Display module, preparation method thereof and display device

Abstract

Embodiments of the present disclosure provide a display module, a preparation method thereof and a display device, and relate to the technical field of display, and are used for improving the connection reliability of a chip on film and a display panel. The display module comprises a display panel, a chip on film, a first insulating layer, liquid metal and a cover layer. The display panel comprises a substrate, a first binding pin and a groove. The groove exposes the first binding pin through the substrate. The chip on film comprises a first connecting part and a plurality of second binding pins. The first connecting part is bonded to the surface of the substrate away from the first binding pin. The first insulating layer comprises a plurality of connecting holes. The connecting holes expose one first binding pin and one second binding pin. Adjacent first binding pins and adjacent second binding pins are separated by the first insulating layer. The cover layer covers the first insulating layer and surrounds the connecting holes to form a containing cavity. The liquid metal is located in the containing cavity and is electrically connected to the first binding pin and the second binding pin respectively. The display module is used for preparing the display device.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] With the development of display technology, display devices have gradually become ubiquitous in people's lives. Display devices can include Organic Light Emitting Diode (OLED) displays. OLED displays have advantages such as self-illumination, low power consumption, wide viewing angle, fast response speed, high contrast, and the ability to achieve flexible displays, thus they are widely used. Among these advantages, narrow bezels are a crucial development direction for current display devices, and how to reduce the bezel width is a pressing technical problem that needs to be solved. Summary of the Invention

[0003] The purpose of this disclosure is to provide a display module and its manufacturing method, as well as a display device, for improving the connection reliability between the flip-chip film and the display panel.

[0004] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions: On one hand, a display module is provided. The display module includes a display panel, a flip-chip film, a first insulating layer, liquid metal, and a cover layer. The display panel includes a display area and a bonding area located on one side of the display area. The display panel also includes a substrate, a plurality of first bonding pins, and at least one groove. The first bonding pins and the groove are both disposed in the bonding area and respectively on both sides of the substrate. The groove at least penetrates the substrate and exposes at least a portion of the first bonding pins. The flip-chip film is disposed on the non-display side of the display panel and includes a first connecting portion. The first connecting portion is disposed in the bonding area and located on the side of the groove near the display area. The first connecting portion is bonded to the surface of the substrate away from the first bonding pins. The flip-chip film also includes a plurality of second bonding pins. The first insulating layer is at least partially disposed on the side of the flip-chip film away from the display panel and at least partially disposed on the side of the substrate away from the first bonding pins. The first insulating layer includes a plurality of connection holes. Each connection hole exposes at least a portion of the area of ​​a first bonding pin and at least a portion of the area of ​​a second bonding pin. Adjacent first bonding pins and adjacent second bonding pins are separated by the first insulating layer. The liquid metal is disposed within the connection hole and electrically connected to the first bonding pin and the second bonding pin, respectively. The cover layer is disposed on the side of the first insulating layer and the liquid metal away from the display panel, covering the first insulating layer and forming a receiving cavity with the connection hole; wherein the liquid metal is located within the receiving cavity.

[0005] The display module provided in the embodiments of this disclosure has a groove that at least penetrates the substrate and exposes at least a portion of the first bonding pin. A first insulating layer is at least partially disposed on the side of the flip-chip film away from the display panel and at least partially disposed on the side of the substrate away from the first bonding pin. A connection hole in the first insulating layer exposes at least a portion of a first bonding pin and at least a portion of a second bonding pin. Adjacent first bonding pins and adjacent second bonding pins are separated by the first insulating layer. Liquid metal is disposed within the connection hole and electrically connected to both the first and second bonding pins. A cover layer is disposed on the side of the first insulating layer and the liquid metal away from the display panel, covering at least a portion of the first insulating layer. In the embodiments of this disclosure, the cover layer, the connection hole, and the display panel can form a closed cavity, with the liquid metal located within this cavity, preventing overflow from the connection hole. Using liquid metal to connect the first and second bonding pins, the fluidity of the liquid metal allows for connection even with high step differences, avoiding problems such as broken connection lines and uneven connection line widths between the first and second bonding pins. Furthermore, liquid metal can be sequentially or simultaneously filled into multiple connection holes using printing, coating, or other processes. As long as a first insulating layer with multiple connection holes is prepared, the liquid metal can be guaranteed to be distributed in a preset position. The precision of photolithography is higher than that of printing, which is beneficial to improving the positional accuracy of the liquid metal, improving the connection reliability between the first bonding pin and the second bonding pin, and thus improving the connection reliability between the flip-chip film and the display panel.

[0006] In some embodiments, the liquid metal is made of gallium-based liquid metal.

[0007] In some embodiments, the display module further includes a solid gallium oxide layer located between the liquid metal and the cover layer.

[0008] In some embodiments, the hydrophilicity of the surface of the first insulating layer away from the substrate is greater than the hydrophilicity of the sidewall of the connection hole.

[0009] In some embodiments, the first insulating layer has a first hydrophobic structure surrounding the sidewall of the connection hole.

[0010] In some embodiments, the hydrophilicity of the surface of the first insulating layer away from the substrate is less than the hydrophilicity of the sidewall of the connection hole.

[0011] In some embodiments, the surface of the first insulating layer away from the substrate is provided with a second hydrophobic structure.

[0012] In some embodiments, the wettability of the liquid metal on the surface of a preset liquid is less than the wettability of the liquid metal on the first insulating layer, and the preset liquid is immiscible with the liquid metal.

[0013] In some embodiments, the first insulating layer includes a substrate layer and a functional layer stacked together, the functional layer being disposed on the side of the substrate layer away from the display panel, and at least covering the portion of the first insulating layer located between two adjacent connection holes. The material of the functional layer includes polydimethylsiloxane, polyethylene terephthalate, polyimide, polyvinyl chloride, polyurethane, and polyacrylate viscoelasticity; and / or, the preset solution includes ethanol.

[0014] In some embodiments, the liquid metal material includes gallium-based liquid metal and doped metal material; the doped metal material includes silver-plated copper particles.

[0015] In some embodiments, the flip-chip film has a first gap between itself and the groove near the end of the groove. The display module further includes an adhesive layer and a dispensing portion. The adhesive layer includes a first adhesive portion located between the first connecting portion and the substrate, and bonded to both the first connecting portion and the substrate. The dispensing portion is disposed at the first gap, and the surface of the dispensing portion in contact with the first insulating layer forms a first slope, one end of the first slope extending to the edge of the groove or the first bonding pin, and the other end extending to the flip-chip film.

[0016] In some embodiments, the distance between the first adhesive portion and the groove is greater than or equal to the first distance.

[0017] In some embodiments, the dispensing portion and the first insulating layer are made of the same material and are integrally formed.

[0018] In some embodiments, the flip-chip film has a first gap between itself and the groove near the end of the groove. The display module further includes an adhesive layer. The adhesive layer includes a first adhesive portion located between the first connector and the substrate, and bonded to both the first connector and the substrate. The gap between the first adhesive portion and the groove is greater than or equal to the first gap. The liquid metal covers the first gap and at least partially fills the space between the first connector and the substrate.

[0019] In some embodiments, the first adhesive portion near the edge of the groove includes a plurality of protrusions extending toward the groove, the plurality of protrusions being spaced apart along the extending direction of the first adhesive portion near the edge of the groove. The first insulating layer includes a barrier portion located between two adjacent connection holes, one of the barrier portions contacting one of the protrusions.

[0020] In some embodiments, the display panel includes a plurality of said recesses, one of said recesses exposing one of the first bonding pins.

[0021] In some embodiments, the display panel includes one of the recesses that exposes a plurality of the first bonding pins. Alternatively, the display panel includes a plurality of the recesses, at least one of the recesses exposing a plurality of the first bonding pins.

[0022] In some embodiments, the display module further includes a support module, an adhesive layer, and a driver chip. The support module is disposed on the non-display side of the display panel and connected to the substrate. The adhesive layer includes a first adhesive portion and a second adhesive portion. The first adhesive portion is located between the first connecting portion and the substrate, and is bonded to both the first connecting portion and the substrate. The flip-chip film further includes a second connecting portion, the second adhesive portion being located between the support module and the second connecting portion, and is bonded to both the support module and the second connecting portion. The driver chip is electrically connected to the second connecting portion of the flip-chip film.

