A chip processing burning device

Abstract

The application discloses a burning device for chip processing and relates to the technical field of chip processing. The burning device comprises a workbench, a bottom plate fixed on the workbench, a burning assembly installed on the bottom plate, an adjusting mechanism installed on the workbench and a rectifying assembly. The burning device is provided with the rectifying assembly. The rectifying rod with a lower end surface lower than the silica gel suction head is used to realize double automatic rectification in the two key processes of chip material taking and burning butt joint. When the material is taken, the rectifying rod is first slidably connected with the upper inclined surface of the storage groove of the material loading disc. The multidirectional sliding structure of the sliding block, the convex strip and the horizontal rod can realize the bidirectional fine adjustment of the silica gel suction head X axis and Y axis, automatically calibrate the central axis of the suction head and the chip, ensure the central adsorption of the chip and complete the secondary accurate centering of the chip and the burning seat positioning groove according to the same principle when the chip is butted against the burning seat, thereby significantly improving the chip burning qualification rate.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, specifically to a chip processing programming device. Background Technology

[0002] Chip programming is a core process in chip manufacturing. It involves writing program data into the chip's internal storage using specialized programming equipment. This is a crucial step in ensuring the chip achieves its preset functions. Currently, automated chip programming production lines commonly use conveyor belts in conjunction with vacuum suction transfer mechanisms to complete the chip loading, transfer, and programming installation operations. However, existing programming devices still have many technical shortcomings in practical use, which limit the accuracy and production efficiency of chip programming. Existing vacuum adsorption transfer mechanisms have a simple structure and cannot complete secondary precise correction in the two key processes of chip picking and loading docking. The alignment accuracy is insufficient and cannot meet the requirements of high-precision chip programming. For example, the storage tank of the carrier tray is prone to positional deviation during the transportation process, and there are mechanical fit gaps in the X and Y axis drive movement of the transfer mechanism. This makes it difficult for the central axis of the suction head to be precisely aligned with the central axis of the chip when picking up the chip. This can easily lead to problems such as chip offset and skew. After the chip is offset, when it is directly transferred to the programming socket for installation, it will cause misalignment between the chip and the positioning groove of the programming socket. This will not only lead to programming failure and chip pin wear and damage, but also cause damage to the programming socket structure in severe cases, which will significantly increase the product defect rate and equipment maintenance costs. Summary of the Invention

[0003] The purpose of this invention is to provide a chip processing programming apparatus to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a chip processing programming device, comprising a worktable, a base plate fixed on the worktable, a programming component mounted on the base plate, the programming component being used to position the chip body, an adjustment mechanism also being mounted on the worktable, the adjustment mechanism being composed of a Y-axis drive mechanism consisting of a motor and a lead screw and an X-axis drive mechanism consisting of a linear motor, and the adjustment mechanism being used to drive a movable block to move in the X-axis and Y-axis directions, a cylinder being fixed on the movable block, a positioning component being fixed at the output end of the cylinder, and a correction component being mounted on the positioning component, the correction component cooperating with the positioning component to achieve the automatic centering, transfer and installation of the chip body.

[0005] Preferably, a conveyor belt is provided on the upper side of the workbench, and a material tray is provided on the conveyor belt. The material tray is provided with storage troughs evenly distributed, and the chip body is nested in the storage trough. Through the above structure, the chip body can be conveyed and fed, ensuring the normal operation of the device.

[0006] Preferably, the programming component includes programming sockets fixed at equal intervals on the base plate, and the programming sockets are provided with positioning slots. The positioning slots and the chip body are nested together. By nesting the chip body and the positioning slots, the normal progress of subsequent programming can be ensured.

[0007] Preferably, the programming socket is symmetrically connected to a limiting plate, and the limiting plate contacts the chip body to achieve positioning. The limiting plate is connected to the bracket through a first spring, and the bracket is symmetrically fixed on the outside of the programming socket. The elastic action of the first spring can provide a basic force for the automatic reset of the limiting plate. Through the action of the limiting plate, the positioning of the chip body can be achieved, ensuring the stability of the chip body installation.

[0008] Preferably, the limiting plate is fixed to one end of the connecting rod, and the other end of the connecting rod is fixed with an inclined plate. The connecting rod and the bracket are slidably connected. When the limiting plate moves, the sliding guide between the connecting rod and the bracket can ensure the stability of the limiting plate's movement. The inclined plate can provide a basic guarantee for the normal movement of the limiting plate.

