Lenticular film, LED display module and preparation method thereof

Abstract

The application provides a blackout film, an LED display module and a preparation method thereof, and belongs to the technical field of LEDs. The application comprises a bottom film, the bottom film having at least black fillers and first diffusion particles; and a surface film on the bottom film, comprising a transparent carrier layer and a blackout pattern layer, the blackout pattern layer being on the side of the transparent carrier layer facing the bottom film. The application adds black fillers and first diffusion particles to the bottom film, taking into account the consistency of ink color and low brightness loss. Moreover, the surface film containing the blackout pattern layer is provided, so that in the off-screen state, the bottom film can provide a high-purity black background for the blackout pattern layer, and a high contrast is formed with the blackout pattern layer itself, greatly improving the definition and brightness of the blackout pattern layer; in the on-screen state, the bottom film absorbs ambient light, so that the blackout pattern layer is hardly identified, achieving better display effect.

Description

Technical Field

[0001] This application relates to the field of LED technology, specifically to a shadow-reflecting film, an LED display module, and a method for preparing the same. Background Technology

[0002] In the field of LED display packaging, LED display modules need to achieve a consistent surface color when spliced, and present decorative shadow patterns when the screen is off, in order to meet the market's design requirements for screen-off aesthetics.

[0003] Current technologies typically achieve a uniform ink color by spraying black ink or attaching a black film layer to the surface of the LED display module. However, this method usually results in significant brightness loss in the display module, thus affecting the display effect. Furthermore, lower display brightness makes it difficult to discern shadow patterns when the screen is off, becoming a bottleneck restricting the improvement of display performance. Summary of the Invention

[0004] In view of this, the embodiments of this application aim to provide a shadow film, an LED display module and a method for manufacturing the same, so as to solve the problem that the LED display module in the prior art cannot simultaneously achieve shadow patterns with consistent ink color, high brightness and high definition.

[0005] This application provides a shadow-reducing film, comprising: A base film, wherein the base film contains at least a black filler and first diffused particles; and, A face mask, located on the base film, includes a transparent carrier layer and a shadow pattern layer, wherein the shadow pattern layer is located on the side of the transparent carrier layer facing the base film.

[0006] In one embodiment, the face mask further includes: A transparent adhesive layer is located on the side of the shadow pattern layer near the base film. The transparent adhesive layer contains second diffusing particles, the particle size of which is different from that of the first diffusing particles.

[0007] In one embodiment, the thickness of the base film is 30 μm to 50 μm, the light transmittance is 0.5% to 5%, and the light reflectance is less than or equal to 8%; and / or, The black filler accounts for 9% to 12% of the mass of the base film, the first diffusing particles account for 3% to 15% of the mass of the base film, and the particle size of the first diffusing particles is 5 μm to 20 μm.

[0008] In one embodiment, the thickness of the transparent adhesive layer is 50 μm to 60 μm, and the light transmittance is greater than or equal to 90%; and / or, The mass of the second diffusing particle accounts for 2% to 10% of the mass of the transparent adhesive layer, and the particle size of the second diffusing particle is 3 μm to 15 μm.

[0009] In one embodiment, the face mask further includes: An anti-fingerprint layer is located on the transparent carrier layer, wherein the water contact angle of the anti-fingerprint layer is greater than or equal to 110°; and / or, The shadow-reducing membrane also includes: A first adhesive layer is located between the base film and the face film to adhere the base film and the face film; The second adhesive layer is located on the side of the base film that faces away from the face film.

[0010] In one embodiment, the material of the shadow pattern layer is transparent white ink, the thickness of the shadow pattern layer is less than or equal to 1 μm, and the dot area is 3%~8%; or... The material of the shadow pattern layer is semi-transparent black ink, the thickness of the shadow pattern layer is less than or equal to 2μm, and the light transmittance is 10%~30%.

[0011] In one embodiment, the optical density difference between the shadow pattern layer and the base film is less than or equal to 0.2.

