A circuit board initial inspection and reinspection integrated device

Abstract

The application discloses a circuit board primary inspection and reinspection integrated device, and relates to the technical field of circuit board inspection devices, comprising: a rack, wherein a loading table, a primary inspection camera mechanism, a reinspection camera mechanism and a first driving mechanism are arranged on the rack; the primary inspection camera is used to collect the image of the circuit board, and then the image processing algorithm is compared with the preset standard image to determine whether the circuit board has defects; then, the reinspection camera is used to collect the image again, manual inspection is performed, and whether the circuit board has defects is determined, so that the primary inspection and reinspection of the material are completed at one time, and the reinspection is not needed to be performed separately; therefore, the process of material transfer is saved, the reinspection efficiency is improved, and the probability of collision and damage of the material caused by the transportation is reduced.

Description

Technical Field

[0001] This invention relates to the field of circuit board testing equipment technology, specifically to an integrated equipment for initial and re-inspection of circuit boards. Background Technology

[0002] Printed Circuit Boards (PCBs), often referred to as the "mother of electronic products," are the core foundational components that carry electronic components and enable electrical interconnection. Their technological development has essentially been a continuous pursuit of higher integration, smaller size, and higher performance, a process that has also given rise to a series of current key technological challenges.

[0003] Early circuit board manufacturing primarily employed a subtractive process, where excess copper foil was etched away from a copper-clad substrate to form circuits. While this method was mature, it suffered from inherent drawbacks such as complex processes, limited circuit control precision, and high cost. As smartphones, wearable devices, and other end-products have evolved towards thinner, lighter, and higher-performance designs, circuit boards are required to have higher wiring density and more intricate lines. Therefore, rigorous quality control is essential in the circuit board manufacturing process. Currently, various inspection technologies exist for circuit boards, including manual visual inspection, automated optical inspection (AOI), and automated X-ray inspection (AXI).

[0004] Automated Optical Inspection (AOI) technology uses an optical imaging system to acquire images of circuit boards, and then uses image processing algorithms to compare and analyze these images with preset standard images to determine whether the circuit boards have defects. AOI technology overcomes some of the shortcomings of manual visual inspection to a certain extent, possessing high inspection accuracy and efficiency, and can detect various external and some hidden defects. However, AOI equipment also has limitations in practical applications. For example, for some complex multilayer circuit boards, since the inner layers are covered by the outer layers, it is sometimes difficult to fully and accurately obtain the true condition of the inner layers using only optical imaging. Moreover, during the inspection process, misjudgments or omissions may occur due to factors such as lighting conditions, image acquisition angle, and algorithm adaptability, requiring further verification to ensure the accuracy of the inspection results. Given the limitations of the above-mentioned inspection technology, in the actual circuit board production process, it is often necessary to re-inspect circuit boards after the initial inspection to further improve the accuracy of the inspection results and reduce the risk of defective products being released.

[0005] The re-inspection of circuit boards is generally carried out by re-inspection equipment, which requires the materials after the initial inspection to be transferred to the re-inspection equipment, resulting in low efficiency. When the materials are large, the transfer is inconvenient, and there is a risk of the materials being bumped and dropped during the transfer process.

[0006] In view of this, there is an urgent need for a device that integrates initial and re-inspection of circuit boards. Summary of the Invention

[0007] To address the problems existing in the prior art, the present invention solves this problem using the following technical structure.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: A circuit board initial inspection and re-inspection integrated equipment includes: a frame, on which a platform, an initial inspection camera mechanism, a re-inspection camera mechanism and a first drive mechanism are arranged; The platform is slidably mounted on the frame, and the platform is provided with a plurality of vacuum adsorption holes; The first inspection camera mechanism includes a first inspection bracket and a first inspection camera. The first inspection bracket is mounted on the frame, and the first inspection camera is mounted on the first inspection bracket. The re-inspection camera mechanism includes a re-inspection bracket and a re-inspection camera. The re-inspection bracket is mounted on the frame, and the re-inspection camera is mounted on the re-inspection bracket. The first driving mechanism is used to drive the platform past the first inspection camera and the second inspection camera.

[0009] The frame is provided with a first linear slide rail, and the platform is slidably mounted on the first linear slide rail. The first linear slide rail passes under the first inspection bracket and the second inspection bracket.

[0010] The first inspection camera mechanism further includes a first linear module and a first adjustment component. The first linear module is horizontally disposed on the first inspection bracket. The driving direction of the first linear module is perpendicular to the extension direction of the first linear slide rail. The first inspection camera is disposed on the first linear module. The first adjustment component is used to adjust the position and image acquisition angle of the first inspection camera.

