Radio frequency sip fast thermal simulation method based on templated guided fine modeling

Abstract

The application relates to the technical field of electronic packaging design, and discloses a radio frequency SIP (System in Package) rapid thermal simulation method based on a template-based wizard fine modeling, which comprises the following steps: constructing an input design file specification of a radio frequency system level package, and performing standardization checking and regularization on design files corresponding to rigid entity structures and fine circuit structures respectively; automatically analyzing the design files after the standardization checking and regularization, and constructing three-dimensional simulation models of rigid entity components and fine circuit components respectively; extracting coordinate and hierarchical information of the components, automatically completing layer-by-layer assembly according to a packaging stacking sequence, and generating a complete three-dimensional simulation model; configuring and checking simulation parameters of the three-dimensional simulation model based on a standardized template through a wizard interactive interface; and automatically performing thermal simulation solving on the three-dimensional simulation model that passes the checking, and outputting a simulation result. The application can realize rapid modeling and accurate thermal simulation of a radio frequency system level package.

Description

Technical Field

[0001] This invention relates to the field of electronic packaging design technology, and in particular to a rapid thermal simulation method for radio frequency SIP based on template-based wizard-driven fine modeling. Background Technology

[0002] Radio frequency (RF) SiP (System-in-Package) is a core advanced packaging technology for the miniaturization and high integration of RF devices. By integrating multiple RF chips, power devices, passive components, microstrip transmission lines, and gold wire bonding structures onto special substrates such as LTCC and HTCC, it possesses core advantages of low loss, high integration, and small size, and is widely used in next-generation communications, satellite navigation, and RF microwave equipment. During RF SiP operation, the power chips and RF devices continuously generate heat dissipation. Furthermore, the compact internal structure and densely packed circuitry of the package make heat accumulation highly likely, leading to problems such as excessive device temperature rise, RF performance degradation, shortened lifespan, and even failure. Therefore, thermal simulation analysis is a core technical means for optimizing the heat dissipation structure of RF SiP and verifying product reliability. However, the current mainstream thermal simulation modeling method in the industry is mainly manual, relying on commercial simulation software such as ANSYS and Cadence for step-by-step manual modeling, parameter configuration, and simulation solutions, which has the following problems.

[0003] (1) The modeling process is fragmented and requires a lot of manual work. In the design of SiP, some parts, such as the metal structure of the frame and cover plate, are designed by CAD and archived as CAD files, while other parts, such as the composite substrate and microstrip transmission line, are designed by software such as Cadence and archived as files such as brd and ODB++. Traditional thermal simulation modeling requires manual step-by-step modeling, referring to two-dimensional drawings to create three-dimensional metal structures, chips, substrates and other fine structures, and then manually completing the assembly of parts, parameter configuration and simulation verification results one by one. The steps are cumbersome and require a high degree of professionalism. The modeling cycle for a single product can be as long as several days, which cannot meet the needs of batch simulation.

[0004] (2) Insufficient detailed modeling and low simulation accuracy. In order to simplify the modeling difficulty, traditional solutions generally simplify the fine structures such as micron-level microstrip lines and thin-layer metal circuits, resulting in a large deviation between the simulation model and the actual package structure. It is impossible to accurately reproduce the real heat dissipation path and temperature rise characteristics, and the simulation results have large errors.

[0005] (3) There is no standardized system for parameter configuration, resulting in poor repeatability of results. Core parameters such as boundary conditions, chip power consumption and thermal load are set manually based on experience, without unified template constraints. Different operators configure parameters differently, resulting in poor comparability and repeatability of simulation data, which is not conducive to product iteration optimization and batch quality verification.

[0006] High-precision and high-efficiency modeling and simulation analysis are core technologies for optimizing the heat dissipation structure of RF SiP, verifying product reliability, and controlling the quality of mass production. Traditional modeling methods can no longer meet the needs of rapid product design iteration, and there is an urgent need to study a rapid modeling and accurate thermal simulation method for highly integrated RF SiP. Summary of the Invention

[0007] To address the aforementioned issues, this invention proposes a rapid thermal simulation method for RF SiP based on template-based wizard-driven fine modeling. The core objective is to simulate the temperature field distribution under conditions where power chips and RF devices continuously generate heat during RF SiP operation. This achieves automated, high-fidelity, and high-efficiency modeling of fine-scale RF SiP models, enabling accurate prediction of maximum cumulative temperature, among other parameters. Furthermore, addressing the low modeling efficiency and distorted heat dissipation simulation issues of traditional methods, this invention standardizes RF SiP thermal simulation modeling by establishing templates based on product form, creating a modeling and simulation operation wizard. This significantly improves pre-processing and solution efficiency, greatly reducing the simulation operation threshold and providing efficient digital support for RF SiP reliability design, failure prediction, and parameter optimization.

