Semiconductor precision component surface quality detection device

Abstract

The application discloses a kind of semiconductor precision component surface quality detection device, specifically relates to semiconductor detection field, including: machine body, detection table is provided on machine body, it is characterized in that: detection table is provided with the pre-supporting mechanism for supporting the piece to be detected, detection mechanism is further provided on machine body.The application is by being provided with pre-supporting mechanism, before detection, first by lifting supporting unit, the piece to be detected is supported from center supporting table, and the back of the piece to be detected is formed with the gap between center supporting table, then by circumferential swing blowing unit, blowing head is driven to move along the circumferential direction of the piece to be detected and reciprocating swing, and the back of the piece to be detected in the gap and the surface of center supporting table are blown, so that the small particles possibly clamped into supporting interface are removed, the situation that the piece to be detected is locally lifted, overall slightly inclined or locally deformed due to particle support is reduced, and the accuracy of laser detection head to the surface quality detection of the piece to be detected is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and more specifically, to a device for testing the surface quality of precision semiconductor components. Background Technology

[0002] Semiconductor precision components are typically used in semiconductor equipment, wafer processing, or precision bearing positioning scenarios. Their surface flatness directly affects the positioning accuracy during subsequent assembly, adsorption, sealing, or processing. Therefore, it is usually necessary to inspect their surface quality after production.

[0003] Currently, when inspecting the surface flatness of precision semiconductor components, the component to be inspected is typically placed directly on a high-flatness inspection stage, and a laser inspection head moves above the component to obtain the height changes on its surface. This method can meet conventional inspection requirements when the back of the component is relatively flat and foreign objects are unlikely to get stuck between the back of the component and the inspection stage.

[0004] However, the back of some precision semiconductor components typically features air channels, countersunk holes, positioning holes, chamfered edges, or shallow recesses. After the component is processed, handled, or pre-processed, these locations can easily trap hard, tiny particles such as ceramic powder, silicon carbide microparticles, quartz chips, dried polishing slurry particles, or coating debris. When the component is placed directly on the testing table, these tiny particles may become trapped between the back of the component and the supporting surface of the testing table, causing the component to be partially lifted, slightly tilted, or deformed. This results in false height variations caused by the back particles in the laser testing results, making it difficult to accurately reflect the true flatness of the component's surface. Summary of the Invention

[0005] The present invention provides a surface quality inspection device for precision semiconductor components, which aims to solve the problem that in the existing surface flatness inspection of precision semiconductor components, when the component to be inspected is placed directly on the inspection stage, tiny particles are easily trapped between the back of the component and the inspection stage, causing the component to be inspected to be partially lifted, slightly tilted, or deformed, thus affecting the accuracy of the laser inspection results.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor precision component surface quality inspection device, comprising: a body, wherein a testing platform is provided on the body, characterized in that: a pre-support rejection mechanism for supporting the component to be inspected is provided on the testing platform, and a testing mechanism is also provided on the body, the testing mechanism being used to inspect the surface quality of the component to be inspected;

[0007] The pre-support and rejection mechanism includes a ring seat, a central support platform, a lifting support unit, and a circumferential swing blowing unit. An installation area for accommodating the lifting support unit is formed between the ring seat and the central support platform. The lifting support unit can move vertically relative to the ring seat and the central support platform.

[0008] The lifting support unit is used to lift the part to be tested before testing, so that a rejection gap is formed between the back of the part to be tested and the central support platform.

[0009] The circumferential oscillating purging unit includes a purging head, which is used to blow airflow into the rejection gap between the back of the workpiece to be tested and the central support platform. The purging head can move along the circumference of the workpiece to be tested and can oscillate up and down repeatedly during the circumferential movement.

[0010] The testing mechanism includes a laser testing head, which is used to test the surface quality of the part to be tested after it is placed on the central support platform.

[0011] In a preferred embodiment, the lifting support unit includes a linear drive and a support ring. The support ring is disposed at the output end of the linear drive, which drives the support ring to move vertically. The support ring lifts the object to be tested away from the central support platform by rising vertically.