[0011] The first adjustment component includes a first inspection carrier, a first inspection slide, and a first drive component. The first inspection carrier is disposed on the first linear module. The first inspection slide is provided with a second linear slide rail, which extends vertically. The first inspection slide is slidably disposed on the second linear slide rail. The first drive component is used to drive the first inspection slide to move on the second linear slide rail. The first inspection camera is mounted on the first inspection slide.

[0012] The first adjustment assembly also includes a first inspection mounting bracket, on which two mounting plates are provided. The first inspection mounting bracket and the two mounting plates are rotatably connected via a rotating shaft. The first inspection camera is mounted on the first inspection mounting bracket. Both mounting plates are rotatably connected to adjusting screws. The axial direction of the adjusting screws is consistent with the extension direction of the first linear slide rail. Limiting sleeves are provided on both sides of the first inspection mounting bracket. The limiting sleeves are provided with waist-shaped holes. The length direction of the waist-shaped holes is vertical. Nuts are provided in the waist-shaped holes. The adjusting screws pass through the limiting sleeves and the nuts and are threadedly connected to the nuts.

[0013] It also includes a lighting assembly, which includes a first support frame, a first screw, a second support frame, a second screw, a light source, and a third support frame. The first support frame is disposed on the first inspection carrier, the second support frame is slidably disposed on the first support frame, the third support frame is slidably disposed on the second support frame, the light source is disposed on the third support frame, and the light source is disposed below the first inspection camera. The first screw is rotatably mounted on the first support frame, passes through the second support frame, and is threadedly connected to the second support frame. The axial direction of the first screw is consistent with the extension direction of the first linear slide rail. The second screw is rotatably mounted on the second support frame, passes through the third support frame, and is threadedly connected to the third support frame. The axial direction of the second screw is vertical.

[0014] The re-inspection camera mechanism further includes a second linear module and a second adjustment component. The second linear module is horizontally disposed on the re-inspection bracket. The driving direction of the second linear module is perpendicular to the extension direction of the first linear slide rail. The re-inspection camera is disposed on the second linear module. The second adjustment component is used to adjust the position of the re-inspection camera.

[0015] The second adjustment component includes a re-inspection carrier and a re-inspection slide. The re-inspection carrier is disposed on the second linear module. A third linear slide rail is disposed on the re-inspection carrier and extends in a vertical direction. The re-inspection slide is disposed on the third linear slide rail and a locking bolt is rotatably disposed on the re-inspection slide. One end of the locking bolt faces the third linear slide rail. The re-inspection camera is mounted on the re-inspection slide.

[0016] The re-inspection camera mechanism also includes an encoder and a laser positioning light, both of which are mounted on the re-inspection camera.

[0017] The re-inspection bracket is equipped with an air knife assembly and a dust collection assembly, which are arranged side by side above the first linear slide rail.

[0018] The following beneficial effects can be achieved by using the structure described above in this invention: In use, both the lenses of the first inspection camera and the re-inspection camera are pointed towards the worktable of the lower frame. During inspection, the material is placed on the platform, and the platform is moved by the first drive mechanism, so that the material passes under the first inspection camera and the re-inspection camera. The first inspection camera captures an image of the circuit board, and then the image processing algorithm is used to compare and analyze it with a preset standard image to determine whether there are defects in the circuit board. Then, the re-inspection camera captures an image again to re-inspect the material after the first inspection, thus completing the first inspection and re-inspection of the material in one go, improving the accuracy of defect detection. Moreover, there is no need to perform a separate re-inspection, which not only saves a material transfer process, but also improves the efficiency of re-inspection, and avoids the occurrence of bumps and damage caused by material handling. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this application; Figure 2 This is a schematic diagram of the structure of part of the first inspection camera mechanism in this application; Figure 3 This is a structural schematic diagram of the first inspection carrier and the first inspection slide in this application; Figure 4 for Figure 2 Enlarged structural diagram at point A; Figure 5 This is a schematic diagram of the re-inspection camera mechanism in this application; Figure 6 This is a schematic diagram of the structure of part of the re-inspection camera mechanism in this application; Figure 7 This is a schematic diagram of the structure of the air knife assembly and the dust collection assembly in this application.