[0008] The technical solution adopted in this invention is as follows: A rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling includes: Establish input design document specifications for RF system-in-package, and standardize and regulate the design documents corresponding to rigid physical structures and fine circuit structures respectively; The system automatically parses the standardized and normalized design documents and constructs three-dimensional simulation models of rigid solid components and fine circuit components respectively. Extract the coordinates and hierarchical information of each component, automatically complete the layer-by-layer assembly according to the packaging stacking order, and generate a complete three-dimensional simulation model; Through a wizard-driven interactive interface, the simulation parameters of the 3D simulation model are configured and verified based on standardized templates. The simulation parameters include boundary conditions, material properties, thermal loads, and mesh parameters. The system performs automated thermal simulation on the verified 3D simulation model and outputs the simulation results.

[0009] Furthermore, the input design file specifications for constructing RF system-in-package include: for rigid solid structures, unifying the output format of rigid solid structure design files; standardizing that a single structure corresponds to a single independent layer, eliminating blank layers and redundant lines; unifying global coordinate references and dimensional tolerance standards, requiring all structural contours to be completely closed; the rigid solid structure includes a substrate, solder balls, frame, and chip.

[0010] It should be noted that by standardizing the format, layers, coordinates, tolerances, and contours of the design files for rigid solid structures, the consistency and standardization of the design files can be guaranteed, providing a reliable data source for subsequent automatic parsing and modeling, and reducing parsing errors caused by inconsistent file formats or missing data.

[0011] Furthermore, the input design file specifications for constructing RF system-in-package also include: a unified recognizable and parseable format for circuit layout files for fine circuit structures; standardized definitions of trace accuracy, metal layer thickness, device coordinates, and stacking levels; and retention of derived standards for microstrip line width and spacing and device package parameters; the fine circuit structures include multilayer boards, passive components, and microstrip lines.

[0012] It should be noted that by standardizing the format and parameters of the design files for fine circuit structures, the integrity and accuracy of micron-level circuit structure information can be guaranteed, providing accurate data support for subsequent refined modeling and preventing the loss of fine structure information during file conversion.

[0013] Furthermore, the standardization and rectification of the design documents corresponding to the rigid physical structure and the fine circuit structure includes: verifying the original design documents according to the design document specifications, eliminating invalid data, and calibrating the structural parameters; dividing the design documents into two categories: rigid physical structure documents and fine circuit structure documents; and classifying and archiving the design documents according to the hierarchy of peripheral packaging, substrate structure, core chip, and fine circuit.

[0014] It should be noted that by verifying, organizing, and classifying the design documents, the quality and usability of the design documents can be improved, invalid data can be eliminated and parameters can be calibrated. At the same time, classifying them according to structural type and hierarchy facilitates subsequent differentiated analysis and modeling, thereby improving processing efficiency and targeting.

[0015] Furthermore, the method for constructing a three-dimensional simulation model of the rigid solid component includes: reading the two-dimensional contour data of the rigid solid structure design file, identifying the structural parameters such as substrate thickness, solder ball size, frame wall thickness and chip outline size, calling the stretching template of the corresponding structure, completing the three-dimensional stretching forming with fixed thickness and adaptive thickness, and generating a standardized rigid solid component model.

[0016] It should be noted that by automatically reading two-dimensional contour data and calling the extrusion template for three-dimensional modeling, it is possible to achieve automated modeling of rigid solid parts, ensure the consistency of modeling parameters of each part, improve modeling efficiency, and reduce dimensional errors that may occur during manual modeling.

[0017] Furthermore, the method for constructing the three-dimensional simulation model of the micro-circuit components includes: reading the layout data of the micro-circuit structure design file, parsing the trace coordinates, metal layer parameters and device packaging information, independently constructing three-dimensional models of micron-level microstrip lines, multilayer wiring boards and passive components, and preserving the complete geometric features of the micro-heat dissipation structure.

[0018] It should be noted that by automatically parsing the layout data and independently constructing a 3D model of the micron-level fine circuit structure, the geometric features of the fine heat dissipation structure can be completely preserved, avoiding simulation errors caused by the simplification of fine structures in traditional modeling methods, and improving the accuracy of thermal simulation results.