[0012] This application provides an LED display module, including: LED module packaging structure; The shadow-reflecting film, as described in any of the above embodiments, is located on the LED module packaging structure.

[0013] This application provides a method for manufacturing an LED display module, including: Provide LED module packaging structure; The shadow-reflecting film as described in any of the above embodiments is disposed on the LED module packaging structure.

[0014] In one embodiment, the step of disposing the shadow-reducing film on the LED module packaging structure includes: The shadow-reflecting film is attached to the LED module packaging structure; Perform hot pressing and curing.

[0015] In one embodiment, the step of disposing the shadow-reducing film on the LED module packaging structure includes: The base film is attached to the LED module packaging structure and subjected to initial hot pressing and curing. The face mask is then attached to the base film and subjected to heat pressing and curing again.

[0016] In one embodiment, the vacuum degree of both hot pressings is less than or equal to -95 kPa, and the hot pressing time is 5 min to 10 min; the pressure of the first hot pressing is 0.3 MPa to 0.6 MPa, and the pressure of the second hot pressing is 0.2 MPa to 0.4 MPa; and / or, the curing energy of both curings is 1000 mJ / cm² to 1200 mJ / cm².

[0017] This application achieves visual color consistency by adding black filler to the base film to mask the ink color differences in the LED module packaging structure. Adding first diffusing particles scatters light entering the base film, reducing brightness loss and improving overall display brightness. Furthermore, by incorporating a film containing a shadow pattern layer, in the screen-off state, the base film provides a high-purity black background for the shadow pattern layer, creating high contrast and significantly improving its clarity and brightness. In the screen-on state, the base film absorbs ambient light, making the shadow pattern layer almost invisible, resulting in better display performance. Attached Figure Description

[0018] Figure 1 This is a cross-sectional view of the structure of a first type of shadow-reducing membrane provided in an embodiment of this application.

[0019] Figure 2 This is a cross-sectional view of the structure of a second type of shadow-reducing membrane provided in an embodiment of this application.

[0020] Figure 3 This is a cross-sectional view of an LED display module provided in an embodiment of this application.

[0021] Figure 4 This is a step diagram illustrating the fabrication method of an LED display module provided in an embodiment of this application.

[0022] The attached figures are labeled as follows: 000 - LED module packaging structure; 001 - Reflective film; 100 - Base film; 101 - Black filler; 102 - First diffusion particle; 200 - Top film; 201 - Transparent carrier layer; 202 - Reflective pattern layer; 203 - Transparent adhesive layer; 2031 - Reflective pattern layer; 204 - Anti-fingerprint layer; 300 - First adhesive layer; 400 - Second adhesive layer. Detailed Implementation

[0023] In LED display module applications, such as COB (Chip On Board) display modules, SMD (Surface Mount Device) display modules, Mini LED display modules, or Micro LED display modules, a black coating or black film is typically applied to the surface of the LED display module to achieve color consistency when different LED display modules are spliced ​​together. Specifically, a black film layer can be placed on the light-emitting surface of the LED display module. Its absorption of ambient light helps to uniformly mask the differences in base color between substrates from different batches or using different processes. The basic working principle is that when external ambient light shines on the surface of the LED display module, the black film layer absorbs most of the incident light, thus making both gray-white and dark gray substrates appear nearly black when the screen is off. This method is widely used mainly because it can solve the "mosaic effect" problem when splicing LED display modules to a certain extent with a relatively simple process and low cost, achieving a basic uniformity in appearance.

[0024] However, this approach is less than ideal for applications requiring both high display brightness and a clear backlight pattern. This is primarily because, to achieve a consistent black color, a high optical density black material is typically used to ensure sufficient absorption of ambient light. This design inevitably leads to the absorption of light emitted by the internal LED chips, resulting in significant brightness reduction. Tests have shown that such LED display modules experience a brightness loss of 25% to 60%. Furthermore, since the black material itself does not reflect light, and the gray-white substrate cannot provide a sufficiently black background, a high-contrast backlight pattern cannot be formed when the screen is off.

