Lens driving device, camera device, and optical apparatus including the camera module

Abstract

A lens driving apparatus, a camera apparatus, and an optical device including the camera module are disclosed. One embodiment includes a circuit board including a seating recess, an image sensor disposed in the seating recess of the circuit board, and a first epoxy resin disposed in the seating recess, wherein the seating recess includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other, the circuit board includes at least one application groove disposed on the first side surface and / or the second side surface of the seating recess, the at least one application groove includes an opening open toward an upper surface of the circuit board, and at least a portion of the first epoxy resin is disposed in the at least one application groove.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 201980036844.2, filed on May 29, 2019, entitled “Lens Driving Device, Camera Device and Optical Device Including the Camera Module”. Technical Field

[0002] The embodiments relate to lens-mounted mobile devices, camera devices, and optical devices including the camera module. Background Technology

[0003] The voice coil motor (VCM) technology used in existing conventional camera modules is difficult to apply to miniature low-power camera modules, and related research has been actively carried out.

[0004] In the case of camera modules constructed for installation in small electronic products (such as smartphones), the camera module may frequently be subjected to shocks during use and may experience slight vibrations due to, for example, the user's hand tremors. With this in mind, techniques have been developed that allow for the additional installation of anti-shake devices into the camera module. Summary of the Invention

[0005] [Technical Issues]

[0006] The embodiments provide a camera device and an optical device including the camera device, which can prevent the introduction of foreign objects, ensure the reliability of wire bonding and facilitate the application of reagents for preventing the introduction of foreign objects.

[0007] Furthermore, the embodiments provide a lens mobile device and a camera module and optical device, each including the lens mobile device, which can suppress the generation of contaminants and improve the solderability between the coil board and the circuit board.

[0008] [Technical Solution]

[0009] A lens-mounted device according to one embodiment includes: a circuit board having a mounting recess; an image sensor disposed in the mounting recess of the circuit board; and a first epoxy resin disposed in the mounting recess, wherein the mounting recess has a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other, wherein the circuit board has at least one application groove formed in at least one of the first side surface and the second side surface of the mounting recess, wherein the at least one application groove has an opening formed in an upper surface of the circuit board, and wherein at least a portion of the first epoxy resin is disposed in the at least one application groove.

[0010] Another portion of the first epoxy resin may be disposed between the first to fourth side surfaces of the mounting recess and the side surface of the image sensor disposed in the mounting recess.

[0011] The camera device may also include a lens moving device for moving the lens.

[0012] The camera device may further include a second epoxy resin for attaching the lower surface of the image sensor to the bottom surface of the mounting recess. The first and second epoxy resins may be made of the same material.

[0013] The circuit board may include a first terminal disposed in a region on a third side surface of the mounting recess, the image sensor may include a first terminal disposed in a region on the upper surface of the image sensor, the region being abutted on a side surface of the third side surface facing the mounting recess, and the circuit board may also include a first wire connecting the first terminal of the circuit board to the first terminal of the image sensor.

[0014] The at least one application groove may have a diameter greater than the distance between the side surface of the placement recess and the side surface of the image sensor.

[0015] The at least one applied groove may not overlap with the first conductor in the optical axis direction.

[0016] The bottom surface of the at least one applying groove and the bottom surface of the placement recess may have a height difference in the optical axis direction, and the bottom surface of the at least one applying groove may be positioned higher than the bottom surface of the placement recess.

[0017] The first epoxy resin can be a thermosetting resin, a naturally curing resin, or a UV-curing resin.

[0018] Each of the first and second side surfaces of the at least one applied groove may be longer than each of the third and fourth side surfaces of the at least one applied groove.

[0019] The upper surface of the first epoxy resin may be at the same level as or lower than the upper surface of the image sensor disposed in the mounting recess.

[0020] A camera device according to another embodiment includes: a circuit board having a mounting recess having a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other; a reinforcing member disposed below the circuit board; an image sensor disposed on the reinforcing member and disposed in the mounting recess; and a first epoxy resin disposed in the mounting recess, wherein the circuit board further has at least one application groove formed on at least one of the first side surface and the second side surface of the mounting recess, and at least a portion of the first epoxy resin is disposed in the at least one application groove.

[0021] The first epoxy resin may be disposed on the side surface of the at least one applied groove, the first to fourth side surfaces of the placement recess, and the first region of the reinforcing member, wherein the first region of the reinforcing member is the region on the upper surface of the reinforcing member located between the side surface of the image sensor and the first to fourth side surfaces of the circuit board.

[0022] [Beneficial Effects]

[0023] The embodiments can prevent the introduction of foreign matter, ensure the reliability of wire bonding, and make it easy to apply reagents to prevent the introduction of foreign matter.

[0024] Furthermore, the embodiments are able to suppress the generation of contaminants and improve the solderability between the coil board and the circuit board. Attached Figure Description

[0025] Figure 1 This is an exploded perspective view of a camera device according to one embodiment; Figure 2 yes Figure 1 A cross-sectional view of an embodiment of the camera device shown; Figure 3 It shows a plan view of the circuit board and image sensor; Figure 4a It is along Figure 3 A cross-sectional view taken from line AB in the diagram; Figure 4b It is along Figure 3 A cross-sectional view taken from line CD in the diagram; Figure 4c This is a view showing the application of a groove according to another embodiment; Figure 5a It is shown Figure 3 A view showing a variant with an applied groove; Figure 5b This is a plan view of an image sensor disposed on a circuit board according to another embodiment; Figure 6 This is a perspective view of a camera device according to another embodiment; Figure 7 It is shown Figure 6 Cross-sectional views of the circuit board, image sensor, foreign object blocking component, and reinforcing component shown; Figure 8 This is an exploded perspective view of an embodiment of a lens-mounted mobile device; Figure 9 This is a 3D assembly diagram of the lens-mounted device, with the following elements removed. Figure 8 The cover component shown; Figure 10 It is shown Figure 8 A three-dimensional view of the bobbin, the first coil, the second magnet, and the third magnet shown in the figure; Figure 11 It is shown Figure 8 A perspective view of the housing and the first magnet shown in the figure; Figure 12 It is shown Figure 8 An exploded perspective view of the housing, the first position sensor, and the circuit board shown. Figure 13a It is shown Figure 12 Enlarged view of the circuit board and the first position sensor shown; Figure 13b yes Figure 13a A block diagram of the first position sensor shown; Figure 14 It is along Figure 9 A cross-sectional view of the lens-mounted device taken by line AB in the diagram; Figure 15 It is along Figure 9 A cross-sectional view of the lens-mounted device taken from the line CD; Figure 16a yes Figure 1 A plan view of the upper elastic member shown; Figure 16b yes Figure 8 A plan view of the lower elastic member shown; Figure 17 It is shown Figure 8 An assembly perspective view of the upper elastic member, lower elastic member, base, support member, second coil, and circuit board shown. Figure 18 It is shown Figure 8 An exploded perspective view of the second coil, circuit board, base, and second position sensor shown in the figure; Figure 19 yes Figure 18 A plan view of the second coil shown; Figure 20 yes Figure 19 The bottom view of the second coil shown; Figure 21yes Figure 19 A cross-sectional view of the dashed section in the diagram; Figure 22 It is along Figure 9 A partial cross-sectional view of the coil plate taken from line CD in the diagram; Figure 23a This is a view showing the cut lines used to form the terminals and bores of a conventional coil plate; Figure 23b This is a view showing the burrs produced during the process of forming bores in the coil plate; Figure 24 This is a view showing the terminals of the coil plate according to an embodiment and the cutting lines for forming bores in the coil plate; Figure 25a This is a view showing the terminals and pads of the coil board; Figure 25b It shows that Figure 25a A view of the conductive adhesive component connecting the terminals of the coil board to the pads of the circuit board. Figure 26 This is a perspective view of a portable terminal according to an embodiment; and Figure 27 It is shown Figure 26 A view showing the construction of a portable terminal. Detailed Implementation

[0026] In the following description, embodiments of the present invention that specifically achieve the above objectives will be described with reference to the accompanying drawings.

[0027] As will be understood in the following description of the embodiments, when an element is referred to as being formed “on” or “below” another element, it may be directly “on” or “below” the other element, or it may be indirectly disposed with one or more intermediate elements between them. Additionally, it will be understood that “on” or “below” an element may refer to the upward or downward direction of the element.

[0028] Additionally, relative terms used in the following description (such as, for example, "first," "second," "upper," "above," and "lower") may be used to distinguish any substance or element from another substance or element where there is no or no physical or logical relationship or order between them. In all the accompanying drawings, the same reference numerals denote the same elements.

[0029] Unless otherwise defined, the terms “comprising,” “including,” or “having” as used in the foregoing description are used to specify the presence of a feature, step, or combination thereof described in the specification, and should be understood to not exclude the possibility of the presence or additional inclusion of one or more different features, steps, or combinations thereof. Furthermore, the terms “corresponding,” etc., may include at least one of the meanings of “facing” or “overlapping.”

[0030] In the following description, a camera module and an optical device including the camera module according to an embodiment will be described with reference to the accompanying drawings. For ease of description, although the camera module according to this embodiment is described using a quadrilateral coordinate system (x, y, z), other coordinate systems may be used to describe the lens moving device, and the embodiment is not limited thereto. In the various drawings, the X-axis and Y-axis refer to directions perpendicular to the optical axis OA (i.e., the Z-axis), and the direction of the optical axis (Z-axis) or a direction parallel to the optical axis OA may be referred to as a "first direction," the X-axis direction may be referred to as a "second direction," and the Y-axis direction may be referred to as a "third direction." In the following description, the term "terminal" may be used interchangeably with "pad," "electrode," or "conductive layer."

[0031] The "shake correction function" of an ultra-compact camera module applied to mobile devices (such as smartphones or tablets) can be the following function: to move the lens in a direction perpendicular to the optical axis or to tilt the lens relative to the optical axis, thereby eliminating vibration (or movement) caused by the user's hand shaking.

[0032] In addition, the term "autofocus function" can refer to the function of moving the lens along the optical axis according to the distance to the object and thus automatically focusing on the object to obtain a clear image in the image sensor.

[0033] The lens moving device may include a VCM (voice coil motor), a lens moving motor, or an actuator, and may be used interchangeably with a VCM, a lens moving motor, or an actuator. The lens moving device according to embodiments can be implemented or used in various fields such as, for example, camera modules or optical devices.

[0034] For example, the lens-mounted mobile device 100 according to the embodiment may be included in an optical instrument designed to form an image of an object in space by using reflection, refraction, absorption, interference, diffraction, etc., as properties of light, to extend vision, record or reproduce an image obtained through a lens, perform optical measurements, or propagate or transmit an image. For example, the optical instrument according to the embodiment may include a smartphone and a portable terminal equipped with a camera.

[0035] Figure 1 This is an exploded perspective view of the camera device 200 according to an embodiment.

[0036] Reference Figure 1 The camera device 200 may include a lens or lens barrel 400, a lens moving part 100, a filter 610, a retainer 600, a circuit board 800, an image sensor 810, and a foreign object blocking member 310. Here, the term "camera device" may be used interchangeably with "camera module," "imaging unit," or "photographic unit," and the term "retainer" may be used interchangeably with "sensor base." The term "foreign object blocking member" may be used interchangeably with "epoxy resin" or "adhesive member."

[0037] The camera device 200 may further include a blocking member 1500 disposed on the filter 610.

[0038] In addition, the camera device 200 may also include an adhesive member 612.

[0039] Additionally, the camera device 200 may also include a motion sensor 820, a controller 830, and a connector 840.

[0040] The lens or lens barrel 400 can be mounted in the spool 110 of the lens moving device 100 and can move in the direction of the optical axis.

[0041] The retainer 600 can be disposed below the base 210 of the lens moving device 100.

[0042] For example, the retainer 600 can be located below the lens or lens barrel 400.

[0043] The filter 610 can be mounted on the holder 600. The upper surface of the holder 600 may be recessed and may include a mounting portion 500 therein for holding the filter 610. The filter 610 may be disposed in the mounting portion 500.

[0044] Although the placement portion 500 may be implemented as a recess, cavity, or opening formed from its upper surface, this disclosure is not limited thereto. In another embodiment, the placement portion 500 may be implemented as a protrusion extending from the upper surface of the retainer 600.

[0045] The adhesive member 612 can connect or attach the base 210 of the lens moving device 100 to the retainer 600. For example, the adhesive member 612 can be disposed between the lower surface of the base 210 and the upper surface of the retainer 600, thereby attaching the two surfaces to each other.

[0046] The adhesive member 612 can be used to prevent foreign objects from entering the lens moving device 100 and to perform attachment as described above. For example, the adhesive member 612 can be epoxy resin, thermosetting adhesive, UV-curing adhesive, etc.

[0047] The placement portion in the retainer 600 may include an inner surface and a bottom surface.

[0048] The filter 610 can be set on the bottom surface of the mounting part 500.

[0049] The retainer 600 may have a bore 501 formed in the area where the filter 610 is mounted or disposed, to allow light passing through the filter 610 to be incident on the image sensor 810.

[0050] For example, a bore 501 may be formed through the retainer 600 along the optical axis and may be alternatively referred to as a through hole. For example, the bore 501 may be formed through the center of the retainer 600 and may be configured to correspond to or face the image sensor 810.

[0051] For example, the bore 501 can be provided in the bottom surface of the mounting portion 500, and its area can be smaller than the area of ​​the filter 610.

[0052] For example, filter 610 may be disposed on the bottom surface of the placement portion 500 in the holder 600. Filter 610 may be used to prevent light of a specific frequency band passing through the lens barrel 400 from entering the image sensor 810. In another embodiment, filter 610 may be disposed in a placement recess formed in the lower surface of the base 210.

[0053] Although filter 610 may be, for example, an infrared blocking filter, this disclosure is not limited thereto. In another embodiment, filter 610 may be an infrared transmitting filter.

[0054] For example, filter 610 can be set to be parallel to the xy plane perpendicular to the optical axis OA.

[0055] The filter 610 can be attached to the bottom surface of the placement portion in the retainer 600 by means of an adhesive member (not shown) (such as UV epoxy resin).

[0056] The circuit board 800 may be disposed below the retainer 600, and the image sensor 810 may be mounted or disposed on the circuit board 800. The image sensor 810 may be the area thereon on which an image contained in the light passing through the filter 610 is formed.

[0057] The circuit board 800 may include various circuits, components, controllers, etc., to convert the image formed on the image sensor 810 into an electrical signal and transmit the electrical signal to an external device.

[0058] The circuit board 800 may have a circuit pattern formed thereon that is electrically connected to the image sensor 810 and various components.

[0059] The retainer 600 can be mounted on the circuit board 800 and can house the filter 610 therein. The retainer 600 can support the lens moving device 100 located above it. The retainer 600 can also be referred to as the sensor base.

[0060] The lower surface of the base 210 of the lens moving device 100 may be disposed on the upper surface of the holder 600. For example, the lower surface of the base 210 of the lens moving device 100 may contact the upper surface of the holder 600 and may be supported by the upper surface of the holder 600.

[0061] The holder 600 may have a placement portion 500 recessed from the upper surface of the holder 600, and the placement portion 500 may have an inner surface and a bottom surface. At least some of the inner surface of the placement portion 500 may face the side surface of the filter 610.

[0062] Holder 600 may alternatively be referred to as the first holder, and circuit board 800 may alternatively be referred to as the second holder.

[0063] The image sensor 810 can receive an image contained in light entering the image sensor 810 through the lens moving device 100, and can convert the received image into an electrical signal.

[0064] For example, the image sensor 810 may have an imaging area for detecting light passing through the lens or barrel 400. Here, the imaging area 811 may alternatively be referred to as the effective area, the light receiving area, or the effective display area.

[0065] The filter 610 and the image sensor 810 can be spaced apart from each other so that they face each other in the direction of the optical axis OA or in the first direction.

[0066] The filter 610 can be disposed on or placed on the bottom surface of the mounting portion 500. For example, the lower surface of the filter 610 can contact the bottom surface of the mounting portion 500.

[0067] The blocking member 1500 may be disposed on the upper surface of the filter 610. The blocking member 1500 may alternatively be referred to as a shielding portion.

[0068] The blocking member 1500 may have a bore, such as a through hole, formed along the optical axis at a position corresponding to the image sensor 810.

[0069] For example, the blocking member 1500 may be disposed on the peripheral region of the upper surface of the filter 610 and may be used to prevent at least a portion of the light entering the peripheral region of the filter 610 through the lens or lens barrel 400 from passing through the filter 610. For example, the blocking member 1500 may be coupled to or attached to the upper surface of the filter 610.

[0070] For example, filter 610 can be configured to have a quadrilateral shape when viewed in the optical axis direction, and the blocking member 1500 can be formed along the peripheral side of the upper surface of filter 610 to define a symmetrical shape relative to filter 610. Here, the blocking member 1500 can have a constant width at the peripheral side of the upper surface of filter 1610.

[0071] For example, the blocking member 1500 may have a quadrilateral shape and may have a quadrilateral bore, but is not limited thereto.

[0072] The blocking member 1500 can be made of an opaque material.

[0073] The blocking member 1500 may be made of an opaque adhesive material and applied to the filter 610, or it may be implemented as a membrane and attached to the filter 610.

[0074] The filter 610 and the image sensor 810 can be positioned facing each other in the optical axis direction, and at least a portion of the blocking member 1500 can overlap with terminals 41a and 41b and / or wires 51a and 51b disposed on the circuit board 800. The blocking member 1500 may not overlap with the imaging area 811 of the image sensor 810 in the optical axis direction.

[0075] The blocking member 1500 disposed on the outer region of the upper surface of the filter 610 can be used to prevent unwanted portions of the incident light 1010 incident on the image sensor 810 through the lens or lens barrel 1400 from entering the image sensor 810.

[0076] The terminals 41a and 41b of the circuit board 800, as well as the wires 51a and 51b, can be made of conductive materials (such as gold, silver, copper, copper alloys, etc.). The conductive material can have the property of reflecting light.

[0077] Specifically, light that has passed through filter 610 may be reflected by terminals 41a and 41b of circuit board 800 and wires 51a and 51b, and the reflected light may cause momentary blazing, i.e., a flare phenomenon. The flare phenomenon may distort the image formed on image sensor 810 or degrade the image quality.

[0078] Because the blocking member 1500 is configured such that at least a portion of it overlaps with terminals 41a and 41b and / or wires 51a and 51b in the optical axis direction, it can block a portion of the light that has passed through the lens or lens barrel 400 and is then directed to the circuit board 800 terminals 41a and 41b and / or wires 51a and 51b, thereby preventing image distortion or image quality degradation formed on the image sensor 810.

