Substation switch cabinet temperature monitoring method

Abstract

The application provides a kind of temperature monitoring method of transformer substation switch cabinet, it is related to power equipment monitoring technical field.The method includes: obtaining temperature sampling parameter, and with first, second, third sampling interval respectively collecting equipment target area, equipment non-target area and box area temperature data;According to the temperature data of target area and non-target area, monitor abnormal temperature working condition, and when abnormal occurs, dynamically reduce the sampling interval corresponding to abnormal area and its adjacent area;Calculate the dynamic temperature difference between the reference temperature of the box and the ambient temperature, and globally reduce the sampling interval of all areas in the box based on the dynamic temperature difference.The application reduces data redundancy while ensuring core fault capture capability through hierarchical dynamic sampling and multi-dimensional temperature data analysis, effectively eliminates environmental interference, solves the false alarm problem of fixed threshold in variable temperature environment, and improves monitoring reliability and intelligent level.

Description

Technical Field

[0001] This application relates to the field of power equipment monitoring technology, specifically to a method for monitoring the temperature of substation switchgear. Background Technology

[0002] As a critical node in the power system, the operational stability of substation switchgear directly affects the safety of the power grid. In actual operation, electrical connection points within the switchgear (such as contacts and busbars) are prone to abnormal temperature rises due to poor contact, overload, or aging, which can lead to insulation aging and even fire accidents. Therefore, real-time monitoring of the temperature of critical components within the switchgear is an important means of ensuring the safe operation of power equipment.

[0003] Existing switchgear temperature monitoring technologies employ non-contact temperature monitoring, periodically collecting data from key temperature measurement points within the enclosure. However, existing monitoring methods suffer from a simplistic approach to adjusting sampling intervals, exhibiting the following main technical problems: Current temperature monitoring methods often use fixed sampling intervals, lacking a mechanism for dynamic adjustment based on equipment temperature change trends. Regardless of whether the equipment is in steady-state operation or in the rapid temperature rise phase at the initial stage of a fault, the sensors collect data at the same frequency. This approach results in a large amount of redundant data during stable operation and slow temperature changes, wasting communication bandwidth and storage resources; conversely, during fault occurrences and rapid temperature changes, fixed low-frequency sampling may fail to capture crucial temperature rise details, leading to delayed or missed warnings. Therefore, how to dynamically adjust monitoring sampling parameters according to actual operating conditions is a technical problem that needs to be solved in this field. Summary of the Invention

[0004] In view of this, this application provides a method for monitoring the temperature of substation switchgear, which can dynamically adjust the monitoring sampling parameters according to the actual operating conditions.

[0005] In a first aspect, this application provides a method for monitoring the temperature of a substation switchgear. The method includes: acquiring temperature sampling parameters corresponding to various types of switchgear; based on the temperature sampling parameters, collecting first temperature data of a target area of ​​the equipment to be monitored in the switchgear at a first sampling interval; based on the temperature sampling parameters, collecting second temperature data of a non-target area of ​​the equipment to be monitored in the switchgear at a second sampling interval, wherein the second sampling interval is greater than the first sampling interval; based on the temperature sampling parameters, collecting third temperature data of the enclosure area of ​​the switchgear at a third sampling interval, wherein the third sampling interval is greater than the second sampling interval; and monitoring a first abnormal temperature condition and a second abnormal temperature condition of the target area and the non-target area of ​​the equipment, respectively, based on the first temperature data and the second temperature data. The system operates under the following conditions: Based on the first abnormal temperature condition, it locates the abnormal target area and dynamically reduces the first sampling interval and the second sampling interval corresponding to the abnormal target area and its adjacent non-target areas, respectively; based on the second abnormal temperature condition, it locates the abnormal non-target area and dynamically reduces the second sampling interval and the first sampling interval corresponding to the abnormal non-target area and its adjacent target area, respectively; it obtains the enclosure reference temperature based on the third temperature data and calculates the dynamic temperature difference between the enclosure reference temperature and the current ambient temperature; based on the dynamic temperature difference, it globally reduces the first sampling interval, the second sampling interval, and the third sampling interval for all the monitored devices in the switch cabinet; and it updates the abnormal triggering conditions corresponding to the first abnormal temperature condition and the second abnormal temperature condition according to the ambient temperature range.

[0006] In conjunction with the first aspect, in one possible implementation, the process of determining the target area of ​​the device includes: locating the area of ​​interest in the switch cabinet to obtain the pixel area of ​​interest; drawing a first rectangular pixel area with the edge pixels of the pixel area of ​​interest as the boundary; and determining the target area of ​​the device based on the first rectangular pixel area.

[0007] In conjunction with the first aspect, in one possible implementation, the process of determining the non-target area of ​​the device includes: setting multiple secondary areas of interest around the area of ​​interest; locating the secondary areas of interest in the switch cabinet to obtain secondary pixel areas of interest; drawing a second rectangular pixel area with the edge pixels of the secondary pixel areas of interest as boundaries; if the second rectangular pixel area and the first rectangular pixel area have overlapping pixel areas, removing the overlapping pixel areas in the second rectangular pixel area to obtain a corrected pixel area; and determining the non-target area of ​​the device based on the corrected pixel area.

