A split type SSD master control and flash test development board system based on a DDR4-DIMM interface

Abstract

The application discloses a split type SSD master control and Flash test development board system based on a DDR4-DIMM interface, which comprises a test motherboard, a Flash daughterboard and a DDR4-DIMM interface, the DDR4-DIMM interface comprises a first DDR4-DIMM connecting unit arranged on the test motherboard and a second DDR4-DIMM connecting unit arranged on the Flash daughterboard, and the two units are plugged and matched to form a complete interface. The split type SSD master control and Flash test development board system based on the DDR4-DIMM interface disclosed by the application realizes detachable mechanical fixing and full-channel high-speed signal electrical connection of the test motherboard and the Flash daughterboard through the DDR4-DIMM interface, and realizes chip welding-free replacement, full-model Flash adaptation, full-channel full-load debugging and full-signal distortion-free measurement through modular design.

Description

Technical Field

[0001] This invention belongs to the technical field of solid-state storage chip testing equipment, specifically relating to a separate SSD controller and Flash test development board system based on the DDR4-DIMM interface, which is applied to the research and development, performance verification and compatibility testing of SSD controller chips and NAND Flash memory chips. Background Technology

[0002] With the rapid development of solid-state storage technology, the models and manufacturing processes of SSD controller chips and NAND Flash memory chips are becoming increasingly diverse. Flash chips with different architectures, such as SLC, MLC, TLC, and QLC, have significantly different requirements for power supply voltage, signal timing, and interface protocols. During the chip R&D and mass production testing phase, the development board, as the core verification platform, directly determines testing efficiency and data accuracy based on its design level.

[0003] The closest existing technology in the industry is the integrated SSD test development board, which has a single PCB structure, with an onboard soldered SSD controller chip and NAND Flash chip, and integrates a fixed voltage power supply circuit, SATA communication interface, and simple debugging interface. Some improved solutions use soldered chip sockets, which can support easy replacement of individual chips, but the signal links, power supply circuits, and interface circuits of the controller and Flash are all fixedly integrated on the same PCB, and basic read / write tests and performance verification are carried out through a host computer.

[0004] However, the aforementioned prior art has the following structural defects: First, chip replacement is inefficient and has a high failure rate. The main controller and Flash chip need to be soldered to be fixed. Replacing a single chip requires desoldering, cleaning the pads, and resoldering, which usually takes no less than ten minutes. Repeated desoldering can easily lead to chip pin burnout and PCB pad detachment. The chip failure rate is no less than 5%, which significantly increases testing costs.

[0005] Second, Flash chip compatibility is extremely poor. Existing development boards have a fixed voltage output power supply, which is only compatible with a few Flash chips of fixed specifications. This cannot meet the differentiated power supply requirements of Flash chips of different processes and manufacturers, such as SLC, MLC, TLC, and QLC, resulting in a development board being unable to cover testing of all models.

[0006] Third, it is impossible to achieve full-load debugging of all channels of the main control unit. The existing solution only supports one or two Flash channels. In the four-channel solution, due to the large difference in wiring length and signal asynchrony, it is impossible to stably achieve full-load parallel operation of all channels, and extreme performance verification is lacking.

[0007] Fourth, distortion in high-speed signal transmission leads to inaccurate test data. Existing high-speed signal links lack impedance matching and shielding design, resulting in severe crosstalk and reflections, and closed differential signal eye diagrams, which cannot accurately reflect chip performance, leading to distorted test data.

[0008] Fifth, signal debugging is difficult and R&D efficiency is low. Existing solutions only bring out a small number of control signals, requiring flying wire measurements during debugging, which damages signal integrity, makes it impossible to accurately locate timing and signal anomalies, and the debugging cycle can take several days.

[0009] Therefore, there is an urgent need for an SSD test development board system that achieves a systematic breakthrough in mechanical structure, power architecture, signal integrity, and ease of debugging. Summary of the Invention

[0010] The main objective of this invention is to provide a separate SSD controller and Flash test development board system based on a DDR4-DIMM interface. The core consists of three parts: a test motherboard, a Flash daughterboard, and a DDR4-DIMM interface. The test motherboard and the Flash daughterboard are mechanically fixed and electrically connected to high-speed signals across all channels via the DDR4-DIMM interface. The modular design enables chip replacement without soldering, compatibility with all Flash models, full-channel full-load debugging, and distortion-free measurement of all signals.

