Integrated tooling for MEMS probe card assembly and method of assembly thereof

Abstract

The application relates to an integrated tool for MEMS probe card assembly and an assembly method thereof, and relates to the technical field of semiconductor wafer testing. The integrated tool comprises a tool main body, which is provided with a main rib, an auxiliary rib, a reference surface main support frame, a reference surface boss, a leveling assembly, a fixed grab seat and a fixed seat; the main rib and the auxiliary rib are coplanarly arranged, the frame surface of the reference surface main support frame is higher than the coplanar surface and forms a sunken space; the top surface of the reference surface boss is coplanar with the frame surface of the reference surface main support frame and forms a point-like support for a PCB; and the leveling assembly penetrates through the auxiliary rib, the reference surface boss, the PCB and an intermediate layer and then abuts against the bottom surface of a probe head substrate. The application further discloses an assembly method based on the integrated tool. The application has the advantages that the sunken space design solves the problems of PCB device avoidance and thermal expansion and contraction impact, the tool has the functions of support, fixation, leveling and installation, and the probe card assembly process is simplified.

Description

Technical Field

[0001] This invention relates to an integrated tooling for assembling MEMS probe cards, belonging to the field of semiconductor wafer testing. Background Technology

[0002] In semiconductor wafer testing, the probe card serves as the interface between the tester and the wafer under test. It is a core device in the chip probing (CP) stage of wafer probing, and its performance directly affects testing efficiency, cost, and coverage. MEMS probe cards were first developed by FormFactor in 1998. They utilize MEMS technology to fabricate probes and pins, using bonding or resin bonding to MLC (Multilayer Ceramic) substrates to create 2D or 3D MEMS probe cards. However, only the probe head is fabricated using MEMS technology; it still needs to be assembled with PCB (Printed Circuit Board), intermediate layers, and other components to obtain a complete probe card.

[0003] In existing technologies, solutions involving MEMS probe cards and their assembly fall into the following categories:

[0004] The first category involves the assembly method of the probe head itself. For example, Chinese patent application CN104345181A, "A method and system for assembling probe heads on a probe card," discloses a method where multiple positioning plates are stacked to align the holes on each plate. After the probes are inserted into their corresponding holes, the positioning plates are separated by separators, allowing the probes to bend or twist when contacting the component under test. This solution primarily addresses the efficiency of probe insertion into the positioning plates and the control of probe bending; it pertains to the probe assembly process within the probe head itself and does not involve the assembly and fixing structure between the probe head and the PCB.

[0005] The second category involves the overall architecture design of modular probe cards. For example, Chinese patent application CN120722034A, "A Wafer-Level Modular Probe Card," discloses a design that uses multiple modular, replaceable probe head modules arranged in a rectangular array on a probe head mounting plate. The probe head modules achieve flexible electrical connection to the PCB motherboard module via ceramic substrates and spring probes. A height-adjusting module provides a Z-axis mounting reference surface for the probe head mounting plate, and Z-axis flatness adjustment screws finely adjust the local Z-axis height of each ceramic substrate. This solution primarily addresses the issue of increasing the number of probes tested simultaneously and improving testing efficiency. However, each probe head module is still independently and directly mounted on the probe head mounting plate, lacking an integrated reinforcing rib structure to uniformly and securely assemble the probe head, intermediate layer, and PCB together. Furthermore, its height-adjusting surface is a continuous plane, requiring high processing precision.

[0006] The third category involves fine-tuning and positioning of the probe tip and support structure. For example, Chinese patent application CN122449322A, "A Close-packed Vertical Probe Card," discloses a method that uses an inner support frame and an outer support frame in the lower support assembly, and a fine-tuning mechanism composed of set screws and / or deformation structures between the inner and outer support frames. This mechanism adjusts and fixes the position of the inner support frame within the outer support frame, achieving micro-dimensional adjustment of the probe tip position. This solution primarily addresses the problem of adjusting minute positional deviations of the probe tip in a close-packed probe card. However, its inner and outer support frames are located below the PCB, resulting in a complex structure. Furthermore, it represents a localized support structure optimization downstream of the probe card, rather than an integrated tooling for the overall assembly of the probe tip, intermediate layer, and PCB.

[0007] The fourth type is the reinforcing rib technology widely used in MEMS probe card assembly. Currently, reinforcing ribs for MEMS probe assembly are mainly available in two forms: separate and integral.

[0008] Split-type reinforcing ribs generally consist of two parts: an inner ring and an outer ring, which respectively fix the middle part and the outside of the probe card;

[0009] Integral reinforcing bars do not distinguish between main bars and secondary bars, and all reinforcing bars do not differentiate between support methods, but share the same support and fixation functions in the same way.

[0010] In both of the above methods, whether it is a separate unit or a whole unit, the reinforcement, beams or frames are all set on the same plane, and there is no local height difference.

[0011] In addition, the following technical solutions exist in the assembly process of existing probe cards: such as the use of positioning and transfer fixtures to achieve precise positioning and transfer between ceramic substrates in Chinese patent application CN120722034A, and the use of Z-down pressing fixtures to achieve uniform Z-direction pressing of probe head fixing plate. However, these are all auxiliary assembly tools and do not involve the improvement of the reinforcing rib structure that integrates the probe head, intermediate layer and PCB into one.

[0012] Based on the above-mentioned existing technologies, the existing MEMS probe card reinforcement ribs and assembly solutions mainly have the following disadvantages or deficiencies:

[0013] 1. All components of the existing reinforcing ribs are located on the same plane, resulting in a significant reduction in mounting space on the PCB. When tall or large components are placed on the PCB, the shape of the reinforcing ribs must be changed or bent to avoid these components or locations, which directly weakens the strength, structural rigidity, and stability of the reinforcing ribs.

[0014] 2. Existing reinforcing ribs are packaged using a planar bonding method, with each part tightly fitted together. Sometimes, more than one intermediate layer is required for assembly. When exposed to harsh external environmental factors such as temperature changes, the different coefficients of thermal expansion between the resin material of the PCB, the MLC ceramic substrate of the probe tip, and the metal material of the reinforcing rib cause mutual influence and stress during thermal expansion and contraction. Ultimately, this results in the probe tip level of the assembled probe card failing to meet testing requirements.

[0015] 3. Existing assembly methods all use ordinary fastening screws to connect and fix the components. The adjustment of the level depends on the machining accuracy of each component and the experience of the assembly operation. There is no special leveling device to accurately control the level of the probe tip substrate, making it difficult to achieve precise control of the probe tip flatness.

[0016] 4. Since all components of the existing reinforcing rib must be on the same plane, any machining error will directly affect the flatness of the entire reference surface, requiring extremely high machining accuracy, making machining difficult and manufacturing costly.

[0017] 5. The reference surface of the existing reinforcing rib is a continuous large-area plane. To ensure the overall flatness, high-precision machining of the large area is required, which further increases the machining difficulty and cost.

