An apparatus for manufacturing a semiconductor chip

Abstract

The application provides a kind of preparation device of semiconductor chip, belongs to the technical field of semiconductor processing equipment, including, cutting components, including bottom plate, the top of bottom plate is equipped with push component, two clamping components are symmetrically installed on push component, controller is installed on the outside of cutting assembly;Support components, including support components installed on the clamping component close to the right end of bottom plate, support components are located inside the clamping component.The application is through the oblique groove of the oblique groove opened in the annular array on the annular seat and the sliding block and driving rod cooperation structure of sliding connection in the sliding groove, when the oblique groove drives driving rod to move along the radial direction of sliding block, multiple clamping blocks are simultaneously centripetal or centrifugal motion, the effect that different diameter specifications of single crystal silicon ingot are adaptively clamped and fixed, without replacing fixture, can be quickly changed, effectively improves the cutting efficiency.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing equipment technology, and specifically relates to a semiconductor chip fabrication apparatus. Background Technology

[0002] In recent years, as chip manufacturing processes have continued to evolve towards smaller linewidths and chip structures have progressed from two-dimensional planar to three-dimensional stacking, the requirements for processing precision in semiconductor chip fabrication processes have been increasing. As a crucial process connecting front-end wafer manufacturing and back-end packaging, dicing technology has gradually evolved from traditional mechanical blade cutting to non-contact processing methods such as laser stealth dicing and plasma dicing to adapt to the processing needs of thinner, larger wafers and hard, brittle materials such as silicon carbide. Simultaneously, leading companies in manufacturing and packaging / testing have begun to extend their reach into upstream equipment, driving the iteration of dicing equipment from single-function to high-precision, low-damage, and automated processes. Overall, semiconductor chip fabrication equipment is developing towards higher dicing precision, stronger material adaptability, and superior processing efficiency.

[0003] In the semiconductor chip manufacturing process, single-crystal silicon ingots need to undergo a dicing process to form wafers for subsequent processing. Existing dicing equipment's clamping mechanisms are typically only compatible with single-crystal silicon ingots of a single diameter. When the diameter of the silicon ingot to be diced changes, it is necessary to replace the clamps with those of the appropriate size or to perform cumbersome manual adjustments, which is time-consuming and affects dicing efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor chip fabrication apparatus that addresses the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A semiconductor chip fabrication apparatus includes a dicing component, comprising a base plate, a pushing assembly mounted on the top of the base plate, two clamping assemblies symmetrically mounted on the pushing assembly, a rolling assembly mounted on the clamping assembly near the left end of the base plate, a driving assembly mounted between the two clamping assemblies, a conveying assembly mounted on the outside of the clamping assembly near the left end of the base plate, a dicing component fixedly connected to the top of the base plate, and a controller mounted on the outside of the dicing component. The support component includes a support assembly mounted on a clamping assembly near the right end of the base plate, the support assembly being located inside the clamping assembly.

[0006] In a preferred embodiment of the present invention, the pushing assembly includes a first motor, two support plates, and slide rails. Two slide rails are symmetrically fixedly connected to the top of the base plate, and two support plates are installed on the top of the base plate. The support plate near the right end of the base plate is slidably connected to the outside of the two slide rails, and the support plate near the left end of the base plate is fixedly connected to the top of the base plate. A lead screw is rotatably connected to the right end face of the support plate near the left end of the base plate, and the support plate near the right end of the base plate is threaded onto the outside of the lead screw. A first motor for driving the lead screw to rotate is fixedly connected to the outside of the base plate.

[0007] In a preferred embodiment of the present invention, the clamping assembly includes a vertical plate fixedly connected to the top of a support plate. A fixing hole is formed on the vertical plate, and an annular seat is rotatably connected inside the fixing hole. A toothed ring is rotatably connected to the inner surface of the vertical plate, and the toothed ring is fixedly connected to the outer wall of the annular seat. Multiple sliding grooves are arranged in a circular array on the inner surface of the vertical plate, and a slider is slidably connected inside each of the sliding grooves. Multiple oblique grooves are arranged in a circular array on the annular seat, and a drive rod is installed inside each of the oblique grooves. One end of the drive rod is fixedly connected to the surface of the slider, and the other end of the drive rod is fixedly connected to a connecting plate. A clamping block is fixedly connected to the end of the connecting plate away from the drive rod.

