Single wafer cleaning apparatus and method of operation thereof

Abstract

The application relates to a single-wafer cleaning device and a working method thereof. The device comprises a rotating disc for carrying a wafer and capable of horizontal rotation around a vertical axis; a rotating support arranged below the rotating disc and capable of horizontal rotation; a clamping member movably connected to the rotating support and used for performing a clamping action on the wafer; a driving cam located below the rotating support and arranged to be vertically lifted and lowered, wherein an outer profile surface of the driving cam is in transmission cooperation with the rotating support so as to convert the vertical lifting and lowering movement of the driving cam into the horizontal rotation of the rotating support; and an output shaft in transmission cooperation with the rotating support and capable of horizontal rotation. In the clamping stage, the driving cam is vertically lifted, the rotating support is driven to rotate through the outer profile surface of the driving cam, and the clamping member is driven to perform the clamping action until the rotating support and the rotating disc are in circumferential abutment with each other. In the rotating stage, the output shaft is rotated, and the torque is transmitted to the rotating disc through the circumferential abutment between the rotating support and the rotating disc.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and in particular to a single-wafer cleaning device and its operating method. Background Technology

[0002] Semiconductor manufacturing processes typically include many steps such as photolithography, ion implantation, and etching. After these steps, the wafer surface needs to be cleaned to remove residual impurities. In single-wafer cleaning equipment, the wafer is usually fixed on a support stage by a clamping mechanism, and a drive device rotates the support stage and the wafer, working in conjunction with cleaning fluid nozzles to complete the cleaning operation.

[0003] However, existing single-wafer cleaning equipment has a complex overall transmission structure and a large number of parts when realizing wafer clamping and rotation functions, which makes the assembly and debugging process of the equipment cumbersome.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this application and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] In view of this, this application provides a single-wafer cleaning device and its working method to solve at least one problem existing in the background art.

[0006] To achieve the above objectives, the technical solution of this application is implemented as follows: In a first aspect, embodiments of this application provide a single-wafer cleaning apparatus, comprising: A rotating disk, used to hold wafers, can rotate horizontally about a vertical axis; A rotating bracket, located below the rotating disk, is capable of horizontal rotation; A clamping element, movably connected to the rotating support, is used to perform a clamping action on the wafer; A drive cam, located below the rotating bracket, is vertically movable, and its outer contour surface is in transmission cooperation with the rotating bracket to convert the vertical lifting motion of the drive cam into the horizontal rotation of the rotating bracket. The output shaft is connected to the rotating bracket in a transmission manner, and the output shaft can rotate horizontally; During the clamping phase, the drive cam rises vertically and drives the rotating bracket to rotate through its outer contour surface, thereby causing the clamping member to perform a clamping action until the rotating bracket and the rotating disk abut against each other in the circumferential direction to lock the clamping position of the clamping member and complete the clamping of the wafer. During the rotation phase, the output shaft rotates, and the torque is transmitted to the rotating disk through the circumferential contact between the rotating bracket and the rotating disk, causing the rotating disk to rotate together with the wafer.

[0007] In one optional embodiment, the outer contour surface of the drive cam includes a guide section and a retaining section connected in sequence. The radial dimension of the guide section gradually increases downward along the vertical direction, and the radial dimension of the retaining section is the same vertically. During the clamping stage, the guide section drives the rotating bracket to rotate to perform the clamping action. When the rotating bracket abuts against the rotating disk, the retaining section of the drive cam remains in contact with the rotating bracket to maintain the circumferential position of the rotating bracket.

[0008] In one optional embodiment, the rotating bracket has a first abutting part on the side facing the rotating disk in the rotation direction, and the rotating disk has a second abutting part corresponding to the first abutting part. The first abutting part and the second abutting part abut against each other in the circumferential direction by fitting together.

[0009] In one optional embodiment, the clamping member is connected to the rotating support via a gear pair; the outer ring of the rotating support is provided with a first gear, and the clamping member includes a second gear that cooperates with the first gear; the clamping member also includes an eccentric column disposed on the end face of the second gear, and when the second gear rotates, the distance between the eccentric column and the center of the rotating disk changes accordingly according to the rotation angle, so as to achieve clamping or releasing of the wafer.

[0010] In one alternative embodiment, the contact surface between the clamping member and the wafer is a partial point contact or line contact structure to reduce the contact area.

[0011] In an optional embodiment, the drive cam is further provided with a return spring with a preload; in the non-clamped state, the preload of the return spring holds the drive cam in the initial position and eliminates transmission backlash; after the power component driving the drive cam stops driving, the drive cam descends to the initial position under the action of the return spring.

[0012] In one optional embodiment, a roller that can rotate about its own axis is provided at the position where the rotating bracket contacts the outer contour surface of the drive cam, and the axis of the roller extends radially along the rotating bracket; during the clamping phase, when the drive cam moves vertically up and down, the roller rolls along the outer contour surface.

[0013] In one optional embodiment, the surface of the holding section of the drive cam is provided with a friction-reducing and wear-resistant coating. The friction coefficient of the friction-reducing and wear-resistant coating is lower than that of the contact surface of the rotating bracket, and the hardness of the friction-reducing and wear-resistant coating is not greater than that of the contact surface of the rotating bracket. During the clamping and rotation phases, the friction-reducing and wear-resistant coating is configured to reduce the wear rate of the friction pair between the drive cam and the rotating support, thereby increasing the stability of the circumferential position of the rotating support.

[0014] In one optional embodiment, the generatrix profile of the guide section of the drive cam includes a quick-entry section and a precision force control section connected sequentially in the vertical direction; The lift slope of the rapid inlet section is greater than that of the precision force control section; During the clamping phase, as the rotating support moves along the rapid infeed section, it is driven to rotate at a first angular velocity, bringing the clamping member closer to the wafer edge. When the rotating bracket moves from the rapid inlet section into the precision force control section, the rotating bracket rotates at a second angular velocity, which is less than the first angular velocity; The rotating bracket and the rotating disk are configured to engage with each other in the circumferential direction within the stroke range of the rotating bracket when it enters the precision force control section, so that the circumferential engagement undertakes the main positioning function.

[0015] In an alternative embodiment, a radial elastic buffer pad is provided between the clamping member and the rotating disk, the radial elastic buffer pad being configured to provide radial elastic deformation when the clamping member performs a clamping action; During the clamping stage, when the rotating support abuts against the rotating disk in the circumferential direction, the compression amount of the radial elastic buffer pad is set to keep the radial clamping force of the clamping member on the wafer within a preset safety range. The circumferential abutment configuration limits the maximum radial displacement of the clamping member, while the radial elastic buffer pad converts the diameter deviation of the wafer into a gradual change in clamping force within the maximum radial displacement, reducing the risk of damage to wafers with larger diameters due to over-clamping and reducing the possibility of loosening of wafers with smaller diameters.

[0016] In one optional embodiment, a rotatable eccentric sleeve is fitted on the eccentric pillar, and the outer surface of the eccentric sleeve makes rolling contact with the edge of the wafer during the clamping process; the eccentric sleeve converts the sliding friction between the eccentric pillar and the edge of the wafer into rolling friction, so as to reduce the motion resistance in the clamping action and improve the smoothness of the clamping force transmission.

[0017] In one optional embodiment, a pressure sensor is embedded in the first abutment portion and / or the second abutment portion, and the sensing area of ​​the pressure sensor covers the actual contact area between the first abutment portion and the second abutment portion; during the clamping stage, the measurement data of the pressure sensor is collected to determine whether the circumferential abutment reaches a preset abutment pressure threshold, and the rotation stage is triggered when the preset abutment pressure threshold is reached.

[0018] In an optional embodiment, the cone angle α of the guide segment satisfies 15°≤α≤25°; The cone angle α is configured such that, in the initial clamping stage, the axial component force on the drive cam is less than the preload force of the return spring, so as to prevent the drive cam from undergoing axial displacement before overcoming the preload force; and in the final clamping stage, the frictional self-locking torque between the guide section and the rotating bracket is greater than the maximum reverse torque during the rotation stage.

[0019] In one optional embodiment, a one-way clutch is provided at the transmission connection between the output shaft and the rotating bracket, and the locking direction of the one-way clutch is consistent with the driving direction of the rotation phase; in the clamping phase, the one-way clutch is in a disengaged state, allowing the rotating bracket to be driven independently by the drive cam without being hindered by the output shaft; in the rotation phase, the one-way clutch is locked, realizing the torque transmission from the output shaft to the rotating bracket.

[0020] The single-wafer cleaning equipment and its working method provided in this application embodiment include: a rotating disk for carrying wafers and capable of horizontal rotation around a vertical axis; a rotating support disposed below the rotating disk and capable of horizontal rotation; a clamping member movably connected to the rotating support for performing a clamping action on the wafer; a drive cam located below the rotating support and vertically movable, its outer contour surface engaging with the rotating support to convert the vertical lifting motion of the drive cam into the horizontal rotation of the rotating support; and an output shaft connected to the rotating support, capable of horizontal rotation. During the clamping phase, the drive cam rises vertically, driving the rotating support to rotate via its outer contour surface, thereby causing the clamping member to perform a clamping action until the rotating support and the rotating disk abut against each other circumferentially, locking the clamping position of the clamping member and completing the clamping of the wafer. During the rotation phase, the output shaft rotates, transmitting torque to the rotating disk through the circumferential contact between the rotating support and the rotating disk, causing the rotating disk and the wafer to rotate together. As can be seen, the single-wafer cleaning equipment and its working method of this application embodiment, by setting a drive cam that can be raised and lowered vertically below the rotating bracket, and utilizing the transmission cooperation between the outer contour surface of the drive cam and the rotating bracket, converts the vertical raising and lowering motion of the drive cam into the horizontal rotation of the rotating bracket to perform the clamping action, and after clamping, achieves mechanical limiting through the circumferential abutment between the rotating bracket and the rotating disk. At the same time, the circumferential abutment transmits the rotational power of the output shaft to the rotating disk during the rotation phase. Thus, clamping can be completed with the single raising and lowering motion of the drive cam, and the reliable transmission of rotational torque can be achieved by the functional reuse of the circumferential abutment. This effectively simplifies the transmission structure of the equipment, reduces the number of drive components, and reduces assembly complexity.

