Printed board testing apparatus and printed board testing method

Abstract

The application is suitable for the field of electronic technology, and provides a printed board testing device and method, wherein the device comprises: a mounting substrate provided with a positioning and locking structure matched with a printed board to be tested; a pin test assembly, which comprises an odd-row pin test assembly and an even-row pin test assembly, the odd-row pin test assembly is used for corresponding matching with odd-row or column pads on the printed board to be tested, the even-row pin test assembly is used for corresponding matching with even-row or column pads on the printed board to be tested, and the two are independently mounted on the mounting substrate; the odd-row pin test assembly and the even-row pin test assembly comprise a pin connector and an adapter connector; one end of the pin connector is electrically connected with the adapter connector through the mounting substrate, and the other end of the pin connector is used for elastically and pressingly contacting the pads of the printed board to be tested; and the adapter connector is used for converting a signal channel of the pin into a standard test interface.

Description

Technical Field

[0001] This application belongs to the field of electronic technology, and in particular relates to a printed circuit board testing device and a printed circuit board testing method. Background Technology

[0002] With the rapid development of microelectronics technology towards high density and high integration, the component layout on printed circuit boards (PCBs) is becoming increasingly compact, and the spacing between signal channels is constantly shrinking. Currently, the spacing between RF channels on some RF PCBs has been reduced to 2.4mm, and the spacing between low-frequency signal channels has even reached 0.8mm. When performing performance testing on these high-density pad channel PCBs, it is necessary to interconnect each signal channel on the PCB with the test equipment and convert the signal channels to standard test interfaces to achieve overall system testing of all functional components on the PCB.

[0003] In related technologies, test equipment typically uses probes or coaxial connectors to contact the printed circuit board pads to achieve signal transmission. However, since the spacing between RF channels is smaller than the installation space required by the probes and coaxial connectors, interference occurs between components during testing, making it impossible to complete the arrangement of signal and ground channels. Summary of the Invention

[0004] This application provides a printed circuit board testing device and a printed circuit board testing method, which can solve the technical problems in related technologies, such as limited testing space and interference between components during testing, which makes it impossible to complete the arrangement of signal channels and ground channels.

[0005] A first aspect of this application provides a printed circuit board testing apparatus for testing a printed circuit board under test with a high-density matrix layout of pad channels, including: The mounting substrate is equipped with a positioning and locking structure that matches the printed circuit board under test. The button test assembly includes an odd-row button test assembly and an even-row button test assembly. The odd-row button test assembly is used to match the pads in the odd-row or column of the printed circuit board under test, and the even-row button test assembly is used to match the pads in the even-row or column of the printed circuit board under test. The odd-row button test assembly and the even-row button test assembly are independently mounted on the mounting substrate. The odd-numbered pile button test assembly and the even-numbered pile button test assembly include a pile button assembly and an adapter connector; One end of the button-fitting assembly is electrically connected to the adapter connector via a mounting base plate, and the other end of the button-fitting assembly is used for elastic pressing contact with the pads of the printed circuit board under test. Adapter connectors are used to convert the signal channels of snap fasteners into standard test interfaces.

[0006] The printed circuit board testing device provided in this application provides odd-numbered row button test components and even-numbered row button test components, which correspond to and match the odd-numbered rows or columns and even-numbered rows or columns of pads on the printed circuit board under test, respectively. The high-density matrix-arranged pads are divided into two groups for independent testing. After splitting, the equivalent spacing of the RF units in a single group of components is expanded to twice the original spacing. This can reserve sufficient assembly space for button assemblies and adapter connectors, solve the problem of component interference in the area of ​​extremely small-pitch pads, and help to achieve reliable interconnection and signal transmission between the testing device and the high-density pads.

[0007] Optionally, the button assembly includes a first outer conductor, a high-frequency insulating dielectric body, and a button contact. The first outer conductor is connected to the mounting substrate, the high-frequency insulating dielectric body is fixedly connected to the first outer conductor, and the contact is placed inside the high-frequency insulating dielectric body with one end elastically pressed into contact with the pad of the printed circuit board under test.