[0079] The motion sensor 820 can be mounted or disposed on the circuit board 800 and can be electrically connected to the controller 830 through a circuit pattern disposed on the circuit board 800.

[0080] The motion sensor 820 can output angular velocity information about the motion of the camera device 200. The motion sensor 820 can be implemented as a dual-axis or three-axis gyroscope sensor or an angular velocity sensor.

[0081] The controller 830 can be mounted or set on the circuit board 800.

[0082] Circuit board 800 can be electrically connected to lens moving device 100. For example, circuit board 800 can be electrically connected to circuit board 250 of lens moving device 100.

[0083] For example, a drive signal can be provided to each of the first coil 120 and the second coil 230 of the lens moving device 100, and can also be provided to the AF position sensor (or OIS position sensor). The output of the AF position sensor (or OIS position sensor) can be transmitted to the circuit board 800.

[0084] Connector 840 can be electrically connected to circuit board 800 and may include a port that will be electrically connected to an external device.

[0085] The camera device 200 can be one of an AF (autofocus) camera module and an OIS (optical image stabilizer) camera module. The AF camera module is used only to perform the autofocus function, while the OIS camera module is used to perform both the autofocus function and the OIS function.

[0086] For example, the lens moving device 100 can be an AF lens moving device or an OIS lens moving device. Here, AF and OIS can have the same meaning as described in the AF camera module and OIS camera module.

[0087] Figure 2 yes Figure 1 A cross-sectional view of an embodiment of the camera device 200 shown. Figure 2 In, with Figure 1 In the accompanying drawings, the same reference numerals indicate the same elements.

[0088] Reference Figure 2 The lens moving device 100 of the camera device 200 can be an OIS lens moving device.

[0089] The lens moving device 100 may include: a housing 140; a spool 110 disposed in the housing 140 and in which a lens or lens barrel 400 is mounted; a first coil 120 disposed at the spool 110; a magnet 130 disposed at the housing 140 facing the first coil 120; at least one upper elastic member (not shown) connected to both the upper portion of the spool 110 and the upper portion of the housing 140; at least one lower elastic member (not shown) connected to both the lower portion of the spool 110 and the lower portion of the housing 140; a second coil 230 disposed below the spool 110 (and / or the housing 140); a circuit board 250 disposed below the second coil 230; and a base 210 disposed below the circuit board 250.

[0090] The lens moving device 100 may also include a cover member 300, which is coupled to the base 210 of the lens moving device 100 and together with the base 210 provides space for accommodating components of the lens moving device 100.

[0091] The lens moving device 100 may further include a support member for electrically connecting the upper elastic member to the circuit board 250 and for supporting the housing 140 relative to the base 210. Each of the first coil 120 and the second coil 230 may be electrically connected to the circuit board 250 and may receive a drive signal (drive current) from the circuit board 250.

[0092] For example, the upper elastic member may include multiple upper elastic units (e.g., an upper spring), and the support member may include a support member connected to the upper elastic units. The first coil 120 may be electrically connected to the circuit board 250 via the upper elastic units and the support member. The circuit board 250 may include multiple terminals, and some of the multiple terminals may be electrically connected to the first coil 120 and / or the second coil 230.

[0093] The electromagnetic force generated by the interaction of the first coil 120 and the magnet 130 can be used to move the spool 110 and the lens or lens barrel 400 connected to the spool 110 along the optical axis. As a result, the displacement of the spool 110 in the optical axis direction is controlled, thereby realizing the AF operation.

[0094] In addition, the electromagnetic force generated by the interaction between the second coil 230 and the magnet 130 can be used to move the housing 140 in a direction perpendicular to the optical axis, thereby achieving hand shake correction or OIS operation.

[0095] For AF feedback operation, the lens moving part 100 of the camera device 200 may further include a sensing magnet (not shown) disposed at the linear axis 110 and an AF position sensor (e.g., a Hall sensor (not shown)) disposed at the housing 140. Additionally, the lens moving part 100 may also include a circuit board (not shown) disposed at the housing and / or base, and the AF position sensor disposed on or mounted thereon. In another embodiment, the AF position sensor may be disposed at the linear axis, and the sensing magnet may be disposed at the housing. Furthermore, the lens moving part 100 may also include a balancing magnet disposed at the linear axis 110 to correspond to the sensing magnet.

[0096] Based on the movement of the spool 110, the AF position sensor can output an output signal corresponding to the detection result of the magnetic field of the sensing magnet. The AF position sensor can be electrically connected to the circuit board 250 via an upper (or lower) elastic member and / or a support member. The circuit board 250 can provide a drive signal to the AF position sensor, and the output of the AF position sensor can be transmitted to the circuit board 250.

[0097] In another embodiment, the lens moving device 100 may be an AF lens moving device. The AF lens moving device may include: a housing; a spool disposed within the housing; a coil disposed at the spool; a magnet disposed at the housing; at least one elastic member connected to both the spool and the housing; and a base disposed below the spool (and / or the housing). The elastic member may include, for example, the upper elastic member and the lower elastic member described above.

[0098] The coil can be provided with a drive signal (e.g., a drive current), and the spool can be moved along the optical axis using the electromagnetic force generated by the interaction between the coil and the magnet. In another embodiment, the coil can be disposed at the housing, and the magnet can be disposed at the spool.

[0099] For AF feedback operation, the AF lens moving device may further include: a sensing magnet disposed at the spool; an AF position sensor (e.g., a Hall sensor) disposed at the housing; and a circuit board at which the AF position sensor is disposed, and the circuit board is disposed on or mounted on the housing and / or base. In another embodiment, the AF position sensor may be disposed at the spool, and the sensing magnet may be disposed at the housing.

[0100] The circuit board can be electrically connected to the coil and the AF position sensor. Drive signals can be provided to the coil and the AF position sensor via the circuit board, and the output of the AF position sensor can be transmitted to the circuit board.

[0101] Figure 3This is a plan view showing the circuit board 800 and the image sensor 810. Figure 4a It is along Figure 3 The cross-sectional view taken from line AB in the diagram. Figure 4b It is along Figure 3 The cross-sectional view taken from line CD.

[0102] Reference Figure 3 , Figure 4a and Figure 4b The circuit board 800 may have: a placement recess 80 in which an image sensor 810 is disposed or housed; and one or more application grooves 26a1 and 26b for applying or injecting foreign object blocking members.

[0103] Here, the recess 80 may be alternatively referred to as a groove, cavity, or first groove, and each of the applying grooves 26a1 and 26b may be alternatively referred to as an injection groove, second groove, or cavity.

[0104] The mounting recess 80 in the circuit board 800 may have a bottom surface 81 and a side surface 82.

[0105] The mounting recess 80 in the circuit board 800 can have various shapes, such as polygons, circles, ellipses, etc., and can have a larger dimension (e.g., surface area) than the image sensor 810. For example, the surface area of ​​the bottom surface 81 of the mounting recess 80 can be larger than the surface area of ​​the bottom surface of the image sensor 810.

[0106] The depth H1 of the mounting recess 80 in the circuit board 800 can be equal to the height H2 of the upper surface of the image sensor 810, but is not limited to this. Here, the height H2 of the image sensor 810 can be the distance between the bottom surface 81 of the mounting recess 80 and the upper surface of the image sensor 810.

[0107] For example, although the height of the upper surface of the circuit board 800 may be equal to the height of the upper surface of the image sensor disposed in the mounting recess 80, this disclosure is not limited thereto.

[0108] In another embodiment, the depth H1 of the mounting recess 80 in the circuit board 800 may be greater than the height H2 of the upper surface of the image sensor 810 (H1> H2). For example, the height of the upper surface of the circuit board 800 may be greater than the height of the upper surface of the image sensor 810 disposed in the mounting recess 80.

[0109] In another embodiment, the depth H1 of the mounting recess 80 in the circuit board 800 may be less than the height H2 of the upper surface of the image sensor 810 (H1 < H2). For example, the height of the upper surface of the circuit board 800 may be less than the height of the upper surface of the image sensor 810 disposed in the mounting recess 80.

[0110] The side surface of the image sensor 810 may be spaced apart from the side surface 82 of the mounting recess 80 in the circuit board 800. For example, the distance d1 between the side surface of the image sensor 810 and the side surface 82 of the mounting recess 80 in the circuit board 800 may be 0.1 mm to 0.5 mm. For example, this distance d1 may be 0.1 mm to 0.3 mm.

[0111] If the distance d1 is less than 0.1mm, the machining allowance is insufficient to place the image sensor 810 in the mounting recess 80 in the circuit board 800, and the image sensor 810 or the circuit board 800 may be damaged due to collision between the image sensor 810 and the circuit board 800 caused by external impact.

[0112] If the distance d1 is greater than 0.5mm, the distance between terminals 41a and 41b of the circuit board 800 and terminals 42a and 42b of the image sensor 810 increases, making it difficult to perform wire bonding and reducing the reliability of wire bonding.

[0113] Reference Figure 3 The side surface 82 of the mounting recess 80 in the circuit board 800 may have a first side surface 21a and a second side surface 21b facing each other, as well as a third side surface 21c and a fourth side surface 21d facing each other. For example, the third side surface 21c can connect the first end of the first side surface 21a to the first end of the second side surface 21b, and the fourth side surface 21d can connect the second end of the first side surface 21a to the second end of the second side surface 21b.

[0114] The application grooves 26a1 and 26b in the circuit board 800 can be provided in at least one of the first side surface 21a and the second side surface 21b of the recess 80.

[0115] The application grooves 26a1 and 26b can be recessed in the horizontal direction into the first side surface 21a (or the second side surface 21b) of the placement recess 80, and can have openings formed in the upper surface of the circuit board 800. The application grooves 26a1 and 26b can be used as inlets through which the foreign object blocking member 310 is injected or applied.

[0116] For example, the horizontal direction can be the direction from the first side surface of the image sensor 810 toward the first side surface 21a (or the second side surface 21b) of the mounting recess 80. The first side surface of the image sensor 810 can be the side surface facing the first side surface 21a (or the second side surface 21b) of the mounting recess 80.

[0117] For example, the corner where the two adjacent side surfaces of the recess 80 intersect can have a curved or rounded shape, but is not limited thereto. In another embodiment, the corner where the two adjacent side surfaces of the recess 80 intersect can have an angled shape. For example, the two adjacent side surfaces of the recess 80 can be perpendicular to each other.

[0118] The length of each of the first side surface 21a and the second side surface 21b of the recess 80 may be greater than the length of each of the third side surface 21c and the fourth side surface 21d of the recess 80. For example, each of the third side surface 21c and the fourth side surface 21d of the recess 80 may be a shorter side surface, while each of the first side surface 21a and the second side surface 21b may be a longer side surface than the shorter side surface. In another embodiment, each of the first side surface 21a and the second side surface 21b of the recess 80 may be a shorter side surface, while each of the third and fourth side surfaces may be a longer side surface than the shorter side surface.

[0119] For example, since the grooves 26a1 and 26b are provided in the first side surface 21a and the second side surface 21b (which are the longer side surfaces) of the placement recess 80, it is possible to ensure sufficient space for the foreign object blocking member to be injected and to make the foreign object blocking member evenly diffused into the placement recess 80.

[0120] For example, the circuit board 800 may have a first application groove 26a1 formed in the first side surface 21a of the placement recess 80 and a second application groove 26b formed in the second side surface 21b of the placement recess 80.

[0121] For example, the first applying groove 26a1 and the second applying groove 26b may face each other or overlap in the horizontal direction, but are not limited thereto. In another embodiment, the first applying groove 26a1 and the second applying groove 26b may not face each other or overlap in the horizontal direction.

[0122] For example, the first application groove 26a1 may be formed in the center or central position of the first side surface 21a where the recess 80 is placed. For example, the center of the first application groove 26a1 may be aligned with the center or central position of the first side surface 21a.

[0123] Furthermore, the second application groove 26b may be formed in the center or central position of the second side surface where the recess 80 is placed. For example, the center of the second application groove 26b may be aligned with the center or central position of the second side surface 21b. Here, the center of each application groove 26a1 and 26b may be the center point between the two ends of each of the side surfaces 21a and 21b.

[0124] The reason is that the foreign object blocking member injected through the first application groove 26a1 is allowed to move uniformly along the first side surface 21a into the space between the side surface of the image sensor 810 disposed in the placement recess 80 and the side surface 82 of the placement recess 80.

[0125] exist Figure 3 Although an application groove is formed in one of the side surfaces (e.g., 21a or 21b) of the recess 80, this disclosure is not limited thereto. Two or more application grooves spaced apart from each other may be formed in one of the side surfaces (e.g., 21a or 21b) of the recess 80.

[0126] Although the inner surfaces of each applied groove 26a1 and 26b may be curved, this disclosure is not limited thereto. In another embodiment, the inner surfaces of the applied grooves may include at least one flat surface and / or at least one curved surface.

[0127] For example, although the bottom surfaces of the grooves 26a1 and 26b may be flush with the bottom surface of the recess 80, this disclosure is not limited thereto.

[0128] The maximum distance d2 between the imaginary straight line 1401 between the two ends of each applied groove 26a1 and 26b and the inner surface of each inner surface 22a and 22b of the applied groove 26a1 can be from 0.1 mm to 2.5 mm. For example, the distance d2 can be from 0.25 mm to 1 mm.

[0129] For example, the distance d2 could be half the diameter R of each applied groove 26a1 and 26b, but is not limited to this.

[0130] Figure 4c Application grooves 26a11 and 26b1 according to another embodiment are shown. Figure 4c It is a cross-sectional view taken along line CD in Figure 4B.

[0131] and Figure 4b The same reference numerals in the figures denote the same elements, and descriptions of the same elements will be given briefly or omitted.

[0132] Reference Figure 4c Each of the bottom surface 22c1 of the first applied groove 26a11 and the bottom surface 22c2 of the second applied groove 26b1 may have a height difference ST in the optical axis direction or in the direction from the lower surface of the circuit board 800 toward the upper surface.

[0133] For example, each of the bottom surface 22c1 of the first applying groove 26a11 and the bottom surface 22c2 of the second applying groove 26b1 can be positioned above the bottom surface 81 of the placement recess 80. Furthermore, each of the bottom surface 22c1 of the first applying groove 26a11 and the bottom surface 22c2 of the second applying groove 26b1 can be positioned below the upper surface of the image sensor 810.

[0134] exist Figure 3 Although each of the first applying groove 26a1 and the second applying groove 26b may have a semi-circular shape when viewed from above, this disclosure is not limited thereto. In another embodiment, each of the first applying groove and the second applying groove may have a semi-elliptical or polygonal shape (e.g., a triangular shape, a quadrilateral shape, etc.) when viewed from above.

[0135] The diameter R of each of the first application groove 26a1 and the second application groove 26b can be 0.2 mm to 5 mm. For example, the diameter R can be 0.5 mm to 2 mm.

[0136] If the diameter R is less than 0.2 mm, the diameter of each applied groove 26a1 and 26b is smaller than the diameter of the injection port (e.g., injection needle) of the injection device for injecting the foreign object blocking member 310, making it difficult to inject into the foreign object blocking member or causing the foreign object blocking member to overflow.

[0137] If the diameter R is greater than 5 mm, the consumption of foreign object blocking components may increase because a large number of foreign object blocking components must be injected into the application groove in order to introduce the foreign object blocking components into the placement recess 80, and the foreign object blocking components injected into the application groove may not be easy to move into the placement recess.

[0138] For example, the diameter R of each applied groove 26a1 and 26b can be greater than the distance d1 between the side surface 82 of the mounting recess 80 and the side surface of the image sensor 810 disposed in the mounting recess 80.

[0139] The ratio (d1:R) of the distance d1 between the side surface of the image sensor 810 and the side surface 82 of the placement recess 80 to the diameter R of each of the first application groove 26a1 and the second application groove 26b can be from 1:1.7 to 1:20. For example, the ratio (d1:R) can be from 1:2 to 1:10. If the ratio (R / d1) is less than 1.7, it is not easy to inject the foreign object blocking member, or the foreign object blocking member may overflow. If the ratio (R / d1) is greater than 20, the consumption of the foreign object blocking member may be unnecessarily high, and the foreign object blocking member injected into the application groove may not be easy to move into the placement recess.

[0140] The foreign object blocking member 310 can be disposed in the application grooves 26a1 and 26b and in the space between the side surface of the image sensor 810 and the side surface 82 of the mounting recess 80 in the circuit board 800.

[0141] For example, the foreign object blocking member 310 can be provided on the side and bottom surfaces of the grooves 26a1 and 26b. For example, the foreign object blocking member 310 can be provided on the side surface of the recess 80 and on a first region of the bottom surface 81 of the recess 80. Here, the first region of the bottom surface 81 of the recess 80 can be the region between the side surface of the image sensor 810 and the side surface 82 of the recess 80.

[0142] Here, the foreign object blocking member 310 can be used interchangeably with foreign object blocking members, adhesive members, protective members, insulating members (or coatings), resin bodies, or epoxy resins.

[0143] For example, the foreign object blocking member 310 can be made of resin or plastic.

[0144] For example, the foreign object blocking member 310 can be made of thermosetting resin, natural curing resin or UV curing resin.

[0145] For example, the foreign object blocking member 310 may include a thermosetting epoxy resin, a UV-curing epoxy resin, or a mixture of thermosetting and UV-curing epoxy resins. Alternatively, the foreign object blocking member 310 may be an epoxy resin comprising titanium (Ti).

[0146] For example, the foreign object blocking member 310 may include a first epoxy resin disposed in the mounting recess 80, and at least a portion of the first epoxy resin of the foreign object blocking member 310 may be disposed in at least one of the application grooves 26a1 and 26b. Another portion of the first epoxy resin of the foreign object blocking member 310 may be disposed between the first to fourth side surfaces of the mounting recess 80 and the side surface of the image sensor 810 disposed in the mounting recess 80.

[0147] Furthermore, the foreign object blocking member 310 may also include a second epoxy resin disposed between the bottom surface 81 of the mounting recess 80 and the lower surface of the image sensor 810 to attach the bottom surface 81 of the mounting recess 80 and the lower surface of the image sensor 810 to each other. For example, the first epoxy resin and the second epoxy resin may be made of the same epoxy resin material.

[0148] The upper surface of the foreign object blocking member 310 disposed in the application grooves 26a1 and 26b and in the placement recess 80 can be positioned below the upper surface of the image sensor 810. This is to prevent the foreign object blocking member 310 from overflowing onto the upper surface of the image sensor 810, thereby preventing contamination of the terminals 42a and 42b of the image sensor 810.

[0149] The upper surface of the foreign object blocking member 310 disposed in the application grooves 26a1, 26b and the placement recess 80 can be positioned below the upper surface of the circuit board 800. This is to prevent the foreign object blocking member 310 from overflowing onto the upper surface of the circuit board 800, thereby preventing contamination of the terminals 41a and 41b of the circuit board 800.

