Full-automatic exposure machine for processing printed circuit board

Abstract

The present application belongs to the technical field of printed circuit board processing, and particularly relates to a full-automatic exposure machine for printed circuit board processing. The existing rigid clamping jaw is in contact with a roller for positioning, which is easy to scratch the board surface and damage the dry film, leading to alignment failure and batch quality defects, and reducing the reliability of automation. The present application proposes the following scheme, which comprises an exposure chamber shell, and control cabinets are arranged on both sides of the exposure chamber shell. The full-automatic exposure machine for printed circuit board processing disclosed in the present application has a floating correction module, which drives a flexible soft plate by air pressure to correct the suspension substrate without contact, completely eliminates hard scratches, and guarantees the integrity of the pattern. The independent air path control of the partitioned hollow plate is combined with intelligent adsorption and air floating and blowing dual functions. When adsorbing, only the covered area of the plate is opened, air leakage is prevented, high-speed transfer stability is ensured, energy consumption is greatly reduced, and when blowing, an air film is formed to realize non-damaging demolding, and the alignment accuracy and the yield of the discharging are improved.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board processing technology, and in particular to a fully automatic exposure machine for printed circuit board processing. Background Technology

[0002] Printed circuit boards (PCBs) are core components of various electronic devices and are widely used in new energy vehicles, 5G communications, industrial intelligent equipment, aerospace, and many other fields. The exposure process, as the core and critical process of PCB pattern transfer, directly determines the PCB circuit forming accuracy, interlayer alignment accuracy, and overall product quality. It is an indispensable core link in the production and processing of multilayer precision PCBs. In the more cutting-edge field of integrated circuit manufacturing, extreme ultraviolet (EUV) lithography technology has taken the lead in achieving efficient patterning with nanometer-level linewidths. Its mature experience in high-precision alignment and yield control is gradually penetrating into high-end PCB processes. At the same time, the AI-assisted optical proximity effect correction and real-time exposure parameter optimization methods relied upon by intelligent integrated circuits also provide important technical references for the intelligent upgrading of PCB exposure processes. These cross-domain collaborative innovations are driving the PCB industry to evolve from traditional pattern transfer to higher precision and higher efficiency chip-level manufacturing.

[0003] Existing fully automatic exposure equipment relies on pneumatic grippers to hold and fix the plate from the edge during the pre-exposure alignment process, or on edge rollers to apply lateral thrust to the plate to achieve edge positioning when the platform moves. These actuators are made of metal or hard engineering plastics, and their contact with the plate surface is a rigid point contact or line contact. These rigid contact components are very easy to scratch or indent the plate surface, which seriously weakens the reliability and operating efficiency of the fully automatic exposure machine for continuous automated operation, and also significantly increases the risk of batch quality defects. Summary of the Invention

[0004] This invention discloses a fully automatic exposure machine for printed circuit board processing, aiming to solve the technical problems in the prior art where existing rigid grippers and rollers contact positioning, which easily scratch the board surface, damage the dry film, and lead to alignment failure and poor batch quality, thus reducing the reliability of automation.

[0005] This invention proposes a fully automatic exposure machine for printed circuit board processing, comprising:

[0006] The exposure chamber shell has control cabinets on both sides, and a feeding platform and a discharging platform are respectively installed above the two control cabinets.

[0007] A floating correction module is installed inside the outer shell of the exposure chamber. The floating correction module includes multiple electric hydraulic cylinders, which are arranged in a rectangular shape at equal intervals on one side of the top of the outer shell of the exposure chamber. The drive ends of the multiple electric hydraulic cylinders are fixedly connected to the same lifting fixture plate.

[0008] The unloading module is located inside the outer shell of the exposure chamber. The unloading module includes two electric telescopic rods, which are symmetrically arranged on one side of the top of the outer shell of the exposure chamber. The drive ends of the two electric telescopic rods are fixedly connected to the same lifting U-shaped frame.

[0009] In a preferred embodiment, the floating correction module further includes:

[0010] The tooling frame is fixedly connected to one side of the lifting tooling plate. Multiple sides of the tooling frame are provided with mounting round openings, and hollow air cylinders are fixedly connected inside the multiple mounting round openings.

[0011] Multiple sealing slide rods are slidably connected to the inside of multiple hollow air cylinders. The same return spring is fixedly connected to the opposite side of the sealing slide rod and the inside of the hollow air cylinder. The return spring is located outside the sealing slide rod. The same correction plate is provided at one end of the two sealing slide rods located on the same side.