[0018] 6. The impact of PCB thermal expansion and contraction on the probe tip reference surface is not adequately addressed. For example, Chinese patent application CN120722034A uses equal-height blocks to form an equal-height surface to provide a Z-axis reference for the probe tip fixing plate, but it does not consider the deformation problem caused by the difference in thermal expansion coefficients between the PCB, ceramic substrate, and skeleton. In existing solutions, the connections between the probe tip substrate MLC and the reinforcing skeleton, as well as between the PCBs, are all rigid connections. When the temperature changes, the PCB resin material, which has the largest thermal expansion coefficient, deforms the most, directly impacting the rigidly connected reinforcing skeleton reference surface and MLC, causing changes in the probe tip flatness and affecting test stability.

[0019] 7. Whether it is a split or integral reinforcing rib, each component performs the same support and fixation function, lacking functional hierarchy. For example, the inner and outer support frames in CN122449322A only provide support and fine-tuning, and the probe head fixing plate in CN120722034A only provides support and positioning for the probe head module. Neither forms a multi-layered, multi-functional integrated reinforcing rib structure with main ribs, secondary ribs, and reference surfaces, making it difficult to simultaneously achieve multiple functions such as high-strength support, PCB component avoidance, thermal deformation isolation, and precise leveling in the same fixture.

[0020] In summary, the existing technology lacks an integrated tooling for MEMS probe card assembly that can simultaneously solve the above problems, achieve a simple and efficient way to firmly assemble the probe head, intermediate layer and PCB, and at the same time ensure the high precision requirement of probe tip levelness. Summary of the Invention

[0021] To overcome the shortcomings of existing technologies, this invention provides an integrated tooling for assembling MEMS probe cards and its assembly method. The technical solution of this invention is as follows:

[0022] An integrated tooling for assembling MEMS probe cards includes:

[0023] The tooling body is provided with main ribs, secondary ribs, a reference surface main support frame, a reference surface boss, a leveling component, a fixed gripper and a fixed seat;

[0024] The main reinforcement and the secondary reinforcement are arranged in the same plane, and the frame surface of the reference plane main support frame is higher than the plane where the main reinforcement and the secondary reinforcement are located;

[0025] The reference surface boss is disposed on the main rib and / or the secondary rib, and the top surface of the reference surface boss is coplanar with the frame surface of the reference surface main support frame, for forming point support for the PCB;

[0026] The leveling component is disposed on the reference surface boss and is used to level the PCB and the probe head substrate. The leveling component passes through the sub-rib, the reference surface boss 5, the PCB and the intermediate layer and then abuts against the bottom surface of the probe head substrate.

[0027] The fixed gripper and the fixed base are respectively disposed on the outside of the main support frame of the reference surface and extend to the outer edge of the PCB, for mounting the integrated tooling on the probe stage.

[0028] The main reinforcement consists of four supporting beams arranged in a star-shaped pattern. The length of the main reinforcement is equal to the inner diameter of the main support frame of the reference surface. The cross-section of the beam of the main reinforcement is square or trapezoidal. The reference surface boss is provided at the upper part of the intersection area of ​​the four supporting beams of the main reinforcement, and a support frame sleeve for installing the leveling component is provided at the lower part of the intersection area.

[0029] The secondary rib is a circular inner ring support frame. The diameter of the secondary rib is smaller than the diameter of the probe head base plate. The cross-section of the secondary rib frame is square or trapezoidal. The secondary rib and the root support beam of the main rib form 8 intersection areas. The reference surface boss is provided on the upper part of the 8 intersection areas of the secondary rib and the main rib. A support frame sleeve for installing the leveling component is provided on the lower part of the 8 intersection areas. The frame surface of the secondary rib and the beam surface of the main rib are located on the same plane and are sunk by a predetermined distance relative to the frame surface of the reference surface main support frame. The predetermined distance is 3-6mm.

[0030] The reference surface main support frame is a circular outer ring support frame connected to the main rib. The cross-section of the reference surface main support frame is square or trapezoidal. The reference surface main support frame is located on the periphery of the secondary rib. The reference surface main support frame, the reference surface boss, the fixed gripper, and the fixed seat are located on the same plane and together constitute the basic surface of the probe card assembly. The height of this basic surface is fixed and cannot be adjusted.

[0031] The upper part of the reference surface main support frame is provided with several internal thread non-through holes and positioning posts. The internal thread non-through holes are used to lock the reference surface main support frame with the bottom layer of the PCB by engaging with the external threads of the fastening screws, so as to support and fix the PCB. The positioning posts are used to pass through the preset positioning holes on the PCB to position the intermediate layer and the probe head substrate.

[0032] Several slots are provided at the lower part of the main support frame of the reference surface. Each slot has a through hole in the center. The external thread of the fixing screw with a fixed length threaded sleeve passes through the through hole of the slot and the corresponding preset through hole on the PCB, and then engages and locks with the preset internal thread on the metal fixing ring of the probe head substrate, thereby supporting and fixing the outer metal fixing ring of the probe head substrate. A pressure plate is provided in the slot, and the pressure plate presses the bottom of the fixing screw to tighten the fixing screw.

[0033] The reference surface boss is frustum-shaped, and a through hole is provided in the middle of the reference surface boss for the support frame sleeve of the leveling component to pass through. There are a total of 9 reference surface bosses, which are respectively located at the center of the intersection area of ​​the 4 support beams of the main reinforcement, and at the 8 intersection areas of the 4 support beams of the main reinforcement and the secondary reinforcement. The diameter of the reference surface boss located at the center of the intersection area of ​​the 4 support beams of the main reinforcement is smaller than the size of the intersection area, and the diameter of the reference surface boss located at the 8 intersection areas of the 4 support beams of the main reinforcement and the secondary reinforcement is smaller than the width of the secondary reinforcement.

[0034] The top surfaces of the nine reference surface bosses are on the same plane as the frame surface of the reference surface main support frame. The top surfaces of the reference surface bosses are attached to the bottom layer of the PCB and form point support for the central area of ​​the PCB.

[0035] The leveling assembly comprises nine sets, each set corresponding to one of the nine reference surface bosses. Each leveling assembly includes a support frame sleeve, a PCB sleeve inner thread, a probe card substrate sleeve, a substrate positioning post, leveling screws, and a pressure plate.

[0036] The support frame sleeve passes through the through hole of the reference surface boss and is fixed on the secondary rib and / or the main rib; the leveling screw passes through the support frame sleeve, the preset through hole on the PCB, and the probe card substrate sleeve in sequence, and then engages and locks with the inner thread of the PCB sleeve and the inner thread of the substrate positioning post, thereby supporting and fixing the middle part of the PCB and the middle part of the probe head substrate; the levelness of the PCB and the probe head substrate is adjusted by turning the leveling screw.

