Liquid discharge head and liquid discharge apparatus

Abstract

A liquid discharge head includes: a nozzle plate including: a nozzle, and a piezoelectric body provided to the nozzle plate to vibrate the nozzle plate; and a flow path substrate provided to the nozzle plate, the flow path substrate having a pressure chamber communicating with the nozzle. The piezoelectric body has: a Curie point equal to or higher than 350°C, or no Curie point. The nozzle plate is vibrated by driving the piezoelectric body, and a molten resin or a molten metal heated to equal to or higher than 130°C in the flow path substrate is discharged from the nozzle toward a discharge direction.

Description

Technical Field

[0001] This embodiment relates to a liquid discharge head and a liquid discharge device. Background Technology

[0002] Conventionally, a liquid discharge head is known that comprises: a nozzle plate having a nozzle; and a flow path plate having a pressure chamber communicating with the nozzle. It discharges liquid from the pressure chamber through the nozzle by driving a piezoelectric element.

[0003] As a liquid discharge head, Patent Document (PTL) 1 describes a liquid discharge head that discharges molten solder from a nozzle to form solder bumps on a semiconductor chip or the like. A piezoelectric element is provided on the wall of the pressure chamber opposite the nozzle plate, and by vibrating this wall, molten solder is discharged from the nozzle. Furthermore, a heater is provided on the cover member covering the liquid discharge head to heat the solder inside the liquid discharge head to a temperature equal to or higher than the melting point. Summary of the Invention

[0004] Technical issues

[0005] However, depending on the material of the piezoelectric element, it is sometimes impossible to properly discharge molten resin or molten metal heated to 130°C or higher, such as solder, from the nozzle.

[0006] Solution to the problem

[0007] In one aspect of the invention, a liquid discharge head is provided, comprising:

[0008] Nozzle plate, comprising:

[0009] Nozzle; and

[0010] A piezoelectric element is disposed on the nozzle plate to cause the nozzle plate to vibrate; and

[0011] A flow path substrate is disposed on the nozzle plate, and the flow path substrate has a pressure chamber communicating with the nozzle.

[0012] The piezoelectric element has the following characteristics:

[0013] The Curie point equal to or higher than 350°C; or

[0014] There is no Curie point, and

[0015] By driving the piezoelectric element to vibrate the nozzle plate, molten resin or molten metal heated to 130°C or higher on the flow path substrate is discharged from the nozzle in the discharge direction.

[0016] Effects of the present invention

[0017] According to this embodiment, molten resin or molten metal heated to 130°C or higher can be efficiently discharged from the nozzle. Attached Figure Description

[0018] A more complete understanding of the embodiments of the present disclosure and its many incidental advantages and features can be readily obtained and understood from the following detailed description with reference to the accompanying drawings.

[0019] [ Figure 1 ]

[0020] Figure 1 This is a schematic cross-sectional view of the nozzle vibration type liquid discharge head in this embodiment.

[0021] [ Figure 2 ]

[0022] Figure 2 This is a schematic three-dimensional diagram of the liquid discharge head.

[0023] [ Figure 3 ]

[0024] Figure 3 yes Figure 1 Enlarged cross-sectional view of the X-section.

[0025] [ Figure 4 ]

[0026] Figure 4 This is a schematic diagram of a printer that functions as a liquid discharge device.

[0027] [ Figure 5 ]

[0028] Figure 5 This is an explanatory diagram showing a top view of the main part of another example of a printer.

[0029] [ Figure 6 ]

[0030] Figure 6 This is an explanatory diagram showing a side view of the main part of another example of a printer.

[0031] [ Figure 7 ]

[0032] Figure 7 This is an explanatory diagram showing a top view of the main part of a liquid discharge device in another example.

[0033] [ Figure 8 ]

[0034] Figure 8 This is an explanatory diagram showing the front view of yet another example of a liquid discharge device.

[0035] The accompanying drawings are intended to illustrate embodiments of this disclosure and should not be construed as limiting its scope. Unless explicitly stated otherwise, the drawings should not be considered to be drawn to scale. Furthermore, throughout several views, the same or similar reference numerals denote the same or similar parts. Detailed Implementation

[0036] In describing the embodiments shown in the accompanying drawings, specific terminology has been used for clarity. However, the disclosure of this specification is not intended to be limited to the specific terminology chosen, and it should be understood that each particular component includes all technical equivalents that have similar functionality, operate in a similar manner, and achieve similar results.

[0037] Hereinafter, embodiments of the invention will be described with reference to the accompanying drawings. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0038] The preferred embodiments of the present invention will now be described with reference to the accompanying drawings. It should be understood that those skilled in the art can readily modify and alter this disclosure to form other embodiments within the scope of the appended claims, and such modifications and alterations are included within the scope of the appended claims. The following embodiments are illustrative and do not limit the scope of the appended claims.

