Full-automatic double-station wafer double-side detection device

Abstract

The present application relates to wafer detection technical field, specifically to a kind of full-automatic double-station wafer double-side detection device, including machine table;The machine table is equipped with detection mechanism and bearing mechanism;The detection mechanism includes detection seat, upper test needle and lower test needle arranged in detection seat;The bearing mechanism includes bearing seat;The bearing seat is equipped with bearing top plate;The bearing top plate is equipped with detection groove;The bearing top plate is equipped with bearing platform;The bearing mechanism further includes compression ring;The bearing seat is equipped with fixed component;The machine table is equipped with support frame;The bearing mechanism further includes pick-and-place component.The present application is by using upper test needle and lower test needle of upper and lower symmetry, can complete wafer double-side synchronous detection after once positioning to wafer, without turning over wafer, to avoid damage and positioning error in turning over process, and the test pressure of upper test needle and lower test needle is consistent, effectively prevent thin wafer stress warping, effectively improve detection precision.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection technology, specifically to a fully automated dual-station double-sided wafer inspection device. Background Technology

[0002] As the core carrier of semiconductor manufacturing, wafer quality inspection is a crucial step in ensuring chip yield. Currently, mainstream inspection equipment generally adopts a single-sided inspection mode, requiring manual or flipping mechanisms to flip the wafer for secondary inspection. This process not only significantly extends the inspection cycle but also easily leads to wafer edge scratches and surface particle contamination. Especially for thin wafers, stress concentration during the flipping process can even cause wafer breakage. Furthermore, the coordinate systems of the two inspections are difficult to perfectly coincide, making it impossible to accurately correlate and trace defects on both sides, severely impacting defect analysis efficiency.

[0003] Furthermore, current wafer positioning and fixing methods mostly rely on manual placement of pressure rings to secure the wafer. This results in poor operational consistency and uneven pressure, which can easily lead to localized wafer warping, causing poor contact of test probes or even puncture of the wafer. Moreover, existing correction systems often only have XY-axis translation capabilities and cannot correct rotational deviations generated during wafer transfer. This causes the alignment error between the test probes and wafer pads to exceed the allowable range, leading to numerous false positives and false negatives. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned shortcomings in the prior art by providing a fully automated dual-station wafer double-sided inspection device.

[0005] The objective of this invention is achieved through the following technical solution: a fully automated dual-station wafer double-sided inspection device, comprising a machine base; the machine base is equipped with an inspection mechanism and a support mechanism; The testing mechanism includes a testing base on the machine, an upper test probe on the testing base, and a lower test probe on the testing base; the upper test probe is located at the top of the lower test probe. The support mechanism includes a support base movably mounted on the machine tool; a support top plate is provided on the top of the support base; a detection groove is provided through the middle of the support top plate; a support platform for placing wafers is provided on the outer periphery of the support top plate around the detection groove; the support mechanism also includes a pressure ring detachably connected to the support platform; the support base is provided with a fixing component for fixing the pressure ring to the support platform; The machine tool is provided with a support frame; the bearing mechanism also includes a pick-and-place assembly provided on the support frame for picking up and placing the pressure ring.

[0006] The invention is further configured such that the detection mechanism includes an upper detection plate and a lower detection plate; the upper test stylus and the lower test stylus are respectively disposed on the upper detection plate and the lower detection plate; the detection mechanism also includes a detection motor disposed on the detection seat, a detection screw rotatably disposed on the detection seat, an upper detection nut sleeved on the top of the detection screw, and a lower detection nut sleeved on the bottom of the detection screw; the output end of the detection motor is connected to the detection screw; the detection screw extends along the Z-axis direction; the top and bottom of the detection screw are respectively provided with external threads with opposite directions of rotation; the upper detection plate and the lower detection plate are respectively connected to the upper detection nut and the lower detection nut; the upper detection plate and the lower detection plate are both slidably disposed on the detection seat along the Z-axis direction.

[0007] The present invention is further configured such that the pick-and-place assembly includes a pick-and-place plate slidably disposed on the support frame along the Z-axis direction, a pick-and-place cylinder disposed on the support frame, and a pick-and-place suction nozzle disposed on the pick-and-place plate; the pick-and-place suction nozzle is used to pick up and place the pressure ring; the pick-and-place suction nozzle is disposed on the top of the bearing top plate; the output end of the pick-and-place cylinder is connected to the pick-and-place plate; The fixing assembly includes a fixing rod movably mounted on the support platform and a rotary clamping cylinder mounted on the support seat; the output end of the rotary clamping cylinder is connected to the fixing rod; the rotary clamping cylinder drives the fixing rod to rotate and move up and down.

[0008] The invention is further configured such that: a carrier component is movably provided in the middle of the detection groove along the Z-axis direction; a carrier motor is provided in the carrier seat; an upper carrier wheel and a lower carrier wheel are rotatably provided in the carrier seat; the upper carrier wheel is located on top of the lower carrier wheel; a carrier synchronous belt is provided between the upper carrier wheel and the lower carrier wheel; the output end of the carrier motor is connected to the lower carrier wheel; a carrier connecting rod is slidably provided in the carrier seat along the Z-axis direction; the carrier connecting rod is connected to one side of the carrier synchronous belt and the carrier component respectively.

[0009] The present invention is further configured such that the machine tool is provided with a longitudinal bearing linear module extending along the Y-axis direction; the output end of the longitudinal bearing linear module is provided with a transverse bearing linear module extending along the X-axis direction; the output end of the transverse bearing linear module is provided with a bearing base plate; and the bearing seat is rotatably mounted on the bearing base plate. A load-bearing tension spring is provided between one end of the bottom of the bearing seat along the X-axis and the bearing base plate; the bearing base plate is provided with a straight-line correction bearing module extending along the Y-axis; a bearing roller is rotatably provided at the output end of the straight-line correction bearing module; and a load-bearing correction rod is provided at the other end of the bottom of the bearing seat along the X-axis, which abuts against the bearing roller. The support frame is equipped with a camera assembly.

[0010] The present invention is further configured such that the machine tool is provided with a loading and unloading mechanism; the loading and unloading mechanism includes a loading and unloading linear module extending along the Z-axis direction and disposed on the machine tool, and a material box disposed at the output end of the loading and unloading linear module; the material box is provided with a plurality of material slots arranged along the Z-axis direction. The support frame is equipped with a dotting device; the machine base is equipped with a drying platform; The support frame is equipped with a detection card.

