Electrical apparatus

Abstract

The invention relates to an electrical device having a lower part and an upper part arranged on the lower part, the upper part having a cooling body, the lower part having a circuit board equipped with power semiconductors, the power component having a base body from which a pin protrudes, the pin protruding into a hole of the circuit board, a cover being fitted onto the base body, the base body being inserted into a recess of the cooling body together with the cover, the cover being arranged between the cooling body and the base body, the cover being arranged in contact not only against the cooling body but also against the base body.

Description

Technical Field

[0001] This invention relates to an electrical device / applied equipment. Background Technology

[0002] As is well known, cooling elements improve the heat dissipation of electrical equipment.

[0003] As the closest prior art, a component of an electrical device is known from CN 1 08 630 636 A.

[0004] A cooling device for electrical components is known from DE 10 2004 025 523 A1.

[0005] A multifunctional housing for electronic components is known from DE 10 2015 203 791 A1.

[0006] A method for installing electrical components is known from DE 691 05 020 T2. Summary of the Invention

[0007] Therefore, the purpose of this invention is to improve the efficient heat dissipation of electrical equipment.

[0008] According to the invention, this objective is achieved by an electrical device according to the features described in claim 1.

[0009] An important feature of this invention in electrical equipment is that the electrical equipment has a lower component and an upper component disposed on the lower component.

[0010] The upper component includes a cooling body / heat sink.

[0011] The lower component includes a circuit board equipped with power semiconductors.

[0012] The power component has a base from which pins extend and into holes in the circuit board, particularly holes oriented parallel to each other.

[0013] The cover assembly and / or heat-shrink mount are attached to the substrate, particularly the side of the power component facing the cooling body.

[0014] The substrate, along with the cover, is inserted into the cooling body, particularly into a bag-shaped notch or recess.

[0015] The cover is positioned between the cooling body and the base.

[0016] The cover is in contact with both the cooling body and the substrate.

[0017] The advantage here is that the cover ensures electrical insulation while also ensuring heat dissipation from the power semiconductor to the cooling body. Furthermore, the contact-type abutment provides good thermal contact while also achieving mechanical fixation, especially vibration-damping fixation. Without mechanical fixation, the power semiconductor might be prone to vibration due to its extended leads.

[0018] Furthermore, during the assembly of electrical equipment, power semiconductors form orientation and positioning aids, and due to their elongated, protruding leads from the substrate, they remain resiliently deflectable. Guiding with smaller tolerances can be achieved via a guide device (which may be additionally provided).

[0019] In an advantageous design, the cover elastically deforms, and in particular, the wall thickness of the cover is reduced by means of this elastic deformation. The advantage here is that improved mechanical fastening and thermal coupling can be achieved.

[0020] In an advantageous design, the insertion direction is perpendicular to the surface normal of the contact cover wall region of the notch, and the hole axis is oriented parallel to the insertion direction, or forms an angle with the insertion direction less than a maximum angle value, especially an inclined angle. The advantage here is that jamming can be avoided because the maximum angle value can be chosen such that, within a range below that maximum angle value, the static friction force does not exceed a critical value.

[0021] In an advantageous design, the cooling element has a through-hole that leads into a notch, serving primarily as a ventilation opening. This has the advantage of allowing for simple and minimal installation, especially when the power components, along with the cover, are inserted into the notch.

[0022] In an advantageous design, the pins extend at least 5 mm, and particularly at least 10 mm, from the substrate. The advantage here is that this exceptionally long pin allows for flexible improvement in positioning tolerances when placing and mounting the upper component onto the lower component. Even if the upper component is slightly offset from its ideal position, the power semiconductor can still be successfully inserted into the notch because the flexible pins provide a degree of freedom of movement for the substrate.

[0023] In an advantageous design, the electrical equipment includes a guiding device for guiding the upper component when it is placed onto the lower component, particularly useful in the manufacture of electrical equipment. The advantage here is that it makes it possible to place the upper component onto the lower component with the greatest possible precision.

[0024] In one advantageous design, a power module is mounted on a circuit board, and the housing of the power module, particularly a cuboid or dome-shaped housing, extends into a recess in the cooling body during placement and / or acts as a guide. The advantage here is that it allows for seamless insertion into the recess.

[0025] In an advantageous design, the power components are power semiconductors, particularly transistors, IGBTs, or CMOS.

[0026] In particular, the substrate has a rectangular shape. An advantage of this is that lost heat can be dissipated into the surrounding environment through the cooling system.

[0027] In an alternative, advantageous design, the power component is a capacitor.

[0028] In particular, the substrate has a cylindrical structure. An advantage of this is that lost heat can be dissipated into the surrounding environment via a cooling system.

[0029] In an advantageous design, the power module has a half-bridge electrically connected in parallel with each other, the half-bridge being composed of power semiconductor switches, particularly IGBT or MOSFET switches. The advantage here is that multiple semiconductor switches can be arranged in a common housing, and heat loss can be dissipated through the housing to a cooling element. Here, the housing is preferably made of ceramic and contacts the cooling element.

[0030] Preferably, the cooling element is made of aluminum.