[0008] As a preferred embodiment of the present invention, an annular groove 1 is provided on the outer side of the annular seat, and an annular block 1 is rotatably connected inside the annular groove 1. The annular block 1 is fixedly connected to the inner wall of the fixing hole. An annular groove 2 is provided on the inner surface of the upright plate, and an annular block 2 is rotatably connected inside the annular groove 2. The annular block 2 is fixedly connected to the toothed ring.

[0009] As a preferred embodiment of the present invention, the rolling assembly includes a groove, and a groove is provided on a clamping block near the left end of the base plate, and a roller is rotatably connected inside the groove.

[0010] In a preferred embodiment of the present invention, the driving assembly includes a through hole, a rotating shaft, a fixed plate, and a main gear. Through holes are provided on both upright plates, and main gears are rotatably connected to opposite sides of both upright plates. Hexagonal prisms are rotatably connected inside the two through holes, and both main gears are slidably sleeved on the outer sides of the hexagonal prisms. A rotating shaft is rotatably connected to the outer side of the upright plate near the right end of the base plate. The rotating shaft is fixedly connected to the hexagonal prism, and a worm gear is fixedly connected to the outer side of the rotating shaft. Two fixed plates are fixedly connected to the outer side of the upright plate near the right end of the base plate, and a worm is rotatably connected between the two fixed plates. A second motor for driving the worm to rotate is fixedly connected to the outer side of the fixed plate away from the base plate. The main gear is meshed with a ring gear, and the worm is meshed with a worm wheel.

[0011] As a preferred embodiment of the present invention, the conveying assembly includes a conveyor belt and a guide block. The conveyor belt is fixedly connected to the outer side of the upright plate near the left end of the base plate, and the guide block is fixedly connected to the outer side of the upright plate near the left end of the base plate. The surface of the guide block is set at an angle.

[0012] In a preferred embodiment of the present invention, the cutting assembly includes a bracket, a bracket fixedly connected to the top of the base plate, an electric push rod fixedly connected to the top of the bracket, the output end of the electric push rod passing through the middle of the bracket and fixedly connected to a housing, a rotating shaft rotatably connected to the upper inside of the housing, a shaft rotatably connected to the lower inside of the housing, the right end of the shaft extending to the outside of the housing and fixedly connected to a cutting blade, the shaft and the rotating shaft being connected via a pulley assembly, a third motor for driving the rotating shaft to rotate fixedly connected to the outside of the housing, and a controller fixedly connected to the outside of the bracket.

[0013] In a preferred embodiment of the present invention, the support assembly includes a rectangular plate, and a rectangular plate is fixedly connected to the outer side of the upright plate near the right end of the base plate, and a limit post is fixedly connected to the inner surface of the rectangular plate.

[0014] In a preferred embodiment of the present invention, the limiting post is located in the middle of the annular seat.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. By using the inclined grooves opened in the annular array on the annular seat and the sliding block and drive rod connected in the sliding groove, the inclined grooves drive the drive rod to move synchronously along the radial direction of the slider when the toothed ring drives the annular seat to rotate, and multiple clamping blocks move simultaneously in a centripetal or centrifugal motion. This achieves the effect of adaptive clamping and fixing of single crystal silicon ingots of different diameters and can quickly change shapes without changing the fixture, effectively improving the cutting efficiency.

[0016] 2. By using the threaded engagement between the lead screw and the support plate in the push assembly, and the first motor driving the lead screw to rotate, the controller precisely controls the number of rotations of the first motor each push to adjust the single feed distance of the support plate, thereby achieving precise control of the slice thickness and adapting to the processing needs of wafers with different thicknesses.

[0017] 3. By using the groove on the clamping block near the left end of the base plate and the rollers that are rotatably connected inside the groove, the silicon ingot rolls and rubs between multiple rollers when the pushing component moves the single crystal silicon ingot, which reduces the pushing resistance and prevents scratches on the surface of the silicon ingot.

