Valve plate polishing and grinding apparatus and control method thereof

Abstract

The application is suitable for the technical field of valve plate production, and particularly relates to a valve plate polishing and grinding device and a control method thereof. The control method of the valve plate polishing and grinding device comprises the following steps: receiving a configuration instruction; based on the configuration instruction, performing a preliminary polishing operation on all current valve plates to be polished by using preliminary polishing general parameters, and synchronously collecting output batch comprehensive state data; in the case that a first measurement event and a second measurement event are both triggered, generating a current polishing target group based on the batch comprehensive state data and the estimated polishing time of each candidate polishing parameter group; matching a corresponding target polishing parameter group based on the current polishing target group; controlling the polishing and grinding device to switch to the target polishing parameter group, performing a fine polishing operation on the current polishing target group, and after the fine polishing operation is completed, repeatedly collecting valve plate polishing state data, generating a next current polishing target group, and performing a fine polishing operation until the valve plates in the polishing disc reach a target polishing precision. The parameter switching and adjustment can be reduced.

Description

Technical Field

[0001] This application belongs to the field of valve plate manufacturing technology, and in particular relates to a valve plate polishing and grinding equipment and its control method. Background Technology

[0002] As a core precision component in fluid control, pneumatic, and hydraulic equipment, the surface roughness, thickness uniformity, and defect repair effectiveness of valve plates directly affect the sealing performance, operational stability, and service life of the equipment. Therefore, the precision control requirements for valve plate polishing and grinding are extremely high. Currently, valve plate polishing and grinding equipment mostly adopts a two-stage processing mode of initial polishing + fine polishing. The initial polishing operation removes excess material and obvious defects from the valve plate surface, and then the fine polishing operation optimizes the surface accuracy to meet the target processing requirements. In existing control methods, uniform initial polishing parameters are usually configured first to process the entire batch of valve plates synchronously, and then the fine polishing parameters are adjusted based on the collected grinding status data to achieve batch polishing of valve plates.

[0003] However, in actual production, in order to save processing costs, rework pieces, valve plates from different batches, or valve plates with different specifications are often processed simultaneously in valve plate polishing and grinding equipment. Because the initial surface condition, thickness allowance, and defect distribution of valve plates vary from person to person, it is difficult to adapt to the processing needs of all valve plates using uniform fine polishing parameters. In mixed processing scenarios, polishing and grinding individual valve plates one by one in sequence contradicts the cost-saving principle. Furthermore, processing each valve plate in sequence requires frequent adjustment of equipment parameters, which not only fails to save processing time but also causes wear and tear on equipment precision and shortens the equipment's service life. Summary of the Invention

[0004] This application provides a valve plate polishing and grinding equipment and its control method, which can solve the problem of equipment precision loss and shortened equipment service life in mixed processing scenarios.

[0005] In a first aspect, embodiments of this application provide a control method for valve plate polishing and grinding equipment, including: Receive configuration instructions, wherein the configuration instructions are used to configure initial polishing general parameters, candidate polishing parameter groups, a first measurement event and its corresponding first trigger threshold, a second measurement event and its corresponding second trigger threshold, the first measurement event being related to the estimated polishing time corresponding to the candidate polishing parameter group, the second measurement event being related to the estimated polishing time corresponding to the current polishing parameters, and the estimated polishing time being used to indicate the estimated time taken to complete the target polishing accuracy for all valve plates to be polished using the corresponding parameter group; Based on the configuration instructions, the initial polishing operation is performed synchronously on all valve plates to be polished using the general parameters for initial polishing. The polishing status data of each valve plate is collected synchronously, and the batch comprehensive status data is output. The polishing status data includes at least one of the following: surface roughness difference, thickness allowance, and defect repair progress. When both the first measurement event and the second measurement event are triggered, a current grinding target group is generated based on the batch comprehensive status data and the estimated grinding time of each candidate grinding parameter group; wherein, the current grinding target group is used to reflect the target valve plate to be ground in the current stage, and there is at least one valve plate to be finely polished in the current grinding target group; Match the corresponding target grinding parameter group based on the current grinding target group; The polishing and grinding equipment is switched to the target grinding parameter group. Fine polishing operation is performed on the current grinding target group. After the fine polishing operation is completed, the grinding status data of each valve plate is collected repeatedly to generate the next current grinding target group and perform fine polishing operation until all valve plates in the grinding disc reach the target grinding accuracy.

[0006] The technical solutions described in this application embodiment have at least the following technical effects: The valve plate polishing and grinding equipment control method provided in this application first receives configuration instructions for configuring general initial polishing parameters, candidate grinding parameter groups, a first measurement event and its corresponding first trigger threshold, and a second measurement event and its corresponding second trigger threshold. The first measurement event is related to the estimated grinding time corresponding to the candidate grinding parameter group, and the second measurement event is related to the estimated grinding time corresponding to the current grinding parameters. The estimated grinding time is used to indicate the estimated time required to complete the target grinding accuracy for all valve plates to be ground using the corresponding parameter group. Then, based on the configuration instructions, the method synchronously performs initial polishing operations on all valve plates to be ground using the general initial polishing parameters, synchronously collects grinding status data for each valve plate, and outputs batch comprehensive status data. The status data includes a table... At least one of the following: surface roughness difference, thickness allowance, and defect repair progress; when both the first and second measurement events are triggered, based on the batch comprehensive status data and the estimated grinding time of each candidate grinding parameter group, a current grinding target group is generated to reflect the target valve plate to be ground in the current stage, wherein at least one valve plate to be finely polished is in the current grinding target group; then, the corresponding target grinding parameter group is matched based on the current grinding target group; finally, the polishing equipment is controlled to switch to the target grinding parameter group, and a fine polishing operation is performed on the current grinding target group. After the fine polishing operation is completed, the collection of grinding status data of each valve plate is repeated to generate the next current grinding target group and perform the fine polishing operation until all valve plates in the grinding disc reach the target grinding accuracy. This method simultaneously collects batch comprehensive status data after initial polishing and combines it with a dual measurement event triggering mechanism to accurately capture the state differences of different types of valve plates in mixed-assembly scenarios. Based on the batch comprehensive status data and candidate parameter groups, it generates polishing target groups by estimating the polishing time. Even if the target polishing precision is different, it can simultaneously perform partial polishing of valve plates with high polishing precision while polishing valve plates with low polishing precision. This not only improves the continuity of processing but also significantly reduces the frequent parameter switching and adjustment required to process individual valve plates sequentially, thereby reducing equipment precision loss and extending equipment life. Through precise matching of polishing target groups and target parameter groups and iterative fine polishing operations, it ensures that each group of valve plates can achieve the target polishing precision. By relying on the estimated polishing time to optimize the overall processing rhythm, it achieves a two-way improvement in processing precision and efficiency.

