Silane deep hydrophobic modified building energy-saving insulation board and preparation method thereof

Abstract

The present application relates to the technical field of deep processing of building insulation board, and provides a silane deep hydrophobic modified building energy-saving insulation board and a preparation method thereof, the insulation board uses a finished product composite expanded polystyrene particle insulation board as a plate-shaped insulation base material, and a silane hydrophobic modified layer formed by curing of a low-viscosity deep-penetration silane waterproof impregnating solution is combined on the base material; the impregnating solution comprises methylsilane hydrolysis solution, nano-gas-phase silica water dispersion solution, organic fluorine low-surface-tension penetration aid, organic zirconium low-temperature cross-linking curing agent and deionized water, has a viscosity of 8-12 mPa.s and a pH value of 6.5-8. During preparation, the base material is pretreated, immersed and soaked or sprayed on both sides, low-temperature cross-linked and cured, and maintained at room temperature in sequence. The method is suitable for post-processing of the finished product insulation board, can improve the hydrophobicity of the board, reduce the volume water absorption, and reduce the adverse effect of hydrophobic modification on the heat conduction performance.

Description

Technical Field

[0001] This invention relates to the field of deep processing technology of building insulation boards, and in particular to a silane deep hydrophobic modified building energy-saving insulation board and its preparation method. Technical Background

[0002] In building exterior wall insulation systems, composite expanded polystyrene particle insulation boards are widely used due to their lightweight, good insulation performance, and ease of construction. However, these boards typically have numerous pores. When exposed to rain, humidity, or alternating wet and dry environments for extended periods, moisture can easily penetrate and accumulate within the boards, increasing their moisture content. This leads to increased thermal conductivity, decreased insulation performance, and potentially problems such as efflorescence, delamination, and peeling of the finish layer.

[0003] Existing waterproofing modification methods mostly involve adding water-repellent materials during the board forming stage, which is difficult to apply to already formed commercial boards. Some finished boards use surface protection treatment, but the protective materials usually cannot penetrate into the board, and the protective effect is easily reduced under cutting, collision or long-term environmental effects. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a silane deep hydrophobic modified building energy-saving insulation board and its preparation method, so as to solve or alleviate the technical problems existing in the prior art.

[0005] The technical solution of this invention is implemented as follows: a silane deep hydrophobic modified building energy-saving insulation board, comprising:

[0006] The sheet-like insulation substrate is a finished composite expanded polystyrene particle insulation board with capillary pores inside.

[0007] A silane hydrophobic modified layer is bonded to the plate-shaped thermal insulation substrate and is formed by curing a low-viscosity, deep-penetrating silane waterproof impregnation liquid.

[0008] The low-viscosity deep-penetrating silane waterproofing impregnation solution has a viscosity of 8–12 mPa·s and a pH value of 6.5–8, and comprises the following components by weight percentage:

[0009] The solid content of methylsilane hydrolysate is 40%, and its content is 45%–56%.

[0010] A 20% concentration nano-fumed silica aqueous dispersion, 18%–24%;

[0011] Organic fluorine low surface tension penetration aid 3%–6%;

[0012] Organozzirconium low-temperature crosslinking curing agent 2%–5%;

[0013] The remainder is deionized water.

[0014] In the above embodiments: the hydrophobicity of the silane deep hydrophobic modified building energy-saving insulation board is not less than 98%, the volume water absorption rate is not higher than 3.5%, and the difference between its thermal conductivity and the thermal conductivity of the original plate-shaped insulation substrate is not greater than 0.003 W / (m·K).

[0015] A method for preparing a silane-modified deep hydrophobic building energy-saving insulation board, characterized by comprising the following steps:

[0016] S1. Substrate pretreatment: Select finished composite expanded polystyrene particle insulation board as the board insulation substrate, blow away the floating dust and loose powder on the surface of the board insulation substrate, and control the moisture content of the board insulation substrate to below 10%.

[0017] S2. Silane hydrophobic modification treatment: The pretreated plate-shaped thermal insulation substrate is brought into contact with a low-viscosity deep-penetrating silane waterproof impregnation liquid, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the capillary pores of the plate-shaped thermal insulation substrate or adheres to the surface of the plate-shaped thermal insulation substrate.

[0018] S3. Low-temperature cross-linking and curing: The plate-shaped thermal insulation substrate that has been modified by hydrophobic silane is placed in a ventilated environment at 30-42°C for curing, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid is cross-linked and formed.

[0019] S4. Room temperature curing: The plate-shaped thermal insulation substrate that has been cross-linked and cured at low temperature is placed in a room temperature ventilated environment for static curing, so that the low viscosity deep penetration silane waterproof impregnation liquid is completely cured, and silane deep hydrophobic modified building energy-saving thermal insulation board is obtained.

[0020] The low-viscosity deep-penetrating silane waterproofing impregnation solution has a viscosity of 8–12 mPa·s and a pH value of 6.5–8, and comprises the following components by weight percentage:

[0021] The mixture consists of 45%–56% methylsilane hydrolysate with a solid content of 40%, 18%–24% nano-fumed silica aqueous dispersion with a concentration of 20%, 3%–6% organic fluorine low surface tension penetrating agent, 2%–5% organic zirconium low-temperature crosslinking curing agent, and the remainder deionized water.

[0022] In the above embodiments: the silane hydrophobic modification treatment in S2 is carried out by a whole-body immersion soaking method, specifically including:

[0023] The pretreated plate-shaped thermal insulation substrate is completely immersed in the low-viscosity deep-penetrating silane waterproof impregnation liquid and soaked at 22-30°C for 6-12 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the core layer of the plate-shaped thermal insulation substrate along the capillary pores.