[0012] In a preferred embodiment, the support ring is disposed between the ring seat and the central support platform, and the support ring has an annular structure. After the support ring rises, it is used to support the edge area of ​​the test piece, so that an annular rejection gap is formed between the back of the test piece and the upper surface of the central support platform.

[0013] In a preferred embodiment, the circumferential oscillating purging unit further includes a circumferential moving seat and an annular groove. The annular groove is disposed on the supporting ring, and the circumferential moving seat can move circumferentially along the annular groove. The purging head is hingedly disposed on the circumferential moving seat and moves circumferentially along the workpiece to be tested along with the circumferential moving seat.

[0014] In a preferred embodiment, the circumferential oscillating purging unit further includes an elastic element, an annular wave frame, and a limiting rod. The elastic element is used to apply a reset force to the purging head. The circumferential moving seat is slidably sleeved on the limiting rod, so that when the circumferential moving seat moves along the annular groove, the purging head oscillates up and down under the combined action of the elastic element and the annular wave frame.

[0015] In a preferred embodiment, the circumferential oscillating purging unit further includes a circumferential drive assembly, which includes a rotary drive member, a drive gear, and a driven gear. The drive gear is disposed at the output end of the rotary drive member, and the driven gear is coaxially disposed with the support seat. The drive gear and the driven gear are in transmission cooperation, and a limit rod is fixedly disposed on the driven gear for driving the circumferential moving seat to move circumferentially along the annular groove.

[0016] In a preferred embodiment, a central support mechanism is further provided on the central support platform. The central support mechanism includes a narrow-top support ring and an adapter groove. The adapter groove is provided on the central support platform, and the narrow-top support ring is provided in the adapter groove. The narrow-top support ring is fixedly connected to the support ring. The narrow-top support ring is used to provide auxiliary support for the back of the center of the test piece when it is lifted by the lifting support unit.

[0017] In a preferred embodiment, the central support mechanism further includes an air supply unit, which includes an air supply pipe, an annular cavity, and an air outlet. The annular cavity is disposed within the narrow-top support ring, and the air supply pipe communicates with the annular cavity. The air outlet is disposed on the side wall of the narrow-top support ring near the top, and the air outlet is used to blow air into the rejection gap between the back of the test piece and the central support platform.

[0018] In a preferred embodiment, multiple narrow-top support rings are provided, arranged concentrically, with a connecting strip between adjacent narrow-top support rings. The connecting strip has a vent hole for connecting the annular cavity in the adjacent narrow-top support rings. The air outlets on the multiple narrow-top support rings are arranged circumferentially at intervals, so that the central support mechanism can purge the central area on the back of the test piece while assisting in supporting the central part of the test piece.

[0019] In a preferred embodiment, the detection mechanism further includes a linear drive assembly one and a linear drive assembly two. The linear drive assembly two is disposed at the output end of the linear drive assembly one, and the laser detection head is disposed at the output end of the linear drive assembly two. The linear drive assembly one and the linear drive assembly two are used to drive the laser detection head to move and detect the workpiece to be detected.

[0020] The beneficial effects of this invention are as follows:

[0021] This invention employs a pre-support and rejection mechanism. Before testing, a lifting support unit lifts the part to be tested away from the central support platform, creating a rejection gap between the back of the part and the central support platform. Then, a circumferential swinging blowing unit drives the blowing head to move circumferentially along the part and swing back and forth, blowing the back of the part and the surface of the central support platform within the rejection gap. This removes any tiny particles that may be trapped at the support interface, reducing the likelihood of the part being partially lifted, slightly tilted, or deformed due to particle support, and improving the accuracy of the laser detection head in detecting the surface quality of the part.

[0022] This invention, by setting up a central support mechanism, utilizes multiple concentrically arranged narrow-top support rings to provide auxiliary support for the back of the central part of the test piece when the support rings support a large-format, thin test piece. This reduces the problem of the central part of the test piece deflecting downwards due to its own weight and sticking close to the central support platform. At the same time, an air supply unit supplies air to the annular cavity inside the narrow-top support rings, and blows air through the air outlets into the central area of ​​the back of the test piece. This allows the central support mechanism to provide auxiliary support while also performing auxiliary purging, reducing the problem of particles being trapped due to the central support structure blocking the airflow. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0024] Figure 2 This is a schematic diagram of the front cross-sectional structure of the present invention;