[0007] Secondly, embodiments of this application provide a valve plate polishing and grinding equipment control system, including: The receiving module is used to receive configuration instructions, wherein the configuration instructions are used to configure initial polishing general parameters, candidate polishing parameter groups, a first measurement event and its corresponding first trigger threshold, a second measurement event and its corresponding second trigger threshold, the first measurement event being related to the estimated polishing time corresponding to the candidate polishing parameter group, the second measurement event being related to the estimated polishing time corresponding to the current polishing parameters, and the estimated polishing time being used to indicate the estimated time taken to complete the target polishing accuracy for all valve plates to be polished using the corresponding parameter group; The execution acquisition module is used to simultaneously perform initial polishing operations on all valve plates to be polished based on the configuration instructions and using general initial polishing parameters, simultaneously acquire polishing status data of each valve plate, and output batch comprehensive status data; wherein, the status data includes at least one of surface roughness difference, thickness allowance, and defect repair progress; The generation module is used to generate a current grinding target group based on the batch comprehensive status data and the estimated grinding time of each candidate grinding parameter group when both the first measurement event and the second measurement event are triggered; wherein, the grinding target group is used to reflect the target valve plate to be ground in the current stage, and there is at least one valve plate to be finely polished in the grinding target group; The matching module is used to match the corresponding target grinding parameter group based on the grinding target group; The control module is used to control the polishing and grinding equipment to switch to the target grinding parameter group, perform fine polishing operation on the current grinding target group, and after the fine polishing operation is completed, repeatedly collect the grinding status data of each valve plate, generate the next current grinding target group, and perform fine polishing operation until all valve plates in the grinding disc reach the target grinding accuracy.

[0008] Thirdly, embodiments of this application provide a valve plate polishing and grinding device, wherein the valve plate polishing and grinding device performs the control method described in any one of the first aspects.

[0009] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in any one of the first aspects above.

[0010] Fifthly, embodiments of this application provide a computer program product that, when running on a valve plate polishing and grinding equipment, causes the valve plate polishing and grinding equipment to execute the valve plate polishing and grinding equipment control method described in any one of the first aspects.

[0011] It is understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic flowchart of the valve plate polishing and grinding equipment control method provided in the embodiments of this application; Figure 2 This is a schematic diagram of the control system of the valve plate polishing and grinding equipment provided in the embodiments of this application; Figure 3 This is a schematic diagram of the valve plate polishing and grinding equipment provided in the embodiments of this application; Figure 4 This is a schematic diagram of the control device of the valve plate polishing and grinding equipment provided in the embodiments of this application. Detailed Implementation

[0014] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0015] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0016] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0017] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determination" or "if the described condition or event is detected" may be interpreted, depending on the context, as "once determination," "in response to determination," "once the described condition or event is detected," or "in response to the detection of the described condition or event."

[0018] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0019] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0020] In actual production, to save processing costs, rework pieces, valve plates from different batches, or valve plates with different specifications are often processed simultaneously in valve plate polishing and grinding equipment. Because the initial surface condition, thickness allowance, and defect distribution of valve plates vary individually, it is difficult to adapt to the processing needs of all valve plates using uniform fine polishing parameters. On the other hand, polishing and grinding each valve plate sequentially contradicts the cost-saving principle. Furthermore, processing each valve plate sequentially requires frequent adjustment of equipment parameters, which not only fails to save processing time but also damages the equipment's accuracy and shortens its service life. At the same time, there is a lack of a reasonable grouping mechanism that combines the differences in the condition of multiple types of valve plates with the estimated grinding time. It is impossible to balance cost control, processing accuracy, and equipment stability in mixed processing scenarios, making it difficult to adapt to the actual needs of large-scale production.

[0021] To address the aforementioned problems, this application provides a valve plate polishing and grinding device and its control method. In this method, configuration instructions are received for configuring general initial polishing parameters, candidate grinding parameter groups, a first measurement event and its corresponding first trigger threshold, and a second measurement event and its corresponding second trigger threshold. The first measurement event is related to the estimated grinding time corresponding to the candidate grinding parameter group, and the second measurement event is related to the estimated grinding time corresponding to the current grinding parameters. The estimated grinding time indicates the estimated time required to achieve the target grinding accuracy for all valve plates to be polished using the corresponding parameter group. Then, based on the configuration instructions, initial polishing operations are synchronously performed on all valve plates to be polished using the general initial polishing parameters, and grinding status data for each valve plate is collected synchronously. The status data includes surface roughness difference, thickness allowance, and defect repair progress. At least one of the following is executed: output batch comprehensive status data; when both the first and second measurement events are triggered, based on the batch comprehensive status data and the estimated grinding time of each candidate grinding parameter group, generate a current grinding target group to reflect the target valve plate to be ground in the current stage; wherein, at least one valve plate to be finely polished is in the current grinding target group; then match the corresponding target grinding parameter group based on the current grinding target group; finally, control the polishing and grinding equipment to switch to the target grinding parameter group, perform fine polishing operation on the current grinding target group, and after the fine polishing operation is completed, repeat the process of collecting grinding status data of each valve plate, generating the next current grinding target group, and performing fine polishing operation until all valve plates in the grinding disc reach the target grinding accuracy. This method simultaneously collects batch comprehensive status data after initial polishing and combines it with a dual measurement event triggering mechanism to accurately capture the state differences of different types of valve plates in mixed-assembly scenarios. Based on the batch comprehensive status data and candidate parameter groups, it generates polishing target groups by estimating the polishing time. Even if the target polishing precision is different, it can simultaneously perform partial polishing of valve plates with high polishing precision while polishing valve plates with low polishing precision. This not only improves the continuity of processing but also significantly reduces the frequent parameter switching and adjustment required to process individual valve plates sequentially, thereby reducing equipment precision loss and extending equipment life. Through precise matching of polishing target groups and target parameter groups and iterative fine polishing operations, it ensures that each group of valve plates can achieve the target polishing precision. By relying on the estimated polishing time to optimize the overall processing rhythm, it achieves a two-way improvement in processing precision and efficiency.

[0022] To better understand the valve plate polishing and grinding equipment control method provided in the embodiments of this application, the specific implementation process of the valve plate polishing and grinding equipment control method provided in the embodiments of this application will be described by way of example below.

[0023] Figure 1 This illustration shows a schematic flowchart of a valve plate polishing and grinding equipment control method provided in an embodiment of this application. The valve plate polishing and grinding equipment control method includes: S100, receive configuration instructions, wherein the configuration instructions are used to configure the initial polishing general parameters, candidate polishing parameter groups, first measurement event and corresponding first trigger threshold, second measurement event and corresponding second trigger threshold, the first measurement event is related to the estimated polishing time corresponding to the candidate polishing parameter group, the second measurement event is related to the estimated polishing time corresponding to the current polishing parameters, and the estimated polishing time is used to indicate the estimated time taken to complete the target polishing accuracy of all valve plates to be polished using the corresponding parameter group.

