A flexible NTC thermistor with adjustable thickness and a manufacturing method thereof

Abstract

The application discloses a thickness-adjustable flexible NTC thermistor and a manufacturing method thereof, and is characterized in that the thickness-adjustable flexible NTC thermistor comprises an ultrathin flexible NTC substrate pre-preparation process and a chip area local thickness compensation process; the chip area local thickness compensation process is executed by one-side local thickness compensation technology or double-side local thickness compensation technology according to assembly gap and temperature measurement demand. The thickness-adjustable flexible NTC thermistor can be combined with customer demand to be adapted to installation of different gap sizes through simple process change, film thickness is increased, bending installation is not affected, and temperature measurement rapid response can be realized.

Description

Technical Field

[0001] This invention relates to a thermistor, and more particularly to a method for manufacturing a flexible NTC thermistor suitable for installation in narrow and variable gaps. Background Technology

[0002] Flexible NTC temperature sensors, due to their excellent bendability and adaptability to curved surface installation environments, have been widely used in real-time battery temperature monitoring scenarios. In practical applications, flexible NTC sensors are typically inserted into the gap between the battery and the fixed bracket, achieving continuous monitoring of the battery's thermal state through contact temperature measurement of the battery surface.

[0003] However, the gap size between the battery and the bracket varies significantly depending on the customer or application scenario. To meet diverse installation gap requirements, existing technologies typically employ the following two approaches: First, developing multiple sensor products with different thicknesses for different gap sizes leads to increased mold costs and complex inventory management. Secondly, thermally conductive pads or adhesives are used for thickness compensation at the installation site. This method has problems such as low compensation accuracy, uncertain thermal conductivity, and poor installation consistency.

[0004] Based on a comprehensive analysis of the existing technologies, current flexible NTC temperature sensors still have the following shortcomings in battery installation monitoring applications: First, the fixed thickness makes it unsuitable for varying installation gaps. As described in patent CN210956321U, the overall thickness of its NTC temperature sensor remains fixed after design and manufacturing. When the gap between the battery and the bracket changes for different customers or in different application scenarios, the overall sensor structure must be redesigned or a different model must be used, making it unable to flexibly adapt to diverse assembly requirements.

[0005] Second, there is a contradiction between thickness adjustment and maintaining flexibility. Some studies have proposed introducing additional structural layers for thickness compensation, such as CN110840417A, which improves structural reliability by adding a reinforcement layer. However, this approach leads to an increase in the overall thickness of the device and an increase in bending stiffness, which is detrimental to maintaining the sensor's flexible mounting capability. Existing technologies have not yet resolved the technical contradiction between "achieving thickness compensation" and "maintaining the original flexibility of the pin area".

[0006] Third, the differentiated compensation requirements for different temperature measurement modes are not considered. In battery monitoring scenarios, single-sided and double-sided temperature measurement have different requirements for sensor adhesion. Existing technologies do not provide a selective thickness adjustment solution to address this difference.

[0007] Therefore, there is an urgent need to develop a flexible NTC product with adjustable thickness, enabling it to adapt to different assembly spaces in a simple way without altering other structural features. An ideal solution should meet the following requirements: maintain the ultra-thin characteristics of the substrate for use in confined spaces and with rapid thermal response; thickness compensation should be precisely applied to the chip area requiring bonding; the compensation area should not affect the flexible bending capability of the pins; and it should be compatible with different installation requirements for single-sided and double-sided temperature measurement. Summary of the Invention

[0008] The purpose of this invention is to solve the problems in the prior art and provide a method for manufacturing flexible NTC thermistors based on ultra-thin flexible NTC, by adjusting the thickness of the chip and regulating its thickness.

