A power supply system for powering network devices

Abstract

The application provides a power supply system for supplying power to a network device, comprising a power supply module and a housing, and a three-dimensional accommodating space between the housing and the power supply module. The power supply module comprises: a primary side circuit configured to receive an alternating current input voltage and convert the alternating current input voltage into a first voltage, the primary side circuit comprising at least one primary side switch; a transformer comprising a primary side winding and a secondary side winding, the primary side winding being coupled to the primary side circuit, the transformer being configured to convert the first voltage into a second voltage; and a secondary side circuit coupled to the secondary side winding and configured to convert the second voltage into a direct current output voltage and supply power to the network device. The secondary side circuit comprises at least one secondary side switch, wherein the secondary side switch adopts a patch type packaging form, and the power density of the power supply module is greater than or equal to 60W / inch 3 . The power supply module does not comprise a fan, and the three-dimensional accommodating space is filled with a liquid coolant, and the liquid coolant is used for liquid cooling heat dissipation of the power supply module.

Description

[0001] This application is a divisional application of the invention patent application filed on October 20, 2020, with application number 202011122732.X and invention title "A power supply system for supplying power to network devices". Technical Field

[0002] This document relates to a power supply device, and more specifically, to a power supply system for supplying power to network devices. Background Technology

[0003] With the development of distributed computing architectures such as artificial intelligence, cloud computing, and big data, data centers, as information infrastructure, are undertaking increasingly larger computing loads, placing a heavier burden on energy consumption. How to balance service demands and energy consumption has become a pressing issue for operators and power suppliers. In terms of PUE (Total Usage Effectiveness) values ​​(total power consumption of data center equipment / power consumption of IT equipment), data center PUE values ​​are typically in the range of 2.2-2.5. This makes traditional network power supplies inadequate when facing the requirements of larger power levels and higher power densities, while the power levels and power densities of data centers are steadily increasing.

[0004] In existing technologies, the power supply system within a data center has a significant impact on power density. Generally speaking, power density is a metric that measures how much power can be processed within a given space; it can be quantified as the amount of power processed per unit volume, with units of watts per cubic meter (W / m³). 3 ) or watts per cubic inch (W / inch) 3 These power density figures are calculated based on the rated power of the power converter and the volume (length × width × height) of the power system. In traditional power supply systems, passive components such as inductors, capacitors, transformers, and heat sinks typically occupy a significant portion of the volume, creating a bottleneck for increasing power density.

[0005] To improve or overcome the aforementioned technical problems, existing power supply systems have explored and researched aspects such as the switching frequency of power converters and the thermal performance of the system. However, this has also brought other challenges. For example, while increasing the switching frequency can improve power density, higher switching frequencies have side effects, leading to increased switching losses and higher operating temperatures. Empirical evidence suggests that for every 10°C increase in temperature, the lifespan of electronic devices is halved. Furthermore, according to reliability manuals, a 10°C increase in temperature will increase the failure rate of semiconductors and capacitors by approximately 25% and 50%, respectively.

[0006] Furthermore, although the industry has proposed some design concepts for heat dissipation using liquid cooling, there are no power modules specifically designed to power network devices based on this concept, or the power density is too low to meet the current or future power level and power density requirements of data centers. Summary of the Invention

[0007] One of the objectives of this invention is to provide a power supply system for supplying power to network devices.

[0008] According to one aspect of this application, a power supply system for supplying power to network devices is provided. The power supply system includes a power module and a housing, wherein a three-dimensional accommodating space exists between the housing and the power module.

[0009] The power module includes:

[0010] A primary-side circuit is used to receive an AC input voltage and convert the AC input voltage into a first voltage, the primary-side circuit including at least one primary-side switch;

[0011] A transformer, comprising a primary winding and a secondary winding, the primary winding being coupled to the primary circuit, the transformer being used to convert a first voltage into a second voltage; and

[0012] The secondary-side circuit, coupled to the secondary-side winding, is used to convert the second voltage into a DC output voltage and supply power to the network device. The secondary-side circuit includes at least one secondary-side switch, wherein the secondary-side switch is in a surface-mount package. The power density of the power module is greater than or equal to 60W / inch. 3 ;

[0013] The power module does not include a fan, and the three-dimensional accommodating space is filled with liquid coolant, which is used to perform liquid cooling heat dissipation on the power module.