[0025] Figure 3 This is a schematic diagram of the pre-support rejection mechanism of the present invention;

[0026] Figure 4 This is a schematic diagram of the circumferential oscillating purging unit of the present invention;

[0027] Figure 5 This is a three-dimensional structural diagram of the annular wave frame of the present invention;

[0028] Figure 6 This is a schematic diagram of the central support mechanism of the present invention;

[0029] Figure 7 This is an enlarged view of the central support mechanism of the present invention;

[0030] Figure 8 This is a three-dimensional structural diagram of the narrow-top support ring of the present invention;

[0031] Figure 9 This is a three-dimensional structural diagram of the detection mechanism of the present invention.

[0032] The attached figures are labeled as follows: 100, Part to be tested; 1, Machine body; 11, Testing table; 2, Pre-support and rejection mechanism; 21, Ring seat; 22, Central support platform; 23, Lifting support unit; 231, Linear drive component; 232, Support ring; 24, Circumferential swing blowing unit; 241, Blowing head; 242, Circumferential moving seat; 243, Annular groove; 244, Elastic component; 245, Annular wave frame; 246, Circumferential drive assembly; 24 61. Rotary drive component; 2462. Drive gear; 2463. Driven gear; 247. Limiting rod; 3. Detection mechanism; 31. Linear drive assembly one; 32. Linear drive assembly two; 33. Laser detection head; 4. Central support mechanism; 41. Narrow top support ring; 42. Adaptor groove; 43. Air supply unit; 431. Air supply pipe; 432. Annular cavity; 433. Air outlet; 434. Connecting strip; 4341. Vent hole. Detailed Implementation

[0033] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0034] Refer to the instruction manual appendix Figures 1 to 4 A semiconductor precision component surface quality inspection device includes: a body 1, on which an inspection table 11 is provided, characterized in that: the inspection table 11 is provided with a pre-support and rejection mechanism 2 for supporting the component 100 to be inspected, and the body 1 is also provided with an inspection mechanism 3 for inspecting the surface quality of the component 100 to be inspected.

[0035] The pre-support and rejection mechanism 2 includes a ring seat 21, a central support platform 22, a lifting support unit 23, and a circumferential swing blowing unit 24. An installation area for accommodating the lifting support unit 23 is formed between the ring seat 21 and the central support platform 22. The lifting support unit 23 can move vertically relative to the ring seat 21 and the central support platform 22.

[0036] The lifting support unit 23 is used to lift the part to be tested 100 before testing, so that a rejection gap is formed between the back of the part to be tested 100 and the central support platform 22, and is used to lower after rejection, so that the part to be tested 100 is placed on the central support platform 22.

[0037] The circumferential oscillating blowing unit 24 includes a blowing head 241, which is used to blow air into the rejection gap between the back of the test piece 100 and the central support platform 22. The blowing head 241 can move along the circumference of the test piece 100 and can oscillate up and down during the circumferential movement.

[0038] The testing mechanism 3 includes a laser testing head 33, which is used to test the surface quality of the workpiece 100 after it is placed on the central support platform 22.

[0039] It should be noted that the main function of the lifting support unit 23 is not to continuously support the workpiece 100 during the testing process, but to temporarily lift the workpiece 100 away from the central support platform 22 before testing, so that a clearance gap is formed between the back of the workpiece 100 and the central support platform 22, allowing airflow to pass through. The circumferential swing purging unit 24 can be connected to a clean air source, which can be clean compressed air, clean nitrogen, or other gases that are not easily contaminated by the workpiece 100. The laser detection head 33 in the testing mechanism 3 can be a laser displacement sensor, a laser contour detection head, or other laser detection components capable of acquiring changes in the surface height of the workpiece 100.

