Space on-orbit experiment base power connection structure

Abstract

The application discloses a space in-orbit experiment substrate power connection structure, which comprises a plurality of micron-thick conductive areas on an experiment substrate, a ring-shaped adapter plate, a lower surface of the ring-shaped adapter plate being provided with a plurality of pads, a plurality of spring probes, an upper end of each spring probe being electrically connected to one pad on the ring-shaped adapter plate, and a lower end of each spring probe being in contact with the micron-thick conductive area of the experiment substrate, and a plurality of columns, which are arranged between the experiment substrate and the ring-shaped adapter plate and are used for supporting the ring-shaped adapter plate. The spring probes are in contact with the experiment substrate in a conductive mode, so that high-temperature damage to the surface of the experiment substrate during power supply can be avoided. The application uses the elastic contact of the spring probes to replace the traditional welding mode, solves the problem that the substrate welding power supply mode for space in-orbit experiments in the prior art is easy to damage a multilayer deposition substrate due to high temperature or mechanical stress and is difficult to meet the requirements of an extreme mechanical environment and camera observation, and provides a reliable, nondestructive and space environment-adaptable power connection structure.

Description

Technical Field

[0001] This invention belongs to the technical field of electrical connection structure for experimental substrates used in space on orbit, and particularly relates to an electrical connection structure for experimental substrates used in space on orbit. Background Technology

[0002] In space science experiments, the experimental substrate typically refers to the key structure that bears and supports the core experimental payloads (such as those used for material growth, chemical reactions, and physical detection). These experimental substrates are often prepared using multilayer deposition processes, and their structures may contain low-melting-point non-metallic materials such as polyetheretherketone (PEEK) and parylene (Parylene C).

[0003] In practical applications of experimental substrates, it is often necessary to electrify the substrate to achieve specific functions, such as heating or creating an electric field. Currently, the mainstream method for electrification is welding, which involves directly welding cables to the metal conductor to be energized. However, for experimental substrates prepared using multilayer deposition processes, the low-melting-point non-metallic materials in their structure are highly susceptible to melting and damage during the high temperatures of welding. Furthermore, welding typically only connects the cable to the outermost metal layer of the multilayer deposition substrate, and this metal layer is generally only on the micrometer scale, making it difficult to withstand significant mechanical forces. Therefore, welding cannot be used for electrical connections in devices that need to withstand extreme mechanical environments. Summary of the Invention

[0004] This invention addresses the problems existing in the prior art by proposing a power connection structure for space-based experimental substrates. It aims to solve the problem that existing power connection methods (such as welding) for space-based experimental substrates are prone to damage to multi-layered deposited substrates due to high temperatures or mechanical stress, making it difficult to meet the requirements of extreme mechanical environments and camera observations. The invention provides a reliable, non-destructive power connection structure that is adaptable to the space environment.

[0005] To address the problems existing in the prior art, the present invention proposes the following technical solutions: A space-based on-orbit experimental substrate electrical connection structure is characterized by comprising multiple micrometer-thick conductive regions on the experimental substrate, an annular adapter plate with multiple pads on its lower surface, multiple spring probes, each spring probe having its upper end electrically connected to a pad on the annular adapter plate and its lower end in contact with the micrometer-thick conductive regions of the experimental substrate, multiple pillars arranged between the experimental substrate and the annular adapter plate for supporting the annular adapter plate, and multiple mounting holes on the annular adapter plate for fixing the adapter plate to the bottom structure by screws engaging with the pillars; the pads on the lower surface of the annular adapter plate include cable pads for welding to external cables and spring probe pads for connecting to the spring probes; the conductive contact method of the spring probes is designed to avoid high-temperature damage to the surface of the experimental substrate during energization.

[0006] Furthermore, the spring probe is a compressible probe with a built-in spring, which can still ensure a reliable electrical connection even if there are certain errors in the design, processing and assembly process; the way the spring probe contacts the substrate surface for conductivity avoids the risk of failure of the fragile substrate surface due to contact with high temperature during the welding process; a reserved exposed metal area is provided at the corresponding position of the experimental substrate for conductive contact with the spring probe.

[0007] Furthermore, the probe tip of the spring probe is designed with a circular structure to effectively reduce mechanical wear on the substrate surface caused by the launch vibration.