[0012] In a preferred embodiment, the floating correction module further includes:

[0013] Pump body one is set on one side of the lifting fixture plate. The air-blowing end of pump body one is connected to the inside of multiple hollow air cylinders through an air-blowing pipe. Floating round slide rods are equidistantly connected to one side of the lifting fixture plate.

[0014] The limiting flexible plate is fixedly connected to one end of multiple floating slide rods. The floating slide rods and the lifting tool plate are fixedly connected to the same telescopic spring on the opposite side. The telescopic spring is located outside the floating slide rod.

[0015] In a preferred embodiment, the floating correction module further includes:

[0016] Two linear guides are symmetrically arranged on one side of the bottom of the exposure chamber shell. An adjusting slide is slidably connected inside each of the two linear guides, and the same lead screw nut slide is fixedly connected to one side of each adjusting slide.

[0017] A transfer fixture is fixedly connected to one side of two adjusting slides. An installation port is provided on one side of the transfer fixture. A partitioned hollow plate is fixedly connected inside the installation port. Holes are provided at equal intervals on one side of the partitioned hollow plate. A rectangular partition is provided inside the partitioned hollow plate.

[0018] Pump body two is located on one side of the transfer fixture. The flow end of pump body two is connected to the interior of the partition hollow plate through the partition airflow pipe. Multiple airflow ends of the partition airflow pipe are equipped with electronic flow valves. Positioning sensor one is installed on both sides of the transfer fixture and the fixture frame.

[0019] In a preferred embodiment, the feeding module further includes:

[0020] The drive motor is located on one side of the lifting U-shaped frame. Both sides of the lifting U-shaped frame have a circular hole. The two circular holes are connected to the same double-acting lead screw through bearings. Two guide cylinders are fixedly connected to the opposite side of the lifting U-shaped frame.

[0021] Two opposing adjusting plates are symmetrically slidably connected to the outside of two guide cylinders. One end of the bidirectional lead screw and the drive end of the drive motor are both fixedly connected to pulley one. The two pulleys one are slidably connected to the outside of the same belt.

[0022] In a preferred embodiment, the feeding module further includes:

[0023] Two lead screw nut blocks are fixedly connected to one side of two opposing adjusting plates. Two circular holes are equally spaced on one side of the two opposing adjusting plates. The interior of each of the multiple circular holes is connected to a rotating shaft through a bearing. One end of each of the two rotating shafts on the same side is fixedly connected to a pulley. The exterior of the two pulleys on the same level is slidably connected to the same side conveyor belt.

[0024] In a preferred embodiment, the feeding module further includes:

[0025] Two general-purpose motors are respectively set on one side of two opposing adjustment plates. The drive end of the general-purpose motors is connected to one end of two rotating shafts through a coupling. The other end of multiple rotating shafts located on the same side is fixedly connected to linkage gears. Two linkage gears located on the same opposing adjustment plate mesh with each other.

[0026] In a preferred embodiment, the feeding module further includes:

[0027] Two positioning sensors are symmetrically arranged on both sides of the lifting U-shaped frame, and two vision probes are arranged on one side of each of the two opposing adjustment plates.

[0028] In a preferred embodiment, it also includes:

[0029] The control panel is located on one side of the exposure chamber housing, and a transparent observation window is provided on one side of the exposure chamber housing.

[0030] In a preferred embodiment, it also includes:

[0031] The fixture placement rack is located inside the outer shell of the exposure chamber. A laser exposure mechanism is installed on one side of the fixture placement rack, a warning light is installed on the outer side of the outer shell of the exposure chamber, and an adjusting screw is installed on the bottom side of the outer shell of the exposure chamber.

[0032] As can be seen from the above, the fully automatic exposure machine for printed circuit board processing provided by the present invention has the advantages of using a floating correction module to drive a flexible board with air pressure to perform non-contact correction on a suspended substrate, completely eliminating hard scratches and ensuring the integrity of the pattern. With the independent air path control of the partitioned hollow board, it has both intelligent adsorption and air flotation blowing functions. During adsorption, only the area covered by the board is opened to prevent air leakage, ensure high-speed transfer stability and significantly reduce energy consumption. During blowing, an air film is formed to achieve non-destructive demolding, which has the beneficial effects of comprehensively improving alignment accuracy and blanking yield. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the main structure of a fully automatic exposure machine for printed circuit board processing proposed in this invention;

[0034] Figure 2 This is a side view of a fully automatic exposure machine for printed circuit board processing proposed in this invention.

[0035] Figure 3 This is a cross-sectional view of the outer shell of the exposure chamber of a fully automatic exposure machine for printed circuit board processing proposed in this invention.

[0036] Figure 4 This is a schematic diagram of the floating correction module structure of a fully automatic exposure machine for printed circuit board processing proposed in this invention.

