High density packaged photovoltaic module

Abstract

The application relates to the technical field of photovoltaic power generation equipment, in particular to a high-density packaged photovoltaic module, which comprises a photovoltaic module main body, a frame body, an axial flow fan and a fin group arranged on the bottom surface of the frame body; the photovoltaic module main body comprises a panel layer, a liquid flow interlayer, a light-transmitting heat-insulating layer and a substrate layer which are sequentially stacked from top to bottom, and a plurality of photovoltaic patches arranged on the surface of the substrate layer; a continuous and extending coil pipe flow channel is arranged on the surface of the substrate layer; a diaphragm pump and an inner flow channel are arranged in the frame body; the two ends of the coil pipe flow channel are respectively communicated with the diaphragm pump and the inner flow channel, and the liquid outlet end of the diaphragm pump is communicated with the inner flow channel. By arranging the liquid flow interlayer above the photovoltaic patch and forming a pre-heating structure of the light-receiving area by using heat-conducting liquid, part of the heat is absorbed and taken away before entering the photovoltaic patch area, and the heat resistance area is formed by combining the light-transmitting heat-insulating layer, so that the heat accumulation in the working process of the photovoltaic patch is reduced, the power generation efficiency is improved, and the aging speed of the packaging structure is slowed down.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic power generation equipment technology, specifically to a high-density packaged photovoltaic module. Background Technology

[0002] Photovoltaic modules are the core components of solar power generation systems. Existing photovoltaic modules typically consist of a laminated structure of tempered glass, encapsulating film, photovoltaic cells, and a backsheet. During actual operation, only a portion of solar radiation energy is converted into electrical energy; the majority is converted into heat and accumulates in the cell area. As the operating temperature of the photovoltaic cells continues to rise, the open-circuit voltage decreases, and the photoelectric conversion efficiency reduces. Furthermore, prolonged high-temperature operation accelerates the aging of the encapsulating film, backsheet, and welded connections, thus affecting the overall power generation performance and lifespan of the module.

[0003] Currently, most photovoltaic (PV) modules rely primarily on natural air convection and backsheet cooling for heat dissipation. However, due to the limited heat exchange capacity between the back of the module and the ambient air, especially under high temperature, low wind speed, and strong solar radiation conditions, the heat generated inside the module is difficult to dissipate in time, easily forming localized hot spots. This not only affects power generation efficiency but may also accelerate cell thermal degradation. To improve heat dissipation, some technical solutions involve adding heat dissipation fins, setting cooling channels, or using liquid circulation systems to cool the module. However, most existing solutions only target heat dissipation from the back of the PV cell; the heat still needs to pass through the cell area before being dissipated. A large amount of thermal radiation generated in the sun-receiving area continues to act on the surface of the PV cell, limiting the overall temperature control effect.

[0004] In view of this, we will study and improve the existing problems to provide a high-density encapsulated photovoltaic module to solve the current problems. The aim is to solve the problems and improve the practical value through this technology. Summary of the Invention

[0005] This invention aims to solve the problem of heat accumulation in existing photovoltaic modules under prolonged exposure to solar radiation. Existing photovoltaic modules typically employ a glass encapsulation structure and a backsheet structure for sealed installation. During module operation, besides a portion of solar energy being converted into electrical energy, most of the remaining energy is converted into heat and accumulates in the cell area. As the cell temperature continues to rise, it not only reduces photoelectric conversion efficiency but also accelerates the aging of the encapsulation materials, affecting the overall lifespan of the module.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A high-density encapsulated photovoltaic module includes a photovoltaic module body, a frame, and an axial flow fan and fin assembly arranged on the bottom surface of the frame. The photovoltaic module body includes a panel layer, a liquid flow interlayer, a light-transmitting and heat-insulating layer, and a substrate layer arranged sequentially from top to bottom, and a plurality of photovoltaic patches arranged on the surface of the substrate layer. A continuously extending coil flow channel is formed on the surface of the substrate layer. A diaphragm pump and an inner flow channel are provided inside the frame. The two ends of the coil flow channel are respectively connected to the diaphragm pump and the inner flow channel, and the liquid outlet end of the diaphragm pump is connected to the inner flow channel. A plurality of flow channel holes are formed on the inner side of the frame, and the plurality of flow channel holes are respectively connected to the inner flow channel and the liquid flow interlayer to form a heat transfer fluid circulation path. The liquid flow interlayer, the inner flow channel, and the coil flow channel are all filled with heat transfer fluid. A plurality of densely arrayed turbulence protrusions are provided on the bottom surface of the substrate layer.

