Material scheduling and data burning system for automatically taking and placing material splicing boards

Abstract

The present application relates to the field of electrical assembly manufacturing, and discloses a material scheduling and data burning system for automatic material taking and placing panel, comprising a carrier plate transmission module, an identification acquisition module, an electrical connection configuration module, a sorting and buffering and shunting module and a central control module, the central control module establishes the logical topology coordinates of the measured circuit unit according to the carrier plate identification code, the electrical connection configuration module comprises a passive centering compensation unit, which is used for neutralizing the positioning gap tolerance, so that the configuration probe is aligned with the measured circuit unit, the central control module determines the quality state according to the burning feedback data, and marks the physical position of the abnormal circuit unit in the logical topology coordinates, and the sorting and buffering and shunting module adjusts the buffering height according to the carrier plate thickness, the present application establishes the dynamic association mechanism of identity information and physical position, solves the alignment compensation and fault tracing problems in the high-density panel automatic burning process, and guarantees the yield control efficiency under high line load.

Description

Technical Field

[0001] This invention belongs to the field of electrical component manufacturing technology, and in particular relates to a material scheduling and data recording system for automatic material picking and placing assembly plates. Background Technology

[0002] Currently, automated material handling and integrated circuit programming typically employ a production system consisting of a linear conveyor belt and pneumatic fixtures to physically position circuit board panels and write firmware. This existing technology offers a degree of stability in large-scale continuous production of a single model. However, as wireless communication module products evolve towards miniaturization and high-density deployment, the requirements for the alignment accuracy of automated programming equipment and the flexibility of line switching when switching between multiple models increase. In manufacturing environments that prioritize high output rates, existing automated equipment often faces physical alignment limitations when handling large-scale panel products. Cumulative tolerances generated during panel manufacturing and deformation caused by environmental heat effects result in rigid constraints from the fixtures when programming probes contact pads or pins. Simply increasing the speed of the robotic arm to achieve a breakthrough in production capacity can lead to a decrease in programming yield due to positioning center offset caused by motion inertia, and may even result in probe damage or physical damage to the circuit board. This forces the manufacturing end to compromise between alignment accuracy and production cycle time.

[0003] Conventional methods of correcting positioning errors by adding high-resolution vision sensors or multi-axis servo compensation increase the computational load on the central processing unit and extend the single alignment cycle in high-speed production line pulsating conditions. Precision optical components are highly sensitive to environmental vibrations and temperature fluctuations, increasing equipment maintenance costs and failure rates. It is difficult to balance rapid changeover with high repeatability positioning accuracy while ensuring high production line load. Existing technologies require a technical approach that achieves physical-level alignment self-compensation while maintaining dynamic response performance. For example, Chinese invention patent CN222028607U discloses a chip programming device that uses a moving plate to drive a fixed block and a movable plate to generate linkage, causing multiple push plates to move closer to the center, thereby improving the alignment accuracy of a single chip. While physical extrusion positioning of chips offers some centering and alignment capabilities for single-size chips, it fundamentally relies on the pre-defined trajectory of a rigid linkage mechanism. Faced with the nonlinear cumulative tolerances generated during the production process of high-density panelization, the lack of physical-level flexible compensation margin makes it highly susceptible to probe damage or abnormal contact resistance due to over-constraint in positioning. A deeper problem lies in the fact that this existing technology only addresses the single dimension of physical alignment, failing to establish an instantaneous correlation between the programming feedback data stream and the physical topological coordinates of the panelization. This results in the system's inability to accurately trace the logical origin and route abnormal sub-units when processing large-scale panels, making it difficult to meet the requirements of modern high-load production lines for flexible scheduling and full lifecycle data traceability.

[0004] Therefore, the technical problem to be solved by this invention is how to construct a programming alignment structure with physical constraint self-compensation characteristics, combined with full-chain material scheduling and fault tracking logic, to achieve efficient and high-precision automated production and yield monitoring of high-density panel products in complex dynamic environments. Summary of the Invention

[0005] This invention aims to solve the problems of high difficulty in automatically compensating for physical positioning deviations and low efficiency in tracing faulty sub-units during the automated programming process of high-density circuit board panels.

[0006] In this technical solution, an automatic material handling and data recording system for picking up and placing pallets includes a carrier plate transmission module, an electrical connection configuration module, a central control module, a sorting buffer and diversion module, and an identification acquisition module.

[0007] The electrical connection configuration module includes a passive centering compensation unit, which is used to neutralize the fit clearance tolerance between the positioning reference and the carrier, so that the configuration probe is aligned with the pin of the circuit unit under test and the coaxiality deviation is no more than 0.3mm.