[0023] On the other hand, a method for fabricating a display module is provided, the method comprising: providing an initial display panel; forming at least one groove on a non-display side of a substrate; bonding a flip-chip film to the non-display side of the substrate; forming a first insulating layer on the side of the flip-chip film away from the display panel; filling a connection hole with liquid metal; and forming a cover layer on the first insulating layer and the side of the liquid metal away from the display panel. The initial display panel includes a display area and a bonding area located on one side of the display area. The initial display panel also includes a plurality of first bonding pins disposed on one side of the substrate, the first bonding pins being disposed in the bonding area. The groove at least penetrates the substrate and exposes at least a portion of the first bonding pins. The flip-chip film includes a first connecting portion disposed in the bonding area, located on the side of the groove near the display area, and bonded to the display panel; the flip-chip film includes a plurality of second bonding pins. The first insulating layer includes a plurality of connection holes, each connection hole exposing at least a portion of a first bonding pin and at least a portion of a second bonding pin, with adjacent first bonding pins and adjacent second bonding pins separated by the first insulating layer. The liquid metal is electrically connected to the first bonding pin and the second bonding pin exposed by the connection hole, respectively. The cover layer and the connection hole form a receiving cavity; the liquid metal is located within the receiving cavity.

[0024] In some embodiments, the wettability of the liquid metal on the surface of a preset liquid is less than the wettability of the liquid metal on the first insulating layer, and the preset liquid is immiscible with the liquid metal; the first insulating layer includes a substrate layer and a functional layer stacked together, the functional layer being disposed on the side of the substrate layer away from the display panel, and at least covering the portion of the first insulating layer located between two adjacent connection holes; the liquid metal material includes gallium-based liquid metal and a doped metal material, the doped metal material including silver-plated copper particles; filling the connection hole with liquid metal includes: applying a full layer of liquid metal on the side of the first insulating layer away from the display panel, the liquid metal filling the connection hole and at least a portion of the surface of the first insulating layer; applying a preset solution on the side of the liquid metal away from the display panel, the preset solution covering the liquid metal layer; using a needle to separate the preset solution and liquid metal from a preset area, the preset solution and liquid metal remaining in the portion located in the connection hole; evaporating the preset solution.

[0025] In some embodiments, the material of the functional layer includes polydimethylsiloxane, polyethylene terephthalate, polyimide, polyvinyl chloride, polyurethane, and polyacrylate viscoelastic; and / or, the preset solution includes ethanol.

[0026] In some embodiments, after filling the connection hole with liquid metal and before forming the capping layer, the preparation method further includes: oxidizing the surface portion of the liquid metal to form a solid gallium oxide layer.

[0027] In some embodiments, bonding the flip-chip film to the non-display side of the substrate includes: bonding an adhesive layer to the non-display side of the substrate; and bonding a first connecting portion of the flip-chip film to the first adhesive portion. The adhesive layer includes a first adhesive portion located in the fan-out region and spaced from the groove. The first adhesive portion near the edge of the groove includes a plurality of protrusions extending toward the groove, the protrusions being spaced apart along the extending direction of the first adhesive portion near the edge of the groove. The distance between the orthographic projection of the first connecting portion on the substrate and the groove is greater than the distance between the first adhesive portion and the groove. The first insulating layer includes a barrier portion located between two adjacent connecting holes, one barrier portion contacting one of the protrusions, and the liquid metal at least partially filling the space enclosed by the substrate, the flip-chip film, and the adjacent protrusions.

[0028] In some embodiments, bonding a flip-chip film to the non-display side of the substrate includes: bonding an adhesive layer to the non-display side of the substrate; and bonding a first connecting portion of the flip-chip film to a first adhesive portion. The adhesive layer includes a first adhesive portion located in the fan-out region and spaced from the groove; the first adhesive portion is substantially flush with the edge of the groove. The distance between the orthographic projection of the first connecting portion on the substrate and the groove is greater than the distance between the first adhesive portion and the groove; a step is formed between the flip-chip film and the first bonding pin. After forming a first insulating layer and before forming a capping layer, the fabrication method further includes: forming a dispensing portion at the step. The dispensing portion forms a first slope on the surface away from the substrate, one end of the first slope extending to the edge of the groove and the other end extending to the flip-chip film.

[0029] On the other hand, a display device is provided, the display device including the display module as described in any of the above embodiments, the display device further including a driving circuit board, the driving circuit board being electrically connected to the display module and configured to transmit control signals to the display module.

[0030] The above-described method for preparing the display module and the display device have the same structure and beneficial technical effects as the display modules provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0032] Figure 1 This is a structural diagram of a display device according to some embodiments; Figure 2 This is a planar structural diagram of a display module according to some embodiments; Figure 3 for Figure 2 The image shows a cross-sectional view of the display module along section line A1-A1; Figure 4 This is a structural diagram of a groove and a first insulating layer according to some embodiments; Figure 5 This is another structural diagram of the groove and the first insulating layer according to some embodiments; Figure 6 for Figure 2 The image shows a cross-sectional view of the display module along section line A2-A2; Figure 7 for Figure 2 The diagram shows another sectional view of the module along section line A1-A1; Figure 8 for Figure 5 The image shown is a partial enlarged view of a connection hole 31 in region B1 of the display module; Figure 9 for Figure 8 A cross-sectional view of the connecting hole 31 shown along section line A3-A3; Figure 10 for Figure 5 The image shown is another enlarged view of a connection hole 31 in region B1 of the display module; Figure 11 for Figure 2 The diagram shows another sectional view of the module along section line A2-A2; Figure 12 for Figure 2 The diagram shows another sectional view of the display module along section line A2-A2; Figure 13 for Figure 2 The diagram shows another sectional view of the display module along section line A1-A1; Figure 14 for Figure 2The diagram shows another sectional view of the display module along section line A2-A2; Figure 15 This is a structural diagram of an adhesive layer according to some embodiments; Figure 16 for Figure 2 The diagram shows another sectional view of the display module along section line A1-A1; Figure 17 This is another structural diagram of the adhesive layer according to some embodiments; Figure 18 for Figure 2 The diagram shows another sectional view of the display module along section line A2-A2; Figures 19-37 This is a process step diagram of a method for manufacturing a display module according to some embodiments. Detailed Implementation

[0033] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0034] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplarily," or "for example" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0035] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0036] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0037] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0038] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0039] The use of “configured as” in this article implies an open and inclusive language that does not preclude devices from being configured to perform additional tasks or steps.

[0040] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0041] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0042] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0043] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0044] See Figure 1 Some embodiments of this disclosure provide a display device 1000, which can be any device that displays text or images, whether in motion (e.g., video) or still (e.g., image).

[0045] For example, the aforementioned display device 1000 can be any product or component with display function, such as a television, laptop computer, tablet computer, mobile phone, personal digital assistant (PDA), clock, global positioning system (GPS) receiver / navigator, vehicle display, flight display, wearable device, virtual reality (VR) device, augmented reality (AR) device, sight, rangefinder, sign, electronic billboard, and shopping mall display.

[0046] In some embodiments, from the perspective of the light emission type of the display device 1000, the display device 1000 may be an organic light-emitting diode (OLED) display device or a quantum dot light-emitting diode (QLED) display device, etc. From the perspective of the form of the display device 1000, the display device 1000 may be a flat display device, a curved display device, or a foldable display device, etc. From the perspective of the shape of the display device 1000, the display device 1000 may be rectangular or circular, etc. The following uses a rectangular and flat OLED display device as an example to illustrate some embodiments of this disclosure; however, the embodiments of this disclosure are not limited to this, and any other display device can be considered, as long as the same technical concept is applied.

[0047] In some embodiments, the display device 1000 may include a display module and a driving circuit board. The driving circuit board may include, for example, a timing controller (TCON), a DC / DC power management chip, and an adjustable resistor voltage divider circuit (generating Vcom), etc. The driving circuit board may also include other circuit structures, which will not be listed here. The driving circuit board is electrically connected to the display module and is used to transmit control signals to the display module, thereby driving the display module to display images. In addition, the display device 1000 may also include a touch structure, an under-display camera, and an under-display fingerprint sensor, enabling the display device 1000 to perform various functions such as touch control, photography, video recording, or fingerprint recognition; specific limitations are not specified here.