[0011] The present invention is further configured such that the machine tool is provided with a material transfer mechanism; The material transfer mechanism includes a material transfer platform, an upper material transfer plate slidably disposed on the material transfer platform along a first direction, and a lower material transfer plate slidably disposed on the material transfer platform along the first direction; the upper material transfer plate is movably disposed on top of the lower material transfer plate; The upper transfer plate and the lower transfer plate are each provided with a first transfer arm and a second transfer arm; a transfer opening groove is formed between the first transfer arm and the second transfer arm; The material transfer mechanism further includes an adjustment platform that is slidably disposed on the material transfer table along the Z-axis direction; the adjustment platform is provided with an adjustment motor; the output end of the adjustment motor is provided with an adjustment plate; the diameter of the adjustment plate is smaller than the width of the material transfer opening slot.

[0012] The present invention is further configured such that the transfer platform is provided with an upper transfer motor, an upper transfer synchronous wheel, an upper transfer synchronous belt, an upper transfer slide rail, and an upper C-shaped slider on one side along the second direction; the upper transfer slide rail extends along the first direction; the first direction is perpendicular to the second direction; the output end of the upper transfer motor is connected to the upper transfer synchronous wheel; the upper transfer synchronous belt is sleeved on the upper transfer synchronous wheel; the upper C-shaped slider is connected to the upper transfer synchronous belt and the upper transfer plate respectively; the upper C-shaped slider is slidably disposed on the upper transfer slide rail; The transfer platform is provided with a lower transfer motor, a lower transfer synchronous wheel, a lower transfer synchronous belt, a lower transfer slide rail, and a lower C-shaped slider on the other side along the second direction; the lower transfer slide rail extends along the first direction; the output end of the lower transfer motor is connected to the lower transfer synchronous wheel; the lower transfer synchronous belt is sleeved on the lower transfer synchronous wheel; the lower C-shaped slider is connected to the lower transfer synchronous belt and the lower transfer plate respectively; the lower C-shaped slider is slidably disposed on the lower transfer slide rail.

[0013] The present invention is further configured such that the transfer stage is provided with a transfer camera assembly on the top of the adjustment plate; the first transfer arm, the second transfer arm, the upper transfer plate and the lower transfer plate are all provided with vacuum holes.

[0014] The present invention is further configured such that the transfer table is provided with an adjustment lifting linear module extending along the Z-axis direction; the output end of the adjustment lifting linear module is connected to the adjustment table; The material transfer mechanism further includes a material transfer base mounted on the machine base, a material transfer rotary table rotatably mounted on the material transfer base, a material transfer rotary motor mounted on the material transfer base, and a material transfer movable plate mounted on the material transfer rotary table; the material transfer rotary motor is used to drive the material transfer rotary table to rotate; the material transfer table is slidably mounted on the material transfer movable plate along a second direction; the material transfer movable plate is provided with a material transfer linear module extending along the second direction; the output end of the material transfer linear module is connected to the material transfer table.

[0015] The present invention is further configured such that the number of the detection mechanism and the number of the bearing mechanism are both two; the two detection mechanisms are respectively located at both ends of the machine tool along the X-axis direction; the two bearing mechanisms are respectively located at both ends of the machine tool along the X-axis direction.

[0016] The beneficial effects of the present invention are as follows: By using symmetrical upper and lower test probes, the present invention can complete the synchronous detection of both sides of the wafer after one positioning without flipping the wafer, thereby avoiding damage and positioning errors during the flipping process. In addition, the test pressure of the upper and lower test probes is consistent, which effectively prevents the thin wafer from warping under force and effectively improves the detection accuracy. In addition, by using the fixing and picking components, the vacuum nozzle automatically picks up and places the pressure ring, and the rotating clamping cylinder applies pressure evenly to ensure reliable wafer fixation. Furthermore, the carrying camera component collects wafer position information in real time, driving the straight-line correction module, the lateral straight-line correction module, and the longitudinal straight-line correction module to complete the correction, effectively reducing the false detection and false detection rates. Attached Figure Description

[0017] The invention will be further illustrated with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the invention. For those skilled in the art, other drawings can be obtained based on the following drawings without any creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 yes Figure 1 A magnified view of part A in the middle; Figure 3 This is a structural schematic diagram from another perspective of the present invention; Figure 4 This is a schematic diagram of the detection mechanism of the present invention; Figure 5 This is a schematic diagram of the structure of the bearing mechanism of the present invention; Figure 6 This is a structural schematic diagram of the bearing mechanism of the present invention from another perspective; Figure 7 This is a cross-sectional view of the bearing mechanism of the present invention; Figure 8 This is a schematic diagram of the material transfer mechanism of the present invention; Figure 9 yes Figure 8 A magnified view of part B in the middle; Figure 10 This is a cross-sectional view of the material transfer mechanism of the present invention; Figure 11 This is a cross-sectional view of the material transfer mechanism of the present invention from another perspective; The components include: 1. Machine base; 11. Drying platform; 12. Support frame; 13. Camera assembly; 14. Dot generator; 15. Detector card; 2. Detection mechanism; 21. Detection seat; 22. Upper detection plate; 23. Upper detection nut; 24. Upper test probe; 25. Lower detection plate; 26. Lower detection nut; 27. Lower test probe; 28. Detection motor; 29. ​​Detection screw; 3. Bearing mechanism; 31. Bearing seat; 32. Bearing top plate; 33. Detection slot. 34. Bearing platform; 35. Rotary clamping cylinder; 36. Fixing rod; 4. Pick-up and place assembly; 41. Pressure ring; 42. Pick-up and place plate; 43. Pick-up and place cylinder; 44. Pick-up and place nozzle; 5. Bearing component; 51. Bearing motor; 52. Upper bearing wheel; 53. Lower bearing wheel; 54. Bearing synchronous belt; 55. Bearing connecting rod; 61. Longitudinal bearing linear module; 62. Lateral bearing linear module; 63. Bearing base plate; 64. Bearing tension spring; 65. Correction bearing 66. Loading linear module; 67. Loading roller; 7. Loading correction rod; 7. Loading / unloading mechanism; 71. Loading / unloading linear module; 72. Material box; 73. Material trough; 8. Transfer mechanism; 81. Transfer platform; 82. Upper transfer plate; 83. Lower transfer plate; 84. First transfer arm; 85. Second transfer arm; 86. Transfer opening slot; 87. Vacuum hole; 88. Transfer camera assembly; 91. Upper transfer motor; 911. Upper transfer synchronous pulley; 912. Upper transfer synchronous... 913. Upper transfer slide rail; 914. Upper C-shaped slider; 92. Lower transfer motor; 921. Lower transfer synchronous pulley; 922. Lower transfer synchronous belt; 923. Lower transfer slide rail; 924. Lower C-shaped slider; 93. Adjustment lifting linear module; 931. Adjustment table; 932. Adjustment motor; 933. Adjustment plate; 94. Transfer seat; 95. Transfer rotary table; 96. Transfer rotary motor; 97. Transfer movable plate; 98. Transfer linear module. Detailed Implementation

[0019] The present invention will be further described in conjunction with the following embodiments.