[0008] The central control module retrieves the preset unit layout data based on the carrier board identification code and establishes the logical topology coordinates of each tested circuit unit within the carrier board. The central control module obtains the programming feedback data of the tested circuit unit and compares the programming feedback data with the preset verification threshold to determine the quality status of the tested circuit unit and marks the physical location information of abnormal circuit units in the logical topology coordinates.

[0009] The sorting buffer diversion module includes a lifting step adjustment unit. The central control module obtains the thickness parameters of the carrier plate and calculates the displacement step of the lifting step adjustment unit, so that the sorting buffer diversion module adjusts the buffer height according to the displacement step to support the carrier plate containing the abnormal circuit unit.

[0010] The system connects to a mobile interactive terminal. The central control module receives the carrier board identification code transmitted back by the mobile interactive terminal and highlights the physical location information in the corresponding position on the display interface.

[0011] Preferably, the sorting buffer diversion module also includes a width adjustment and flow guiding unit and a vertical transmission unit; the width adjustment and flow guiding unit adjusts the track width according to the lateral dimension of the carrier plate, and its width adjustment accuracy is 0.05mm; the vertical transmission unit drives the sorting buffer diversion module to generate a stroke displacement of 150mm to 300mm in the vertical direction; the central control module matches the internal transmission path coordinates according to the displacement step distance to form a dynamic coupling path for the carrier plate diversion process.

[0012] Preferably, the repeatability of the electrical connection configuration module is 0.1mm to 0.15mm; the passive centering compensation unit establishes an adaptive alignment of the configuration probe with the center of the pin of the circuit unit under test through a flexible constraint mechanism, so as to neutralize the mechanical cumulative tolerance caused by system replacement.

[0013] Preferably, the carrier board transmission module adopts a dual-path parallel architecture, including a main transmission line module and a bypass return module; the central control module monitors the operating load of the electrical connection configuration module and adjusts the turnout allocation logic between the main transmission line module and the bypass return module based on the utilization rate of each configuration station.

[0014] Preferably, the central control module collects the amount of carrier board input, output, and system idle time, and calculates the production yield curve and the overall system performance index. When the defect rate in the burning feedback data exceeds the preset threshold, the central control module triggers the early warning logic and diagnoses the contact stress of the configuration probe based on the clustering distribution characteristics of the abnormal circuit units.

[0015] Preferably, the carrier board transmission module is equipped with an electrostatic shielding unit and a side orientation correction unit; the side orientation correction unit completes the initial orientation alignment before the carrier board enters the electrical connection configuration module through pneumatic adjustment logic.

[0016] Preferably, the passive centering compensation unit includes an elastic reset component and a floating support base, which is used to generate a radial micro-displacement in response to the contact pressure between the pin of the circuit unit under test and the configuration probe during the configuration pressing process.

[0017] Preferably, when the system is in the model change mode, the central control module simultaneously issues the width setting command of the width adjustment guide unit and the initial potential energy command of the vertical transmission unit according to the currently retrieved model specification parameters, and the system completes the model change logic switch in less than 40 seconds.

[0018] Compared with existing technologies, the material scheduling and data recording system for automatic material loading and unloading of assembly plates of the present invention has the following advantages:

[0019] 1. In the material scheduling of automatic pick-and-place assembly, the layered programming fixture adopts a separate structure of upper pin plate and carrier plate, and with the help of positioning pins and magnetic adsorption components, a physical constraint mechanism with self-collimation characteristics is constructed. During component replacement, the mechanism achieves initial positioning through pin hole cooperation, and completes the final steady-state anchoring by using the attraction of magnetic components. This ensures that the coaxiality between the programming probe and the circuit module pin is maintained within 0.3mm on one side, which solves the technical contradiction between the high-precision contact requirements in electronic manufacturing and the frequent changeover speed of the production line, and ensures the electrical connection stability during the high-density integrated circuit programming process.

[0020] 2. The buffer system integrates a lead screw pitch lifting mechanism and a width-adjustable conveyor line, enabling the track to adaptively adjust its state according to the thickness and dimensions of the circuit board. This dynamic adjustment method in both vertical and horizontal directions, combined with the material scheduling logic of the multi-layer buffer positions, allows the system to maintain the continuity of material flow through flexible configuration of the mechanical structure when processing panel products of different specifications. This avoids downtime and maintenance caused by insufficient hardware compatibility when traditional equipment faces the production of diverse products, and achieves refined control of production cycle time.

