A printed circuit board assembly incorporating a non-reciprocal network

Abstract

The application discloses a printed circuit substrate assembly integrated with non-reciprocal networks and belongs to the technical field of printed circuit integrated devices. Metal through holes and a printed circuit board form a plurality of substrate integrated waveguide branches, the plurality of substrate integrated waveguide branches meet at a central region, a non-reciprocal medium body is arranged at the meeting central region, and the non-reciprocal medium body and surrounding metal boundaries jointly form a non-reciprocal feed isolation network. A magnetic bias assembly is arranged on one side or both sides of the non-reciprocal medium body, the magnetic bias assembly is used for providing a static magnetic bias field to the non-reciprocal medium body, the non-reciprocal medium body generates a gyromagnetic non-reciprocal response under the action of the static magnetic bias field, and electromagnetic signals in a target working frequency band are transmitted between a transmitting port, a receiving port and a common radiation branch according to a predetermined direction. The application is used to solve the problems of low cascading integration and large switching loss of existing printed circuit type radio frequency front end discrete devices.

Description

Technical Field

[0001] This invention belongs to the field of printed circuit integrated device technology, and specifically relates to a printed circuit board assembly integrating a non-reciprocal network. Background Technology

[0002] Existing common-antenna transceiver front-ends based on printed circuit boards (PCBs) generally employ discrete non-reciprocal components, independent feed networks, and individual antenna elements, assembled through surface mount, coaxial adapters, or cascaded printed circuit traces. This approach requires additional PCB adapter pads, microstrip connection traces, port adapter structures, and assembly stations, easily introducing additional insertion loss, impedance mismatch, parasitic radiation, and assembly tolerances at the PCB level. For miniaturized, highly integrated, and low-loss PCB-based RF systems, the cascaded discrete component structure is insufficient to meet the demands of compact board-level integration.

[0003] Substrate integrated waveguides (DIWBs), as planar waveguide structures compatible with standard printed circuit (PCB) fabrication processes, possess low radiation loss, high power capacity, and ease of integration, making them suitable for constructing compact PCB microwave front-end devices. Current PCB-based non-reciprocal DIWB devices primarily focus on directional transmission and isolation between ports, requiring their output ports to be connected to independent antenna elements via additional PCB feed networks. This prevents the integration of isolation and radiation functions at the board level. Furthermore, existing PCB-based DIWB end-fire antennas mainly focus on bandwidth, gain, and pattern modulation, typically lacking non-reciprocal isolation capabilities for transmission and reception in shared antenna scenarios.

[0004] Therefore, there is an urgent need to develop an integrated device that can simultaneously realize transmit power supply, receive power supply, transmit / receive isolation and antenna radiation on a single printed circuit board. This allows the antenna radiation port to directly serve as a component port of the non-reciprocal power supply isolation network in the printed circuit, participating in overall impedance matching and energy routing. This eliminates the need for interconnection traces and assembly steps between discrete components, reduces connection losses, and improves the integration and performance stability of printed circuit RF front-ends. Summary of the Invention

[0005] This invention provides a printed circuit board assembly integrating a non-reciprocal network, addressing the shortcomings of existing printed circuit-type RF front-end discrete device cascades, such as low integration density and high switching losses.

[0006] This invention is achieved through the following technical solution: A printed circuit board assembly integrating a non-reciprocal network, the assembly comprising a printed circuit board 1, a non-reciprocal dielectric 2, a magnetic biasing component 3, a metal via 4, a non-reciprocal power supply isolation network 5, a transmitting port 6, a receiving port 7, and a common radiating branch 8. The printed circuit board 1 includes a dielectric substrate 11, an upper metal conductive layer 13, and a lower metal conductive layer 12; the metal via 4 penetrates the upper metal conductive layer 13 and the dielectric substrate 11, and the metal via 4 and the printed circuit board 1 form multiple substrate integrated waveguide branches, which converge in the central region. A non-reciprocal dielectric body 2 is disposed in the central region where they converge, and the non-reciprocal dielectric body 2 and the surrounding metal boundary together constitute a non-reciprocal power supply isolation network 5. Magnetic biasing components 3 are provided on one or both sides of the non-reciprocal medium 2. The magnetic biasing components 3 are used to provide a static magnetic bias field to the non-reciprocal medium 2. Under the action of the static magnetic bias field, the non-reciprocal medium 2 generates a gyromagnetic non-reciprocal response, so that the electromagnetic signal in the target operating frequency band is transmitted between the transmitting port 6, the receiving port 7 and the common radiation branch 8 in a predetermined direction.

