlled to remain off. When the inlet temperature is greater than or equal to the difference between the target liquid supply temperature and the preset temperature difference, but less than the target liquid supply temperature, the heater is controlled to start.

[0023] If the inlet temperature is less than the difference between the target supply temperature and the preset temperature difference, it indicates that the temperature of the refrigerant is too low. At this time, the proportional valve is opened at the initial opening to mix the hot and cold fluids, thereby achieving a rapid increase in the temperature of the refrigerant at the heater input.

[0024] When the inlet temperature is greater than or equal to the difference between the target supply temperature and the preset temperature difference, but less than the target supply temperature, it indicates that the temperature of the refrigerant is only slightly lower than the target supply temperature. This controls the heater to start, thereby achieving precise adjustment of the temperature of the mixed refrigerant, saving energy and improving temperature control accuracy.

[0025] In an optional implementation, after the step of controlling the proportional valve to open at the initial opening degree, the method further includes: Obtain the actual liquid supply temperature of the process chamber; If the duty cycle of the heater is less than or equal to the first preset duty cycle value, and the difference between the actual liquid supply temperature and the target liquid supply temperature is greater than or equal to the first preset value, then the proportional valve is controlled to reduce the first preset opening value every first preset time interval. If the duty cycle of the heater is greater than the second preset duty cycle value, or the difference between the actual liquid supply temperature and the target liquid supply temperature is less than the second preset value, then the proportional valve is controlled to increase the second preset opening value every second preset time interval.

[0026] The opening of the proportional valve is periodically adjusted according to the duty cycle of the heater and the actual supply liquid temperature, so as to achieve dynamic adjustment of the mixing of hot and cold refrigerant and significantly improve the temperature control accuracy.

[0027] In an optional implementation, after the step of controlling the heater to start, the method further includes: Obtain the actual liquid supply temperature of the process chamber; If the actual liquid supply temperature is lower than the target liquid supply temperature, then increase the duty cycle of the heater; If the actual supply temperature is greater than the target supply temperature, then the duty cycle of the heater is reduced.

[0028] The heater's duty cycle is dynamically adjusted based on the comparison between the actual supply temperature and the target supply temperature, saving energy while further improving temperature control accuracy. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A schematic diagram of the structure of a semiconductor temperature control device provided in an embodiment of the present invention; Figure 2 A flowchart illustrating a semiconductor temperature control device control method provided in an embodiment of the present invention; Figure 3 In order to be in Figure 2 A flowchart of multiple control steps that can be executed after step S107; Figure 4 In order to be in Figure 2 Another flowchart of multiple control steps that can be executed after step S107 in the flowchart.

[0031] Icons: 100-Semiconductor temperature control equipment; 110-Refrigerant circulation system; 111-Compressor; 112-First heat exchanger; 1121-First refrigerant flow channel; 1122-Cooling water flow channel; 1123-First secondary refrigerant flow channel; 113-Throttle valve; 114-Second heat exchanger; 1141-Second refrigerant flow channel; 1142-Second secondary refrigerant flow channel; 120-Secondary refrigerant circulation system; 121-Process chamber; 122-First control valve; 123-Second control valve; 124-Heater; 125-Proportional valve; 126-First temperature detection device; 127-Second temperature detection device; 128-Third temperature detection device; 1291-Check valve; 1292-Water pump; 1293-Water tank; 130-Plant cooling water system. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] In the description of this invention, it should be understood that the terms "upper," "lower," "inner," "outer," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0036] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0037] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0039] Example Please see Figure 1 , Figure 1 The diagram shown is a structural schematic of the semiconductor temperature control device 100 provided in this embodiment.

[0040] The semiconductor temperature control device 100 provided in this embodiment includes a refrigerant circulation system 110, a coolant circulation system 120, and a plant cooling water system 130. The refrigerant circulation system 110 and the plant cooling water system 130 are used to exchange heat with the coolant in the coolant circulation system 120 through refrigerant and cooling water, respectively, so that the coolant flows into the process chamber 121 after the temperature of the coolant reaches the process requirements, thereby achieving precise temperature control of the process chamber 121.