[0020] Depend on Figures 1 to 11 As can be seen, the fully automatic dual-station wafer double-sided inspection device described in this embodiment includes a machine base 1; the machine base 1 is provided with an inspection mechanism 2 and a support mechanism 3; The testing mechanism 2 includes a testing base 21 on the machine base 1, an upper test needle 24 on the testing base 21, and a lower test needle 27 on the testing base 21; the upper test needle 24 is located at the top of the lower test needle 27. The support mechanism 3 includes a support base 31 movably mounted on the machine base 1; a support top plate 32 is provided on the top of the support base 31; a detection groove 33 is provided through the middle of the support top plate 32; a support platform 34 for placing wafers is provided on the outer periphery of the support top plate 32 around the detection groove 33; the support mechanism 3 also includes a pressure ring 41 detachably connected to the support platform 34; the support base 31 is provided with a fixing component for fixing the pressure ring 41 to the support platform 34; The machine base 1 is provided with a support frame 12; the bearing mechanism 3 also includes a pick-and-place assembly 4 provided on the support frame 12 and used for picking up and placing the pressure ring 41.

[0021] Specifically, in the fully automatic dual-station wafer double-sided inspection device described in this embodiment, after the device is started, the carrier 31 moves to the transfer station under the drive of the longitudinal carrier linear module 61 and the transverse carrier linear module 62 to wait for wafer transfer; the transfer mechanism 8 transports the wafer to the top of the carrier platform 34, and the wafer is placed stably on the annular support surface of the carrier platform 34, with the center of the wafer to be inspected aligned with the inspection slot 33 below; then the carrier 31 moves to the clamping ring 41 pick-and-place station, and the pick-and-place component 4 places the pre-adsorbed clamping ring 41 in the non-circuit area of ​​the wafer edge, and the fixing component then acts to firmly press the clamping ring 41 onto the carrier platform 34, so that the wafer edge is evenly clamped and fixed without warping or deformation; finally, the carrier 31 moves to the inspection station, and the upper test probe 24 and the lower test probe 27 simultaneously approach the center area of ​​the wafer, and the electrical parameters of the front and back sides of the wafer can be inspected simultaneously with one contact.

[0022] This embodiment eliminates the need for the traditional single-sided wafer flipping process, avoiding the risks of wafer edge scratches, surface particle contamination, and thin wafer breakage during the flipping process. At the same time, the clamping ring 41 ensures the stability of the wafer position during the testing process by using a ring clamping method, preventing test probe misalignment and missed detection caused by wafer displacement, thus effectively improving the reliability of the test.

[0023] This embodiment describes a fully automatic dual-station wafer double-sided inspection device. The inspection mechanism 2 includes an upper inspection plate 22 and a lower inspection plate 25. An upper test probe 24 and a lower test probe 27 are respectively disposed on the upper inspection plate 22 and the lower inspection plate 25. The inspection mechanism 2 also includes an inspection motor 28 disposed on an inspection base 21, an inspection screw 29 rotatably disposed on the inspection base 21, an upper inspection nut 23 sleeved on the top of the inspection screw 29, and a lower inspection nut 26 sleeved on the bottom of the inspection screw 29. The output end of the inspection motor 28 is connected to the inspection screw 29. The inspection screw 29 extends along the Z-axis direction. The top and bottom of the inspection screw 29 are respectively provided with external threads with opposite directions of rotation. The upper inspection plate 22 and the lower inspection plate 25 are respectively connected to the upper inspection nut 23 and the lower inspection nut 26. The upper inspection plate 22 and the lower inspection plate 25 are both slidably disposed on the inspection base 21 along the Z-axis direction.

[0024] Specifically, in the fully automatic dual-station wafer double-sided inspection device described in this embodiment, after the carrier 31 stops with the wafer at the inspection station, the inspection motor 28 is started. The inspection motor 28 rotates in the forward direction, driving the inspection screw 29 to rotate synchronously. Since the upper and lower sections of the inspection screw 29 are machined with external threads of opposite directions, the upper inspection nut 23 and the lower inspection nut 26 will respectively drive the upper inspection plate 22 and the lower inspection plate 25 to move synchronously towards each other along the linear guide rail on the inspection seat 21. When the tips of the upper test needle 24 and the lower test needle 27 simultaneously contact the test pads on both sides of the wafer and reach the preset contact pressure, the inspection motor 28 stops rotating and maintains this position to start electrical testing. After the test is completed, the inspection motor 28 rotates in the reverse direction, driving the upper inspection plate 22 and the lower inspection plate 25 to synchronously and quickly reset to the initial safe position, waiting for the next wafer to be inspected. This embodiment, through the above-described settings, ensures the synchronous movement of the upper test probe 24 and the lower test probe 27, with a small deviation in the contact pressure between the upper and lower probes. This effectively avoids the problem of excessive pressure on one side causing warping or deformation of the thin wafer or the test probe puncturing the wafer.

[0025] This embodiment describes a fully automatic dual-station wafer double-sided inspection device. The pick-and-place assembly 4 includes a pick-and-place plate 42 slidably mounted on a support frame 12 along the Z-axis, a pick-and-place cylinder 43 mounted on the support frame 12, and a pick-and-place nozzle 44 mounted on the pick-and-place plate 42. The pick-and-place nozzle 44 is used to pick up and place a pressure ring 41. The pick-and-place nozzle 44 is located on the top of a supporting top plate 32. The output end of the pick-and-place cylinder 43 is connected to the pick-and-place plate 42. The fixing assembly includes a fixing rod 36 movably mounted on the bearing platform 34 and a rotary clamping cylinder 35 mounted on the bearing seat 31; the output end of the rotary clamping cylinder 35 is connected to the fixing rod 36; the rotary clamping cylinder 35 drives the fixing rod 36 to rotate and rise.