[0021] 3. The barcode scanning and identification mechanism and control system establish a dynamic association between the panel identity information and the physical location of the sub-units. In conjunction with the handheld identification terminal, a spatial topology tracking path is formed for abnormal products. When the system detects an individual with abnormal burning inside the panel, this association mechanism locks the abnormal data to the specific physical coordinates and highlights the fault location on the terminal interface. This transforms the subsequent maintenance process from blind troubleshooting to precise positioning, improves the yield control efficiency under high production line load, and ensures the traceability of manufacturing data throughout the entire life cycle. Attached Figure Description

[0022] Figure 1 This is a flowchart illustrating the overall collaborative operation of the material scheduling and data recording system of this invention.

[0023] Figure 2 This is a block diagram of the carrier board transmission and distribution logic for the load feedback of the present invention. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0025] It should be noted that all directional and positional terms used in this invention, such as: up, down, left, right, front, back, vertical, horizontal, inner, outer, top, bottom, transverse, longitudinal, center, etc., are only used to explain the relative positional relationship and connection between components in a specific state (as shown in the accompanying drawings). They are only for the convenience of describing this invention and do not require that this invention be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention. In addition, the descriptions of "first," "second," etc., in this invention are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated.

[0026] In the description of this invention, unless otherwise explicitly specified and limited, the terms installation, connection, and linking should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0027] In the description of this specification, references to the terms "an embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example, and the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] An automated material handling and data recording system for pallet loading and unloading includes a carrier plate transmission module, an electrical connection configuration module, a central control module, a sorting buffer and diversion module, and an identification acquisition module.

[0029] The electrical connection configuration module includes a passive centering compensation unit, which is used to neutralize the fit clearance tolerance between the positioning reference and the carrier, so that the configuration probe is aligned with the pin of the circuit unit under test and the coaxiality deviation is no more than 0.3mm.

[0030] The central control module retrieves the preset unit layout data based on the carrier board identification code and establishes the logical topology coordinates of each tested circuit unit within the carrier board. The central control module obtains the programming feedback data of the tested circuit unit and compares the programming feedback data with the preset verification threshold to determine the quality status of the tested circuit unit and marks the physical location information of abnormal circuit units in the logical topology coordinates.

[0031] The sorting buffer diversion module includes a lifting step adjustment unit. The central control module obtains the thickness parameters of the carrier plate and calculates the displacement step of the lifting step adjustment unit, so that the sorting buffer diversion module adjusts the buffer height according to the displacement step to support the carrier plate containing the abnormal circuit unit.

[0032] The system connects to a mobile interactive terminal. The central control module receives the carrier board identification code transmitted back by the mobile interactive terminal and highlights the physical location information in the corresponding position on the display interface.

[0033] Preferably, the sorting buffer diversion module also includes a width adjustment and flow guiding unit and a vertical transmission unit; the width adjustment and flow guiding unit adjusts the track width according to the lateral dimension of the carrier plate, and its width adjustment accuracy is 0.05mm; the vertical transmission unit drives the sorting buffer diversion module to generate a stroke displacement of 150mm to 300mm in the vertical direction; the central control module matches the internal transmission path coordinates according to the displacement step distance to form a dynamic coupling path for the carrier plate diversion process.

[0034] Preferably, the repeatability of the electrical connection configuration module is 0.1mm to 0.15mm; the passive centering compensation unit establishes an adaptive alignment of the configuration probe with the center of the pin of the circuit unit under test through a flexible constraint mechanism, so as to neutralize the mechanical cumulative tolerance caused by system replacement.

[0035] Preferably, the carrier board transmission module adopts a dual-path parallel architecture, including a main transmission line module and a bypass return module; the central control module monitors the operating load of the electrical connection configuration module and adjusts the turnout allocation logic between the main transmission line module and the bypass return module based on the utilization rate of each configuration station.

[0036] Preferably, the central control module collects the amount of carrier board input, output, and system idle time, and calculates the production yield curve and the overall system performance index. When the defect rate in the burning feedback data exceeds the preset threshold, the central control module triggers the early warning logic and diagnoses the contact stress of the configuration probe based on the clustering distribution characteristics of the abnormal circuit units.

[0037] Preferably, the carrier board transmission module is equipped with an electrostatic shielding unit and a side orientation correction unit; the side orientation correction unit completes the initial orientation alignment before the carrier board enters the electrical connection configuration module through pneumatic adjustment logic.

[0038] Preferably, the passive centering compensation unit includes an elastic reset component and a floating support base, which is used to generate a radial micro-displacement in response to the contact pressure between the pin of the circuit unit under test and the configuration probe during the configuration pressing process.