[0025] In view of this, this application provides a shadowless film, an LED display module, and a method for manufacturing the same, comprising a base film containing at least black filler and first diffusing particles; and a face film located on the base film, comprising a transparent carrier layer and a shadowless pattern layer, the shadowless pattern layer being located on the side of the transparent carrier layer facing the base film. This application achieves visual color consistency by adding black filler to the base film to cover the ink color differences in the LED module packaging structure. Adding first diffusing particles scatters light entering the base film 100, reducing brightness loss and improving overall display brightness. Furthermore, by providing a face film containing the shadowless pattern layer, in the off-screen state, the base film provides a high-purity black background for the shadowless pattern layer, creating a high contrast with the shadowless pattern layer itself, greatly improving the clarity and brightness of the shadowless pattern layer; in the on-screen state, the base film absorbs ambient light, making the shadowless pattern layer almost invisible, thus achieving a better display effect.

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] Reference Figure 1 , Figure 1 A cross-sectional view of the structure of a shadow-reducing diaphragm provided in an embodiment of this application, as shown below. Figure 1 As shown, the shadow-reducing film 001 provided in this application includes: a base film 100 and a face film 200.

[0028] In one embodiment, the base film 100 contains at least a black filler 101 and first diffusing particles 102. Specifically, the black filler 101 and the first diffusing particles 102 can be uniformly distributed in the base film 100. The black filler 101 is used to absorb ambient light and provide a low-reflection black background, thereby masking differences in ink color caused by differences in substrate, packaging materials, or processes, and improving the consistency of visual appearance. The black filler 101 can be a material capable of absorbing visible light to make the film appear black, such as carbon black, black iron oxide, graphite, and carbon nanotubes. The first diffusing particles 102 can scatter light passing through the base film 100, thereby reducing the absorption loss of light by the black filler 101, keeping the brightness attenuation within an acceptable range, and improving the uniformity of light emission. Exemplarily, the material of the first diffusing particles 102 can be a transparent or translucent organic or inorganic material, such as silica, titanium dioxide, or polymethyl methacrylate (PMMA) microspheres. This application achieves visual uniformity of ink color by adding black filler 101 to the base film 100 to cover the ink color differences in the LED module packaging structure. Simultaneously, it reduces brightness loss by adding first diffusing particles 102 to scatter light entering the base film 100. Testing shows that the shadow-reducing film 001 provided by this application can reduce the overall brightness loss of the LED display module to less than 15%.

[0029] In one embodiment, when forming the base film 100, the resin and black filler 101 can be mixed first, and then the first diffusing particles 102 can be added and mixed uniformly. To improve the uniformity of the black filler 101 and / or the first diffusing particles 102, the particle size of the black filler 101 and / or the first diffusing particles 102 can be adjusted, or the dispersion process can be optimized. For example, the material of the first diffusing particles 102 can be narrow-distribution diffusing particles with a particle size variation coefficient of less than or equal to 15%, or a polymeric dispersant can be added during formulation, or auxiliary ultrasonic waves can be used during mixing, thereby improving the uniformity of mixing and avoiding agglomeration.

[0030] In one embodiment, the thickness of the base film 100 is 30μm to 50μm to balance improving opacity and reducing brightness loss. Specifically, if the thickness of the base film 100 is less than 30μm, the thickness is too thin and the total amount of black filler 101 is insufficient to fully absorb ambient light, making it difficult to achieve consistent ink color. If the thickness of the base film 100 is greater than 50μm, the light transmission path in the base film 100 becomes longer. Even with the presence of the first diffusing particles 102, the absorption and scattering loss of light will accumulate, leading to increased brightness attenuation. Furthermore, it will increase the total thickness of the shadow-reducing film 001, making the lamination process more difficult.