[0041] The refrigerant circulation system 110 includes a compressor 111, a first heat exchanger 112, a throttle valve 113, and a second heat exchanger 114. In this embodiment, the first heat exchanger 112 is a dual-system heat exchanger with a first refrigerant flow channel 1121, a cooling water flow channel 1122, and a first refrigerant flow channel 1123. The second heat exchanger 114 has a second refrigerant flow channel 1141 and a second refrigerant flow channel 1142. The compressor 111, the first refrigerant flow channel 1121, the throttle valve 113, and the second refrigerant flow channel 1141 are connected in sequence through pipelines to form a loop for refrigerant flow.

[0042] The refrigerant circulation system 120 includes a process chamber 121, a first control valve 122, and a second control valve 123. The process chamber 121, the first control valve 122, the first refrigerant flow channel 1123, and the second refrigerant flow channel 1142 are connected sequentially by pipelines to form a loop for refrigerant flow. One end of the second control valve 123 is connected to the pipeline section between the process chamber 121 and the first control valve 122, and the other end is connected to the pipeline section between the first refrigerant flow channel 1123 and the second refrigerant flow channel 1142.

[0043] The plant cooling water system 130 is connected to the cooling water channel 1122 and is used to transport cooling water through the cooling water channel 1122 to absorb the heat of the refrigerant in the first refrigerant channel 1121 and / or the refrigerant in the first heat transfer fluid channel 1123.

[0044] For the refrigerant circulation system 110, when the compressor 111 is running, the refrigerant output by it first flows through the first refrigerant channel 1121 of the first heat exchanger 112, where it exchanges heat with the cooling water in the cooling water channel 1122 to achieve cooling. After the refrigerant flows out of the first refrigerant channel 1121, it passes sequentially through the expansion valve 113 and the second refrigerant channel 1141 of the second heat exchanger 114, where it exchanges heat with the refrigerant in the second secondary refrigerant channel 1142 to achieve cooling of the secondary refrigerant. After leaving the second refrigerant channel 1141, the refrigerant flows back into the compressor 111, completing one cycle.

[0045] For the refrigerant circulation system 120, if the first control valve 122 is open and the second control valve 123 is closed, the refrigerant output from the process chamber 121 will flow sequentially through the first refrigerant channel 1123 and the second refrigerant channel 1142. The refrigerant exchanges heat with the cooling water in the cooling water channel 1122 in the first refrigerant channel 1123 and with the refrigerant in the second refrigerant channel 1141 in the second refrigerant channel 1142. That is, the refrigerant flows into the process chamber 121 after completing two cooling cycles.

[0046] If the first control valve 122 is closed and the second control valve 123 is open, the second control valve 123 will short-circuit both ends of the first refrigerant channel 1123. The refrigerant output from the process chamber 121 will not be able to enter the first refrigerant channel 1123 to exchange heat with the cooling water. Instead, it will flow through the second control valve 123 and the second refrigerant channel 1142 in sequence, and only after exchanging heat with the refrigerant in the second refrigerant channel 1141 in the second refrigerant channel 1142 will it flow into the process chamber 121.

[0047] In this embodiment, the refrigerant circulation system 120 further includes a heater 124, which is disposed on the pipe section between the second refrigerant flow channel 1142 and the process chamber 121, and is capable of actively heating the refrigerant.

[0048] The heater 124 is located on the pipe section before the second refrigerant flow channel 1142 and the refrigeration chamber. After the first heat exchanger 112 and / or the second heat exchanger 114 cools down the refrigerant in the refrigerant circulation system 120, the heater 124 can also actively heat the refrigerant before it enters the process chamber 121 to precisely regulate the temperature of the refrigerant and achieve more precise temperature control of the process chamber 121.

[0049] In this embodiment, the refrigerant circulation system 120 further includes a proportional valve 125. One end of the proportional valve 125 is connected to the pipe section between the process chamber 121 and the first control valve 122, and the connection position is upstream of the connection position of the second control valve 123. The other end of the proportional valve 125 is connected to the pipe section between the second refrigerant flow channel 1142 and the heater 124.

