Probe card transfer device and method for power semiconductor device wafer electrical signal testing

Abstract

The application discloses a power semiconductor device wafer electrical signal test probe card transfer device and method, and relates to the technical field of electrical variable testing. The device comprises a rack and a bearing mechanism, the bearing mechanism comprising a bearing base, a first pushing module and a second pushing module, and the probe card is provided with first and second pin holes at intervals along the length direction. The first pushing module is connected to the first pin hole through a first push-pull pin shaft, and the probe card is pushed to a preset stroke position; the bearing base is provided with a positioning unit, and the positioning unit is connected to the probe card through a positioning block inserted into a positioning groove to complete the locking of the transfer position; then the first push-pull pin shaft is lowered to be separated, the second push-pull pin shaft of the second pushing module is connected to the second pin hole in the rear end region, and the probe card is pushed to a target station such as a testing machine or a cooling bin. The application solves the problem of large thickness of the single push-pull mechanism at the end and easy interference when the single push-pull mechanism extends into the target station, realizes deep position conveying of the probe card in a compact space, and improves the transfer reliability and station adaptability.

Description

Technical Field

[0001] This application relates to the technical field of electrical variable testing, and in particular to a probe card transfer device and method for testing electrical signals on power semiconductor device wafers. Background Technology

[0002] In the manufacturing process of power semiconductor devices, wafer electrical signal testing is a critical step in screening out defective chips and evaluating wafer yield. This process typically requires moving the probe card carrying the wafer back and forth between multiple stations such as alignment machines, testing machines, and cooling chambers.

[0003] In related technologies, a wafer testing equipment and control method are disclosed. The equipment includes a wafer loading / unloading device, a transfer device, an aging test device, and a cooling device. The transfer device is located between the aging test device and the wafer loading / unloading device and includes multiple push-pull mechanisms arranged vertically in a stacked manner. Each push-pull mechanism has a locking component, which includes a limiting post and a driving component. The limiting post moves vertically up and down to engage or disengage with a limiting hole at the bottom of the wafer testing fixture, thereby realizing the pushing and pulling of the wafer testing fixture between the aging test chamber and the cooling chamber, achieving automated transfer of the wafer testing fixture between multiple workstations.

[0004] However, the push-pull mechanism of the above-mentioned scheme uses a single set of snap-fit ​​components to complete the full stroke. Its structure includes multiple components such as a damping wheel, a drive mechanism, and snap-fit ​​components, resulting in a relatively large overall thickness of the end effector. When the transfer space is limited, the end effector is prone to interference with the internal structural components of the testing machine and cooling chamber, thus restricting the depth to which the effector can enter the testing machine and cooling chamber. To avoid interference, it is necessary to make additional designs to the structure of the testing machine and cooling chamber, or even reduce some functions to adapt to the transfer requirements. At the same time, in a compact transfer environment, the push-pull mechanism is also difficult to debug and maintain. Summary of the Invention

[0005] To address the issues of large thickness of end effectors, limited entry depth, and maintenance difficulties in existing wafer transfer equipment, this application provides a probe card transfer device and method for testing electrical signals on power semiconductor device wafers.

[0006] This application provides a probe card transfer device for testing electrical signals on power semiconductor device wafers, employing the following technical solution: A probe transfer device for testing electrical signals on power semiconductor device wafers includes a frame and a support mechanism slidably mounted on the frame, wherein the support mechanism includes: A support base, wherein the support base is provided with a support slide rail for the probe to slide; The first push module, located on the support base, includes a first push-pull pin, a first linear drive assembly, and a first lifting drive assembly. The first linear drive assembly is used to drive the first push-pull pin to slide along the length direction of the support slide rail. The probe is provided with a first pin hole for the first push-pull pin to be inserted into. The first lifting drive assembly is used to drive the first push-pull pin to rise and fall, so that the first push-pull pin can be inserted into or disengaged from the first pin hole. The second push module, located on the support base, includes a second push-pull pin, a second linear drive assembly, and a second lifting drive assembly. The second linear drive assembly drives the second push-pull pin to slide along the length direction of the support slide rail. The probe is provided with a second pin hole for the second push-pull pin to be inserted into. The second lifting drive assembly drives the second push-pull pin to move up and down, so that the second push-pull pin is inserted into or disengaged from the second pin hole. The first pin hole and the second pin hole are spaced apart along the length direction of the support slide rail. The first push module and the second push module are configured to switch the transport probe sequentially along the length of the transport slide rail.

[0007] By adopting the above technical solution, the first pushing module and the second pushing module are arranged at intervals along the length of the support slide rail and switch sequentially to transport the probe. The first pushing module pushes the probe a certain distance and then disengages, and the second pushing module takes over to continue pushing the probe to the target station. Because the first pin hole and the second pin hole are arranged at intervals along the length of the support slide rail, the insertion positions of the first push-pull pin and the second push-pull pin with the probe are misaligned along the length of the probe. When the probe is sent out, the second push-pull pin is inserted into the rear end area of ​​the probe, and only the probe itself and a portion of the second push-pull pin extend into the target station. Therefore, when the probe is sent into the target station such as the testing machine or cooling chamber, it is not easy to interfere with its internal structural components. This solves the problem of limited insertion depth caused by the large thickness at the end of a single push-pull mechanism, and realizes deep delivery of the probe to the target station within a limited transfer space.

[0008] Optionally, the first pushing module further includes a first slide block, on which a first force-applying component is provided, and the first push-pull pin slides vertically on the first slide block. The first force-applying component is used to drive the first push-pull pin to slide upward, and the first lifting drive assembly is used to drive the first push-pull pin to descend. The second pushing module further includes a second slide block, on which a second force-applying component is provided, and the second push-pull pin slides vertically on the second slide block. The second force-applying component is used to drive the second push-pull pin to slide upward, and the second lifting drive assembly is used to drive the second push-pull pin to descend.

