Chip testing apparatus and testing method

Abstract

The present disclosure relates to the field of semiconductor technology, and provides a chip testing device and a testing method. The chip testing device comprises a bearing main body having a first flow channel; the first flow channel comprises a first air inlet and a first air outlet; the first air inlet is connected to a hot air flow device; a pressure applying body has a second flow channel comprising a second air inlet and a second air outlet; the second air outlet is formed on the bottom wall of a working end; wherein the working end is configured to abut against a chip under test on a testing portion when descending, and the second air inlet is sealed and docked to the first air outlet to connect the first flow channel and the second flow channel, so that hot air flows through the second air outlet to act on the chip under test; the working end is configured to adsorb the chip under test and take it away from the testing portion when ascending, and the second air inlet is dislocated and separated from the first air outlet. Through the unique air channel switching structure, when the pressure applying body moves and takes out the chip under test, only the hot air flow is cut off without the need to close the hot flow instrument.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and in particular to a chip testing apparatus and testing method. Background Technology

[0002] In existing technologies, hand-operated test covers are typically used only as simple physical pressing covers, and their structure mainly consists of a metal or plastic cover with an air inlet. During testing, the hand-operated test cover is fixed to the test socket by external latches or screws, and the chip is directly exposed within the cavity formed by the hand-operated test cover.

[0003] However, this traditional structure has significant efficiency bottlenecks and safety risks in practical applications:

[0004] First, the warm-up time cost is extremely high. When multiple chips need to be tested in the same batch with varying temperatures, the lack of an effective dynamic seal and rapid opening / closing mechanism between the hand test cover and the test socket necessitates interrupting the gas supply to the heat flow meter every time a chip is swapped (DUT Swap). Operators must execute a lengthy process of "shutdown-warm-open cover-chip replacement-warm-reset." The heat flow meter takes 5-10 minutes to recover from extreme temperatures (such as -55℃ or +125℃) to room temperature, and another 5-10 minutes to restart and stabilize at the target temperature. The cumulative wasted waiting time for a single chip swap can reach 15-20 minutes, resulting in extremely low machine utilization.

[0005] Secondly, there is insufficient operational safety. In extreme cases, the temperature of the metal heat-conducting components inside the cover can become extremely high, making it very easy for operators to suffer burns when opening the cover to remove the chip.

[0006] Therefore, there is an urgent need for a testing device that can enable rapid and safe chip replacement without shutting off the heat source or with a very short thermal recovery time. Summary of the Invention

[0007] In view of the shortcomings of the prior art described above, the purpose of this disclosure is to provide a chip testing device and testing method to solve the problems in the related art.

[0008] The first aspect of this disclosure provides a chip testing apparatus, comprising:

[0009] The supporting body has a first flow channel; the first flow channel includes a first air inlet and a first air outlet; the first air inlet is connected to a hot air flow device.

[0010] The pressure-applying body is slidably and vertically attached to the supporting body, and has a working end at its bottom; the pressure-applying body has a second flow channel, which includes a second air inlet and a second air outlet; the second air outlet is formed on the bottom wall of the working end;

[0011] A negative pressure unit, located in the second flow channel, is configured to keep the second air outlet in a negative pressure state at least when the pressure-applying member rises;

[0012] The supporting body also includes a test end located below the pressure body, and the test end is provided with a test section for supporting and communicating with the chip under test;

[0013] The working end is configured such that when it descends, its bottom wall abuts against the chip under test in the testing section, and the second air inlet is sealed and connected to the first air outlet to connect the first flow channel and the second flow channel so that hot air flows through the second air outlet to act on the chip under test; the working end is configured such that when it rises, it adsorbs the chip under test and carries it away from the testing section, and the second air inlet and the first air outlet are misaligned and separated.

[0014] In an embodiment of the first aspect, the shape of the test section is adapted to the shape of the chip under test.

[0015] In a first aspect embodiment, a sealing unit is provided between the first air outlet and the second air inlet; and / or, at least one of the wall surfaces where the first air outlet and the second air inlet are located is provided with a sealing ring.

[0016] In a first aspect embodiment, the negative pressure unit includes a valve body and a vacuum pump; the valve body is disposed in the second flow channel, and the vacuum pump connects the valve body and the second air outlet to the second flow channel; wherein, the valve body and the vacuum pump are configured to open and close respectively when the chip under test abuts the test section, so as to conduct the second flow channel and connect the first air inlet and the second air outlet; the valve body and the vacuum pump are configured to close and open respectively when the working end rises, so as to cut off the second flow channel and put the second air outlet in a negative pressure state.

[0017] In an embodiment of the first aspect, the negative pressure unit is further configured to place the second air outlet in a negative pressure state when the pressure-applying member descends, so as to transfer the chip under test to the testing unit.