[0024] It can be understood that the general parameters for initial polishing refer to the basic process parameters used to uniformly perform the initial polishing operation, typically including initial polishing speed, polishing pressure, abrasive type, and initial polishing time. Candidate polishing parameter sets refer to multiple sets of differentiated process parameter schemes pre-configured for the fine polishing stage. Each scheme corresponds to the fine polishing requirements of specific valve plates, such as low-speed, high-pressure parameters for high-roughness valve plates, and high-speed, low-pressure parameters for thin-walled valve plates. The first measurement event refers to the state judgment event used to determine whether the candidate polishing parameter set is suitable for the overall requirements of the valve plate to be processed. The second measurement event refers to the real-time state judgment event used to monitor whether the parameters are stable and whether the fine polishing start conditions are met during the current polishing process. The estimated polishing time refers to the theoretical time required from the current state to achieving the target accuracy of all valve plates to be polished when processing with the corresponding parameter set.

[0025] In one possible implementation, in step S100, the estimated grinding time is obtained based on the estimated time corresponding to at least one grinding influence parameter. The grinding influence parameters include at least one of valve plate material, thickness, initial surface roughness, defect type and defect area, and abrasive particle size. The estimated grinding time is calculated in any of the following ways: taking the minimum value of the estimated time corresponding to each grinding influence parameter as the estimated grinding time; taking the average value of the estimated time corresponding to each grinding influence parameter as the estimated grinding time; or calculating the weighted sum based on the weight ratio of each grinding influence parameter as the estimated grinding time.

[0026] It is understandable that the parameters affecting grinding refer to the core process and valve plate characteristic parameters that directly determine the difficulty, efficiency, and time of valve plate grinding. Their selection is based on the process mechanism of valve plate polishing and grinding. Each type of parameter directly affects the grinding difficulty and time: the valve plate material determines hardness and wear resistance. For example, hard alloy valve plates require longer grinding time, while ordinary steel valve plates have higher grinding efficiency; the thickness allowance is directly related to the amount to be removed. The larger the allowance, the longer the estimated time; the initial surface roughness determines the difficulty of fine polishing. High-roughness valve plates require more time to optimize surface accuracy; the type and area of ​​defects affect the grinding strategy. For example, scratches require targeted extension of local grinding time, while holes require control of grinding pressure to avoid damage; the abrasive particle size affects grinding efficiency. Coarse-grained abrasives have a fast removal speed but low precision, while fine-grained abrasives have high precision but slow speed. A balance needs to be reflected in the time calculation.

[0027] Three calculation methods are adapted to different production needs: taking the minimum value is suitable for scenarios with extremely high processing efficiency requirements and slight precision redundancy, such as batch processing of low-precision valve plates; taking the average value is suitable for most conventional mixed assembly scenarios, taking into account the versatility of efficiency and precision; weighted summation based on weight ratio refers to assigning corresponding weights according to the degree of influence of each grinding parameter on the time, and then calculating the total time through weighted calculation. This method is most suitable for complex mixed assembly scenarios. The weight of each parameter can be determined through historical processing data. For example, the material and initial roughness have the greatest impact on the time, and the weights can be set to 30% and 25%, respectively. The weights of thickness allowance, defect area, and abrasive particle size are set to 20%, 15%, and 10%, respectively, and the estimated time is obtained through weighted calculation.

[0028] This setup, through the scientific selection of influencing parameters and diverse calculation methods, achieves precise and scenario-specific adjustments to the estimated grinding time. The three calculation methods can be flexibly switched according to production needs, adapting to processing scenarios with different precision, efficiency, and cost requirements, thus enhancing the method's versatility and applicability. By using a weighted summation method based on weighted proportions, the differential impact of various factors on grinding time can be fully considered, reducing estimation deviations caused by a single parameter dominating the calculations. This is particularly suitable for scenarios involving multiple specifications and mixed rework, ensuring accurate and controllable time estimations for valve plates with different characteristics. Simultaneously, accurate time estimation reduces the problems of under-grinding (insufficient precision) or over-grinding (reduced efficiency, valve plate wear), minimizing rework costs and resource waste. In one possible implementation, in step S100, the entry and / or exit conditions of the first measurement event are related to at least one of the following parameters: the estimated grinding time of the candidate grinding parameter group, the first trigger threshold, and the first hysteresis parameter; the entry and / or exit conditions of the second measurement event are related to at least one of the following parameters: the estimated grinding time of the current grinding parameter, the second trigger threshold, and the second hysteresis parameter; the configuration instruction includes at least one of the first trigger threshold, the first hysteresis parameter, the second trigger threshold, and the second hysteresis parameter.

[0029] The first measurement event, designed for candidate grinding parameter sets, uses the synergistic effect of estimated grinding time, a first trigger threshold, and a first hysteresis parameter to determine whether these parameters are suitable for the current valve plate processing requirements. Its triggering state directly determines whether the parameter set can be used for subsequent fine polishing. The second measurement event, designed for the current grinding parameters, focuses on parameter fluctuations during real-time processing. It uses estimated grinding time, a second trigger threshold, and a second hysteresis parameter to determine if the current processing state is stable, avoiding initiating fine polishing when parameter fluctuations are large, thus preventing impact on accuracy. The first and second trigger thresholds are critical values ​​for parameter judgment and can be set based on historical processing data and target accuracy requirements. For example, the first trigger threshold can be set to ±10% of the estimated grinding time to keep the duration deviation of the candidate parameter set within an acceptable range. The first and second hysteresis parameters are buffer parameters used to buffer false triggers caused by parameter fluctuations, reducing frequent switching of measurement events due to instantaneous fluctuations and improving judgment stability. For example, the first hysteresis parameter can be set to 5 seconds, requiring a difference condition to be met for more than 5 seconds before triggering the first measurement event. The configuration instructions include the aforementioned key parameters, and the judgment criteria can be flexibly adjusted according to the characteristics of the batch of valve plates to be processed. For example, for high-precision valve plates, the trigger threshold can be tightened and the hysteresis parameter can be increased to improve the rigor of the judgment; for ordinary precision valve plates, the threshold can be relaxed to improve processing efficiency.