[0014] In some embodiments, the primary-side switch is in a surface-mount package.

[0015] In some embodiments, the housing includes a plurality of openings cut out in a preset pattern.

[0016] In some embodiments, the wire diameter current density of the primary winding and the secondary winding is greater than or equal to 15 A / mm².

[0017] In some embodiments, the primary-side circuit further includes an EMI filter circuit having a common-mode inductor with a winding wire diameter current density greater than or equal to 15 A / mm².

[0018] In some embodiments, both the primary-side circuit and the secondary-side circuit are configured as modular circuits that can be expanded by cascading or paralleling.

[0019] In some embodiments, the primary-side circuit further includes a bridge PFC circuit having a rectifier circuit, a PFC inductor, a switching unit, and a diode unit. The rectifier circuit includes a single rectifier bridge or multiple rectifier bridges connected in parallel. The PFC inductor is electrically coupled to the rectifier circuit. The switching unit is electrically coupled to the PFC inductor. The diode unit is electrically coupled to the PFC inductor and includes a single diode or multiple diodes connected in parallel.

[0020] In some embodiments, the primary-side circuit further includes a bridgeless PFC circuit having a PFC inductor, a switching unit, and a diode unit, wherein the PFC inductor is electrically coupled to the switching unit, and the diode unit is electrically coupled to the PFC inductor and includes a single diode or multiple diodes connected in parallel.

[0021] In some of these embodiments, the current density of the PFC inductor winding wire diameter is greater than or equal to 15 A / mm².

[0022] In some embodiments, the switching unit and the diode unit are power semiconductor elements in a surface-mount package.

[0023] In some embodiments, the primary-side circuit further includes an inverter circuit, the DC side of which is electrically coupled to the bridge PFC circuit or the bridgeless PFC circuit, and the AC side of which is electrically coupled to the primary winding of the transformer. The inverter circuit includes multiple switching transistors, and the switching transistors are in a surface-mount package.

[0024] In some embodiments, the primary-side switch is made of Si, SiC, or GaN material.

[0025] In some embodiments, the secondary switch is made of Si, SiC, or GaN material.

[0026] In some embodiments, the secondary circuit further includes a rectifier circuit electrically coupled to the secondary winding of the transformer. The rectifier circuit includes multiple switching units, wherein each switching unit includes a single switch or multiple switches connected in parallel, and the switches are in a surface-mount package.

[0027] In some embodiments, the secondary circuit further includes an anti-backflow circuit comprising a plurality of switches connected in parallel.

[0028] In some of these embodiments, the conversion efficiency of the power module first increases monotonically and then decreases monotonically within the 0-50% rated load range.

[0029] In some embodiments, the optimal conversion efficiency of the power module corresponds to a rated load operating condition of 10% to 40%.

[0030] In some embodiments, the peak conversion efficiency of the power module corresponds to 35% of the rated load operating condition.

[0031] In some embodiments, the power module achieves a conversion efficiency higher than 80 Plus at 50% of its rated load. ® Requirements.

[0032] In some embodiments, the liquid coolant is a fluorinated liquid or an oily liquid.

[0033] The power supply system for supplying power to network devices according to the present invention includes a power module and a housing, with a three-dimensional accommodating space between the housing and the power module. The power module includes a primary circuit, a transformer, and a secondary circuit. The primary circuit receives an AC input voltage and converts the AC input voltage into a first voltage, and includes at least one primary switch. The transformer includes a primary winding and a secondary winding, with the primary winding coupled to the primary circuit. The transformer converts the first voltage into a second voltage. The secondary circuit is coupled to the secondary winding and converts the second voltage into a DC output voltage to supply power to the network device. The secondary circuit includes at least one secondary switch, wherein the secondary switch is in a surface-mount package. The power density of the power module is greater than or equal to 60 W / inch. 3 The power module does not include a fan; its three-dimensional housing is filled with liquid coolant for liquid cooling. Compared to existing technologies, the power module of this invention adopts an AC / DC converter power supply architecture, designs the secondary-side switch in the secondary circuit as a surface-mount package, and fills the space between the power module and the casing with liquid coolant, resulting in a power density of the power module greater than or equal to 60W / inch. 3 Furthermore, the power supply module of this invention is designed with optimal conversion efficiency in the light load range, while simultaneously ensuring that the internal device temperature meets derating requirements under full load conditions. Attached Figure Description

[0034] Figure 1 This document illustrates a schematic diagram of a power supply system for supplying power to a network device according to one embodiment of the present document.

