A polishing structure for an aluminum nitride ceramic substrate

Abstract

The application provides a polishing structure of an aluminum nitride ceramic substrate, which comprises a circular plate, a plurality of material conveying rings arranged on the circular plate and capable of rotating around the center of the circular plate, a plurality of processing units arranged on the upper end of the circular plate, wherein the plurality of processing units comprise a feeding unit, a lubricating unit, a polishing unit and a discharging unit, and the plurality of material conveying rings pass through the plurality of processing units in sequence; the feeding unit comprises a discharging cylinder used for storing the ceramic substrate, and the ceramic substrate is dropped by the discharging cylinder when the material conveying ring passes through; the four processing units of the feeding unit, the lubricating unit, the polishing unit and the discharging unit are uniformly arranged on the upper end of the circular plate in the circumferential direction, so that the plurality of material conveying rings pass through the four processing units in sequence during the rotation process, and the full-automatic continuous processing of the four processes of feeding, lubricating, polishing and discharging of the aluminum nitride ceramic substrate is realized; and workers only need to place a plurality of ceramic substrates in the discharging cylinder, and then the polishing processing of the plurality of ceramic substrates can be sequentially completed.

Description

Technical Field

[0001] This invention relates to the field of aluminum nitride ceramic substrate processing, and more particularly to a polishing structure for aluminum nitride ceramic substrates. Background Technology

[0002] After sintering, aluminum nitride ceramic substrates typically exhibit a certain degree of roughness, undulation, and microscopic defects on their surface. These surface defects significantly affect the bonding strength between the subsequent metallization layer and the ceramic substrate, heat dissipation efficiency, and the overall operational stability of electronic devices. Therefore, the surface of aluminum nitride ceramic substrates must be polished to obtain a mirror-like finish with high flatness and low roughness, meeting the requirements of subsequent metallization, welding, and packaging processes.

[0003] Chinese Patent Application No. 202422209415.1 discloses a ceramic substrate polishing device, including a machine body, a main grinding disc, and a first motor. The main grinding disc is concentrically rotated inside the machine body, and the first motor is installed below the machine body. The main grinding disc is connected to the output end of the first motor. A base is fixedly installed on the side of the machine body. A reciprocating drive mechanism is set between the connecting arm and the base, so that the correction disc can perform horizontal reciprocating motion on the surface of the main grinding disc. At this time, the workpiece can be fixed on the surface of the main grinding disc by an additional pneumatic clamping mechanism on the correction disc, thereby changing the polishing trajectory of the workpiece and improving the polishing effect. At the same time, the reciprocating drive mechanism can also drive the cleaning mechanism to move, so that the cleaning mechanism can move vertically to clean the side of the main grinding disc, thereby preventing workpiece debris from adhering to the side of the main grinding disc without stopping the machine for cleaning.

[0004] During equipment operation, the main grinding disc remains rotating. Operators must manually pick up and place ceramic substrates on the dynamically rotating disc. Under dynamic conditions, there are not only safety hazards such as hands being scratched by the grinding disc or bumped by bricks, but also the hasty operation cannot achieve accurate alignment of the substrates, which can easily cause workpiece displacement, uneven polishing, or even cause brittle ceramic substrates to break and be scrapped. At the same time, the polishing slurry must be manually applied one by one before loading, which not only adds an extra independent operation and lengthens the production cycle, but also makes it difficult to ensure the weight and uniformity of the polishing slurry application by manual application, directly resulting in significant differences in polishing effects between different workpieces and different batches. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the defects of the existing technology. The present invention proposes a polishing structure for aluminum nitride ceramic substrate.

[0006] To solve the above technical problems, the technical solution adopted by the present invention is: a polishing structure for an aluminum nitride ceramic substrate, comprising: a circular plate, a plurality of material conveying rings disposed on the circular plate and rotatable around the center of the circular plate, the upper end of the circular plate being provided with a plurality of processing units, the plurality of processing units including a feeding unit, a lubrication unit, a polishing unit and a unloading unit, the plurality of material conveying rings passing through the plurality of processing units in sequence; The feeding unit includes a feeding cylinder for storing ceramic substrates, which drops the ceramic substrates as the conveyor ring passes by; The lubrication unit includes a coating component disposed on a circular plate, which is used to apply polishing liquid to the surface of the ceramic substrate it passes over. The polishing unit includes a polishing disc mounted on a circular plate and a motor that drives the polishing disc to rotate. The polishing disc polishes the ceramic substrate carried by the conveying ring. The feeding unit includes a feeding port on a circular plate, which is used to allow the polished ceramic substrate to fall from the conveying ring; The conveyor belt drives the ceramic substrate through the feeding unit, lubrication unit, polishing unit and unloading unit in sequence to achieve uninterrupted processing of the ceramic substrate.

[0007] Preferably, the feeding unit further includes a support, a partition, and a spring. The feeding cylinder is fixed to the surface of the circular plate by the support. The middle part of the partition is rotatably connected to the surface of the support. The partition is set at the lower opening of the feeding cylinder to block the ceramic substrate from being fed into the feeding cylinder. A spring is connected between the end of the partition and the support. There is a gap between the bottom of the partition and the upper surface of the circular plate. The conveying ring can push the partition to rotate relative to the support around its rotatable connection to open the lower opening of the feeding cylinder, so that the ceramic substrate in the feeding cylinder falls into the conveying ring due to gravity.

