Optical fiber electric field sensor anti-electromagnetic interference packaging fixing assembly
Patent Information
- Application Number
- CN202611068453.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-17
- Publication Date
- 2026-10-13
AI Technical Summary
[0005]本发明的目的是提供一种光纤电场传感器抗电磁干扰封装固定组件以解决光纤电场传感器在高频多方向振动场景下抗振能力弱、内部元件易受损、测量数据易失真的问题
本申请的光纤电场传感器抗电磁干扰封装固定组件,通过网格板、定位架、微型气囊和阻尼杆的配合设置,在封装壳上端承受水平多方向的振动时,与外部设备连接的阻尼杆能够第一时间吸收振动,通过杆体阻尼消耗能量,限制光纤电场传感器抗电磁干扰封装固定组件的横向位移幅度,增强水平方向抗振能力;同时部分振动沿阻尼杆传递至与阻尼杆相连的微型气囊,微型气囊内部填充有气体,基于气体的可压缩性实现多方向柔性缓冲,吸收水平方向高频振动和微小位移,同时通过柔性接触避免元件被刚性固定损伤;进一步的,网格板既能够为定位架和微型气囊提供安装支点,还能通过自身的微型形变分散所受的振动应力,有效规避局部受力过大引发的部件疲劳或损坏,在封装壳上端承受垂直方向的振动时,支撑筒和垂直缓冲组件则能够通过自身的缓冲与耗能机制,有效抵消垂直方向的振动冲击,减少振动对网格板及上方连接的元件的影响,从而保障整个光纤电场传感器抗电磁干扰封装固定组件在垂直振动环境下的结构稳定性,实现内部元件的正常工作,避免了原有高频振动的场景中,因难以形成有效抵御进而导致光信号传输损耗的不规则波动,测量数据失真,无法准确反映被测电场的真实强度与变化趋势的问题;更进一步的,本申请基于放置槽的设置为屏蔽壳提供精准安装定位空间,确保屏蔽壳与封装壳紧密贴合,放置槽内部的碳基导电涂层利用自身碳基材料的导电特性形成电磁屏蔽辅助层,与屏蔽壳配合形成双重电磁防护,反射或吸收外部电磁干扰信号,减少对屏蔽壳内部电场传感器的影响,大幅降低外部复杂电磁环境对屏蔽壳内部电场传感器的干扰,有效避免传感器测量信号出现漂移、失真等问题,显著提升其在高电磁环境下的工作稳定性与抗干扰能力,确保电场数据采集的精度与可靠性,同时借助封盖对封装壳进行密封形成密封空间,防止灰尘、水汽等环境因素侵入,避免其因环境侵蚀而发生性能衰减或损坏,确保传感器在长期使用中保持稳定的工作状态。
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Abstract
Description
Technical Field
[0001] This invention relates to the field of fiber optic sensor technology, and in particular to an anti-electromagnetic interference packaging and fixing assembly for a fiber optic electric field sensor. Background Technology
[0002] Fiber optic electric field sensors, with their significant advantages such as small size, simple manufacturing, and outstanding resistance to electromagnetic interference, are finding increasingly wider applications. In fields like civil engineering and power engineering, they have become powerful tools for detecting key parameters such as pressure and temperature. As power systems evolve towards high voltage and large capacity, and with the deep integration of 5G and IoT technologies, the requirements for accuracy, sensitivity, and anti-interference capabilities in electric field measurement are dramatically increasing. Against this backdrop, the technological advantages of fiber optic electric field sensors are fully demonstrated. Based on optical principles such as the Pockels effect, they can achieve non-contact measurement of the object being measured, fundamentally solving the contact problem of traditional sensors in high-voltage environments. Simultaneously, they possess inherent electromagnetic interference resistance, nanosecond-level response speed, and excellent insulation performance, perfectly adapting to the monitoring needs of extreme environments such as high voltage and strong electromagnetic fields. It is precisely because of these irreplaceable characteristics that fiber optic electric field sensors exhibit superior performance in the field of high-voltage electrical equipment monitoring, providing reliable technical support for the safe and stable operation of equipment.
[0003] The maturity of drone technology has provided a revolutionary solution for power system inspection. By equipping drones with fiber optic electric field sensors, drones can maintain a safe distance of several meters from insulator strings on high-voltage transmission lines for close-range patrols. This allows for real-time collection of data on the spatial electric field intensity, radial and axial electric field components, and other distribution patterns around the insulators. This enables precise capture of the electric field characteristics on and around the insulator surface. The principle is that when insulators deteriorate, the decline in insulation performance disrupts the original equilibrium of the electric field distribution, forming identifiable abnormal electric field signals. By continuously measuring and recording these abnormal characteristics, and combining them with a preset correlation model between the degree of deterioration and electric field characteristics, the deterioration state of the insulator can be deduced in reverse. Ultimately, this achieves efficient deterioration diagnosis in a non-contact, energized state. The combination of fiber optic electric field sensors and drones not only expands the technological boundaries of power inspection but also becomes a key support for ensuring the safe and stable operation of high-voltage transmission lines.