[0039] Preferably, when the system is in the model change mode, the central control module simultaneously issues the width setting command of the width adjustment guide unit and the initial potential energy command of the vertical transmission unit according to the currently retrieved model specification parameters, and the system completes the model change logic switch in less than 40 seconds.

[0040] Example 1: In a specific scenario of automated wireless communication module programming, the operation flow of an automatic material handling and data programming system for panel assembly is as follows. The challenges faced in this scenario stem from the cumulative mechanical tolerances induced by frequent line changes between multiple models and the difficulty in locating individual faulty sub-units in high-density panels. Traditional rigid alignment mechanisms struggle with handling dimensions of 250mm. When assembling 250mm panels, the misalignment of the positioning reference and the carrier causes the probe to fail to align with the pins of the circuit unit under test. When abnormal feedback data is recorded inside the panel, the material scheduling logic struggles to correlate electrical performance defects with specific physical coordinates in real time, leading to manual troubleshooting during rework. Furthermore, the conveyor track lacks an adaptive adjustment mechanism in the height direction for carriers of different thicknesses. To address the technical contradiction between alignment accuracy and line change speed, the system uses a carrier transfer module to send the circuit unit under test to the electrical connection configuration module. The electrical connection configuration module employs a layered structure including an upper pin plate and a carrier plate. This structure utilizes positioning pins and magnets for positioning and activates a passive centering compensation unit during the pressing process. Through the physical cooperation of the elastic reset component and the floating support base, the system neutralizes the accumulated mechanical tolerances caused by the system's changeover and generates a slight radial displacement in response to the contact pressure between the pins of the circuit unit under test and the configuration probe. To ensure the probe is aligned with the pin of the circuit unit under test with a coaxiality deviation of no more than 0.3mm, specifically, the bottom of the floating support base and the supporting substrate are provided with inverted conical guide grooves that are centrally symmetrically distributed, and pressure-equalizing balls are assembled in the grooves. When the upper needle plate presses down, causing the initial position of the needle tip and the pin to be misaligned, the contact pressure is decomposed into a horizontal tangential component under the action of the inclined surface of the inverted conical guide groove, driving the balls to roll along the inclined surface, mechanically converting the vertical force into a driving force that drives the entire floating support base to slide radially in the XY plane, until the probe and the pin are centered and the force reaches physical equilibrium. This physical-level flexible compensation mechanism and the rapid positioning characteristics of the layered structure produce a synergistic effect. Under the premise that the repeatability accuracy is maintained at 0.1mm to 0.15mm, the time to complete the switching of machine specification parameters is no more than 40s, achieving a balance between high-precision contact requirements and frequent model changeover efficiency on the production line.

[0041] In terms of data stream processing, the identification acquisition module collects the carrier board identification code and sends it to the central control module. The central control module retrieves the preset unit layout data based on the carrier board identification code and establishes the logical topology coordinates of each tested circuit unit within the carrier board. When the central control module obtains the burning feedback data of the tested circuit unit and determines that the quality status is abnormal, the system marks the physical location information of the abnormal circuit unit in the logical topology coordinates and associates it with the handheld identification terminal. When the operator returns the carrier board identification code through the handheld identification terminal, the central control module displays the physical location information at the corresponding position on the display interface. This dynamic association mechanism between identification information and physical location transforms the fault diagnosis task into precise positioning based on spatial topology, eliminating the traceability delay caused by the complex internal layout of large-scale panel products. The sorting, buffering, and diversion module calculates the data based on the central control module's data. The calculated displacement step distance adjusts the buffer height. Through the coordinated operation of the lifting step distance adjustment unit and the width adjustment guide unit, compatible transmission for carrier plates of different thicknesses is achieved. In the underlying execution of this transmission scheduling, the central control module has a built-in multi-axis motion controller. Based on the known mass of the carrier plate and the calculated discrete displacement step distance, the trapezoidal velocity curve feedforward algorithm is used to calculate the continuous acceleration, uniform velocity and deceleration profile parameters of the servo drive in real time. Synchronous motion interpolation commands are issued to the vertical transmission unit and the width adjustment guide unit, so that the physical track changing trajectory of the diversion mechanism is smooth and without mechanical collision when handling materials of different specifications. Through the above methods, the system forms a closed-loop system that integrates physical constraint self-compensation, logical coordinate mapping and flexible material scheduling. While ensuring the traceability of manufacturing data throughout the entire life cycle, it maintains the high-efficiency output of electrical component manufacturing in complex dynamic environments.

