Interface shear force test fixture and method for heat-conductive gel for optical modules

Abstract

The application relates to an interface shear force test clamp and a test method for a heat-conducting gel for an optical module. The test clamp comprises a moving shear module and a fixed shear module. The fixed shear module comprises a fixed base and a fixed shear seat which is detachably installed on the fixed base and has a second gel bonding surface for simulating the contact interface between an optical module chip and the heat-conducting gel. The moving shear module comprises a moving base which is movably arranged on the fixed base along a preset shear test direction, and a moving shear seat which is detachably installed on the moving base and has a first gel bonding surface for simulating the contact interface between an optical module structural part and the heat-conducting gel. The two gel bonding surfaces are arranged in parallel and spaced apart, and form a gel filling gap. The shear strength data measured by the application can directly reflect the actual bonding strength of the complete interface link of "chip-gel-structural part" in the optical module, and the problems such as simulation distortion are avoided.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic device reliability testing technology, specifically to an interfacial shear force testing fixture and method for thermally conductive gel used in optical modules. Background Technology

[0002] As optical module speeds evolve towards 800G, 1.6T, and even higher, their power consumption and heat flux density increase dramatically, making heat dissipation design a core factor determining product reliability. Thermal conductive gel, as a key thermal interface material, is widely used inside optical modules to fill the tiny gaps between heat-generating chips (such as lasers, DSPs, and drivers) and metal heat sinks or substrates, serving the dual purpose of heat transfer and mechanical fixation.

[0003] In the actual working and service environment of optical modules, the mechanical load borne by the thermally conductive gel interface mainly comes from shear stress, for example:

[0004] (1) Thermal mismatch stress: There is a huge difference in the coefficient of thermal expansion between the chip and the heat dissipation structure. During temperature cycling, this difference will generate periodic shear stress at the interface, which is the main cause of interface fatigue delamination.

[0005] (2) Mechanical insertion and removal stress: When the optical module is inserted and removed in the device, its shell will be subjected to lateral force, which may be transmitted to the gel interface through the structural components, forming a shear load.

[0006] (3) Vibration and impact stress: During transportation or operation, external vibration and impact may also induce interfacial shear failure.

[0007] Currently, the industry has standard testing methods for the mechanical properties of thermally conductive gels (such as tensile strength and shear strength), but there is a severe lack of dedicated testing methods that can accurately simulate and quantify the shear strength of the gel at the interface of heterogeneous materials in actual optical modules. Existing general-purpose shear fixtures have the following key shortcomings:

[0008] (1) Interface simulation distortion: It is impossible to simulate the tiny contact area and specific surface materials (such as silicon, passivation layer, metal pads) of real chips, and it is also impossible to easily replace the mating friction pairs of different materials (such as zinc alloy, copper, aluminum alloy shells).

[0009] (2) Key variables are difficult to control: It is impossible to conveniently and accurately study the influence of the key process parameter "gel thickness" on the interfacial shear performance on a unified and standard testing platform.

[0010] (3) Impure load mode: When shear force is applied, the fixture is prone to generate unexpected bending moment or peeling force, resulting in load that is not pure shear. The test data includes the influence of other failure modes, resulting in low accuracy and poor repeatability, and cannot provide effective input for accurate simulation analysis and life prediction. Summary of the Invention

[0011] This invention relates to a fixture and method for testing the interfacial shear force of thermally conductive gel for optical modules, which can at least solve some of the defects of the prior art.

[0012] This invention relates to a fixture for testing the interfacial shear force of thermally conductive gel for optical modules, comprising a movable shear module and a fixed shear module.

[0013] The movable shearing module includes a movable base and a movable shearing seat. The movable shearing seat is detachably mounted on the movable base and has a first gel bonding surface, which is used to simulate the contact interface between the optical module structure and the thermally conductive gel.

[0014] The fixed shearing module includes a fixed base and a fixed shearing seat. The fixed shearing seat is detachably mounted on the fixed base and has a second gel bonding surface, which is used to simulate the contact interface between the optical module chip and the thermally conductive gel.

[0015] The movable base is movably mounted on the fixed base and its movement direction is a preset shear test direction; the first gel bonding surface and the second gel bonding surface are arranged parallel to each other and spaced apart, forming a gel filling gap between them.