[0035] Figure 2 Show Figure 1 A circuit diagram of the power module in a power supply system.

[0036] Figure 3 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional structural diagram of the transformer of the power supply module.

[0037] Figure 4 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional structural diagram of the PFC inductor of the power supply module.

[0038] Figure 5 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional structural diagram of the common mode inductor of the power supply module.

[0039] Figure 6 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional structural diagram of the resonant inductor of the power supply module.

[0040] Figure 7 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional dimension diagram of the PCB circuit board of the power supply module.

[0041] Figure 8 Show Figure 1 A schematic diagram of the conversion efficiency curve of the power module in one embodiment of the power system.

[0042] Figure 9 Show Figure 1 Thermal simulation results of key areas in the power supply system during system operation. Detailed Implementation

[0043] Various embodiments of the present invention will now be described in detail, with one or more examples of embodiments illustrated in the accompanying drawings. In the following description taken in conjunction with the drawings, the same reference numerals denote the same elements. Generally, only differences relating to individual embodiments are described. The examples are provided by way of illustration and are not intended to limit the invention. Furthermore, features illustrated or described as part of one embodiment may be used in other embodiments or in combination with other embodiments to obtain further embodiments, and the present invention is intended to include these modifications and variations.

[0044] As energy conversion efficiency continues to improve, the design complexity of switching power supplies increases exponentially. For example, in some applications, increasing conversion efficiency from 97% to 98% means reducing losses by one-third, while increasing it from 98% to 99% means further reducing losses by half. In a sense, in the design of most circuit converters, reducing overall losses by 50% may force a complete overhaul, with the only solution being the use of more complex technologies and more expensive components, often at the expense of size. For instance, a 1kW power supply with a 98% conversion efficiency has only 20.4W of loss. To achieve a 99% conversion efficiency and reduce losses by 10.1W, what is the cost? Relevant data shows that the price of industrial electricity in the United States is approximately 7 cents / kWh. Assuming a 1kW power supply has a normal operating life of 5 years (or approximately 44,000 hours), reducing losses by 10.1W would save approximately $31. However, we should also note that to achieve an increase in conversion efficiency from 98% to 99%, the increased cost of the load's power supply exceeds $3,100. Therefore, if the original power supply design (with an efficiency of 98%) can still operate reliably, the $31 saving is meaningless.

[0045] On the other hand, for end users, productivity and profitability are more important. Saving a few dollars by consuming less energy is certainly a good thing, but the gains from increasing the density of power equipment in racks or cabinets and improving productivity per cubic foot are far more attractive. Therefore, integrating more energy conversion devices into smaller packages, increasing power density while maintaining conversion efficiency, and more effectively utilizing data center rack or cabinet space is a major challenge that the inventors of this application need to address.

[0046] Figure 1 This document illustrates a schematic diagram of a power supply system for supplying power to a network device according to one embodiment of the present document. Figure 2 Show Figure 1 A circuit diagram of the power module in a power supply system.

[0047] Reference Figure 1 and Figure 2In this embodiment, the power system includes a power module 1 and a housing. Specifically, the power module 1 does not include a fan, and a three-dimensional accommodating space exists between the housing and the power module 1. This three-dimensional accommodating space is filled with a liquid coolant, which is used for liquid cooling of the power module 1. The power module 1 includes a primary circuit 10, a transformer 20, and a secondary circuit 30. It should be noted that liquid cooling refers to using a specific liquid, such as water, fluorinated liquid, or a special non-conductive oil, to replace air, thereby removing the heat generated by various components of the power supply device during operation. Based on whether the liquid is in contact with the heat-generating components, it can be roughly divided into two types: one is an indirect cooling plate method, where the components themselves do not directly contact the liquid. Instead, the components first transfer the dissipated heat to a heat sink containing liquid, and then the heat is carried out of the device through liquid circulation. Since the heat sink can only cover part of the heat-generating components, the heat generated by other components still needs to be carried away by a fan. This means the fan will occupy a portion of the power supply device's board space, leading to a decrease in power density. Another method is direct immersion, which involves immersing the device or even the entire power supply directly in the liquid and then removing the heat through liquid circulation. No fan is required in the device. The power system architecture of this application is mainly designed for the latter direct immersion method.

