A SOC decoupling type IVI multi-channel multi-protocol anti-electromagnetic interference switching and isolation system and method

Abstract

The application relates to the field of vehicle-mounted information entertainment technology, in particular to a SOC decoupling type IVI multi-channel multi-protocol anti-electromagnetic interference switching and isolation system and method, which comprises a SOC master module, an IVI communication integrated module, a multi-protocol interface module and a multi-element isolation power supply and physical interface integrated module. The IVI communication integrated module communicates with the SOC master module through a unified slave interface, calls a configuration mapping table according to an access equipment identifier, and links and adapts interface configurations of each module. The multi-protocol interface module selectively integrates various physical layer interfaces, terminates peripheral device protocols at the physical layer, and realizes signal transmission through signal line mapping. The multi-element isolation power supply and physical interface integrated module provides a hierarchical isolation power supply domain to inhibit electromagnetic interference, and realizes multi-protocol signal pin multiplexing mapping through multiplexing physical plug-in components. The application offloads multi-protocol analysis, isolation and plug-in mapping from the SOC to an independent switching layer, and solves the problems of high SOC iteration sunk cost, difficult interface expansion and limited panel interface.

Description

Technical Field

[0001] This invention relates to the field of in-vehicle infotainment technology, specifically to a SOC-decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system and method. Background Technology

[0002] When connecting peripherals, in-vehicle infotainment (IVI) systems typically face four major challenges: rapid market demand iteration, the initial design of the main control SoC faces the risk of becoming obsolete before mass production, and changing the SoC selection will overturn existing product designs and testing plans, resulting in huge sunk costs; non-standard and multi-protocol interfaces of in-vehicle peripherals require the system to have sufficiently rich interface resources; the high electromagnetic interference environment of in-vehicle systems requires highly robust product designs; and the limited space in the vehicle body structure limits the number of panel interfaces and makes them significantly different.

[0003] To address the aforementioned issues, there are three main technical approaches within the industry.

[0004] Route 1 is a high-configuration, highly integrated SOC solution, such as CN216772414U and CN218661677U. This solution stacks the main control SOC and various functional components on a single board or a highly coupled structure board. The main control SOC and physical interfaces are directly connected via on-board traces. The main control SOC directly handles all physical layer interface protocol parsing and management. This solution tightly couples the main control SOC with the physical interfaces; replacing the main control SOC inevitably requires a complete board redesign. The product lifecycle is limited by the main control SOC's supply cycle and technological iteration speed, making it only suitable for highly scaled market applications.

[0005] Route two is a main control SOC core board architecture solution, such as CN210630173U and CN210793057U. This solution uses a relatively flexible SOC core board form factor, with pre-drilled holes on the motherboard for the core board to connect. However, all peripheral communication protocols are still processed and parsed by the core board. While this solution achieves physical separation between the core board and the motherboard, the management and parsing of external communication protocols are still directly handled by the main control SOC. The EMI isolation and physical interface reuse required for vehicle adaptation still need to be customized for different vehicle models. This solution has not yet systematically resolved the sunk cost issues and limited interface resources resulting from SOC iteration.

[0006] Route 3 is a virtualization solution within the main control SoC, such as CN119576596A, which utilizes the resources of a multi-core heterogeneous SoC to perform virtualization partitioning and hard isolation within the chip. This solution runs the protocol stacks and interface management of each functional module in different virtual partitions within the same main control SoC. Once the main control SoC is replaced, the entire protocol stack and interface drivers need to be redeveloped and verified, exacerbating cost pressures.

[0007] In the existing technology, there is no systematic architecture solution that is between the IVI master control SOC and the peripheral device, communicates with the master control SOC through a unified slave interface, offloads the multi-protocol physical layer interface management function from the master control SOC to an independent transfer layer, and simultaneously realizes hierarchical isolation of power domains and physical pin multiplexing mapping. As a result, the above four types of contradictions cannot be alleviated at the same architecture.

[0008] To address the aforementioned issues, we propose an improved SOC-decoupled IVI multi-channel multi-protocol electromagnetic interference-resistant switching and isolation system and method. Summary of the Invention

[0009] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0010] The first aspect of this invention provides a SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system, comprising: an SOC main control module, an IVI communication integration module, a multi-protocol interface module, and a multi-electrode isolation power supply and physical interface integration module; the IVI communication integration module communicates with the SOC main control module through a unified slave interface and is configured to call a pre-stored configuration mapping table according to the access device identifier, and to adapt the external interface configuration of the multi-protocol interface module and the multi-electrode isolation power supply and physical interface integration module; the multi-protocol interface module is configured to selectively integrate multiple physical layer interfaces according to a preset optional configuration, and terminate the communication protocol of the external device at the physical layer, and realize signal transmission with the SOC main control module through physical layer signal routing mapping; the multi-electrode isolation power supply and physical interface integration module is connected to the power supply circuit of each module, is configured to provide hierarchical isolation power domains for different physical layer interfaces, and is provided with a multiplexed physical plug component for multiplexing and mapping the signal pins of multiple physical layer interfaces to the physical pins of the multiplexed physical plug component.

[0011] As a preferred embodiment of the present invention, the multi-protocol interface module is materialized as an independently set interface adapter board.

[0012] As a preferred embodiment of the present invention, the multiple physical layer interfaces include a high-speed physical layer interface group and a low-speed physical layer interface group; the high-speed physical layer interface group includes at least one or a combination of optical interface, automotive Ethernet PHY and USB interface; the low-speed physical layer interface group includes at least one or a combination of CAN bus, UART serial port, AD signal and IO signal.

[0013] As a preferred embodiment of the present invention, the hierarchical isolation power domain includes: a digital isolation and low-noise power domain for high-speed physical layer interfaces, and an analog ground isolation for low-speed physical layer interfaces.

[0014] As a preferred embodiment of the present invention, the multi-element isolated power supply and physical interface integration module further includes a plug-in identification detection unit; the plug-in identification detection unit is configured to obtain the identification of the accessed device through an active configuration mode or a passive detection mode; the active configuration mode is a fixed configuration preset by the user according to the user's specified requirements before the product leaves the factory; the passive detection mode obtains the identification of the accessed device by detecting the voltage divider resistor value and / or scanning the CAN baud rate; the IVI communication integration module has a pre-stored mapping relationship library between device identification and service type, and in response to the output signal of the plug-in identification detection unit, calls the configuration mapping table that matches the accessed device identification.

[0015] As a preferred technical solution of the present invention, a custom private interface is also provided between the SOC main control module and the IVI communication integration module to be compatible with old interfaces and specially defined interfaces, so as to achieve backward compatibility.