[0150] In another embodiment, the upper surface of the foreign object blocking member 310 disposed in the application grooves 26a1 and 26b and in the placement recess 80 may be flush with the upper surface of the image sensor 810 and / or the upper surface of the circuit board 800.

[0151] In another embodiment, the upper surface of the foreign object blocking member 310 disposed in the application grooves 26a1 and 26b can be positioned above the upper surface of the image sensor 810 and / or the upper surface of the circuit board 800. This is because even if the foreign object blocking member 310 overflows onto the upper surface of the circuit board 800 around the application grooves 26a1 and 26b, there is no need to worry about the terminals 41a, 41b, 42a, and 42b being contaminated, since the application grooves 26a1 and 26b are positioned spaced apart from the terminals 42a and 42b of the image sensor 810 and the terminals 41a and 41b of the circuit board 800.

[0152] The camera device 200 may further include wires 51a and 51b that electrically connect terminals 41a and 41b disposed on the circuit board 800 to terminals 42a and 42b disposed on the image sensor 810.

[0153] The circuit board 800 may include at least one first terminal 41a disposed in a region adjacent to the third side surface 21c of the recess 80.

[0154] For example, the at least one first terminal 41a may include a plurality of first terminals, and the plurality of first terminals 41a may be configured to be spaced apart from each other in the direction from the first side surface 21a of the placement recess 80 toward the second side surface 21b.

[0155] In addition, the circuit board 800 may include at least one second terminal 41a, which is disposed in another region adjacent to the fourth side surface 21d of the recess 80.

[0156] For example, the at least one second terminal 41b may include a plurality of second terminals, and the plurality of second terminals 41b may be configured to be spaced apart from each other in the direction from the first side surface 21a of the placement recess 80 toward the second side surface 21b.

[0157] For example, the first terminal 41a and the second terminal 41b of the circuit board 800 may be configured to face each other in a direction from the third side surface 21c of the mounting recess 80 toward the fourth side surface 21d, but are not limited thereto.

[0158] The image sensor 810 may include a first terminal 42a and a second terminal 42b, which are electrically connected to the first terminal 41a and the second terminal 41b of the circuit board 800.

[0159] The first terminal 42a of the image sensor 810 may be disposed in a first region on the upper surface of the image sensor 810, which is adjacent to the side surface of the image sensor 810 facing the third side surface of the mounting recess 80.

[0160] For example, the first terminal 42a of the image sensor 810 may include a plurality of first terminals, and the plurality of first terminals 42a of the image sensor 810 may be configured to be spaced apart from each other in the direction from the first side surface 21a of the mounting recess 80 in the circuit board 800 toward the second side surface 21b.

[0161] The second terminal 42b of the image sensor 810 may be disposed in a second region on the upper surface of the image sensor 810, which is adjacent to the side surface of the image sensor 810 facing the fourth side surface of the mounting recess 80.

[0162] For example, the second terminal 42b of the image sensor 810 may include a plurality of second terminals, and the plurality of second terminals 42b of the image sensor 810 may be configured to be spaced apart from each other in the direction from the first side surface 21a of the mounting recess 80 in the circuit board 800 toward the second side surface 21b.

[0163] The first wire 51a can connect the first terminal 41a of the circuit board 800 to the first terminal 42a of the image sensor 810 via solder or a conductive component.

[0164] The second wire 51b can connect the second terminal 41b of the circuit board 800 to the second terminal 42b of the image sensor 810 via solder or a conductive component.

[0165] The first conductor 51a and the second conductor 51b may overlap with the third side surface 21c and the fourth side surface 21d of the placement recess 80 in the optical axis direction, but may not overlap with the first application groove 21a and the second application groove 21b.

[0166] A circuit board 800 having application grooves 26a1 and 26b and mounting recesses 80 is prepared. For example, the application grooves 26a1 and 26b can be formed by a cutting process using a cutter.

[0167] The operations of mounting the image sensor 810 onto the circuit board 800 and forming the foreign object blocking member 310 can be performed as follows.

[0168] Image sensor 810 is mounted on circuit board 800.

[0169] Subsequently, wire bonding is performed between terminals 41a and 41b of the circuit board 800 and terminals 42a and 42b of the image sensor 810.

[0170] Subsequently, the material used to form the foreign object blocking member is injected or applied into the application grooves 26a1 and 26b. By applying epoxy resin with good flowability, foreign objects present in the space between the image sensor 810 and the side surface 82 of the mounting recess 80 are fixed, and new foreign objects are prevented from being introduced into the space between the image sensor 810 and the side surface 82 of the mounting recess 80, thereby preventing a decrease in the reliability of the image sensor 810 due to foreign objects.

[0171] Subsequently, the injected or applied foreign object barrier material is cured to form a foreign object barrier, and then the packaging process is performed.

[0172] There is a gap of 0.1 mm to 0.3 mm between the side surface of the mounting recess in the circuit board and the side surface of the image sensor disposed in the mounting recess. Therefore, when foreign objects enter the space between the side surface of the mounting recess and the side surface of the image sensor disposed in the mounting recess, it is difficult to remove the foreign objects due to the presence of the conductive wires connecting the circuit board and the image sensor. Furthermore, the foreign objects may escape from the space, thus causing malfunctions after the packaging process.

[0173] When epoxy resin is applied only to the space to prevent such failures due to foreign objects, it is difficult to apply the epoxy resin because the gap between the side surface of the mounting recess in the circuit board and the side surface of the image sensor disposed in the mounting recess is narrow. Meanwhile, when the width of the gap between the side surface of the mounting recess and the side surface of the image sensor is increased to facilitate epoxy resin application, the length of the wires increases, thereby reducing the reliability of the wire bonding.

[0174] Since this embodiment also provides application grooves 26a1 and 26b for applying a foreign object blocking member (e.g., made of epoxy resin) to the side surface 82 of the mounting recess 80, it can facilitate the application of the foreign object blocking member into the space between the side surface 82 of the mounting recess 80 and the side surface of the image sensor 810, and the operation of applying the foreign object blocking member can be performed after the operation of wire bonding between the circuit board 800 and the image sensor 810 is performed.

[0175] Furthermore, since this embodiment does not require increasing the distance between the side surface 82 of the recess 80 and the side surface of the image sensor 810, it does not require increasing the length of the wire due to the increase in distance, thereby preventing a decrease in the reliability of the wire bonding.

[0176] Furthermore, since this embodiment can apply a foreign object blocking member after performing the wire bonding operation between the circuit board 800 and the image sensor 810, even if the terminals 41a and 41b of the circuit board 800 and the terminals 42a and 42b of the image sensor 810 are contaminated by the foreign object blocking member, it will not have a significant impact on the reliability of the wire bonding.

[0177] Figure 5a It shows Figure 3 The variation shown is the one with the groove applied.

[0178] refer to Figure 5a The first application groove 26a1 and the second application groove 26b may not face each other in the direction from the first side surface of the mounting recess 80 toward the second side surface.

[0179] For example, the first application groove 26a1 may be located between the center of the first side surface 21a of the mounting recess 80 and the first corner where the first side surface 21a and the fourth side surface 21c intersect each other.

[0180] For example, the second application groove 21b may be located between the center of the second side surface 21b of the recess 80 and the second corner where the second side surface 21b and the third side surface 21d intersect each other. The first corner and the second corner of the recess 80 may face each other.

[0181] For example, the first application groove 26a1 and the second application groove 26b can be positioned relative to each other with respect to a center line that connects to the center of both the first side surface 21a and the center of the second side surface 21b.

[0182] Figure 5b This is a plan view of an image sensor 810 disposed in a circuit board 800a according to another embodiment.

[0183] refer to Figure 5bAccording to another embodiment, the circuit board 800a may have a placement recess 80 and applied grooves 26a2 and 26b2.

[0184] Figure 5b The application grooves 26a2 and 26b2 shown can be formed in the first side surface 21a and the second side surface 21b of the placement recess 80 in the circuit board 800a.

[0185] The first application groove 26a2 (or the second application groove 26b2) may include a first portion 106a abutting against the first side surface 21a (or the second side surface 21b) and a second portion 105b connected to the first portion 106a.

[0186] The second portion 106b of which the foreign object blocking member 310 is injected or applied may be spaced apart from the first side surface 21a (or the second side surface 21b) of the first application groove 26a2 (or the second application groove 26b2).

[0187] The distance K between the first side surface 21a (or second side surface 21b) of the first applied groove 26a2 (or the second applied groove 26b2) can be greater than the distance between the side surface 82 of the recess 80 and the side surface of the image sensor 810, but is not limited thereto.

[0188] The first part 106a may have a linear shape, and the second part 106b may have a circular shape, an elliptical shape, a semi-circular shape, or a polygonal shape, but is not limited to these.

[0189] The diameter (M or horizontal length) of the first part 106a may be smaller than the diameter R of the second part 106b. Although the diameter R of the second part 106b may be equal to the diameter of each of the above-described applied grooves 26a1 and 26b, this disclosure is not limited thereto.

[0190] Since the diameter R of the second part 106b is larger than the diameter M of the first part 106a, this embodiment can suppress the overflow of the foreign object blocking member 310 onto the upper surface of the circuit board 800a during the injection process of the foreign object blocking member 310.

[0191] Furthermore, since the second portion 106b in which the foreign object blocking member 310 is injected is spaced apart from the side surface 82 of the placement recess 80, the foreign object blocking member 310 injected into the second portion 106b can slowly flow through the first portion 106a into the space between the side surface 82 of the placement recess 80 and the side surface of the image sensor 810, thereby preventing the foreign object blocking member 310 from overflowing onto the upper surface of the image sensor 810 or adhering to the wires 51a and 51b.

[0192] Figure 5bThe applied grooves 26a2 and 26b2 shown are with Figure 3 The application grooves 26a1 and 26b shown differ only in shape. Therefore, for Figure 3 , Figure 4a , Figure 4b and Figure 4c The settings, height differences, dimensions, etc., described in the application grooves 26a1 and 26b shown can be applied in the same or similar manner to [other applications]. Figure 5b The grooves 26a2 and 26b2 are shown.

[0193] Figure 6 This is a perspective view of a camera device 200-1 according to another embodiment. Figure 7 It is shown Figure 6 The diagram shows a cross-sectional view of the circuit board 800b, image sensor 810, foreign object blocking member 310, and reinforcing member 900.

[0194] Reference Figure 6 and Figure 7 The camera device 200-1 may include a lens or lens barrel 400, a lens moving device 100, a filter 610, a retainer 600, a circuit board 800b, an image sensor 810, a foreign object blocking member 310, and a reinforcing member 900. Although in Figure 6 The wires used to electrically connect the image sensor 810 to the circuit board 800b are omitted, but the description of wires 51a and 51b above can be applied to... Figure 6 The example shown.

[0195] Figure 1 The circuit board 800 shown has a mounting recess 80 for mounting the image sensor 810 therein, and Figure 6 The circuit board 800b shown has a bore 801, an image sensor 810 is disposed in the bore, and the image sensor 810 is disposed on the reinforcing member 900.

[0196] The circuit board 800b may have a bore 801 corresponding to the bore 501 in the retainer 600.

[0197] The bore 801 in circuit board 800 can be a through hole, formed by passing through circuit board 800b in the optical axis direction. When viewed from above, the shape of the bore 801 in circuit board 800 can be similar to... Figure 1 The shapes of the recesses shown are the same.

[0198] For example, the structure of the bore 801 in circuit board 800b can be similar to... Figure 1 The mounting recess 80 shown has the same structure as, but omits, the bottom surface 81, or is similar to... Figure 1 The structure shown is the same as the one with bores formed in the bottom surface 81. Therefore, except for Figure 1 Outside the bottom surface 81 shown, for Figure 1 The description of the mounting recess 80 shown also applies.

[0199] The circuit board 800b may have one or more application grooves 26a2 and 26b2 formed in the side surface of the bore 801 for applying or injecting foreign object blocking member 310.

[0200] The one or more application grooves 26a2 and 26b2 can be formed in the horizontal direction from the first side surface 21a (or the second side surface 21b) of the recess 80.

[0201] Figure 1 The applied grooves 26a and 26b shown are with Figure 6 The difference between the applied grooves 26a2 and 26b2 shown is that, Figure 6 The grooves 26a2 and 26b2 shown are through holes formed by passing through the upper and lower surfaces of the circuit board 800b.

[0202] The description of the side surfaces 21a to 21d of the recess 80 can be applied to the side surfaces of the bore 801. One or more grooves 26a2 and 26b2 can be formed in at least one of the first side surface 21a and the second side surface 21b of the bore 801 in the circuit board 800b.

[0203] For example, the bore 801 in circuit board 800b can be alternatively referred to as a mounting hole, and the application grooves 26a2 and 26b2 can be alternatively referred to as application holes.

[0204] In the following text, bore 801 will be referred to as placement hole, and application grooves 26a2 and 26b2 will be referred to as application hole.

[0205] right Figures 1 to 4c The description of the application grooves 26a and 26b shown can be applied to Figure 6 The application holes 26a2 and 26b2 are shown. For example, the description of the shape, size, etc. of the application grooves 26a and 26b can be applied to the application holes 26a2 and 26b2.

[0206] The foreign object blocking member 310 can be disposed in the space between the side surface of the image sensor 810 and the mounting hole 801 in the circuit board 800b.

[0207] For example, the foreign object blocking member 310 may be disposed on the side surfaces of the application holes 26a2 and 26b2, on the side surfaces of the placement hole 801 (e.g., the first to fourth side surfaces), and on the first region of the reinforcing member 900.

[0208] Here, the description of the first to fourth side surfaces 21a to 21d of the recess 80 can be applied to the side surfaces of the hole 801 (e.g., the first to fourth side surfaces).

[0209] For example, the first region of the reinforcing member 900 may be the region on the upper surface of the reinforcing member 900 located between the side surface of the image sensor 810 and the side surface (e.g., the first to fourth side surfaces) of the mounting hole 801 in the circuit board 800b. For example, the first region of the reinforcing member 900 may be the region on the upper surface of the reinforcing member 900 exposed by the application of grooves 26a2 and 26b2 and mounting recess 80.

[0210] The image sensor 810 can be disposed in the mounting hole 810 in the circuit board 800b. Alternatively, the image sensor 810 can be disposed on the reinforcing member 900.

[0211] The reinforcing member 900 can be located below the circuit board 800b.

[0212] The upper surface of the reinforcing member 900 may include an area on which the image sensor 810 is mounted, corresponding to the bore 801 in the circuit board 800b. (Hereinafter referred to as the mounting area)

[0213] An adhesive component (e.g., epoxy resin) can be provided between the lower surface of the circuit board 800b and the upper surface of the reinforcing member 900, and the circuit board 800b can be attached or fixed to the reinforcing member 900 by means of the adhesive component.

[0214] An adhesive member (e.g., epoxy resin) may be disposed between the lower surface of the image sensor 810 and the upper surface of the reinforcing member 900 (e.g., the mounting area), and the image sensor 810 may be attached or fixed to the reinforcing member 900 by means of the adhesive member. Although the adhesive member may be made of, for example, epoxy resin, thermosetting adhesive, UV-curing adhesive, adhesive film, etc., this disclosure is not limited thereto.

[0215] For example, the foreign object blocking member 310 may include a first epoxy resin disposed in the placement hole 801, and at least a portion of the first epoxy resin may be disposed in the application holes 26a2 and 26b2.

[0216] The image sensor 810b, which is disposed on the upper surface of the reinforcing member 900, can be electrically connected to the circuit board 800b via wires 51a and 51b.

[0217] The reinforcing member 900, which is a plate-shaped member with a predetermined thickness and hardness, can stably support the image sensor 810 and suppress damage to the image sensor caused by external impact or contact.

[0218] In addition, the reinforcing member 900 can improve the radiation effect of dissipating the heat generated by the image sensor 810.

[0219] For example, the reinforcing member 900 may be made of a metallic material with high thermal conductivity (such as stainless steel or aluminum), but is not limited thereto. In another embodiment, the reinforcing member 900 may be made of glass epoxy resin, plastic, synthetic resin, etc.

[0220] The reinforcing member 900 can be electrically connected to the grounding terminal of the circuit board 800b to serve as a ground to protect the camera device from ESD (electrostatic discharge).

[0221] Figure 8 This is an exploded three-dimensional representation of an embodiment of the lens moving device 100. Figure 9 This is an assembly 3D view of the lens moving device 100, which has been removed. Figure 8 The cover member 300 is shown. For example, Figure 8 The lens moving device 100 shown can be Figure 2 An embodiment of the lens mobile device shown.

[0222] Reference Figure 8 and Figure 9 The lens moving device 100 may include a spool 110, a first coil 120, a first magnet 130, a housing 140, an upper elastic member 150, a lower elastic member 160, and a second coil 230.

[0223] The lens moving device 100 may also include a first position sensor 170 and a second magnet 180 for AF feedback operation.

[0224] Additionally, the lens moving device 100 may also include a second position sensor 240 (240a and 240b) for OIS (Optical Image Stabilizer) feedback operation.

[0225] In addition, the lens moving device 100 may also include at least one of a third magnet 185, a circuit board 190, a support member 220, a circuit board 250, a base 210, and a cover member 300.

[0226] In the following text, the term "coil" may be used interchangeably with "coil unit", and the term "elastic member" may be used interchangeably with "elastic unit" or "spring".

[0227] First, the spool 110 will be described.

[0228] The spool 110 can be disposed in the housing 140 and can be moved in the optical axis OA direction or in a first direction (e.g., in the z-axis direction) by the electromagnetic interaction between the first coil 120 and the first magnet 130.

[0229] Figure 10 It is shown Figure 8 A three-dimensional view of the bobbin 110, the first coil 120, the second magnet 180, and the third magnet 185 shown.

[0230] refer to Figure 10 The spool 110 may have a bore or cavity, in which a lens or lens barrel is mounted. For example, the bore in the spool 110 may be a through hole formed by passing through the spool 110 in the optical axis direction. Although the bore in the spool 110 may have a circular, elliptical, or polygonal shape, this disclosure is not limited thereto.

[0231] The lens can be directly mounted in the bore of the spool 110, but is not limited thereto. In another embodiment, at least one lens barrel to which the lens is mounted or coupled can be coupled or mounted in the bore of the spool 110. The lens or lens barrel can be coupled to the inner circumferential surface 110a of the spool 110 in various ways.

[0232] The spool 110 may include a plurality of first sides 110b-1 spaced apart from each other and a plurality of second sides 110b-2 spaced apart from each other. Each of the plurality of second sides 110b-1 may connect two adjacent first sides to each other. For example, the length of each first side 110b-1 of the spool 110 in the horizontal or transverse direction may differ from the length of each second side 110b-2 in the horizontal or transverse direction, but is not limited thereto.