[0018] In a first aspect embodiment, a vertically arranged driving mechanism is provided between the bearing body and the pressure-applying body, for driving the pressure-applying body to slide and engage with the bearing body in a vertical manner.

[0019] In an embodiment of the first aspect, the driving mechanism includes at least one guide unit and a driving unit; the guide unit is vertically disposed between the bearing body and the pressure-applying body; the driving unit is driven to connect to the pressure-applying body to drive the pressure-applying body to rise and fall.

[0020] In a first aspect embodiment, the first air outlet and the second air inlet are respectively formed on the wall surfaces opposite to the bearing body and the pressure-applying body, so that the pressure-applying body can block the first air outlet when it moves upward.

[0021] In an embodiment of the first aspect, the test section is configured to be recessed from the top of the test end; and / or, the bottom wall of the working end is provided with a bonding groove for embedding the chip under test; and / or, the bottom wall of the working end is provided with an annular flexible bonding section.

[0022] A second aspect of this disclosure provides an operating method, comprising the following steps:

[0023] S1: Drive the working end to move down until its bottom surface contacts and presses the chip under test placed in the test section against the communication connection to the test section; and at this time the first flow channel and the second flow channel are connected so that the hot air flows through the second air outlet to act on the chip under test.

[0024] S2: After the test is completed, close the valve body to cut off the second flow channel; start the vacuum pump to put the second outlet under negative pressure.

[0025] S3: Drive the work unit to rise, and the work unit will take the tested chip away from the test section;

[0026] S4: After the chip under test is removed from the working end after the test is completed, open the valve body and turn off the vacuum pump;

[0027] S5: After the next chip to be tested is placed in the testing section, repeat the above steps.

[0028] As described above, this disclosure relates to the field of semiconductor technology and provides a chip testing apparatus, including a carrier body having a first flow channel; the first flow channel includes a first air inlet and a first air outlet; the first air inlet is for connecting to a hot air flow device; a pressure applying body is slidably coupled to the carrier body in a lifting manner, and a working end is provided at its bottom; the pressure applying body has a second flow channel, the second flow channel including a second air inlet and a second air outlet; the second air outlet is formed on the bottom wall of the working end; a negative pressure unit is provided in the second flow channel and configured to keep the second air outlet in a negative pressure state at least when the pressure applying body rises; the carrier body also includes a test end located below the pressure applying body, the test end having a test section for supporting and communicating with the chip under test; wherein, the working end is configured to abut the chip under test against the test section on its bottom wall when descending, and the second air inlet is sealed and connected to the first air outlet to conduct the first flow channel and the second flow channel so that the hot air flow acts on the chip under test through the second air outlet; the working end is configured to adsorb the chip under test and carry it away from the test section when rising, and the second air inlet and the first air outlet are misaligned and separated. This application utilizes a unique airflow switching structure to cut off the hot airflow delivery without shutting down the heat flow meter when the pressure body moves upward and removes the chip under test; once the pressure body moves downward and reaches the chip under test, the hot airflow delivery is immediately restored, allowing for rapid and precise heating of the chip under test. Attached Figure Description

[0029] Figure 1 The diagram shown is a schematic representation of a chip testing apparatus according to an embodiment of this disclosure.

[0030] Figure 2 The diagram shown is a cross-sectional view of a chip testing apparatus according to an embodiment of this disclosure.

[0031] Figure 3 The diagram shown is a schematic diagram of the circuit connection structure of a chip testing device in one embodiment of this disclosure.

[0032] Figure 4 The diagram below illustrates the steps of a testing method in one embodiment of this disclosure.

[0033] Figure 5 The diagram shown is a schematic representation of the structure of a computer device according to an embodiment of this disclosure.

[0034] Reference numerals: 100, chip testing device; 110, supporting body; 1101, first flow channel; 11011, first air inlet; 11012, first air outlet; 111, testing end; 1111, testing section; 120, pressure applying body; 121, working end; 1201, second flow channel; 12011, second air inlet; 12012, second air outlet; 130, negative pressure unit; 131, valve body; 132, vacuum pump; 140, drive mechanism; 141, guide unit; 1411, guide rail; 1412, slider; 142, drive unit; 150, controller; 160, sealing unit; 200, computer device; 210, bus; 220, processor; 230, memory; 240, communicator. Detailed Implementation

[0035] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the information disclosed herein. This disclosure can also be implemented or applied through other different specific embodiments, and various details in this disclosure can be modified or changed according to different viewpoints and application modules without departing from the spirit of this disclosure. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be combined with each other.

[0036] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this disclosure pertains can readily implement it. This disclosure may be embodied in many different forms and is not limited to the embodiments described herein.

