An integrated circuit cutting method

Abstract

The application discloses an integrated circuit cutting method, and belongs to the field of integrated circuit manufacturing.The product comprises a ball mounting surface a and a plastic sealing surface b; the product is attached to a film with the ball mounting surface a facing the film; the adhesion of the film is reduced by UV irradiation; the product is cut from the plastic sealing surface b; a recognition point is arranged at the position of the front frame of the product, and the recognition point is used for alignment when the product is cut, so that single cutting operation of the product is realized to form single product.The UV residual glue problem of FCBGA / BGA products during cutting is solved, the deburring operation difficulty is improved, the process yield and efficiency are improved, and the mass production demand is met.

Description

Technical Field

[0001] This invention belongs to the field of integrated circuit manufacturing technology, specifically referring to an integrated circuit dicing method. Background Technology

[0002] Traditional FCBGA / BGA packaging dicing processes mostly employ the Jig saw method, where the spherical surface faces down and the colloid surface faces up, using a fixture as a fixed carrier to complete the dicing operation. This process revealed several limitations in the early stages of mass production: First, the spherical surface directly contacts the fixture, making it susceptible to contamination or watermark defects from coolant and fixture residues on the solder ball surface during dicing. This affects solder wetting during subsequent SMT soldering, leading to risks such as cold solder joints and decreased connection reliability. Second, colloid burrs generated during dicing tend to remain on the dicing edges. Subsequent deburring processes using brushes are difficult to effectively clean in corner areas due to fixture positioning limitations, making burr residue difficult to eliminate. Furthermore, the Jig saw process relies on dedicated fixtures for single-batch fixation, requiring frequent fixture loading, unloading, and cleaning during production. This not only limits production efficiency but also increases the risk of secondary contamination due to fixture wear and inadequate cleaning, making it unsuitable for the efficiency and quality requirements of large-scale mass production. Summary of the Invention

[0003] In response to the above issues and to overcome the shortcomings of existing technologies, this invention provides an integrated circuit cutting method that effectively solves the problems of the current market where additional cutting path identification points need to be designed on the front side of the substrate, increasing substrate design and manufacturing costs; the direct contact between the spherical surface and the fixture during cutting, which easily leads to contamination and watermark defects, affecting the reliability of subsequent soldering; and the fixture positioning method makes subsequent brush deburring processes difficult, making it hard to completely remove colloidal burrs, resulting in poor overall workability.

[0004] The technical solution adopted by this invention is as follows: This invention proposes an integrated circuit cutting method, including a product comprising a spherical surface a and a plastic cover b;

[0005] The product is mounted on the film with the spherical surface a facing the film;

[0006] UV irradiation reduces the film's viscosity;

[0007] The product is cut from the plastic cover b. Identification points are set at the front edge of the product. These identification points are used for alignment during product cutting to achieve single-piece cutting of the product.

[0008] Preferably, the identification point is located in the non-working area of ​​the product frame, and the position of the identification point corresponds to the position of the cutting channel.

[0009] Preferably, the identification point is located on the extension line of the cutting track.

[0010] Preferably, the shape of the identification point includes at least one of T-shape, cross shape, and rice shape.

[0011] Preferably, the identification point is T-shaped, and there are two sets of identification points, with the center of the two sets of identification points coinciding with the center of the cutting channel.

[0012] Preferably, the method for forming the strip product includes:

[0013] The product is then sealed and marked.

[0014] Perform a partial cutting operation on the encapsulating material of the product;

[0015] A sputtering operation is performed on the surface of the product to form a sputtered layer;

[0016] Solder ball placement is performed on the product.

[0017] Preferably, the process of cutting the product into individual pieces to form a single product includes:

[0018] Remove burrs from the cutting grooves of individual products;

[0019] Individual products are peeled off the film and picked up into a tray;

[0020] The individual product is subjected to automatic optical inspection.

[0021] Preferably, removing burrs from the cutting path of a single product includes: repeatedly moving the brush along direction a or b to remove the burrs from the cutting path.

[0022] The beneficial effects of the present invention using the above structure are as follows: This solution proposes an integrated circuit cutting method. This method adopts a process sequence of first removing UV coating and then cutting, and a cutting method with the ball facing down in the cutting process of FCBGA / BGA products with solder balls. It also sets a special cutting identification point on the front edge of the substrate. This effectively solves the problems of UV residue and difficulty in deburring in traditional processes, significantly improves process yield and operation efficiency, meets the mass production requirements of new products, and achieves stable mass production. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of an integrated circuit dicing method proposed in this invention.

[0024] Figure 2 This is a schematic diagram of the product encapsulation and marking process for an integrated circuit cutting method proposed in this invention;

[0025] Figure 3 This is a schematic diagram of a colloidal half-cutting method for an integrated circuit cutting method proposed in this invention.

[0026] Figure 4 This is a schematic diagram of a colloidal half-cut side view of an integrated circuit cutting method proposed in this invention.

