A semiconductor package baking apparatus

Abstract

The application discloses a semiconductor package baking device, and relates to the technical field of semiconductor production, which comprises a bearing table, a plurality of heating plates are stacked on the bearing table, a support frame is fixedly arranged on the bearing table, a plurality of pressing members are arranged on the top of the support frame, the driving ends of the plurality of pressing members abut against the top heating plate, a plurality of jacking members are arranged on the two sides of the support frame, the driving ends of the plurality of jacking members are connected with the plurality of heating plates respectively, a plurality of guide rods are fixedly arranged on the bearing table, a plurality of guide blocks are slidably arranged on each guide rod, the plurality of guide blocks are fixedly connected with the plurality of heating plates respectively, and a stacking opening and closing mechanism is arranged in the bearing table and is used for separating adjacent heating plates. The plurality of jacking members of the application apply different jacking forces to each layer of heating plates, the influence of gravity on each layer of heating plates is overcome, then the pressing members apply equal pressure to the plurality of heating plates, so that the pressure borne by each layer of chips in the baking device is the same.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor packaging baking apparatus. Background Technology

[0002] Semiconductor packaging refers to the process of encapsulating a chip in a support carrier using specific techniques to protect it from external environmental influences. Semiconductor packaging baking equipment typically includes an oven and a support platform. After the semiconductor component is encapsulated, it is placed in the oven for further curing. Driven by a mechanism, the oven comes into contact with the support platform, applying pressure and heating the semiconductor component. The pressure applied during baking is a key parameter affecting the curing quality. Insufficient pressure may lead to incomplete curing of the adhesive material, resulting in bubbles or voids; excessive pressure may damage the chip or cause warping of the package.

[0003] Currently, in existing semiconductor packaging baking equipment, the oven often consists of a multi-layered structure (such as multiple hot press plates or stacked heating layers), and its downward pressing action is driven by a pressing cylinder. However, each layer of the oven has its own weight. In a multi-layered structure, the gravity of the upper layer components is transferred and superimposed to the lower layers. Therefore, the bottom layer of the oven experiences the greatest gravitational impact, while the top layer experiences the least. This top-down cumulative gravitational effect results in a significant difference in the pressure applied by different layers when the oven contacts the semiconductor device; the pressure applied to the lower layer is much greater than that to the upper layer, leading to uneven pressure on the surface of different chip layers. Summary of the Invention

[0004] To improve the problem of uneven pressure on chips on different layers of an oven, this application provides a semiconductor packaging baking apparatus.

[0005] The semiconductor packaging baking apparatus provided in this application adopts the following technical solution: A semiconductor packaging baking apparatus includes a support platform with multiple heating plates stacked on it. A support frame is fixedly mounted on the support platform, and multiple pressure-applying components are provided on the top of the support frame. The driving ends of the multiple pressure-applying components abut against the top heating plate. Multiple lifting components are provided on both sides of the support frame, and the driving ends of the multiple lifting components are respectively connected to the multiple heating plates. Multiple guide rods are fixedly mounted on the support platform, and multiple guide blocks are slidably mounted on each guide rod. The multiple guide blocks are respectively fixedly connected to the multiple heating plates. A stacking opening and closing mechanism is provided inside the support platform for separating adjacent heating plates.

[0006] By adopting the above technical solution, the stacking opening and closing mechanism drives the heating plate to move. The heating plate moves up and down on the guide rod through the guide block, so that adjacent heating plates are separated, making it easier for the chip to be put into the heating plate or taken out of the heating plate. Multiple lifting components apply different lifting forces to each heating plate to overcome the influence of gravity on each heating plate. Then, the pressure application component applies equal pressure to the multi-layer heating plates, so that the pressure on each layer of chip in the baking device is the same.

[0007] Preferably, a plurality of lifting plates are slidably arranged on the support frame, and a connecting plate is fixedly arranged at the end of each lifting plate. The plurality of connecting plates are respectively fixedly connected to a plurality of heating plates. A support plate is fixedly arranged on the support frame, and a plurality of lifting components are fixedly arranged on the support plate. Each lifting component has a lifting plate fixedly arranged at its lifting end, and the plurality of lifting plates are respectively fixedly connected to a plurality of lifting plates.

[0008] By adopting the above technical solution, the lifting component transmits the lifting force to the heating plate through the lifting plate, the lifting plate and the connecting plate, so that the heating plate overcomes the influence of gravity. When the stacking opening and closing mechanism drives the heating plate to move, the heating plate drives the lifting plate to move up and down on the support frame through the connecting plate, making the lifting and moving of the heating plate more stable.

[0009] Preferably, the driving ends of the plurality of pressure-applying components are fixedly provided with pressure plates, and the pressure plates are adapted to abut against the top of the heating plate.

