An injection system, a driving module and an injection method

Abstract

The application provides a glue injection system, a driving module and a glue injection method, and belongs to an energy-saving heat exchange device. The application provides a glue injection system for injecting glue into a power module, comprising a glue injection assembly; the power module is installed on a radiator, a contact gap is formed between the power module and the radiator, and the contact gap is filled with heat dissipation glue; a glue outlet of the glue injection assembly is in communication with the contact gap, wherein the glue injection assembly supplements the heat dissipation glue in the contact gap according to changes in at least one of the following parameters: a temperature difference between an inlet and an outlet of the radiator and a temperature of the power module. In the application, the system can obtain the temperature difference between the inlet and the outlet of the radiator and the temperature of the power module in real time, and the system can automatically identify the time when the performance of the heat dissipation glue decreases based on changes in these parameters, thereby avoiding the hysteresis and subjective misjudgment of traditional manual inspection.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology, specifically relating to a glue injection system, a drive module, and a glue injection method, and is an energy-saving heat exchange device. Background Technology

[0002] Variable frequency drive modules generate a significant amount of heat during operation, especially IGBT (Insulated Gate Bipolar Transistor) modules, which are known for their high heat output. Because IGBT modules, as power modules, frequently switch at high speeds and carry enormous currents, their chips generate substantial heat during operation. This necessitates the use of thermal grease, applied in the tiny gap between the module and the heatsink, to reduce contact thermal resistance and improve heat transfer efficiency. However, over long-term operation, thermal grease is susceptible to high temperatures, vibration, and oxidation, gradually drying out or leaking away. This leads to increased thermal resistance, abnormally high module temperatures, and ultimately, device aging, performance degradation, and even burn-out failures.

[0003] In the field of energy-saving heat exchange devices, the current industry mainly relies on manual periodic inspection and manual replenishment for the maintenance of thermal grease. Manual maintenance is usually based on fixed cycles or discovered after shutdown, and it is impossible to monitor the heat dissipation status of the module in real time, such as changes in thermal resistance. When the performance of the thermal grease deteriorates and causes abnormal module temperature, irreversible thermal damage has often already occurred. Summary of the Invention

[0004] This invention provides a glue injection system, a drive module, and a glue injection method, which belong to an energy-saving heat exchange device. It can solve the technical problem that the maintenance of thermal grease relies on manual inspection and glue injection, and cannot be based on the heat dissipation status of the module.

[0005] This invention provides a dispensing system for dispensing adhesive into a power module, including a dispensing assembly; The power module is mounted on the heat sink, and a contact gap is formed between the power module and the heat sink, which is filled with thermal adhesive. The dispensing port of the dispensing assembly is connected to the contact gap, wherein the dispensing assembly replenishes thermal adhesive into the contact gap according to changes in at least one of the following parameters: the temperature difference between the inlet and outlet of the radiator, and the temperature of the power module.

[0006] In some embodiments, an injection channel is also included, wherein the power module is embedded in the heat sink, the injection channel is formed in the heat sink, the inlet of the injection channel is connected to the outlet of the glue injection assembly, and the outlet of the injection channel is connected to the contact gap.

[0007] In some embodiments, the contact gap is formed between the bottom of the power module and the heat sink, the injection channel is opened on one side of the power module, the injection channel has multiple outlets, the multiple outlets are spaced apart along the length direction of the contact gap and are respectively connected to the contact gap.

[0008] In some embodiments, the injection channel includes a main channel and a plurality of branch channels. The main channel extends along the length of the contact gap, and the plurality of branch channels are spaced apart between the contact gap and the main channel. The main channel is connected to the dispensing port of the dispensing assembly. One end of each of the plurality of branch channels is connected to the sidewall of the main channel, and the other end of each of the plurality of branch channels is connected to the contact gap, thereby forming a plurality of outlets.

[0009] In some embodiments, a connecting pipe is also included, which is mounted on the heat sink, with one end of the connecting pipe connected to the dispensing port of the dispensing assembly and the other end of the connecting pipe connected to the main channel.

[0010] In some embodiments, the dispensing assembly includes a liquid reservoir and a dispensing tube, the dispensing tube having an inlet and an outlet, the inlet being connected to the liquid reservoir.

[0011] In some embodiments, the dispensing assembly further includes a pump body, and the dispensing tube includes a pump outlet tube and a pump return tube. One end of the pump return tube is the dispensing inlet, and the other end of the pump return tube is connected to the pump body inlet. One end of the pump outlet tube is connected to the pump body outlet tube, and the other end of the pump outlet tube is the dispensing outlet.

[0012] In some embodiments, the heat sink is a liquid-cooled plate, the liquid-cooled plate is provided with liquid-cooled channels, the liquid-cooled channels are multi-bend channels, and the contact gap is located in the upper region of the liquid-cooled channels.

[0013] In some embodiments, the liquid cooling plate is equipped with a water temperature sensor at its inlet and outlet, and the power module has a built-in temperature sensor.

[0014] A drive module includes a dispensing system, wherein the dispensing system is the dispensing system described above.

[0015] A glue injection method, for use in a glue injection system, wherein the glue injection system is as described above, and the glue injection method includes: Obtain the temperature difference between the inlet and outlet of the radiator and / or the temperature of the power module; When the temperature difference exceeds a first preset threshold and / or the temperature exceeds a second preset threshold, the dispensing assembly is controlled to add heat-dissipating adhesive to the contact gap.