[0050] By opening the proportional valve 125, the refrigerant with a higher temperature before entering the first heat exchanger 112 can be mixed into the refrigerant with a lower temperature after flowing out of the second heat exchanger 114, thereby achieving temperature regulation by mixing hot and cold substances. This raises the temperature of the refrigerant before the heater 124, which can effectively reduce the energy consumption of the heater 124.

[0051] Furthermore, the refrigerant circulation system 120 in this embodiment also includes a one-way valve 1291, a water pump 1292, and a water tank 1293. The one-way valve 1291 is disposed on the pipe section between the first refrigerant flow channel 1123 and the second refrigerant flow channel 1142, and is located upstream of the connection position of the second control valve 123. The water pump 1292 is disposed on the pipe section between the process chamber 121 and the first control valve 122, and the water tank 1293 is selectively connected to the input end of the water pump 1292.

[0052] One-way valve 1291 restricts the refrigerant to flow only from the output end of the first refrigerant channel 1123 to the input end of the second refrigerant channel 1142, preventing the refrigerant flowing through the second control valve 123 from flowing back into the first refrigerant channel 1123, thus improving the temperature control effect. Water pump 1292 serves as the power source for the refrigerant circulation in the refrigerant circulation system 120. Water tank 1293 can replenish refrigerant to the refrigerant circulation system 120 as needed under the action of water pump 1292, to avoid the refrigerant flow rate being too low and affecting the temperature control effect on the process chamber 121.

[0053] In addition, a first temperature detection device 126 is provided at the input end of the heater 124 to detect the temperature of the refrigerant when it flows into the heater 124, i.e., the inlet temperature; a second temperature detection device 127 is provided at the input end of the process chamber 121 to detect the temperature of the refrigerant when it flows into the process chamber 121, i.e., the actual supply temperature; and a third temperature detection device 128 is provided at the output end of the process chamber 121 to detect the temperature of the refrigerant output from the process chamber 121.

[0054] The semiconductor temperature control device 100 provided in this embodiment of the invention can, in practical applications, control the first control valve 122 to close, the second control valve 123 to open, and control the compressor 111 to run, so that the refrigerant exchanges heat with the refrigerant in the refrigerant circulation system 110 in the second heat exchanger 114, satisfying the first temperature control requirement of the process chamber 121. Alternatively, it can control the first control valve 122 to open, the second control valve 123 to close, and control the compressor 111 to remain off, so that the refrigerant only exchanges heat with the cooling water in the plant cooling water system 130 in the first heat exchanger 112, satisfying the second temperature control requirement of the process chamber 121. Because the compressor 111 remains off, energy consumption can be reduced and the equipment lifespan extended. Furthermore, it can control the first control valve 122 to open, the second control valve 123 to close, and control the compressor 111 to run, so that the refrigerant first exchanges heat with the cooling water in the first heat exchanger 112, and then with the refrigerant in the second heat exchanger 114, satisfying the third temperature control requirement of the process chamber 121.

[0055] As can be seen, the semiconductor temperature control device 100 provided in this embodiment of the invention can meet the diverse temperature control requirements of the process chamber 121, and can also effectively reduce energy consumption and extend service life.

[0056] This embodiment also provides a semiconductor temperature control device control method, applied to the aforementioned semiconductor temperature control device 100. Please refer to the following references. Figure 2 , Figure 2 The diagram shown is a flowchart of a control method for a semiconductor temperature control device. This control method may include: In step S101, when the target liquid supply temperature of the process chamber 121 is less than or equal to the first preset temperature, the compressor 111 is started, and the first control valve 122 is closed and the second control valve 123 is opened.

[0057] It is understandable that the target liquid supply temperature refers to the refrigerant temperature that meets the requirements of the process chamber 121, which can be set by the operator according to the actual process steps.

[0058] When the target liquid supply temperature is less than or equal to the first preset temperature, it indicates that the process chamber 121 requires a coolant at a lower temperature. At this time, the first control valve 122 is closed and the second control valve 123 is opened, so that the refrigerant exchanges heat with the cooling water separately in the first heat exchanger 112 and then absorbs the heat of the coolant in the second heat exchanger, thereby achieving efficient and significant cooling of the coolant to meet the low temperature requirement of the process chamber 121.

[0059] Preferably, the first preset temperature in this embodiment is 20°C.