[0009] The technical solution of the present invention is: a method for manufacturing a thickness-adjustable flexible NTC thermistor, characterized in that: it includes an ultra-thin flexible NTC substrate prefabrication process and a chip area local thickness compensation process; The ultra-thin flexible NTC substrate prefabrication process includes the following steps: (1) Take an NTC chip with a thickness of 0.2mm and a metal lead frame with a thickness of 0.15mm, assemble the NTC chip at the middle position of the front end of the two leads of the lead frame, and use the immersion soldering process to complete the electrical and mechanical fixation of the NTC chip and the lead frame; (2) Cut two pieces of insulating encapsulation film with a thickness of 0.05mm, attach the two pieces of insulating encapsulation film to the left and right sides of the soldered chip-pin assembly respectively, and perform hot-press encapsulation on the overall structure. After encapsulation, leave the pin ends exposed for back-end circuit board soldering. (3) After packaging, an ultra-thin flexible NTC substrate with a base thickness of 0.3mm is obtained. The pin frame area of ​​the ultra-thin flexible NTC substrate has no additional thickening layer and has free bending flexibility; The chip area local thickness compensation process can be performed using either a single-sided local thickness compensation process or a double-sided local thickness compensation process, depending on the assembly gap and temperature measurement requirements.

[0010] Preferably, the unilateral local thickness compensation process is adapted to scenarios where the single-sided surface temperature is high and the gap between the battery and the bracket is greater than 0.3mm, and includes the following steps: S1: Cut a compensation encapsulation film with a thickness of 0.2mm. The outer dimensions of the compensation encapsulation film are perfectly matched with the projection area of ​​the NTC chip on the ultra-thin flexible NTC substrate. S2: The cut compensation encapsulation film is attached to one side of the ultra-thin flexible NTC substrate with adhesive, and only covers the area where the NTC chip is located. The compensation encapsulation film is not attached to the pin area. S3: Hot-press curing adhesive to complete the preparation of single-sided thickened flexible NTC products; the compensation layer is only set on the chip side, and the pins maintain the original 0.3mm ultra-thin flexible structure; during assembly, the side without the compensation layer is in close contact with the battery surface, and the side with the compensation layer faces the bracket to fill the gap.

[0011] Preferably, the dual-sided local thickness compensation process is adapted to scenarios with dual-sided surface temperatures and a gap between the battery and the bracket greater than 0.3mm, and includes the following steps: S1: Cut two 0.1mm thick compensation encapsulation films, with the dimensions of each compensation encapsulation film perfectly matching the projection area of ​​the NTC chip on the ultra-thin flexible NTC substrate; S2: Take the first compensation encapsulation film and attach it to the upper side of the ultra-thin flexible NTC substrate with adhesive, covering only the NTC chip area; S3: Take the second compensation encapsulation film and attach it to the underside of the ultra-thin flexible NTC substrate with adhesive, covering only the NTC chip area; S4: Hot-press curing of adhesives on both sides completes the preparation of double-sided thickened flexible NTC products; the compensation layers on both sides are limited to the chip area, and there is no compensation layer in the pin area, maintaining the original bending flexibility; during assembly, the compensation layers on both sides are respectively attached to two sets of battery / bracket structures to achieve double-sided temperature measurement.

[0012] Preferably, the 0.3mm ultrathin flexible NTC substrate prefabricated in steps (1) to (3) has a bare die temperature measurement response time of 0.8 to 0.9s.

[0013] Preferably, the single-sided thickened flexible NTC product prepared by the single-sided local thickness compensation process has a total thickness adapted to an assembly gap of 0.5mm and a temperature measurement response time of 1.0~1.2s.

[0014] Preferably, the double-sided thickened flexible NTC product prepared by the double-sided local thickness compensation process has a total thickness adapted to an assembly gap of 0.5mm and a temperature measurement response time of 1.2~1.6s.

[0015] Preferably, the single-sided compensation encapsulation film and the double-sided compensation encapsulation film are only attached to a local area of ​​the NTC chip, and the pin frame is not covered by a compensation layer throughout. The finished pin segment can be bent freely to adapt to curved surfaces and narrow variable gap installation scenarios.