[0008] In conjunction with the first aspect, one possible implementation further includes: sequentially configuring different ambient temperature ranges; in each of the ambient temperature ranges, debugging and testing each device to be monitored in the switchgear within its rated parameter range; in each of the ambient temperature ranges, setting the normal temperature range corresponding to the target area of ​​the device to be monitored within each parameter range to obtain a first normal temperature range table; in each of the ambient temperature ranges, setting the normal temperature range corresponding to the non-target area of ​​the device to be monitored within each parameter range to obtain a second normal temperature range table; setting a first warning temperature corresponding to the target area of ​​the device to be monitored within each parameter range; and setting a second warning temperature corresponding to the non-target area of ​​the device to be monitored within each parameter range.

[0009] In conjunction with the first aspect, in one possible implementation, the step of monitoring and obtaining the first abnormal temperature condition and the second abnormal temperature condition of the target area and the non-target area of ​​the device based on the first temperature data and the second temperature data respectively includes: within the current ambient temperature range, based on the first normal temperature range table, if the temperature of the target area of ​​the device deviates from its normal temperature range by more than a first preset amplitude within a certain parameter range, it is marked as the first abnormal temperature condition; within the current ambient temperature range, based on the second normal temperature range table, if the temperature of the non-target area of ​​the device deviates from its normal temperature range by more than a second preset amplitude within a certain parameter range, it is marked as the second abnormal temperature condition.

[0010] In conjunction with the first aspect, one possible implementation further includes: if the temperature value corresponding to the first abnormal temperature condition is greater than or equal to the first warning temperature corresponding to the current parameter range, then a first warning message is generated; if the temperature value corresponding to the second abnormal temperature condition is greater than or equal to the second warning temperature corresponding to the current parameter range, then a second warning message is generated.

[0011] In conjunction with the first aspect, in one possible implementation, the process of determining the boundary conditions for reducing the adjustment in locating the abnormal target area based on the first abnormal temperature condition and dynamically reducing the first sampling interval and the second sampling interval corresponding to the abnormal target area and its adjacent non-target areas includes: the current temperature of the target area of ​​the equipment is less than or equal to the maximum value of the normal temperature range in the corresponding parameter interval, corresponding to the first initial sampling interval set in the temperature sampling parameters for the first sampling interval; the current temperature of the target area of ​​the equipment is greater than or equal to the first warning temperature in the corresponding parameter interval, corresponding to the first upper limit sampling interval set in the temperature sampling parameters for the first sampling interval; wherein, the reduction step size of the second sampling interval is equal to the reduction step size of the first sampling interval.

[0012] In conjunction with the first aspect, in one possible implementation, it further includes: based on the ambient temperature and the first normal temperature range table, if the temperature of the target area of ​​the device returns to the corresponding normal temperature range and remains redundant for a certain duration, then the first sampling interval is controlled to return to the first initial sampling interval set in the temperature sampling parameters for the first sampling interval, and the second sampling interval of the adjacent non-target area is controlled to return to the second initial sampling interval set in the temperature sampling parameters for the second sampling interval.

[0013] In conjunction with the first aspect, one possible implementation further includes: setting an allowable range and a warning range for the dynamic temperature difference; the step of globally reducing the first sampling interval, the second sampling interval, and the third sampling interval for all the monitored devices in the switch cabinet based on the dynamic temperature difference includes: when the dynamic temperature difference is less than or equal to the maximum value of the allowable range, it is set to a global zero reduction; when the dynamic temperature difference is greater than the maximum value of the allowable range, the dynamic temperature difference is globally reduced by a preset interval step for every preset temperature step increase; if the first sampling interval is reduced to the first upper limit sampling interval, the global reduction is stopped.

[0014] In conjunction with the first aspect, one possible implementation further includes: if a certain device under monitoring is in a dormant state, then the collection of the first temperature data of the target area of ​​the device and the second temperature data of the non-target area of ​​the device is stopped; if more than a preset proportion of the devices under monitoring in the switch cabinet switch to a dormant state, then the collection of the third temperature data of the cabinet area at the third sampling interval is stopped.

[0015] In application, this method achieves efficient and accurate monitoring of substation switchgear through non-contact infrared sensing and hierarchical dynamic sampling. First, high-frequency sampling is used for the target area of ​​the equipment, while medium- and low-frequency sampling is used for non-target areas and the switchgear enclosure. This significantly reduces data redundancy and system load while ensuring core fault detection capabilities. Second, by utilizing the temperature difference and heat conduction time difference between the target and non-target areas, environmental temperature interference is effectively eliminated, enabling the identification of genuine faults such as poor contact. Furthermore, the sampling frequency of adjacent areas can be adjusted in conjunction with the location of anomalies, achieving preventative monitoring of fault propagation. Finally, by combining the dynamic temperature difference between the enclosure and the environment, the global sampling strategy and alarm threshold are adaptively adjusted, solving the problem of false alarms caused by fixed thresholds in variable temperature environments. This significantly improves the system's monitoring reliability and intelligence level under complex operating conditions. Attached Figure Description

[0016] Figure 1 The diagram shown is a schematic representation of the steps of a method for monitoring the temperature of a substation switchgear according to an embodiment of this application.

[0017] Figure 2 The diagram shows the determination of the target area and non-target area of ​​the equipment.