[0037] Figure 5 for Figure 4 A magnified structural diagram of part A;

[0038] Figure 6 This is a schematic diagram of the floating correction module of a fully automatic exposure machine for printed circuit board processing proposed in this invention.

[0039] Figure 7 This is a schematic diagram of the tooling frame structure of a fully automatic exposure machine for printed circuit board processing proposed in this invention.

[0040] Figure 8 This is a schematic diagram of the unloading module structure of a fully automatic exposure machine for printed circuit board processing proposed in this invention;

[0041] Figure 9 This is a schematic diagram of the unloading module of a fully automatic exposure machine for printed circuit board processing proposed in this invention.

[0042] Figure 10 for Figure 9 A magnified structural diagram of part B.

[0043] In the diagram: 1. Exposure chamber shell; 2. Transparent observation window; 3. Control panel; 4. Control cabinet; 5. Feeding platform; 6. Discharging platform; 7. Floating correction module; 701. Electric hydraulic cylinder; 702. Lifting fixture plate; 703. Positioning sensor one; 704. Floating slide bar; 705. Telescopic spring; 706. Air blower; 707. Limiting flexible plate; 708. Fixture frame; 709. Correction flexible plate; 710. Reset spring; 711. Sealing slide bar; 712. Hollow air cylinder; 713. Transfer fixture table; 714. Partitioned hollow plate; 715. Rectangular partition; 716. Partitioned airflow pipe; 8. Unloading module 801. Electric telescopic rod; 802. Lifting U-shaped frame; 803. Drive motor; 804. Belt; 805. Guide cylinder; 806. Two-way lead screw; 807. Opposing adjustment plate; 808. Vision probe; 809. Lead screw nut block; 810. Positioning sensor two; 811. Rotating shaft; 812. Linkage gear; 813. General motor; 814. Side conveyor belt; 9. Warning light; 10. Tooling rack; 11. Laser exposure mechanism; 12. Linear guide rail; 13. Adjusting lead screw; 14. Adjusting slide; 15. Lead screw nut slide bar; 16. Pump body one; 17. Pump body two; 18. Electronic flow valve. Detailed Implementation

[0044] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0045] The fully automatic exposure machine for printed circuit board processing disclosed in this invention is mainly used in scenarios where existing rigid grippers and rollers are in contact for positioning, which can easily scratch the board surface, damage the dry film, lead to alignment failure and poor batch quality, and reduce the reliability of automation.

[0046] Reference Figures 1-10 A fully automatic exposure machine for printed circuit board processing, comprising:

[0047] Exposure chamber shell 1, control cabinets 4 are provided on both sides of the exposure chamber shell 1, and feeding platform 5 and discharging platform 6 are respectively provided above the two control cabinets 4;

[0048] The floating correction module 7 is located inside the outer shell 1 of the exposure chamber. The floating correction module 7 includes multiple electric hydraulic cylinders 701. The multiple electric hydraulic cylinders 701 are arranged in a rectangular shape at equal intervals on one side of the top of the outer shell 1 of the exposure chamber. The drive ends of the multiple electric hydraulic cylinders 701 are fixedly connected to the same lifting fixture plate 702.

[0049] The unloading module 8 is located inside the outer shell 1 of the exposure chamber. The unloading module 8 includes two electric telescopic rods 801. The two electric telescopic rods 801 are symmetrically arranged on one side of the top of the outer shell 1 of the exposure chamber. The driving ends of the two electric telescopic rods 801 are fixedly connected to the same lifting U-shaped frame 802.

[0050] Reference Figures 1-7 In a preferred embodiment, the floating correction module 7 further includes:

[0051] The tooling frame 708 is fixedly connected to one side of the lifting tooling plate 702. Multiple sides of the tooling frame 708 are provided with mounting round openings, and hollow air cylinders 712 are fixedly connected inside the multiple mounting round openings.

[0052] Multiple sealing slide rods 711 are slidably connected to the inside of multiple hollow air cylinders 712. The same return spring 710 is fixedly connected to the opposite side of the sealing slide rod 711 and the inside of the hollow air cylinder 712. The return spring 710 is located outside the sealing slide rod 711. The same correction plate 709 is provided at one end of the two sealing slide rods 711 located on the same side.

[0053] Reference Figures 1-7 In a preferred embodiment, the floating correction module 7 further includes:

[0054] Pump body 16 is located on one side of lifting fixture plate 702. The air-blowing end of pump body 16 is connected to the inside of multiple hollow air cylinders 712 through air-blowing pipe 706. Floating round rods 704 are slidably connected at equal distances on one side of lifting fixture plate 702.