[0009] By adopting the above technical solution, the first force-applying component and the second force-applying component enable the first push-pull pin and the second push-pull pin to remain in an upward state when no external force is applied, that is, they are in the ready position for inserting the probe by default, and are only driven to press down by the lifting drive component when they need to be disengaged, which simplifies the control logic.

[0010] Optionally, the first lifting drive assembly includes two first lifting units spaced apart along the transfer direction; the first lifting unit includes a first telescopic source and a first pressing slide, the first pressing slide is provided with a first pressing slope, and the first telescopic source is used to drive the first pressing slide to slide perpendicular to the transfer direction; A first linkage post is connected to the first push-pull pin shaft, and the first downward pressing slope is used to press against the first linkage post to drive the first push-pull pin shaft to descend.

[0011] By adopting the above technical solution, the two first lifting units are arranged at intervals along the transfer direction, so that the first push-pull pin is controlled by the front first lifting unit to disengage at the beginning of the stroke and by the rear first lifting unit to disengage at the end of the stroke. This allows for independent control of the insertion and disengagement of the first push-pull pin at both ends of the push stroke. Simultaneously, the drive method of using a first downward-pressing inclined surface to press against the first linkage column converts the horizontal output force of the telescopic source into vertical downward pressure, which helps reduce the vertical space occupied by the lifting drive assembly and adapts to usage scenarios with tight transfer spaces.

[0012] Optionally, the second lifting drive assembly includes a second lifting unit, and the second linear drive assembly is used to drive the second lifting unit to slide together with the second push-pull pin. The second lifting unit includes a second telescopic source and a second pressing slide. The second pressing slide is provided with a second pressing inclined surface. The second telescopic source is used to drive the second pressing slide to slide perpendicular to the transfer direction. A second linkage column is connected to the second push-pull pin shaft, and the second downward pressing slope is used to press against the second linkage column to drive the second push-pull pin shaft to descend.

[0013] By adopting the above technical solution, the second lifting unit and the second push-pull pin slide together with the second linear drive component, so that the second push-pull pin can be controlled to rise and fall by the second lifting unit throughout the entire pushing stroke, eliminating the need to set multiple fixed second lifting units along the stroke direction, resulting in a more compact structure.

[0014] Optionally, the support base is further provided with a positioning unit, which includes a telescopic drive source and a positioning block driven by the telescopic drive source. The positioning block is configured to extend when the first push module pushes the probe to a preset travel position to position the probe in place.

[0015] By adopting the above technical solution, the positioning unit automatically extends to perform positioning confirmation when the first push module pushes the probe to the preset stroke position, ensuring that the probe is accurately and reliably positioned during the switching and handover between the first push module and the second push module, and avoiding the second push-pull pin from failing to be accurately inserted into the second pin hole due to positional deviation.

[0016] Optionally, the positioning block is tapered towards one end of the probe.

[0017] By adopting the above technical solution, the tapered shape of the positioning block plays a guiding role. When the probe reaches the preset travel position, even if there is a slight positional deviation, the tapered design can guide the probe to slide into the correct position, thereby improving the fault tolerance and reliability of positioning.

[0018] Optionally, a barcode scanning and identification unit is also included, which is disposed above the support base and is used to scan the identification information on the detector to identify whether the detector is the designated incoming material.

[0019] By adopting the above technical solution, the barcode scanning and identification unit can automatically identify the marking information on the probe during the probe transfer process, determine whether the incoming material is correct, avoid erroneous testing caused by material confusion, and improve the accuracy and traceability of the testing process.

[0020] Optionally, a buffer unit may also be included, which is used to abut against the first downward-pressing carriage.

[0021] By adopting the above technical solution, the buffer unit limits the sliding stroke of the first downward slide and provides buffering to prevent the first downward slide from overshooting and causing impact damage to the first linkage column or the first push-pull pin, while ensuring that the downward pressure of the first downward inclined surface on the first linkage column is accurate and controllable.

[0022] Optionally, the second linear drive assembly further includes a second slide, which is slidably disposed on the support base along the transfer direction, and a limit unit is provided on the second slide; The limiting unit includes two limiting seats arranged opposite each other, and the second pressing slide includes an outer edge strip, which is located between the two limiting seats.

[0023] By adopting the above technical solution, the outer edge of the second pressing slide is located between the two limiting seats, which can limit the sliding stroke of the second pressing slide in the direction perpendicular to the transfer direction in both directions, ensuring that the pressing amount of the second pressing slope against the second linkage column is accurate, and preventing the second pressing slide from overstepping or falling out.

[0024] This application also provides a probe card transfer method for testing electrical signals on power semiconductor device wafers, employing the following technical solution: A probe card transfer method for testing electrical signals on power semiconductor device wafers, applied to the aforementioned probe card transfer device, includes the following steps: S1. Receive the probe card onto the carrier mechanism; S2. Execute the first push-pull stage, insert the probe card through the first push-pull pin, and push the probe card to the preset stroke position along the transfer direction; S3. Switch to the second push-pull stage, disengage the first push-pull pin from the probe, and connect the probe to the probe through the second push-pull pin, and continue to push the probe to the target station along the transfer direction; S4. Disengage the second push-pull pin from the probe and drive the second push-pull pin to reset.

[0025] By adopting the above technical solution, the probe is pushed in two stages. The first stage completes the intermediate stroke of the push, and the second stage is completed by the compact second push-pull pin to push it into the target station. This allows the probe to be delivered deep into the testing machine or cooling chamber and other stations. The entire transfer process is segmented, coordinated, reliable and efficient.