[0030] This design, through the correlation of dual measurement events and multiple parameters, solves the problems of single-point judgment and susceptibility to interference in the fine polishing start timing of existing technologies, significantly improving the stability and precision controllability of the processing. Compared with a single-parameter triggering mechanism, the dual judgment logic of this scheme can effectively filter out erroneous operations caused by instantaneous parameter fluctuations, avoiding fine polishing interruptions or premature starts due to brief parameter anomalies, and reducing precision deviations and efficiency losses. The configurability of the trigger threshold and hysteresis parameters allows the method to adapt to the processing needs of different precision levels and different types of valve plates, enhancing the versatility and flexibility of the scheme, without the need to redesign the judgment mechanism for specific valve plates. At the same time, by using the estimated grinding time as the core correlation indicator, a logical closed loop of time prediction - status judgment - fine polishing start is realized, ensuring that the start of the fine polishing stage meets both parameter adaptation requirements and processing stability requirements, providing pre-support for subsequent group grinding and precision assurance.

[0031] In one possible implementation, the entry condition for the first measurement event includes: the difference between the estimated grinding time of the candidate grinding parameter group and the first hysteresis parameter is greater than a first trigger threshold; the exit condition for the first measurement event includes: the sum of the estimated grinding time of the candidate grinding parameter group and the first hysteresis parameter is less than or equal to the first trigger threshold; the entry condition for the second measurement event includes: the difference between the estimated grinding time of the current grinding parameter and the second hysteresis parameter is less than a second trigger threshold; the exit condition for the second measurement event includes: the difference between the estimated grinding time of the current grinding parameter and the second hysteresis parameter is greater than or equal to the second trigger threshold.

[0032] The core function of the first measurement event is to determine whether the candidate grinding parameter set is suitable for the overall requirements of the valve plate to be processed. The entry condition for the first measurement event refers to the criterion that the candidate grinding parameter set meets the suitability requirements and can be included in the selection range of fine polishing parameters. Specifically, the difference between the estimated grinding time of the candidate grinding parameter set and the first lag parameter is greater than the first trigger threshold. The difference = estimated grinding time - first lag parameter. When this result exceeds the first trigger threshold, it means that the estimated time of the candidate parameter set can cover the current valve plate processing requirements, and the suitability baseline is still met after buffering, so the first measurement event can be triggered. The exit condition for the first measurement event refers to the criterion that the suitability of the candidate grinding parameter set disappears and needs to be excluded from the selection range. The sum of the estimated grinding time and the first lag parameter is compared with the first trigger threshold. When the sum is less than or equal to the first trigger threshold, it means that even with the addition of lag buffer, the estimated time of the candidate parameter set cannot meet the processing requirements, the suitability is completely lost, and the first measurement event terminates.

[0033] The core function of the second measurement event is to monitor the stability of the current grinding process, ensuring that fine polishing starts when parameters are stable. Similarly, quantitative logic defines the boundary between stability and instability. The entry condition for the second measurement event refers to the criteria for determining when the current grinding parameters have reached a stable state and fine polishing can begin. Specifically, the difference between the estimated grinding time and the second lag parameter must be less than the second trigger threshold. The difference = estimated grinding time - second lag parameter. When this result is less than the second trigger threshold, it indicates that the current duration fluctuation is within the allowable buffer range, the processing state is stable, and the second measurement event can be triggered. The exit condition for the second measurement event refers to the criteria for determining when the current grinding parameters fluctuate and fine polishing needs to be paused. That is, the above difference must be greater than or equal to the second trigger threshold, indicating that the duration fluctuation exceeds the buffer range, the processing state is unstable, and continuing fine polishing may lead to accuracy deviations. Therefore, the second measurement event must be terminated and fine polishing paused. Although the first and second lag parameters in all the above conditions have the same function (buffering fluctuations), their values ​​need to be adapted to the two types of measurement events respectively. The first lag parameter focuses on the stability of the candidate parameter group's adaptability judgment, while the second lag parameter focuses on the sensitivity of real-time processing status monitoring. They can be adjusted separately according to production needs.

[0034] This setup, with the first measurement event using difference-based admission and sum-based exit criteria, ensures that only candidates meeting sufficient suitability standards are included in the pool. The sum-based judgment also prevents the erroneous rejection of suitable parameter groups due to minor fluctuations, effectively improving the accuracy of candidate parameter group selection and providing a reliable foundation for subsequent fine-polishing parameter matching. This is particularly suitable for scenarios involving mixed installations of multiple valve plate specifications, accurately filtering out parameter groups with insufficient suitability and reducing accuracy issues caused by incorrect parameter selection. Secondly, the second measurement event uses a two-way difference-based definition, focusing on real-time stability monitoring of the processing status. By using a hysteresis parameter to buffer instantaneous fluctuations, it avoids frequent start-ups and shutdowns of fine-polishing due to brief parameter drift, reducing equipment wear and processing interruptions.

[0035] S200, based on configuration instructions, uses general initial polishing parameters to simultaneously perform initial polishing operations on all valve plates to be polished, synchronously collects polishing status data of each valve plate, and outputs batch comprehensive status data; among which, the polishing status data includes at least one of surface roughness difference, thickness allowance, and defect repair progress.

[0036] It is understandable that grinding status data refers to quantitative data used to characterize the surface and dimensional characteristics of valve plates after initial polishing, which can be acquired and collected through visual defect detectors and other imaging equipment. Surface roughness difference refers to the difference between the actual surface roughness and the target surface roughness of the valve plate after initial polishing, reflecting the gap between the initial polishing and the target roughness; thickness allowance refers to the difference between the actual thickness and the target thickness of the valve plate after initial polishing, reflecting the remaining removal amount; defect repair progress refers to the degree of improvement of the original defects of the valve plate after initial polishing, reflecting the effect of initial polishing on the original defects, such as whether scratches are completely removed and whether holes are reduced to an acceptable range. Batch comprehensive status data refers to a structured data set formed after standardizing and classifying the grinding status data of all valve plates to be processed. Through data standardization (such as dimensionless processing and outlier removal) and classification statistics (such as classification by valve plate type and defect level), the various status indicators of each valve plate and the overall batch distribution characteristics are clearly defined.

[0037] S300, when both the first and second measurement events are triggered, the current grinding target group is generated based on the batch comprehensive status data and the estimated grinding time of each candidate grinding parameter group; wherein, the current grinding target group is used to reflect the target valve plate to be ground in the current stage, and there is at least one valve plate to be finely polished in the current grinding target group.