[0008] By adopting the above technical solution, the snap-fit ​​assembly consists of a first outer conductor, a high-frequency insulating dielectric, and snap-fit ​​contacts. The first outer conductor is connected to the mounting substrate, the high-frequency insulating dielectric is fixed inside the first outer conductor, and the contacts are placed inside the dielectric with one end extending out to elastically press against the pads. This allows for a modular integrated structure of the snap-fit ​​assembly. The first outer conductor serves as both structural support and a grounding channel, the high-frequency insulating dielectric ensures insulation and impedance matching between the signal channel and the grounding channel, and the contacts provide elastic pressing functionality. The organic cooperation of these three components enables the snap-fit ​​assembly to be mounted on the mounting substrate in a compact structure, meeting the space constraints of high-density scenarios.

[0009] Optionally, the hair button contact includes a hair button and a protective cover mounted on the elastic end of the hair button. The diameter of the hair button ranges from 0.3 mm to 0.5 mm, the length ranges from 2.5 mm to 3 mm, the axial elastic float is 0.5 mm, and the axial tolerance is 0.3 mm.

[0010] By adopting the above technical solution, the extremely small diameter hair button can be adapted to the low-frequency channel with a spacing of only 0.8mm and the RF channel with a spacing of 2.4mm, meeting the size requirements of high-density pads; the elastic float of 0.5mm and the axial tolerance of 0.3mm can compensate for the height unevenness caused by warping and flatness deviation of large printed circuit boards, ensuring that each pad can achieve reliable pressing contact with the corresponding hair button; the protective cap directly contacts the pad, avoiding scratches or indentations on the pad by the hair button body.

[0011] Optionally, the adapter connector is an SSMP adapter plug, which includes a second outer conductor, an inner conductor, a dielectric body, and a sleeve; The dielectric body is disposed inside the second outer conductor, the inner conductor passes through the dielectric body and one end abuts against the button of the button assembly, and the sleeve is fitted onto one end of the second outer conductor and connected to the grounding channel of the first outer conductor.

[0012] By adopting the above technical solution, the inner conductor penetrates the dielectric body and abuts against the button at one end, enabling the transmission of radio frequency signals from the button to the SSMP interface; the sleeve is connected to the grounding channel of the first outer conductor, ensuring the conduction of the grounding loop; the dielectric body is placed inside the second outer conductor, ensuring coaxial positioning and impedance matching between the inner conductor and the second outer conductor. Thus, one end of the test device is a flexible button end for contacting the printed circuit board pads, and the other end is an SSMP(J) standard interface for connecting test instruments, realizing a complete signal link transition from high-density pads to a standard test interface.

[0013] Optionally, the first outer conductor includes an interference section and a guide section. The guide section is used to guide the first outer conductor into a first mounting hole in the mounting substrate, and the interference section is interference-fitted with the first mounting hole in the mounting substrate.

[0014] By adopting the above technical solution, a guide section and an interference section are provided on the first outer conductor, enabling rapid and reliable fixing between the first outer conductor and the mounting substrate. During assembly, the guide section guides the first outer conductor smoothly into the first mounting hole on the mounting substrate, preventing assembly misalignment and damage to components. The interference section achieves a fixed connection with the mounting hole through an interference fit, facilitating a fixed connection between the first outer conductor and the mounting substrate through interference force, making the installation process simple and quick.

[0015] Optionally, the first outer conductor is provided with a limiting block, which is configured to restrict the rotation of the first outer conductor relative to the mounting substrate.

[0016] By adopting the above technical solution, setting a limiting block on the first outer conductor can restrict the rotational freedom of the first outer conductor relative to the mounting substrate, prevent the first outer conductor from rotating relative to the mounting substrate, and help ensure the positional accuracy of the matrix arrangement channel and the reliability of signal transmission.