[0018] Figure 3 The diagram shows the steps for setting the normal temperature range and the warning temperature. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0020] This application provides a method for monitoring the temperature of a substation switchgear. In one embodiment, the switchgear is equipped with multiple devices to be monitored. Different switchgears can be equipped with different types of devices to be monitored, such as circuit breakers, disconnect switches, transformers, etc. During the operation of the switchgear, a non-contact infrared sensor temperature measurement method is used. An infrared sensor is installed on the inner wall of the switchgear door to perform non-contact temperature measurement of the devices to be monitored and the cabinet.

[0021] Figure 1 The diagram shown is a schematic representation of the method steps for monitoring the temperature of a substation switchgear according to an embodiment of this application. Figure 1 As shown, the temperature monitoring method for the substation switchgear includes: Step 101: Obtain the temperature sampling parameters corresponding to various switch cabinets.

[0022] Step 102: Based on the temperature sampling parameters, collect the first temperature data of the target area of ​​the equipment to be monitored in the switch cabinet at the first sampling interval.

[0023] For determining the target area of ​​equipment, for example, the target area for a circuit breaker is set to the circuit breaker contacts, the target area for a disconnector switch is set to the disconnector blade, and the target area for a transformer is set to the transformer bushing terminal block. In this step, high-frequency monitoring is performed on key components such as circuit breaker contacts to ensure that rapid temperature rise caused by poor contact can be captured, providing high-temporal-resolution data support for early warning of faults.

[0024] Step 103: Based on the temperature sampling parameters, collect the second temperature data of the non-target area of ​​the equipment to be monitored in the switch cabinet at the second sampling interval.

[0025] The second sampling interval is greater than the first sampling interval. For determining non-target areas of equipment, for example, the non-target area of ​​a circuit breaker is set to the circuit breaker body, the target area of ​​a disconnector switch is set to the disconnector switch body, and the target area of ​​a transformer is set to the transformer body. In this step, medium-frequency monitoring is used for non-critical parts of the equipment. While maintaining the overall status awareness capability of the equipment, this significantly reduces data redundancy in non-core areas and alleviates communication and storage load.

[0026] Step 104: Based on the temperature sampling parameters, collect the third temperature data of the switch cabinet enclosure area at the third sampling interval.

[0027] In this step, the third sampling interval is greater than the second sampling interval, and low-frequency monitoring is used for the enclosure to monitor the enclosure temperature and determine whether the enclosure temperature environment is normal.

[0028] Step 105: Based on the first temperature data and the second temperature data, monitor the first abnormal temperature conditions and the second abnormal temperature conditions of the equipment target area and the equipment non-target area respectively.

[0029] In this step, hierarchical and differentiated fault identification is achieved, and anomaly judgments are made for target areas and non-target areas respectively, and the first abnormal temperature condition and the second abnormal temperature condition are monitored respectively.

[0030] Step 106: Locate the abnormal target area based on the first abnormal temperature condition, and dynamically reduce the first sampling interval and the second sampling interval corresponding to the abnormal target area and its adjacent non-target area, respectively.

[0031] In this step, when a temperature anomaly occurs in a target area of ​​a device, the high temperature in the target area often affects adjacent non-target areas of the device, or may cause both the target and non-target areas to heat up due to the fault's cascading effect. For example, when the temperature of the circuit breaker contacts in a circuit breaker is abnormal, it usually leads to an abnormal temperature of the circuit breaker itself, requiring an increase in the monitoring frequency for that circuit breaker. The sampling frequency of this point and adjacent areas is automatically increased to acquire more intensive data during the critical window of fault evolution, while avoiding invalid high-frequency sampling of irrelevant areas, thus optimizing the allocation of computing power and power consumption.

[0032] By monitoring the temperature data of the target area and non-target area of ​​the equipment separately, it is possible to distinguish between real faults and environmental interference. For example, if only the contact area of ​​a circuit breaker is monitored, the contact temperature will also rise when the overall ambient temperature increases or the heat dissipation of the enclosure is poor, which can easily trigger false alarms. By simultaneously monitoring the circuit breaker body area, the system can determine that if the contact temperature rises but the body temperature is normal, it is likely a real fault caused by poor contact. If the contact and body temperature rise simultaneously, it may be a false anomaly caused by environmental factors.

[0033] In addition, by monitoring the temperature data of the target area and the non-target area of ​​the equipment respectively, the relative temperature difference between the target area and the non-target area can be obtained, rather than just looking at the absolute temperature. This more objectively reflects the true degree of deterioration of the target area of ​​the equipment, which is independent of the non-target area, and eliminates the background noise of the equipment's own heat generation and the ambient temperature.

[0034] Furthermore, monitoring the temperature data of the target area and non-target area of ​​the equipment separately can reveal the time difference in heat conduction. It takes time for heat to transfer from the target area to the non-target area. In the early stages of a fault, the temperature in the target area may have already risen significantly, while the temperature in the non-target area may not yet have changed noticeably. Separate monitoring can detect this characteristic of the target area heating up before the non-target area, providing an early warning before the fault affects the entire equipment and switchgear, thus gaining valuable repair windows for maintenance.

[0035] When abnormal temperature rises occur simultaneously in both the target area and the non-target area of ​​the equipment, the system can determine that it is a complex working condition caused by poor contact, overload, or serious fault leading to overall overheating, thereby triggering a higher level of alarm or linkage protection strategy to avoid the one-sidedness of a single threshold judgment.