[0016] Preferably, the thickness of the insulating encapsulation film used in the prefabricated ultrathin flexible NTC substrate is uniformly 0.05mm; a single 0.2mm compensation encapsulation film is used for single-sided compensation, and two 0.1mm compensation encapsulation films are used for double-sided compensation. The compensation encapsulation film and the insulating encapsulation film are made of the same insulating and thermally conductive material.

[0017] Preferably, the flexible NTC thermistor is used for power battery temperature monitoring, and the ultra-thin flexible NTC substrate is adapted to a narrow assembly gap of 0.3mm; the single-sided thickened flexible NTC product is used for single-sided temperature measurement of a single battery, and the double-sided thickened flexible NTC product is used for double-sided clamping temperature measurement of two batteries.

[0018] An adjustable-thickness flexible NTC thermistor is characterized in that: the resistor comprises a 0.3mm ultrathin flexible substrate and a local compensation encapsulation film; the 0.3mm ultrathin flexible substrate is formed by hot-pressing a 0.2mm NTC chip, a 0.15mm lead frame, and two 0.05mm basic insulating encapsulation films.

[0019] Preferably, the local compensation encapsulation film is only attached to a local area on one or both sides of the NTC chip, and the pin area has no thickened structure and can be freely bent.

[0020] Preferably, the compensation encapsulation film and the basic insulating encapsulation film are bonded together by hot pressing with an adhesive; the overall assembly thickness of the same ultra-thin flexible substrate can be adjusted by adding a single-sided or double-sided local compensation encapsulation film, which is compatible with both single-sided and double-sided temperature measurement installation modes.

[0021] The present invention has the following beneficial effects: 1) Thickness-adjustable structural design: A thickness-adjustable flexible NTC structure is proposed. Through an independent thickness compensation mechanism for the chip area, the same product can be adapted to different application scenarios and customers' different requirements for installation gaps without redesigning the overall sensor structure or changing the product model.

[0022] 2) Ultra-thin substrate design: The substrate adopts an ultra-thin flexible NTC design with an overall base thickness of only 0.3mm, which can be used in extremely narrow installation spaces and achieve extremely fast thermal response speed.

[0023] 3) Localized Precise Thickness Compensation: Thickness compensation is performed only in localized areas of the NTC chip, precisely filling the gap between the battery and the bracket, ensuring a tight fit between the sensor and the battery surface, significantly improving temperature measurement accuracy and response speed, while avoiding waste of compensation materials.

[0024] 4) Flexible retention technology: Thickness compensation is applied only to the chip area, and the pin area retains the original 0.3mm ultra-thin structure, without affecting the flexibility and bending installation capability of the pin area, and the overall installation convenience is not affected.

[0025] 5) Dual-sided selectable compensation mode: Supports single-sided or dual-sided thickness adjustment, which can meet the different needs of single-sided temperature measurement and dual-sided temperature measurement respectively, further expanding the product's applicable scenarios. Attached Figure Description

[0026] Figure 1 and Figure 1a The front view and side view in step 1 of this invention. Figure 2 and Figure 2a The front view and side view in step 2 of this invention. Figure 3 This is an assembly diagram of application scenario one in this invention. Figure 4 This is a schematic diagram of the temperature measurement installation of a single-sided thickened flexible NTC product battery in this invention. Figure 5 This is an assembly diagram of application scenario two in this invention. Figure 6 This is a schematic diagram of the temperature measurement installation of the double-sided thickened flexible NTC product battery in this invention. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” used in the embodiments of this invention and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. “Multiple” generally includes at least two, but does not exclude the inclusion of at least one.

[0029] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0030] Depending on the context, the words “if” or “suppose” as used here can be interpreted as “when” or “in response to determination” or “in response to detection.” Similarly, depending on the context, the phrases “if determination” or “if detection (of the stated condition or event)” can be interpreted as “when determination” or “in response to determination” or “when detection (of the stated condition or event)” or “in response to detection (of the stated condition or event).”