[0037] The fixed gripper is connected to the outside of the intersection of two mutually perpendicular support beams of the main support frame and the main rib, and extends to the outer edge of the PCB. The fixed gripper is a trapezoidal column with a square cross-section. The top surface of the fixed gripper 7 is coplanar with the frame surface of the main support frame and closely adheres to the bottom layer of the PCB, providing support for the outer edge of the PCB. The fixed gripper is provided with gripper holes for matching the grippers on the probe station to install the integrated tooling on the probe station.

[0038] The fixing seat is connected to the outside of the intersection of the main support frame of the reference surface and the other two mutually perpendicular support beams of the main rib, and extends to the outer edge of the PCB. The fixing seat is a trapezoidal column with a square cross-section. The top surface of the fixing seat is coplanar with the frame surface of the main support frame of the reference surface and is in close contact with the bottom layer of the PCB, providing support for the outer edge of the PCB. The fixing seat is provided with a fixing seat circular hole for installing fasteners to fix the probe card to the probe stage.

[0039] An assembly method based on an integrated tooling for MEMS probe card assembly includes the following steps:

[0040] Step S1: The reference surface main support frame is locked by engaging the inner thread non-through hole with the outer thread of the fastening screw, so that the reference surface main support frame is in contact with the bottom layer of the PCB, and the PCB is supported and fixed. At the same time, the positioning post passing through the PCB positions the intermediate layer and the probe head substrate.

[0041] Step S2: The external thread of the fixing screw with a fixed length thread sleeve in the slot at the lower part of the reference surface main support frame passes through the through hole of the slot and the corresponding preset through hole on the PCB, and then engages and locks with the preset internal thread on the metal fixing ring of the probe head substrate, thereby supporting and fixing the outer peripheral metal fixing ring of the probe head substrate. Then, the bottom of the fixing screw is pressed by the pressure plate set in the slot for tightening.

[0042] Step S3: The leveling screw of the leveling component passes through the support frame sleeve of the secondary rib and the reference surface boss, the preset through hole of the intermediate layer, and the probe card substrate sleeve in sequence, and then engages and locks with the inner thread of the PCB sleeve and the inner thread of the substrate positioning post to support and fix the middle part of the PCB and the middle part of the probe head substrate. The PCB and the probe head substrate are leveled by turning the leveling screw.

[0043] Step S4: Match the gripper on the probe stage with the gripper hole on the fixed gripper, and insert the fastener through the fixed seat round hole on the fixed seat to install and fix the assembled probe card on the probe stage.

[0044] The advantages of this invention are:

[0045] 1. A multi-layered design is adopted, consisting of main ribs, secondary ribs, a main support frame for the reference surface, and reference surface bosses. This design ensures a clear structural hierarchy and well-defined functions for each component. The main ribs serve as the primary framework, providing the main support. The secondary ribs reinforce the main ribs and provide support for the central area. The main support frame for the reference surface forms a fixed reference on the outer edge of the PCB, while the reference surface bosses provide point-like support references for the central area of ​​the PCB. Fixed grippers and mounting bases facilitate the installation and connection between the probe card and the probe station. Through the functional division of each layer, the probe head, intermediate layer, and PCB of the MEMS probe card can be securely assembled into a single unit in a simple and effective manner, solving the problems of single function and unclear hierarchy in existing reinforcing ribs.

[0046] 2. The main rib surface and the secondary rib surface are coplanar, and the main support frame surface is recessed by a predetermined distance of 3-6mm, preferably 5mm, relative to the reference surface. This recessed setting provides ample installation space for components on the PCB, eliminating the need to bend or change the shape of the reinforcing rib to avoid components, thus ensuring the overall strength and structural stability of the reinforcing rib. More importantly, this recessed setting fully considers the difference in thermal expansion coefficients between the resin material of the PCB and the metal material of the reinforcing rib, such as stainless steel, aluminum alloy, or ceramic. When the temperature changes, the thermal expansion and contraction deformation of the PCB is the greatest. The recessed space allows the PCB to expand or contract freely in the horizontal direction, avoiding direct impact of the PCB on the reference surface of the reinforcing rib and the MLC substrate. This effectively solves the technical problem of probe tip levelness not meeting the standards due to the difference in thermal expansion coefficients.

[0047] 3. Nine frustum-shaped reference bosses replace the traditional continuous large-area reference surface. These bosses are distributed in a point-like pattern, forming point contact support with the PCB bottom layer. This structural design greatly reduces the total area of ​​the reference surface. Only the top surfaces of the nine small-area bosses need to be precisely machined to ensure the accuracy of the reference surface. This significantly reduces the processing difficulty and manufacturing cost of the reinforcing rib body. At the same time, due to the reduction in processing area, processing accuracy is more easily guaranteed.

[0048] 4. Nine sets of through-type leveling components are specially designed and installed at the nine reference surface bosses, each of which is independently controllable. The leveling screws pass through the support frame sleeve, PCB, and intermediate layer sequentially from the main fixture body, and then engage and lock with the inner threads of the PCB sleeve and the substrate positioning post. By independently fine-tuning the Z-axis height at nine points in the middle of the probe head substrate, precise control of the levelness of the PCB and probe head substrate is achieved.

[0049] 5. The main tooling integrates four major functions: supporting the main and secondary ribs, fixing the main support frame of the reference surface, fixing screws and pressure plates with internal thread holes and slots, leveling 9 sets of leveling components, and installing and fixing grippers and fixing seats. The entire process of positioning, supporting, fixing and leveling the PCB and probe head substrate can be completed in one installation without the need for additional auxiliary tooling, which greatly simplifies the assembly process of the probe card and improves assembly efficiency and consistency.

[0050] 6. Through the cross-shaped skeleton of the main reinforcement, the circular inner ring support of the secondary reinforcement, the outer ring support of the main support frame of the reference surface, the point support of the 9 protrusions, and the outer edge support of the conventional fixed gripper and fixed seat, a multi-level, multi-point support network is formed from the center to the periphery. The stress points are evenly distributed and the stress transmission path is reasonable, ensuring the stability and deformation resistance of the probe card in the overall structure during the test.

[0051] 7. A pressure plate is installed in the slot at the bottom of the main support frame of the reference surface to provide secondary tightening of the bottom of the fixing screws; a pressure plate is also installed in the leveling assembly to tighten the leveling screws. Through the double locking mechanism of the pressure plates, the screws are effectively prevented from loosening due to vibration during the test, ensuring the connection reliability of the probe card for long-term use. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the main structure of the present invention.

[0053] Figure 2 yes Figure 1 Rear view. Detailed Implementation

[0054] The present invention will be further described below with reference to specific embodiments, and the advantages and features of the present invention will become clearer as a result. However, these embodiments are merely exemplary and do not constitute any limitation on the scope of the present invention. Those skilled in the art should understand that modifications or substitutions can be made to the details and form of the technical solutions of the present invention without departing from the spirit and scope of the present invention, but all such modifications and substitutions fall within the protection scope of the present invention.

[0055] See Figure 1 and Figure 2 This invention relates to an integrated tooling for assembling MEMS probe cards, comprising:

[0056] The tooling body 1 is provided with main rib 2, secondary rib 3, reference surface main support frame 4, reference surface boss 5, leveling component 6, fixed gripper 7 and fixed seat 8.