[0010] By adopting the above technical solution, the pressure of multiple pressure-applying components is transmitted to the heating plate through the pressure plate, making the pressure on multiple chips in the heating plate more uniform.

[0011] Preferably, the stacked opening and closing mechanism includes a lifting component, two translation components and four drive components. The lifting component is disposed at the bottom of the support platform, the two translation components are symmetrically disposed at the lifting end of the lifting component, and the four drive components are respectively disposed at the translation end of the two translation components. The drive end of the drive component is used to drive the adjacent upper heating plate to move upward and restrict the movement of the adjacent lower heating plate.

[0012] By adopting the above technical solution, the lifting component drives four driving components to move up and down through two translation components. The two translation components drive the four driving components to move towards or away from the heating plate. When the driving component moves towards the heating plate, the driving end of the driving component is connected to the two adjacent heating plates. The driving end of the driving component drives the adjacent upper heating plate to move up and restricts the movement of the adjacent lower heating plate, thereby separating the adjacent heating plates.

[0013] Preferably, the lifting assembly includes a drive component, a lead screw, and a lifting frame. The drive component is disposed at the bottom of the support platform. The lead screw is rotatably disposed within the support platform and is connected to the drive end of the drive component. The lifting frame is slidably disposed within the support platform in a vertical direction. The lead screw is threaded through the lifting frame. Two translation components are disposed on the lifting frame.

[0014] By adopting the above technical solution, the driving component drives the lead screw to rotate, the lead screw drives the lifting frame to move up and down, and the lifting frame then drives the two translation components to move up and down.

[0015] Preferably, the translation assembly includes a translation component and a translation frame. The translation frame is fixedly mounted on the lifting assembly and is slidably mounted on the lifting assembly in a horizontal direction. The driving end of the translation component is connected to the translation frame, and every two driving assemblies are located at both ends of a translation frame.

[0016] By adopting the above technical solution, the translation component drives the translation frame to move on the lifting assembly, and the translation frame then drives the drive assembly to move, which can drive the drive assembly to move towards or away from the heating plate.

[0017] Preferably, the drive assembly includes a drive frame, an upward fork, a lifting member, a lifting block, and a limiting fork. The drive frame is fixedly mounted on the translation assembly, the upward fork is fixedly mounted on the top of the drive frame, the lifting member is fixedly mounted on the drive frame, the lifting block is slidably mounted on the drive frame and connected to the drive end of the lifting member, the limiting fork is mounted on the lifting block and located below the upward fork, and two fork slots are formed in the opposite side walls of the heating plate, with the upward fork and the limiting fork respectively inserted into the fork slots of the adjacent heating plate.

[0018] By adopting the above technical solution, the lifting component and the translation component drive the upward fork and the limiting fork to move, so that the upward fork and the limiting fork are respectively inserted into the fork slots of the adjacent heating plates. Then, the lifting component drives the upward fork to move upward through the translation component and the drive frame. The upward fork drives the upper heating plate to move upward. The lifting component drives the limiting fork to move downward through the lifting block, which counteracts the upward movement of the drive frame, so that the limiting fork remains stationary and restricts the lower heating plate from being pressed tightly onto the support platform, thereby separating the adjacent heating plates.

[0019] Preferably, each heating plate has a sleeve embedded at one of its four corners. A sliding column is slidably disposed inside the sleeve along its own axis. A pressure-bearing contact is disposed at the bottom end of the sliding column. The pressure-bearing contact is slidably disposed inside the sleeve. An elastic energy-absorbing element is sleeved on the sliding column. The two ends of the elastic energy-absorbing element abut against the pressure-bearing contact and the sleeve, respectively. The elastic energy-absorbing element pushes the pressure-bearing contact out of the sleeve.

[0020] By adopting the above technical solution, when the stacking opening and closing mechanism drives the adjacent heating plates to separate and then stack again, the four pressure-bearing contacts at the bottom of the upper heating plate first contact the top wall of the lower heating plate. As the upper heating plate moves continuously, the pressure-bearing contacts are gradually pushed into the sleeve. During the movement of the pressure-bearing contacts, the elastic energy-absorbing component contracts and deforms. The falling kinetic energy of the heating plate is converted into the elastic potential energy of the elastic energy-absorbing component, which realizes the impact buffering when the heating plates are stacked, reduces the collision vibration caused by the stacking of the heating plates, and thus reduces the damage to the chip.

[0021] Preferably, a locking rod is slidably disposed inside the sleeve along its own diameter direction, a locking groove is formed on the side wall of the sliding column, a first elastic element is disposed inside the sleeve for pushing the locking rod to slide into the locking groove, an inclined wall is formed on the top wall of the end of the locking rod, and a ball is rotatably embedded on the top wall of the sliding column at the opening of the locking groove. When the pressure-bearing contact moves into the sleeve and the bottom wall of the pressure-bearing contact is flush with the bottom of the sleeve, the inclined wall of the locking rod contacts the ball, the first elastic element pushes the locking rod to slide into the locking groove, the inclined wall pushes the sliding column to move into the sleeve through the ball, the sliding column drives the pressure-bearing contact to move into the sleeve and separates the bottom wall of the pressure-bearing contact from the lower heating plate.