[0036] Step 107: Locate the abnormal non-target area based on the second abnormal temperature condition, and dynamically reduce the second sampling interval and the first sampling interval corresponding to the abnormal non-target area and its adjacent target area, respectively.

[0037] In this step, preventive monitoring of abnormal spread can be achieved. When an abnormal temperature occurs in a non-target area of ​​the equipment, the sampling frequency of the target area of ​​the adjacent equipment is increased simultaneously to prevent local overheating from spreading to the target area of ​​the equipment. This preventive monitoring logic can be implemented to enhance the system's active defense capabilities.

[0038] Step 108: Obtain the chamber reference temperature based on the third temperature data, and calculate the dynamic temperature difference between the chamber reference temperature and the current ambient temperature.

[0039] In this step, the average value of the third temperature data is used to obtain the chamber reference temperature. Then, the difference between the chamber reference temperature and the current ambient temperature is calculated to obtain the dynamic temperature difference. This can isolate environmental interference and eliminate false alarms caused by ambient temperature fluctuations by using the dynamic difference between the chamber temperature and the ambient temperature. This ensures that the monitoring results truly reflect the equipment's own heating status and improves the reliability of the monitoring.

[0040] Step 109: Based on the dynamic temperature difference, globally reduce the first sampling interval, the second sampling interval, and the third sampling interval for all devices to be monitored in the switch cabinet.

[0041] In this step, the overall system can be adjusted based on feedback. When the ambient temperature changes drastically or the overall enclosure overheats, resulting in a large dynamic temperature difference, the sampling frequency is increased globally to ensure that no potential fault points are missed under systemic risks, thus guaranteeing the monitoring reliability of the substation in harsh environments.

[0042] Step 110: Update the abnormal trigger conditions corresponding to the first and second abnormal temperature conditions according to the ambient temperature range.

[0043] In this step, the alarm threshold is dynamically calibrated, and the anomaly criteria are automatically adjusted according to the ambient temperature range. This avoids false alarms / missed alarms caused by fixed thresholds due to seasonal changes or diurnal temperature differences, enabling the monitoring system to have long-term stable adaptive capabilities and reducing the operation and maintenance misjudgment rate.

[0044] In this embodiment, the method achieves efficient and accurate monitoring of substation switchgear through non-contact infrared sensing and hierarchical dynamic sampling. First, high-frequency sampling is used for the target area of ​​the equipment, while medium- and low-frequency sampling is used for non-target areas and the switchgear enclosure. This significantly reduces data redundancy and system load while ensuring the core fault detection capability. Second, by utilizing the temperature difference and heat conduction time difference between the target and non-target areas, environmental temperature interference is effectively eliminated, allowing for the identification of genuine faults such as poor contact. Furthermore, the sampling frequency of adjacent areas can be adjusted in conjunction with the location of anomalies, achieving preventative monitoring of fault propagation. Combined with the dynamic temperature difference between the enclosure and the environment, the global sampling strategy and alarm threshold are adaptively adjusted, solving the problem of false alarms caused by fixed thresholds in variable temperature environments. This significantly improves the system's monitoring reliability and intelligence level under complex operating conditions.

[0045] Figure 2 The diagram illustrates the determination of the target area and non-target area of ​​the device. In one embodiment, referring to... Figure 2 Taking a switchgear equipped with a circuit breaker as an example, the shaded area represents the target area of ​​the equipment, namely the circuit breaker contact area. The process of determining the target area of ​​the equipment includes: Step 201: Locate the area of ​​interest in the switch cabinet to obtain the pixel area of ​​interest.

[0046] Step 202: Draw the first rectangular pixel region with the edge pixels of the pixel region of interest as the boundary.

[0047] Step 203: Determine the device target area based on the first rectangular pixel area.

[0048] In this embodiment, critical equipment components (such as circuit breaker contacts) that maintenance personnel are concerned about often appear as irregular shapes in infrared images. This embodiment first identifies the pixel region of interest containing the critical component in step 201; then, in step 202, a first rectangular pixel region is drawn with the edge pixels as boundaries, transforming the irregular image region into a standard rectangular matrix. The rectangular region conforms to the matrix operation logic of computer image processing, significantly simplifying subsequent temperature data extraction and statistical algorithms, reducing the processor's computational burden, and meeting the speed requirements of real-time monitoring. Drawing a rectangle with the edge pixels of the region of interest as boundaries maximizes the fit to the contour of the critical component, avoiding both overly small monitoring ranges that might miss high-temperature points and overly large monitoring ranges that might introduce background noise, thus ensuring the representativeness and accuracy of the temperature data for the determined target equipment area.

[0049] In one embodiment, reference is made to Figure 2 The shaded areas in the grid represent non-target areas of the equipment, including the circuit breaker body and a portion of the circuit breaker contact wiring. The process of determining the non-target areas of the equipment includes: Step 301: Set multiple secondary attention areas around the area of ​​interest.

[0050] Step 302: Locate the secondary area of ​​interest in the switch cabinet to obtain the secondary pixel area of ​​interest.

[0051] Step 303: Draw a second rectangular pixel region with the edge pixels of the secondary focus pixel region as the boundary.

[0052] Step 304: If there is an overlapping pixel region between the second rectangular pixel region and the first rectangular pixel region, remove the overlapping pixel region in the second rectangular pixel region to obtain the corrected pixel region.

[0053] Step 305: Determine the non-target area of ​​the device based on the corrected pixel area.

