Semiconductor temperature control device and temperature control method thereof

Abstract

The application provides a semiconductor temperature control device and a temperature control method thereof. The temperature control device comprises a circulating system, a refrigeration system, an energy storage assembly, a flow divider, a switching valve and a controller. The energy storage assembly is connected with the circulating system. The energy storage assembly comprises a cold accumulator and a heat accumulator. The cold accumulator has a first cold storage channel. The heat accumulator has a first heat storage channel. The controller is connected with the circulating system, the refrigeration system, the energy storage assembly, the flow divider and the switching valve respectively. The controller controls the flow division ratio of the flow divider, the conduction of the switching valve and the first heat storage channel or the first cold storage channel according to the circulating liquid temperature, the target set temperature, the heat storage temperature of the heat accumulator and the cold storage temperature of the cold accumulator. The semiconductor temperature control device can realize waste heat or waste cold recovery, has fast response and can save energy and reduce consumption.

Description

Technical Field

[0001] This application relates to the field of semiconductor temperature control technology, and more specifically, to a semiconductor temperature control device and its temperature control method. Background Technology

[0002] In semiconductor etching processes, the stability of the process chamber temperature and the heating / cooling rates directly affect the etching rate, uniformity, and device yield. Existing temperature control devices typically use basic components such as compressors, condensers, and evaporators to achieve cooling and heating functions. During the heating / cooling process, these devices require the cooling system to operate at full load from zero, or the heater to operate at high power for extended periods, resulting in high energy consumption and slow response. Summary of the Invention

[0003] The purpose of this application is to provide a semiconductor temperature control device and its temperature control method, which can realize waste heat or waste cold recovery, and has a fast response and can save energy and reduce consumption.

[0004] This application can be implemented as follows: This application provides a semiconductor temperature control device, including a circulation system and a refrigeration system. The refrigeration system includes a compressor, a condenser, and an evaporator. The circulation system includes a load and is connected to the evaporator for heat exchange. An energy storage component is connected to the circulation system. The energy storage component includes a cold storage unit and a heat storage unit. The cold storage unit has a first cold storage channel, and the heat storage unit has a first heat storage channel. A diverter, the inlet of which is connected to the outlet of the load, and the outlet of which is connected to the energy storage component and the evaporator respectively, so as to proportionally divert the circulating liquid of the circulation system to the evaporator and the energy storage component; A switching valve is connected to the distributor and the energy storage component respectively, and the outlet of the switching valve is connected to the first heat storage channel and the first cold storage channel respectively. The controller is connected to the circulation system, the refrigeration system, the energy storage component, the distributor and the switching valve respectively. The controller controls the flow splitting ratio of the distributor and the connection between the switching valve and the first heat storage channel or the first cold storage channel according to the circulating liquid temperature, the target set temperature, the heat storage temperature of the heat storage device and the cold storage temperature of the cold storage device.

[0005] In some embodiments, the load outlet is provided with a first temperature sensor, the load inlet is provided with a second temperature sensor, the energy storage assembly is provided with a heat storage temperature sensor for detecting the heat storage temperature of the heat storage unit and a cold storage temperature sensor for detecting the cold storage temperature of the cold storage unit; the controller is connected to the first temperature sensor, the second temperature sensor, the cold storage temperature sensor and the heat storage temperature sensor respectively.

[0006] In some embodiments, the circulating fluid temperature includes the load outlet temperature, the load inlet temperature, and the average circulating temperature. The average circulating temperature is the average of the load inlet temperature and the load outlet temperature. The switching valve is controlled to connect with the first heat storage channel or the first cold storage channel based on the average circulating temperature, the target set temperature, and the load outlet temperature. The ratio of the distributor is adjusted based on the temperature difference between the cold storage temperature or the heat storage temperature and the load outlet temperature.

[0007] In some embodiments, the energy storage component is an integrated bidirectional energy storage device. The housing of the integrated bidirectional energy storage device is provided with a hot-end phase change region, a thermal insulation layer and a cold-end phase change region in sequence. The hot-end phase change region is filled with a hot-end phase change material to form the heat storage device, and the cold-end phase change region is filled with a cold-end phase change material to form the cold storage device. The thermal insulation layer blocks heat conduction between the hot-end phase change region and the cold-end phase change region.

[0008] In some embodiments, the cold accumulator has a second cold storage channel, the heat accumulator has a second heat storage channel, the inlet of the second heat storage channel is connected to the outlet of the compressor, the inlet of the second cold storage channel is connected to the outlet of the condenser, and the outlets of both the second cold storage channel and the second heat storage channel are connected to the inlet of the compressor.

[0009] In some embodiments, both the flow divider and the switching valve are three-way valves.

[0010] In some embodiments, the refrigeration system further includes a bypass line, one end of which is connected to the outlet of the compressor and the other end of which is connected to the inlet of the evaporator.

[0011] In some embodiments, the refrigeration system further includes a liquid receiver having a liquid storage chamber and an external cooling pipe. The inlet and outlet of the liquid storage chamber are connected to the condenser and the evaporator, respectively, and the two ends of the external cooling pipe are connected to the inlet of the condenser and the compressor, respectively.