[0018] 4. The guide block, which is fixedly connected to the outside of the vertical plate near the left end of the base plate, has an inclined surface. The rubber layer on the surface of the guide block and the rubber belt of the conveyor belt work together to buffer the cut silicon ingots as they slide down the inclined surface of the guide block and to provide flexible support from the conveyor belt. This achieves the effect of protecting the cut silicon ingots from falling and preventing them from breaking due to collision. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a top view of the present invention; Figure 2 This is a perspective view of the overall structure of the present invention; Figure 3 This is a schematic diagram of the structure of the present invention from another perspective; Figure 4 This is a partial structural side view of the present invention; Figure 5 This is a schematic diagram of the structure of the present invention with a portion removed; Figure 6 For the present invention Figure 5 Enlarged schematic diagram of the structure of region A in the middle; Figure 7 This is a front sectional view of the present invention; Figure 8 This is a partial structural schematic diagram of the present invention.

[0020] In the diagram: 10. Base plate; 11. Pushing assembly; 111. First motor; 112. Support plate; 113. Slide rail; 114. Lead screw; 12. Clamping assembly; 120. Gear ring; 121. Vertical plate; 122. Fixing hole; 123. Slide groove; 124. Slider; 125. Annular seat; 126. Inclined groove; 127. Drive rod; 128. Connecting plate; 129. Clamping block; 13. Rolling assembly; 131. Groove; 132. Roller; 14. Drive assembly; 141. Second motor; 1 42. Fixed plate; 143. Worm gear; 144. Worm wheel; 145. Rotating shaft; 146. Hexagonal column; 147. Main gear; 148. Through hole; 15. Conveying assembly; 151. Conveyor belt; 152. Guide block; 16. Cutting assembly; 161. Bracket; 162. Electric push rod; 163. Housing; 164. Third motor; 165. Rotating shaft; 166. Shaft; 167. Cutting disc; 168. Pulley assembly; 17. Support assembly; 171. Rectangular plate; 172. Limiting post. Detailed Implementation

[0021] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0022] Example 1

[0023] Reference Figure 1 , Figure 2 and Figure 3 This embodiment of the present invention provides a semiconductor chip fabrication apparatus, including a cutting component, a base plate 10, a pushing assembly 11 mounted on the top of the base plate 10, two clamping assemblies 12 symmetrically mounted on the pushing assembly 11, a rolling assembly 13 mounted on the clamping assembly 12 near the left end of the base plate 10, a driving assembly 14 mounted between the two clamping assemblies 12, a conveying assembly 15 mounted on the outside of the clamping assembly 12 near the left end of the base plate 10, a cutting assembly 16 fixedly connected to the top of the base plate 10, and a controller mounted on the outside of the cutting assembly 16. All motors, conveyor belts 151 and electric push rods 162 in this application are electrically connected to the controller. The support component includes a support component 17 mounted on the clamping assembly 12 near the right end of the base plate 10, the support component 17 being located inside the clamping assembly 12.

[0024] Reference Figure 3 The pushing assembly 11 includes a first motor 111, two support plates 112, and slide rails 113. Two slide rails 113 are symmetrically fixedly connected to the top of the base plate 10. Two support plates 112 are mounted on the top of the base plate 10. The support plate 112 near the right end of the base plate 10 is slidably connected to the outside of the two slide rails 113, and the support plate 112 near the left end of the base plate 10 is fixedly connected to the top of the base plate 10. A lead screw 114 is rotatably connected to the right end face of the support plate 112 near the left end of the base plate 10, and the support plate 112 near the right end of the base plate 10 is threaded onto the lead screw 114. A first motor 111 for driving the lead screw 114 to rotate is fixedly connected to the outer side of the rod 114 and the outer side of the base plate 10. The first motor 111 is controlled to drive the lead screw 114 to rotate, thereby driving the upright plate 121 near the right end of the base plate 10 to move, thereby driving the clamped monocrystalline silicon ingot to move. When the monocrystalline silicon ingot moves, its cut end rolls between multiple rollers 132, thereby realizing automated pushing without manual operation. At the same time, the thickness of the slice can be controlled and adjusted by controlling and adjusting the moving distance of the first motor 111 for each push through the controller.