[0024] In the above embodiment: after S2, a vertical draining step is further included, specifically:

[0025] After soaking, remove the plate-shaped thermal insulation substrate and hang it vertically to drain the liquid for 2-4 minutes to remove excess free impregnation liquid from the surface of the plate-shaped thermal insulation substrate.

[0026] In the above embodiments: the silane hydrophobic modification treatment in S2 can also be carried out by low-pressure atomized double-sided spraying, specifically including:

[0027] The low-viscosity deep-penetrating silane waterproof impregnation liquid is uniformly sprayed onto both sides of the plate-shaped thermal insulation substrate using a low-pressure spraying equipment. The dry film thickness formed by a single spraying is 0.08 to 0.15 mm.

[0028] In the above embodiment: after step S3, the method further includes:

[0029] The treated plate-shaped thermal insulation substrate is subjected to a first low-pressure atomized spray coating on both sides to form a microporous closed primer.

[0030] The plate-shaped thermal insulation substrate after the first low-pressure atomized spray coating is placed in an environment of 30-42℃ and cured for 10-20 minutes.

[0031] A second spray coating is applied to the opposite two sides of the cured plate-shaped thermal insulation substrate to form a weather-resistant topcoat.

[0032] In the above embodiments: the low-temperature cross-linking curing time in S3 is 25 to 60 minutes.

[0033] In the above embodiment: the ambient temperature curing time in S4 is 12-24 hours.

[0034] Compared with the prior art, the present invention has the following advantages:

[0035] This invention uses finished composite expanded polystyrene particle insulation board as the board-shaped insulation substrate, eliminating the need to add hydrophobic materials during the board forming stage, and can perform hydrophobic modification on the already formed insulation board.

[0036] The present invention utilizes a whole-body immersion method, in which a low-viscosity, deep-penetrating silane waterproof impregnating liquid can penetrate into the core layer along the capillary pores inside the plate-shaped thermal insulation substrate, and form an internal silane hydrophobic barrier layer within the capillary pores, so that the plate can still maintain its internal hydrophobic effect after cutting or local impact.

[0037] This invention, by employing a low-pressure atomization double-sided spraying method, can form a surface silane waterproof film on both sides of a plate-shaped thermal insulation substrate, which has the advantages of fewer processing steps, faster processing speed, and lower impregnation liquid consumption.

[0038] This invention improves the hydrophobicity of the board and reduces its volume water absorption rate by controlling the composition, viscosity, low-temperature curing and room-temperature curing conditions of the low-viscosity deep-penetrating silane waterproof impregnation liquid, while reducing the adverse effects of hydrophobic modification on the thermal conductivity and combustion performance of the board.

[0039] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the invention will become readily apparent from the accompanying drawings and the following detailed description. Detailed Implementation

[0040] The present invention will be further described below through several exemplary embodiments. Those skilled in the art can make various modifications or substitutions to the following embodiments without departing from the technical principles and core concepts of the present invention, and the modified solutions will still fall within the protection scope of the present invention. The accompanying drawings and descriptions of the embodiments in this specification are for illustrative purposes only and are not intended to limit the protection scope of the present invention.

[0041] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0042] A silane-modified deep hydrophobic building energy-saving insulation board includes:

[0043] The sheet-like insulation substrate is a finished composite expanded polystyrene particle insulation board with capillary pores inside.

[0044] A silane hydrophobic modified layer is bonded to a plate-shaped thermal insulation substrate and is formed by curing a low-viscosity, deep-penetrating silane waterproof impregnation liquid.

[0045] The low-viscosity deep-penetrating silane waterproofing impregnation solution has a viscosity of 8–12 mPa·s and includes the following components by weight percentage:

[0046] A methylsilane hydrolysate with a solid content of 40% is 45%–65%;

[0047] A 20% concentration nano-fumed silica aqueous dispersion contains 18%–32%;

[0048] Organic fluorine low surface tension penetration aid 3%–10%;

[0049] Organozzirconium low-temperature crosslinking curing agent 2%–8%;

[0050] The remaining amount is deionized water: replenish the remaining amount to 100%.

[0051] The above components are mixed to obtain a low-viscosity deep-penetrating silane waterproofing impregnation solution. The viscosity of the low-viscosity deep-penetrating silane waterproofing impregnation solution is 8-12 mPa·s, the pH value is 6.5-8, and it does not separate into layers or produce solid precipitates when mixed at room temperature.

[0052] The water repellency of the silane deep hydrophobic modified building energy-saving insulation board is not less than 98%, the volume water absorption rate is not higher than 3.5%, and the difference between its thermal conductivity and that of the original board insulation substrate is not greater than 0.003 W / (m·K).

[0053] Example 1

[0054] Prepare a low-viscosity, deep-penetrating silane waterproofing impregnation solution according to the following weight percentages:

[0055] 45% of the methylsilane hydrolysate has a solid content of 40%.

[0056] A 20% concentration nano-fumed silica aqueous dispersion (18%);

[0057] 3% organic fluorine low surface tension penetration aid;

[0058] 2% organozirconium low-temperature crosslinking curing agent;

[0059] 32% deionized water.

[0060] The above components were mixed to obtain a low-viscosity deep-penetrating silane waterproofing impregnation solution. The low-viscosity deep-penetrating silane waterproofing impregnation solution has a viscosity of 8 mPa·s, a pH value of 6.5, and does not separate into layers or produce solid precipitates when mixed at room temperature.