[0021] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the external appearance of the single-wafer cleaning equipment provided in the embodiments of this application; Figure 2 A schematic diagram of a single-wafer cleaning apparatus for removing a rotating disk provided in an embodiment of this application; Figure 3 This is a longitudinal cross-sectional view of the single-wafer cleaning equipment provided in an embodiment of this application; Figure 4 The single-wafer cleaning equipment provided in the embodiments of this application is along Figure 3 A cross-sectional view along the direction of AA; Figure 5 for Figure 4 A magnified view of a portion of point B in the middle; Figure 6 This is a schematic diagram of the driving cam in the single-wafer cleaning equipment provided in the embodiments of this application; Figure 7 for Figure 2 A magnified view of a portion of point C in the middle; Figure 8 for Figure 3 A magnified view of a portion of point D in the middle; Figure 9 This is an assembly diagram of the rotating disk, rotating support, and clamping components in the single-wafer cleaning equipment provided in the embodiments of this application; Figure 10 for Figure 9 A magnified view of a portion of point E in the middle; Figure 11 This is a schematic flowchart illustrating the working method of the single-wafer cleaning equipment provided in the embodiments of this application.

[0023] Explanation of reference numerals in the attached figures: 10. Rotating disk; 11. Transmission protrusion; 111. First abutment surface; 12. Radial elastic buffer pad; 20. Rotating bracket; 21. Outer ring body; 22. Central hub body; 23. Spoke; 231. Second abutment surface; 24. First gear; 25. Roller; 30. Clamping component; 31. Second gear; 32. Eccentric column; 40. Drive cam; 41. Guide section; 411. Quick entry section; 412. Precision force control section; 42. Holding section; 43. Return spring; 50. Output shaft; 90. Frame. Detailed Implementation

[0024] To make the technical solutions and beneficial effects of this application more obvious and understandable, the technical solutions in the embodiments of this application are clearly and completely described below by listing specific embodiments. Obviously, the embodiments of this application are not exhaustive, and the described embodiments are only some embodiments of this application, not all embodiments.

[0025] The exemplary embodiments disclosed in this application will now be described in more detail with reference to the accompanying drawings, providing a detailed structure and steps to illustrate the technical solution of this application. Note that the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used herein is for the purpose of describing particular embodiments only and should not be construed as limiting the technical solutions of this application.

[0027] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. To clearly define the inventive concept of this application and avoid confusion with its content, technical features well-known in the art and conventionally understood by those skilled in the art are not elaborated upon. Specifically, this document does not fully list all features of actual embodiments, nor does it provide a detailed description of well-known functions and structures.

[0028] The inventors of this application discovered during research and development that, in order to solve the problem of structural redundancy in traditional dual-drive systems, existing technologies have attempted to merge the wafer clamping drive and rotation drive into the same power system. For example, a single motor is used in conjunction with a complex clutch switching mechanism or a compound cam linkage mechanism to alternately perform clamping and rotation actions. However, this single power source solution has exposed new technical problems in practical applications: since the requirements for speed, torque, and motion form are completely different between clamping and rotation, forcibly sharing a single power chain inevitably introduces a large number of intermediate conversion parts such as multi-stage gearboxes, electromagnetic clutches, or hydraulic directional valves, resulting in a longer transmission chain, increased cumulative assembly errors, and failure of any conversion link leading to complete machine malfunction and a significant decrease in reliability. In view of this, the inventors re-examined the rationality of the dual-power architecture and realized that the root of the problem is not the number of power sources, but that: although existing conventional dual-drive systems have independent power, the clamping transmission chain and the rotation transmission chain interweave spatially, failing to utilize the natural intersection of their mechanical structures to simplify the overall design, and still facing the dilemma of complex structure, numerous parts, and cumbersome assembly.

[0029] Therefore, through further research and development, the inventors proposed the following technical solution.

[0030] This application provides a single-wafer cleaning device. (See reference...) Figures 1-4 The single-wafer cleaning equipment includes: The rotating disk 10 is used to support the wafer and can rotate horizontally around the vertical axis. The rotating bracket 20 is located below the rotating disk 10 and can rotate horizontally. The clamping member 30 is movably connected to the rotating support 20 and is used to perform clamping action on the wafer; The drive cam 40 is located below the rotating bracket 20 and is vertically movable. Its outer contour surface is in transmission cooperation with the rotating bracket 20 to convert the vertical lifting motion of the drive cam 40 into the horizontal rotation of the rotating bracket 20. The output shaft 50 is connected to the rotating bracket 20 in a transmission manner, and the output shaft 50 can rotate horizontally; During the clamping phase, the drive cam 40 rises vertically and drives the rotating bracket 20 to rotate through its outer contour surface, thereby causing the clamping member 30 to perform a clamping action until the rotating bracket 20 and the rotating disk 10 abut against each other in the circumferential direction to lock the clamping position of the clamping member 30, thus completing the clamping of the wafer. During the rotation phase, the output shaft 50 rotates, and the torque is transmitted to the rotating disk 10 through the circumferential contact between the rotating bracket 20 and the rotating disk 10, so that the rotating disk 10 rotates together with the wafer.

[0031] Understandably, the rotating disk 10 can be a support component that directly supports the wafer and rotates synchronously with it, thus providing a stable rotational reference plane for the wafer. The rotating bracket 20 can be an intermediate transmission component located below the rotating disk 10, converting the linear motion of the drive cam 40 into its own circumferential rotation, thus enabling the conversion of power form. The clamping member 30 can be an actuating end that directly contacts the edge of the wafer and applies radial constraint force, thus preventing radial displacement of the wafer during rotation; the clamping member 30 does not continuously clamp the wafer, but rather defines a range of motion for the wafer. The drive cam 40 can be a power input element with a specific outer contour surface that maps vertical lifting displacement to angular displacement of the rotating bracket 20, thus enabling control of circumferential clamping action with a single-dimensional linear input. The output shaft 50 can be a torque input interface that receives external rotational power and transmits it to the rotating bracket 20, thus providing a power source for the wafer cleaning rotation independent of the clamping action. The circumferential contact between the rotating bracket 20 and the rotating disk 10 can be a physical fit between them at a specific relative position. This provides a defined axial or circumferential stop during the clamping phase to limit the clamping stroke endpoint, while simultaneously transmitting drive torque as a friction pair or meshing pair during the rotation phase. The coordinated operation of these components allows the lifting motion of the drive cam 40 to independently complete the clamping action, with the mechanical limit of the circumferential contact determining the clamping endpoint. The rotational motion of the output shaft 50 is transmitted to the rotating disk 10 through the coupling relationship between the rotating bracket 20 and the rotating disk 10, which are already in contact. This achieves decoupling of the clamping and rotation functions in the transmission path and reuse at the structural interface, simplifying the overall transmission architecture of the equipment.

[0032] Specifically, the single-wafer cleaning equipment also includes a frame 90 for supporting the aforementioned components. The frame 90 is a conventional configuration and will not be described in detail. The rotating disk 10 may include a disc-shaped body and a wafer-bearing area disposed on the upper surface of the body. The surface of the bearing area may be provided with multiple support bumps to reduce the contact area with the back of the wafer. Either the rotating support 20 or the rotating disk 10 may be provided with a first transmission structure extending upward or downward, and the other of the rotating support 20 and the rotating disk 10 may be provided with a second transmission structure that cooperates with the first transmission structure to transmit torque. The number of clamping members 30 may be four or more, evenly distributed along the circumference of the rotating disk 10. Each clamping member 30 is radially movably connected to the rotating support 20, allowing it to move radially to approach or move away from the wafer edge. The outer contour surface of the drive cam 40 may be a cylindrical surface or a conical surface with a helical lift. When the drive cam 40 is driven upward by the first power component, it forces the rotating support 20 to rotate around the vertical axis through a predetermined angle. The first power component may be a cylinder or a linear motor. The output shaft 50 can be connected to the second power component via a coupling or gear set. The second power component can be a servo motor or a stepper motor. The specific form of the circumferential contact can be a planar friction pair, an end face gear meshing pair, or a pin hole positioning pair, as long as it can provide a rigid stop at the clamping end point and transmit torque during the rotation phase.

[0033] More specifically, to reduce damage to the wafer, the diameter of the clamping member 30 can be slightly larger than the diameter of the wafer. This way, the wafer will only contact the clamping member 30 and be contained by it when its position shifts due to centrifugal force during rotation. Alternatively, other configurations are possible, such as setting the clamping member 30 as a floating or elastic element, which will not be detailed here.