[0031] In one embodiment, the light transmittance of the backing film 100 is 0.5% to 5%. Specifically, if the light transmittance is too low, although the backing film 100 has excellent light-blocking properties and a deeper black color, it will cause light to be significantly absorbed when passing through the backing film 100, and the brightness loss may exceed the acceptable limit. If the light transmittance is too high, the backing film 100 will have difficulty providing a sufficiently deep black background, thereby affecting the clarity of the shadow pattern layer 202.

[0032] In one embodiment, the light reflectivity of the back film 100 is less than or equal to 8%. Specifically, the low light reflectivity ensures that the back film 100 appears as a deep black when the screen is off, avoiding a hazy appearance caused by the back film 100 reflecting ambient light, thereby providing a high-contrast black background for the back-on pattern layer 202.

[0033] In one embodiment, the black filler 101 accounts for 9% to 12% of the mass of the base film 100 to balance high opacity and flexibility. Specifically, the black filler 101 is a key factor determining the blackness of the base film 100. If the content of the black filler 101 is less than 9%, the blackness of the base film 100 is insufficient, and the light-blocking ability decreases; if the content of the black filler 101 is greater than 12%, the proportion of the resin matrix is ​​relatively reduced, the flexibility and film-forming properties of the base film 100 deteriorate, and brittleness may occur.

[0034] In one embodiment, the mass of the first diffusing particle 102 accounts for 3% to 15% of the mass of the base film 100. Specifically, the main function of the first diffusing particle 102 is to reduce the absorption loss of light by the black filler 101 by scattering light, thereby controlling the overall brightness attenuation to within 15%. If the content of the first diffusing particle 102 is less than 3%, the number of scattering centers is insufficient, and the light path cannot be effectively changed to avoid the black filler 101, resulting in significant brightness attenuation; if the content of the first diffusing particle 102 is greater than 15%, the particle density is too high, which will increase the loss of light through multiple scattering at the particle interface.

[0035] In one embodiment, the particle size of the first diffusing particle 102 is 5 μm to 20 μm. Specifically, the particle size of the first diffusing particle 102 is directly related to the scattering efficiency and film uniformity. If the particle size is less than 5 μm, the diffusion effect on light is limited, the pre-smoothing effect is not ideal, and the improvement in brightness uniformity is not significant. If the particle size is greater than 20 μm, the large-diameter particles are not easy to disperse uniformly in the resin and are prone to sedimentation and agglomeration, resulting in local differences in optical performance.

[0036] In one embodiment, the face film 200 is located on the base film 100 and includes a transparent carrier layer 201 and a shadowless pattern layer 202. The shadowless pattern layer 202 is located on the side of the transparent carrier layer 201 facing the base film 100. Specifically, the side of the transparent carrier layer 201 facing the external environment and away from the base film 100 can serve as a touch or protective surface, protecting the underlying film structure. The shadowless pattern layer 202 includes a preset screen-off display pattern, which can be formed by printing, transfer, or photolithography. After the shadowless film 001 is attached to the LED module packaging structure, in the screen-off state, ambient light shines through the transparent carrier layer 201 onto the shadowless pattern layer 202 and is absorbed by the black filler 101 in the base film 100. The pattern area of ​​the shadowless pattern layer 202 reflects or partially transmits ambient light in a manner different from that of the base film 100, thereby forming a high-contrast visible pattern on the deep black background provided by the base film 100. When the screen is on, the intensity of the emitted light generated by the LED module packaging structure is much greater than the light reflection intensity of the shadow pattern layer 202 itself, and the bottom film 100 absorbs most of the ambient light incident from the outside, so that the shadow pattern layer 202 is almost undetectable and does not affect the normal display content.

[0037] In one embodiment, the transparent carrier layer 201 may be made of a glass material with high hardness to provide better scratch resistance.

[0038] In one embodiment, when the screen is off, the contrast ratio between the base film 100 and the shadow pattern layer 202 can reach greater than or equal to 10:1.