[0055] The limiting flexible plate 707 is fixedly connected to one end of multiple floating slide rods 704. The floating slide rods 704 and the lifting tool plate 702 are fixedly connected to the same telescopic spring 705 on the opposite side. The telescopic spring 705 is located outside the floating slide rods 704.

[0056] Reference Figures 1-7 In a preferred embodiment, the floating correction module 7 further includes:

[0057] Two linear guide rails 12 are symmetrically arranged on one side of the bottom of the exposure chamber shell 1. An adjusting slide block 14 is slidably connected inside each of the two linear guide rails 12. The same lead screw nut slide block 15 is fixedly connected to one side of each of the two adjusting slide blocks 14.

[0058] The transfer tooling table 713 is fixedly connected to one side of the two adjusting slides 14. An installation port is opened on one side of the transfer tooling table 713. A partitioned hollow plate 714 is fixedly connected inside the installation port. Holes are opened at equal intervals on one side of the partitioned hollow plate 714. A rectangular partition 715 is provided inside the partitioned hollow plate 714.

[0059] Pump body 2 17 is located on one side of transfer fixture 713. The flow end of pump body 2 17 is connected to the interior of partition hollow plate 714 through partition airflow pipe 716. Multiple airflow ends of partition airflow pipe 716 are equipped with electronic flow valves 18. Positioning sensor 1 703 is installed on both sides of transfer fixture 713 and fixture frame 708.

[0060] Specifically, the PCB substrate to be exposed is first transferred by the feeding platform 5 to the transfer fixture 713 inside the exposure chamber shell 1. At this time, the transfer fixture 713 does not directly adsorb the substrate, but enters the air-float suspension alignment mode. Specifically, the pump body 17 is started, and compressed gas is delivered into the partitioned hollow plate 714 through the partitioned airflow pipe 716. The control system opens the electronic flow valve 18 of the corresponding area air path according to the substrate size. The compressed gas is sprayed upward through the dense channels on the surface of the partitioned hollow plate 714, forming a uniform and stable micron-level gas film between the substrate and the platform. This gas film lifts the substrate upward, so that the substrate is completely separated from the hard upper surface of the transfer fixture 713 and is in a suspended state, thereby aligning the substrate with the platform. Sliding friction is transformed into air friction with extremely low resistance. In this suspended state, the floating correction module 7 initiates an alignment action. During the alignment action, positioning sensors 703 are installed on both sides of the transfer fixture table 713 and the fixture frame 708. These positioning sensors 703 are used to initially sense the position information of the substrate, ensuring that the substrate is roughly within the coverage area of ​​the fixture frame 708. Then, multiple electric hydraulic cylinders 701 synchronously drive the lifting fixture plate 702 to descend, causing the fixture frame 708 and its internal correction flexible plate 709 to move to a horizontal position around the suspended substrate. Compressed air is then pumped into a specific hollow air cylinder 712 through the pump body 16 and the air pipe 706. The air pressure pushes the sealing slide rod 711 to extend outward against the elastic force of the return spring 710. This drives the alignment plate 709 to gently push the edge of the suspended substrate. Because the substrate is in an air-floating state, its horizontal movement resistance is extremely low. The alignment plate 709 only needs to apply a very weak pushing force to make the substrate move smoothly in the horizontal plane. Through the coordination of multiple alignment plates 709, the substrate is efficiently and accurately pushed to the target alignment position without any contact or hard friction, until its alignment mark strictly coincides with the graphic reference of the laser exposure mechanism 11. Simultaneously, the limiting plate 707, under the action of the telescopic spring 705, applies a gentle downward preload to the suspended substrate from above. Combined with the upward thrust of the bottom air film, this ensures that the substrate maintains a stable suspension height during horizontal alignment, preventing excessive jumping or tilting. When the substrate is in… After high-precision alignment is completed in air-float mode, the system automatically switches to precision exposure and fixation mode. At this time, pump body 17 stops supplying air and switches to vacuum mode. The electronic flow valve 18 of the partitioned hollow plate 714 remains open according to the substrate size, while the valves in other areas remain closed. As the gas film rapidly dissipates, the substrate is stably and tightly adsorbed onto the surface of the partitioned hollow plate 714. Since no hard contact occurs during the alignment process, the dry film and circuit structure on the substrate surface remain intact. At this stage, the key lies in the partitioned adsorption method: because only the air path corresponding to the area effectively covered by the substrate is opened, the uncovered suction holes are not connected to the atmosphere due to the closed valves, avoiding the problem of sudden drop in vacuum caused by large-area air leakage in traditional integral adsorption platforms.The system maintains an extremely high negative pressure value, ensuring the substrate is firmly held during high-speed transfer, and the surface flatness meets the standards required for exposure. Subsequently, the adjusting screw 13 drives the screw nut slide 15 to move the adjusting slide 14 on the linear guide rail 12, precisely transporting the transfer fixture 713 to below the laser exposure mechanism 11. During the transport process, vacuum adsorption is maintained, and the substrate does not undergo any micro-displacement. The laser exposure mechanism 11 scans or projects the substrate according to the preset pattern, completing a high-precision pattern transfer.