[0034] For example, when the equipment starts the cleaning process, the control system first issues a clamping command, and the drive cam 40 rises at a constant speed in the vertical direction under the push of the linear actuator. The helical inclined surface on the outer contour surface of the drive cam 40 abuts against the rotating bracket 20. As the drive cam 40 continues to rise, the vertical thrust is converted into the rotational torque of the rotating bracket 20 around the vertical axis. After the rotating bracket 20 rotates, it drives the clamping member 30 to synchronously retract towards the center of the rotating disk 10 through a linkage mechanism or gear pair, gradually approaching and finally fitting against the edge of the wafer. When the rotating bracket 20 rotates to the preset clamping termination angle, the first abutting part on the upper surface of the rotating bracket 20 and the second abutting part on the lower surface of the rotating disk 10 are completely abutted and pressed together. At this time, the drive cam 40 stops rising, and the clamping member 30 applies a predetermined radial clamping force to the wafer. The magnitude of this clamping force is mainly determined by the mechanical limiting position of the circumferential abutment and is no longer affected by the continued rise of the drive cam 40. Subsequently, after the control system confirms that the circumferential contact has reached the predetermined pressure threshold, it starts the rotary motor, and the output shaft 50 begins to rotate. The torque is transmitted to the rotating bracket 20 via the output shaft 50, and then to the rotating disk 10 through the tightly fitted circumferential contact interface. The rotating disk 10 drives the wafer to rotate at a set speed, and the cleaning nozzle simultaneously sprays cleaning fluid to complete the cleaning operation. After cleaning, the rotary motor stops, the drive cam 40 descends and resets, and the clamping member 30 releases the wafer, preparing for the loading of the next wafer.

[0035] Furthermore, the circumferential contact between the rotating disk 10 and the rotating support 20 can adopt an end-face tooth structure, that is, mutually meshing radial teeth are machined on the upper end face of the rotating support 20 and the lower end face of the rotating disk 10 respectively. At the end of the clamping stage, the two sets of teeth are fully meshed, which not only provides precise circumferential angle limit to ensure the consistency of the clamping endpoint each time, but also transmits torque through the lateral compression of the tooth surface during the rotation stage, which has higher torque transmission reliability and anti-slip capability compared with pure friction pairs. In addition, the lifting guide of the drive cam 40 can adopt a high-precision linear guide to eliminate the radial wobble of the drive cam 40 during the lifting process, so that the contact trajectory between the outer contour surface and the follower of the rotating support 20 is stable, thereby improving the consistency of clamping force.

[0036] The single-wafer cleaning equipment of this application embodiment, by setting a drive cam 40 that can be raised and lowered vertically below the rotating bracket 20, utilizes the transmission cooperation between the outer contour surface of the drive cam 40 and the rotating bracket 20 to convert the vertical raising and lowering motion of the drive cam 40 into the horizontal rotation of the rotating bracket 20 to perform the clamping action. After clamping, mechanical limiting is achieved through the circumferential abutment between the rotating bracket 20 and the rotating disk 10. At the same time, this circumferential abutment serves as a coupling surface for torque transmission during the rotation phase, transmitting the rotational power of the output shaft 50 to the rotating disk 10. Thus, clamping can be completed with a single raising and lowering motion of the drive cam 40, and reliable transmission of rotational torque can be achieved by the functional reuse of the circumferential abutment. This effectively simplifies the transmission structure of the equipment, reduces the number of drive components, and lowers the assembly complexity.

[0037] In other embodiments of this application, the outer contour surface of the drive cam 40 includes a guide section 41 and a retaining section 42 connected in sequence. The radial dimension of the guide section 41 gradually increases downward along the vertical direction, while the radial dimension of the retaining section 42 is the same vertically. During the clamping phase, the guide section 41 drives the rotating bracket 20 to rotate to perform the clamping action. When the rotating bracket 20 abuts against the rotating disk 10, the retaining section 42 of the drive cam 40 remains in contact with the rotating bracket 20 to maintain the circumferential position of the rotating bracket 20.

[0038] Understandably, the guide section 41 can be a section on the outer contour surface of the drive cam 40 where the radial dimension changes with height, generating a circumferential drive component. This converts the vertical lifting motion into an angular displacement of the rotating support 20 to achieve the clamping action. The holding section 42 can be a section on the outer contour surface of the drive cam 40 where the radial dimension remains constant and does not generate a circumferential drive component. This provides continuous circumferential support to the rotating support 20 after clamping without introducing additional angular changes. The combined use of the guide section 41 and the holding section 42 divides the execution of the clamping action and the maintenance of the clamping state into two functionally distinct sections on the cam profile, improving the controllability of the clamping process and the stability of the clamping state.

[0039] Specifically, the generatrix profile of the guide section 41 can be a straight line, a curve, or a segmented broken line, and the rate of change of its radial dimension determines the transmission ratio between the angular velocity of the rotating bracket 20 and the lifting speed of the drive cam 40. The generatrix profile of the retaining section 42 can be a straight line parallel to the axis of the drive cam 40, and its axial length should be greater than or equal to the maximum axial movement that the drive cam 40 may experience in the clamping and holding state, to prevent the rotating bracket 20 from disengaging from the retaining section 42 and causing clamping failure. A smooth transition curve can be provided at the connection between the guide section 41 and the retaining section 42 to avoid impact or jamming of the follower when passing through the connection point.

[0040] For example, the drive cam 40 is a rotating component, with the upper half of its outer contour surface being a conical surface serving as a guide section 41, and the lower half being a cylindrical surface of equal diameter serving as a holding section 42. During the clamping stage, the rotating support 20 presses against the conical surface. As the drive cam 40 rises vertically, the radial dimension of the conical surface gradually increases, forcing the rotating support to shift circumferentially, i.e., the rotating support 20 rotates and drives the clamping member 30 to clamp the wafer. When the rotating support 20 and the rotating disk 10 abut against each other circumferentially, the rotating support just contacts the lower cylindrical surface of equal diameter, i.e., the holding section 42. Thereafter, even if the drive cam 40 experiences slight axial movement due to vibration or thermal deformation, the circumferential position of the rotating support 20 remains undisturbed because the radial dimension of the holding section 42 is constant, and the clamping force remains constant.

[0041] Furthermore, the axial length of the retaining section 42 can be designed to cover the range of axial position drift of the drive cam 40 due to wear throughout its entire service life, so that even if the inlet end of the guide section 41 experiences slight wear due to long-term stress, the contact between the rotating bracket and the drive cam 40 remains within the effective range of the retaining section 42, thus extending the maintenance-free cycle of the equipment.

[0042] In some other embodiments of this application, the rotating bracket 20 is provided with a first abutting part on the side facing the rotating disk 10 in the rotation direction, and the rotating disk 10 is provided with a second abutting part corresponding to the first abutting part. The first abutting part and the second abutting part abut against each other in the circumferential direction by fitting together.

[0043] Understandably, the first abutment can be a protrusion, groove, or planar structure specifically designed on the rotating bracket 20 to form physical contact with the rotating disk 10, thus concentrating the circumferential position and axial load of the rotating bracket 20 to the rotating disk 10. The second abutment can be a corresponding structure on the rotating disk 10 whose geometry matches that of the first abutment, thus forming a definite fit with the first abutment. The pairing design of the first and second abutments allows the position, area, and contact stiffness of the circumferential abutment to be independently designed and optimized, without being limited by other functional areas of the rotating bracket 20 or the rotating disk 10.

[0044] Specifically, both the first and second abutment parts can be made of ordinary alloy steel, but the contact surfaces undergo carburizing or other surface treatments to increase hardness, resulting in high overall strength and high contact surface hardness, thereby improving the compressive strength and wear resistance of the contact surfaces. The mating surfaces can be precision ground or polished to reduce surface roughness and minimize the impact of friction coefficient fluctuations on torque transmission smoothness. The geometry of the first and second abutment parts can be a plane, a conical surface, or an end face with radial teeth, selected according to the required degrees of freedom and torque transmission method.

[0045] More specifically, see reference Figure 4 and Figure 5 The rotating support 20 may include an outer ring 21, a central hub 22, and at least one spoke 23 connecting the outer ring 21 and the central hub 22. The outer ring 21, the central hub 22, and the spoke 23 together enclose a hollow area. A first abutment is provided on the side of the spoke 23 in the circumferential direction, and a second abutment is a transmission protrusion 11 extending downward from the lower surface of the rotating disk 10 and disposed opposite to the side of the spoke 23. The transmission protrusion 11 and the spoke 23 fit together in the circumferential direction to achieve mutual abutment in the circumferential direction. That is, the end of the transmission protrusion 11 that contacts the spoke 23 has a first abutment surface 111, and the spoke 23 has a second abutment surface 231 that cooperates with the first abutment surface 111. In this way, the spoke 23 structure of the rotating bracket 20 obtains the overall torsional stiffness and torque transmission capability of the rotating bracket 20, while reducing the weight and moment of inertia of the rotating bracket 20, which is conducive to improving the response speed of the clamping action and reducing the load on the drive cam 40. At the same time, the hollow area provides clearance space for the arrangement of cleaning fluid flow path, sensor cable or other functional components, improving the utilization rate of the internal space of the equipment.

[0046] Furthermore, an elastic washer or wave spring can be provided between the transmission protrusion 11 and the spoke 23. Before the two are rigidly attached, the elastic element absorbs the slight assembly error and surface unevenness, so that the multiple contact points can distribute the load more evenly, thereby improving the overall contact stiffness and torque transmission efficiency of the circumferential contact.

[0047] In other embodiments of this application, reference is made to Figure 2 and Figure 7 The clamping member 30 is connected to the rotating support 20 via a gear pair. The outer ring of the rotating support 20 is provided with a first gear 24, and the clamping member 30 includes a second gear 31 that meshes with the first gear 24. The clamping member 30 also includes an eccentric post 32 disposed on the end face of the second gear 31. When the second gear 31 rotates, the distance between the eccentric post 32 and the center of the rotating disk 10 changes accordingly based on the rotation angle, thereby achieving clamping or releasing of the wafer.