[0039] In one optional embodiment, the material of the shadow pattern layer 202 can be transparent white ink. In this case, the thickness of the shadow pattern layer 202 is less than or equal to 1 μm, and the dot area is 3% to 8%. Specifically, the dot area refers to the percentage of ink dots covered per unit area. When the material of the shadow pattern layer 202 is transparent white ink, a bright white pattern can be displayed when the screen is off, resulting in a strong visual impact. However, the process control is difficult, and there is a risk that a faint white shadow may appear when the screen is on. The shadow pattern layer 202 formed by transparent white ink can transmit ambient light when the screen is off, forming a high-contrast pattern on the black background provided by the base film 100, which can be clearly distinguished by the human eye. When the screen is on, because the shadow pattern layer 202 is extremely thin and the dot area is small, the attenuation, scattering, or obstruction of light when passing through the pattern area of ​​the shadow pattern layer 202 is negligible, so that the human eye cannot recognize the presence of the pattern, thus not affecting normal display.

[0040] In an optional embodiment, the material of the shadowless pattern layer 202 can also be semi-transparent black ink. In this case, the thickness of the shadowless pattern layer 202 is less than or equal to 2μm, and the light transmittance is 10%~30%. When the material of the shadowless pattern layer 202 is semi-transparent black ink, a dark gray pattern can be displayed when the screen is off, the optical compatibility with the base film 100 is higher, and the invisibility effect is better when the screen is on, but there is a risk of lower pattern contrast.

[0041] In one embodiment, the pattern shape in the shadow pattern layer 202 may be text, decorative texture, or preset logo, etc., but should not be limited thereto.

[0042] In one embodiment, the optical density difference between the shadowless pattern layer 202 and the base film 100 is less than or equal to 0.2. Specifically, optical density is an indicator of a material's ability to absorb or block light. When the optical densities of the shadowless pattern layer 202 and the base film 100 are very close, in the bright screen state, because the shadowless pattern layer 202 and the base film 100 have almost identical optical effects on light, there will be no discernible brightness difference between the pattern area and the background area. At the same time, the base film 100 can fully absorb ambient light entering from the outside, blocking the possibility of it activating the shadowless pattern layer 202, thereby making the shadowless pattern layer 202 completely invisible under bright screen conditions, with no visual residue.

[0043] In one embodiment, the mask 200 further includes a transparent adhesive layer 203 located on the side of the shadow pattern layer 202 near the base film 100. The transparent adhesive layer 203 contains second diffusing particles 2031, the particle size of which is different from that of the first diffusing particles 102. Specifically, the transparent adhesive layer 203 can have high light transmittance, and the main material can be a resin with high light transmittance. The second diffusing particles 2031 are uniformly distributed in the resin main body, enabling secondary scattering of light and forming a double diffusion structure with the first diffusing particles 102 in the base film 100. Specifically, the first diffusing particles 102 perform initial scattering of the light emitted from the LED module packaging structure, reducing the non-uniformity of the light. Then, the light emitted from the base film 100 enters the transparent adhesive layer 203 and is scattered again by the second diffusing particles 2031, further dispersing the light beam and improving the uniformity of light emission. Tests show that in the bright screen state, the brightness uniformity can reach greater than or equal to 85%, and the light uniformity effect can be improved by 20% to 30%.

[0044] In one specific implementation, the particle size of the second diffusing particle 2031 may be smaller or larger than the particle size of the first diffusing particle 102, or their particle size distributions may partially overlap. The material of the second diffusing particle 2031 may be the same as or different from that of the first diffusing particle 102, for example, both may be silica microspheres, or silica and PMMA microspheres respectively, but this should not be a limitation.

[0045] In one embodiment, the thickness of the transparent adhesive layer 203 is 50 μm to 60 μm. Specifically, if the thickness of the transparent adhesive layer 203 is less than 50 μm, it cannot accommodate a sufficient number of second diffusing particles 2031, affecting the scattering effect; if the thickness of the transparent adhesive layer 203 is greater than 60 μm, the total thickness of the shadow-reducing film 001 increases, which may lead to an increase in the absorption and scattering loss of the transparent adhesive layer 203 itself, affecting the overall light transmittance.