[0061] In specific application scenarios, this invention fundamentally changes the rigid contact positioning method of traditional pneumatic grippers or edge rollers by setting a floating correction module 7. Specifically, both the correction flexible board 709 and the limiting flexible board 707 are made of flexible polymer materials, and their contact with the edge or surface of the printed circuit board (PCB) is a flexible surface contact. During the correction process, the sealing slide rod 711 is driven by air pressure in the hollow air cylinder 712, and at the same time, with the buffering effect of the return spring 710, the pushing force applied by the correction flexible board 709 to the board is a uniform and gradual elastic force, rather than a sudden rigid impact force. This design completely eliminates the risk of scratches and indentations on the dry film and circuitry on the board surface. This invention ensures the integrity of graphic transfer from the source and significantly improves the yield of batch products. The transfer fixture 713 in this invention integrates a partitioned hollow plate 714 with a rectangular partition 715, and achieves independent control of the airflow path through the partitioned airflow pipe 716 and electronic flow valve 18. This allows the platform to have both intelligent adsorption and air flotation blowing effects: when processing PCB boards of different sizes, the control system feeds back the board size information and only opens the electronic flow valve 18 in the area completely covered by the board. The air intake holes in the uncovered areas are not connected to the atmosphere because the valves are closed, avoiding the problem of sudden drop in vacuum caused by large-area air leakage in traditional integral adsorption platforms. This not only ensures that boards of any size can be firmly adsorbed and prevent microscopic displacement during high-speed transfer, but also significantly reduces the ineffective power consumption and operating noise of the vacuum pump body 17, achieving energy saving and noise reduction. After the exposure process is completed and the transfer fixture 713 moves to the unloading station, the hollow plate 714 in this partition can switch the air path through the electronic flow valve 18 to uniformly blow compressed gas to the bottom of the board. The airflow forms a micron-level air film between the board and the platform, effectively destroying the vacuum adsorption force and electrostatic adhesion force between the board and the platform, making the board suspend. At this time, with the side conveyor belt 814 of the unloading module 8 inserted into the side of the board, the material can be easily picked up, avoiding bending of the board or damage to the inner circuit caused by forced prying or pulling.

[0062] Reference Figure 1 , Figure 8 , Figure 9 and Figure 10 In a preferred embodiment, the feeding module 8 further includes:

[0063] The drive motor 803 is located on one side of the lifting U-shaped frame 802. Both sides of the lifting U-shaped frame 802 have a circular hole 1. The two circular holes 1 are connected to the same bidirectional lead screw 806 through bearings. Two guide cylinders 805 are fixedly connected to the opposite side of the lifting U-shaped frame 802.

[0064] Two opposing adjusting plates 807 are symmetrically slidably connected to the outside of two guide cylinders 805. One end of the bidirectional lead screw 806 and the driving end of the drive motor 803 are both fixedly connected to pulleys. The two pulleys are slidably connected to the outside of the same belt 804.

[0065] Reference Figure 1 , Figure 8 , Figure 9 and Figure 10 In a preferred embodiment, the feeding module 8 further includes:

[0066] Two lead screw nut blocks 809 are fixedly connected to one side of two opposing adjusting plates 807 respectively. Two circular holes 2 are equally spaced on one side of the two opposing adjusting plates 807. The interior of multiple circular holes 2 is connected to a rotating shaft 811 through a bearing. One end of the two rotating shafts 811 located on the same side is fixedly connected to a pulley 2. The exterior of the two pulleys 2 located at the same level is slidably connected to the same side conveyor belt 814.

[0067] Reference Figure 1 , Figure 8 , Figure 9 and Figure 10 In a preferred embodiment, the feeding module 8 further includes:

[0068] Two general-purpose motors 813 are respectively set on one side of two opposing adjustment plates 807. The drive end of the general-purpose motors 813 is connected to one end of two rotating shafts 811 through a coupling. The other end of the multiple rotating shafts 811 located on the same side is fixedly connected to a linkage gear 812. The two linkage gears 812 located on the same opposing adjustment plate 807 mesh with each other.