[0009] Preferably, the inclined panel contacts the roller and is symmetrically rotated on the mounting frame. A guide rod is fixed on the mounting frame, and the guide rod is slidably connected to the support frame. The support frame is fixed on the base plate. When the guide rod is subjected to force and moves downward, the rolling action between the roller and the inclined panel can provide a basic force for the movement of the inclined panel, thereby ensuring the normal operation of the device.

[0010] Preferably, the positioning component includes a fixed bracket fixed to the cylinder output end, and a pressure plate is fixed on the fixed bracket. The fixed bracket is fixed to one end of the second spring, and the other end of the second spring is fixed to the slider. The slider is also symmetrically fixed with protrusions on the top and bottom, and the protrusions are slidably connected to the fixed bracket. When the slider moves relative to the fixed bracket, it can achieve fine adjustment of the silicone suction head in the Y-axis direction. The sliding action between the protrusions and the fixed bracket can ensure the stability of the slider movement. In addition, the elastic action of the second spring can provide a basic force for the automatic reset of the slider.

[0011] Preferably, the slider and the crossbar are slidably connected, and the crossbar is symmetrically fixed on the air tube. The air tube is connected to the vacuum generator through a conduit. A third spring is fixed between the air tube and the slider. A silicone suction head is fixed at the lower end of the air tube. Through the sliding action between the crossbar and the slider, the silicone suction head can be finely adjusted in the X-axis direction. Combined with the elastic action of the third spring, it can provide a basic force for the automatic reset of the silicone suction head, thereby achieving precise automatic alignment between the silicone suction head and the chip body, better meeting the transfer and installation requirements of the chip body.

[0012] Preferably, the correction assembly includes a movable ring slidably connected to the outside of the air tube, and a fourth spring is fixed between the movable ring and the air tube. Four correction rods are fixed on the movable ring, and the lower side of each correction rod has an inclined surface structure. The correction rods can slide in contact with the upper inclined surface of the storage tank and the upper inclined surface of the positioning slot. The lower end face of the correction rod is lower than the lower end face of the silicone suction head. The sliding action between the movable ring and the air tube ensures the stability of the movable ring's movement. The elastic action of the fourth spring provides a basic force for the automatic reset of the movable ring. The sliding action between the correction rods and the storage tank and positioning slot provides a basic force for the automatic centering and positioning of the silicone suction head and the chip body, thereby ensuring the normal operation of the device.

[0013] Preferably, the correction rod is further connected to a rotatable swing plate, and a torsion spring is connected between the swing plate and the correction rod. The swing plate contacts the baffle for positioning, and the baffle is fixed to the correction rod. The swing plate is slidably connected to the drive rod, the drive rod is slidably connected to the correction rod, and the drive rod is slidably connected to the inclined groove block. A limit rod is fixed on the inclined groove block, and the limit rod is slidably connected to the correction rod and engaging with the annular groove on the air pipe. The swinging action of the swing plate can drive the drive rod to move, and the drive rod can drive the inclined groove block and the limit rod to move, thereby providing the basic force for unlocking the movable ring. The baffle can limit the rotation angle of the swing plate to ensure the normal operation of the device.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. This chip processing and programming device is equipped with a correction component. Utilizing a correction rod whose lower end face is lower than the silicone suction head, it can achieve dual automatic correction in two key processes: chip picking and programming docking. During picking, the correction rod first slides against the inclined surface on the upper side of the material tray storage groove. With the help of a multi-directional sliding structure of slider, convex bar, and crossbar, it can achieve bidirectional micro-adjustment of the silicone suction head along the X and Y axes, automatically calibrating the central axis of the suction head and the chip to ensure centered chip adsorption. When the chip is docked with the programming socket, it can achieve secondary precise alignment between the chip and the positioning groove of the programming socket based on the same principle. This completely solves the chip alignment misalignment problem caused by mechanical clearance, conveying deviation, and assembly error, fundamentally avoiding problems such as chip docking misalignment, programming failure, and pin damage, and significantly improving the chip programming pass rate. 2. This chip processing and burning device, through the engagement and disengagement structure of the limiting rod and the annular groove of the air tube, combined with the linkage structure of the swing plate, torsion spring, inclined groove block and drive rod, realizes automatic locking and unlocking during the correction process. During the correction and centering operation, the limiting rod engages with the annular groove to complete the structural locking, ensuring the alignment accuracy of the correction fine adjustment process. After the correction is completed, the locking can be automatically released, allowing the silicone suction head to move down independently to adsorb the chip. The structural linkage is precise and the action is smooth. At the same time, after the operation is completed, each spring and torsion spring can drive the correction component and positioning component to automatically reset and calibrate, ensuring the alignment accuracy of the equipment for long-term continuous operation. 3. This chip processing and programming device achieves automatic avoidance and reset of the limiting plate through the linkage transmission of the pressure plate, guide rod, mounting bracket, roller and inclined plate. During the chip lowering and installation process, the pressure plate squeezes the guide rod to drive the roller to move, driving the limiting plates on both sides to automatically retract outward to avoid the chip, completely eliminating the problem of hard collision and jamming between the chip and the limiting plate, ensuring that the chip is stably embedded into the positioning slot. After the chip is installed, the first spring drives the limiting plate to automatically reset, elastically limiting and fixing the chip, ensuring that the chip position is stable during the programming process, preventing data writing abnormalities caused by chip displacement during programming, and taking into account both installation convenience and operational stability. Attached Figure Description