[0037] In this disclosure, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic represented in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. Furthermore, the specific features, structures, materials, or characteristics represented may be combined in any suitable manner in any one or a group of embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples represented in this disclosure, as well as the features of those different embodiments or examples.

[0038] Furthermore, the terms "first" and "second" are used for illustrative purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the representation of this disclosure, "a set" means two or more, unless otherwise explicitly specified.

[0039] For the purpose of clarity, devices unrelated to the description are omitted, and the same or similar components throughout the specification are given the same reference numerals.

[0040] Throughout this specification, when it is said that a device is "connected" to another device, this includes not only "direct connection" but also "indirect connection" by placing other components in between. Furthermore, when it is said that a device "comprises" a certain constituent element, unless otherwise stated otherwise, this does not exclude other constituent elements, but rather implies that other constituent elements may be included.

[0041] While the terms first, second, etc., are used in some examples herein to refer to various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, first interface and second interface, etc., are used. Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, step, operation, element, module, item, kind, and / or group, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, modules, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition will only occur if the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0042] The technical terms used herein are for reference only to specific embodiments and are not intended to limit the scope of this disclosure. The singular form used herein includes the plural form unless the statement explicitly indicates otherwise. The word "comprising" as used in this specification means to specify a particular characteristic, region, integer, step, operation, element, and / or component, and does not exclude the presence or addition of other characteristics, regions, integers, steps, operations, elements, and / or components.

[0043] Although not explicitly defined, all terms, including technical and scientific terms used herein, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms defined in commonly used dictionaries shall be further interpreted as having a meaning consistent with the relevant technical literature and the message of the present disclosure, and shall not be over-interpreted as having an ideal or overly formulaic meaning unless otherwise defined.

[0044] In existing technologies, hand-operated test covers are typically used only as simple physical pressing covers, and their structure mainly consists of a metal or plastic cover with an air inlet. During testing, the hand-operated test cover is fixed to the test socket by external latches or screws, and the chip is directly exposed within the cavity formed by the hand-operated test cover.

[0045] However, this traditional structure has significant efficiency bottlenecks and safety risks in practical applications:

[0046] First, the warm-up time cost is extremely high. When multiple chips need to be tested in the same batch with varying temperatures, the lack of an effective dynamic seal and rapid opening / closing mechanism between the hand test cover and the test socket necessitates interrupting the gas supply to the heat flow meter every time a chip is swapped (DUT Swap). Operators must execute a lengthy process of "shutdown-warm-open cover-chip replacement-warm-reset." The heat flow meter takes 5-10 minutes to recover from extreme temperatures (such as -55℃ or +125℃) to room temperature, and another 5-10 minutes to restart and stabilize at the target temperature. The cumulative wasted waiting time for a single chip swap can reach 15-20 minutes, resulting in extremely low machine utilization.

[0047] Secondly, there is insufficient operational safety. In extreme cases, the temperature of the metal heat-conducting components inside the cover can become extremely high, making it very easy for operators to suffer burns when opening the cover to remove the chip.

[0048] Therefore, there is an urgent need for a testing device that can enable rapid and safe chip replacement without shutting off the heat source or with a very short thermal recovery time.

[0049] Based on the above issues, those skilled in the art will understand that this application, through its unique airway switching structure, can cut off the hot airflow delivery without shutting down the heat flow meter when the pressure body moves upward and removes the chip under test; once the pressure body moves downward and reaches the chip under test, the hot airflow delivery is immediately restored, and the chip under test is quickly and accurately heated.

[0050] Figure 1 The diagram shown is a schematic representation of a chip testing apparatus according to an embodiment of this disclosure. Figure 2 The diagram shown is a cross-sectional view of a chip testing apparatus according to an embodiment of this disclosure. Figure 3 The diagram shown is a schematic representation of the circuit connection structure of a chip testing apparatus according to an embodiment of this disclosure. Figure 1 , Figure 2 and Figure 3 In the example, the chip testing device 100 includes a support body 110, a pressure applying body 120, and a negative pressure unit 130.

[0051] The support body 110 is vertically arranged. In some embodiments, the support body 110 can be made of engineering materials resistant to high and low temperatures to meet testing requirements in extreme temperature environments. Preferably, the support body 110 can be made of high-performance engineering plastics such as polyetheretherketone (PEEK) or aluminum alloy. Using PEEK significantly reduces the thermal conductivity of the support body 110, which on the one hand reduces the diffusion of heat generated by the heat flow meter to other parts of the support body 110, improving heat utilization and shortening the temperature stabilization time; on the other hand, it reduces the temperature of the outer surface of the support body 110 in high or low temperature testing environments, preventing burns or frostbite to the operator due to accidental contact, thereby improving operational safety. Using aluminum alloy utilizes the high structural strength and rigidity of the metal material to ensure that the support body 110 is not easily deformed under long-term reciprocating mechanical movement and thermal shock, thus ensuring the long-term positioning accuracy and stability of the testing device.