[0039] Figure 1 This is a schematic cross-sectional view of the nozzle vibration type liquid discharge head in this embodiment. Figure 2 This is a schematic three-dimensional diagram of the liquid discharge head.

[0040] The liquid discharge head (head) 1 includes a nozzle plate 110, a flow path base plate 100, and a frame component 120.

[0041] The nozzle plate 110 is formed as a thin film and includes a plurality of nozzles 2 and a piezoelectric element 5. The plurality of nozzles 2 discharge liquid. The piezoelectric element 5 is an electromechanical conversion element formed in a ring and disposed around the nozzles 2. The flow path substrate 100 has a plurality of pressure chambers (also referred to as individual liquid chambers or pressurized liquid chambers) 4, each communicating with the plurality of nozzles 2. The frame member 120 has a common liquid chamber 3, which serves as a supply liquid chamber, communicating with the plurality of pressure chambers 4. Electrical connection pads 6 for connecting to electrical components such as an external power source are provided at both ends of the head 1.

[0042] A heater 130 is provided on the outer peripheral surface of the frame member 120. In the liquid discharge head according to this embodiment, a metal material such as solder or a resin material that is solid at room temperature is used as the material to be discharged (discharge material). The discharge material in the common liquid chamber 3 is heated to 130°C or higher by the heater 130 provided on the frame member 120 and melted. As a result, the molten discharge material is discharged from the nozzle 2.

[0043] Figure 3 yes Figure 1 Enlarged cross-sectional view of the X-section.

[0044] The flow path substrate 100 is a silicon-on-insulator (SOI) substrate, and includes a driving circuit 101 and a wiring layer 102 on the side where the diaphragm 103 is formed. The driving circuit 101 is a circuit including transistors, resistors, etc. The wiring layer 102 includes wiring portions for applying a driving waveform to the first electrode 51 and wiring portions for applying a driving waveform to the second electrode 53.

[0045] By embedding the drive circuit within the flow path substrate 100, the steps required to mount the drive circuit on another substrate can be reduced, and the area of ​​the connection portion for external connections can be decreased, resulting in miniaturization of the head. If the drive circuit is not embedded in the flow path substrate 100 and an opening is provided in the nozzle plate 110 for external drive control, the flow path substrate 100 can be a silicon (Si) substrate. This also eliminates the need for the wiring layer 102.

[0046] The nozzle plate 110 has a plurality of nozzles 2 formed thereon, and has a vibrating diaphragm 103, a piezoelectric element 5, and a surface layer (surface film) 111 covering the piezoelectric element 5. From the viewpoints of heat resistance, liquid resistance, and insulation, the vibrating diaphragm 103 is preferably made of inorganic materials such as silicon dioxide (SiO2), silicon nitride (SiN), or metal oxides. However, in order to increase displacement, it is desirable to use a material with a low Young's modulus. In addition, considering the difference in linear expansion coefficient with the flow path substrate 100, it is most desirable to use silicon dioxide (SiO2) as the material of the vibrating diaphragm 103, which has a relatively small difference in linear expansion coefficient.

[0047] Similar to the vibrating diaphragm 103, from the viewpoints of heat resistance, liquid resistance, and insulation, the surface layer (surface film) 111 is preferably made of an inorganic material such as SiO2, SiN, or metal oxide. A liquid-resistant film can be formed on the nozzle surface of the surface layer 111. In the case of continuous liquid discharge, mist generated simultaneously with the liquid discharge adheres to the nozzle surface. When a large amount of mist adheres to the nozzle surface, the liquid discharged from the nozzle 2 may be affected by the liquid adhering to the nozzle surface, potentially causing it to deviate from the desired position where the liquid is to be applied. By forming a liquid-resistant film on the nozzle surface, liquid adhesion to the nozzle surface can be prevented. Therefore, it is possible to prevent the liquid discharged from the nozzle 2 from being affected by the liquid adhering to the nozzle surface.

[0048] The piezoelectric element 5 of the nozzle plate 110 has a first electrode 51 (also called the lower electrode), a piezoelectric body 52, and a second electrode 53 (also called the upper electrode). The piezoelectric element 5 is covered by a first insulating film 8a. Like the vibrating diaphragm 103, the first insulating film 8a preferably has insulating properties, a low Young's modulus, and a coefficient of linear expansion close to that of the constituent materials. Therefore, it is desirable to use SiO2, similar to the vibrating diaphragm 103.

[0049] The first insulating film 8a has a third contact 7c and a fourth contact 7d. The third contact 7c is a hole-shaped contact for electrical connection with the first electrode 51. The fourth contact 7d is a hole-shaped contact for electrical connection with the second electrode 53.