[0008] Furthermore, the surface of the spring probe is gold-plated, which can effectively reduce the contact resistance between the probe and the conductive contact area of ​​the substrate, and reduce the voltage drop at the contact interface when energized.

[0009] Furthermore, the design of the column height needs to take into account two aspects: it must ensure that the spring probe has a suitable amount of compression, and it must avoid obstruction of the droplet observation by the side-view camera during the experiment.

[0010] Furthermore, provided that the space at the corresponding location on the substrate allows, a dual-probe redundancy design can be configured for each power connection location to further improve connection reliability.

[0011] Furthermore, approximately two-thirds of the free length of the spring probe is set as the working compression amount to ensure that the contact will not become loose or intermittent due to vibration, nor will the experimental substrate be damaged due to excessive pressure.

[0012] Furthermore, the spring probe pad is designed to be smaller at the top and larger at the bottom to fit the spring probe.

[0013] Furthermore, when routing the circuit board internally, the trace length should be shortened as much as possible and the trace width should be widened to increase the current carrying capacity, reduce heat generation, and improve overall reliability. The spacing between the pads on the circuit board should be adjusted reasonably according to the voltage level of the corresponding signal to reduce the possibility of pad breakdown in the presence of condensation. Advantages and effects of the present invention

[0014] 1. This invention, by employing a spring-probe conductive contact method and a pre-reserved exposed metal area, avoids the risk of melting damage to the fragile, low-melting-point non-metallic materials (such as PEEK and Parylene C) of the experimental substrate due to high temperatures during welding. This ensures the integrity and reliability of the experimental substrate. It avoids high-temperature damage and guarantees substrate reliability. 2. The present invention uses a compressible spring probe with a built-in spring to ensure a reliable electrical connection. Even if there are certain errors in the design, processing and assembly process, the spring probe can still maintain a reliable electrical connection with the conductive area through its compressibility, thus ensuring the stability of the power supply.

[0015] 3. The spring probe of this invention is designed with a circular probe tip. The circular probe tip can effectively reduce the mechanical wear caused by the emission vibration on the experimental substrate surface and extend the contact life between the probe and the substrate.

[0016] 4. The present invention performs gold plating on the surface of the spring probe. Gold plating can significantly reduce the contact resistance between the spring probe and the conductive contact area of ​​the substrate, thereby reducing the contact interface voltage drop when energized and improving the conduction efficiency.

[0017] 5. In this invention, approximately two-thirds of the free length of the spring probe is set as the working compression. This design ensures that the spring probe will not become loose or disconnected due to vibration during operation, nor will it cause mechanical damage to the experimental substrate due to excessive pressure, thus achieving safety and stability of the connection.

[0018] 6. This invention, through the redundant configuration of dual probes, ensures that even if one probe fails, the other probe can still maintain a smooth electrical connection, greatly improving the overall reliability of the connection and meeting the high stability requirements of space missions.

[0019] 7. The design of the column height in this invention takes into account both the appropriate compression of the spring probe and the avoidance of obstruction of the droplet observation by the side-view camera. While ensuring the normal working compression of the spring probe, it also avoids visual interference with the critical droplet observation during the experiment, thus meeting the monitoring requirements of the experiment.

[0020] 8. The internal traces of this invention are designed to be as short as possible and as wide as possible, with the pad spacing adjusted appropriately according to the voltage level. This optimized internal trace design increases current carrying capacity and reduces heat generation, thereby improving the overall reliability of the adapter board. Simultaneously, adjusting the pad spacing according to the voltage level effectively reduces the possibility of inter-pad breakdown in the presence of condensation, further enhancing the structural reliability. Attached Figure Description

[0021] Figure 1a This is an application effect diagram of the adapter plate of the present invention for use in evaporation tables; Figure 1b This is one of the schematic diagrams for the installation of the adapter plate of the present invention applicable to a local heating evaporation platform. Figure 1c This is the second schematic diagram of the adapter plate installation for the local heating evaporation platform of the present invention. Figure 2aThis is one of the schematic diagrams of the adapter plate installation for a uniformly heated evaporation platform according to the present invention. Figure 2b This is the second schematic diagram of the adapter plate installation for a uniformly heated evaporation platform according to the present invention. Figure 3 This is a schematic diagram of the gold-plated surface and circular spring head probe selected for this invention; Figure 4 This is a schematic diagram of the internal wiring of the uniform heating evaporation platform of the present invention; Figure 5 This is a schematic diagram of the internal wiring of the local heating evaporation stage of the present invention; Figure 6 This is a cross-sectional view of the upper small and lower large pads of the spring probe of the present invention. Detailed Implementation Innovation of this invention