[0031] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes said element.

[0032] The present invention discloses a method for manufacturing a thickness-adjustable flexible NTC thermistor, characterized in that it includes an ultra-thin flexible NTC substrate prefabrication process and a chip area local thickness compensation process; The ultra-thin flexible NTC substrate prefabrication process includes the following steps: (1) Take an NTC chip with a thickness of 0.2 mm and a metal lead frame with a thickness of 0.15 mm. Assemble the NTC chip at the middle position of the front end of the two leads of the lead frame, and complete the electrical and mechanical fixation of the NTC chip and the lead frame by immersion soldering process; refer to Figure 1 and Figure 1a As shown.

[0033] (2) Cut two 0.05mm thick insulating encapsulation films and attach them to the left and right sides of the soldered chip-pin assembly, respectively. Perform thermo-press encapsulation on the overall structure, leaving the pin ends exposed for subsequent circuit board soldering; refer to Figure 2 and Figure 2a As shown.

[0034] (3) After packaging, an ultra-thin flexible NTC substrate with a base thickness of 0.3mm is obtained. The pin frame area of ​​the ultra-thin flexible NTC substrate has no additional thickening layer and has free bending flexibility.

[0035] The ultra-thin flexible NTC of the present invention (0.3 mm thickness) and the conventional product (0.5 mm thickness) were attached to the surface of the battery and their response times were compared.

[0036] The 0.3mm ultrathin flexible NTC substrate prefabricated in steps (1) to (3) has a bare die temperature measurement response time of 0.8 to 0.9s.

[0037] The existing manufacturing process for conventional products is as follows: Step (1) Install the 0.4mm thick NTC chip in the middle of the front end of the two pins of the 0.15mm thick pin frame and fix it by immersion soldering.

[0038] Step (2) Use two 0.05mm encapsulation films to heat-press encapsulate the product obtained in step (1). The encapsulation films are located on the left and right sides of the product as shown in the side view. Some of the pins are exposed to facilitate soldering to the circuit board.

[0039] The response time of existing products (0.5mm thickness) is about 1.1~1.5s; while the response time of the ultra-thin product of the present invention (0.3mm thickness) is about 0.8~0.9s; the response speed of the ultra-thin product is 35% better than that of conventional products.

[0040] The ultra-thin product of this invention meets the application scenario where the gap between the battery and the bracket is only 0.3mm. The ultra-thin flexible NTC product is in close contact with the battery, which can meet the temperature measurement accuracy and achieve an extremely fast response speed.

[0041] In addition, for applications where the gap between the battery and the bracket is greater than 0.3mm, the application can be achieved by adjusting the thickness of the product.

[0042] The chip area local thickness compensation process can be performed using either a single-sided local thickness compensation process or a double-sided local thickness compensation process, depending on the assembly gap and temperature measurement requirements.

[0043] Application Scenario 1: Assuming the gap between the battery and the bracket is 0.5mm, and temperature measurement is required on one side.

[0044] The single-sided local thickness compensation process is suitable for scenarios with single-sided surface temperature and a gap between the battery and the bracket greater than 0.3mm, and includes the following steps: S1: Cut a compensation encapsulation film with a thickness of 0.2mm. The outer dimensions of the compensation encapsulation film are perfectly matched with the projection area of ​​the NTC chip on the ultra-thin flexible NTC substrate. S2: The cut compensation encapsulation film is attached to one side of the ultra-thin flexible NTC substrate with adhesive, and only covers the area where the NTC chip is located. The compensation encapsulation film is not attached to the pin area. S3: Hot-press curing adhesive to complete the fabrication of a single-sided thickened flexible NTC product; the compensation layer is only located on the chip side, maintaining the original 0.3mm ultra-thin flexible structure of the leads; during assembly, the side without the compensation layer is in close contact with the battery surface, while the side with the compensation layer faces the support to fill the gap, as shown in the reference. Figure 3 As shown.