[0040] In this embodiment, the specific implementation scenario is as follows: after the test piece 100 is placed on the pre-support rejection mechanism 2, the test piece 100 is first lifted by the lifting support unit 23 so that a rejection gap is maintained between the back of the test piece 100 and the central support platform 22. Then, the circumferential swing blowing unit 24 drives the blowing head 241 to move along the circumference of the test piece 100. At the same time, the blowing head 241 swings up and down, so that the blowing airflow acts on the rejection gap at different height positions. For the test piece 100 with air channels, countersunk holes, positioning holes, chamfered edges, or shallow concave structures on its back, hard microparticles such as ceramic micro powder, silicon carbide microparticles, quartz micro chips, dried grinding fluid particles, or coating debris are easily trapped on its back. Through the above-mentioned pre-support and purging process, these particles can be discharged from between the back of the test piece 100 and the central support platform 22 before the test piece 100 is officially placed for testing. Then, the lifting support unit 23 descends, and the test piece 100 is placed back on the central support platform 22, so that the central support platform 22 forms a stable plane to support the test piece 100. Finally, the surface quality of the test piece 100 is tested by the laser detection head 33, thereby reducing the problem of microparticles being trapped between the test piece 100 and the central support platform 22, causing the test piece 100 to be partially lifted, slightly tilted, or deformed, which would affect the test results.

[0041] Further, please refer to the appendix to the instruction manual. Figure 3 The lifting support unit 23 includes a linear drive 231 and a support ring 232. The support ring 232 is located at the output end of the linear drive 231. The linear drive 231 is used to drive the support ring 232 to move vertically. The support ring 232 lifts the test piece 100 away from the central support platform 22 by rising vertically.

[0042] It should be noted that the linear drive 231 can be an electric push rod. Before the workpiece 100 needs to be inspected, the linear drive 231 drives the support ring 232 upward, so that the support ring 232 contacts the edge area of ​​the workpiece 100, and continues to drive the workpiece 100 upward, so that a rejection gap is formed between the back of the workpiece 100 and the central support platform 22. Then, the circumferential oscillating blowing unit 24 blows through the rejection gap, so that the tiny particles between the back of the workpiece 100 and the central support platform 22 are blown away. After the rejection is completed, the linear drive 231 drives the support ring 232 downward, so that the support ring 232 is lower than or flush with the support surface of the central support platform 22, so that the workpiece 100 is placed back on the central support platform 22 for subsequent surface quality inspection by the laser inspection head 33.

[0043] Further, please refer to the appendix to the instruction manual. Figure 3 The support ring 232 is disposed between the ring seat 21 and the central support platform 22, and the support ring 232 has an annular structure. After the support ring 232 rises, it is used to support the edge area of ​​the test piece 100, so that an annular rejection gap is formed between the back of the test piece 100 and the upper surface of the central support platform 22.

[0044] It should be noted that after the test piece 100 is placed on the pre-support rejection mechanism 2, the support ring 232 moves upward under the drive of the linear drive member 231 and lifts the test piece 100 from the back edge region, causing the middle back of the test piece 100 to disengage from the upper surface of the central support platform 22, thereby forming an annular rejection gap. Since this rejection gap is formed around the central support platform 22, when the purge head 241 moves circumferentially along the test piece 100... The purging airflow can enter between the back of the test piece 100 and the central support platform 22, and diffuse along the annular rejection gap, carrying away the tiny particles located on the upper surface of the central support platform 22 or the back of the test piece 100 from the support area. After rejection, the support ring 232 descends to be lower than or flush with the upper surface of the central support platform 22, so that the test piece 100 is again supported by the central support platform 22, avoiding the support ring 232 from participating in the final test support and affecting the test benchmark.

[0045] Further, please refer to the appendix to the instruction manual. Figure 3 , Figure 4 The circumferential swing purging unit 24 also includes a circumferential moving seat 242 and an annular groove 243. The annular groove 243 is disposed on the supporting ring 232. The circumferential moving seat 242 can move circumferentially along the annular groove 243. The purging head 241 is hingedly disposed on the circumferential moving seat 242 and moves circumferentially along the workpiece 100 to be tested with the circumferential moving seat 242.