[0050] A first lead 9a and a second lead 9b are formed on the first insulating film 8a. The first lead 9a electrically connects the first electrode 51 of the piezoelectric element 5 to the wiring layer 102 of the flow path substrate 100. The second lead 9b electrically connects the second electrode 53 of the piezoelectric element 5 to the wiring layer 102 of the flow path substrate 100.

[0051] The first lead 9a is electrically connected to the first electrode 51 via the third contact 7c, and is also electrically connected to the wiring layer 102 via the first contact 7a. The second lead 9b is electrically connected to the second electrode 53 via the fourth contact 7d, and is also electrically connected to the wiring layer 102 via the second contact 7b.

[0052] The first lead 9a and the second lead 9b are covered by a second insulating film 8b. For the second insulating film 8b, it is desirable to use SiN, which is widely used as a semiconductor protective film, to improve moisture resistance reliability. Since the second insulating film 8b has both insulating and moisture-proof functions, the nozzle plate 110 can be made thinner compared to the case where a moisture-proof protective film is formed on the second insulating film 8b. As a result, the vibrating diaphragm 103 is easily deformable, which improves vibration efficiency.

[0053] Alternatively, lead-out wiring portions can be provided on the first electrode 51 and the second electrode 53, respectively, and directly electrically connected to the wiring layer 102 via contacts at the opening of the diaphragm. Additionally, a contact improvement film can be formed on the second insulating film 8b to ensure adhesion to the surface layer 111. Furthermore, the wiring layer 102 is electrically connected to the electrical connection pad 6 via a third contact 7c at the opening of the diaphragm 103.

[0054] In this embodiment, a protective film 11 is formed on the inner circumferential surface of the pressure chamber 4 to prevent contamination by molten metal or molten resin. The protective film 11 is composed of inorganic materials such as metal oxides, metal nitrides, ceramic oxides, ceramic nitrides, and carbide ceramics. More specifically, alumina (Al2O3), silicon dioxide (SiO2), silicon nitride (SiN), zirconium oxide (ZrO), and silicon carbide (SiC) can be used as the protective film 11.

[0055] Zirconate titanate (PZT) is a piezoelectric material widely used as the piezoelectric element in inkjet printheads due to its high piezoelectric properties. PZT is a strong dielectric, possessing electric dipoles that locally separate into positively and negatively charged portions even without an externally applied electric field. However, PZT typically has a Curie point between 150°C and 350°C, at which point its crystal structure changes and it loses its piezoelectric properties. Therefore, the temperature range in which PZT can be used is limited. Consequently, metals with high melting temperatures cannot be used as ejector materials.

[0056] Therefore, in this embodiment, aluminum nitride (AlN) is used as the electrostrictive material for the piezoelectric element 52. AlN has a melting point of over 2000°C and does not have a Curie point. Therefore, AlN can be driven well even in high-temperature environments.

[0057] Furthermore, in this embodiment, a nozzle vibration method is employed whereby a piezoelectric element 5 is disposed on the nozzle plate 110, and the pressure within the pressure chamber 4 is changed by the piezoelectric element 5 of the nozzle plate 110, thereby causing the liquid in the pressure chamber to be discharged from the nozzle. Compared to a typical single-piezoelectric chip piezoelectric head (a head that discharges liquid by vibrating the surface of the pressure chamber opposite to the wall having a communication port (nozzle communication wall) that communicates with the nozzle), this nozzle vibration method is characterized by its ability to cause droplets to splash with less force. Therefore, even when using AlN, which has a smaller displacement compared to PZT, as the electrostrictive material of the piezoelectric element 52, liquid can be discharged effectively.

[0058] As a result, even discharge materials with high melting temperatures can be melted and discharged.

[0059] Furthermore, by employing the aforementioned nozzle vibration system, an opening can be provided in the portion of the pressure chamber facing the nozzle plate, through which molten material is supplied from the common liquid chamber. As a result, compared to providing an opening for molten material on the side of the pressure chamber, nozzles can be arranged at a high density, thereby enabling miniaturization of the liquid discharge head. Therefore, the heat capacity of the liquid discharge head can be reduced, and the discharged material can be effectively heated above its melting temperature. Consequently, power consumption can be reduced.

[0060] Furthermore, using AlN as the electrostrictive material offers the following advantages. While it's possible to improve piezoelectric properties by ensuring uniform crystal orientation of the piezoelectric material 52, an orientation control layer is required between the vibrating membrane 103 and the first electrode 51 to control the orientation. By using AlN as the material for the piezoelectric material 52 and also using AlN as the orientation control layer, the lattice constant of the first electrode 51, which is made of Mo, can be made close to that of AlN. As a result, the crystal orientation of the piezoelectric material 52 becomes more uniform, thereby improving its piezoelectric properties.