[0015] Figure 1 This is a frontal three-dimensional structural diagram of the overall composition of the device of the present invention; Figure 2 This is a frontal three-dimensional structural diagram of the base plate of the present invention; Figure 3 This is a frontal cross-sectional three-dimensional structural diagram of the programming component of the present invention; Figure 4 This is a bottom-view three-dimensional structural diagram of the positioning component of the present invention; Figure 5 This is a frontal cross-sectional three-dimensional structural diagram of the positioning component of the present invention; Figure 6 This is a bottom-view cross-sectional three-dimensional structural diagram of the correction component of the present invention; Figure 7 This is a frontal cross-sectional three-dimensional structural diagram of the correction component of the present invention.

[0016] In the diagram: 1. Workbench; 2. Conveyor belt; 3. Material tray; 4. Storage tank; 5. Chip body; 6. Base plate; 7. Programming assembly; 701. Programming socket; 702. Positioning groove; 703. Limiting plate; 704. First spring; 705. Bracket; 706. Connecting rod; 707. Slanted panel; 708. Roller; 709. Mounting bracket; 710. Guide rod; 711. Support frame; 8. Adjustment mechanism; 9. Movable block; 10. Cylinder; 11. Positioning assembly ; 1101, Fixing frame; 1102, Pressure plate; 1103, Second spring; 1104, Slider; 1105, Protruding strip; 1106, Crossbar; 1107, Air tube; 1108, Third spring; 1109, Silicone suction head; 12, Correction assembly; 1201, Movable ring; 1202, Fourth spring; 1203, Correction rod; 1204, Swing plate; 1205, Baffle; 1206, Drive rod; 1207, Inclined groove block; 1208, Limiting rod. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Please see Figures 1-7 This invention provides a technical solution: a chip processing programming device, including a worktable 1, a base plate 6 fixed on the worktable 1, and a programming component 7 installed on the base plate 6. The programming component 7 is used to position the chip body 5. An adjustment mechanism 8 is also installed on the worktable 1. The adjustment mechanism 8 consists of a Y-axis drive mechanism composed of a motor and a lead screw and an X-axis drive mechanism composed of a linear motor. The adjustment mechanism 8 is used to drive a movable block 9 to move in the X-axis and Y-axis directions. A cylinder 10 is fixed on the movable block 9. A positioning component 11 is fixed at the output end of the cylinder 10. A correction component 12 is installed on the positioning component 11. The correction component 12 cooperates with the positioning component 11 to realize the automatic centering and transfer installation of the chip body 5.