[0042] Example 2: In the stability verification test for a high-density integrated circuit manufacturing environment, the system collects real-time operating data through a physical experimental platform. This platform has a displacement detection environment with a measurement range of 0mm to 500mm and a resolution of 0.01mm, and is equipped with an electrical signal monitoring device with a sampling frequency of not less than 1000Hz. To simulate real industrial electromagnetic interference, Gaussian white noise with a signal-to-noise ratio of 20dB is actively superimposed on the test signal source, and a 50Hz power frequency interference harmonic is introduced. The core parameter involved in the test is the sampling period. The setting depends on the moving speed of the carrier board transmission module and the processing latency of the central control module. The technical trade-off lies in maintaining the real-time performance of data feedback while reducing the system's computational load. The sampling period... Follow the decision model: when the movement speed When the value is in the high range of 0.5 m / s to 0.8 m / s, in order to avoid loss of data features, The sampling period tends to be close to the lower limit of the range of 1ms. Under typical operating conditions, i.e., a moving speed of 0.6m / s, the sampling period is... Set to 1.2ms.

[0043] The experiment involved multi-dimensional comparisons using the present invention sample group, control sample group one, and control sample group two. The present invention sample group employed a complete electrical connection configuration module including a passive centering compensation unit. Control sample group one removed the passive centering compensation unit and adopted a rigid fixing structure. Control sample group two had the panel size of the tested circuit unit set to 300mm. The test was performed at a depth of 300mm to exceed the boundary limits. During the operation of the prototype, after the identification module recognized the carrier board identification code and established the logical topology coordinates, the tested circuit unit entered the electrical connection configuration module. The system observed that under the input condition of an original alignment deviation of 0.52mm, the passive centering compensation unit responded to the contact pressure generated by the downward pressure of the configuration probe, and its floating bearing base generated radial displacement. The output intermediate characteristic data, i.e., the real-time coaxiality deviation, decreased from the original 0.52mm to 0.18mm. The processed electrical signal waveform showed that the power frequency interference was effectively suppressed. Finally, it was determined that the programming feedback data of the tested circuit unit was stable and the first pass rate was high. The first pass rate reached 98.2%, while the control group, under the same noise interference and initial deviation, had a coaxiality deviation between the probe and pin maintained at 0.48mm, leading to abnormal fluctuations in contact resistance and ultimately a lower first pass rate. With a success rate of only 85.6%, this comparison confirms that the passive centering compensation unit's mechanism of neutralizing mechanical tolerances through physical displacement is a necessary prerequisite for improving contact stability.

[0044] To verify the performance inflection point and boundary conditions, the experiment examined the nonlinear effect of changes in panel size on positioning accuracy. Data showed that when the panel size increased from 100mm... The thickness was increased from 100mm to the preset upper limit of 250mm in this invention. At 250mm, the repeatability of the sample group of this invention remained at around 0.12mm, exhibiting stability. However, when the size continued to increase to 300mm, corresponding to the second comparative sample group, the accuracy decreased. At 300mm, the repeatability deteriorated to 0.35mm, and the coaxiality deviation exceeded the 0.3mm threshold. This indicates that when the cantilever length of the carrier exceeds the physical modal constraint, mechanical resonance causes overload interference to the elastic reset component of the passive centering compensation unit, confirming the 250mm... 250mm is the optimal working window to ensure the system's flexible compensation effectiveness. Within this window, the system calculates the displacement step distance through the central control module. The command-driven lifting step adjustment unit is calculated using the following formula: ,in, For the target cache height, At the current height, the test record shows that the system completed a full thickness specification switch and buffer height adjustment in 38.5 seconds. This test directly proves that in a non-ideal environment filled with noise and mechanical tolerances, the system can stably maintain high-precision electrical connections and material scheduling through deep collaboration of physical compensation and logical mapping. The hourly output measured in the experiment... Stable above 2150, and during continuous 24-hour operation, the central control module achieved 100% accuracy in marking the physical location of abnormal circuit units. The closed-loop control mechanism formed by the system effectively solves the technical problem of the incompatibility between high efficiency and high reliability in the manufacturing of electrical components, and realizes the unity of traceability of manufacturing data throughout the entire life cycle and production flexibility.