[0057] The main reinforcement 2 and the secondary reinforcement 3 are arranged in the same plane, and the frame surface of the reference plane main support frame 4 is higher than the plane where the main reinforcement 2 and the secondary reinforcement 3 are located;

[0058] The reference surface boss 5 is disposed on the main rib 2 and / or the secondary rib 3. The top surface of the reference surface boss 5 is coplanar with the frame surface of the reference support frame 4, and is used to form point support for the PCB.

[0059] The leveling component 6 is disposed on the reference surface boss 5 and is used to level the PCB and the probe head substrate. The leveling component 6 passes through the secondary rib 3, the reference surface boss 5, the PCB and the intermediate layer and then abuts against the bottom surface of the probe head substrate.

[0060] The fixed gripper 7 and the fixed base 8 are respectively disposed on the outside of the main support frame 4 of the reference surface and extend to the outer edge of the PCB, for mounting the integrated tooling on the probe stage.

[0061] The tooling body 1 is made of stainless steel, aluminum alloy or ceramic; the diameter of the reference surface main support frame 4 is set to 340mm based on the total diameter of the probe head base plate (300mm) and the outer metal fixing ring (335mm); the diameter of the secondary rib 3 is set to 150mm based on the diameter of the probe head base plate (300mm); the leveling component 6 is adjusted by leveling screws.

[0062] The main rib 2 and the secondary rib 3 are arranged on the same plane, while the frame surface of the reference plane main support frame 4 is higher than this coplanar plane, forming a recessed space of a predetermined height among the three. This recessed space provides sufficient clearance for components on the PCB, avoiding structural strength loss caused by bending the reinforcing ribs to avoid components; on the other hand, the recessed space allows the PCB with the largest coefficient of thermal expansion to freely expand and contract in the horizontal direction. When the temperature changes, the expansion and deformation of the PCB will not directly impact the reference plane main support frame 4 and the probe tip substrate, effectively eliminating the problem of probe tip inaccuracy caused by the different coefficients of thermal expansion of the materials of each component.

[0063] The reference surface boss 5 is disposed on the main rib 2 and / or the secondary rib 3, and its top surface is coplanar with the frame surface of the reference surface main support frame 4, together forming the basic surface for probe card assembly. Unlike the prior art that uses a continuous large-area plane as the reference surface, the reference surface of the present invention is composed of the top surfaces of point-shaped bosses distributed in various intersection areas. Only the top surfaces of 9 small-area bosses need to be precisely machined to ensure the flatness of the entire reference surface, which greatly reduces the machining area and the machining difficulty. At the same time, due to the reduction in machining area, the machining accuracy of the reference surface is more easily guaranteed.

[0064] The leveling component 6 is mounted on the reference surface boss 5 and passes through the secondary rib 3, the reference surface boss 5, the PCB, and the intermediate layer before directly abutting the bottom surface of the probe head substrate. This through-type connection allows the leveling component 6 to apply a Z-axis adjustment force directly to the probe head substrate from the middle of the fixture body, independent of the conventional fixing structure. Through independent adjustment at 9 points, the levelness of the probe head substrate is controlled.

[0065] The main reinforcement 2 consists of four supporting beams arranged in a cross shape. The length of the main reinforcement 2 is equal to the inner diameter of the reference surface main support frame 4. The cross-section of the beam of the main reinforcement 2 is square or trapezoidal. The reference surface boss 5 is provided at the upper part of the intersection area of ​​the four supporting beams of the main reinforcement 2, and the support frame through sleeve 61 for installing the leveling component 6 is provided at the lower part of the intersection area.

[0066] The main ribs 2 consist of four intersecting support beams arranged in a star-shaped pattern. Their lengths are equal to the inner diameter of the main support frame 4, ensuring that both ends of the main ribs 2 connect precisely to the inner edge of the main support frame 4. This connection ensures that the Z-axis load on the probe card during testing can be evenly transferred from the intersection center of the main ribs 2 along the four support beams to the outer circular main support frame 4, forming a complete force flow path, avoiding stress concentration, and maximizing the overall strength of the frame. Simultaneously, the symmetrical distribution of the star-shaped, perpendicularly intersecting structures in all directions achieves equal stiffness in the X and Y directions, ensuring equal bending and torsional resistance in any direction and improving the overall rigidity and stability of the probe card structure.

[0067] In the intersection area of ​​the four supporting beams of the main rib 2, the upper part is provided with the reference surface boss 5, and the lower part is provided with a support frame sleeve 61 for installing the leveling component 6. The beam cross-section of the main rib 2 is designed to be square or trapezoidal to ensure sufficient structural strength. This coordinated upper and lower arrangement allows the same intersection area to perform two functions simultaneously: the reference surface boss 5 and the reference surface main support frame 4 are coplanar, forming a stable point support for the central area of ​​the PCB; while the lower support frame sleeve 61 provides a through channel for the leveling component 6, allowing the leveling force to reach the bottom of the probe head substrate. The upper and lower functions do not interfere with each other, making full use of the space in the intersection area without the need for an additional independent leveling installation structure, further improving the structural integration of the tooling.

[0068] The secondary rib 3 is a circular inner ring support frame. The diameter of the secondary rib 3 is smaller than the diameter of the probe head base plate. The cross-section of the frame of the secondary rib 3 is square or trapezoidal. The secondary rib 3 and the four support beams of the main rib 2 form eight intersection areas. The reference surface boss 5 is provided on the upper part of the eight intersection areas of the secondary rib 3 and the main rib 2. The support frame sleeve 61 for installing the leveling component 6 is provided on the lower part of the eight intersection areas. The frame surface of the secondary rib 3 and the beam surface of the main rib 2 are located on the same plane and are sunk by a predetermined distance relative to the frame surface of the reference surface main support frame 4. The predetermined distance is 3-6mm.

[0069] The secondary rib 3 is a circular inner ring support frame, forming eight intersection areas with the four support beams of the main rib 2. Each intersection area has a reference surface boss 5 at the top and a support frame sleeve 61 for installing the leveling component 6 at the bottom. This enhances the lateral connection between the support beams of the main rib 2, effectively suppresses the radial and torsional deformation of the main rib 2 under stress, and improves the structural rigidity and torsional resistance of the overall frame. At the same time, the intersection areas and the central intersection area of ​​the main rib 2 together form nine installation points for the leveling component 6, so that the leveling force is evenly distributed in a ring in the middle area of ​​the probe head base plate, avoiding the local deformation problem caused by single-point or few-point leveling, and providing a structural foundation for subsequent precise leveling.