[0048] Understandably, the gear pair can be a meshing transmission mechanism that transmits circumferential motion between the rotating support 20 and the clamping member 30, thus precisely distributing the overall rotation of the rotating support 20 to the independent rotation of each clamping member 30. The first gear 24 can be a driving gear fixed to the outer ring of the rotating support 20 and rotating synchronously with the rotating support 20, thus using the angular displacement of the rotating support 20 as a unified input for the clamping action. The second gear 31 can be a driven gear meshing with the first gear 24 and mounted on the clamping member 30, thus converting the rotation of the rotating support 20 into the rotation of the clamping member 30 itself. The eccentric column 32 can be a cylindrical protrusion offset from the rotation center of the second gear 31 by a certain distance, so that when the second gear 31 rotates, the rotation trajectory of the eccentric column 32 forms a circle, and the distance from each point on this circle to the center of the rotating disk 10 changes periodically, thereby realizing the approach and departure of the clamping member 30 from the edge of the wafer.

[0049] Specifically, the first gear 24 can be an external gear ring, selected according to the spatial layout of the rotating support 20 and the clamping member 30. The number of teeth of the second gear 31 can be in a specific ratio to the number of teeth of the first gear 24 to adjust the transmission ratio between the rotation angle range of the clamping member 30 and the rotation angle of the rotating support 20. The eccentricity of the eccentric column 32 can be determined according to the diameter tolerance range of the wafer and the required clamping stroke. The surface of the eccentric column 32 can be fitted with bearings or rolling sleeves to convert the sliding friction with the wafer edge into rolling friction, reducing clamping resistance and reducing the risk of wafer edge scratches.

[0050] Furthermore, a torsion spring or disc spring assembly can be provided between the second gear 31 and the clamping member 30 body. Even when there is a gear meshing gap, a preload torque can still be applied to the clamping member 30 to eliminate the influence of the backlash on the consistency of the clamping force, so that the radial force applied to the wafer by the three clamping members 30 at any time is basically equal.

[0051] In some other embodiments of this application, the contact surface between the clamping member 30 and the wafer is a partial point contact or line contact structure to reduce the contact area.

[0052] Understandably, the local point contact or line contact structure can be a specially designed arc surface or spherical surface on the contact surface of the clamping element 30. This limits the actual contact area between the clamping element 30 and the wafer edge to a very small geometric range. Reducing the contact area can decrease the shading effect of the clamping surface on the wafer surface, allowing the cleaning fluid to fully cover the wafer edge area and reducing cleaning dead zones. At the same time, by reasonably configuring the radius of curvature of the contact surface, the peak stress in the contact area can be controlled below the yield strength threshold of the wafer material, preventing mechanical damage such as edge chipping or microcracks at the wafer edge.

[0053] Specifically, for line contact structures, the contact surface of the clamping member 30 can be a portion of a cylindrical surface, with its generatrix parallel to the thickness direction of the wafer, and the radius of curvature can be selected within the range of 0.5 mm to 3.0 mm. For point contact structures, the contact surface of the clamping member 30 can be a portion of a sphere, and the radius of curvature can be selected within the range of 1.0 mm to 5.0 mm. The surface roughness of the contact surface can be controlled to be below Ra 0.4 micrometers to reduce micro-stress concentration. The contact surface material can be selected from engineering ceramics or polymer composite materials with a hardness lower than that of single-crystal silicon but good wear resistance, so as to protect the wafer while ensuring the service life of the clamping member 30.

[0054] Furthermore, the contact surface of the clamping member 30 can be set as a combination of two arc surfaces with different radii of curvature along the wafer thickness direction. The upper section has a larger radius of curvature to adapt to the chamfer shape of the upper edge of the wafer, while the lower section has a smaller radius of curvature to provide the main clamping support force. The two arc surfaces transition smoothly, which not only ensures clamping stability but also avoids stress concentration at the wafer chamfer.

[0055] In some other embodiments of this application, the drive cam 40 is driven by a first power component, and the output shaft 50 is driven by a second power component. The first power component initiates the clamping phase, and the second power component initiates the rotation phase. The second power component is initiated only if the rotating bracket 20 and the rotating disk 10 are detected to be in circumferential contact.

[0056] Understandably, the first power unit can be an actuator specifically designed to provide vertical lifting power to the drive cam 40, thus physically separating the power source for the clamping action from the power source for the rotational action. The second power unit can be a motor specifically designed to provide rotational power to the output shaft 50, allowing the rotational speed and torque during the rotational phase to be adjusted independently of the clamping phase. Tying the activation condition of the second power unit to the circumferential contact state detection ensures that rotation is only initiated after the clamping action is completed and the clamping force reaches a predetermined value, preventing the wafer from flying out or vibrating eccentrically due to high-speed rotation in an insufficiently clamped state.

[0057] Specifically, the first power component can be a linear motor, cylinder, hydraulic cylinder, electric cylinder, or a linear drive module consisting of a rotary motor and a lead screw and nut. The second power component can be a servo motor, stepper motor, or brushless DC motor. The detection of the contact state can be achieved through pressure sensors, displacement sensors, or current feedback. The control system can delay the activation of the second power component by a preset time after receiving the contact confirmation signal to allow for a margin of safety in stabilizing the mechanical structure.

[0058] For example, the first power component is a servo electric cylinder with an encoder, and the second power component is an AC servo motor. The equipment controller first starts the servo electric cylinder, driving the cam 40 to rise to the clamping end point. A thin-film pressure sensor installed on the first abutment part and / or the second abutment part monitors the abutment pressure in real time. When the pressure value exceeds a preset threshold of 200 Newtons for 50 milliseconds continuously, the controller determines that the circumferential abutment has been reliably formed, and then sends an enable signal and speed command to the AC servo motor. The motor accelerates to the target cleaning speed according to the set acceleration curve. If the pressure sensor does not reach the threshold before the servo electric cylinder reaches the upper limit, the controller immediately stops the electric cylinder and issues an alarm to prevent the equipment from continuing to operate in an abnormal state.

[0059] Furthermore, the control system can continuously monitor the real-time value of the contact pressure during the rotation phase. If the pressure value drops below a preset ratio during the rotation, an emergency stop is immediately triggered and the output shaft 50 is braked to prevent torque interruption and wafer ejection accidents caused by unexpected separation of the circumferential contact.

[0060] In other embodiments of this application, reference is made to Figure 3 and Figure 8 The drive cam 40 is also equipped with a return spring 43 with preload. In the non-clamped state, the preload of the return spring 43 holds the drive cam 40 in its initial position and eliminates transmission backlash. After the power component driving the drive cam 40 stops driving, the drive cam 40 descends to its initial position under the action of the return spring 43.

[0061] Understandably, the return spring 43 can be an elastic element that stores elastic potential energy and releases it to drive the drive cam 40 to reset after the first power component removes the driving force. This eliminates the cost of separately configuring a pull-down driver. The preload can be the initial compression force already present in the return spring 43 in the installed state. This allows a unidirectional biasing force to be continuously applied to the drive cam 40 in the non-clamped state, eliminating the gaps between the drive cam 40 and the mating surfaces in the transmission chain, and improving the repeatability of the clamping starting point. The descent and reset process driven by the return spring 43 is passive and self-contained, independent of external energy, improving the safety of the equipment in the event of a power outage or malfunction.

[0062] Specifically, the return spring 43 can be a compression spring, a disc spring assembly, or a gas spring, installed above or below the drive cam 40, selected according to the spatial layout and force direction. The preload should be greater than the sum of the weight of the drive cam 40 and the friction of the transmission chain to ensure reliable return in any posture. The free length and stiffness coefficient of the return spring 43 should be designed to match the stroke of the drive cam 40 and the required return time.

[0063] Furthermore, the preload of the return spring 43 can be finely adjusted by adjusting the nut or shim to accommodate the increased transmission clearance caused by wear after long-term use of the equipment. The initial clearance elimination effect can be restored without replacing the spring, thus extending the maintenance interval.

[0064] In some other embodiments of this application, a roller 25 rotatable about its own axis is provided at the position where the rotating bracket 20 contacts the outer contour surface of the drive cam 40. The axis of the roller 25 extends radially along the rotating bracket 20. During the clamping phase, when the drive cam 40 moves vertically up and down, the roller 25 rolls along the outer contour surface.

[0065] Understandably, the roller 25 can be a rotating body mounted on the rotating bracket 20 and forming a rolling friction pair with the outer contour surface of the drive cam 40. This converts the sliding friction between the drive cam 40 and the rotating bracket 20 into rolling friction, significantly reducing transmission resistance and contact surface wear. The arrangement of the roller 25's axis extending radially along the rotating bracket 20 ensures that the rolling direction of the roller 25 is consistent with the tangential direction of the outer contour surface of the drive cam 40, which is beneficial to the effectiveness of rolling contact and reduces the occurrence of side slippage or uneven wear of the roller 25.

[0066] Specifically, roller 25 can be a rolling bearing, such as a deep groove ball bearing, cylindrical roller bearing, or pinwheel bearing, selected according to load capacity and space constraints. The outer ring material of roller 25 can be bearing steel or carburized steel, with a surface hardness of not less than HRC60. Roller 25 is mounted on rotating bracket 20 via pins or spindles, and retaining rings or end caps can be provided at both ends of the pins to prevent axial movement of roller 25. The contact width between roller 25 and the outer contour surface should match the effective working surface width of the outer contour surface.

[0067] Furthermore, the roller 25 can be filled with high-temperature long-lasting grease, and a dustproof seal ring is provided on the outside of the roller 25 to prevent cleaning fluid and particulate contaminants from entering the bearing, so that the roller 25 can operate reliably for a long time in a humid cleanroom environment.

[0068] In some other embodiments of this application, an elastic backlash elimination mechanism is provided between the first gear 24 and the second gear 31. The elastic backlash elimination mechanism includes a preload spring and a floating tooth block. During clamping, the elastic backlash elimination mechanism compensates for the gear meshing clearance to reduce clamping force fluctuations that could damage the wafer.