[0027] Figure 5 This is a schematic diagram of the sputtering process on the surface of a product according to the integrated circuit cutting method proposed in this invention;

[0028] Figure 6 This is a schematic diagram of the ball-mounting method for integrated circuit cutting proposed in this invention.

[0029] Figure 7 This is a schematic diagram illustrating the deburring process for an integrated circuit cutting method proposed in this invention.

[0030] Figure 8 This is a frontal view of a product placed in a tray according to the integrated circuit cutting method proposed in this invention;

[0031] Figure 9 This is a schematic diagram of the back of a product placed in a tray according to the integrated circuit cutting method proposed in this invention;

[0032] Figure 10 This is a schematic diagram of the pin front-side film application in an integrated circuit cutting method proposed in this invention.

[0033] Figure 11 This is a schematic diagram of the pin back-side film application in an integrated circuit cutting method proposed in this invention;

[0034] Figure 12 This is a schematic diagram of the debonding of the pins in an integrated circuit cutting method proposed in this invention.

[0035] Figure 13 This is a schematic diagram of the debonding of the pins in an integrated circuit cutting method proposed in this invention;

[0036] Figure 14 This is a schematic diagram of the identification points in an integrated circuit cutting method proposed in this invention;

[0037] Figure 15 This is a schematic diagram of the T-shaped identification point in the integrated circuit cutting method proposed in this invention;

[0038] Figure 16 This is a schematic diagram of a deburring device for an integrated circuit cutting method proposed in this invention.

[0039] Figure 17 This is a schematic diagram of a tray loading and unloading machine for an integrated circuit cutting method proposed in this invention.

[0040] Among them, 1. Product; 111. Single product; 2. Product pin; 3. UV anti-adhesion film; 4. Product frame; 5. Brush; 6. Identification point; 7. Cutting track; 9. Plastic sealant; 10. Sputtering layer; 11. Burr; 12. Antistatic tray; 13. Nozzle; 14. Ring placement area; 15. Ejector pin; 16. Transport mechanism; 17. Adhesive layer; 18. Substrate layer.

[0041] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. Detailed Implementation

[0042] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0043] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0044] Implementation Method 1:

[0045] like Figures 1-17 As shown, this invention proposes a method for cutting integrated circuits, such as... Figure 1 As shown, the product includes product 1, which can be a strip product. Product 1 includes a spherical surface a and a plastic cover b. Before the cutting operation, product 1 is mounted with the spherical surface a facing the UV anti-adhesion film 3. The UV anti-adhesion film 3 includes an adhesive layer 17 and a substrate layer 18, so that the product pins 2 face the adhesive layer 17 side and the plastic cover b faces upward to expose the plastic sealant 9. This can avoid the pins 2 from being contaminated, squeezed or producing watermarks and other appearance defects during the cutting process.

[0046] like Figures 10 to 13 As shown, based on the above embodiment, the UV anti-adhesion film 3 is subjected to UV irradiation treatment before cutting to reduce the adhesiveness of the UV anti-adhesion film 3. Compared with the traditional process of cutting first and then removing UV, the present invention places the UV removal before cutting, which can effectively solve the problem of residual adhesive on the surface of the product pin 2, avoid the UV adhesive residue affecting the electrical properties and appearance of the product 1, and improve the yield and cleanliness of the product 1.

[0047] like Figures 14 to 15 As shown, based on the above embodiment, in order to ensure cutting accuracy, an identification point 6 is set in the non-working area on the front of the product frame 4. The position of the identification point 6 corresponds to the cutting track 7 and is set on the extension line of the cutting track 7 as a visual alignment reference for the cutting equipment to achieve high-precision alignment cutting.

[0048] For example, the shape of the identification point 6 can be at least one of T-shaped, cross-shaped, or rice-shaped. When a T-shaped structure is used, two sets can be set so that the center position of the two sets of identification points 6 coincides with the center position of the cutting path 7, thereby further improving the alignment accuracy and cutting stability.

[0049] It should be understood that when the identification point 6 adopts a T-shaped shape, two sets of T-shaped structures can be set to ensure that the center position of the identification point 6 coincides with the center position of the cutting track 7, thus ensuring alignment accuracy. During cutting, the spherical surface faces down and the colloid surface faces up, exposing the colloid surface of product 1. The cutting tool enters from the colloid surface during cutting, avoiding damage to the lead surface and significantly improving workability. This method has been implemented in mass production. Through the alignment of the identification point 6, precise cutting of the front of the product is achieved. After cutting, product 1 remains on the UV anti-adhesion film 3, providing a fixed foundation for the subsequent deburring process 11.

[0050] Implementation Method Two:

[0051] like Figure 2 As shown, based on the above embodiment, before entering the cutting process, product 1 undergoes a molding process to form a protective colloidal structure, providing a stable physical carrier for subsequent processes such as half-cutting, sputtering, and ball-mounting. Simultaneously, the product is marked to create unique identification information, enabling full-process traceability and batch control. This step lays the foundation for the entire cutting process, ensuring that subsequent processes can be carried out systematically based on the complete product structure.