[0045] The manufacturing process is simple, and by increasing the thickness of the film on one side, it can be applied to applications with different gap sizes.

[0046] In this type of adjustable-thickness flexible NTC product, the film thickness is increased on one side near the support, while the unthickened part is installed close to the battery. An installation diagram is shown below. Figure 4As shown. Because the film thickness is increased only at the NTC chip area, it does not affect the bending of the terminals below, and can be adapted for curved surface mounting.

[0047] Testing showed that the product's response time is approximately 1.0 to 1.2 seconds, which is 15% faster than conventional products.

[0048] Application Scenario 2: Assuming the gap between the battery and the bracket is 0.5mm, and temperature measurement is required on both sides.

[0049] The dual-sided local thickness compensation process is suitable for scenarios with dual-sided surface temperatures and a gap between the battery and the bracket greater than 0.3mm, and includes the following steps: S1: Cut two 0.1mm thick compensation encapsulation films, with the dimensions of each compensation encapsulation film perfectly matching the projection area of ​​the NTC chip on the ultra-thin flexible NTC substrate; S2: Take the first compensation encapsulation film and attach it to the upper side of the ultra-thin flexible NTC substrate with adhesive, covering only the NTC chip area; S3: Take the second compensation encapsulation film and attach it to the underside of the ultra-thin flexible NTC substrate with adhesive, covering only the NTC chip area; S4: Hot-press curing of adhesives on both sides completes the fabrication of the double-sided thickened flexible NTC product; the compensation layers on both sides are limited to the chip area, with no compensation layer in the pin area, maintaining the original bending flexibility; during assembly, the compensation layers on both sides are respectively attached to two sets of battery / bracket structures to achieve double-sided temperature measurement, reference. Figure 5 As shown.

[0050] The manufacturing process is simple. Increasing the film thickness on both sides can meet the needs of applications with different gap sizes and also achieve the requirement of bilateral temperature measurement. The adjustable thickness flexible NTC product is directly inserted into the gap between the bracket and the battery, and the product is installed in a state of close contact with the battery. The installation diagram is shown below. Figure 6 As shown. Because the film thickness is increased only at the NTC chip area, it does not affect the bending of the terminals below, allowing for curved surface mounting. Testing showed that the response time of this product is approximately 1.2~1.6s, comparable to conventional products.

[0051] In this embodiment, the single-sided compensation encapsulation film and the double-sided compensation encapsulation film are only attached to a local area of ​​the NTC chip. The pin frame is not covered by a compensation layer throughout, and the finished pin segment can be bent freely to adapt to curved surfaces and narrow variable gap installation scenarios.

[0052] In this embodiment, the thickness of the insulating encapsulation film used in the prefabricated ultra-thin flexible NTC substrate is uniformly 0.05mm; a single 0.2mm compensation encapsulation film is used for single-sided compensation, and two 0.1mm compensation encapsulation films are used for double-sided compensation. The compensation encapsulation film and the insulating encapsulation film are made of the same insulating and thermally conductive material.

[0053] The flexible NTC thermistor described in this embodiment is used for power battery temperature monitoring. The ultra-thin flexible NTC substrate is adapted to a narrow assembly gap of 0.3mm. The single-sided thickened flexible NTC product is used for single-sided temperature measurement of a single battery, and the double-sided thickened flexible NTC product is used for double-sided clamping temperature measurement of two batteries.

[0054] This embodiment also provides a thickness-adjustable flexible NTC thermistor, characterized in that: the resistor includes a 0.3mm ultra-thin flexible substrate and a local compensation encapsulation film 1; the 0.3mm ultra-thin flexible substrate is formed by hot-pressing a 0.2mm NTC chip 11, a 0.15mm lead frame 12, and two 0.05mm basic insulating encapsulation films 13.

[0055] Preferably, the local compensation encapsulation film 1 is only attached to a local area on one or both sides of the NTC chip 11, and the pin area has no thickened structure and can be freely bent.