[0017] Optionally, the high-frequency insulating dielectric body contains several circular channels arranged in a matrix, and the radio frequency channels within the circular channels have 50-ohm impedance matching.

[0018] By adopting the above technical solution, and by setting several circular channels arranged in a matrix within the high-frequency insulating dielectric, and limiting the impedance matching of the radio frequency channels to 50 ohms, it is helpful to achieve high-quality transmission of high-frequency signals.

[0019] Optionally, the positioning and locking structure includes a locking hole provided on the mounting base plate and a locking screw that mates with the locking hole; The printed circuit board testing device also includes stepped pads, which are set at the locking holes to ensure that the screw heads of adjacent locking screws are located at different height planes.

[0020] By adopting the above technical solution, the test device and the printed circuit board are locked and fixed by setting locking holes and locking screws on the mounting substrate. Furthermore, by setting stepped spacers so that the screw heads of adjacent locking screws are located at different height planes, the problem of screw head interference caused by the small center distance of the locking holes on the printed circuit board can be avoided. The stepped spacers, by staggering the adjacent screw heads in the height direction, allow each screw to work independently in its own height plane, avoiding installation conflicts caused by the screw head diameter being larger than the hole spacing in a limited planar space, and achieving reliable locking in a compact space.

[0021] Optionally, the pads of the printed circuit board under test adopt a nine-grid matrix RF unit layout, with the central pad of the nine-grid as the RF channel and the surrounding pads as the grounding channel; Odd-numbered button-shaped test components are used to test all odd-numbered rows or columns of 9x9 RF units, while even-numbered button-shaped test components are used to test all even-numbered rows or columns of 9x9 RF units.

[0022] By adopting the above technical solution, the pads of the printed circuit board under test are set as a nine-square matrix RF unit layout (the central pad is the RF channel and the surrounding pads are the ground channels). Odd-numbered row button test components are used to match and test all odd-numbered row or column nine-square units, and even-numbered row button test components are used to match and test all even-numbered row or column nine-square units. In the nine-square layout, after dividing the number of rows of RF channel units into odd and even groups, the spacing between adjacent RF channel units in the same group is doubled, which can provide space for the installation of button assemblies. At the same time, the ground pads around the nine-square grid also obtain sufficient arrangement space after grouping, taking into account both RF performance and structural feasibility, and ensuring the impedance matching and grounding integrity of RF channels in high-density scenarios.

[0023] A second aspect of this application provides a printed circuit board (PCB) testing method, which uses the PCB testing apparatus described in any of the above claims to test a PCB with a high-density matrix layout of pad channels, including: Select an odd-numbered button test assembly and align and bond the mounting substrate with the odd-numbered button test assembly to the printed circuit board under test using a positioning and locking structure. The mounting substrate and the printed circuit board under test are locked and fixed by the positioning and locking structure, so that the button assembly of the odd row of button test components is elastically pressed into contact with the pads of the odd row or column on the printed circuit board under test, thereby completing the signal transfer and testing of the pads of the odd row or column. Loosen the positioning locking structure and remove the odd-numbered pile button test assembly; Select an even-numbered button test assembly and align and bond the mounting substrate with the even-numbered button test assembly to the printed circuit board under test using a positioning and locking structure. The mounting substrate and the printed circuit board under test are locked and fixed by the positioning and locking structure, so that the button fastener of the even-numbered row of button test components is elastically pressed into contact with the even-numbered row or column of pads on the printed circuit board under test, thereby completing the signal transfer and testing of the even-numbered row or column of pads.