[0046] In one embodiment, the light transmittance of the transparent adhesive layer 203 is greater than or equal to 90% to reduce light loss during transmission in the transparent adhesive layer 203.

[0047] In one embodiment, the mass of the second diffusing particles 2031 accounts for 2% to 10% of the mass of the transparent adhesive layer 203. Specifically, if the content of the second diffusing particles 2031 is less than 2%, the secondary scattering effect is not obvious, and the synergistic effect with the first diffusing particles 102 cannot be fully utilized. If the content of the second diffusing particles 2031 is greater than 10%, the film viscosity increases significantly, making coating and leveling difficult, and uneven coating or particle agglomeration is likely to occur.

[0048] In one embodiment, the particle size of the second diffused particle is 3μm-15μm.

[0049] In one embodiment, the mask 200 further includes an anti-fingerprint layer 204 located on the transparent carrier layer 201, with a water contact angle greater than or equal to 110°. Specifically, the anti-fingerprint layer 204 can be made of a hydrophobic and oleophobic material with a water contact angle greater than or equal to 110°. This allows water droplets to form spherical shapes on the surface of the anti-fingerprint layer 204, making them less likely to spread. At the same time, organic contaminants such as grease are less likely to adhere, and even if they do, they are easy to wipe away, thus achieving a good anti-fingerprint effect.

[0050] In one alternative embodiment, such as Figure 1 As shown, the base film 100 and the face film 200 can be prepared to form a composite film layer to reduce process steps and facilitate bonding.

[0051] In one alternative embodiment, such as Figure 2 As shown, the base film 100 and the face film 200 can also be prepared independently and applied separately, realizing a flexible combination of standardized base film 100 and customized face film 200, and reducing the scrap cost caused by poor application.

[0052] In one embodiment, the LED reflector sheet 001 provided in this application further includes a first adhesive layer 300 and a second adhesive layer 400. Specifically, the first adhesive layer 300 is located between the base film 100 and the surface film 200 to adhere the base film 100 and the surface film 200. The second adhesive layer 400 is located on the side of the base film 100 facing away from the surface film 200 and is used to adhere the base film 100 to the LED module packaging structure. By providing the first adhesive layer 300 and the second adhesive layer 400, if misalignment, bubbles, or other defects occur during the application of the base film 100 and the surface film 200, the film can be removed and replaced without discarding the entire LED reflector sheet 001, thereby significantly reducing scrap losses, improving process flexibility, and reducing production costs.

[0053] In one embodiment, the first adhesive layer 300 and the second adhesive layer 400 may be release films.

[0054] Reference Figure 2 , Figure 2 A cross-sectional view of an LED display module provided in an embodiment of this application is shown below. Figure 2 As shown, the LED display module provided in this application embodiment includes an LED module packaging structure 000 and a shadow film 001 as described in any of the above embodiments, with the shadow film 001 located on the LED module packaging structure 000.

[0055] Specifically, the LED module packaging structure 000 may include a substrate, an array of LED chips, a covering adhesive layer for the chips, and a driving circuit. After the shadowless film 001 is attached to the LED module packaging structure 000, in the off-screen state, the entire display surface presents a uniform black appearance, with a color difference ΔE between different areas less than or equal to 1.5, making the boundaries indistinguishable to the human eye. Furthermore, the shadowless pattern layer 202 presents a high contrast, creating a unique aesthetic effect when the screen is off. In the on-screen state, the shadowless pattern layer 202 is completely invisible, and the displayed content is clear and uninterrupted.

[0056] It is understood that the LED display module provided in this application has the advantages of the shadow film 001 as described in any of the above embodiments, which will not be repeated here.