[0026] Specifically, in the fully automatic dual-station wafer double-sided inspection device described in this embodiment, during standby, the pick-and-place nozzle 44 pre-grabs the pressure ring 41 through vacuum adsorption, and the pick-and-place cylinder 43 is in a retracted state; when the carrier 31 moves the wafer to the pressure ring 41 station, the piston rod of the pick-and-place cylinder 43 extends, driving the pick-and-place plate 42 to descend smoothly until the pressure ring 41 is placed on the top surface of the wafer, the pick-and-place nozzle 44 closes the vacuum, and places the pressure ring 41 on the top surface of the wafer edge; subsequently, four evenly distributed spiral nozzles around the carrier platform 34... The rotary clamping cylinder 35 operates simultaneously, first rotating the fixing rod 36 90 degrees so that the end of the fixing rod 36 is aligned with the pressure ring 41. Then, the fixing rod 36 is driven to descend vertically, pressing the pressure ring 41 evenly against the edge of the wafer. After the test is completed, the process is reversed. The rotary clamping cylinder 35 first drives the fixing rod 36 to rise and reset, then rotates 90 degrees in the opposite direction to disengage from the pressure ring 41. Subsequently, the pick-and-place cylinder 43 descends, the pick-and-place nozzle 44 opens to vacuum adsorb the pressure ring 41, and the pick-and-place cylinder 43 rises to remove the pressure ring 41, ready for the next use.

[0027] This embodiment describes a fully automatic dual-station wafer double-sided inspection device. A carrier 5 is movably mounted in the center of the inspection slot 33 along the Z-axis. A carrier base 31 is equipped with a carrier motor 51. The carrier base 31 is rotatably equipped with an upper carrier wheel 52 and a lower carrier wheel 53. The upper carrier wheel 52 is located on top of the lower carrier wheel 53. A carrier synchronous belt 54 is provided between the upper carrier wheel 52 and the lower carrier wheel 53. The output end of the carrier motor 51 is connected to the lower carrier wheel 53. A carrier connecting rod 55 is slidably mounted on the carrier base 31 along the Z-axis. The carrier connecting rod 55 is connected to one side of the carrier synchronous belt 54 and the carrier 5.

[0028] Specifically, in the fully automatic dual-station wafer double-sided inspection device described in this embodiment, after the transfer mechanism 8 moves the wafer directly above the support platform 34 and stops, the support motor 51 rotates in the forward direction, driving the lower support wheel 53 to rotate, and the upper support wheel 52 rotates synchronously through the support synchronous belt 54; the support connecting rod 55 fixed on the side of the support synchronous belt 54 then drives the support member 5 to rise vertically. When the top surface of the support member 5 is higher than the support surface of the support platform 34, the support motor 51 stops rotating; at this time, the transfer arm of the transfer mechanism 8 is pulled out from the bottom of the wafer, and the wafer is supported by the center of the support member 5; then the support motor 51 rotates in the reverse direction, driving the support member 5 to descend smoothly, so that the edge of the wafer falls smoothly on the annular support surface of the support platform 34. The support motor 51 continues to rotate until the support member 5 returns to the initial position at the bottom of the inspection slot 33; after the inspection is completed, the support member 5 rises again to lift the wafer and hands it over to the transfer mechanism 8.

[0029] This embodiment describes a fully automatic dual-station wafer double-sided inspection device. The machine base 1 is equipped with a longitudinal bearing linear module 61 extending along the Y-axis, wherein the longitudinal bearing linear module 61 can be a combination of a motor, lead screw, slide rail, and slider; the output end of the longitudinal bearing linear module 61 is equipped with a transverse bearing linear module 62 extending along the X-axis, wherein the transverse bearing linear module 62 can be a combination of a motor, lead screw, slide rail, and slider; the output end of the transverse bearing linear module 62 is equipped with a bearing base plate 63; and the bearing seat 31 is rotatably mounted on the bearing base plate 63. A bearing tension spring 64 is provided between one end of the bottom of the bearing seat 31 along the X-axis and the bearing base plate 63; the bearing base plate 63 is provided with a straightening bearing linear module 65 extending along the Y-axis, wherein the straightening bearing linear module 65 can be a combination of motor screw slide rail slider; the output end of the straightening bearing linear module 65 is provided with a bearing roller 66; the other end of the bottom of the bearing seat 31 along the X-axis is provided with a bearing straightening rod 67 that abuts against the bearing roller 66. The support frame 12 is equipped with a camera assembly 13.

[0030] Specifically, in the fully automated dual-station wafer double-sided inspection device described in this embodiment, after the wafer is placed on the carrier platform 34, the carrier seat 31 first moves to directly below the carrier camera assembly 13. The carrier camera assembly 13 captures a high-definition image of the wafer, and extracts three reference marker points on the wafer edge through an image recognition algorithm. The translational deviation of the wafer relative to the standard coordinate system in the X and Y directions, as well as the rotational angle deviation around the Z axis, are calculated. Based on the calculation results, the longitudinal carrier linear module 61 and the transverse carrier linear module 62 are first driven to move the carrier base plate 63 to complete the X and Y direction translational deviations. The directional translation correction aligns the wafer center with the center of the inspection slot 33. Subsequently, the driving correction bearing linear module 65 moves the bearing roller 66 along the Y direction. The bearing roller 66 pushes the bearing correction rod 67 against it, causing the bearing seat 31 to rotate around its hinge axis with the bearing base plate 63 until the rotation angle deviation is eliminated. During this process, the bearing tension spring 64 is always in a stretched state, providing a constant reset tension to ensure that the bearing correction rod 67 and the bearing roller 66 are in close contact, eliminating transmission gaps. After the correction is completed, the bearing seat 31 moves the wafer to the inspection station.

[0031] The fully automatic dual-station wafer double-sided inspection device described in this embodiment includes a loading and unloading mechanism 7 on the machine base 1. The loading and unloading mechanism 7 includes a loading and unloading linear module 71 extending along the Z-axis direction on the machine base 1 and a material box 72 located at the output end of the loading and unloading linear module 71. The loading and unloading linear module 71 can be a combination of a motor, lead screw, slide rail, and slider. The material box 72 is provided with multiple material slots 73 arranged along the Z-axis direction. The support frame 12 is equipped with a dotting device 14; the machine base 1 is equipped with a drying platform 11; The support frame 12 is equipped with a detector card 15.