[0022] By adopting the above technical solution, when adjacent heating plates are stacked, the pressure-bearing contact is pushed into the sleeve by the lower heating plate, making the bottom wall of the pressure-bearing contact flush with the bottom of the sleeve. At this time, the ball contacts the end of the inclined wall of the locking rod, and the first elastic element pushes the locking rod to slide into the locking groove. During the process of the locking rod being inserted into the locking groove, the inclined wall always contacts the ball and drives the sliding column to move into the sleeve through the ball. When the ball moves away from the inclined wall and releases the top wall of the locking rod, the locking rod is fully inserted into the locking groove. At this time, the sliding column drives the pressure-bearing contact to move a small distance into the sleeve, so that the pressure-bearing contact is separated from the top wall of the lower heating plate. With this setting, after the adjacent heating plates are stacked, the locking rod locks the pressure-bearing contact through the sliding column, and the pressure-bearing contact is separated from the top wall of the lower heating plate, so that the elastic force stored in the elastic energy-absorbing element will not be transmitted to the lower heating plate, thereby facilitating the lifting element to perform precise gravity compensation for the heating plate.

[0023] Preferably, an unlocking rod is fixedly installed on the top wall of the heating plate, and an unlocking block is slidably installed on the side wall of the top of the unlocking rod. The top of the unlocking block is chamfered. A second elastic element for pushing the unlocking block to move away from the unlocking rod is provided inside the unlocking rod. A sliding groove is opened in the sleeve along the direction parallel to its own axis. The unlocking rod and the unlocking block are slidably installed in the sliding groove. A through hole is opened in the locking rod. The unlocking rod slides through the through hole. A push groove is obliquely opened on the side wall of the locking rod located at the through hole. The upper and lower ends of the push groove are open. The unlocking block is slidably installed in the push groove. When the unlocking block moves from top to bottom through the push groove, the unlocking block drives the locking rod to slide out of the lock groove. When the unlocking block moves from bottom to top through the through hole, the locking rod drives the unlocking block to retract into the unlocking rod through the chamfer at the top of the unlocking block.

[0024] By adopting the above technical solution, when adjacent heating plates are stacked, the unlocking rod on the lower heating plate slides into the groove of the upper heating plate sleeve and passes through the through hole of the locking rod. During the process of the unlocking rod driving the unlocking block to slide through the through hole, the chamfer on the top of the unlocking block is released from the locking rod. The locking rod pushes the unlocking block into the unlocking rod through the chamfer, so that the unlocking block can pass smoothly through the through hole. Then the second elastic element pushes the unlocking block to slide out of the unlocking rod again. When adjacent heating plates are separated, the unlocking rod drives the unlocking block to move downward relative to the sleeve. The unlocking block moves into the push groove of the locking rod. During the movement of the unlocking block, the inclined push groove drives the locking rod to move out of the locking groove, thereby unlocking the sliding column and the pressure-bearing contact. This allows the elastic energy-absorbing element to release elastic potential energy and push the pressure-bearing contact out of the sleeve, which facilitates impact buffering again.

[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. By using multiple lifting components to apply different lifting forces to each heating plate layer, the influence of gravity on each heating plate layer is overcome. Then, the pressure application component applies equal pressure to the multiple heating plates, so that the pressure on each layer of chip in the baking device is the same. 2. The lifting component uses the lifting plate, the lifting plate and the connecting plate to transfer the lifting force to the heating plate, so that the heating plate overcomes the influence of gravity. When the stacking opening and closing mechanism drives the heating plate to move, the heating plate drives the lifting plate to move up and down on the support frame through the connecting plate, so that the lifting and moving of the heating plate is more stable. 3. The lifting assembly drives four drive assemblies to move up and down through two translation assemblies. The two translation assemblies drive the four drive assemblies to move towards or away from the heating plate. When the drive assemblies move towards the heating plate, the drive end of the drive assemblies is connected to the two adjacent heating plates. The drive end of the drive assemblies drives the adjacent upper heating plate to move up and restricts the movement of the adjacent lower heating plate, thereby separating the adjacent heating plates. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the semiconductor packaging baking apparatus in Embodiment 1 of this application; Figure 2 This is a schematic diagram of the upper part of the semiconductor packaging baking apparatus in Embodiment 1 of this application; Figure 3 This is a schematic diagram of the lower part of the semiconductor packaging baking apparatus in Embodiment 1 of this application; Figure 4 This is a partial structural schematic diagram of the semiconductor packaging baking apparatus in Embodiment 2 of this application; Figure 5 This is a partial structural cross-sectional view of the semiconductor packaging baking apparatus in Embodiment 2 of this application; Figure 6 This is a partial structural cross-sectional view of the semiconductor packaging baking apparatus in Embodiment 2 of this application; Figure 7 For this application Figure 6 Enlarged view of point A in the middle; Figure 8 This is a partially exploded view of the semiconductor packaging baking apparatus in Embodiment 2 of this application; Figure 9 This is a partially exploded cross-sectional view of the semiconductor packaging baking apparatus in Embodiment 2 of this application.