[0020] In the diagram: 100, frame; 110, first linear slide rail; 200, platform; 300, first inspection camera mechanism; 310, first inspection bracket; 320, first inspection camera; 330, first linear module; 340, first inspection carrier; 341, second linear slide rail; 350, first inspection slide; 351, mounting plate; 360, first inspection mounting bracket; 370, adjusting screw; 380, limit sleeve; 381, oblong hole; 390, nut; 400, re-inspection camera mechanism; 410. 420. Re-inspection bracket; 430. Re-inspection camera; 440. Second linear module; 441. Re-inspection slide; 442. Locking bolt; 450. Encoder; 460. Laser positioning light; 470. Re-inspection carrier; 471. Third linear slide rail; 500. Lighting assembly; 510. First support frame; 520. First screw; 530. Second support frame; 540. Second screw; 550. Light source; 560. Third support frame; 600. Air knife assembly; 700. Dust collection assembly. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0022] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification, claims and accompanying drawings of this invention are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product or device.

[0023] The following is in conjunction with the appendix Figures 1-5 This application will be described in further detail.

[0024] refer to Figures 1-3 The illustrated integrated circuit board initial and re-inspection equipment includes: a frame 100, which serves as the supporting foundation for the entire equipment and adopts a rigid welded frame structure to ensure stability during operation. The frame 100 is equipped with a platform 200, an initial inspection camera mechanism 300, a re-inspection camera mechanism 400, and a first drive mechanism (not shown in the figure). In this embodiment, the first drive mechanism is preferably a servo motor-driven screw transmission assembly, but a linear motor or synchronous belt transmission assembly can also be used. It provides precise driving force for the movement of the platform 200 along the first linear slide rail 110. The upper surface of the stage 200 is provided with several vacuum adsorption holes (not shown in the figure). These vacuum adsorption holes are connected to an external vacuum generator (such as a vacuum pump) through the internal air passage of the stage 200. When the circuit board to be tested is placed on the stage 200, the vacuum adsorption holes generate negative pressure to tightly adsorb the circuit board onto the surface of the stage 200, thereby effectively preventing the circuit board from shifting during high-speed movement or acceleration and deceleration of the stage 200, ensuring the consistency and repeatability of the test position. The size of the stage 200 can be adapted to the largest size of the circuit board to be tested. In this embodiment, the bearing area of ​​the stage 200 is configured to accommodate circuit boards of various sizes. The first inspection camera mechanism 300 includes a first inspection bracket 310 and a first inspection camera 320. The first inspection bracket 310 is mounted on the frame 100, and the first inspection camera 320 is mounted on the first inspection bracket 310. The re-inspection camera mechanism 400 includes a re-inspection bracket 410 and a re-inspection camera 420. The re-inspection bracket 410 is mounted on the frame 100, and the re-inspection camera 420 is mounted on the re-inspection bracket 410. The first drive mechanism is used to drive the stage 200 through the first inspection camera 320 and the second inspection camera 420.

[0025] Based on the above structure, during use, the lenses of the first inspection camera 320 and the re-inspection camera 420 are both directed towards the worktable surface of the lower frame 100. During inspection, the material is placed on the platform 200, and the platform 200 is driven to move by the first drive mechanism, so that the material passes under the first inspection camera 320 and the re-inspection camera 420. The first inspection camera 320 captures images of the circuit board, and then the image processing algorithm is used to compare and analyze them with the preset standard images to determine whether there are defects in the circuit board. Then, the re-inspection camera 420 captures images again to re-inspect the material after the first inspection, thus completing the first inspection and re-inspection of the material in one go, improving the accuracy of defect detection, and eliminating the need for separate re-inspection. This not only saves a material transfer process and improves the efficiency of re-inspection, but also avoids the occurrence of bumps and damage caused by material handling.

[0026] like Figure 1 As shown, a first linear slide rail 110 is provided on the frame 100, and the platform 200 is slidably disposed on the first linear slide rail 110. The first linear slide rail 110 passes under the first inspection bracket 310 and the re-inspection bracket 410. In this embodiment, two parallel first linear slide rails 110 are preferably provided. The two first linear slide rails 110 support the platform 200 from both sides, which can effectively distribute the weight of the platform 200 and the material on it, ensuring the stability of the platform 200 during high-speed movement and avoiding the impact of shaking on the imaging quality. The first linear slide rail 110 extends in the horizontal direction, and its extension path passes directly under the first inspection bracket 310 and the re-inspection bracket 410 in sequence, so as to ensure that the material on the platform 200 can enter the imaging field of view of the first inspection camera 320 and the re-inspection camera 420 in one linear movement.