[0032] Specifically, in the fully automatic dual-station wafer double-sided inspection device described in this embodiment, before operation, the operator places the material box 72 filled with wafers to be inspected on the platform of the loading and unloading linear module 71. After the fully automatic dual-station wafer double-sided inspection device is started, the loading and unloading linear module 71 drives the material box 72 to rise step by step with the spacing of the material slots 73, so that the uppermost wafer to be inspected moves to the preset picking height. After the transfer mechanism 8 takes out the wafer, it first transports it to the bottom of the detector card 15. The detector card 15 reads the QR code or barcode information on the wafer surface to identify parameters such as the batch, model, and thickness of the wafer. After the inspection is completed, if the wafer is found to have a defect, the defect location will be recorded and the dotting device 14 will be driven to move to the corresponding position to mark the wafer with ink. After marking, the transfer mechanism 8 transports the wafer to the drying platform 11. The drying platform 11 dries the marking ink to prevent the ink from spreading and contaminating the circuit area. Finally, the transfer mechanism 8 puts the qualified wafers and the unqualified wafers back to the corresponding positions in the material box 72.

[0033] The fully automatic dual-station wafer double-sided inspection device described in this embodiment includes a material transfer mechanism 8 on the machine base 1. The material transfer mechanism 8 includes a material transfer platform 81, an upper material transfer plate 82 slidably disposed on the material transfer platform 81 along a first direction, and a lower material transfer plate 83 slidably disposed on the material transfer platform 81 along a first direction; the upper material transfer plate 82 is movably disposed on the top of the lower material transfer plate 83. The upper transfer plate 82 and the lower transfer plate 83 are each provided with a first transfer arm 84 and a second transfer arm 85; a transfer opening groove 86 is formed between the first transfer arm 84 and the second transfer arm 85. The material transfer mechanism 8 also includes an adjustment platform 931 that is slidably disposed on the material transfer table 81 along the Z-axis direction; the adjustment platform 931 is provided with an adjustment motor 932; the output end of the adjustment motor 932 is provided with an adjustment plate 933; the diameter of the adjustment plate 933 is smaller than the width of the material transfer opening groove 86.

[0034] Specifically, in this embodiment, the fully automatic dual-station wafer double-sided inspection device adopts a parallel design of two transfer plates in the transfer mechanism 8. One transfer plate is responsible for picking up the wafer to be inspected, and the other transfer plate is responsible for placing the inspected wafer. The two can operate independently without interfering with each other. For example, when picking up the wafer, the upper transfer plate 82 extends along the first direction, so that the first transfer arm 84 and the second transfer arm 85 of the upper transfer plate 82 are inserted into the bottom of the wafer in the material tray 73, and retracted after vacuum adsorption. At the same time, the lower transfer plate 83 can extend with the inspected wafer and put it back into the material box 72.

[0035] Before the wafer needs to be returned to the material box 72, the transfer mechanism 8 first transports it to the adjustment station. The adjusting lifting linear module 93 drives the adjusting table 931 to rise, and the adjusting plate 933 extends upward from the bottom of the transfer opening slot 86, lifting the wafer from the first transfer arm 84 and the second transfer arm 85 of the lower transfer plate 83, so that the wafer is completely separated from the first transfer arm 84 and the second transfer arm 85. Then, the adjusting motor 932 drives the adjusting plate 933 to rotate according to the feedback signal of the transfer camera component 88, compensating for the rotational deviation generated by the wafer during the transfer. After the correction is completed, the adjusting table 931 descends, and the wafer falls back onto the first transfer arm 84 and the second transfer arm 85. The transfer mechanism 8 then places it back into the corresponding material slot 73 of the material box 72. This embodiment improves the effective working time ratio of the transfer mechanism 8 and the material turnover efficiency through the above settings, while the secondary correction function ensures the accuracy of wafer placement.

[0036] This embodiment describes a fully automatic dual-station wafer double-sided inspection device. The transfer stage 81 is equipped with an upper transfer motor 91, an upper transfer synchronous wheel 911, an upper transfer synchronous belt 912, an upper transfer slide rail 913, and an upper C-shaped slider 914 on one side along a second direction. The upper transfer slide rail 913 extends along a first direction, which is perpendicular to the second direction. The output end of the upper transfer motor 91 is connected to the upper transfer synchronous wheel 911. The upper transfer synchronous belt 912 is sleeved around the upper transfer synchronous wheel 911. The upper C-shaped slider 914 is connected to both the upper transfer synchronous belt 912 and the upper transfer plate 82. The upper C-shaped slider 914 is slidably mounted on the upper transfer slide rail 913. The transfer platform 81 is provided with a lower transfer motor 92, a lower transfer synchronous wheel 921, a lower transfer synchronous belt 922, a lower transfer slide rail 923, and a lower C-shaped slider 924 on the other side along the second direction; the lower transfer slide rail 923 extends along the first direction; the output end of the lower transfer motor 92 is connected to the lower transfer synchronous wheel 921; the lower transfer synchronous belt 922 is sleeved on the lower transfer synchronous wheel 921; the lower C-shaped slider 924 is connected to the lower transfer synchronous belt 922 and the lower transfer plate 83 respectively; the lower C-shaped slider 924 is slidably disposed on the lower transfer slide rail 923.

[0037] Specifically, in the fully automatic dual-station wafer double-sided inspection device described in this embodiment, the upper transfer plate 82 and the lower transfer plate 83 adopt completely independent drive systems and are respectively arranged on both sides of the transfer stage 81 to avoid motion interference. When the upper transfer motor 91 receives the pick-up signal, it rotates in the forward direction, driving the upper transfer synchronous wheel 911 to rotate. Through the upper transfer synchronous belt 912, the upper C-shaped slider 914 fixed on the synchronous belt slides forward along the upper transfer slide rail 913, thereby driving the upper transfer plate 82 to extend. After reaching the pick-up position, the upper transfer motor 91 stops rotating, the vacuum system is activated to adsorb the wafer, and then the upper transfer motor 91 rotates in the reverse direction, driving the upper transfer plate 82 to retract to the initial position.