[0048] In detail, the primary-side circuit 10 receives the AC input voltage and converts it into a first voltage. The primary-side circuit 10 includes at least one primary-side switch, such as P1. The transformer 20 includes a primary winding and a secondary winding. The primary winding is coupled to the primary-side circuit 10, and the transformer 20 converts the first voltage into a second voltage. The secondary-side circuit 30 is coupled to the secondary winding and converts the second voltage into a DC output voltage to power the network device. The secondary-side circuit 30 includes at least one secondary-side switch, such as S1. The secondary-side switch uses a surface-mount package, and the power density of the power module 1 is greater than or equal to 60W / inch. 3 In power supply design, it is necessary to ensure that all semiconductor components in the circuit operate within their respective heat dissipation thresholds to maintain their actual heat generation power. For example, if the heat dissipation threshold of the rectifier bridge is 15W, when the actual heat generation power of the rectifier bridge exceeds 15W, the heat generated by the rectifier bridge has exceeded its heat dissipation design, and the rectifier bridge may be damaged. Similarly, when using a PG-HSOF-8 surface-mount packaged switch, the heat dissipation threshold under immersion liquid cooling can reach 10W, but under air cooling, the heat dissipation threshold is only 5W. Preferably, both the primary-side circuit 10 and the secondary-side circuit 30 can be configured as modular circuits, which can be cascaded or connected in parallel to achieve flexible expansion and better compatibility. The primary-side switch P1 and / or the secondary-side switch S1 are silicon switches, silicon carbide switches, or gallium nitride switches made of Si, SiC, or GaN materials.

[0049] In one specific embodiment, the primary-side circuit 10 further includes a power factor correction (PFC) circuit and an inverter circuit. The DC side of the inverter circuit is electrically coupled to the PFC circuit, and the AC side of the inverter circuit is electrically coupled to the primary winding of the transformer 20. The inverter circuit includes multiple switching transistors, and the switching transistors are in surface-mount packages.

[0050] For example, the PFC circuit can be a bridge circuit, which includes a rectifier circuit, a PFC inductor, a switching unit, and a diode unit. Here, the rectifier circuit may include a single rectifier bridge or multiple rectifier bridges connected in parallel, and the PFC inductor is electrically coupled to the rectifier circuit. The switching unit is electrically coupled to the PFC inductor. The diode unit is electrically coupled to the PFC inductor and includes a single diode or multiple diodes connected in parallel. Preferably, the switching unit and the diode unit are power semiconductor devices in surface-mount packages.

[0051] For example, the PFC circuit can also be a bridgeless PFC circuit, which includes a PFC inductor, a switching unit, and a diode unit. The PFC inductor is electrically coupled to the switching unit, and the diode unit is electrically coupled to the PFC inductor and includes a single diode or multiple diodes connected in parallel. Similarly, the switching unit and diode unit are power semiconductor devices in surface-mount packages. Those skilled in the art will understand that... Figure 2 The PFC circuit 11 shown adopts a Boost structure, but this application is not limited to this. For example, the PFC circuit 11 can also adopt other circuit structures such as Totem Pole and H-bridge. Preferably, whether it is a bridge PFC circuit or a bridgeless PFC circuit, the winding wire diameter current density of the PFC inductor can be set to be greater than or equal to 15A / mm². Therefore, under the premise that the temperature rise of the PFC inductor meets the requirements, the PFC inductor uses wires with smaller wire diameters to form the inductor winding, which can further compress the winding space, thereby reducing the size of the PFC inductor and saving its volume in the power supply device layout space. Related tests show that the winding wire diameter current density of the PFC inductor in immersion liquid cooling is at least 50% higher than that of the PFC inductor in air cooling. Therefore, the size of the PFC inductor in the power supply device of this application will be significantly reduced under the condition of implementing immersion liquid cooling treatment.