[0061] S1. Substrate pretreatment: Select 40mm thick finished composite expanded polystyrene particle insulation board as the board insulation substrate, use a fan to blow away the floating dust and loose powder on the surface of the board insulation substrate, and control its moisture content to below 10%.

[0062] S2. Silane hydrophobic modification treatment: The pretreated plate-shaped thermal insulation substrate is completely immersed in a low-viscosity deep-penetrating silane waterproof impregnation liquid and soaked at 22°C for 6 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the core layer along the capillary pores inside the plate-shaped thermal insulation substrate.

[0063] It also includes a vertical draining step, which is as follows: after soaking, the plate-shaped insulation substrate is taken out and hung vertically to drain for 2 minutes, only removing the excess free impregnation liquid on its surface, without rinsing or wiping it.

[0064] S3. Low-temperature cross-linking and curing: The plate-shaped thermal insulation substrate after drainage is placed in a ventilated environment at 30°C for low-temperature pre-cross-linking and curing for 25 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid located in the capillary pores is initially cross-linked and formed.

[0065] S4. Room temperature curing: Place the low-temperature cured plate-shaped insulation substrate in a room temperature ventilated environment for 14 hours to allow the low viscosity deep-penetrating silane waterproof impregnation liquid to fully cure and form an internal silane hydrophobic barrier layer in the capillary pores of the plate-shaped insulation substrate, thus obtaining a silane deep hydrophobic modified building energy-saving insulation board.

[0066] Example 2

[0067] Prepare a low-viscosity, deep-penetrating silane waterproofing impregnation solution according to the following weight percentages:

[0068] 50% of the methylsilane hydrolysate has a solid content of 40%;

[0069] A 20% concentration nano-fumed silica aqueous dispersion (21%);

[0070] 5% organic fluorine low surface tension penetration aid;

[0071] 3% organozirconium low-temperature crosslinking curing agent;

[0072] Deionized water 21%.

[0073] The above components are mixed to obtain a low-viscosity deep-penetrating silane waterproofing impregnation solution. The low-viscosity deep-penetrating silane waterproofing impregnation solution has a viscosity of 10 mPa·s, a pH value of 7, and does not separate into layers or produce solid precipitates when mixed at room temperature.

[0074] S1. Substrate pretreatment: Select 40mm thick finished composite expanded polystyrene particle insulation board as the board insulation substrate, use a fan to blow away the floating dust and loose powder on the surface of the board insulation substrate, and control its moisture content to below 10%.

[0075] S2. Silane hydrophobic modification treatment: The pretreated plate-shaped thermal insulation substrate is completely immersed in a low-viscosity deep-penetrating silane waterproof impregnation liquid and soaked at 25°C for 8 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the core layer along the capillary pores inside the plate-shaped thermal insulation substrate.

[0076] It also includes a vertical draining step, which is as follows: after soaking, the plate-shaped thermal insulation substrate is taken out and hung vertically to drain for 3 minutes, only removing the excess free impregnation liquid on its surface, without rinsing or wiping it.

[0077] S3. Low-temperature cross-linking and curing: The plate-shaped thermal insulation substrate after drainage is placed in a ventilated environment at 35°C for low-temperature pre-cross-linking and curing for 35 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid located in the capillary pores is initially cross-linked and formed.

[0078] S4. Room temperature curing: Place the low-temperature cured plate-shaped insulation substrate in a room temperature ventilated environment for 16 hours to allow the low viscosity deep-penetrating silane waterproof impregnation liquid to fully cure and form an internal silane hydrophobic barrier layer in the capillary pores of the plate-shaped insulation substrate, thus obtaining a silane deep hydrophobic modified building energy-saving insulation board.

[0079] Example 3

[0080] Prepare a low-viscosity, deep-penetrating silane waterproofing impregnation solution according to the following weight percentages:

[0081] The methylsilane hydrolysate with a solid content of 40% is 56%;

[0082] A 20% concentration nano-fumed silica aqueous dispersion (24%);

[0083] Organic fluorine low surface tension penetration aid 6%;

[0084] Organozzirconium low-temperature crosslinking curing agent 5%;

[0085] 9% deionized water.

[0086] The above components were mixed to obtain a low-viscosity deep-penetrating silane waterproofing impregnation solution. The low-viscosity deep-penetrating silane waterproofing impregnation solution has a viscosity of 12 mPa·s, a pH value of 8, and does not separate into layers or produce solid precipitates when mixed at room temperature.

[0087] S1. Substrate pretreatment: Select 40mm thick finished composite expanded polystyrene particle insulation board as the board insulation substrate, use a fan to blow away the floating dust and loose powder on the surface of the board insulation substrate, and control its moisture content to below 10%.

[0088] S2. Silane hydrophobic modification treatment: The pretreated plate-shaped thermal insulation substrate is completely immersed in a low-viscosity deep-penetrating silane waterproof impregnation liquid and soaked at 30°C for 12 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the core layer along the capillary pores inside the plate-shaped thermal insulation substrate.

[0089] It also includes a vertical draining step, which is as follows: after soaking, the plate-shaped insulation substrate is taken out and hung vertically to drain for 4 minutes, only removing the excess free impregnation liquid on its surface, without rinsing or wiping it.

[0090] S3. Low-temperature cross-linking and curing: The plate-shaped thermal insulation substrate after drainage is placed in a ventilated environment at 42°C for low-temperature pre-cross-linking and curing for 50 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid located in the capillary pores is initially cross-linked and formed.