[0026] In summary, this application includes at least one of the following beneficial effects: 1. This application uses a first pushing module and a second pushing module to push the probe card in segments in a relay. The first pin hole and the second pin hole are set at intervals along the length of the support slide rail, so that the insertion positions of the first push-pull pin and the second push-pull pin with the probe card are staggered along the length of the probe card. When the probe card is sent out, the second push-pull pin is inserted into the rear end area of ​​the probe card. Only the probe card itself and the second push-pull pin partially extend into the target station. Therefore, when the probe card is sent into the target station such as the testing machine or cooling chamber, it is not easy to interfere with its internal structural components. 2. The first force-applying component and the second force-applying component in this application keep the first push-pull pin and the second push-pull pin in an upward state when no external force is applied, and drive them to move downward in combination with the wedge-shaped inclined plane. This achieves the lifting and lowering control of the push-pull pin under the condition of compact vertical space. The structure is simple and the space utilization rate is high. 3. This application also provides a positioning unit on the support base. The positioning unit automatically extends to confirm the positioning when the probe is pushed to the preset travel position by the first push module, so as to ensure that the probe is accurately and reliably positioned when switching between the first push module and the second push module. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the probe transfer device in Embodiment 1 of this application; Figure 2 This is a schematic diagram of the load-bearing mechanism in Embodiment 1 of this application; Figure 3This is a schematic diagram of the supporting mechanism structure after removing the scanning and recognition components in Embodiment 1 of this application; Figure 4 This is a schematic diagram of the detector card in Embodiment 1 of this application; Figure 5 This is a schematic diagram of the structure of the first push module in Embodiment 1 of this application; Figure 6 This is a structural schematic diagram of the first push module in Embodiment 1 of this application from another perspective; Figure 7 This is a partially enlarged structural diagram of the second push module in Embodiment 1 of this application; Figure 8 This is a schematic diagram of the structure of the second push module in Embodiment 1 of this application; Figure 9 This is a schematic diagram of the positioning unit in Embodiment 1 of this application.

[0028] Explanation of reference numerals in the attached figures: 1. Frame; 11. Lifting frame; 12. Translation assembly; 2. Support base; 21. Support slide rail; 22. Support rollers; 23. Top frame; 3. First push module; 31. First push-pull pin; 311. First linkage column; 312. First measuring plate; 3121. Light shield; 32. First slide; 33. First force application component; 34. First linear drive assembly; 341. First slide table; 35. First lifting drive assembly; 351. Front first lifting unit; 3511. First telescopic source; 3512. First downward slide; 3513. First downward inclined surface; 352. Rear first lifting unit; 353. First photoelectric sensor; 4. Second push module; 41. Second push-pull pin; 411. Second linkage column; 412. Second measuring plate; 42. Second slide block; 43. Second force application component; 44. Second linear drive assembly; 441. Second slide table; 45. Second lifting drive assembly; 451. Second lifting unit; 4511. Second telescopic source; 4512. Second downward pressing slide; 4513. Second downward pressing inclined surface; 4514. Outer edge strip; 452. Second photoelectric sensor; 5. Positioning unit; 51. Telescopic drive source; 52. Positioning block; 6. QR code scanning and recognition unit; 7. Buffer unit; 8. Emergency stop module; 81. First emergency stop button; 82. Second emergency stop button; 9. Electrical cabinet components; 10. Seat-limiting mechanism; 100, probe card; 110, first pin hole; 120, second pin hole; 130, identification code; 140, positioning groove. Detailed Implementation

[0029] Example 1: Embodiment 1 of this application provides a probe card transfer device for testing electrical signals on power semiconductor device wafers.

[0030] The probe transfer device of this embodiment is used to reciprocate and transport probes 100 carrying wafers between multiple workstations such as alignment machines, testing machines, and cooling chambers. The probe transfer device as a whole includes a frame 1 and a support mechanism slidably mounted on the frame 1.

[0031] refer to Figure 1 The frame 1 is equipped with a lifting frame 11 and a translation component 12. A support mechanism is mounted on the lifting frame 11, which drives the support mechanism to move vertically to accommodate target workstations at different heights. The translation component 12 drives the lifting frame 11 to move horizontally, thereby enabling the support mechanism to reach target workstations at different horizontal positions. In this embodiment, the lifting frame 11 employs two opposing synchronous belt drive mechanisms, which are fixedly connected by a bracket. The support mechanism is fixedly connected between the two synchronous belts within the synchronous belt drive mechanisms. The translation component 12 can be a servo motor-driven linear slide module, with its moving end fixedly connected to the lifting frame, enabling two-dimensional movement of the support mechanism on the frame. In other embodiments, the lifting frame 11 can also employ a cylinder-driven or hydraulic cylinder-driven lifting structure, and the translation component 12 can also employ a rack and pinion assembly, etc.

[0032] refer to Figure 1 The rack 1 also houses the electrical cabinet assembly 9. The electrical cabinet assembly 9 integrates electrical components related to detector transfer. The electrical cabinet assembly 9 is connected to the external electrical cabinet via only one power cable and one communication cable. The detector transfer device can function as an independent unit; when disassembly is required, simply disconnecting the power and network cables allows the entire detector transfer device to be moved. Similarly, when parallel operation is needed, only the power and communication cables need to be connected, simplifying disassembly and parallel operation.

[0033] refer to Figure 2 and Figure 3The supporting mechanism includes a supporting base 2. The upper surface of the supporting base 2 is provided with a support rail 21 for the probe 100 to slide along the transfer direction. The support rail 21 extends along the transfer direction, and the bottom of the probe 100 slides in cooperation with the support rail 21, allowing the probe 100 to slide smoothly on the supporting base 2 along the transfer direction. In this embodiment, the support rail 21 consists of two parallel linear guide rails, and multiple mounting slots are equally spaced along the side of the support rail 21 along its length. Support rollers 22 are rotatably connected to the mounting slots via rotating shafts. The upper surface of the support rollers 22 is flush with the upper surface of the support rail 21 to reduce friction on the probe 100. In other embodiments, the support rail 21 can also be a full roller guide rail or a sliding guide bar, etc.