[0061] Aluminum nitride (AlN), comprising at least one of scandium, yttrium, titanium, magnesium, hafnium, zirconium, tin, chromium, and boron, can be used as an electrostrictive material for piezoelectric materials. Specifically, a portion of the aluminum in aluminum nitride is replaced with at least one of the aforementioned materials. Therefore, aluminum nitride can contain at least one of the aforementioned materials. As a piezoelectric material, the piezoelectric properties can be enhanced by replacing a portion of the aluminum in aluminum nitride with at least one of the aforementioned materials.

[0062] Furthermore, the electrostrictive material of the piezoelectric element 52 is not limited to aluminum nitride; it can also be an electrostrictive material with a Curie point equal to or higher than 350°C, or an electrostrictive material with high heat resistance but no Curie point. By using an electrostrictive material with a Curie point equal to or higher than 350°C, it is possible to use a discharge material with a higher melting temperature compared to PZT. Therefore, the amount of dischargeable material can be increased.

[0063] The flow path substrate 100 and the frame component 120 are joined together using an adhesive 140. The adhesive 140 uses a metal with a melting temperature higher than that of the discharged material. This prevents the adhesive 140 from melting due to the heating of the discharged material.

[0064] Next, an example of the liquid discharge device according to this embodiment will be described.

[0065] Figure 4 This is a schematic diagram of the printer 300, which is used as a liquid discharge device.

[0066] like Figure 4 As shown, the printer 300 includes a liquid discharge device 301 and a worktable 320. The liquid discharge device 301 includes a head 1 and a supply device 302. A substrate 310 is placed on the worktable 320.

[0067] The supply device 302 has a particle loading section 302a for loading solder particles. Solder particles are supplied from the particle loading section 302a to the common liquid chamber 3. The solder particles supplied to the common liquid chamber 3 are heated to a molten state by the heater 130. Alternatively, a heater can be provided in the supply device to supply molten solder to the common liquid chamber 3.

[0068] The liquid discharge device 301 is movable in the left-right direction (hereinafter referred to as the sub-scanning direction) and the direction orthogonal to the paper plane (hereinafter referred to as the main scanning direction). Then, while moving in the main scanning direction and the sub-scanning direction, the liquid discharge device 301 discharges molten solder from the nozzle 2 to form solder bumps at the desired positions on the substrate 310 on the worktable 320.

[0069] The liquid discharge device 301 can also be configured to discharge liquid from one end to the other in the main scanning direction. Then, the liquid discharge device 301 can be fixed, and the substrate 310 can be transported in the sub-scanning direction by a conveyor to form solder bumps at the desired positions on the substrate 310.

[0070] Next, we will refer to Figure 5 and Figure 6 Another example of a printer used as a liquid discharge device according to this embodiment is described.

[0071] Figure 5 This is an explanatory diagram showing a top view of the main parts of the printer in this embodiment.

[0072] Figure 6 This is an explanatory diagram showing a side view of the main parts of the printer in this embodiment.

[0073] Printer 500 is a serial inkjet recording device, and carriage 403 is moved by main scanning unit 493. Figure 5 The main scanning direction, indicated by the middle arrow "MSD", is reciprocated. The main scanning movement unit 493 includes a guide 401, a main scanning motor 405, and a timing belt 408. The guide 401 is mounted between the left side plate 491A and the right side plate 491B to movably hold the carriage 403. The main scanning motor 405 reciprocates on the carriage 403MSD via the timing belt 408 mounted between the drive pulley 406 and the driven pulley 407.

[0074] The carriage 403 includes a liquid discharge device 440. According to this embodiment, the head 1 and head tank 441 form a liquid discharge device 440 as a single unit. The head 1 of the liquid discharge device 440 discharges liquids of various colors, such as yellow (Y), cyan (C), magenta (M), and black (K). The head 1 includes a nozzle array comprising multiple nozzles arranged in the sub-scanning direction as indicated by the arrow "SSD". The sub-scanning direction is orthogonal to the main scanning direction MSD. The head 1 is mounted to the carriage 403 in a manner that discharges ink droplets downwards.

[0075] Printer 500 includes a conveyor 495 for conveying sheet 410. The conveyor 495 includes a conveyor belt 412 and a secondary scanning motor 416 that drives the conveyor belt 412. The conveyor belt 412 attracts the sheet 410 and conveys it to a position facing the print head 1. The conveyor belt 412 is an annular belt positioned between a conveyor roller 413 and a tension roller 414. The attraction of the sheet 410 to the conveyor belt 412 can be applied by electrostatic attraction, air attraction, or the like. When the conveyor roller 413 is rotatably driven by the secondary scanning motor 416 via a synchronous belt 417 and synchronous pulleys 418, the conveyor belt 412 rotates in the secondary scanning direction (SSD).