[0027] like Figure 2 and Figure 3As shown, the first inspection camera mechanism 300 also includes a first linear module 330 and a first adjustment component. The first linear module 330 is horizontally mounted on the first inspection bracket 310. In this embodiment, the first linear module 330 preferably adopts a ball screw type linear module, which has the characteristics of high positioning accuracy and good repeatability. The driving direction of the first linear module 330 is perpendicular to the extension direction of the first linear slide rail 110. The first adjustment component is used to adjust the image acquisition direction of the first inspection camera 320. The first inspection camera 320 is mounted on the first linear module 330. Driven by the first linear module 330, the first inspection camera 320 can adjust its position in a horizontal direction perpendicular to the material's forward direction. The significance of this degree of freedom is that when the platform 200 transports the material to the first inspection station, if the area to be inspected on the material is offset in the width direction, the first linear module 330 can drive the first inspection camera 320 to follow the offset, ensuring that the field of view of the first inspection camera 320 always covers the entire effective area of ​​the material. Meanwhile, this horizontal adjustment function also provides the first inspection camera 320 with the ability to scan circuit boards of different widths.

[0028] The first adjustment component includes a first inspection carrier 340, a first inspection slide 350, and a first drive component (the first drive component can be an electric push rod driven by a micro servo motor to achieve automated height adjustment). The first inspection carrier 340 is mounted on the first linear module 330. The first inspection slide 350 is provided with a second linear slide rail 341, which extends vertically. The first inspection slide 350 is slidably mounted on the second linear slide rail 341. The first drive component is used to drive the first inspection slide 350 to move on the second linear slide rail 341. The first inspection camera 320 is mounted on the first inspection slide 350. The height of the first inspection camera 320 can be flexibly adjusted according to the thickness, surface characteristics, and required resolution of different materials. For example, when inspecting a circuit board with high-protruding components on the surface, the first inspection camera 320 can be appropriately raised to avoid interference, while the focal length can be adjusted to ensure clear imaging.

[0029] The first adjustment component also includes a first inspection mounting bracket 360. Two mounting plates 351 are mounted on the first inspection slide block 350 (the two mounting plates 351 are arranged sequentially along the driving direction of the first linear module 330). The first inspection mounting bracket 360 and the two mounting plates 351 are rotatably connected via a rotating shaft (the axis of the rotating shaft is consistent with the driving direction of the first linear module). The first inspection camera 320 is mounted on the first inspection mounting bracket 360. Adjusting screws 370 are rotatably connected to each of the two mounting plates 351. The axis of the adjusting screws 370 is consistent with the extension direction of the first linear slide rail 110. The adjusting screws 370 can be positioned above or below the rotating shaft. Limit sleeves 380 are provided on both sides of the first inspection mounting bracket 360. The sleeve 380 is provided with a waist-shaped hole 381, the length of which is vertical. A nut 390 is provided inside the waist-shaped hole 381 (the waist-shaped hole 381 allows the nut 390 to move vertically within it, while the nut 390 and the limiting sleeve 380 do not move relative to each other in the axial direction of the adjusting screw 370). The adjusting screw 370 passes through the limiting sleeve 380 and the nut 390 and is threadedly connected to the nut 390. Thus, when the operator turns the adjusting screw 370, the nut 390 is axially limited and moves along the axial direction of the adjusting screw 370, thereby causing the corresponding sides of the limiting sleeve 380 and the first inspection mounting bracket 360 to move synchronously. The first inspection mounting bracket 360 is independently controlled by two adjusting screws 370 on each side. When the adjusting screws 370 on both sides are screwed in to different depths, the first inspection mounting bracket 360 will deflect around its axis, thereby changing the optical axis direction of the first inspection camera 320 fixed on it. For example, when it is necessary to tilt the lens of the first inspection camera 320 towards the material's inlet direction to capture reflective information at a specific angle, the adjusting screw 370 on the inlet side can be screwed in deeper, while the adjusting screw 370 on the other side can be screwed out appropriately. The oblong hole 381 allows the nut 390 to slide adaptively in the vertical direction during the adjustment process, avoiding motion interference caused by the swing of the first inspection mounting bracket 360. Through this structure, the first inspection camera 320 can achieve a wide range of high-precision image acquisition angle adjustment to adapt to the different requirements of light incident angle for different surface textures, different colored solder resist layers, and different defect types.