[0048] See Figure 2 and Figure 3 The display module 1100 may include a display panel 100, a support module 200, a functional stack 300, and a driving component 400. The display panel 100 may include a display side and a non-display side, the display side ( Figure 3The upper side of the display panel 100 refers to the side of the display panel 100 used to display images, while the non-display side ( Figure 3 The lower side of the display panel 100 refers to the other side of the display panel 100 opposite to the display side. In addition, the display panel 100 also includes a display area AA and a bonding area NA disposed on one side of the display area AA. The display area AA refers to the area of ​​the display panel 100 actually used for image display, and the bonding area NA refers to the area of ​​the display panel 100 used for bonding and connecting with the driving component 400. The bonding area NA may include a plurality of first bonding pins 12.

[0049] When the display device is an OLED display device, the display panel 100 may include a substrate 11, and a circuit functional layer, a light-emitting device layer, and an encapsulation layer disposed on one side of the substrate 11. The circuit functional layer may include a plurality of thin film transistors (TFTs), which may be LTPS thin film transistors, oxide thin film transistors, or LPTO thin film transistors, etc. For example, when the display panel 100 includes LTPS thin film transistors, the circuit functional layer may include a stacked active layer, a first gate insulating layer, a first gate conductive layer, a second gate insulating layer, an interlayer insulating layer, and at least one source-drain conductive layer. The light-emitting device layer may include a planarization layer, an anode layer, a pixel defining layer, a light-emitting stack, and a cathode layer; wherein, the light-emitting stack includes, but is not limited to, at least one of a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL). The encapsulation layer may include, but is not limited to, an inorganic insulating layer, an organic insulating layer, and an inorganic insulating layer arranged sequentially. The inorganic insulating layer can function as a water and oxygen barrier, while the organic insulating layer can function as a stress release and planarization layer. The materials of the inorganic insulating layer include, but are not limited to, at least one of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and titanium oxide, while the materials of the organic insulating layer include, but are not limited to, acrylic resin.

[0050] The display panel may also include multiple signal lines, including but not limited to initialization voltage signal lines, power supply voltage signal lines, clock signal lines, start signal lines, data signal lines, and test signal lines. The signal lines may extend to the bonding area NA and be electrically connected to the first bonding pin 12 of the bonding area NA, and be electrically connected to external devices through the first bonding pin 12. For example, the first bonding pin 12 may be configured to be electrically connected to the drive component 400.

[0051] A support module 200 is disposed on the non-display side of the display panel 100 and is attached to the display panel 100. The support module 200 provides support and protection for the display panel 100. Exemplarily, the support module 200 includes, but is not limited to, a back film (BF) and a backplate composite support film (SCF). The backplate composite support film (SCF) includes, but is not limited to, at least one of a support layer, a buffer layer, a heat dissipation layer, and a shielding layer. The support module 200 may expose at least a portion of the bonding area NA of the display panel 100, meaning that the support module 200 is not disposed on the non-display side of at least a portion of the bonding area NA. For example, the support module 200 may not be disposed in the area of ​​the first bonding pin 12 and its surrounding area, so that the first bonding pin 12 can be led out from the non-display side of the display panel 100.

[0052] A functional stack 300 is disposed on the display side of the display panel 100 to provide corresponding functions for the display panel. Exemplarily, the functional stack 300 may include, but is not limited to, a polarizer (POL) and a cover. The polarizer (POL) can be used to reduce the reflection of ambient light by the display panel 100, and the cover can be used to protect the display panel. Exemplarily, the cover may include ultra-thin glass (UTG), which possesses excellent optical properties (high light transmittance), a hard and flat surface (scratch-resistant), and a good tactile feel, effectively protecting the display panel 100 from external impacts, scratches, and the intrusion of moisture and oxygen.

[0053] The driving component 400 may include, but is not limited to, a chip-on-film (COF) 20, a driver IC 21, and a flexible printed circuit (FPC) 22. The COF 20 may include a first connection portion 23, which is disposed in the bonding area NA and located on the side of the groove 13 near the display area AA. The first connection portion 23 is bonded to the surface of the substrate 11 away from the first bonding pin 12 (the lower surface of the substrate 11). In other words, the first connection portion 23 refers to the portion of the COF 20 used for bonding with the substrate 11 of the display panel 100. The COF 20 also includes a plurality of second bonding pins 24, which can be electrically connected to the first bonding pins 12 of the display panel 100 to realize the electrical connection between the COF 20 and the display panel 100. The driver chip 21 can be disposed on the flip-chip film 20, and the flexible printed circuit board 22 can be electrically connected to the flip-chip film 20. The driver chip 21 and the flexible printed circuit board 22 are electrically connected to the display panel 100 through the flip-chip film 20 and are configured to transmit control signals to the display panel 100 to drive the display panel 100 to achieve image display.

[0054] Improving the screen-to-body ratio of display devices is a pressing technical problem that needs to be solved. Reducing the width of the bonding area is a crucial research direction for further enhancing the screen-to-body ratio. One related technology provides a display module that uses a pad bending process to reduce the width of the bonding area (bottom bezel), thereby increasing the screen-to-body ratio. However, the pad bending process has dimensional limitations; under current technology, it cannot further reduce the bottom bezel width of the display module. Another related technology provides a back-side bonding process, where a chip-on-film is bonded to the non-display side of the display panel. For example, a slot is cut into the non-display side of the display panel, exposing the first bonding pin. The chip-on-film is then directly adhered to the non-display side, and a printed connection line is formed between the first and second bonding pins through a printing process, achieving the bonding connection between the chip-on-film and the display panel. Existing back-side bonding processes have several drawbacks. First, the significant height difference (step difference) between the first and second bonding pins, coupled with volume shrinkage after metal printing, can lead to poor continuity and linewidth uniformity in the resulting interconnects. Furthermore, these processes place high demands on the metal material. Second, the large number of interconnects between the flip-chip film and the display panel necessitates individual printing of each interconnect, resulting in prolonged printing time, numerous printing cycles, and accumulated tolerances in the interconnect fabrication process. This can cause positional deviations in the interconnects, ultimately leading to poor reliability of the connection between the flip-chip film and the display panel.

[0055] To solve at least one of the above technical problems, see [reference] Figures 2-6 The display module 1100 provided in the embodiments of this disclosure includes a display panel 100, a flip-chip film 20, a first insulating layer 30, liquid metal 25, and a cover layer 26.

[0056] The display panel 100 includes a display area AA and a bonding area NA located on one side of the display area AA. The display area AA and bonding area NA are described above and will not be repeated here. The display panel 100 also includes a substrate 11, a plurality of first bonding pins 12, and at least one recess 13. The recess 13 is disposed in the bonding area NA, and the recess 13 and the first bonding pins 12 are respectively disposed on opposite sides of the substrate 11. That is, the recess 13 can be disposed on the non-display side of the substrate 11. The recess 13 at least penetrates the substrate 11 and exposes at least a portion of the first bonding pins 12.

[0057] For example, such as Figure 4 As shown, the display panel 100 may include a recess 13, in which the recess 13 simultaneously exposes multiple (all) first bonding pins 12. This helps to reduce the number of recesses 13 and lower the manufacturing difficulty of the recesses 13. For example, as... Figure 5As shown, the display panel 100 may include a plurality of recesses 13. Each recess 13 may expose one first bonding pin 12. This allows adjacent first bonding pins 12 to be separated by portions of the substrate 11 located between adjacent recesses 13, reducing the risk of short circuits between adjacent first bonding pins 12. Exemplarily, the display panel 100 may include a plurality of recesses 13. At least one recess 13 may expose only one first bonding pin 12, and at least one recess 13 may simultaneously expose multiple first bonding pins 12. Alternatively, all recesses 13 may simultaneously expose multiple first bonding pins 12. In the embodiments of this disclosure, the specific number of recesses 13 and the number of first bonding pins 12 exposed by each recess 13 will not be listed individually. Below, only the example of "the display panel 100 including one recess 13, and the recess 13 simultaneously exposing all first bonding pins 12" will be used to exemplarily describe the embodiments of this disclosure.

