Electronic device

Abstract

An electronic device is obtained, which can realize heat dissipation of various heat-generating electronic components while suppressing cost increase and weight increase in the manufacturing process, and realize device miniaturization. The electronic device (1) has: a housing (10); a partition portion (40) that partitions a housing (10) internal accommodation space; and a switching element (24) that is fixed to the partition portion (40) and uses the partition portion (40) as a heat dissipation path to resin-encapsulate the inside of a resin-encapsulated partition (42) obtained by partitioning the partition portion (42).

Description

Technical Field

[0001] This disclosure relates to an electronic device. Background Technology

[0002] The following solution has been proposed: a heat-generating electronic component is mounted on a vertical wall that is erected relative to the bottom surface of the housing, so that the heat of the electronic component is dissipated to one side of the housing through the vertical wall (for example, see Japanese Patent Application Publication No. 2000-183574). Summary of the Invention

[0003] The technical problem that the invention aims to solve As described in Japanese Patent Application Publication No. 2000-183574, the method of mounting electronic components on a vertical wall erected relative to the bottom surface of the casing is applicable to relatively small electronic components such as semiconductor devices, which can reduce the mounting area of ​​electronic components and achieve device miniaturization. However, it is more difficult to apply to relatively large electronic components such as transformers.

[0004] One method for dissipating heat from relatively large electronic components is to encapsulate them using resin with high thermal conductivity. However, heat dissipation through such resin encapsulation typically only fills almost the entire internal space of the casing with resin, making it impossible to encapsulate only certain electronic components. This results in increased costs and weight due to the increased amount of resin used.

[0005] In view of the foregoing facts, the present disclosure aims to provide an electronic device that can achieve heat dissipation of various heat-generating electronic components while suppressing cost increases and weight increases during the manufacturing process, thereby achieving device miniaturization.

[0006] Technical solutions for solving technical problems The electronic device of the first technical solution disclosed herein includes: a housing; a partition that divides the accommodating space within the housing; and an electronic component fixed to the partition, which serves as a heat dissipation path for resin encapsulation of the interior of the partition.

[0007] Invention Effects The electronic device of the first aspect of this disclosure divides the housing space into partitions, and encapsulates the interior of each partition with resin. Therefore, it is possible to reduce the amount of resin filling the housing while simultaneously dissipating heat from relatively large electronic components within the partitions. Furthermore, the partitions serve as heat dissipation paths for electronic components, fixing them in place. Thus, by utilizing the partitions as mounting surfaces and heat dissipation areas for relatively small electronic components, the required area of ​​the housing's bottom surface can be reduced. Consequently, an electronic device can be obtained that suppresses cost and weight increases during manufacturing, achieves heat dissipation from various heat-generating electronic components, and enables device miniaturization. Attached Figure Description

[0008] Figure 1 This is a block diagram illustrating the circuit structure of the electronic device according to this embodiment.

[0009] Figure 2 This is a top view of the interior of the electronic device housing as seen from above in this embodiment.

[0010] Figure 3 To enlarge Figure 2 The area shown is a partially enlarged top view.

[0011] Figure 4 To indicate along Figure 2 A cross-sectional view of the shell cut along line IV-IV.

[0012] Figure 5 This is a schematic diagram illustrating a first modified example of the partition section in this embodiment.

[0013] Figure 6 This is a schematic diagram illustrating a second variation of the partition section in this embodiment.

[0014] Figure 7 This is a schematic diagram illustrating a third variation of the partition section in this embodiment. Detailed Implementation

[0015] The following is for reference Figures 1-4 An electronic device 1 according to one embodiment of the present disclosure will be described. In this embodiment, for ease of explanation, the directions indicated by the up-down, left-right, and front-back arrows appropriately shown in the accompanying drawings will be defined as the up-down direction, left-right direction, and front-back direction of the electronic device 1, respectively.