[0016] As one embodiment, the distance between the first gel bonding surface and the second gel bonding surface is adjustable.

[0017] As one embodiment, the test fixture further includes a first thickness control unit, which includes a plurality of first thickness control pads adapted to be assembled to the connection surface between the movable shear seat and the movable base. The distance between the first gel bonding surface and the second gel bonding surface can be adjusted by increasing or decreasing the number of first thickness control pads between the movable shear seat and the movable base and / or replacing first thickness control pads of different thickness specifications.

[0018] And / or, the test fixture further includes a second thickness control unit, which includes a plurality of second thickness control pads adapted to be fitted to the connection surface between the fixed shear seat and the fixed base. The distance between the first gel bonding surface and the second gel bonding surface can be adjusted by increasing or decreasing the number of second thickness control pads between the fixed shear seat and the fixed base and / or replacing second thickness control pads of different thickness specifications.

[0019] As one implementation method, the adjustable spacing range is 0.05~0.5mm.

[0020] As one embodiment, the movable shearing module includes multiple movable shearing seats for matching different optical module structural components. The structural component simulation parameters of each movable shearing seat are different from each other. The structural component simulation parameters include the material of the first gel bonding surface and / or the surface treatment method of the first gel bonding surface. Each movable shearing seat is selectively installed on the fixed base.

[0021] As one embodiment, the fixed shearing module includes multiple fixed shearing seats for matching different optical module chips. The chip simulation parameters of each fixed shearing seat are different from each other. The chip simulation parameters include the material of the second gel bonding surface and / or the size of the second gel bonding surface. Each fixed shearing seat is selectively installed on the fixed base.

[0022] As one embodiment, the test fixture also includes a guiding mechanism for guiding the movement of the movable base.

[0023] As one embodiment, the guiding mechanism includes a guide post and a guide bearing that are in tandem. The axial direction of the guide post is parallel to the preset shear test direction. One of the guide post and the guide bearing is mounted on the movable base, and the other is mounted on the fixed base.

[0024] The present invention also relates to a method for testing the interfacial shear force of thermally conductive gel for optical modules, which is implemented based on the above-mentioned interfacial shear force testing fixture;

[0025] The testing method includes:

[0026] A thermally conductive gel is coated on the first gel bonding surface and / or the second gel bonding surface, and the movable base is assembled onto the fixed base, so that the thermally conductive gel is sandwiched between the first gel bonding surface and the second gel bonding surface and forms a gel layer.

[0027] The movable base is driven to move relative to the fixed base along a preset shear test direction, and the force-displacement curve during the shear process is recorded. When the gel interface fails, the peak shear force is recorded, and the interfacial shear strength is calculated based on the contact area between the first gel bonding surface and the thermally conductive gel.

[0028] Furthermore, the method also includes at least one of the following:

[0029] The distance between the first gel bonding surface and the second gel bonding surface was adjusted to test the effect of gel layer thickness on interfacial shear strength.

[0030] The structural simulation parameters of the movable shear seat are varied to test the influence of different types of optical module structural components on the interface shear strength. The structural simulation parameters include the material of the first gel bonding surface and / or the surface treatment method of the first gel bonding surface.

[0031] The chip simulation parameters of the fixed shear seat are varied to test the influence of different types of optical module chips on the interface shear strength. The chip simulation parameters include the material and / or size of the second gel bonding surface.

[0032] The present invention has at least the following beneficial effects:

[0033] This invention divides the shear interface into two independent components: a movable shear seat and a fixed shear seat. These components respectively simulate the functions of the optical module's structural components and the chip. The first gel bonding surface and the second gel bonding surface are positioned opposite each other, forming a gel-filled gap between them. This "dual-interface, face-to-face" architecture allows the gel to be held between two bonding surfaces representing real components. During testing, shear failure occurs at the heterogeneous interface consistent with actual operating conditions. The measured shear strength data directly reflects the actual bonding strength of the complete interface link of "chip-gel-structural component" in the optical module, avoiding simulation distortion and other problems. The test results have direct engineering reference value for the design of the optical module's heat dissipation structure and the evaluation of material compatibility.