[0058] See Figures 2-5 The first insulating layer 30 is at least partially disposed on the side of the flip-chip film 20 away from the display panel 100, and at least partially disposed on the side of the substrate 11 away from the first bonding pin 12. Exemplarily, the first insulating layer 30 may cover at least a portion of the substrate 11 where the first bonding pin 12 is disposed, and at least a portion of the flip-chip film 20 where the second bonding pin is disposed. For example, the first insulating layer 30 may cover a plurality of first bonding pins 12, a plurality of second bonding pins 24, and the portion located between the plurality of first bonding pins 12 and the plurality of second bonding pins 24. The first insulating layer 30 may be a single-layer structure, or the first insulating layer 30 may be a multi-layer structure with stacked layers.

[0059] In this process, the portion of the first insulating layer 30 covering the substrate 11 and the portion covering the flip-chip film 20 are continuous film structures. For example, after the flip-chip film 20 is bonded and fixed to the display panel 100 and the support module 200 respectively, the first insulating layer 30 can be formed on the non-display side of the display module, in the area where the flip-chip film 20 is located, and in the area where the first bonding pin 12 is set in the substrate 11, using the same material and in the same MASK process, so that the portion of the first insulating layer 30 covering the flip-chip film 20 and the portion covering the substrate 11 are continuous film structures.

[0060] The first insulating layer 30 may include a plurality of connection holes 31, each connection hole 31 exposing at least a portion of a first bonding pin 12 and at least a portion of a second bonding pin 24. Adjacent first bonding pins 12 and adjacent second bonding pins 24 are separated by the first insulating layer 30. In the embodiments of this disclosure, an electrically connected first bonding pin 12 and a second bonding pin 24 are referred to as a set of bonding pins 101; that is, a connection hole 31 can expose a set of bonding pins 101, and adjacent sets of bonding pins 101 can be separated by the first insulating layer 30. The portion of the first insulating layer 30 located between adjacent connection holes 31 is a barrier portion 32, which can separate adjacent sets of bonding pins 101 from each other, preventing the subsequently formed liquid metal 25 from short-circuiting adjacent sets of bonding pins 101.

[0061] Liquid metal 25 is disposed within the connection hole 31 and electrically connected to the first bonding pin 12 and the second bonding pin 24, respectively. A cover layer 26 is disposed on the side of the first insulating layer 30 and the liquid metal 25 away from the display panel 100, covering at least a portion of the first insulating layer 30. Exemplarily, the cover layer 26 covers at least the peripheral area of ​​each connection hole 31 in the first insulating layer 30. In this way, the cover layer 26, the connection hole 31, and the display panel 100 can form a closed receiving cavity, within which the liquid metal 25 is located, preventing it from overflowing from the connection hole 31. In the embodiments of this disclosure, liquid metal 25 is used to connect the first bonding pin 12 and the second bonding pin 24. Utilizing the fluidity of the liquid metal, connections can be achieved even with high step differences, avoiding problems such as broken connection wires and uneven connection wire widths between the first bonding pin 12 and the second bonding pin 24. Furthermore, liquid metal 25 can be sequentially or simultaneously filled into multiple connection holes 31 by printing, coating or other processes. As long as a first insulating layer 30 with multiple connection holes 31 is prepared (for example, by photolithography to prepare the connection holes 31), it can be ensured that the liquid metal 25 is distributed in a preset position. The precision of photolithography is higher than that of printing, which is beneficial to improving the positional accuracy of the liquid metal 25 and improving the connection reliability between the first bonding pin 12 and the second bonding pin 24.

[0062] For example, the connection hole 31 exposes at least a portion of the recess 13, and the connection hole 31 can expose the first bonding pin 12 through the recess 13. The recess 13 of the display panel 100, the connection hole 31 in the first insulating layer 30, and the cover layer 26 together form a closed receiving cavity, in which liquid metal 25 is simultaneously filled and electrically connected (contacted) with the first bonding pin 12. Furthermore, the aforementioned closed receiving cavity can prevent the liquid metal 25 from overflowing and prevent the liquid metal 25 from flowing in two adjacent receiving cavities and short-circuiting two adjacent sets of bonding pins 101.

[0063] For example, the aforementioned cover layer 26 not only fixes the liquid metal 25, but also protects the bonding area between the flip-chip film 20 and the display panel 100, and improves the mechanical strength and stability and reliability of the display panel 100 in the bonding area NA under high temperature and high humidity conditions. The cover layer 26 can be formed using a thermosetting resin material. Thermosetting resin materials have high crosslinking density and high mechanical properties. For example, the aforementioned thermosetting resin materials include, but are not limited to, polyurethane-modified acrylate, photocationic epoxy resin, etc.

[0064] The coverage area of ​​the cover layer 26 may be the same as the coverage area of ​​the first insulating layer 30, or the coverage area of ​​the cover layer 26 may not be exactly the same as the coverage area of ​​the first insulating wire 50. Exemplarily, the cover layer 26 at least covers the connection hole 31 and the area surrounding the connection hole 31, so that the cover layer 26 and the first insulating layer 30 form a closed receiving cavity, and the cover layer 26 and the first insulating layer 30 cooperate to fix the liquid metal 25 and limit the overflow of the liquid metal 25.

[0065] In some embodiments, the material of the liquid metal 25 may include gallium-based liquid metal. Gallium-based liquid metal can remain liquid at room temperature, and it has high conductivity, which is beneficial for reducing the connection resistance between the first bonding pin 12 and the second bonding pin 24.

[0066] In some embodiments, see Figure 7 In the case where the material of the liquid metal 25 includes gallium-based liquid metal, the display module 1100 may also include a solid gallium oxide layer 39. The solid gallium oxide layer 39 is located between the liquid metal 25 and the capping layer 26. The solid gallium oxide layer 39 is a nanoscale, dense thin film structure, which can not only help constrain the flow of the liquid metal 25, but also prevent oxygen from further contacting the liquid metal 25, thus avoiding further oxidation of the liquid metal 25.

[0067] For example, the solid gallium oxide layer 39 may be formed by oxidation of the surface portion of the liquid metal 25.

[0068] In some embodiments, see Figure 8 and Figure 9 The hydrophilicity of the surface of the first insulating layer 30 away from the substrate 11 is greater than that of the sidewall of the connection hole 31. This avoids the capillary effect of liquid metal 25 on the sidewall of the connection hole 31, that is, it prevents liquid metal 25 from flowing along the sidewall of the connection hole 31 to the surface of the first insulating layer 30 away from the substrate 11, and prevents liquid metal 25 from forming a structure covering the entire surface of the first insulating layer 30. For example, it can prevent liquid metal 25 from flowing to the upper surface of the barrier portion 32, thereby reducing the risk of short circuit of liquid metal 25 in two adjacent connection holes 31 and reducing the risk of short circuit of two adjacent sets of bonding pins 101.

[0069] For example, when the hydrophilicity of the surface of the first insulating layer 30 away from the substrate 11 is greater than the hydrophilicity of the sidewall of the connection hole 31, the liquid metal 25 can be directly filled into the connection hole 31 using a printing process. In this case, the liquid metal 25 is located inside the connection hole 31, and the liquid metal 25 can be prevented from flowing along the sidewall of the connection hole 31 to the surface of the first insulating layer 30 away from the substrate 11.

[0070] In some embodiments, such as Figure 8 and Figure 9 As shown, a first hydrophobic structure 33 can be provided on the sidewall of the first insulating layer 30 surrounding the connection hole 31 to reduce the spreading ability of the liquid metal 25 on the first hydrophobic structure 33 and avoid capillary effect of the liquid metal 25 on the sidewall of the connection hole 31. For example, the first hydrophobic structure 33 may include densely distributed micro-protrusion structures. The cross-sectional shape of the micro-protrusion structure (such as the cross-section parallel to the plane of the first insulating layer) can be semi-circular, triangular, elliptical or any other suitable shape. In addition, the micro-protrusion structure can be columnar in the thickness direction of the first insulating layer 30. In this way, the first hydrophobic structure 33 can be formed directly by photolithography while the connection hole 31 is being prepared, which helps to reduce the preparation difficulty and preparation cost of the first insulating layer 30.

[0071] In some embodiments, see Figure 10 and Figure 11 The hydrophilicity of the surface of the first insulating layer 30 away from the substrate 11 is less than that of the sidewall of the connection hole 31. In this way, the liquid metal 25 can preferentially flow into the connection hole 31, reducing the distribution of the liquid metal 25 on the surface of the first insulating layer 30 away from the substrate 11, thereby reducing the risk of short circuit of the liquid metal 25 in two adjacent connection holes 31 and reducing the risk of short circuit of two adjacent sets of bonding pins 101.