[0008] Preferably, in the lubrication unit, the coating component includes a fixed brush and bristles fixed to the surface of the fixed brush. The fixed brush is fixed to the surface of the circular plate, the interior of the fixed brush is hollow, the bottom of the fixed brush is connected to a pipe for supplying polishing liquid, and the fixed brush has an opening at the location of the bristles.

[0009] Preferably, the polishing unit includes a positioning frame, a second motor, a screw, a floating frame, a first motor, and a polishing disc. The positioning frame is fixed to the surface of the circular plate, the second motor is fixed to the upper end of the positioning frame, the output end of the second motor is driven by a rotatable screw, the surface of the screw is threaded with a floating frame, the first motor is fixedly connected to the surface of the floating frame, and the polishing disc is driven by the output end of the first motor.

[0010] Preferably, the side of the positioning frame is fixedly connected to a slide rail extending in a vertical direction, and the floating frame is fixedly connected to a slider that slides in cooperation with the slide rail.

[0011] Preferably, the discharge port is a through hole penetrating the circular plate along the thickness direction, the diameter of the discharge port is larger than the outer diameter of the ceramic substrate, and the discharge port is located on the movement trajectory path of the conveying ring.

[0012] Preferably, it also includes a clamping unit, which includes an inner groove and an outer groove formed on the surface of the circular plate. The inner groove has a communicating groove on the side near the polishing unit, and the surface of the outer groove has a protrusion communicating with the outer groove. The bottom of the conveying ring has a lower slot, and a rotatable pressure plate is provided in the lower slot.

[0013] Preferably, the curvature of the groove is smaller than that of the inner groove, and the curvature of the convex groove is larger than that of the outer groove. When the pressure plate enters the convex groove from the outer groove or the groove from the inner groove, the pressure plate squeezes the ceramic substrate in the middle of the conveying ring.

[0014] Preferably, the circular plate is provided with a rotatable rotating frame, and multiple material conveying rings are connected to the rotating frame; the bottom of the circular plate is fixedly connected to a support leg for support, and a drive motor is fixedly connected inside the support leg through a motor bracket. The output end of the drive motor is connected to the rotating frame for transmission. The drive motor drives the rotating frame to rotate around the central axis of the circular plate, thereby driving the multiple material conveying rings to rotate around the center of the circular plate.

[0015] Preferably, four material conveying rings are fixedly connected to the rotating frame, and the number of processing units is four, which are evenly distributed along the circumference of the circular plate.

[0016] Compared with the prior art, the beneficial effects of the present invention include: by uniformly arranging four processing units—a feeding unit, a lubrication unit, a polishing unit, and a unloading unit—along the upper end of the circular plate, multiple conveying rings pass through the four processing units in sequence during rotation, thus realizing fully automated continuous processing of the four processes of feeding, lubrication, polishing, and unloading of aluminum nitride ceramic substrates. Workers only need to place multiple ceramic substrates inside the unloading cylinder to complete the polishing process of multiple ceramic substrates in sequence. Attached Figure Description

[0017] The disclosure of this invention is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this invention. In the drawings, the same reference numerals are used to refer to the same parts. Wherein: Figure 1 The diagram schematically illustrates a polished structure of an aluminum nitride ceramic substrate according to an embodiment of the present invention.

[0018] Figure 2 The diagram schematically illustrates a polishing structure according to an embodiment of the present invention.

[0019] Figure 3The diagram illustrates a circular plate structure according to one embodiment of the present invention.

[0020] Figure 4 The diagram illustrates a cross-sectional structure of a conveyor ring according to an embodiment of the present invention.

[0021] Figure 5 The diagram schematically illustrates a positioning frame structure according to an embodiment of the present invention.

[0022] Figure 6 The schematic diagram shows a feed cylinder structure according to an embodiment of the present invention.

[0023] The following are the labels in the diagram: 1. Circular plate; 2. Fixed brush; 3. Outer groove; 4. Support; 5. Feeding cylinder; 6. Support leg; 7. Feeding port; 8. Conveying ring; 9. Inner groove; 10. Rotating frame; 11. Polishing disc; 12. Motor 1; 13. Brush bristles; 14. Groove; 15. Raised groove; 16. Pressure plate; 17. Lower slot; 18. Floating frame; 19. Screw; 20. Slide rail; 21. Slider; 22. Motor 2; 23. Positioning frame; 24. Spring; 25. Partition. Detailed Implementation

[0024] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0026] Reference Figures 1 to 6 This invention proposes a polishing structure for aluminum nitride ceramic substrates. The polishing structure mainly consists of a circular plate 1, a support leg 6 fixedly connected to the bottom of the circular plate 1, four processing units fixedly installed on the upper end of the circular plate 1, a rotating frame 10 rotatably set at the center of the circular plate 1, and a material conveying ring 8 fixedly connected to the end of the rotating frame 10. Through the coordinated work of the four processing units, continuous automated polishing of aluminum nitride ceramic substrates can be achieved.