[0052] Furthermore, the housing also includes multiple openings with a pre-defined pattern. During normal operation, the liquid coolant located between the power supply unit and the housing flows from one end of the unit (e.g., the power input side) to the other end (e.g., the power output side), dissipating heat from the heat-generating components within the unit. To enhance the reliability of heat dissipation and the safety of power supply operation, the openings can be made at specific locations on the housing. For example, through-holes can be provided on the housing surface near the power input side and also on the housing surface near the power output side. This design ensures better flow path unobstructed, preventing components or structures on the power input side or power output side from obstructing the flow path of the liquid coolant. In this embodiment, the liquid coolant can be a fluorinated liquid or an oily liquid.

[0053] In one specific embodiment, the secondary circuit further includes a rectifier circuit. The rectifier circuit is electrically coupled to the secondary winding of the transformer. The rectifier circuit includes multiple switching units, wherein each switching unit includes a single switch or multiple switches connected in parallel, and the rectifier switches are in a surface-mount package. Thus, in this embodiment, the power module 1 adopts a PFC+DC / DC circuit topology, wherein the inverter circuit, transformer, and rectifier circuit constitute a DC / DC module. In other words, the inverter circuit first converts the DC voltage output from the PFC circuit into AC voltage, then transfers energy from the primary to the secondary side through the magnetic coupling between the primary and secondary windings of the transformer, and finally converts the AC voltage back into DC voltage through the rectifier circuit. Those skilled in the art should understand that... Figure 2 The DC / DC module of the power supply device 11 employs an LLC resonant circuit, but this application is not limited to this; the DC / DC module can also employ other circuit structures such as a phase-shifted full-bridge or a dual active bridge. Furthermore, to prevent energy from being transferred in reverse from the output side to the input side, the secondary circuit may also include an anti-backflow circuit (or ORing circuit), which has multiple switches connected in parallel, such as diodes or MOSFETs. Similarly, the switches in the anti-backflow circuit are preferably surface-mount packages, utilizing the advantages of the package itself to save board space. As an alternative illustrative embodiment, in an immersion liquid cooling method, the number of switches in the anti-backflow circuit can be reduced by nearly half compared to an air-cooled cooling method of the same power level.

[0054] Figure 3 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional structural diagram of the transformer of the power supply module.

[0055] As mentioned earlier, the PFC inductors L1 and L2 use wires with smaller diameters (e.g., wires with a current density greater than or equal to 15 A / mm²) to construct the inductor windings, which further compresses the winding space, thereby reducing the size of the PFC inductors and saving space occupied by them in the power supply unit's board layout. Similarly, the primary and secondary windings of the transformer in the power supply module of this application can also be constructed using wires with smaller diameters, thereby reducing the size of the windings. Correspondingly, since the size of the transformer windings is reduced, fewer magnetic cores can be used, further reducing the volume occupied by the magnetic cores. For example, in a 2kW power supply unit for powering network equipment, under existing heat dissipation conditions, the power supply unit often requires a transformer with two magnetic cores, and the transformer size is as large as 62.25mm x 34.5mm x 30.8mm. However, the power supply unit of this application, after adopting the transformer winding with the above-mentioned wire diameter and current density, only requires a transformer with a single magnetic core. The transformer size is reduced to 35mm x 30mm x 32mm, thereby improving the proportion of transformer space occupied by the power supply unit (saving about 49.2%), and thus increasing the power density of the power supply unit.

[0056] Figure 4 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional structural diagram of the PFC inductor of the power supply module.

[0057] Reference Figure 4 ,exist Figure 1 In the power supply system, after configuring the PFC inductor of the power supply module according to the above parameters of winding wire diameter and current density, the volume of the PFC inductor is 25mm╳16mm╳28mm. In comparison, the volume of the existing PFC inductor is 33.5mm╳23mm╳32.5mm. It can be seen that the PFC inductor of this application has reduced dimensions in length, width and height, thereby reducing the volume occupied by the power supply module layout space.

[0058] Figure 5 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional structural diagram of the common mode inductor of the power supply module.

[0059] Reference Figure 5 ,exist Figure 1In the power supply system, the primary circuit of the power module may further include an EMI filter circuit, which has a common-mode inductor with a winding wire diameter current density greater than or equal to 15A / mm². The volume dimensions of the common-mode inductor are 26.5mm x 16.25mm x 25.5mm, compared to the existing common-mode inductors which have a volume dimension of 30mm x 16.5mm x 31mm. Therefore, the common-mode inductor of this application is significantly reduced in both length and height, thereby reducing the volume occupied by the power module on the board.