[0030] like Figure 2 and Figure 4As shown, this embodiment also includes a lighting assembly 500, which includes a first support frame 510, a first screw 520, a second support frame 530, a second screw 540, a light source 550, and a third support frame 560. The first support frame 510 is mounted on the first inspection carrier 340, the second support frame 530 is slidably mounted on the first support frame 510, the third support frame 560 is slidably mounted on the second support frame 530, and the light source 550 is mounted on the third support frame 560. The light source 550 is positioned below the first inspection camera 320. The light source 550 illuminates the material inspection surface downwards, enabling the first inspection camera 320 to capture clearer material images and improve the accuracy of defect detection. The first screw 520 is rotatably mounted on the first support frame 510 and passes through the second support frame 540. The first screw 520 is threaded onto the support frame 530 and connected to the second support frame 530. The axial direction of the first screw 520 is consistent with the extension direction of the first linear slide rail 110. Thus, by screwing the first screw 520, the second support frame 530 slides along the axial direction of the first screw 520 on the first support frame 510. The second screw 540 is rotatably mounted on the second support frame 530 and passes through the third support frame 560, and is threadedly connected to the third support frame 560. The axial direction of the second screw 540 is vertical. By screwing the second screw 540, the third support frame 560 slides along the axial direction of the second screw 540 on the second support frame 530. Furthermore, by screwing the first screw 520 and the second screw 540, the horizontal position and height of the light source 550 can be adjusted, thereby ensuring a better lighting effect.

[0031] Through the aforementioned twin-screw adjustment mechanism, the light source 550 can achieve two independent degrees of translational freedom in the horizontal and vertical planes. In practical use, operators can flexibly adjust the position and height of the light source 550 according to the surface reflectivity, color, and type of defect to be highlighted of the material to obtain the best bright or dark field lighting effect. For example, for circuit boards with high surface gloss, the light source 550 can be appropriately raised and offset to the side to avoid specular reflection causing image overexposure; for circuit boards with rough surfaces or dark colors, the light source 550 can be lowered and centered to enhance the light intensity.

[0032] like Figure 5 and Figure 6As shown, the re-inspection camera mechanism 400 also includes a second linear module 430 and a second adjustment component. The second linear module 430 is horizontally mounted on the re-inspection bracket 410, and the driving direction of the second linear module 430 is perpendicular to the extension direction of the first linear slide rail 110. The re-inspection camera 420 is mounted on the second linear module 430. The second adjustment component is used to adjust the position of the re-inspection camera 420. In this embodiment, the second linear module 430 preferably adopts the same ball screw type linear module as the first linear module 330 to achieve unified spare parts management and similar accuracy levels. The re-inspection camera 420 is mounted on the second linear module 430. Driven by the second linear module 430, the re-inspection camera 420 can be adjusted in a horizontal direction perpendicular to the material's forward direction to adapt to the re-inspection requirements of materials with different width specifications.

[0033] The second adjustment component includes a re-inspection carrier 470 and a re-inspection slide 440. The re-inspection carrier 470 is mounted on the second linear module 430. A third linear slide rail 471 is mounted on the re-inspection carrier 470 and extends vertically. The re-inspection slide 440 is mounted on the third linear slide rail 471 and has a locking bolt 441 rotatably mounted on it, with one end of the locking bolt 441 facing the third linear slide rail 471. A re-inspection camera 420 is also included. The camera 420 is placed on the re-inspection slide 440, which moves along the third linear slide rail 471 to adjust the height of the re-inspection camera 420 to meet different inspection needs. When the operator pushes the re-inspection slide 440 vertically to the desired height, they tighten the locking bolt 441, causing its end to press against the surface of the third linear slide rail 471. Friction is used to lock the position of the re-inspection slide 440, thus fixing the re-inspection camera 420 at that height. Compared to the precision lead screw adjustment method in the initial inspection camera mechanism, the height adjustment of the re-inspection camera mechanism uses a manual sliding and locking structure. This fully considers the operational characteristics of the re-inspection stage—manual observation or intervention is usually required during re-inspection. Manual adjustment is more intuitive and faster, and the locking bolt structure is simple and reliable, meeting the stable positioning requirements of the re-inspection camera in terms of height.

[0034] Among them, such as Figure 6As shown, the re-inspection camera mechanism 400 also includes an encoder 450 and a laser positioning light 460. Both the encoder 450 and the laser positioning light 460 are fixedly mounted on the housing of the re-inspection camera 420 and move with it. The encoder 450 identifies and records the material number currently passing through the re-inspection station. Operators can associate the inspection results with this number for storage, facilitating subsequent quality traceability and statistical analysis. The laser positioning light 460 projects a visible light positioning cursor onto the material surface on the platform 200. When the defect area marked in the initial inspection stage moves with the platform 200 to below the re-inspection camera 420, operators can use the laser positioning light 460 to quickly locate the defect position for accurate secondary interpretation and marking.