[0070] The surface of the secondary rib 3 is on the same plane as the beam surface of the main rib 2, and is recessed by 3-6mm relative to the surface of the main support frame 4 of the reference surface. On the one hand, this recessed space allows the central area of ​​the PCB to be suspended relative to the outer ring after it is fixed to the main support frame 4 of the reference surface. When the temperature changes cause the PCB to expand and contract, the central area can freely expand and contract within this recessed space, without exerting pushing stress on the outer ring fixed to the reference surface, effectively isolating the impact of thermal deformation on the reference surface. On the other hand, the predetermined recessed distance of 3-6mm provides sufficient space for components of different heights on the PCB, ensuring that components of any height will not interfere with the main rib 2 and the secondary rib 3. At the same time, this distance range takes into account the balance between the overall thickness control of the fixture and the structural strength, avoiding the impact on the installation compatibility of the probe clip on the probe table due to the increase in the overall thickness of the fixture caused by excessive recess.

[0071] The reference surface main support frame 4 is a circular outer ring support frame connected to the main rib 2. The cross-section of the reference surface main support frame 4 is square or trapezoidal. The reference surface main support frame 4 is located on the periphery of the secondary rib 3. The reference surface main support frame 4, the reference surface boss 5, the fixed gripper 7, and the fixed seat 8 are located on the same plane, together forming the basic surface of the probe card assembly. The height of this basic surface is fixed and cannot be adjusted.

[0072] The upper part of the reference surface main support frame 4 is provided with several internal thread non-through holes and positioning posts. The internal thread non-through holes are used to lock the reference surface main support frame 4 with the bottom layer of the PCB by engaging with the external thread of the fastening screw 11, so as to support and fix the PCB. The positioning posts are used to pass through the preset positioning holes on the PCB to position the intermediate layer and the probe head substrate.

[0073] The reference surface main support frame 4, the reference surface boss 5, the fixed gripper 7, and the fixed seat 8 are located on the same plane, together forming the basic surface for probe card assembly, and the height of this basic surface is fixed and cannot be adjusted. The reference surface main support frame 4 provides continuous peripheral support as a circular outer ring, the reference surface boss 5 provides nine point supports in the internal area, and the fixed gripper 7 and fixed seat 8 provide auxiliary support on the outer edge. Once this basic surface is processed, its height is fixed, and each subsequent assembly uses this fixed basic surface as the sole reference, eliminating the need for repeated adjustments. This ensures the consistency of the reference surfaces of each probe card during batch assembly and avoids the accumulation of assembly errors introduced by the adjustable structure.

[0074] The upper part of the reference surface main support frame 4 is simultaneously provided with several internal thread non-through holes and positioning posts. The positioning posts pass through the pre-set positioning holes on the PCB to position the intermediate layer and the probe tip substrate. After the external threads of the fastening screw 11 engage with the internal thread non-through holes and lock, the reference surface main support frame 4 is fixedly attached to the bottom layer of the PCB. The positioning posts function before the fastening screw 11. Before the fastening screw 11 is tightened, the positioning posts have already passed through the positioning holes on the PCB, pre-constraining the positions of the intermediate layer and the probe tip substrate, ensuring that the PCB, intermediate layer, and probe tip substrate maintain the correct relative positions throughout the tightening process. The fastening screw 11 then tightens, firmly attaching the PCB to the reference surface. This division of labor avoids the problem of slight displacement of the PCB due to rotational torque during the tightening process when the positioning and fixing functions are performed by the same component in traditional solutions, thus achieving high alignment accuracy between layers.

[0075] Several slots 43 are provided at the lower part of the main support frame 4 of the reference surface. Each slot 43 has a through hole in the center. The external thread of the fixing screw with a fixed length threaded sleeve passes through the through hole of the slot 43 and the corresponding preset through hole on the PCB, and then engages and locks with the preset internal thread on the metal fixing ring of the probe head substrate, thereby supporting and fixing the outer peripheral metal fixing ring of the probe head substrate. A pressure plate 15 is provided in the slot 43. The pressure plate 15 presses the bottom of the fixing screw to tighten the fixing screw.

[0076] The slots 43 are located at the lower part of the main support frame 4 on the reference surface. Each slot 43 has a through hole in the center. The external threads of the fixing screw with a fixed-length threaded sleeve pass through the through hole of the slot 43 and the corresponding preset through hole on the PCB from bottom to top, and then engage and lock with the preset internal threads on the metal fixing ring of the probe tip substrate, thereby achieving support and fixation of the outer peripheral metal fixing ring of the probe tip substrate. This through-connection method ensures that the tension direction of the fixing screw on the probe tip substrate is completely consistent with the direction of the wafer contact force (Z-direction upward) that the probe tip bears during the test. During the test, the upward reaction force on the probe tip is directly transmitted to the axial direction of the fixing screw without generating additional lateral force or bending moment, effectively avoiding warping and deformation of the probe tip substrate due to inconsistent force directions. At the same time, the fixed-length threaded sleeve limits the maximum tightening depth of the fixing screw, preventing damage to the metal fixing ring of the probe tip substrate due to over-tightening.

[0077] The slot 43 is equipped with a pressure plate 15. After the fixing screw and the inner thread of the metal retaining ring are engaged and locked, the pressure plate 15 presses the bottom of the fixing screw. The pressure plate 15 applies an auxiliary clamping force from the bottom of the screw, which, together with the axial locking force formed by the thread engagement, constitutes a double fastening. When the probe is subjected to high-frequency vibration or temperature cycling impact during the test, even if the thread pair has a slight tendency to loosen due to fretting wear, the pressure plate 15 can still maintain the axial preload of the fixing screw through continuous bottom clamping force, preventing the screw from loosening. This ensures that the outer peripheral metal retaining ring of the probe tip substrate remains firmly fixed during long-term use, avoiding problems such as changes in the level of the probe tip and unstable test signals caused by screw loosening.

[0078] The reference surface boss 5 is frustum-shaped, and a through hole 51 is provided in the middle of the reference surface boss 5 for the support frame sleeve 61 of the leveling component 6 to pass through. There are a total of 9 reference surface bosses 5, which are respectively located at the center of the intersection area of ​​the 4 support beams of the main reinforcement 2, and at the 8 intersection areas of the 4 support beams of the main reinforcement 2 and the secondary reinforcement 3. The diameter of the reference surface boss 5 located at the center of the intersection area of ​​the 4 support beams of the main reinforcement 2 is smaller than the size of the intersection area, and the diameter of the reference surface boss 5 located at the 8 intersection areas of the 4 support beams of the main reinforcement 2 and the secondary reinforcement 3 is smaller than the width of the secondary reinforcement 3.

[0079] The top surfaces of the nine reference surface bosses 5 are located on the same plane as the frame surface of the reference surface main support frame 4. The top surfaces of the reference surface bosses 5 are attached to the bottom layer of the PCB and form point support for the central area of ​​the PCB.