[0056] Preferably, the compensation encapsulation film 1 and the basic insulating encapsulation film 13 are bonded together by hot pressing with an adhesive; the overall assembly thickness of the same ultra-thin flexible substrate can be adjusted by adding one-sided or two-sided local compensation encapsulation films 1, which is compatible with both single-sided and double-sided temperature measurement installation modes.

[0057] In this embodiment, when assembling the single-sided compensation product 2, the side without the compensation film is attached to the surface of the power battery 3, and the side with the compensation film abuts against the metal bracket 31 to fill the assembly gap; the double-sided compensation product 4 has the compensation films on both sides attached to the surfaces of the two sets of power batteries 3 respectively, so as to realize simultaneous temperature measurement on both sides.

[0058] A thickness compensation layer is set only in the temperature measurement area of ​​the NTC chip, while the pin area retains its original flexibility. There is no need to open molds to prepare multiple sensor substrates of different thicknesses. Different battery-bracket assembly gaps can be adapted simply by cutting the local compensation encapsulation film. This reduces mold development and inventory management costs and avoids the defects of poor bonding accuracy and unstable thermal conductivity caused by adding additional thermal pads on site.

[0059] This embodiment of the thickness-adjustable flexible NTC can be adapted to different gap sizes for installation by simple process changes, and the film thickness can be increased without affecting bending installation, and rapid temperature measurement response can be achieved.

[0060] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the invention. All equivalent changes and modifications made in accordance with the scope of the claims of this invention should fall within the technical scope of this invention.

Claims

1. A method for manufacturing a thickness-adjustable flexible NTC thermistor, characterized in that: This includes the ultra-thin flexible NTC substrate prefabrication process and the chip area local thickness compensation process; The ultra-thin flexible NTC substrate prefabrication process includes the following steps: (1) Take an NTC chip with a thickness of 0.2mm and a metal lead frame with a thickness of 0.15mm, assemble the NTC chip at the middle position of the front end of the two leads of the lead frame, and use the immersion soldering process to complete the electrical and mechanical fixation of the NTC chip and the lead frame; (2) Cut two pieces of insulating encapsulation film with a thickness of 0.05mm, attach the two pieces of insulating encapsulation film to the left and right sides of the soldered chip-pin assembly respectively, and perform hot-press encapsulation on the overall structure. After encapsulation, leave the pin ends exposed for back-end circuit board soldering. (3) After packaging, an ultra-thin flexible NTC substrate with a base thickness of 0.3mm is obtained. The pin frame area of ​​the ultra-thin flexible NTC substrate has no additional thickening layer and has free bending flexibility; The chip area local thickness compensation process can be performed using either a single-sided local thickness compensation process or a double-sided local thickness compensation process, depending on the assembly gap and temperature measurement requirements.

2. The method for manufacturing a thickness-adjustable flexible NTC thermistor according to claim 1, characterized in that: The single-sided local thickness compensation process is suitable for scenarios with single-sided surface temperature and a gap between the battery and the bracket greater than 0.3mm, and includes the following steps: S1: Cut a compensation encapsulation film with a thickness of 0.2mm. The outer dimensions of the compensation encapsulation film are perfectly matched with the projection area of ​​the NTC chip on the ultra-thin flexible NTC substrate. S2: The cut compensation encapsulation film is attached to one side of the ultra-thin flexible NTC substrate with adhesive, and only covers the area where the NTC chip is located. The compensation encapsulation film is not attached to the pin area. S3: Hot-press curing adhesive to complete the preparation of single-sided thickened flexible NTC products; the compensation layer is only set on the chip side, and the pins maintain the original 0.3mm ultra-thin flexible structure; during assembly, the side without the compensation layer is in close contact with the battery surface, and the side with the compensation layer faces the bracket to fill the gap.