[0057] Reference Figure 3 , Figure 3 This is a step diagram illustrating the fabrication method of an LED display module provided in an embodiment of this application, as shown below. Figure 3 As shown, the manufacturing steps of the LED display module provided in this application embodiment include: Step S101: Provide an LED module packaging structure 000, which can be a packaging structure obtained after die bonding, wire bonding or reflow soldering, encapsulant filling and curing on a substrate.

[0058] Step S102: Deposit the shadow film 001 as described in any of the above embodiments onto the LED module packaging structure 000.

[0059] In an optional embodiment, performing step S102 may include the following steps: The shadow film 001 is attached to the LED module packaging structure 000.

[0060] Next, hot pressing and curing are performed.

[0061] Specifically, in this embodiment, the base film 100 and the surface film 200 of the LED reflector film 001 can be an integral composite structure. When attaching the LED reflector film 001 to the LED module packaging structure 000, the entire LED reflector film 001 can be attached to the LED module packaging structure 000, followed by hot pressing and curing. This method is simple and can improve process efficiency.

[0062] In an optional embodiment, when performing step S102 above, the following steps may also be included: The base film 100 is attached to the LED module packaging structure 000 and subjected to initial hot pressing and curing.

[0063] Next, the face mask 200 is attached to the base film 100 and then hot-pressed and cured again.

[0064] Specifically, in this embodiment, the base film 100 and the face film 200 in the shadow mask 001 can be separate structures. When attaching the shadow mask 001 to the LED module packaging structure 000, the base film 100 is first positioned and attached to the LED module packaging structure 000 via the second adhesive layer 400, and then subjected to initial hot pressing and curing; then the face film 200 is positioned and attached to the cured base film 100 via the first adhesive layer 300, and then subjected to hot pressing and curing again. Step-by-step bonding allows for separate control of the alignment and bonding of the base film 100 and the face film 200. If any layer fails to bond or is defective, it can be removed and re-bonded individually, greatly reducing the scrap rate and production costs.

[0065] In one embodiment, the vacuum degree of both hot pressing operations is less than or equal to -95 kPa, and the hot pressing time is 5 min to 10 min for each operation. The first pressure used for the initial hot pressing is 0.3 MPa to 0.6 MPa, and the second pressure used for the subsequent hot pressing is 0.2 MPa to 0.4 MPa.

[0066] In one embodiment, the curing energy for both curing processes is 1000mJ / cm²~1200mJ / cm².

[0067] It is understood that the method for preparing the LED display module provided in this application has the advantages of the shadow film 001 described in any of the above embodiments, and will not be repeated here.

[0068] It should be understood that the elements described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0069] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

[0070] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section.

[0071] Furthermore, although preferred embodiments have been disclosed above in this application, these embodiments are not intended to limit this application. For any person skilled in the art, many possible variations and modifications can be made to the technical solutions of this application based on the disclosed technical content, or equivalent embodiments can be modified accordingly, without departing from the scope of the technical solutions of this application. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this application, without departing from the content of the technical solutions of this application, shall still fall within the scope of protection of the technical solutions of this application.

[0072] It should also be understood that, unless otherwise specified or indicated, the terms “first,” “second,” “third,” etc., in the specification are used only to distinguish the various components, elements, and steps in the specification, and not to indicate the logical or sequential relationships between the various components, elements, and steps.

[0073] Furthermore, it should be recognized that the terminology described herein is used only to describe particular embodiments and is not intended to limit the scope of this application. It must be noted that the singular forms “a” and “an” as used herein include plural bases unless the context clearly indicates the opposite. For example, a reference to “a step” or “an apparatus” means a reference to one or more steps or apparatuses, and may include secondary steps and secondary apparatuses. All conjunctions used should be understood in the broadest sense. Also, the word “or” should be understood as having the definition of logical “or”, not logical “exclusive OR”, unless the context clearly indicates the opposite. Furthermore, implementations of the methods and / or devices in the embodiments of this application may include performing selected tasks manually, automatically, or in combination.