[0091] S4. Room temperature curing: Place the low-temperature cured plate-shaped insulation substrate in a room temperature ventilated environment for 20 hours to allow the low viscosity deep-penetrating silane waterproof impregnation liquid to fully cure and form an internal silane hydrophobic barrier layer in the capillary pores of the plate-shaped insulation substrate, thus obtaining a silane deep hydrophobic modified building energy-saving insulation board.

[0092] Example 4

[0093] The same low-viscosity deep-penetrating silane waterproof impregnation solution as in Example 1 was used.

[0094] S1. Substrate pretreatment: Select a 40mm thick finished composite expanded polystyrene particle insulation board as the board insulation substrate, blow away the floating dust and loose powder on its surface, and control its moisture content to below 10%.

[0095] S2. Silane hydrophobic modification treatment: Low-viscosity deep-penetrating silane waterproof impregnation liquid is evenly sprayed onto both sides of the plate-shaped thermal insulation substrate using low-pressure spraying equipment, so that the dry film thickness formed by a single spraying is 0.08mm.

[0096] S3. Low-temperature segmented curing: Place the sprayed plate-shaped thermal insulation substrate in a ventilated environment at 30℃ for 40 minutes to allow the low-viscosity deep-penetrating silane waterproof impregnation liquid to cross-link and form.

[0097] S4. Room temperature curing: Then place the board-shaped insulation substrate in a ventilated and cool environment for 12 hours to allow the low viscosity deep-penetrating silane waterproof impregnation liquid to fully solidify and form a surface silane waterproof film on the surface of the board-shaped insulation substrate, thus obtaining a silane deep hydrophobic modified building energy-saving insulation board.

[0098] Example 5

[0099] The same low-viscosity deep-penetrating silane waterproof impregnation solution with the same proportions as in Example 2 was used.

[0100] S1. Substrate pretreatment: Select a 40mm thick finished composite expanded polystyrene particle insulation board as the board insulation substrate, blow away the floating dust and loose powder on its surface, and control its moisture content to below 10%.

[0101] S2. Silane hydrophobic modification treatment: Low-viscosity deep-penetrating silane waterproof impregnation liquid is evenly sprayed onto both sides of the plate-shaped thermal insulation substrate using low-pressure spraying equipment, so that the dry film thickness formed by a single spraying is 0.1mm.

[0102] S3. Low-temperature segmented curing: Place the sprayed plate-shaped thermal insulation substrate in a ventilated environment at 36℃ for 50 minutes to allow the low-viscosity deep-penetrating silane waterproof impregnation liquid to cross-link and form.

[0103] S4. Room temperature curing: Then place the plate-shaped insulation substrate in a ventilated and cool environment for 15 hours to allow the low viscosity deep-penetrating silane waterproof impregnation liquid to fully solidify and form a surface silane waterproof film on the surface of the plate-shaped insulation substrate, thus obtaining a silane deep hydrophobic modified building energy-saving insulation board.

[0104] Example 6

[0105] The same low-viscosity deep-penetrating silane waterproof impregnation solution with the same proportions as in Example 3 was used.

[0106] S1. Substrate pretreatment: Select a 40mm thick finished composite expanded polystyrene particle insulation board as the board insulation substrate, blow away the floating dust and loose powder on its surface, and control its moisture content to below 10%.

[0107] S2. Silane hydrophobic modification treatment: Low-viscosity deep-penetrating silane waterproof impregnation liquid is evenly sprayed onto both sides of the plate-shaped thermal insulation substrate using low-pressure spraying equipment, so that the dry film thickness formed by a single spraying is 0.15mm.

[0108] S3. Low-temperature segmented curing: Place the sprayed plate-shaped thermal insulation substrate in a ventilated environment at 42℃ for 60 minutes to cure at a low temperature, allowing the low-viscosity deep-penetrating silane waterproof impregnation liquid to cross-link and form.

[0109] S4. Room temperature curing: Then place the board-shaped insulation substrate in a ventilated and cool environment for 18 hours to allow the low viscosity deep-penetrating silane waterproof impregnation liquid to fully solidify and form a surface silane waterproof film on the surface of the board-shaped insulation substrate, thus obtaining a silane deep hydrophobic modified building energy-saving insulation board.

[0110] Example 7

[0111] The same low-viscosity deep-penetrating silane waterproof impregnation solution as in Example 1 was used.

[0112] S1. Substrate pretreatment: Select 40mm thick finished composite expanded polystyrene particle insulation board as the board insulation substrate, use a fan to blow away the floating dust and loose powder on the surface of the board insulation substrate, and control its moisture content to below 10%.

[0113] S2. Silane hydrophobic modification treatment: The pretreated plate-shaped thermal insulation substrate is completely immersed in a low-viscosity deep-penetrating silane waterproof impregnation liquid and soaked at 25°C for 8 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the core layer along the capillary pores inside the plate-shaped thermal insulation substrate.

[0114] It also includes a vertical draining step, which is as follows: after soaking, the plate-shaped thermal insulation substrate is taken out and hung vertically to drain for 2 minutes, only removing the excess free impregnation liquid on its surface, without rinsing or wiping it.

[0115] Low-viscosity deep-penetrating silane waterproof impregnation liquid is uniformly sprayed onto both sides of the plate-shaped thermal insulation substrate after the vertical draining step using low-pressure spraying equipment, so that the dry film thickness formed by a single spraying is 0.08mm.

[0116] S3. Low-temperature cross-linking and curing: The plate-shaped thermal insulation substrate after drainage is placed in a ventilated environment at 30°C for low-temperature pre-cross-linking and curing for 25 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid located in the capillary pores is initially cross-linked and formed.