[0034] refer to Figure 2 , Figure 3 and Figure 4 The support base 2 is equipped with a first pushing module 3 and a second pushing module 4. In this embodiment, two second pushing modules 4 are spaced apart on the support base 2, and the first pushing module 3 is located between the two second pushing modules 4. The first pushing module 3 and the second pushing module 4 are configured to sequentially switch the transport of the probe 100 along the length direction of the support slide rail 21. That is, the first pushing module 3 first pushes the probe 100 from the initial position to the preset travel position, and then the second pushing module 4 takes over and continues to push the probe 100 from the preset travel position to the target workstation.

[0035] refer to Figure 4 and Figure 5 The first pushing module 3 includes a first push-pull pin 31, a first slide block 32, a first force-applying component 33, a first linear drive assembly 34, and a first lifting drive assembly 35. The first slide block 32 is mounted on the support base 2, and the first push-pull pin 31 is slidably connected to the first slide block 32 in the vertical direction through a pre-machined first sliding groove. When in the raised state, the top end of the first push-pull pin 31 protrudes above the upper surface of the support base 2 and can be inserted into the corresponding first pin hole 110 on the probe 100. The diameter of the first pin hole 110 matches the outer diameter of the first push-pull pin 31 to achieve a reliable insertion fit. To facilitate the insertion of the first push-pull pin 31 into the first pin hole 110, one end of the first push-pull pin 31 is designed as a tapered structure; in this embodiment, the first push-pull pin 31 is cylindrical, and one end of the first push-pull pin 31 is frustum-shaped.

[0036] refer to Figure 4 and Figure 5The first force-applying component 33 is disposed on the first slide block 32 and is used to drive the first push-pull pin 31 to slide upward. In this embodiment, the first force-applying component 33 is a compression spring, which is sleeved on the outer periphery of the first push-pull pin 31 or connected to the bottom of the first push-pull pin 31. When no external force is applied, the elastic restoring force of the compression spring drives the first push-pull pin 31 to remain in the raised position, that is, the first push-pull pin 31 is in the ready position by default, which can be inserted into the first pin hole 110. In this embodiment, the first force-applying component 33 is fixedly connected between the bottom of the first push-pull pin 31 and the inner bottom wall of the first slide groove. In other embodiments, the first force-applying component 33 can also be a gas spring or an elastic rubber block, etc., which have an elastic restoring function.

[0037] refer to Figure 5 and Figure 6 A first push-pull pin 31 is fixedly connected to a first linkage column 311 at one end of the first slide groove, and first linkage columns 311 are fixed on both sides of the first push-pull pin 31. A first waist-shaped hole for vertical sliding of the first linkage column 311 is opened on the side wall of the first slide block 32, and one end of the first linkage column 311 protrudes from the first waist-shaped hole in the horizontal direction. A first measuring plate 312 is also fixed on the first push-pull pin 31, and a second waist-shaped hole for vertical sliding of the first measuring plate 312 is also opened on the side wall of the first slide block 32. A first detection unit is fixed on the bearing base 2. The first detection unit is used to determine the lifting state of the first push-pull pin by detecting the vertical position of the first measuring plate 312. When the lifting state meets the preset requirements, the next action is executed. In this embodiment, the first detection unit includes two first photoelectric sensors 353 arranged at intervals in the vertical direction. A light shield 3121 is fixed on one side of the first measuring plate 312, and the light shield is located at the detection port of the first photoelectric sensor 353. There are two first detection units arranged opposite each other on the support base 2, and each first detection unit corresponds to a light-shielding sheet 3121.

[0038] The first linear drive assembly 34 is used to drive the first push-pull pin 31 to slide horizontally along the length direction of the load-bearing slide rail 21. In this embodiment, the first linear drive assembly 34 is a cylinder-driven linear guide slide structure. The first slide 341 is fixed on the sliding end of the first linear drive assembly 34, and the first slide block 32 is fixedly installed on the first slide 341 by bolts, so as to drive the first push-pull pin 31 to reciprocate along the transfer direction. In other embodiments, the first linear drive assembly 34 may also be in the form of a cylinder, a synchronous belt module, or a gear and rack drive.

[0039] refer to Figure 5 and Figure 6The first lifting drive assembly 35 is used to drive the first push-pull pin 31 to descend, so that the first push-pull pin 31 disengages from the first pin hole 110 (not shown in the figure). In this embodiment, the first lifting drive assembly 35 includes two first lifting units arranged at intervals along the transfer direction, respectively referred to as the front first lifting unit 351 and the rear first lifting unit 352, and the first linear drive assembly 34 is located between the front first lifting unit 351 and the rear first lifting unit 352.

[0040] The front first lifting unit 351 and the rear first lifting unit 352 have the same structure, both including a first telescopic source 3511 and a first pressing slide 3512. The first pressing slide 3512 includes a connecting strip and a drive wedge fixed to one end of the connecting strip, and the side end of the drive wedge is machined with a first pressing inclined surface 3513. The first telescopic source 3511 is used to drive the first pressing slide 3512 to slide perpendicular to the transfer direction. In this embodiment, the first telescopic source 3511 is a cylinder, and the piston rod of the first telescopic source 3511 is fixedly connected to the connecting strip, and the telescopic direction is perpendicular to the transfer direction. In other embodiments, the first telescopic source 3511 can also be a linear drive element such as an electric push rod or a hydraulic cylinder.

[0041] refer to Figure 4 , Figure 5 and Figure 6 The front first lifting unit 351 and the rear first lifting unit 352 each drive a first linkage column 311. When the first telescopic source 3511 drives the first downward sliding carriage 3512 to slide, the first downward pressing inclined surface 3513 presses against the first linkage column 311, converting the horizontal driving force into a vertical downward force through the inclined surface. This drives the first push-pull pin 31 to overcome the elasticity of the first force-applying member 33 and descend, causing the first push-pull pin 31 to disengage from the first pin hole 110. When the first telescopic source 3511 retracts and the first downward pressing inclined surface 3513 disengages from the first linkage column 311, the first force-applying member 33 drives the first push-pull pin 31 to automatically spring back to its original position.