[0038] The operation flow of the lower transfer plate 83 is exactly the same as that of the upper transfer plate 82, but it is controlled by an independent lower transfer motor 92, which can be started or stopped at any time according to the needs of the workstation. For example, when the first workstation is inspecting, the upper transfer plate 82 can pick up the second wafer to be inspected from the material box 72, while the lower transfer plate 83 can send the first inspected wafer back to the material box 72. The two actions are completely parallel.

[0039] The fully automatic dual-station wafer double-sided inspection device described in this embodiment has a transfer stage 81 with a transfer camera assembly 88 on the top of the adjustment plate 933; the first transfer arm 84, the second transfer arm 85, the upper transfer plate 82 and the lower transfer plate 83 are all provided with vacuum holes 87.

[0040] The fully automatic dual-station wafer double-sided inspection device described in this embodiment includes a transfer stage 81 equipped with an adjustment and lifting linear module 93 extending along the Z-axis direction. The adjustment and lifting linear module 93 can be a combination of a motor, lead screw, slide rail, and slider. The output end of the adjustment and lifting linear module 93 is connected to the adjustment stage 931. The material transfer mechanism 8 further includes a material transfer seat 94 disposed on the machine base 1, a material transfer rotary table 95 rotatably disposed on the material transfer seat 94, a material transfer rotary motor 96 disposed on the material transfer seat 94, and a material transfer movable plate 97 disposed on the material transfer rotary table 95; the material transfer rotary motor 96 is used to drive the material transfer rotary table 95 to rotate; the material transfer table 81 is slidably disposed on the material transfer movable plate 97 along the second direction; the material transfer movable plate 97 is provided with a material transfer linear module 98 extending along the second direction, wherein the material transfer linear module 98 can be a combination of motor, lead screw, slide rail, and slider; the output end of the material transfer linear module 98 is connected to the material transfer table 81.

[0041] Specifically, the transfer mechanism 8 has four degrees of freedom of movement: the transfer rotary motor 96 drives the transfer rotary table 95 to rotate within a 360-degree range, so that the transfer table 81 can be aligned with the loading and unloading mechanism 7, the two bearing seats 31, the drying platform 11, and the adjustment station; the transfer linear module 98 drives the transfer table 81 to translate along the second direction to adapt to the position requirements of different stations; the upper transfer motor 91 and the lower transfer motor 92 drive the transfer plate to extend and retract along the first direction to complete the wafer picking and placing action; the adjustment lifting linear module 93 drives the adjustment table 931 to rise and fall along the Z-axis to realize the transfer of wafers between the first transfer arm 84, the second transfer arm 85, and the adjustment plate 933.

[0042] During operation, the rotary transfer motor 96 first drives the transfer stage 81 to rotate to the loading / unloading station. The linear transfer module 98 adjusts the radial position of the transfer stage 81, and the upper transfer plate 82 extends to take away the wafer to be inspected. Then, the rotary transfer motor 96 rotates to the detector card 15 station for wafer identification, and then rotates to the idle carrier mechanism 3 station for wafer transfer. After the inspection is completed, the transfer mechanism 8 takes away the inspected wafer, rotates it to the drying platform 11 for drying, then rotates it to the adjustment station for secondary correction, and finally rotates it to the loading / unloading station to put the wafer back into the material box 72.

[0043] This embodiment describes a fully automated dual-station wafer double-sided inspection device, in which there are two inspection mechanisms 2 and two support mechanisms 3. The two inspection mechanisms 2 are respectively located at both ends of the machine base 1 along the X-axis; the two support mechanisms 3 are also respectively located at both ends of the machine base 1 along the X-axis. Specifically, this embodiment adopts a dual-station parallel operation mode, with each of the two support mechanisms 3 corresponding to one of the two inspection mechanisms 2, effectively improving the overall working efficiency of the fully automated dual-station wafer double-sided inspection device.

[0044] Specifically, the fully automatic dual-station wafer double-sided inspection device described in this embodiment has the following working process: After the fully automatic dual-station wafer double-sided inspection device is powered on and started, all mechanisms are reset to the initial safe position. The loading and unloading linear module 71 drives the material box 72 to descend to the bottom. The transfer table 81 rotates to the loading and unloading station to wait for the order. The upper transfer plate 82 and the lower transfer plate 83 are completely retracted. The pick-and-place nozzle 44 pre-vacuum adsorbs the pressure ring 41. The upper inspection plate 22 and the lower inspection plate 25 are reset to the maximum spacing position. The carrier 5 descends to the bottom of the inspection groove 33.

[0045] Next, the operator places the wafer-filled cassette 72 on the loading and unloading platform, scans the QR code on the cassette 72, enters the batch information and establishes a test data file; then the loading and unloading linear module 71 drives the cassette 72 to rise, so that the bottom surface of the top wafer to be tested is flush with the picking plane of the first transfer arm 84 and the second transfer arm 85, waiting for picking. Next, the upper transfer motor 91 rotates in the forward direction, driving the upper C-shaped slider 914 to slide along the upper transfer rail 913, which in turn drives the upper transfer plate 82 to extend, allowing the first transfer arm 84 and the second transfer arm 85 to insert into the bottom of the wafer. The wafer is then firmly attached to the first transfer arm 84 and the second transfer arm 85 through the vacuum hole 87. Then, the upper transfer motor 91 rotates in the reverse direction, driving the upper transfer plate 82 to retract to a safe position. The transfer rotary motor 96 drives the transfer stage 81 to rotate, allowing the wafer to pass under the detector card 15 below the support frame 12. The detector card 15 reads the laser-marked QR code on the wafer surface, identifies parameters such as wafer model, thickness, and process batch, and matches the corresponding detection parameters. Next, the transfer rotary motor 96 drives the transfer stage 81 to rotate to the first carrier mechanism 3 position. The longitudinal carrier linear module 61 and the transverse carrier linear module 62 drive the carrier seat 31 to move to the transfer handover position. Then, the carrier motor 51 starts, driving the carrier connecting rod 55 to rise, so that the carrier 5 extends upward from the detection slot 33, passes through the transfer opening slot 86 between the first transfer arm 84 and the second transfer arm 85, and lifts the wafer to a height above the carrier platform 34. Then, the upper transfer plate 82 retracts, the carrier motor 51 rotates in the opposite direction, and drives the carrier 5 to descend, placing the wafer stably on the annular support surface of the carrier platform 34, with the center of the wafer to be detected aligned with the detection slot 33.