[0007] Furthermore, the component also includes a shared end-emitting radiation unit 10; The common radiating branch 8 is at least one of multiple substrate integrated waveguide branches, and the common radiating branch 8 is directly coupled with the common end-fire radiating unit 10 to form a common antenna port. The shared end-emitting radiation unit 10 participates in impedance matching and energy routing of the non-reciprocal feed isolation network 5.

[0008] Furthermore, the component also includes a mode conversion structure 9 disposed between the transmit port 6, the receive port 7 and the non-reciprocal feed isolation network 5, to realize the conversion between the substrate integrated waveguide guided wave mode and the microstrip line mode, and at the same time undertake the functions of port impedance matching, mode transition and excitation.

[0009] Furthermore, the printed circuit board 1 includes a dielectric substrate 11, an upper metal conductive layer 13, and a lower metal conductive layer 12; the metal via 4 penetrates the upper metal conductive layer 13 and the dielectric substrate 11. The metal via 4 includes a substrate integrated waveguide sidewall via 41 and a tuning via 42; A pair of tuning vias 42 on each common radiating branch 8 forms a filter matching circuit; The through-hole 41 on the sidewall of the substrate integrated waveguide, together with the upper and lower metal conductive layers, defines a common radiation branch 8.

[0010] Furthermore, the magnetic biasing component 3 includes a biasing permanent magnet 31, a magnetic conductive sheet 32, and a pad 33; A lower metal conductive layer 12 is disposed above the magnetic conductive sheet 32. A dielectric substrate 11, a non-reciprocal dielectric body 2 and a metal through hole 4 are disposed above the lower metal conductive layer 12. A gasket 33 is fixedly connected above the non-reciprocal dielectric body 2. A bias permanent magnet 31 is disposed above the gasket 33.

[0011] Furthermore, the magnetic biasing component 3 can be disposed above, below, or on both sides of the printed circuit board 1.

[0012] Furthermore, the shared end-emitting radiation unit 10 includes a driving unit 101 and a director unit 102; The driving unit 101 is directly connected to the shared end-emitting radiation unit 10; The director unit 102 is arranged along the end-radiation direction to guide the radiated energy to propagate in a predetermined direction.

[0013] A method for operating a printed circuit board assembly integrating a non-reciprocal network, the method comprising: The transmitting port 6, receiving port 7, and common radiating branch 8 are distributed around the non-reciprocal feed isolation network 5. During operation, the signal input at the transmit port 6 enters the common radiation branch 8 through the non-reciprocal feed isolation network 5, and then excites the common end-emitting radiation unit 10 to radiate into space through the mode conversion structure; the space signal received by the common end-emitting radiation unit 10 enters the common radiation branch 8 through mode conversion, and then is output to the receive port 7 through the non-reciprocal feed isolation network 5. The system integrates transmit power supply, receive power supply, transmit / receive isolation, and end-radiation within the same substrate structure.

[0014] Furthermore, when the target frequency band signal is input into the transmit port 6, the signal is transmitted to the common radiation branch 8 via the non-reciprocal feed isolation network 5, and then the common end-fire radiation unit 10 is excited by the mode conversion structure 9 and radiated into space along the end-fire radiation direction. When the shared end-emitting radiation unit 10 receives a space signal, the received signal enters the shared radiation branch 8 through the mode conversion structure 9, and is then transmitted to the receiving port 7 through the non-reciprocal feed isolation network 5.

[0015] A printed circuit board assembly with an integrated non-reciprocal network as described above, the assembly being used in wireless communication, radar, satellite communication, microwave test systems, transceiver shared RF front-ends, and other electronic devices requiring port isolation, directional transmission, and out-of-band signal suppression.