[0045] Example 3: In a multi-model mixed manufacturing scenario where the carrier plate thickness is between 1.0mm and 2.5mm, the system faces cumulative displacement deviations caused by the lack of a physical reference for the lifting step distance adjustment unit. This leads to a decrease in the horizontal alignment accuracy between the width adjustment and flow guiding unit and the carrier plate transmission module. Simultaneously, if the carrier plate identification code acquired by the identification acquisition module lacks a definite mapping path, it will cause a temporal misalignment between the logical topological coordinates and the physical spatial quadrant of the sub-unit. Furthermore, the floating support base experiences displacement lag due to static friction when responding to contact pressure, causing the repeatability accuracy to deviate from the target range of 0.1mm to 0.15mm. Before operation, the system completes the initial state definition by using the limit sensor at the top of the lifting step distance adjustment unit to sense the physical upper limit point and using this point as the zero height point to eliminate cumulative tolerances. The central control module acquires the thickness parameters of the carrier plate to be processed and calculates the displacement step distance. displacement step The calculation formula is as follows: ,in, This refers to the vertical travel of the lifting step adjustment unit. This is a preset thickness reference value corresponding to the carrier plate identification code. To compensate for the real-time flatness deviation feedback from the height displacement sensor, during the establishment of the logical topology coordinates, the central control module receives the carrier plate identification code transmitted by the identification acquisition module, retrieves the panel specifications corresponding to the carrier plate identification code from the preset unit layout database, and extracts the total number of rows of the sub-unit. With total number of columns Based on the configuration probe array arrangement of the electrical connection configuration module, establish the initial index coordinates (1,1); fill the input with the programming feedback data of each tested circuit unit according to the scanning timing. When the quality status of a certain coordinate point is determined to be abnormal, the central control module sets the abnormality flag bit and the corresponding... Physical space parameters are synchronously written to non-volatile memory. During this process, the electrical connection configuration module adjusts the preload of the elastic reset component in the passive centering compensation unit to ensure that the preload is greater than the starting static friction of the floating support base. This ensures that the radial displacement generated by the configuration probe under contact pressure follows the pin position in real time. When the system continuously processes 50 sets of carriers of different specifications, the positioning deviation of the lifting step adjustment unit is maintained within 0.05mm. The accuracy of the logical topology coordinates generated by the central control module and the physical correspondence between the panels is 100%. This reliable parameter calculation path and orderly matrix establishment process transform the scheduling logic into reproducible control commands, eliminating deviation fluctuations during height adjustment and position tracking, and maintaining the hourly output. While maintaining a value above 2200, it ensures the reliability of manufacturing data in a multi-variety mixed production environment.

[0046] Example 4: In a scenario involving the programming of high-density, irregularly shaped circuit units under test, the system establishes a logical topological coordinate reference library for specific carrier board identification codes before initiating the data mapping logic. The central control module retrieves offline calibration data from the memory. This data is generated by a high-resolution vision sensor scanning the physical origin of the sample. This vision sensor is orthogonally mounted at the top center point of the track where the carrier board enters the electrical connection configuration module. Before scanning, the radial and tangential distortion coefficients of the lens are extracted using a standard checkerboard calibration plate and solidified into a calibration intrinsic parameter matrix. The pixel coordinates of the sample edge feature points in the image are obtained through a sub-pixel edge extraction algorithm and multiplied by a pre-established millimeter / pixel physical equivalent scaling factor. Finally, the spatial translation vector from the track zero point to the camera optical center is superimposed, thereby realizing the transformation and mapping from the visual image domain to the absolute physical coordinate system of the machine tool. The system retrieves the reference library based on the carrier board identification code collected by the identification acquisition module and establishes the reference library for the circuit unit under test. Logical topology matrix, physical center coordinates of sub-units The calculation formula is as follows: ;in, For the first The horizontal physical coordinates of the row sub-unit. The coordinates of the reference point for the upper left corner of the carrier plate are given. The preset unit spacing, For row index, The system uses the cumulative manufacturing deviation compensation amount obtained by visual scanning to restore the spatial quadrant of the tested circuit unit based on the carrier board identification code, and then burns the feedback data to bind it with the physical location.