[0060] Figure 6 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional structural diagram of the resonant inductor of the power supply module.

[0061] Reference Figure 6 ,exist Figure 1 In the power supply system, the primary circuit of the power supply module may also include a resonant inductor L3. Preferably, the winding wire diameter current density of the resonant inductor can be set to be greater than or equal to 15A / mm², corresponding to a volume size of 23mm╳15mm╳28mm. In comparison, the volume size of the existing resonant inductor is 33mm╳32mm╳30.6mm. It can be seen that the size of the resonant inductor in this application is significantly reduced in the length, width and height directions, and the volume occupied in the power supply module layout space is reduced by 70% year-on-year.

[0062] Figure 7 Show Figure 1 A schematic embodiment of the power supply system shows a three-dimensional dimension diagram of the PCB circuit board of the power supply module.

[0063] Reference Figure 7 and combined Figure 1 and Figure 2 In this illustrative embodiment, the power module of this application has a power rating of 2kW, wherein the winding wire current density of the PFC inductor, common-mode inductor, resonant inductor, and transformer is greater than or equal to 15A / mm². The corresponding PCB board dimensions are 305mm in length, 40.6mm in width, and 40.6mm in height. Here, 1 inch equals 25.4mm. According to the power density calculation formula, the power density of this power module is 2000 × 25.4 × 25.4 × 25.4 / (305 × 40.6 × 40.6) W / inch 3 That is, 65.2W / inch 3 Those skilled in the art should understand that Figure 7The power rating and size of the power module described are merely descriptive examples, but the invention is not limited thereto. In other embodiments, when the electronic components used in the power module meet specifications and operate normally, the power density of the power module may be further increased; for example, the power density may even be increased to 90W / inch. 3 That's all. For example, if the power rating of the power module is increased from 2kW to 4kW, the power density of the power module will correspondingly increase to 130.4W / inch. 3 For example, by keeping the power rating of the power module unchanged and adjusting the placement of electronic components on the PCB board to further reduce the size of the PCB board, the power density of the power module can also be increased.

[0064] Figure 8 Show Figure 1 A schematic diagram of the conversion efficiency curve of the power module in one embodiment of the power system.

[0065] Reference Figure 8 In this embodiment, the conversion efficiency of the power module of this application first increases monotonically and then decreases monotonically within the rated load range of 0-50%. Preferably, the optimal conversion efficiency of the power module corresponds to the rated load operating state of 10%-40%, thereby improving the light-load efficiency of the power system and reducing costs. More preferably, the peak conversion efficiency of the power module corresponds to the rated load operating state of 35%.

[0066] From a loss perspective, the losses of a power supply module can be broadly categorized into three types, which are related to the zero power, first power, and second power of the current, respectively: I 0 I 1 I 2 The following is a brief explanation.

[0067] I 0 Losses mainly include core losses, control losses, and drive losses, which dominate the impact on conversion efficiency within the 10%~35% rated load operating range. These types of losses, especially core losses, are the key losses to reduce when optimizing the efficiency curve. When power supply size is limited, core losses in transformers and inductors can be reduced by increasing the number of winding turns or increasing the core volume while decreasing the wire diameter. However, under light load conditions, the current is small, and the impact of winding copper losses on power supply conversion efficiency is far less than that of core losses.

[0068] I 1The losses mainly include rectification losses and switching losses of the switching transistor, which have a dominant impact on conversion efficiency within the 35%~70% rated load operating range. Taking the switching loss of the switching transistor as an example, since the switching loss is directly proportional to the switching frequency, the switching loss under light load conditions is much greater than the conduction loss. Therefore, a switching transistor with a higher on-resistance but faster switching speed can be selected to reduce IL under light load conditions. 1 This reduces losses and significantly lowers the cost of the switching transistor. If the circuit topology used in the design can achieve soft switching of the switching transistor, the substantial reduction in switching losses will further improve half-load efficiency and meet the power conversion efficiency requirements of 80 Plus.