[0016] The beneficial effects of this invention are: This invention integrates a non-reciprocal feed isolation network and a shared end-emitting radiation unit into the same substrate structure, which can reduce the connection interface, adapter port and additional feed line required for cascading independent isolation devices and independent antennas, and is beneficial to reducing the insertion loss and assembly complexity of the RF front end.

[0017] This invention enables the shared end-emitting radiating element to directly participate in energy routing as a shared antenna port of a non-reciprocal feed isolation network, thereby matching the antenna input impedance with the non-reciprocal feed isolation network. This helps to improve the performance degradation caused by port mismatch in traditional cascaded structures.

[0018] The mode conversion structure in this invention can convert the guided wave mode in the substrate integrated waveguide branch into the feeding mode required by the common end-fire radiation unit, while realizing common antenna port matching and end-fire pattern adjustment, which is beneficial to improving the structural integration and end-fire radiation stability.

[0019] The metal via in this invention can simultaneously serve as the sidewall of the substrate integrated waveguide, the tuning boundary of the non-reciprocal feed isolation network, and the reflection boundary of the end-emitting radiation unit, thereby reducing the device area and improving the degree of structural reuse. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention.

[0021] Figure 2 This is a side view of the structure of the present invention.

[0022] Figure 3 This is a top view schematic diagram of the non-reciprocal feeding isolation network and the shared end-emitting radiation unit of the present invention.

[0023] Figure 4 This is a schematic diagram of the electric field distribution of the present invention.

[0024] Figure 5 This is a schematic diagram of the S-parameter simulation results of the present invention.

[0025] Figure 6 This is the far-field three-dimensional total gain pattern at 13.50 GHz of the present invention.

[0026] Figure 7 Figure 2 shows the far-field gain direction at 13.50 GHz of the present invention. Detailed Implementation

[0027] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of this application with unnecessary detail.

[0028] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0029] It should also be understood that the terminology used in this application specification is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this application specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0030] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0031] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] Implementation Method 1 This embodiment provides a printed circuit board assembly integrating a non-reciprocal network. This assembly is fabricated using standard printed circuit technology, combined with... Figure 1 To be continued Figure 7 The components include a printed circuit board 1, a non-reciprocal dielectric 2, a magnetic bias component 3, a metal via 4, a non-reciprocal power supply isolation network 5, a transmit port 6, a receive port 7, and a common radiation branch 8. The printed circuit board 1 includes a dielectric substrate 11, an upper metal conductive layer 13, and a lower metal conductive layer 12; the metal via 4 penetrates the upper metal conductive layer 13 and the dielectric substrate 11, and the metal via 4 and the printed circuit board 1 form multiple substrate integrated waveguide branches, which converge in the central region. A non-reciprocal dielectric body 2 is disposed in the central region where they converge, and the non-reciprocal dielectric body 2 and the surrounding metal boundary together constitute a non-reciprocal power supply isolation network 5. Magnetic biasing components 3 are provided on one or both sides of the non-reciprocal medium 2. The magnetic biasing components 3 are used to provide a static magnetic bias field to the non-reciprocal medium 2. Under the action of the static magnetic bias field, the non-reciprocal medium 2 generates a gyromagnetic non-reciprocal response, so that the electromagnetic signal in the target operating frequency band is transmitted between the transmitting port 6, the receiving port 7 and the common radiation branch 8 in a predetermined direction.

[0033] Furthermore, the component also includes a mode conversion structure 9 and a shared end-emitting radiation unit 10; The common radiating branch 8 is at least one of multiple substrate integrated waveguide branches, and the common radiating branch 8 is directly coupled with the common end-fire radiating unit 10 to form a common antenna port. The shared end-emitting radiation unit 10 participates in the impedance matching and energy routing of the non-reciprocal feed isolation network 5.

[0034] Furthermore, the non-reciprocal isolation network and the radiating unit are integrated into a single, seamless architecture on the printed circuit board 1. This invention directly uses the shared end-emitting radiating unit as a shared port on the non-reciprocal feed isolation network, enabling the transmit / receive isolation function and the antenna radiation function to be implemented in situ within the same printed circuit structure, thus eliminating the interface and connection loss between devices at the source.