[0016] As a preferred technical solution of the present invention, the system adopts a hierarchical PCB board material configuration: the SOC main control module and the IVI communication integration module adopt Class-grade PTFE board material; the multi-protocol interface module adopts Class-grade high TgFR- board material; and the multi-element isolation power supply and physical interface integration module adopts Class-grade ordinary FR- board material.

[0017] The second aspect of this invention provides a SOC-decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation method, used in any of the above-mentioned SOC-decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation systems, comprising the following steps:

[0018] S1, Power-on initialization, the IVI communication integration module loads the pre-stored default configuration mapping table, which defines the basic working parameters of various physical layer interfaces;

[0019] S2 detects the access device identifier of the multiplexed physical plug-in component and identifies the service type required by the currently accessed external device;

[0020] S3, based on the business model, retrieves preset optional configurations that match the business model, dynamically adjusts the enabling status of multi-protocol interface modules, and selectively activates target interfaces among various physical layer interfaces.

[0021] S4, based on the protocol type of the target interface, enable the corresponding hierarchical isolation power domain in the multi-isolation power supply and physical interface integration module;

[0022] S5, based on the correspondence between the target interface and the multiplexed physical plug-in component, issues a pin mapping table and controls the multiplexed physical plug-in component to switch the signal of the target interface to the corresponding physical pin, thereby achieving panel interface convergence.

[0023] As a preferred embodiment of the present invention, the detection access device identifier in S2 specifically includes:

[0024] The system reads the pre-set fixed configuration identifiers from the product before it leaves the factory through the active configuration mode; or...

[0025] The type of the currently accessed device is identified by detecting the voltage divider resistor value and / or scanning the CAN baud rate at the access device end in passive detection mode.

[0026] As a preferred technical solution of the present invention, enabling the corresponding hierarchical isolation power domain in the multi-element isolation power supply and physical interface integration module in S4 specifically includes: arranging π-type filters at the power input and output terminals of the multi-element isolation power supply and physical interface integration module respectively to control the power ripple within a preset threshold.

[0027] A star grounding strategy is adopted, connecting the digital ground, analog ground, and protective ground only to a single grounding point within the multi-element isolation power supply and physical interface integration module to suppress noise introduced by ground loop current.

[0028] The beneficial effects of this invention are as follows: 1. By using the IVI communication integration module to communicate with the SOC main control module through a unified slave interface, and calling the pre-stored configuration mapping table according to the access device identifier to adapt the external interface configuration of the multi-protocol interface module and the multi-isolated power supply and physical interface integration module, the iterative upgrade of the SOC main control module only needs to maintain the compatibility of the unified slave interface, without modifying the hardware design and driver software of the IVI communication integration module and downstream modules. This significantly reduces the product redesign and verification costs caused by the iteration of the main control SOC, and solves the problems of high sunk costs, short product life cycle and mass production difficulties caused by the rapid iteration of the main control SOC in vehicle IVI systems.

[0029] 2. The communication protocol of the external device is terminated at the physical layer through the multi-protocol interface module, and the signal transmission between the device and the SOC main control module is realized through physical layer signal routing mapping. Multiple physical layer interfaces are natively supported by the SOC main control module, without the need for intermediate protocol conversion chips or additional MCUs for protocol parsing. This avoids the additional occupation of the computing power of the SOC main control module and the binding dependence on specific protocol stacks in the scenario of multiple protocols coexisting. It solves the problems of high system complexity, difficulty in expansion, and rewriting of protocol stack when the SOC is replaced due to non-standard interfaces and multiple protocols coexisting.

[0030] 3. By integrating a multi-element isolated power supply and physical interface module, a hierarchical isolated power domain is provided for different physical layer interfaces. This suppresses vehicle electromagnetic interference from both power supply and grounding dimensions, solving the problem of high signal error rate in high electromagnetic interference environments and ensuring that the system operates stably and reliably in harsh electromagnetic environments such as engine ignition, motor inverter, and DC-DC switching noise.

[0031] 4. By multiplexing physical plug-in components, the signal pins of multiple physical layer interfaces are multiplexed and mapped to the physical pins of the same composite physical plug-in component, so that multiple peripheral signals converge to the output of the same composite physical plug-in component. The number of external physical interfaces does not increase with the increase of supported protocol types. This solves the problems of limited space in the vehicle body structure, limited number of panel interfaces and obvious differences between them, and reduces panel mold cost and wiring complexity.

[0032] 5. Through the systematic collaboration of the above four modules, the four types of contradictions—SOC iteration binding, non-standard interface expansion, high EMI interference, and limited panel interfaces—are alleviated simultaneously under a unified architecture. This significantly improves the hardware compatibility, electromagnetic robustness, and vehicle adaptation flexibility of the IVI system, providing a reliable technical path for the rapid iteration of customized in-vehicle IVI products. Attached Figure Description

[0033] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0034] Figure 1 This is an overall system block diagram of the present invention;

[0035] Figure 2 This is a schematic diagram of the multi-protocol interface module of the present invention;

[0036] Figure 3 This is a schematic diagram of the multi-element isolated power supply and physical interface integration module of the present invention;

[0037] Figure 4 This is a schematic diagram of the power supply method of the present invention;

[0038] Figure 5 This is a flowchart of the method of the present invention;

[0039] Figure 6 This is a schematic diagram of the SOC main control module structure of the present invention;

[0040] Figure 7 This is a schematic diagram of the IVI communication integrated module structure of the present invention;

[0041] Figure 8 This is a schematic diagram of the multi-protocol interface module structure of the present invention;

[0042] Figure 9 This is a schematic diagram of the integrated module structure of the multi-element isolated power supply and physical interface of the present invention.

[0043] In the diagram: 100, SOC main control module; 200, IVI communication integrated module; 300, multi-protocol interface module; 310, multiple physical layer interfaces; 311, high-speed physical layer interface group; 3111, optical interface; 3112, vehicle Ethernet PHY; 3113, USB interface; 312, low-speed physical layer interface group; 3121, CAN bus; 3122, UART serial port; 3123, AD signal; 3124, IO signal; 320, interface adapter board; 400, multi-element isolated power supply and physical interface integrated module; 410, hierarchical isolated power domain; 411, digital isolation and low-noise power domain; 412, analog ground isolation; 420, multiplexed physical plug-in component; 430, plug-in identification detection unit; 500, π-type filter. Detailed Implementation

[0044] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0045] An embodiment of the first aspect of the present invention provides a SOC-decoupled IVI multi-channel multi-protocol electromagnetic interference-resistant switching and isolation system. For example... Figures 1 to 3 , Figures 6 to 9 As shown, the system includes a SOC main control module 100, an IVI communication integration module 200, a multi-protocol interface module 300, and a multi-element isolated power supply and physical interface integration module 400.