[0035] like Figure 5 and Figure 7 As shown, the re-inspection bracket 410 is equipped with an air knife assembly 600 and a dust collection assembly 700. The air knife assembly 600 and the dust collection assembly 700 are arranged side by side above the first linear slide rail 110 and are arranged sequentially along the material forward direction. In this embodiment, the air knife assembly 600 is located on the upstream side and the dust collection assembly 700 is located on the downstream side; in another embodiment, the arrangement order of the two can also be interchanged.

[0036] The air knife assembly 600 includes a high-pressure air source interface, an airflow distribution chamber, and a narrow air outlet. The length of the air outlet is perpendicular to the extension direction of the first linear slide rail 110, that is, it spans the width direction of the entire platform 200. When the platform 200 passes under the air knife assembly 600, high-pressure gas is ejected at high speed from the air outlet, forming a uniform air curtain that thoroughly blows away the top surface of the material, removing dust, fiber debris, and other small particles attached to the surface.

[0037] The vacuuming assembly 700 includes a negative pressure inlet, a dust collection chamber, and an air intake, which also spans the width of the platform 200. The vacuuming assembly 700 is connected to an external negative pressure generating device (such as an industrial vacuum cleaner), creating a negative pressure area at the air intake. As the platform 200 continues to move forward and passes under the vacuuming assembly 700, particles blown up by the air knife assembly 600, along with the surrounding air, are sucked into the dust collection chamber, filtered, and then discharged into the atmosphere.

[0038] The air knife assembly 600 and the dust extraction assembly 700 work together to achieve online cleaning of the material surface. This design allows materials to be cleaned in a timely manner before entering the first inspection station or after completing the first inspection, avoiding false inspections and missed inspections caused by foreign objects obstructing the circuit or creating false reflections. It also improves the cleanliness level of the product before it leaves the warehouse. In this embodiment, the air knife assembly 600 and the dust extraction assembly 700 are configured to be in a constantly operating state, that is, to maintain blowing and suction regardless of whether the platform 200 passes by. In another embodiment, a position sensor can also be added, which will only activate when the platform 200 is detected to be approaching, in order to save energy.

[0039] In the above embodiments, the lighting component 500 is only configured in the first inspection camera mechanism 300. However, in another embodiment, the re-inspection camera mechanism 400 may also be equipped with an independent lighting component, whose structure and adjustment method are the same as or different from the lighting component 500 at the first inspection end, so as to provide an independent and controllable lighting environment in the re-inspection stage and meet the needs of reviewing specific defects under different lighting conditions.

[0040] In another embodiment, both the first-inspection camera 320 and the second-inspection camera 420 can be either line scan cameras or area scan cameras. Line scan cameras are suitable for continuous scanning mode, have a fast imaging speed, and are suitable for large-format circuit boards; area scan cameras are suitable for fixed-point shooting mode, and are suitable for fine inspection of small-area, high-resolution areas. The specific selection can be flexibly determined according to the inspection speed and accuracy requirements of the actual production line.

[0041] In summary, compared with the traditional model of separating initial inspection and re-inspection and requiring material transfer in the existing technology, the integrated initial and re-inspection equipment for circuit boards provided by the present invention has the following significant advantages: This invention integrates a first-inspection camera mechanism and a second-inspection camera mechanism on the same frame, and uses a single platform and a first drive mechanism to drive materials sequentially through two inspection stations, realizing a streamlined operation of "one-time loading and continuous inspection" for circuit boards. This design fundamentally eliminates the cumbersome intermediate steps of material unloading, transfer, second-inspection loading, and repositioning after the first inspection, merging two originally separate independent processes into a single continuous process. This not only significantly shortens the overall inspection cycle time but also reduces production management costs and significantly improves the flow rate of the production line.

[0042] In traditional multi-station inspection processes, the repeated handling and clamping of materials between the initial inspection and re-inspection equipment is a major cause of physical damage such as scratches, solder pad detachment, and substrate cracks in delicate circuits. The integrated design of this invention allows materials to directly enter the re-inspection area after the initial inspection without leaving the platform, completely avoiding repeated material transfers between production lines. This "zero-transfer" design fundamentally eliminates the risks of bumps, drops, and secondary stress damage caused by manual or mechanical handling, which is of great significance for ensuring the yield of high-value, high-density circuit boards.