[0011] To achieve the above objectives, this invention provides a separate SSD controller and Flash test development board system based on a DDR4-DIMM interface, including a test motherboard, a Flash daughterboard, and a DDR4-DIMM interface, wherein: The DDR4-DIMM interface includes a first DDR4-DIMM connection unit located on the test motherboard and a second DDR4-DIMM connection unit located on the Flash daughterboard. The first DDR4-DIMM connection unit is a DDR4-DIMM female connector, and the second DDR4-DIMM connection unit is a DDR4-DIMM gold finger. The two are plugged and unplugged to form a complete interface, realizing a detachable mechanical connection and a high-speed signal electrical connection between the test motherboard and the Flash daughterboard. The system's working process includes: Hardware setup: Place the SSD controller chip into the high-frequency adapter probe-type controller socket of the test motherboard and close the flip cover to lock it. Place the Flash chip into the high-frequency adapter probe-type Flash socket of the Flash daughterboard and close the flip cover to lock it. Insert the DR4-DIMM gold fingers into the DDR4-DIMM female socket to complete the solderless hardware assembly. Power supply configuration: Adjust the output voltage of the multi-rail adjustable low-noise power supply module according to the specifications of the Flash chip under test to match the power supply parameters with the Flash chip; set the VCCF, VCCFQ, and other voltages to the matching values. For example, when testing TLC Flash, set VCCF to 3.3 volts and VCCFQ to 1.8 volts; when testing QLC Flash, set VCCF to 2.5 volts and VCCFQ to 1.2 volts.

[0012] Testing and debugging: Connect to the host computer through the standard SATA interface module, start the full-channel full-load test of the main controller, and collect signals and locate timing or electrical faults through the full signal output debugging unit; during the test, the signal waveform, timing parameters and power supply noise of each channel can be measured in real time through the 80-pin full signal output debugging unit 10 to quickly locate abnormal channels and abnormal signals.

[0013] Chip replacement: After disconnecting the system power supply, open the corresponding probe socket flip cover to replace the chip; no desoldering is required.

[0014] As a further preferred embodiment of the above technical solution, the test motherboard is an eight-layer rectangular PCB board, with onboard high-frequency adapter probe-type main control chip socket, multi-rail adjustable low-noise power supply module, standard SATA interface module, main control peripheral circuitry, and a first DDR4-DIMM connection unit, wherein: High-frequency adapter probe-type main control chip socket: located in the center of the test motherboard, it is compatible with the preset package, the signal end connects to the IO signal conditioning module, the power supply end connects to the multi-track adjustable low-noise power supply module, and the peripheral end connects to the main control peripheral circuit. Multi-track adjustable low-noise power supply module: Located on the left side of the test motherboard, the input end is connected to the 5V power supply of the standard SATA interface module, and the output end provides multi-track adjustable power supply for the entire system; Standard SATA interface module: Located on the upper edge of the test motherboard, the signal end is connected to the IO signal conditioning module, and the power supply end is a multi-rail adjustable low-noise power supply module input; Main controller peripheral circuitry: Surrounding the high-frequency adapter probe-type main controller chip socket, including crystal oscillator, reset, JTAG debugging, and status indication circuitry, providing peripheral support for the SSD main controller chip; The first DDR4-DIMM connection unit is located on the lower edge of the test motherboard, with pins connecting the IO signal conditioning module and the multi-track adjustable low-noise power supply module.

[0015] As a further preferred embodiment of the above technical solution, the Flash daughterboard is an eight-layer rectangular PCB board, with four onboard high-frequency adapter probe-type Flash chip sockets, a full-signal lead-out debugging unit, and a second DDR4-DIMM connection unit, wherein: Four-channel high-frequency adapter probe-type Flash chip sockets: symmetrically distributed on the upper half of the Flash daughterboard, adapted to preset packages, corresponding to the four Flash channels of the main control, and the signal terminals are connected to the Flash channel signal matching unit; Full signal output debugging unit: located on the right side of the Flash daughterboard, with an 80-pin through-hole header connected in parallel to the Flash signal link, fully outputting all high-speed signals, power signals, and ground signals; The second DDR4-DIMM connection unit is located at the lower edge of the Flash subboard and enables signal and power transmission.

[0016] As a further preferred technical solution of the above technical solution, the pin arrangement of the DDR4-DIMM interface adopts a structure in which power and ground pins are arranged at both ends and high-speed signal pins are arranged in the middle. Ground pins are provided to shield adjacent high-speed signals, and ground pins are provided to isolate differential signals on both sides, with continuous impedance matching throughout the entire link.

[0017] As a further preferred technical solution to the above technical solution, both the high-frequency adapter probe-type main control chip socket and the high-frequency adapter probe-type Flash chip socket are flip-type probe structures.