[0016] The present invention provides a glue injection system, a drive module, and a glue injection method, which belong to an energy-saving heat exchange device and have the following beneficial effects: In this invention, the system can acquire the temperature difference between the heat sink inlet and outlet and the power module temperature in real time. When the thermal adhesive increases thermal resistance due to drying, loss, or aging, the above parameters will change accordingly. Based on these parameter changes, the system can automatically identify when the thermal adhesive performance deteriorates, avoiding the lag and subjective misjudgment of traditional manual inspection. The adhesive injection assembly automatically starts the replenishment program according to the temperature difference and / or module temperature changes, realizing on-demand replenishment instead of blind maintenance at fixed cycles. The replenishment amount is controllable, avoiding both excessive replenishment that causes thermal adhesive overflow and circuit contamination, and insufficient replenishment that results in limited heat dissipation improvement, significantly improving the accuracy and effectiveness of replenishment. In the early stage of thermal adhesive performance degradation, the system automatically replenishes fresh thermal adhesive, promptly restoring the thermal conductivity of the contact interface and maintaining the operating temperature of the power module within a safe range. This effectively suppresses abnormal temperature rise of the module caused by continuous increase in thermal resistance, thereby delaying the aging process of the device and reducing the risk of performance degradation or burn-out failure caused by overheating. This system can complete the refilling while the power module is running normally, without stopping the machine or only requiring a brief load reduction. Compared with the traditional solution that requires stopping, disassembling, cleaning and recoating, it significantly reduces the downtime for equipment maintenance and improves production continuity and overall system availability. Attached Figure Description

[0017] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the dispensing system according to an embodiment of the present invention; Figure 2 This is a top view of the dispensing system according to an embodiment of the present invention; Figure 3 This is a cross-sectional view of the dispensing system according to an embodiment of the present invention; Figure 4 for Figure 3 Enlarged detail image of point E in the middle; Figure 5 This is a schematic diagram of the injection channel according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the liquid cooling channel according to an embodiment of the present invention.

[0019] Attached Figures: 1-Power Module; 2-Glue Dispensing Assembly; 201-Reservoir Tank; 202-Glue Dispensing Tube; 221-Glue Inlet; 222-Glue Outlet; 223-Pump Outlet Pipe; 224-Pump Return Pipe; 203-Pump Body; 3-Radiator; 301-Liquid Cooling Channel; 4-Contact Gap; 5-Injection Channel; 51-Outlet; 501-Main Channel; 502-Branch Channel; 6-Connecting Pipe; 7-Variable Frequency Drive Module. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0022] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used here to describe the spatial positional relationship of a device or feature as shown in the figure with other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation of the device as described in the figure. For example, if a device in the figure is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures.

[0023] See also Figures 1 to 6As shown, according to an embodiment of the present invention, a glue injection system is provided, belonging to an energy-saving heat exchange device, for injecting glue into a power module 1, including a glue injection component 2; the power module 1 is mounted on a heat sink 3, and a contact gap 4 is formed between the power module 1 and the heat sink 3, the contact gap 4 being filled with thermal adhesive; the glue outlet 222 of the glue injection component 2 is connected to the contact gap 4, wherein the glue injection component 2 replenishes thermal adhesive into the contact gap 4 according to changes in at least one of the following parameters: the temperature difference between the inlet and outlet of the heat sink 3, and the temperature of the power module 1. The power module 1 is specifically an IGBT module, a core power switching device in the electronic field. In this embodiment, the IGBT module is one type of power module 1; in other embodiments, it could also be a module requiring heat dissipation.

[0024] Specifically, in the initial state, power module 1 is mounted on heat sink 3, and thermal adhesive is pre-applied to the contact gap 4 between them. Heat sink 3 can dissipate heat from power module 1. The adhesive injection assembly 2 is in standby mode, and its outlet 222 is connected to the contact gap 4 through injection channel 5. The system continuously monitors the following two parameters: the temperature difference between the inlet and outlet of heat sink 3; and the temperature of power module 1. As the running time increases, the thermal adhesive in the contact gap 4 gradually dries and leaks, leading to an increase in contact thermal resistance. The increased thermal resistance makes it more difficult for heat to be transferred from the module to the coolant, resulting in a larger increase in the outlet coolant temperature compared to the inlet temperature. The internal chip of the module experiences an increase in temperature due to obstructed heat dissipation. The system detects that at least one of these two parameters has exceeded the threshold. Based on the characteristics of the parameter changes, the system determines that the current decrease in heat dissipation performance is caused by the drying or leakage of thermal adhesive, rather than other faults, and replenishes new thermal adhesive into the contact gap 4. The adhesive injection component 2 continuously injects adhesive for a period of time, then stops injection, allowing the injected fresh thermal adhesive to fully penetrate and fill the gaps in the dried and cracked old thermal grease under the action of thermal motion, restoring the thermal conductivity uniformity of the contact surface. After adhesive injection, the system continuously monitors parameter changes. If the parameters gradually recover, there is no need to refill the thermal adhesive.