[0069] Understandably, an elastic backlash elimination mechanism can be a mechanical device installed in the gear meshing pair that automatically fills the tooth flank backlash through elastic force. This eliminates the negative impact of backlash on the smoothness of clamping force transmission without increasing gear machining accuracy. A preload spring can be an elastic element that applies a continuous biasing force to the floating tooth block, ensuring that the floating tooth block always remains in close contact with one side of the meshing tooth surface, eliminating bidirectional backlash. The floating tooth block can be a toothed component that can move elastically within a certain range, thus adaptively filling the tooth flank backlash under the action of spring force and absorbing minor impacts and vibrations during clamping.

[0070] Specifically, the floating tooth block can be installed in the tooth groove of the second gear 31 or on the tooth tip of the first gear 24, depending on space and assembly convenience. The preload spring can be a miniature compression spring or a spring sheet, installed on the back of the floating tooth block. The tooth profile parameters of the floating tooth block should be conjugate with the tooth profile of the mating gear to ensure smooth meshing. The preload of the elastic backlash elimination mechanism should be greater than the amplitude of the tangential component fluctuation of the gear meshing force during clamping to prevent the floating tooth block from being pushed away under force and losing its backlash elimination function.

[0071] Furthermore, the floating tooth block can be made of wear-resistant self-lubricating materials such as polytetrafluoroethylene composite material, which reduces the coefficient of friction with the mating tooth surface while eliminating backlash, reduces the wear and heat generation of the elastic backlash elimination mechanism itself, and improves the reliability of long-term use.

[0072] In some other embodiments of this application, the surface of the holding section 42 of the drive cam 40 is provided with a friction-reducing and wear-resistant coating. The friction coefficient of the friction-reducing and wear-resistant coating is lower than that of the contact surface of the rotating bracket 20, and the hardness of the friction-reducing and wear-resistant coating is not greater than that of the contact surface of the rotating bracket 20. During the clamping and rotation phases, the friction-reducing and wear-resistant coating is configured to reduce the wear rate of the friction pair between the drive cam 40 and the rotating bracket 20, thereby increasing the circumferential positional stability of the rotating bracket 20.

[0073] Understandably, the friction-reducing and wear-resistant coating can be a thin layer of functional material covering the surface of the retaining section 42. This allows for the reduction of the friction coefficient and wear rate of the friction pair through material-level modification. The coating's friction coefficient being lower than that of the contact surface of the rotating bracket 20 ensures that the frictional resistance is primarily borne by the coating side, reducing wear on the substrate material of the retaining section 42. The coating's hardness being no greater than that of the contact surface of the rotating bracket 20 allows the coating to wear preferentially as a sacrificial layer during friction, protecting the contact surface of the rotating bracket 20, which has higher processing costs, from scratches or plastic deformation. The combination of these two factors extends the functional life of the retaining section 42 and maintains the long-term circumferential positional accuracy of the rotating bracket 20.

[0074] Specifically, the friction-reducing and wear-resistant coating can be a diamond-like carbon coating, a molybdenum disulfide coating, or a polytetrafluoroethylene (PTFE) vinyl composite coating, with a thickness selectable in the range of 2 micrometers to 20 micrometers. The coating deposition process can be physical vapor deposition, chemical vapor deposition, or spray sintering, selected according to the substrate material and coating type. The contact surface of the rotating bracket 20 can be an uncoated metal substrate or a hardened surface, with a hardness higher than or equal to the coating hardness.

[0075] Furthermore, the surface of the friction-reducing and wear-resistant coating can be processed with micron-level oil-retaining textures, releasing trace amounts of lubricating media during friction, further reducing the coefficient of friction under boundary lubrication conditions, making it particularly suitable for clean environments in cleaning equipment where the use of liquid lubricating oil is not permitted.

[0076] In other embodiments of this application, reference is made to Figure 6 The generatrix profile of the guide section 41 of the drive cam 40 includes a rapid entry section 411 and a precision force control section 412 connected sequentially in the vertical direction. The lift slope of the rapid entry section 411 is greater than that of the precision force control section 412. During the clamping phase, when the rotary support 20 moves along the rapid entry section 411, it is driven to rotate at a first angular velocity, bringing the clamping member 30 close to the wafer edge. When the rotary support 20 moves from the rapid entry section 411 into the precision force control section 412, it rotates at a second angular velocity, which is less than the first angular velocity. The rotary support 20 and the rotating disk 10 are configured to complete the circumferential contact within the stroke range of the rotary support 20 entering the precision force control section 412, so that the circumferential contact performs the main positioning function.

[0077] Understandably, the rapid approach segment 411 can be a section with a larger lift slope in the guide segment 41, thus generating a larger rotation angle of the rotating support 20 within a unit lifting stroke, shortening the idle travel time of the clamping member 30 from the open position to near the wafer edge, and improving the clamping cycle time. The precision force control segment 412 can be a section with a smaller lift slope in the guide segment 41, thus generating a smaller rotation angle of the rotating support 20 within a unit lifting stroke, amplifying the adjustment resolution of the clamping force by the lifting displacement of the drive cam 40, and achieving fine control of the clamping force. The two-stage contour design divides the clamping process into two stages in time and space: rapid approach and precision force application, balancing efficiency and accuracy. The circumferential contact is configured within the stroke of the precision force control segment 412, so that the final clamping positioning is determined by the rigid circumferential contact rather than the flexible cam contour, improving the repeatability of the clamping endpoint. After contact, the clamping member 30 only needs to provide a flexible holding force that is insufficient to cause wafer deformation, reducing the risk of over-clamping. The flexible holding force can be generated by the elastic deformation of elastic elements (such as springs, sheet metal, etc.) to maintain the continuous clamping action of the clamping element 30 on the wafer. Unlike rigid limiting or locking mechanisms, this holding force has adaptive compensation capability: when there are tolerances in the wafer thickness, minor wear on the clamping surface, or thermal deformation of the system, the elastic element can automatically adjust and maintain the preset clamping force through the flexible holding force, avoiding wafer breakage due to over-clamping or wafer slippage due to under-clamping, thereby achieving flexible protection of the wafer while ensuring clamping reliability.

[0078] Specifically, the lift slope of the rapid inlet section 411 can be 2 to 5 times that of the lift slope of the precision force control section 412. A continuous curvature transition curve can be provided at the connection between the two sections to avoid acceleration shocks caused by abrupt changes in the lift slope. The axial length of the precision force control section 412 should be greater than the stroke of the drive cam 40 required for the circumferential contact from initial contact to complete engagement, ensuring that the entire contact process is within the low slope range of the precision force control section 412.

[0079] Furthermore, the lift slope of the precision force control section 412 can be designed as a variable slope curve that gradually decreases along the vertical direction. That is, the slope is further reduced when approaching the end point of contact, so that the clamping force increases at a more gradual rate in the final stage before contact, further reducing the dynamic impact on the wafer edge.

[0080] In other embodiments of this application, a transition arc is provided at the connection between the retaining section 42 and the guide section 41. The radius of curvature of the transition arc is configured to match the outer diameter of the roller 25 so that the roller 25 maintains continuous rolling contact as it passes through the connection. At the end of the clamping phase, the transition arc guides the roller 25 to smoothly transition to the retaining section 42, reducing the discontinuity of movement between the drive cam 40 and the rotating support 20, thereby mitigating the dynamic disturbance when the circumferential contact enters the self-locking state.

[0081] Understandably, the transition arc can be a smooth curved surface connection structure at the junction of the guide segment 41 and the retaining segment 42, thus eliminating abrupt changes in curvature or tangent direction at the connection point of the two contours. The configuration of the transition arc's radius of curvature matching the outer diameter of the roller 25 ensures that the roller 25 maintains a continuous and smooth trajectory as it passes through the connection point, without any abrupt changes in velocity or acceleration. This maintenance of motion continuity reduces the impact force of the roller 25 on the cam surface, reduces the micro-slippage or bounce caused by transmission chain vibration at the moment of contact in the circumferential contact, and improves the smoothness and reliability of the circumferential contact entering a stable self-locking state.

[0082] Specifically, the radius of curvature of the transition arc can be equal to or slightly larger than the outer diameter of the roller 25, so that the roller 25 maintains single-point or single-line contact with the cam surface during the transition process, avoiding jamming caused by two-point contact. The arc length of the transition arc should cover the entire angle required for the roller 25 to rotate from the tangential direction at the end of the guide section 41 to the tangential direction of the holding section 42. The surface finish of the transition arc should be consistent with that of the guide section 41 and the holding section 42 to avoid abrupt changes in the coefficient of friction due to differences in surface quality.

[0083] Furthermore, the surface of the transition arc can be locally strengthened, such as by laser hardening or nitriding, to improve the fatigue resistance of this high-stress transition area and prevent surface spalling or pitting caused by repeated impacts.

[0084] In other embodiments of this application, reference is made to Figure 9 and Figure 10 A radial elastic buffer pad 12 is provided between the clamping member 30 and the rotating disk 10. The radial elastic buffer pad 12 is configured to provide radial elastic deformation when the clamping member 30 performs the clamping action. During the clamping stage, when the rotating support 20 and the rotating disk 10 abut against each other in the circumferential direction, the compression amount of the radial elastic buffer pad 12 is set to keep the radial clamping force of the clamping member 30 on the wafer within a preset safety range. The circumferential abutment configuration limits the maximum radial displacement of the clamping member 30, and the radial elastic buffer pad 12 converts the diameter deviation of the wafer into a gradual change in clamping force within the maximum radial displacement, reducing the risk of damage to wafers with larger diameters due to over-clamping and reducing the possibility of loosening of wafers with smaller diameters.