[0027] Reference Figure 1 and Figure 2The polishing structure of the present invention includes a circular plate 1. The bottom of the circular plate 1 is fixedly connected with a support leg 6 for supporting the entire device by bolts. In one specific embodiment, there are three or four support legs 6, which are evenly distributed along the circumference of the bottom of the circular plate 1. The upper end of the support leg 6 is welded to the lower surface of the circular plate 1. The lower end of the support leg 6 contacts the ground and supports the entire device to ensure the stability of the device during operation. A drive motor is fixed inside the support leg 6 by a motor bracket. Specifically, one end of the motor bracket is fixedly connected to the inner wall of the support leg 6 by bolts, and the other end of the motor bracket is fixedly connected to the housing of the drive motor by bolts. The output shaft of the drive motor is vertically arranged upward and extends through a pre-set shaft hole at the center of the circular plate 1 to the top of the circular plate 1. The output shaft of the drive motor is connected to the center of the rotating frame 10 through a coupling, so that the drive motor can drive the rotating frame 10 to rotate around the central axis of the circular plate 1.

[0028] The rotating frame 10 has a cross-shaped structure with four radially outward extending arms. The four arms are evenly distributed at 90 degrees relative to the center of the rotating frame 10. Each arm is fixedly connected to a material conveying ring 8 by welding. That is, a total of four material conveying rings 8 are fixedly connected to the rotating frame 10. The four material conveying rings 8 are evenly distributed in a circle relative to the central axis of the rotating frame 10 and are located at the same horizontal height. When the drive motor drives the rotating frame 10 to rotate, the rotating frame 10 drives the four material conveying rings 8 fixedly connected to it to rotate synchronously around the central axis of the circular plate 1, so that the four material conveying rings 8 pass through the four processing units set above the circular plate 1 in sequence.

[0029] Four processing units are fixedly installed on the upper surface of the circular plate 1 and evenly distributed along the circumference of the circular plate 1. The central angle between two adjacent processing units is 90 degrees, and the circumferential positions of the four processing units correspond to the movement trajectories of the four conveying rings 8. The four processing units are the feeding unit, the lubrication unit, the polishing unit, and the unloading unit. In each working cycle, the four conveying rings 8 simultaneously perform different processing procedures at the four processing units. That is, at a certain moment, one conveying ring 8 is feeding at the feeding unit, another conveying ring 8 is lubricating at the lubrication unit, the third conveying ring 8 is polishing at the polishing unit, and the fourth conveying ring 8 is unloading at the unloading unit, thereby realizing continuous and automated processing of aluminum nitride ceramic substrates.

[0030] Reference Figure 1 and Figure 6The feeding unit includes a feeding cylinder 5 for storing ceramic substrates and a bracket 4 for fixing the feeding cylinder 5 to the surface of the circular plate 1. The bottom end of the bracket 4 is fixedly connected to the side of the circular plate 1 by bolts. The bracket 4 has a U-shaped structure with a vertically extending support part and a horizontally extending mounting part. The feeding cylinder 5 is a hollow cylindrical structure. The outer wall of the feeding cylinder 5 is fixedly connected to the mounting part of the bracket 4 by welding, so that the feeding cylinder 5 is vertically set and located at a certain height above the circular plate 1. The axial direction of the feeding cylinder 5 is perpendicular to the upper surface of the circular plate 1. The inner diameter of the feeding cylinder 5 is slightly larger than the outer diameter of the ceramic substrate. Specifically, the inner diameter is 0.5mm to 2mm larger than the outer diameter of the ceramic substrate to ensure that the ceramic substrate can fall smoothly along the axial direction inside the feeding cylinder 5. The upper end of the feeding cylinder 5 is an open end for replenishing ceramic substrates, and the lower end of the feeding cylinder 5 is a discharge end, which is directly opposite the upper surface of the circular plate 1.

[0031] A hinge seat is provided on the side surface of the support 4. The partition 25 is hinged to the hinge seat on the side surface of the support 4 through a pin, so that the partition 25 can rotate relative to the support 4 around the pin. The partition 25 has a plate-like structure. In the initial state, the partition 25 is arranged horizontally and located at the lower end opening of the feed cylinder 5. Springs 24 are respectively arranged between the two ends of the partition 25 and the support 4. Specifically, one end of the spring 24 is hooked and connected to the partition 25 near its rotating end, and the other end of the spring 24 is hooked and connected to the fixed hook at the corresponding position of the support 4. The spring 24 generates tension in the natural state, so that the partition 25 is pressed tightly against the lower end opening of the feed cylinder 5, thereby sealing the lower end opening of the feed cylinder 5 and preventing the ceramic substrate stored inside the feed cylinder 5 from falling downward due to gravity.

[0032] A gap is formed between the bottom surface of the partition 25 and the upper surface of the circular plate 1. The height of this gap is slightly greater than the height of the conveying ring 8. Specifically, the gap is 1 mm to 3 mm larger than the height of the conveying ring 8, so that the conveying ring 8 can pass smoothly under the partition 25 without interference. The partition 25 is horizontally set at the lower opening of the feeding cylinder 5. In the initial state, the upper surface of the partition 25 is in close contact with the lower opening end face of the feeding cylinder 5, blocking the feeding of the ceramic substrate inside the feeding cylinder 5.