[0019] Furthermore, the step of extracting the coordinates and layer information of each component and automatically completing the layer-by-layer assembly according to the packaging stacking order includes: extracting the global coordinates, stacking level, relative position and assembly spacing information of each component; aligning and assembling according to the actual packaging stacking order of the outer frame, substrate, solder ball array, core chip, multi-layer circuit and microstructure to achieve the fusion assembly of rigid structure and micro-circuit structure; and simultaneously performing interference detection and gap verification during the assembly process to automatically identify and correct structural overlap, positional offset or abnormal assembly gap.

[0020] It should be noted that by extracting the coordinates and hierarchical information of the parts and assembling them automatically according to the actual packaging sequence, while performing interference detection and error correction during the assembly process, the model can be fully automated and accurate, avoiding misalignment, deviation and interference problems that are easy to occur during manual assembly, and ensuring assembly accuracy and model integrity.

[0021] Furthermore, the configuration and verification of simulation parameters of the 3D simulation model based on standardized templates through a wizard-guided interactive interface includes: inputting boundary conditions such as ambient temperature, thermal resistance of the package contact surface, and bottom constraint of the substrate through step-by-step guidance; calling the internal material library, which contains material properties of composite substrates, conductors, and solders, and assigning corresponding material properties according to structural classification; automatically identifying the number and position of each chip in the 3D simulation model, inputting the power consumption parameters of each chip, and realizing the mapping between thermal load and chip entity; and preset multiple levels of mesh control parameters for selection and configuration.

[0022] It should be noted that by guiding users step-by-step through the wizard-style interactive interface to configure boundary conditions, material properties, thermal loads, and mesh parameters, the technical threshold for simulation parameter configuration can be lowered, parameter configuration standards can be unified, the standardization and consistency of parameter configuration can be guaranteed, and the efficiency of parameter configuration can be improved.

[0023] Furthermore, the method of configuring and verifying the simulation parameters of the 3D simulation model through a wizard-style interactive interface based on standardized templates also includes: automatically comparing the simulation parameters with the standard parameter template after configuration, verifying the rationality of the boundary conditions, verifying the matching accuracy between the thermal load and the chip entity, prompting and guiding corrections for abnormal parameters, and recording the parameter configuration log.

[0024] It should be noted that by automatically verifying and alerting users of the configured simulation parameters, the accuracy and compliance of the simulation parameter configuration can be guaranteed, errors in parameter configuration can be detected and corrected in a timely manner, and simulation failures or result distortions caused by improper parameter settings can be avoided. At the same time, parameter logs facilitate subsequent parameter traceability and problem investigation.

[0025] Furthermore, the automated thermal simulation solution of the verified 3D simulation model and the output of simulation results include: converting the 3D simulation model into a simulation-compatible format; performing equivalent simplification on the substrate wiring structure; discretizing the substrate layered structure into a regular mesh; calculating the local metal ratio to solve for equivalent material properties; and completing adaptive mesh generation; calling the solver; automatically selecting the thermal simulation mode based on the template and completing iterative calculations; and after simulation convergence, outputting simulation results and a standardized simulation report. The simulation results include temperature cloud maps, heat flux density distribution maps, and temperature rise data and heat dissipation path data of key components. The standardized simulation report includes modeling parameters, simulation conditions, calculation results, and data analysis.

[0026] It should be noted that by simplifying the substrate wiring structure and combining it with adaptive mesh generation, the model size can be effectively reduced and the computational efficiency improved while ensuring simulation accuracy. Through automated solving and standardized report output, the simulation process can be unattended, improving simulation efficiency. At the same time, the standardized report format facilitates the analysis and use of results.

[0027] The beneficial effects of this invention are as follows: 1. This invention establishes a standardized input design file specification for RF system-in-package (RSP) systems, enabling standardized verification and organization of design files. Based on this, it automates the entire process from file parsing, component modeling, model assembly to parameter configuration and simulation solving. This unifies the technical standards for thermal simulation, improves modeling efficiency and simulation accuracy, reduces errors introduced by manual operation, lowers the technical threshold for RSP thermal simulation, and provides an efficient and reliable technical means for RSP thermal design.