[0085] Understandably, the radial elastic buffer pad 12 can be a flexible component installed between the clamping member 30 and the rotating disk 10, possessing elastic deformation capability in the radial direction. This allows an elastic element to be inserted between the rigid displacement of the clamping member 30 and the wafer edge, converting the geometric displacement of the clamping member 30 into a controllable elastic clamping force. The linear or nonlinear relationship between the compression of the radial elastic buffer pad 12 and the clamping force ensures that the manufacturing tolerance of the wafer diameter is transformed into a continuous change in the clamping force rather than a step change, achieving adaptive and compatible clamping for wafers of different diameters. The configuration of circumferential contact limiting the maximum radial displacement ensures that even under extreme tolerance conditions, the clamping force will not exceed the safety limit, forming a dual protection mechanism of elastic buffering and rigid limiting.

[0086] Specifically, the material of the radial elastic buffer pad 12 can be silicone rubber, fluororubber, or polyurethane elastomer. The radial thickness of the radial elastic buffer pad 12 can be determined according to the wafer diameter tolerance range and the required clamping force adjustment range. The radial elastic buffer pad 12 can be bonded or mechanically fixed in the clamping member mounting groove of the rotating disk 10. More specifically, the rotating disk 10 is provided with a clamping member mounting groove, and the clamping member also includes a gear post between the second gear 31 and the eccentric post 32. The gear post is located in the clamping member mounting groove, the second gear 31 is located below the clamping member mounting groove to cooperate with the first gear, and the eccentric post 32 is located above the clamping member mounting groove for clamping the wafer.

[0087] In some other embodiments of this application, the device is further provided with a torque monitoring mechanism. The torque monitoring mechanism is configured to issue a control signal to stop the upward movement of the drive cam 40 when the upward driving force of the drive cam 40 is detected to be greater than or equal to a preset upward driving force threshold during the clamping stage, so as to reduce overload damage caused by abnormal mechanical transmission chain.

[0088] Understandably, the torque monitoring mechanism can be a sensor and control unit that collects the upward driving force of the drive cam 40 or its equivalent physical quantity in real time, thus continuously monitoring the load status of the transmission chain during clamping. The upward driving force threshold can be a protection threshold set based on the maximum driving force under normal clamping conditions plus a safety margin, which can trigger protection actions in a timely manner while distinguishing between normal clamping resistance and abnormal overload. When the driving force is detected to reach or exceed the threshold, the control logic that immediately stops the upward movement of the drive cam 40 can cut off the power input before the mechanical parts undergo plastic deformation, fracture, or the wafer is crushed, thus playing a role in overload protection.

[0089] Specifically, the torque monitoring mechanism may include a force sensor, a torque sensor, or a current sampling circuit that indirectly calculates the driving force through the motor current, all mounted on the first power component. The setting of the rising driving force threshold should consider the variation range of the friction coefficient of the outer contour surface of the drive cam 40, the attenuation range of the preload of the return spring 43, and the variation range of the clamping force caused by the wafer diameter tolerance; it is typically set to 1.2 to 1.5 times the normal driving force. The response time of the control signal should be less than 50 milliseconds to effectively prevent overload in its early stages.

[0090] Furthermore, the torque monitoring mechanism can have a self-learning function, automatically statistically analyzing the peak distribution of driving force during each clamping process during normal equipment operation, and dynamically adjusting the rising driving force threshold based on the statistical results, thereby reducing the number of erroneous shutdowns caused by overly conservative threshold fixation while ensuring safety.

[0091] In some other embodiments of this application, a rotatable eccentric sleeve is fitted on the eccentric post 32, and the outer surface of the eccentric sleeve makes rolling contact with the wafer edge during clamping. The eccentric sleeve converts the sliding friction between the eccentric post 32 and the wafer edge into rolling friction, thereby reducing the motion resistance during clamping and improving the smoothness of clamping force transmission.

[0092] Understandably, the eccentric rolling sleeve can be an annular sleeve fitted around the eccentric pillar 32 and capable of rotating freely around the axis of the eccentric pillar 32. This allows the outer surface of the eccentric rolling sleeve to form rolling contact rather than sliding contact with the wafer edge as the eccentric pillar 32 revolves with the second gear 31. The effect of replacing sliding friction with rolling friction is to significantly reduce the tangential friction between the clamping member 30 and the wafer edge, reduce the clamping force loss and fluctuation caused by frictional resistance during the clamping action, and enable the geometric displacement input by the eccentric pillar 32 to be converted into radial clamping force on the wafer more efficiently and linearly, thereby improving the controllability and consistency of the clamping force.

[0093] Specifically, the eccentric sleeve can be a rolling bearing, such as a miniature deep groove ball bearing or a thin-walled needle roller bearing, with the inner bore and eccentric column 32 having an interference fit or clearance fit and being bonded together. The surface roughness of the outer ring of the eccentric sleeve should be less than Ra 0.2 micrometers to avoid scratching the wafer edge.

[0094] Furthermore, the outer ring of the eccentric roller sleeve can be made of zirconia ceramic material. The high hardness and chemical inertness of the ceramic material mean that it does not produce metal ion contamination when in contact with the wafer edge, and it can resist the corrosion of the cleaning solution. It is particularly suitable for advanced process wafer cleaning scenarios that are sensitive to metal impurities.

[0095] In some other embodiments of this application, pressure sensors are embedded in the first abutment portion and / or the second abutment portion, and the sensing area of ​​the pressure sensors covers the actual contact area between the first abutment portion and the second abutment portion. During the clamping phase, the measurement data from the pressure sensors is collected to determine whether the circumferential abutment reaches a preset abutment pressure threshold, and the rotation phase is triggered when the threshold is reached.

[0096] Understandably, the pressure sensor can be a sensing element embedded in the first and / or second abutment portions and directly sensing the contact pressure. This allows for the acquisition of firsthand data on the actual circumferential contact state, rather than inference from indirect parameters. The configuration of the sensing area covering the actual contact area ensures that the pressure signal collected by the sensor represents the load-bearing state of the entire circumferential contact, avoiding misjudgments caused by poor local contact.

[0097] Specifically, the pressure sensor can be a thin-film piezoresistive sensor, a piezoelectric sensor, or a strain gauge sensor, selected based on the measurement range, response speed, and installation space. The sensing surface of the sensor should be flush with or slightly lower than the contact surface of the first and / or second contact portion, for example, 0.01 mm to 0.05 mm lower, to avoid the sensor itself becoming a protrusion on the contact surface and affecting contact uniformity. The sensor's signal cable can be routed inside the rotating bracket 20 and led out through a slip ring or wireless transmission module. Furthermore, the pressure sensor can be configured with a temperature compensation circuit to eliminate the influence of cleaning fluid temperature changes on the sensor's zero-point drift and sensitivity, thereby improving the accuracy of contact pressure determination under different process temperature conditions.

[0098] In some other embodiments of this application, the cone angle α of the guide section 41 satisfies 15°~25°. The cone angle α is configured such that, in the initial clamping stage, the axial component force on the drive cam 40 is less than the preload force of the return spring 43, to prevent the drive cam 40 from undergoing axial displacement before overcoming the preload force. At the end of clamping, the frictional self-locking torque between the guide section 41 and the rotating bracket 20 is greater than the maximum reverse torque during the rotation phase.

[0099] Understandably, the cone angle α can be the angle between the generatrix of the guide section 41 and the horizontal reference plane perpendicular to the axis of the drive cam 40. This angle directly determines the transmission ratio and mechanical characteristics between the vertical lifting motion and the horizontal circumferential motion. Limiting the cone angle α to the range of 15°~25° is the result of balancing transmission efficiency, self-locking performance, and anti-rebound performance. In the initial stage of clamping, the smaller cone angle ensures that the reverse axial force from the rotating support 20 on the drive cam 40 is insufficient to overcome the preload of the return spring 43, thus preventing the drive cam 40 from being pushed down before clamping actually begins, eliminating the backlash and uncertainty at the clamping starting point. When the clamping action reaches the end position, the cone angle design of the guide section 41 enables the frictional self-locking condition to be met. Therefore, in the subsequent rotation stage, the inertial counter-torque generated by the wafer and the rotating disk 10 is effectively blocked by the frictional self-locking, preventing the drive cam 40 from retracting and ensuring the dynamic stability of the clamping position. Specifically, the specific value of the cone angle α can be determined by comprehensive calculation based on the magnitude of the preload of the return spring 43, the coefficient of friction between the guide section 41 and the driven member, and the maximum reverse torque during the rotation phase.

[0100] Furthermore, the cone angle α of the guide section 41 can be set to a gradual value along the vertical direction. That is, a smaller value, such as 15°, is taken in the initial inlet section to enhance the anti-rebound performance, and a larger value, such as 25°, is taken in the precision force control section 412 to improve the clamping force adjustment resolution. The transition between the two sections is smooth, taking into account the performance requirements of the entire process.

[0101] In some other embodiments of this application, a one-way clutch is provided at the transmission connection between the output shaft 50 and the rotating bracket 20, and the locking direction of the one-way clutch is consistent with the driving direction during the rotation phase. During the clamping phase, the one-way clutch is in a disengaged state, allowing the rotating bracket 20 to be driven independently by the drive cam 40 without being hindered by the output shaft 50. During the rotation phase, the one-way clutch is locked, realizing torque transmission from the output shaft 50 to the rotating bracket 20.