[0069] Reference Figure 1 , Figure 8 , Figure 9 and Figure 10 In a preferred embodiment, the feeding module 8 further includes:

[0070] Two positioning sensors 810 are symmetrically arranged on both sides of the lifting U-shaped frame 802, and two vision probes 808 are provided on one side of each of the two opposing adjustment plates 807.

[0071] Reference Figure 1 , Figure 2 and Figure 3 In a preferred embodiment, it further includes:

[0072] The control panel 3 is located on one side of the outer shell 1 of the exposure chamber, and a transparent observation window 2 is provided on one side of the outer shell 1 of the exposure chamber.

[0073] Reference Figure 1 , Figure 2 and Figure 3 In a preferred embodiment, it further includes:

[0074] The tooling rack 10 is located inside the exposure chamber shell 1. A laser exposure mechanism 11 is provided on one side of the tooling rack 10. A warning light 9 is provided on the outer side of the exposure chamber shell 1. An adjusting screw 13 is provided on the bottom side of the exposure chamber shell 1.

[0075] Specifically, after exposure, the transfer fixture 713 moves to the unloading station, and the system enters the air-float assisted unloading mode. First, the unloading module 8 performs a width adaptive action: the drive motor 803 drives the bidirectional lead screw 806 to rotate via the belt 804, and the lead screw nut block 809 drives two opposing adjusting plates 807 to move towards each other along the guide cylinder 805. The vision probe 808 monitors the edge position of the substrate in real time, so that the side conveyor belt 814 is precisely adjusted to the two sides of the substrate edge. Subsequently, the pump body 17 switches to the air supply mode again, and the partitioned hollow plate 714 blows compressed air to the bottom of the substrate again. The substrate is re-formed into an air-floating layer, which lifts the exposed substrate upwards, breaking the vacuum adsorption force. At this time, the substrate is in a suspended state again, with no hard contact positive pressure between it and the platform. Finally, the general motor 813 is started, which drives the side conveyor belt 814 through the linkage gear 812 and pulley 2. Since the substrate is in an air-floating state, the side conveyor belt 814 only needs to provide a very small horizontal clamping and guiding force from both sides to smoothly and gently pull the substrate out horizontally from above the transfer fixture 713 and transport it to the discharge platform 6, completing the entire fully automatic non-destructive exposure processing flow.

[0076] In specific application scenarios, the unloading module 8 uses a bidirectional lead screw 806 in conjunction with a vision probe 808 to achieve adaptive counter-directional adjustment for plates of different widths. The side conveyor belt 814 provides clamping and conveying force only within a very narrow range on both sides of the plate, and it is a flexible belt contact. Combined with the air-blowing suspension function of the aforementioned partitioned hollow plate 714, the side conveyor belt 814 does not need to bear the full weight of the plate, but only needs to provide horizontal guiding force, which completely avoids secondary damage to the plate caused by uneven force or friction with a hard platform during the unloading process.