[0025] In this embodiment, a fixed, refillable contact gap 4 is formed between the power module 1 and the heat sink 3. The introduction of the adhesive injection component 2 transforms this originally static, one-time coated interface into a dynamically repairable thermal interface. Together, they enable the system to inject adhesive into the thermal interface material in situ without disassembly. When the thermal adhesive dries or leaks, the thermal resistance within the contact gap 4 increases, directly resulting in a rise in the temperature of the power module 1 and / or an increase in the temperature difference between the inlet and outlet of the heat sink 3. The adhesive injection component 2, acting as an execution unit, automatically initiates a compensation action based on the abnormal changes in these parameters, precisely injecting fresh thermal adhesive into the same gap. In this embodiment, the system can acquire the temperature difference between the inlet and outlet of the heat sink 3 and the temperature of the power module 1 in real time. When the thermal resistance increases due to the drying, loss, or aging of the thermal adhesive, the above parameters will change accordingly. Based on these parameter changes, the system can automatically identify the timing of the thermal adhesive performance degradation, avoiding the lag and subjective misjudgment of traditional manual inspection. The adhesive injection component 2 automatically starts the replenishment program according to the temperature difference and / or module temperature changes, realizing on-demand replenishment instead of blind maintenance at fixed cycles. The replenishment amount is controllable, avoiding both excessive replenishment that causes thermal adhesive overflow and circuit contamination, and insufficient replenishment that results in limited heat dissipation improvement, significantly improving the accuracy and effectiveness of replenishment. In the early stage of thermal adhesive performance degradation, the system automatically replenishes fresh thermal adhesive to restore the thermal conductivity of the contact interface in a timely manner, keeping the operating temperature of the power module 1 within a safe range. This effectively suppresses the abnormal rise in module temperature caused by the continuous increase in thermal resistance, thereby delaying the device aging process and reducing the risk of performance degradation or burn-out failure caused by overheating. This system can complete the refilling while the power module 1 is running normally, without stopping the machine or only requiring a brief load reduction. Compared with the traditional solution that requires stopping, disassembling, cleaning and recoating, it significantly reduces the downtime for equipment maintenance and improves production continuity and overall system availability.

[0026] As a specific implementation, the heat sink 3 provides a heat conduction and heat dissipation path for the power module 1. Its specific structural form is not limited, as long as it allows for contact installation of the power module 1 and has inlet and outlet ports for the flow of working fluid. For example, the heat sink 3 can be a liquid-cooled plate with internal liquid-cooled channels 301 for coolant flow. The liquid-cooled channels 301 can be serpentine, parallel straight channels, or spiral shapes to increase the heat exchange area. The coolant flows in from the inlet, absorbs heat in the area below the power module 1, and then flows out from the outlet. The temperature difference between the inlet and outlet directly reflects the degree of heat generation of the module and the thermal conductivity of the thermal paste. The heat sink 3 can also be an air-cooled heat sink 3, including a substrate and multiple heat dissipation fins disposed on the substrate. Airflow channels are formed between the heat dissipation fins. At least one cooling pipe can be embedded in the substrate, with both ends of the cooling pipe serving as the inlet and outlet of the heat sink 3, allowing liquid medium to flow through to assist in heat dissipation. In this case, the temperature difference between the inlet and outlet can also be used as a basis for determining the state of the thermal paste. The heat sink 3 can also be a heat pipe heat sink 3.

[0027] As a specific implementation method, thermal adhesive is filled in the contact gap 4 between the power module 1 and the heat sink 3. Its main function is to remove air between the contact interfaces, reduce contact thermal resistance, and improve heat conduction efficiency. The thermal adhesive can be thermal silicone.

[0028] See also Figures 1 to 4As shown, it also includes an injection channel 5. The power module 1 is embedded in the heat sink 3, and the injection channel 5 is opened in the heat sink 3. The injection channel 5 is opened inside the solid body of the heat sink 3. The inlet of the injection channel 5 is connected to the outlet 222 of the glue injection assembly 2. The inlet is located on the outer surface of the heat sink 3 and is sealed and connected to the outlet 222 of the glue injection assembly 2 through a pipe or connector to receive the heat dissipation glue output by the glue injection assembly 2. The outlet 51 of the injection channel 5 is connected to the contact gap 4.

[0029] Specifically, when the dispensing assembly 2 receives a refill command, the thermal adhesive is discharged from the dispensing port 222 of the dispensing assembly 2 at a preset micro-flow rate. At this time, the thermal adhesive is in a paste or liquid state with a certain degree of fluidity. The thermal adhesive discharged from the dispensing port 222 first enters the inlet of the injection channel 5, which is directly connected to it. The injection channel 5 is preferably opened inside the radiator 3 and extends along one side or edge of the power module 1. Under the continuous thrust applied by the injection pump, the thermal adhesive flows along the inside of the injection channel 5 and is transported from the inlet to the outlet 51. The end of the injection channel 5 has an outlet 51. The thermal adhesive flows into the contact gap 4 from the outlet 51 in the form of a micro-jet or seepage. Once inside the contact gap 4, the thermal adhesive begins to diffuse outwards under the combined action of capillary force and injection pressure. Due to the small thickness of the contact gap 4, the thermal adhesive, under the action of surface tension, can quickly wet the micro-uneven structure on the bottom surface of the power module 1 and the upper surface of the heat sink 3, gradually filling the gaps formed by drying, cracking, or loss. Simultaneously, the heat generated by the module's operation raises the temperature of the thermal adhesive, further reducing its viscosity, enhancing its fluidity, and promoting penetration into the micro-gaps. When the injection assembly 2 stops working, the residual pressure in the injection channel 5 gradually dissipates, and the thermal adhesive that has entered the contact gap 4 remains stable within it, no longer flowing, forming a uniform and continuous thermally conductive medium layer, restoring and optimizing the heat conduction path between the power module 1 and the heat sink 3.