[0072] For example, when the hydrophilicity of the surface of the first insulating layer 30 away from the substrate 11 is less than that of the sidewall of the connection hole 31, a coating process can be used to directly coat a layer of liquid metal 25 onto the surface of the first insulating layer 30. The liquid metal 25 preferentially fills the connection hole 31, and then the liquid metal 25 located on the surface of the first insulating layer 30 is removed. Since the hydrophilicity of the surface of the first insulating layer 30 away from the substrate 11 is less, during the removal of the liquid metal 25 on the surface of the first insulating layer 30, the liquid metal 25 in the connection hole 31 will not flow to the surface of the first insulating layer 30 away from the substrate 11. That is, the liquid metal 25 in the connection hole 31 will not be removed. Based on this, liquid metal 25 that only fills the connection hole 31 can be obtained.

[0073] In some embodiments, such as Figure 10 and Figure 11 As shown, a second hydrophobic structure 34 is provided on the surface of the first insulating layer 30 away from the substrate 11 to reduce the hydrophilicity of the surface of the first insulating layer 30 away from the substrate 11 and reduce the spreading ability of the liquid metal 25 on the second hydrophobic structure 34. Exemplarily, the second hydrophobic structure 34 may include multiple micro-protrusion structures or multiple micro-groove structures. Furthermore, the first insulating layer 30 can be formed using a printing process, thus the second hydrophobic structure 34 can be directly formed during the printing of the first insulating layer 30, reducing the fabrication difficulty of the second hydrophobic structure 34 and the fabrication cost of the first insulating layer 30.

[0074] In some embodiments, the wettability of the liquid metal 25 on the surface of the preset liquid is less than the wettability of the liquid metal 25 on the first insulating layer 30, and the preset liquid and the liquid metal are immiscible. That is, in an air environment, the contact angle of the liquid metal 25 on the first insulating layer 30 is less than the contact angle of the liquid metal 25 on the functional layer 36 in a preset liquid environment (where a layer of preset liquid adheres to the surface of the first insulating layer 30). Thus, in an air environment, the liquid metal 25 can spread on the connection hole 31 and the first insulating layer 30. Then, the layer of preset liquid adhering to the surface of the first insulating layer 30 can drive away or remove the liquid metal 25 from the surface of the first insulating layer 30 (see below for the manufacturing method of the display module), thereby ensuring that the liquid metal 25 only fills the connection hole 31.

[0075] In some embodiments, see Figure 12The first insulating layer 30 may include a substrate layer 35 and a functional layer 36 stacked together. The functional layer 36 is disposed on the side of the substrate layer 35 away from the display panel 100, and at least covers the portion of the substrate layer 35 located between two adjacent connection holes 31. For example, the functional layer 36 may be disposed around the connection holes 31, or the functional layer 36 may cover the upper surface of the substrate layer 35 (the surface away from the substrate 11). The wettability of the liquid metal 25 on the surface of the preset liquid is less than the wettability of the liquid metal 25 on the functional layer 36, and the preset liquid and the liquid metal are immiscible.

[0076] In some embodiments, the material of the functional layer 36 includes at least one of polydimethylsiloxane (PDMS), polyethylene terephthalate (PET), polyimide (PI), polyvinyl chloride (PVC), polyacrylate viscoelastic (PU), and VHB. And / or, the preset solution includes ethanol. In one specific example, the material of the functional layer includes PDMS, and in an air environment, the contact angle of the liquid metal 25 on the PDMS is approximately 50°, for example, the contact angle of the liquid metal 25 on the PDMS may be less than or equal to 50°. In an ethanol environment, the contact angle of the liquid metal 25 on the functional layer 36 is approximately 130°, for example, the contact angle of the liquid metal 25 on the functional layer 36 may be greater than or equal to 130°. It can be seen that the contact angle of liquid metal 25 on the surface of PDMS varies greatly under different environments (air / ethanol). That is, the wettability of liquid metal 25 on the surface of the preset liquid (ethanol) is less than that on the functional layer 36.

[0077] When the display module 1100 includes a functional layer 36, the material of the liquid metal 25 may include gallium-based liquid metal and doped metal material. The doped metal material is used to reduce the fluidity of the liquid metal 25, giving it a certain shape retention capability, and preventing the liquid metal 25 from flowing rapidly to the surface of the first insulating layer 30 after the preset solution is removed (see below for the fabrication method of the display module), thus preventing short circuits in the liquid metal 25 within adjacent connection holes 31. For example, the doped metal material and the gallium-based liquid metal can together form a semi-liquid metal.

[0078] In some embodiments, the doped metal material includes silver-plated copper particles. Exemplarily, the mass percentage of the silver-plated copper particles can be 10 wt% to 20 wt%, for example, the mass percentage of the silver-plated copper particles can be 10 wt%, 13 wt%, 15 wt%, 18 wt%, or 20 wt%, etc., and the embodiments of this disclosure will not be listed one by one.

[0079] In other embodiments, the first insulating layer 30 may also include only the functional layer 36, that is, the first insulating layer 30 may not have a substrate layer.

[0080] In some embodiments, see Figure 3 and Figure 4 The flip-chip film 20 is located near the end of the groove 13 and has a first gap D1 between it and the groove 13. The display module 1100 also includes an adhesive layer 40 and a dispensing portion 28. The adhesive layer 40 may include a first adhesive portion 41, which is located between the first connecting portion 23 and the substrate 11 and is bonded to the first connecting portion 23 and the substrate 11 respectively.

[0081] See Figure 3 In some embodiments, the distance D2 between the first adhesive portion 41 and the groove 13 is greater than or equal to the first distance D1, i.e., D2≥D1. In this way, an inwardly recessed portion is formed between the flip-chip film 20, the first adhesive portion 41 and the substrate 11. After the adhesive layer 40 is deformed by compression, the first adhesive portion 41 will not overflow the edge of the flip-chip film 20 (first connecting portion 23), that is, there will be no adhesive overflow problem at the bonding position between the flip-chip film 20 and the display panel 100.

[0082] The dispensing portion 28 is disposed at the first interval D1, and the surface of the dispensing portion 28 in contact with the first insulating layer 30 forms a first slope 29, one end of the first slope 29 extending to the edge of the groove 13 (e.g., Figure 3 (as shown) or extends to the first bonding pin 12 (as shown) Figure 13 As shown, the other end extends to the flip-chip film 20. The dispensing portion 28 can be used to modify the step difference between the flip-chip film 20 and the first bonding pin 12, modifying the vertical step difference into a gentle slope shape. This is beneficial for the preparation of the first insulating layer 30 and facilitates the flow of liquid metal in the subsequently formed connection hole 31.

[0083] See Figure 3 and Figure 13In some embodiments, the dispensing portion 28 and the first insulating layer 30 may also comprise different materials and be formed separately in different processes. For example, the dispensing portion 28 may be formed by a dispensing process, and the first insulating layer 30 may be formed by a printing process or a photolithography process. Alternatively, the dispensing portion 28 and the first insulating layer 30 may comprise the same material, but they may be formed separately in different processes.

[0084] In other embodiments, see Figure 14 The dispensing portion 28 may be integrally formed with the first insulating layer 30, using the same material. Exemplarily, the dispensing portion 28 and the first insulating layer 30 are made of insulating material and formed simultaneously in a single process step using one of the following methods: dispensing, printing, or photolithography.

[0085] See Figure 5 , Figure 6 and Figure 15 In some embodiments, the first adhesive portion 41 extends approximately in a straight line near the edge of the groove 13. In this case, the dispensing portion 28 can be provided to fill the above-mentioned groove to prevent the liquid metal 25 from short-circuiting in the groove.

[0086] In other embodiments, see Figure 16 The flip-chip film 20 has a first gap D1 between it and the groove 13 near its end. Liquid metal 25 covers the first gap D1 and at least partially fills the space between the first connector 23 and the substrate 11. In other words, the dispensing part 28 can be omitted at the first gap D1. The fluidity of the liquid metal 25 can be used to directly fill the step difference between the flip-chip film 20 and the first bonding pin 12 without causing breakage at the step difference location (where the first gap D1 is located).