[0024] The printed circuit board testing method provided in this application divides the high-density matrix-arranged pads into two groups for independent testing by setting up odd-row and even-row button test components. Within each group, the equivalent spacing of the RF units is increased to twice the original spacing, providing ample assembly space for the button assembly and adapter connectors, effectively solving the component interference problem in extremely small-pitch pad areas. During testing, the odd-row components are first selected to complete the testing of the odd-row or column pads. After loosening the locking structure, the even-row components are removed and replaced to complete the testing of the even-row or column pads. These two independent tests cover all pads, overcoming the space limitations of small pitch while avoiding the excessive structural complexity caused by accommodating all contacts at once, ensuring the integrity and reliability of the test. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a printed circuit board testing device provided in one embodiment of this application; Figure 2 This is a schematic diagram of the structure of a printed circuit board testing device provided in one embodiment of this application; Figure 3 This is a schematic diagram of the back of a printed circuit board testing device provided in one embodiment of this application; Figure 4 This is a schematic diagram of the structure of a mounting substrate provided in one embodiment of this application; Figure 5 This is a schematic diagram of the structure of a button testing component provided in one embodiment of this application; Figure 6 This is a cross-sectional structural schematic diagram of a bobbin fastener provided in an embodiment of this application; Figure 7 This is a cross-sectional structural schematic diagram of an SSMP adapter provided in an embodiment of this application; Figure 8This is a schematic diagram of the structure of the first outer conductor provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a stepped pad block provided in an embodiment of this application; Figure 10 This is a schematic flowchart of a printed circuit board testing method provided in one embodiment of this application. Detailed Implementation

[0027] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0028] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] Please see Figures 1 to 9 This application provides a printed circuit board testing device 100 for testing a printed circuit board under test with a high-density matrix layout of pad channels, including a mounting substrate 10 and a button test assembly 20.

[0032] like Figures 1 to 4As shown, the mounting base 10 has a plate-like structure and serves as the supporting structure for the button test assembly 20, used to support and fix the odd-numbered button test assemblies 21 and the even-numbered button test assemblies 22. The mounting base 10 is equipped with a positioning and locking structure that matches the printed circuit board under test (PCB). This positioning and locking structure enables rapid positioning and retraction fixation between the mounting base 10 and the PCB. Optionally, the positioning and locking structure includes four M2.5 internal threaded holes and positioning holes. After the mounting base 10 is mated with the PCB, locking screws 112 are used to lock it into the internal threaded holes, compressing the button test assembly 20 into place and achieving reliable contact with the pads. The positioning holes cooperate with positioning pins on the PCB to achieve rapid positioning, ensuring accurate positioning of the button test assembly 20 and the pads on the PCB. Similarly, positioning pins can be provided on the mounting base 10, and positioning holes can be provided on the PCB to achieve rapid positioning.

[0033] like Figure 1 and Figure 2 As shown, the button test assembly 20 includes odd-row button test assemblies 21 and even-row button test assemblies 22. The pads of the printed circuit board under test adopt a nine-grid matrix RF unit layout, with the central pad of the nine-grid as the RF channel and the perimeter as the ground channel. The number of rows or columns of the RF channel units are divided into odd and even groups. The odd-row button test assembly 21 is used to match the odd-row or column pads on the printed circuit board under test, and the even-row button test assembly 22 is used to match the even-row or column pads on the printed circuit board under test. The odd-row button test assembly 21 and the even-row button test assembly 22 are independently mounted on the mounting substrate 10.

[0034] like Figures 1 to 6 As shown, the odd-numbered button test assembly 21 and the even-numbered button test assembly 22 have the same structure, both including a button assembly 23 and an adapter connector 24.

[0035] The button 2231 is electrically connected to the adapter connector 24. The other end of the button assembly 23 is an elastic end, which is used to elastically press and contact the pads of the printed circuit board under test.

[0036] like Figure 7 As shown, the adapter connector 24 is used to convert the signal channel of the button assembly 23 into a standard test interface. Optionally, the adapter connector 24 is an SSMP adapter plug 241, which includes a second outer conductor 2411, an inner conductor 2412, a dielectric body 2413, and a sleeve 2414.