[0054] In this embodiment, spatial exclusivity processing and pixel-level correction mechanisms ensure the independence and purity of temperature measurement data in non-target areas. Step 304 removes pixels overlapping with the target area of ​​the device, severing the temperature measurement overlap between the target and non-target areas and ensuring that the data in non-target areas accurately reflects the thermal state of the device itself. Steps 301-303 standardize and correct the non-target areas into rectangles, ensuring that the monitoring range of the non-target areas covers the heat diffusion zone around key components while avoiding core fault points, preventing the system from misjudging the fault propagation trend due to overlapping areas. Drawing rectangles with edge pixels as boundaries and dynamically correcting them can adapt to changes in different device installation positions and infrared image viewing angles. Even if the area of ​​interest and the secondary area of ​​interest partially occlude or overlap in the image, the algorithm can still automatically correct the monitoring range through pixel-level calculations, eliminating the need for manual recalibration and enhancing the system's long-term stable operation capability in complex field environments.

[0055] Figure 3 The diagram illustrates the steps of setting the normal temperature range and the warning temperature. In one embodiment, as shown... Figure 3 As shown, the temperature monitoring method for the substation switchgear also includes: Step 401: Configure different ambient temperature ranges sequentially. In the commissioning and testing of this embodiment, the switch cabinet can be simulated to be in different ambient temperature ranges by heating and cooling methods.

[0056] Step 402: In each ambient temperature range, debug and test each device to be monitored in the switch cabinet within its rated parameter range.

[0057] At the same time, the rated parameter range is divided into multiple parameter intervals. The division criteria include: uniformly dividing into a certain number of intervals from 3 to 10, for example, dividing into 3 parameter intervals and defining them as low power consumption interval, medium power consumption interval, and high power consumption interval respectively; dividing into the power grid peak period operation parameter range and the power grid valley period operation parameter range. Step 403: Within each ambient temperature range, define the normal temperature range corresponding to the target area of ​​the device to be monitored within each parameter range to obtain the first normal temperature range table. That is, each parameter range corresponds to its own first normal temperature range, and multiple first normal temperature ranges are summarized into the first normal temperature range table.

[0058] Step 404: Within each ambient temperature range, define the normal temperature range for the non-target area of ​​the device to be monitored within each parameter range, thus obtaining a second normal temperature range table. That is, each parameter range corresponds to its own second normal temperature range, and multiple second normal temperature ranges are summarized into a second normal temperature range table.

[0059] Step 405: Set the first warning temperature for the target area of ​​the device to be monitored within each parameter range.

[0060] Step 406: Set the second warning temperature for the non-target area of ​​the device to be monitored within each parameter range.

[0061] In this embodiment, a dynamically correlated monitoring benchmark database is constructed through pre-debugging and calibration. Steps 401 and 402 further subdivide the monitoring benchmark into different ambient temperature ranges, and on-site debugging is performed within each parameter range. Fixed alarm values ​​are no longer used; instead, the system automatically matches the corresponding normal temperature range and warning value based on the current ambient temperature. During testing, extreme abnormal temperatures are removed, and the normal temperature range for each parameter range is defined based on expert experience. This effectively avoids frequent false alarms caused by high ambient temperatures in summer and missed alarms caused by small temperature differences in winter.

[0062] Steps 403 and 404 establish independent normal temperature range tables for the target area and non-target area of ​​the equipment, respectively, enabling comparisons based on the characteristics of different physical components. For example, the maximum allowable temperature rise of the contacts may differ from that of the main body. Separate calibration makes anomaly judgments more consistent with the actual physical and thermal characteristics of the equipment, further reducing the risk of misjudgment caused by a single standard.

[0063] By conducting debugging and testing within the rated parameters in step 402 and setting warning temperatures corresponding to different parameter ranges in steps 405 and 406, a warning message needs to be generated if the warning temperature is exceeded. This links temperature monitoring with the real-time load (current / voltage) of the equipment, enabling the system to quickly identify abnormalities by looking up tables and accurately capture latent faults.

[0064] In one embodiment, step 105 includes: Step 1051: Within the current ambient temperature range, based on the first normal temperature range table, if the temperature of the target area of ​​the monitored device deviates from its normal temperature range by more than a first preset amplitude within a certain parameter range, it is marked as a first abnormal temperature condition. The first preset amplitude can be dynamically set, and can be set to a value between 0% and 30% according to various categories such as system sensitivity, system monitoring purpose, and system monitoring preferences. When the current temperature of the target area of ​​the device is between the maximum value of the normal temperature range and the first preset amplitude, the first abnormal temperature condition will not be triggered; this temperature range is used for redundancy buffering.

[0065] Step 1052: Within the current ambient temperature range, based on the second normal temperature range table, if the temperature of the non-target area of ​​the monitored device deviates from its normal temperature range by more than a second preset amplitude within a certain parameter range, it is marked as a second abnormal temperature condition. The second preset amplitude can be dynamically set, and can be set to a value between 0% and 30% according to various categories such as system sensitivity, system monitoring purpose, and system monitoring preferences. When the current temperature of the non-target area of ​​the device is between the maximum value of the normal temperature range and the second preset amplitude, the second abnormal temperature condition will not be triggered; this temperature range is used for redundancy buffering.