[0042] The rear-mounted first lifting unit 352 is fixedly disposed on the support base 2 at one end near the initial position of the first push-pull pin 31. It controls the descent of the first push-pull pin 31 during the initial receiving phase when the probe 100 enters the support base 2. Specifically, when the probe 100 is fed onto the support base 2 by the upstream mechanism, the first push-pull pin 31 is positioned directly below the first pin hole 110. Under the action of the first force-applying component 33, the first push-pull pin 31 automatically pops out and inserts into the first pin hole 110. The front-mounted first lifting unit 351 is fixedly disposed on the support base 2 at one end near the preset stroke position. It controls the descent of the first push-pull pin 31 after it pushes the probe 100 to the preset stroke position, thereby disengaging it from the first pin hole 110. This separates the first pushing module 3 from the probe 100, preparing for the subsequent pushing of the second pushing module 4.

[0043] refer to Figure 5 and Figure 6 A buffer unit 7 is also fixed on the support base 2. The buffer unit 7 is used to abut against the first downward sliding carriage 3512, limiting the sliding stroke of the first downward sliding carriage 3512 and providing cushioning. In this embodiment, the buffer unit 7 is a hydraulic buffer or an elastic stop. The buffer unit 7 can prevent the first downward sliding carriage 3512 from overshooting due to the inertia of the first telescopic source 3511, avoiding excessive downward pressure on the first linkage column 311, and protecting the first push-pull pin 31 and related structures. In this embodiment, two buffer units 7 are arranged on both sides of each first downward sliding carriage 3512; specifically, one buffer unit 7 is located on the side of the connecting strip, and the other buffer unit 7 is located on the side of the drive wedge, thereby limiting the horizontal sliding range of the first downward sliding carriage 3512.

[0044] refer to Figure 4 , Figure 7 and Figure 8 The second push module 4 includes a second push-pull pin 41, a second slide block 42, a second force application component 43, a second linear drive assembly 44, and a second lifting drive assembly 45.

[0045] refer to Figure 4 The probe card 100 is provided with two second pin holes 120, which are collinearly arranged on the probe card 100. Two second push-pull pins 41 are respectively inserted into the two second pin holes 120 to push the probe card 100 with a dual-point support, thereby improving the stability during the pushing process.

[0046] refer to Figure 4The first pin hole 110 and the second pin hole 120 are spaced apart along the length of the support slide rail 21. In this embodiment, both the first pin hole 110 and the second pin hole 120 are circular holes. The first pin hole 110 and the second pin hole 120 located in different end regions of the probe 100 form a set of insertion holes. In this embodiment, one set of insertion holes is provided. In other embodiments, two sets of insertion holes may be symmetrically arranged to facilitate smooth cooperation between the probe 100 and the support mechanism when the probe 100 is fed in different directions.

[0047] refer to Figure 7 and Figure 8 The second push-pull pin 41 is equipped with a second slide block 42 and a second force-applying component 43. The second push-pull pin 41 is vertically slidably installed within the second slide block 42 via a second slide groove. The second force-applying component 43 is located within the second slide block 42 and is used to drive the second push-pull pin 41 upward to maintain the default upward insertion ready state. The second force-applying component 43 can also be a compression spring, a tension spring, or an elastic rubber block, etc., and is connected between the second push-pull pin 41 and the bottom wall of the second slide groove. A second detection unit is fixedly connected to one side of the second slide block 42, and the second detection unit is used to detect the lifting and lowering state of the second push-pull pin 41. Specifically, a second measuring plate 412 is fixed on the side wall of the second push-pull pin 41, and a guide groove for vertical sliding of the second measuring plate 412 is provided on the side wall of the second slide block 42; the second detection unit selects a second photoelectric sensor 452, and one end of the second measuring plate 412 passes through the guide groove and is located at the detection port of the second photoelectric sensor 452.

[0048] refer to Figure 8 The second linear drive assembly 44 is used to drive the second push-pull pin 41 to slide along the length direction of the support slide rail 21. In this embodiment, the second linear drive assembly 44 includes a second slide table 441, which is slidably disposed on the support base 2 along the transfer direction. Two second slide blocks 42 are installed on the corresponding second slide table 441, and each is driven by a second linear drive assembly 44 to move synchronously. The second slide table 441 is a long strip plate structure, and the second slide blocks 42 are installed at the ends of the corresponding second slide table 441 to further extend the pushing distance. In this embodiment, the second linear drive assembly 44 also adopts a cylinder-driven linear guide slide structure. The second slide table 441 is fixedly installed on the sliding end of the second linear drive assembly 44 by bolts. In other embodiments, the driving method of the second linear drive assembly 44 can also adopt a servo motor-driven linear slide module or a synchronous belt module, etc.

[0049] refer to Figure 4 and Figure 7The second lifting drive assembly 45 includes a second lifting unit 451. Unlike the first lifting drive assembly 35, the second lifting unit 451 is mounted on the second slide table 441 and slides along the transfer direction together with the second push-pull pin 41. This design allows the second lifting unit 451 to control the lifting of the second push-pull pin 41 throughout its entire pushing stroke, without the need for multiple fixed lifting units along the stroke line.

[0050] The second lifting unit 451 includes a second telescopic source 4511 and a second pressing slide 4512. A second pressing slope 4513 is machined on the side wall of the second pressing slide 4512 near the second slide block 42. The second telescopic source 4511 drives the second pressing slide 4512 to slide perpendicular to the transfer direction. A second linkage column 411 is fixed on the side wall of the second push-pull pin 41. A second oblong hole is provided on the side wall of the second slide block 42 for the second linkage column 411 to slide vertically. One end of the second linkage column 411 protrudes horizontally from the second oblong hole. The second pressing slope 4513 presses against the second linkage column 411 to drive the second push-pull pin 41 to descend and disengage from the second pin hole 120.