[0037] The dielectric 2413 is disposed within the second outer conductor 2411, enabling coaxial positioning and impedance matching between the inner conductor 2412 and the second outer conductor 2411. The inner conductor 2412 penetrates the dielectric 2413, and one end abuts against the button 2231 of the button assembly 23, allowing the transmission of radio frequency signals from the button 2231 to the SSMP interface. The sleeve 2414 is fitted onto one end of the second outer conductor 2411 and connected to the grounding channel of the first outer conductor 231, enabling the conduction of the grounding loop. Thus, one end of the test device is the elastic end of the button 2231 for contact with the printed circuit board pads, and the other end is the SSMP(J) standard interface for connecting test instruments, realizing a complete signal link conversion from high-density pads to the standard test interface.

[0038] When using this testing device, first, select the corresponding button test assembly 20 (odd-numbered or even-numbered rows) based on the pad layout of the printed circuit board under test (PCB) and install it on the mounting substrate 10. Quickly align and attach the button assembly 23 to the PCB using the positioning pins or holes on the mounting substrate 10, ensuring that each pad in the corresponding row or column is aligned. Then, secure the mounting substrate 10 to the PCB using the locking screws 112, compressing the button assembly 2231 and elastically pressing it into contact with the pads, achieving reliable solderless interconnection. The signal is transmitted via the button assembly 23 to the adapter connector 24, converted to a standard interface, and then connected to an external testing instrument for testing. After testing, loosen the locking screws 112, remove the current test assembly, and repeat the above steps with another test assembly to complete the testing of all pads.

[0039] The printed circuit board testing device 100 provided in this application embodiment sets up odd-numbered row button test components 21 and even-numbered row button test components 22, which correspond to and match the odd-numbered rows or columns and even-numbered rows or columns of pads on the printed circuit board under test, respectively. The high-density matrix-arranged pads are divided into two groups for independent testing. After splitting, the equivalent spacing of the RF units in a single group of components is expanded to twice the original spacing. This can reserve sufficient assembly space for the button assembly 23 and the adapter connector 24, solve the problem of component interference in the extremely small spacing pad area, and help to achieve reliable interconnection and signal transmission between the testing device and the high-density pads.

[0040] like Figure 6 As shown, optionally, the button assembly 23 includes a first outer conductor 231, a high-frequency insulating dielectric 222, and a button contact 223. The first outer conductor 231 is connected to the mounting substrate 10, the high-frequency insulating dielectric 222 is fixedly connected to the first outer conductor 231, and the contact is placed inside the high-frequency insulating dielectric 222 with one end in elastic pressure contact with the pad of the printed circuit board to be tested.

[0041] The first outer conductor 231, serving as a structural support and a carrier for the grounding channel, is fixed to the mounting base plate 10 via an interference fit. For example... Figure 8 As shown, optionally, the first outer conductor 231 includes an interference fit 2211 and a guide fit 2212. The guide fit 2212 guides the first outer conductor 231 into the first mounting hole of the mounting substrate 10. The interference fit 2211 is interference-fitted with the first mounting hole of the mounting substrate 10. During assembly, the guide fit 2212 guides the first outer conductor 231 smoothly into the first mounting hole of the mounting substrate 10, preventing assembly misalignment and damage to components. The interference fit between the interference fit 2211 and the mounting hole achieves a fixed connection, facilitating the fixed connection between the first outer conductor 231 and the mounting substrate 10 through the interference force, making the installation process simple and quick.

[0042] The first outer conductor 231 has a matrix of grounding channels distributed on it, such as... Figure 8 As shown, optionally, the first outer conductor 231 is provided with a limiting block 2213, which is configured to restrict the rotation of the first outer conductor 231 relative to the mounting substrate 10. This can limit the rotational freedom of the first outer conductor 231 relative to the mounting substrate 10, prevent the first outer conductor 231 from rotating relative to the mounting substrate 10, and help ensure the positional accuracy of the matrix arrangement channels and the reliability of signal transmission.