[0016] Furthermore, unless otherwise stated in this specification, each element is not limited to one, and multiple elements may exist. Additionally, in the accompanying drawings, substantially identical elements are labeled with the same reference numerals, omitting repetitive descriptions found elsewhere in the specification.

[0017] (The overall structure of the electronic device) In this embodiment, as an example of the electronic device of this disclosure, the following electronic device 1 will be described (see reference). Figure 1 This electronic device is used to convert the AC voltage supplied from the AC power source 7 into DC voltage and to charge the battery 8 installed in an electric vehicle (EV) or plug-in hybrid electric vehicle (PHV). Such an electronic device 1 is also referred to as an on-board charger.

[0018] Figure 1This is a block diagram illustrating the basic circuit structure of electronic device 1. As shown in the figure, electronic device 1 includes: a power conversion circuit section 2, which converts the AC voltage supplied from AC power source 7 into DC voltage; and a control section 3, which is electrically connected to the power conversion circuit section 2 and controls the power conversion from AC to DC. The power conversion circuit section 2 includes a PFC circuit section 21 and a converter circuit section 22. As an example, the PFC circuit section 21 is composed of a single-stage power factor correction (PFC) circuit with a converter, which converts AC to DC and improves the power factor of the power supply by shaping the output waveform. The converter circuit section 22 constitutes a known DC-DC converter, which converts the DC power output from the PFC circuit section 21 to the level required for charging battery 8. As an example, the converter circuit section 22 includes a transformer 22B, a converter input section 22A disposed on the input side of the transformer 22B, and a converter output section 22C disposed on the output side of the transformer 22B. The DC power output from the PFC circuit section 21 is boosted or bucked by the converter input section 22A and the transformer 22B, and then rectified and smoothed by the converter output section 22C.

[0019] The aforementioned PFC circuit section 21 and converter circuit section 22 include multiple switching elements 24 composed of MOSFETs, IGBTs, etc. (see reference) Figure 2 These switching elements 24, the transformer 22B constituting the converter circuit section 22, etc., are heat-generating components that generate heat during operation, and heat dissipation components are required. In addition, the switching element 24 is an example of a relatively small electronic component in this disclosure, and the transformer 22B is an example of a relatively large electronic component in this disclosure.

[0020] In the electronic device 1, a heat dissipation member is provided in the housing 10 that houses the power conversion circuit section 2. This heat dissipation member is implemented by a partition section 40 for partitioning the accommodating space within the housing 10. The detailed structure of the interior of the housing 10 of the electronic device 1 will be described below.

[0021] (case) Figure 2 This is a top view of the housing 10 of the electronic device 1, viewed from above. (See attached image.) Figure 2 As shown, the housing 10 is formed into a rectangular box shape with an upward opening. The housing 10 is preferably made of a material with high electrical and thermal conductivity; as an example of this embodiment, the housing is made of die-cast aluminum.

[0022] The housing 10 has: a bottom wall portion 14, which forms the bottom surface of the receiving space within the housing 10; and a side wall portion 16, which is erected vertically upward from the edge of the bottom wall portion 14. The side wall portion 16 has a front wall portion 16A, a rear wall portion 16B, a left wall portion 16C, and a right wall portion 16D, and is rectangular in shape when viewed from above. At the four corners of the side wall portion 16, base portions 12 for supporting the corner portions of the wiring substrate 30 described later are integrally formed with the side wall portion 16 and the bottom wall portion 14.

[0023] Two through holes 18 are provided on the left side of the housing 10, which penetrate the left wall portion 16C along the thickness direction. These through holes 18 are respectively fitted with external connection connectors 19A and 19B. In this embodiment, one through hole 18 is fitted with an input-side external connection connector 19A, and the other through hole 18 is fitted with an output-side external connection connector 19B. The external connection connectors 19A and 19B are housed within the upper wiring substrate 30 (see reference 10) inside the housing 10. Figure 4 (Connection). Additionally, for ease of understanding, Figure 2 The wiring board 30 is omitted from the diagram.