[0038] It is understandable that the triggering of the first measurement event indicates that the candidate grinding parameter group is generally compatible with the valve plate to be processed, and the estimated grinding time meets the processing requirements; the triggering of the second measurement event indicates that the current post-initial polishing processing status is stable, with no parameter fluctuations or abnormal interference, providing a stable environment for group grinding. The core function of the current grinding target group is to clarify the specific object of the current single fine polishing, and the valve plates within the group have the current fine polishing parameter requirements and can be adapted to the same set of candidate grinding parameter groups. For example, multiple grinding feature convergence groups can be generated based on batch comprehensive status data, and then the time adaptation degree of each grinding feature convergence group can be calculated based on the estimated grinding time of each candidate grinding parameter group. Finally, the current grinding target group can be generated based on the time adaptation degree; alternatively, valve plates with similar states can be directly selected based on batch comprehensive status data, and the adaptation degree of this part of the valve plates with the corresponding parameter group can be judged by combining the estimated grinding time of each candidate grinding parameter group. The set of valve plates with the highest adaptation degree and the quantity that meets the single processing range of the equipment can be directly selected as the current grinding target group, and so on, but not limited to these.

[0039] In one possible implementation, in step S300, based on the batch comprehensive status data and the estimated polishing time of each candidate polishing parameter group, a current polishing target group is generated, including: S310 generates multiple converging groups of polishing features based on batch comprehensive status data.

[0040] It can be understood that a grinding feature convergence group refers to a sub-batch of valve plates whose post-polishing state indicators and grinding requirements are relatively similar. For example, based on the batch's comprehensive state data, the feature span of the grinding requirements for each valve plate can be calculated, and then multiple grinding feature convergence groups can be generated based on the feature span. Alternatively, a coarse classification can be performed based on the classification attributes in the batch's comprehensive state data, such as dividing the entire batch of valve plates into several major categories according to valve plate material (hard alloy, ordinary steel), specifications (5mm, 8mm thickness), and defect type (scratches, holes). Then, within each major category, fine-tuning and screening can be performed based on refined state indicators such as surface roughness difference and thickness allowance, eliminating individuals in the major category with abnormal states or excessive differences from similar valve plates, and aggregating the remaining valve plates with similar states into grinding feature convergence groups, and so on, but not limited to these methods.

[0041] In one possible implementation, in step S310, based on the batch comprehensive status data, multiple polishing feature convergence groups are generated, including: S311, based on batch comprehensive status data, calculate the feature span of each valve plate's grinding requirements; whereby the feature span is used to reflect the degree of difference between the initial features of the valve plate and the features of the target grinding accuracy.

[0042] It can be understood that feature span refers to an index used to quantify the degree of difference between the initial features of a valve disc after initial polishing and the target polishing features. Its calculation needs to revolve around the post-polishing state indicators and target accuracy requirements, covering core dimensions such as surface roughness, thickness, and defects. After calculating the span for each dimension separately, a comprehensive feature span can be formed by weighted fusion, or a specific span can be calculated for a single key dimension. Taking the calculation of comprehensive feature span as an example, firstly, the target values ​​for each dimension are defined (e.g., target surface roughness Ra≤0.8μm, target thickness 5mm), then the difference between the actual value and the target value after initial polishing of each valve disc is calculated, and the comprehensive feature span value is calculated by combining the weights of each dimension (e.g., roughness weight 40%, thickness weight 30%, defect weight 30%). Among them, the span calculation of the defect dimension requires first quantifying the defect type and area, such as scoring 1 point for every 1mm increase in scratch length and 1 point for every 0.5mm² increase in hole area, and then calculating the difference between the actual defect score and the target defect score (usually 0 points), which is used as the defect dimension span. The larger the feature span value, the greater the gap between the initial state of the valve plate and the target requirement, and the higher the difficulty and time required for fine polishing; the smaller the span value, the smaller the gap, and the simpler the fine polishing requirement.

[0043] S312 generates multiple converging polishing feature groups based on feature span.

[0044] For example, the feature spans can be sorted to obtain a feature span sequence. Then, the span difference between two adjacent feature spans in the feature span sequence is calculated. Finally, using the smallest feature span as a benchmark, valves with span differences less than a preset threshold are grouped into a set to generate multiple polishing feature convergence groups. Alternatively, the feature span values ​​of all valves can be used as the core data dimension and imported into a preset clustering model. The clustering algorithm refers to an algorithm that automatically aggregates data into several categories based on data similarity (such as K-means clustering or hierarchical clustering). The algorithm automatically calculates the similarity between the feature spans of each valve and aggregates valves with high similarity into the same cluster. During the clustering process, the optimal number of clusters, i.e., the number of polishing feature convergence groups, can be determined using methods such as the elbow rule and silhouette coefficient to avoid efficiency reduction due to too many groups or excessive intra-group differences due to too few groups. At the same time, cluster centers need to be set (referring to the mean point of the feature span within each cluster, serving as the representative of the features within the group). Through iterative optimization, the distance from each valve to the corresponding cluster center is minimized to ensure high convergence of features within the group. After grouping, outlier detection needs to be performed on each cluster to remove those that deviate too far from the cluster center or have abnormal feature spans (they should be grouped separately or the feature spans should be recalculated). Finally, the optimized clusters are used as feature convergence groups, and so on, but not limited to these.

[0045] This setup, by quantifying the difference between the initial features of the valve disc and the target grinding precision through feature span, provides a precise quantitative basis for generating grinding feature convergence groups. This ensures that the differences in key indicators such as surface roughness difference, thickness allowance, and defect repair progress among valve discs within a group are controllable. Consequently, each group of valve discs has convergent fine polishing requirements and can be adapted to the same set of candidate grinding parameters, significantly reducing the frequency of parameter switching during fine polishing and balancing batch processing efficiency with precise grinding effects. At the same time, it can accurately adapt to complex mixed assembly scenarios with multiple specifications and a mix of return workpieces, breaking down heterogeneous batches into homogeneous sub-batches, laying a solid foundation for subsequent duration adaptation calculations and precise parameter matching.

[0046] In one possible implementation, in step S312, multiple polishing feature convergence groups are generated based on the feature span, including: S3121, sort the feature spans to obtain the feature span sequence.

[0047] It is understandable that the sorting direction can be chosen from small to large or from large to small. The core purpose is to arrange the scattered feature spans in order of their degree of difference, so that the grinding requirements of the valve plates can form an ordered sequence from simple to complex (or vice versa). During the sorting process, the unique identifier of each valve plate (such as number and position information) must be retained.

[0048] S3122, calculate the span difference between two adjacent characteristic spans in the characteristic span sequence.

[0049] It can be understood that the span difference specifically refers to the difference in the feature span values ​​between two adjacent valve plates in the feature span sequence. The span difference = the feature span of the next valve plate - the feature span of the previous valve plate (when the sorting direction is from smallest to largest). The magnitude of the span difference directly reflects the degree of fit between the grinding requirements of adjacent valve plates: the smaller the span difference, the closer the initial characteristics and target accuracy of the two valve plates are, and the more similar their grinding requirements (time, pressure, etc.); the larger the span difference, the more significant the difference between their requirements.