[0030] In this embodiment, the thermal adhesive output from the dispensing assembly 2 flows directionally along a preset channel, directly reaching the contact gap 4 that needs replenishment. This prevents the thermal adhesive from escaping, shifting, or contaminating other areas of the radiator 3 during transport. The injection channel 5 is directly located inside the radiator 3, eliminating the need for additional external piping or independent channels. This facilitates a miniaturized and compact system design and reduces the risk of leakage or mechanical interference caused by exposed piping. The outlet 51 leads directly to the contact gap 4, allowing the thermal adhesive to enter the target area from the injection starting point. This reduces resistance loss and uncertainty in the flow path, improving the positioning accuracy and effectiveness of the replenishment action. By adjusting the location, length, orifice diameter of the injection channel 5 and the layout of the outlet 51, directional, multi-point, or uniform injection can be achieved for different areas of the contact gap 4, thereby optimizing the replenishment effect.

[0031] See also Figures 1 to 4 As shown, the heat sink 3 is provided with a corresponding mounting groove, the power module 1 is installed in the mounting groove, and a contact gap 4 is formed between the bottom of the power module 1 and the heat sink 3. The injection channel 5 is opened on one side of the power module 1. The injection channel 5 has multiple outlets 51, which extend through to the side wall of the mounting groove. The multiple outlets 51 are spaced apart along the length of the contact gap 4 and are respectively connected to the contact gap 4.

[0032] Specifically, since the injection channel 5 is located on one side of the power module 1 and extends along the length of the contact gap 4, the thermal adhesive, after entering the injection channel 5, flows forward along the length of the channel under continuous pressure. At this time, the injection channel 5 acts as a distribution manifold, delivering the thermal adhesive from the inlet end to the distal end. During the flow, because the sidewall or end of the injection channel 5 is provided with multiple outlets 51, and these outlets 51 are spaced apart along the length of the contact gap 4, when the thermal adhesive flows through each outlet 51, a portion of the adhesive is squeezed out from the outlet 51 under the action of pressure difference and enters the contact gap 4 connected to it. The thermal adhesive discharged from each outlet 51, under the combined action of injection pressure and capillary force, enters the contact gap 4 between the bottom of the power module 1 and the upper surface of the heat sink 3. The thermal adhesive diffuses and wets within the gap along the planar direction, gradually filling the voids formed by drying or loss, ultimately forming a uniform thermally conductive medium layer.

[0033] In this embodiment, the injection channel 5 is located on one side of the power module 1, and multiple outlets 51 are provided along the length of the contact gap 4. This allows the thermal adhesive to enter the contact gap 4 simultaneously from multiple locations, rather than relying on a single injection point to spread outwards. This arrangement effectively avoids the problem of uneven filling caused by the thermal adhesive having to flow laterally over a long distance when injected at a single point. Multi-point injection enables the thermal adhesive to be evenly distributed along the entire length of the contact gap 4, ensuring consistent thermal conductivity across the entire contact interface. By arranging the outlets 51 at intervals along the length of the contact gap 4, the coverage area of ​​each outlet 51 is limited to a local area between adjacent outlets 51. The furthest flow distance of the thermal adhesive from the outlet 51 to the filling area is shortened, and the resistance on the flow path is reduced accordingly. This not only reduces the driving pressure required by the injection assembly 2, but also facilitates the rapid and smooth entry of the thermal adhesive into all areas of the contact gap 4, improving the filling efficiency.

[0034] As a specific implementation method, the outlet 51 near the inlet end is closer to the inlet, has a shorter flow path, and lower flow resistance, so the heat dissipation adhesive is more easily discharged and the amount of adhesive discharged is relatively large. The outlet 51 far from the inlet end has a slightly lower driving pressure due to pressure loss along the flow path. However, by reasonably designing the diameter and spacing of the outlets 51, the amount of adhesive discharged from each outlet 51 can be made more uniform, ensuring that the heat dissipation adhesive can be injected synchronously at multiple points along the entire length of the contact gap 4.

[0035] See also Figures 1 to 4 As shown, the injection channel 5 includes a main channel 501 and multiple branch channels 502. In this embodiment, five branch channels 502 are provided. The main channel 501 extends along the length direction of the contact gap 4, which is the length extension direction of the power module 1. The main channel 501 has a flow inlet located on the outer surface of the heat sink 3 for sealing communication with the glue outlet 222 of the glue injection assembly 2. The multiple branch channels 502 are spaced apart between the contact gap 4 and the main channel 501, that is, in a direction perpendicular to the length direction of the contact gap 4. The main channel 501 is connected to the glue outlet 222 of the glue injection assembly 2. One end of each of the multiple branch channels 502 is connected to the side wall of the main channel 501, and the other end of each of the multiple branch channels 502 is connected to the contact gap 4. That is, the length direction of the multiple branch channels 502 extends along the width direction of the contact gap 4 to form multiple flow outlets 51. Each branch channel 502 has one end connected to the sidewall of the main channel 501 and the other end connected to the contact gap 4, thus forming a flow outlet 51 at the connection between the branch channel 502 and the contact gap 4. Multiple flow outlets 51 are spaced apart along the length of the contact gap 4, and each flow outlet 51 corresponds to a different position in the contact gap 4. The main channel 501 serves as a main collection and distribution pipe, extending along its length. Each branch channel 502 serves as a distribution branch pipe, branching out from the sidewall of the main channel 501 along its width. In a preferred embodiment, each branch channel 502 extends perpendicular to the sidewall of the main channel 501, and the spacing between adjacent branch channels 502 is equal to ensure the uniformity of the area covered by each flow outlet 51. The aperture of each branch channel 502 can be the same or different depending on the heat load difference of the corresponding area.