[0035] Furthermore, the magnetic biasing component 3 includes one or more of the following: a biasing permanent magnet 31, a magnetic conductive sheet 32, a pad 33, and a magnetic yoke or electromagnetic coil on the biasing permanent magnet 31. A lower metal conductive layer 12 is disposed above the magnetic conductive sheet 32. A dielectric substrate 11, a non-reciprocal dielectric body 2 and a metal through hole 4 are disposed above the lower metal conductive layer 12. A gasket 33 is fixedly connected above the non-reciprocal dielectric body 2. A bias permanent magnet 31 is disposed above the gasket 33.

[0036] Furthermore, the magnetic biasing component 3 can be disposed above, below, or on both sides of the substrate 1.

[0037] Furthermore, the printed circuit board 1 includes a dielectric substrate 11, an upper metal conductive layer 13, and a lower metal conductive layer 12; the metal via 4 penetrates the upper metal conductive layer 13 and the dielectric substrate 11. The metal via 4 includes a substrate integrated waveguide sidewall via 41 and a tuning via 42; A pair of tuning vias 42 on each common radiating branch 8 forms a filter matching circuit; The through-hole 41 on the sidewall of the substrate integrated waveguide, together with the upper and lower metal conductive layers, defines a common radiation branch 8.

[0038] Furthermore, the component also includes a mode conversion structure 9 disposed between the transmit port 6, the receive port 7 and the non-reciprocal feed isolation network 5, to realize the conversion between the substrate integrated waveguide guided wave mode and the microstrip line mode, and at the same time undertake the functions of port impedance matching, mode transition and excitation.

[0039] Furthermore, the shared end-emitting radiation unit 10 includes a driving unit 101 and a director unit 102; The driving unit 101 is directly connected to the shared end-emitting radiation unit 10; The director unit 102 is arranged along the end-radiation direction to guide the radiated energy to propagate in a predetermined direction. If a quasi-Yagi antenna is used, the reflection unit is located on the side of the drive unit 101 near the non-reciprocal feed isolation network 5 to suppress back radiation and enhance end-fire direction radiation.

[0040] This invention presents a seamless, integrated architecture for non-reciprocal isolation networks and radiating units on a printed circuit board. Unlike existing cascaded solutions that combine discrete isolators, feed lines, and independent antennas, this invention directly uses the shared end-firing radiating unit as a shared port on the non-reciprocal feed isolation network. This allows the transmit / receive isolation function and the antenna radiation function to be implemented in situ within the same printed circuit structure, fundamentally eliminating the interface and connection loss between components.

[0041] This invention relates to a mode conversion matching structure embedded in a printed circuit board. This structure is integrated between the port and the non-reciprocal feed isolation network, simultaneously performing the conversion between the substrate integrated waveguide guided mode and the radiated feed mode, as well as the matching and control of the port impedance on the same substrate, without the need for additional independent matching circuits and transition structures. Specifically, the mode conversion structure 9, located between the transmit port 6, the receive port 7, and the non-reciprocal feed isolation network 5, realizes the conversion between the substrate integrated waveguide guided mode and the microstrip line mode, while also undertaking port impedance matching, mode transition, and excitation functions.

[0042] The common end-fire radiating element 10 of the present invention has a wide protection form. The common end-fire radiating element 10 is not limited to an end-fire Yagi antenna, but can also be a quasi-Yagi antenna, a bow-shaped end-fire antenna, a rhombus-shaped ring end-fire antenna, an end-fire metasurface antenna, a substrate integrated waveguide end-fire slot antenna, a substrate integrated waveguide end-fire horn antenna, or other radiating structures capable of forming end-fire radiation along a predetermined direction.

[0043] The present invention provides a multifunctional multiplexing structure for the metal via 4. A portion of the metal via 4 can simultaneously serve as a sidewall of the substrate-integrated waveguide, a tuning boundary of the non-reciprocal feed isolation network, a reflection boundary of the end-emitting radiation unit, and a magnetic field isolation boundary, thereby reducing structural size and improving end-emitting radiation performance.

[0044] The present invention relates to the cooperative matching relationship between the shared end-fire radiating unit 10 and the non-reciprocal feed isolation network 5. The input impedance of the shared end-fire radiating unit 10 participates in the overall matching as a shared antenna port load of the non-reciprocal feed isolation network 5, so that transmit feed, receive feed, transmit / receive isolation, and end-fire radiation are achieved by the same electromagnetic structure.