[0028] 2. In terms of modeling and assembly, this invention adopts differentiated analytical and modeling methods for rigid solid structures and fine circuit structures, which not only ensures the modeling efficiency of large-size rigid structures, but also fully preserves the geometric features of micron-level fine heat dissipation structures, avoiding simulation errors caused by the simplification of fine structures in traditional modeling methods. By extracting the coordinates and hierarchical information of components and automatically assembling them according to the actual packaging stacking order, while simultaneously performing interference detection and error correction, the fully automatic and accurate assembly of the model can be achieved, avoiding misalignment, deviation and interference problems that are easy to occur in manual assembly, and ensuring assembly accuracy and model integrity.

[0029] 3. Regarding simulation parameter configuration and solution, this invention adopts a wizard-style interactive interface, which guides the configuration of boundary conditions, material properties, thermal loads, and mesh parameters step by step. It also has a built-in parameter verification function, which can reduce the technical threshold for parameter configuration, unify parameter configuration standards, and ensure the accuracy and standardization of parameter configuration. By performing equivalent simplification of the substrate wiring structure and combining it with adaptive mesh generation, the model size can be effectively reduced and the computational efficiency can be improved while ensuring simulation accuracy. At the same time, the automated solution process and standardized result output can realize unattended simulation, which facilitates the analysis and use of simulation results.

[0030] 4. This invention streamlines the entire process from design documents to simulation results, enabling automated, high-fidelity, and high-efficiency modeling of fine thermal simulation models for RF system-in-package (RISC). It can accurately predict the temperature distribution and heat dissipation of the package, providing strong digital support for the reliability design, failure prediction, and parameter optimization of RF RISC, which helps improve product design quality and shorten the R&D cycle. Attached Figure Description

[0031] Figure 1 This is a flowchart of a rapid thermal simulation method for radio frequency SIP based on template-based wizard-driven fine modeling, according to Embodiment 1 of the present invention.

[0032] Figure 2 This is a schematic diagram of the basic structure of the SiP model in Embodiment 2 of the present invention.

[0033] Figure 3 This is a standard specification diagram of the SiP design document in Embodiment 2 of the present invention.

[0034] Figure 4 This is a schematic diagram of the automatic generation of the SiP part model in Embodiment 2 of the present invention.

[0035] Figure 5 This is a schematic diagram of the assembly process of the SiP model in Embodiment 2 of the present invention.

[0036] Figure 6This is a schematic diagram of the wizard-style simulation setup process in Embodiment 2 of the present invention.

[0037] Figure 7 This is a schematic diagram of the process of regular grid discretization of the substrate layered structure in Embodiment 2 of the present invention.

[0038] Figure 8 This is a cloud map of each layer in the SiP model simulation in Embodiment 2 of the present invention. Detailed Implementation

[0039] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments are now described. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention; that is, the described embodiments are only a part of the embodiments of the invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0040] Example 1 This embodiment provides a rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling, including: Establish input design document specifications for RF system-in-package, and standardize and regulate the design documents corresponding to rigid physical structures and fine circuit structures respectively; The system automatically parses the standardized and normalized design documents and constructs three-dimensional simulation models of rigid solid components and fine circuit components respectively. Extract the coordinates and hierarchical information of each component, automatically complete the layer-by-layer assembly according to the packaging stacking order, and generate a complete three-dimensional simulation model; Through a wizard-driven interactive interface, the simulation parameters of the 3D simulation model are configured and verified based on standardized templates. The simulation parameters include boundary conditions, material properties, thermal loads, and mesh parameters. The system performs automated thermal simulation on the verified 3D simulation model and outputs the simulation results.

[0041] like Figure 1 As shown, the rapid thermal simulation method for RF SIP in this embodiment can be implemented using the following steps: Step 1: Develop RF SiP input design document specifications The system pre-builds standardized documentation for refined thermal simulation modeling of RF SiP, and establishes adaptable templates according to SiP product categories. The design documents are divided into two main modules: AutoCAD structural drawing specifications and BRD circuit layout specifications, which realizes the standardization and normalization of design documents and provides a standardized data source for automated parsing and modeling of design documents.

[0042] (1) CAD file specifications: For rigid solid structures such as LTCC / HTCC substrates, substrate solder balls, aluminum alloy frames, and packaged chips, the file output should be uniformly set to DWG and DXF formats; each structure should correspond to a single independent layer, and blank layers and redundant lines should be eliminated; the global coordinate reference and dimensional tolerance standards should be unified, and all structural outlines should be completely closed to eliminate incomplete outlines.