[0036] Specifically, the thermal adhesive output from the dispensing assembly 2, under driving pressure, first enters the main channel 501 through its inlet. Inside the main channel 501, the thermal adhesive flows axially along the main channel 501 under continuous pressure. When the thermal adhesive flows through the connection ports of the various branch channels 502 on the side wall of the main channel 501, due to the pressure difference at the inlet of the branch channel 502, a portion of the thermal adhesive is diverted into the branch channel 502. Within the branch channel 502, the thermal adhesive flows towards the contact gap 4 along the width direction of the contact gap 4. (This process is repeated twice in the original text.)

[0037] In this embodiment, the main channel 501 extends along the length of the contact gap 4, delivering the thermal adhesive longitudinally to the entire coverage area of ​​the power module 1. The branch channel 502 branches out from the sidewall of the main channel 501 along the width of the contact gap 4, changing the flow direction of the thermal adhesive from longitudinal to transverse and directly guiding it to the contact gap 4. This configuration achieves a directional conversion of the thermal adhesive from longitudinal delivery to transverse distribution. The main channel 501 distributes the thermal adhesive to multiple locations along the length of the contact gap 4, while the branch channel 502 further guides the thermal adhesive from these locations into the width of the contact gap 4. Through the combination of the longitudinally evenly distributed main channel 501 and the transversely extending branch channel 502, the thermal adhesive can be injected simultaneously along both the length and width of the contact gap 4 in a multi-point and three-dimensional manner, avoiding filling dead zones or coverage blind spots present in single-point or unidirectional injection, significantly improving the uniformity and integrity of the filling.

[0038] See also Figures 1 to 4 As shown, it also includes a connecting pipe 6, which is vertically installed on the heat sink 3. One end of the connecting pipe 6 is connected to the glue outlet 222 of the glue injection assembly 2, and the other end of the connecting pipe 6 is connected to the middle of the main channel 501. That is, after the heat dissipation glue flows into the main channel 501, it flows in two directions, flowing simultaneously to the front end and the rear end of the main channel 501 in two opposite directions along the length of the main channel 501.

[0039] Specifically, under driving pressure, the thermal adhesive output from the dispensing assembly 2 first enters the connecting pipe 6 from the dispensing port 222 of the dispensing assembly 2. The thermal adhesive flows vertically downwards within the connecting pipe 6 and exits from the other end, entering the middle of the main channel 501. Upon reaching the middle of the main channel 501, a T-shaped or cross-shaped branching node is formed, causing the thermal adhesive to split into two paths under pressure. The first path flows along the main channel 501 in a first direction (e.g., towards the front end), and the second path flows along the main channel 501 in a second direction (e.g., towards the rear end). Both paths simultaneously flow in opposite directions along the axial direction of the main channel 501, each flowing towards the far end of the main channel 501. Inside the main channel 501, the two paths flow through the connection ports of various branch channels 502 along their respective routes. At each branch channel 502 connection port, a portion of the thermal adhesive is diverted into the corresponding branch channel 502 and flows along the branch channel 502 towards the width of the contact gap 4.

[0040] In this embodiment, the thermal adhesive enters from the middle of the main channel 501 and flows simultaneously to both ends. Compared to a unidirectional flow from one end of the main channel 501 to the other, the maximum flow distance of the thermal adhesive within the main channel 501 is halved, resulting in reduced pressure loss along the flow path. This reduces the driving pressure required for the dispensing assembly 2, facilitating faster and smoother delivery of the thermal adhesive to both ends of the main channel 501 and each branch channel 502. In a unidirectional dispensing scheme, the thermal adhesive flow rate at the far end of the main channel 501 is low, easily forming flow dead zones or stagnant areas, where the thermal adhesive may accumulate or solidify. The bidirectional flow scheme ensures continuous flow and renewal of fluid within the main channel 501, reducing the risk of dead zones and helping to maintain unobstructed flow. The connecting pipe 6 is vertically installed on the radiator 3 and directly connected to the middle of the main channel 501, avoiding the space occupation problem caused by needing to draw pipes from the ends of the main channel 501. This structure allows the dispensing assembly 2 to be flexibly arranged above or to the side of the radiator 3, contributing to a compact system layout.

[0041] See also Figures 1 to 6As shown, the dispensing assembly 2 includes a reservoir 201 and a dispensing tube 202. The reservoir 201 is mounted on the radiator 3 and is used to store a preset amount of fresh thermal paste. It may have a sealed piston or air bladder inside to prevent the thermal paste from oxidizing or evaporating due to direct contact with air. It contains 50ml of the same type of fresh thermal grease and has a heating jacket to maintain a temperature of 50°C. The dispensing tube 202 is a hollow tubular component with an inlet 221 and an outlet 222. The inlet 221 communicates with the reservoir 201 and is sealed to the internal space of the reservoir 201 to receive the thermal paste output from the reservoir 201. The outlet 222 communicates with the connecting tube 6 to deliver the thermal paste to the target location. In one embodiment, the dispensing tube 202 is a rigid tube, such as a metal tube or a rigid plastic tube, to ensure that it does not undergo radial expansion deformation under driving pressure, thereby ensuring precise control of the dispensing amount. In another embodiment, the dispensing tube 202 is a flexible tube to facilitate flexible arrangement in space-constrained situations.