[0043] like Figures 1 to 6 As shown, the high-frequency insulating dielectric 222 is press-fitted into the central channel mounting hole of the first outer conductor 231 via an interference fit. It has several circular channels arranged in a matrix to accommodate the button contact 223. The radio frequency channels within the circular channels have 50-ohm impedance matching to meet the high-frequency signal transmission performance requirements. Optionally, the high-frequency insulating dielectric 222 has a countersunk hole structure inside to fix the button 2231 and the protective cap.

[0044] The button contact 223 includes a button 2231 and a protective cap 2232 installed on the elastic end of the button 2231. The diameter of the button 2231 ranges from 0.3 mm to 0.5 mm, the length ranges from 2.5 mm to 3 mm, the axial elastic float is 0.5 mm, and the axial tolerance is 0.3 mm, which can accommodate large warpage and flatness deviations of the printed circuit board. The protective cap is installed on the elastic end of the button 2231, that is, the end facing the pad. The protective cap directly contacts the pad of the printed circuit board under test, which can prevent the button 2231 from directly contacting and damaging the pad.

[0045] By adopting the above technical solution, the snap-fit ​​assembly 23 is composed of a first outer conductor 231, a high-frequency insulating dielectric 222, and a snap-fit ​​contact 223. The first outer conductor 231 is connected to the mounting substrate 10, the high-frequency insulating dielectric 222 is fixed inside the first outer conductor 231, and the contact is placed inside the dielectric 2413 with one end extending out to elastically press against the pad. This achieves a modular integrated structure for the snap-fit ​​assembly 23. The first outer conductor 231 serves as both a structural support and a grounding channel, the high-frequency insulating dielectric 222 ensures insulation isolation and impedance matching between the signal channel and the grounding channel, and the contact provides elastic pressing functionality. The organic cooperation of these three components allows the snap-fit ​​assembly 23 to be installed on the mounting substrate 10 in a compact structure, meeting the space constraints in high-density scenarios.

[0046] The extremely small diameter fuzzy button 2231 can accommodate low-frequency channels with a pitch of only 0.8mm and RF channels with a pitch of 2.4mm, meeting the size requirements of high-density pads; the 0.5mm elastic float and 0.3mm axial tolerance can compensate for the height unevenness caused by warping and flatness deviations of large printed circuit boards, ensuring that each pad can achieve reliable press-fit contact with the corresponding fuzzy button 2231; the protective cap directly contacts the pad, which can prevent the fuzzy button 2231 body from scratching or indenting the pad.

[0047] like Figure 3 and Figure 9 As shown, optionally, the positioning and locking structure includes a mounting base 10 disposed on the mounting base 10 and a locking screw 112 cooperating with the mounting base 10. The printed circuit board testing device 100 also includes a stepped pad 30, which is disposed at the mounting base 10 to make the screw heads of adjacent locking screws 112 located at different height planes.

[0048] The stepped pad 30 is designed in a stepped shape, allowing two pads installed on adjacent mounting base plates 10 to have different heights. Specifically, the stepped pad 30 includes a first stepped surface 31 and a second stepped surface 32, with the first stepped surface 31 being higher than the second stepped surface 32. One mounting base plate 10 is located on the first stepped surface 31, and the other adjacent mounting base plate 10 is located on the second stepped surface 32. Because the two screw heads are staggered in the height direction, one above and one below, although their projections overlap in the horizontal direction, they do not interfere with each other in height space and can each independently complete the locking operation.

[0049] By adopting the above technical solution, the test device and the printed circuit board are locked and fixed by setting the mounting base 10 and locking screws 112 on the mounting base 10. Furthermore, the stepped pads 30 are set so that the screw heads of adjacent locking screws 112 are located in different height planes, which can avoid the problem of screw head interference caused by the small center distance of the mounting base 10 on the printed circuit board. The stepped pads 30 stagger the adjacent screw heads in the height direction, so that each screw works independently in its own height plane, avoiding the installation conflict caused by the screw head diameter being larger than the hole spacing in a limited plane space, and achieving reliable locking in a compact space.