[0007] By setting a liquid flow interlayer inside the main body of the photovoltaic module, the heat transfer fluid is located in the area above the photovoltaic patch. After sunlight enters the module, it can first pass through the liquid flow interlayer area. While ensuring that effective light enters the photovoltaic patch to generate electricity, the heat transfer fluid absorbs and transports some of the heat, thereby reducing the rate of heat accumulation in the photovoltaic patch area.

[0008] In a preferred embodiment, the panel layer is further configured as follows: the panel layer is a high-transparency tempered glass structure with a thickness of 2.0-4.0 mm; the liquid flow interlayer has a thickness of 1.0-5.0 mm.

[0009] Specifically, high-transparency tempered glass is used to improve the transmittance of sunlight while ensuring the overall mechanical strength of the components; the liquid flow jacket provides space for the heat transfer fluid to circulate, enabling the heat transfer fluid to form a continuous heat exchange layer in the light-receiving area, thereby improving the heat removal efficiency.

[0010] In a preferred embodiment, the substrate layer is further configured as follows: the substrate layer is one of an aluminum alloy plate, a copper alloy plate, or a graphite composite thermal conductive plate; the bottom surface of the photovoltaic patch is provided with an insulating thermal conductive pad, and is fixed to the surface of the substrate layer by the insulating thermal conductive pad; the insulating thermal conductive pad is one of an alumina ceramic pad, an aluminum nitride ceramic pad, or a thermally conductive silicone pad; the thickness of the insulating thermal conductive pad is 0.2-1.5 mm.

[0011] Specifically, the insulating thermal pad can achieve electrical insulation between the photovoltaic patch and the substrate layer, while quickly transferring the heat generated by the photovoltaic patch during operation to the substrate layer, thereby improving the heat dissipation capacity.

[0012] In a preferred embodiment, the light-transmitting heat-insulating layer is further configured as follows: the light-transmitting heat-insulating layer is either a PMMA acrylic layer or a LOW-E transparent coating layer; the thickness of the light-transmitting heat-insulating layer is 0.5-5.0 mm.

[0013] Specifically, the light-transmitting and heat-insulating layer allows visible light and photovoltaic response wavelengths to pass through, while reducing the efficiency of heat absorption by the liquid flow interlayer and its transfer to the photovoltaic patch, thus forming a thermal barrier area between the liquid flow interlayer and the photovoltaic patch and improving the overall thermal management capability of the module.

[0014] In a preferred embodiment, the turbulence bumps are further configured such that they are arranged in an alternating array; the diameter of each turbulence bump is 2-8 mm; the height of each turbulence bump is 1-5 mm; and the spacing between adjacent turbulence bumps is 1-6 mm.

[0015] Specifically, the turbulence bumps can disturb the air boundary layer flowing through the bottom surface of the substrate layer, causing the thermal boundary layer to be continuously broken and rebuilt, improving the heat exchange efficiency between the air and the substrate layer, and enhancing the bottom heat dissipation capacity.

[0016] In a preferred embodiment, the coil flow channels are further configured as follows: the coil flow channels are arranged continuously in a serpentine, S-shaped, or U-shaped pattern; a number of photovoltaic patches are arranged in an array between adjacent coil flow channels; and the aperture of the coil flow channels is 3-15mm.