[0046] Next, the longitudinal bearing linear module 61 drives the bearing seat 31 to move to the pressure ring 41 pick-up and drop station. The pick-up and drop cylinder 43 extends and drives the pick-up and drop plate 42 to descend, placing the adsorbed pressure ring 41 on the top surface of the wafer edge. Then, the rotating clamping cylinder 35 first drives the fixing rod 36 to rotate 90 degrees so that the end is aligned with the pressure ring 41, and then descends to evenly press the pressure ring 41, so that the wafer edge is firmly clamped without warping. Next, the carrier 31 moves to directly below the carrier camera assembly 13, and the high-definition industrial camera captures an image of the wafer, extracts three reference marker points on the edge, and calculates the translational deviation in the X and Y directions. Then, the longitudinal carrier linear module 61 and the transverse carrier linear module 62 are driven to complete the X-axis and Y-axis translational correction, so that the center of the wafer coincides with the center of the inspection slot 33. At the same time, the correction carrier linear module 65 drives the carrier roller 66 to push the carrier correction rod 67, so that the carrier 31 rotates around the hinge axis. With the reset tension of the carrier tension spring 64, the angle correction is completed, and finally the overall correction of the wafer is completed.

[0047] After the correction is completed, the carrier 31 moves to the testing station of the testing mechanism 2. Then, the testing motor 28 rotates in the forward direction, driving the upper and lower test screws 29 with opposite rotation directions to rotate. This causes the upper test nut 23 and the lower test nut 26 to drive the upper test plate 22 and the lower test plate 25 to move synchronously towards each other. When the upper test probe 24 and the lower test probe 27 simultaneously contact the pads on both sides of the wafer and reach the preset pressure, the testing motor 28 stops and remains in place. Then, the electrical parameters of the front and back sides of the wafer are tested in one go, with a testing time of about 20 seconds. Meanwhile, while the wafer in the first carrier mechanism 3 is being inspected, the transfer mechanism 8 has completed the picking and identification of the second wafer, and the second carrier mechanism 3 simultaneously completes all the preparatory work for wafer handover, fixing of the pressure ring 41 and triaxial correction. After the wafer inspection in the first carrier mechanism 3 is completed, the inspection motor 28 rotates in the reverse direction, driving the upper test needle 24 and the lower test needle 27 to synchronously reset to a safe position; if the inspection determines that the wafer is defective, the longitudinal carrier linear module 61 and the transverse carrier linear module 62 drive the wafer to move below the dot marker 14, and the dot marker 14 marks the wafer with ink. Next, the rotating clamping cylinder 35 drives the fixing rod 36 to rise and rotate 90 degrees in the opposite direction to disengage from the pressure ring 41. The pick-and-place cylinder 43 descends, and the pick-and-place nozzle 44 opens the vacuum adsorption pressure ring 41 and resets it. The carrier 5 rises again to lift the wafer, and the lower transfer plate 83 of the transfer mechanism 8 extends to adsorb the detected wafer and then retracts. The transfer rotary motor 96 drives the transfer stage 81 to rotate to the drying platform 11. The wafer is placed on the drying platform 11 for drying to prevent ink from spreading and contaminating the circuit area. After drying, the transfer mechanism 8 transports the wafer to the adjustment station. The adjustment lifting linear module 93 drives the adjustment table 931 to rise, and the adjustment plate 933 extends from the transfer opening slot 86 to support the wafer, so that the wafer is completely separated from the first transfer arm 84 and the second transfer arm 85. Then, the transfer camera component 88 captures an image of the wafer, calculates the rotation angle deviation, and adjusts the motor 932 to drive the adjustment plate 933 to rotate to compensate for the deviation, completing the secondary correction. Finally, the adjustment table 931 descends, and the wafer falls back to the first transfer arm 84 and the second transfer arm 85. The transfer rotary motor 96 drives the transfer table 81 to rotate to the loading and unloading station, and places the wafer in the corresponding material slot 73 according to the detection results.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A fully automated dual-station wafer double-sided inspection device, characterized in that: Includes a machine base (1); the machine base (1) is equipped with a detection mechanism (2) and a bearing mechanism (3); The testing mechanism (2) includes a testing seat (21) on the machine base (1), an upper test needle (24) on the testing seat (21), and a lower test needle (27) on the testing seat (21); the upper test needle (24) is located at the top of the lower test needle (27); The support mechanism (3) includes a support base (31) movably mounted on the machine base (1); a support top plate (32) is provided on the top of the support base (31); a detection groove (33) is provided through the middle of the support top plate (32); a support platform (34) for placing wafers is provided on the outer periphery of the detection groove (33) of the support top plate (32); the support mechanism (3) also includes a pressure ring (41) detachably connected to the support platform (34); the support base (31) is provided with a fixing component for fixing the pressure ring (41) to the support platform (34); The machine base (1) is provided with a support frame (12); the bearing mechanism (3) also includes a pick-and-place assembly (4) provided on the support frame (12) for picking up and placing the pressure ring (41).

2. The fully automated dual-station wafer double-sided inspection device according to claim 1, characterized in that: The detection mechanism (2) includes an upper detection plate (22) and a lower detection plate (25); the upper test needle (24) and the lower test needle (27) are respectively disposed on the upper detection plate (22) and the lower detection plate (25); the detection mechanism (2) also includes a detection motor (28) disposed on the detection seat (21), a detection screw (29) rotatably disposed on the detection seat (21), an upper detection nut (23) sleeved on the top of the detection screw (29), and a lower detection nut (24) sleeved on the bottom of the detection screw (29). 6); The output end of the detection motor (28) is connected to the detection lead screw (29); The detection lead screw (29) extends along the Z-axis direction; The top and bottom of the detection lead screw (29) are respectively provided with external threads with opposite directions; The upper detection plate (22) and the lower detection plate (25) are respectively connected to the upper detection nut (23) and the lower detection nut (26); The upper detection plate (22) and the lower detection plate (25) are both slidably disposed on the detection seat (21) along the Z-axis direction.

3. The fully automated dual-station wafer double-sided inspection device according to claim 1, characterized in that: The pick-and-place assembly (4) includes a pick-and-place plate (42) slidably disposed on the support frame (12) along the Z-axis direction, a pick-and-place cylinder (43) disposed on the support frame (12), and a pick-and-place suction nozzle (44) disposed on the pick-and-place plate (42); the pick-and-place suction nozzle (44) is used to pick up and place the pressure ring (41); the pick-and-place suction nozzle (44) is disposed on the top of the bearing top plate (32); the output end of the pick-and-place cylinder (43) is connected to the pick-and-place plate (42); The fixing assembly includes a fixing rod (36) movably mounted on the support platform (34) and a rotary clamping cylinder (35) mounted on the support seat (31); the output end of the rotary clamping cylinder (35) is connected to the fixing rod (36); the rotary clamping cylinder (35) drives the fixing rod (36) to rotate and rise.