[0046] The SOC main control module 100 and the IVI communication integration module 200 communicate bidirectionally via a unified slave interface. The SOC main control module 100 runs the main control program and upper-layer application software of the in-vehicle infotainment system, and sends data and commands to the IVI communication integration module 200 through the unified slave interface. The IVI communication integration module 200 is the system's switching and control core, and it pre-stores multiple sets of configuration mapping tables. These tables record the correspondence between access device identifiers and service types, as well as the corresponding interface configuration parameters. The IVI communication integration module 200 receives data and commands from the SOC main control module 100 through the unified slave interface, and simultaneously sends data or status information back to the SOC main control module 100 through a custom private interface.

[0047] The IVI communication integration module 200 is connected to the multi-protocol interface module 300 and the multi-element isolated power supply and physical interface integration module 400, respectively. The IVI communication integration module 200 is configured to call a pre-stored configuration mapping table based on the identifier of the connected device, and to adapt the external interface configurations of the multi-protocol interface module 300 and the multi-element isolated power supply and physical interface integration module 400 accordingly. Specifically, when an external device connects to the system, the IVI communication integration module 200 obtains the identification information of the connected device through the plug-in identification detection unit 430, then queries the pre-stored configuration mapping table, determines the required service type of the currently connected external device based on the device identifier, and then sends corresponding configuration signals to the multi-protocol interface module 300 and the multi-element isolated power supply and physical interface integration module 400.

[0048] The multi-protocol interface module 300 and the IVI communication integration module 200 are connected via physical layer signal traces. The multi-protocol interface module 300 is configured to selectively integrate multiple physical layer interfaces 310 according to preset optional configurations. The multi-protocol interface module 300 terminates the communication protocol of the external device at the physical layer; that is, the multi-protocol interface module 300 only performs physical layer signal grouping and trace mapping, without performing protocol parsing or format conversion of the data. The multi-protocol interface module 300 achieves signal transmission with the SOC main control module 100 through physical layer signal trace mapping. The physical layer signals of the external device are directly mapped to the corresponding physical layer interface of the SOC main control module 100 via the multi-protocol interface module 300, and the data is processed by the multiple physical layer protocols natively supported by the SOC main control module 100.

[0049] The multi-mode isolated power supply and physical interface integrated module 400 is connected to the power supply circuits of the SOC main control module 100, the IVI communication integrated module 200, and the multi-protocol interface module 300, respectively, to provide operating power for each module. The multi-mode isolated power supply and physical interface integrated module 400 is configured to provide hierarchical isolation power domains 410 for different physical layer interfaces. The hierarchical isolation power domains 410 include a digital isolation and low-noise power domain 411 for high-speed physical layer interfaces and an analog ground isolation domain 412 for low-speed physical layer interfaces. The multi-mode isolated power supply and physical interface integrated module 400 also includes a multiplexed physical connector assembly 420. The multiplexed physical connector assembly 420 is used to multiplex and map the signal pins of multiple physical layer interfaces 310 onto the physical pins of the multiplexed physical connector assembly 420 to achieve panel interface convergence.

[0050] The present invention provides a SOC-decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system. By setting the IVI communication integration module 200 as the switching and control core independent of the SOC main control module 100, the multi-protocol parsing, interface adaptation and EMI protection functions are offloaded from the SOC main control module 100 to an independent switching layer. This allows the iterative upgrade of the SOC main control module 100 to only maintain the compatibility of the unified slave interface, without modifying the hardware design of the IVI communication integration module 200 and downstream modules. This significantly reduces the sunk costs caused by the iteration of the SOC main control module 100 and solves the problems of long product development cycle, high verification cost and mass production difficulty caused by the rapid iteration of the main control SOC in vehicle IVI systems.

[0051] The communication protocol of the external device is terminated at the physical layer by the multi-protocol interface module 300 and signal transmission is achieved through physical layer signal routing mapping. Multiple physical layer interfaces 310 are natively supported by the SOC main control module 100, eliminating the need for intermediate protocol conversion chips. This avoids additional occupation of the computing power of the SOC main control module 100 in scenarios with multiple protocols coexisting, and solves the problems of high system complexity and difficulty in expansion caused by non-standard interfaces and multiple protocols coexisting.

[0052] The multi-element isolation power supply and physical interface integration module 400 provides hierarchical isolation power domains 410 for different physical layer interfaces. It provides digital isolation and low-noise power domains 411 for high-speed physical layer interfaces to ensure high-speed signal integrity, and provides analog ground isolation 412 for low-speed physical layer interfaces to prevent digital noise from coupling to analog signals through ground loops. It works in concert from the two dimensions of power supply and grounding to suppress vehicle electromagnetic interference and solve the problem of high signal bit error rate in high electromagnetic interference environment.

[0053] By multiplexing the signal pins of multiple physical layer interfaces 310 to the physical pins of the same physical plug-in component through the multiplexing physical plug-in component 420, multiple peripheral signals are converged to the output of the same composite physical plug-in component, which significantly reduces the number of panel interfaces, solves the problem of limited space in the vehicle body structure and limited number of panel interfaces, and reduces mold cost and wiring complexity.

[0054] In summary, this invention, through the collaborative work of four modules—the SOC main control module 100, the IVI communication integration module 200, the multi-protocol interface module 300, and the multi-element isolated power supply and physical interface integration module 400—simultaneously alleviates four types of contradictions under a unified architecture: SOC iteration binding, non-standard interface expansion, high EMI interference, and limited panel interfaces. This significantly improves the hardware compatibility, electromagnetic robustness, and vehicle adaptation flexibility of the IVI system.

[0055] In the above embodiments, this embodiment further defines the physical implementation form of the multi-protocol interface module 300 based on Embodiment 1. For example... Figure 2and Figure 8 As shown, the multi-protocol interface module 300 is materialized as an independently set interface adapter board 320.

[0056] The interface adapter board 320 is an independent printed circuit board assembly that can be plugged into and connected to the IVI communication integrated module 200 via a connector. The interface adapter board 320 has reserved pads for various physical layer interfaces, allowing for the selective mounting of different types of physical layer interface modules. The interface adapter board 320 is independently designed and can be replaced or selected individually according to different vehicle models or business needs, without requiring the replacement of the entire system motherboard.