[0087] See Figure 16 , Figure 17 and Figure 18 Without the dispensing portion 28 at the first interval D1, the edge of the first adhesive portion 41 near the groove 13 may include a plurality of protrusions 42 extending toward the groove 13, the plurality of protrusions 42 being spaced apart along the extending direction of the first adhesive portion 41 near the edge of the groove 13. The first insulating layer 30 includes a barrier portion 32 located between two adjacent connecting holes 31, one barrier portion 32 contacting one protrusion 42. The protrusion 42 can reduce the inward dimension of the edge of the first adhesive portion 41, facilitating contact between the barrier portion 32 and the protrusion 42, and the barrier portion 32 and the protrusion 42 together separate two adjacent connecting holes 31, further reducing the risk of short circuit of the liquid metal 25 in the groove.

[0088] In some embodiments, such as Figure 3As shown, the flip-chip film 20 may further include a second connecting portion 37, and the adhesive layer 40 may further include a second adhesive portion 43. The second adhesive portion 43 is located between the support module 200 and the second connecting portion 37, and is respectively bonded to the support module 200 and the second connecting portion 43.

[0089] Some embodiments of this disclosure also provide a method for manufacturing a display module, which can be used to manufacture the display module described in any of the above embodiments. The method for manufacturing the display module may include steps S10 to S60.

[0090] S10, see reference Figure 19 Provides an initial display panel of 100'.

[0091] The initial display panel 100' includes a display area AA and a bonding area NA located on one side of the display area AA. The initial display panel 100' also includes a plurality of first bonding pins 12 disposed on one side of the substrate 11, and the first bonding pins 12 are disposed in the bonding area NA. For other structures of the initial display panel 100', please refer to the structure of the display panel 100 above, and will not be repeated here.

[0092] S20, see S20. Figure 20 and Figure 21 At least one groove 13 is formed on the non-display side of the substrate 11.

[0093] The groove 13 penetrates at least through the substrate 11 and exposes at least a portion of the first bonding pin 12. The number of grooves 13 can be one or more; the number of grooves 13 and the number of first bonding pins 12 exposed by the grooves 13 are described above and will not be repeated here. Figure 21 and Figure 22 In this document, only one example of "the number of grooves 13 is one, and the groove 13 exposes all the first bonding pins 12" is used to illustrate the embodiments of this disclosure.

[0094] For example, the aforementioned groove 13 can be formed on the non-display side of the substrate 11 by an etching process.

[0095] In some embodiments, after step S20 and before step S30, the method for preparing the display module may further include step S21.

[0096] S21, see S21. Figure 22 A support module 200 is formed on the non-display side of the display panel 100, and a functional stack 300 is formed on the display side of the display panel 100.

[0097] The composition and structure of the support module 200 and the functional stack 300 are described above and will not be repeated here.

[0098] S30, see reference Figure 23 A flip-chip film 20 is bonded to the non-display side of the substrate 11.

[0099] The flip-chip film 20 may include a first connecting portion 23 and a second connecting portion 37. The first connecting portion 23 is disposed in the bonding area NA, located on the side of the groove 13 near the display area AA, and is bonded to the display panel 100. The flip-chip film 20 includes a plurality of second bonding pins 24. The second bonding portion 37 is disposed on the side of the support module 200 away from the display panel 100, and is bonded to the support module 200.

[0100] In some embodiments, step S30, which involves bonding a flip-chip film to the non-display side of the substrate, includes steps S31 and S32.

[0101] S31, adhesive layer 40 is bonded to the non-display side of substrate 11.

[0102] The adhesive layer 40 may include a first adhesive portion 41 and a second adhesive portion 43. The first adhesive portion 41 is located in the fan-out area NA of the display panel 100 and is spaced from the recess 13. The first connecting portion 23 is bonded and fixed to the display panel 100 via the first adhesive portion 41. The second adhesive portion 43 is located on the side of the support module 200 away from the display panel and is bonded to both the support module 200 and the second connecting portion 37. That is, the second connecting portion 37 is bonded to the support module 200 via the second adhesive portion 43.

[0103] S32, the first connecting portion 23 of the flip-chip film 20 is bonded to the first adhesive portion 41. At the same time, the second connecting portion 37 of the flip-chip film 20 can also be bonded to the second adhesive portion 43.

[0104] Wherein, the distance D1 between the orthographic projection of the first connecting part 23 on the substrate 11 and the groove 13 is smaller than the distance D2 between the first adhesive part 41 and the groove.

[0105] In some embodiments, after step S32 and before step S40, the method for preparing the display module may further include S35.

[0106] S35, see S35. Figure 24 An adhesive dispensing portion 28 is formed between the first connecting portion 23 and the groove 13.

[0107] The dispensing portion 28 is at least partially disposed at the first interval D1, and the surface of the dispensing portion 28 that contacts the first insulating layer 30 forms a first slope 29, one end of which extends to the edge of the groove 13 (e.g., Figure 24 (as shown) or extends to the first bonding pin 12 (as shown) Figure 13On the dispensing portion 28 shown, the other end of the first slope 29 extends to the flip-chip film 20. The dispensing portion 28 can be used to modify the step difference between the flip-chip film 20 and the first bonding pin 12, modifying the vertical step difference into a gentle slope shape. This facilitates the preparation of the first insulating layer 30 and allows the liquid metal to flow within the subsequently formed connection hole 31. Hereinafter, unless otherwise stated, embodiments of this disclosure will be described exemplarily using the method of preparing a display module including the above-described step S35 as an example.

[0108] S40, see S40. Figure 25 , Figure 26 and Figure 27 A first insulating layer 30 is formed on the side of the flip-chip film 20 away from the display panel 100.

[0109] The first insulating layer 30 includes a plurality of connection holes 31, each connection hole 31 exposing at least a portion of a first bonding pin 12 and at least a portion of a second bonding pin 24, and adjacent first bonding pins 12 and adjacent second bonding pins 24 are separated by the first insulating layer 30.

[0110] For example, the first insulating layer 30 includes a barrier portion 32 located between two adjacent connection holes 31, the barrier portion 32 separating two adjacent first bonding pins 12 and separating two adjacent second bonding pins 24.

[0111] For example, the first insulating layer 30 described above can be formed by printing processes (such as inkjet printing, five-axis dispensing, etc.) or photolithography processes. The material and coverage area of ​​the first insulating layer 30 are described above and will not be repeated here.

[0112] S50, see S50. Figure 28 and Figure 29 Liquid metal 25 is filled into the connection hole 31.

[0113] Liquid metal 25 is electrically connected to the first bonding pin 12 and the second bonding pin 24 exposed by the connection hole 31.

[0114] For example, liquid metal 25 can be filled into the area of ​​connection hole 31 by printing, coating or other suitable processes.

[0115] S60, a cover layer 26 is formed on the side of the first insulating layer 30 and the liquid metal 25 away from the display panel 100.

[0116] The cover layer 26 and the connecting hole 31 form a receiving cavity; the liquid metal 25 is located inside the receiving cavity. After the above steps S10~S60, a structure as shown can be formed. Figure 2 , Figure 3 and Figure 6The display module 1100 shown is shown.

[0117] In some embodiments, the method for fabricating the display module may include the steps S10-S60 described above. Unlike the embodiments described above, in this embodiment, during step S40, when forming the first insulating layer 30 on the side of the flip-chip film 20 away from the display panel 100, a first hydrophobic structure 33 may be formed on the sidewall of the connection hole 31. The first hydrophobic structure 33 can be found in [reference needed]. Figure 8 and Figure 9 The embodiments disclosed herein will not be described in detail.

[0118] In some embodiments, the method for manufacturing the display module may include steps S10 to S60 described above. However, unlike the above embodiments, in this embodiment, the method for manufacturing the display module may not include step S35, i.e., the dispensing portion 28 is not specifically formed through a dispensing process. In this case, refer to... Figure 30 The first insulating layer 30 can be formed using a printing process. Thus, during the formation of the first insulating layer 30 in step S40, the dispensing portion 28 can be formed. At this time, the dispensing portion 28 and the first insulating layer 30 comprise the same material and are formed simultaneously; the dispensing portion 28 can also be considered a part of the first insulating layer 30. Therefore, after step S60, a... Figure 14 The display module shown.