[0018] As a further preferred technical solution to the above technical solution, the four Flash channels adopt equal-length wiring to achieve synchronous and parallel full-load operation of the main control channel.

[0019] Compared with the prior art, the present invention has the following advantages: First, by using a separate architecture for the motherboard and the Flash daughterboard, combined with the pluggable connection of the DDR4-DIMM interface and the solderless installation of the probe socket, the chip replacement time is greatly improved, and damage from desoldering is completely avoided.

[0020] Secondly, through the OVP protection, LDO voltage regulation and multi-channel PWM adjustable output of the multi-track adjustable low-noise power supply module, multiple voltage levels such as VCCF and VCCFQ can be adjusted. Combined with fixed and adjustable voltage combinations such as VCCK and VCCIO, it covers the power supply requirements of all SLC, MLC, TLC and QLC Flash chips.

[0021] Third, the design of four equal-length Flash signal links eliminates the time delay difference between channels and stably supports the parallel full-load operation of the main control channel.

[0022] Fourth, through the fully shielded stacked design of the eight-layer PCB, the shielding and isolation design of the ground pin of the DDR4-DIMM interface, and impedance control, high-speed signal crosstalk is reduced, eye diagram margin is improved, and test data accuracy is improved.

[0023] Fifth, the 80-pin full signal lead-out debugging unit connects all high-speed signals, power and ground signals of the Flash signal link in parallel, eliminating the need for flying wires during debugging, quickly locating timing and signal anomalies, and improving debugging efficiency.

[0024] Sixth, through modular design, the test motherboard and Flash daughterboard can be replaced independently to adapt to different test scenarios, without the need to redesign the entire development board, thus reducing hardware costs and enhancing scalability. Attached Figure Description

[0025] Figure 1 This is a block diagram of the overall architecture of the present invention.

[0026] Figure 2 This is a schematic diagram of the test motherboard of the present invention.

[0027] Figure 3 This is a schematic diagram of the structure of the Flash subboard of the present invention.

[0028] Figure 4 This is a schematic diagram of the system workflow of the present invention.

[0029] The attached diagram includes the following reference numerals: 1. Test motherboard; 2. Flash daughterboard; 3. DDR4-DIMM interface; 4. High-frequency adapter probe-type main control chip socket; 5. Multi-track adjustable low-noise power supply module; 6. Standard SATA interface module; 7. Main control peripheral circuit; 8. First DDR4-DIMM connection unit; 9. High-frequency adapter probe-type Flash chip socket; 10. Full signal output debugging unit; 11. Second DDR4-DIMM connection unit. Detailed Implementation

[0030] The following description is intended to disclose the present invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0031] In the preferred embodiments of the present invention, those skilled in the art should note that the SSD controller chip, Flash chip, etc. involved in the present invention can be regarded as prior art.

[0032] Preferred embodiment.

[0033] like Figure 1 As shown, this invention discloses a separate SSD controller and Flash test development board system based on a DDR4-DIMM interface, including a test motherboard 1, a Flash daughterboard 2, and a DDR4-DIMM interface 3, wherein: The DDR4-DIMM interface 3 includes a first DDR4-DIMM connection unit 8 disposed on the test motherboard 1 and a second DDR4-DIMM connection unit 11 disposed on the Flash daughterboard 2; the first DDR4-DIMM connection unit 8 is a DDR4-DIMM female connector and the second DDR4-DIMM connection unit 11 is a DDR4-DIMM gold finger. The two are plugged and unplugged to form a complete interface, realizing a detachable mechanical connection and a high-speed signal electrical connection between the test motherboard 1 and the Flash daughterboard 2. like Figure 4 As shown, the system's working process includes: Hardware setup: Place the SSD controller chip into the high-frequency adapter probe type controller socket 4 of the test motherboard 1, place the Flash chip into the high-frequency adapter probe type Flash socket 9 of the Flash daughterboard 2, and insert the DR4-DIMM gold fingers into the DDR4-DIMM female socket to complete the solderless hardware assembly. Power supply configuration: Adjust the output voltage of the multi-track adjustable low-noise power supply module 5 according to the specifications of the Flash chip under test to match the power supply parameters with the Flash chip; the multi-track adjustable low-noise power supply module realizes multi-level adjustment of VCCF and VCCFQ, and is compatible with all types of Flash; the multi-level adjustable power supply is compatible with all SLC / MLC / TLC / QLC Flash, and is fully packaged. Testing and debugging: Connect to the host computer through the standard SATA interface module 6, start the full-channel full-load test of the main controller, and collect signals through the full signal output debugging unit 10 to locate timing or electrical faults; Chip replacement: After disconnecting the system power supply, open the corresponding probe socket flip cover to replace the chip; no desoldering is required.