[0046] It should be noted that the circumferential moving seat 242 can slide and engage with the annular groove 243 via a slider, roller, or guide protrusion to ensure that the circumferential moving seat 242 does not easily deviate from the predetermined trajectory when moving along the annular groove 243. After the supporting ring 232 rises and lifts the workpiece 100 to be tested, a rejection gap is formed between the back of the workpiece 100 to be tested and the central supporting platform 22. At this time, the circumferential moving seat 242 moves circumferentially along the annular groove 243, driving the blowing head 241 to move circumferentially around the workpiece 100 to be tested. The blowing head 241 can sequentially blow different circumferential positions on the back of the test piece 100. Since the annular groove 243 is set on the support ring 232, when the support ring 232 is in the lifted state, the circumferential moving seat 242 and the blowing head 241 can be positioned with the support ring 232 at the position corresponding to the rejection gap. This makes it easier for the air outlet direction of the blowing head 241 to be aligned with the gap between the back of the test piece 100 and the central support platform 22, reducing the problem that the fixed blowing position can only act on a local area.

[0047] Further, please refer to the appendix to the instruction manual. Figure 4 , Figure 5 The circumferential oscillating purging unit 24 also includes an elastic element 244, an annular wave frame 245, and a limiting rod 247. The elastic element 244 is used to apply a reset force to the purging head 241. The circumferential moving seat 242 is slidably sleeved on the limiting rod 247, so that when the circumferential moving seat 242 moves along the annular groove 243, the purging head 241 oscillates up and down under the combined action of the elastic element 244 and the annular wave frame 245.

[0048] It should be noted that the elastic element 244 can be a spring. After the supporting ring 232 lifts the part to be tested 100 and forms a rejection gap, the circumferential moving seat 242 moves circumferentially along the annular groove 243. The blowing head 241 moves circumferentially synchronously with the circumferential moving seat 242. During the circumferential movement, the blowing head 241 abuts against the annular wave frame 245 under the action of the elastic element 244, and swings up and down with the change in the height of the wave surface of the annular wave frame 245. This causes the air outlet direction of the blowing head 241 to alternate between near the back of the part to be tested 100 and near the upper surface of the central support platform 22. With this setting, the blowing airflow can not only cover the rejection gap circumferentially, but also swing vertically. This reduces the problem that when blowing at a fixed angle, the airflow can only act on a certain height position of the rejection gap, which makes it difficult to blow away local particles on the edge of the groove hole on the back of the part to be tested 100 or on the surface of the central support platform 22.

[0049] Further, please refer to the appendix to the instruction manual. Figure 3The circumferential oscillating blowing unit 24 also includes a circumferential drive assembly 246, which includes a rotary drive member 2461, a drive gear 2462, and a driven gear 2463. The drive gear 2462 is located at the output end of the rotary drive member 2461, and the driven gear 2463 is coaxially arranged with the support seat 22. The drive gear 2462 and the driven gear 2463 are in a transmission cooperation, and the limiting rod 247 is fixedly arranged on the driven gear 2463 to drive the circumferential moving seat 242 to move circumferentially along the annular groove 243.

[0050] It should be noted that the rotary drive component 2461 can be a servo motor. After the support ring 232 lifts the workpiece 100 to be tested and forms a rejection gap, the rotary drive component 2461 starts and drives the drive gear 2462 to rotate. The drive gear 2462 drives the driven gear 2463 to rotate around the central support platform 22. The driven gear 2463 then drives the circumferential moving seat 242 to move circumferentially along the annular groove 243 through the limit rod 247, so that the blowing head 241 can blow around the circumference of the workpiece 100 to be tested.

[0051] In the above technical solution, the lifting support unit 23 drives the support ring 232 to rise, which can lift the part to be tested 100 from the central support platform 22 before testing, so that a rejection gap is formed between the back of the part to be tested 100 and the central support platform 22. The circumferential swinging blowing unit 24 drives the blowing head 241 to move circumferentially and swing up and down, thereby blowing and removing foreign matter from the rejection gap. However, in the testing of precision semiconductor components, some parts to be tested 100 are large-format thin structures with thin thickness, large overall area, and relatively low bending stiffness. When only the edge area of ​​the part to be tested 100 is lifted by the support ring 232, the edge position of the part to be tested 100 can be lifted with the support ring 232. As ring 232 rises, the central region of the test piece 100 is prone to bending downwards under its own weight, causing its central back surface to remain in contact with or too close to the central support platform 22. At this time, although the edge region of the test piece 100 has formed a rejection gap, the gap in the central region is discontinuous. The airflow blown in by the blown head 241 is easily blocked when entering the central region, making it difficult to fully blow away the tiny particles on the central back surface of the test piece 100 or the central support platform 22. After rejection, the particles may still be trapped in the support interface when the test piece 100 is repositioned, thus affecting the accuracy of subsequent laser detection results. To address this, the present invention also proposes a central support mechanism 4 to solve the above-mentioned technical problems.