[0033] When the drive motor drives the rotating frame 10 and its conveying ring 8 to the position of the feeding cylinder 5, the side wall of the conveying ring 8 contacts the edge of the partition 25. The movement of the conveying ring 8 pushes the partition 25 to rotate around the pin shaft relative to the bracket 4 in a direction away from the feeding cylinder 5. During this process, the spring 24 is stretched and elongated, and the spring 24 generates an elastic restoring force. When the conveying ring 8 continues to move to the position directly below the feeding cylinder 5, the conveying ring 8 pushes the partition 25 completely open. At this time, the partition 25 is completely separated from the lower opening end face of the feeding cylinder 5. Upon contact, the lower opening of the feeding cylinder 5 is opened, and the ceramic substrate at the bottom of the feeding cylinder 5 falls downward along the axis of the feeding cylinder 5 due to its own gravity. The ceramic substrate falls into the conveying ring 8 located directly below it, completing the feeding step. When the conveying ring 8 continues to rotate with the rotating frame 10 and moves away from the position directly below the feeding cylinder 5, under the pulling force of the spring 24, the partition 25 returns to the position close to the lower opening of the feeding cylinder 5, resealing the lower opening of the feeding cylinder 5, and waiting for the arrival of the next conveying ring 8.

[0034] Reference Figure 2 The lubrication unit includes a fixed brush 2 fixed to the surface of the circular plate 1 and brush bristles 13 fixed to the surface of the fixed brush 2. The bottom end of the fixed brush 2 is fixedly connected to the upper surface of the circular plate 1 by welding, so that the fixed brush 2 is arranged vertically and located on the movement trajectory path of the conveying ring 8. The height of the fixed brush 2 is higher than the part of the upper end of the ceramic substrate that is higher than the conveying ring 8. The fixed brush 2 has a hollow structure. The internal cavity of the fixed brush 2 is used to store or transport polishing liquid. The bottom of the fixed brush 2 is connected to a pipe for supplying polishing liquid. Specifically, one end of the pipe is sealed to the liquid inlet at the bottom of the fixed brush 2 by a threaded connection or quick-connect fitting. The other end of the pipe is connected to an external polishing liquid supply device, such as a polishing liquid storage tank and a pump, so that the polishing liquid is continuously transported to the internal cavity of the fixed brush 2 through the pipe.

[0035] The roots of the bristles 13 are fixedly connected to the outer wall of the fixed brush 2 by bonding or bristle implantation. The bristles 13 are densely arranged on the surface of the fixed brush 2 along the length of the fixed brush 2. The extension direction of the bristles 13 is perpendicular to the movement direction of the ceramic substrate, so that the bristles 13 can fully contact the side surface of the ceramic substrate. The fixed brush 2 has several openings at the connection position with the bristles 13. The openings penetrate the side wall of the fixed brush 2 and communicate with the internal cavity of the fixed brush 2, so that the polishing liquid in the internal cavity of the fixed brush 2 can seep out through the openings and drip or penetrate onto the surface of the bristles 13, so that the surface of the bristles 13 is always moist and covered with polishing liquid.

[0036] After being fed by the feeding unit, the conveying ring 8 rotates with the rotating frame 10, carrying the ceramic substrate inside it towards the lubrication unit. Since the height of the ceramic substrate is greater than the height of the conveying ring 8, the upper end of the ceramic substrate is higher than the upper end of the conveying ring 8, that is, the upper part of the ceramic substrate extends out of the conveying ring 8 by a certain distance. When the conveying ring 8 rotates to the position of the lubrication unit, the part of the ceramic substrate that extends out of the conveying ring 8 comes into contact with the bristles 13 on the fixed brush 2 and squeezes the bristles 13. As a result, the bristles 13 undergo elastic deformation. Under the action of squeezing and friction, the polishing liquid attached to the surface of the bristles 13 is evenly coated on the outer surface of the ceramic substrate, completing the lubrication and polishing liquid coating process on the surface of the ceramic substrate, and preparing for the subsequent polishing process.

[0037] Reference Figure 1 , Figure 2 and Figure 5 The polishing unit includes a positioning frame 23 fixed on the surface of the circular plate 1 and a second motor 22 fixed on the upper end of the positioning frame 23. The positioning frame 23 is a vertically arranged support structure. The bottom end of the positioning frame 23 is fixedly connected to the surface of the circular plate 1 by bolts. The height of the positioning frame 23 is designed according to the working height required by the polishing disc 11. The second motor 22 is a servo motor. The housing of the second motor 22 is fixedly connected to the upper end face of the positioning frame 23 by bolts. The output shaft of the second motor 22 is arranged vertically downward.