[0034] Specifically, such as Figure 2 As shown, the test motherboard 1 is an eight-layer rectangular PCB board, with an onboard high-frequency adapter probe-type main control chip socket 4, a multi-rail adjustable low-noise power supply module 5, a standard SATA interface module 6, main control peripheral circuitry 7, and a first DDR4-DIMM connection unit 8, wherein: High-frequency adapter probe-type main control chip socket 4: Located in the center of test motherboard 1, it is compatible with a preset package (e.g., BGA144), the signal end is connected to the IO signal conditioning module, the power supply end is connected to the multi-track adjustable low-noise power supply module 5, and the peripheral end is connected to the main control peripheral circuit. Multi-track adjustable low-noise power supply module 5: Located on the left side of the test motherboard 1, its input end is connected to the 5V power supply of the standard SATA interface module 6, and its output end provides multi-track adjustable power supply for the entire system; Standard SATA interface module 6: Located on the upper edge of the test motherboard 1, its signal end connects to the IO signal conditioning module, and its power supply end is the input of a multi-rail adjustable low-noise power supply module; it uses a SATA 7-pin plus 15-pin connector. The signal end connects to the IO conditioning module to achieve data communication with the host computer; the power supply end extracts 5V input power to supply the multi-rail adjustable low-noise power supply module 5. ESD protection devices are arranged in the signal link to improve the system's anti-static capability.

[0035] Main control peripheral circuit 7: surrounds the high-frequency adapter probe-type main control chip socket 4, including a crystal oscillator circuit, a reset circuit, a JTAG debug port, a GPIO configuration circuit, an LED status indicator circuit, and a voltage detection circuit; the crystal oscillator circuit provides the system clock for the main control chip; the reset circuit includes a manual reset button and a power-on reset network; the JTAG debug port is a four-wire standard interface; the voltage detection circuit includes an internal voltage detector for the host power supply and an internal voltage detector for the Flash core power supply, used to monitor the system power supply status in real time.

[0036] First DDR4-DIMM connection unit 8: Located at the lower edge of test motherboard 1, its pins are connected to the IO signal conditioning module and the multi-track adjustable low-noise power supply module.

[0037] More specifically, such as Figure 3 As shown, the Flash daughterboard 2 is an eight-layer rectangular PCB board, with onboard four-channel high-frequency adapter probe-type Flash chip sockets 9, a full-signal lead-out debugging unit 10, and a second DDR4-DIMM connection unit 11, wherein: Four-channel high-frequency adapter probe-type Flash chip socket 9: symmetrically distributed on the upper half of Flash daughterboard 2, adapting to preset packages (BGA132 / BGA152), corresponding to the four main control Flash channels, and the signal end is connected to the Flash channel signal matching unit; Full-signal output debugging unit 10: Located on the right side of Flash daughterboard 2, it is an 80-pin through-hole header connected in parallel to the Flash signal link, fully outputting all high-speed signals, power signals, and ground signals. During debugging, an oscilloscope or logic analyzer can be directly connected to this header without the need for jumpers, thus avoiding damage to signal integrity; The second DDR4-DIMM connection unit 11 is located at the lower edge of the Flash daughterboard 2 and enables signal and power transmission.

[0038] Furthermore, the pin arrangement of the DDR4-DIMM interface 3 adopts a structure in which power and ground pins are arranged at both ends and high-speed signal pins are arranged in the middle. Ground pins are provided to shield adjacent high-speed signals, and ground pins are provided to isolate differential signals on both sides, ensuring continuous impedance matching throughout the entire link.

[0039] Furthermore, both the high-frequency adapter probe-type main control chip socket 4 and the high-frequency adapter probe-type Flash chip socket 9 are flip-top probe structures.

[0040] Preferably, the four Flash channels use equal-length wiring. By adjusting the wiring length and adding serpentine compensation, the length deviation of the four links is controlled within a preset tolerance range, ensuring that the signals of the four channels arrive synchronously, thereby realizing the parallel full-load debugging of the main control channel.

[0041] It is worth mentioning that the technical features of SSD controller chips, Flash chips, etc. involved in this patent application should be regarded as prior art. The specific structure, working principle, and possible control methods and spatial arrangement of these technical features can be adopted using conventional choices in the field, and should not be regarded as the inventive point of this patent. This patent will not be further elaborated in detail.

[0042] For those skilled in the art, modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this invention should be included within the protection scope of this invention.