[0060] In step S102, when the target liquid supply temperature is greater than the first preset temperature and less than or equal to the second preset temperature, the compressor 111 is started, and the first control valve 122 is opened and the second control valve 123 is closed.

[0061] When the target liquid supply temperature is greater than the first preset temperature and less than or equal to the second preset temperature, the first control valve 122 is opened and the second control valve 123 is closed, and the compressor 111 is operated, so that the refrigerant exchanges heat with the cooling water first and then with the refrigerant, so as to achieve precise control of the refrigerant temperature.

[0062] Preferably, the second preset temperature in this embodiment is 35°C.

[0063] In step S103, when the target liquid supply temperature is greater than the second preset temperature, the compressor 111 is shut down, and the first control valve 122 is opened and the second control valve 123 is closed.

[0064] When the target liquid supply temperature is higher than the second preset temperature, it indicates that the process chamber 121 requires a higher temperature refrigerant. The first control valve 122 is opened and the second control valve 123 is closed, and the compressor 111 is stopped. This allows the refrigerant to exchange heat only with the cooling water in the plant system. The temperature of the cooling water is much higher than the temperature of the refrigerant that exchanges heat with the refrigerant in the second heat exchanger 114. This can meet the high temperature requirements of the process chamber 121, and can also significantly reduce energy consumption and extend the service life of the equipment.

[0065] Step S104: Obtain the inlet temperature of heater 124.

[0066] Understandably, the inlet temperature is detected by the first temperature detection device 126.

[0067] Step S105: Select the preset temperature difference and the initial opening degree of the proportional valve 125 corresponding to the target liquid supply temperature.

[0068] In this embodiment, the preset temperature difference is 2°C when the target liquid supply temperature is less than or equal to the first preset temperature, and when the target liquid supply temperature is greater than the first preset temperature but less than or equal to the second preset temperature. When the target liquid supply temperature is greater than the second preset temperature, the corresponding preset temperature difference is 3°C.

[0069] There is a preset initial opening degree for the range of target liquid supply temperature. For multiple target liquid supply temperatures in different ranges, the higher the target liquid supply temperature, the larger the initial opening degree, that is, the greater the flow rate of the refrigerant in the high-temperature state.

[0070] In step S106, if the inlet temperature is less than the difference between the target liquid supply temperature and the preset temperature difference, the proportional valve 125 is opened at the initial opening, and the heater 124 is kept off.

[0071] If the inlet temperature is less than the difference between the target supply temperature and the preset temperature difference, it indicates that the temperature of the refrigerant is too low. At this time, the proportional valve 125 is opened at the initial opening to mix the hot and cold refrigerants, thereby achieving a rapid increase in the temperature of the refrigerant at the input end of the heater 124. The heater 124 is kept off to avoid excessive load on the heater 124 and high energy consumption.

[0072] Step S107: When the inlet temperature is greater than or equal to the difference between the target liquid supply temperature and the preset temperature difference, but less than the target liquid supply temperature, control the heater 124 to start.

[0073] If the inlet temperature is greater than or equal to the difference between the target supply temperature and the preset temperature difference, but less than the target supply temperature, it indicates that the temperature of the refrigerant is only slightly lower than the target supply temperature. At this time, the control heater 124 is started to achieve further precise adjustment of the temperature of the mixed refrigerant, saving energy and improving temperature control accuracy.

[0074] It is understandable that if the inlet temperature is greater than or equal to the target supply temperature, it indicates that the actual temperature of the refrigerant is already high enough. In this case, the proportional valve 125 is kept closed and the heater 124 is kept off.

[0075] Please see Figure 3 After step S107, the semiconductor temperature control device control method may further include: Step S108a: Obtain the actual liquid supply temperature of the process chamber 121.

[0076] Understandably, the actual liquid supply temperature is obtained through the second temperature detection device 127.

[0077] In step S109a, if the duty cycle of heater 124 is less than or equal to the first preset duty cycle value, and the difference between the actual liquid supply temperature and the target liquid supply temperature is greater than or equal to the first preset value, then control proportional valve 125 to reduce the first preset opening value every first preset time interval.