[0076] On one side of the carriage 403 in the main scanning direction MSD, a maintenance unit 420 for properly holding the printhead 1 is arranged on the side of the conveyor belt 412. The maintenance unit 420 includes, for example, a cover 421 for covering the nozzle surface of the printhead 1 and a wiper 422 for wiping the nozzle surface of the printhead 1. The main scanning movement unit 493, the maintenance unit 420, and the conveyor 495 are mounted on a frame consisting of a left side plate 491A, a right side plate 491B, and a back plate 491C.

[0077] In the printer 500 configured in this way, the sheet 410 is conveyed and adsorbed on the conveyor belt 412 and transported in the sub-scanning direction (SSD) by the cyclic rotation of the conveyor belt 412. While the carriage 403 moves along the main scanning direction (MSD), the image signal drives the head 1 to discharge liquid onto the stopped sheet 410, thereby forming an image on the sheet 410.

[0078] Next, refer to Figure 7 Another example of the liquid discharge device 440 of this embodiment will be described.

[0079] Figure 7 This is an explanatory diagram showing a top view of the main parts of the liquid discharge device in this embodiment.

[0080] The liquid discharge device 440 includes the components of a liquid discharge device, such as a housing, a main scanning moving unit 493, a carriage 403, and a head 1. The housing is formed by a left side plate 491A, a right side plate 491B, and a back plate 491C.

[0081] Alternatively, the maintenance unit 420 described above can also be installed on the right side plate 491B in the liquid discharge device 440, for example.

[0082] Next, refer to Figure 8 Another example of the liquid discharge device 440 of this embodiment will be described.

[0083] Figure 8 This is an explanatory diagram showing the front view of the liquid discharge device in this embodiment.

[0084] The liquid discharge device 440 includes a head 1 on which a flow path section 444 is installed, and a pipe 456 connected to the flow path section 444.

[0085] The flow path 444 is disposed inside the cover 442. The liquid discharge device 440 may also have a head tank 441 instead of the flow path 444. A connector 443 electrically connected to the head 1 is provided on the upper part of the flow path 444.

[0086] In the printer 500 configured as described above, by using the liquid discharge head of this embodiment, resin ink such as solid ink, which is used after being heated and melted, can be used as the discharge material.

[0087] The above embodiments are illustrative and do not limit this disclosure. Therefore, many additional modifications and variations are possible based on the above teachings.

[0088] In this application, the liquid to be discharged is not particularly limited, as long as the liquid has a viscosity or surface tension sufficient to allow for discharge from the head. On the other hand, the liquid preferably has a viscosity of at least 30 mPa·s when heated. Examples of liquids include solutions, suspensions, emulsions, and molten metals such as solder containing solvents such as water and organic solvents, colorants such as dyes and pigments, polymeric compounds, resins, functional materials such as surfactants, biocompatible materials such as DNA, amino acids, proteins, and calcium, and edible materials such as natural pigments. Such solutions, suspensions, emulsions, and molten metals can be used, for example, as inks for inkjet printing, surface treatment solutions, liquids for forming resist patterns in electronic components or light-emitting elements or electronic circuits, liquids for forming solder bumps, or material solutions for three-dimensional modeling.

[0089] "Liquid discharge device" is an assembly of components related to liquid discharge. The term "liquid discharge device" refers to a structure that includes a head and functional parts or units combined with the head to form a single unit. For example, a "liquid discharge device" includes a combination of a head and at least one of a head tank, a carriage, a supply device, a maintenance unit, a main scanning moving unit, and a liquid circulation device.

[0090] Examples of a "single unit" include combinations of a head and one or more functional components or mechanisms that are fixed to each other by means of fastening, bonding, or joining, as well as combinations in which one of the head and functional components or mechanisms is movably held relative to the other. The head may be detachably mounted to the functional components or mechanisms.

[0091] For example, the head and the head tank can be formed as a single unit of liquid discharge device. Alternatively, the head and the head tank connected by pipes, etc., can be formed as a single unit of liquid discharge device. A unit including a filter can be added between the head and the head tank of the liquid discharge device.

[0092] In another example, the head and carriage can be a single unit, serving as a liquid discharge device.

[0093] In yet another example, the liquid discharge device includes a head movably held by a guide that forms part of the main scanning moving unit, such that the head and the main scanning moving unit form a single unit. The liquid discharge device may also be a structure in which the head, carriage, and main scanning moving unit are integrally formed.

[0094] In yet another example, a cover forming part of the maintenance unit can be fixed to a carriage on which a head is mounted, such that the head, carriage, and maintenance unit form a single unit to form a liquid discharge device.