[0050] S3123, using the maximum feature span as a benchmark, takes the corresponding valve plates with span differences less than a preset threshold as a set to generate multiple grinding feature convergence groups.

[0051] The choice of the maximum feature span as the grouping benchmark is understandable because the valve plate grinding requirements corresponding to the maximum feature span are the most complex (the initial state differs most from the target accuracy, requiring a longer grinding time). Grouping based on this starting point prioritizes aggregating valve plates with complex requirements and high parameter adaptation difficulty, and then gradually generates grinding feature convergence groups with different grinding requirements. The preset threshold is a pre-set value, which is generated based on the appropriate parameter range adjusted by the valve plate polishing equipment each time, to generate the critical parameter value for gradual optimization of the valve plate during the grinding process.

[0052] This setup, based on the maximum feature span, prioritizes the aggregation of valve plates with the most complex grinding requirements. This facilitates centralized adjustment of adaptability parameters, reduces frequent parameter switching and accuracy deviations caused by the dispersed processing of complex valve plates, and ensures that the grinding requirements of valve plates within the group are highly similar through quantitative judgment of span difference and preset threshold. This allows for stable adaptation to the same set of candidate grinding parameters, balancing accuracy and batch processing efficiency.

[0053] S320 calculates the duration fit of each grinding feature convergence group based on the estimated grinding time of each candidate grinding parameter group.

[0054] It can be understood that duration fit refers to an indicator used to quantify the degree of fit between the estimated grinding time of candidate grinding parameter groups and the grinding requirements of grinding feature convergence groups. For example, based on the estimated grinding time of each candidate grinding parameter group, the duration sufficiency coefficient and the fit redundancy coefficient of each grinding feature convergence group can be calculated, and then the two coefficients can be weighted and fused to obtain the duration fit of the corresponding grinding feature convergence group; alternatively, based on the feature span distribution of grinding feature convergence groups, the feature span interval of the group can be determined (referring to the numerical range formed by the minimum and maximum feature spans within the group, which intuitively reflects the overall range of valve plate grinding requirements within the group), and then converted into the required benchmark duration interval (referring to the theoretical duration range covering all valve plates within the feature span interval to achieve the target accuracy). Subsequently, the estimated grinding time of each candidate grinding parameter group is matched with the benchmark time interval, and the interval coverage (referring to the proportion of the estimated grinding time falling into the benchmark time interval, or the proportion of the number of valve plates that can be covered in the interval) and the time deviation rate (referring to the proportion of the difference between the estimated grinding time and the median of the benchmark time interval) are calculated. The two indicators are then summed after being converted according to fixed weights (such as the interval coverage accounting for 60% and the time deviation rate accounting for 40%) to obtain the final time fit, and so on, but not limited to this.

[0055] In one possible implementation, in step S320, the duration fit of each grinding feature convergence group is calculated based on the estimated grinding time of each candidate grinding parameter group, including: S321, based on the estimated grinding time of each candidate grinding parameter group, calculate the time sufficiency coefficient and the adaptation redundancy coefficient for each grinding feature convergence group; wherein, the time sufficiency coefficient is related to the estimated grinding time and the maximum feature span within the group, and the adaptation redundancy coefficient is related to the estimated grinding time and the average span difference within the group.

[0056] The time sufficiency coefficient is understood to be the ratio of the estimated grinding time of the candidate grinding parameter group to the theoretical time required for the largest feature span within the group. The mean span difference refers to the average span difference of all adjacent valve plates within the group where the grinding feature converges. It directly reflects the uniformity of valve plate grinding requirements within the group; a smaller mean indicates more uniform requirements within the group, while a larger mean indicates more dispersed requirements. The adaptation redundancy coefficient is the ratio of the estimated grinding time to the theoretical time corresponding to the average feature span within the group.

[0057] S322, weighted fusion of the two coefficients, to obtain the duration fit of the corresponding polishing feature convergence group.

[0058] It can be understood that the duration fit degree = duration sufficiency coefficient × duration weight + fit redundancy coefficient × fit weight. The weights of these two coefficients can be manually entered, obtained from the valve plate database, etc., but are not limited to these methods. The valve plate database refers to a database containing duration weights and fit weights. This data can be obtained through laboratory experiments, field measurements and monitoring, and past experience. After acquisition, the collected data is organized, classified, and archived, useful information and patterns are extracted, and the relevant data is then saved into the database to form the valve plate database.

[0059] This setting links the duration sufficiency coefficient to the maximum feature span within the group, accurately pinpointing the precision requirements of the most difficult-to-process valve plate within the group. It also links the redundancy coefficient to the average span difference, breaking through the limitation of only focusing on average requirements and fully considering the consistency of valve plate requirements within the group.

[0060] S330 generates the current polishing target group based on duration adaptation.

[0061] For example, a pre-selection set can be formed by groups of grinding features with similar durations that have a difference of less than a preset difference. Then, valve plates that are within the current single processing range in the pre-selection set can be selected to generate the current grinding target group. Alternatively, all grinding feature similarity groups can be sorted from high to low durations and the single group with the highest duration can be selected as the current grinding target group, and so on, but not limited to these.

[0062] This setup breaks down heterogeneous batches based on comprehensive batch status data, generating multiple converging grinding feature groups to ensure high uniformity in grinding requirements for valve plates within each group. Then, by measuring the matching degree between candidate grinding parameter groups and each converging group through duration adaptation, the estimated grinding time is correlated with the valve plate requirements within the group. Finally, the current grinding target group is generated based on the adaptation degree, prioritizing the processing object with the best adaptation, taking into account both the equipment's single-time processing capacity and processing accuracy, and reducing parameter switching frequency and ineffective energy consumption.

[0063] In one possible implementation, in step S330, the current polishing target group is generated based on the duration adaptation, including: S331, group the polishing features that converge to a preselected set if the difference in duration adaptation is less than a preset difference.

[0064] It can be understood that the pre-selected set specifically refers to the set formed by aggregating grinding feature convergence groups whose duration adaptation difference is less than a preset difference. The preset difference is a pre-set difference, which can be manually input, obtained from the valve plate database, etc., but is not limited to these methods.

[0065] S332, filter out valve plates in the pre-selected set that are within the range of the current single processing parameters, and generate the current grinding target group.

[0066] It is understandable that the current single-processing parameter range refers to the range of polishable precision that the valve plate can achieve from the first precision to the second precision under the current polishing parameters. This range is determined by the process capability of the current polishing parameters, such as the roughness optimization range and thickness control precision range that the abrasive can achieve under a specific combination of rotation speed and pressure.