[0042] Specifically, when the dispensing system receives a replenishment command, the heat-dissipating adhesive inside the reservoir 201 flows out from the outlet of the reservoir 201 and enters the inlet 221 of the dispensing tube 202. After entering the dispensing tube 202, under continuous pressure, the heat-dissipating adhesive flows axially along the dispensing tube 202 from the inlet 221 to the outlet 222. The heat-dissipating adhesive finally reaches the outlet 222 of the dispensing tube 202 and is discharged from the outlet 222. The outlet 222 is directly connected to the inlet of the injection channel 5 or the inlet of the connecting pipe 6, and the heat-dissipating adhesive thus enters the injection channel 5 and continues to be delivered along the injection channel 5 to the contact gap 4.

[0043] In this embodiment, the liquid storage tank 201 is set independently of the radiator 3, providing a closed and stable storage space for the thermal adhesive, avoiding the accelerated aging or volatilization caused by the thermal adhesive being exposed to the high temperature environment of the power module 1 for a long time. The injection tube 202 serves as a delivery pipe connecting the liquid storage tank 201 and the injection channel 5, realizing the spatial separation of storage and supply, which is beneficial to the modular layout and maintenance of the system.

[0044] See also Figures 1 to 6As shown, in this embodiment, a pumping structure, such as a piston, can be built into the storage tank 201. Alternatively, the dispensing assembly 2 can also include a pump body 203, driven by a micro stepper motor with an accuracy of 0.001 ml. The dispensing tube 202 is a high-pressure resistant Teflon hose, including a pump outlet tube 223 and a pump return tube 224. One end of the pump return tube 224 is the dispensing inlet 221, and the other end is connected to the inlet of the pump body 203. One end of the pump outlet tube 223 is connected to the outlet tube 6 of the pump body 203, and the other end is the dispensing outlet 222. The storage tank 201, pump return tube 224, pump body 203, and pump outlet tube 223 are connected in series to form a complete delivery path from the storage tank 201 to the injection channel 5. The pump body 203, acting as a power source, is located between the return tube and the outlet tube, driving the heat-dissipating adhesive to flow directionally along the pipeline.

[0045] Specifically, when the dispensing system receives a replenishment command, pump 203 starts working. Pump 203 generates negative pressure at its inlet, drawing the heat-dissipating adhesive from storage tank 201 through pump return pipe 224 from inlet 221. The adhesive flows along pump return pipe 224 to the inlet of pump 203, where it is drawn into the pump body 203. The heat-dissipating adhesive is then discharged from the outlet of pump 203 into the inlet of pump outlet pipe 223. During this stage, pump 203 completes the energy conversion from adhesive suction to discharge, providing the driving force to overcome pipeline resistance and injection channel 5 resistance. After entering pump outlet pipe 223 from the outlet of pump 203, the heat-dissipating adhesive flows axially along pump outlet pipe 223 under pressure, flowing from the inlet to the outlet, i.e., outlet 222. During this process, the pump outlet pipe 223 delivers the heat dissipation adhesive from the pump body 203 to the inlet of the injection channel 5. The heat dissipation adhesive is finally discharged from the outlet 222 and enters the connecting pipe 6 connected to it, continuing to be delivered along the injection channel 5 to the contact gap 4.

[0046] In this embodiment, the pump body 203 serves as an independent power source, providing stable positive or negative pressure for the delivery of thermal adhesive. This overcomes the friction resistance along the pipeline and the flow resistance of the injection channel 5. Compared to the passive delivery method that relies solely on gravity or pre-pressurization within the storage tank 201, the pump body 203 drive makes the adhesive replenishment action more controllable, the delivery distance longer, and the adaptability wider. The pump return pipe 224 is responsible for drawing adhesive from the storage tank 201, while the pump outlet pipe 223 is responsible for injecting adhesive into the injection channel 5. The two pipelines each play different functional roles, and this functional separation design reduces the complexity of the pipeline layout.

[0047] See also Figures 1 to 6As shown, the heat sink 3 is a liquid-cooled plate made of a high thermal conductivity material. The liquid-cooled plate has one or more liquid-cooled flow channels 301 inside. These flow channels 301 are multi-bend channels. The contact gap 4 is located above the liquid-cooled flow channel 301; that is, when viewed from a direction perpendicular to the upper surface of the liquid-cooled plate, the orthographic projection of the contact gap 4 onto the liquid-cooled plate covers at least a portion of the liquid-cooled flow channel 301, allowing the heat from the power module 1 to be transferred to the coolant in the liquid-cooled flow channel 301 via the shortest possible heat conduction path. In one embodiment, the liquid-cooled flow channel 301 is a single serpentine flow channel, connected in series to cover the entire cooling area below the power module 1. In another embodiment, the liquid-cooled flow channel 301 consists of multiple parallel multi-bend channels arranged in parallel to reduce flow resistance and improve cooling uniformity.

[0048] Specifically, the heat generated by power module 1 during operation is first conducted outward from its bottom. The heat is transferred to the top of the liquid-cooled plate via the heat-dissipating adhesive filled in the contact gap 4. Due to the high thermal conductivity of the heat-dissipating adhesive and the small thickness of the contact gap 4, the thermal resistance is low, allowing heat to be quickly and smoothly conducted from the bottom of power module 1 to the cold plate. After entering the top of the liquid-cooled plate, the heat continues to be conducted along the thickness direction inside the cold plate substrate, from the upper region to the lower liquid-cooled flow channel 301. Because the liquid-cooled plate is made of a high thermal conductivity material, heat is rapidly transferred to the area where the liquid-cooled flow channel 301 is located within the substrate via thermal conduction. When the heat reaches the wall of the liquid-cooled flow channel 301, forced convection heat transfer occurs between the coolant flowing inside the channel and the channel wall. The coolant flows in from the inlet, passes through the multi-bend flow channel, continuously absorbs heat from the channel wall along the way, and its own temperature gradually increases. Finally, it flows out from the outlet, and the heat is carried out of the liquid-cooled plate by the coolant and released into the environment.