[0019] A conveyor belt 2 is provided on the upper side of the workbench 1, and a material tray 3 is provided on the conveyor belt 2. Storage troughs 4 are evenly distributed on the material tray 3, and chip bodies 5 are nested within the storage troughs 4. The positioning assembly 11 includes a fixing frame 1101 fixed to the output end of the cylinder 10, and a pressure plate 1102 is fixed on the fixing frame 1101. One end of the fixing frame 1101 is fixed to one end of the second spring 1103, and the other end of the second spring 1103 is fixed to the slider 1104. The slider 1104 is also symmetrically fixed with protrusions 110. 5. Simultaneously, the convex strip 1105 and the fixed frame 1101 are slidably connected; the slider 1104 and the crossbar 1106 are slidably connected, and the crossbar 1106 is symmetrically fixed on the air tube 1107. The air tube 1107 is connected to the vacuum generator through a conduit. At the same time, a third spring 1108 is fixed between the air tube 1107 and the slider 1104, and a silicone suction head 1109 is fixed at the lower end of the air tube 1107. The correction assembly 12 includes a movable ring 1201 slidably connected to the outside of the air tube 1107, and the movable ring 1201... A fourth spring 1202 is fixed between the air tube 1107 and the duct 1107, and four correction rods 1203 are fixed on the movable ring 1201. The lower side of each correction rod 1203 has an inclined surface structure, allowing it to slide against the upper inclined surface of the storage tank 4 and the upper inclined surface of the positioning groove 702. The lower end face of the correction rod 1203 is lower than the lower end face of the silicone suction head 1109. A rotatable swing plate 1204 is also connected to the correction rod 1203, and a torsion spring connects the swing plate 1204 to the correction rod 1203. 04. Positioning is achieved by contacting the baffle 1205. At the same time, the baffle 1205 is fixed on the correction rod 1203. The swing plate 1204 and the drive rod 1206 are slidably connected. The drive rod 1206 and the correction rod 1203 are also slidably connected. The drive rod 1206 and the inclined groove block 1207 are also slidably connected. At the same time, the inclined groove block 1207 is fixed with a limit rod 1208. The limit rod 1208 and the correction rod 1203 are slidably connected. The limit rod 1208 and the annular groove on the air pipe 1107 are engaged. When using the chip processing programming device, such as Figures 1-7As shown, the conveyor belt 2 first transports the material tray 3 to the loading position for subsequent transfer and loading of the chip body 5. During loading of the chip body 5, the adjusting mechanism 8 drives the movable block 9, cylinder 10, fixing frame 1101, and silicone suction head 1109 to move in the X-axis or Y-axis direction, causing the silicone suction head 1109 to move above the chip body 5 to be transferred. At this time, by controlling the extension of the cylinder 10, the fixing frame 1101 can be moved downwards, causing the silicone suction head 1109 to approach the chip body 5 in the storage tank 4 on the material tray 3. Because the lower end face of the correction rod 1203 is lower than the lower end face of the silicone suction head 1109, the correction rod 1203 will first contact the upper inclined surface of the storage tank 4. When there is a certain deviation between the central axis of the silicone suction head 1109 and the central axis of the storage tank 4, the limiting rod 1208 and the annular groove on the air pipe 1107... When the components are in a locked state, the sliding action between the correction rod 1203 and the upper inclined surface of the storage tank 4 allows the movable ring 1201, air tube 1107, and silicone suction head 1109 to move under force. The sliding action between the crossbar 1106 and the slider 1104 enables the silicone suction head 1109 to be finely adjusted in the X-axis direction. Combined with the sliding guide action between the protrusion 1105 and the fixing frame 1101, the slider 1104 can be finely adjusted in the Y-axis direction, thereby enabling the silicone suction head 1109 to be finely adjusted in the Y-axis direction. Through the fine-tuning of the silicone suction head 1109 in the X-axis and Y-axis directions, the central axis of the silicone suction head 1109 can be ensured to coincide with the central axis of the storage tank 4, thereby aligning the central axis of the silicone suction head 1109 with the central axis of the chip body 5 in the storage tank 4, achieving automatic centering of the silicone suction head 1109 and the chip body 5. When the correction rod 1203 slides against the upper inclined surface of the storage tank 4 to achieve correction, the swing plate 1204 simultaneously contacts the loading plate 3. When the correction rod 1203 moves downward relative to the upper inclined surface of the storage tank 4, the swing plate 1204 is subjected to force and deflects relative to the correction rod 1203. Through the rotation of the correction rod 1203 and the sliding action between the correction rod 1203 and the drive rod 1206, the drive rod 1206 can be subjected to force relative to the correction rod 1203. 