[0080] Nine reference surface bosses 5 are respectively located at the center of the intersection area of ​​the four supporting beams of the main rib 2 and at the eight intersection areas of the main rib 2 and the secondary rib 3. The diameter of the boss located at the center of the intersection area is smaller than the size of the intersection area, and the diameter of the boss located in the eight intersection areas is smaller than the width of the secondary rib 3. This spatial layout allows the nine bosses to form a uniform distribution of "one in the center and eight around the circumference" in the middle area of ​​the fixture body, forming multi-point contact support with the bottom layer of the PCB. Compared with traditional continuous large-area planar support, this point support structure only requires precision machining of the top surface of the nine small-area bosses to ensure the flatness of the reference surface, greatly reducing the total machining area of ​​the reference surface, and reducing the processing difficulty and manufacturing cost while ensuring support stability.

[0081] The reference surface boss 5 is frustum-shaped, with a through hole 51 in the center for the support frame sleeve 61 of the leveling component 6 to pass through. The top surfaces of the nine reference surface bosses 5 are on the same plane as the frame surface of the main support frame 4. The top surface of the reference surface boss 5 forms point support for the PCB as part of the reference surface, and the through hole 51 inside provides a through channel for the leveling component 6, allowing the leveling screw to pass through the PCB and intermediate layer from the center of the boss to the bottom surface of the probe substrate.

[0082] Nine sets of leveling components 6 are respectively installed at nine reference surface bosses 5. Each leveling component 6 includes a support frame sleeve 61, a PCB sleeve inner thread, a probe card substrate sleeve, a substrate positioning post, a leveling screw, and a pressure plate 65. The support frame sleeve 61 passes through the through hole 51 of the reference surface boss 5 and is fixed on the secondary rib 3 and / or the main rib 2. The leveling screw passes through the support frame sleeve 61, the preset through hole on the PCB, and the probe card substrate sleeve in sequence, and then engages and locks with the inner thread of the PCB sleeve and the inner thread of the substrate positioning post to support and fix the middle part of the PCB and the middle part of the probe head substrate. The levelness of the PCB and the probe head substrate is adjusted by turning the leveling screw.

[0083] Nine sets of leveling components 6 are respectively disposed at nine reference surface protrusions 5. The support frame sleeve 61 of each leveling component 6 passes through the through hole 51 of the reference surface protrusion 5 and is fixed on the secondary rib 3 and / or the main rib 2. The leveling screw passes through the support frame sleeve 61, the preset through hole on the PCB, and the probe card substrate sleeve in sequence, and then engages and locks with the inner thread of the PCB sleeve and the inner thread of the substrate positioning post. This structure allows the leveling force to act on the central area of ​​the probe head substrate through nine evenly distributed points, one of which acts on the center and eight of which act on the circumferentially distributed area. Each leveling screw is independently controllable and can be independently adjusted in the Z-direction height of the corresponding point by screwing, without interference. At the same time, the leveling screw passes through the support frame sleeve 61, the PCB, and the intermediate layer in sequence from bottom to top and then engages and locks with the inner thread of the substrate positioning post, directly transmitting the adjustment force to the bottom surface of the probe head substrate, eliminating the accumulation of errors in the intermediate transmission links. Operators can make corrections to each of the nine points one by one based on the test results of the needle tip level.

[0084] The fixed gripper 7 is connected to the outside of the intersection of two mutually perpendicular support beams of the main support frame 4 and the main rib 2 on the reference surface, and extends to the outer edge of the PCB. The fixed gripper 7 is a trapezoidal column with a square cross-section. The top surface of the fixed gripper 7 is coplanar with the frame surface of the main support frame 4 on the reference surface and is in close contact with the bottom layer of the PCB to support the outer edge of the PCB. The fixed gripper 7 is provided with gripper holes for matching the grippers on the probe station to install the integrated tooling on the probe station.

[0085] The support and installation functions are integrated into the fixed gripper 7, eliminating the need for additional mounting components for the probe station, reducing the overall number of tooling parts, and ensuring the positional accuracy of the probe on the probe station relative to the tooling reference surface.

[0086] The fixing seat 8 is connected to the outer side of the intersection of the main support frame 4 and the other two mutually perpendicular support beams of the main rib 2, and extends to the outer edge of the PCB. The fixing seat 8 is a trapezoidal column with a square cross-section. The top surface of the fixing seat 8 is coplanar with the frame surface of the main support frame 4 and closely adheres to the bottom layer of the PCB, providing support for the outer edge of the PCB. The fixing seat 8 has a fixing seat circular hole for installing fasteners to fix the probe card to the probe table. This layout allows the top surface of the fixing seat 8 and the top surface of the fixing gripper 7 to provide uniform support for the four corners of the outer edge of the PCB, preventing the outer edge of the PCB from sagging due to suspension. At the same time, the fixing seat 8 has a fixing seat circular hole, which complements the gripper hole on the fixing gripper 7. The gripper hole is used to form a quick positioning engagement with the gripper on the probe table, and the fixing seat circular hole is used to permanently or semi-permanently lock the probe card to the probe table using fasteners. The three functions of support, positioning, and locking work together at the four corners of the tooling's outer edge to ensure that the probe card remains fixed relative to the probe station during long-term testing, preventing probe card displacement caused by vibration or external impact.

[0087] The present invention also relates to an assembly method based on an integrated tooling for assembling MEMS probe cards, comprising the following steps:

[0088] Step S1: The reference surface main support frame 4 is locked by engaging the inner thread non-through hole with the outer thread of the fastening screw 11, so that the reference surface main support frame 4 is in contact with the bottom layer of the PCB, and the PCB is supported and fixed. At the same time, the positioning post passing through the PCB positions the intermediate layer and the probe head substrate.

[0089] Specifically, the fixture body 1 is placed under the PCB. The external threads of the fastening screw 11 pass through the PCB and engage with the internal threads of the main support frame 4 on the upper part of the reference surface, locking them in place. This ensures the main support frame 4 is tightly fitted to the bottom layer of the PCB, providing support and fixation for the PCB. Simultaneously, the positioning post 42, passing through the PCB, positions the intermediate layer and the probe head substrate, ensuring the correct relative positions of the three. The tightening of the fastening screw 11 and the positioning of the positioning post are completed synchronously, avoiding potential positional deviations that might be introduced by separate operations.

[0090] In this state, the coplanar surfaces of the main rib 2 and the secondary rib 3 are recessed by 3-6mm relative to the main support frame 4 of the reference plane, forming a recessed space between them. This recessed space provides ample clearance for components on the PCB, while also allowing the central area of ​​the PCB to be suspended relative to the outer ring, providing room for free expansion and contraction due to thermal changes.

[0091] Step S2: The external thread of the fixing screw with a fixed length thread sleeve in the slot 43 at the lower part of the reference surface main support frame 4 passes through the through hole of the slot 43 and the corresponding preset through hole on the PCB, and then engages and locks with the preset internal thread on the metal fixing ring of the probe head substrate, thereby supporting and fixing the outer peripheral metal fixing ring of the probe head substrate. Then, the bottom of the fixing screw is pressed by the pressure plate 15 set in the slot 43 for tightening.