[0233] Furthermore, the spool 110 may have a protrusion 112 protruding along a second direction and / or a third direction on its outer surface. The protrusion 112 of the spool 110 can be used to prevent the spool 110 from directly colliding with the housing 140, even if the spool 110 moves beyond a predetermined range due to external impacts or the like during the process of moving along the optical axis for autofocusing. In addition, the protrusion 112 of the spool 110 can be used together with the recessed portion 146 in the housing 140 as a stop.

[0234] The spool 110 may have a first clearance groove 112a in its upper surface to avoid interference with the first frame connector 153 of the upper elastic member 150. For example, the first clearance groove 112a may be formed in the first side portion 110b-1 of the spool 110, but is not limited thereto.

[0235] The spool 110 may have a guide portion 111 on its upper surface for guiding the mounting position of the upper elastic member 150. For example, the guide portion 111 of the spool 110 may protrude from the upper surface of the spool 110 in a first direction (e.g., in the z-axis direction) to guide the frame connector 153 of the upper elastic member 150 along its path of movement, such as... Figure 10 As shown. For example, the guide portion 111 may be provided in the clearance groove 112a.

[0236] The spool 110 may include a first connector 113a or an upper support protrusion, which is connected and secured to the upper elastic member 150. Although the first connector 113a of the spool 110 may have a protrusion shape, this disclosure is not limited thereto. In another embodiment, the first connector 113a may be a groove or a flat surface.

[0237] The spool 110 may include a second connector (not shown) that is coupled to and secured to the lower resilient member 160. Although the second connector may have a protruding shape, this disclosure is not limited thereto. In another embodiment, the second connector of the spool 110 may be a groove or a flat surface.

[0238] The spool 110 may include a stop 116 that protrudes upward from its upper surface.

[0239] The stop 116 of the spool 110 can be used to prevent the upper surface of the spool 110 from directly colliding with the inner side of the upper plate of the cover member 300, even if the spool 110 moves beyond the specified range due to external impact or the like during the process of the spool 110 moving in the first direction for automatic focusing.

[0240] The spool 110 may have a coil mounting groove on its outer surface, in which the first coil 120 is mounted, assembled, or disposed. The coil mounting groove may have a groove structure formed by recesses from the outer surface 110b of the first and second sides 110b-1, 110b-2, and may have a shape consistent with the shape of the first coil 120, such as a closed curve shape (e.g., annular shape).

[0241] The spool 110 may have a second magnet mounting groove 180a formed in the outer surface 110b, in which the second magnet 180 is mounted, fixed or disposed.

[0242] The second magnet placement groove 180a in the spool 110 can be recessed from the outer surface 110b of the spool 110, and can have an opening formed in the upper surface of the spool 110, but is not limited thereto.

[0243] The second magnet mounting groove 180a in the spool 110 may be located above the coil mounting groove in which the first coil 120 is disposed, and may be spaced apart from the coil mounting groove, but is not limited thereto.

[0244] In addition, the spool 110 may have a third magnet mounting groove 185a formed in its upper surface, in which the third magnet 185 is mounted, assembled, fixed or disposed.

[0245] The third magnet mounting groove 185a can be recessed from the outer surface 110b of the spool 110, and can have an opening formed in the upper surface of the spool 110, but is not limited thereto.

[0246] The third magnet mounting groove 185a in the spool 110 may be located above the coil mounting groove in which the first coil 120 is disposed, and may be spaced apart from the coil mounting groove, but is not limited thereto.

[0247] The second magnet mounting groove 180a can be formed in one of the plurality of second sides 110b-2 of the linear shaft 110, and the third magnet mounting groove 185a can be formed in the other of the plurality of second sides 110b-2 of the linear shaft 110.

[0248] The third magnet mounting groove 185a can be positioned facing the second magnet mounting groove 180a. For example, the second magnet mounting groove 180a and the third magnet mounting groove 185a can be formed in two facing second sides of the linear shaft 110.

[0249] Since the second magnet 180 and the third magnet 185 are set at the spool in a balanced state relative to the first position sensor 170, a weight balance can be established between the second magnet 180 and the third magnet 185, and the magnetic forces of the first magnet 130 and the second magnet 180 can cancel each other out on the first coil 120, thereby improving the accuracy of AF (autofocus) operation.

[0250] Next, the first coil 120 will be described.

[0251] The first coil 120 can be set on the outer surface 110b of the spindle 110.

[0252] Although the first coil 120 may be disposed below the second magnet 180 and the third magnet 180, this disclosure is not limited thereto. For example, although the first coil 120 may be disposed below the protrusion 112 of the spool 110, this disclosure is not limited thereto.

[0253] For example, although the first coil 120 may not overlap with the second magnet 180 and the third magnet 185 in the second or third direction, this disclosure is not limited thereto.

[0254] For example, the first coil 130 can be disposed in the coil mounting groove, the second magnet 180 can be assembled or disposed in the second magnet mounting groove 180a, and the third magnet 185 can be assembled or disposed in the third magnet mounting groove 185a.

[0255] Although each of the second magnet 180 and the third magnet 185 disposed at the spindle 110 may be spaced apart from the first coil 120, this disclosure is not limited thereto. In another embodiment, each of the second magnet 180 and the third magnet 185 disposed at the spindle 110 may be in contact with the first coil 120, or may overlap the first coil 120 in a second or third direction.

[0256] The first coil 120 may have a closed, curved shape (e.g., a ring shape) surrounding the outer surface 110b of the spool 110 in the rotational direction about the optical axis OA.

[0257] Although the first coil 120 can be directly wound around the outer surface 110b of the spool 110, this disclosure is not limited thereto. In another embodiment, the first coil 120 can be implemented as a coil loop wound around the spool 110, or it can be implemented as a coil block having an angled annular shape.

[0258] Power or a drive signal can be provided to the first coil 120. The power or drive signal provided to the first coil 120 can be a DC signal, an AC signal, or a combination of DC and AC signals, and can be a voltage-type signal or a current-type signal.

[0259] When power or a drive signal (e.g., drive current) is supplied to the first coil 120, an electromagnetic force can be generated through the electromagnetic interaction between the first coil 120 and the first magnet 130, and thus the generated electromagnetic force can be used to move the spool 110 along the direction of the optical axis OA.

[0260] At the initial position of the AF operation unit, the first coil 120 can be configured to correspond to or overlap with the first magnet 130 disposed on the housing 140 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis.

[0261] For example, the AF operation unit may include a spool 110 and components connected to the spool 110 (e.g., a first coil 120, a second magnet 180, and a third magnet 185).

[0262] The initial position of the AF operating unit can be the initial position of the AF operating unit when no power is applied to the first coil 1120, or it can be the initial position of the AF operating unit when the upper elastic member 150 and the lower elastic member 160 are elastically deformed only due to the weight of the AF operating unit.

[0263] Furthermore, the initial position of the spool 110 can be the position of the AF operating unit when gravity is applied from the spool 110 toward the base 210 or from the base 210 toward the spool 110.

[0264] Next, the second magnet 180 and the third magnet 185 will be described.

[0265] The second magnet 180 can be referred to as the sensing magnet because the second magnet 180 provides the magnetic field detected by the first position sensor 170. The third magnet 185 can be referred to as the balancing magnet because it eliminates the influence of the magnetic field of the sensing magnet 180 and establishes a weight balance relative to the sensing magnet 180.

[0266] The second magnet 180 can be disposed in the second magnet placement groove 180a in the linear shaft 110, and a portion of the surface of the second magnet 180 facing the first position sensor 170 can be exposed through the second magnet placement groove 180a.

[0267] For example, each of the second magnet 180 and the third magnet 185 located at the optical axis 110 can be configured such that the boundary plane between the N pole and the S pole is parallel to a direction perpendicular to the optical axis OA. For example, each of the surfaces of the second magnet 180 and the third magnet 185 facing the first position sensor 170 can be divided into N poles and S poles, but is not limited thereto.

[0268] In another embodiment, for example, each of the second magnet 180 and the third magnet 185 located at the optical axis 110 can be configured such that the boundary plane between the N pole and the S pole is parallel to the optical axis OA.

[0269] Although each of the second magnet 180 and the third magnet 185 may be a unipolar magnetized magnet comprising a single N pole and a single S pole, this disclosure is not limited thereto.

[0270] In another embodiment, each of the second magnet 180 and the third magnet 185 may be a bipolar magnetized magnet including two N poles and two S poles, or it may be a quadrupole magnetized magnet.

[0271] The second magnet 180 can move together with the spool 110 in the optical axis direction, and the first position sensor 170 can detect the magnetic field strength or magnetic force of the second magnet 180 moving in the optical axis direction and can output an output signal (e.g., output voltage) corresponding to the detection result.

[0272] For example, the magnetic field strength detected by the first position sensor 170 can vary according to the displacement of the spool 110 in the optical axis direction, and the first position sensor 170 can output an output signal proportional to the magnetic field strength detected by the first position sensor 170. The controllers 830 and 780 of the camera module or optical device (described later) can use the output signal from the first position sensor 170 to detect the displacement of the spool 110 in the optical axis direction, and can control the drive signal provided to the first coil 120 based on the detected displacement of the spool 110, thereby performing AF feedback operation.

[0273] A third magnet 185 can be disposed on the second side, facing the second magnet 180, wherein the second side of the third magnet 185 is positioned opposite the second side of the spool 110 where the second magnet 180 is disposed. Due to this orientation of the second magnet 180 and the third magnet 185, the magnetic field of the third magnet 185 can cancel the magnetic field of the second magnet 180 (the magnetic field of the second magnet affects the interaction between the first magnet 130 and the first coil 120), thus reducing or eliminating the influence of the magnetic field of the second magnet 180 on the AF operation, thereby improving the accuracy of the AF operation in this embodiment.

[0274] Next, the housing 140 will be described.

[0275] The housing 140 can accommodate the spool 110 and can support the first magnet 130 and the circuit board 190, on which the first position sensor 170 is located.

[0276] Figure 11 It is shown Figure 8 A perspective view of the housing 140 and the first magnet 130 shown. Figure 12 It is shown Figure 8 An exploded perspective view of the housing 140, the first position sensor 170, and the circuit board 190 shown.

[0277] refer to Figure 11 and Figure 12 The housing 140 may generally have a hollow cylindrical shape. For example, the housing 140 may have a polygonal (e.g., quadrilateral or octagonal) or circular bore or cavity. The bore in the housing 140 may be a through hole formed through the housing 140 in the optical axis direction.

[0278] The housing 140 may include a plurality of sides 141 and 142. For example, the housing 140 may include a plurality of first sides 141 spaced apart from each other and a plurality of second sides 142 spaced apart from each other.

[0279] Each first side 141 of the housing 140 may be disposed or positioned between two adjacent second sides 142 to connect the two adjacent second sides to each other, and may have a flat surface having a predetermined depth.

[0280] For example, the first side 141 of the housing 140 may be simply referred to as the side, while the second side 142 of the housing 140 may be located at a corner of the housing 140 and may therefore be alternatively referred to as the corner or corner portion.

[0281] For example, the number of first side portions 141 of the housing 140 is four, and the number of second side portions 142 is four, but it is not limited to this.

[0282] Although the horizontal length of each first side 141 of the housing 140 may be greater than the horizontal length of each second side 142, this disclosure is not limited thereto.

[0283] Each of the first sides 141-1 to 141-4 of the housing 140 may be configured to be parallel to a corresponding side plate of the cover member 300.

[0284] For example, the first side 141 of the housing 140 may correspond to the first side 110b-1 of the spool 110, and the second side 142 of the housing 140 may correspond to or face the second side 110b-2 of the spool 110.

[0285] The first magnet 130 may be disposed or mounted on the first side 141 of the housing 140. Each second side 142 of the housing 140 may be disposed between two adjacent first sides 141 to connect the two adjacent first sides to each other.

[0286] The housing 140 may have a mounting groove 146 formed at a position corresponding to the protrusion 112 of the spool 110.

[0287] For example, when the initial position of the spool 110 is set to a state where the lower surface of the protrusion 111 of the spool 110 contacts the bottom surface 146a of the mounting groove 146 in the housing 140, the autofocus function can be controlled in a single direction (e.g., in the positive z-axis direction starting from the initial position).

[0288] Alternatively, when the initial position is set such that the lower surface of the protrusion 111 of the spool is spaced a predetermined distance from the bottom surface 146a of the mounting groove 146 in the housing 140, the autofocus function can be controlled in two directions (e.g., in the positive z-axis direction and the negative z-axis direction from the initial position).

[0289] The housing 140 may include a first magnet placement portion 141a for receiving a first magnet 130, a placement groove 141-1 for receiving a circuit board 190, and a first position sensor placement groove 141-2 for receiving a first position sensor 170.

[0290] The first magnet placement portion 141a may be formed in the lower inner end of at least one first side portion 141 of the housing 140. For example, the first magnet placement portion 141a may be formed in the lower inner end of each of the four first side portions 141, and each of the first magnets 130-1 to 130-4 may be assembled or fixed to a corresponding first magnet placement portion.

[0291] The first magnet placement portion 141a in the housing 140 can be configured to have a recess whose size corresponds to the size of the first magnet 130. The bottom surface of the first magnet placement portion 141a of the housing 140 (facing the second coil 230) can have an opening formed therein, and the bottom surface of the first magnet 130 fixed to the first magnet placement portion 141a can face the second coil 230 in the optical axis direction.

[0292] The mounting recess 141-1 may be formed in the upper portion or end of a second side 142 of the housing 140. For ease of mounting of the circuit board 190, the mounting recess 141-1 may have a recessed structure with an open upper portion and side surfaces and a bottom, and may have an opening formed in the inner surface of the housing 140. The bottom of the mounting recess 141-1 may have a shape corresponding to or consistent with that of the plate 110.

[0293] The first position sensor mounting groove 141-2 may be formed in the bottom of the mounting groove 141-1, and may have a structure that is recessed from the bottom of the mounting groove 141-1, but is not limited thereto.

[0294] To facilitate the installation of the first position sensor 170, the first sensor mounting recess 141-2 may have a recess shape, which is open at its upper portion and has side surfaces and a bottom, and may have an opening formed in the inner surface of the second side 142 of the housing 140. The first position sensor mounting recess 141-2 may have a shape that corresponds to or matches the shape of the first position sensor 170.

[0295] Each of the first magnet 130 and the circuit board 190 can be secured to a corresponding one of the first magnet mounting portion 141a and mounting recess 141-1 via an adhesive member (e.g., epoxy resin or double-sided tape). The first position sensor 170 can be secured to the first position sensor mounting recess 141-2 via an adhesive member.

[0296] Each first side of the housing 140 may be configured parallel to a corresponding side plate of the cover member 300. The surface area of ​​each first side 141 of the housing 140 may be greater than the surface area of ​​each second side 142.

[0297] Each second side 142 of the housing 140 may have a through hole 147 that defines a path through which the support member 220 extends. For example, the housing 140 may have a through hole 147 formed through the upper portion of the second side 142.

[0298] In another embodiment, each through hole formed in the second side may have a structure recessed from the outer surface of the second side 142 of the housing 140, and at least a portion of the through hole may be open at the outer surface of the second side 142.

[0299] The number of through holes 147 in the housing 140 can be the same as the number of support members. The first end of the support member 220 can extend through the through hole 147 and can be connected or coupled to the upper elastic member 150.

[0300] To prevent the housing 140 from... Figure 8 The inner surface of the upper end of the cover member 300 shown directly impacts the housing 140, which may be provided with stop members 144-1 to 144-4 on its upper end.

[0301] For example, the second side 142 of the housing 140 may be provided with stop members 144-1 to 144-4 on its upper surface.

[0302] The housing 140 may include at least one upper support protrusion 143, which is connected to the outer frame 152 of the upper elastic member 150.

[0303] The upper support protrusion 143 of the housing 140 may be formed on the upper surface of at least one of the first side portion 141 and the second side portion 142 of the housing 140. For example, although the upper support protrusion 143 of the housing 140 may be provided on the upper surface of the second side portion of the housing 140, this disclosure is not limited thereto.

[0304] The housing 140 may have a lower support protrusion (not shown) on its lower surface, which is connected to and fixed to the outer frame 162 of the lower elastic member 160.

[0305] In order to provide space not only for defining the path through which the support member 220 extends, but also for receiving the gel-type silicone resin that can be used as a damper, the housing 140 may have a recess 142a formed in the lower part or end of the second side 142.

[0306] To reduce the vibration of the support member 220, at least one of the through hole 147 and the recess 142a in the housing 140 may be filled with a damping member (e.g., silicone resin).

[0307] The housing 140 may include at least one stop 149 protruding from the outer surface of the first side 141. When the housing 140 moves upward in a second direction and / or a third direction, the at least one stop 149 can prevent the housing 140 from colliding with the side plate of the cover member 300.

[0308] To prevent the lower surface of housing 140 from colliding with base 210 and / or circuit board 250, housing 140 may further include a stop protruding from its lower surface.

[0309] At the initial position of the AF operation unit, the first magnets 130-1 to 130-4 can be disposed at the housing 140 so as to partially overlap with the first coil 120 in a direction parallel to a straight line perpendicular to the optical axis OA and extending through the optical axis.

[0310] For example, each of the first magnets 130-1 to 130-4 may be fitted or disposed in a placement portion 141a in a corresponding first side 141 of the housing 140.

[0311] In another embodiment, the first magnets 130-1 to 130-4 may be disposed on the outer surface of the first side 141 of the housing 140 or on the inner or outer surface of the second side 142 of the housing 140.

[0312] Although each of the first magnets 130-1 to 130-4 may have a quadrilateral parallelepiped shape corresponding to the side 141 of the housing 140, this disclosure is not limited thereto. In another embodiment, a surface of the first magnet facing the corresponding surface of the first coil 120 may have a curvature corresponding to or consistent with the curvature of the corresponding surface of the first coil 120.

[0313] Each first magnet 130 may consist of a single body and may be configured such that its surface facing the first coil becomes the S pole and its opposite surface becomes the N pole. However, this disclosure is not limited thereto, and the first magnet 130 may be configured such that its surface facing the first coil 120 becomes the N pole and its opposite surface becomes the S pole.

[0314] First magnets 130-1 to 130-4 may be disposed and mounted on a first side of housing 140, with two or more first magnets facing each other.

[0315] For example, two pairs of first magnets 130-1 to 130-4 can be disposed at the first side 141 of the housing 140, such that the first magnets in each pair face each other. Here, each of the first magnets 130-1 to 130-4 can have an approximately quadrilateral shape or a triangular or rhomboid shape in a plan view.