[0004] However, traditional fiber optic electric field sensors have weak vibration resistance. When used in high-frequency vibration scenarios, their vibration-resistant structures can only absorb part of the vibration, exhibiting significant directional limitations. They can mostly only buffer vibrations in a single direction, making it difficult to effectively resist complex multi-directional high-frequency vibrations in real-world scenarios. High-frequency vibrations can easily cause micro-bending, breakage, or detachment of the optical fiber inside the sensor, leading to irregular fluctuations in optical signal transmission loss. Simultaneously, vibrations can disrupt the relative positional stability of the electro-optic crystal and electrodes inside the sensor, weakening the conversion efficiency of the electric field and optical signal and introducing nonlinear errors. On the other hand, problems such as fiber micro-bending and polarization state disorder can cause irregular jitter in characteristic parameters such as the phase and intensity of the optical signal. When these jitters are superimposed on the electric field signal, they can lead to distorted measurement data, failing to accurately reflect the true intensity and changing trend of the measured electric field. Summary of the Invention
[0005] The purpose of this invention is to provide an anti-electromagnetic interference packaging and fixing component for fiber optic electric field sensors to solve the problems of weak vibration resistance, easy damage to internal components, and easy distortion of measurement data in high-frequency multi-directional vibration scenarios.
[0006] Based on this, the present invention provides an anti-electromagnetic interference packaging and fixing assembly for an optical fiber electric field sensor, including a packaging shell. Supports are detachably connected to both sides of the packaging shell. Multiple support cylinders are fixedly mounted on the top of each of the two supports. The multiple support cylinders on each support are sequentially arranged from front to back on the support. A vertical buffer assembly is detachably connected inside each support cylinder. A grid plate is detachably connected to the upper end of the vertical buffer assembly. Multiple positioning frames are fixedly connected to the outer surface of the grid plate. A micro airbag is fixedly connected to the side of the positioning frame facing the grid plate. The micro airbag is detachably connected to the grid plate. A damping rod is fixedly connected to the end of the positioning frame away from the micro airbag. A mounting plate is fixedly connected to the end of the damping rod away from the positioning frame.
[0007] In some embodiments of this application, a placement groove is provided inside the encapsulation shell, and a carbon-based conductive coating is provided on the inner wall of the placement groove. The placement groove is used to place an electric field sensor. The electric field sensor is covered with a shielding shell, which is snapped into the placement groove. The top of the encapsulation shell is provided with a cover for sealing the placement groove.
[0008] In some embodiments of this application, the vertical buffer assembly includes a positioning disk and a connecting plate. The positioning disk is detachably connected to the support cylinder. A return spring is fixedly connected to the top surface of the positioning disk. A magnetorheological damping rod is detachably connected to the top surface of the positioning disk. A fixed disk is fixedly connected to the other end of the return spring and the magnetorheological damping rod. A butterfly spring is provided on the top surface of the fixed disk. A transfer disk is detachably connected to the top surface of the butterfly spring. A threaded post is fixedly provided on the bottom surface of the transfer disk. The threaded post passes through the butterfly spring and is threadedly connected to the fixed disk. The top surface of the transfer disk is detachably connected to the lower end of the connecting plate. The upper end of the connecting plate is fixedly connected to the lower end of the mesh plate by bolts.
[0009] In some embodiments of this application, the shielding shell has multiple grooves on its left and right sides, and the inner wall of the placement groove is fixedly provided with protrusions that match the shape of the grooves. The number of protrusions is equal to the number of grooves and corresponds one-to-one with each groove.
[0010] In some embodiments of this application, the encapsulation shell is provided with two storage slots, which are respectively disposed on both sides of the placement slot and symmetrically arranged relative to the placement slot. Each of the two storage slots is provided with an insulating buffer pad, and the cover is also used to seal the two storage slots.
[0011] In some embodiments of this application, a wire outlet hole is provided on one side of the encapsulation shell, the optical fiber extends out of the encapsulation shell after passing through the wire outlet hole, and a plastic elastic clamp is provided in the wire outlet hole, the plastic elastic clamp being sleeved on the optical fiber.
[0012] In some embodiments of this application, the sealing cap is provided with a sealing film at the edge of the encapsulation shell, the bottom surface of the sealing cap is provided with a carbon-based conductive coating, and the top surface of the sealing cap is provided with an electromagnetic wave shielding coating.
[0013] In some embodiments of this application, a locking block is fixedly provided at the bottom of the placement slot of the encapsulation shell, and a plurality of silicone grease grooves are opened on the top of the locking block. Each silicone grease groove is coated with thermal conductive silicone grease, and the top of the locking block is engaged with the bottom of the shielding shell.
[0014] In some embodiments of this application, an optical fiber fixing assembly is detachably connected to one side of the encapsulation shell. The optical fiber fixing assembly includes a limiting frame and a connecting plate. A plurality of telescopic rods are rotatably connected to the outer surface of the limiting frame. The plurality of telescopic rods are arranged in a circular array around the limiting frame. The other end of each of the plurality of telescopic rods is detachably connected to the encapsulation shell. A pull rod is rotatably connected to the middle of each telescopic rod. The other end of the pull rod is rotatably connected to the connecting plate. The limiting frame and the connecting plate are sleeved on the optical fiber.
[0015] In some embodiments of this application, a positioning block is sleeved on the optical fiber, and the positioning block is engaged with the end of the limiting frame away from the connecting plate.