[0017] Specifically, the coil flow channel covers the area below the photovoltaic patch, enabling the heat generated by the photovoltaic patch to be quickly transferred to the flowing heat transfer fluid, thereby increasing the liquid cooling heat exchange area and heat collection efficiency.

[0018] In a preferred embodiment, the fin groups are further configured such that: the fin groups are respectively arranged on both sides of the axial flow fan; the fin groups are composed of several parallel heat dissipation fins; the thickness of each heat dissipation fin is 1-5mm; and the spacing between adjacent heat dissipation fins is 2-15mm.

[0019] Specifically, the finned assembly can increase the heat dissipation area, and the axial flow fan drives air to continuously flow across the surface of the finned assembly, thereby improving the heat release efficiency carried by the heat transfer fluid during circulation.

[0020] In a preferred embodiment, the axial flow fan is further configured such that: the axial flow fan includes an air guide tube and a fan impeller disposed inside the air guide tube; the air guide tube has a straight cylindrical structure; an annular cavity layer is provided on the outer side of the air guide tube; the annular cavity layer is connected to the inner flow channel to form a heat transfer fluid flow space.

[0021] Specifically, the air duct can concentrate and guide the airflow, increasing the airflow speed; after the annular cavity layer is connected to the inner flow channel, it can form an additional heat exchange area, allowing the heat transfer fluid to dissipate heat simultaneously as it flows through the frame area, thereby improving the overall heat exchange capacity.

[0022] In a preferred embodiment, the heat-conducting fluid is further configured such that it has a spectral filtering and heat absorption function, which is used to absorb part of the near-infrared heat in solar radiation, and to transport the absorbed heat to the coil channel and the frame for heat dissipation through circulation.

[0023] Specifically, the heat-conducting fluid can absorb some of the heat radiation before sunlight enters the photovoltaic patch area, and continuously remove the heat through the liquid circulation system, thereby reducing the operating temperature of the photovoltaic patch, improving the photoelectric conversion efficiency and the long-term operational stability of the module.

[0024] The beneficial effects achieved by this invention include: 1. This invention provides a liquid flow interlayer above the photovoltaic patch and utilizes a heat-conducting liquid to form a pre-heat exchange structure in the light-receiving area, so that some heat is absorbed and carried away before entering the photovoltaic patch area. At the same time, combined with a light-transmitting heat insulation layer to form a heat-blocking area, this invention can reduce the heat accumulation during the operation of the photovoltaic patch, improve power generation efficiency, and slow down the aging rate of the encapsulation structure.

[0025] 2. In this invention, the panel layer, liquid flow interlayer, light-transmitting heat insulation layer, substrate layer, and photovoltaic patch are arranged in a high-density integrated manner along the thickness direction. The diaphragm pump, internal flow channel, axial flow fan, and fin assembly are simultaneously integrated inside the frame. Within the limited thickness of the component, a composite structure integrating light-receiving power generation, heat absorption, liquid circulation heat dissipation, and air-enhanced heat dissipation is constructed. This allows each functional module to operate collaboratively without additional independent installation. This not only improves the functional integration within the unit volume of the photovoltaic module but also reduces the installation space occupied by traditional external heat dissipation systems, thereby improving the overall structural compactness and engineering applicability.

[0026] 3. The present invention constructs an enhanced air-cooling heat dissipation system by means of turbulence protrusions on the bottom surface of the substrate layer, axial flow fan at the bottom of the frame and fin assembly. This system can continuously disturb the air boundary layer and enhance air circulation efficiency, enabling the liquid cooling system and the air cooling system to work together to form a multi-level thermal management system that combines spectral filtration heat absorption, liquid circulation heat dissipation and forced air cooling heat dissipation, thereby improving the power generation efficiency, operational stability and service life of the module. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the present invention; Figure 2 This is a schematic diagram of the main cross-sectional structure of a photovoltaic module according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the substrate layer surface structure according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the turbulence bump structure on the bottom surface of the substrate layer according to an embodiment of the present invention; Figure 5 This is a schematic diagram of a photovoltaic patch and an insulating thermal pad structure according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the substrate layer surface and the internal structure of the frame according to an embodiment of the present invention.