[0049] In this embodiment, the contact gap 4 is located directly above the liquid cooling channel 301, allowing the heat generated by the power module 1 to travel from the bottom of the module, through the thermal adhesive and cold plate, to the wall of the liquid cooling channel 301 via the shortest vertical path. This shortened heat conduction path reduces thermal resistance and lowers the total temperature difference between the power module 1 and the coolant, thus helping to control the module temperature at a lower level. The multi-bend channel increases the total length of the channel within a limited cold plate area, thereby extending the residence time of the coolant within the cold plate and increasing the heat exchange area between the coolant and the channel wall. This allows the coolant to absorb heat from the power module 1 more fully, improving coolant utilization. The bends in the channel can guide the coolant to change direction, generating secondary flow or local turbulence at the bends, disrupting the laminar boundary layer near the wall, and thus enhancing the convective heat transfer coefficient near the wall. Compared to a straight channel, the multi-bend channel achieves higher heat transfer efficiency under the same flow rate conditions.

[0050] See also Figures 1 to 6 As shown, the liquid cooling plate has water temperature sensors installed at both its inlet and outlet, and power module 1 has a built-in temperature sensor. The two water temperature sensors are connected to the system's control unit, such as a controller or processor, to provide real-time feedback of the inlet and outlet temperature data. The built-in temperature sensor in power module 1 is also connected to the system's control unit to provide real-time feedback of the power module 1's temperature data.

[0051] In this embodiment, by simultaneously acquiring the temperature difference data between the inlet and outlet of the radiator 3 and the temperature data of the power module 1, the system can establish a logic for multi-parameter collaborative judgment. The temperature difference sensor and the module temperature sensor provide real-time feedback signals to the system, enabling the system to dynamically adjust the glue application strategy according to the current actual thermal state. For example, after the glue application action is executed, the system can judge the glue application effect by monitoring whether the temperature difference and module temperature have returned to the normal range. If they have not returned to the normal range, a second glue application can be performed or a maintenance alarm can be issued. This feedback mechanism constitutes a complete closed-loop control loop, improving the intelligence level of the system.

[0052] A drive module, specifically a frequency converter drive module 7, includes a power module 1 that generates a large amount of heat, and also includes a glue injection system, which is the glue injection system mentioned above.

[0053] A dispensing method is provided for use in a dispensing system, wherein the dispensing system is as described above, and the method is executed by a control unit, such as a PLC, microcontroller, or embedded processor. The dispensing method includes: Obtain the temperature difference between the inlet and outlet of radiator 3 and / or the temperature of power module 1; When the temperature difference exceeds the first preset threshold and / or the temperature exceeds the second preset threshold, the dispensing component 2 is controlled to add heat dissipation adhesive to the contact gap 4.

[0054] It is worth noting that in this embodiment, thermal adhesive can be replenished based on a single parameter change or by combining two parameters. It is preferable to replenish thermal adhesive by combining two parameters.

[0055] The specific method is as follows: S1: The system collects the coolant temperature T at the liquid inlet of the liquid-cooled plate in real time. 进 The temperature T of the coolant at the outlet of the liquid-cooled plate is obtained by the first water temperature sensor located at the inlet. 出 The temperature T of the power module 1 is obtained by the second water temperature sensor located at the outlet; the temperature T of the power module 1 is obtained by the temperature sensor built into the power module 1.

[0056] S2: When the system detects that the temperature T of power module 1 is close to its alarm temperature T 报警 When the second preset threshold is reached, in this embodiment the second preset threshold is T.报警 When the load reaches 80%, the system automatically switches power module 1 to constant load mode. Constant load and constant flow can specifically determine whether the thermal grease has failed and eliminate the influence of other factors, such as load changes affecting water temperature. At the same time, the system controls the coolant circulation system to operate at a constant flow. The purpose of this step is to eliminate the influence of load fluctuations and flow changes on temperature parameters, so that subsequent temperature difference determination is carried out under standardized operating conditions, thereby improving the accuracy of the determination.

[0057] S3: After running for a preset time t under constant load and constant flow conditions (in this embodiment, t is 5 minutes), the system continuously monitors the inlet and outlet temperature difference ΔT of the liquid-cooled plate. 出 -T 进 =ΔT, if ΔT continues to rise and exceeds the system's set allowable temperature difference threshold T 设 If the thermal adhesive in contact gap 4 has dried up or been lost, resulting in increased contact thermal resistance and ineffective heat transfer to the coolant, the system will issue a command to replenish the adhesive.

[0058] S4: After determining that the thermal adhesive has failed, the system performs the following preparation and execution actions for replenishing the adhesive. The system checks the level of thermal adhesive in the reservoir 201 to confirm that the level is sufficient. If the level is insufficient, a maintenance alarm for replenishing thermal adhesive is issued. If the viscosity of the thermal adhesive is too high in a low-temperature environment, the system activates the heating device to preheat the thermal adhesive, raising its temperature to the preset working temperature, such as 50°C, to reduce viscosity and improve flowability. The system starts the pump 203 and injects fresh thermal adhesive into the injection channel 5 at a preset injection speed of 0.01 ml / s. The thermal adhesive enters the main channel 501 through the connecting pipe 6, and then enters the contact gap 4 simultaneously from multiple outlets 51 through multiple branch channels 502. The injection process lasts for a preset time of 15 seconds, and the total injection volume is approximately 0.15 ml.