[0022] 1. Employing spring probes for non-destructive, non-contact electrical connections, overcoming the problem of high-temperature damage: This invention proposes using "multiple spring probes," whose lower ends contact a micrometer-thick conductive area of ​​the experimental substrate. It further emphasizes that "the conductive contact method of the spring probes is designed to avoid high-temperature damage to the experimental substrate surface during energization" and that "the conductive contact between the spring probes and the substrate surface avoids the risk of failure due to high temperatures on the fragile substrate surface during welding." This method conducts current through physical contact rather than welding, avoiding melting damage to the experimental substrate caused by high temperatures during welding. This is a fundamental improvement over existing welding methods.

[0023] 2. Through the reliable design of the spring probe, it adapts to errors and provides a stable electrical connection, while considering mechanical wear and the mechanical environment: (1) Reliable connection and error adaptation: This invention states that "the spring probe is a compressible probe with a built-in spring, which can still ensure a reliable electrical connection even if there are certain errors in the design, processing and assembly process." (2) Reduced mechanical wear: This invention states that "the probe end of the spring probe is designed with a circular structure to effectively reduce the mechanical wear caused by the emission vibration on the substrate surface." (3) Optimized compression to balance connection stability and avoid damage: This invention specifies that "approximately two-thirds of the free length of the spring probe is set as the working compression amount to ensure that there will be no loosening or poor connection due to vibration, nor will there be damage to the experimental substrate due to excessive pressure." Existing welding methods are difficult to withstand extreme mechanical environments. This invention, through the elastic deformation of the spring probe and the optimized structural design, ensures connection reliability while proactively considering and solving the problems of vibration, errors and possible mechanical effects on the substrate in the space environment. This is a more comprehensive electrical connection solution adapted to the mechanical environment.

[0024] 3. By employing gold plating and optimized pad design, contact resistance is reduced, and conductivity and reliability are improved: (1) Reduced contact resistance: This invention proposes that "the surface of the spring probe is gold-plated, which effectively reduces the contact resistance of the conductive contact area between the probe and the substrate, and reduces the voltage drop at the contact interface when energized." (2) Fitting design: Claim 8 states that "the spring probe pad is designed to be smaller at the top and larger at the bottom to fit the spring probe." This invention, through optimization of contact materials and structure, significantly improves the performance of electrical connections, reduces energy loss, and enhances the efficiency and stability of the overall system.

[0025] 4. Balancing experimental and observational needs through column height and probe design: This invention proposes that "the design of the column height must consider two aspects: ensuring the spring probe has appropriate compression while avoiding obstruction of the droplet by the side-view camera during the experiment." Existing technologies only focus on the power supply method itself, while this invention fully considers other practical application needs that may be encountered in space experiments (such as camera observation) in its structural design, optimizing the integration of the electrical connection structure with the overall experiment.

[0026] 5. Enhanced overall reliability and current-carrying capacity through redundant design and internal wiring optimization: (1) Redundant design: This invention proposes that "provided the space allows at the corresponding location on the substrate, a dual-probe redundant design can be configured for each power connection location to further improve connection reliability." (2) Internal wiring optimization: This invention points out that "when wiring inside the adapter board, the wiring length should be shortened as much as possible and the wiring width should be widened to increase current-carrying capacity, reduce heat generation, and improve overall reliability; the spacing between the adapter board pads needs to be reasonably adjusted according to the voltage level of the corresponding signal to reduce the possibility of inter-pad breakdown in the presence of condensation." Existing technologies focus on pointing out the shortcomings of soldering, while this invention improves the robustness and safety of electrical connections at the system level through multiple design measures (redundancy, optimized wiring and spacing), enabling it to better adapt to the harsh environment of space applications. Key point design principles

[0027] 1. Non-destructive contact method: (1) Spring probe: A compressible spring probe with a built-in spring is used to make contact through the elasticity of the spring, rather than high-temperature welding. This contact method can accommodate errors in design, processing, and assembly, ensuring a reliable connection. (2) Avoiding high-temperature damage: The spring probe directly contacts the micron-thick conductive area (the reserved exposed metal area) on the experimental substrate, avoiding the excessively high temperatures generated during welding that could melt or damage the fragile experimental substrate (which may contain low-melting-point non-metallic materials).