[0025] Reference Figure 8The clamping assembly 12 includes a vertical plate 121 fixedly connected to the top of the support plate 112. The vertical plate 121 has a fixing hole 122. An annular seat 125 is rotatably connected inside the fixing hole 122. A toothed ring 120 is rotatably connected to the inner surface of the vertical plate 121. The toothed ring 120 is fixedly connected to the outer wall of the annular seat 125. A plurality of sliding grooves 123 are arranged in an annular array on the inner surface of the vertical plate 121. A slider 124 is slidably connected inside the sliding grooves 123. A plurality of oblique grooves 126 are arranged in an annular array on the annular seat 125. A drive rod 127 is installed inside the oblique grooves 126. One end of the drive rod 127 is fixedly connected to the surface of the slider 124. A connecting plate 128 is fixedly connected to the other end of the drive rod 127. A clamping block 129 is fixedly connected to the end of the connecting plate 128 away from the drive rod 127. An annular groove 1 is formed on the outer side of the annular seat 125. An annular block 1 is rotatably connected inside the annular groove 1. The annular block 1 is fixedly connected to the inner wall of the fixing hole 122. An annular groove 2 is formed on the inner surface of the vertical plate 121. An annular block 2 is rotatably connected inside the annular groove 2. The annular block 2 is fixedly connected to the toothed ring 120. The rotation of the toothed ring 120 drives the annular seat 125 to rotate. The rotation of the annular seat 125 drives the drive rod 127 to move through the action of the inclined groove 126. Since the drive rod 127 is slidably connected inside the sliding groove 123 through the slider 124, the annular seat 125... When the 25 rotates, multiple drive rods 127 drive the centers of multiple connecting plates 128 and annular seats 125 to move synchronously to clamp and fix the monocrystalline silicon ingot. This also facilitates clamping and fixing monocrystalline silicon ingots of different diameters. During clamping, the monocrystalline silicon ingot is inserted from left to right into the two fixing holes 122, and the right end of the monocrystalline silicon ingot abuts against the inner surface of the limiting post 172. Then, the second motor 141 is controlled to work so that the annular seat 125 rotates, thereby causing multiple clamping blocks 129 to move toward the center of the annular seat 125 to clamp and fix the monocrystalline silicon ingot.

[0026] Reference Figure 8 The rolling assembly 13 includes a groove 131. The clamping block 129 near the left end of the base plate 10 has a groove 131. Rollers 132 are rotatably connected inside the groove 131. After the single crystal silicon ingot is clamped and fixed by the clamping assembly 12 in conjunction with the rolling assembly 13, the single crystal silicon ingot can roll and move between multiple rollers 132 when the pushing assembly 11 pushes the single crystal silicon ingot to move.

[0027] Reference Figure 3 , Figure 4 and Figure 8The drive assembly 14 includes a through hole 148, a rotating shaft 145, a fixed plate 142, and a main gear 147. Both upright plates 121 have through holes 148. The main gears 147 are rotatably connected to opposite sides of the two upright plates 121. Hexagonal prisms 146 are rotatably connected inside the two through holes 148. The two main gears 147 are slidably sleeved on the outer sides of the hexagonal prisms 146. A rotating shaft 145 is rotatably connected to the outer side of the upright plate 121 near the right end of the base plate 10. The rotating shaft 145 is fixedly connected to the hexagonal prism 146. A worm gear 144 is fixedly connected to the outer side of the rotating shaft 145. Two worm gears 144 are fixedly connected to the outer side of the upright plate 121 near the right end of the base plate 10. A fixed plate 142 is provided, and a worm gear 143 is rotatably connected between the two fixed plates 142. A second motor 141 for driving the worm gear 143 to rotate is fixedly connected to the outer side of the fixed plate 142 away from the base plate 10. The main gear 147 and the gear ring 120 are meshed together, and the worm gear 143 and the worm wheel 144 are meshed together. The second motor 141 is controlled to work and drive the worm gear 143 to rotate. The rotation of the worm gear 143 drives the worm wheel 144 to rotate. The rotation of the worm wheel 144 drives the rotating shaft 145 to rotate. The rotation of the rotating shaft 145 drives the hexagonal column 146 to rotate. The rotation of the hexagonal column 146 drives the two main gears 147 to rotate. The rotation of the main gears 147 drives the gear ring 120 to rotate. When the push assembly 11 moves the support plate 112 near the right end of the base plate 10, the support plate 112 drives the hexagonal column 146 to move inside the through hole 148. The hexagonal column 146 passes through the through hole 148 near the left end of the base plate 10 and moves to the left.