[0016] This invention provides an anti-electromagnetic interference packaging and fixing assembly for an optical fiber electric field sensor. Compared with the prior art, its advantages are as follows: The electromagnetic interference (EMI) resistant packaging and fixing assembly for the fiber optic electric field sensor disclosed in this application, through the coordinated arrangement of a grid plate, a positioning frame, a micro-airbag, and a damping rod, allows the damping rod, connected to external equipment, to absorb vibrations immediately when the upper part of the packaging shell is subjected to horizontal multi-directional vibrations. The rod's damping dissipates energy, limiting the lateral displacement of the EMI resistant packaging and fixing assembly and enhancing its horizontal vibration resistance. Simultaneously, some vibrations are transmitted along the damping rod to the micro-airbag connected to it. The micro-airbag, filled with gas, provides multi-directional flexible buffering based on the compressibility of the gas, absorbing horizontal vibrations. The fiber optic electric field sensor exhibits high-frequency vibration and minute displacement, while flexible contact prevents damage from rigid fixation. Furthermore, the grid plate provides mounting points for the positioning frame and miniature airbags, and its own minute deformation disperses vibration stress, effectively preventing component fatigue or damage caused by excessive localized stress. When the upper part of the encapsulation shell experiences vertical vibration, the support cylinder and vertical buffer assembly effectively counteract the vertical vibration impact through their buffering and energy dissipation mechanisms, reducing the impact of vibration on the grid plate and the components connected above, thus ensuring the electromagnetic interference resistance of the entire fiber optic electric field sensor encapsulation. The structural stability of the fixed component under vertical vibration environment ensures the normal operation of internal components. This avoids the irregular fluctuations that lead to optical signal transmission loss and measurement data distortion caused by the difficulty in forming effective resistance in the original high-frequency vibration scenario, which prevents the accurate reflection of the true strength and trend of the measured electric field. Furthermore, this application provides a precise installation and positioning space for the shielding shell based on the placement slot, ensuring a tight fit between the shielding shell and the encapsulation shell. The carbon-based conductive coating inside the placement slot utilizes the conductivity of its own carbon-based material to form an electromagnetic shielding auxiliary layer, which, together with the shielding shell, forms double electromagnetic protection, reflecting or absorbing external electromagnetic interference signals, reducing the impact on the electric field sensor inside the shielding shell, and significantly reducing the interference of the complex external electromagnetic environment on the electric field sensor inside the shielding shell. This effectively avoids problems such as drift and distortion of the sensor measurement signal, significantly improving its working stability and anti-interference ability in high electromagnetic environments, ensuring the accuracy and reliability of electric field data acquisition. At the same time, the sealing of the encapsulation shell by the cover forms a sealed space to prevent the intrusion of environmental factors such as dust and moisture, avoiding performance degradation or damage due to environmental corrosion, and ensuring that the sensor maintains a stable working state during long-term use. Attached Figure Description
[0017] Figure 1This is a schematic diagram of the structure of the electromagnetic interference-resistant packaging and fixing assembly of the fiber optic electric field sensor according to some embodiments of the present invention; Figure 2 This is a schematic diagram of the assembly of the electromagnetic interference-resistant packaging and fixing component of the fiber optic electric field sensor with the electric field sensor, the bracket, and the fiber optic fixing component according to some embodiments of the present invention. Figure 3 This is a schematic diagram of the assembly and forming of the packaging shell and bracket of the electromagnetic interference-resistant packaging and fixing component for the fiber optic electric field sensor according to some embodiments of the present invention. Figure 4 This is a schematic diagram of the structure of the electromagnetic interference-resistant encapsulation and fixing component electric field sensor according to some embodiments of the present invention. Figure 5 This is a schematic diagram of the structure of the electromagnetic interference-resistant packaging and fixing component of the fiber optic electric field sensor according to some embodiments of the present invention, showing the insulating buffer pad and the cover. Figure 6 This is a schematic diagram of the internal structure of the electromagnetic interference-resistant packaging and fixing assembly placement slot for fiber optic electric field sensors according to some embodiments of the present invention; Figure 7 This is a schematic diagram of the structure of the electromagnetic interference-resistant packaging and fixing assembly grid plate of the fiber optic electric field sensor according to some embodiments of the present invention; Figure 8 This is a schematic diagram of the vertical buffer assembly of the electromagnetic interference-resistant packaging and fixing component for fiber optic electric field sensors according to some embodiments of the present invention. Figure 9 This is a schematic diagram of the damping rod of the electromagnetic interference-resistant packaging and fixing component for an optical fiber electric field sensor according to some embodiments of the present invention. Figure 10 This is a schematic diagram of the structure of the optical fiber fixing component, which is an anti-electromagnetic interference packaging and fixing component for optical fiber electric field sensors according to some embodiments of the present invention.
[0018] In the diagram, 1. Encapsulation shell; 2. Electric field sensor; 3. Bracket; 4. Rubber pad; 5. Support cylinder; 6. Vertical buffer assembly; 601. Positioning plate; 602. Connecting plate; 603. Return spring; 604. Magnetorheological damping rod; 605. Fixed plate; 606. Disc spring; 607. Transfer plate; 608. Threaded post; 7. Mesh plate; 8. Positioning frame; 9. Miniature airbag; 10. Damping rod; 11. Mounting plate; 12. Placement 13. Slot; 14. Carbon-based conductive coating; 15. Shielding shell; 16. Cover; 17. Optical fiber; 18. Groove; 19. Protrusion; 20. Storage slot; 21. Insulating buffer pad; 22. Cable outlet hole; 23. Plastic elastic clamp; 24. Sealing film; 25. Optical fiber fixing assembly; 26. Limiting frame; 27. Connecting plate; 28. Telescopic rod; 29. Pull rod; 20. Positioning block; 21. Locking block; 22. Silicone grease groove. Detailed Implementation
[0019] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.