[0057] The interface adapter board 320 is a passive printed circuit board. It does not contain a protocol conversion chip or a main control MCU; it only achieves direct connection between the physical layer signals of external devices and the unified slave interface through PCB traces. After an external device is connected to the interface adapter board 320, its physical layer signals are directly transmitted to the unified slave interface socket via PCB traces, and then transmitted to the SOC main control module 100 via the IVI communication integration module 200. No protocol format conversion is performed throughout the signal path, maintaining the original form of the physical layer signals.

[0058] In this embodiment, by materializing the multi-protocol interface module 300 as an independently configured interface adapter board 320, the multi-protocol interface module 300 can be independently replaced or selected according to vehicle model requirements, achieving physical decoupling and further improving the modularity and platform adaptability of the system architecture in Embodiment 1. The interface adapter board 320 does not contain a protocol conversion chip or a main control MCU; signal mapping is achieved only through PCB traces, reducing system costs and potential failure points, while facilitating platform adaptability and quick replacement between different vehicle models.

[0059] In some embodiments, such as Figure 2 As shown, the specific types and grouping methods of various physical layer interfaces 310 are further defined. The various physical layer interfaces 310 include a high-speed physical layer interface group 311 and a low-speed physical layer interface group 312.

[0060] The high-speed physical layer interface group 311 includes at least one or a combination of an optical interface 3111, an automotive Ethernet PHY 3112, and a USB interface 3113. The optical interface 3111 uses a miniaturized SFP-packaged optical module socket, supports hot-swapping, and is used for long-distance high-definition video transmission or access to sensors such as LiDAR, meeting the requirements of high bandwidth and low latency transmission. The automotive Ethernet PHY 3112 preferably uses a 100BASE-T1 or 1000BASE-T1 physical layer chip, supports full-duplex data transmission via unshielded single-pair twisted-pair cable, and is used for communication with the autonomous driving domain controller or the vehicle's central gateway. The USB interface 3113 is used to connect smartphones or multimedia storage devices that support CarPlay, Android Auto, and other functions.

[0061] The low-speed physical layer interface group 312 includes at least one or a combination of CAN bus 3121, UART serial port 3122, AD signal 3123, and IO signal 3124. CAN bus 3121 integrates a CAN FD controller, supporting an arbitration bit rate of up to 8 Mbps, and is used for applications such as vehicle body control and sensor data acquisition. UART serial port 3122 supports hardware flow control and is used to connect to a debugging terminal or low-speed sensors. AD signal 3123 is used to acquire analog signals, such as audio signals, temperature sensor signals, or start-up status signals. IO signal 3124 is used to transmit digital input / output signals, such as button status and indicator light control.

[0062] The physical layer interface modules of the high-speed physical layer interface group 311 and the low-speed physical layer interface group 312 are selectively mounted on the corresponding reserved pad areas on the interface adapter board 320. Depending on the vehicle's business requirements, different combinations of interface modules can be selected. For example, high-end vehicles can simultaneously mount the optical interface 3111, the automotive Ethernet PHY 3112, the USB interface 3113, and the CAN bus 3121 to achieve full-function access to advanced driver assistance systems and multimedia entertainment systems. Low-end vehicles can mount only the USB interface 3113 and the CAN bus 3121 to reduce hardware costs.

[0063] In this embodiment, by dividing the various physical layer interfaces 310 into a high-speed physical layer interface group 311 and a low-speed physical layer interface group 312, and specifying the specific interface types included in each group, the system can flexibly select and combine interface modules according to the configuration requirements of different vehicle models, realizing on-demand configuration of interface resources. The high-speed physical layer interface group 311 meets the transmission requirements of high bandwidth and low latency, while the low-speed physical layer interface group 312 meets the stable transmission requirements of control and status signals. The two work together to cover all peripheral access scenarios of the vehicle IVI system, further enhancing the vehicle-wide adaptability flexibility of the system architecture in Embodiment 1.

[0064] In some embodiments, such as Figure 3 As shown, the specific content of the hierarchical isolation power domain 410 is further defined. The hierarchical isolation power domain 410 includes a digital isolation and low-noise power domain 411 for high-speed physical layer interfaces and an analog ground isolation domain 412 for low-speed physical layer interfaces.

[0065] The digital isolation and low-noise power domain 411 provides a low-ripple operating power supply with digital isolation for the high-speed physical layer interface. Specifically, the digital isolation and low-noise power domain 411 uses a digital isolator to isolate the digital ground of the SOC main control module 100 and the IVI communication integrated module 200 from the digital ground of the high-speed physical layer interface, blocking high-frequency noise from the digital circuit from being conducted to the high-speed interface through the power path. In the digital isolation and low-noise power domain 411, a low-noise DC-DC converter unit combined with a π-type filter controls the power ripple to within 50mV, ensuring that high-speed interfaces such as the optical interface 3111, the automotive Ethernet PHY 3112, and the USB interface 3113 receive a clean and stable operating power supply.

[0066] Analog ground isolation 412 provides an independent analog ground loop for the low-speed physical layer interface. Specifically, analog ground isolation 412 separates the analog ground of the low-speed physical layer interface from the digital ground of other circuits, preventing high-frequency switching noise on the digital ground from coupling to the analog signal path. The transceiver analog front end of the CAN bus 3121, the sampling loop of the AD signal 3123, and the audio analog signal loop are all connected to analog ground isolation 412 to ensure the sampling accuracy and transmission quality of the analog signals. Analog ground isolation 412 is isolated from the digital ground by magnetic isolation or capacitive isolation, and is connected to a single ground point only within the multi-element isolated power supply and physical interface integrated module 400.

[0067] In this embodiment, hierarchical power isolation management is achieved by providing digital isolation and low-noise power domain 411 and analog ground isolation 412 for the high-speed physical layer interface and the low-speed physical layer interface, respectively. The high-speed physical layer interface obtains a clean power supply with low ripple and low noise, ensuring the signal integrity of high-speed data transmission; the low-speed physical layer interface obtains an independent analog ground loop, avoiding digital noise contamination of analog signals and ensuring the acquisition accuracy and control reliability of analog signals. The hierarchical isolation power domain 410 suppresses vehicle electromagnetic interference from the power source, further improving the electromagnetic compatibility performance of the system architecture in Embodiment 1.

[0068] In some embodiments, such as Figure 3 and Figure 9 As shown, the multi-element isolated power supply and physical interface integration module 400 further includes a plug-in identification detection unit 430. The plug-in identification detection unit 430 is located inside or near the multiplexed physical plug-in assembly 420 and is used to obtain the identification information of the access device.

[0069] The plug-in identification detection unit 430 is configured to obtain the identification of the connected device through active configuration mode or passive detection mode.