[0051] refer to Figure 8 The second slide 441 is also provided with a limiting unit. The limiting unit includes two limiting seats 10 disposed opposite to each other. The second pressing slide 4512 includes an outer edge strip 4514 protruding along the direction perpendicular to the transfer direction, and the outer edge strip 4514 is located between the two limiting seats 10. The two limiting seats 10 form a bidirectional limiting on the outer edge strip 4514, limiting the maximum sliding stroke of the second pressing slide 4512 in the direction perpendicular to the transfer direction. In this embodiment, the limiting seat 10 can be in the form of an adjusting bolt or a fixing block.

[0052] In this embodiment, each of the two second push-pull pins 41 is equipped with an independent second lifting unit 451 to achieve independent lifting control of the two second push-pull pins 41.

[0053] refer to Figure 3 and Figure 9 The support base 2 is also equipped with a positioning unit 5. The positioning unit 5 is located on the support base 2 in an area close to the preset travel position, and is used to position the probe 100 in place when the first push module 3 pushes the probe 100 to the preset travel position.

[0054] The positioning unit 5 includes a telescopic drive source 51 and a positioning block 52 driven by the telescopic drive source 51. In this embodiment, the telescopic drive source 51 is a cylinder, and the positioning block 52 is fixed to the end of the piston rod of the cylinder. When the probe 100 reaches a preset stroke position, the telescopic drive source 51 drives the positioning block 52 to extend. A positioning groove 140 is provided on the side wall of the probe 100 for the positioning block 52 to be inserted into. The insertion of the positioning block 52 into the positioning groove 140 limits the position of the probe 100.

[0055] The positioning block 52 is tapered at one end facing the probe 100, and has a trapezoidal cross-section. The tapered guide surface allows the positioning block 52 to guide the probe 100 into the correct positioning position even if there is a slight positional deviation during the extension process, thus improving the fault tolerance of the positioning.

[0056] In this embodiment, two positioning units 5 are provided. The two positioning units are symmetrically fixed on both sides of the support base 2, and the probe card 100 is clamped and positioned from both sides at the same time, thereby further improving the positioning accuracy.

[0057] refer to Figure 2 and Figure 4 A barcode scanning unit 6 is provided above the support base 2. In this embodiment, the barcode scanning unit 6 is a barcode scanner, installed on the top frame 23 above the support base 2, with the scanning window of the barcode scanning unit 6 facing downwards and aligned with the moving path of the probe 100 on the support slide rail 21. An identification code 130 is affixed to the probe 100. In this embodiment, the identification code 130 is a QR code, located on the upper surface of the probe 100. When the probe 100 moves along the transfer direction on the support base 2 and passes directly below the barcode scanning unit 6, the barcode scanning unit 6 automatically scans the identification code 130 on the probe 100, compares the obtained information with preset information, and determines whether the incoming material is correct. If the identification result shows that the current probe 100 is not the specified incoming material, the control system executes a material return action, and the first push module 3 or the second push module 4 pushes the probe 100 back to its initial position. In other embodiments, the identification code 130 may also be a one-dimensional barcode or an RFID tag, and correspondingly, the barcode scanning and identification unit 6 may be a barcode scanner or an RFID reader / writer.

[0058] refer to Figure 2 , Figure 5 and Figure 7Emergency stop modules 8 are also fixed on both sides of the support base 2. The emergency stop modules 8 are electrically connected to the first linear drive assembly 34, the first telescopic source 3511, the second linear drive assembly 44, the second telescopic source 4511, the telescopic drive source 51, the lifting frame 11, and the translation assembly 12 on the support base 2. When operators are performing maintenance or repairs inside the machine, if abnormal movement occurs, the operator can trigger the emergency stop module 8 nearby. The emergency stop module 8 immediately cuts off the power supply to all drive components, causing all moving parts to stop immediately, ensuring personnel safety.

[0059] In this embodiment, the emergency stop module 8 includes a first emergency stop button 81 and a second emergency stop button 82 located at different positions on the support base 2. The first emergency stop button 81 and the second emergency stop button 82 are distributed at both ends or both sides of the support base 2 to ensure that the operator can reach the emergency stop button from whichever side they enter the machine.

[0060] The implementation principle of the detector transfer device in Embodiment 1 of this application is as follows: The first telescopic source 3511 of the rear-mounted first lifting unit 352 is activated, driving the first downward sliding carriage 3512 within the rear-mounted first lifting unit 352 to slide. The first downward inclined surface 3513 presses against the first linkage column 311, driving the first push-pull pin 31 to descend. When the upstream mechanism sends the assembled probe card 100 and wafer onto the support base 2 of the transfer machine, the probe card 100 slides in along the support slide rail 21 and is in place. Then, through the first telescopic source 3511, the first downward sliding carriage 3512 is driven to slide, causing the first downward inclined surface 3513 to disengage from the first linkage column 311. At this time, the first push-pull pin 31 rises and resets under the elastic restoring force of the first force application component 33, inserting into the corresponding first pin hole 110 on the probe card 100, thus realizing the engagement of the first push module 3 and the probe card 100.

[0061] Next, the first push-pull stage begins. The first linear drive assembly 34 is activated, driving the first slide block 32 and its first push-pull pin 31 to slide horizontally along the transfer direction. Through the insertion and engagement of the first push-pull pin 31 with the first pin hole 110, the probe card 100 is pushed along the support slide rail 21 to the preset stroke position. During the pushing process, the probe card 100 passes under the barcode scanning and identification unit 6. The barcode scanning and identification unit 6 automatically scans the identification code 130 on the probe card 100 and performs incoming material identification. If the identification result is unqualified, the control system controls the first linear drive assembly 34 to move in the opposite direction, pushing the probe card 100 back to the initial position to remove the material. If the identification result is qualified, the pushing continues.