[0117] The silane hydrophobic modification treatment, after employing a composite high-weather-resistance treatment involving overall immersion and low-pressure atomized double-sided spraying, also includes:

[0118] The treated plate-shaped thermal insulation substrate is subjected to a first low-pressure atomized spray coating on both sides to form a microporous closed primer.

[0119] After the first low-pressure atomized spray coating, the plate-shaped thermal insulation substrate was placed in a 30°C environment for 10 minutes to cure.

[0120] A second spray coating is applied to the opposite two sides of the cured plate-shaped thermal insulation substrate to form a weather-resistant topcoat.

[0121] S4. Room Temperature Curing: Place the low-temperature cured plate-shaped insulation substrate in a room temperature and ventilated environment for 20 hours to allow the low-viscosity deep-penetrating silane waterproof impregnation liquid to fully cure and form an internal silane hydrophobic barrier layer within the capillary pores of the plate-shaped insulation substrate.

[0122] Example 8

[0123] The same low-viscosity deep-penetrating silane waterproof impregnation solution with the same proportions as in Example 2 was used.

[0124] S1. Substrate pretreatment: Select 40mm thick finished composite expanded polystyrene particle insulation board as the board insulation substrate, use a fan to blow away the floating dust and loose powder on the surface of the board insulation substrate, and control its moisture content to below 10%.

[0125] S2. Silane hydrophobic modification treatment: The pretreated plate-shaped thermal insulation substrate is completely immersed in a low-viscosity deep-penetrating silane waterproof impregnation liquid and soaked at 22°C for 6 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the core layer along the capillary pores inside the plate-shaped thermal insulation substrate.

[0126] It also includes a vertical draining step, which is as follows: after soaking, the plate-shaped thermal insulation substrate is taken out and hung vertically to drain for 3 minutes, only removing the excess free impregnation liquid on its surface, without rinsing or wiping it.

[0127] Low-viscosity deep-penetrating silane waterproof impregnation liquid is uniformly sprayed onto both sides of the plate-shaped thermal insulation substrate after the vertical draining step using low-pressure spraying equipment, so that the dry film thickness formed by a single spraying is 0.1mm.

[0128] S3. Low-temperature cross-linking and curing: The plate-shaped thermal insulation substrate after drainage is placed in a ventilated environment at 35°C for low-temperature pre-cross-linking and curing for 35 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid located in the capillary pores is initially cross-linked and formed.

[0129] The silane hydrophobic modification treatment, after employing a composite high-weather-resistance treatment involving overall immersion and low-pressure atomized double-sided spraying, also includes:

[0130] The treated plate-shaped thermal insulation substrate is subjected to a first low-pressure atomized spray coating on both sides to form a microporous closed primer.

[0131] After the first low-pressure atomized spray coating, the plate-shaped thermal insulation substrate was placed in an environment of 36℃ and cured for 15 minutes.

[0132] A second spray coating is applied to the opposite two sides of the cured plate-shaped thermal insulation substrate to form a weather-resistant topcoat.

[0133] S4. Room temperature curing: Place the plate-shaped thermal insulation substrate that has been cured at low temperature in a room temperature and ventilated environment for 22 hours to allow the low viscosity deep-penetrating silane waterproof impregnation liquid to fully cure and form an internal silane hydrophobic barrier layer in the capillary pores of the plate-shaped thermal insulation substrate.

[0134] Example 9

[0135] The same low-viscosity deep-penetrating silane waterproof impregnation solution with the same proportions as in Example 3 was used.

[0136] S1. Substrate pretreatment: Select 40mm thick finished composite expanded polystyrene particle insulation board as the board insulation substrate, use a fan to blow away the floating dust and loose powder on the surface of the board insulation substrate, and control its moisture content to below 10%.

[0137] S2. Silane hydrophobic modification treatment: The pretreated plate-shaped thermal insulation substrate is completely immersed in a low-viscosity deep-penetrating silane waterproof impregnation liquid and soaked at 30°C for 12 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the core layer along the capillary pores inside the plate-shaped thermal insulation substrate.

[0138] It also includes a vertical draining step, which is as follows: after soaking, the plate-shaped thermal insulation substrate is taken out and hung vertically to drain for 4 minutes, only removing the excess free impregnation liquid on its surface, without rinsing or wiping it.

[0139] Low-viscosity deep-penetrating silane waterproof impregnation liquid is uniformly sprayed onto both sides of the plate-shaped thermal insulation substrate after the vertical draining step using low-pressure spraying equipment, so that the dry film thickness formed by a single spraying is 0.15mm.

[0140] S3. Low-temperature cross-linking and curing: The plate-shaped thermal insulation substrate after drainage is placed in a ventilated environment at 42°C for low-temperature pre-cross-linking and curing for 50 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid located in the capillary pores is initially cross-linked and formed.

[0141] The silane hydrophobic modification treatment, after employing a composite high-weather-resistance treatment involving overall immersion and low-pressure atomized double-sided spraying, also includes:

[0142] The treated plate-shaped thermal insulation substrate is subjected to a first low-pressure atomized spray coating on both sides to form a microporous closed primer.

[0143] After the first low-pressure atomized spray coating, the plate-shaped thermal insulation substrate was placed in an environment of 42℃ and cured for 20 minutes.

[0144] A second spray coating is applied to the opposite two sides of the cured plate-shaped thermal insulation substrate to form a weather-resistant topcoat.