[0031] In an advantageous design, the cover is thermally conductive. The advantage here is that heat loss from the power components can be dissipated from the power components to the cooling body via the cover. In particular, the specific thermal conductivity of the cover is greater than that of rubber, wood, or air at 30% relative humidity and 0°C, especially at least one hundred times greater.

[0032] In an advantageous design, the cover is made of silicone rubber / silicone / organosilicon, or is made of silicone rubber (Silikon). The advantage here is that the cover is thermally conductive, and therefore heat loss from the power components can be conducted through the cover and the coolant with extremely low thermal resistance.

[0033] In one advantageous design, the power module is soldered to the conductor traces of the circuit board. The advantage here is that the power module connects directly to the circuit board using its electrical contacts, thus connecting with a spacing of less than 3 mm. Therefore, the power module acts as a load-bearing positioning aid by interacting with the recess.

[0034] In one advantageous design, two of the four sides of the substrate are larger than the other two and press against the cover. The advantage here is that this achieves the largest possible contact area and thus results in low thermal resistance.

[0035] In one advantageous design, the contact area where the cover rests against the coolant has at least two interruptions in the circumferential direction relative to the insertion direction of the power semiconductor.

[0036] In particular, the total area of ​​the interrupted regions covers a circumferential angle range smaller than half that of each of the contact regions. The advantage here is that during insertion, a certain gap exists in the lateral direction relative to the insertion direction and, moreover, in the direction of the interruption. Therefore, low force consumption can be achieved while still maintaining efficient heat dissipation.

[0037] Further advantages are provided by the dependent claims. The invention is not limited to the combination of features of the claims. For those skilled in the art, particularly for purposes proposed and / or proposed by comparison with the prior art, other reasonable combinations of features of the claims and / or individual claims and / or description features and / or drawings are possible. Attached Figure Description

[0038] The invention will now be described in detail with reference to the schematic diagram:

[0039] exist Figure 1 The diagram schematically shows a cross-section of the electrical device according to the invention cut along a first cutting plane.

[0040] exist Figure 2 The diagram schematically shows a cross-section of an electrical device according to the invention cut along a second cutting plane, wherein a first cutting plane is perpendicular to the second cutting plane. Detailed Implementation

[0041] As shown in the attached figure, the electrical device has a circuit board 1, which is equipped with power semiconductors 4, especially transistors.

[0042] A cover 2 is fitted onto the substrate of the power semiconductor 4, so that the substrate of the power semiconductor 4 is at least partially surrounded by the cover 2, especially the sleeve. The connection pins of the power semiconductor 4 extend from the substrate toward the circuit board 1 and are soldered to the conductor traces of the circuit board 1, especially being inserted into holes in the circuit board 1 and soldered to the conductor traces of the circuit board 1.

[0043] Preferably, the power semiconductor 4 is a transistor, especially an IGBT or a MOSFET.

[0044] The cover 2 is made of a material that is softer than the substrate of the power semiconductor 4 and also softer than the coolant 3. This material has electrical insulation strength and is therefore particularly electrical insulating.

[0045] The cover 2 is made of thermally conductive material.

[0046] Preferably, the cover 2 is made of silicone rubber or a material containing silicone rubber.

[0047] The base body, together with the cover 2, is inserted into the bag-shaped notch 6 of the cooling body 3. The cooling body has cooling ribs 5 extending toward the surrounding environment.

[0048] The notch 6 is only slightly larger than the substrate on at least two sides, so that the material of the cover 2 can be elastically deformed, especially at least at the contact surface segment corresponding to the cover 2 and the cooling body 3, the normal of which is perpendicular to the insertion direction of the power semiconductor.

[0049] In particular, there is a distance between the cover 2 and the bottom of the bag-shaped notch, that is, a distance in the insertion direction of the cover 2 into the cooling body.

[0050] To maintain an insulating distance, the cover 2 extends toward the circuit board 1 and beyond the cooling body 3 after being inserted into the notch 6.

[0051] The shape of the notch is adapted to the shape of the substrate of the power semiconductor 4.

[0052] Therefore, according to the present invention, the simple manufacture of electrical equipment is made possible because the circuit board 1 can be arranged in the lower component, while the upper component having the cooling body 3 can be placed on the lower component. When the upper component is placed on the lower component in the insertion direction, the power semiconductor 4, especially the substrate, together with its cover 2, is inserted into the notch 6.

[0053] In particular, the base is cuboid in shape, and the notch 6 is also cuboid in shape.

[0054] The ideal insertion direction for inserting the power semiconductor 4 together with the cover 2 into the notch 6 is perpendicular to the normal to the wall of the notch 6.

[0055] To prevent jamming during installation, it is preferable to use a guide device to guide the upper component onto the lower component. Therefore, the guide device is constructed in a manner that prevents excessively large tilt angles from being created.

[0056] Although the cover 2 undergoes elastic deformation, resulting in a reduction in the wall thickness of the cover 2, it still has sufficiently high insulation strength.

[0057] The holes in the circuit board 1 through which the pins of the power semiconductor 4 pass have hole axes parallel to the ideal insertion direction. By means of a guiding device, the tilt angle between the hole axis and the insertion direction perpendicular to the wall segment is limited to a maximum value. Therefore, the power semiconductor 4 is protected from damage when inserted into the notch 6.