[0316] In another embodiment, only one pair of first magnets may be disposed on two first sides of the housing 140 facing each other.

[0317] Figure 14 It is along Figure 9 The cross-sectional view of the lens moving device 100 is taken by line AB. Figure 15 It is along Figure 9 The image shows a cross-sectional view of the lens moving device 100 taken from the line CD.

[0318] Reference Figure 14 and Figure 15 Each of the second magnet 180 and the third magnet 185 may not overlap with the first coil 120 in a direction parallel to a line perpendicular to and extending through the optical axis OA, but is not limited thereto.

[0319] At the initial position of the AF operation unit, the second magnet 180 can overlap or align with the third magnet 185 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis.

[0320] At the initial position of the AF operation unit, the first position sensor 170 may overlap with each of the second magnet 180 and the third magnet 185 in a direction parallel to a line perpendicular to and extending through the optical axis OA, but is not limited thereto. In another embodiment, the first position sensor 170 may not overlap with at least one of the second magnet 180 and the third magnet 185 in a direction parallel to a line perpendicular to and extending through the optical axis OA.

[0321] Next, the first position sensor 170 and the circuit board 190 will be described.

[0322] Figure 13a It is shown Figure 12 Enlarged view of the circuit board 190 and the first position sensor 170 shown. Figure 13b yes Figure 13a The block diagram of the first position sensor 170 shown is shown.

[0323] Reference Figure 13a and Figure 13b The circuit board 190 may be disposed on one side of the housing 140. For example, the circuit board 190 may be disposed on one of the second sides 142 of the housing 140.

[0324] The first position sensor 170 can be disposed on or mounted on a circuit board 190 disposed on the housing 140, and can be fixed to the housing 140. For example, the circuit board 190 can be disposed in a mounting recess 14a in the housing 140. For example, the first position sensor 170 can move with the housing 140 during hand tremor correction operation.

[0325] The first position sensor 170 can detect the magnetic field strength of the second magnet 180 mounted on the spindle 110 when the spindle 110 moves, and can output an output signal corresponding to the detection result.

[0326] exist Figure 8 In the illustrated embodiment, although the first position sensor 170 can detect the magnetic field strength of the second magnet 180 and thus the displacement of the spool 110, this disclosure is not limited thereto. In another embodiment, the second and third magnets may be omitted, and the first position sensor 170 may output an output signal corresponding to the detection result of the magnetic field strength of the first magnet, and the output signal may be used to detect or control the displacement of the spool 110.

[0327] Although the first position sensor 170 may be located on the lower surface of the circuit board 190, this disclosure is not limited thereto. In another embodiment, the first position sensor 170 may be located at any of a variety of locations.

[0328] Here, the lower surface of the circuit board 190 can be the upper surface of the circuit board 190 facing the housing 140 or the surface that contacts the mounting groove 141-1 in the housing 140.

[0329] Reference Figure 13b The first position sensor 170 may include a Hall sensor 61 and a driver 62.

[0330] For example, the Hall sensor 61 can be made of silicon-based material. The output VH of the Hall sensor 61 can increase with increasing ambient temperature.

[0331] In another embodiment, the Hall sensor 61 may be made of GsAs, and the output VH of the Hall sensor 61 may vary with ambient temperature by -0.06% / The gradient of C.

[0332] The first position sensor 170 may further include a temperature sensing element 63 capable of detecting ambient temperature. The temperature sensing element 63 may output a temperature sensing signal Ts to the driver 62 based on the ambient temperature detected near the first position sensor 170.

[0333] For example, the Hall sensor 61 of the first position sensor 190 can generate an output VH based on the detected magnetic strength of the second magnet 180. For example, the output stage of the first position sensor 190 can be proportional to the magnetic strength of the second magnet 180.

[0334] The driver 62 can output a drive signal dV for driving the Hall sensor 61 and a drive signal Id1 for driving the first coil 120.

[0335] For example, driver 62 can use protocols (such as I2C communication) to receive clock signal SCL, data signal SDA, and power signals VDD and GND via data communication.

[0336] The driver 62 can use the clock signal SCL and the power signals VDD and GND to generate the drive signal dV for driving the Hall sensor 61 and the drive signal Id1 for driving the first coil 120.

[0337] Here, the first power signal GND can be ground voltage or 0V, and the second power signal VDD can be a predetermined voltage for driving the driver 62, and can be DC voltage and / or AC voltage, but is not limited thereto.

[0338] The driver 62 can receive the output VH from the Hall sensor 61 and can use protocols (such as I2C communication) to send the clock signal SCL and the data signal SDA related to the output VH of the Hall sensor 61 to the controllers 830 and 780 via data communication.

[0339] In addition, the driver 62 can receive the temperature sensing signal Ts detected by the temperature sensing element 63, and can send the temperature sensing signal Ts to the controller 830 via data communication using a protocol (such as I2C communication).

[0340] The controller 830 can perform temperature compensation on the output VH from the Hall sensor 61 based on the change in ambient temperature detected by the temperature sensing element 63 of the first position sensor 170.

[0341] For example, when the drive signal dV or bias signal of the Hall sensor 61 is 1mA, the output VH of the Hall sensor 61 of the first position sensor 170 can be in the range of -20mV to +20mV.

[0342] When temperature compensation is applied to the output VH of Hall sensor 61, if there is a negative gradient relative to the change in ambient temperature, the output VH of Hall sensor 61 of the first position sensor 170 can be in the range of 0 mV to +30 mV.

[0343] When the output of the Hall sensor 61 of the first position sensor 170 is plotted on the xy coordinate system, the reason why the output range of the Hall sensor 61 of the first position sensor 170 is represented in the first quadrant (e.g., 0 mV to +30 mV) ZH is as follows.

[0344] Because the outputs of Hall sensor 61 in the first quadrant of the xy coordinate system and Hall sensor 61 in the third quadrant of the xy coordinate system move in opposite directions depending on changes in ambient temperature, the accuracy and reliability of the Hall sensors may decrease when both the first and third quadrants are used as AF operation control areas. Therefore, to accurately compensate for changes in ambient temperature, a specific range in the first quadrant can be considered as the output range of Hall sensor 61 of the first position sensor 170.

[0345] The first position sensor 170 may include four terminals for transmitting and receiving clock signal SCL, data signal SDA, and power signals VDD and GND, as well as two terminals for providing drive signals to the first coil 120.

[0346] For example, the first position sensor 170 may include first to third terminals for a clock signal SCL and two power signals VDD and GND, a fourth terminal for data SDA, and fifth and sixth terminals for providing a drive signal to the first coil 120.

[0347] Each of the first to sixth terminals of the first position sensor 170 can be electrically connected to a corresponding terminal or pad 190-1 to 190-6 of the circuit board 190.

[0348] The circuit board 190 may include first to sixth terminals disposed on its upper surface, as well as circuit patterns or wiring (not shown).

[0349] Reference Figure 13a The circuit board 190 may include a body portion 90-1, a first bent portion 90-2 bent at one end of the body portion 90-1, and a second bent portion 90-3 bent at the other end of the body portion 190-2.

[0350] For example, the first curved portion 90-2 and the second curved portion 90-3 can be curved in the same direction relative to the body portion 90-1.

[0351] For example, the circuit board 190 disposed at the housing 140 may include a first side surface 6a facing the optical axis OA and a second side surface 6b positioned opposite to the first side surface 6a. The first side surface 6a of the circuit board 190 may have a flat shape, and the second side surface 6b of the circuit board 190 may have a curved shape.

[0352] exist Figure 13a Although the circuit board 190 is bent at both ends to allow easy attachment to the upper elastic member, this disclosure is not limited thereto. In another embodiment, the circuit board 190 may not have a bent shape, but may have a linear shape.

[0353] Although the first to sixth terminals 190-1 to 190-6 may be disposed on the upper surface of the circuit board 190 with the terminals spaced apart from each other to allow easy conductive connection to the upper elastic member 150, this disclosure is not limited thereto.

[0354] The circuit pattern or wiring (not shown) of the circuit board 190 can electrically connect the first to sixth terminals 190-1 to 190-6 to the first to sixth terminals of the first position sensor 170, and can be disposed on at least one of the upper and lower surfaces of the circuit board 190.

[0355] For example, circuit board 190 can be a printed circuit board or a flexible PCB (FPCB).

[0356] In another embodiment, the first position sensor 170 may be disposed on the upper surface of the circuit board 190, and terminals 190-1 to 190-4 may be disposed on the lower surface of the circuit board 190.

[0357] The first to sixth terminals 190-1 to 190-6 of the circuit board 190 can be electrically connected to the terminals of the circuit board 250 via the upper elastic member 150 and the support member 220, and thus the first position sensor 170 can be electrically connected to the circuit board 250.

[0358] In another embodiment, the first position sensor 170 may be implemented as a single position detection sensor, such as a Hall sensor.

[0359] Next, the upper elastic member 150, the lower elastic member 160, and the support member 220 will be described.

[0360] Figure 16a yes Figure 1 The plan view of the upper elastic member 150 shown. Figure 16b yes Figure 8 The plan view of the lower elastic member 160 shown. Figure 17 It is shown Figure 8 The figure shows an assembled perspective view of the upper elastic member 150, the lower elastic member 160, the base 210, the support member 220, the second coil 230, and the circuit board 250. Figure 18 It is shown Figure 8An exploded perspective view of the second coil 230, circuit board 250, base 210, and second position sensor 240 shown.

[0361] Reference Figures 16a to 18 The upper elastic member 150 and the lower elastic member 160 can elastically support the spool 110 relative to the housing 140.

[0362] The upper elastic member 150 can be connected to the upper part, upper end or upper surface of the spool 110, and the lower elastic member 160 can be connected to the lower part, lower end or lower surface of the spool 110.

[0363] For example, the upper elastic member 150 can be connected to both the upper part, upper end, or upper surface of the spool 110 and the upper part, upper end, or upper surface of the housing 140, and the lower elastic member 160 can be connected to both the lower part, lower end, or lower surface of the spool 110 and the lower part, lower end, or lower surface of the housing 140.

[0364] The support member 220 can support the housing 140 to allow the housing 140 to move in a direction perpendicular to the optical axis, and at least one of the upper elastic member 150 and the lower elastic member 160 can be electrically connected to the circuit board 250.

[0365] Reference Figure 16a The upper elastic member 150 may include a plurality of upper elastic units 150-1 to 150-8 that are electrically isolated from each other. Although Figure 16a Eight upper elastic units electrically isolated from each other are shown, but this disclosure is not limited thereto.

[0366] The upper elastic member 150 may include first to sixth upper elastic units 150-1 to 150-6, which are directly coupled to and electrically connected to the first to sixth terminals 191-1 to 191-6 of the circuit board 190.

[0367] In addition, the upper elastic member 150 may also include a seventh and a eighth upper elastic unit 150-7 and 150-8, which are non-conductively connected to the first to sixth terminals 191-1 to 191-6 of the circuit board 190.

[0368] Multiple upper elastic units may be disposed at the first corner portion of the housing 140 where the circuit board 190 is disposed, and at least one upper elastic unit may be disposed at each of the remaining second to fourth corner portions other than the first corner portion.

[0369] For example, four upper elastic units 150-1 to 150-4 can be disposed at the first corner of the housing 140, two upper elastic units 150-5 and 150-8 can be disposed at the second corner of the housing, one upper spring 150-6 can be disposed at the third corner of the housing 140, and one upper spring can be disposed at the fourth corner of the housing 140. This is done to allow the upper elastic units 150-1 to 150-6 to be easily coupled to the six terminals 190-1 to 190-6 of the circuit board 190.

[0370] The upper elastic units 150-1, 150-6, 150-7 and 150-8, respectively located at the first to fourth corners of the housing 140, can be connected to both the upper part of the housing 140 and the upper part of the spool 110.

[0371] At least one of the first to fourth upper elastic units 150-1 to 150-4 may include a first inner frame 151 connected to the spool 110, a first outer frame 152 connected to a corresponding one of the first to fourth corner portions of the housing 140, and a first frame connector 153 connecting the first inner frame to the first outer frame.

[0372] At least one of the fifth to eighth upper elastic units 150-5 to 150-8 may include a first inner frame 151 connected to the spool 110, a first outer frame 152 connected to a corresponding one of the first to fourth corner portions of the housing 140, and a first frame connector 153 connecting the first inner frame to the first outer frame.

[0373] For example, the first inner frame 151 may have a through hole h1 for connecting to a first connector 113a of the spool 110, while the outer frame 152 may have a through hole h2 for connecting to an upper support protrusion 143 of the housing 140.

[0374] refer to Figure 16a The first to fourth upper elastic units 150-1 to 150-4 disposed at the first corner portion of the housing 140 may each include first connectors 410a to 410d, which are connected to the first corner portion of the housing 140.

[0375] The first connectors 410a to 410d of the first to fourth upper elastic units 150-1 to 150-4 may be respectively provided with contacts P2 to P5, each contact being in contact with or connected to a corresponding one of the first to sixth terminals 191-1 to 191-6 of the circuit board 190.

[0376] Each contact P2 to P5 may extend or protrude from one end of a corresponding one of the first connectors 410a to 410d, and may be bonded to a corresponding terminal of the circuit board 190 by solder or conductive adhesive.

[0377] The first outer frame of each of the first upper elastic unit 150-1 and the fourth upper elastic unit 150-4 may be provided with a third connector 590, which is connected to one end of a corresponding one of the first support member 220-1 and the fourth support member 220-4.

[0378] The second upper elastic unit 150-2 and the third upper elastic unit 150-3 can be disposed between the first upper elastic unit 150-1 and the fourth upper elastic unit 150-4.

[0379] The second upper elastic unit 150-2 and the third upper elastic unit 150-3 may each include: second connectors 430a and 430b, which are connected to the second support member 220-2 and the third support member 220-3; and connectors 420a and 420b, which connect the first connectors 410b and 410c to the second connectors 430a and 430b.

[0380] The first outer frame 152, which is respectively disposed at the second to fourth corner portions of the housing 140, including the fifth to eighth upper elastic units 150-5 to 150-8, may include: first connectors 510, 560 and 570, connected to the second to fourth corner portions of the housing 140; second connectors 520a, 520b, 570a and 570b, connected to the fifth to eighth support members 220-5 to 220-8; and connectors 530a, 530b, 580a and 580b, connecting the first connectors 510, 560 and 570 to the second connectors 520a, 520b, 570a and 570b.

[0381] Using solder or conductive adhesive components (e.g., conductive epoxy resin) 901 (see Figure 17 The second support member 220-2 and the third support member 220-3 can be electrically connected to the second connectors 430a and 430b, and the fifth to eighth support members 220-5 to 220-8 can be electrically connected to the second connectors 520a, 520b, 570a and 570b.

[0382] The first connecting members 410a to 410d, 510, 560 and 570 of the first outer frame of the first to fourth upper elastic members 150-1 to 150-4 and the fifth to eighth upper elastic members 150-5 to 150-8 may include one or more connecting regions connected to the housing 140, and each connecting region may be implemented as a through hole.

[0383] Although each of the second connectors 420a, 420b, 520a, 520b, 570a and 570b and the third connector 590 may have a through hole, the present disclosure is not limited thereto. In another embodiment, the through hole may be replaced with any one of various structures capable of being coupled to the housing 140, for example, a groove.

[0384] Each of the connectors 430a, 430b, 530a, 530b, 580a and 580b may have a shape bent at least once, and a width W2 of each of the connectors 430a, 430b, 530a, 530b, 580a and 580b may be smaller than a width W1 of the first frame connector 153 of the upper elastic member 150 (W2<W1).

[0385] Because the width W2 is smaller than the width W1 (W2<W1), the connectors 430a, 430b, 530a, 530b, 580a and 580b can easily move in the optical axis direction, so that stress applied to the upper elastic member 150 and stress applied to the support member 220 can be distributed.

[0386] Although in this embodiment, the width W1 of the first frame connector 153 of the upper elastic member 150 is greater than the width of each of the second frame connectors 163-1 and 163-2 of the lower elastic member 160, the present disclosure is not limited thereto.

[0387] For example, the first outer frames 152 of the sixth and seventh upper elastic units 150-6 and 150-6 may be symmetrical with respect to the reference lines 501 and 502. In addition, the outer frame units 150-5 and 150-8 of the fifth and eighth upper elastic units may be bilaterally symmetrical with each other on both sides with respect to the reference line 501 (bilaterally symmetrical).

[0388] The reference line 501 may be a straight line extending through the central point 101 (see Figure 16a ) and extending through vertices of the opposite second and third corner portions of the housing 140, and the reference line 502 may be a straight line extending through the central point 101 (see Figure 16a ) and extending through vertices of the opposite first and fourth corner portions of the housing 140. For example, the central point 101 may be the center of the spool 110 or the center of the housing 140, and the corners of the housing 140 may be formed as stoppers 144-1 to 144-4.

[0389] The fifth upper spring 150-5 located at the second corner portion may include a first upper extension frame 154a that extends from one end of the first connector 570 of the first outer frame 152a toward the first corner portion. For example, the first upper extension frame 154a may be connected to the first outer frame 152a at one end and to a terminal 190-1 of the circuit board 190 at the other end.

[0390] Furthermore, the sixth upper spring 160-6 located at the third corner portion may include a second upper extension frame 154b that extends from one end of the first connector 510 of the first outer frame 152 toward the first corner portion. For example, the second upper extension frame 154b may be connected to the first outer frame 152 at one end and to a terminal 190-6 of the circuit board at the other end.

[0391] The first upper extension frame 154a and the second upper extension frame 154b may be provided with contacts P1 and P6 respectively, and each contact is in contact with or connected to one of the first to sixth pads 191-1-191-6 of the circuit board 190.

[0392] Each of the first upper extension frame 154a and the second upper extension frame 154b may have a through hole h3, which is connected to a corresponding one of the upper support protrusions of the housing 140.

[0393] The first connectors 410a to 410d, 510, 560, and 570 may contact the upper surface of the corner portion 142 of the housing 140 and may be supported by the corner portion 142 of the housing 140. Meanwhile, connectors 430a, 430b, 530a, 530b, 580a, and 580b may not contact the upper surface of the housing 140, but may be spaced apart from the housing 140. To prevent oscillation due to vibration, the space between connectors 430a, 430b, 530a, 530b, 580a, and 580b and the housing 140 may be filled with a damper (not shown).

[0394] Reference Figure 16b The lower elastic member 160 may include a plurality of lower elastic units 160-1 and 160-2.