[0145] S4. Room temperature curing: Place the plate-shaped insulation substrate in a room temperature and ventilated environment for 24 hours to allow the low viscosity deep-penetrating silane waterproof impregnation liquid to fully solidify and form an internal silane hydrophobic barrier layer in the capillary pores of the plate-shaped insulation substrate.

[0146] Experimental Example 1: Preparation and Performance Verification of Monolithically Immersed Modified Insulation Board

[0147] This experimental example is used to verify the hydrophobic and water-absorbing properties of the finished composite expanded polystyrene particle insulation board after being modified by overall immersion in a low-viscosity deep-penetrating silane waterproof impregnation solution.

[0148] I. Experimental Materials

[0149] Finished composite expanded polystyrene particle insulation boards of the same production batch and with a thickness of 40mm were selected as the board-shaped insulation substrate. A 40% solids content methylsilane hydrolysate, a 20% concentration nano-fumed silica aqueous dispersion, an organofluorine low-surface-tension penetrating agent, an organozirconium low-temperature crosslinking curing agent, and deionized water were selected as the impregnation liquid raw materials.

[0150] The dosage of each component is shown in the table below, based on the preparation of 10 kg of low-viscosity deep-penetrating silane waterproof impregnation solution.

[0151] 40% solids content methylsilane hydrolysate 56% 5.60kg 20% concentration of nano-fumed silica aqueous dispersion 24% 2.40kg Organic fluorine low surface tension penetration aid 6% 0.60kg Organozzirconium low-temperature crosslinking curing agent 5% 0.50kg Deionized water 9% 0.90kg total 100% 10.00kg

[0152] II. Preparation of Low-Viscosity Deep-Penetrating Silane Waterproofing Impregnation Solution

[0153] Weigh out the following amounts respectively: methylsilane hydrolysate, nano-fumed silica aqueous dispersion, organofluorine low surface tension penetrating agent, organozirconium low-temperature crosslinking curing agent, and deionized water.

[0154] The weighed components are added to a clean mixing container and stirred continuously at room temperature to ensure thorough mixing until the resulting mixture is homogeneous and no obvious stratification or solid precipitation is observed, thus obtaining a low-viscosity, deep-penetrating silane waterproof impregnation solution.

[0155] The prepared impregnation solution was tested and found to have a viscosity of 12 mPa·s and a pH of 8, which meet the requirements for capillary penetration and low-temperature cross-linking curing.

[0156] III. Experimental Process of Insulation Board Modification

[0157] S1. Substrate pretreatment:

[0158] Select finished composite expanded polystyrene particle insulation boards that are intact in appearance and free from obvious cracks, missing corners, and severe powder shedding.

[0159] A blower was used to sequentially blow the two sides and four sides of the board-shaped insulation substrate to remove surface dust and loose powder. The moisture content of the board-shaped insulation substrate was then measured. If the moisture content was higher than 10%, the board-shaped insulation substrate was placed in a room-temperature, ventilated environment to dry until its moisture content decreased to below 10%.

[0160] By removing dust and loose powder from the surface of the board, the impact of impurities on the adhesion and penetration of the impregnation solution can be reduced; by controlling the moisture content to below 10%, the obstruction of the impregnation solution by residual moisture in the capillary pores can be reduced.

[0161] S2, Silane hydrophobic modification treatment:

[0162] Add the prepared low-viscosity deep-penetrating silane waterproof impregnation solution into the impregnation tank, and control the temperature of the impregnation solution at 25℃.

[0163] Slowly place the pretreated sheet-like thermal insulation substrate into the impregnation tank, ensuring that both sides and all four sides of the substrate are completely submerged in the impregnation solution. Start timing when the substrate is completely submerged and maintain immersion for 8 minutes.

[0164] During the immersion process, the low-viscosity deep-penetrating silane waterproof impregnation liquid comes into full contact with all the outer surfaces of the plate-shaped thermal insulation substrate, and penetrates into the interior of the plate-shaped thermal insulation substrate along the capillary pores under capillary action.

[0165] Among them, the organic fluorine low surface tension penetration aid is used to reduce the surface tension of the impregnation liquid and reduce the interfacial resistance encountered by the impregnation liquid when entering the micropores, thereby promoting the entry of methyl silane hydrolysate, nano-fumed silica aqueous dispersion and organic zirconium low-temperature crosslinking curing agent into the interior of the plate-shaped thermal insulation substrate.

[0166] Vertical drainage treatment:

[0167] After soaking, slowly remove the plate-shaped thermal insulation substrate from the impregnation tank and immediately hang it vertically on the draining rack, keeping it vertical for 3 minutes to drain.

[0168] During the draining process, excess free impregnating liquid on the surface of the plate-shaped insulation substrate is allowed to drip off naturally without rinsing, wiping, or squeezing the plate-shaped insulation substrate, so as to avoid removing the impregnating liquid that has adhered to the surface of the board or entered the capillary pores.

[0169] Vertical dripping can reduce localized accumulation of impregnating liquid on the surface of the board, making the amount of impregnating liquid adhering to different positions of the board-shaped thermal insulation substrate more uniform, and is conducive to the formation of a relatively uniform silane hydrophobic modified layer during the subsequent curing process.

[0170] S3, Low-temperature pre-crosslinking curing

[0171] Place the finished, drained sheet-like insulation substrate into a constant-temperature, ventilated curing environment, keeping adjacent sheets spaced apart to prevent the sheets from touching each other.

[0172] The curing temperature was controlled at 35℃, and the plate-shaped thermal insulation substrate was subjected to low-temperature pre-crosslinking curing for 35 minutes.