[0092] Specifically, after the PCB is fixed, the outer periphery of the probe head substrate is fixed. The external threads of the fixing screw 13 with the fixed length thread sleeve pass through the through hole 44 of the slot 43 and the corresponding preset through hole on the PCB from bottom to top, and then engage and lock with the preset internal threads on the metal fixing ring of the probe head substrate, thereby supporting and fixing the outer periphery metal fixing ring of the probe head substrate.

[0093] The tightening direction (Z-axis upward) of the fixing screw 13 is completely consistent with the direction in which the probe tip bears the wafer contact force during the test. During the test, the upward reaction force on the probe tip is directly transmitted to the axial direction of the fixing screw 13, without generating additional lateral force or bending moment. After tightening, the pressure plate 15 in the slot 43 presses the bottom of the fixing screw 13, performing a secondary anti-loosening tightening of the fixing screw 13.

[0094] Step S3: The leveling screw of the leveling component 6 passes through the support frame sleeve 61 of the secondary rib 3 and the reference surface boss 5 in sequence, the preset through hole of the intermediate layer, and the probe card substrate sleeve, and then engages and locks with the inner thread of the PCB sleeve and the inner thread of the substrate positioning post to support and fix the middle part of the PCB and the middle part of the probe head substrate. The PCB and the probe head substrate are leveled by turning the leveling screw.

[0095] Specifically, after the outer periphery is fixed, the levelness of the probe head substrate is precisely adjusted by using 9 sets of leveling components 6. The 9 sets of leveling components 6 correspond to 9 reference surface bosses 5, one of which is located at the center of the intersection area of ​​the main ribs 2, and the other 8 are located in the 8 intersection areas of the main ribs 2 and the secondary ribs 3.

[0096] The leveling screws 64 pass sequentially from bottom to top through the support frame sleeve 61 fixed to the secondary rib 3 and / or the main rib 2, the pre-set through hole on the PCB, and the probe card substrate sleeve. They then engage and lock with the inner threads of the PCB sleeve 62 and the substrate positioning post 63, providing support and fixation for the center of the PCB and the center of the probe head substrate. At this point, the operator, based on the probe tip leveling test results, screws 64 into each of the nine leveling screws to independently adjust the Z-axis height at the corresponding points. One screw acts on the center, and eight act on the circularly distributed circumferential area. Because the leveling screws 64 directly transmit the adjusting force to the bottom surface of the probe head substrate, error accumulation in the intermediate transmission links is eliminated, allowing for independent and precise adjustment at nine points.

[0097] Step S4: Match the gripper on the probe stage with the gripper hole on the fixed gripper 7, and insert the fastener through the fixed seat round hole on the fixed seat 8 to install and fix the assembled probe card on the probe stage.

[0098] Specifically, after the probe head, intermediate layer, and PCB are assembled and leveled, the entire probe card is installed on the probe stage. The gripper hole 71 on the fixing gripper 7 engages with the gripper on the probe stage for quick positioning, initially positioning the probe card on the probe stage. Simultaneously, fasteners are inserted through the fixing hole on the fixing seat 8 to permanently or semi-permanently lock the probe card onto the probe stage. The fixing gripper 7 and fixing seat 8 work together at the four corners of the fixture's outer edge to ensure that the probe card's position relative to the probe stage remains constant during long-term testing.

[0099] Step S1: The intermediate layer 12 and the probe head substrate are pre-positioned by the positioning post 42, and then the PCB9 is locked and fixed by the fastening screw 11. This achieves the division of labor of positioning first and then fixing, avoiding the slight displacement of each layer caused by the rotational torque during the locking process, and ensuring the alignment accuracy of the PCB9, intermediate layer 12 and probe head substrate.

[0100] Step S2: The fixing screw 13 is inserted from bottom to top, and the tightening direction (Z direction upward) is completely consistent with the direction of the wafer contact force during the probe head test. The test reaction force is directly transmitted to the screw axis without generating lateral component force or bending moment, effectively avoiding warping and deformation of the probe head substrate; at the same time, the pressure plate 15 performs secondary tightening on the bottom of the fixing screw 13 to prevent the screw from loosening under high frequency vibration.

[0101] Step S3: The 9 sets of leveling components 6 correspond to 9 reference surface bosses 5 - 1 acts on the center and 8 act on the circumferential area. Each leveling screw 64 is independently controllable and does not interfere with each other. The adjustment force is directly transmitted to the bottom surface of the probe head substrate, without the accumulation of intermediate transmission error.

[0102] Step S4: The gripper hole 71 on the fixed gripper 7 engages with the probe holder gripper for quick positioning, and the fixed seat round hole on the fixed seat 8 is fitted with a fastener to lock the probe card. The two are evenly distributed at the four corners and complement each other in function. The quick positioning and permanent locking work together to ensure that the probe card remains in a fixed position during long-term testing.

[0103] Steps S1 to S4 sequentially complete the PCB positioning and fixing, the outer periphery fixing of the probe head substrate, the precise leveling of the 9 points, and the overall installation on the probe station. The four steps are logically progressive and do not interfere with each other. The entire process of positioning, supporting, fixing, leveling, and installing the MEMS probe card probe head, intermediate layer, and PCB is realized with the same tooling body.

[0104] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An integrated tooling for assembling MEMS probe cards, characterized in that, include: The tooling body (1) is provided with main ribs (2), secondary ribs (3), main support frame (4) of reference surface, boss (5) of reference surface, leveling component (6), fixed gripper (7) and fixed seat (8); The main reinforcement (2) and the secondary reinforcement (3) are arranged on the same plane, and the frame surface of the reference plane main support frame (4) is higher than the plane where the main reinforcement (2) and the secondary reinforcement (3) are located; The reference surface boss (5) is set on the main rib (2) and / or the secondary rib (3). The top surface of the reference surface boss (5) is coplanar with the frame surface of the reference surface main support frame (4) and is used to form point support for the PCB. The leveling component (6) is disposed on the reference surface boss (5) and is used to level the PCB and the probe head substrate. The leveling component (6) passes through the sub-rib (3), the reference surface boss (5), the PCB and the intermediate layer and then abuts against the bottom surface of the probe head substrate. The fixed gripper 7 and the fixed seat (8) are respectively disposed on the outside of the main support frame (4) of the reference surface and extend to the outer edge of the PCB, for mounting the integrated tooling on the probe stage.

2. The integrated tooling for assembling MEMS probe cards according to claim 1, characterized in that, The main reinforcement (2) consists of four supporting beams arranged in a cross shape. The length of the main reinforcement (2) is equal to the inner diameter of the reference surface main support frame (4). The cross-section of the beam of the main reinforcement (2) is square or trapezoidal. The reference surface boss (5) is provided at the upper part of the intersection area of ​​the four supporting beams of the main reinforcement (2), and a support frame sleeve (61) for installing the leveling component (6) is provided at the lower part of the intersection area.