[0078] In step S110a, if the duty cycle of heater 124 is greater than the second preset duty cycle value, or the difference between the actual liquid supply temperature and the target liquid supply temperature is less than the second preset value, then control proportional valve 125 to increase the second preset opening value every second preset time interval.

[0079] The opening of the proportional valve 125 is dynamically adjusted based on the duty cycle of the heater 124 and the relative relationship between the actual supply temperature and the target supply temperature, so as to achieve efficient and accurate adjustment of the actual supply temperature while rapidly reducing the energy consumption of the heater 124.

[0080] Preferably, in this embodiment, the first preset duty cycle value is 10%, the first preset value is 0.5℃, the first preset duration is 20s, and the first preset opening value is 0.1%; the second preset duty cycle value is 20%, the second preset value is -1℃, the second preset duration is 20s, and the second preset opening value is 0.1%.

[0081] Please see Figure 4 After step S107, the semiconductor temperature control device control method may further include: Step S108b: Obtain the actual liquid supply temperature of the process chamber 121.

[0082] Similarly, the actual liquid supply temperature is obtained by the second temperature detection device 127.

[0083] In step S109b, if the actual liquid supply temperature is lower than the target liquid supply temperature, the duty cycle of heater 124 is increased.

[0084] In step S110b, if the actual liquid supply temperature is greater than the target liquid supply temperature, the duty cycle of heater 124 is reduced.

[0085] The heater 124 is controlled by PID based on the actual liquid supply temperature, so that the actual liquid supply temperature is always maintained near the target liquid supply temperature, thereby improving the accuracy of temperature regulation of the process chamber 121.

[0086] In practical applications, when the inlet temperature is less than the difference between the target liquid supply temperature and the preset temperature difference, the proportional valve 125 is first controlled to open at the initial opening degree so that the inlet temperature rises rapidly to be greater than or equal to the difference between the target liquid supply temperature and the preset temperature difference, but less than the target liquid supply temperature. At this time, the heater 124 is started while the proportional valve 125 remains open.

[0087] In this case, it can be based on Figure 3 Steps S108a, S109a, and S110a show the steps adjusting the opening value of the proportional valve 125, according to... Figure 4 Steps S108b, S109b, and S110b, as shown, adjust the duty cycle of heater 124. In other words, Figure 3 and Figure 4 All of the steps shown can be triggered.

[0088] If the first detected inlet temperature is greater than or equal to the difference between the target liquid supply temperature and the preset temperature difference, but less than the target liquid supply temperature, then there is no need to control the proportional valve 125 to open; instead, the heater 124 can be directly started to fine-tune the temperature.

[0089] In this case, it can be based on Figure 4 Steps S108b, S109b, and S110b show how the duty cycle of heater 124 is adjusted. Figure 4 The steps shown can be triggered. However, since proportional valve 125 remains closed, Figure 3 Steps S108a, S109a, and S110a shown will not be triggered.

[0090] In summary, the semiconductor temperature control device control method provided in this embodiment can meet the diverse temperature control requirements of the process chamber 121, and can also effectively reduce energy consumption and extend service life.

[0091] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A semiconductor temperature control device, characterized in that, include: The refrigerant circulation system (110) includes a compressor (111), a first heat exchanger (112), a throttle valve (113), and a second heat exchanger (114). The first heat exchanger (112) has a first refrigerant flow channel (1121), a cooling water flow channel (1122), and a first refrigerant flow channel (1123). The second heat exchanger (114) has a second refrigerant flow channel (1141) and a second refrigerant flow channel (1142). The compressor (111), the first refrigerant flow channel (1121), the throttle valve (113), and the second refrigerant flow channel (1141) are connected in sequence through pipelines to form a loop for refrigerant flow. The refrigerant circulation system (120) includes a process chamber (121), a first control valve (122), and a second control valve (123). The process chamber (121), the first control valve (122), the first refrigerant flow channel (1123), and the second refrigerant flow channel (1142) are connected in sequence by pipelines to form a loop for refrigerant flow. One end of the second control valve (123) is connected to the pipe section between the process chamber (121) and the first control valve (122), and the other end is connected to the pipe section between the first refrigerant flow channel (1123) and the second refrigerant flow channel (1142). The plant cooling water system (130) is connected to the cooling water channel (1122) and is used to transport cooling water through the cooling water channel (1122) to absorb the heat of the refrigerant in the first refrigerant channel (1121) and / or the refrigerant in the first refrigerant channel (1123).