[0020] Please see Figures 1 to 10 This invention provides an anti-electromagnetic interference packaging and fixing assembly for an optical fiber electric field sensor 2. The assembly includes a packaging shell 1, with brackets 3 detachably connected to both sides of the shell 1. Rubber pads 4 are provided on the end faces of the shell 1 that contact the brackets 3. Multiple support cylinders 5 are sequentially arranged from left to right on the upper ends of both brackets 3. A vertical buffer assembly 6 is detachably installed inside each support cylinder 5. A grid plate 7 is detachably connected to the top of the vertical buffer assembly 6. Multiple positioning frames 8 are fixedly connected to the outer surface of the grid plate 7. Miniature airbags 9 are fixedly connected to the inner walls of the positioning frames 8. The outer surface of the miniature airbags 9 is detachably connected to the inner wall of the grid plate 7. A damping rod 10 is fixedly connected to the other end of each positioning frame 8, and a mounting plate 11 is fixedly connected to the other end of the damping rod 10. A placement groove 12 is provided inside the packaging shell 1. The inner wall of the placement groove 12 is coated with a carbon-based conductive coating 13. The placement groove 12 is used to house a shielding shell 14, in which the electric field sensor 2 is fixedly installed.
[0021] Based on the above structure, the positioning frame 8 can be used to install the micro airbag 9 and the damping rod 10. The rigid structure restricts the position of the two, thereby ensuring that the micro airbag 9 and the damping rod 10 can stably absorb vibration. It is worth noting that in the prior art, the micro airbag 9 or the damping rod 10 are generally used alone. When the micro airbag 9 is used alone, although it can absorb vibration by means of gas compression, it is prone to high-frequency rebound and excessive deformation, resulting in insufficient vibration reduction stability. When relying solely on the damping rod 10, although it can suppress rebound, it is difficult to quickly buffer instantaneous impact energy. The rigid constraint of the positioning frame 8 can ensure that the micro airbag 9 and the damping rod 10 form a synergistic vibration reduction. The micro airbag 9 uses the compressibility of gas to quickly absorb horizontal and inclined vibration impacts, while the damping rod 10 consumes vibration energy and slows down the vibration transmission speed through its own damping characteristics. The two complement each other and solve the shortcomings of a single vibration reduction structure, ensuring the stability and continuity of the vibration reduction effect. At the same time, the positioning frame 8 can also transfer part of the horizontal impact force borne by the damping rod 10 to the grid plate 7, which is absorbed by the deformation of the grid plate 7.
[0022] Furthermore, the bracket 3 is connected to the left and right sides of the encapsulation shell 1, serving as an auxiliary support for the support cylinder 5. Together with the encapsulation shell 1, it enhances the stability of the overall structure. In a vibration environment, it can disperse external forces and prevent the encapsulation shell 1 from being deformed due to excessive local stress. In the existing technology, some similar devices rely solely on the encapsulation shell 1 for load-bearing. Under the high-frequency vibration environment of the drone, it is prone to local deformation due to concentrated force, which in turn affects the installation accuracy and working stability of internal components. The addition of the bracket 3 can effectively disperse the impact force brought by external vibration and prevent the encapsulation shell 1 from being deformed due to excessive local stress. At the same time, the rubber pad 4 is located at the contact end face between the encapsulation shell 1 and the bracket 3. Utilizing the elasticity and damping characteristics of rubber, it reduces the rigid collision and friction between the two caused by vibration, while absorbing some low-frequency vibration energy and reducing the transmission of vibration to the interior of the encapsulation shell 1.
[0023] Furthermore, in some embodiments of this application, the shielding shell 14 has multiple grooves 17 on its left and right sides, and the inner wall of the placement groove 12 has multiple protrusions 18 that match the shape of the grooves 17 and correspond one-to-one. When the shielding shell 14 is placed in the placement groove 12, each protrusion 18 engages with each groove 17, and the electric field sensor 2 is detachably placed inside the shielding shell 14. The top of the encapsulation shell 1 is also provided with a cover 15 for sealing the placement groove 12. The cover 15 abuts against the end face of the encapsulation shell 1 and is provided with a sealing film 23. The bottom surface of the cover 15 is provided with a carbon-based conductive coating 13, and the top surface of the cover 15 is provided with an electromagnetic wave shield. The shielding coating; the encapsulation shell 1 also has two storage slots 19, which are located on both sides of the placement slot 12 and are symmetrically arranged relative to the placement slot 12. Each of the two storage slots 19 is provided with an insulating buffer pad 20. The cover 15 is also used to seal the storage slots 19. Furthermore, a locking block 26 is fixedly connected to the bottom of the placement slot 12. Multiple silicone grease slots 27 are opened on the top of the locking block 26. Each silicone grease slot 27 is coated with thermal conductive silicone grease. The top of the locking block 26 is engaged with the bottom of the shielding shell 14. In addition, an optical fiber 16 is provided on one side of the electric field sensor 2. The optical fiber 16 passes through the encapsulation shell 1 and extends to the outside of the encapsulation shell 1.