[0047] When the system faces situations where the electrical connection configuration module needs to be replaced or the pin material of the circuit unit under test changes, the electrical connection configuration module performs force-position co-calibration through the pressure transmitter and displacement feedback meter. The system drives the upper needle plate to press down onto the surface of the calibration block and acquires the pressure value. Radial displacement value of the passive centering compensation unit By adjusting the initial compression of the elastic reset component, the starting pressure of the passive centering compensation unit is kept within the range of 1.5N to 2.2N. This starting pressure is greater than the starting static friction of the floating bearing base. The width-adjusting guide unit synchronously adjusts the step distance according to the clamping force feedback from the pressure sensor, keeping the clamping force between 5N and 8N, and the coaxiality deviation within 0.18mm. The reproducibility accuracy of the electrical component manufacturing process is maintained throughout the entire equipment lifecycle. A process judgment quantification procedure based on the spatial geometric clustering model is established, and configuration probe contact stress interference elimination and independent diagnosis are performed. The central control module extracts the marked abnormal physical location information from the logical topology coordinates and calculates the spatial clustering index of the abnormal circuit unit in a specific physical quadrant. , The calculation formula is as follows: , This indicates the number of sub-units within an independent physical detection area where three consecutive batches of programming failure feedback occurred. This indicates the total number of sub-units covered by the detection area. The value range is 0 to 1, and the calculated result is... If the value exceeds the set aggregation threshold of 0.6 and the voltage sensor's real-time recorded curve is retrieved to eliminate power supply fluctuation interference in the corresponding channel, the central control module determines that there is poor mechanical contact in a specific topology area. To confirm that this electrical spatial aggregation failure is truly caused by a lack of stress in the purely mechanical dimension, after eliminating power supply fluctuations, the central control module will immediately send an impedance testing waveform with a high-frequency AC component to the abnormal area. The dynamic change rate of the contact resistance of the array pin circuit is extracted through the system's built-in precision current transmitter. When it is found that the equivalent contact resistance drift in this area exceeds 15% of the standard impedance threshold and does not converge with the continuous pressing time, this electromechanical correlation characterization ultimately identifies it as abnormal probe contact stress. The output adjustment command drives the micro push rod motor inside the electrical connection configuration module. This micro push rod motor is matrix-embedded in the rigid metal back plate on the top of the upper needle plate. The end of its power output shaft is equipped with a micro ball screw mechanism. The moving end of the screw mechanism presses vertically downwards directly against the top force-bearing surface of the elastic reset component. After receiving the adjustment command, the rotor of the micro push rod motor rotates and extends independently through the micro-stepping drive circuit, changing the vertical height of the corresponding shaft end with millimeter-level precision. This dynamically increases or decreases the preload of the helical spring at a specific local position, thereby triggering the corresponding configuration probe group to perform secondary calibration of contact stress and physically adjust the compression of the elastic reset component to correct the local support surface parameters of the floating bearing base.

[0048] Example 5: In the deployment and debugging scenario of an automated production line for circuit board assemblies, the system initiates a standardized position timing alignment procedure to establish a synchronization benchmark between the logical topology coordinates and the physical workstation. After the identification acquisition module senses the signal edge of the scanning area triggered by the carrier board edge, the central control module starts a synchronization counter to calculate the synchronization deviation compensation time. Synchronization deviation compensation time The calculation formula is as follows: ;in, This is the delay adjustment amount for logical image instructions. To identify the fixed distance between the sensing center of the acquisition module and the physical center of the electrical connection configuration module, The real-time operating speed of the carrier board transmission module is fed back by the motor encoder. To mitigate the inherent processing delay caused by the system parsing the carrier board identifier code, and to eliminate the nonlinear error interference caused by control bus load fluctuations on the inherent processing delay in actual calculations, the central control module has a built-in high-frequency timestamp capture register. Each time an identifier code reading task is triggered, the start time of the hardware interrupt is recorded, and the end time of parsing is captured to obtain the single-cycle time. A moving average filtering algorithm with a forgetting factor is used to continuously extract the average single-cycle time of the most recently completed 10 processing cycles as the real-time update. The parameters are substituted into the formula to perform compensation; this procedure ensures that the logic index and physical position of the tested circuit unit and the configured probe are synchronized at the moment of contact by quantifying the time of the physical motion process, and in response to the abnormal working condition of failure to read the carrier board identification code during continuous processing, the central control module marks the current material status as pending inspection status and instructs the sorting buffer diversion module to stop the automatic diversion path.

[0049] When the system detects fluctuations in storage load within the sorting, buffering, and distribution module, the central control module makes decisions to correct the material scheduling direction through process judgment quantification. The central control module obtains the single-patch quality judgment result returned by the electrical connection configuration module and retrieves the number of coordinate points marked as abnormal in the logical topology coordinates. and compare it with the preset overflow threshold. A logical comparison is performed, and the decision logic is determined as follows: when Upon setup, the central control module outputs a path reset command, driving the sorting buffer diversion module to deliver the carrier board to the corresponding NG buffer position via the width-adjusting guide unit. If the real-time number of idle positions reported by the height sensor is zero, the system suspends the current transfer task and activates the status indicator light. It then performs dynamic switch allocation between the main transmission line module and the bypass return module of the carrier board transfer module. The central control module collects the occupancy time within a preset time window using photoelectric switches at the entrance of each configured workstation and calculates the utilization rate of each configured workstation. , The calculation formula is as follows: ,in, This indicates the cumulative time during which the tested circuit unit is in the pressure-burning state within the current time window. This indicates the total duration of the set statistical period. For a dimensionless parameter with a value range of 0 to 1, the central control module monitors the utilization rate of all configured workstations associated with the main transmission line module. If the value is greater than 0.85 for three consecutive cycles, the output level conversion signal drives the turnout servo motor of the carrier plate transmission module, switching the subsequent physical transmission trajectory of the carrier plate to the bypass return module for cyclic waiting. This procedure, through the coordination of synchronous compensation calculation and load feedback logic, converts the timing fluctuations in the mechanical structure operation process into a controlled parameter matrix. The system maintains the accuracy of the physical sorting path for defective products while keeping the cycle processing cycle within 12 seconds.