[0024] (District Department) A partition section 40, formed by processing a metal sheet separately from the housing 10, is disposed within the accommodating space of the housing 10. The partition section 40 forms a longitudinal wall that is erected vertically relative to the bottom surface of the housing 10, thereby partially dividing the accommodating space within the housing 10. As an example, the partition section 40 is formed into a rectangular plate shape, with its length direction in the front-to-back direction and its thickness direction in the left-to-right direction.

[0025] like Figure 3 As shown, the ends of the partition portion 40 along its length are inserted into grooves 17 formed in the side wall portion 16 of the housing 10, thereby being supported in an upright position relative to the bottom wall portion 14. Furthermore, a sealing material 26 seals the housing 10 and the side wall portion 16 within the groove 17. In this embodiment, the accommodating space within the housing 10 is divided into left and right sections by the partition portion 40. The partition portion 40 is preferably formed of a metal material with high thermal conductivity, but is not limited thereto. It may also be formed of a resin material with high thermal conductivity.

[0026] Furthermore, the structure of forming a groove 17 in the side wall portion 16 of the housing 10 and inserting it to support the end of the partition portion 40 is not necessary. Alternatively, a flange can be formed at the end of the partition portion 40, and the partition portion can be fixed to the housing 10 by means of screws or other methods. Or, as in the first modified example described later, the partition portion 40 can form part of a box-shaped modular housing. Furthermore, the sealing material 26 can also be an adhesive.

[0027] The transformer 22B is housed in the first accommodating space R1 on the right side of the housing 10, which is partitioned by the partition section 40. Furthermore, the converter output section 22C and multiple capacitors 4 provided for smoothing are housed in the second accommodating space R2 on the left side of the housing 10, which is also partitioned by the partition section 40. The right-side accommodating space is configured as a resin encapsulation partition 42, which serves as a partition for internal resin encapsulation. The resin encapsulation partition 42 is constructed using a resin 44 mixed with a highly thermally conductive filler (see reference). Figure 4 Resin encapsulation is performed.

[0028] like Figure 2 and Figure 4 As shown, a switching element 24, which utilizes the partition 40 as a heat dissipation path, is fixed in the partition 40. In the partition 40, the switching element 24 is fixed to the first side 40A facing the resin-encapsulated partition 42 by a clamping member 50.

[0029] The clamping member 50, viewed from the side, is a plate bent into an approximately crank-like shape, having a fixing portion 51 that contacts the first side surface 40A and a clamping portion 52 that is spaced apart from the first side surface 40A. The fixing portion 51 is fixed to the first side surface 40A with fasteners such as screws 62. A sheet-like insulating member 54 is disposed between the fixing portion 51 and the first side surface 40A. The clamping portion 52 is configured to hold the switching element 24 in place by pressing the switching element 24 inserted between the clamping portion 52 and the first side surface 40A and applying force toward the first side surface 40A. In this embodiment, the open end of the clamping portion 52 is open toward the upper part of the housing 10. The lead 241 of the switching element 24 (the lead 241 extending from the switching element 24 fixed to the partition portion 40) extends upward from the resin-encapsulated partition 42 as a connecting member.

[0030] The leading end of the lead wire 241 extends toward the substrate receiving portion 46 provided inside the housing 10 and connects to the wiring substrate 30. The substrate receiving portion 46 is provided corresponding to the partition portion 40 and is opposite to the resin encapsulation partition 42. In this embodiment, the substrate receiving portion 46 is formed in the upper part of the receiving space inside the housing 10, that is, above the partition portion 40. The leading end of the lead wire 241 of the switching element 24 fixed to the partition portion 40 extends from the resin encapsulation partition 42 and connects to the wiring substrate 30 disposed in the substrate receiving portion 46. The wiring substrate 30 is arranged approximately parallel to the bottom wall portion 14 of the housing 10 with the vertical direction as the thickness direction. The four corners of the wiring substrate 30 are fixed to the base portion 12, which is erected vertically from the four corners of the bottom wall portion 14 of the housing 10, by fastening members such as screws.