[0052] The supporting body 110 has a first flow channel 1101 including a first air inlet 11011 and a first air outlet 11012; the first air inlet 11011 is connected to a hot air flow device.

[0053] In some embodiments, the first air inlet 11011 is in fluid communication with an external hot airflow device via a pipe or adapter. The hot airflow device is configured to provide and regulate a high-speed airflow at a set temperature to simulate the extreme ambient temperature of the chip under test. Specifically, the hot airflow device can be a heat flow meter. This heat flow meter typically includes a temperature control module, a fan, and a heater (or cooler), capable of outputting a precisely temperature-controlled airflow (e.g., a temperature range covering -65°C to +225°C).

[0054] The pressure-applying body 120 can be vertically and slidably coupled to the supporting body 110. In this embodiment, a vertically arranged drive mechanism 140 is provided between the supporting body 110 and the pressure-applying body 120 to drive the pressure-applying body 120 to be vertically and slidably coupled to the supporting body 110.

[0055] In some embodiments, the drive mechanism 140 includes at least one guide unit 141 and a drive unit 142. The at least one guide unit 141 is vertically disposed between the bearing body 110 and the pressure body 120; the drive unit 142 is drivenly connected to the pressure body 120 to drive the pressure body 120 to move up and down.

[0056] In this embodiment, two guide units 141 are provided and spaced apart on the supporting body 110. Each guide unit 141 includes a cooperating guide rail 1411 and a slider 1412, wherein the guide rail 1411 is fixed to the supporting body 110, and the slider 1412 is fixed to the pressure applying body 120, and the two slide together to guide the lifting and lowering movement of the pressure applying body 120. It should be understood that in other embodiments, the guide rail 1411 may also be provided on the pressure applying body 120, and the slider 1412 may be provided on the supporting body 110, that is, the relative positions of the guide rail 1411 and the slider 1412 can be interchanged, and are not limited to this embodiment. In addition, the number of guide units 141 can also be adjusted according to the structural dimensions and force requirements of the supporting body 110 and the pressure applying body 120. For example, only one guide unit 141 or more than two guide units 141 may be provided.

[0057] In this embodiment, the drive unit 142 is specifically implemented as a telescopic component, such as a pneumatic cylinder, hydraulic cylinder, or electric cylinder. Preferably, this embodiment uses an electric cylinder as the drive unit 142. The stator (fixed end) of the electric cylinder is fixedly connected to the bearing body 110, and its mover (movable end) is fixedly connected to the pressure applying body 120, providing precise and stable lifting driving force for the pressure applying body 120. It should be noted that the electric cylinder can precisely control its stroke displacement and lifting rate through its own motor to match the thickness tolerance of the chip under test and the insertion depth requirements of the test section 1111 (to be discussed later). It can be understood that through the closed-loop control of the servo motor, the electric cylinder can drive the pressure applying body 120 to perform lifting and lowering movements with micron-level resolution, ensuring that the pressure applying part can make smooth contact when it abuts the chip, and pressing the chip under test against the communication connection to the test section 1111 without damaging the chip under test. This avoids damage to the chip due to excessive pressure or failure of air circuit docking due to positional deviation.

[0058] The bottom wall of the pressure-applying body 120 has a downwardly protruding working end 121. In some embodiments, the working end 121 may be integrally formed on the bottom wall of the pressure-applying body 120, or it may be welded or inserted into the pressure-applying body 120.

[0059] The pressure body 120 has a second flow channel 1201 inside; the second flow channel 1201 includes a second air inlet 12011 and a second air outlet 12012; wherein the second air outlet 12012 is formed on the bottom wall of the working end 121.

[0060] The negative pressure unit 130 is located in the second flow channel 1201 and is configured to keep the second air outlet 12012 in a negative pressure state at least when the pressure body 120 rises.

[0061] In this embodiment, the negative pressure unit 130 includes a valve body 131 and a vacuum pump 132. The valve body 131 is disposed in the second flow channel 1201, and the vacuum pump 132 is connected to the second flow channel 1201 between the valve body 131 and the second air outlet 12012. The valve body 131 and the vacuum pump 132 are configured to open and close respectively when the chip under test abuts the test section 1111, so as to conduct the second flow channel 1201 and connect the first air inlet 11011 and the second air outlet 12012. The valve body 131 and the vacuum pump 132 are configured to close and open respectively when the working end 121 rises, so as to cut off the second flow channel 1201 and put the second air outlet 12012 into a negative pressure state.