[0028] 2. Reliable Electrical Connection: (1) Working Compression of the Spring Probe: Approximately two-thirds of the free length of the spring probe is set as the working compression, ensuring that it will not detach or become loosely connected under vibration, while also preventing damage to the substrate due to excessive pressure. (2) Redundancy Design: Where space permits, a dual-probe redundancy design is configured for each electrical connection point, further improving the reliability of the connection.

[0029] 3. Adaptability to Space Environment: (1) Wear-resistant design: The probe tip of the spring probe is designed with a circular structure, effectively reducing mechanical wear on the substrate surface caused by emission vibration. (2) Low contact resistance: The surface of the spring probe is gold-plated, reducing contact resistance, lowering current drop during energization, and improving conductivity. (3) Structural support and height design: The annular adapter plate is supported by columns, and the height of the columns is designed to balance the compression of the spring probe and the obstruction of droplets observed by the camera during the experiment. (4) Internal design of the adapter plate: The internal traces are shortened as much as possible and widened to increase current carrying capacity, reduce heat generation, and improve overall reliability. The pad spacing is reasonably adjusted according to the voltage level to prevent condensation from causing breakdown.

[0030] 4. Flexible Interface Design: (1) Ring Adapter Board: Provides an intermediate adapter layer with pads on its lower surface for connecting external cables (cable pads) and spring probes (spring probe pads). (2) Pad Shape: The spring probe pads are designed to be smaller at the top and larger at the bottom for better fit to the spring probes.

[0031] Based on the above principles, this invention designs a space-based on-orbit experimental substrate electrical connection structure, such as... Figure 1a , Figure 1b , Figure 1c , Figure 2a , Figure 2b , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, its features include multiple micrometer-thick conductive regions on an experimental substrate; an annular adapter plate with multiple pads on its lower surface; multiple spring probes, each with its upper end electrically connected to a pad on the annular adapter plate and its lower end in contact with the micrometer-thick conductive regions of the experimental substrate; multiple pillars positioned between the experimental substrate and the annular adapter plate to support the annular adapter plate; multiple mounting holes on the annular adapter plate for fixing the adapter plate to the bottom structure via screws engaging with the pillars; the pads on the lower surface of the annular adapter plate include cable pads for soldering to external cables and spring probe pads for connecting to the spring probes; the conductive contact method of the spring probes is designed to avoid high-temperature damage to the surface of the experimental substrate during energization.

[0032] Supplementary Note 1 The aforementioned locally heated evaporation platform, such as Figure 1a and Figure 1b As shown, local heating refers to heating one side of the conductive area symmetrically at 180 degrees while leaving the other side unheated.

[0033] The above-mentioned uniformly heated evaporation platform, as shown Figure 2a and Figure 2b As shown, uniform heating refers to heating from bottom to top in the central area of ​​the evaporation platform, which is called uniform heating.

[0034] Supplementary Note 2 like Figure 4 , Figure 5 As shown, the above cable pads are Figure 4 The elliptical pads in the above-mentioned spring probe pads are Figure 4 The circular pad in the middle.

[0035] The spring probe is a compressible probe with a built-in spring, which can still ensure a reliable electrical connection even if there are certain errors in the design, processing and assembly process; the way the spring probe contacts the substrate surface for conductivity avoids the risk of failure of the fragile substrate surface due to contact with high temperature during the welding process; a reserved exposed metal area is provided at the corresponding position of the experimental substrate for conductive contact with the spring probe.

[0036] like Figure 3 As shown, the probe tip of the spring probe is designed with a circular structure to effectively reduce mechanical wear on the substrate surface caused by the launch vibration.