2. The semiconductor temperature control device according to claim 1, characterized in that, The refrigerant circulation system (120) further includes a heater (124) disposed on a pipe section between the second refrigerant channel (1142) and the process chamber (121).

3. The semiconductor temperature control device according to claim 2, characterized in that, The refrigerant circulation system (120) also includes a proportional valve (125), one end of which is connected to the pipe section between the process chamber (121) and the first control valve (122), and the connection position is upstream of the connection position of the second control valve (123). The other end of the proportional valve (125) is connected to the pipe section between the second refrigerant flow channel (1142) and the heater (124).

4. The semiconductor temperature control device according to claim 2, characterized in that, The heater (124) is equipped with a first temperature detection device (126) at its input terminal; and / or, The process chamber (121) is equipped with a second temperature detection device (127) at its input end.

5. The semiconductor temperature control device according to claim 1, characterized in that, The refrigerant circulation system (120) further includes a one-way valve (1291), which is located on the pipe section between the first refrigerant flow channel (1123) and the second refrigerant flow channel (1142), and is upstream of the connection position of the second control valve (123).

6. The semiconductor temperature control device according to claim 1, characterized in that, The refrigerant circulation system (120) further includes a water pump (1292) and a water tank (1293). The water pump (1292) is located on the pipe section between the process chamber (121) and the first control valve (122). The water tank (1293) is selectively connected to the input end of the water pump (1292).

7. A method for controlling a semiconductor temperature control device, applied to the semiconductor temperature control device (100) as described in any one of claims 1-6, characterized in that, The semiconductor temperature control device control method includes: When the target liquid supply temperature in the process chamber (121) is less than or equal to the first preset temperature, the compressor (111) is started, and the first control valve (122) is closed and the second control valve (123) is opened. When the target liquid supply temperature is greater than the first preset temperature and less than or equal to the second preset temperature, the compressor (111) is controlled to start, and the first control valve (122) is controlled to open and the second control valve (123) is controlled to close. When the target liquid supply temperature is greater than the second preset temperature, the compressor (111) is stopped, and the first control valve (122) is opened and the second control valve (123) is closed.

8. The semiconductor temperature control device control method according to claim 7, characterized in that, The semiconductor temperature control device control method further includes: Obtain the inlet temperature of the heater (124); Select a preset temperature difference corresponding to the target liquid supply temperature and the initial opening degree of the proportional valve (125); When the inlet temperature is less than the difference between the target liquid supply temperature and the preset temperature difference, the proportional valve (125) is controlled to open at the initial opening degree, and the heater (124) is controlled to remain off. When the inlet temperature is greater than or equal to the difference between the target liquid supply temperature and the preset temperature difference, but less than the target liquid supply temperature, the heater (124) is controlled to start.

9. The semiconductor temperature control device control method according to claim 8, characterized in that, After the step of controlling the proportional valve (125) to open at the initial opening degree, the method further includes: Obtain the actual liquid supply temperature of the process chamber (121); If the duty cycle of the heater (124) is less than or equal to the first preset duty cycle value, and the difference between the actual liquid supply temperature and the target liquid supply temperature is greater than or equal to the first preset value, then the proportional valve (125) is controlled to reduce the first preset opening value every first preset time interval. If the duty cycle of the heater (124) is greater than the second preset duty cycle value, or the difference between the actual liquid supply temperature and the target liquid supply temperature is less than the second preset value, then the proportional valve (125) is controlled to increase the second preset opening value every second preset time interval.

10. The semiconductor temperature control device control method according to claim 8, characterized in that, Following the step of controlling the heater (124) to start, the method further includes: Obtain the actual liquid supply temperature of the process chamber (121); If the actual liquid supply temperature is less than the target liquid supply temperature, then the duty cycle of the heater (124) is increased; If the actual liquid supply temperature is greater than the target liquid supply temperature, then the duty cycle of the heater (124) is reduced.

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