[0024] Based on the above structure, when installing the shielding shell 14 and the encapsulation shell 1, the staff can use the cooperation of the groove 17 and the protrusion 18 to achieve a precise snap-fit between the shielding shell 14 and the encapsulation shell 1, enhancing the stability of the shielding shell 14 installation and preventing the shielding shell 14 from loosening during vibration. The locking block 26 can further provide bottom support and positioning for the shielding shell 14, enhancing the installation stability of the shielding shell 14 within the encapsulation shell 1. Furthermore, the thermally conductive silicone grease inside the silicone grease groove 27 can enhance the heat conduction efficiency between the shielding shell 14 and the locking block 26, helping the electric field sensor 2 dissipate heat and preventing excessive temperature from affecting its operation. Its working performance, while the sealing film 23 can enhance the sealing of the connection between the cover 15 and the package shell 1, preventing dust, moisture and other substances from entering the package shell 1 from the gaps, protecting the internal components from environmental corrosion, while the electromagnetic wave shielding coating on the upper surface of the cover 15 can use its own conductive or magnetic properties to initially reflect, absorb or attenuate electromagnetic waves in the external environment, further blocking electromagnetic interference signals from entering the package shell 1. The carbon-based conductive coating 13 at the lower end of the cover 15, the shielding shell 14 and the carbon-based conductive coating 13 on the inner wall of the placement groove 12 form a multi-layer electromagnetic protection system. To provide secondary protection, the influence of external electromagnetic radiation on the electric field sensor 2 is reduced, ensuring the measurement accuracy and stability of the electric field sensor 2 in complex electromagnetic environments. The carbon-based conductive coating 13 contains carbon nanotubes, graphene, and other carbon-based materials with excellent conductivity and flexibility, which can closely adhere to the surface of the structure, fill tiny gaps, and further absorb and reflect residual electromagnetic waves through the eddy current effect, especially significantly suppressing low-frequency electromagnetic interference. The shielding shell 14 can be made of a metal material with high conductivity, such as copper, aluminum, or alloy. The metal material, with its excellent conductivity, can reflect external electromagnetic waves, preventing them from penetrating the shielding shell 14 and interfering with the electric field sensor 2. At the same time, it can also isolate the electromagnetic signals that may be generated inside the electric field sensor 2 from radiating outward, avoiding interference with the external environment. The insulating buffer pad 20 is set on the inner wall of the storage tank 19. On the one hand, it prevents the formation of a conductive path between the tank and the encapsulation shell 1 through its insulation properties. On the other hand, it uses its buffering properties to reduce the vibration transmitted from the outside to the inside of the encapsulation shell 1, ensuring that the electric field sensor 2 can sense the external electric field signal and convert it into an optical signal in a stable environment to complete the electric field measurement.
[0025] In some embodiments of this application, the overall assembly can be connected to different external devices, such as a drone, using the mounting plate 11 and external bolts. When faced with high-frequency vibrations generated by the drone itself, the damping rod 10 installed at one end of the positioning frame 8 further consumes vibration energy through its own damping characteristics, slowing down the transmission speed of vibration. The positioning frame 8 can also transmit most of the unabsorbed vibration to the interior of the micro-airbag 9. The micro-airbag 9, with the compressibility of its internal gas, can effectively absorb vibration impacts from both horizontal and inclined directions. Simultaneously, the vertical buffer assembly 6 provides initial buffering and attenuation of vibration energy transmitted along the vertical direction. Through the synergy of these three components… The same function can significantly reduce the transmission of high-frequency vibrations from the UAV to the interior of the enclosure 1, creating a stable working environment for the electric field sensor 2. At the same time, the component can be installed on other different devices with the help of the mounting plate 11 and external bolts. The mounting plate 11 adopts a standardized hole design. When installing, the staff only needs to select standardized bolts that match the hole positions of the mounting plate 11 according to the actual measurement requirements and the structural characteristics of the target device. No modification to the structure of the component itself is required to achieve quick disassembly and stable fixation, further improving the versatility of the equipment in complex industrial environments. It also improves the deployment efficiency of the equipment and saves a lot of installation and debugging time.
[0026] Please see Figure 1 , Figure 7 and Figure 8 The vertical buffer assembly 6 of this application includes a positioning disk 601 and a connecting plate 602. The bottom of the positioning disk 601 is detachably connected to the inner bottom wall of the support cylinder 5. A return spring 603 is fixedly connected to the top of the positioning disk 601. A magnetorheological damping rod 604 is detachably connected to the top of the positioning disk 601. A fixed disk 605 is fixedly connected to the other end of the return spring 603 and the magnetorheological damping rod 604. A butterfly spring 606 is provided on the top of the fixed disk 605. A transfer disk 607 is detachably connected to the top of the butterfly spring 606. A threaded post 608 is fixedly connected to the bottom of the transfer disk 607. The threaded post 608 passes through the butterfly spring 606 and is detachably connected to the fixed disk 605. The top of the transfer disk 607 is detachably connected to the bottom of the connecting plate 602. The top of the connecting plate 602 is connected to the bottom of the grid plate 7 by bolts.
[0027] Based on the above structure, the vertical buffer assembly 6 can absorb the vertical vibration received at the upper end of the encapsulation shell 1. Vertical vibrations that cannot be absorbed at the upper end of the grid plate 7 are transmitted to the vertical buffer assembly 6. The connecting plate 602, connected to the grid plate 7, transmits the vibration to the transmission disk 607, which then transmits it to the butterfly spring 606. The butterfly spring 606 further absorbs the vertical vibration energy through its own elastic deformation, enhancing the load capacity and vibration resistance range of the vertical buffer assembly 6. After absorbing part of the vibration, the magnetorheological damping rod 604 at the lower end of the fixed disk 605 performs secondary absorption of the vertical vibration, utilizing the properties of the magnetorheological fluid. The damping force is adjusted in time to quickly dissipate the energy of vertical vibration and enhance the buffering effect on high-frequency and strong vibrations. The return spring 603 can also absorb the vertical vibration energy through elastic deformation and drive the magnetorheological damping rod 604 to reset after the vibration ends, so that it can quickly return to the initial state and prepare for the next vibration absorption. At the same time, the support cylinder 5 can provide the installation foundation and axial positioning for the vertical buffer assembly 6. Its cylindrical structure can limit the lateral displacement of the vertical buffer assembly 6 and ensure that the vertical buffering effect is stable. Meanwhile, the operator can adjust the preload of the disc spring 606 by rotating the threaded column 608 to adapt to different vibration scenarios.