[0034] The embodiments of the present invention further have the following beneficial effects:

[0035] In this invention, the simulated parameters of the structural components with adjustable gel layer thickness, movable shear seat, and fixed shear seat are variable. A unified testing platform allows for the completion of a full matrix combination test of "chip interface material—gel thickness—structural component material," thereby selecting the optimal solution. During the optical module development phase, the combination screening of "chip interface type × gel thickness × structural component interface type" can be completed in a short time. The data is comparable under the same platform, avoiding systemic biases introduced by using different testing equipment and schemes, and significantly shortening the material selection and process optimization cycle. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is an exploded structural diagram of the interface shear force testing fixture provided in an embodiment of the present invention;

[0038] Figure 2 This is an assembly front view of the interface shear force testing fixture provided in an embodiment of the present invention;

[0039] Figure 3 This is an assembly side view of the interface shear force testing fixture provided in an embodiment of the present invention;

[0040] Figure 4 This is a bottom view of the assembly of the interface shear force testing fixture provided in an embodiment of the present invention. Detailed Implementation

[0041] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Example 1

[0043] like Figures 1-4 This invention provides a fixture for testing the interfacial shear force of thermally conductive gel for optical modules, comprising a movable shear module and a fixed shear module.

[0044] The movable shearing module includes a movable base 2 and a movable shearing seat 3. The movable shearing seat 3 is detachably mounted on the movable base 2 and has a first gel bonding surface, which is used to simulate the contact interface between the optical module structure and the thermally conductive gel.

[0045] The fixed shearing module includes a fixed base 7 and a fixed shearing seat 9. The fixed shearing seat 9 is detachably mounted on the fixed base 7 and has a second gel bonding surface, which is used to simulate the contact interface between the optical module chip and the thermally conductive gel.

[0046] The movable base 2 is movably mounted on the fixed base 7 and its movement direction is a preset shear test direction; the first gel bonding surface and the second gel bonding surface are arranged parallel to each other and spaced apart, forming a gel filling gap between them.

[0047] In one embodiment, such as Figures 1-4 The movable base 2 is equipped with a first tie rod 1, and the fixed base 7 is equipped with a second tie rod 6. During testing, the first tie rod 1 and the second tie rod 6 can be respectively installed on the two clamps of the tensile testing machine. Preferably, the first tie rod 1 and the movable base 2 are hinged, including but not limited to a pin-and-bolt connection. Similarly, the second tie rod 6 and the fixed base 7 are preferably hinged, including but not limited to a pin-and-bolt connection.

[0048] The movable shear seat 3 and the movable base 2 are fixed together, including but not limited to, using threaded connectors such as screws / bolts. The fixed shear seat 9 and the fixed base 7 are fixed together, including but not limited to, using threaded connectors such as screws / bolts.

[0049] The distance between the first gel bonding surface and the second gel bonding surface is set according to the preset gel layer thickness.

[0050] During testing, thermally conductive gel can be applied to the second gel bonding surface / first gel bonding surface. After the movable base 2 and the fixed base 7 are assembled, the thermally conductive gel is sandwiched between the first gel bonding surface and the second gel bonding surface, forming a gel layer. Subsequently, the movable base 2 is driven to move relative to the fixed base 7 along a preset shear test direction, and the gel layer is subjected to shear force. The interfacial shear strength can be calculated by recording the peak shear force and combining it with the bonding area.

[0051] More preferably, the distance between the first gel bonding surface and the second gel bonding surface is adjustable. By adjusting this distance, the thickness of the gel layer can be precisely controlled and adjusted, thereby studying the influence of thickness, a key process parameter, on the interfacial shear strength, and providing a scientific basis for determining the optimal amount of gel and pressing process parameters.

[0052] In one embodiment, the adjustable spacing is achieved by providing thickness control shims between the movable shear seat 3 and the movable base 2 and / or between the fixed shear seat 9 and the fixed base 7. Specifically, this can be achieved in the following manner:

[0053] (1) such as Figure 1 and Figure 2 The test fixture also includes a first thickness control unit, which includes a plurality of first thickness control pads 4 adapted to be assembled to the connection surface between the movable shear seat 3 and the movable base 2. The distance between the first gel bonding surface and the second gel bonding surface can be adjusted by increasing or decreasing the number of first thickness control pads 4 between the movable shear seat 3 and the movable base 2 and / or replacing first thickness control pads 4 with different thickness specifications.