[0028] Figure label: 100. Photovoltaic module body; 110. Panel layer; 120. Liquid flow interlayer; 130. Light-transmitting and heat-insulating layer; 140. Substrate layer; 150. Photovoltaic patch; 141. Turbulence bumps; 142. Coil flow channel; 151. Insulating and thermally conductive pad; 200, Frame; 210, Axial flow fan; 220, Fin assembly; 201, Diaphragm pump; 202, Inner flow channel; 203, Flow channel hole. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0030] It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the invention.

[0031] The following describes, with reference to the accompanying drawings, some embodiments of a high-density encapsulated photovoltaic module provided by the present invention.

[0032] Combination Figures 1-6 As shown, the present invention provides a high-density encapsulated photovoltaic module, including a photovoltaic module body 100, a frame 200, and an axial flow fan 210 and a fin assembly 220 arranged on the bottom surface of the frame 200. The photovoltaic module body 100 includes a panel layer 110, a liquid flow interlayer 120, a light-transmitting and heat-insulating layer 130 and a substrate layer 140 arranged sequentially from top to bottom, and a plurality of photovoltaic patches 150 arranged on the surface of the substrate layer 140. A continuously extending coiled flow channel 142 is formed on the surface of the substrate layer 140. A diaphragm pump 201 and an inner flow channel 202 are provided inside the frame 200. The two ends of the coiled flow channel 142 are connected to the diaphragm pump 201 and the inner flow channel 202, respectively. A number of flow channel holes 203 are formed on the inner side of the frame 200. Each flow channel hole 203 is connected to the inner flow channel 202 and the liquid flow interlayer 120, so that a closed loop circulation flow path is formed between the liquid flow interlayer 120, the inner flow channel 202 and the coiled flow channel 142. The circulation flow path is filled with heat-conducting liquid for active thermal management of the photovoltaic module body 100.

[0033] Combination Figure 2As shown, in this embodiment, the panel layer 110 adopts a high-transparency tempered glass structure with a thickness of 3mm, possessing high light transmittance and weather resistance, and is used to encapsulate and protect the internal structure. A liquid flow interlayer 120 is disposed between the panel layer 110 and the light-transmitting heat-insulating layer 130. The liquid flow interlayer 120 has a thickness of 2mm and is filled with a heat-conducting liquid. The heat-conducting liquid is preferably one of a nano-silica suspension, a nano-alumina suspension, or an ethylene glycol aqueous solution. By absorbing a portion of the near-infrared band of solar radiation, the heat-conducting liquid itself pre-reduces the incident heat, reducing the heat load entering the photovoltaic patch 150 area.

[0034] When the heat transfer fluid is an aqueous solution of ethylene glycol, both ethylene glycol molecules and water molecules have the ability to absorb near-infrared energy. After sunlight passes through the panel layer 110 and enters the liquid flow interlayer 120, some of the near-infrared radiation energy is absorbed by the aqueous solution of ethylene glycol and converted into heat energy stored inside the liquid. Subsequently, the heat is transported to the coil flow channel 142 and the frame 200 area for release through circulation, thereby reducing the heat load entering the photovoltaic patch 150 area.

[0035] When a nano-silica suspension is used as the heat transfer fluid, the nano-silica particles suspended in the liquid can microscopically scatter light passing through the liquid flow interlayer 120, increasing the propagation path of light within the liquid and thus improving the contact time between the liquid and light energy. Simultaneously, the nano-silica particles have a large specific surface area, which promotes uniform heat diffusion within the liquid, creating a more uniform temperature field within the liquid flow interlayer 120, reducing localized heat accumulation, and improving overall thermal management stability.