[0102] Understandably, a one-way clutch can be a mechanical coupling element installed between the output shaft 50 and the rotating support 20, transmitting torque only in one direction of rotation and automatically disengaging in the opposite direction or in an overrunning state. This allows for automatic switching of the power transmission path between the clamping and rotating stages without the need for additional control valves or electromagnetic clutches. The configuration where the locking direction coincides with the driving direction of the rotating stage ensures reliable transmission of rotational torque. The mechanism of the one-way clutch automatically being in an overrunning disengagement state during the clamping stage allows the rotating support 20 to be freely driven to rotate by the drive cam 40 without being hindered by the stationary output shaft 50 and its rear reducer and motor. This avoids unnecessary additional resistance to the clamping action and prevents energy waste and component damage caused by the drive cam 40 being forced to drive the rotating motor in the opposite direction.

[0103] Specifically, the one-way clutch can be a wedge type, roller type, or ratchet type, selected based on torque capacity, response speed, and service life. The inner ring of the one-way clutch can be fixed to the output shaft 50, and the outer ring fixed to the rotating bracket 20, or vice versa, depending on space layout and installation convenience. The rated torque of the one-way clutch should be greater than 1.5 times the maximum operating torque during rotation to withstand transient shocks during starting and braking.

[0104] For example, a wedge-type one-way clutch is installed between the output shaft 50 and the rotating bracket 20, with the locking direction clockwise. During the clamping phase, the drive cam 40 drives the rotating bracket 20 to rotate 30 degrees clockwise to complete the clamping. At this time, the rotational speed of the rotating bracket 20 is higher than the zero speed of the output shaft 50. The wedge inside the one-way clutch is in a lying state under the action of centrifugal force and spring force, and the inner and outer rings slide freely. The rotation of the rotating bracket 20 is not hindered by the output shaft 50. After clamping is completed, the rotary motor starts, and the output shaft 50 accelerates clockwise. When the speed of the output shaft 50 catches up with and exceeds the speed of the rotating bracket 20, the wedge stands up under the action of friction and weds the inner and outer rings. The one-way clutch automatically locks, and the torque is seamlessly transmitted from the output shaft 50 to the rotating bracket 20, and then transmitted to the rotating disk 10 through the circumferential contact, driving the wafer to rotate and clean. The entire process does not require any sensor detection or solenoid valve control, and the power path switching is automatically completed by mechanical principles.

[0105] Furthermore, a one-way clutch can be integrated with a damping ring or a buffer spring to absorb the speed difference energy between the inner and outer rings at the moment of locking, reducing locking impact noise and instantaneous contact stress of the wedge, thereby improving the service life of the one-way clutch and the quietness of equipment operation.

[0106] In some other embodiments of this application, the upper surface of the rotating disk 10 is provided with a wafer alignment mechanism. The wafer alignment mechanism includes at least two sets of alignment guide rods arranged symmetrically along the radial direction of the rotating disk 10. Each set of alignment guide rods is connected to the rotating support 20 via a linkage mechanism. During the clamping stage, as the rotating support 20 rotates, the wafer is pushed towards the center position of the rotating disk 10 through the radial contraction movement of the alignment guide rods, so that the geometric center of the wafer coincides with the rotation center of the rotating disk 10.

[0107] Understandably, the wafer alignment mechanism can be a centering and positioning device that is synchronously driven by the clamping movement of the rotating support 20. This allows the center of the wafer to be aligned with the rotation center of the rotating disk 10 before or simultaneously with the contact of the clamping member 30 with the wafer, avoiding uneven wafer edge stress and rotational vibration caused by the clamping member 30 forcibly clamping in an eccentric state. The radial retraction movement of the alignment guide rod and the clamping movement of the clamping member 30 are driven by the same rotating support 20, ensuring the timing synchronization and motion coordination between the two, without the need for an additional alignment drive source.

[0108] Specifically, the centering guide rods can be in three or four sets, evenly distributed circumferentially. The linkage mechanism can be a cam groove, connecting rod, or rack and pinion, converting the circumferential rotation of the rotating support 20 into the radial linear motion of the centering guide rods. The top of the centering guide rods can be provided with an arc-shaped guide surface or ball bearings to form a low-friction contact with the wafer edge, preventing scratches on the wafer during alignment. The radial stroke of the centering guide rods should be greater than the maximum eccentricity of the wafer to ensure effective alignment even in the most unfavorable loading position.

[0109] For example, three sets of centering guide rods are evenly arranged along the circumference of the rotating disk 10 at 120°. Each set of centering guide rods is connected to a drive pin on the rotating bracket 20 via an arc-shaped cam groove. During the clamping phase, within the first 15 degrees of clockwise rotation of the rotating bracket 20, the drive pin moves along the arc-shaped cam groove, pushing the three sets of centering guide rods to synchronously retract 10 mm towards the center, pushing the wafer, which may have an eccentricity of ±5 mm on the rotating disk 10, to the center position. Within the remaining 15 degrees of rotation of the rotating bracket 20, the centering guide rods remain stationary, and the clamping member 30 performs the final clamping action. The entire centering and clamping process is completed in one continuous motion by the single upward movement of the drive cam 40, eliminating the need for an additional centering motor and control timing, thus simplifying the equipment structure and control logic.

[0110] Furthermore, the retraction speed of the centering guide rod can be designed as a non-linear motion law that is fast at first and slow at the end, quickly eliminating most of the eccentricity in the initial stage and slowing down when approaching the center to avoid impacting the wafer edge, thereby improving the smoothness of the centering process and the positioning accuracy of the wafer.

[0111] This application also provides a method for operating a single-wafer cleaning device, applied to the single-wafer cleaning device described above, with reference to... Figure 11 The working method includes: Step 801: Control the drive cam to rise vertically, drive the rotating bracket to rotate horizontally through the outer contour surface of the drive cam, thereby driving the clamping component to perform clamping action until the rotating bracket and the rotating disk abut against each other in the circumferential direction to lock the clamping position of the clamping component and complete the clamping of the wafer. Step 802: Control the output shaft to rotate horizontally, and transmit torque to the rotating disk through the circumferential contact between the rotating bracket and the rotating disk, so that the rotating disk rotates together with the wafer.

[0112] Understandably, the above-described working method achieves decoupling of the clamping and rotational actions at the physical execution level by independently controlling the first power component (the lifting drive source for the driving cam) and the second power component (the rotational drive source for the output shaft) in terms of timing through the control system. Using the "circumferential contact" as the connecting hub between the two stages allows the mechanical limit endpoint of the clamping stage to be directly transformed into the torque transmission interface of the rotation stage. This control logic not only avoids complex clutch switching or compound motion interpolation algorithms but also reduces the computational burden and response delay requirements of the control system through the inherent self-locking characteristics of the mechanical structure, thereby improving the overall operational reliability and cycle stability of the equipment.

[0113] Specifically, the process of controlling the upward movement of the drive cam can be achieved by the main controller of the equipment (such as a PLC or industrial computer) sending position or speed commands to the first power component. During the upward movement of the drive cam, the controller can monitor the output torque or drive current of the first power component in real time to determine whether the transmission chain is jammed. The condition of "until the rotating bracket and the rotating disk abut against each other in the circumferential direction" can be determined by the feedback signals from pressure sensors set on the first abutment part and / or the second abutment part; when the contact pressure detected by the pressure sensor reaches the preset abutment pressure threshold and is maintained for a preset time (such as 50 milliseconds), the controller determines that the circumferential abutment has been reliably formed and then stops the upward movement of the drive cam. Subsequently, the controller sends an enable signal and speed curve command to the second power component to start the output shaft rotation. During the rotation phase, the speed of the output shaft can be closed-loop controlled according to the cleaning speed required by the process.

[0114] For example, in a complete wafer cleaning cycle, the robotic arm first places the wafer to be cleaned in the bearing area of ​​the rotating disk. After receiving the loading completion signal, the control system initiates the clamping phase: the servo electric cylinder pushes the drive cam to rise at a constant speed, and the rotating bracket rotates under the drive of the convex profile surface, causing multiple clamping components to synchronously retract towards the center. When the clamping components contact the edge of the wafer and continue to apply radial force, causing the rotating bracket and the end face teeth (or friction surface) of the rotating disk to fully contact and press together, the pressure sensor triggers a threshold signal, the servo electric cylinder stops and maintains its current position. Immediately afterwards, the control system initiates the rotation phase: the servo motor drives the output shaft to accelerate to the set cleaning speed (e.g., 500 rpm), and the torque is seamlessly transmitted to the rotating disk through the locked circumferential contact surface. The wafer begins to rotate at high speed, while the cleaning nozzles spray cleaning fluid and pure water for rinsing and drying. After cleaning is completed, the servo motor decelerates and stops, the servo electric cylinder drives the drive cam to descend and reset, the clamping components release the wafer, the robotic arm removes the cleaned wafer, and the equipment is ready for the next work cycle.

[0115] Furthermore, the operating method may also include safety interlocking and abnormal handling steps. During the rotation phase, the control system continuously collects real-time data from the pressure sensor. If the pressure value at the circumferential contact point drops below a preset percentage (e.g., below 80% of the threshold), it indicates that relative slippage or accidental separation may occur between the rotating support and the rotating disk. The control system will immediately trigger an emergency stop command, cut off the power output of the second power unit, and apply mechanical braking to prevent the wafer from being thrown out by centrifugal force due to interruption of torque transmission. In addition, if, during the clamping phase, the pressure sensor still has not reached the contact pressure threshold when the drive cam rises to the preset maximum stroke limit, the control system will determine that the clamping has failed (e.g., wafer is missing or dimensionally out of tolerance), automatically execute the drive cam descent reset action, and issue an equipment alarm to avoid overload damage to the mechanism.

[0116] It should be noted that the various embodiments or implementation methods in this document can be described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to mutually. It should be understood that in the various embodiments of this application, the embodiment numbers are merely for descriptive purposes and do not represent the superiority or inferiority of the embodiments.