[0070] Active configuration mode is a fixed configuration preset by the user before the product leaves the factory. In active configuration mode, the product undergoes active configuration of the SOC main control module 100 according to the OEM's requirements during the production stage, determining the signal type and protocol configuration corresponding to each physical pin. During actual equipment installation, the system operates according to the factory-preset fixed configuration, prohibiting external changes and complying with standardized SOP business process requirements. Active configuration mode is suitable for mass-produced, standardized vehicle models with uniform configurations.

[0071] In passive detection mode, the access device identifier is obtained by detecting the voltage divider resistor value and / or scanning the CAN baud rate at the access device end. In passive detection mode, when an external device is inserted into the multiplexed physical connector 420, the insertion identification detection unit 430 first detects the electrical characteristics of the access device end. For USB devices, the insertion identification detection unit 430 identifies the device type by reading the voltage divider resistor value at the device end. This method references the identification mechanism of the QC3.0 fast charging protocol, which determines the device attribute by detecting the voltage of the D+ and D- pins. For CAN bus devices, the insertion identification detection unit 430 identifies the device type by scanning the baud rate on the CAN bus. The insertion identification detection unit 430 compares the detected voltage divider resistor value and / or baud rate information with preset reference values ​​to determine the type and identifier of the access device.

[0072] The IVI communication integration module 200 has a pre-stored mapping database of device identifiers and service types. When the plug-in identifier detection unit 430 outputs a device identifier signal, the IVI communication integration module 200 responds to this output signal by querying the mapping database and calling the configuration mapping table that matches the access device identifier. The configuration mapping table records complete configuration information for the device, including interface type, protocol parameters, power supply requirements, and pin mapping relationships.

[0073] In this embodiment, by setting up a plug-in identification detection unit 430 and employing both active configuration and passive detection modes, automatic identification and configuration of the access device are achieved. The active configuration mode is suitable for standardized mass production scenarios, ensuring product consistency and traceability; the passive detection mode supports hot-swapping and dynamic identification, allowing the same reusable physical plug-in component 420 to adapt to various types of devices, improving interface versatility and user experience. The two modes complement each other, satisfying both the standardization requirements of manufacturing and the flexibility requirements of user operation, further enhancing the vehicle-wide adaptability flexibility of the system architecture in Embodiment 1.

[0074] In some embodiments, such as Figure 1 As shown, a custom private interface is further defined between the SOC master control module 100 and the IVI communication integration module 200. The custom private interface and the unified slave interface are configured in parallel between the SOC master control module 100 and the IVI communication integration module 200.

[0075] Custom private interfaces are used to ensure compatibility with legacy and specially defined interfaces, achieving backward compatibility. Specifically, for some non-standardized, manufacturer-defined, or legacy interface protocols that cannot communicate through the standard protocol of the unified interface, a custom private interface can be used for transmission. The custom private interface uses a custom communication protocol and data format, with communication rules pre-agreed between the SOC main control module 100 and the IVI communication integration module 200.

[0076] The custom proprietary interface serves two purposes. First, it ensures compatibility with legacy interface definitions from older vehicle models, allowing the system to adapt to these models without altering the original wiring harness and interface definitions, thus reducing modification and upgrade costs. Second, it caters to the specific interface plug-in requirements of different OEMs. Different OEMs may have different interface definitions and communication protocols; the custom proprietary interface provides flexible adaptation without requiring modifications to the hardware design of the SOC main control module 100.

[0077] The unified interface is used for standardized data communication and command issuance, while the custom private interface is used for compatibility extension and adaptation to special scenarios. The two work together to ensure both the efficiency of standardized communication and the compatibility of special scenarios.

[0078] In this embodiment, by setting a custom private interface, the system is compatible with both legacy interfaces and specially defined interfaces, achieving backward compatibility and flexible adaptation to different OEM interface specifications. The custom private interface complements the unified slave interface, ensuring both the efficiency of standardized communication and compatibility for special scenarios, further enhancing the system's vehicle-wide adaptability and extending the product's lifecycle.

[0079] In some embodiments, such as Figures 6 to 9 As shown, the system further restricts its use to a tiered PCB board configuration. Specifically, different functional modules of the system use different grades of PCB boards based on their operating frequency, signal integrity requirements, and manufacturing costs.

[0080] The SOC main control module 100 and the IVI communication integration module 200 use Class 3 PTFE sheets. Class 3 is the highest grade of printed circuit board, suitable for electronic devices with high reliability and high performance requirements. PTFE sheets have extremely low dielectric constant and dielectric loss, making them suitable for high-frequency, high-speed signal transmission and ensuring signal integrity during high-speed data communication between the SOC main control module 100 and the IVI communication integration module 200. Class 3 PTFE sheets also have good thermal stability and low moisture absorption, making them suitable for wide-temperature-range automotive operating environments.

[0081] The multi-protocol interface module 300 uses Class 2 high-Tg FR-4 board material. Class 2 is a medium-grade printed circuit board grade, suitable for most general-purpose electronic devices. High-Tg FR-4 board material has a high glass transition temperature, maintaining dimensional stability and mechanical strength at higher temperatures. The multi-protocol interface module 300 primarily handles physical layer signal routing and does not involve high-speed processing of high-frequency digital signals; therefore, using Class 2 high-Tg FR-4 board material meets performance requirements while reducing material costs.

[0082] The 400 multi-element isolated power supply and physical interface integration module uses Class 2 standard FR-4 board material. Standard FR-4 board material is the most commonly used printed circuit board substrate, with advantages such as low cost and mature processing. The 400 multi-element isolated power supply and physical interface integration module is mainly responsible for power supply and physical interface connection, and has relatively low requirements for the high-frequency performance of the board material. Using Class 2 standard FR-4 board material can meet the functional requirements, while minimizing manufacturing costs.

[0083] In this embodiment, by using different grades of PCB materials for different functional modules, manufacturing costs are optimized while ensuring the performance requirements of each module. High-frequency, high-speed modules use high-performance Class 3 PTFE materials to ensure signal integrity, while power and interface modules use Class 2 ordinary FR-4 materials to reduce costs. This achieves an optimal balance between performance and cost, which is beneficial for mass production and cost reduction.

[0084] The second aspect of the present invention provides a SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation method based on the above system embodiment. Figure 5 This is a flowchart of the method. Figure 4 As shown, the method includes the following steps S1 to S5.

[0085] S1, Power-on Initialization. Upon system power-on, the IVI communication integration module 200 first executes the initialization program. The IVI communication integration module 200 loads a pre-stored default configuration mapping table from its internal embedded Flash memory. The default configuration mapping table defines the basic operating parameters of various physical layer interfaces 310, including the enable state, baud rate, data format, power supply voltage, and other initial parameters for each interface. The default configuration mapping table ensures that the system can operate in a known initial state after power-on, awaiting the connection of external devices.