[0052] For details, please refer to the instruction manual appendix. Figure 6 , Figure 7The central support platform 22 is also provided with a central support mechanism 4. The central support mechanism 4 includes a narrow top support ring 41 and an adapter groove 42. The adapter groove 42 is provided on the central support platform 22, and the narrow top support ring 41 is provided in the adapter groove 42. The narrow top support ring 41 is fixedly connected to the support ring 232. The narrow top support ring 41 is used to provide auxiliary support for the back of the middle part of the test piece 100 when the test piece 100 is lifted by the lifting support unit 23.

[0053] It should be noted that the narrow-top support ring 41 can be fixedly connected to the support ring 232 through a connecting plate, connecting rod, or bolt connection structure. When the part to be tested 100 is a large-format thin semiconductor precision component, the support ring 232 can lift the edge area of ​​the part to be tested 100 after it rises. However, the middle area of ​​the part to be tested 100 is prone to deflecting due to its own weight and approaching or contacting the central support platform 22, resulting in discontinuity of the rejection gap in the middle area. At this time, the support ring 232 rises while driving the narrow-top support ring 41 to rise. The support ring 41 rises synchronously from the adapter groove 42, so that the narrow-top support ring 41 provides auxiliary support for the middle back of the test piece 100, thereby creating a gap between the middle area of ​​the test piece 100 and the central support platform 22, which facilitates the entry of the purging airflow into the middle area of ​​the back of the test piece 100. After the rejection is completed, the support ring 232 descends and drives the narrow-top support ring 41 back into the adapter groove 42, so that the test piece 100 is placed back on the central support platform 22 for testing.

[0054] Further, please refer to the appendix to the instruction manual. Figure 7 The central support mechanism 4 also includes an air supply unit 43, which includes an air supply pipe 431, an annular cavity 432, and an air outlet 433. The annular cavity 432 is located inside the narrow top support ring 41, and the air supply pipe 431 is connected to the annular cavity 432. The air outlet 433 is located on the side wall of the narrow top support ring 41 near the top. The air outlet 433 is used to blow air into the rejection gap between the back of the test piece 100 and the central support platform 22.

[0055] It should be noted that the air supply pipe 431 can be a flexible or telescopic air pipe to accommodate the lifting and lowering movement of the narrow-top support ring 41 with the support ring 232, thus preventing the air supply pipe 431 from being stretched or bent during the lifting and lowering of the narrow-top support ring 41. The clean air source connected to the air supply unit 43 can be clean compressed air, clean nitrogen, or other gases that are not easily contaminated by the test piece 100. When the support ring 232 drives the narrow-top support ring 41 to rise and provides auxiliary support for the middle back of the test piece 100 through the narrow-top support ring 41, the air supply unit 43 simultaneously supplies clean gas into the air supply pipe 431. The clean gas enters the narrow-top support ring through the air supply pipe 431. The annular cavity 432 inside 41 blows air through multiple air outlets 433 towards the central area of ​​the back of the test piece 100. Since the narrow top support ring 41 is located in the middle of the central support platform 22, if it is only mechanically supported by the narrow top support ring 41, the area near the narrow top support ring 41 may become an airflow obstruction area. However, by setting an air supply unit 43 on the narrow top support ring 41, the narrow top support ring 41 can assist in supporting the test piece 100 while also assisting in blowing the area near and in the middle of it. This makes it easier for the tiny particles in the middle of the back of the test piece 100 to detach and be discharged with the airflow, thereby reducing the problem of the central support structure blocking the exhaust airflow.