[0050] Optionally, the pads of the printed circuit board under test adopt a nine-grid matrix RF unit layout, with the central pad of the nine-grid as the RF channel and the surrounding pads as the grounding channel. Odd-numbered button-shaped test components 21 are used to match and test all odd-numbered row or column nine-grid RF units, and even-numbered button-shaped test components 22 are used to match and test all even-numbered row or column nine-grid RF units.

[0051] By adopting the above technical solution, the pads of the printed circuit board under test are set as a nine-square matrix RF unit layout (the central pad is the RF channel and the surrounding pads are the grounding channels). Odd-numbered row button test components 21 are used to match and test all odd-numbered row or column nine-square grid units, and even-numbered row button test components 22 are used to match and test all even-numbered row or column nine-square grid units. In the nine-square grid layout, after dividing the number of rows of RF channel units into odd and even groups, the spacing between adjacent RF channel units in the same group is doubled, which can provide space for the installation of the button assembly 23. At the same time, the grounding pads around the nine-square grid also obtain sufficient arrangement space after grouping, taking into account both RF performance and structural feasibility, and ensuring the impedance matching and grounding integrity of the RF channels in high-density scenarios.

[0052] like Figure 10 As shown, Figure 10 This is a schematic flowchart of a printed circuit board testing method provided in an embodiment of this application, including the following steps 1001 to 1005.

[0053] Step 1001: Select the odd-numbered button test assembly and align and bond the mounting substrate with the odd-numbered button test assembly to the printed circuit board under test using the positioning and locking structure.

[0054] Step 1002: The mounting substrate and the printed circuit board under test are locked and fixed by the positioning and locking structure, so that the button assembly of the odd-numbered row of button test components is elastically pressed into contact with the pads of the odd-numbered row or column on the printed circuit board under test, thereby completing the signal transfer and testing of the pads of the odd-numbered row or column.

[0055] Step 1003: Loosen the positioning locking structure and remove the odd-numbered button test assembly.

[0056] Step 1004: Select an even-numbered button test assembly and align and bond the mounting substrate with the even-numbered button test assembly to the printed circuit board under test using a positioning and locking structure.

[0057] Step 1005: The mounting substrate and the printed circuit board under test are locked and fixed by the positioning and locking structure, so that the button fastener of the even-numbered row of button test components is elastically pressed into contact with the even-numbered row or column of pads on the printed circuit board under test, thereby completing the signal transfer and testing of the even-numbered row or column of pads.

[0058] The printed circuit board testing method provided in this application divides the high-density matrix-arranged pads into two groups for independent testing by setting up odd-row and even-row button test components. Within each group, the equivalent spacing of the RF units is increased to twice the original spacing, providing ample assembly space for the button assembly and adapter connectors, effectively solving the component interference problem in extremely small-pitch pad areas. During testing, the odd-row components are first selected to complete the testing of the odd-row or column pads. After loosening the locking structure, the even-row components are removed and replaced to complete the testing of the even-row or column pads. These two independent tests cover all pads, overcoming the space limitations of small pitch while avoiding the excessive structural complexity caused by accommodating all contacts at once, ensuring the integrity and reliability of the test.

[0059] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A printed circuit board testing apparatus for testing a printed circuit board with a high-density matrix layout of pad channels, characterized in that, include: The mounting substrate is equipped with a positioning and locking structure that matches the printed circuit board under test; The button testing assembly includes an odd-numbered row button testing assembly and an even-numbered row button testing assembly. The odd-numbered row button testing assembly is used to correspond and match with the pads in the odd-numbered rows or columns of the printed circuit board under test, and the even-numbered row button testing assembly is used to correspond and match with the pads in the even-numbered rows or columns of the printed circuit board under test. The odd-numbered row button testing assembly and the even-numbered row button testing assembly are respectively and independently mounted on the mounting substrate. The odd-numbered pile button test assembly and the even-numbered pile button test assembly include a pile button assembly and an adapter connector. One end of the snap fastener is electrically connected to the adapter connector via the mounting substrate, and the other end of the snap fastener is used for elastic pressing contact with the pads of the printed circuit board under test. The adapter connector is used to convert the signal channel of the snap fastener assembly into a standard test interface.