[0119] In some embodiments, the method for fabricating the display module may include the steps S10-S60 described above. Unlike the previous embodiments, in this embodiment, during the formation of the first insulating layer 30 in step S40, a second hydrophobic structure 34 can be formed on the surface of the first insulating layer 30 away from the display panel 100. Thus, after step S60, a second hydrophobic structure 34 can be formed. Figure 11 The display module shown. The second hydrophobic structure 34 formed in this embodiment can be combined with any of the aforementioned embodiments other than the one having the first hydrophobic structure 33.

[0120] In some embodiments, the method for fabricating a display module may include the steps S10-S60 described above. The difference from the above embodiments is that in this embodiment, the method for fabricating a display module may not include step S35, i.e., the dispensing portion 28 is not specifically formed via a dispensing process, and the dispensing portion 28 is not specifically formed during the formation of the first insulating layer 30 in step S40. In this case, the fluidity of the liquid metal 25 can be utilized to directly fill the step difference between the flip-chip film 20 and the first bonding pin 12, without causing breakage at the step difference location (where the first interval D1 is located). Thus, after step S60, a layer as described above can be formed. Figures 15-18 The display module shown.

[0121] For example, see Figure 31 In the above step S31, the first adhesive part 41 extends approximately in a straight line near the edge of the groove 13, or in other words, the first adhesive part 41 is approximately flush with the edge of the groove 13.

[0122] For example, see Figure 32 The first adhesive portion 41 near the edge of the groove 13 may include a plurality of protrusions 42 extending toward the groove 13, the plurality of protrusions 42 being spaced apart along the extending direction of the first adhesive portion 41 near the edge of the groove 13. In this case, the first insulating layer 30 includes a barrier portion 32 located between two adjacent connecting holes 31, with one barrier portion 32 contacting one protrusion 42. The protrusions 42 can reduce the inward dimension of the edge recess of the first adhesive portion 41, facilitating contact between the barrier portion 32 and the protrusion 42, and the barrier portion 32 and the protrusion 42 together separate two adjacent connecting holes 31, further reducing the risk of short circuit of the liquid metal 25 within the groove.

[0123] In some embodiments, the method for preparing the display module may include the steps S10 to S60 described above. The difference from the above embodiments is that, in this embodiment, after step S50 "filling the connection hole 31 with liquid metal 25" and before step S60 "forming a cover layer 26 on the side of the first insulating layer 30 and the liquid metal 25 away from the display panel 100", the method for preparing the display module may also include step S55.

[0124] S55, see S55. Figure 33 The surface layer of liquid metal 25 is oxidized to form a solid gallium oxide layer 39.

[0125] For example, after the liquid metal 25 is formed, the surface of the liquid metal 25 can be oxidized using oxygen (O2) and nitrous oxide (N2O). A nanoscale, dense, and self-limiting solid gallium oxide layer 39 can be rapidly formed on the surface of the liquid metal 25. The solid gallium oxide layer 39 formed can prevent the interior of the liquid metal 25 from continuing to contact with oxygen. Therefore, the thickness of the solid gallium oxide layer 39 will not increase indefinitely, and the interior of the liquid metal 25 will not be completely oxidized. Only a solid gallium oxide layer 39 is formed on the surface of the liquid metal 25.

[0126] The solid gallium oxide layer 39 can help fix and confine the liquid metal 25, reducing the risk of liquid metal 25 overflowing. After steps S10-S50, and steps S55 and S60, a layer as shown can be formed. Figure 2 , Figure 3 and Figure 7 The display module 1100 shown is shown.

[0127] The above step S55 can be used in combination with the display module preparation method described in any of the foregoing embodiments. That is, step S55 can be added to any of the above embodiments. The embodiments of this disclosure will not list the combinations of step S55 with the above embodiments one by one.

[0128] In some embodiments, the wettability of the liquid metal 25 on the surface of the preset liquid is less than the wettability of the liquid metal on the first insulating layer, and the preset liquid and the liquid metal are immiscible. The first insulating layer 30 includes a substrate layer 35 and a functional layer 36 (see above, not repeated here), the functional layer 36 is disposed on the side of the substrate layer 35 away from the display panel 100, and at least covers the portion of the first insulating layer located between two adjacent connection holes 31. The liquid metal material includes gallium-based liquid metal and doped metal material, the doped metal material including silver-plated copper particles. The material of the functional layer 36 may include at least one of polydimethylsiloxane, polyethylene terephthalate, polyimide, polyvinyl chloride, polyurethane and polyacrylate viscoelastic; and / or, the preset solution includes ethanol. At this time, the above step S50 of filling the connection hole 31 with liquid metal 25 may include S51~S54.

[0129] S51, see S51. Figure 34 A full layer of liquid metal 25 is coated on the side of the first insulating layer 30 away from the display panel 100.

[0130] Liquid metal 25 fills at least a portion of the surfaces of the connection hole 31 and the first insulating layer 30.

[0131] S52, see S52. Figure 35 A preset solution 38 is applied to the side of the liquid metal 25 away from the display panel 100.

[0132] The preset solution 38 covers the liquid metal layer 25.

[0133] S53, see S53. Figure 36 Use a needle to separate the preset solution 38 and liquid metal 25 from the preset area.

[0134] For example, the preset area may include all areas of the functional layer 36 except for the area where the connecting hole 31 is located. Furthermore, during step S53, the area of ​​the functional layer 36 that is cut open can quickly be covered with a layer of preset solution 38. That is, the area where the preset solution 38 is located can be the same as the area of ​​the preset solution 38 formed in step S52. Since the liquid metal has poor wettability in the preset solution environment, i.e., the contact angle of the liquid metal on the surface of the functional layer 36 covered with the preset solution is large, it can act as a physical barrier, preventing the liquid metal 25 from reflowing to the surface of the functional layer 36; that is, the liquid metal 25 can remain within the connecting hole 31. During step S53, the portion of the preset solution and liquid metal located within the connecting hole 31 is not cut open; therefore, the portion of the preset solution and liquid metal located within the connecting hole 31 can be retained.

[0135] For example, in step S53 above, in order to prevent the preset solution (ethanol) from damaging other structures of the display module, the sides of the display module can be protected with a mold.

[0136] S54, see also Figure 37 Evaporate the preset solution.

[0137] For example, to prevent the liquid metal 25 from reflowing to the surface of the functional layer 36 during step S54, the material of the liquid metal 25 may include gallium-based liquid metal and doped metal material; the doped metal material is used to reduce the fluidity of the liquid metal 25, giving the liquid metal 25 a certain shape retention capability. The selection of the doped metal material is described above and will not be repeated here.

[0138] The above steps S51 to S54 can be used in combination with the preparation method of the display module described in any of the foregoing embodiments. That is, in any of the above embodiments, steps S51 to S54 can be used to fill the connection hole 31 with liquid metal 25. The embodiments of this disclosure will not list the combinations of steps S51 to S54 with the foregoing embodiments one by one.

[0139] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: The display panel includes a display area and a bonding area located on one side of the display area. The display panel also includes a substrate, a plurality of first bonding pins and at least one groove. The first bonding pins and the groove are both disposed in the bonding area and are respectively disposed on both sides of the substrate. The groove at least passes through the substrate and exposes at least a portion of the first bonding pins. A flip-chip film is disposed on the non-display side of the display panel, including a first connecting portion and a plurality of second bonding pins. The first connecting portion is disposed in the bonding area and located on the side of the groove closer to the display area. The first connecting portion is bonded to the surface of the substrate away from the first bonding pin. A first insulating layer is at least partially disposed on the side of the flip-chip film away from the display panel and at least partially disposed on the side of the substrate away from the first bonding pin. The first insulating layer includes a plurality of connection holes, each connection hole exposing at least a portion of a first bonding pin and at least a portion of a second bonding pin. Adjacent first bonding pins and adjacent second bonding pins are separated by the first insulating layer. Liquid metal is disposed within the connection hole and electrically connected to the first bonding pin and the second bonding pin, respectively; A cover layer is disposed on the side of the first insulating layer and the liquid metal away from the display panel, covering the first insulating layer and forming a receiving cavity with the connection hole; wherein the liquid metal is located within the receiving cavity.

2. The display module according to claim 1, characterized in that, The liquid metal is made of gallium-based liquid metal.

3. The display module according to claim 2, characterized in that, The display module also includes: A solid gallium oxide layer is located between the liquid metal and the capping layer.

4. The display module according to claim 1, characterized in that, The hydrophilicity of the surface of the first insulating layer away from the substrate is greater than the hydrophilicity of the sidewall of the connection hole.