[0031] As described above, by forming a resin encapsulation partition 42 in the lower part of the accommodating space within the housing 10 and using the upper part of the accommodating space as a substrate accommodating part 46, it is possible to sequentially perform the partitioning operation 40 of the housing 10, the resin filling operation 44, and the connection operation between the electronic components and the wiring substrate 30 from one direction.

[0032] Furthermore, the structure described above, in which the switching element 24 is fixed to the partition portion 40 by the clamping member 50, is not necessary. The switching element 24 can also be directly fixed to the partition portion 40 using fasteners such as screws or adhesives. Additionally, the structure in which the switching element 24 is fixed to the first side 40A facing the resin-encapsulated partition 42 is also not necessary. It can also be fixed to the second side 40B facing the second receiving space R2 not encapsulated by the resin 44 (see reference). Figure 4 ).

[0033] (Function and effect) In the electronic device 1 of this embodiment, the accommodating space within the housing 10 is divided by a partition 40, and the interior of each partition (resin-encapsulated partition 42) is resin-encapsulated. Therefore, while suppressing the amount of resin filling the housing 10, relatively large electronic components such as the transformer 22B can achieve good heat dissipation within the partition. Furthermore, the partition 40 is used to fix relatively small electronic components such as the switching element 24, serving as a heat dissipation path for the switching element 24. Therefore, by utilizing the partition 40 as a mounting surface and heat dissipation part for relatively small electronic components, the required area of ​​the bottom surface of the housing 10 can be reduced. Thus, an electronic device can be obtained that suppresses cost increases and weight increases during the manufacturing process, and achieves heat dissipation for various heat-generating electronic components, thereby achieving device miniaturization.

[0034] Furthermore, in this embodiment, the partition 40 and the housing 10 are separate components. Therefore, electronic components can be fixed relative to the partition 40 outside the housing 10, resulting in an electronic device 1 structure with excellent assembly workability.

[0035] Furthermore, in this embodiment, the switching element 24 fixed to the partition 40 is fixed to a first side 40A located on the side of the resin encapsulation. Therefore, the switching element 24 fixed to the partition 40 can use both the partition 40 and the resin 44 filling the resin encapsulation partition 42 as heat dissipation paths.

[0036] Furthermore, in this embodiment, a resin-encapsulated partition is formed in the receiving space of the housing 10 via a partition 40, and a substrate receiving portion 46 corresponding to the partition 40 is formed. Additionally, a lead 241 extending from the switching element 24 fixed to the partition 40 is connected to a wiring substrate 30 disposed in the substrate receiving portion 46. Therefore, within the housing 10, the lead 241 of the switching element 24 is arranged to extend from the partition 40 toward the substrate receiving portion 46. Thus, after resin encapsulating one partition within the housing 10, the connection between the switching element 24 fixed to the partition 40 and the wiring substrate 30 can be easily established during the process of accommodating the wiring substrate 30 in the substrate receiving portion 46 within the housing 10.

[0037] The electronic device 1 of this embodiment has been described above, but this disclosure is not limited thereto. The following are examples of variations of the above embodiment. Each variation basically follows the structure of the electronic device of the above embodiment, and therefore the same function and effect can be obtained.

[0038] (First variation) like Figure 5 As shown, the partition 40 in the above embodiment can also be a partition 70, which constitutes at least a portion of the module housing 72 for forming an independent receiving space within the housing 10. For ease of understanding, Figure 5 The illustration of the electronic components housed within the housing 10 is omitted. In this first variation, the accommodating space within the box-shaped module housing 72 is a resin-encapsulated partition 42. As an example, the module housing 72 is formed as a rectangular box opening upwards, having a bottom wall portion 74 forming the bottom surface of the accommodating space within the housing 10 and side wall portions 76 erected vertically upwards from the edge of the bottom wall portion 74. The partition portion 70 is formed by the side wall portions 76 of the module housing 72.