[0043] This invention organically integrates automated optical inspection (initial inspection) with manual / assisted re-inspection into a single device. First, a high-speed, automated initial screening is performed using an initial inspection camera. Then, a re-inspection camera performs targeted, high-precision image acquisition of suspicious areas, providing quality inspectors or advanced algorithms with accurate verification data. This hierarchical inspection strategy of "full-coverage initial screening + precise re-inspection" effectively avoids "false positives" and "false negatives" caused by issues such as lighting and algorithm adaptability in single AOI devices. It also provides supplementary confirmation for "blind spots" in the initial inspection, such as complex multilayer boards, thereby significantly improving the comprehensiveness of defect detection and the authority of the judgment results while ensuring inspection efficiency.

[0044] This invention revolves around the first-inspection and re-inspection cameras, designing a flexible, multi-degree-of-freedom adjustment structure that can flexibly adapt to the requirements of circuit boards of different specifications and inspection accuracies. Specifically, it is reflected in: First-line inspection camera adjustment: Horizontal displacement is achieved through the first linear module, and height adjustment is achieved through the first-line inspection slide and the second linear slide rail. Furthermore, the unique adjustment screw, limit sleeve, and waist-shaped hole linkage mechanism can precisely adjust the pitch and image acquisition angle of the first-line inspection camera. This allows the equipment to optimize the optical path and acquire the best initial image based on the surface reflectivity of the material or the observation angle of specific defects.

[0045] Re-inspection camera adjustment: The re-inspection camera can be quickly and steadily adjusted in both horizontal and vertical directions using the second linear module and the re-inspection slide structure with locking bolts, ensuring accurate positioning of the re-inspection field of view.

[0046] Fine adjustment of the lighting components: The matching light source system can be independently adjusted in horizontal position and vertical height through two sets of screws (first screw and second screw), which can flexibly adjust the lighting angle and intensity for different colored solder mask layers or different substrate materials, ensuring imaging under optimal lighting conditions and providing a solid foundation for the accurate operation of the detection algorithm.

[0047] The equipment innovatively integrates an air knife assembly and a dust extraction assembly onto the re-inspection bracket, positioning it above the movement path of the platform. This design allows for high-pressure blowing and negative-pressure suction of the circuit board surface during the inspection process, effectively removing tiny particles, dust, or fibrous impurities that may have adhered to the board surface during handling or inspection. This not only ensures the cleanliness of the inspected board surface and avoids false inspections due to foreign object interference, but also provides the equipment with additional surface cleaning capabilities, combining inspection and cleaning into one, further optimizing station efficiency.

[0048] The re-inspection camera mechanism is equipped with an encoder and a laser positioning light. The encoder can be used to identify the material number, realize the automatic recording of defect data and product traceability, and facilitate subsequent quality statistical analysis. The laser positioning light can project a positioning cursor onto the board during re-inspection, assisting operators or algorithms to quickly and accurately re-judge and mark the defect location, improving human-machine interaction efficiency and enhancing the intelligence level of the equipment.

[0049] The above are merely preferred embodiments of this application, and the present invention is not limited to the above embodiments. It is understood that other improvements and variations that are directly derived or conceived by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included within the protection scope of the present invention.

Claims

1. A circuit board initial inspection and re-inspection integrated device, characterized in that, include: A frame (100) is provided with a platform (200), a first inspection camera mechanism (300), a second inspection camera mechanism (400) and a first drive mechanism; The stage (200) is slidably disposed on the frame (100), and the stage (200) is provided with a plurality of vacuum adsorption holes; The first inspection camera mechanism (300) includes a first inspection bracket (310) and a first inspection camera (320). The first inspection bracket (310) is mounted on the frame (100), and the first inspection camera (320) is mounted on the first inspection bracket (310). The re-inspection camera mechanism (400) includes a re-inspection bracket (410) and a re-inspection camera (420). The re-inspection bracket (410) is mounted on the frame (100), and the re-inspection camera (420) is mounted on the re-inspection bracket (410). The first driving mechanism is used to drive the stage (200) past the first inspection camera (320) and the second inspection camera (420).

2. The integrated circuit board initial inspection and re-inspection equipment according to claim 1, characterized in that: The frame (100) is provided with a first linear slide rail (110), and the platform (200) is slidably disposed on the first linear slide rail (110). The first linear slide rail (110) passes under the first inspection bracket (310) and the second inspection bracket (410).