[0054] (2) The test fixture also includes a second thickness control unit, which includes a plurality of second thickness control pads adapted to be assembled to the connection surface between the fixed shear seat 9 and the fixed base 7. The distance between the first gel bonding surface and the second gel bonding surface can be adjusted by increasing or decreasing the number of second thickness control pads between the fixed shear seat 9 and the fixed base 7 and / or replacing the second thickness control pads with different thickness specifications.

[0055] The aforementioned thickness control unit allows operators to quickly switch and precisely set the gel layer thickness through simple pad addition, removal, or replacement operations, without requiring complex mechanism adjustments. The first and second thickness control units can be used independently or in combination.

[0056] The aforementioned first thickness control shim 4 / second thickness control shim are rigid precision shims, for example, made of tool steel through grinding.

[0057] Preferably, the spacing between the first gel bonding surface and the second gel bonding surface is adjustable in the range of 0.05~0.5mm, with a thickness accuracy of submicron level. This range also covers the typical application thickness of thermally conductive gel in optical modules.

[0058] In one embodiment, such as Figure 1 The movable shear seat 3 includes a shearing boss (shown in the figure, not labeled) and an annular flange plate (shown in the figure, not labeled). One end of the shearing boss forms a first gel bonding surface, and the annular flange plate is connected to the other edge of the shearing boss. The annular flange plate is connected to the movable base 2, and the shearing boss passes through the movable base 2 to engage with the fixed shear seat 9. Accordingly, the aforementioned first thickness control shim 4 can be disposed between the annular flange plate and the movable base 2. By increasing the number of first thickness control shims 4 and / or replacing them with first thickness control shims 4 of different thicknesses, the distance between the shearing boss and the fixed shear seat 9 can be adjusted, thereby adjusting the distance between the first gel bonding surface and the second gel bonding surface.

[0059] To further optimize the above-mentioned test fixture, the movable shearing module includes multiple movable shearing seats 3 for matching different optical module structural components. The structural component simulation parameters of each movable shearing seat 3 are different from each other. The structural component simulation parameters include the material of the first gel bonding surface and / or the surface treatment method of the first gel bonding surface. Each movable shearing seat 3 is selectively installed on the fixed base 7.

[0060] The simulation of the material of the first gel bonding surface, i.e., the interface material in contact with the thermally conductive gel, can be made of materials such as zinc alloy, copper, or aluminum alloy. Since the movable shear seat 3 does not need to simulate other functions of the optical module structure, the movable shear seat 3 can be made entirely of the aforementioned "material of the first gel bonding surface," for example, using materials such as zinc alloy, copper, or aluminum alloy.

[0061] The surface treatment of the first gel bonding surface may include sandblasting, anodizing, nickel plating, or electroless plating.

[0062] In this embodiment, by replacing the moving shear seat 3 with different simulated parameters of different structural components, the influence of different structural component interface materials and surface treatment processes on the adhesion strength of the gel interface can be systematically evaluated, providing a direct basis for structural component selection and surface treatment process optimization.

[0063] To further optimize the above-mentioned test fixture, the fixed shearing module includes multiple fixed shearing seats 9 for matching different optical module chips. The chip simulation parameters of each fixed shearing seat 9 are different from each other. The chip simulation parameters include the material of the second gel bonding surface and / or the size of the second gel bonding surface. Each fixed shearing seat 9 is selectively installed on the fixed base 7.

[0064] The material of the second gel bonding surface, i.e., the interface material in contact with the thermally conductive gel, can be a single-crystal silicon wafer or a ceramic sheet with a metallization layer. The metallization layer includes, but is not limited to, a gold layer, a copper layer, or an aluminum layer, and the ceramic sheet includes, but is not limited to, an alumina ceramic sheet or an aluminum nitride ceramic sheet. Since the fixed shear seat 9 does not require other functions of the analog optical module chip, the fixed shear seat 9 can be made entirely of the aforementioned "material of the second gel bonding surface," for example, using a single-crystal silicon wafer or a ceramic sheet with a metallization layer.