[0066] This embodiment addresses the problems of high false alarm rate and poor sensitivity in traditional fixed threshold monitoring under complex operating conditions. By calling the corresponding normal temperature range table within the current ambient temperature range, this scheme achieves dynamic anchoring of the monitoring benchmark. Using a deviation from the normal temperature range exceeding a preset range as the criterion, a monitoring dimension of relative change rate is introduced. For target areas (such as contacts) and non-target areas (such as the body), the system sets a first preset range and a second preset range (0-30%), respectively. To monitor potential issues such as initial contact malfunctions where the absolute temperature rise is small but significantly deviates from the normal value, setting a smaller preset range (such as 5%-10%) allows for earlier detection of anomalies and early warning compared to traditional methods. For non-target areas, a larger preset range can be set to tolerate short-term fluctuations caused by sudden changes in ambient temperature, avoiding false triggering due to the enclosure being affected by high ambient temperatures or direct cold air. If only step 1051 is triggered, the system can confirm that the fault is a critical component such as excessive local contact resistance or point-to-point overload. At this time, we can focus on the deterioration trend of that point. If step 1052 is triggered first or at the same time, it indicates that the environmental heat dissipation may be ineffective or the overall system may be overloaded.

[0067] The configurability of the preset amplitude (0-30%) provides flexibility for the full lifecycle management of substations. In the initial stage of equipment commissioning, when the contact surface is not yet stable, the amplitude threshold can be lowered for close monitoring; during the stable operation period of the equipment, the amplitude threshold can be appropriately increased to reduce invalid work orders.

[0068] In one embodiment, the substation switchgear temperature monitoring method further includes: Step 601: If the temperature value corresponding to the first abnormal temperature condition is greater than or equal to the first warning temperature corresponding to the current parameter range, then generate the first warning information.

[0069] Step 602: If the temperature value corresponding to the second abnormal temperature condition is greater than or equal to the second warning temperature corresponding to the current parameter range, then generate the second warning information.

[0070] In this embodiment, the warning threshold is dynamically adapted to the environment. The alarm threshold changes dynamically with operating parameters such as equipment load and ambient temperature, effectively eliminating the threshold mismatch problem caused by seasonal changes, diurnal temperature differences, or load fluctuations, making the warning signal fit the actual thermal state of the equipment. Furthermore, the nature of the fault is distinguished: the first warning information corresponds to anomalies in the target area of ​​the equipment, pointing to core electrical faults such as poor contact or overload, requiring immediate action; the second warning information corresponds to anomalies in non-target areas of the equipment (such as the equipment body), which may reflect poor heat dissipation or environmental thermal interference, and the priority and method of handling are different.

[0071] In one embodiment, the process of determining the boundary conditions for reducing the adjustment in step 106 includes: Step 1061: The current temperature of the target area of ​​the device is less than or equal to the maximum value of the normal temperature range of the corresponding parameter interval, which corresponds to the first initial sampling interval set in the temperature sampling parameters for the first sampling interval.

[0072] Step 1062: The current temperature of the target area of ​​the equipment is greater than or equal to the first warning temperature of the corresponding parameter range, which corresponds to the first upper limit sampling interval set in the temperature sampling parameters for the first sampling interval. The decreasing step size of the second sampling interval is equal to the decreasing step size of the first sampling interval.

[0073] In this embodiment, within the boundary conditions, the process of adjusting the first sampling interval according to the current temperature is generally set as a linear adjustment, with the second sampling interval decreasing synchronously with the first sampling interval. The first initial sampling interval is generally set to a value between 30s and 60s, and the first upper limit sampling interval is generally set to 5s. By setting the first initial sampling interval and the first upper limit sampling interval as boundary conditions, the system can perform linear adjustment based on the change in the target area temperature between the maximum value of the normal range and the first warning temperature. That is, the higher the equipment temperature and the closer it is to the danger threshold, the higher the sampling frequency. This dynamic adjustment mechanism ensures that monitoring is maintained with low power consumption in the early stages of fault evolution, while capturing temperature rise details with the highest temporal resolution during the critical window period when the fault is about to occur, providing high-density data support for fault early warning.

[0074] Maintaining synchronized frequency increases between non-target and target areas ensures that when the temperature of the target area (such as the contact) rises sharply, the sampling frequency of adjacent non-target areas (such as the body) can increase at the same rate. This guarantees that the system can record the process of heat conduction from the contact to the body with equal time resolution, providing a time-aligned data foundation for accurate calculation of heat conduction time difference and judgment of fault propagation trend, and avoiding data misalignment and misjudgment caused by inconsistent sampling step sizes.

[0075] Using linear adjustment instead of step abrupt changes makes the transition of the sampling interval smoother, avoiding excessive instantaneous data caused by too rapid increase in the sampling frequency.

[0076] In one embodiment, the substation switchgear temperature monitoring method further includes: Step 801: Based on the ambient temperature and the first normal temperature range table, if the temperature of the target area of ​​the device returns to the corresponding normal temperature range and continues for a redundant duration, then control the first sampling interval to return to the first initial sampling interval set in the temperature sampling parameters, and control the second sampling interval of the adjacent non-target area to return to the second initial sampling interval set in the temperature sampling parameters.