[0037] like Figure 3 As shown, the surface of the spring probe is gold-plated, which can effectively reduce the contact resistance between the probe and the conductive contact area of ​​the substrate and reduce the voltage drop at the contact interface when energized.

[0038] The design of the column height needs to take into account two requirements: it must ensure that the spring probe has a suitable amount of compression, and it must avoid obstruction of the droplet observation by the side-view camera during the experiment.

[0039] Provided that the space at the corresponding location on the substrate allows, a dual-probe redundancy design can be configured for each power connection location to further improve connection reliability.

[0040] The working compression is set at approximately two-thirds of the free length of the spring probe to ensure that the contact will not become loose or intermittent due to vibration, nor will it damage the experimental substrate due to excessive pressure.

[0041] like Figure 6 As shown, the spring probe pad is designed to be smaller at the top and larger at the bottom to fit the spring probe.

[0042] When routing the circuit board, the trace length should be shortened as much as possible and the trace width should be widened to increase the current carrying capacity, reduce heat generation, and improve overall reliability. The spacing between the pads on the circuit board should be adjusted reasonably according to the voltage level of the corresponding signal to reduce the possibility of pad breakdown in the presence of condensation.

[0043] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A space-based experimental substrate electrical connection structure, characterized in that, The system includes multiple micrometer-thick conductive regions on an experimental substrate; an annular adapter plate with multiple pads on its lower surface; multiple spring probes, each with its upper end electrically connected to a pad on the annular adapter plate and its lower end in contact with the micrometer-thick conductive regions of the experimental substrate; multiple pillars positioned between the experimental substrate and the annular adapter plate to support the annular adapter plate; multiple mounting holes on the annular adapter plate for fixing the adapter plate to the bottom structure via screws engaging with the pillars; the pads on the lower surface of the annular adapter plate include cable pads for soldering to external cables and spring probe pads for connecting to the spring probes; the conductive contact method of the spring probes is designed to avoid high-temperature damage to the surface of the experimental substrate during energization.

2. The space-based on-orbit experimental substrate electrical connection structure according to claim 1, characterized in that: The spring probe is a compressible probe with a built-in spring, which can still ensure a reliable electrical connection even if there are certain errors in the design, processing and assembly process; the way the spring probe contacts the substrate surface for conductivity avoids the risk of failure of the fragile substrate surface due to contact with high temperature during the welding process; a reserved exposed metal area is provided at the corresponding position of the experimental substrate for conductive contact with the spring probe.

3. The space-based on-orbit experimental substrate electrical connection structure according to claim 1, characterized in that: The spring probe has a circular tip to effectively reduce mechanical wear on the substrate surface caused by the launch vibration.

4. The space-based on-orbit experimental substrate electrical connection structure according to claim 1, characterized in that: The surface of the spring probe is gold-plated, which can effectively reduce the contact resistance between the probe and the conductive contact area of ​​the substrate and reduce the voltage drop at the contact interface when energized.

5. The space-based on-orbit experimental substrate electrical connection structure according to claim 1, characterized in that: The design of the column height needs to take into account two requirements: it must ensure that the spring probe has a suitable amount of compression, and it must avoid obstruction of the droplet observation by the side-view camera during the experiment.

6. The space-based on-orbit experimental substrate electrical connection structure according to claim 1, characterized in that: Provided that the space at the corresponding location on the substrate allows, a dual-probe redundancy design can be configured for each power connection location to further improve connection reliability.

7. The space-based on-orbit experimental substrate electrical connection structure according to claim 1, characterized in that: The working compression is set at approximately two-thirds of the free length of the spring probe to ensure that the contact will not become loose or intermittent due to vibration, nor will it damage the experimental substrate due to excessive pressure.

8. The space-based on-orbit experimental substrate electrical connection structure according to claim 1, characterized in that: The spring probe pad is designed to be smaller at the top and larger at the bottom to fit the spring probe.

9. The space-based on-orbit experimental substrate electrical connection structure according to claim 1, characterized in that: When routing the circuit board, the trace length should be shortened as much as possible and the trace width should be widened to increase the current carrying capacity, reduce heat generation, and improve overall reliability. The spacing between the pads on the circuit board should be adjusted reasonably according to the voltage level of the corresponding signal to reduce the possibility of pad breakdown in the presence of condensation.

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