[0036] When a nano-alumina suspension is used as the heat transfer fluid, the nano-alumina particles have high thermal conductivity. Their uniform dispersion within the liquid increases the overall thermal conductivity of the fluid, allowing the heat absorbed by the liquid flow interlayer 120 to be transferred more quickly to the circulation path. Simultaneously, the Brownian motion of the nano-alumina particles in the liquid promotes energy exchange at the microscale, improving the heat transfer efficiency of the heat transfer fluid and thus enhancing the heat dissipation capacity of the photovoltaic module body 100.

[0037] In a preferred example, the heat transfer fluid uses an aqueous ethylene glycol solution as the base heat exchange medium, and incorporates nano-silica particles and nano-alumina particles to form a composite nano-heat transfer fluid. The aqueous ethylene glycol solution absorbs some of the near-infrared radiant heat and provides circulating heat exchange capability; the nano-silica particles improve the propagation path of light in the fluid flow interlayer 120 and the uniformity of heat distribution; and the nano-alumina particles improve the overall thermal conductivity of the heat transfer fluid. Thus, the fluid flow interlayer 120 simultaneously performs heat absorption, heat homogenization, and heat transfer functions, ensuring normal solar power generation of the photovoltaic panel 150 while reducing the module's operating temperature, thereby improving overall power generation efficiency and long-term operational stability.

[0038] refer to Figure 2 As shown, in this embodiment, a light-transmitting heat-insulating layer 130 is disposed between the liquid flow interlayer 120 and the substrate layer 140. The light-transmitting heat-insulating layer 130 can be one of a PMMA acrylic layer or a LOW-E transparent coating layer, and its thickness is preferably 1-3 mm. The light-transmitting heat-insulating layer 130 allows visible light and photovoltaic response wavelength light to pass through, while reducing the efficiency of heat absorption and downward transfer of the liquid flow interlayer 120, thereby making the liquid flow interlayer 120 a heat buffer area, reducing the operating temperature of the photovoltaic patch 150 while ensuring power generation efficiency.

[0039] Combination Figure 3 , Figure 5 As shown, in this embodiment, the substrate layer 140 adopts a high thermal conductivity aluminum alloy plate structure, and a plurality of photovoltaic patches 150 are fixedly mounted on its surface. Each photovoltaic patch 150 has an insulating thermally conductive pad 151 on its bottom surface. Each insulating thermally conductive pad 151 is one of an alumina ceramic pad, an aluminum nitride ceramic pad, or a thermally conductive silicone pad, and its thickness is 0.2-1.5 mm. The insulating thermally conductive pad 151 serves two purposes: firstly, it provides electrical insulation between the photovoltaic patch 150 and the metal substrate layer 140; secondly, it rapidly transfers the heat generated by the photovoltaic patch 150 during operation to the interior of the substrate layer 140, improving heat dissipation efficiency.

[0040] refer to Figure 3 As shown, in this embodiment, the coil flow channel 142 is formed on the surface of the substrate layer 140. The coil flow channel 142 is arranged in a continuous serpentine S-shaped structure and covers most of the area below the photovoltaic panels 150. The photovoltaic panels 150 are arranged in an array between adjacent coil flow channels 142, so that the heat generated by each photovoltaic panel 150 can be transferred to the coil flow channel 142 in the vicinity through the insulating thermal pad 151. The aperture of the coil flow channel 142 is preferably 5-10 mm, thereby ensuring that the heat transfer fluid has sufficient flow cross-sectional area and heat exchange area.