[0062] When the probe 100 is pushed to the preset travel position, the telescopic drive source 51 of the positioning unit 5 is activated, driving the positioning block 52 to extend. The positioning block 52 is inserted into the positioning groove 140 of the probe 100 to position the probe 100 in place and confirm that the probe 100 has accurately reached the preset travel position.

[0063] After positioning confirmation, the switching phase begins. The first telescopic source 3511 of the front-mounted first lifting unit 351 is activated, driving the first downward sliding carriage 3512 to slide. The first downward inclined surface 3513 presses against the first linkage column 311, driving the first push-pull pin 31 to descend against the elastic force of the first force-applying member 33, causing the first push-pull pin 31 to disengage from the first pin hole 110. The first linear drive assembly 34 then drives the first push-pull pin 31 to retract back to its initial position. During the switching phase, the second lifting unit 451 drives the two second push-pull pins 41 to descend, aligning the second push-pull pins 41 with the second pin holes 120.

[0064] Subsequently, in the second push-pull stage, the second lifting unit 451 in the second lifting drive assembly 45 drives the second downward pressure ramp 4513 to disengage from the second linkage column 411. The two second push-pull pins 41 will remain in an upward state under the elastic restoring force of their respective second force-applying components 43, automatically inserting into the two corresponding second pin holes 120 of the probe 100. The second linear drive assembly 44 is activated, driving the second slide table 441 to continue sliding along the transfer direction. Through the insertion and engagement of the two second push-pull pins 41 with the two second pin holes 120, the probe 100 is pushed from the preset stroke position to the target station (the inside of the testing machine or cooling chamber). Because the two second push-pull pins 41 are compact in size and do not require a complex speed-multiplying mechanism, they can penetrate deep into the internal space of the testing machine or cooling chamber without interfering with its structural components.

[0065] After the probe 100 reaches the target workstation, the second telescopic source 4511 of the second lifting unit 451 is activated, driving the second downward slide 4512 to slide. The second downward inclined surface 4513 presses against the second linkage column 411, driving the two second push-pull pins 41 to descend and disengage from the two second pin holes 120. The second linear drive assembly 44 then drives the second slide 441 to reverse back to the initial position, completing one complete transfer process.

[0066] Example 2: Embodiment 2 of this application provides a probe card transfer method for testing electrical signals on power semiconductor device wafers, which is applied to the probe card transfer device described in Embodiment 1.

[0067] The probe transfer method in this embodiment includes the following steps: S1. Receive the probe card onto the carrier mechanism.

[0068] The upstream mechanism assembles the probe card 100 with the wafer and sends it onto the support base 2. The probe card 100 slides along the support slide rail 21 and is positioned in its initial position. At this time, the rear first lifting unit 352 pre-drives the first push-pull pin 31 to a lowering avoidance state. After the probe card 100 is in place, the front first lifting unit 351 releases, and the first push-pull pin 31 rises and resets under the elastic restoring force of the first force application member 33, inserting into the first pin hole 110, thus completing the engagement between the first push module 3 and the probe card 100.

[0069] S2. Execute the first push-pull stage, insert the probe 100 through the first push-pull pin 31, and push the probe 100 to the preset stroke position along the transfer direction.

[0070] The first linear drive assembly 34 is activated, driving the first push-pull pin 31 to move horizontally along the length of the support slide rail 21, pushing the probe 100 towards the preset travel position. During the pushing process, the probe 100 passes under the barcode scanning unit 6, which scans the identification code 130 and compares it with the preset information; if they do not match, the first linear drive assembly 34 reverses the drive to perform material removal; if they match, the pushing continues. After the probe 100 reaches the preset travel position, the telescopic drive source 51 of the positioning unit 5 drives the positioning block 52 to extend, causing the positioning block 52 to insert into the positioning groove 140 of the probe 100, completing the positioning confirmation.

[0071] S3. Switch to the second push-pull stage, so that the first push-pull pin 31 is disengaged from the probe 100 and is connected to the probe 100 through the second push-pull pin 41, and continue to push the probe 100 to the target station along the transfer direction.

[0072] After positioning confirmation, the first telescopic source 3511 of the front-mounted first lifting unit 351 drives the first downward slide 3512 to slide, and the first downward inclined surface 3513 presses against the first linkage column 311, forcing the first push-pull pin 31 to descend and disengage from the first pin hole 110. The first linear drive assembly 34 drives the first push-pull pin 31 to retract to the initial position. At the same time, the second lifting unit 451 releases the pressure of the second downward slide 4512 on the second linkage column 411, and the two second push-pull pins 41 spring up under the action of their respective second force-applying components 43, respectively inserting into the two corresponding second pin holes 120 on the probe 100. Subsequently, the second linear drive assembly 44 is activated, driving the second slide 441 to slide along the transfer direction, and through the two second push-pull pins 41, the probe 100 is pushed from the preset stroke position to the target station such as the testing machine or cooling chamber.

[0073] S4. Disengage the second push-pull pin 41 from the probe 100 and drive the second push-pull pin 41 to reset.

[0074] After the probe 100 reaches the target workstation, the second telescopic source 4511 of the second lifting unit 451 is activated, driving the second downward slide 4512 to slide. The second downward inclined surface 4513 presses against the second linkage column 411, and the two second push-pull pins 41 descend and disengage from the second pin holes 120. The second linear drive assembly 44 drives the second slide table 441 to return to the initial position in the opposite direction, completing one transfer.

[0075] When the probe card 100 needs to be retrieved, the reverse operation of the above steps is performed: the second linear drive component 44 first drives the second push-pull pin 41 to move to the target position and insert it into the second pin hole 120, pulling the probe card 100 back to the preset stroke position and then disengaging it; then the first push-pull pin 31 is inserted into the first pin hole 110, pulling the probe card 100 back to the initial position, completing the reciprocating transfer.