[0086] S2, Detect the access device identifier of the multiplexed physical connector 420. After system initialization, the IVI communication integration module 200 continuously monitors the access status of the multiplexed physical connector 420 through the connector identifier detection unit 430. When an external device is inserted into the multiplexed physical connector 420, the connector identifier detection unit 430 detects the access event and initiates the device identifier identification process. The connector identifier detection unit 430 obtains the identifier information of the access device through active configuration mode or passive detection mode, and sends the device identifier signal to the IVI communication integration module 200. The IVI communication integration module 200 identifies the service type required by the currently accessed external device based on the received device identifier signal.

[0087] S3: Retrieve preset optional configurations matching the service type and dynamically activate the target interface. Based on the service type identified in S2, the IVI communication integration module 200 searches a pre-stored configuration mapping table for a preset optional configuration matching that service type. The preset optional configurations record the physical layer interface type to be activated under that service type, the interface operating parameters, and the corresponding power configuration. Based on the found preset optional configuration, the IVI communication integration module 200 sends an enable signal to the multi-protocol interface module 300, dynamically adjusting the enable state of the multi-protocol interface module 300 and selectively activating the target interface among various physical layer interfaces 310. For example, when the connected device is a USB multimedia device, the USB interface 3113 is activated; when the connected device is a CAN bus sensor, the CAN bus 3121 is activated.

[0088] S4, enable the corresponding hierarchical isolation power domain 410. The IVI communication integration module 200 sends a power configuration command to the multi-level isolated power supply and physical interface integration module 400 based on the protocol type of the target interface activated in S3. The multi-level isolated power supply and physical interface integration module 400, upon receiving the command, enables the hierarchical isolation power domain 410 corresponding to the target interface. For high-speed physical layer interfaces, the digital isolation and low-noise power domain 411 is enabled to provide a low-ripple operating power supply processed by digital isolation. For low-speed physical layer interfaces, analog ground isolation 412 is enabled to provide an independent analog ground loop, preventing digital noise from coupling to analog signals through the ground loop.

[0089] S5: A pin mapping table is sent out, and signals are switched to the corresponding physical pins to achieve panel interface convergence. The IVI communication integration module 200 generates a pin mapping table based on the correspondence between the target interface activated in S3 and the multiplexed physical connector 420. The pin mapping table records the correspondence between each signal pin of the target interface and each physical pin of the multiplexed physical connector 420. The IVI communication integration module 200 sends the pin mapping table to the multiplexed physical connector 420, controlling the analog switch array inside the multiplexed physical connector 420 to switch the signals of the target interface to the corresponding physical pins, achieving dynamic mapping from signal pins to physical pins and panel interface convergence.

[0090] According to the SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation method provided by the present invention, the IVI communication integration module 200 in S1 loads a pre-stored default configuration mapping table during power-on initialization, so that the system has a definite initial working state after power-on, establishing a unified starting point for the identification and configuration of subsequent external devices. The pre-stored default configuration mapping table mechanism avoids the need for the SOC main control module 100 to participate in the interface initialization process every time it is powered on, and further offloads the interface management function from the SOC main control module 100 to the IVI communication integration module 200, shortening the system startup time.

[0091] By detecting the access device identifier and identifying the service type of the multiplexed physical connector 420 through the IVI communication integration module 200 in S2, the system achieves automatic identification capability of external devices. This step enables the system to automatically perceive and distinguish the service attributes of different types of devices when the same multiplexed physical connector 420 is connected, without requiring manual selection or configuration by the user, thus improving the system's intelligence and ease of use.

[0092] By using the IVI communication integration module 200 in S3 to retrieve matching preset optional configurations based on the service type and dynamically activate the target interface, on-demand dynamic allocation of interface resources is achieved. The system only activates the corresponding physical layer interface 310 when needed, while inactive interfaces remain closed, reducing overall system power consumption and electromagnetic radiation. Simultaneously, the dynamic activation mechanism eliminates the need for the multi-protocol interface module 300 to enable all physical layer interfaces 310 simultaneously, simplifying interface management logic and improving system reliability.

[0093] By enabling the corresponding hierarchical isolation power domain 410 according to the target interface protocol type through the multi-element isolated power supply and physical interface integration module 400 in S4, on-demand hierarchical power supply is achieved. High-speed physical layer interfaces obtain digital isolation and low-noise power domain 411 to ensure the integrity of high-speed signal transmission; low-speed physical layer interfaces obtain analog ground isolation 412 to ensure the accuracy of analog signal acquisition. The on-demand activation of the hierarchical isolation power domain 410 avoids the power consumption waste and electromagnetic interference superposition caused by all interfaces being powered on at the same time, and improves the electromagnetic compatibility performance of the system from the power management perspective.

[0094] By issuing a pin mapping table through the IVI communication integration module 200 in the S5 and controlling the multiplexing physical connector component 420 to switch signals to corresponding physical pins, the convergence of multiple protocol signals to the same composite physical connector component is achieved, enabling the reuse of physical pins. This step ensures that the number of external physical interfaces of the system does not increase with the increase of supported protocol types, solving the problem of limited interface resources on the vehicle panel. The dynamic issuance mechanism of the pin mapping table allows the same physical pin to carry signals of different protocols under different service modes, realizing time-division multiplexing of interface resources and improving interface utilization.

[0095] In summary, through the streamlined control of S1 to S5, a complete end-to-end workflow is achieved, encompassing system power-on, device access, interface activation, power configuration, and signal conduction. The entire process is centrally scheduled by the IVI communication integration module 200, eliminating the need for the SOC main control module 100 to participate in the configuration and management of the underlying physical interfaces, thus completely offloading the physical layer interface management function. The steps of this method are interconnected and logically clear, collectively ensuring the system's plug-and-play characteristics, on-demand power distribution capabilities, and effective panel interface convergence.

[0096] In the above embodiments, the specific implementation method of detecting the access device identifier in S2 is further defined. Specifically, the detection of the access device identifier in S2 includes two methods: active configuration mode or passive detection mode.

[0097] The proactive configuration mode is a fixed configuration preset by the user before the product leaves the factory. In this mode, the product's configuration information is written into the embedded Flash memory of the IVI communication integration module 200 during the production stage, according to the OEM's requirements. This configuration information includes complete settings such as signal type, protocol parameters, and power supply requirements for each physical pin. During actual equipment installation, the system directly reads the preset fixed configuration identifier and operates according to that configuration. The proactive configuration mode does not allow external changes, ensuring product configuration consistency and traceability, and meeting the requirements of standardized operating procedures (SOPs). This mode is suitable for mass-produced, standardized vehicle models with uniform configurations, such as those on an OEM production line where all vehicles of the same model use the same interface configuration.