[0065] Preferably, the size of the second gel bonding surface can be as small as 1mm×1mm or even smaller, so as to truly simulate the bonding interface of the micro-chips in the optical module, and realize the direct measurement of the shear strength of the micro-bonding interface of the real chips (such as lasers, driver ICs, etc.) in the optical module.

[0066] In this embodiment, by changing the fixed shear seat 9 with different chip simulation parameters, the adhesion performance between the thermally conductive gel and different chip interface materials can be evaluated, providing accurate interface parameter input for chip-level thermomechanical simulation and reliability assessment.

[0067] In one embodiment, the test fixture further includes a guide mechanism for guiding the movement of the movable base 2. This guide mechanism, positioned between the movable base 2 and the fixed base 7, eliminates interference from bending moment, peeling force, and non-axial displacement by constraining the area perpendicular to the shear direction, ensuring that the load applied to the gel interface is a pure shear load.

[0068] Optionally, such as Figure 1The guiding mechanism includes a guide post 5 and a guide bearing 8 that are in a guiding fit. The axial direction of the guide post 5 is parallel to the preset shear test direction. One of the guide post 5 and the guide bearing 8 is mounted on the movable base 2, and the other is mounted on the fixed base 7. Furthermore, this guiding assembly of guide post 5 and guide bearing 8 can be provided in two sets, which can further improve the reliability of guiding the movable base 2. Preferably, the guide post 5 and the guide bearing 8 adopt a precision fit of H7 / g6 or higher, and the length of the guide post 5 ensures that it remains engaged with the guide bearing 8 throughout the entire shear stroke.

[0069] Example 2

[0070] This invention provides a method for testing the interfacial shear force of thermally conductive gel for optical modules, wherein the testing method is implemented based on the interfacial shear force testing fixture provided in Embodiment 1 above;

[0071] The testing method includes:

[0072] Thermally conductive gel is coated on the first gel bonding surface and / or the second gel bonding surface, and the movable base 2 is assembled onto the fixed base 7, so that the thermally conductive gel is sandwiched between the first gel bonding surface and the second gel bonding surface and forms a gel layer.

[0073] The movable base 2 is driven to move relative to the fixed base 7 along the preset shear test direction, and the force-displacement curve during the shear process is recorded. When the gel interface fails, the peak shear force is recorded, and the interface shear strength is calculated based on the contact area between the first gel bonding surface and the thermally conductive gel.

[0074] Preferably, the formula for calculating the interfacial shear strength τ is: τ = Fs / A, where Fs is the peak shear force and A is the contact area between the first gel bonding surface and the thermally conductive gel.

[0075] Preferably, the relative movement between the movable base 2 and the fixed base 7 is driven by a universal tensile testing machine at a speed of 0.5~5 mm / min.

[0076] More preferably, the method further includes at least one of the following:

[0077] The distance between the first gel bonding surface and the second gel bonding surface was adjusted to test the effect of gel layer thickness on interfacial shear strength.

[0078] The structural simulation parameters of the movable shear seat 3 are changed to test the influence of different types of optical module structural components on the interface shear strength. The structural simulation parameters include the material of the first gel bonding surface and / or the surface treatment method of the first gel bonding surface.

[0079] The chip simulation parameters of the fixed shear seat 9 are varied to test the influence of different types of optical module chips on the interface shear strength. The chip simulation parameters include the material and / or the size of the second gel bonding surface.

[0080] The variable adjustment methods mentioned above have been described in Embodiment 1. For example, adding, subtracting or replacing thickness control shims between the movable shear seat 3 and the movable base 2 and / or between the fixed shear seat 9 and the fixed base 7; replacing different movable shear seats 3, or replacing different fixed shear seats 9, etc., will not be elaborated here.