2. The printed circuit board testing device according to claim 1, characterized in that, The button assembly includes a first outer conductor, a high-frequency insulating dielectric body, and a button contact. The first outer conductor is connected to the mounting substrate, the high-frequency insulating dielectric body is fixedly connected to the first outer conductor, and the contact is placed inside the high-frequency insulating dielectric body with one end in elastic pressure contact with the pad of the printed circuit board under test.

3. The printed circuit board testing device according to claim 2, characterized in that, The bob button contact includes a bob button and a protective cover installed on the elastic end of the bob button. The bob button has a diameter ranging from 0.3 mm to 0.5 mm, a length ranging from 2.5 mm to 3 mm, an axial elastic float of 0.5 mm, and an axial tolerance of 0.3 mm.

4. The printed circuit board testing device according to claim 3, characterized in that, The adapter connector is an SSMP adapter plug, which includes a second outer conductor, an inner conductor, a dielectric body, and a sleeve. The dielectric body is disposed inside the second outer conductor, the inner conductor passes through the dielectric body and one end abuts against the button of the button assembly, and the sleeve is fitted onto one end of the second outer conductor and connected to the grounding channel of the first outer conductor.

5. The printed circuit board testing device according to claim 2, characterized in that, The first outer conductor includes an interference section and a guide section. The guide section is used to guide the first outer conductor into a first mounting hole of the mounting substrate, and the interference section is interference-fitted to the first mounting hole of the mounting substrate.

6. The printed circuit board testing apparatus according to claim 5, characterized in that, The first outer conductor is provided with a limiting block, which is configured to restrict the first outer conductor from rotating relative to the mounting substrate.

7. The printed circuit board testing device according to claim 2, characterized in that, The high-frequency insulating dielectric body contains several circular channels arranged in a matrix, and the radio frequency channels within the circular channels have 50-ohm impedance matching.

8. The printed circuit board testing apparatus according to claim 1, characterized in that, The positioning and locking structure includes a locking hole provided on the mounting base plate and a locking screw that cooperates with the locking hole; The printed circuit board testing device also includes a stepped pad, which is disposed at the locking hole to make the screw heads of adjacent locking screws located at different height planes.

9. The printed circuit board testing device according to claim 1, characterized in that, The pads of the printed circuit board under test adopt a nine-grid matrix RF unit layout, with the central pad of the nine-grid being the RF channel and the surrounding pads being the grounding channel. The odd-numbered button test assembly is used to test all odd-numbered rows or columns of 9x9 RF units, while the even-numbered button test assembly is used to test all even-numbered rows or columns of 9x9 RF units.

10. A printed circuit board testing method, comprising testing a printed circuit board with a high-density matrix layout of pad channels using the printed circuit board testing apparatus as described in any one of claims 1 to 9, characterized in that, include: Select an odd-numbered button test assembly, and align and bond the mounting substrate on which the odd-numbered button test assembly is installed with the printed circuit board under test through a positioning and locking structure. The mounting substrate and the printed circuit board under test are locked and fixed by the positioning and locking structure, so that the button assembly of the odd row of button test components is elastically pressed into contact with the pads of the odd row or column on the printed circuit board under test, thereby completing the signal transfer and testing of the pads of the odd row or column. Loosen the positioning and locking structure and remove the odd-numbered pile button test assembly; Select an even-numbered button test assembly, and align and bond the mounting substrate on which the even-numbered button test assembly is installed with the printed circuit board under test using a positioning and locking structure. The mounting substrate and the printed circuit board under test are locked and fixed by the positioning and locking structure, so that the button fastener of the even-numbered row of button test components is elastically pressed into contact with the even-numbered row or column of pads on the printed circuit board under test, thereby completing the signal transfer and testing of the even-numbered row or column of pads.

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