[0395] For example, each of the first upper elastic unit 160-1 and the second upper elastic unit 160-2 may include: second inner frames 161-1 and 161-2, which are coupled or fixed to the lower part of the second spool 110; second outer frames 162-1 to 162-3, which are coupled or fixed to the lower part of the housing 140; second frame connectors 163-1 and 163-2, connecting the second inner frames 161-1 and 161-2 to the second outer frames 162-1 and 162-2; and connecting frames 164-1 and 164-2, connecting the second outer frames to each other.

[0396] Although the width of each connecting frame 164-1 and 164-2 may be smaller than the width of each first inner frame, this disclosure is not limited thereto.

[0397] To avoid spatial interference with the second coil 230 and the first magnets 130-1 to 130-4, the connecting frames 164-1 and 164-2 can be positioned outside the second coils 230-1 to 230-4 and the first magnets 130-1 to 130-4. Here, the outer side of the second coils 230-1 to 230-4 and the first magnets 130-1 to 130-4 can be the side opposite to the center of the spool 110 or the center of the housing 140, relative to the second coils 230-1 to 230-4 and the first magnets 130-1 to 130-4.

[0398] For example, although connecting frames 164-1 and 164-2 may not overlap with the second coils 230-1 to 230-4 in the optical axis direction, this disclosure is not limited thereto. In another embodiment, at least a portion of connecting frames 164-1 and 164-2 may be aligned with or overlap with the second coils 230-1 to 230-4 in the optical axis direction.

[0399] A first connecting protrusion 165-1 may be provided at the part where the connecting frame 164-1 of the first lower elastic unit 160-1 and the second outer frame 162-2 are connected to each other, and the other end of the first support member 220-1 is attached to the first connecting protrusion.

[0400] A second connecting protrusion 165-2 may be provided at the point where the connecting frame of the second upper elastic unit 160-2 connects to the second outer frame, and the other end of the fourth support member 220-4 is attached to the second connecting protrusion. Each of the first connecting protrusion 165-1 and the second connecting protrusion 165-2 may have a through hole 165a, and the other end of a corresponding one of the first support member 220-1 and the fourth support member 220-4 is attached to the through hole.

[0401] Each of the upper elastic units 150-1 to 150-8 and upper elastic units 160-1 and 160-2 can be implemented as a leaf spring. However, the upper elastic units are not limited to this and can be implemented as a coil spring, etc.

[0402] The outer frame (e.g., 152 or 162) may be alternatively referred to as the exterior, the inner frame (e.g., 151 or 161) may be alternatively referred to as the interior, and the support component (e.g., 220) may be alternatively referred to as the conductor.

[0403] Next, support members 220-1 to 220-8 will be described.

[0404] Support members 220-1 to 220-8 may be configured to correspond to the second side or corner portion 142 of the housing 140.

[0405] The support member 220 can electrically connect two of the upper elastic units 150-1 to 150-8 (e.g., 150-1 and 150-4) to the first lower elastic unit 160-1 and the second lower elastic unit 160-2. Furthermore, the support member 220 can electrically connect the other four of the upper elastic units 150-1 to 150-8 (e.g., 150-2, 150-3, 150-5, and 150-6) to the circuit board 250.

[0406] Support members 220-1 to 220-8 can electrically connect at least one of the upper elastic units located at at least one corner portion of the housing 140 to the circuit board.

[0407] One end of each of the support members 220-2, 220-3, 220-5 and 220-8 can be directly connected or combined to the second connectors 420a, 420b, 520a, 520b, 570a and 570b of the corresponding one of the second, third and fifth to eighth upper elastic members 150-2, 150-3, 150-5 to 150-8.

[0408] The other end of each support member 220-2, 220-3 and 220-5 to 220-8 can be directly connected or combined to circuit board 250.

[0409] One end of each support member 220-1 and 220-4 can be directly connected or coupled to a third connector 590 of a corresponding one of the first upper elastic unit 220-1 and the fourth upper elastic unit 220-4. The other end of each of the support members 220-1 and 220-4 can be directly connected or coupled to a through hole 165a formed in a corresponding one of the first connecting protrusion 165-1 and the second connecting protrusion 165-2 of the lower elastic units 160-1 and 160-2.

[0410] A single contact can be formed between each of the second connectors 420a, 420b, 520a, 520b, 570a, and 570b and a corresponding one of the first connectors 410b, 410c, 510, 560, and 570b through a corresponding one of the connectors 430a, 430b, 530a, 530b, 580a, and 580b.

[0411] For example, support members 220-2, 220-3, and 220-5 to 220-8 may extend through through holes 147 formed in the corner portions of the housing 140 (see...). Figure 11 Meanwhile, support members 220-1 and 220-4 can be located near the boundary line between the first side portion 141 and the corner portion 142 of the housing 140, and can not extend through the corner portion 142 of the housing 140.

[0412] Each of the support members 220-1 to 220-4 can independently and electrically connect one of the first to fourth upper elastic units 150-1 to 150-4 to the circuit board 250.

[0413] In order to support the housing 140 in a balanced state by means of symmetrical orientation, each of the sixth and seventh support members 220-6 and 220-7 may include two support members 220-6a and 220-6b or 220-7a and 220-7b, which are connected or combined to the sixth upper elastic member 150-6 or the seventh upper elastic member 150-7, and at least one of the two support members 220-6a and 220-6b or 220-7a and 220-7b may be electrically connected to the circuit board 250.

[0414] The first coil 120 can be directly connected to or combined with the second inner frame of the first lower elastic unit 160-1 and the second lower elastic unit 160-2.

[0415] The four terminals 191-1, 191-3, 191-4 and 191-6 of the circuit board 190 can be electrically connected to the four corresponding terminals of the circuit board 250 via four corresponding upper elastic units 150-5, 150-2, 150-3 and 150-6 and four corresponding support members 220-5, 220-2, 220-3 and 220-6.

[0416] Meanwhile, the two terminals 191-2 and 191-5 of the circuit board 190 can be electrically connected to the first coil 120 via two corresponding upper elastic units 150-1 and 150-4, two support members 220-1 and 220-4, and the first lower elastic unit 160-1 and the second lower elastic unit 160-2.

[0417] The six terminals 191-1 to 191-6 of the circuit board 190 and the first position sensor 190 can be electrically connected to each other, and four of the six terminals 191-1 to 191-6 of the circuit board 190 (e.g., 191-1, 191-3, 191-4 and 191-6) can be electrically connected to the circuit board 250.

[0418] The clock signal SCL and power signals VDD and GND can be transmitted and received between the first position sensor 170 and the circuit board 250 through four terminals of the circuit board 190 (e.g., 191-1, 191-3, 191-4 and 191-6), the upper elastic units 150-2, 150-3, 150-5 and 150-6 connected to these four terminals, and the support members 220-2, 220-3, 220-5 and 220-6 connected to these four terminals.

[0419] Each support member 220 may be implemented as a conductive member that provides elastic support, such as a suspension wire, leaf spring, or coil spring. In another embodiment, the support member 220 may be integrally formed with the upper elastic member 150.

[0420] exist Figure 17 In the illustrated embodiment, although the second terminal 191-2 and the fifth terminal 191-5 of the circuit board 190 are connected to the first and second lower elastic units via the first support member 220-1 and the fourth support member 220-4, and thus to the first coil 120, this disclosure is not limited thereto.

[0421] In another embodiment, the first coil 120 may be incorporated into the first inner frame of two of the upper elastic units 150-2, 150-5 and 150-6, and the first support member 220-1 and the fourth support member 220-4 may be omitted.

[0422] In another embodiment, one end of the first coil 120 may be connected to the second inner frame of one of the first and second lower elastic units 160-1 and 160-2, and the other end of the first coil 120 may be connected to the first inner frame of one of the upper elastic units 150-2, 150-5 and 150-6, and at least one of the first support member 220-1 and the fourth support member 220-4 may be provided.

[0423] Next, the base 210, the circuit board 250, and the second coil 230 will be described.

[0424] refer to Figure 18 The base 210 may have bores corresponding to bores in the spool 110 and / or bores in the housing 140, and may have a shape corresponding to or consistent with the shape of the cover member 300, for example, a square shape.

[0425] The base 210 may include a stepped portion 211 to which adhesive is applied when the cover member 300 is fixed to the base 210 by adhesive. Here, the stepped portion 211 can guide the cover member 300 connected to the upper side of the base, and the side plate of the cover member 300 can contact the stepped portion 211.

[0426] The lower end of the side plate of the cover member 300 can be adhesively bonded or fixed to the stepped portion 211 of the base 210 using an adhesive or the like.

[0427] A support member 255 may be provided in the area of ​​the base 210 facing the terminal 251 of the circuit board 250. The support member 255 may support the terminal member 253 of the circuit board 250, on which the terminal 251 is formed.

[0428] The base 210 may have a recess 212 in the region corresponding to the corner of the cover member 300. When the corner of the cover member 300 has a protrusion, the protrusion of the cover member 300 may be connected to the second recess 212.

[0429] The upper surface of the base 210 may be provided with mounting grooves 215-1 and 215-2, in which a second position sensor 240, including OIS position sensors 240a and 240b, is disposed. The lower surface of the base 210 may be provided with a mounting portion (not shown), to which the filter 610 of the camera module 200 is mounted.

[0430] The upper surface of the base 210 surrounding the bore may be provided with a protrusion 19, which connects to the bore 25a in the circuit board 250 and the bore in the circuit component 231.

[0431] The protrusion 19 on the base 210 may have a protrusion 19a on its side surface, which is connected to the groove 18a in the coil plate 231 and the groove 8a in the circuit board 250.

[0432] The second coil 230 can be positioned below the magnet 130 located in the housing 140, and can also be positioned on the circuit board 250.

[0433] OIS position sensors 240a and 240b can be mounted, surface-mounted, or disposed on circuit board 250, and can be disposed in mounting recesses 215-1 and 215-2 in base 210.

[0434] OIS position sensors 240a and 240b can detect the displacement of the OIS operation unit in a direction perpendicular to the optical axis. Here, the OIS operation unit may include an AF operation unit and components mounted on the housing 140.

[0435] For example, the OIS operation unit may include an AF operation unit and a housing 140. In some embodiments, the OIS operation unit may further include first magnets 130-1 to 130-4. For example, the AF operation unit may include a spool 110 and components mounted on and moving with the spool 110. For example, the AF operation unit may include a spool 110 and a lens (not shown), a first coil 120, and first and second magnets 180 and 185 mounted on the spool 110.

[0436] The circuit board 250 may be disposed on the upper surface of the base 210 and may have a bore 25a corresponding to the bore in the spool 110, the bore in the housing 140 and / or the bore in the base 210. The outer peripheral surface of the circuit board 250 may have a shape that is consistent with or corresponds to the upper surface of the base 210, for example, a quadrilateral shape.

[0437] The circuit board 250 may include at least one terminal member 253 that is bent from the upper surface of the circuit board and is provided with a plurality of terminals 251 or pins to which external electrical signals are provided. Although the circuit board 250 may include, for example, two terminal members facing each other, this disclosure is not limited thereto.

[0438] The terminal component 253 of the circuit board 250 may be provided with terminals 251.

[0439] Drive signals can be provided to the first coil 120 and the second coil 230 respectively via terminal 251 on terminal member 253 mounted on circuit board 250.

[0440] Signals SCL, SDA, VDD, and GND used for data communication with the first position sensor 190 can be transmitted and received via multiple terminals 251 mounted on terminal members 253 of the circuit board 250.

[0441] The drive signal can be provided to the OIS position sensors 240a and 240b via a plurality of terminals 251 mounted on the terminal member 253 of the circuit board 250, and the terminals 251 can receive the signals output from the OIS position sensors 240a and 240b and output the signals to the outside.

[0442] The inner circumferential surface of the circuit board 250 formed by the hole 25a may be provided with a groove 8a, which is connected to the protrusion 19a of the base 210.

[0443] The drive signal provided to the first coil 120 and / or the second coil 230 can be a DC and / or AC signal, and can be of current type or voltage type.

[0444] In the embodiments, although the circuit board 250 may be an FPCB, this disclosure is not limited thereto, and the terminals of the circuit board 250 may be directly formed on the surface of the base 210 by surface electrode technology.

[0445] To avoid spatial interference with support members 220-1 to 220-8, circuit board 250 may have clearance grooves 250a formed in its corners or apexes.

[0446] In another embodiment, instead of the clearance groove 250a, the corners or apexes of the circuit board 250 may be provided with holes through which the support members 220-1 to 220-8 extend.

[0447] For example, although support members 220-1 to 220-8 may be electrically connected to the lower surface of circuit board 250 or to a circuit pattern formed on the lower surface via solder or the like, this disclosure is not limited thereto.

[0448] In another embodiment, the circuit board 250 may not have clearance recesses or holes formed therein, and the support members may be electrically connected to circuit patterns or pads formed on the upper surface of the circuit board 250 via solder or the like.

[0449] In another embodiment, the support member may be electrically connected to the coil plate 231, and the coil plate 231 may electrically connect the support member to the circuit board 250.

[0450] The second coil 230 may be positioned below the spool 110 and / or the housing 140.

[0451] For example, the second coil 230 may be disposed on the upper surface of the circuit board 250 so as to face or overlap with the first magnets 130-1 to 130-4 disposed in the housing 140.

[0452] Figure 19 yes Figure 18 The plane of the second coil 230 shown Figure 18 . Figure 20 yes Figure 19 The second coil 230 shown is viewed from below. Figure 19 . Figure 21 yes Figure 19 The cross-sectional view of the dashed section in the figure.

[0453] Reference Figures 19 to 21 The second coil 230 may include a coil plate 231 and coil units 230-1 to 230-4 disposed on the coil plate 231 and corresponding to the first magnets 130-1 to 130-4. The coil plate 231 may alternatively be referred to as a circuit component or a plate.

[0454] The coil plate 231 may have a polygonal shape (e.g., a quadrilateral shape).

[0455] For example, coil plate 231 may include four sides S11 to S14 and four corners S2, and may have bores (or cavities) 231a corresponding to bores in housing 140, bores in circuit board 250 and / or bores in base 210.

[0456] Figure 19 The coil plate 231 shown can be a unit coil plate. The process of forming the unit coil plate 231 is as follows.

[0457] First, a plate comprising multiple unit coil plates is prepared. Then, to shape the unit coil plates, a first laser cutting operation is performed, along... Figure 19 The coil plate 231 shown is cut at its sides S11 to S14. At this time, the plate may include bridging members, each bridging member connecting two adjacent corners of two adjacent unit coil plates.

[0458] Subsequently, a second laser cutting operation is performed, cutting the coil plate 231 along corner S2. In this second laser cutting operation, the bridging element may also be cut along with the corner, and burrs may be generated at the cutting area of ​​the bridging element. This is because the laser power required to cut the portion of the coil plate 231 that includes Cu (e.g., coil units or dummy patterns) is different from the laser power required to cut the portion of the coil plate 231 that does not include Cu.

[0459] In this embodiment, burrs may be generated at the corners of the unit coil plate 231 during its formation. However, since each corner of the coil plate 231 is provided with a clearance groove to avoid spatial interference with the support component, even if burrs are formed, friction with the cover component will not occur, and no foreign matter will be generated.

[0460] Because burrs are formed at the corners of the unit coil plate, the roughness of the corner S2 of the coil plate 231 can be higher than the roughness of the sides S11 to S14 of the coil plate 231.

[0461] Meanwhile, when each bridging member connects the sides of two adjacent unit coil plates to each other, during the second laser cutting operation, burrs (such as grooves or protrusions) may be locally generated at the side of the unit coil plate where the bridging member has been removed, and foreign objects may be generated due to contact or collision between the side plate of the cover member and the side of the coil plate 231.

[0462] Each corner S2 of the coil plate 231 can be located between two adjacent sides of the coil plate 231, and the two adjacent sides can be connected to each other.

[0463] Each coil unit 230-1 to 230-4 may face or overlap with a corresponding one of the first magnets 130-1 to 130-4 in the optical axis direction.

[0464] Each of the first to fourth coil units 230-1 to 230-4 may have a closed curve shape (e.g., annular shape) including a central hole, and the central hole may be formed in the optical axis direction.

[0465] For example, the first coil unit 230-1 and the second coil unit 230-2 can be configured to face each other in the lateral direction (e.g., in the x-axis direction), and the third coil unit 230-3 and the fourth coil unit 230-4 can be configured to face each other in the vertical direction (e.g., in the y-axis direction).

[0466] Each of the first to fourth coil units 230-1 to 230-4 can be located at a corresponding one of the four sides S1 of the coil plate 231.

[0467] For example, each of the first coil unit 230-1 and the second coil unit 230-2 may be arranged parallel to a corresponding one of the first side S11 and the second side S12 facing each other on the coil plate 231, and each of the third coil unit 230-3 and the fourth coil unit 230-4 may be arranged parallel to a corresponding one of the first side S11 and the second side S12 facing each other.

[0468] To avoid spatial interference with the support members 220-1 to 220-8, each corner S2 of the coil plate 231 may have a clearance groove 23 formed therein, and the support members 220-1 to 220-8 may be positioned near the clearance groove 23 in the coil plate 231. In another embodiment, to avoid spatial interference between the coil plate 231 and the support members 220-1 to 220-8, the corners of the coil plate 231 may be provided with through holes instead of clearance holes 23.

[0469] The inner circumferential surface of the coil plate 231 formed by the bore 231a may be provided with a groove 18a, which is connected to a protrusion 19a on the base 210.

[0470] refer to Figure 20 The coil plate 231 may include at least one terminal.

[0471] For example, coil plate 231 may include terminals Q1 to Q8. Figure 20 Although the coil board 231 includes eight terminals, this disclosure is not limited thereto.

[0472] In another embodiment, the coil plate 231 may include four terminals (e.g., Q1 to Q4). In this case, the first coil unit 230-1 and the second coil unit 230-2 may be connected to each other, and the third coil unit 230-3 and the fourth coil unit 230-4 may be connected to each other. The first coil unit 230-1 and the second coil unit 230-2, which are connected to each other, may be electrically connected to two terminals (e.g., Q1 and Q2), and the third coil unit 230-3 and the fourth coil unit 230-4, which are connected to each other, may be electrically connected to two other terminals (e.g., Q3 and Q4).

[0473] In another embodiment, coil plate 231 may include six terminals (e.g., Q1 to Q6). In this case, two coil units facing each other may be connected to each other and may be electrically connected to two terminals (e.g., Q1 and Q2). Two other coil units facing each other may not be connected to each other. One of the two unconnected coil units may be electrically connected to the other two terminals (e.g., Q3 and Q4), while the other of the two unconnected coil units may be electrically connected to the remaining two terminals (e.g., Q5 and Q6).

[0474] At least one of the terminals Q1 to Q8 of the coil plate 231 can be electrically connected to the coil units 230-1 to 230-4. The terminals of the coil plate 231 may alternatively be referred to as pads, conductive bodies, electrodes, or bonding portions.