[0028] Reference Figure 1 , Figure 2 and Figure 3 The conveying assembly 15 includes a conveyor belt 151 and a guide block 152. The conveyor belt 151 is fixedly connected to the outer side of the upright plate 121 near the left end of the base plate 10, and the guide block 152 is fixedly connected to the outer side of the upright plate 121 near the left end of the base plate 10. The surface of the guide block 152 is set at an angle. This setting guides the cut monocrystalline silicon ingots onto the conveyor belt 151 for conveying. The conveyor belt 151 is made of rubber material, and the surface of the guide block 152 is provided with a rubber layer. This design plays a role in buffering and supporting the monocrystalline silicon ingots, and plays a role in protecting the monocrystalline silicon ingots from falling.

[0029] Reference Figure 5 , Figure 6 and Figure 7The cutting assembly 16 includes a bracket 161. The bracket 161 is fixedly connected to the top of the base plate 10. An electric push rod 162 is fixedly connected to the top of the bracket 161. The electric push rod 162 can drive the cutting blade 167 to move downward to slice the single crystal silicon ingot. The output end of the electric push rod 162 passes through the middle of the bracket 161 and is fixedly connected to a housing 163. A rotating shaft 165 is rotatably connected to the upper side of the inside of the housing 163, and a shaft 166 is rotatably connected to the lower side of the inside of the housing 163. The right end of the shaft 166 extends... A cutting blade 167 extends to the outside of the housing 163 and is fixedly connected thereto. The shaft 166 and the rotating shaft 165 are connected by a belt pulley assembly 168. A third motor 164 for driving the rotating shaft 165 to rotate is fixedly connected to the outside of the housing 163. The third motor 164 drives the rotating shaft 165 to rotate, and the shaft 166 is driven to rotate by the belt pulley assembly 168, thereby driving the cutting blade 167 to rotate to slice the single crystal silicon ingot. The controller is fixedly connected to the outside of the support 161.

[0030] Reference Figure 3 The support assembly 17 includes a rectangular plate 171. The rectangular plate 171 is fixedly connected to the outer side of the upright plate 121 near the right end of the base plate 10. The rectangular plate 171 is used to connect and fix the limiting post 172. The limiting post 172 is fixedly connected to the inner surface of the rectangular plate 171. The limiting post 172 is located in the middle of the annular seat 125. During the clamping and cutting of the monocrystalline silicon ingot, the end of the monocrystalline silicon ingot contacts and abuts against the limiting post 172, thus further improving the stability of the monocrystalline silicon ingot when pushing it.

[0031] In use, the monocrystalline silicon ingot is first passed through the fixing holes 122 on the two upright plates 121 from left to right, so that the right end of the monocrystalline silicon ingot abuts against the inner surface of the limiting post 172, completing the initial positioning. Then, the second motor 141 is controlled to work, the second motor 141 drives the worm gear 143 to rotate, the worm gear 143 drives the worm wheel 144 to rotate, the worm wheel 144 drives the hexagonal column 146 to rotate through the rotating shaft 145, the hexagonal column 146 drives the two main gears 147 to rotate synchronously, and the main gears 147 drive the gear ring 120 meshing with them to rotate. The toothed ring 120 drives the annular seat 125 to rotate inside the fixing hole 122. When the annular seat 125 rotates, the inclined groove 126 on it drives the drive rod 127 to move along the inclined groove. Since the drive rod 127 is slidably connected to the sliding groove 123 on the vertical plate 121 through the slider 124, the sliding groove 123 limits the movement direction of the drive rod 127, so that the drive rod 127 can only move radially along the annular seat 125. The drive rod 127 drives the clamping block 129 to move synchronously towards the center of the annular seat 125 through the connecting plate 128, thereby clamping and fixing single crystal silicon ingots of different diameters.