[0043] (2) BRD layout file specification: For the fine circuit structure such as multi-layer boards, passive components, and radio frequency microstrip lines inside the package, a unified Cadence-recognizable and parse format is used; the routing accuracy, metal layer thickness, device coordinates, and stacking level definition are standardized, core parameters such as microstrip line width and spacing and device package parameters are forcibly retained, and parameter export standards are unified.

[0044] Based on the above two types of specifications, the original design documents are verified, corrected and organized, invalid data is removed and structural parameters are calibrated, and finally divided into two categories: rigid physical structure documents and fine circuit structure documents, and archived according to the hierarchy of "peripheral packaging - substrate structure - core chip - fine circuit".

[0045] Step 2: Automatic File Parsing and Independent Component Modeling The SpaceClaim and Cadence modeling software in ANSYS can be used as platforms to customize and develop a file loading and parsing module. The module can load design file templates and import the corresponding CAD and BRD files. The parsing module automatically classifies and parses the structural parameters, and automatically completes the three-dimensional fine modeling of all parts, achieving zero simplification of the structure and zero distortion of parameters.

[0046] (1) Rigid component modeling: SpaceClaim automatically reads CAD 2D contour data, identifies parameters such as substrate thickness, solder ball size, frame wall thickness, and chip outline size, calls the corresponding structure stretching template, completes 3D stretching forming with fixed thickness and adaptive thickness, and generates standardized rigid solid components.

[0047] (2) Modeling of fine circuit components: Cadence reads BRD files to accurately analyze the trace coordinates, metal layer parameters and device packaging information of composite substrate layout files, and independently constructs micron-level RF microstrip lines, multilayer wiring boards and passive components three-dimensional models, fully preserving fine heat dissipation structures and avoiding simulation errors caused by traditional model simplification.

[0048] (3) Independent molding of parts: All structures are modeled separately, parameters are traceable, and structures are independently controllable, providing a foundation for subsequent precise assembly, local parameter modification, and structural optimization iteration.

[0049] Step 3: Precise model assembly based on coordinate hierarchy matching Based on a preset position matching algorithm, the global coordinates, stacking levels, relative positions, and assembly spacing information of all independent parts are extracted to achieve fully automated, precise layer-by-layer assembly, solving problems such as misalignment, deviation, and interference in manual assembly.

[0050] (1) Layered assembly logic: According to the actual packaging stacking order of “outer frame → substrate → solder ball array → core chip → multilayer circuit → gold wire microstrip microstructure”, the alignment assembly is automatically completed to achieve seamless integration and assembly of rigid structure and micro circuit structure.

[0051] (2) Automatic error correction: During the assembly process, the real-time interference detection and gap verification modules are started simultaneously to automatically identify and correct problems such as structural overlap, position offset, and abnormal assembly gap.

[0052] (3) Model output: Finally, a complete three-dimensional geometric model with high precision and no interference is generated that is completely consistent with the actual radio frequency SiP packaging structure.

[0053] Step 4: Standardized Configuration of Wizard-Based Simulation Parameters A customized visual wizard-style dialog box was developed based on SpaceClaim, using a step-by-step guided mode to replace the traditional manual configuration. Simulation parameters were entered and verified based on standardized templates, ensuring that simulation conditions were uniform and standardized.

[0054] (1) Boundary condition wizard configuration: Step-by-step guidance for entering ambient temperature, thermal resistance of package contact surface, and constraint conditions of substrate bottom. The default loading of industry standard template parameters supports manual fine-tuning and automatic recording of parameter logs.

[0055] (2) Material wizard assignment: The internal material library covers a series of material properties such as composite substrate, conductor, solder, etc. The material assignment is completed step by step by selecting the corresponding material by name according to the structure classification in batches.

[0056] (3) Thermal load wizard configuration: Identify the chip number and position in the three-dimensional model, and enter the rated power consumption and dynamic power consumption range of each RF chip and power chip step by step to achieve accurate mapping between thermal load and chip entity and complete distributed thermal load loading.

[0057] (4) Mesh control settings: To balance simulation accuracy and speed, three levels of mesh thickness are preset: elementary, medium and fine.

[0058] (5) Parameter compliance verification: After configuration, the parameter template is automatically compared to the standard parameter template to verify the rationality of the boundary conditions and the accuracy of thermal load matching. Abnormal parameters are prompted by pop-up windows and guided to correction, thus preventing parameter configuration errors.