[0475] The terminals Q1 to Q8 of the coil plate 231 can be arranged to abut against the inner circumferential surface or inner surface of the coil plate 231 formed by the hole 231a. For example, the terminals Q1 to Q8 of the coil plate 231 can be arranged to be spaced apart from each other along the inner circumferential surface or inner surface of the coil plate 231.

[0476] For example, the lower surface of each terminal Q1 to Q8 of the coil plate 231 can be exposed from the lower surface of the coil plate 231.

[0477] The circuit board 250 may include at least one pad corresponding to at least one terminal of the coil board 231.

[0478] For example, circuit board 250 may include pads 25-1 to 25-4, and each pad 25-1 to 25-4 of circuit board 250 may be electrically connected to a corresponding terminal (e.g., Q1 to Q4) of coil board 231. Although circuit board 250 includes four pads 25-1 to 25-4 connected to the four terminals Q1 to Q4 of coil board 231, this disclosure is not limited thereto. Depending on the conductive connection relationship of coil units 230-1 to 230-5, circuit board 250 may include two, three, five or more pads for conductive connection to the coil units.

[0479] The coil plate 231 may include a first mark 271, and the circuit board 250 may include a second mark 281 corresponding to the first mark 281. Although the first mark 271 may be located, for example, between the first coil unit 230-1 and the fourth coil unit 230-4, this disclosure is not limited thereto. The first mark 271 and the second mark 281 may be used as marks for properly aligning the terminals Q1 to Q4 of the coil plate 231 with the pads 25-1 to 25-4 of the circuit board 250 during the operation of electrically connecting the terminals Q1 to Q4 of the coil plate 231 to the pads 25-1 to 25-4 of the circuit board 250.

[0480] In another embodiment, the second coil 230 may include a coil unit for a second direction and a coil unit for a third direction, and may include four or more second coil units.

[0481] The housing 140 can be moved in a second direction and / or a third direction (e.g., in the x-axis direction and / or the y-axis direction) by electromagnetic force generated by the interaction between the first magnets 130-1 to 130-4, which are arranged to face each other in the optical axis direction, and the second coil units 230-1 to 230-4. For example, controllers 830 and 780 can perform shakiness correction on the lens moving device 100 by controlling the drive signals provided to the coil units 230-1 to 230-4.

[0482] The lens moving device 100 may also include a second position sensor 240 for OIS feedback operation. The second position sensor 240 may include a first OIS position sensor 240a and a second OIS position sensor 240b.

[0483] Each OIS position sensor 240a and 240b can be a Hall sensor, and any sensor can be used as long as it can detect the strength of the magnetic field. For example, each position sensor 240a and 240b can be implemented as a driver that includes a Hall sensor, or it can be implemented simply as a position detection sensor (such as a Hall sensor).

[0484] For example, although the first OIS position sensor 240a and the second OIS position sensor 240b can be disposed or mounted on the lower surface of the circuit board 250, and the first and second OIS sensors 240a and 240b can be disposed in the mounting recesses 215-1 and 215-2 in the base 210, this disclosure is not limited thereto. In another embodiment, the first and second OIS position sensors 240a and 240b can be disposed on the upper surface of the circuit board 250.

[0485] At least a portion of the first OIS position sensor 240a may overlap with the first coil unit 230-1 in the optical axis direction, and at least a portion of the second OIS position sensor 240b may overlap with the fourth coil unit 230-4 in the optical axis direction.

[0486] The first OIS position sensors 240a and 240b can be electrically connected to terminals 251 of the circuit board 250. For example, a drive signal can be provided to the first OIS position sensors 240a and 240b via terminals 251 of the circuit board, and a second output from the first OIS position sensors 240a and 240b can be output via terminals 251 of the circuit board 250.

[0487] The controller 830 of the camera module or the controller 780 of the portable terminal 200A can use the first output of the first OIS position sensor 240a and the second output of the second OIS position sensor 240b to sense or detect the displacement of the OIS operation unit, and can perform OIS feedback control on the OIS operation unit based on the detected displacement of the OIS operation unit.

[0488] The cover member 300 can accommodate at least one of the following components in the space defined between the cover member 300 and the base 210: spool 110, first coil 120, first magnet 130, housing 140, upper elastic member 150, lower elastic member 160, first position sensor 170, second magnet 180, third magnet 185, circuit board 190, support member 220, second coil 230, second position sensor 240, and circuit board 250.

[0489] The cover member 300 may have a box shape, which is open at its lower part and includes a top plate and side plates, and the lower part of the cover member 300 may be connected to the upper part of the base 210. The top plate of the cover member 300 may have a polygonal shape, such as a quadrilateral or an octagonal shape.

[0490] The cover member 300 may have a bore or cavity through which its upper plate is formed, through which a lens (not shown) coupled to the spool 110 is exposed to external light. Although the cover member 300 may be made of a non-magnetic material (such as stainless steel) to prevent attraction by the first magnet 130, this disclosure is not limited thereto. In another embodiment, the cover member may be made of a magnetic material.

[0491] For example, the length L1 of the first coil unit 230-1 may be different from the length L2 of the second coil unit 230-2, and the length of the third coil unit 230-3 may be different from the length of the fourth coil unit 230-4, but is not limited thereto. In another embodiment, the two lengths may be equal to each other. Furthermore, for example, the length L1 of the first coil unit 230-1 and the length of the third coil unit 230-3 may be equal to each other, and the length L2 of the second coil unit 230-2 and the length of the fourth coil unit 230-4 may be equal to each other, but is not limited thereto. In another embodiment, the two lengths may be different from each other.

[0492] For example, the width W1 of the first coil unit 230-1 and the width W2 of the second coil unit 230-2 can be equal to each other, and the widths of the third coil unit 230-3 and the fourth coil unit 230-4 can be equal to each other, but are not limited thereto. In another embodiment, the two widths can be different from each other. Furthermore, for example, the width W1 of the first coil unit 230-1 and the width of the third coil unit 230-3 can be equal to each other, and the widths of the second coil unit 230-2 and the fourth coil unit 230-4 can be equal to each other, but are not limited thereto. In another embodiment, the two widths can be different from each other.

[0493] Reference Figure 19 and Figure 21 The first coil unit 230-1 can be disposed in a first region between the first side S11 of the coil plate 231 and the bore 231a in the coil plate 231, and can have a first number of turns. The second coil unit 230-2 can be disposed in a second region between the second side S12 of the coil plate 231 and the bore 231a in the coil plate 231, and can have a second number of turns. The third coil unit 230-3 can be disposed in a third region between the third side S13 of the coil plate 231 and the bore 231a in the coil plate 231, and can have a third number of turns. The fourth coil unit 230-4 can be located in a fourth region between the fourth side S14 of the coil plate 231 and the bore 231a in the coil plate 231, and can have a fourth number of turns.

[0494] Each of the first to fourth coil units 230-1 to 230-4 may include a wire with a plurality of turns.

[0495] For example, each of the first to fourth coil units 230-1 to 230-4 may have a continuous spiral, elliptical and / or track-shaped pattern.

[0496] For example, line PA1 can be made of a conductive body. For example, line PA1 can be made of a conductive metal (e.g., copper, gold, aluminum, silver, or an alloy including at least one of them).

[0497] The line PA1 of each of the first to fourth coil units 230-1 to 230-4 can be formed in the corresponding one of the first to fourth regions of the coil plate 231.

[0498] Each of the first to fourth coil units 230-1 to 230-4 may include a first layer (layer 11) and a second layer (layer 12) disposed on the first layer (layer 11).

[0499] The first layer (layer 11) can have a continuous spiral, elliptical, or orbital shape. In addition, the second layer (layer 12) can have a continuous spiral, elliptical, or orbital shape.

[0500] The first layer (layer 11) and the second layer (layer 12) can overlap each other in the optical axis direction and can have the same linewidth.

[0501] Although Figure 21 Only the first and second layers of the first coil unit 230-1 are shown, but for Figure 14 The description of the first layer (layer 11) and the second layer (layer 12) shown can also be applied to the first and second layers of the second to third coil units 230-2 to 230-4.

[0502] Although the thickness T1 of the first layer (layer 11) and the thickness T1 of the second layer (layer 12) can be equal, this disclosure is not limited thereto. In another embodiment, the two thicknesses can be different from each other.

[0503] The first layer (layer 11) of each of the first to fourth coil units 230-1 to 230-4 may include multiple first lines R1 to Rn (n is a natural number greater than 1, n> 1), and the first lines are disposed in the corresponding one of the first to fourth regions of the coil plate 231.

[0504] Furthermore, the second layer (layer 12) of each of the first to fourth coil units 230-1 to 230-4 may include multiple second lines P1 to Pn (n is a natural number greater than 1, n>1), which are disposed in the corresponding one of the first to fourth regions of the coil plate 231. The first lines R1 to Rn or the second lines P1 to Pn may alternatively be referred to as conductive lines or coil pattern lines.

[0505] For example, although the first wires R1 to Rn and the second wires P1 to Pn may be aligned or overlap each other in the optical axis direction, this disclosure is not limited thereto. For example, although the number of first wires R1 to Rn and the number of second wires P1 to Pn may be the same, this disclosure is not limited thereto. In another embodiment, the two numbers may be different from each other.

[0506] Each of the first to fourth coil units 230-1 to 230-4 may include a via 55a that connects one end of one of the first wires R1 to Rn (e.g., R1) to one end of one of the second wires P1 to Pn (e.g., P1).

[0507] Two of the first to fourth coil units 230-1 to 230-4 can be connected to each other, and the two connected coil units can be electrically connected to two pads of the coil board 231.

[0508] Two of the remaining coils in the first to fourth coil units 230-1 to 230-4 can be connected to each other, and these two remaining coil units connected to each other can be electrically connected to two remaining pads of the coil board 231.

[0509] For example, one end of the first coil unit 230-1 and one end of the second coil unit 230-2 can be connected to each other, the other end of the first coil unit 230-1 can be connected to a pad (e.g., Q1) of the coil board 231, and the other end of the second coil unit 230-2 can be connected to another pad (e.g., Q2) of the coil board 231.

[0510] Furthermore, one end of the third coil unit 230-3 and one end of the fourth coil unit 230-4 can be connected to each other, the other end of the third coil unit 230-3 can be connected to another pad (e.g., Q3) of the coil board 231, and the other end of the fourth coil unit 230-4 can be connected to another pad (e.g., Q4) of the coil board 231.

[0511] The conductive connection between the first to fourth coil units 230-1 to 230-4 and the pads of the coil board 231 is not limited to the above-described manner, and the first to fourth coil units 230-1 to 230-4 and the pads of the coil board 231 can be connected to each other in various ways.

[0512] Reference Figure 21 The second coil 230 may include: a first insulating layer 71; a first layer (layer 11) of the first to fourth coil units 230-1 to 230-4 disposed on the first insulating layer 71; a second insulating layer 73 disposed on the first layer (layer 11, layer 21); a second layer (layer 12) of the first to fourth coil units 230-1 to 230-4 disposed on the second insulating layer 73; and a third insulating layer 75 disposed on the second layer.

[0513] Each of the first insulating layer 71 and the third insulating layer 75 may include a resin layer made of resin (e.g., epoxy resin) and a polyimide layer (or polyimide tape) including polyimide. For example, each of the first insulating layer 71 and the third insulating layer 75 may include a solder resist.

[0514] The second insulating layer 73 may include a polymeric organic compound or a resin. For example, the second insulating layer 73 may include polyimide and epoxy bond.

[0515] For example, the first layer (layer 11) of each of the first to fourth coil units 230-1 to 230-4 may be disposed between the first insulating layer 71 and the second insulating layer 73, and the second layer (layer 12) of each of the first to fourth coil units 230-1 to 230-4 may be disposed between the second insulating layer 73 and the third insulating layer 75.

[0516] The second coil 230 may further include: a fourth insulating layer 72 disposed between the first wires R1 to Rn and S1 to Sm of each of the first to fourth coil units 230-1 to 230-4; and a fifth insulating layer 74 disposed between the second wires P1 to Pn of each of the first to fourth coil units 230-1 to 230-4.

[0517] In other words, the fourth insulating layer 72 can be disposed between the first insulating layer 71 and the second insulating layer 73, and the fifth insulating layer 74 can be disposed between the second insulating layer 73 and the third insulating layer 75.

[0518] For example, each of the first insulating layer 75 and the third insulating layer 75 may alternatively be referred to as a capping layer.

[0519] For example, the coil plate 231 may include first to fifth insulating layers 71 to 75, and the first layer (layer 11) of each of the first to fourth coil units 230-1 to 230-4 may be formed between the first insulating layer 71 and the second insulating layer 73, and the second layer (layer 12) may be formed between the second insulating layer 73 and the third insulating layer 75. Terminals Q1 to Q8 of the coil plate 231 may be formed below the second insulating layer 73.

[0520] Figure 22 It is along Figure 9 A partial cross-sectional view of coil plate 231 taken from line CD.

[0521] Reference Figure 21 and Figure 22 The second insulating layer 73 may include a polyimide layer 73a. The second insulating layer 73 may further include an adhesive 73b1 disposed on the upper surface of the polyimide layer 73a. The second insulating layer 73 may further include an adhesive 73b2 disposed on the lower surface of the polyimide layer 73a.

[0522] For example, adhesives 73b1 and 73b2 may include epoxy bonds.

[0523] For example, the first insulating layer 71 may include a first resin layer 7a1 disposed below the fourth insulating layer 72 and the first layer (layer 11). The first insulating layer 71 may further include a first polyimide layer 7b1 disposed below the first resin layer 7a1.

[0524] The first insulating layer 71 may further include a first adhesive 7c1 disposed between the first resin layer 7a1 and the first polyimide layer 7b1.

[0525] For example, the third insulating layer 75 may include a second resin layer 7a2 disposed on the fifth insulating layer 74 and the second layer (layer 12). The third insulating layer 75 may further include a second polyimide layer 7b2 disposed on the second resin layer 7a2.

[0526] The third insulating layer 75 may further include a second adhesive 7c2 disposed between the second resin layer 7a2 and the second polyimide layer 7b2.

[0527] For example, the thickness K11 of the second polyimide layer 7b2 can be in the range of 25µm to 75µm, and the thickness K21 of the second resin layer 7a2 can be in the range of 12.5µm to 50µm.

[0528] For example, although the thickness of the first polyimide layer 7b1 may be equal to the thickness K11 of the second polyimide layer 7b2, this disclosure is not limited thereto. The two thicknesses may be different from each other.

[0529] Although the thickness of the first resin layer 7a1 can be equal to the thickness K21 of the second resin layer 7a2, this disclosure is not limited thereto. The two thicknesses can be different from each other.

[0530] For example, although the thicknesses of polyimide layers 7b2 and 7b1 may be equal to or greater than the thicknesses of resin layers 7a and 7a2, this disclosure is not limited thereto. In another embodiment, the thicknesses of polyimide layers 7b2 and 7b1 may be less than the thicknesses of resin layers 7a and 7a2, respectively.

[0531] For example, although the thickness T1 of each of the first layer (layer 11) and the second layer (layer 12) can be in the range of 45µm to 50µm, this disclosure is not limited thereto.

[0532] The lower surface 40a of each terminal Q1 to Q8 of the coil plate 231 is exposed from the first insulating layer 71, and the first side surface 40b of each terminal Q1 to Q8 of the coil plate 231 may be open or exposed at the inner circumferential surface 41 formed by the hole 231a in the coil plate 231. Here, the first side surface 40b of each of the terminals Q1 to Q8 of the coil plate 231 may be the side surface of each of the terminals Q1 to Q8 of the coil plate 231 facing the inner circumferential surface 40b of the coil plate 231.

[0533] For example, the lower surface 40a of each terminal Q1 to Q8 of the coil plate 231 can be exposed by removing a portion of the first insulating layer 71. For example, the lower surface 40a of each terminal Q1 to Q8 of the coil plate 231 can be exposed downward in the optical axis direction.

[0534] The first side surface 40b of each terminal Q1 to Q8 of the coil plate 231 may be located at surface 401, which is the same surface as the inner circumferential surface 41 of the coil plate 231.

[0535] For example, the first side surface 40b can form a single surface 401, which is the same as the inner circumferential surface 41 of the coil plate 231.

[0536] The first side surface 40b of each terminal of the coil plate 231 may be exposed in the central direction of the bore 231a or in the optical axis direction of the coil plate 231.

[0537] For example, the first side surface 40b of each terminal of the coil plate 231 may be a curved surface and may have the same radius of curvature as the inner circumferential surface 41 of the coil plate 231, but is not limited thereto. In another embodiment, the two radii of curvature may be different from each other.

[0538] The exposed lower surface 40a of each terminal Q1 to Q8 of the coil plate 231 can be positioned higher than the lower surface of the first insulating layer 71 (e.g., the lower surface of the first polyimide layer 7a1).

[0539] The thickness of each terminal Q1 to Q8 of the coil plate 231 and the thickness of the first layer (layer 11) can be equal to each other. This is because the first layer (layer 11) of each of the first to fourth coil units 230-1 to 230-4 and the conductive layer (e.g., copper layer) for the terminals Q1 to Q8 of the coil plate 231 can be located between the first insulating layer 71 and the second insulating layer 73, and can be patterned simultaneously.

[0540] In another embodiment, the thickness of each terminal Q1 to Q8 of the coil plate 231 and the thickness of the first layer (layer 11) of each of the first to fourth coil units 230-1 to 230-4 may be different from each other. For example, the thickness of each terminal Q1 to Q8 of the coil plate 231 may be greater than or less than the thickness of the first layer (layer 11).

[0541] Figure 23a Cut lines for forming bores and terminals of a conventional coil plate 31 are shown. Figure 23b The burr 36 formed during the operation of forming a bore in the coil plate 31 is shown.

[0542] refer to Figure 23a and Figure 23b A laser is used to cut along the cutting line 51 of the coil plate 31, thereby forming a bore in the coil plate 31. When the terminal 35 is positioned spaced apart from the cutting line 51, the terminal 35 may not be exposed on the inner circumferential surface of the coil plate 31, and burrs 36 may be generated on the inner circumferential surface of the coil plate 31 due to laser cutting. Therefore, burrs 36 may degrade the solderability between the terminal 35 of the coil plate 31 and the pads (or solder pads) of the circuit board (e.g., 250), thereby impairing the conductive contact between the two terminals.

[0543] Figure 24 The terminal Q1 of the coil plate 231 according to this embodiment and the cutting line 51 for forming a bore in the coil plate 231 are shown. Figure 25a The terminal Q1 of coil board 231 and the pad 25-1 of coil board 250 are shown. Figure 25b It shows that Figure 25a The terminal Q1 of the coil board 231 shown is connected to the conductive adhesive component 80 of the pad 25-1 of the circuit board 250.