[0045] In this invention, the transmit port, receive port, and common radiating branch are all patterned on a printed circuit board and are connected to the central non-reciprocal feed isolation network. The transmit port and receive port can be in the form of coaxial port, microstrip port, coplanar waveguide port, or substrate integrated waveguide port; the common radiating branch extends from the non-reciprocal feed isolation network along the end-emitting radiation direction and directly connects to the common end-emitting radiation unit at its end.

[0046] The mode conversion structure 9 of this invention may include a gradient transition section and a 50-ohm microstrip line segment.

[0047] The non-reciprocal power supply isolation network 5 can adopt a three-port, four-port, or multi-port structure. The non-reciprocal dielectric 2 can be a ferrite disc, a ferrite cylinder, a ferrite rounded triangular prism, a ferrite polygon, or other structures capable of generating a gyromagnetic non-reciprocal response.

[0048] The shared end-fire radiating element 10 can preferably be an end-fire Yagi antenna, but other end-fire radiating structures can also be used. As long as it is directly coupled to the non-reciprocal feed isolation network 5 through the shared radiating branch 8 and the mode conversion structure, and participates in transmit feed, receive feed, and transmit / receive isolation as a shared antenna port, it falls within the protection scope of this invention.

[0049] The mode conversion structure 9 can employ one or more of the following transition methods: substrate integrated waveguide to wide-side parallel stripline transition, substrate integrated waveguide to microstrip transition, tapered aperture transition, stepped impedance transition, or stub compensation transition.

[0050] Taking the current 13.1GHz to 14GHz simulation prototype as an example, the S-parameter results show that within the 13.1GHz to 14GHz range, the overall return loss at both the transmit and receive ports is better than 15dB, while the overall reverse isolation is better than 15dB. The overall forward transmission from the transmit port to the shared antenna port is better than 1.2dB. With 13.50GHz as the center frequency, the transmit port return loss is approximately 25dB, the receive port return loss is approximately 25dB, the forward transmission loss is approximately 0.7dB, and the reverse isolation is approximately 24dB.

[0051] Taking the far-field radiation pattern at 13.50 GHz as an example, the total gain is 3.76 dB. The shared end-fire radiating element forms a distinct main lobe in the 0-degree direction, and the backscattered radiation is approximately 5 dB to 6 dB lower than the main lobe, indicating that this structure can achieve end-fire radiation while achieving transmit / receive isolation. The simulation results above show that the present invention can achieve integrated operation of shared antenna transmission, shared antenna reception, transmit / receive isolation, impedance matching, and end-fire radiation within the target frequency band.

[0052] Figure 3 Used to demonstrate the connection relationships between the transmit port, receive port, common radiation branch, non-reciprocal medium, and common end-radiating unit.

[0053] Figure 4 This is used to demonstrate the energy transfer process of a signal entering a common end-emitting radiation unit from a non-reciprocal fed isolation network via a common radiation branch.

[0054] Figure 5 Used to demonstrate return loss, forward transmission, and reverse isolation performance between the transmit and receive ports.

[0055] Figure 6 and Figure 7 This is used to demonstrate the radiation characteristics of a shared end-emitting radiation unit forming an end-emitting main lobe along the 0-degree direction.

[0056] The common end-fire radiating element 10 is preferably an end-fire Yagi antenna. The end-fire Yagi antenna includes a driving element 101, a directing element 102, and a reflecting element.

[0057] The driving unit 101 can be directly connected to the common radiating branch 8, or it can be first connected to the transmission mode-radiation mode conversion structure and then connected to the common radiating branch 8. The transmission mode-radiation mode conversion structure converts the guided wave mode of the substrate integrated waveguide in the common radiating branch 8 into the feed current required by the driving unit 101. The driving unit 101 can be a wide-side parallel metal arm disposed on the upper metal conductive layer 13 and the lower metal conductive layer 12, or it can be a forked metal arm, an arc-shaped metal arm, or a gradient metal arm.

[0058] The director unit 102 is positioned in front of the drive unit 101 and arranged along the end-radiation direction. The number of director units 102 can be one, two, three, or more. The length, width, and spacing of multiple director units 102 can be the same, or they can gradually change along the end-radiation direction.