[0095] In another example, the liquid discharge device includes a tube connected to the printhead or printhead, wherein a flow path is mounted to the printhead, such that the printhead and the supply unit form a single unit. Liquid from a liquid supply source, such as an ink cartridge, is supplied to the printhead through this tube.

[0096] The main scanning moving unit can also be just a guide. The supply unit can be just a tube or just a filling unit.

[0097] The "liquid discharge device" includes a head module having the aforementioned head, and a head assembly in which the aforementioned functional components and mechanisms are combined to form a single unit.

[0098] In addition, in this specification, "liquid discharge device" also includes the aforementioned head, liquid discharge apparatus, head module, and head device, referring to a device that discharges liquid by driving the head. A liquid discharge device can be, for example, any device capable of discharging liquid to a medium to which the liquid can adhere, or any device discharging liquid toward a gas or liquid.

[0099] Liquid discharge equipment may include devices for supplying, conveying, and spraying liquid onto materials to which the liquid can adhere. Liquid discharge equipment may also include pretreatment equipment for coating materials with the treatment liquid, and post-treatment equipment for coating materials with the treatment liquid, after the liquid has been discharged onto the materials.

[0100] "Liquid ejection equipment" includes, for example, an image forming apparatus that forms an image on a sheet by ejecting ink, or a three-dimensional shaping apparatus that forms a three-dimensional object by ejecting a modeling liquid into a powder layer of stacked powder material.

[0101] "Liquid dispensing device" is not limited to a device that visualizes meaningful images such as letters or graphics by dispensing liquid. For example, liquid dispensing devices also include devices for forming patterns that do not have meaning on their own, or devices for creating three-dimensional images.

[0102] The term "materials to which liquids can adhere" as used above refers to materials to which liquids can adhere at least temporarily, materials to which liquids adhere and solidify, or materials to which liquids adhere and permeate. Specific examples of "materials to which liquids can adhere" include, but are not limited to, paper, recording paper, recording media such as film and cloth, electronic substrates, electronic components such as piezoelectric elements, powder layers, organ models, inspection units, and other media. Unless otherwise specified, it includes all materials to which liquids adhere.

[0103] Examples of "materials to which liquids can adhere" can include paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, ceramics, and any material that can adhere, even temporarily.

[0104] Liquid discharge equipment can be a device that allows relative movement between the head and the medium to which the liquid can adhere, but is not limited to this. Specific examples include serial devices that move the head unit and linear devices that do not move the head unit.

[0105] Examples of "liquid discharge apparatus" also include a treatment liquid coating apparatus that discharges treatment liquid onto a sheet to coat the surface of the sheet with the treatment liquid for surface modification; and a jet granulation apparatus in which a liquid composition comprising raw materials dispersed in a solution is jetted through a nozzle to granulate the raw materials into microparticles. Furthermore, there are jet granulation devices for granulating the raw materials into microparticles by jetting a liquid composition comprising raw materials dispersed in a solution through a nozzle.

[0106] The terms "image formation," "recording," "printing," "image printing," and "modeling" used in this specification may be used interchangeably.

[0107] The above embodiments are illustrative and do not limit this disclosure. Therefore, many additional modifications and variations are possible based on the above teachings.

[0108] The above embodiments are limited examples, and this disclosure includes, for example, the following aspects that have advantageous effects.

[0109] Aspect 1

[0110] According to aspect 1, a liquid discharge head 1 drives a piezoelectric element 52 to discharge liquid from a nozzle 2 within a pressure chamber 4. The liquid discharge head 1 includes: a nozzle plate 110 having a nozzle 2; and a flow path substrate 100 having a pressure chamber 4 communicating with the nozzle 2. The nozzle plate 110 has a piezoelectric element 52 with a Curie point equal to or higher than 350°C or without a Curie point. The nozzle plate 110 vibrates as driven by the piezoelectric element 52, discharging molten resin or molten metal heated to a temperature equal to or higher than 130°C from the nozzle 2.

[0111] In liquid discharge heads that discharge materials that are solid at room temperature, such as solder (hereinafter referred to as discharge materials), from a nozzle, the discharge material needs to be heated to a temperature equal to or higher than its melting temperature by a heater. Therefore, the temperature of the piezoelectric element increases due to the discharge material being heated to a temperature equal to or higher than its melting temperature. Zirconium titanate (PZT) has high piezoelectric properties. However, PZT typically has a Curie point of 150°C to 350°C, at which point its crystal structure changes and it loses its piezoelectric properties. Therefore, the temperature range in which PZT can be used as a piezoelectric element is limited. Thus, when molten resin or molten metal heated to a temperature equal to or higher than 130°C is discharged from a nozzle, the piezoelectric properties may be lost.