[0544] exist Figures 24 to 25b The description of the terminal Q1 of the coil board 231 and the pads (e.g., 25-1) of the circuit board 250 can also be applied to the remaining terminals Q2 to Q8 of the coil board 231 and the remaining pads 25-1 to 25-4 of the circuit board 250.

[0545] refer to Figures 24 to 25bThe terminals (e.g., Q1) of the coil plate 231 can be formed to overlap with the cutting line 51. When the coil plate 231 is cut along the cutting line 51 to form a bore, the side surface 40b of the terminal (e.g., Q1) can be exposed at the inner circumferential surface 41 of the coil plate 231, and the exposed side surface 40b of the terminal (e.g., Q1) can be made to be the same surface as the inner circumferential surface 41 of the coil plate 231. Therefore, no burrs are formed due to laser cutting, and thus poor conductive contact between the terminals (e.g., Q1) of the coil plate 231 and the pads (e.g., 25-1) of the circuit board 250 can be prevented.

[0546] Furthermore, since the side surface 40b of the terminal Q1 of the coil plate 231 is exposed at the inner circumferential surface 41 of the coil plate 231, the conductive adhesive component or solder 80 can be disposed at the exposed side surface 40b of the terminal Q1, and the contact area between the conductive adhesive component or solder 80 and the terminal Q1 of the coil plate 231 can be increased, thereby improving solderability.

[0547] The circuit board 250 may include holes 25a and pads (e.g., 25-1) located in the circuit board 250, which are formed on the inner circumferential surface 26a of the circuit board 250 at positions corresponding to the terminals (e.g., Q1) of the coil board 231.

[0548] The size or diameter of the bore 231a in the coil plate 231 can be smaller than the size or diameter of the bore 25a in the circuit board 250.

[0549] For example, the inner circumferential surface 26a of the circuit board 250 may be located outside the inner circumferential surface 41 of the coil board 231.

[0550] For example, although the distance between the inner circumferential surface 26a of the circuit board 250 and the inner circumferential surface 41 of the coil plate 231 may be less than the thickness of the circuit board 250, this disclosure is not limited thereto. In another embodiment, the distance between the inner circumferential surface 26a of the circuit board 250 and the inner circumferential surface 41 of the coil plate 231 may be equal to or greater than the thickness of the circuit board 250.

[0551] For example, although the distance between the inner circumferential surface 26a of the circuit board 250 and the inner circumferential surface 41 of the coil plate 231 may be greater than the thickness of the coil plate 231, this disclosure is not limited thereto. In another embodiment, the distance between the inner circumferential surface 26a of the circuit board 250 and the inner circumferential surface 41 of the coil plate 231 may be equal to or less than the thickness of the coil plate 231.

[0552] For example, the pads 25-1 of the circuit board 250 may have side surfaces 59c exposed at the inner circumferential surface 26a of the circuit board 250. For example, the pads 25-1 of the circuit board 250 may have side surfaces 59c exposed toward the center of the bore 25a in the circuit board 250.

[0553] For example, the pads (e.g., 25-1) of the circuit board 250 may be exposed at at least one of the upper surface, side surface and lower surface of the circuit board 250.

[0554] For example, the pads (e.g., 25-1) of circuit board 250 may include: a first portion 59a (see Figure 18 The first portion is exposed on the upper surface of circuit board 250; the second portion 59b (see...) Figure 25a The second portion is exposed on the lower surface of the circuit board 260; and the third portion 59c connects the first portion 59a to the second portion 59b. Although the pads of the circuit board 250 may be conductive layers, such as Au layers or Au plating, this disclosure is not limited thereto.

[0555] The third portion 59c of the pad 25-1 of the circuit board 250 can be disposed on the inner circumferential surface of the circuit board 250. In order to increase the contact area with the solder, the third portion 59c of the circuit board 250 can have a recessed shape or groove shape formed by recessing from the inner circumferential surface of the circuit board 250.

[0556] Although the third portion 59c of the pad 25-1 of the circuit board 250 may have a curved surface, such as a semi-circular via shape, this disclosure is not limited thereto.

[0557] For example, a groove may be formed in the inner circumferential surface 26a of the circuit board 250, and the pads 25-1 of the circuit board 250 may include the third portion 59c, which is formed in the groove in the circuit board 250.

[0558] While the radius of curvature of the curved surface (or the groove in the circuit board 250) of the third portion 59c of the pad 25-1 of the circuit board 250 may be smaller than the radius of curvature of the inner circumferential surface 41 of the bore 231a in the coil board 231, this disclosure is not limited thereto. In another embodiment, the radius of curvature of the curved surface of the third portion 59c may be equal to or greater than the radius of curvature of the inner circumferential surface 41 of the bore 231a.

[0559] Although the length K1 of the second portion 59b of the pad 25-1 of the circuit board 250 can be equal to the length K2 of the terminal Q1 of the coil board 231 (K1=K2), this disclosure is not limited thereto. In another embodiment, the length K1 can be greater than the length K2 (K1>K2). In yet another embodiment, the length K1 can be less than the length K2 (K1=K2). <K2)。

[0560] Here, length K1 can be the shortest distance between the two ends of the second portion 59b that is close to the inner circumferential surface 41 of the circuit board 250, or the diameter of the second portion 29b of the circuit board 250. Length K2 can be the distance between the two ends of the terminal Q1 that is close to the inner circumferential surface 41 of the coil plate 231.

[0561] For example, length K1 can be from 0.4mm to 1.6mm, and length K2 can be from 0.4mm to 2mm. For example, the diameter of the third part 59c of pad 25-1 of circuit board 250 can be from 0.3mm to 0.6mm.

[0562] Although the thickness T3 of the pad 25-1 of the circuit board 250 can be 100µm-140µm, this disclosure is not limited thereto. Although the thickness of the terminal Q1 of the coil board 231 can be 40µm-60µm, this disclosure is not limited thereto.

[0563] The thickness T3 of pad 25-1 on circuit board 250 can be less than the length K1 (T3) of pad 25-1 on circuit board 250. <K1)。

[0564] For example, the ratio (T3:K1) of the thickness T3 of the pad 25-1 of the circuit board 250 to the length K1 of the pad 25-1 can be 1:2.5 to 1:6.

[0565] Although the length of the first portion 59a of the pad 25-1 of the circuit board 250 can be equal to the length K2 of the terminal Q1 of the coil board 231, this disclosure is not limited thereto. In another embodiment, the length of the first portion 59a can be greater than or less than the length K2 of the terminal Q1 of the coil board 231.

[0566] Although the length of the first portion 59a of the pad 25-1 of the circuit board 250 may be equal to the length K1, this disclosure is not limited thereto.

[0567] For example, the pads (e.g., 25-1) of the circuit board 250 may overlap with at least a portion of the terminals (e.g., Q1) of the coil board 231 in the optical axis direction.

[0568] The conductive adhesive component 80 can contact, connect, or attach to the exposed side surface 59c of the pad 25-1 of the circuit board 250. Furthermore, the conductive adhesive component 80 can contact, connect, or attach to the exposed side surface 40b of the terminal 25-1 of the coil board 231.

[0569] The conductive adhesive component or solder 80 may be disposed on, contact with, connected to or attached to at least one of the first to third portions 59a to 59c of the pads (e.g. 25-1) of the circuit board 250 and the terminals (e.g., Q1) of the coil board 231.

[0570] The coil board 231 may include virtual layers, virtual patterns, or virtual lines 45 to increase durability.

[0571] Typically, when the cover layer of the coil plate 231 is formed of resin (such as epoxy resin), burrs may be generated at the cut surface during the cutting operation used to form the bore or unit coil plate, and thus foreign matter caused by the burrs may be generated.

[0572] Furthermore, since resin layers (such as epoxy resin layers) are easily scratched, foreign objects may be generated during the handling of coil board 231 due to impact or scratching, and such foreign objects may cause malfunction of the lens moving device or degrade the image quality of the image sensor of the camera module.

[0573] like Figure 22 As shown, since each of the first insulating layer 71 and the third insulating layer 75 of the second coil 230 includes a polyimide layer 7b1 or 7b2 on the surface of its resin layer 7a1 or 7a2, this embodiment is able to suppress the generation of contaminants at the coil plate 231 due to cutting, impact or scratching.

[0574] The lens mobile device 100 according to the above embodiments can be implemented in various fields as, for example, a camera module or an optical device, or used in a camera module or optical device.

[0575] For example, the lens-mounted mobile device 100 according to the embodiment may be included in an optical instrument designed to form an image of an object in space using reflection, refraction, absorption, interference, diffraction, etc., as optical properties, to expand vision, record or reproduce an image obtained through a lens, perform optical measurements, or propagate or transmit an image. For example, the optical instrument according to the embodiment may be a smartphone or portable terminal equipped with a camera.

[0576] Furthermore, the lens-mounted mobile device 100 of this embodiment can also be included in an optical instrument designed to form an image of an object in space using light properties such as reflection, refraction, absorption, interference, and diffraction, to expand vision, record or reproduce an image obtained through a lens, perform optical measurements, or propagate or transmit an image. For example, the optical instrument according to the embodiment can be a smartphone or portable terminal equipped with a camera.

[0577] Figure 26 This is a perspective view showing a portable terminal 200A according to an embodiment. Figure 27 It is shown Figure 26 The view shown illustrates the configuration of the portable terminal 200A.

[0578] Reference Figure 26 and Figure 27 The portable terminal 200A (hereinafter referred to as the "terminal") may include a main body 850, a wireless communication unit 710, an audio / video (A / V) input unit 720, a sensing unit 740, an input / output unit 750, a storage unit 760, an interface unit 770, a controller 780, and a power supply unit 790.

[0579] exist Figure 8 The body 850 shown is in the shape of a bar, but is not limited to this, and can be any of various types (such as, for example, sliding type, folding type, swing type or rotating type, etc.), wherein two or more sub-bodies are connected to be movable relative to each other.

[0580] The body 850 may include a shell (e.g., outer casing, housing, or cover) that defines the appearance of the terminal. For example, the body 850 may be divided into a front shell 851 and a rear shell 852. Various electronic components of the terminal may be housed in the space defined between the front shell 851 and the rear shell 852.

[0581] The wireless communication unit 710 may include one or more modules that enable wireless communication between the terminal 200A and the wireless communication system or between the terminal 200A and the network to which the terminal 200A resides. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a near-field communication module 714, and a location information module 715.

[0582] The A / V input unit 720 is used to input audio or video signals and may include, for example, a camera 721 and a microphone 722.

[0583] Camera 721 may include, according to Figure 1 or Figure 6The camera 200 of the camera device 200, 200-1 shown in the embodiment.

[0584] The sensing unit 740 can sense the current state of the terminal 200A, such as whether the terminal 200A is on or off, the position of the terminal 200A, whether there is a user touch, the orientation of the terminal 200A, or the acceleration / deceleration of the terminal 200A, and can generate sensing signals to control the operation of the terminal 200A. When the terminal 200A is, for example, a slider mobile phone, the sensing unit 740 can sense whether the slider mobile phone is on or off. In addition, the sensing unit 740 can sense the power supply from the power supply unit 790, the connection between the interface unit 770 and external devices, etc.

[0585] The input / output unit 750 is used to generate, for example, visual, auditory, or tactile inputs or outputs. The input / output unit 750 can generate input data to control the operation of the terminal 200A, and can display processed information on the terminal 200A.

[0586] The input / output unit 750 may include a keyboard unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 730 can generate input data in response to input on the keyboard.

[0587] Display module 751 may include a plurality of pixels, the color of which changes in response to an electrical signal applied thereto. For example, display module 751 may include at least one of liquid crystal display, thin-film transistor liquid crystal display, organic light-emitting diode, flexible display, and 3D display.

[0588] The audio output module 752 can output audio data received from the wireless communication unit 710, such as call signal receiving mode, call mode, recording mode, voice recognition mode, or broadcast mode, or it can output audio data stored in the storage unit 760.

[0589] The touchscreen panel 753 can convert the capacitance change caused by the user touching a specific area of ​​the touchscreen into an electrical input signal.

[0590] Storage unit 760 can temporarily store programs for processing and control by controller 780, as well as input / output data (e.g., telephone numbers, messages, audio data, still images, moving images, etc.). For example, storage unit 760 can store images captured by camera 721, such as pictures or moving images.

[0591] Interface unit 770 serves as a path through which the lens mobile device connects to an external device connected to terminal 200A. Interface unit 770 can receive power or data from external components and transmit it to various components within terminal 200A, or it can transmit data from within terminal 200A to external components. For example, interface unit 770 may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting to a device equipped with an identification module, an audio input / output (I / O) port, a video input / output (I / O) port, a headphone port, etc.

[0592] The controller 780 can control the overall operation of the terminal 200A. For example, the controller 780 can perform control and processing related to, for example, voice calls, data communications, and video calls.

[0593] The controller 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented in the controller 180 or may be implemented separately from the controller 780.

[0594] The controller 780 can perform a pattern recognition process, which can recognize written or drawn inputs performed on the touch screen as characters and images, respectively.

[0595] When receiving external or internal power under the control of controller 780, power supply unit 790 can provide the power required to operate each component.

[0596] At least one embodiment includes the features, configurations, effects, etc., described in the above embodiments; however, the present invention is not limited to these embodiments. Furthermore, the features, configurations, effects, etc., exemplified in the various embodiments can be combined with other embodiments or modified by those skilled in the art. Therefore, anything relating to these combinations and modifications should be interpreted as falling within the scope of the embodiments.

[0597] [Industrial Applicability]

[0598] The embodiments can be applied to lens mobile devices, camera modules, and optical devices including such camera modules that can improve the reliability of wire bonding and allow for easy application of foreign object blocking components.

Claims

1. A lens-mounted device, comprising: Base; A coil plate is disposed on the base and includes a first bore, a second coil, and a terminal electrically connected to the second coil. The housing is disposed on the coil plate; A bobbin is disposed within the housing; A first magnet is disposed in the housing so as to be opposite the second coil in the optical axis direction; as well as The solder pad portion is electrically connected to the terminals of the coil board. The terminals of the coil plate are arranged along the inner circumferential surface of the coil plate formed by the bore. The solder pads are provided corresponding to the terminals of the coil board. The pad portion includes a concave shape, such that a portion of the first surface of the pad portion is exposed, and The conductive adhesive component or solder is disposed on the exposed portion of the first surface of the pad portion to electrically connect the terminals of the coil board to the pad portion.

2. The lens moving device according to claim 1, wherein, The pad portion includes: The first part faces the terminal in the direction of the optical axis; The second part is disposed opposite to the first part in the optical axis direction; and The third part connects the first part and the second part, and The third part includes a curved surface.

3. The lens moving device according to claim 1, wherein, The terminals of the coil plate include side surfaces exposed on the inner circumferential surface of the coil plate.

4. The lens moving device according to claim 1, wherein, The conductive adhesive component contacts the terminals and the pad portion of the coil board.

5. The lens moving device according to claim 1, wherein, At least a portion of the terminals of the coil board overlaps with the pad portion in the optical axis direction.

6. The lens moving device according to claim 3, wherein, The exposed side surface of the terminal of the coil plate forms the same surface as the inner circumferential surface of the coil plate.

7. The lens moving device according to claim 1, wherein, The terminals of the coil plate are exposed from the lower surface of the coil plate.

8. The lens moving device according to claim 1, wherein, The second coil includes four coils spaced apart from each other, the terminals of the coil board include four terminals corresponding to the four coils, and the pad portion includes four pads corresponding to the four terminals. Two of the four terminals are connected to two of the four coils, and the other two terminals are connected to the other two coils.

9. The lens moving device according to claim 1 further includes a first coil disposed on the spool. in, The spool is configured to move along the optical axis direction through the interaction between the first coil and the first magnet.

10. The lens moving device according to claim 1, wherein, The housing is configured to move in a direction perpendicular to the optical axis through the interaction between the second coil and the first magnet.

11. The lens moving device according to claim 1, further comprising: An upper elastic member connects the upper part of the spool and the upper part of the housing; as well as A support member is attached to the upper elastic member and electrically connected to the circuit board.

12. The lens moving device according to claim 1, wherein, The second coil is disposed between the first bore of the coil plate and the outer peripheral surface of the coil plate.

13. The lens-mounted mobile device of claim 10, further comprising a first sensor and a second sensor configured to detect displacement of the housing.

14. The lens moving device according to claim 1, wherein, The first magnet includes four magnet units disposed on four sides of the housing, and the second coil includes four coil units corresponding to the four magnet units.

15. The lens moving device according to claim 2, wherein, The conductive adhesive member contacts at least one of the first to the third portions of the pad portion.

16. A lens-mounted device, comprising: Base; A coil plate is disposed on the base and includes a first bore, a second coil, and a terminal electrically connected to the second coil. The housing is disposed on the coil plate; A bobbin is disposed within the housing; A first magnet is disposed in the housing so as to be opposite the second coil in the optical axis direction; as well as A circuit component, disposed on the base and including a pad portion electrically connected to the terminals of the coil board. The terminals of the coil plate are arranged along the inner circumferential surface of the coil plate formed by the bore. The solder pads are provided corresponding to the terminals of the coil board. The pad portion includes a concave shape, such that a portion of the first surface of the pad portion is exposed, and The conductive adhesive component or solder is disposed on the exposed portion of the first surface of the pad portion to electrically connect the terminals of the coil board to the pad portion.

17. The lens moving device according to claim 16, further comprising: The first coil is disposed on the bobbin; An upper elastic member connects the upper part of the spool and the upper part of the housing; as well as The support member is connected to the upper elastic member and electrically connected to the coil plate. The spool is configured to move along the optical axis direction through the interaction between the first coil and the first magnet, and The housing is configured to move in a direction perpendicular to the optical axis through the interaction between the second coil and the first magnet.

18. The lens moving device according to claim 16, wherein, At least a portion of the terminals of the coil board overlaps with the pad portion in the optical axis direction.

19. A camera module, comprising: lens; The lens-mounted mobile device according to claim 1; as well as Image sensor.

20. A lens-mounted device, comprising: A circuit board having a mounting recess; An image sensor is disposed in the mounting recess of the circuit board; as well as A first epoxy resin is disposed in the placement recess. The recessed portion has a first side surface and a second side surface facing each other, as well as a third side surface and a fourth side surface facing each other. The circuit board has at least one application groove formed on at least one of the first side surface and the second side surface of the placement recess. Wherein, at least one of the applying grooves has an opening formed in the upper surface of the circuit board, and Wherein, at least a portion of the first epoxy resin is disposed in the at least one application groove.

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