[0050] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit of this application and the scope of protection of this invention, and all of these forms are within the protection scope of this application.

Claims

1. A material scheduling and data recording system for automatic material loading and unloading assembly, characterized in that, Includes a carrier board transmission module, an electrical connection configuration module, a central control module, a sorting buffer and diversion module, and an identification acquisition module: The electrical connection configuration module includes a passive centering compensation unit, which is used to neutralize the fit clearance tolerance between the positioning reference and the carrier, so that the configuration probe is aligned with the pin of the circuit unit under test and the coaxiality deviation is no more than 0.3mm. The central control module retrieves the preset unit layout data based on the carrier board identification code and establishes the logical topology coordinates of each tested circuit unit within the carrier board. The central control module obtains the programming feedback data of the tested circuit unit and compares the programming feedback data with the preset verification threshold to determine the quality status of the tested circuit unit and marks the physical location information of abnormal circuit units in the logical topology coordinates. The sorting buffer diversion module includes a lifting step adjustment unit. The central control module obtains the thickness parameters of the carrier plate and calculates the displacement step of the lifting step adjustment unit, so that the sorting buffer diversion module adjusts the buffer height according to the displacement step to support the carrier plate containing the abnormal circuit unit. The system connects to a mobile interactive terminal. The central control module receives the carrier board identification code transmitted back by the mobile interactive terminal and highlights the physical location information in the corresponding position on the display interface.

2. The material scheduling and data recording system for automatic material handling and assembly according to claim 1, characterized in that, The sorting and buffering diversion module also includes a width adjustment and flow guiding unit and a vertical transmission unit. The width adjustment and flow guiding unit adjusts the track width according to the lateral dimension of the carrier plate, and its width adjustment accuracy is 0.05mm. The vertical transmission unit drives the sorting and buffering diversion module to generate a stroke displacement of 150mm to 300mm in the vertical direction. The central control module matches the internal transmission path coordinates according to the displacement step distance to form a dynamic coupling path for the carrier plate diversion process.

3. The material scheduling and data recording system for automatic material handling and assembly according to claim 1, characterized in that, The repeatability of the electrical connection configuration module is 0.1mm to 0.15mm; the passive centering compensation unit establishes an adaptive alignment of the configuration probe with the center of the pin of the circuit unit under test through a flexible constraint mechanism to neutralize the mechanical cumulative tolerance caused by system replacement.

4. The material scheduling and data recording system for automatic material handling and assembly according to claim 1, characterized in that, The carrier board transmission module adopts a dual-path parallel architecture, including a main transmission line module and a bypass return module; the central control module monitors the operating load of the electrical connection configuration module and adjusts the turnout allocation logic between the main transmission line module and the bypass return module based on the utilization rate of each configuration station.

5. The material scheduling and data recording system for automatic material handling and assembly according to claim 1, characterized in that, The central control module collects data on the number of carrier boards input, output, and system idle time, and calculates the production yield curve and the overall system performance index. When the defect rate in the programming feedback data exceeds the preset threshold, the central control module triggers the early warning logic and diagnoses the contact stress of the configuration probe based on the clustering and distribution characteristics of the abnormal circuit units.

6. The material scheduling and data recording system for automatic material handling and assembly according to claim 1, characterized in that, The carrier board transmission module is equipped with an electrostatic shielding unit and a side orientation correction unit; the side orientation correction unit completes the initial orientation alignment before the carrier board enters the electrical connection configuration module through pneumatic adjustment logic.

7. The material scheduling and data recording system for automatic material handling and assembly according to claim 1, characterized in that, The passive centering compensation unit includes an elastic reset component and a floating support base. The floating support base is used to generate a small radial displacement in response to the contact pressure between the pin of the circuit unit under test and the configuration probe during the configuration pressing process.

8. The material scheduling and data recording system for automatic material handling and assembly according to claim 2, characterized in that, When the system is in the model changeover mode, the central control module simultaneously issues the width setting command of the width adjustment guide unit and the initial potential energy command of the vertical transmission unit based on the currently retrieved model specification parameters. The system completes the model changeover logic switchover in less than 40 seconds.

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