[0027] Reference numerals: 1. Support platform; 2. Heating plate; 3. Support frame; 4. Pressure applying component; 5. Lifting component; 6. Guide rod; 7. Guide block; 8. Stacking opening and closing mechanism; 81. Lifting assembly; 811. Driving component; 812. Lead screw; 813. Lifting frame; 82. Translation assembly; 821. Translation component; 822. Translation frame; 83. Driving assembly; 831. Driving frame; 832. Upward fork; 833. Lifting component; 834. Lifting block; 835. Limiting fork; 9. Lifting plate; 10. 11. Connecting plate; 12. Support plate; 13. Lifting plate; 14. Pressure plate; 15. Fork groove; 16. Sleeve; 17. Sliding column; 18. Pressure-bearing contact; 19. Elastic energy-absorbing component; 20. Locking rod; 21. Locking groove; 22. First elastic component; 23. Inclined wall; 24. Ball bearing; 25. Unlocking rod; 26. Unlocking block; 27. Chamfer; 28. Second elastic component; 29. ​​Perforation; 30. Push groove; 31. Top plate; 32. Limiting ring; 33. Limiting groove; 34. Guide block; 35. Guide groove. Detailed Implementation

[0028] The following is in conjunction with the appendix Figures 1-9 This application will be described in further detail.

[0029] This application discloses a semiconductor packaging baking apparatus.

[0030] Example 1: Reference Figure 1 A semiconductor packaging baking apparatus includes a support platform 1, on which fourteen heating plates 2 are stacked. Each heating plate 2 has guide blocks 7 fixedly installed at both ends of opposite side walls. Guide rods 6 are fixedly installed vertically at the four corners of the top of the support platform 1. Top plates 31 are fixedly installed at the top of the four guide rods 6. The four guide blocks 7 on each heating plate 2 are slidably installed on the four guide rods 6 respectively.

[0031] The support platform 1 is equipped with a stacking opening and closing mechanism 8. The stacking opening and closing mechanism 8 acts on two adjacent heating plates 2. The upper heating plate 2 moves upward and the lower heating plate 2 remains stationary, thereby separating the two adjacent heating plates 2 and facilitating the removal and placement of chips in the heating plates 2.

[0032] A support frame 3 is fixedly installed on the top of the support platform 1, and the support frame 3 covers multiple heating plates 2. Multiple pressure-applying components 4 are fixedly installed on the top of the support frame 3, and pressure plates 13 are fixedly installed on the bottom of the multiple pressure-applying components 4. In this application, the pressure-applying components 4 can be cylinders, and the pressure plates 13 abut against the top wall of the uppermost heating plate 2.

[0033] Reference Figure 2 Two support plates 11 are fixedly installed on each opposite side of the support frame 3. Seven lifting components 5 are fixedly installed on each support plate 11. In this application, the lifting components 5 can be cylinders. A lifting plate 12 is fixedly installed on the lifting end of the top of each lifting component 5. The seven lifting plates 12 have different lengths.

[0034] Each heating plate 2 has a connecting plate 10 fixedly installed at both ends of opposite side walls. A lifting plate 9 is fixedly installed on the two connecting plates 10 on one side of each heating plate 2. The lifting plate 9 is slidably installed on the support frame 3 in the vertical direction through a slider and a guide rail. Multiple lifting plates 12 are fixedly connected to multiple lifting plates 9 respectively.

[0035] Multiple lifting components 5 apply lifting force to multiple heating plates 2 through the force transmission path formed by the lifting plate 12, the lifting plate 9 and the connecting plate 10, so as to balance the gravity of each heating plate 2 and eliminate the load difference caused by the superposition of gravity between layers; then, the pressing component 4 applies uniform pressing force to the multi-layer heating plates 2 through the pressing plate 13 to ensure that the chips in each heating plate 2 bear the same pressure load during the baking process.

[0036] When the stacking opening and closing mechanism 8 drives the heating plate 2 to rise and fall, the heating plate 2 sequentially drives the lifting plate 9 to slide on the support frame 3 through the connecting plate 10. At the same time, the heating plate 2 drives the guide block 7 to slide on the guide rod 6. The two guide structures work together to enhance the motion stability and positional accuracy of the heating plate 2 during the lifting and falling process.