3. Moving upwards, in conjunction with the sliding guide action between the drive rod 1206 and the correction rod 1203, ensures the stability of the drive rod 1206's movement. Furthermore, when the drive rod 1206 moves upwards relative to the correction rod 1203, the sliding action between the drive rod 1206 and the inclined block 1207 allows the limit rod 1208 to be forced to move outwards from the correction rod 1203. When the inclined surface of the correction rod 1203 is completely in contact with the upper inclined surface of the storage tank 4, thus achieving… The positioning function of the current correction rod 1203 is such that the limiting rod 1208 is separated from the annular groove on the air tube 1107, thereby releasing the locking effect on the movable ring 1201. By extending the cylinder 10, the fixing frame 1101 and the silicone suction head 1109 can continue to move downward. Since the positions of the correction rod 1203 and the movable ring 1201 are limited at this time, the silicone suction head 1109 can move downward relative to the movable ring 1201 until the silicone suction head 1109 contacts the chip body 5. With the action of the vacuum generator, the chip body 5 can be adsorbed and fixed. According to the above principle, through the locking action between the limiting rod 1208 and the annular groove on the air tube 1107, automatic centering can be achieved before the silicone suction head 1109 adsorbs the chip body 5. After centering, the limiting rod 1208 is separated from the annular groove on the air tube 1107 to unlock, so as to achieve the centered adsorption and fixing of the chip body 5. The programming assembly 7 includes a programming socket 701 fixed at equal intervals on the base plate 6, and a positioning groove 702 is provided on the programming socket 701, and the positioning groove 702 is nested with the chip body 5; a limiting plate 703 is symmetrically slidably connected to the programming socket 701, and the limiting plate 703 contacts the chip body 5 to achieve positioning, and the limiting plate 703 is connected to the bracket 705 through a first spring 704, while the bracket 705 is symmetrically fixed on the outside of the programming socket 701; The limiting plate 703 is fixed to one end of the connecting rod 706, and the other end of the connecting rod 706 is fixed with a slanted plate 707. The connecting rod 706 is slidably connected to the bracket 705. The slanted plate 707 contacts the roller 708 and is symmetrically rotated on the mounting frame 709. The mounting frame 709 is fixed with a guide rod 710, and the guide rod 710 is slidably connected to the support frame 711. The support frame 711 is fixed on the base plate 6. After the chip body 5 is centrally adsorbed and fixed, as follows Figures 1-7As shown, by controlling the retraction of the cylinder 10, the fixing frame 1101 can be moved upward and reset, thereby separating the chip body 5 from the storage tank 4 to realize the transfer of the chip body 5. During the reset process of the fixing frame 1101, when the correction rod 1203 is separated from the storage tank 4, the second spring 1103 and the third spring 1108 can automatically reset the central axis of the silicone suction head 1109 to coincide with the central axis of the cylinder 10. With the action of the fourth spring 1202, the movable ring 1201 can be automatically reset. With the action of the torsion spring, the swing plate 1204 and the limiting rod 1208 can be reset, so that the limiting rod 1208 can engage with the annular groove on the air pipe 1107 to achieve positioning. After the fixing bracket 1101 is reset, the chip body 5 can be moved above a positioning groove 702 by the adjusting mechanism 8. Based on the above principle, the extension of the cylinder 10 can drive the movable block 9, the cylinder 10, the fixing bracket 1101, the silicone suction head 1109, and the chip body 5 to move downwards, so as to realize the installation function of the chip body 5. During the downward movement of the fixing bracket 1101, when the pressure plate 1102 contacts the guide rod 710, the correction rod 1203 does not contact the upper inclined surface of the positioning groove 702. The downward movement applies pressure to the guide rod 710, causing it to move downwards. This, in turn, moves the mounting bracket 709 and roller 708 downwards. Combined with the rolling action between the roller 708 and the inclined surface of the inclined panel 707, the connecting rod 706 is moved under force, causing the limiting plate 703 to move outwards from the programming socket 701. This continues until the roller 708 rolls away from the inclined surface of the inclined panel 707 and contacts the vertical surface of the inclined panel 707. At this point, the limiting plate 703 is completely retracted into the programming socket 701, achieving an active avoidance function and facilitating... The chip body 5 is nested within the positioning groove 702. When the roller 708 rolls to contact the vertical surface of the inclined panel 707, the correction rod 1203 contacts the upper inclined surface of the positioning groove 702. If there is a certain deviation between the central axis of the chip body 5 and the central axis of the positioning groove 702, the chip body 5 and the positioning groove 702 can be automatically aligned through the sliding action between the inclined surface of the correction rod 1203 and the upper inclined surface of the positioning groove 702 (similar to the aforementioned alignment achieved by sliding the correction rod 1203 against the storage tank 4). To achieve precise docking and installation of the chip body 5, the chip body 5 is finally installed in the positioning slot 702. This avoids the impact of chip body 5 installation deviation on the normal progress of subsequent programming. After the chip body 5 is installed, the negative pressure is released and the device can be moved upward and reset by the retraction of the cylinder 10. When the pressure plate 1102 moves upward and separates from the guide rod 710, the elastic action of the first spring 704 can reset the limiting plate 703 to achieve the limiting effect of the chip body 5, ensuring the normal progress of subsequent programming of the chip body 5.