3. The method for manufacturing a thickness-adjustable flexible NTC thermistor according to claim 1 or 2, characterized in that: The dual-sided local thickness compensation process is suitable for scenarios with dual-sided surface temperatures and a gap between the battery and the bracket greater than 0.3mm, and includes the following steps: S1: Cut two 0.1mm thick compensation encapsulation films, with the dimensions of each compensation encapsulation film perfectly matching the projection area of ​​the NTC chip on the ultra-thin flexible NTC substrate; S2: Take the first compensation encapsulation film and attach it to the upper side of the ultra-thin flexible NTC substrate with adhesive, covering only the NTC chip area; S3: Take the second compensation encapsulation film and attach it to the underside of the ultra-thin flexible NTC substrate with adhesive, covering only the NTC chip area; S4: Hot-press curing of adhesives on both sides completes the preparation of double-sided thickened flexible NTC products; the compensation layers on both sides are limited to the chip area, and there is no compensation layer in the pin area, maintaining the original bending flexibility; during assembly, the compensation layers on both sides are respectively attached to two sets of battery / bracket structures to achieve double-sided temperature measurement.

4. The method for manufacturing a thickness-adjustable flexible NTC thermistor according to claim 1, characterized in that: The 0.3mm ultrathin flexible NTC substrate prefabricated in steps (1) to (3) has a bare die temperature measurement response time of 0.8 to 0.9s.

5. The method for manufacturing a thickness-adjustable flexible NTC thermistor according to claim 2, characterized in that: The single-sided thickened flexible NTC product prepared by the single-sided local thickness compensation process has a total thickness adapted to an assembly gap of 0.5mm and a temperature measurement response time of 1.0~1.2s.

6. The method for manufacturing a thickness-adjustable flexible NTC thermistor according to claim 2 or 3, characterized in that: The double-sided thickened flexible NTC product prepared by the double-sided local thickness compensation process has a total thickness adapted to an assembly gap of 0.5mm and a temperature measurement response time of 1.2~1.6s.

7. The method for manufacturing a thickness-adjustable flexible NTC thermistor according to claim 6, characterized in that: The single-sided and double-sided compensation encapsulation films are only attached to a local area of ​​the NTC chip, and the pin frame is not covered by a compensation layer throughout. The finished pin segment can be bent freely to adapt to curved surfaces and narrow variable gap installation scenarios.

8. The method for manufacturing a thickness-adjustable flexible NTC thermistor according to claim 1, characterized in that: The thickness of the insulating encapsulation film used in the prefabricated ultra-thin flexible NTC substrate is uniformly 0.05mm; a single 0.2mm compensation encapsulation film is used for single-sided compensation, and two 0.1mm compensation encapsulation films are used for double-sided compensation. The compensation encapsulation film and the insulating encapsulation film are made of the same insulating and thermally conductive material.

9. The method for manufacturing a thickness-adjustable flexible NTC thermistor according to claim 1, characterized in that: The flexible NTC thermistor is used for power battery temperature monitoring, and the ultra-thin flexible NTC substrate is adapted to a narrow assembly gap of 0.3mm; the single-sided thickened flexible NTC product is used for single-sided temperature measurement of a single battery, and the double-sided thickened flexible NTC product is used for double-sided clamping temperature measurement of two batteries.

10. A flexible NTC thermistor with adjustable thickness prepared by any one of the manufacturing methods described in claims 1 to 9, characterized in that: The resistor comprises a 0.3mm ultra-thin flexible substrate and a local compensation encapsulation film. The 0.3mm ultra-thin flexible substrate is formed by hot-pressing a 0.2mm NTC chip, a 0.15mm lead frame, and two 0.05mm basic insulating encapsulation films. The local compensation encapsulation film is only attached to a local area on one or both sides of the NTC chip, and the lead area has no thickened structure and can be freely bent. The compensation encapsulation film and the basic insulating encapsulation film are bonded together by hot-pressing with adhesive. The overall assembly thickness of the same ultra-thin flexible substrate can be adjusted by adding one or both sides of local compensation encapsulation films, and it is compatible with both single-sided and double-sided temperature measurement installation modes.

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