[0037] Reference Figure 1 and Figure 3 Specifically, the stacked opening and closing mechanism 8 includes a lifting component 81, two translation components 82 and four drive components 83. The two translation components 82 are symmetrically mounted on the lifting component 81, and the four drive components 83 are respectively mounted on the two translation components 82.

[0038] The lifting assembly 81 includes a drive component 811, a lead screw 812, and a lifting frame 813. The drive component 811 is fixedly installed at the bottom of the support platform 1. In this application, the drive component 811 can be a servo motor. The lead screw 812 is rotatably installed inside the support platform 1, and its bottom end is connected to the drive end of the drive component 811 via a synchronous belt. The lifting frame 813 is slidably installed inside the support platform 1 in the vertical direction via a slider and a guide rail, and the lead screw 812 is threaded through the middle of the lifting frame 813. The drive component 811 drives the lead screw 812 to rotate in both directions, and the lead screw 812 can drive the lifting frame 813 to move up and down.

[0039] The translation assembly 82 includes a translation component 821 and a translation frame 822. The translation component 821 is fixedly installed on the lifting frame 813, and the translation frame 822 is slidably installed on the lifting frame 813 in the horizontal direction via a slider and a guide rail. In this application, the translation component 821 can be a cylinder.

[0040] The drive assembly 83 includes a drive frame 831, an upward fork 832, a lifting member 833, a lifting block 834, and a limiting fork 835. The drive frame 831 is fixedly installed at the end of the translation frame 822 in the length direction, and the upward fork 832 is fixedly installed at the top of the drive frame 831 and located on the side close to the heating plate 2.

[0041] The lifting component 833 is fixedly installed on the side wall of the drive frame 831, and the lifting block 834 is slidably installed on the side wall of the drive frame 831 in the vertical direction via guide rails and sliders. The limiting fork 835 is fixedly installed on the top of the lifting block 834, and the limiting fork 835 is located below the upward fork 832. In this application, the lifting component 833 can be a cylinder, and the lifting end of the lifting component 833 is fixedly connected to the bottom end of the lifting block 834. Each heating plate 2 has fork slots 14 at both ends of opposite side walls, and the upward fork 832 and the limiting fork 835 move into the fork slots 14 of the upper heating plate 2 and the lower heating plate 2, respectively.

[0042] The lifting assembly 81 and the translation assembly 82 work together to drive four sets of upward forks 832 and limiting forks 835 to move, so that they respectively insert into the fork slots 14 on the side walls of the two adjacent heating plates 2, completing the positioning and engagement. Subsequently, the lifting assembly 81 drives the upward forks 832 to move upward via the translation assembly 82 and the drive frame 831, and the upward forks 832 lift the upper heating plate 2 to rise synchronously; at the same time, the lifting component 833 drives the lifting block 834 to move the limiting forks 835 downward to compensate for the positional change caused by the rise of the drive frame 831, so that the limiting forks 835 remain stationary in space, thereby pressing the lower heating plate 2 tightly onto the support platform 1. Through the lifting action of the upward forks 832 and the limiting constraint of the limiting forks 835, the reliable separation of adjacent heating plates 2 is achieved.

[0043] The implementation principle of a semiconductor packaging baking apparatus according to an embodiment of this application is as follows: Multiple lifting members 5 apply lifting force to multiple heating plates 2 through a force transmission path formed by lifting plate 12, lifting plate 9, and connecting plate 10, so as to balance the gravity of each heating plate 2 and eliminate the load difference caused by the superposition of gravity between layers. The pressure member 4 applies uniform pressing force to the multi-layer heating plates 2 through the pressure plate 13, thereby ensuring that the chips in each heating plate 2 bear the same pressure load during the baking process.

[0044] Example 2: Reference Figure 4 , Figure 5 and Figure 6 The difference between this embodiment and embodiment 1 is that a sleeve 15 is fixedly embedded at the four corners of the bottom wall of each heating plate 2, and a sliding column 16 is slidably installed inside the sleeve 15 along its own axis. A pressure-bearing contact 17 is fixedly installed at the bottom of the sliding column 16, and the pressure-bearing contact 17 is slidably installed inside the sleeve 15 along the axis of the sleeve 15.

[0045] Reference Figure 6 , Figure 7 and Figure 8 An elastic energy-absorbing element 18 is fitted onto the sliding column 16. In this application, the elastic energy-absorbing element 18 can be a stacked spring, with its top end abutting against the inner wall of the sleeve 15 and its bottom end abutting against the top wall of the pressure-bearing contact 17. A limiting ring 32 is fixedly installed at the top end of the sliding column 16, and a limiting groove 33 is formed inside the sleeve 15, with the limiting ring 32 sliding within the limiting groove 33. The elastic energy-absorbing element 18 pushes the pressure-bearing contact 17 out of the sleeve 15. The pressure-bearing contact 17 moves the limiting ring 32 via the sliding column 16, and the limiting groove 33 limits the movement of the pressure-bearing contact 17 through the limiting ring 32, preventing the pressure-bearing contact 17 from falling out of the sleeve 15.