[0028] Furthermore, during assembly, a through hole can be opened in the center of the positioning plate 601, and a corresponding threaded blind hole can be opened in the center of the bottom surface of the support cylinder 5. Countersunk screws or bolts are installed, passing through the through hole of the positioning plate 601 and screwed into the threaded blind hole at the bottom of the support cylinder 5, thereby firmly fixing the entire vertical buffer assembly 6 inside the support cylinder 5. When disassembly is required, the screws can be unscrewed from the top to achieve a detachable connection. Alternatively, an annular groove can be set at the bottom of the inner wall of the support cylinder 5, and elastic buckles can be set on the side of the positioning plate 601. When the vertical buffer assembly 6 is pressed vertically into the support cylinder 5, the buckles are compressed and contracted. When they reach the groove position, the buckles spring open and engage in the annular groove to achieve quick installation. When disassembling, a special tool is used to press the buckles from the opening on the side wall of the support cylinder 5 to remove the assembly upwards, achieving a detachable connection.
[0029] Furthermore, the connecting plate 602 and the grid plate 7 of this application are connected by bolts. Specifically, multiple threaded holes are pre-drilled on the connecting plate 602, and through holes are opened at corresponding positions on the grid plate 7. During installation, the bolts are passed through the through holes from above the grid plate 7, and then screwed into the threaded holes of the connecting plate 602 and tightened. This connection method is stable and reliable, and is easy to disassemble and maintain.
[0030] It should be noted that since the vertical buffer assembly 6 is detachably connected to the support cylinder 5 and the grid plate 7, when any internal component reaches the end of its service life or is damaged, maintenance personnel do not need to disassemble the entire encapsulation shell 1. They only need to unscrew the connecting bolts between the connecting plate 602 and the grid plate 7 from the top, and then release the fixing of the positioning plate 601. The entire vertical buffer assembly 6 can then be extracted as an independent module for repair or replacement, which greatly reduces the difficulty and cost of on-site maintenance.
[0031] Furthermore, the preload of the disc spring 606 can be adjusted by rotating the threaded column 608 to adapt to different vibration scenarios. Through the detachable and adjustable settings, the same set of encapsulated fixing components can be adapted to various complex working conditions, from high-frequency vibration of drones to low-frequency strong vibration of industrial equipment, by simple adjustment. This greatly improves the product's versatility and environmental adaptability. At the same time, the detachable design allows for sequential optimization during the assembly process. For example, the vertical buffer component 6 can be fully assembled outside the support cylinder 5 first, and the preload of the threaded column 608 can be preset. Then, the entire assembly can be inserted into the support cylinder 5 and fixed at the bottom. This avoids complex assembly inside the narrow support cylinder 5, ensures assembly accuracy, and improves production efficiency.
[0032] It should be further explained that the core of existing vibration reduction technology is the synergistic setting of springs and dampers. The spring is responsible for buffering impacts and storing energy, while the damper is responsible for dissipating energy and suppressing rebound. Although this setting solves the main defects of pure elastic or pure damping systems, its adaptability to wide-frequency vibrations and complex working conditions is still limited. The vertical buffer component 6 uses a butterfly spring 606 as the main buffer. Compared with traditional helical springs, it has a higher load capacity and a larger deformation in the same space. The magnetorheological damping rod 604 is the core damper. Its damping force can be adjusted in real time and actively according to the vibration intensity, so it can simultaneously and efficiently cope with gentle low-frequency vibrations and severe high-frequency impacts. In this structure, the butterfly spring 606 and the magnetorheological damping rod 604 form a functionally complementary main buffer chain, while the reset spring 603 is specifically used for auxiliary reset and absorption of micro-vibrations. The entire component is precisely axially guided by the support cylinder 5. It can be seen that this structure is not a simple stacking of components, but can achieve the optimal buffering effect in a wide frequency range and under multiple working conditions.
[0033] Please see Figure 6 and Figure 10The encapsulation shell 1 has an outlet hole 21 on one side for the optical fiber 16 to pass through. A plastic elastic clip 22 is provided in the outlet hole 21. The plastic elastic clip 22 is sleeved on the optical fiber 16 and detachably connected to the optical fiber 16. An optical fiber fixing assembly 24 is detachably connected to one side of the encapsulation shell 1. Specifically, the fiber optic fixing assembly 24 includes a limiting frame 2401 and a connecting plate 2402. Multiple telescopic rods 2403 are rotatably connected to the outer surface of the limiting frame 2401. The multiple telescopic rods 2403 are arranged in a ring array around the center point of the limiting frame 2401. The other end of each of the multiple telescopic rods 2403 is detachably connected to one side of the encapsulation shell 1. A pull rod 2404 is rotatably connected to the middle of each telescopic rod 2403. The other end of the pull rod 2404 is rotatably connected to the connecting plate 2402. A positioning block 25 is sleeved on the fiber optic cable 16. After the fiber optic cable 16 extends out of the encapsulation shell 1, it passes through the limiting frame 2401 and the connecting plate 2402 in sequence. One side of the positioning block 25 is engaged with the side of the limiting frame 2401 away from the connecting plate 2402.