[0056] Further, please refer to the appendix to the instruction manual. Figure 8 Multiple narrow-top support rings 41 are provided, and the multiple narrow-top support rings 41 are arranged concentrically. A connecting strip 434 is provided between two adjacent narrow-top support rings 41. A vent hole 4341 is opened in the connecting strip 434. The vent hole 4341 is used to connect the annular cavity 432 in the two adjacent narrow-top support rings 41. The air outlet holes 433 on the multiple narrow-top support rings 41 are arranged circumferentially at intervals, so that the central support mechanism 4 can purge the central area of ​​the back side of the test piece 100 while assisting in supporting the central part of the test piece 100.

[0057] It should be noted that when the support ring 232 drives the multiple narrow-top support rings 41 to rise synchronously, the multiple narrow-top support rings 41 provide auxiliary support to the back of the central part of the test piece 100 from different radius positions. This reduces the possibility of the large-format, thin test piece 100 sags downwards and touches the central support platform 22. At the same time, clean gas enters the annular cavity 432 of one of the narrow-top support rings 41 through the air supply pipe 431, and then enters the annular cavity 432 of the adjacent narrow-top support ring 41 through the vent hole 4341 in the connecting strip 434. Subsequently, it is blown out to the central area of ​​the back of the test piece 100 through the air outlet hole 433 on the multiple narrow-top support rings 41. With this setting, the central support mechanism 4 can support the central part of the test piece 100 at multiple points while simultaneously purging multiple support radius areas. This reduces the problem of the central support structure itself blocking the purging airflow, causing particles to remain between or near the adjacent narrow-top support rings 41.

[0058] Further, please refer to the appendix to the instruction manual. Figure 9 The detection mechanism 3 also includes a linear drive assembly 31 and a linear drive assembly 32. The linear drive assembly 32 is located at the output end of the linear drive assembly 31, and the laser detection head 33 is located at the output end of the linear drive assembly 32. The linear drive assembly 31 and the linear drive assembly 32 are used to drive the laser detection head 33 to move and detect the workpiece 100.

[0059] It should be noted that linear drive assembly 1 31 and linear drive assembly 2 32 can be linear motors, lead screws, and linear modules. After the workpiece 100 to be inspected completes back-side clearance through the pre-support clearance mechanism 2 and is placed back on the central support platform 22, linear drive assembly 1 31 first drives linear drive assembly 2 32 and laser detection head 33 to move in one direction. Then, linear drive assembly 2 32 drives laser detection head 33 to move in the other direction, so that laser detection head 33 can move and inspect above workpiece 100 along a predetermined path. Since workpiece 100 has completed back-side clearance through lifting support unit 23, circumferential swing blowing unit 24, and central support mechanism 4 before inspection, and is finally supported by the central support platform 22, the height change obtained by laser detection head 33 during inspection is closer to the true state of the surface of workpiece 100 itself, reducing the possibility of inspection errors caused by back-side particles supporting workpiece 100.

[0060] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A surface quality inspection device for semiconductor precision components, characterized in that, include: The body (1) is provided with a testing platform (11), characterized in that: the testing platform (11) is provided with a pre-support rejection mechanism (2) for supporting the test piece (100), and the body (1) is also provided with a testing mechanism (3), which is used to test the surface quality of the test piece (100); The pre-support and rejection mechanism (2) includes a ring seat (21), a central support platform (22), a lifting support unit (23), and a circumferential swing blowing unit (24). An installation area for accommodating the lifting support unit (23) is formed between the ring seat (21) and the central support platform (22). The lifting support unit (23) can move vertically relative to the ring seat (21) and the central support platform (22). The lifting support unit (23) is used to lift the part to be tested (100) before testing, so that a rejection gap is formed between the back of the part to be tested (100) and the central support platform (22); The circumferential swinging purging unit (24) includes a purging head (241), which is used to blow air into the rejection gap between the back of the test piece (100) and the central support platform (22). The purging head (241) can move along the circumference of the test piece (100) and can swing back and forth up and down during the circumferential movement. The testing mechanism (3) includes a laser testing head (33), which is used to test the surface quality of the test piece (100) after it is placed on the central support platform (22).

2. The semiconductor precision component surface quality inspection device according to claim 1, characterized in that: The lifting support unit (23) includes a linear drive (231) and a support ring (232). The support ring (232) is located at the output end of the linear drive (231). The linear drive (231) is used to drive the support ring (232) to move vertically. The support ring (232) lifts the test piece (100) away from the central support platform (22) by rising vertically.