[0046] Four guide blocks 34 are fixedly installed at equal intervals along the outer side wall of the sliding column 16, and four guide grooves 35 are equally spaced along the inner side wall of the sleeve 15. The four guide blocks 34 slide in the four guide grooves 35 respectively, so that the sliding column 16 will not rotate when it is raised and lowered.

[0047] When the stacking opening and closing mechanism 8 drives the adjacent heating plates 2 to switch from a separated state to a stacked state, the four pressure-bearing contacts 17 located at the bottom of the upper heating plate 2 first contact the top wall of the lower heating plate 2. As the upper heating plate 2 continues to descend, the pressure-bearing contacts 17 are gradually pushed into the corresponding sleeves 15, and during the movement, they drive the elastic energy-absorbing element 18 to undergo compression deformation, converting the kinetic energy of the falling heating plate 2 into the elastic potential energy of the elastic energy-absorbing element 18, thereby forming a buffer effect during the stacking process, effectively attenuating the structural vibration caused by the stacking impact, and reducing the risk of chip damage due to collision.

[0048] A locking rod 19 is slidably installed inside the sleeve 15 along its own diameter direction, and four locking rods 19 are installed at equal intervals along the circumference of the sleeve 15. A locking groove 20 is provided on the side wall of the sliding column 16, and four locking grooves 20 are provided at equal intervals along the circumference of the sliding column 16, and the four locking grooves 20 correspond one-to-one with the four locking rods 19.

[0049] Two first elastic elements 21 are installed at the ends of each locking rod 19 away from the slide post 16. In this application, the first elastic element 21 can be a spring. The top of the locking rod 19 near the slide post 16 is inclined with an inclined wall 22. The slide post 16 is rotatably embedded with a ball bearing 23 in the top wall of the opening end of each locking groove 20.

[0050] When the pressure-bearing contact 17 is fully inserted into the sleeve 15, the first elastic element 21 can push the locking rod 19 to slide into the locking groove 20. The inclined wall 22 of the locking rod 19 first contacts the ball 23. As the locking rod 19 is continuously inserted into the locking groove 20, the inclined wall 22 drives the pressure-bearing contact 17 to move into the sleeve 15 through the ball 23, so that the pressure-bearing contact 17 can be separated from the lower heating plate 2.

[0051] Reference Figure 6 , Figure 8 and Figure 9 Four unlocking rods 24 are fixedly installed at the four corners of the top wall of the heating plate 2. Two unlocking blocks 25 are symmetrically slidably installed at the top of each unlocking rod 24, and each unlocking block 25 has a chamfer 26 at its top. A second elastic element 27 is installed inside the unlocking rod 24. The two ends of the second elastic element 27 are connected to the two unlocking blocks 25. In this application, the second elastic element 27 can be a spring, and the second elastic element 27 can push the two unlocking blocks 25 to slide out of the unlocking rod 24.

[0052] The sleeve 15 has a sliding groove along its own axis. Four sliding grooves are equally spaced along the circumference of the sleeve 15, and four unlocking rods 24 and eight unlocking blocks 25 are slidably installed in the four sliding grooves respectively.

[0053] Each locking lever 19 has a through hole 29 inside, the width of which is greater than the width of the unlocking lever 24, and the unlocking lever 24 slides through the through hole 29. The unlocking lever 24 has push grooves 30 on the opposite side walls of the through hole 29, the top of which is inclined away from the sliding post 16, and the two unlocking blocks 25 on the unlocking lever 24 slide through the two push grooves 30.

[0054] When the adjacent heating plates 2 are fully overlapped, the pressure-bearing contact 17 is pushed into the sleeve 15 by the lower heating plate 2, with its bottom wall flush with the lower end face of the sleeve 15. At this time, the ball 23 contacts the end of the inclined wall 22 of the locking rod 19, and the first elastic element 21 drives the locking rod 19 to slide into the locking groove 20. During the insertion of the locking rod 19, its inclined wall 22 always maintains rolling contact with the ball 23, and pushes the sliding column 16 further into the sleeve 15 through the ball 23; when the ball 23 moves to disengage from the inclined wall 22, the locking rod 19 is fully embedded in the locking groove 20, and the sliding column 16 then drives the pressure-bearing contact 17 to retract into the sleeve 15 by a preset clearance stroke, so that the pressure-bearing contact 17 separates from the top wall of the lower heating plate 2.