[0034] Based on the above structure, the outlet hole 21 provides a passage for the optical fiber 16, enabling the optical fiber 16 to connect to external devices. Simultaneously, it restricts the outlet position of the optical fiber 16, preventing it from moving erratically within the housing. The plastic elastic clamp 22 inside the outlet hole 21 elastically holds the outer surface of the optical fiber 16, fixing its position while preventing damage from rigid clamping. It also reduces friction between the optical fiber 16 and the outlet hole 21 during vibration. After completing the wiring inside the encapsulation housing 1, the optical fiber 16 sequentially passes through the central channel of the limiting frame 2401 and the connecting plate 2402, ultimately connecting to external signal processing equipment. The positioning block 25, fitted onto the surface, forms a tight engagement with the side of the limiting frame 2401 away from the connecting plate 2402. When external tension is applied to the optical fiber 16, the positioning block 25 can axially limit the optical fiber 16, concentrating the external tension on itself and transmitting it to the limiting frame 2401 on its side. At the same time, the telescopic rod 2403 connected to the outer surface of the limiting frame 2401, due to its telescopic nature, can generate a certain reverse tension when the optical fiber 16 is pulled externally, offsetting part of the pulling force. Furthermore, the telescopic rod 2403 is also fixed to one side of the encapsulation shell 1, which can transfer part of the pulling force to the encapsulation shell 1, avoiding force concentration. Used for the optical fiber 16 itself, to prevent the connection end between the optical fiber 16 and the electric field sensor 2 from falling off or loosening due to excessive force, thereby ensuring the continuity and stability of optical signal transmission. When installing the optical fiber fixing assembly 24, by pulling the pull rod 2404, the opening angle and opening range of the telescopic rod 2403 can be precisely changed to adapt to the spatial position of the encapsulation shell 1. During this process, since one end of the telescopic rod 2403 is connected to the limiting frame 2401, when the telescopic rod 2403 opens and closes, the limiting frame 2401 will move accordingly, thereby achieving flexible position adjustment. In actual installation or use scenarios, the work... According to the specific position of the positioning block 25 on the outer surface of the optical fiber 16, the operator can finely adjust the position of the limiting frame 2401 through the above adjustment method to ensure that the limiting frame 2401 can form a tight and precise engagement with the positioning block 25, thereby providing stable axial constraint for the optical fiber 16. At the same time, the two ends of the pull rod 2404 are rigidly connected to the telescopic rod 2403 and the connecting plate 2402 respectively. This structure can effectively limit the opening and closing trajectory of the telescopic rod 2403, avoiding instability such as deviation or shaking during adjustment or force application, ensuring that the entire adjustment process is smooth and controllable, and keeping the positions of the telescopic rod 2403 and the limiting frame 2401 stable.
[0035] In summary, the electromagnetic interference-resistant encapsulation and fixing assembly for this fiber optic electric field sensor requires the initial installation of the fiber optic fixing assembly 24. Operators precisely adjust the opening angle and range of the telescopic rod 2403 by pulling the lever 2404 to fit the installation position of the encapsulation shell 1. Based on the specific position of the positioning block 25 on the outer surface of the fiber optic 16, the position of the limiting frame 2401 is fine-tuned. Then, the telescopic rod 2403 is fixed to one side of the encapsulation shell 1. When installing the electric field sensor 2 into the shielding shell 14, the fiber optic 16 at one end of the electric field sensor 2 should first pass through the outlet hole 21 into the encapsulation shell 1. The plastic elastic clamp 22 inside the outlet hole 21 will simultaneously clamp and fix the fiber optic 16. Subsequently, the fiber optic 16 passes sequentially through the limiting frame 2401. 1. Connecting plate 2402, the positioning block 25 on its outer surface is engaged with the limiting frame 2401. Then, the shielding shell 14 is engaged in the placement groove 12 inside the encapsulation shell 1. When installing the shielding shell 14, the operator needs to pull the optical fiber 16 at any time to ensure that it is smoothly sent out from the inside of the outlet hole 21, avoiding problems such as entanglement in the placement groove 12. After the shielding shell 14 is installed, the cover 15 is fixed to the upper end of the encapsulation shell 1 to seal the encapsulation shell 1. After sealing, the operator connects the component to the external equipment through the mounting plate 11. Facing horizontal multi-directional vibration in the external environment, after the vibration energy is transmitted to the upper end of the encapsulation shell 1, the damping rod 10 connected to the external equipment responds immediately, consuming the initial vibration by means of the damping characteristics of the rod. The energy is limited, and the lateral displacement of the component is restricted. Vibrations that are not fully absorbed are further transmitted to the miniature airbag 9 connected to the damping rod 10. The gas inside the airbag uses compressibility to achieve multi-directional flexible buffering, absorbing high-frequency vibrations and small displacements in the horizontal direction, and avoiding damage to the component due to rigid fixation through flexible contact. In this process, the grid plate 7 not only provides a stable mounting point for the positioning frame 8 and the miniature airbag 9, but also disperses the vibration stress it receives through its own slight deformation. At the same time, if the encapsulation shell 1 is subjected to vertical vibration, the vibration energy that the grid plate 7 cannot fully absorb will be transmitted to the transfer disk 607 through the connecting plate 602, and then transmitted to the butterfly spring 606 through the transfer disk 607. The butterfly spring 606 initially deforms through its own elastic deformation. The vertical vibration energy is absorbed step by step. The residual vibration is transmitted to the magnetorheological damping rod 604 via the fixed disk 605. The damping force is adjusted in real time using the properties of the magnetorheological fluid to quickly dissipate the energy of the vertical vibration. After the vibration ends, the return spring 603 absorbs the remaining energy through elastic deformation and drives the magnetorheological damping rod 604 to return to its original state, maintaining the initial state of the structure in preparation for the next buffering. In a strong electromagnetic environment, the carbon-based conductive coating 13 on the inner wall of the placement tank 12 forms an electromagnetic shielding auxiliary layer, which, together with the shielding shell 14, forms a double protection, reflecting or absorbing external electromagnetic interference signals. The electromagnetic wave shielding coating on the outer surface of the cover 15 further blocks the intrusion of electromagnetic signals. Together with the shielding shell 14 and the carbon-based conductive coating 13, they form a multi-layer protection system, reducing interference to the electric field sensor 2.Ensure its measurement accuracy.
[0036] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.