3. The semiconductor precision component surface quality inspection device according to claim 2, characterized in that: The supporting ring (232) is disposed between the ring seat (21) and the central supporting platform (22), and the supporting ring (232) has an annular structure. After the supporting ring (232) rises, it is used to support the edge area of ​​the test piece (100), so that an annular rejection gap is formed between the back of the test piece (100) and the upper surface of the central supporting platform (22).

4. The semiconductor precision component surface quality inspection device according to claim 3, characterized in that: The circumferential swing purging unit (24) further includes a circumferential moving seat (242) and an annular groove (243). The annular groove (243) is disposed on the supporting ring (232). The circumferential moving seat (242) can move circumferentially along the annular groove (243). The purging head (241) is hinged on the circumferential moving seat (242) and moves circumferentially along the test piece (100) with the circumferential moving seat (242).

5. The semiconductor precision component surface quality inspection device according to claim 4, characterized in that: The circumferential oscillating purging unit (24) also includes an elastic element (244), an annular wave frame (245), and a limiting rod (247). The elastic element (244) is used to apply a reset force to the purging head (241). The circumferential moving seat (242) is slidably sleeved on the limiting rod (247). When the circumferential moving seat (242) moves along the annular groove (243), the purging head (241) oscillates up and down under the combined action of the elastic element (244) and the annular wave frame (245).

6. The semiconductor precision component surface quality inspection device according to claim 5, characterized in that: The circumferential oscillating purging unit (24) further includes a circumferential drive assembly (246), which includes a rotary drive member (2461), a drive gear (2462), and a driven gear (2463). The drive gear (2462) is located at the output end of the rotary drive member (2461), and the driven gear (2463) is coaxially arranged with the support (22). The drive gear (2462) and the driven gear (2463) are in transmission cooperation, and the limiting rod (247) is fixedly arranged on the driven gear (2463) to drive the circumferential moving seat (242) to move circumferentially along the annular groove (243).

7. The semiconductor precision component surface quality inspection device according to claim 6, characterized in that: The central support platform (22) is also provided with a central support mechanism (4). The central support mechanism (4) includes a narrow top support ring (41) and an adapter groove (42). The adapter groove (42) is provided on the central support platform (22). The narrow top support ring (41) is provided in the adapter groove (42). The narrow top support ring (41) is fixedly connected to the support ring (232). The narrow top support ring (41) is used to provide auxiliary support to the back of the middle part of the test piece (100) when the test piece (100) is lifted by the lifting support unit (23).

8. The semiconductor precision component surface quality inspection device according to claim 7, characterized in that: The central support mechanism (4) further includes an air supply unit (43), which includes an air supply pipe (431), an annular cavity (432) and an air outlet (433). The annular cavity (432) is located inside the narrow top support ring (41), and the air supply pipe (431) is connected to the annular cavity (432). The air outlet (433) is located on the side wall of the narrow top support ring (41) near the top. The air outlet (433) is used to blow air into the rejection gap between the back of the test piece (100) and the central support platform (22).

9. The semiconductor precision component surface quality inspection device according to claim 8, characterized in that: Multiple narrow-top support rings (41) are provided, and the multiple narrow-top support rings (41) are arranged concentrically. A connecting strip (434) is provided between two adjacent narrow-top support rings (41). A vent hole (4341) is provided in the connecting strip (434). The vent hole (4341) is used to connect the annular cavity (432) in two adjacent narrow-top support rings (41). The air outlets (433) on the multiple narrow-top support rings (41) are arranged at intervals along the circumference. They are used for the central support mechanism (4) to blow the central area of ​​the back of the test piece (100) while assisting in supporting the central part of the test piece (100).

10. The semiconductor precision component surface quality inspection device according to claim 9, characterized in that: The detection mechanism (3) further includes a linear drive component one (31) and a linear drive component two (32). The linear drive component two (32) is located at the output end of the linear drive component one (31), and the laser detection head (33) is located at the output end of the linear drive component two (32). The linear drive component one (31) and the linear drive component two (32) are used to drive the laser detection head (33) to move and detect the workpiece (100) to be tested.

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