[0067] This setup, combined with the flexible and adjustable preset difference, allows the construction of the pre-selection set to adapt to the parameter acquisition needs of different production scenarios, enhancing the versatility of the solution. By filtering out valve plates within the current single-processing parameter range from the pre-selection set, the current grinding target group is generated to identify the valve plates suitable for grinding at the current stage and under the current grinding parameters, thereby reducing the frequency of equipment parameter adjustments.

[0068] S400 matches the corresponding target grinding parameter group based on the current grinding target group.

[0069] It can be understood that the target grinding parameter set refers to a set of process parameters selected from the preset candidate grinding parameter sets that has the highest adaptability to the current grinding target set in terms of duration and meets its accuracy requirements and processing characteristics. It can be obtained by matching the characteristics of the valve plates in the current grinding target set (such as the maximum feature span within the set and the accuracy improvement range) in the valve plate database.

[0070] S500 controls the polishing and grinding equipment to switch to the target grinding parameter group, performs fine polishing operation on the current grinding target group, and after the fine polishing operation is completed, repeatedly collects the grinding status data of each valve plate, generates the next current grinding target group, and performs fine polishing operation until all valve plates in the grinding disc reach the target grinding accuracy.

[0071] It is understandable that after receiving the target grinding parameter group instruction, the system automatically switches to the corresponding parameter configuration (such as rotation speed, pressure, abrasive compatibility parameters, etc.) and performs fine polishing operation on the valve plates of the current grinding target group. During the fine polishing process, the processing status is monitored simultaneously. After the fine polishing of the current group is completed, the grinding status data of all valve plates (including finely polished and unpolished valve plates) in the grinding disc needs to be collected again, the batch comprehensive status data is updated, valve plates that have reached the target grinding accuracy are removed, and the process of "S300 generate the next current grinding target group - S400 match parameter group - S500 fine polishing" is repeated for valve plates that have not met the standard.

[0072] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0073] Corresponding to the valve plate polishing and grinding equipment control method described in the above embodiments, this application also provides a valve plate polishing and grinding equipment control system, the various modules of which can realize the various steps of the valve plate polishing and grinding equipment control method. Figure 2 The diagram shows a structural block diagram of the valve plate polishing and grinding equipment control system provided in the embodiments of this application. For ease of explanation, only the parts related to the embodiments of this application are shown.

[0074] Reference Figure 2 The control system of the valve plate polishing and grinding equipment includes: The receiving module is used to receive configuration instructions, which are used to configure the initial polishing general parameters, candidate grinding parameter groups, first measurement event and corresponding first trigger threshold, second measurement event and corresponding second trigger threshold. The first measurement event is related to the estimated grinding time corresponding to the candidate grinding parameter group, and the second measurement event is related to the estimated grinding time corresponding to the current grinding parameters. The estimated grinding time is used to indicate the estimated time to complete the target grinding accuracy of all valve plates to be ground using the corresponding parameter group.

[0075] The execution acquisition module is used to perform initial polishing operations on all valve plates to be polished simultaneously based on configuration instructions and using general initial polishing parameters, and to collect polishing status data of each valve plate simultaneously, and output batch comprehensive status data; wherein, the status data includes at least one of surface roughness difference, thickness allowance, and defect repair progress.

[0076] The generation module is used to generate the current grinding target group based on the batch comprehensive status data and the estimated grinding time of each candidate grinding parameter group when both the first measurement event and the second measurement event are triggered. The grinding target group is used to reflect the target valve plate to be ground in the current stage, and there is at least one valve plate to be finely polished in the grinding target group.

[0077] The matching module is used to match the corresponding target grinding parameter group based on the grinding target group.

[0078] The control module is used to control the polishing and grinding equipment to switch to the target grinding parameter group, perform fine polishing operation on the current grinding target group, and after the fine polishing operation is completed, repeatedly collect the grinding status data of each valve plate, generate the next current grinding target group, and perform fine polishing operation until all valve plates in the grinding disc reach the target grinding accuracy.

[0079] It should be noted that the information interaction and execution process between the above modules are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, which will not be repeated here.

[0080] Those skilled in the art will understand that, for the sake of convenience and brevity, the above-described module division is merely an example. In practical applications, the above functions can be assigned to different modules as needed, that is, the internal structure of the system can be divided into different modules to complete all or part of the functions described above. The modules in the embodiments can be integrated into one processing unit, or each module can exist physically separately, or two or more modules can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0081] This application embodiment also provides a valve plate polishing and grinding device 100, please refer to [link / reference]. Figure 3 The valve plate polishing and grinding device 100 includes a grinding disc 10, a grinding wheel 20, a robotic arm 30, and a control device 6. The grinding disc 10 is used to place multiple valve plates. The grinding wheel 20 is divided into two rotating grinding wheels, located on the upper and lower sides of the grinding disc 10, respectively, for grinding the valve plates in the grinding disc 10. The output end of the robotic arm 30 is connected to the grinding wheel 20 and is used to control the grinding wheel 20 to move closer to or further away from the grinding disc 10, so as to control the grinding pressure of the grinding wheel 20 on the valve plates. The control device 6 is electrically connected to the grinding disc 10, the grinding wheel 20, and the robotic arm 30. Figure 4 This is a schematic diagram of the structure of a control device 6 provided in an embodiment of this application. Figure 4 As shown, the control device 6 in this embodiment includes: at least one processor 60 ( Figure 4 Only one is shown in the image), at least one memory 61 ( Figure 4(Only one is shown in the image) and a computer program 62 stored in the at least one memory 61 and executable on the at least one processor 60. When the processor 60 executes the computer program 62, it causes the control device 6 to perform the steps in any of the above-described valve plate polishing and grinding equipment control method embodiments, or causes the control device 6 to perform the functions of each module in the above-described system embodiments.

[0082] For example, the computer program 62 may be divided into one or more modules / units, which are stored in the memory 61 and executed by the processor 60 to complete this application. The one or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program 62 in the control device 6.

[0083] The control device 6 can be a computing device such as a PLC or industrial computer. The control device 6 may include, but is not limited to, a processor 60 and a memory 61. Those skilled in the art will understand that... Figure 4 This is merely an example of control device 6 and does not constitute a limitation on control device 6. It may include more or fewer components than shown, or combine certain components, or different components, such as input / output devices, network access devices, buses, etc.

[0084] The processor 60 can be a Central Processing Unit (CPU), or it can be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0085] In some embodiments, the memory 61 may be an internal storage unit of the control device 6, such as a hard disk or memory of the control device 6. In other embodiments, the memory 61 may be an external storage device of the control device 6, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the control device 6. Furthermore, the memory 61 may include both internal storage units and external storage devices of the control device 6. The memory 61 is used to store operating systems, applications, bootloaders, data, and other programs, such as the program code of computer programs. The memory 61 can also be used to temporarily store data that has been output or will be output.