[0081] Through the above variable studies, a full matrix combination test of "chip interface material - gel thickness - structural component material" can be completed on a unified testing platform, thereby screening the optimal solution.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fixture for testing the interfacial shear force of thermally conductive gel for optical modules, characterized in that, Includes a moving shearing module and a fixed shearing module. The movable shearing module includes a movable base and a movable shearing seat. The movable shearing seat is detachably mounted on the movable base and has a first gel bonding surface, which is used to simulate the contact interface between the optical module structure and the thermally conductive gel. The fixed shearing module includes a fixed base and a fixed shearing seat. The fixed shearing seat is detachably mounted on the fixed base and has a second gel bonding surface, which is used to simulate the contact interface between the optical module chip and the thermally conductive gel. The movable base is movably mounted on the fixed base and its movement direction is a preset shear test direction; the first gel bonding surface and the second gel bonding surface are arranged parallel to each other and spaced apart, forming a gel filling gap between them.

2. The interfacial shear force testing fixture as described in claim 1, characterized in that: The distance between the first gel bonding surface and the second gel bonding surface is adjustable.

3. The interfacial shear force testing fixture as described in claim 2, characterized in that: The test fixture also includes a first thickness control unit, which includes a plurality of first thickness control pads adapted to be assembled to the connection surface between the movable shear seat and the movable base. The distance between the first gel bonding surface and the second gel bonding surface can be adjusted by increasing or decreasing the number of first thickness control pads between the movable shear seat and the movable base and / or replacing first thickness control pads of different thickness specifications. And / or, the test fixture further includes a second thickness control unit, which includes a plurality of second thickness control pads adapted to be fitted to the connection surface between the fixed shear seat and the fixed base. The distance between the first gel bonding surface and the second gel bonding surface can be adjusted by increasing or decreasing the number of second thickness control pads between the fixed shear seat and the fixed base and / or replacing second thickness control pads of different thickness specifications.

4. The interfacial shear force testing fixture as described in claim 2, characterized in that: The adjustable spacing range is 0.05~0.5mm.

5. The interfacial shear force testing fixture as described in claim 1, characterized in that: The movable shearing module includes multiple movable shearing seats for matching different optical module structural components. The structural component simulation parameters of each movable shearing seat are different from each other. The structural component simulation parameters include the material of the first gel bonding surface and / or the surface treatment method of the first gel bonding surface. Each movable shearing seat is selectively installed on the fixed base.

6. The interfacial shear force testing fixture as described in claim 1, characterized in that: The fixed shearing module includes multiple fixed shearing seats for matching different optical module chips. The chip simulation parameters of each fixed shearing seat are different from each other. The chip simulation parameters include the material of the second gel bonding surface and / or the size of the second gel bonding surface. Each fixed shearing seat is selectively installed on the fixed base.

7. The interfacial shear force testing fixture as described in claim 1, characterized in that: The test fixture also includes a guiding mechanism for guiding the movement of the movable base.

8. The interfacial shear force testing fixture as described in claim 7, characterized in that: The guiding mechanism includes a guide post and a guide bearing that are in tandem. The axial direction of the guide post is parallel to the preset shear test direction. One of the guide post and the guide bearing is mounted on the movable base, and the other is mounted on the fixed base.

9. A method for testing the interfacial shear force of thermally conductive gel for optical modules, characterized in that, Implemented based on the interface shear force testing fixture according to any one of claims 1 to 8; The testing method includes: A thermally conductive gel is coated on the first gel bonding surface and / or the second gel bonding surface, and the movable base is assembled onto the fixed base, so that the thermally conductive gel is sandwiched between the first gel bonding surface and the second gel bonding surface and forms a gel layer. The movable base is driven to move relative to the fixed base along a preset shear test direction, and the force-displacement curve during the shear process is recorded. When the gel interface fails, the peak shear force is recorded, and the interfacial shear strength is calculated based on the contact area between the first gel bonding surface and the thermally conductive gel.

10. The interfacial shear force testing method as described in claim 9, characterized in that, The method further includes at least one of the following: The distance between the first gel bonding surface and the second gel bonding surface was adjusted to test the effect of gel layer thickness on interfacial shear strength. The structural simulation parameters of the movable shear seat are varied to test the influence of different types of optical module structural components on the interface shear strength. The structural simulation parameters include the material of the first gel bonding surface and / or the surface treatment method of the first gel bonding surface. The chip simulation parameters of the fixed shear seat are varied to test the influence of different types of optical module chips on the interface shear strength. The chip simulation parameters include the material and / or size of the second gel bonding surface.

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