[0076] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A probe card transfer device for testing electrical signals on power semiconductor device wafers, characterized in that, The system includes a frame (1) and a support mechanism slidably mounted on the frame (1), the support mechanism comprising: The support base (2) is provided with a support slide rail (21) for the probe (100) to slide. The first push module (3) is located on the support base (2) and includes a first push-pull pin (31), a first linear drive assembly (34) and a first lifting drive assembly (35). The first linear drive assembly (34) is used to drive the first push-pull pin (31) to slide along the length direction of the support slide rail (21). The probe (100) is provided with a first pin hole (110) for the first push-pull pin (31) to be inserted into. The first lifting drive assembly (35) is used to drive the first push-pull pin (31) to be lifted or lowered, so that the first push-pull pin (31) can be inserted into or disengaged from the first pin hole (110). The second push module (4) is located on the support base (2) and includes a second push-pull pin (41), a second linear drive assembly (44), and a second lifting drive assembly (45). The second linear drive assembly (44) is used to drive the second push-pull pin (41) to slide along the length direction of the support slide rail (21). The probe (100) is provided with a second pin hole (120) for the second push-pull pin (41) to be inserted into. The second lifting drive assembly (45) is used to drive the second push-pull pin (41) to rise and fall, so that the second push-pull pin (41) can be inserted into or disengaged from the second pin hole (120). The first pin hole (110) and the second pin hole (120) are spaced apart along the length direction of the support slide rail (21). The first push module (3) and the second push module (4) are configured to switch the transport probe (100) sequentially along the length direction of the transport slide rail (21).

2. The probe card transfer device for testing electrical signals on power semiconductor device wafers according to claim 1, characterized in that, The first push module (3) further includes a first slide (32), on which a first force-applying component (33) is provided. The first push-pull pin (31) slides vertically on the first slide (32). The first force-applying component (33) is used to drive the first push-pull pin (31) to slide upward. The first lifting drive assembly (35) is used to drive the first push-pull pin (31) to descend. The second push module (4) further includes a second slide (42), on which a second force-applying component (43) is provided. The second push-pull pin (41) slides vertically on the second slide (42). The second force-applying component (43) is used to drive the second push-pull pin (41) to slide upward. The second lifting drive assembly (45) is used to drive the second push-pull pin (41) to descend.

3. The probe card transfer device for testing electrical signals on power semiconductor device wafers according to claim 1, characterized in that, The first lifting drive assembly (35) includes two first lifting units spaced apart along the transfer direction; The first lifting unit includes a first telescopic source (3511) and a first pressing slide (3512). The first pressing slide (3512) is provided with a first pressing inclined surface (3513). The first telescopic source (3511) is used to drive the first pressing slide (3512) to slide perpendicular to the transfer direction. The first push-pull pin (31) is connected to a first linkage column (311), and the first downward pressing slope (3513) is used to press against the first linkage column (311) to drive the first push-pull pin (31) to descend.

4. The probe card transfer device for testing electrical signals on power semiconductor device wafers according to claim 2, characterized in that, The second lifting drive assembly (45) includes a second lifting unit (451), and the second linear drive assembly (44) is used to drive the second lifting unit (451) to slide together with the second push-pull pin (41); The second lifting unit (451) includes a second telescopic source (4511) and a second pressing slide (4512). The second pressing slide (4512) is provided with a second pressing inclined surface (4513). The second telescopic source (4511) is used to drive the second pressing slide (4512) to slide perpendicular to the transfer direction. The second push-pull pin (41) is connected to a second linkage column (411), and the second downward pressure slope (4513) is used to press against the second linkage column (411) to drive the second push-pull pin (41) to descend.

5. The probe card transfer device for testing electrical signals on power semiconductor device wafers according to claim 1, characterized in that, The bearing mechanism is also provided with a positioning unit (5), which includes a telescopic drive source (51) and a positioning block (52) driven by the telescopic drive source (51). The positioning block (52) is configured to extend when the first push module (3) pushes the probe card (100) to a preset travel position, so as to position the probe card (100) in place.

6. The probe card transfer device for testing electrical signals on power semiconductor device wafers according to claim 5, characterized in that, The positioning block (52) is tapered toward the end of the probe (100).

7. The probe card transfer device for testing electrical signals on power semiconductor device wafers according to claim 1, characterized in that, It also includes a barcode scanning and identification unit (6), which is located above the support base (2) and is used to scan the identification information on the probe card (100) to identify whether the probe card (100) is the designated incoming material.

8. The probe card transfer device for testing electrical signals on power semiconductor device wafers according to claim 3, characterized in that, It also includes a buffer unit (7) for abutting against the first pressure carriage (3512).

9. The probe card transfer device for testing electrical signals on power semiconductor device wafers according to claim 4, characterized in that, The second linear drive assembly (44) further includes a second slide (441), which is slidably disposed on the support base (2) along the transfer direction, and a limit unit is provided on the second slide (441); The limiting unit includes two limiting seats (10) arranged opposite to each other, and the second pressing slide (4512) includes an outer edge strip (4514) located between the two limiting seats (10).

10. A probe transfer method for testing electrical signals on power semiconductor device wafers, applied to the probe transfer device according to any one of claims 1 to 9, characterized in that, Includes the following steps: S1. Receive the probe card (100) onto the carrying mechanism; S2. Execute the first push-pull stage, insert the probe (100) through the first push-pull pin (31), and push the probe (100) to the preset stroke position along the transfer direction; S3. Switch to the second push-pull stage, so that the first push-pull pin (31) disengages from the probe (100) and is connected to the probe (100) through the second push-pull pin (41), and continue to push the probe (100) to the target station along the transfer direction; S4. Disengage the second push-pull pin (41) from the probe (100) and drive the second push-pull pin (41) to reset.

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