[0041] Combination Figure 4As shown, in this embodiment, the bottom surface of the substrate layer 140 is provided with several flow disturbance bumps 141. The flow disturbance bumps 141 are evenly distributed on the bottom surface of the substrate layer 140 in a staggered array. The diameter of each flow disturbance bump 141 is preferably 3-6 mm, the height is preferably 2-4 mm, and the spacing between adjacent flow disturbance bumps 141 is preferably 2-5 mm. When air flows along the bottom surface of the substrate layer 140, each flow disturbance bump 141 can disturb the boundary layer airflow, causing the thermal boundary layer originally attached to the bottom surface of the substrate layer 140 to be continuously destroyed and rebuilt, thereby improving the heat exchange efficiency between the substrate layer 140 and the air, and enhancing the bottom air cooling capacity.

[0042] refer to Figure 1 and Figure 6 As shown, in this embodiment, the frame 200 is arranged around the outer periphery of the photovoltaic module body 100. An annular inner flow channel 202 is formed inside the frame 200. A diaphragm pump 201 is installed inside the frame 200, and its outlet end is connected to the inner flow channel 202. A plurality of flow channel holes 203 are evenly distributed on the inner side of the frame 200, each flow channel hole 203 communicating with the liquid flow jacket 120, allowing the heat transfer fluid to circulate inside the liquid flow jacket 120. After absorbing some solar radiation heat in the liquid flow jacket 120, the heat transfer fluid enters the inner flow channel 202 through the flow channel holes 203, and is then transported to the coil flow channel 142 by the diaphragm pump 201 to continue absorbing heat conducted from the photovoltaic patch 150, finally returning to the frame 200 to form a cycle.

[0043] In this embodiment, an axial flow fan 210 is installed at the bottom of the frame 200. The axial flow fan 210 includes an air guide duct and a fan impeller disposed inside the air guide duct. The air guide duct has a straight cylindrical structure, and an annular cavity layer is formed on the outer periphery of the air guide duct. The annular cavity layer is connected to the inner flow channel 202, allowing the heat transfer fluid to flow around the air guide duct. When the axial flow fan 210 is started, air is continuously guided to flow through the fin assembly 220 and the bottom area of ​​the substrate layer 140, thereby forming a forced convection heat transfer environment.

[0044] Combination Figure 1 As shown, in this embodiment, the finned assemblies 220 are respectively arranged on both sides of the axial flow fan 210. The finned assemblies 220 are composed of several parallel heat dissipation fins, the thickness of which is preferably 3mm, and the spacing between adjacent heat dissipation fins is preferably 3-5mm. The heat generated by the heat transfer fluid during circulation can be conducted to the finned assemblies 220 through the frame 200, and the heat is carried away by the high-speed airflow generated by the axial flow fan 210, thereby achieving continuous cooling of the heat transfer fluid.

[0045] During operation, sunlight first passes through the panel layer 110 and enters the liquid flow interlayer 120 region. The heat-conducting liquid in the liquid flow interlayer 120 absorbs some of the near-infrared thermal radiation and carries the absorbed heat into the circulation path. The remaining usable wavelength continues to pass through the light-transmitting heat insulation layer 130 and irradiates the surface of the photovoltaic patch 150 for photoelectric conversion. The heat generated during the operation of the photovoltaic patch 150 is transferred to the substrate layer 140 via the insulating thermal pad 151, and then from the substrate layer 140 to the heat-conducting liquid flowing inside the coil flow channel 142. The diaphragm pump 201 drives the heat-conducting liquid to circulate between the liquid flow interlayer 120, the inner flow channel 202, and the coil flow channel 142, transporting both the heat received from the sunlight and the heat generated by power generation to the frame 200 region. At the same time, the axial flow fan 210 continuously pushes air through the bottom surface of the substrate layer 140 and the fin group 220 area. Under the action of the turbulence protrusions 141, the thermal boundary layer is broken, the air heat exchange capacity is improved, and the heat carried by the heat transfer liquid is quickly released into the environment. This forms a multi-stage heat dissipation system that combines liquid heat absorption, heat insulation, heat transfer, liquid cooling circulation and air cooling enhancement, effectively reducing the operating temperature of the photovoltaic module and improving power generation efficiency and long-term operating stability.