[0038] The output shaft of motor 22 is connected to a rotatable screw 19 via a coupling. The screw 19 is arranged vertically and is coaxial with the output shaft of motor 22. The upper end of the screw 19 is fixedly connected to the output shaft of motor 22 via a coupling, and the lower end of the screw 19 is rotatably supported on the lower bearing seat of the positioning frame 23 via a bearing, so that the screw 19 can rotate around its own axis under the drive of motor 22 without radial wobble. The outer surface of the screw 19 is machined with external threads.

[0039] A floating frame 18 is threadedly connected to the external thread of the screw 19. Specifically, the floating frame 18 is machined with an internal thread through hole that mates with the external thread of the screw 19. The screw 19 passes through the internal thread through hole on the floating frame 18. The internal thread of the internal thread through hole meshes with the external thread of the screw 19 to form a threaded pair, so that the floating frame 18 can move up and down along the axial direction of the screw 19 through the transmission action of the threaded pair.

[0040] To ensure that the floating frame 18 moves only vertically and does not rotate around the screw 19 when the screw 19 rotates, a slide rail 20 is fixedly connected to the side of the positioning frame 23 in the vertical direction. The slide rail 20 is bolted to the inside of the positioning frame 23 and extends vertically. A slider 21 is bolted to the side of the floating frame 18 near the positioning frame 23. The slider 21 is slidably connected to the slide rail 20 through a dovetail groove or linear sliding fit, allowing the slider 21 to move along the length of the slide rail 20. The floating frame 18 slides up and down, but cannot rotate around the axis of the screw 19. When the second motor 22 drives the screw 19 to rotate, the floating frame 18 cannot rotate due to the guidance and restriction of the slide rail 20 and the slider 21. Therefore, the floating frame 18 moves up and down along the axis of the screw 19 under the action of the threaded pair of the screw 19 and the internal threaded through hole, thereby changing the height of the floating frame 18. By controlling the rotation direction and number of rotations of the second motor 22, the height of the floating frame 18 can be precisely adjusted, thereby adjusting the distance between the polishing disc 11 and the ceramic substrate and the polishing pressure.

[0041] A motor 12 is bolted to the side of the floating frame 18 away from the positioning frame 23. The motor 12 is vertically arranged and its housing is fixed to the floating frame 18 by bolts. The output shaft of the motor 12 is vertically downward and is connected to a polishing disc 11 via a coupling. The polishing disc 11 is located directly below the motor 12. The center of the polishing disc 11 has a connecting hole that matches the output shaft of the motor 12. After the output shaft of the motor 12 passes through the connecting hole, it is locked by a fastening nut, so that the polishing disc 11 and the output shaft of the motor 12 rotate synchronously. The polishing disc 11 has a disc-shaped structure and the bottom surface of the polishing disc 11 is the polishing working surface. Polishing pads or sandpaper can be glued or fixed on the polishing working surface. The motor 12 drives the polishing disc 11 to rotate at high speed around its central axis.

[0042] When the conveyor ring 8 carries the ceramic substrate coated with polishing liquid to the polishing unit, the bottom surface of the high-speed rotating polishing disc 11 contacts the upper surface of the ceramic substrate, polishing the upper surface of the ceramic substrate. The rotating frame 10 continues to rotate, and the ceramic substrate starts to contact the polishing disc 11 and be polished from one end of the polishing unit. As the rotating frame 10 rotates further, the ceramic substrate gradually separates from the polishing disc 11 from the other end of the polishing unit. Throughout the polishing process, the motor 12 does not stop, ensuring that the polishing disc 11 continues to rotate, thereby ensuring that the ceramic substrate receives continuous polishing throughout its entire stroke through the polishing unit. When the rotating frame 10 drives the conveyor ring 8 to leave the polishing unit, the polishing process of the ceramic substrate is completed.

[0043] The height of the floating frame 18 can be adjusted by driving the screw 19 with motor 22. The height of the polishing disc 11 can be flexibly adjusted according to the ceramic substrate of different thicknesses and different polishing requirements to obtain the best polishing effect.

[0044] Reference Figure 1 and Figure 3 The unloading unit includes an unloading port 7 disposed on the surface of the circular plate 1. The unloading port 7 is a through hole that penetrates the circular plate 1 along the thickness direction. The diameter of the unloading port 7 is slightly larger than the outer diameter of the ceramic substrate. Specifically, the diameter is 1 mm to 3 mm larger than the outer diameter of the ceramic substrate. The unloading port 7 is located on the movement trajectory path of the conveying ring 8, so that the polished ceramic substrate can pass smoothly through the unloading port 7.

[0045] After the ceramic substrate completes the polishing process, the conveying ring 8 carries the ceramic substrate and continues to rotate with the rotating frame 10, moving to the position above the unloading port 7. When the conveying ring 8 is exactly above the unloading port 7, the ceramic substrate falls downward along the axis of the unloading port 7 from inside the conveying ring 8 due to its own gravity, and leaves the circular plate 1 through the unloading port 7, completing the unloading step. A collection box or conveyor belt can be provided below the unloading port 7 to collect or transport the polished ceramic substrate.

[0046] Reference Figure 1 , Figure 3 and Figure 4 The polishing structure of the present invention also includes a clamping unit, which is used to reliably fix the ceramic substrate during polishing to prevent displacement or vibration of the ceramic substrate during the polishing process, thereby ensuring polishing quality.