[0112] As materials for piezoelectric elements, there are piezoelectric materials such as aluminum nitride (AlN) with a higher Curie point than PZT, and piezoelectric materials without a Curie point, but the piezoelectric properties of such materials are lower than those of PZT. Therefore, in the structure of Patent Document 1, in which a piezoelectric element is installed on the wall of the pressure chamber opposite to the nozzle plate, sufficient pressure cannot be generated, and there is a possibility that molten resin or molten metal heated to a temperature equal to or higher than 130°C cannot be discharged from the nozzle.

[0113] In aspect 1, a piezoelectric element is installed on the nozzle plate, causing the nozzle plate to vibrate and discharge liquid. This allows for efficient liquid discharge from the nozzle with lower pressure compared to discharging liquid by vibrating the wall of the pressure chamber opposite the nozzle plate. Therefore, even if the piezoelectric element is made of a material with lower piezoelectric properties than PZT and lower pressure but a higher Curie point than PZT, or a heat-resistant material such as AlN which does not have a Curie point and whose displacement does not change even at high temperatures, efficient liquid discharge from the nozzle is still possible. As a result, molten resin or molten metal with a melting temperature equal to or higher than 130°C can be efficiently discharged.

[0114] Aspect 2

[0115] According to aspect 2, in the liquid discharge head of aspect 1, the nozzle plate 110 has a surface layer 111 containing inorganic material.

[0116] Based on this aspect, heat resistance can be improved compared to organic materials such as resins. As a result, even when using discharge materials with high melting temperatures, the nozzle plate does not soften, and liquid can be discharged well.

[0117] Aspect 3

[0118] According to aspect 3, in the liquid discharge head of aspect 1 or aspect 2, the pressure chamber 4 has an opening on the side facing the nozzle plate 110, through which liquid is supplied.

[0119] According to this aspect, as described in the embodiment, compared to the case where the sidewall of the pressure chamber 4 has an opening for supplying liquid, a higher density of nozzles and a smaller liquid discharge head can be achieved. Since the liquid discharge head can be miniaturized, its heat capacity can be reduced, thereby enabling efficient heating of the discharged material to a temperature equal to or higher than the melting point. Therefore, power consumption can be reduced.

[0120] Aspect 4

[0121] According to aspect 4, in any one of aspects 1 to 3, the pressure chamber 4 has a protective layer containing inorganic materials such as a protective film 11 on the inner circumferential surface of the pressure chamber.

[0122] According to this aspect, as described in the embodiments, the sidewalls of the flow path substrate 100 forming the pressure chamber 4 can be protected from contamination by the discharged material, such as the melting of the discharged material.

[0123] Aspect 5

[0124] According to aspect 5, in the liquid discharge head of aspect 4, the protective layer, such as the protective film 11, includes metal oxides, metal nitrides, ceramic oxides, ceramic nitrides, or carbide ceramics.

[0125] Based on this aspect, corrosion and erosion caused by molten material discharge can be effectively prevented, thereby effectively protecting the flow path substrate 100 that forms the pressure chamber 4.

[0126] Aspect 6

[0127] According to aspect 6, in the liquid discharge head of any one of aspects 1 to 5, the piezoelectric element 52 comprises aluminum nitride, or aluminum nitride comprising at least one of scandium, yttrium, titanium, magnesium, hafnium, zirconium, tin, chromium and boron.

[0128] According to this aspect, as described in the embodiment, the heat resistance of the piezoelectric element 52 can be improved. Therefore, even if the temperature of the piezoelectric element rises due to heating of the liquid in the pressure chamber or heating by the heater, the liquid will still displace well. Thus, the liquid can be discharged well from the nozzle.

[0129] Aspect 7

[0130] According to aspect 7, in the liquid discharge head of any one of aspects 1 to 6, the flow path substrate 100 and a substrate such as frame member 120 are joined by a metal with a melting temperature equal to or higher than the melting temperature of the molten resin or the molten metal, and the substrate has a supply liquid chamber such as a common liquid chamber 3 for supplying liquid to the pressure chamber 4.

[0131] According to this aspect, it is possible to prevent the metal that joins the flow path substrate 100 with the frame member 120 and other substrates from melting due to the heating of the discharged material.

[0132] Aspect 8

[0133] According to aspect 8, in any one of aspects 1 to 7, the nozzle 2 and the pressure chamber 4 are respectively provided in a plurality of ways.

[0134] Based on this aspect, molten metal or molten resin can be discharged from multiple nozzles.

[0135] Aspect 9

[0136] According to aspect 9, in any one of aspects 1 to 8, the liquid discharged from the nozzle in the liquid discharge head is molten metal, and the molten metal is solder.