[0077] Working principle: The PCB substrate to be exposed is first transferred by the feeding platform 5 to the transfer fixture 713 inside the exposure chamber shell 1. At this time, the transfer fixture 713 does not directly adsorb the substrate, but enters the air-float suspension alignment mode. Specifically, the pump body 17 is started, and compressed gas is delivered into the partitioned hollow plate 714 through the partitioned airflow pipe 716. The control system opens the electronic flow valve 18 of the corresponding area air path according to the substrate size. The compressed gas is sprayed upward through the dense channels on the surface of the partitioned hollow plate 714, forming a uniform and stable micron-level gas film between the substrate and the platform. This gas film lifts the substrate upward, so that the substrate is completely separated from the hard upper surface of the transfer fixture 713 and is in a suspended state, thereby aligning the substrate with the platform. The sliding friction is transformed into air friction with extremely low resistance. In this suspended state, the floating correction module 7 initiates the alignment action. Multiple electric hydraulic cylinders 701 synchronously drive the lifting fixture plate 702 to descend, causing the fixture frame 708 and its internal correction flexible plate 709 to move to the horizontal position around the suspended substrate. Compressed air is pumped into a specific hollow air cylinder 712 through the pump body 16 and the air pipe 706. The air pressure pushes the sealing slide rod 711 to overcome the elastic force of the return spring 710 and extend outward, thereby driving the correction flexible plate 709 to gently push the edge of the substrate in the suspended state. Since the substrate is in an air-floating state, its horizontal movement resistance is extremely small. The correction flexible plate 709 only needs to apply an extremely weak pushing force to make the substrate produce a smooth translation in the horizontal plane. With the coordinated action of multiple alignment flexible plates 709, the substrate is efficiently and precisely pushed to the target alignment position without any contact or hard friction, until its alignment mark strictly coincides with the graphic reference of the laser exposure mechanism 11. At the same time, the limiting flexible plate 707, under the action of the telescopic spring 705, applies a gentle downward pressure preload to the suspended substrate from above, which, together with the upward thrust of the bottom air film, keeps the substrate at a stable suspension height during the horizontal alignment process, preventing excessive jumping or tilting. After the substrate completes high-precision alignment in the air-floating state, the system automatically switches to the precision exposure fixing mode. At this time, the pump body 17 stops supplying air and switches to the vacuum pumping mode, and the electronic flow valve 18 of the partitioned hollow plate 714 remains open in a state corresponding to the substrate size. The valves in the remaining areas remain closed. As the gas film rapidly dissipates, the substrate is smoothly and tightly adsorbed onto the surface of the partitioned hollow plate 714. Since no hard contact occurs during the alignment process, the dry film and circuit structure on the substrate surface remain intact. At this stage, the key lies in the partitioned adsorption method: because only the air path corresponding to the area effectively covered by the substrate is opened, the uncovered air intake holes are not connected to the atmosphere due to the closed valves, avoiding the problem of sudden drop in vacuum caused by large-area air leakage in traditional integral adsorption platforms. The system can maintain an extremely high negative pressure value, ensuring that the substrate is firmly adsorbed during high-speed transfer, and the surface flatness meets the standard required for exposure. Subsequently, the adjusting screw 13 drives the screw nut slide 15 to move the adjusting slide 14 on the linear guide rail 12.The transfer fixture 713 is precisely transported to the area below the laser exposure mechanism 11. During transport, vacuum adsorption is maintained, preventing any microscopic displacement of the substrate. The laser exposure mechanism 11 scans or projects the substrate according to a preset pattern, completing a high-precision pattern transfer. After exposure, the transfer fixture 713 moves to the unloading station, and the system enters the air-float assisted unloading mode. First, the unloading module 8 performs a width adaptive action: the drive motor 803 drives the bidirectional lead screw 806 to rotate via the belt 804, and the lead screw nut block 809 drives two opposing adjusting plates 807 to move towards each other along the guide cylinder 805. The vision probe 808 monitors the edge position of the substrate in real time, ensuring that the side conveyor belt 814 is precisely adjusted to the substrate. Next, pump body 17 switches back to air supply mode, and the partitioned hollow plate 714 blows compressed gas to the bottom of the substrate again, reforming the air-floating layer and lifting the exposed substrate upwards, breaking the vacuum suction force. At this point, the substrate is in a suspended state again, with no rigid contact pressure between it and the platform. Finally, the general-purpose motor 813 starts, driving the side conveyor belt 814 through the linkage gear 812 and pulley 2. Because the substrate is in an air-floating state, the side conveyor belt 814 only needs to provide a very small horizontal clamping and guiding force from both sides to smoothly and gently pull the substrate horizontally out from above the transfer fixture 713 and transport it to the discharge platform 6, completing the entire fully automatic non-destructive exposure processing flow.

[0078] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A fully automatic exposure machine for printed circuit board processing, characterized in that, include: Exposure chamber shell (1), and control cabinets (4) are provided on both sides of the exposure chamber shell (1), and feeding platform (5) and discharging platform (6) are respectively provided above the two control cabinets (4). A floating correction module (7) is installed inside the outer shell (1) of the exposure chamber. The floating correction module (7) includes multiple electric hydraulic cylinders (701). The multiple electric hydraulic cylinders (701) are arranged in a rectangular shape at equal intervals on one side of the top of the outer shell (1). The driving ends of the multiple electric hydraulic cylinders (701) are fixedly connected to the same lifting fixture plate (702). The unloading module (8) is located inside the outer shell (1) of the exposure chamber. The unloading module (8) includes two electric telescopic rods (801). The two electric telescopic rods (801) are symmetrically arranged on one side of the top of the outer shell (1) of the exposure chamber. The driving ends of the two electric telescopic rods (801) are fixedly connected to the same lifting U-shaped frame (802).

2. The fully automatic exposure machine for printed circuit board processing according to claim 1, characterized in that, The floating correction module (7) also includes: The tooling frame (708) is fixedly connected to one side of the lifting tooling plate (702). Multiple sides of the tooling frame (708) are provided with mounting round openings, and hollow air cylinders (712) are fixedly connected inside the multiple mounting round openings. Multiple sealing slide rods (711) are slidably connected to the interior of multiple hollow air cylinders (712). The same return spring (710) is fixedly connected to the opposite side of the interior of the sealing slide rod (711) and the hollow air cylinder (712). The return spring (710) is located outside the sealing slide rod (711). The same correction plate (709) is provided at one end of the two sealing slide rods (711) located on the same side.