[0059] The reflecting unit is located on the side of the driving unit 101 near the non-reciprocal feeding isolation network 5. The reflecting unit can be constructed from a metal via wall, or from a metal strip, a metal sheet, or a combination of vias and metal strips. The metal via wall can simultaneously serve as a substrate integrated waveguide sidewall, a Yagi reflector, and a magnetic field isolation boundary.

[0060] By adjusting the size of the drive unit 101, the number and spacing of the director units 102, and the position of the Yagi reflector reflector unit, the end-fire radiation pattern, input impedance, and transmit / receive isolation performance can be adjusted in a coordinated manner.

[0061] The shared radiating branch 8 may also include a substrate integrated waveguide branch segment and a transmission mode-radiation mode conversion structure.

[0062] The mode conversion structure can also be configured with interdigital coupling strips, arc-shaped matching stubs, stepped impedance sections, or stub compensation structures. By adjusting the number, length, width, gap, and position of these structures, the input impedance, coupling strength, and end-fire radiation performance of the shared antenna port can be adjusted.

[0063] Implementation Method 2 This embodiment provides a method for operating a printed circuit board assembly with an integrated non-reciprocal network. The method uses the printed circuit board assembly with an integrated non-reciprocal network as described in Embodiment 1. The transmitting port 6, receiving port 7, and common radiating branch 8 are distributed around the non-reciprocal feed isolation network 5. During operation, the signal input at the transmit port 6 enters the common radiation branch 8 through the non-reciprocal feed isolation network 5, and then excites the common end-emitting radiation unit 10 to radiate into space through the mode conversion structure; the space signal received by the common end-emitting radiation unit 10 enters the common radiation branch 8 through mode conversion, and then is output to the receive port 7 through the non-reciprocal feed isolation network 5. The system integrates transmit power supply, receive power supply, transmit / receive isolation, and end-radiation within the same substrate structure.

[0064] Furthermore, when the target frequency band signal is input into the transmit port 6, the signal is transmitted to the common radiation branch 8 via the non-reciprocal feed isolation network 5, and then the common end-fire radiation unit 10 is excited by the mode conversion structure 9 and radiated into space along the end-fire radiation direction. When the shared end-emitting radiation unit 10 receives a space signal, the received signal enters the shared radiation branch 8 through the mode conversion structure 9, and is then transmitted to the receiving port 7 through the non-reciprocal feed isolation network 5.

[0065] Implementation Method 3 This embodiment provides a printed circuit board assembly with an integrated non-reciprocal network as described in Embodiment 1. The printed circuit board assembly is an integrated electrical component structure that integrates a power supply isolation network and a radiating unit on a single-layer printed circuit board.

[0066] Implementation Method 4 This embodiment provides a board-level integrated radio frequency front-end module, which includes a printed circuit board assembly with an integrated non-reciprocal network as described in any of the above embodiments. This assembly, as the core integrated unit of the radio frequency front-end, is connected between the transmit and receive channels, and synchronously completes end-emission radiation of the transmit signal, directional transmission of the receive signal, and signal isolation between the transmit and receive channels on a single printed circuit board.

Claims

1. A printed circuit board assembly integrating a non-reciprocal network, characterized in that, The components include a printed circuit board (1), a non-reciprocal dielectric (2), a magnetic biasing component (3), a metal via (4), a non-reciprocal power supply isolation network (5), a transmit port (6), a receive port (7), and a common radiating branch (8). The metal via (4) and the printed circuit board (1) form multiple substrate integrated waveguide branches. The multiple substrate integrated waveguide branches converge in the central region. A non-reciprocal dielectric body (2) is set in the central region where they converge. The non-reciprocal dielectric body (2) and the surrounding metal boundary together constitute a non-reciprocal power supply isolation network (5). A magnetic biasing component (3) is provided on one or both sides of the non-reciprocal medium (2). The magnetic biasing component (3) is used to provide a static magnetic bias field to the non-reciprocal medium (2). Under the action of the static magnetic bias field, the non-reciprocal medium (2) generates a gyromagnetic non-reciprocal response, so that the electromagnetic signal in the target operating frequency band is transmitted between the transmitting port (6), the receiving port (7) and the common radiation branch (8) in a predetermined direction.