[0052] like Figures 3 to 4 As shown, based on the above embodiment, the encapsulated plastic body 9 is partially cut. This step involves cutting the plastic cover b to form a preset cutting line 7 on the encapsulated plastic body 9, which provides guidance for the subsequent full cutting process. At the same time, it can release some of the plastic stress, reduce the risk of plastic cracking during the subsequent cutting process, and ensure the stability of the product structure.

[0053] like Figure 5 As shown, based on the above embodiment, a sputtering process is performed on the surface of product 1 to form a uniform metal sputtering layer 10. The metal sputtering layer 10 is disposed on the surface of the product to protect the product from external signal interference.

[0054] like Figure 6As shown, based on the above embodiment, product pins 2 are implanted on the sputtered product 1 to provide electrical connection points for subsequent packaging and testing. After the ball implantation process is completed, product 1 has a complete electrical connection structure and can proceed to the subsequent cutting and post-processing steps. After product 1 is cut into individual product 111, product 1 is fixed as a whole on the UV anti-adhesion film 3 without additional fixation, which facilitates subsequent process operations.

[0055] like Figure 7 and Figure 16 As shown, based on the above embodiment, cutting product 1 into individual products 111 includes: fixing product 1 above the Ring placement area 14 of the deburring device, and repeatedly moving the brush 5 along direction a or b to effectively remove sputtering burrs 11 on the cutting path 7. Since product 1 is fixed as a whole on the UV anti-adhesion film 3, the brush 5 can evenly brush the cutting path 7, effectively removing the metal burrs 11 generated during the cutting process, avoiding short circuits and reliability degradation caused by burr 11 residue, and improving the appearance and electrical performance of product 1.

[0056] like Figure 8 , Figure 9 and Figure 17 As shown, based on the above embodiment, after deburring 11 is completed, the ejector pin 15 and the suction nozzle 13 cooperate to peel the single product 111 above the Ring placement area 14 from the UV anti-adhesion film 3, and then the single product 111 is transferred to the antistatic tray 12 by the transport mechanism 16. The stickiness of the UV anti-adhesion film 3 has been reduced by UV irradiation, so that the single product 111 can be easily peeled off without residual adhesive. The antistatic tray 12 can effectively prevent the product from being damaged by static electricity during the transfer process, and at the same time facilitates the transfer and storage of subsequent processes.

[0057] The individual product 111 loaded into the material tray is subjected to automatic optical inspection (AOI). Image recognition technology is used to check for defects such as residual glue, burrs 11, detached pins 2, and cutting edges. This ensures that product 1 meets quality standards and unqualified product 1 can be screened in time to prevent it from flowing into subsequent stages.

[0058] It should be noted that the present invention effectively solves the industry pain points of traditional cutting processes, such as UV residue, product pin damage, and low alignment accuracy, by using a process scheme of first de-adhesive removal of UV anti-adhesion film 3 and then cutting, combined with the identification point 6 set on the product frame 4 for alignment and spherical cutting method. This achieves efficient, residue-free, and highly reliable cutting of product 1, significantly improving product yield and production efficiency.

[0059] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0060] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

[0061] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A method for cutting integrated circuits, characterized in that: include: Product (1) includes a spherical surface a and a plastic cover b; The product (1) is attached to the film with the spherical surface a facing the film; UV irradiation reduces the film's viscosity; The product (1) is cut from the plastic cover b. By setting an identification point (6) at the front edge of the product (1), the identification point (6) is used for alignment when the product (1) is cut, so as to realize the single-piece cutting operation of the product (1) to form a single product (111).

2. The integrated circuit cutting method according to claim 1, characterized in that: The identification point (6) is set in the non-working area of ​​the product frame (4), and the position of the identification point (6) corresponds to the position of the cutting channel (7).

3. The integrated circuit cutting method according to claim 2, characterized in that: The identification point (6) is located on the extension line of the cutting channel (7).

4. The integrated circuit cutting method according to claim 3, characterized in that: The shape of the identification point (6) includes at least one of T-shape, cross shape and rice shape.

5. The integrated circuit dicing method according to claim 4, characterized in that: The identification point (6) is T-shaped, and there are two sets of identification points (6). The center position of the two sets of identification points (6) coincides with the center position of the cutting channel (7).

6. The integrated circuit dicing method according to claim 1, characterized in that: Methods for forming strip products include: The product (1) is subjected to plastic sealing and marking operations; Perform a partial cut operation on the encapsulating colloid (9) of the product (1); A sputtering operation is performed on the surface of the product (1) to form a sputtered layer (10). Solder ball placement is performed on the product (1).

7. The integrated circuit dicing method according to claim 1, characterized in that: The process of cutting product (1) into individual products (111) includes: Remove burrs (11) from the cutting path (7) of the single product (111). After peeling the individual product (111) off the film, pick it up into the tray; The single product (111) is subjected to automatic optical inspection.

8. The integrated circuit dicing method according to claim 7, characterized in that: Removing burrs (11) from the cutting channel (7) of the single product (111) includes: removing burrs (11) from the cutting channel (7) by repeatedly moving the brush (5) along the a or b direction.

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