[0059] Step 5: Automated Thermal Simulation Solution After parameter verification, the system automatically completes model processing, mesh generation, simulation solution, and result output. It relies on classical heat transfer formulas and numerical calculation theory to ensure simulation accuracy and reliability, eliminating the need for manual software interaction. The steady-state thermal simulation of RF SiP packaging follows three basic heat transfer mechanisms: solid-state heat conduction, air convection heat transfer, and surface thermal radiation. A schematic diagram of the multi-mechanism coupled heat transfer principle is provided.

[0060] (1) Solid heat conduction formula (Fourier's law) Heat transfer in solid structures such as RF SiP substrates, chips, frames, and gold wires follows Fourier's law of thermal conductivity and is the core heat transfer method within the package.

[0061] In the formula: Thermal conductivity (W); The thermal conductivity of the material (W / (m•K), preset templates for material parameters such as LTCC / HTCC, aluminum alloy, and silicon chip); The heat transfer cross-sectional area is (m²). This represents the temperature gradient (K / m) along the heat transfer direction; the negative sign indicates that heat is transferred from a high temperature to a low temperature.

[0062] (2) Air convection heat transfer formula (Newton's cooling formula) The heat transfer between the outer surface of the package and the air environment follows Newton's law of convection, making it suitable for both natural and forced convection conditions.

[0063] In the formula: For convective heat transfer (W); The convective heat transfer coefficient is (W / (m²•K); The heat transfer cross-sectional area is (m²). The temperature of the package wall (K); The ambient air temperature (K) is used.

[0064] (3) Surface thermal radiation heat transfer formula (Stephen-Boltzmann law) The radiative heat dissipation of high-temperature RF SiP devices and their enclosure surfaces follows the radiative heat transfer formula:

[0065] In the formula: For radiative heat transfer (W); Surface emissivity; The value is the Stefan-Boltzmann constant, which takes the following values. .

[0066] (4) Formula for calculating interfacial contact thermal resistance The contact thermal resistance at the interface between the chip and the substrate, and between the substrate and the frame, is a key factor affecting the temperature rise error of RF SiP. The calculation formula is as follows:

[0067] In the formula: The interfacial contact thermal resistance (K / W); The temperature difference (K) between the two sides of the contact surface; The heat flow (W) through the interface is used. This solution significantly reduces the simulation error of interface heat dissipation by standardizing the input of thermal resistance parameters using templates.

[0068] (5) Chip thermal load power consumption balance formula The balance between heat generation and dissipation of the chip under steady-state conditions provides a theoretical basis for thermal load application.

[0069] In the formula: The rated power consumption of the chip (W) is the simulated thermal load. For convective heat transfer (W); For radiative heat transfer (W); Heat dissipation through solid conduction (W).

[0070] Based on the above theoretical formulas, subsequent model processing and simulation solutions are carried out: (1) Model format conversion and adaptive mesh generation: The SpaceClaim 3D model is automatically converted into an Icepak-compatible simulation format. The fine modeling of fine structures such as gold wires, microstrip lines, and vias is achieved through the design file. Direct mesh generation results in a huge number of elements, low computational efficiency, or even incomputability. In order to solve the contradiction between the accuracy and efficiency of substrate modeling, the substrate is simplified based on the metal ratio. By discretizing the ECAD layered structure of the substrate with regular meshes, the local metal ratio is calculated to solve the equivalent material properties. The micro-wiring details of the substrate are transformed into macro-equivalent material parameters, replacing the traditional geometric detail reproduction. While retaining the mechanical and thermal properties of the substrate, the model mesh size is greatly reduced, which is an auxiliary means for balancing simulation accuracy and computational efficiency in this invention.

[0071] (2) Automated simulation solution: The Icepak solver is silently called in the background. It automatically selects the steady-state / transient thermal simulation mode according to the template and completes the iterative calculation autonomously without manual operation.

[0072] (3) Standardized output results: After the simulation converges, the temperature cloud map, heat flux density distribution map, temperature rise data of key components, and heat dissipation path data are automatically output in batches. At the same time, a complete standardized simulation report containing modeling parameters, simulation conditions, calculation results, and data analysis is automatically generated.