[0047] The clamping unit includes an inner groove 9 and an outer groove 3 formed on the upper surface of the circular plate 1. The inner groove 9 is an annular groove extending along the circumference of the upper surface of the circular plate 1 and is arranged near the center of the circular plate 1. The outer groove 3 is also an annular groove extending along the circumference of the upper surface of the circular plate 1 and is arranged near the edge of the circular plate 1. Both the inner groove 9 and the outer groove 3 are formed on the upper surface of the circular plate 1 and are arranged concentrically. There is a certain radial distance between the inner groove 9 and the outer groove 3. This radial distance is equal to the radial distance between the two pressure plates 16 at the bottom of the conveying ring 8, so that the two pressure plates 16 at the bottom of the conveying ring 8 can be inserted into the inner groove 9 and the outer groove 3 at the same time.

[0048] A groove 14 is provided on the side of the inner groove 9 near the polishing unit. The groove 14 is connected to the inner groove 9 in the circumferential direction. The two ends of the groove 14 are smoothly connected to the ends of the inner groove 9. Both the groove 14 and the inner groove 9 are arc-shaped structures. The arc of the groove 14 is smaller than that of the inner groove 9, that is, the radius of curvature of the groove 14 is smaller than that of the inner groove 9, so that the groove 14 is offset relative to the inner groove 9 towards the center of the circular plate 1.

[0049] A groove 15 is provided on the side of the outer groove 3 near the polishing unit, which is connected to the outer groove 3 in the circumferential direction. The two ends of the groove 15 are smoothly connected to the ends of the outer groove 3. The curvature of the groove 15 is greater than that of the outer groove 3, that is, the radius of curvature of the groove 15 is greater than that of the outer groove 3, so that the groove 15 is offset relative to the outer groove 3 towards the edge of the circular plate 1. The groove 14 corresponds to the position of the groove 15 in the circumferential direction, and both are located in the lower area of ​​the polishing unit.

[0050] Reference Figure 4 The bottom of the conveying ring 8 has a lower slot 17, which is a receiving groove at the bottom of the conveying ring 8. The lower slot 17 penetrates the bottom wall of the conveying ring 8 along its diameter. Inside the lower slot 17 are two rotatable pressure plates 16. The two pressure plates 16 are symmetrically arranged with respect to the central axis of the conveying ring 8, that is, the two pressure plates 16 are located at opposite ends of the diameter of the conveying ring 8. One pressure plate 16 is close to the center of the circular plate 1, and the other pressure plate 16 is close to the edge of the circular plate 1. The middle part of the pressure plate 16 is rotatably connected to the conveying ring 8 by a pin. Specifically, the middle part of the pressure plate 16 is machined with a pin hole, and the lower slot 17 of the conveying ring 8 is machined with a corresponding pin hole. The pin passes through the pin hole on the side wall of the conveying ring 8 and the pin hole in the middle part of the pressure plate 16, so that the pressure plate 16 can rotate relative to the conveying ring 8 around the pin. The upper end of the pressure plate 16 extends into the inner cavity of the conveying ring 8, and the lower end of the pressure plate 16 extends out of the bottom of the conveying ring 8 and downwards into the inner groove 9 or outer groove 3 on the upper surface of the circular plate 1.

[0051] The lower ends of the two pressure plates 16 are inserted into the outer groove 3 and the inner groove 9 respectively and can slide along the outer groove 3 and the inner groove 9. Specifically, the lower end of the pressure plate 16 near the center of the circular plate 1 is inserted into the inner groove 9 and can slide along the inner groove 9 as the conveying ring 8 rotates; the lower end of the pressure plate 16 near the edge of the circular plate 1 is inserted into the outer groove 3 and can slide along the outer groove 3 as the conveying ring 8 rotates.

[0052] When the conveying ring 8 is located in the loading unit, lubrication unit, and unloading unit, the lower ends of the two pressure plates 16 are located in the inner groove 9 and the outer groove 3, respectively. Since the inner groove 9 and the outer groove 3 are both standard annular arc-shaped grooves, when the conveying ring 8 moves along its circumference, the lower ends of the two pressure plates 16 slide smoothly in the inner groove 9 and the outer groove 3. At this time, the two pressure plates 16 remain vertical, and the upper ends of the two pressure plates 16 do not contact the ceramic substrate. The ceramic substrate can freely enter and exit inside the conveying ring 8 to complete the loading and unloading processes.

[0053] When the conveying ring 8 rotates and approaches the polishing unit, the lower end of the pressure plate 16 near the center of the circular plate 1 slides from the inner groove 9 into the groove 14, and the lower end of the pressure plate 16 near the edge of the circular plate 1 slides from the outer groove 3 into the protrusion 15. Since the curvature of the groove 14 is smaller than that of the inner groove 9, that is, the groove 14 is offset relative to the inner groove 9 towards the center of the circular plate 1, the lower end of the pressure plate 16 near the center of the circular plate 1 is pushed by the inner sidewall of the groove 14 and deflects towards the center of the circular plate 1. With the pin in the middle of the pressure plate 16 as the fulcrum, the upper end of the pressure plate 16 deflects in the opposite direction, that is, towards the edge of the circular plate 1. Thus, the upper end of the pressure plate 16 near the center of the circular plate 1 presses the edge of the ceramic substrate towards the center of the conveying ring 8.