[0062] The supporting body 110 also includes a test end 111 located below the pressure body 120. The test end 111 is provided with a test section 1111 for supporting and communicating with the chip under test. The working end 121 is configured such that when it descends, its bottom wall abuts against the chip under test in the test section 1111, and the second air inlet 12011 is sealed and connected to the first air outlet 11012 to connect the first flow channel 1101 and the second flow channel 1201, so that hot air flows through the second air outlet 12012 and acts on the chip under test. The working end 121 is configured to adsorb the chip under test and carry it away from the test section 1111 when it rises, and the second air inlet 12011 and the first air outlet 11012 are misaligned and separated.

[0063] In some embodiments, the shape of the test section 1111 is adapted to the shape of the chip under test. For example, if the chip under test is rectangular or circular, the test section 1111 is correspondingly set to be rectangular or circular.

[0064] It is understood that the chip testing apparatus 100 further includes a controller 150, electrically connected to the drive mechanism 140, the negative pressure unit 130, and the testing unit 1111. In other embodiments, the controller 150 may also be electrically connected to the heat flow meter.

[0065] Based on the above configuration, under the control of the controller 150, the collaborative working process of the negative pressure unit 130 and the drive unit 142 is as follows:

[0066] During the process of the pressure body 120 moving downward and the working end 121 about to abut against the chip under test located in the test section 1111, the valve body 131 is in the open state (at this time, the airflow in the second flow channel 1201 can pass smoothly) and the vacuum pump 132 is in the closed state. At this time, the second flow channel 1201 is not connected to the first flow channel 1101.

[0067] When the working end 121 is lowered to securely abut the chip under test against the connecting part (i.e., reaching the test position), the second air inlet 12011 is sealed and connected to the first air outlet 11012 to connect the first flow channel 1101 and the second flow channel 1201. At this time, the airflow output by the thermal flow meter enters the first flow channel 1101 of the support body 110 through the first air inlet 11011, and then passes through the second flow channel 1201, finally acting directly on the surface or back of the chip under test from the second air outlet 12012 of the working end 121, subjecting it to a high-temperature test environment.

[0068] Conversely, when the test is completed and the working end 121 rises, the valve body 131 closes to cut off the second flow channel 1201, and at the same time, the vacuum pump 132 is turned on to put the second air outlet 12012 into a negative pressure state, thereby ensuring that the chip under test moves upward with the working end 121 without falling off; until the chip under test is taken away from the test section 1111. After the chip under test is removed from the working end 121, the vacuum pump is turned off and the valve body 131 is turned on, so that the next chip under test can be tested.

[0069] It should be noted that in the above process, the controller 150, in response to the establishment of a communication connection between the chip under test and the test unit 1111, controls the drive mechanism 140 to stop moving downward, so as to prevent it from moving too far downward and damaging the chip under test. In other embodiments, the displacement of the pressure applying body 120 can also be controlled by setting a pressure sensor on the test unit 1111 or by setting a displacement sensor between the test end 111 and the pressure applying body 120.

[0070] As will be understood by those skilled in the art, this application, through its unique airflow switching structure, can interrupt the hot airflow delivery without shutting down the heat flow meter when the pressure body 120 moves upward and removes the chip under test; once the pressure body 120 moves downward to meet the chip under test, the hot airflow delivery is immediately restored, rapidly and precisely heating the chip under test. This mechanism avoids the long, ineffective waiting time caused by the need to stop, reheat, and reheat the machine when replacing chips in traditional solutions, achieving "uninterrupted power supply during multi-chip testing and no temperature drop during chip replacement," significantly improving testing efficiency and equipment utilization; at the same time, the automatic removal of the chip under test effectively avoids the safety hazards of manual operation at high / low temperatures.

[0071] Preferably, the valve body 131 is positioned close to the second air outlet 12012. This significantly reduces the flow channel volume between the valve body 131 and the second air outlet 12012. When the valve body 131 is closed and the vacuum pump 132 evacuates the system, the amount of gas in this flow channel is extremely small. This allows the second air outlet 12012 to reach the required negative pressure adsorption state more quickly, shortening the evacuation response time and improving the agility and stability of the chip removal operation.

[0072] In this embodiment, the first air outlet 11012 and the second air inlet 12011 are respectively formed on the wall surfaces of the supporting body 110 and the pressure applying body 120, which are disposed opposite to each other. In this way, when the pressure applying body 120 moves upward, it can directly block the first air outlet 11012 with its wall surface, thereby cutting off the overflow of hot air (it can also be understood that in the initial state, the wall surface of the pressure applying body 120 is also in the position of blocking the first air outlet 11012).

[0073] In some embodiments, a sealing unit 160 is provided between the first air outlet 11012 and the second air inlet 12011 to improve the sealing between them.