5. The display module according to claim 4, characterized in that, The first insulating layer has a first hydrophobic structure around the sidewall of the connection hole.

6. The display module according to claim 1, characterized in that, The hydrophilicity of the surface of the first insulating layer away from the substrate is less than that of the sidewall of the connecting hole.

7. The display module according to claim 6, characterized in that, The surface of the first insulating layer away from the substrate has a second hydrophobic structure.

8. The display module according to any one of claims 1 to 7, characterized in that, The wettability of the liquid metal on the surface of the preset liquid is less than the wettability of the liquid metal on the first insulating layer, and the preset liquid and the liquid metal are immiscible.

9. The display module according to claim 8, characterized in that, The first insulating layer includes a substrate layer and a functional layer stacked together. The functional layer is disposed on the side of the substrate layer away from the display panel and at least covers the portion of the first insulating layer located between two adjacent connection holes. The materials of the functional layer include polydimethylsiloxane, polyethylene terephthalate, polyimide, polyvinyl chloride, polyurethane, and polyacrylate viscoelastics; and / or, the preset solution includes ethanol.

10. The display module according to claim 8, characterized in that, The liquid metal material includes gallium-based liquid metal and doped metal material; the doped metal material includes silver-plated copper particles.

11. The display module according to any one of claims 1 to 7, characterized in that, The flip-chip film has a first gap between its end near the groove and the groove; the display module further includes: An adhesive layer includes a first adhesive portion located between the first connecting portion and the substrate, and is bonded to both the first connecting portion and the substrate. A dispensing section is disposed at the first interval, and the surface of the dispensing section in contact with the first insulating layer forms a first slope. One end of the first slope extends to the edge of the groove or the first bonding pin, and the other end extends to the flip-chip film.

12. The display module according to claim 11, characterized in that, The distance between the first adhesive portion and the groove is greater than or equal to the first distance.

13. The display module according to claim 11, characterized in that, The dispensing portion and the first insulating layer are made of the same material and are integrally formed.

14. The display module according to any one of claims 1 to 7, characterized in that, The flip-chip film has a first gap between its end near the groove and the groove; the display module further includes: An adhesive layer includes a first adhesive portion located between the first connecting portion and the substrate, and bonded to both the first connecting portion and the substrate. The distance between the first adhesive portion and the groove is greater than or equal to the first distance. The liquid metal covers the first gap and at least partially fills the space between the first connection and the substrate.

15. The display module according to claim 14, characterized in that, The first adhesive portion near the edge of the groove includes a plurality of protrusions extending toward the groove, and the plurality of protrusions are spaced apart along the extending direction of the first adhesive portion near the edge of the groove. The first insulating layer includes a barrier portion located between two adjacent connection holes, one of the barrier portions contacting one of the protrusions.

16. The display module according to claim 1, characterized in that, The display panel includes a plurality of the recesses, one of the recesses exposing one of the first bonding pins.

17. The display module according to claim 1, characterized in that, The display panel includes one of the recesses, the recess exposing a plurality of the first bonding pins; or... The display panel includes a plurality of said recesses, at least one of said recesses exposing a plurality of the first bonding pins.

18. The display module according to claim 1, characterized in that, The display module also includes: A support module is disposed on the non-display side of the display panel and connected to the substrate; The adhesive layer includes a first adhesive portion and a second adhesive portion. The first adhesive portion is located between the first connecting portion and the substrate, and is bonded to both the first connecting portion and the substrate. The flip-chip film also includes a second connecting portion. The second adhesive portion is located between the support module and the second connecting portion, and is bonded to both the support module and the second connecting portion. The driver chip is electrically connected to the second connection portion of the flip-chip film.

19. A method for manufacturing a display module, characterized in that, The preparation method includes: An initial display panel is provided, the initial display panel including a display area and a bonding area located on one side of the display area, the initial display panel further including a plurality of first bonding pins disposed on one side of the substrate, the first bonding pins being disposed in the bonding area; At least one groove is formed on the non-display side of the substrate, the groove extending at least through the substrate and exposing at least a portion of the area of ​​the first bonding pin; A flip-chip film is bonded to the non-display side of the substrate. The flip-chip film includes a first connecting portion, which is disposed in the bonding area, located on the side of the groove near the display area, and is bonded to the display panel. The flip-chip film includes a plurality of second bonding pins. A first insulating layer is formed on the side of the flip-chip film away from the display panel. The first insulating layer includes a plurality of connection holes, each connection hole exposing at least a portion of a first bonding pin and at least a portion of a second bonding pin. Adjacent first bonding pins and adjacent second bonding pins are separated by the first insulating layer. Liquid metal is filled into the connection hole, and the liquid metal is electrically connected to the first bonding pin and the second bonding pin exposed in the connection hole, respectively; A cover layer is formed on the side of the first insulating layer and the liquid metal away from the display panel, and the cover layer and the connection hole form a receiving cavity; the liquid metal is located in the receiving cavity.

20. The preparation method according to claim 19, characterized in that, The wettability of the liquid metal on the surface of the preset liquid is less than the wettability of the liquid metal on the first insulating layer, and the preset liquid and the liquid metal are immiscible; the first insulating layer includes a substrate layer and a functional layer stacked together, the functional layer being disposed on the side of the substrate layer away from the display panel, and at least covering the portion of the first insulating layer located between two adjacent connection holes; the liquid metal material includes gallium-based liquid metal and doped metal material, the doped metal material including silver-plated copper particles; filling the connection holes with liquid metal includes: A full layer of liquid metal is applied to the side of the first insulating layer away from the display panel, and the liquid metal fills the connection hole and at least a portion of the surface of the first insulating layer; A preset solution is applied to the side of the liquid metal away from the display panel, and the preset solution covers the liquid metal layer; Use a needle to separate the preset solution and liquid metal from the preset area, leaving the portion of the preset solution and liquid metal located in the connection hole; The preset solution is evaporated.

21. The preparation method according to claim 20, characterized in that, The materials of the functional layer include polydimethylsiloxane, polyethylene terephthalate, polyimide, polyvinyl chloride, polyurethane, and polyacrylate viscoelastics; and / or, The preset solution includes ethanol.

22. The preparation method according to claim 19, characterized in that, After filling the connection hole with liquid metal and before forming the capping layer, the preparation method further includes: The surface portion of the liquid metal is oxidized to form a solid gallium oxide layer.

23. The preparation method according to any one of claims 19 to 22, characterized in that, The non-display side of the substrate is bonded with a flip-chip film comprising: An adhesive layer is bonded to the non-display side of the substrate. The adhesive layer includes a first adhesive portion located in the fan-out region and spaced from the groove. The first adhesive portion near the edge of the groove includes a plurality of protrusions extending toward the groove, and the plurality of protrusions are spaced apart along the extending direction of the first adhesive portion near the edge of the groove. The first connecting portion of the flip-chip film is bonded to the first adhesive portion, wherein the distance between the orthographic projection of the first connecting portion on the substrate and the groove is greater than the distance between the first adhesive portion and the groove; The first insulating layer includes a barrier portion located between two adjacent connection holes, one of the barrier portions being in contact with one of the protrusions, and the liquid metal being at least partially filled within the space enclosed by the substrate, the flip-chip film, and the adjacent protrusions.

24. The preparation method according to any one of claims 19 to 22, characterized in that, The non-display side of the substrate is bonded with a flip-chip film comprising: An adhesive layer is bonded to the non-display side of the substrate. The adhesive layer includes a first adhesive portion located in the fan-out region and spaced from the groove. The first adhesive portion is approximately flush with the edge of the groove. The first connecting portion of the flip-chip film is bonded to the first adhesive portion, and the distance between the orthographic projection of the first connecting portion on the substrate and the groove is greater than the distance between the first adhesive portion and the groove; a step is formed between the flip-chip film and the first bonding pin; After the formation of the first insulating layer and before the formation of the capping layer, the preparation method further includes: A dispensing portion is formed at the step, and a first slope is formed on the surface of the dispensing portion away from the substrate. One end of the first slope extends to the edge of the groove, and the other end extends to the flip-chip film.

25. A display device, characterized in that, include: The display module as described in any one of claims 1 to 18; The driver circuit board, electrically connected to the display module, is configured to transmit control signals to the display module.

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