[0086] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0087] This application provides a computer program product that, when run on a valve plate polishing and grinding equipment, enables the valve plate polishing and grinding equipment to perform the steps described in any of the above method embodiments.

[0088] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or some intermediate form. The computer-readable medium can include at least: any entity or device capable of carrying the computer program code to the valve plate polishing and grinding equipment, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium, such as a USB flash drive, a portable hard drive, a magnetic disk, or an optical disk.

[0089] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0090] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0091] In the embodiments provided in this application, it should be understood that the disclosed valve plate polishing and grinding equipment and control system can be implemented in other ways. For example, the valve plate polishing and grinding equipment control system embodiments described above are merely illustrative. For instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or modules, and may be electrical, mechanical, or other forms.

[0092] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0093] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A control method for valve plate polishing and grinding equipment, characterized in that, include: Receive configuration instructions, wherein the configuration instructions are used to configure initial polishing general parameters, candidate polishing parameter groups, a first measurement event and its corresponding first trigger threshold, a second measurement event and its corresponding second trigger threshold, the first measurement event being related to the estimated polishing time corresponding to the candidate polishing parameter group, the second measurement event being related to the estimated polishing time corresponding to the current polishing parameters, and the estimated polishing time being used to indicate the estimated time taken to complete the target polishing accuracy for all valve plates to be polished using the corresponding parameter group; Based on the configuration instructions, the initial polishing operation is performed synchronously on all valve plates to be polished using the general parameters for initial polishing. The polishing status data of each valve plate is collected synchronously, and the batch comprehensive status data is output. The polishing status data includes at least one of the following: surface roughness difference, thickness allowance, and defect repair progress. When both the first measurement event and the second measurement event are triggered, a current grinding target group is generated based on the batch comprehensive status data and the estimated grinding time of each candidate grinding parameter group; wherein, the current grinding target group is used to reflect the target valve plate to be ground in the current stage, and there is at least one valve plate to be finely polished in the current grinding target group; Match the corresponding target grinding parameter group based on the current grinding target group; The polishing and grinding equipment is switched to the target grinding parameter group. Fine polishing operation is performed on the current grinding target group. After the fine polishing operation is completed, the grinding status data of each valve plate is collected repeatedly to generate the next current grinding target group and perform fine polishing operation until all valve plates in the grinding disc reach the target grinding accuracy.

2. The control method for valve plate polishing and grinding equipment as described in claim 1, characterized in that, The entry and / or exit conditions of the first measurement event are related to at least one of the following parameters: the estimated polishing time of the candidate polishing parameter group, the first trigger threshold, and the first hysteresis parameter; the entry and / or exit conditions of the second measurement event are related to at least one of the following parameters: the estimated polishing time of the current polishing parameter, the second trigger threshold, and the second hysteresis parameter; the configuration instruction includes at least one of the first trigger threshold, the first hysteresis parameter, the second trigger threshold, and the second hysteresis parameter.

3. The control method for valve plate polishing and grinding equipment as described in claim 2, characterized in that, The entry condition for the first measurement event includes: the difference between the estimated polishing time of the candidate polishing parameter group and the first hysteresis parameter is greater than the first trigger threshold; the exit condition for the first measurement event includes: the sum of the estimated polishing time of the candidate polishing parameter group and the first hysteresis parameter is less than or equal to the first trigger threshold; the entry condition for the second measurement event includes: the difference between the estimated polishing time of the current polishing parameter and the second hysteresis parameter is less than the second trigger threshold; the exit condition for the second measurement event includes: the difference between the estimated polishing time of the current polishing parameter and the second hysteresis parameter is greater than or equal to the second trigger threshold.

4. The control method for valve plate polishing and grinding equipment as described in claim 1, characterized in that, The step of generating the current polishing target group based on the batch comprehensive status data and the estimated polishing time of each candidate polishing parameter group includes: Based on the batch comprehensive status data, multiple polishing feature convergence groups are generated; Calculate the duration fit of each of the converging grinding feature groups based on the estimated grinding time of each of the candidate grinding parameter groups. Based on the duration adaptation, the current polishing target group is generated.

5. The control method for valve plate polishing and grinding equipment as described in claim 4, characterized in that, Based on the batch comprehensive status data, multiple polishing feature convergence groups are generated, including: Based on the batch comprehensive status data, the characteristic span of the grinding requirements for each valve plate is calculated; wherein, the characteristic span is used to reflect the degree of difference between the initial characteristics of the valve plate and the characteristics of the target grinding accuracy. Based on the aforementioned feature span, multiple polishing feature convergence groups are generated.

6. The control method for valve plate polishing and grinding equipment as described in claim 5, characterized in that, Based on the feature span, multiple polishing feature convergence groups are generated, including: The feature spans are sorted to obtain a feature span sequence; Calculate the span difference between two adjacent characteristic spans in the characteristic span sequence; Using the maximum feature span as a benchmark, valve plates with span differences less than a preset threshold are grouped together to generate multiple grinding feature convergence groups.

7. The control method for valve plate polishing and grinding equipment as described in claim 4, characterized in that, The calculation of the duration fit of each of the converging grinding feature groups based on the estimated grinding time of each of the candidate grinding parameter groups includes: Based on the estimated polishing time of each of the candidate polishing parameter groups, calculate the time sufficiency coefficient and the adaptation redundancy coefficient for each polishing feature convergence group; wherein, the time sufficiency coefficient is associated with the estimated polishing time and the maximum feature span within the group, and the adaptation redundancy coefficient is associated with the estimated polishing time and the average span difference within the group. The two coefficients are weighted and fused to obtain the duration fit degree corresponding to the grinding feature convergence group.

8. The control method for valve plate polishing and grinding equipment as described in claim 4, characterized in that, The step of generating the current polishing target group based on the duration adaptation includes: The polishing features that converge to a preselected set are those whose difference in duration adaptation is less than a preset difference. Select valve plates from the pre-selected set that are within the range of the current single processing parameters to generate the current grinding target group.

9. The control method for valve plate polishing and grinding equipment as described in claim 1, characterized in that, The estimated grinding time is obtained based on the estimated time corresponding to at least one grinding influencing parameter. The grinding influencing parameters include at least one of the following: valve plate material, thickness, initial surface roughness, defect type and defect area, and abrasive particle size. The estimated grinding time is calculated in any of the following ways: The minimum value of the estimated time corresponding to each grinding influencing parameter is taken as the estimated grinding time. The average value of the estimated time corresponding to each grinding influencing parameter is taken as the estimated grinding time. Based on the weighting of each grinding-influencing parameter, a weighted summation is calculated as the estimated grinding time.

10. A valve plate polishing and grinding device, characterized in that, The valve plate polishing and grinding equipment performs the control method as described in any one of claims 1 to 9.

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