3. The integrated tooling for assembling MEMS probe cards according to claim 2, characterized in that, The secondary rib (3) is a circular inner ring support frame. The diameter of the secondary rib (3) is smaller than the diameter of the probe head base plate. The cross-section of the frame of the secondary rib (3) is square or trapezoidal. The secondary rib (3) and the four support beams of the main rib (2) form eight intersection areas. The reference surface boss (5) is provided on the upper part of the eight intersection areas of the secondary rib (3) and the main rib (2). The support frame sleeve (61) for installing the leveling component (6) is provided on the lower part of the eight intersection areas. The frame surface of the secondary rib (3) and the beam surface of the main rib (2) are located on the same plane and are sunk by a predetermined distance relative to the frame surface of the reference surface main support frame (4). The predetermined distance is 3-6mm.

4. The integrated tooling for assembling MEMS probe cards according to claim 2 or 3, characterized in that, The reference surface main support frame (4) is a circular outer ring support frame connected to the main rib (2). The cross-section of the reference surface main support frame (4) is square or trapezoidal. The reference surface main support frame (4) is located outside the secondary rib (3). The reference surface main support frame (4), the reference surface boss (5), the fixed gripper (7), and the fixed seat (8) are located on the same plane and together constitute the basic surface of the probe card assembly. The height of this basic surface is fixed and cannot be adjusted. The upper part of the reference surface main support frame (4) is provided with several internal thread non-through holes and positioning posts. The internal thread non-through holes are used to lock the reference surface main support frame (4) with the bottom layer of the PCB by engaging with the external thread of the fastening screw, so as to support and fix the PCB. The positioning posts are used to pass through the preset positioning holes on the PCB to position the intermediate layer and the probe head substrate.

5. The integrated tooling for assembling MEMS probe cards according to claim 4, characterized in that, Several slots (43) are provided at the lower part of the main support frame (4) of the reference surface. Each slot (43) has a through hole in the center. The outer thread of the fixing screw with a fixed length thread sleeve passes through the through hole of the slot (43) and the corresponding preset through hole on the PCB, and then engages and locks with the preset inner thread on the metal fixing ring of the probe head substrate, thereby supporting and fixing the outer metal fixing ring of the probe head substrate. A pressure plate (15) is provided in the slot (43). The pressure plate (15) presses the bottom of the fixing screw and tightens the fixing screw.

6. The integrated tooling for assembling MEMS probe cards according to claim 1, characterized in that, The reference surface boss (5) is frustum-shaped, and the reference surface boss (5) has a through hole (51) in the middle for the support frame sleeve (61) of the leveling component (6) to pass through; there are a total of 9 reference surface bosses (5), which are respectively located at the center of the intersection area of ​​the 4 support beams of the main reinforcement (2) and the 8 intersection areas of the 4 support beams of the main reinforcement (2) and the secondary reinforcement (3); The diameter of the reference surface boss (5) located at the center of the intersection area of ​​the four support beams of the main rib (2) is smaller than the size of the intersection area. The diameter of the reference surface boss (5) located at the intersection area of ​​the four support beams of the main rib (2) and the eight intersection areas of the secondary rib (3) is smaller than the width of the secondary rib (3). The top surface of the nine reference surface bosses (5) is located on the same plane as the frame surface of the reference surface main support frame 4. The top surface of the reference surface boss (5) is attached to the bottom layer of the PCB and forms point support for the middle area of ​​the PCB.

7. The integrated tooling for assembling MEMS probe cards according to claim 1, characterized in that, Nine sets of leveling components (6) are respectively set at nine reference surface bosses (5); each leveling component (6) includes a support frame sleeve (61), a PCB sleeve inner thread, a probe card substrate sleeve, a substrate positioning post, a leveling screw, and a pressure plate (65). The support frame sleeve (61) passes through the through hole (51) of the reference surface boss (5) and is fixed on the secondary rib (3) and / or the main rib (2). The leveling screw passes through the support frame sleeve (61), the preset through hole on the PCB, and the probe card substrate sleeve in sequence, and then engages and locks with the inner thread of the PCB sleeve and the inner thread of the substrate positioning post to support and fix the middle part of the PCB and the middle part of the probe head substrate. The levelness of the PCB and the probe head substrate is adjusted by turning the leveling screw.

8. The integrated tooling for assembling MEMS probe cards according to claim 1, characterized in that, The fixed gripper (7) is connected to the outside of the intersection of two mutually perpendicular support beams of the main support frame (4) and the main rib (2) on the reference surface, and extends to the outer edge of the PCB. The fixed gripper (7) is a trapezoidal column with a square cross-section. The top surface of the fixed gripper (7) is coplanar with the frame surface of the main support frame (4) on the reference surface and closely attached to the bottom layer of the PCB to support the outer edge of the PCB. The fixed gripper (7) is provided with gripper holes, which are used to match the grippers on the probe station to install the integrated tooling on the probe station.

9. The integrated tooling for assembling MEMS probe cards according to claim 7 or 8, characterized in that, The fixing seat (8) is connected to the outside of the intersection of the main support frame (4) of the reference surface and the other two mutually perpendicular support beams of the main rib (2), and extends to the outer edge of the PCB. The fixing seat (8) is a trapezoidal column with a square cross-section. The top surface of the fixing seat (8) is coplanar with the frame surface of the main support frame (4) of the reference surface and closely attached to the bottom layer of the PCB, forming support for the outer edge of the PCB. The fixing seat (8) is provided with a fixing seat circular hole, which is used to install fasteners to fix the probe card on the probe stage.

10. An assembly method for an integrated tooling for MEMS probe card assembly based on any one of claims 1 to 9, characterized in that, Includes the following steps: Step S1: The inner thread of the main support frame (4) on the upper part of the reference surface is engaged with the outer thread of the fastening screw to lock the main support frame (4) to make the reference surface main support frame (4) fit with the bottom layer of the PCB, support and fix the PCB, and at the same time make the positioning post passing through the PCB position the intermediate layer and the probe head substrate. Step S2: The external thread of the fixing screw with a fixed length thread sleeve in the slot (43) at the lower part of the reference surface main support frame (4) passes through the through hole of the slot (43) and the corresponding preset through hole on the PCB, and then engages and locks with the preset internal thread on the metal fixing ring of the probe head substrate, thereby supporting and fixing the outer peripheral metal fixing ring of the probe head substrate. Then, the bottom of the fixing screw is pressed by the pressure plate (15) set in the slot (43) for tightening. Step S3: The leveling screw of the leveling component (6) passes through the support frame sleeve (61) of the secondary rib (3) and the reference surface boss (5), the preset through hole of the intermediate layer, and the probe card substrate sleeve in sequence, and then engages and locks with the inner thread of the PCB sleeve and the inner thread of the substrate positioning post to support and fix the middle part of the PCB and the middle part of the probe head substrate, and the PCB and the probe head substrate are leveled by turning the leveling screw. Step S4: Match the gripper on the probe stage with the gripper hole on the fixed gripper (7), and insert the fastener through the fixed seat round hole on the fixed seat (8) to install and fix the assembled probe card on the probe stage.

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