[0173] During the low-temperature pre-crosslinking curing process, the organozirconium low-temperature crosslinking curing agent promotes the crosslinking reaction of the methylsilane system, so that the impregnating liquid entering the capillary pores of the board is initially fixed on the surface of the pore wall, reducing the loss and migration of the impregnating liquid during the subsequent curing process.

[0174] S4, room temperature maintenance

[0175] After the low-temperature pre-crosslinking curing is completed, the plate-shaped thermal insulation substrate is removed from the curing environment and placed in a room-temperature ventilated environment for static curing for 16 hours.

[0176] During the curing process, the sheet-like insulation substrate should be protected from rain, pressure, and surface contamination to allow the impregnation solution to further cross-link and cure. After curing, a silane hydrophobic modified layer is formed inside the sheet-like insulation substrate, resulting in a silane deep hydrophobic modified building energy-saving insulation board.

[0177] IV. Performance Testing

[0178] Hydrophobicity test:

[0179] Hydrophobicity test samples were prepared from the cured silane deep hydrophobic modified building energy-saving insulation board. After removing loose particles from the sample surface, the condition and mass of the sample before testing were recorded.

[0180] The sample is installed in the hydrophobicity testing device, and the sample surface is sprayed with water. After spraying, the free water on the sample surface is removed, the amount of water absorbed by the sample is measured, and the hydrophobicity of the sample is calculated based on the amount of water absorbed, the sample volume, and the density of water.

[0181] The modified board has a water repellency rate of 98.6% according to the test results.

[0182] Volumetric water absorption rate test:

[0183] Volume water absorption rate test samples were prepared from the silane deep hydrophobic modified building energy-saving insulation board after curing. The length, width and thickness of the samples were measured and the volume of the samples was calculated.

[0184] After drying the sample until its mass stabilizes, weigh it before it absorbs water. Then, immerse the sample in water for a specified immersion time. After the specified immersion time, remove the sample, remove the free water from the sample surface, and weigh the sample after it absorbs water.

[0185] The volumetric water absorption rate of the sample is calculated using the following formula:

[0186]

[0187] in, This refers to the volumetric water absorption rate. This is the mass of the sample before it absorbs water. This refers to the mass of the sample after it absorbs water. The density of water under the experimental conditions; The volume is the sample volume.

[0188] The modified board has a volume water absorption rate of 3.0%.

[0189] Combustion performance testing:

[0190] Combustion performance test samples were prepared from the cured silane deep hydrophobic modified building energy-saving insulation board, and the combustion performance of the samples was tested.

[0191] The modified board was tested and found to have a fire performance rating of Class A.

[0192] V. Experimental Results

[0193] The test results obtained in this experiment are shown in the table below.

[0194] Impregnation solution viscosity 12 mPa·s pH value of impregnation solution 8 Water repellency of modified boards 98.6% Modified board volume water absorption rate 3.0% Modified board fire performance rating Grade A

[0195] VI. Analysis of Experimental Results

[0196] Test results showed that the water repellency of the modified board reached 98.6%, indicating that after overall immersion, low-temperature pre-crosslinking curing and room temperature curing, the board-shaped thermal insulation substrate has a strong water repellency.

[0197] After cross-linking and curing, methylsilane hydrolysate can bind to the surface of the capillary pores in the board, reducing the surface energy of the pore walls and making it difficult for moisture to wet the pore walls and migrate into the interior of the board along the pores. Organic fluorine low surface tension penetrating aids can reduce the surface tension of the impregnation liquid, allowing the impregnation liquid to enter the smaller capillary pores inside the board, thus enabling the hydrophobic modification effect to not only form on the surface of the board but also extend into the interior of the board.

[0198] The modified board exhibits a volumetric water absorption rate of 3.0%, indicating that the amount of water entering the internal pores under immersion conditions is effectively suppressed. Nano-fumed silica can distribute within some of the micropores and capillary water absorption channels of the board, filling the micropores; the cross-linked and cured methylsilane system forms a hydrophobic structure on the pore wall surface. The two work together to reduce the effective channels for water to enter the pores and decrease the wetting and adsorption capacity of the pore walls for water, thereby reducing the volumetric water absorption rate of the board.

[0199] The impregnation solution used in this experiment had a viscosity of 12 mPa·s, maintaining good fluidity. By completely immersing the plate-shaped insulation substrate in the impregnation solution, allowing the solution to simultaneously enter the internal pores from both sides of the plate and the four sides, the uneven penetration caused by single-sided treatment can be reduced.

[0200] Low-temperature pre-crosslinking curing and room-temperature curing work synergistically. Low-temperature pre-crosslinking curing at 35℃ can initially fix the impregnating liquid in the pores, reducing its loss and the possibility of migration to the outer surface of the board; the subsequent 16 hours of room-temperature curing allows the silane system to further complete crosslinking and curing, improving the stability of the silane hydrophobic modified layer.

[0201] The modified board has a fire performance rating of Class A, indicating that under the impregnation solution formulation, soaking time and curing conditions used in this experiment, the hydrophobic modification treatment did not lead to a decrease in the fire performance rating of the board, and can maintain its original fire performance while improving the waterproof performance of the board.

[0202] Based on the experimental data above, it can be seen that using a low-viscosity, deep-penetrating silane waterproof impregnation solution prepared with 56% methylsilane hydrolysate, 24% nano-fumed silica aqueous dispersion, 6% organic fluorine low-surface-tension penetrating agent, 5% organic zirconium low-temperature crosslinking curing agent, and 9% deionized water, and then sequentially subjecting the finished composite expanded polystyrene particle insulation board to overall immersion, vertical draining, low-temperature pre-crosslinking curing, and room-temperature curing, can form a stable silane hydrophobic modified layer in the capillary pores of the board, improve the water-repellent properties of the board, reduce the volume water absorption rate of the board, and maintain the board's combustion performance rating.