3. The fully automatic exposure machine for printed circuit board processing according to claim 2, characterized in that, The floating correction module (7) also includes: Pump body 1 (16) is set on one side of lifting fixture plate (702). The air-blowing end of pump body 1 (16) is connected to the inside of multiple hollow air cylinders (712) through air-blowing pipe (706). Floating round rods (704) are slidably connected at equal distances on one side of lifting fixture plate (702). The limiting soft plate (707) is fixedly connected to one end of multiple floating slide rods (704). The floating slide rods (704) and the lifting tool plate (702) are fixedly connected to the same telescopic spring (705), and the telescopic spring (705) is located outside the floating slide rods (704).

4. The fully automatic exposure machine for printed circuit board processing according to claim 3, characterized in that, The floating correction module (7) also includes: Two linear guides (12) are symmetrically arranged on one side of the bottom of the exposure chamber shell (1). An adjusting slide (14) is slidably connected inside the two linear guides (12). The same lead screw nut slide (15) is fixedly connected to one side of the two adjusting slides (14). A transfer fixture (713) is fixedly connected to one side of two adjusting slides (14). An installation port is provided on one side of the transfer fixture (713). A partitioned hollow plate (714) is fixedly connected inside the installation port. A channel is provided at equal intervals on one side of the partitioned hollow plate (714). A rectangular partition (715) is provided inside the partitioned hollow plate (714). Pump body 2 (17) is located on one side of the transfer fixture table (713). The flow end of pump body 2 (17) is connected to the interior of the partition hollow plate (714) through the partition airflow pipe (716). Multiple airflow ends of the partition airflow pipe (716) are equipped with electronic flow valves (18). Positioning sensor 1 (703) is provided on both sides of the transfer fixture table (713) and the fixture frame (708).

5. The fully automatic exposure machine for printed circuit board processing according to claim 1, characterized in that, The feeding module (8) also includes: The drive motor (803) is located on one side of the lifting U-shaped frame (802). Both sides of the lifting U-shaped frame (802) have a circular hole. The two circular holes are connected to the same double-acting screw (806) through bearings. Two guide cylinders (805) are fixedly connected to the opposite side of the lifting U-shaped frame (802). Two opposing adjusting plates (807) are symmetrically slidably connected to the outside of two guide cylinders (805). One end of the bidirectional lead screw (806) and the drive end of the drive motor (803) are both fixedly connected to pulleys. The two pulleys are slidably connected to the outside of the same belt (804).

6. The fully automatic exposure machine for printed circuit board processing according to claim 5, characterized in that, The feeding module (8) also includes: Two lead screw nut blocks (809) are fixedly connected to one side of two opposing adjusting plates (807). Two circular holes are equally spaced on one side of the two opposing adjusting plates (807). The interior of each of the multiple circular holes is connected to a rotating shaft (811) through a bearing. One end of each of the two rotating shafts (811) located on the same side is fixedly connected to a pulley. The exterior of each of the two pulleys located at the same level is slidably connected to the same side conveyor belt (814).

7. The fully automatic exposure machine for printed circuit board processing according to claim 6, characterized in that, The feeding module (8) also includes: Two general-purpose motors (813) are respectively set on one side of two opposing adjustment plates (807). The drive end of the general-purpose motor (813) is connected to one end of two rotating shafts (811) through a coupling. The other end of the multiple rotating shafts (811) located on the same side is fixedly connected with a linkage gear (812). The two linkage gears (812) located on the same opposing adjustment plate (807) mesh with each other.

8. The fully automatic exposure machine for printed circuit board processing according to claim 7, characterized in that, The feeding module (8) also includes: Two positioning sensors (810) are symmetrically arranged on both sides of the lifting U-shaped frame (802), and two vision probes (808) are provided on one side of each of the two opposing adjustment plates (807).

9. A fully automatic exposure machine for printed circuit board processing according to claim 1, characterized in that, Also includes: The control panel (3) is located on one side of the exposure chamber housing (1), and a transparent observation window (2) is provided on one side of the exposure chamber housing (1).

10. A fully automatic exposure machine for printed circuit board processing according to claim 9, characterized in that, Also includes: The tooling rack (10) is located inside the exposure chamber shell (1). A laser exposure mechanism (11) is provided on one side of the tooling rack (10). A warning light (9) is provided on the outer side of the exposure chamber shell (1). An adjusting screw (13) is provided on the bottom side of the exposure chamber shell (1).

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