[0054] Meanwhile, since the curvature of the groove 15 is greater than that of the outer groove 3, that is, the groove 15 is offset relative to the outer groove 3 towards the edge of the circular plate 1, the lower end of the pressure plate 16 near the edge of the circular plate 1 is pushed by the outer wall of the groove 15 and deflected towards the edge of the circular plate 1. With the pin in the middle of the pressure plate 16 as the fulcrum, the upper end of the pressure plate 16 deflects in the opposite direction, that is, towards the center of the circular plate 1. Thus, the upper end of the pressure plate 16 near the edge of the circular plate 1 presses the other edge of the ceramic substrate towards the center of the conveying ring 8.

[0055] The upper ends of the two pressure plates 16 press towards the center of the conveying ring 8 at the same time, clamping the ceramic substrate located inside the conveying ring 8 together. This reliably fixes the ceramic substrate during polishing, effectively preventing the ceramic substrate from rotating or shifting due to the friction of the polishing disc 11 during the polishing process, thereby ensuring the precision and quality of the polishing process.

[0056] As the conveying ring 8 continues to rotate away from the polishing unit along with the rotating frame 10, the lower end of the pressure plate 16 near the center of the circular plate 1 slides back into the inner groove 9 from the groove 14, and the lower end of the pressure plate 16 near the edge of the circular plate 1 slides back into the outer groove 3 from the protrusion 15. Guided by the side walls of the inner groove 9 and the outer groove 3, the two pressure plates 16 are reset to a vertical state, releasing the clamping of the ceramic substrate so that the ceramic substrate can fall smoothly from the inside of the conveying ring 8 at the unloading unit, completing the unloading process.

[0057] A certain number of aluminum nitride ceramic substrates to be processed are stacked and loaded into the feeding cylinder 5 through the upper opening. Polishing liquid is supplied to the fixed brush 2 through a pipe, so that the surface of the brush bristles 13 is coated with polishing liquid. The drive motor located inside the support leg 6 is started. The output shaft of the drive motor drives the rotating frame 10 to rotate through a key connection or coupling. The rotating frame 10 drives the four conveying rings 8 fixedly connected to the ends of its four support arms to pass through the feeding unit, lubrication unit, polishing unit and unloading unit in sequence. When a conveying ring 8 rotates to the bottom of the feeding cylinder 5, the conveying ring 8 pushes open the partition. 25. Spring 24 is stretched, and the bottom ceramic substrate in the feed cylinder 5 falls into the conveyor ring 8 due to gravity, completing the feeding. Then the conveyor ring 8 leaves, and the partition 25 returns to its original position under the tension of spring 24. The conveyor ring 8 continues to rotate to the lubrication unit, and the part of the ceramic substrate extending out of the conveyor ring 8 squeezes the bristles 13, so that the polishing liquid is evenly applied to the surface of the ceramic substrate. The conveyor ring 8 continues to rotate to the polishing unit. When it is about to reach the polishing unit, the lower ends of the two pressure plates 16 slide from the inner groove 9 and the outer groove 3 into the groove 14 and the protrusion 15, respectively. The two pressure plates 16 are pivoted by the central pin. As the fulcrum deflects, the upper ends of the two pressure plates 16 press and clamp the ceramic substrate towards the center of the conveying ring 8. Simultaneously, motor 12 drives the polishing disc 11 to rotate at high speed around its central axis. Motor 22 drives the screw 19 to rotate and, in conjunction with the guiding action of the slide rail 20 and slider 21, adjusts the height of the floating frame 18, so that the bottom surface of the polishing disc 11 contacts the upper surface of the ceramic substrate and applies appropriate pressure to polish the ceramic substrate. The conveying ring 8 continues to rotate and disengages from the polishing unit, and the lower ends of the two pressure plates 16 re-enter the inner groove 9 and outer groove 3. Positioned in a vertical position, the clamp on the ceramic substrate is released; the conveying ring 8 continues to rotate to the unloading unit, and the ceramic substrate falls from inside the conveying ring 8 due to gravity, leaving the circular plate 1 through the unloading port 7, completing the unloading; the conveying ring 8 continues to rotate with the rotating frame 10, returning to the loading unit position, and starting the next processing cycle. Since there are four conveying rings 8 and four processing units, during the operation of the device, the four conveying rings 8 simultaneously perform different processes at the four processing units, realizing continuous and automated polishing of aluminum nitride ceramic substrates, which greatly improves production efficiency.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A polishing structure for an aluminum nitride ceramic substrate, characterized in that, include: A circular plate (1) and multiple material conveying rings (8) that can rotate around the center of the circular plate (1) are provided on the circular plate (1). Multiple processing units are provided at the upper end of the circular plate (1). The multiple processing units include a feeding unit, a lubrication unit, a polishing unit and a unloading unit. The multiple material conveying rings (8) pass through the multiple processing units in sequence. The feeding unit includes a feeding cylinder (5) for storing ceramic substrates, which drops the ceramic substrates as the conveying ring (8) passes by; The lubrication unit includes a coating component disposed on a circular plate (1), which is used to apply polishing liquid to the surface of the ceramic substrate it passes through; The polishing unit includes a polishing disc (11) disposed on a circular plate (1) and a motor (12) for driving the polishing disc (11) to rotate. The polishing disc (11) polishes the ceramic substrate carried by the conveying ring (8). The unloading unit includes an unloading port (7) provided on the circular plate (1), which is used to allow the polished ceramic substrate to fall from the conveying ring (8); The conveyor ring (8) drives the ceramic substrate through the feeding unit, lubrication unit, polishing unit and unloading unit in sequence to realize uninterrupted processing of the ceramic substrate.