[0074] In some embodiments, at least one of the wall surfaces where the first air outlet 11012 and the second air inlet 12011 are located is provided with a sealing ring.

[0075] For example, in this embodiment, a sealing ring is provided on the wall surface where the first air outlet 11012 and the second air inlet 12011 are located, and the two sealing rings are provided with the same specifications. Specifically, both sealing rings are O-rings with a circular cross-section, and are respectively embedded in the annular grooves around the first air outlet 11012 and the second air outlet 12012.

[0076] By setting up paired sealing rings of the same specifications, a double sealing barrier can be formed when the first air outlet 11012 and the second air inlet 12011 are connected, effectively preventing high-temperature or low-temperature airflow from leaking or flowing back at the connection gap, and ensuring that the hot airflow can all act on the chip under test through the second air outlet 12012. On the other hand, the symmetrical sealing ring configuration can also offset the eccentric load or slight misalignment generated during the connection process, playing a certain self-centering role, thereby reducing the stringent requirements on the positioning accuracy of the guide unit 141 and the drive unit 142, and improving the overall assembly tolerance and long-term reliability of the device.

[0077] In some embodiments, the sealing unit 160 may also include only one sealing ring. For example, a sealing ring is provided at the port of the second air inlet 12011, while a flat sealing surface is provided correspondingly at the end of the first air outlet 11012. In this way, when the pressure body 120 descends to the test position, the sealing ring is compressed between the first air outlet 11012 and the second air inlet 12011, which can also achieve good airtightness, while simplifying the number of parts and assembly process.

[0078] In some embodiments, the negative pressure unit 130 is further configured to maintain the second air outlet 12012 under negative pressure during the descent phase of the pressure applying body 120, thereby adsorbing and transferring the chip under test to the testing section 1111. Based on this design, testers do not need to manually place the chip under test into the testing section 1111 beforehand; they only need to place the chip under test on the working end 121, which has an adsorption function, and then the descending working end 121 automatically completes the transfer and docking. This mechanism effectively avoids direct contact between testers and the internal components of the testing section 1111 under high or low temperature testing environments, thereby further eliminating the safety hazards of burns or frostbite.

[0079] In order to achieve the above functions, the valve body 131 and the vacuum pump 132 are also configured to close and open respectively before the chip under test descends, so as to cut off the second flow channel 1201 and put the second air outlet 12012 into a negative pressure state.

[0080] like Figure 1 and Figure 2 As shown, the working end 121 is adapted to the shape of the test section 1111. Specifically, the working end 121 is implemented as a wedge-shaped structure with a rectangular cross-section that gradually narrows downwards along the vertical direction to accommodate a rectangular chip under test. Correspondingly, the test section 1111 is formed by a recess at the top of the test end 111, and its outline matches the wedge-shaped working end 121.

[0081] Understandably, this wedge-shaped mating structure brings multiple technical advantages: First, during the descent of the pressure body 120, the wedge structure can play a self-centering guiding role. Even if the chip under test has a slight deviation when initially placed, it can be automatically corrected to be precisely aligned with the test section 1111 during the descent, reducing the dependence on the positioning accuracy of the front end; Second, the wedge surface can generate a lateral locking force when mating, effectively improving the tightness of the fit between the working end 121 and the test section 1111, significantly enhancing the sealing performance and preventing hot air leakage; Finally, as a physical foolproof design, this structure avoids jamming or damage caused by incorrect placement of the chip under test.

[0082] In some embodiments, the bottom wall of the working end 121 is provided with an annular flexible joint (e.g., a silicone ring or rubber pad) to increase the contact friction between the working end 121 and the chip under test and to provide buffer protection. This configuration can significantly improve the adsorption stability of the chip during the transfer process and prevent the chip from falling off or being damaged due to sudden acceleration changes.

[0083] In some embodiments, the bottom wall of the working end 121 is provided with a bonding groove for embedding the chip under test. The contour of the bonding groove matches the shape of the chip under test, so as to further enhance the chip clamping stability through physical limiting on the basis of negative pressure adsorption, and prevent the chip from shifting or falling off during the transfer process. It should be noted that after the chip under test is embedded in the bonding groove, a portion of the bonding groove is still exposed, so that the working end 121 can abut the chip under test against the testing part 1111, and it can also facilitate the tester to remove the chip under test from the bonding groove.

[0084] In other embodiments, the working end 121 is detachably connected to the bottom wall of the pressure applying body 120, and the testing section 1111 is detachably disposed on the top wall of the testing end 111. This configuration provides good compatibility: by replacing the working end 121 and the testing section 1111 with different sizes or profiles, various specifications of chips under test can be adapted without replacing the entire testing device. The detachment and connection can be achieved through plug-in or screw-in connections.