[0137] According to this aspect, as described in the embodiments, solder bumps can be formed on the substrate.

[0138] Aspect 10

[0139] According to aspect 10, a liquid discharge device includes a liquid discharge head, wherein the liquid discharge head of any one of aspects 1 to 9 is used as said liquid discharge head.

[0140] Based on this, it is possible to melt and discharge solid materials such as resins and metals at room temperature.

[0141] The above embodiments are illustrative and do not limit the invention. Therefore, many additional modifications and variations are possible based on the above teachings. For example, within the scope of the invention, elements and / or features of different illustrative embodiments can be combined with and / or substituted for each other.

[0142] This patent application is based on and claims priority to Japanese Patent Application No. 2024-032263, filed with the Japan Patent Office on March 4, 2024, the entire disclosure of which is incorporated herein by reference.

[0143] List of reference numerals

[0144] 1: Liquid discharge head

[0145] 2: Nozzle

[0146] 3: Shared liquid chamber

[0147] 4: Pressure Chamber

[0148] 5: Piezoelectric elements

[0149] 6: Electrical connection pads

[0150] 7a: First contact point

[0151] 7b: Second contact point

[0152] 7c: Third contact point

[0153] 7d: Fourth contact point

[0154] 8a: First insulating film

[0155] 8b: Second insulating film

[0156] 9a: First lead

[0157] 9b: Second lead

[0158] 11: Protective film

[0159] 14: Nozzle

[0160] 51: First electrode

[0161] 52: Piezoelectric element

[0162] 53: Second electrode

[0163] 100:Flow path substrate

[0164] 101: Drive Circuit

[0165] 102: Wiring Layer

[0166] 103: Vibrating diaphragm

[0167] 110: Nozzle plate

[0168] 111: Surface layer

[0169] 120: Frame components

[0170] 130: Heater

[0171] 140: Adhesive

[0172] 300: Printer

[0173] 301: Liquid Discharge Device

[0174] 302: Supply device

[0175] 302a: Particle filling section

[0176] 310:Substrate

[0177] 320: Workbench

[0178] 440: Liquid discharge device

[0179] 500: Printer

[0180] List of cited references

[0181] Patent documents

[0182] [PTL1] Japanese Patent No. 4142800

Claims

1. A liquid discharge head, comprising: Nozzle plate, comprising: Nozzle; and A piezoelectric element is disposed on the nozzle plate to cause the nozzle plate to vibrate; and A flow path substrate is disposed on the nozzle plate, and the flow path substrate has a pressure chamber communicating with the nozzle. in, The piezoelectric element has: The Curie point equal to or higher than 350°C; or There is no Curie point, and By driving the piezoelectric element to vibrate the nozzle plate, molten resin or molten metal heated to 130°C or higher on the flow path substrate is discharged from the nozzle in the discharge direction.

2. The liquid discharge head according to claim 1, in, The nozzle plate has a surface layer containing inorganic matter.

3. The liquid discharge head according to claim 1, further comprising: A frame component, located on the flow path substrate, has a common liquid chamber communicating with the pressure chamber. in, The pressure chamber is located between the common liquid chamber and the nozzle in the discharge direction, and The common liquid chamber is located between the pressure chamber and the nozzle.

4. The liquid discharge head according to claim 1, in, The pressure chamber has a protective layer containing inorganic material on its inner circumferential surface.

5. The liquid discharge head according to claim 4, in, The protective layer includes metal oxides, metal nitrides, ceramic oxides, ceramic nitrides, or carbide ceramics.

6. The liquid discharge head according to claim 5, in, The protective layer includes aluminum oxide (Al2O3), silicon dioxide (SiO2), silicon nitride (SiN), zirconium oxide (ZrO), or silicon carbide (SiC).

7. The liquid discharge head according to claim 1, in, The piezoelectric element comprises aluminum nitride, which comprises at least one of scandium, yttrium, titanium, magnesium, hafnium, zirconium, tin, chromium, and boron.

8. The liquid discharge head according to claim 1, further comprising: A frame component having a common liquid chamber communicating with the pressure chamber; and Metal, connecting the flow path substrate and the frame component. in, The metal has a melting temperature equal to or higher than the melting temperature of the molten resin or the molten metal.

9. The liquid discharge head according to claim 1, further comprising: A plurality of nozzles having the aforementioned nozzle; and Multiple pressure chambers having the aforementioned pressure chamber.

10. The liquid discharge head according to claim 1, in, The liquid discharge head discharges the molten metal containing solder from the nozzle.

11. A liquid discharge device, comprising: The liquid discharge head according to claim 1; and A carriage that carries the liquid discharge head and moves the liquid discharge head.

Images