[0077] In this embodiment, the redundancy duration is generally set to a value between 30s and 60s. The second initial sampling interval is generally set to a value between 30% and 60% lower than the first initial sampling interval. By monitoring whether the temperature of the target area of ​​the device returns to the normal temperature range, the system can automatically identify the end of the fault or abnormal state and actively restore the first and second sampling intervals from the high frequency to the low frequency initial sampling interval. After the device resumes normal operation, it can reduce sensor power consumption, communication bandwidth usage, and data processing pressure, avoid resource waste, and extend the battery life and service life of the monitoring equipment.

[0078] In one embodiment, the substation switchgear temperature monitoring method further includes: Step 901: Set the allowable range and warning range for dynamic temperature difference. The allowable range and warning range can be set according to different switch cabinets and different regions, based on expert experience and multiple tests. For example, the allowable range can be set to 0-10°C, and the warning range can be set to above 60°C.

[0079] The boundary conditions in step 109 are set as follows: When the dynamic temperature difference is less than or equal to the maximum value of the allowable range, the global decrease is set to zero. When the dynamic temperature difference is greater than the maximum value of the allowable range, for every preset temperature step increase in the dynamic temperature difference (set to a value between 1℃ and 5℃ based on expert experience or multiple measurements), the global decrease is set to one preset interval step (set to a value between 1s and 5s based on expert experience or multiple measurements). If the first sampling interval decreases to the first upper limit sampling interval, the global decrease stops.

[0080] In this embodiment, a global adaptive sampling mechanism based on the relative temperature rise of the equipment relative to its environment is constructed, enabling the perception and response to external environmental thermal stress and the overall thermal state of the equipment. Since the dynamic temperature difference reflects the deviation between the enclosure temperature and the ambient temperature, this mechanism can automatically adjust its sensitivity according to the thermal environment in which the equipment is located. When the dynamic temperature difference is small (within the allowable range, such as 0–10°C), it indicates that the equipment temperature is close to the ambient temperature, in thermal equilibrium or a low-load state. The system maintains global zero reduction, i.e., low-frequency sampling, to avoid invalid data consuming resources. When the dynamic temperature difference increases (exceeding the allowable range), it indicates a significant overall temperature rise in the equipment, possibly due to a sharp increase in ambient temperature or overall equipment overload. The system triggers global reduction logic, linearly increasing the sampling frequency. This mechanism ensures that under harsh thermal environments or overall overheating risks, the system can capture temperature changes with higher density, preventing the loss of high-temperature extreme values ​​due to excessively large sampling intervals. Simultaneously, the ventilation power of the switchgear is increased when the dynamic temperature difference increases.

[0081] By setting a preset interval step to decrease the global temperature step size for each increase in the preset temperature step size, a linear response model was established. This linear adjustment method is smoother and can gradually improve monitoring accuracy in the early stages of temperature rise, providing maintenance personnel with more continuous trend data.

[0082] In one embodiment, the substation switchgear temperature monitoring method further includes: Step 1001: If a device to be monitored is in a dormant state, stop collecting the first temperature data of the target area of ​​the device and the second temperature data of the non-target area of ​​the device.

[0083] Step 1002: If more than a preset proportion of the monitored devices in the switch cabinet switch to sleep mode, then stop collecting the third temperature data of the switch cabinet enclosure area at the third sampling interval.

[0084] When applied, this embodiment avoids invalid monitoring. When a device under monitoring is identified to be in a dormant state, data collection on both the target and non-target areas is stopped. This avoids invalid work and data reporting by sensors and communication modules when the device is shut down or under low load with no risk of overheating, thus reducing the overall power consumption of the system.

[0085] The preset ratio is generally set to a value between 60% and 80%. When most of the equipment in the switch cabinet enters a sleep state, it means that the main heat source inside the cabinet has been lost. Based on this, the system automatically stops collecting data in the cabinet area, realizing global sleep and further reducing system power consumption.

[0086] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0087] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0088] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0089] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles set forth herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features of the invention herein.

[0090] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for monitoring the temperature of a substation switchgear, characterized in that, include: Obtain temperature sampling parameters for various types of switchgear; Based on the temperature sampling parameters, the first temperature data of the target area of ​​the device to be monitored in the switch cabinet is collected at a first sampling interval. Based on the temperature sampling parameters, second temperature data of the non-target area of ​​the device to be monitored in the switch cabinet is collected at a second sampling interval; the second sampling interval is greater than the first sampling interval. Based on the temperature sampling parameters, third temperature data of the enclosure area of ​​the switch cabinet is collected at a third sampling interval; the third sampling interval is greater than the second sampling interval. Based on the first temperature data and the second temperature data, the first abnormal temperature condition and the second abnormal temperature condition of the target area and the non-target area of ​​the equipment are respectively monitored. Based on the first abnormal temperature condition, the abnormal target area is located, and the first sampling interval and the second sampling interval corresponding to the abnormal target area and the adjacent non-target area are dynamically reduced respectively. Based on the second abnormal temperature condition, the abnormal non-target area is located, and the second sampling interval and the first sampling interval corresponding to the abnormal non-target area and the adjacent target area are dynamically reduced respectively. The chamber reference temperature is obtained based on the third temperature data, and the dynamic temperature difference between the chamber reference temperature and the current ambient temperature is calculated. Based on the dynamic temperature difference, the first sampling interval, the second sampling interval, and the third sampling interval are globally reduced for all the monitored devices in the switch cabinet. Update the abnormal trigger conditions corresponding to the first abnormal temperature condition and the second abnormal temperature condition according to the ambient temperature range.