[0085] Figure 4 The diagram below illustrates the steps of a testing method in one embodiment of this disclosure. Figure 4 As shown, this disclosure also provides a testing method, including the following steps:

[0086] S1: Drive the working end 121 to move down until its bottom surface contacts and presses the chip under test placed in the test section 1111 against the communication connection to the test section 1111; and at this time the first flow channel 1101 and the second flow channel 1201 are connected so that the hot air flows through the second air outlet 12012 to act on the chip under test.

[0087] S2: After the test is completed, close valve body 131 to cut off the second flow channel 1201; start vacuum pump 132 to put the second outlet 12012 into a negative pressure state;

[0088] S3: Drive the working end 121 to rise, and the working end 121 will take the tested chip away from the test section 1111 after the test is completed;

[0089] S4: After the chip under test is removed from the working end 121 after the test is completed, open the valve body 131 and turn off the vacuum pump 132;

[0090] S5: After placing the next chip under test in the test section 1111, repeat the above steps.

[0091] It should be noted that when the negative pressure unit 130 is configured to place the second air outlet 12012 in a negative pressure state during the descent phase of the pressure applying body 120, the test method can also be implemented by including the following steps:

[0092] S01: Close valve body 131 to cut off second flow channel 1201; start vacuum pump 132 to put second outlet 12012 under negative pressure.

[0093] S02: Drive the working end 121 to move down until the chip under test adsorbed on the second air outlet 12012 is pressed against the communication connection to the test unit 1111; and at this time the first flow channel 1101 and the second flow channel 1201 are connected so that the hot air flows through the second air outlet 12012 to act on the chip under test.

[0094] S03: After the test is completed, close valve body 131 to cut off the second flow channel 1201; start vacuum pump 132 to put the second outlet 12012 into a negative pressure state;

[0095] S04: Drive the working end 121 to rise, and the working end 121 will take the tested chip away from the test section 1111 after the test is completed;

[0096] S05: After the chip under test is removed from the working end 121 after the test is completed, open the valve body 131 and turn off the vacuum pump 132.

[0097] S06: After the next chip to be tested is placed in the test section 1111, repeat the above steps.

[0098] Figure 5 The diagram shown is a structural schematic of a computer device according to an embodiment of this disclosure. Figure 5 In this example, the computer device 200 includes a bus 210, a processor 220, and a memory 230. The processor 220 and the memory 230 can communicate with each other via the bus 210. The memory 230 can store program instructions. The aforementioned controller can be implemented by the computer device 200. The processor 220 implements the previous embodiments by running the program instructions in the memory 230. Figure 4 The steps in the process.

[0099] Bus 210 can be a Peripheral Component Interconnect (PCI) bus 210 or an Extended Industry Standard Architecture (EISA) bus 210, etc. Bus 210 can be divided into address bus, data bus, control bus, etc. For ease of representation, although... Figure 5 The bus 210 is represented by a single thick line, but this does not mean that there is only one bus 210 or only one type of bus 210.

[0100] In some embodiments, the processor 220 may be implemented as a central processing unit (CPU), a microprocessor unit (MCU), a system-on-chip (System-on-Chip), or a field-programmable array (FPGA). The memory 230 may include volatile memory for temporary data storage during program execution, such as random access memory (RAM).

[0101] The memory 230 may also include non-volatile memory for data storage, such as read-only memory (ROM), flash memory, hard disk drive (HDD), or solid-state disk (SSD).

[0102] In some embodiments, the computer device 200 may further include a communicator 240. The communicator 240 is used for communication with external devices. In specific examples, the communicator 240 may include one or more wired and / or wireless communication circuit modules. For example, the communicator 240 may include one or more of, for example, a wired network card, a USB module, a serial interface module, etc. The wireless communication protocols followed by the wireless communication module include, for example, Nearfield Communication (NFC) technology, Infrared (IR) technology, Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Bluetooth (BT), Global Navigation Satellite System (GNSS), etc.

[0103] In summary, this disclosure relates to the field of semiconductor technology and provides a chip testing apparatus, including a carrier body having a first flow channel; the first flow channel includes a first air inlet and a first air outlet; the first air inlet is for connecting to a hot air flow device; a pressure applying body is slidably coupled to the carrier body and has a working end at its bottom; the pressure applying body has a second flow channel, the second flow channel including a second air inlet and a second air outlet; the second air outlet is formed on the bottom wall of the working end; a negative pressure unit is disposed in the second flow channel and configured to keep the second air outlet in a negative pressure state at least when the pressure applying body rises; the carrier body also includes a test end located below the pressure applying body, the test end having a test section for supporting and communicating with the chip under test; wherein, the working end is configured to abut the chip under test against the test section on its bottom wall when descending, and the second air inlet is sealed and connected to the first air outlet to connect the first flow channel and the second flow channel so that the hot air flow acts on the chip under test through the second air outlet; the working end is configured to adsorb the chip under test and carry it away from the test section when rising, and the second air inlet and the first air outlet are misaligned and separated. Those skilled in the art will understand that, through its unique airflow switching structure, this application can cut off the hot airflow delivery without shutting down the heat flow meter when the pressure body moves upward and removes the chip under test; once the pressure body moves downward and reaches the chip under test, the hot airflow delivery is immediately restored, and the chip under test is quickly and accurately heated.