2. The polishing structure of an aluminum nitride ceramic substrate according to claim 1, characterized in that, The feeding unit also includes a bracket (4), a partition (25) and a spring (24). The feeding cylinder (5) is fixed to the surface of the circular plate (1) by the bracket (4). The middle part of the partition (25) is rotatably connected to the surface of the bracket (4). The partition (25) is set at the lower opening of the feeding cylinder (5) to block the ceramic substrate in the feeding cylinder (5) from being fed. The end of the partition (25) is connected to the bracket (4) by a spring (24). The bottom of the partition (25) has a gap from the upper surface of the circular plate (1). The conveying ring (8) can push the partition (25) to rotate relative to the bracket (4) around its rotatable connection to open the lower opening of the feeding cylinder (5) so that the ceramic substrate in the feeding cylinder (5) falls into the conveying ring (8) due to gravity.

3. The polishing structure of an aluminum nitride ceramic substrate according to claim 1, characterized in that, In the lubrication unit, the coating component includes a fixed brush (2) and bristles (13) fixed on the surface of the fixed brush (2). The fixed brush (2) is fixed on the surface of the circular plate (1). The interior of the fixed brush (2) is hollow. The bottom of the fixed brush (2) is connected to a pipe for supplying polishing liquid. The fixed brush (2) has an opening at the location of the bristles (13).

4. The polishing structure of an aluminum nitride ceramic substrate according to claim 1, characterized in that, The polishing unit includes a positioning frame (23), a second motor (22), a screw (19), a floating frame (18), a first motor (12), and a polishing disc (11). The positioning frame (23) is fixed to the surface of the circular plate (1), the second motor (22) is fixed to the upper end of the positioning frame (23), the output end of the second motor (22) is connected to a rotatable screw (19), the surface of the screw (19) is threadedly connected to the floating frame (18), the first motor (12) is fixedly connected to the surface of the floating frame (18), and the polishing disc (11) is connected to the output end of the first motor (12).

5. The polishing structure of an aluminum nitride ceramic substrate according to claim 4, characterized in that, The side of the positioning frame (23) is fixedly connected to a slide rail (20) extending in the vertical direction, and the floating frame (18) is fixedly connected to a slider (21) that slides in cooperation with the slide rail (20).

6. The polishing structure of an aluminum nitride ceramic substrate according to claim 1, characterized in that, The discharge port (7) is a through hole that penetrates the circular plate (1) along the thickness direction. The diameter of the discharge port (7) is larger than the outer diameter of the ceramic substrate. The discharge port (7) is located on the movement trajectory path of the conveying ring (8).

7. The polishing structure of an aluminum nitride ceramic substrate according to claim 1, characterized in that, It also includes a clamping unit, which includes an inner groove (9) and an outer groove (3) on the surface of the circular plate (1). The inner groove (9) has a groove (14) that communicates with the polishing unit on the side. The surface of the outer groove (3) has a protrusion (15) that communicates with the outer groove (3). The bottom of the conveying ring (8) has a lower slot (17) and a rotatable pressure plate (16) is provided in the lower slot (17).

8. The polishing structure of an aluminum nitride ceramic substrate according to claim 7, characterized in that, The curvature of the groove (14) is smaller than that of the inner groove (9), and the curvature of the convex groove (15) is larger than that of the outer groove (3). When the pressure plate (16) enters the convex groove (15) from the outer groove (3) or enters the groove (14) from the inner groove (9), the pressure plate (16) squeezes the ceramic substrate in the middle of the conveying ring (8).

9. The polishing structure of an aluminum nitride ceramic substrate according to claim 1, characterized in that, The circular plate (1) is provided with a rotatable rotating frame (10), and multiple material conveying rings (8) are connected to the rotating frame (10). The bottom of the circular plate (1) is fixedly connected with a support leg (6) for support. The inside of the support leg (6) is fixedly connected with a drive motor through a motor bracket. The output end of the drive motor is connected to the rotating frame (10) for transmission. The drive motor drives the rotating frame (10) to rotate around the central axis of the circular plate (1), thereby driving multiple material conveying rings (8) to rotate around the center of the circular plate (1).

10. The polishing structure of an aluminum nitride ceramic substrate according to claim 9, characterized in that, Four material conveying rings (8) are fixedly connected to the rotating frame (10), and the number of processing units is four. The four processing units are evenly distributed along the circumference of the circular plate (1).

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