[0055] With the above-mentioned structural cooperation, after the adjacent heating plates 2 are stacked, the locking rod 19 locks and holds the pressure-bearing contact 17 through the sliding column 16, and the pressure-bearing contact 17 is in a disengaged state from the top wall of the lower heating plate 2. The elastic force stored in the elastic energy-absorbing component 18 forms an internal force closed loop in the locked state and is not transmitted to the heating plate 2, thereby providing favorable conditions for the lifting component 5 to implement precise gravity compensation.

[0056] With adjacent heating plates 2 stacked, the unlocking rod 24 on the lower heating plate 2 slides into the groove of the sleeve 15 of the upper heating plate 2 and passes through the perforation 29 on the locking rod 19. As the unlocking rod 24 passes through the perforation 29, the chamfer 26 on the top of the unlocking block 25 makes sliding contact with the edge of the perforation 29. Under the guidance of the chamfer 26, the unlocking block 25 is pushed into the unlocking rod 24 to pass smoothly through the perforation 29. After passing through, the second elastic element 27 pushes the unlocking block 25 out of the unlocking rod 24 again.

[0057] When adjacent heating plates 2 switch from a stacked state to a separated state, the unlocking rod 24 drives the unlocking block 25 to move downward relative to the sleeve 15, causing the unlocking block 25 to enter the push groove 30 of the locking rod 19. As the unlocking block 25 slides along the push groove 30, the inclined guide surface of the push groove 30 pushes the locking rod 19 to move in the opposite direction, causing it to disengage from the locking groove 20, thereby releasing the locking state of the sliding column 16 and the pressure-bearing contact 17. The elastic energy-absorbing element 18 then releases the stored elastic potential energy, pushing the pressure-bearing contact 17 out of the sleeve 15 and returning it to the buffering working position for the next stacking buffering.

[0058] The implementation principle of Embodiment 2 of this application is as follows: When the stacking opening and closing mechanism 8 drives the adjacent heating plates 2 to switch from a separated state to a stacked state, the four pressure-bearing contacts 17 located at the bottom of the upper heating plate 2 first contact the top wall of the lower heating plate 2. As the upper heating plate 2 continues to descend, the pressure-bearing contacts 17 are gradually pushed into the corresponding sleeves 15, and during the movement, they drive the elastic energy-absorbing element 18 to undergo compression deformation, converting the kinetic energy of the falling heating plate 2 into the elastic potential energy of the elastic energy-absorbing element 18, thereby forming a buffer effect during the stacking process, effectively attenuating the structural vibration caused by the stacking impact, and reducing the risk of chip damage due to collision.

[0059] The above are merely optional embodiments of this disclosure and are not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A semiconductor packaging baking apparatus, characterized in that: The system includes a support platform (1), on which multiple heating plates (2) are stacked. A support frame (3) is fixedly installed on the support platform (1). Multiple pressure-applying components (4) are installed on the top of the support frame (3). The driving ends of the multiple pressure-applying components (4) abut against the top heating plate (2). Multiple lifting components (5) are respectively installed on both sides of the support frame (3). The driving ends of the multiple lifting components (5) are respectively connected to the multiple heating plates (2). Multiple guide rods (6) are fixedly installed on the support platform (1). Multiple guide blocks (7) are slidably installed on each guide rod (6). The multiple guide blocks (7) are respectively fixedly connected to the multiple heating plates (2). A stacking opening and closing mechanism (8) is installed inside the support platform (1). The stacking opening and closing mechanism (8) is used to separate adjacent heating plates (2).

2. The semiconductor packaging baking apparatus according to claim 1, characterized in that: Multiple lifting plates (9) are slidably arranged on the support frame (3). A connecting plate (10) is fixedly arranged at the end of the lifting plate (9). The multiple connecting plates (10) are fixedly connected to multiple heating plates (2) respectively. A support plate (11) is fixedly arranged on the support frame (3). Multiple lifting components (5) are fixedly arranged on the support plate (11). Each lifting component (5) has a lifting plate (12) fixedly arranged at its lifting end. The multiple lifting plates (12) are fixedly connected to the multiple lifting plates (9) respectively.

3. The semiconductor packaging baking apparatus according to claim 1, characterized in that: Each of the multiple pressure-applying components (4) has a pressure plate (13) fixedly installed at its driving end, and the pressure plate (13) is adapted to abut against the top of the heating plate (2).

4. The semiconductor packaging baking apparatus according to claim 1, characterized in that: The stacked opening and closing mechanism (8) includes a lifting component (81), two translation components (82) and four drive components (83). The lifting component (81) is located at the bottom of the support platform (1). The two translation components (82) are symmetrically arranged at the lifting end of the lifting component (81). The four drive components (83) are respectively arranged at the translation end of the two translation components (82). The drive end of the drive component (83) is used to drive the adjacent upper heating plate (2) to move upward and restrict the movement of the adjacent lower heating plate (2).