[0032] After the monocrystalline silicon ingot is clamped and fixed, the first motor 111 is controlled to operate. The first motor 111 drives the lead screw 114 to rotate, and the lead screw 114 drives the support plate 112 near the right end of the base plate 10 to slide to the left along the slide rail 113. The support plate 112 drives the upright plate 121, the clamping assembly 12, and the clamped monocrystalline silicon ingot to move to the left as a whole. During the pushing process, the monocrystalline silicon ingot near the cutting end rolls between multiple rollers 132 on the clamping assembly 12 near the left end of the base plate 10, realizing automatic pushing. By controlling the moving distance of the first motor 111 each time through the controller, the thickness of the wafer can be precisely controlled, realizing the processing of wafer wafers of different thickness specifications.

[0033] The third motor 164 starts first, driving the cutting blade 167 to reach the set rotation speed. Then, the controller controls the electric push rod 162 to operate. The output end of the electric push rod 162 extends, pushing the housing 163 downwards vertically. The housing 163 drives the high-speed rotating cutting blade 167 to descend synchronously. The cutting blade 167 contacts the monocrystalline silicon ingot from above and completes the slicing action. After slicing, the electric push rod 162 retracts in the opposite direction, raising the cutting blade 167 to its initial height, awaiting the next push feed.

[0034] After cutting, the cut single-crystal silicon ingot slides down the inclined surface of the guide block 152 on the outer side of the clamping assembly 12 near the left end of the base plate 10 onto the conveyor belt 151. The rubber layer on the surface of the guide block 152 cushions the falling of the single-crystal silicon ingot, and the rubber belt of the conveyor belt 151 further protects the silicon wafer from impact, preventing it from breaking during the fall. The conveyor belt 151 then transports the cut single-crystal silicon ingot to the next process.

[0035] When clamping single-crystal silicon ingots of different diameters, simply control the second motor 141 to reverse, the worm gear 143 to drive the worm wheel 144 to reverse, the hexagonal column 146 to drive the main gear 147 to reverse, the gear ring 120 and the ring seat 125 to rotate in opposite directions, the inclined groove 126 to drive the drive rod 127 to move radially outward, and the clamping block 129 to expand outward synchronously to release the clamped silicon ingot. After the new silicon ingot is inserted and positioned, control the second motor 141 to rotate forward again to complete the clamping. Throughout the clamping and pushing process, the hexagonal column 146 always passes through the through holes 148 on the two upright plates 121. When the pushing assembly 11 drives the support plate 112 near the right end of the base plate 10 to move, the hexagonal column 146 slides synchronously inside the through holes 148, always maintaining the transmission engagement with the two main gears 147, ensuring that the clamping force remains stable during the silicon ingot pushing process.

[0036] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. An apparatus for fabricating a semiconductor chip, characterized in that: include, The cutting component includes a base plate (10), a pushing assembly (11) is mounted on the top of the base plate (10), two clamping assemblies (12) are symmetrically mounted on the pushing assembly (11), a rolling assembly (13) is mounted on the clamping assembly (12) near the left end of the base plate (10), a driving assembly (14) is mounted between the two clamping assemblies (12), a conveying assembly (15) is mounted on the outside of the clamping assembly (12) near the left end of the base plate (10), a cutting assembly (16) is fixedly connected to the top of the base plate (10), and a controller is mounted on the outside of the cutting assembly (16). The support component includes a support component (17) mounted on a clamping assembly (12) near the right end of the base plate (10), the support component (17) being located inside the clamping assembly (12).

2. The semiconductor chip fabrication apparatus according to claim 1, characterized in that: The pushing assembly (11) includes a first motor (111), two support plates (112) and slide rails (113). Two slide rails (113) are symmetrically fixedly connected to the top of the base plate (10). Two support plates (112) are installed on the top of the base plate (10). The support plate (112) near the right end of the base plate (10) is slidably connected to the outside of the two slide rails (113). The support plate (112) near the left end of the base plate (10) is fixedly connected to the top of the base plate (10). A lead screw (114) is rotatably connected to the right end face of the support plate (112) near the left end of the base plate (10). The support plate (112) near the right end of the base plate (10) is threaded onto the outside of the lead screw (114). A first motor (111) for driving the lead screw (114) to rotate is fixedly connected to the outside of the base plate (10).