[0073] Example 2 This embodiment is based on embodiment 1: This embodiment provides a rapid thermal simulation method for RF SiP based on template-based wizard-driven fine modeling. This embodiment uses a three-layer stacked RF SiP device as an example. Figure 2 As shown, this RF SiP device includes a DXF format double-sided board, two ODB++ format 4-layer wiring substrates, three BGA solder ball arrays, two RF chips and supporting passive components, Kovar alloy frame and cover plate. The specific operation steps are as follows: Step 1: Document Standardization Processing Establish CAD and BRD file specifications adapted to this product, standardizing CAD drawings to DXF format, global coordinate zeroing, and contour closure; standardize BRD file parameters for metal layers, gold wires, and microstrip lines. Perform compliance corrections and hierarchical archiving of product substrate, aluminum alloy frame, power chip, solder ball array drawings, and internal fine circuit layouts, such as... Figure 3 As shown.

[0074] Step 2: Automatic Analysis and Component Modeling Batch import of standardized files, automatic stretching to generate rigid 3D components such as substrates, frames, chips, and solder balls; precise analysis of layout parameters to construct micron-level refined models of 25μm gold wires, 50μm microstrip lines, multilayer wiring, and passive devices, with no simplification or distortion in any structure, such as... Figure 4 As shown.

[0075] Step 3: Fully Automated Precision Assembly Assemble layer by layer according to the actual packaging sequence, simultaneously complete interference detection and error correction, and generate a complete and unbiased RF SiP 3D packaging model. The assembly process is as follows: Figure 5 As shown.

[0076] Step 4: Wizard-guided parameter configuration In the wizard process menu, click on Material Assignment, Thermal Resistance Setting, Operating Condition Setting, and Calculation Setting in sequence. The corresponding setting dialog boxes will then pop up, such as... Figure 6 As shown; in the material settings dialog box, you can define the materials of each layer of the substrate, chip, frame, cover plate and solder ball by selecting the name from the drop-down box; the contact thermal resistance of the interface is set to the default value, the working condition settings can be selected according to the actual heat dissipation path, each working condition will perform a thermal field solution, and multiple selections are supported; the calculation settings are mainly the mesh settings, which provide three levels of options.

[0077] Step 5: Automated Simulation and Result Output The model conversion is performed, Icepak is called to discretize the regular mesh of the ECAD layered structure, and the equivalent material properties are obtained by calculating the local metal ratio, which are then assigned to the solid of the layered structure, such as... Figure 7 As shown; finally, a steady-state thermal simulation calculation is performed. The solution process requires a certain amount of time. After the calculation is completed, the overall temperature rise contour map is automatically output, as shown. Figure 8 As shown, it supports viewing the temperature distribution of each substrate layer one by one and automatically generates a standardized RF SiP thermal simulation analysis report in Word format.

[0078] The present invention is compared with traditional modeling and simulation methods as follows.

[0079] Traditional detailed manual modeling methods involve manually completing modeling and assembly, manually generating meshes, configuring material properties, manually breaking down the analysis into nine sub-analysis steps, configuring material properties, contact pairs, and boundary conditions one by one, and manually completing the temperature field mapping for thermal-structural analysis.

[0080] In the above example, the preprocessing process using traditional methods takes more than 10 hours, while the preprocessing time of the present invention using a wizard-driven simulation method is about 0.5 hours, improving the preprocessing effect by more than 20 times. The accuracy of thermal conductivity is ensured through ECAD Mapping technology, balancing simulation accuracy and computational efficiency. While preserving the nuclear thermal properties, the number of model meshes is significantly reduced, and the solution efficiency is improved by several times. The modeling and simulation cycle for a single product is shortened from several days to less than 2 hours, and the error between the simulation results and the actual test data is controlled within 5%, greatly improving modeling efficiency and simulation accuracy.

[0081] The above description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

[0082] It should be noted that, for the sake of simplicity, the foregoing method embodiments are described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

Claims

1. A rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling, characterized in that, include: Establish input design document specifications for RF system-in-package, and standardize and regulate the design documents corresponding to rigid physical structures and fine circuit structures respectively; The system automatically parses the standardized and normalized design documents and constructs three-dimensional simulation models of rigid solid components and fine circuit components respectively. Extract the coordinates and hierarchical information of each component, automatically complete the layer-by-layer assembly according to the packaging stacking order, and generate a complete three-dimensional simulation model; Through a wizard-driven interactive interface, the simulation parameters of the 3D simulation model are configured and verified based on standardized templates. The simulation parameters include boundary conditions, material properties, thermal loads, and mesh parameters. The system performs automated thermal simulation on the verified 3D simulation model and outputs the simulation results.