[0058] A through hole is formed at the bottom of the notch, which passes through the cooling body 3 and serves as a ventilation hole.

[0059] The pouch-shaped notch is designed to gradually taper / narrow as the depth increases. Therefore, the cover 2 elastically deforms when the substantially cuboid substrate of the power semiconductor 4 is inserted. Preferably, two of the four sides of the substrate are larger than the other two sides and are pressed against the cover 2. Thus, in the circumferential direction relative to the insertion direction of the power semiconductor 4, there are two interruptions in the contact area where the cover 2 abuts against the cooling body 3, wherein the sum of the interrupted areas covers a circumferential angle range smaller than half of each of the contact areas. Therefore, efficient heat dissipation can be achieved.

[0060] In other embodiments of the invention, the substrate of the power semiconductor 4 is implemented as a column and rests uninterruptedly against the cover 2 in the circumferential direction, the cover resting uninterruptedly against the cooling body in the circumferential direction. To avoid obstructing the insertion of the power semiconductor, a through-hole is introduced at the bottom of the notch, which acts as a ventilation hole during insertion. As an alternative to the columnar embodiment of the notch, the notch may also be as described in... Figure 1 and Figure 2 It is implemented as a cuboid shape, as in the previous embodiment.

[0061] List of reference numerals in the attached diagram:

[0062] 1 circuit board

[0063] 2. Covers, especially sleeves

[0064] 3 cooling body

[0065] 4 power semiconductors

[0066] 5 Cooling Ribs

[0067] 6. The bag-shaped notch of the cooling body 3.

Claims

1. An electrical device, Electrical equipment has a lower part and an upper part mounted on the lower part. The upper component has a cooling body. The lower component has a circuit board equipped with power semiconductors. Its features are, The power component has a base from which leads extend, and the leads extend into holes in the circuit board, particularly into holes oriented parallel to each other. The cover assembly and / or heat-shrink mount are attached to the substrate, particularly the side of the power component facing the coolant. The substrate, along with the cover, is inserted into the notch of the cooling body—especially the bag-shaped one—and particularly into the recess of the cooling body. The cover is positioned between the cooling body and the base. The cover is in contact with not only the cooling body but also the substrate.

2. The electrical equipment according to claim 1, characterized in that, The cover undergoes elastic deformation, and in particular, the wall thickness of the cover is reduced by means of elastic deformation.

3. The electrical equipment according to any one of the preceding claims, characterized in that, The insertion direction is perpendicular to the surface normal of the contact cover wall area of ​​the notch, and the hole axis is oriented parallel to the insertion direction or forms an angle with the insertion direction less than the maximum angle value, especially an inclined angle.

4. The electrical equipment according to any one of the preceding claims, characterized in that, The cooling body has through holes that pass through it and into the notch, especially as ventilation holes.

5. The electrical equipment according to any one of the preceding claims, characterized in that, The pins extend at least 5 mm, and especially at least 10 mm, from the substrate.

6. The electrical equipment according to any one of the preceding claims, characterized in that, Electrical equipment has guiding devices for guiding the upper part when placing the upper part onto the lower part, especially in the manufacture of electrical equipment.

7. The electrical equipment according to any one of the preceding claims, characterized in that, A power module is mounted on the circuit board. The housing of the power module, especially the rectangular or dome-shaped housing, extends into the recess of the cooling body during placement and / or acts as a guide device.

8. The electrical equipment according to any one of the preceding claims, characterized in that, Power components are power semiconductors, especially transistors, IGBTs, or CMOS. In particular, the matrix structure is rectangular. or The power component is the capacitor. In particular, the matrix structure is columnar.

9. The electrical equipment according to any one of the preceding claims, characterized in that, The power module has half-bridges that are electrically connected in parallel with each other. The half-bridges are composed of power semiconductor switches, especially IGBT or MOSFET switches.

10. The electrical equipment according to any one of the preceding claims, characterized in that, The cover is thermally conductive. and / or The cover contains silicone rubber or is made of silicone rubber.

11. The electrical equipment according to any one of the preceding claims, characterized in that, The power module is soldered to the conductor traces on the circuit board.

12. The electrical equipment according to any one of the preceding claims, characterized in that, The upper component is connected to the lower component by means of a threaded part. In particular, the screw passes through the circuit board and is screwed into the threaded hole of the cooling element.

13. The electrical equipment according to any one of the preceding claims, characterized in that, The pouch-shaped notch is formed to narrow as the distance from the circuit board increases, especially to gradually narrow.

14. The electrical equipment according to any one of the preceding claims, characterized in that, Two of the four sides of the substrate are larger than the other two sides and are pressed tightly against the cover.

15. The electrical equipment according to any one of the preceding claims, characterized in that, In the circumferential direction based on the insertion direction of the power semiconductor, there are at least two interruptions in the contact area where the cover abuts against the cooling body. In particular, the sum of the interrupted areas covers a circumferential angular range that is less than half the size of each of the contact areas.

Images