2. The printed circuit board assembly according to claim 1, characterized in that, The component also includes a shared end-emitting radiation unit (10). The common radiation branch (8) is at least one of multiple substrate integrated waveguide branches, and the common radiation branch (8) is directly coupled with the common end-fire radiation unit (10) to form a common antenna port. The shared end-emitting unit (10) participates in impedance matching and energy routing of the non-reciprocal fed isolation network (5).

3. The printed circuit board assembly according to claim 1, characterized in that, The component also includes a mode conversion structure (9) disposed between the transmit port (6), the receive port (7) and the non-reciprocal feed isolation network (5) to realize the conversion between the substrate integrated waveguide guided wave mode and the microstrip line mode, while undertaking the functions of port impedance matching, mode transition and excitation.

4. The printed circuit board assembly according to claim 1, characterized in that, The printed circuit board (1) includes a dielectric substrate (11), an upper metal conductive layer (13) and a lower metal conductive layer (12); the metal via (4) penetrates the upper metal conductive layer (13) and the dielectric substrate (11). The metal via (4) includes a substrate integrated waveguide sidewall via (41) and a tuning via (42). A pair of tuning vias (42) on each common radiating branch (8) forms a filter matching circuit; The through-hole (41) on the sidewall of the substrate integrated waveguide, together with the upper metal conductive layer and the lower metal conductive layer, defines a common radiation branch (8).

5. The printed circuit board assembly according to claim 1, characterized in that, The magnetic biasing assembly (3) includes a biasing permanent magnet (31), a magnetic conductive sheet (32), and a pad (33). A lower metal conductive layer (12) is disposed above the magnetic conductive sheet (32). A dielectric substrate (11), a non-reciprocal dielectric body (2) and a metal through hole (4) are disposed above the lower metal conductive layer (12). A gasket (33) is fixedly connected above the non-reciprocal dielectric body (2). A bias permanent magnet (31) is disposed above the gasket (33).

6. The printed circuit board assembly according to claim 5, characterized in that, The magnetic bias component (3) is disposed above, below, or on both sides of the printed circuit board (1).

7. The printed circuit board assembly according to claim 2, characterized in that, The shared end-emitting radiation unit (10) includes a driving unit (101) and a director unit (102). The driving unit (101) is directly connected to the common end-emitting radiation unit (10); The director unit (102) is arranged along the end-radiation direction to guide the radiation energy to propagate in a predetermined direction.

8. A method for operating a printed circuit board assembly integrating a non-reciprocal network, characterized in that, The operating method uses a printed circuit board assembly with an integrated non-reciprocal network as described in any one of claims 1-7, and the operating method is as follows: The transmitting port (6), receiving port (7) and common radiating branch (8) are distributed around the non-reciprocal feed isolation network (5); During operation, the signal input from the transmitter port (6) enters the common radiation branch (8) through the non-reciprocal feed isolation network (5), and then excites the common end-emitting radiation unit (10) to radiate into space through the mode conversion structure; The spatial signal received by the shared end-emitting radiation unit (10) is converted into a mode and then enters the shared radiation branch (8), and is then output to the receiving port (7) via the non-reciprocal feed isolation network (5). The system integrates transmit power supply, receive power supply, transmit / receive isolation, and end-radiation within the same substrate structure.

9. The working method according to claim 8, characterized in that, When the target frequency band signal is input into the transmitting port (6), the signal is transmitted to the common radiation branch (8) through the non-reciprocal feed isolation network (5), and then the common end-emitting radiation unit (10) is excited by the mode conversion structure (9), and radiated into space along the end-emitting radiation direction 104; When the shared end-emitting radiation unit (10) receives a space signal, the received signal enters the shared radiation branch (8) through the mode conversion structure (9), and is then transmitted to the receiving port (7) through the non-reciprocal feed isolation network (5).

10. A printed circuit board assembly with an integrated non-reciprocal network as described in any one of claims 1-7, characterized in that, The printed circuit board assembly is an integrated electrical component structure that integrates a power supply isolation network and a radiation unit on a single-layer printed circuit board.

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