[0020] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0021] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A chip processing programming apparatus, comprising a worktable (1), characterized in that: A base plate (6) is fixed on the workbench (1), and a programming component (7) is installed on the base plate (6). The programming component (7) is used to position the chip body (5). An adjustment mechanism (8) is also installed on the workbench (1). The adjustment mechanism (8) is composed of a Y-axis drive mechanism consisting of a motor and a lead screw and an X-axis drive mechanism consisting of a linear motor. The adjustment mechanism (8) is used to drive the movable block (9) to move in the X-axis and Y-axis directions. A cylinder (10) is fixed on the movable block (9). A positioning component (11) is fixed at the output end of the cylinder (10). A correction component (12) is installed on the positioning component (11). The correction component (12) and the positioning component (11) work together to achieve the automatic centering and transfer installation of the chip body (5).

2. The chip processing programming apparatus according to claim 1, characterized in that: The workbench (1) is provided with a conveyor belt (2) on the upper side, and a material tray (3) is provided on the conveyor belt (2). The material tray (3) is provided with storage troughs (4) evenly, and a chip body (5) is nested in the storage trough (4).

3. The chip processing programming apparatus according to claim 1, characterized in that: The programming component (7) includes a programming socket (701) fixed at equal intervals on the base plate (6), and a positioning groove (702) is provided on the programming socket (701), and the positioning groove (702) and the chip body (5) are nested together.

4. The chip processing programming apparatus according to claim 3, characterized in that: The programming socket (701) is symmetrically connected to a limiting plate (703), and the limiting plate (703) contacts the chip body (5) to achieve positioning. The limiting plate (703) is connected to the bracket (705) through a first spring (704), and the bracket (705) is symmetrically fixed on the outside of the programming socket (701).

5. The chip processing programming apparatus according to claim 4, characterized in that: The limiting plate (703) is fixed to one end of the connecting rod (706), and the other end of the connecting rod (706) is fixed with a slanted plate (707). The connecting rod (706) and the bracket (705) are slidably connected.

6. The chip processing programming apparatus according to claim 5, characterized in that: The inclined panel (707) contacts the roller (708), and the inclined panel (707) is symmetrically rotated and connected to the mounting frame (709). A guide rod (710) is fixed on the mounting frame (709), and the guide rod (710) is slidably connected to the support frame (711). The support frame (711) is fixed on the base plate (6).

7. The chip processing programming apparatus according to claim 6, characterized in that: The positioning component (11) includes a fixing frame (1101) fixed to the output end of the cylinder (10), and a pressure plate (1102) is fixed on the fixing frame (1101). The fixing frame (1101) is fixed to one end of the second spring (1103), and the other end of the second spring (1103) is fixed on the slider (1104). The slider (1104) is also symmetrically fixed with protrusions (1105) on the upper and lower sides, and the protrusions (1105) are slidably connected to the fixing frame (1101).

8. The chip processing programming apparatus according to claim 7, characterized in that: The slider (1104) and the crossbar (1106) are slidably connected, and the crossbar (1106) is symmetrically fixed on the air tube (1107). The air tube (1107) is connected to the vacuum generator through a conduit. At the same time, a third spring (1108) is fixed between the air tube (1107) and the slider (1104). A silicone suction head (1109) is fixed at the lower end of the air tube (1107).

9. The chip processing programming apparatus according to claim 8, characterized in that: The correction assembly (12) includes a movable ring (1201) slidably connected to the outside of the air tube (1107), and a fourth spring (1202) is fixed between the movable ring (1201) and the air tube (1107). Four correction rods (1203) are fixed on the movable ring (1201). The lower side of the correction rod (1203) is a slope structure. The correction rod (1203) can slide in contact with the upper slope of the storage tank (4) and the upper slope of the positioning groove (702). The lower end face of the correction rod (1203) is lower than the lower end face of the silicone suction head (1109).

10. A chip processing programming apparatus according to claim 9, characterized in that: The correction rod (1203) is also connected to a rotatable swing plate (1204), and a torsion spring is connected between the swing plate (1204) and the correction rod (1203). The swing plate (1204) contacts the baffle (1205) for positioning, and the baffle (1205) is fixed on the correction rod (1203). The swing plate (1204) is slidably connected to the drive rod (1206), and the drive rod (1206) is slidably connected to the correction rod (1203). The drive rod (1206) is slidably connected to the inclined groove block (1207), and a limit rod (1208) is fixed on the inclined groove block (1207). The limit rod (1208) is slidably connected to the correction rod (1203), and the limit rod (1208) is engaged with the annular groove on the air pipe (1107).

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