[0104] The above embodiments are merely illustrative of the principles and effects of this disclosure and are not intended to limit this disclosure. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this disclosure. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this disclosure should still be covered by the protection scope of this disclosure.

Claims

1. A chip testing device, characterized in that, include: The supporting body has a first flow channel; the first flow channel includes a first air inlet and a first air outlet; the first air inlet is connected to a hot air flow device. The pressure-applying body is slidably and vertically attached to the supporting body, and has a working end at its bottom; the pressure-applying body has a second flow channel, which includes a second air inlet and a second air outlet; the second air outlet is formed on the bottom wall of the working end; A negative pressure unit, located in the second flow channel, is configured to keep the second air outlet in a negative pressure state at least when the pressure-applying member rises; The supporting body also includes a test end located below the pressure body, and the test end is provided with a test section for supporting and communicating with the chip under test; The working end is configured such that when it descends, its bottom wall abuts against the chip under test in the testing section, and the second air inlet is sealed and connected to the first air outlet to connect the first flow channel and the second flow channel so that hot air flows through the second air outlet to act on the chip under test; the working end is configured such that when it rises, it adsorbs the chip under test and carries it away from the testing section, and the second air inlet and the first air outlet are misaligned and separated.

2. The chip testing apparatus according to claim 1, characterized in that, The shape of the test section is adapted to the shape of the chip under test.

3. The chip testing apparatus according to claim 1, characterized in that, A sealing unit is provided between the first air outlet and the second air inlet; and / or, at least one of the wall surfaces where the first air outlet and the second air inlet are located is provided with a sealing ring.

4. The chip testing apparatus according to claim 1, characterized in that, The negative pressure unit includes a valve body and a vacuum pump; the valve body is disposed in the second flow channel, and the vacuum pump is connected to the second flow channel between the valve body and the second air outlet; wherein, the valve body and the vacuum pump are configured to open and close respectively when the chip under test abuts the test section, so as to conduct the second flow channel and connect the first air inlet and the second air outlet; the valve body and the vacuum pump are configured to close and open respectively when the working end rises, so as to cut off the second flow channel and put the second air outlet in a negative pressure state.

5. The chip testing apparatus according to claim 1, characterized in that, The negative pressure unit is also configured to place the second air outlet in a negative pressure state when the pressure-applying element descends, so as to transfer the chip under test to the testing unit.

6. The chip testing apparatus according to claim 1, characterized in that, A vertically arranged driving mechanism is provided between the bearing body and the pressure-applying body, which drives the pressure-applying body to slide and engage with the bearing body in a vertical manner.

7. The chip testing apparatus according to claim 6, characterized in that, The driving mechanism includes at least one guide unit and a driving unit; the guide unit is vertically disposed between the bearing body and the pressure-applying body; the driving unit is driven to connect to the pressure-applying body to drive the pressure-applying body to rise and fall.

8. The chip testing apparatus according to claim 1, characterized in that, The first air outlet and the second air inlet are respectively formed on the wall surfaces opposite to the supporting body and the pressure applying body, so that the pressure applying body can block the first air outlet when it moves upward.

9. The chip testing apparatus according to claim 1, characterized in that, The test section is configured to be recessed from the top of the test end; and / or, the bottom wall of the working end is provided with a bonding groove for embedding the chip under test; and / or, the bottom wall of the working end is provided with an annular flexible bonding section.

10. A testing method, adapted to the chip testing apparatus as described in any one of claims 1-9, characterized in that, The method includes the following steps: S1: Drive the working end to move down until its bottom surface contacts and presses the chip under test placed in the test section against the communication connection of the test section; and at this time the first flow channel and the second flow channel are connected so that the hot air flows through the second air outlet to act on the chip under test. S2: After the test is completed, close the valve body to cut off the second flow channel; start the vacuum pump to put the second outlet under negative pressure. S3: Drive the work unit to rise, and the work unit will take the tested chip away from the test section; S4: After the chip under test is removed from the working end after the test is completed, open the valve body and turn off the vacuum pump; S5: After the next chip to be tested is placed in the testing section, repeat the above steps.

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