[0117] In some embodiments, prefixes such as "first" and "second" are used merely to distinguish different descriptive objects and do not impose restrictions on the position, order, priority, or value of the descriptive objects. The description of the descriptive objects is given in the context of the embodiments, and the use of prefixes does not constitute unnecessary restrictions. For example, the numerical value of a descriptive object is not limited by ordinal numbers and can be one or more. Taking "first device" as an example, the numerical value of "device" can be one or more. Furthermore, objects modified by different prefixes can be the same or different. For example, if the descriptive object is "device," then "first device" and "second device" can be the same device or different devices, and their types can be the same or different. Describing "first" does not necessarily imply the existence of "second," and discussing "second" does not necessarily imply the existence of "first."

[0118] In some embodiments, unless otherwise expressly defined, the terms "installation," "connection," "linking," "fixing," "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment according to the specific circumstances.

[0119] In some embodiments, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “height,” “up,” “down,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” and “counterclockwise” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. That is, they should not be construed as limitations on this application.

[0120] In some embodiments, unless otherwise expressly defined, "above" or "below" the second feature can mean that the first and second features are in direct contact, or indirect contact via an intermediate medium, or that they are not in contact, but simply indicate that the horizontal level of the first feature is higher than that of the second feature. Furthermore, "above" or "below" the second feature can mean that the first feature is directly above or diagonally above, directly below, or diagonally below the second feature.

[0121] In some embodiments, spatial relation terms such as “upper” and “lower” may be used for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, the description of an element or feature “below” other elements or features will change it to “upper” other elements or features. Therefore, the exemplary terms “upper” and “lower” can include both upper and lower orientations. The device may also be otherwise oriented (rotated 90 degrees or otherwise), and the spatial descriptive terms used herein will be interpreted accordingly.

[0122] It should be understood that the above embodiments are merely illustrative of several implementation methods of this application and do not limit the scope of protection of this patent application. The above embodiments are all exemplary and are not intended to encompass all possible implementation methods included in the technical solutions of this application. Various modifications and changes can be made to the above embodiments without departing from the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

Claims

1. A single-wafer cleaning device, characterized in that, include: A rotating disk, used to hold wafers, can rotate horizontally about a vertical axis; A rotating bracket, located below the rotating disk, is capable of horizontal rotation; A clamping element, movably connected to the rotating support, is used to perform a clamping action on the wafer; A drive cam, located below the rotating bracket, is vertically movable, and its outer contour surface is in transmission cooperation with the rotating bracket to convert the vertical lifting motion of the drive cam into the horizontal rotation of the rotating bracket. The output shaft is connected to the rotating bracket in a transmission manner, and the output shaft can rotate horizontally; During the clamping phase, the drive cam rises vertically and drives the rotating bracket to rotate through its outer contour surface, thereby causing the clamping member to perform a clamping action until the rotating bracket and the rotating disk abut against each other in the circumferential direction to lock the clamping position of the clamping member and complete the clamping of the wafer. During the rotation phase, the output shaft rotates, and the torque is transmitted to the rotating disk through the circumferential contact between the rotating bracket and the rotating disk, causing the rotating disk to rotate together with the wafer.

2. The single-wafer cleaning equipment according to claim 1, characterized in that, The outer contour surface of the drive cam includes a guide section and a holding section connected in sequence. The radial dimension of the guide section gradually increases downward along the vertical direction, and the radial dimension of the holding section is the same vertically. During the clamping stage, the guide section drives the rotating bracket to rotate to perform the clamping action. When the rotating bracket abuts against the rotating disk, the holding section of the drive cam remains in contact with the rotating bracket to maintain the circumferential position of the rotating bracket.

3. The single-wafer cleaning equipment according to claim 1, characterized in that, The rotating bracket has a first abutting part on the side facing the rotating disk in the rotation direction, and the rotating disk has a second abutting part corresponding to the first abutting part. The first abutting part and the second abutting part abut against each other in the circumferential direction by fitting together.

4. The single-wafer cleaning equipment according to claim 1, characterized in that, The clamping member is connected to the rotating support via a gear pair; the outer ring of the rotating support is provided with a first gear, and the clamping member includes a second gear that cooperates with the first gear; the clamping member also includes an eccentric column provided on the end face of the second gear, and when the second gear rotates, the distance between the eccentric column and the center of the rotating disk changes accordingly according to the rotation angle, so as to achieve clamping or releasing of the wafer.

5. The single-wafer cleaning equipment according to claim 1, characterized in that, The contact surface between the clamping member and the wafer is a partial point contact or line contact structure to reduce the contact area.

6. The single-wafer cleaning equipment according to claim 2, characterized in that, The drive cam is also provided with a return spring with a preload; in the non-clamped state, the preload of the return spring holds the drive cam in the initial position and eliminates transmission backlash; after the power component driving the drive cam stops driving, the drive cam descends to the initial position under the action of the return spring.

7. The single-wafer cleaning equipment according to claim 2, characterized in that, The rotating bracket is provided with a roller that can rotate around its own axis at the position where it contacts the outer contour surface of the drive cam, and the axis of the roller extends radially along the rotating bracket; during the clamping phase, when the drive cam moves vertically up and down, the roller rolls along the outer contour surface.

8. The single-wafer cleaning equipment according to claim 2, characterized in that, The surface of the holding section of the drive cam is provided with a friction-reducing and wear-resistant coating. The friction coefficient of the friction-reducing and wear-resistant coating is lower than that of the contact surface of the rotating bracket, and the hardness of the friction-reducing and wear-resistant coating is not greater than that of the contact surface of the rotating bracket. During the clamping and rotation phases, the friction-reducing and wear-resistant coating is configured to reduce the wear rate of the friction pair between the drive cam and the rotating support, thereby increasing the stability of the circumferential position of the rotating support.

9. The single-wafer cleaning equipment according to claim 2, characterized in that, The generatrix of the guide section of the drive cam includes a rapid inlet section and a precision force control section connected sequentially in the vertical direction; The lift slope of the rapid inlet section is greater than that of the precision force control section; During the clamping phase, as the rotating support moves along the rapid infeed section, it is driven to rotate at a first angular velocity, bringing the clamping member closer to the wafer edge. When the rotating bracket moves from the rapid inlet section into the precision force control section, the rotating bracket rotates at a second angular velocity, which is less than the first angular velocity; The rotating bracket and the rotating disk are configured to engage with each other in the circumferential direction within the stroke range of the rotating bracket when it enters the precision force control section, so that the circumferential engagement undertakes the main positioning function.

10. The single-wafer cleaning equipment according to claim 1, characterized in that, A radial elastic buffer pad is provided between the clamping member and the rotating disk. The radial elastic buffer pad is configured to provide radial elastic deformation when the clamping member performs a clamping action. During the clamping stage, when the rotating support abuts against the rotating disk in the circumferential direction, the compression amount of the radial elastic buffer pad is set to keep the radial clamping force of the clamping member on the wafer within a preset safety range. The circumferential abutment configuration limits the maximum radial displacement of the clamping member, while the radial elastic buffer pad converts the diameter deviation of the wafer into a gradual change in clamping force within the maximum radial displacement, reducing the risk of damage to wafers with larger diameters due to over-clamping and reducing the possibility of loosening of wafers with smaller diameters.

11. The single-wafer cleaning equipment according to claim 4, characterized in that, A rotatable eccentric sleeve is fitted on the eccentric pillar. The outer surface of the eccentric sleeve rolls in contact with the edge of the wafer during the clamping process. The eccentric sleeve converts the sliding friction between the eccentric pillar and the edge of the wafer into rolling friction, thereby reducing the motion resistance during the clamping action and improving the smoothness of the clamping force transmission.

12. The single-wafer cleaning equipment according to claim 3, characterized in that, A pressure sensor is embedded in the first abutment part and / or the second abutment part, and the sensing area of ​​the pressure sensor covers the actual contact area between the first abutment part and the second abutment part; during the clamping stage, the measurement data of the pressure sensor is collected to determine whether the circumferential abutment reaches a preset abutment pressure threshold, and the rotation stage is triggered when the preset abutment pressure threshold is reached.

13. The single-wafer cleaning equipment according to claim 6, characterized in that, The cone angle α of the guide section satisfies 15°≤α≤25°; The cone angle α is configured such that, in the initial clamping stage, the axial component force on the drive cam is less than the preload force of the return spring, so as to prevent the drive cam from undergoing axial displacement before overcoming the preload force; and in the final clamping stage, the frictional self-locking torque between the guide section and the rotating bracket is greater than the maximum reverse torque during the rotation stage.

14. The single-wafer cleaning equipment according to claim 1, characterized in that, A one-way clutch is provided at the transmission connection between the output shaft and the rotating bracket. The locking direction of the one-way clutch is consistent with the driving direction during the rotation phase. During the clamping phase, the one-way clutch is in a disengaged state, allowing the rotating bracket to be driven independently by the drive cam without being hindered by the output shaft. During the rotation phase, the one-way clutch is locked, realizing the torque transmission from the output shaft to the rotating bracket.

15. A method for operating a single-wafer cleaning device, characterized in that, The method of operation, applied to the single-wafer cleaning equipment as described in any one of claims 1-14, includes: The drive cam is controlled to rise vertically, and the outer contour surface of the drive cam drives the rotating bracket to rotate horizontally, thereby driving the clamping member to perform a clamping action until the rotating bracket and the rotating disk abut against each other in the circumferential direction, so as to lock the clamping position of the clamping member and complete the clamping of the wafer. The output shaft is controlled to rotate horizontally, and torque is transmitted to the rotating disk through the circumferential contact between the rotating bracket and the rotating disk, so that the rotating disk rotates together with the wafer.

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