[0069] I 2 Losses mainly include conduction losses of the switching transistor, winding copper losses of the transformer and inductor, capacitor losses, and line losses, which have a dominant impact on conversion efficiency within the 70%~100% rated load operating range. Selecting switching transistors with higher on-resistance, reducing the number of switching transistors in parallel, and increasing wire diameter and current density will increase I to some extent. 2 While it reduces power loss, it can significantly reduce the design cost and size of the power supply.

[0070] As can be seen from the above, the power module of this application achieves a power density of at least 60W / inch. 3 Furthermore, the power conversion efficiency can be optimized based on the specific application scenario of the network power supply. The optimal efficiency load point of the power module can be adjusted to the light load range, sacrificing some heavy load efficiency. This fully utilizes the advantages of liquid cooling to reduce the difficulty of power supply design, especially thermal design. Simultaneously, it closely aligns with the specific application scenario of network equipment power supply, saving costs while reducing system electricity operating costs. Specifically, this application uses magnetic components with higher wire diameter current density (such as PFC inductors, common-mode inductors, resonant inductors, or the primary and secondary windings of transformers) to reduce I... 0 Loss. At the same time, by using surface-mount semiconductor devices and reducing the number of devices, I can be reduced. 0 Losses. Furthermore, selecting switching transistors with higher on-resistance and reducing the number of switching transistors, although increasing I... 2 While reducing power loss, it significantly lowers the design cost and size of the power supply, and has minimal impact on conversion efficiency under light loads. Therefore, the optimal conversion efficiency of the power module in this application can be set at 10%~40% of the rated load, and even at 50% of the rated load, the conversion efficiency of the power module is still higher than 80 Plus. ® Requirements.

[0071] Figure 9 Show Figure 1 Thermal simulation results for key areas during system operation in a power supply system. For example... Figure 9 As shown, after modeling the power module of this application, the thermal simulation data from the front and back of the PCB circuit board show that the temperature of each component meets the IPC9592 derating requirements.

[0072] The power supply system for supplying power to network devices according to the present invention includes a power module and a housing, with a three-dimensional accommodating space between the housing and the power module. The power module includes a primary circuit, a transformer, and a secondary circuit. The primary circuit receives an AC input voltage and converts the AC input voltage into a first voltage, and includes at least one primary switch. The transformer includes a primary winding and a secondary winding, with the primary winding coupled to the primary circuit. The transformer converts the first voltage into a second voltage. The secondary circuit is coupled to the secondary winding and converts the second voltage into a DC output voltage to supply power to the network device. The secondary circuit includes at least one secondary switch, wherein the secondary switch is in a surface-mount package. The power density of the power module is greater than or equal to 60 W / inch. 3 The power module does not include a fan; its three-dimensional housing is filled with liquid coolant for liquid cooling. Compared to existing technologies, the power module of this invention adopts an AC / DC converter power supply architecture, designs the secondary-side switch in the secondary circuit as a surface-mount package, and fills the space between the power module and the casing with liquid coolant, resulting in a power density of the power module greater than or equal to 60W / inch. 3 Furthermore, the power supply module of this invention is designed with optimal conversion efficiency in the light load range, while simultaneously ensuring that the internal device temperature meets derating requirements under full load conditions.

[0073] Although the above embodiments disclose specific examples of the present invention, they are not intended to limit the present invention. Those skilled in the art can make various modifications and alterations to the present invention without departing from the principles and spirit of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the appended claims.

Claims

1. A power supply system for supplying power to network devices, characterized in that, The power system includes a power module and a housing, with a three-dimensional accommodating space between the housing and the power module. The power module includes: A primary-side circuit is used to receive an AC input voltage and convert the AC input voltage into a first voltage, the primary-side circuit including at least one primary-side switch; A transformer, comprising a primary winding and a secondary winding, the primary winding being coupled to the primary circuit, the transformer being used to convert a first voltage into a second voltage; and The secondary-side circuit, coupled to the secondary-side winding, is used to convert the second voltage into a DC output voltage and supply power to the network device. The secondary-side circuit includes at least one secondary-side switch, wherein the secondary-side switch is in a surface-mount package. The power density of the power module is greater than or equal to 90W / inch. 3 ; The power module does not include a fan, and the three-dimensional accommodating space is filled with liquid coolant, which is used to perform liquid cooling heat dissipation on the power module.

2. The power supply system according to claim 1, characterized in that, The primary-side switch adopts a surface-mount package.