Claims

1. A separate SSD controller and Flash test development board system based on a DDR4-DIMM interface, characterized in that, This includes the test motherboard, Flash daughterboard, and DDR4-DIMM interface, among which: The DDR4-DIMM interface includes a first DDR4-DIMM connection unit located on the test motherboard and a second DDR4-DIMM connection unit located on the Flash daughterboard. The first DDR4-DIMM connection unit is a DDR4-DIMM female connector, and the second DDR4-DIMM connection unit is a DDR4-DIMM gold finger. The two are plugged and unplugged to form a complete interface, realizing a detachable mechanical connection and a high-speed signal electrical connection between the test motherboard and the Flash daughterboard. The system's working process includes: Hardware setup: Place the SSD controller chip into the high-frequency adapter probe-type controller socket of the test motherboard, place the Flash chip into the high-frequency adapter probe-type Flash socket of the Flash daughterboard, and insert the DR4-DIMM gold fingers into the DDR4-DIMM female socket to complete the solderless hardware assembly. Power supply configuration: Adjust the output voltage of the multi-rail adjustable low-noise power supply module according to the specifications of the Flash chip under test to match the power supply parameters with the Flash chip; Testing and debugging: Connect to the host computer through the standard SATA interface module, start the full-channel full-load test of the main controller, and collect signals through the full signal output debugging unit to locate timing or electrical faults; Chip replacement: After disconnecting the system power supply, open the corresponding probe socket flip cover to replace the chip; no desoldering is required.

2. The separate SSD controller and Flash test development board system based on a DDR4-DIMM interface according to claim 1, characterized in that, The test motherboard is an eight-layer rectangular PCB board, featuring an onboard high-frequency adapter probe-type main control chip socket, a multi-rail adjustable low-noise power supply module, a standard SATA interface module, main control peripheral circuitry, and a first DDR4-DIMM connection unit, wherein: High-frequency adapter probe-type main control chip socket: located in the center of the test motherboard, it is compatible with the preset package, the signal end connects to the IO signal conditioning module, the power supply end connects to the multi-track adjustable low-noise power supply module, and the peripheral end connects to the main control peripheral circuit. Multi-track adjustable low-noise power supply module: Located on the left side of the test motherboard, the input end is connected to the 5V power supply of the standard SATA interface module, and the output end provides multi-track adjustable power supply for the entire system; Standard SATA interface module: Located on the upper edge of the test motherboard, the signal end is connected to the IO signal conditioning module, and the power supply end is a multi-rail adjustable low-noise power supply module input; Main controller peripheral circuitry: Surrounding the high-frequency adapter probe-type main controller chip socket, including crystal oscillator, reset, JTAG debugging, and status indication circuitry, providing peripheral support for the SSD main controller chip; The first DDR4-DIMM connection unit is located on the lower edge of the test motherboard, with pins connecting the IO signal conditioning module and the multi-track adjustable low-noise power supply module.

3. The separate SSD controller and Flash test development board system based on a DDR4-DIMM interface according to claim 2, characterized in that, The Flash daughterboard is an eight-layer rectangular PCB board, with four high-frequency adapter probe-type Flash chip sockets, a full-signal lead-out debugging unit, and a second DDR4-DIMM connection unit, wherein: Four-channel high-frequency adapter probe-type Flash chip sockets: symmetrically distributed on the upper half of the Flash daughterboard, adapted to preset packages, corresponding to the four Flash channels of the main control, and the signal end is connected to the Flash channel signal matching unit; Full signal output debugging unit: located on the right side of the Flash daughterboard, with an 80-pin through-hole header connected in parallel to the Flash signal link, fully outputting all high-speed signals, power signals, and ground signals; The second DDR4-DIMM connection unit is located at the lower edge of the Flash subboard and enables signal and power transmission.

4. The separate SSD controller and Flash test development board system based on a DDR4-DIMM interface according to claim 1, characterized in that, The pin layout of the DDR4-DIMM interface adopts a structure with power and ground pins at both ends and high-speed signal pins in the middle. Ground pins are used to shield adjacent high-speed signals, and ground pins are used to isolate differential signals on both sides. The impedance is continuously matched throughout the entire link.

5. The separate SSD controller and Flash test development board system based on a DDR4-DIMM interface according to claim 1, characterized in that, Both the high-frequency adapter probe-type main control chip socket and the high-frequency adapter probe-type Flash chip socket have a flip-top probe structure.

6. The separate SSD controller and Flash test development board system based on a DDR4-DIMM interface according to claim 3, characterized in that, The four Flash channels use equal-length wiring to enable the main control to operate synchronously and in parallel at full load across all channels.

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