Claims
1. A fiber optic electric field sensor anti-electromagnetic interference packaging and fixing assembly, characterized in that, The package includes a housing (1), on which brackets (3) are detachably connected on both the left and right sides. Multiple support cylinders (5) are fixedly installed on the top of each of the two brackets (3). Multiple support cylinders (5) on each bracket (3) are arranged sequentially from front to back on the bracket (3). A vertical buffer assembly (6) is detachably connected inside the support cylinder (5). A grid plate (7) is detachably connected to the upper end of the vertical buffer assembly (6). Multiple positioning frames (8) are fixedly connected to the outer surface of the grid plate (7). A micro airbag (9) is fixedly connected to the side of the positioning frame (8) facing the grid plate (7). The micro airbag (9) is detachably connected to the grid plate (7). A damping rod (10) is fixedly connected to the end of the positioning frame (8) away from the micro airbag (9). A mounting plate (11) is fixedly connected to the end of the damping rod (10) away from the positioning frame (8).
2. The electromagnetic interference-resistant packaging and fixing assembly for the fiber optic electric field sensor according to claim 1, characterized in that, The encapsulation shell (1) is provided with a placement groove (12), and the inner wall of the placement groove (12) is provided with a carbon-based conductive coating (13). The placement groove (12) is used to place an electric field sensor (2). The electric field sensor (2) is covered with a shielding shell (14). The shielding shell (14) is snapped into the placement groove (12). The top of the encapsulation shell (1) is provided with a cover (15) for sealing the placement groove (12).
3. The electromagnetic interference-resistant packaging and fixing assembly for the fiber optic electric field sensor according to claim 1, characterized in that, The vertical buffer assembly (6) includes a positioning disk (601) and a connecting plate (602). The positioning disk (601) is detachably connected to the support cylinder (5). A return spring (603) is fixedly connected to the top surface of the positioning disk (601). A magnetorheological damping rod (604) is detachably connected to the top surface of the positioning disk (601). A fixed disk (605) is fixedly connected to the other end of the return spring (603) and the magnetorheological damping rod (604). The top surface of the fixed disk (605) is provided with... A butterfly spring (606) is provided with a transfer disc (607) detachably connected to its top surface. A threaded post (608) is fixedly provided on the bottom surface of the transfer disc (607). The threaded post (608) passes through the butterfly spring (606) and is threadedly connected to the fixed disc (605). The top surface of the transfer disc (607) is detachably connected to the lower end of the connecting plate (602). The upper end of the connecting plate (602) is fixedly connected to the lower end of the grid plate (7) by bolts.
4. The electromagnetic interference-resistant packaging and fixing assembly for the fiber optic electric field sensor according to claim 1, characterized in that, The shield shell (14) has multiple grooves (17) on its left and right sides. The inner wall of the placement groove (12) is fixedly provided with protrusions (18) that match the shape of the grooves (17). The number of protrusions (18) is equal to that of the grooves (17) and corresponds one-to-one with the grooves (17).
5. The electromagnetic interference-resistant packaging and fixing assembly for the fiber optic electric field sensor according to claim 1, characterized in that, The encapsulation shell (1) is provided with two storage slots (19). The two storage slots (19) are respectively located on both sides of the placement slot (12) and are symmetrically arranged relative to the placement slot (12). Each of the two storage slots (19) is provided with an insulating buffer pad (20). The cover (15) is also used to seal the two storage slots (19).
6. The electromagnetic interference-resistant packaging and fixing assembly for the fiber optic electric field sensor according to claim 1, characterized in that, The encapsulation shell (1) has a wire outlet hole (21) on one side. The optical fiber (16) passes through the wire outlet hole (21) and extends to the outside of the encapsulation shell (1). A plastic elastic clamp (22) is provided in the wire outlet hole (21) and is sleeved on the optical fiber (16).
7. The electromagnetic interference-resistant packaging and fixing assembly for the fiber optic electric field sensor according to claim 1, characterized in that, The sealing cap (15) is provided with a sealing film (23) at the edge of the encapsulation shell (1), the bottom surface of the sealing cap (15) is provided with a carbon-based conductive coating (13), and the top surface of the sealing cap (15) is provided with an electromagnetic wave shielding coating.
8. The electromagnetic interference-resistant packaging and fixing assembly for the fiber optic electric field sensor according to claim 1, characterized in that, A locking block (26) is fixedly provided at the bottom of the placement groove (12) of the encapsulation shell (1). Multiple silicone grease grooves (27) are opened on the top of the locking block (26). Each silicone grease groove (27) is coated with thermal conductive silicone grease. The top of the locking block (26) is engaged with the bottom of the shielding shell (14).
9. The electromagnetic interference-resistant packaging and fixing assembly for the fiber optic electric field sensor according to claim 1, characterized in that, One side of the encapsulation shell (1) is detachably connected to an optical fiber fixing assembly (24). The optical fiber fixing assembly (24) includes a limiting frame (2401) and a connecting plate (2402). The outer surface of the limiting frame (2401) is rotatably connected to a plurality of telescopic rods (2403). The plurality of telescopic rods (2403) are arranged in a ring array around the limiting frame (2401). The other end of the plurality of telescopic rods (2403) is detachably connected to the encapsulation shell (1). The middle part of each telescopic rod (2403) is rotatably connected to a pull rod (2404). The other end of the pull rod (2404) is rotatably connected to the connecting plate (2402). The limiting frame (2401) and the connecting plate (2402) are sleeved on the optical fiber (16).
10. The electromagnetic interference-resistant packaging and fixing assembly for the fiber optic electric field sensor according to claim 9, characterized in that, A positioning block (25) is fitted on the optical fiber (16), and the positioning block (25) is engaged with the end of the limiting frame (2401) away from the connecting plate (2402).