2. The rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling as described in claim 1, characterized in that, The input design document specifications for constructing a radio frequency system-in-package include: For rigid solid structures, the output format of rigid solid structure design documents is standardized; each structure corresponds to a single independent layer, and blank layers and redundant lines are eliminated; the global coordinate reference and dimensional tolerance standards are standardized, and all structural contours are required to be completely closed; the rigid solid structure includes substrate, solder balls, frame and chip.

3. The rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling as described in claim 1, characterized in that, The input design document specifications for constructing a radio frequency system-in-package include: For fine circuit structures, a unified recognizable and parseable format for circuit layout files is established; the definitions of trace accuracy, metal layer thickness, device coordinates, and stacking levels are standardized; and the derived standards for microstrip line width and spacing and device package parameters are retained; the fine circuit structures include multilayer boards, passive components, and microstrip lines.

4. The rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling according to claim 1, characterized in that, The standardization and regularization of design documents corresponding to rigid solid structures and fine circuit structures includes: The original design documents are verified according to the design document specifications, invalid data is removed, and structural parameters are calibrated. The design documents are divided into two categories: rigid physical structure documents and fine circuit structure documents. The design documents are classified and archived according to the hierarchy of peripheral packaging, substrate structure, core chip, and fine circuit.

5. The rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling according to claim 1, characterized in that, The method for constructing the three-dimensional simulation model of the rigid solid component includes: Read the two-dimensional contour data of the rigid solid structure design file, identify the structural parameters such as substrate thickness, solder ball size, frame wall thickness and chip outline size, call the stretching template of the corresponding structure, complete the three-dimensional stretching forming with fixed thickness and adaptive thickness, and generate a standardized rigid solid component model.

6. The rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling according to claim 1, characterized in that, The method for constructing the three-dimensional simulation model of the micro-circuit components includes: Read the layout data of the fine circuit structure design file, analyze the trace coordinates, metal layer parameters and device package information, independently construct the three-dimensional model of micron-level microstrip lines, multilayer wiring boards and passive components, and retain the complete geometric features of the fine heat dissipation structure.

7. The rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling according to claim 1, characterized in that, The step of extracting the coordinates and layer information of each component and automatically completing layer-by-layer assembly according to the packaging stacking order includes: Extract the global coordinates, stacking levels, relative positions, and assembly spacing information of each component; align and assemble according to the actual package stacking order of the outer frame, substrate, solder ball array, core chip, multilayer circuit, and fine structure to achieve the fusion assembly of rigid structure and fine circuit structure; simultaneously perform interference detection and gap verification during the assembly process to automatically identify and correct structural overlap, positional offset, or abnormal assembly gap issues.

8. The rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling according to claim 1, characterized in that, The process of configuring and verifying simulation parameters of a 3D simulation model through a wizard-driven interactive interface based on standardized templates includes: The system inputs boundary conditions such as ambient temperature, thermal resistance of the package contact surface, and bottom constraint of the substrate in a step-by-step guided manner; it calls up the internal material library, which contains material properties of composite substrates, conductors, and solders, and assigns corresponding material properties according to structural classification; it automatically identifies the number and position of each chip in the 3D simulation model, inputs the power consumption parameters of each chip, and realizes the mapping between thermal load and chip entity; and it presets multiple levels of mesh control parameters for selection and configuration.

9. The rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling according to claim 8, characterized in that, The process of configuring and verifying simulation parameters of a 3D simulation model based on standardized templates through a wizard-driven interactive interface also includes: After the simulation parameters are configured, the system automatically compares them with the standard parameter template to verify the rationality of the boundary conditions and the matching accuracy between the thermal load and the chip entity. It also provides prompts and guides corrections for abnormal parameters and records the parameter configuration log.

10. The rapid thermal simulation method for RF SIP based on template-based wizard-driven fine modeling according to claim 1, characterized in that, The automated thermal simulation solution of the verified 3D simulation model is performed, and the simulation results are output, including: The 3D simulation model is converted into a simulation-solution-compatible format. The substrate wiring structure is simplified by equivalent processing. The substrate layer structure is discretized into a regular mesh, and the local metal ratio is calculated to solve for the equivalent material properties, thus completing the adaptive mesh generation. The solver is called, and the thermal simulation mode is automatically selected according to the template to complete the iterative calculation. After the simulation converges, the simulation results and standardized simulation report are output. The simulation results include temperature cloud map, heat flux density distribution map, and temperature rise data and heat dissipation path data of key components. The standardized simulation report includes modeling parameters, simulation conditions, calculation results, and data analysis.

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