3. The semiconductor chip fabrication apparatus according to claim 2, characterized in that: The clamping assembly (12) includes a vertical plate (121) fixedly connected to the top of the support plate (112). A fixing hole (122) is provided on the vertical plate (121). An annular seat (125) is rotatably connected inside the fixing hole (122). A toothed ring (120) is rotatably connected to the inner surface of the vertical plate (121). The toothed ring (120) is fixedly connected to the outer wall of the annular seat (125). A plurality of sliding grooves (123) are arranged in a circular array on the inner surface of the vertical plate (121). (123) has a slider (124) inside it. The annular seat (125) has a plurality of oblique grooves (126) arranged in annular array. A drive rod (127) is installed inside the oblique groove (126). One end of the drive rod (127) is fixedly connected to the surface of the slider (124). The other end of the drive rod (127) is fixedly connected to a connecting plate (128). A clamping block (129) is fixedly connected to the end of the connecting plate (128) away from the drive rod (127).

4. The semiconductor chip fabrication apparatus according to claim 3, characterized in that: The outer side of the annular seat (125) is provided with an annular groove 1, and an annular block 1 is rotatably connected inside the annular groove 1. The annular block 1 is fixedly connected to the inner wall of the fixing hole (122). The inner surface of the upright plate (121) is provided with an annular groove 2, and an annular block 2 is rotatably connected inside the annular groove 2. The annular block 2 is fixedly connected to the toothed ring (120).

5. The semiconductor chip fabrication apparatus according to claim 4, characterized in that: The rolling assembly (13) includes a groove (131), and a groove (131) is provided on the clamping block (129) near the left end of the base plate (10). A roller (132) is rotatably connected inside the groove (131).

6. The semiconductor chip fabrication apparatus according to claim 3, characterized in that: The drive assembly (14) includes a through hole (148), a rotating shaft (145), a fixed plate (142), and a main gear (147). Both upright plates (121) have through holes (148). A main gear (147) is rotatably connected to the opposite side of each of the two upright plates (121). A hexagonal column (146) is rotatably connected inside each of the two through holes (148). Both main gears (147) are slidably sleeved on the outside of the hexagonal column (146). A rotating shaft (145) is rotatably connected to the outside of the upright plate (121) near the right end of the base plate (10). 45) Fixedly connected to the hexagonal column (146), the outer side of the rotating shaft (145) is fixedly connected to the worm gear (144), the outer side of the upright plate (121) near the right end of the base plate (10) is fixedly connected to two fixed plates (142), the two fixed plates (142) are rotatably connected to the worm (143), the outer side of the fixed plate (142) away from the base plate (10) is fixedly connected to a second motor (141) for driving the worm (143) to rotate, the main gear (147) and the gear ring (120) are meshed, and the worm (143) and the worm gear (144) are meshed.

7. The semiconductor chip fabrication apparatus according to claim 6, characterized in that: The conveying assembly (15) includes a conveyor belt (151) and a guide block (152). The conveyor belt (151) is fixedly connected to the outside of the upright plate (121) near the left end of the base plate (10), and the guide block (152) is fixedly connected to the outside of the upright plate (121) near the left end of the base plate (10). The surface of the guide block (152) is set at an angle.

8. The semiconductor chip fabrication apparatus according to claim 1, characterized in that: The cutting assembly (16) includes a bracket (161). The bracket (161) is fixedly connected to the top of the base plate (10). An electric push rod (162) is fixedly connected to the top of the bracket (161). The output end of the electric push rod (162) passes through the middle of the bracket (161) and is fixedly connected to a housing (163). A rotating shaft (165) is rotatably connected to the upper inside of the housing (163). A shaft (166) is rotatably connected to the lower inside of the housing (163). The right end of the shaft (166) extends to the outside of the housing (163) and is fixedly connected to a cutting blade (167). The shaft (166) and the rotating shaft (165) are connected by a pulley assembly (168). A third motor (164) for driving the rotating shaft (165) to rotate is fixedly connected to the outside of the housing (163). The controller is fixedly connected to the outside of the bracket (161).

9. The semiconductor chip fabrication apparatus according to claim 8, characterized in that: The support assembly (17) includes a rectangular plate (171), and a rectangular plate (171) is fixedly connected to the outside of the upright plate (121) near the right end of the base plate (10), and a limit post (172) is fixedly connected to the inner surface of the rectangular plate (171).

10. The semiconductor chip fabrication apparatus according to claim 9, characterized in that: The limiting post (172) is located in the middle of the annular seat (125).

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