5. The semiconductor packaging baking apparatus according to claim 4, characterized in that: The lifting assembly (81) includes a drive member (811), a lead screw (812), and a lifting frame (813). The drive member (811) is located at the bottom of the support platform (1). The lead screw (812) is rotatably located inside the support platform (1) and is connected to the drive end of the drive member (811). The lifting frame (813) is slidably located inside the support platform (1) in the vertical direction. The lead screw (812) is threaded through the lifting frame (813). Two translation components (82) are located on the lifting frame (813).

6. The semiconductor packaging baking apparatus according to claim 4, characterized in that: The translation component (82) includes a translation element (821) and a translation frame (822). The translation frame (822) is fixedly mounted on the lifting component (81) and slides horizontally on the lifting component (81). The driving end of the translation element (821) is connected to the translation frame (822). Every two driving components (83) are located at both ends of a translation frame (822).

7. The semiconductor packaging baking apparatus according to claim 4, characterized in that: The drive assembly (83) includes a drive frame (831), an upward fork (832), a lifting member (833), a lifting block (834), and a limiting fork (835). The drive frame (831) is fixedly mounted on the translation assembly (82). The upward fork (832) is fixedly mounted on the top of the drive frame (831). The lifting member (833) is fixedly mounted on the drive frame (831). The lifting block (834) is slidably mounted on the drive frame (831) and connected to the drive end of the lifting member (833). The limiting fork (835) is mounted on the lifting block (834) and located below the upward fork (832). Two fork slots (14) are opened in the opposite side walls of the heating plate (2). The upward fork (832) and the limiting fork (835) are respectively inserted into the fork slots (14) of the adjacent heating plate (2).

8. The semiconductor packaging baking apparatus according to claim 1, characterized in that: Each heating plate (2) has a sleeve (15) embedded at one of its four corners. A sliding column (16) is slidably disposed inside the sleeve (15) along its own axis. A pressure-bearing contact (17) is disposed at the bottom end of the sliding column (16). The pressure-bearing contact (17) is slidably disposed inside the sleeve (15). An elastic energy-absorbing element (18) is sleeved on the sliding column (16). The two ends of the elastic energy-absorbing element (18) abut against the pressure-bearing contact (17) and the sleeve (15) respectively. The elastic energy-absorbing element (18) pushes the pressure-bearing contact (17) out of the sleeve (15).

9. A semiconductor packaging baking apparatus according to claim 8, characterized in that: A locking rod (19) is slidably disposed inside the sleeve (15) along its own diameter direction. A locking groove (20) is provided on the side wall of the sliding column (16). A first elastic element (21) is provided inside the sleeve (15) for pushing the locking rod (19) to slide into the locking groove (20). An inclined wall (22) is formed on the top wall of the end of the locking rod (19). A ball bearing (23) is rotatably embedded on the top wall of the sliding column (16) at the opening of the locking groove (20). When the pressure contact (17) moves... When the bottom wall of the pressure contact (17) is flush with the bottom of the sleeve (15), the inclined wall (22) of the locking rod (19) contacts the ball (23). The first elastic element (21) pushes the locking rod (19) to slide into the locking groove (20). The inclined wall (22) pushes the sliding column (16) to move into the sleeve (15) through the ball (23). The sliding column (16) drives the pressure contact (17) to move into the sleeve (15) and separates the bottom wall of the pressure contact (17) from the lower heating plate (2).

10. A semiconductor packaging baking apparatus according to claim 9, characterized in that: An unlocking rod (24) is fixedly installed on the top wall of the heating plate (2). An unlocking block (25) is slidably installed on the side wall of the top end of the unlocking rod (24). The top end of the unlocking block (25) is chamfered (26). A second elastic element (27) is provided inside the unlocking rod (24) for pushing the unlocking block (25) to move away from the unlocking rod (24). A sliding groove is provided inside the sleeve (15) along the direction parallel to its own axis. The unlocking rod (24) and the unlocking block (25) are slidably installed in the sliding groove. A through hole (29) is provided inside the locking rod (19). The locking rod (19) slides through the through hole (29). The locking rod (19) is located on the side wall of the through hole (29) and has a push groove (30) at an angle. The upper and lower ends of the push groove (30) are open. The unlocking block (25) is slidably disposed in the push groove (30). When the unlocking block (25) moves from top to bottom through the push groove (30), the unlocking block (25) drives the locking rod (19) to slide out of the lock groove (20). When the unlocking block (25) moves from bottom to top through the through hole (29), the locking rod (19) drives the unlocking block (25) to retract into the unlocking rod (24) through the chamfer (26) at the top of the unlocking block (25).

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