2. The method for monitoring the temperature of a substation switchgear according to claim 1, characterized in that, The process of determining the target area of ​​the device includes: The region of interest is obtained by locating the area of ​​interest in the switch cabinet; Draw a first rectangular pixel region with the edge pixels of the pixel region of interest as the boundary; The target area of ​​the device is determined based on the first rectangular pixel area.

3. The method for monitoring the temperature of a substation switchgear according to claim 2, characterized in that, The process of determining the non-target area of ​​the device includes: Define multiple secondary interest regions surrounding the aforementioned interest region; The secondary area of ​​interest is located in the switch cabinet to obtain the secondary pixel area of ​​interest. Draw a second rectangular pixel region with the edge pixels of the secondary focus pixel region as the boundary; If the second rectangular pixel region and the first rectangular pixel region have overlapping pixel regions, then the overlapping pixel regions are removed from the second rectangular pixel region to obtain the corrected pixel region; The non-target area of ​​the device is determined based on the corrected pixel area.

4. The method for monitoring the temperature of a substation switchgear according to claim 1, characterized in that, Also includes: Different ambient temperature ranges are configured sequentially; Within each of the aforementioned ambient temperature ranges, each device to be monitored in the switch cabinet is debugged and tested within its rated parameter range; In each of the ambient temperature ranges, the normal temperature range corresponding to the target area of ​​the device to be monitored in each parameter range is set to obtain the first normal temperature range table. In each of the ambient temperature ranges, the normal temperature range corresponding to the non-target area of ​​the device to be monitored in each parameter range is set to obtain a second normal temperature range table. Set the first warning temperature for the target area of ​​the device to be monitored within each parameter range; Set the second warning temperature for the non-target area of ​​the device to be monitored within each parameter range.

5. The method for monitoring the temperature of a substation switchgear according to claim 4, characterized in that, The step of monitoring and obtaining the first abnormal temperature condition and the second abnormal temperature condition of the target area and the non-target area of ​​the equipment based on the first temperature data and the second temperature data respectively includes: In the current ambient temperature range, based on the first normal temperature range table, if the temperature of the target area of ​​the device under monitoring deviates from its normal temperature range by more than a first preset amplitude within a certain parameter range, it is marked as the first abnormal temperature condition. Within the current ambient temperature range, based on the second normal temperature range table, if the temperature of the non-target area of ​​the monitored device deviates from its normal temperature range by more than a second preset amplitude within a certain parameter range, it is marked as the second abnormal temperature condition.

6. The substation switchgear temperature monitoring method according to claim 4, characterized in that, Also includes: If the temperature value corresponding to the first abnormal temperature condition is greater than or equal to the first warning temperature corresponding to the current parameter range, then a first warning message is generated. If the temperature value corresponding to the second abnormal temperature condition is greater than or equal to the second warning temperature corresponding to the current parameter range, then a second warning message is generated.

7. The method for monitoring the temperature of a substation switchgear according to claim 4, characterized in that, In the process of locating the abnormal target area based on the first abnormal temperature condition and dynamically reducing the first sampling interval and the second sampling interval corresponding to the abnormal target area and its adjacent non-target area, respectively, the process of determining the boundary conditions for reduction adjustment includes: The current temperature of the target area of ​​the device is less than or equal to the maximum value of the normal temperature range in the corresponding parameter interval, which corresponds to the first initial sampling interval set for the first sampling interval in the temperature sampling parameters; The current temperature of the target area of ​​the device is greater than or equal to the first warning temperature in the corresponding parameter range, which corresponds to the first upper limit sampling interval set for the first sampling interval in the temperature sampling parameters. Wherein, the decreasing step size of the second sampling interval is equal to the decreasing step size of the first sampling interval.

8. The method for monitoring the temperature of a substation switchgear according to claim 1, characterized in that, Also includes: Based on the ambient temperature and the first normal temperature range table, if the temperature of the target area of ​​the device returns to the corresponding normal temperature range and remains redundant for a certain duration, then the first sampling interval is controlled to return to the first initial sampling interval set in the temperature sampling parameters for the first sampling interval, and the second sampling interval of the adjacent non-target area is controlled to return to the second initial sampling interval set in the temperature sampling parameters for the second sampling interval.

9. The method for monitoring the temperature of a substation switchgear according to claim 5, characterized in that, Also includes: Set the allowable range and warning range for the dynamic temperature difference; The step of globally reducing the first sampling interval, the second sampling interval, and the third sampling interval for all monitored devices in the switch cabinet based on the dynamic temperature difference includes: When the dynamic temperature difference is less than or equal to the maximum value of the allowable range, it is set to a global zero decrease; When the dynamic temperature difference is greater than the maximum value of the allowable range, the dynamic temperature difference is globally reduced by a preset interval step for each preset temperature step increase. If the first sampling interval decreases to the first upper limit sampling interval, then the global decrease stops.

10. The method for monitoring the temperature of a substation switchgear according to claim 1, characterized in that, Also includes: If a device under monitoring is in a dormant state, then the collection of the first temperature data of the target area of ​​the device and the second temperature data of the non-target area of ​​the device shall be stopped. If more than a preset proportion of the monitored devices in the switch cabinet switch to sleep mode, the collection of the third temperature data of the cabinet area at the third sampling interval will stop.

Images