[0098] In passive detection mode, the access device identifier is obtained by detecting the voltage divider resistor value at the access device end and / or scanning the CAN baud rate. In passive detection mode, when an external device is inserted into the multiplexed physical connector 420, the insertion identification detection unit 430 first detects the electrical characteristics of the access device end. Specifically, for USB devices, the insertion identification detection unit 430 identifies the device type by reading the voltage divider resistor values ​​on the D+ and D- pins. When a pull-up or pull-down resistor is connected at the device end, the voltage on the D+ or D- pin changes. The insertion identification detection unit 430 detects this voltage value and compares it with a preset reference voltage threshold to determine the device type and attributes. For CAN bus devices, the insertion identification detection unit 430 identifies the device type by scanning the baud rate on the CAN bus. The insertion identification detection unit 430 attempts to receive data frames on the CAN bus at different baud rates. When reception is successful and the data frame format is correct, the baud rate is determined to be the communication baud rate of the access device, thereby identifying the device type.

[0099] The IVI communication integration module 200 determines the type and identifier of the access device based on the preset fixed configuration identifier read in active configuration mode or the voltage divider resistor value and / or CAN baud rate detected in passive detection mode, and then performs subsequent configuration loading and interface activation operations.

[0100] In this embodiment, flexible acquisition of access device identifiers is achieved through two complementary identification methods: active configuration mode and passive detection mode. Active configuration mode ensures consistency and traceability of product configuration in standardized mass production scenarios, avoiding the risk of errors in on-site configuration. Passive detection mode supports hot-swapping and dynamic identification, requiring no manual configuration from the user; it is plug-and-play, improving user experience and device compatibility. The combination of these two modes allows the system to adapt to both standardized mass production and the flexible and ever-changing aftermarket and repair / replacement scenarios.

[0101] In some embodiments, the specific implementation of the hierarchical isolation power domain 410 in the multi-element isolation power supply and physical interface integration module 400 in S4 is further defined.

[0102] like Figure 4As shown, π-type filters 500 are arranged at both the power input and output terminals of the multi-element isolated power supply and physical interface integrated module 400. The π-type filter 500 consists of a common-mode inductor and two safety capacitors. The common-mode inductor is connected in series in the power line, and the two safety capacitors are connected between the input and output terminals of the common-mode inductor and ground, respectively, forming a π-shaped topology. At the power input terminal of the multi-element isolated power supply and physical interface integrated module 400, the π-type filter 500 filters out common-mode interference and differential-mode noise from the vehicle battery power line, preventing external electromagnetic interference from entering the system through the power line. At the power output terminal of the multi-element isolated power supply and physical interface integrated module 400, the π-type filter 500 filters out high-frequency switching noise generated by the DC-DC conversion unit, ensuring that the power ripple output to each module is controlled within 50mV. Through dual filtering at both the input and output terminals, each module obtains a low-noise, high-purity operating power supply, providing good power quality for high-speed digital circuits and sensitive analog circuits.

[0103] The system employs a star grounding strategy. A star grounding strategy means that the digital ground, analog ground, and protective ground are connected to a single grounding point within the multi-element isolated power supply and physical interface integrated module 400. Specifically, the digital ground provides a grounding reference for the SOC main control module 100, the IVI communication integrated module 200, and the digital circuitry of the high-speed physical layer interface. The analog ground provides a grounding reference for the analog signal processing circuitry in the low-speed physical layer interface, including the transceiver analog front-end of the CAN bus 3121, the sampling loop of the AD signal 3123, and the audio analog signal loop. The protective ground provides a grounding path for the system's metal casing, connector shielding layers, and shielding covers, for safety protection and electromagnetic shielding. The digital ground, analog ground, and protective ground are each routed independently on the PCB, without interference, and each is connected to a single grounding point within the multi-element isolated power supply and physical interface integrated module 400. At this single grounding point, the three grounds are connected through a low-impedance path, achieving potential equalization while blocking the conduction of ground loop current between different ground loops.

[0104] By combining power supply filtering with a π-type filter 500 and ground isolation with star grounding, vehicle-mounted electromagnetic interference is comprehensively suppressed from both power and ground perspectives. The π-type filter 500 blocks the conduction of high-frequency noise in the power path, while star grounding cuts off the coupling of ground loop current in the ground loop. The two work together to significantly improve the system's electromagnetic compatibility performance and anti-interference capability.

[0105] In this embodiment, by arranging π-type filters 500 at both the power input and output terminals of the multi-element isolated power supply and physical interface integration module 400, conducted interference and switching noise are effectively suppressed along the power path, ensuring that each module obtains a low-ripple, high-purity operating power supply, providing good power quality for high-speed digital circuits and sensitive analog circuits. By adopting a star grounding strategy, the digital ground, analog ground, and protective ground are connected to a single grounding point within the multi-element isolated power supply and physical interface integration module 400, cutting off the conduction path of ground loop current from the ground loop and preventing digital noise from coupling to the analog circuits through a shared ground wire. The π-type filter 500 and the star grounding work together to comprehensively improve the electromagnetic compatibility performance of the system from both power and ground dimensions, ensuring stable and reliable operation of the system in the high electromagnetic interference environment of an automotive vehicle.

[0106] Working Principle: The SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system and method of the present invention, after the system is powered on, the IVI communication integration module 200 first loads the pre-stored default configuration mapping table, so that the system enters the known initial working state and waits for external devices to connect. The IVI communication integration module 200 continuously monitors the access status of the multiplexed physical plug component 420 through the plug identification detection unit 430.

[0107] When an external device is inserted into the multiplexed physical connector 420, the insertion identification detection unit 430 acquires the identification information of the accessed device and sends it to the IVI communication integration module 200. There are two acquisition methods: in active configuration mode, the system directly reads the fixed configuration identifier preset before the product leaves the factory; in passive detection mode, the system identifies the device type by detecting the voltage divider resistor value at the accessed device end and / or scanning the CAN baud rate. For USB devices, the insertion identification detection unit 430 determines the device attribute by reading the voltage divider resistor value at the device end; for CAN bus devices, the insertion identification detection unit 430 identifies the device type by scanning the baud rate.