Claims

1. A shadow-reducing diaphragm, characterized in that, include: A base film (100) having at least a black filler (101) and first diffused particles (102) therein; and, A face mask (200) is located on the base film (100) and includes a transparent carrier layer (201) and a shadow pattern layer (202), wherein the shadow pattern layer (202) is located on the side of the transparent carrier layer (201) facing the base film (100).

2. The shadow-reducing membrane according to claim 1, characterized in that, The face mask (200) also includes: A transparent adhesive layer (203) is located on the side of the shadow pattern layer (202) close to the base film (100). The transparent adhesive layer (203) contains second diffusion particles (2031), and the particle size of the second diffusion particles (2031) is different from that of the first diffusion particles (102).

3. The shadow-reducing membrane according to claim 1, characterized in that, The thickness of the base film (100) is 30 μm to 50 μm, the light transmittance is 0.5% to 5%, and the light reflectance is less than or equal to 8%; and / or, The black filler (101) accounts for 9% to 12% of the mass of the base film (100), the first diffusion particle (102) accounts for 3% to 15% of the mass of the base film (100), and the particle size of the first diffusion particle (102) is 5 μm to 20 μm.

4. The shadow-reducing membrane according to claim 2, characterized in that, The thickness of the transparent adhesive layer (203) is 50μm~60μm, and the light transmittance is greater than or equal to 90%; and / or, The mass of the second diffuse particle (2031) accounts for 2% to 10% of the mass of the transparent adhesive layer (203), and the particle size of the second diffuse particle (2031) is 3μm to 15μm.

5. The shadow-reducing membrane according to claim 1, characterized in that, The face mask (200) also includes: An anti-fingerprint layer (204) is located on the transparent carrier layer (201), wherein the water contact angle of the anti-fingerprint layer (204) is greater than or equal to 110°; and / or, The shadow-reducing diaphragm (001) also includes: A first adhesive layer (300) is located between the base film (100) and the face film (200) to adhere the base film (100) and the face film (200). The second adhesive layer (400) is located on the side of the base film (100) opposite to the face film (200).

6. The shadow-reducing membrane according to claim 1, characterized in that, The material of the shadow pattern layer (202) is transparent white ink, the thickness of the shadow pattern layer (202) is less than or equal to 1 μm, and the dot area is 3%~8%; or, The material of the shadow pattern layer (202) is semi-transparent black ink, the thickness of the shadow pattern layer (202) is less than or equal to 2μm, and the light transmittance is 10%~30%.

7. The shadow-reducing membrane according to claim 1, characterized in that, The optical density difference between the shadow pattern layer (202) and the base film (100) is less than or equal to 0.

2.

8. An LED display module, characterized in that, include: LED module packaging structure (000); The shadow film (001) as described in any one of claims 1 to 7 is located on the LED module packaging structure (000).

9. A method for manufacturing an LED display module, characterized in that, include: Provide LED module packaging structure (000); The shadow film (001) as described in any one of claims 1 to 7 is disposed on the LED module packaging structure (000).

10. The method for preparing an LED display module according to claim 9, characterized in that, The step of setting the shadow-reducing film on the LED module packaging structure includes: The shadow-reflecting film (001) is attached to the LED module packaging structure (000); Perform hot pressing and curing.

11. The method for preparing an LED display module according to claim 9, characterized in that, The step of setting the shadow-reducing film on the LED module packaging structure includes: The base film (100) is attached to the LED module packaging structure (000) and subjected to initial hot pressing and curing. The face mask (200) is attached to the base film (100) and then hot-pressed and cured again.

12. The method for preparing an LED display module according to claim 11, characterized in that, The vacuum degree of both hot pressings is less than or equal to -95 kPa, and the hot pressing time is 5 min to 10 min; the pressure of the first hot pressing is 0.3 MPa to 0.6 MPa, and the pressure of the second hot pressing is 0.2 MPa to 0.4 MPa; and / or, the curing energy of both curings is 1000 mJ / cm² to 1200 mJ / cm².

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