[0059] S5: After injection, the system stops pump 203. At this time, power module 1 is kept under low load or no load, while coolant is circulated at a low flow rate for 5 minutes to allow the injected fresh thermal paste to fully impregnate and spread within the contact gap 4, filling the micro-voids caused by drying or loss. During the impregnation period, the system continuously monitors the outlet temperature T of the liquid cooling plate. 出 When T is detected 出 When the temperature begins to drop, it indicates that the injected thermal paste has started to work, the contact thermal resistance is decreasing, and heat is being effectively transferred back to the coolant; when T... 出 The temperature drops to a stable value, and the inlet and outlet temperature difference ΔT returns to the normal range, below T. 设 Afterwards, the system determined that the glue application was successful and automatically restored power module 1 to full-load operation.

[0060] If the outlet temperature T is after the injection is completed and the preset wetting time has elapsed...出 There is still no downward trend, or ΔT still exceeds T. 设 If the temperature continues to rise, the system will determine that there may be a physical connection abnormality between the power module 1 and the heat sink 3, such as loose fixing bolts or excessive contact gap 4. In this case, adding thermal paste cannot solve the fundamental problem, and the system will immediately issue an alarm signal to prompt the operator to stop the machine for inspection and maintenance.

[0061] It will be readily understood by those skilled in the art that the aforementioned advantageous methods can be freely combined and superimposed without conflict.

[0062] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention. The above are merely preferred embodiments of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the protection scope of the present invention.

Claims

1. A dispensing system for dispensing adhesive into a power module (1), characterized in that, Including the glue injection assembly (2); The power module (1) is mounted on the heat sink (3), and a contact gap (4) is formed between the power module (1) and the heat sink (3), and the contact gap (4) is filled with heat-dissipating adhesive; The dispensing port (222) of the dispensing assembly (2) is connected to the contact gap (4), wherein the dispensing assembly (2) replenishes heat dissipation adhesive into the contact gap (4) according to the change of at least one of the following parameters: the temperature difference between the inlet and outlet of the radiator (3) and the temperature of the power module (1).

2. The dispensing system according to claim 1, characterized in that, It also includes an injection channel (5), the power module (1) is embedded in the heat sink (3), the injection channel (5) is opened in the heat sink (3), the inlet of the injection channel (5) is connected to the outlet (222) of the glue injection assembly (2), and the outlet (51) of the injection channel (5) is connected to the contact gap (4).

3. The dispensing system according to claim 2, characterized in that, The bottom of the power module (1) forms a contact gap (4) with the heat sink (3). The injection channel (5) is opened on one side of the power module (1). The injection channel (5) has multiple outlets (51). The multiple outlets (51) are spaced apart along the length direction of the contact gap (4) and are respectively connected to the contact gap (4).

4. The dispensing system according to claim 3, characterized in that, The injection channel (5) includes a main channel (501) and a plurality of branch channels (502). The main channel (501) extends along the length of the contact gap (4). The plurality of branch channels (502) are spaced apart between the contact gap (4) and the main channel (501). The main channel (501) is connected to the dispensing port (222) of the dispensing assembly (2). One end of the plurality of branch channels (502) is connected to the side wall of the main channel (501), and the other end of the plurality of branch channels (502) is connected to the contact gap (4) to form a plurality of outlets (51).

5. The dispensing system according to claim 4, characterized in that, It also includes a connecting pipe (6), which is installed on the radiator (3). One end of the connecting pipe (6) is connected to the glue outlet (222) of the glue injection assembly (2), and the other end of the connecting pipe (6) is connected to the main channel (501).

6. The dispensing system according to claim 1, characterized in that, The glue injection assembly (2) includes a liquid storage tank (201) and a glue injection tube (202). The glue injection tube (202) has a glue inlet (221) and a glue outlet (222). The glue inlet (221) is connected to the liquid storage tank (201).

7. The dispensing system according to claim 6, characterized in that, The glue injection assembly (2) also includes a pump body (203), and the glue injection pipe (202) includes a pump outlet pipe (223) and a pump return pipe (224). One end of the pump return pipe (224) is the glue inlet (221), and the other end of the pump return pipe (224) is connected to the inlet of the pump body (203). One end of the pump outlet pipe (223) is connected to the outlet pipe (6) of the pump body (203), and the other end of the pump outlet pipe (223) is the glue outlet (222).

8. The dispensing system according to claim 1, characterized in that, The radiator (3) is a liquid-cooled plate, and a liquid-cooled channel (301) is provided in the liquid-cooled plate. The liquid-cooled channel (301) is a multi-bend channel, and the contact gap (4) is located in the area above the liquid-cooled channel (301).

9. The dispensing system according to claim 8, characterized in that, The liquid cooling plate is equipped with a water temperature sensor at its inlet and outlet, and the power module (1) has a built-in temperature sensor.

10. A drive module, comprising a dispensing system, characterized in that, The dispensing system is the dispensing system according to any one of claims 1 to 9.

11. A glue injection method, used in a glue injection system, characterized in that, The dispensing system is the dispensing system according to any one of claims 1 to 9, and the dispensing method includes: Obtain the temperature difference between the inlet and outlet of the radiator (3) and / or the temperature of the power module (1); When the temperature difference exceeds the first preset threshold and / or the temperature exceeds the second preset threshold, the glue injection component (2) is controlled to add heat dissipation glue to the contact gap (4).

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