[0046] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0047] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A high-density encapsulated photovoltaic module, characterized in that, It includes a photovoltaic module body (100), a frame (200), and an axial flow fan (210) and a fin assembly (220) arranged on the bottom surface of the frame (200). The photovoltaic module body (100) includes a panel layer (110), a liquid flow interlayer (120), a light-transmitting and heat-insulating layer (130), and a substrate layer (140) arranged in sequence from top to bottom, as well as a plurality of photovoltaic patches (150) arranged on the surface of the substrate layer (140); the surface of the substrate layer (140) is provided with a continuously extending coil flow channel (142). The frame (200) is equipped with a diaphragm pump (201) and an inner flow channel (202). The two ends of the coil flow channel (142) are respectively connected to the diaphragm pump (201) and the inner flow channel (202). The liquid outlet end of the diaphragm pump (201) is connected to the inner flow channel (202). The frame (200) is provided with a number of flow channel holes (203) on the inner side. The number of flow channel holes (203) are respectively connected to the inner flow channel (202) and the liquid flow jacket (120).

2. The high-density encapsulated photovoltaic module according to claim 1, characterized in that: The liquid flow jacket (120), the inner flow channel (202) and the coil flow channel (142) are all filled with heat-conducting liquid; the bottom surface of the substrate layer (140) is provided with a number of densely arrayed turbulence protrusions (141).

3. A high-density encapsulated photovoltaic module according to claim 1, characterized in that: The panel layer (110) is a high-transparency tempered glass structure with a thickness of 2.0-4.0 mm; the liquid flow interlayer (120) has a thickness of 1.0-5.0 mm.

4. A high-density encapsulated photovoltaic module according to claim 1, characterized in that: The substrate layer (140) is one of aluminum alloy plate, copper alloy plate or graphite composite heat-conducting plate; The photovoltaic patch (150) has an insulating thermal pad (151) on its bottom surface and is fixed to the surface of the substrate layer (140) by the insulating thermal pad (151); The insulating thermal pad (151) is one of an alumina ceramic pad, an aluminum nitride ceramic pad, or a thermally conductive silicone pad; the thickness of the insulating thermal pad (151) is 0.2-1.5 mm.

5. A high-density encapsulated photovoltaic module according to claim 1, characterized in that: The light-transmitting heat-insulating layer (130) is either a PMMA acrylic layer or a LOW-E transparent coating layer; the thickness of the light-transmitting heat-insulating layer (130) is 0.5-5.0 mm.

6. A high-density encapsulated photovoltaic module according to claim 2, characterized in that: The turbulence protrusions (141) are arranged in an alternating array; the diameter of each turbulence protrusion (141) is 2-8mm; the height of each turbulence protrusion (141) is 1-5mm; and the spacing between adjacent turbulence protrusions (141) is 1-6mm.

7. A high-density encapsulated photovoltaic module according to claim 1, characterized in that: The coil flow channel (142) is arranged continuously in a serpentine, S-shaped or U-shaped pattern; Several photovoltaic patches (150) are arranged in an array between adjacent coil channels (142); the diameter of the coil channels (142) is 3-15mm.

8. A high-density encapsulated photovoltaic module according to claim 1, characterized in that: The fin groups (220) are respectively arranged on both sides of the axial flow fan (210); the fin groups (220) are composed of several parallel heat dissipation fins; the thickness of each heat dissipation fin is 1-5mm; the spacing between adjacent heat dissipation fins is 2-15mm.

9. A high-density encapsulated photovoltaic module according to claim 1, characterized in that: The axial flow fan (210) includes an air guide tube and a fan impeller disposed inside the air guide tube; the air guide tube has a straight cylindrical structure; an annular cavity layer is provided on the outside of the air guide tube; the annular cavity layer is connected to the inner flow channel (202).

Images