[0203] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in the present invention, and these should all be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A silane-modified deep hydrophobic building energy-saving insulation board, characterized in that, include: The sheet-like insulation substrate is a finished composite expanded polystyrene particle insulation board with capillary pores inside. A silane hydrophobic modified layer is bonded to the plate-shaped thermal insulation substrate and is formed by curing a low-viscosity, deep-penetrating silane waterproof impregnation liquid. The low-viscosity deep-penetrating silane waterproofing impregnation solution has a viscosity of 8–12 mPa·s and a pH value of 6.5–8, and comprises the following components by weight percentage: The methylsilane hydrolysate with a solid content of 40% has a content of 45%–56%. A 20% concentration nano-fumed silica aqueous dispersion (18%–24%); Organic fluorine low surface tension penetration aid 3%–6%; Organozzirconium low-temperature crosslinking curing agent 2%–5%; The remainder is deionized water.

2. The silane deep hydrophobic modified building energy-saving insulation board according to claim 1, characterized in that, The silane deep hydrophobic modified building energy-saving insulation board has a water repellency of not less than 98%, a volume water absorption rate of not more than 3.5%, and its thermal conductivity is not more than 0.003 W / (m·K) different from that of the original board-shaped insulation substrate.

3. A method for preparing a silane-modified deep hydrophobic building energy-saving insulation board, characterized in that, Includes the following steps: S1. Substrate pretreatment: Select finished composite expanded polystyrene particle insulation board as the board insulation substrate, blow away the floating dust and loose powder on the surface of the board insulation substrate, and control the moisture content of the board insulation substrate to below 10%. S2. Silane hydrophobic modification treatment: The pretreated plate-shaped thermal insulation substrate is brought into contact with a low-viscosity deep-penetrating silane waterproof impregnation liquid, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the capillary pores of the plate-shaped thermal insulation substrate or adheres to the surface of the plate-shaped thermal insulation substrate. S3. Low-temperature cross-linking and curing: The plate-shaped thermal insulation substrate that has been modified by hydrophobic silane is placed in a ventilated environment at 30-42°C for curing, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid is cross-linked and formed. S4. Room temperature curing: The plate-shaped thermal insulation substrate that has been cross-linked and cured at low temperature is placed in a room temperature ventilated environment for static curing, so that the low viscosity deep penetration silane waterproof impregnation liquid is completely cured, and silane deep hydrophobic modified building energy-saving thermal insulation board is obtained. The low-viscosity deep-penetrating silane waterproofing impregnation solution has a viscosity of 8–12 mPa·s and a pH value of 6.5–8, and comprises the following components by weight percentage: The mixture consists of 45%–56% methylsilane hydrolysate with a solid content of 40%, 18%–24% nano-fumed silica aqueous dispersion with a concentration of 20%, 3%–6% organic fluorine low surface tension penetrating agent, 2%–5% organic zirconium low-temperature crosslinking curing agent, and the remainder deionized water.

4. The method for preparing a silane-modified deep hydrophobic building energy-saving insulation board according to claim 3, characterized in that, The silane hydrophobic modification treatment in S2 is carried out by a complete immersion soaking method, specifically including: The pretreated plate-shaped thermal insulation substrate is completely immersed in the low-viscosity deep-penetrating silane waterproof impregnation liquid and soaked at 22-30°C for 6-12 minutes, so that the low-viscosity deep-penetrating silane waterproof impregnation liquid penetrates into the core layer of the plate-shaped thermal insulation substrate along the capillary pores.

5. The method for preparing a silane-modified deep hydrophobic building energy-saving insulation board according to claim 4, characterized in that, Following S2, a vertical draining step is also included, specifically: After soaking, remove the plate-shaped thermal insulation substrate and hang it vertically to drain the liquid for 2-4 minutes to remove excess free impregnation liquid from the surface of the plate-shaped thermal insulation substrate.

6. The method for preparing a silane-modified deep hydrophobic building energy-saving insulation board according to claim 3, characterized in that, The silane hydrophobic modification treatment in S2 can also be carried out using a low-pressure atomized double-sided spraying method, specifically including: The low-viscosity deep-penetrating silane waterproof impregnation liquid is uniformly sprayed onto both sides of the plate-shaped thermal insulation substrate using a low-pressure spraying equipment. The dry film thickness formed by a single spraying is 0.08 to 0.15 mm.

7. The method for preparing a silane-modified deep hydrophobic building energy-saving insulation board according to claim 3, characterized in that, Following step S3, the following is also included: The treated plate-shaped thermal insulation substrate is subjected to a first low-pressure atomized spray coating on both sides to form a microporous closed primer. The plate-shaped thermal insulation substrate after the first low-pressure atomized spray coating is placed in an environment of 30-42℃ and cured for 10-20 minutes. A second spray coating is applied to the opposite two sides of the cured plate-shaped thermal insulation substrate to form a weather-resistant topcoat.

8. The method for preparing a silane-modified deep hydrophobic building energy-saving insulation board according to claim 3, characterized in that, The low-temperature cross-linking curing time in S3 is 25–60 min.

9. The method for preparing a silane-modified deep hydrophobic building energy-saving insulation board according to claim 3, characterized in that, The ambient temperature curing time in S4 is 12–24 hours.

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