3. The integrated circuit board initial inspection and re-inspection equipment according to claim 2, characterized in that: The first inspection camera mechanism (300) further includes a first linear module (330) and a first adjustment component. The first linear module (330) is horizontally disposed on the first inspection bracket (310). The driving direction of the first linear module (330) is perpendicular to the extension direction of the first linear slide rail (110). The first inspection camera (320) is disposed on the first linear module (330). The first adjustment component is used to adjust the position and image acquisition angle of the first inspection camera (320).

4. The integrated circuit board initial inspection and re-inspection equipment according to claim 3, characterized in that: The first adjustment component includes a first inspection carrier (340), a first inspection slide (350), and a first drive component. The first inspection carrier (340) is disposed on the first linear module (330). The first inspection slide (350) is provided with a second linear slide rail (341), which extends vertically. The first inspection slide (350) is slidably disposed on the second linear slide rail (341). The first drive component is used to drive the first inspection slide (350) to move on the second linear slide rail (341). The first inspection camera (320) is mounted on the first inspection slide (350).

5. The integrated circuit board initial inspection and re-inspection equipment according to claim 4, characterized in that: The first adjustment component also includes a first inspection mounting bracket (360), on which two mounting plates (351) are provided. The first inspection mounting bracket (360) and the two mounting plates (351) are rotatably connected by a rotating shaft. The first inspection camera (320) is mounted on the first inspection mounting bracket (360). Both mounting plates (351) are rotatably connected with adjusting screws (370). The axial direction of the adjusting screws (370) is consistent with the extension direction of the first linear slide rail (110). Limiting sleeves (380) are provided on both sides of the first inspection mounting bracket (360). The limiting sleeves (380) are provided with waist-shaped holes (381). The length direction of the waist-shaped holes (381) is vertical. Nuts (390) are provided in the waist-shaped holes (381). The adjusting screws (370) pass through the limiting sleeves (380) and the nuts (390) and are threadedly connected to the nuts (390).

6. The integrated circuit board initial inspection and re-inspection equipment according to claim 5, characterized in that: It also includes a lighting assembly (500), which includes a first support frame (510), a first screw (520), a second support frame (530), a second screw (540), a light source (550), and a third support frame (560). The first support frame (510) is disposed on the first inspection carrier (340), the second support frame (530) is slidably disposed on the first support frame (510), the third support frame (560) is slidably disposed on the second support frame (530), the light source (550) is disposed on the third support frame (560), and the light source (550) is disposed below the first inspection camera (320). The first screw (520) is rotatably mounted on the first support frame (510), the first screw (520) passes through the second support frame (530) and is threadedly connected to the second support frame (530), and the axial direction of the first screw (520) is consistent with the extension direction of the first linear slide rail (110); The second screw (540) is rotatably mounted on the second support frame (530), the second screw (540) passes through the third support frame (560) and is threadedly connected to the third support frame (560), and the axial direction of the second screw (540) is vertical.

7. A circuit board initial inspection and re-inspection integrated device according to any one of claims 2-6, characterized in that: The re-inspection camera mechanism (400) further includes a second linear module (430) and a second adjustment component. The second linear module (430) is horizontally disposed on the re-inspection bracket (410). The driving direction of the second linear module (430) is perpendicular to the extension direction of the first linear slide rail (110). The re-inspection camera (420) is disposed on the second linear module (430). The second adjustment component is used to adjust the position of the re-inspection camera (420).

8. The integrated circuit board initial inspection and re-inspection equipment according to claim 7, characterized in that: The second adjustment component includes a re-inspection carrier (470) and a re-inspection slide (440). The re-inspection carrier (470) is disposed on the second linear module (430). A third linear slide rail (471) is disposed on the re-inspection carrier (470). The third linear slide rail (471) extends in a vertical direction. The re-inspection slide (440) is disposed on the third linear slide rail (471). A locking bolt (441) is rotatably disposed on the re-inspection slide (440). One end of the locking bolt (441) faces the third linear slide rail (471). The re-inspection camera (420) is mounted on the re-inspection slide (440).

9. The integrated circuit board initial inspection and re-inspection equipment according to claim 8, characterized in that: The re-inspection camera mechanism (400) also includes an encoder (450) and a laser positioning light (460), both of which are mounted on the re-inspection camera (420).

10. The integrated circuit board initial inspection and re-inspection equipment according to claim 2, characterized in that: The re-inspection bracket (410) is provided with an air knife assembly (600) and a dust collection assembly (700), which are arranged side by side above the first linear slide rail (110).

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