[0039] According to the first variation, the partition 70 constitutes at least a portion of the module housing 72 for forming an independent accommodating space within the housing 10, the accommodating space within the module housing 72 being a resin encapsulation partition 42. Therefore, during the manufacturing process, the electronic components necessary for resin encapsulation can be modularly assembled into the housing 10.

[0040] (Second variation) like Figure 6As shown, the partition 40 in the above embodiment can be constructed from a heat dissipation substrate 82. In the second variation, the partition 80 is constructed from a heat dissipation substrate 82, which has wiring (not shown) provided on a base substrate 84 made of a metal with high thermal conductivity, separated by an insulating layer 86. At least a portion of the multiple switching elements 24 included in the PFC circuit section 21 and the converter circuit section 22 housed within the housing 10 are mounted on the heat dissipation substrate 82. Furthermore, at least a portion of the wiring constituting the PFC circuit section 21 and the converter circuit section 22 is formed on the heat dissipation substrate 82. A plurality of terminals 66 are connected to the upper end of the heat dissipation substrate 82. The plurality of terminals 66 extend toward the substrate receiving portion 46 within the housing 10 and are connected to the wiring substrate 30.

[0041] According to the second variation, the partitioning section 80 is a component that partitions the accommodating space within the housing 10, and constitutes at least a portion of the wiring substrate. This reduces the number of components and lowers costs.

[0042] (Third variation) Furthermore, although not shown in the figure, the partition 40 in the above embodiment may also be composed of a printed wiring substrate, which has wiring formed by conductors on a substrate formed of an insulating material such as resin.

[0043] (Fourth variation) Furthermore, the partition 40 in the above embodiment is formed in the shape of a rectangular plate, but it is not limited thereto. Its shape can be appropriately changed to locally partition the receiving space within the housing 10. For example, as... Figure 7 As shown, the partition section 90 can be configured as a plate-shaped section bent into an L-shape. The partition section 90 divides the receiving space within the housing 10 by the two sides formed by the sidewalls 16 of the housing 10 and the two sides of the partition section 90 itself. The receiving space within the partition section 90 is a resin-encapsulated partition 42.

[0044] Furthermore, in the above embodiments and variations, the partition and the housing 10 are separate components, but this disclosure is not limited to this. The housing 10 can also be die-cast, or the partition and housing 10 can be integrally formed. Furthermore, although the above embodiments and variations show a lidless configuration, a covered structure is also possible. Additionally, the lid and housing can be fixed together using screws or adhesives.

[0045] Furthermore, the entire contents of Japanese Patent Application No. 2024-008923, filed on January 24, 2024, are incorporated herein by reference. All documents, patent applications, and technical specifications mentioned in this specification are incorporated herein by reference, which is equivalent to a specific and separate mention of each document, patent application, and technical specification incorporated by reference.

Claims

1. An electronic device, wherein, have: case; A partitioning section that partitions the accommodating space within the housing; and Electronic components are fixed to the partition section, which serves as a heat dissipation path. The interior of the partition is encapsulated with resin.

2. The electronic device according to claim 1, wherein, The partition and the shell are separate components.

3. The electronic device according to claim 1 or 2, wherein, The electronic component is fixed to the side of the resin encapsulation in the partition section.

4. The electronic device according to claim 1 or 2, wherein, The partition constitutes at least a portion of a module housing for forming an independent accommodating space within the housing, the accommodating space within the module housing being a partition for resin encapsulation.

5. The electronic device according to claim 1 or 2, wherein, The partition is a heat dissipation substrate with wiring disposed on a base substrate through an insulating layer, and the electronic components are mounted on the heat dissipation substrate.

6. The electronic device according to claim 1 or 2, wherein, In the housing's accommodating space, a partition for resin encapsulation is formed by the partition portion, and a substrate accommodating portion corresponding to the partition portion is formed. A connecting member extending from an electronic component fixed to the partition portion is connected to a wiring substrate disposed in the substrate accommodating portion.

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