[0108] The IVI communication integration module 200 queries a pre-stored mapping database based on the received device identifier to determine the service type required by the currently accessing device and retrieves a preset optional configuration matching that service type. Subsequently, the IVI communication integration module 200 sends an enable signal to the multi-protocol interface module 300 to dynamically activate the corresponding physical layer interface 310; simultaneously, it sends a power configuration command to the multi-element isolated power supply and physical interface integration module 400 to enable the corresponding hierarchical isolated power domain 410. For high-speed physical layer interfaces, the digital isolation and low-noise power domain 411 is enabled to provide isolated, low-ripple power; for low-speed physical layer interfaces, analog ground isolation 412 is enabled to provide an independent analog ground loop to avoid digital noise coupling.

[0109] Finally, the IVI communication integration module 200 generates a pin mapping table based on the correspondence between the target interface and the multiplexed physical plug-in component 420 and sends it to the multiplexed physical plug-in component 420. It controls the internal analog switch array to switch the target interface signal to the corresponding physical pin, thus completing the establishment of a complete link from device identification, interface configuration, power supply to signal conduction.

[0110] Throughout the operation, the physical layer signals of external devices are directly mapped to the unified slave interface via the PCB traces of the multi-protocol interface module 300, and data processing is performed by multiple physical layer protocols natively supported by the SOC master control module 100. The IVI communication integration module 200 uniformly schedules the collaborative work of each module, and the SOC master control module 100 does not need to participate in the configuration and management of the underlying physical interface, thus achieving complete offloading of physical layer interface management functions and decoupling of protocol parsing and interface management.

[0111] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A SOC-decoupled IVI multi-channel multi-protocol electromagnetic interference-resistant switching and isolation system, characterized in that, include: SOC main control module (100), IVI communication integration module (200), multi-protocol interface module (300), and multi-element isolated power supply and physical interface integration module (400). The IVI communication integration module (200) communicates with the SOC main control module (100) through a unified slave interface and is configured to call a pre-stored configuration mapping table according to the access device identifier, and adapt the external interface configuration of the multi-protocol interface module (300) and the multi-element isolated power supply and physical interface integration module (400). The multi-protocol interface module (300) is configured to selectively integrate multiple physical layer interfaces (310) according to a preset optional configuration, terminate the communication protocol of the external device at the physical layer, and realize signal transmission with the SOC main control module (100) through physical layer signal routing mapping; The multi-element isolated power supply and physical interface integration module (400) is connected to the power supply circuit of each module and is configured to provide hierarchical isolated power domains (410) for different physical layer interfaces. It is also provided with a multiplexed physical plug-in component (420) for multiplexing and mapping the signal pins of the multiple physical layer interfaces (310) to the physical pins of the multiplexed physical plug-in component (420).

2. The SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system according to claim 1, characterized in that, The multi-protocol interface module (300) is materialized as an independently set interface adapter board (320).

3. The SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system according to claim 1, characterized in that, The multiple physical layer interfaces (310) include a high-speed physical layer interface group (311) and a low-speed physical layer interface group (312). The high-speed physical layer interface group (311) includes at least one or a combination of an optical interface (3111), an automotive Ethernet PHY (3112), and a USB interface (3113); The low-speed physical layer interface group (312) includes at least one or a combination of CAN bus (3121), UART serial port (3122), AD signal (3123) and IO signal (3124).

4. The SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system according to claim 1, characterized in that, The hierarchical isolation power domain (410) includes: Digital isolation and low-noise power domain for high-speed physical layer interfaces (411), and analog ground isolation for low-speed physical layer interfaces (412).

5. The SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system according to claim 1, characterized in that, The multi-element isolated power supply and physical interface integrated module (400) also includes a plug-in identification detection unit (430). The plug-in identification detection unit (430) is configured to obtain the identification of the accessed device through active configuration mode or passive detection mode; The active configuration mode is a fixed configuration preset by the user according to the user's specified requirements before the product leaves the factory; The passive detection mode obtains the access device identifier by detecting the voltage divider resistor value at the access device end and / or scanning the CAN baud rate; The IVI communication integration module (200) has a pre-stored mapping relationship library between device identifiers and service types. In response to the output signal of the plug-in identifier detection unit (430), it calls the configuration mapping table that matches the access device identifier.

6. The SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system according to claim 1, characterized in that, A custom private interface is also provided between the SOC main control module (100) and the IVI communication integration module (200) to be compatible with old interfaces and specially defined interfaces, so as to achieve backward compatibility.

7. The SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation system according to claim 1, characterized in that, The system uses a tiered PCB board configuration: The SOC main control module (100) and the IVI communication integration module (200) are made of Class 3 grade PTFE sheet. The multi-protocol interface module (300) is made of Class 2 high TgFR-4 board material; The multi-element isolated power supply and physical interface integrated module (400) uses Class 2 grade ordinary FR-4 board material.

8. A SOC-decoupled IVI multi-channel multi-protocol electromagnetic interference suppression switching and isolation method, employing the SOC-decoupled IVI multi-channel multi-protocol electromagnetic interference suppression switching and isolation system as described in any one of claims 1-7, characterized in that, Includes the following steps: S1, Power-on initialization, the IVI communication integration module (200) loads the pre-stored default configuration mapping table, which defines the basic operating parameters of various physical layer interfaces (310); S2, detect the access device identifier of the multiplexing physical plug-in component (420) and identify the service type required by the currently accessed external device; S3, according to the business form, retrieve the preset optional configuration that matches the business form, dynamically adjust the enabling state of the multi-protocol interface module (300), and selectively activate the target interface among the multiple physical layer interfaces (310). S4, according to the protocol type of the target interface, enable the corresponding hierarchical isolation power domain (410) in the multi-element isolation power supply and physical interface integration module (400). S5. Based on the correspondence between the target interface and the multiplexed physical connector (420), a pin mapping table is issued to control the multiplexed physical connector (420) to switch the signal of the target interface to the corresponding physical pin, thereby realizing panel interface convergence.

9. The SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation method according to claim 8, characterized in that, The specific identifier for the access detection device in S2 includes: The system reads the pre-set fixed configuration identifiers from the product before it leaves the factory through the active configuration mode; or... The type of the currently accessed device is identified by detecting the voltage divider resistor value and / or scanning the CAN baud rate at the access device end in passive detection mode.

10. The SOC decoupled IVI multi-channel multi-protocol electromagnetic interference switching and isolation method according to claim 8, characterized in that, The specific features of enabling the corresponding hierarchical isolation power domain (410) in the multi-element isolation power supply and physical interface integration module (400) in S4 include: A π-type filter (500) is arranged at the power input and output terminals of the multi-isolated power supply and physical interface integration module (400) to control the power ripple within a preset threshold. A star grounding strategy is adopted, in which the digital ground, analog ground and protective ground are connected to a single grounding point within the multi-element isolation power supply and physical interface integration module (400) to suppress noise introduced by ground loop current.

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