4. The fully automated dual-station wafer double-sided inspection device according to claim 1, characterized in that: A carrier (5) is movably provided in the middle of the detection groove (33) along the Z-axis direction; a carrier motor (51) is provided on the carrier seat (31); an upper carrier wheel (52) and a lower carrier wheel (53) are rotatably provided on the carrier seat (31); the upper carrier wheel (52) is located on the top of the lower carrier wheel (53); a carrier synchronous belt (54) is provided between the upper carrier wheel (52) and the lower carrier wheel (53); the output end of the carrier motor (51) is connected to the lower carrier wheel (53); a carrier connecting rod (55) is slidably provided on the carrier seat (31) along the Z-axis direction; the carrier connecting rod (55) is connected to one side of the carrier synchronous belt (54) and the carrier (5) respectively.

5. The fully automated dual-station wafer double-sided inspection device according to claim 1, characterized in that: The machine base (1) is provided with a longitudinal bearing linear module (61) extending along the Y-axis; the output end of the longitudinal bearing linear module (61) is provided with a transverse bearing linear module (62) extending along the X-axis; the output end of the transverse bearing linear module (62) is provided with a bearing base plate (63); the bearing seat (31) is rotatably mounted on the bearing base plate (63); A bearing tension spring (64) is provided between one end of the bottom of the bearing seat (31) along the X-axis direction and the bearing base plate (63); the bearing base plate (63) is provided with a straight-line correction bearing module (65) extending along the Y-axis direction; a bearing roller (66) is rotatably provided at the output end of the straight-line correction bearing module (65); a bearing correction rod (67) is provided at the other end of the bottom of the bearing seat (31) along the X-axis direction, which abuts against the bearing roller (66); The support frame (12) is equipped with a camera assembly (13).

6. The fully automated dual-station wafer double-sided inspection device according to claim 1, characterized in that: The machine base (1) is provided with a loading and unloading mechanism (7); the loading and unloading mechanism (7) includes a loading and unloading linear module (71) extending along the Z-axis direction and located on the machine base (1) and a material box (72) located at the output end of the loading and unloading linear module (71); the material box (72) is provided with multiple material slots (73) arranged along the Z-axis direction. The support frame (12) is equipped with a dotting device (14); the machine base (1) is equipped with a drying platform (11); The support frame (12) is equipped with a detector card (15).

7. The fully automated dual-station wafer double-sided inspection device according to claim 1, characterized in that: The machine base (1) is equipped with a material transfer mechanism (8); The material transfer mechanism (8) includes a material transfer platform (81), an upper material transfer plate (82) slidably disposed on the material transfer platform (81) along a first direction, and a lower material transfer plate (83) slidably disposed on the material transfer platform (81) along a first direction; the upper material transfer plate (82) is movably disposed on the top of the lower material transfer plate (83); The upper transfer plate (82) and the lower transfer plate (83) are each provided with a first transfer arm (84) and a second transfer arm (85); a transfer opening groove (86) is formed between the first transfer arm (84) and the second transfer arm (85); The material transfer mechanism (8) further includes an adjustment platform (931) that is slidably disposed on the material transfer table (81) along the Z-axis direction; the adjustment platform (931) is provided with an adjustment motor (932); the output end of the adjustment motor (932) is provided with an adjustment plate (933); the diameter of the adjustment plate (933) is smaller than the width of the material transfer opening groove (86).

8. The fully automated dual-station wafer double-sided inspection device according to claim 7, characterized in that: The transfer platform (81) is provided with an upper transfer motor (91), an upper transfer synchronous wheel (911), an upper transfer synchronous belt (912), an upper transfer slide rail (913), and an upper C-shaped slider (914) on one side along the second direction; the upper transfer slide rail (913) extends along the first direction; the first direction is perpendicular to the second direction; the output end of the upper transfer motor (91) is connected to the upper transfer synchronous wheel (911); the upper transfer synchronous belt (912) is sleeved on the upper transfer synchronous wheel (911); the upper C-shaped slider (914) is connected to the upper transfer synchronous belt (912) and the upper transfer plate (82) respectively; the upper C-shaped slider (914) is slidably disposed on the upper transfer slide rail (913); The transfer platform (81) is provided with a lower transfer motor (92), a lower transfer synchronous wheel (921), a lower transfer synchronous belt (922), a lower transfer slide rail (923), and a lower C-shaped slider (924) on the other side along the second direction; the lower transfer slide rail (923) extends along the first direction; the output end of the lower transfer motor (92) is connected to the lower transfer synchronous wheel (921); the lower transfer synchronous belt (922) is sleeved on the lower transfer synchronous wheel (921); the lower C-shaped slider (924) is connected to the lower transfer synchronous belt (922) and the lower transfer plate (83) respectively; the lower C-shaped slider (924) is slidably disposed on the lower transfer slide rail (923).

9. The fully automated dual-station wafer double-sided inspection device according to claim 7, characterized in that: The transfer stage (81) is provided with a transfer camera assembly (88) on the top of the adjustment plate (933); the first transfer arm (84), the second transfer arm (85), the upper transfer plate (82) and the lower transfer plate (83) are all provided with vacuum holes (87).

10. A fully automated dual-station wafer double-sided inspection device according to claim 7, characterized in that: The transfer table (81) is provided with an adjustment lifting linear module (93) extending along the Z-axis direction; the output end of the adjustment lifting linear module (93) is connected to the adjustment table (931); The material transfer mechanism (8) further includes a material transfer seat (94) provided on the machine base (1), a material transfer rotary table (95) rotatably provided on the material transfer seat (94), a material transfer rotary motor (96) provided on the material transfer seat (94), and a material transfer movable plate (97) provided on the material transfer rotary table (95); the material transfer rotary motor (96) is used to drive the material transfer rotary table (95) to rotate; the material transfer table (81) is slidably provided on the material transfer movable plate (97) along the second direction; the material transfer movable plate (97) is provided with a material transfer linear module (98) extending along the second direction; the output end of the material transfer linear module (98) is connected to the material transfer table (81).

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