3. The power supply system according to claim 1, characterized in that, The power module further includes a housing that accommodates the primary circuit, the transformer, and the secondary circuit. The housing includes a plurality of openings with a preset pattern to allow the liquid coolant to enter and exit the power module.

4. The power supply system according to claim 1, characterized in that, The primary circuit also includes an EMI filter circuit, which has a common-mode inductor with a winding wire diameter current density greater than or equal to 15A / mm².

5. The power supply system according to claim 1, characterized in that, Both the primary circuit and the secondary circuit are configured as modular circuits that can be expanded by cascading or paralleling.

6. The power supply system according to claim 1, characterized in that, The primary-side circuit also includes a bridge PFC circuit, which has a rectifier circuit, the PFC inductor, a switching unit, and a diode unit. The rectifier circuit includes a single rectifier bridge or multiple rectifier bridges connected in parallel. The PFC inductor is electrically coupled to the rectifier circuit. The switching unit is electrically coupled to the PFC inductor. The diode unit is electrically coupled to the PFC inductor and includes a single diode or multiple diodes connected in parallel.

7. The power supply system according to claim 1, characterized in that, The primary-side circuit also includes a bridgeless PFC circuit, which has the PFC inductor, switching unit, and diode unit. The PFC inductor is electrically coupled to the switching unit, and the diode unit is electrically coupled to the PFC inductor and includes a single diode or multiple diodes connected in parallel.

8. The power supply system according to claim 6 or 7, characterized in that, The winding wire diameter current density of the PFC inductor is greater than or equal to 15A / mm².

9. The power supply system according to claim 6 or 7, characterized in that, The switching unit and the diode unit are power semiconductor components in surface-mount package.

10. The power supply system according to claim 6, characterized in that, The primary circuit also includes an inverter circuit, whose DC side is electrically coupled to the bridge PFC circuit and whose AC side is electrically coupled to the primary winding of the transformer. The inverter circuit includes multiple switching transistors, and the switching transistors are in surface mount package.

11. The power supply system according to claim 7, characterized in that, The primary circuit also includes an inverter circuit, whose DC side is electrically coupled to the bridgeless PFC circuit and whose AC side is electrically coupled to the primary winding of the transformer. The inverter circuit includes multiple switching transistors, and the switching transistors are in a surface-mount package.

12. The power supply system according to claim 1, characterized in that, The primary-side switch is made of Si, SiC, or GaN material.

13. The power supply system according to claim 1, characterized in that, The secondary switch is made of Si, SiC, or GaN material.

14. The power supply system according to claim 1, characterized in that, The secondary circuit also includes a rectifier circuit electrically coupled to the secondary winding of the transformer. The rectifier circuit includes multiple switching units, wherein each switching unit includes a single switch or multiple switches connected in parallel, and the switches are in a surface-mount package.

15. The power supply system according to claim 1, characterized in that, The secondary circuit also includes an anti-backflow circuit, which comprises multiple switches connected in parallel.

16. The power supply system according to claim 1, characterized in that, Within the rated load range of 0-50%, the conversion efficiency of the power supply module first increases monotonically, and then decreases monotonically.

17. The power supply system according to claim 16, characterized in that, The optimal conversion efficiency of the power module corresponds to a rated load operating condition of 10% to 40%.

18. The power supply system according to claim 17, characterized in that, The peak conversion efficiency of the power module corresponds to 35% of the rated load operating condition.

19. The power supply system according to any one of claims 16 to 18, characterized in that, Under 50% rated load operation, the power supply module has a conversion efficiency higher than 80 Plus. ® Requirements.

20. The power supply system according to claim 1, characterized in that, The liquid coolant is a fluorinated liquid or an oily liquid.

21. The power supply system according to claim 1, characterized in that, The secondary winding wire diameter current density is greater than or equal to 15A / mm².

22. The power supply system according to claim 21, characterized in that, The secondary winding is made of wire.

23. The power supply system according to claim 1, characterized in that, The current density of the primary winding wire diameter is greater than or equal to 15A / mm².

24. The power supply system according to claim 23, characterized in that, The primary winding is made of wire.

25. The power supply system according to claim 1, characterized in that, The primary circuit also includes a PFC inductor, the PFC inductor winding being constructed from wire.

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