[0012] In some embodiments, the circulation system further includes a mixer connected to the evaporator and the water tank of the circulation system, respectively, and the outlets of the first cold storage channel and the first heat storage channel are both connected to the mixer.

[0013] This application also proposes a semiconductor temperature control method for use in the aforementioned semiconductor temperature control device, the temperature control method comprising: The load inlet temperature, load outlet temperature, and target set temperature of the load are obtained, and the operating mode is determined based on the load inlet temperature, load outlet temperature, and target set temperature. Based on the operating mode, the magnitude of the load outlet temperature and the cold storage temperature or the heat storage temperature, the switching valve is controlled to connect with the first cold storage channel or the first heat storage channel, and the flow splitting ratio of the separator is adjusted according to the temperature difference between the load outlet temperature and the cold storage temperature or the heat storage temperature.

[0014] In some embodiments, obtaining the load inlet temperature, load outlet temperature, and target set temperature of the load, and determining the working mode based on the load inlet temperature, load outlet temperature, and target set temperature includes: calculating the cycle average temperature based on the load inlet temperature and the load outlet temperature, and determining whether cooling or heating is required based on the temperature difference between the target set temperature and the cycle average temperature.

[0015] In some embodiments, controlling the connection between the switching valve and the first cold storage channel or the first heat storage channel according to the operating mode, the load outlet temperature, and the magnitude of the cold storage temperature or the heat storage temperature includes: When the target set temperature is greater than the average temperature of the cycle and heating is required, and the load outlet temperature is lower than the cold storage temperature and the cold storage is not saturated, the switching valve connects the first cold storage channel to perform cold storage; when the load outlet temperature is higher than the cold storage temperature or the cold storage is saturated, and the load outlet temperature is lower than the heat storage temperature, the switching valve connects the first heat storage channel to perform heat absorption. When the target set temperature is lower than the average cycle temperature and cooling is required, and the load outlet temperature is higher than the heat storage temperature and the heat storage is not saturated, the switching valve connects the first heat storage channel to perform heat storage; when the load outlet temperature is lower than the heat storage temperature or the heat storage is saturated, and the load outlet temperature is higher than the cold storage temperature, the switching valve connects the first cold storage channel to perform cold absorption.

[0016] Therefore, according to the semiconductor temperature control device and method of the present application embodiments, the heating and cooling time is significantly shortened; the steady-state temperature control accuracy is significantly improved; the temperature fluctuation during mode switching is significantly reduced; and the system energy consumption is significantly reduced. The reason for the reduction in energy consumption is that: during the cooling stage, the waste heat of the circulating liquid is recovered from the high temperature to near the phase change temperature of the heat accumulator; during the warming stage, the waste cold of the circulating liquid is recovered from the low temperature to near the phase change temperature of the cold accumulator; at the same time, in the cold storage mode, the cold accumulator only stores part of the cold, and the remaining cold energy is replenished by the recovery of the waste cold of the circulating liquid, reducing the power consumption of the refrigerant circuit; and the use of the accumulator to assist in heating and cooling further reduces the power consumption of the compressor and heater. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the process structure of the semiconductor temperature control device according to an embodiment of this application; Figure label: 1000: Semiconductor temperature control device; 100: Refrigeration system; 10: Compressor; 20: Condenser; 30: Evaporator; 40: Liquid receiver; 401: Liquid storage chamber; 402: External cooling pipe; 50: Energy storage component; 51: Heat accumulator; 511: First heat storage channel; 512: Second heat storage channel; 513: Heat storage temperature sensor; 52: Cold accumulator; 521: First cold storage channel; 522: Second cold storage channel; 523: Cold storage temperature sensor; 524: Temperature sensor at the outlet of the second cold storage channel; 53: Thermal insulation layer; 60: Distribution... Flow meter, 61: First diversion inlet, 62: First diversion outlet, 63: Second diversion outlet, 70: Switching valve, 200: Circulation system, 80: Load, 81: First temperature sensor, 82: Second temperature sensor, 90: Bypass line; 1: Mixer, 2: Water tank, 21: Temperature sensor between mixer and water tank; 3: Circulation pump, 4: Heater, 11: First control valve, 12: Second control valve, 13: Third control valve, 14: Fourth control valve, 15: Electronic expansion valve, 16: Fifth control valve; 17: Third temperature sensor. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] In the description of this application, it should be noted that if the terms "upper", "lower", "inner", "outer", etc. appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0023] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0024] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0025] Figure 1 This is a schematic diagram of the structure of a semiconductor temperature control device 1000 according to an embodiment of this application, as shown below. Figure 1 As shown, the semiconductor temperature control device 1000 according to an embodiment of this application includes a refrigeration system 100, a circulation system 200, an energy storage component 50, a flow divider 60, a switching valve 70, and a controller. The controller is connected to the refrigeration system 100, the circulation system 200, the energy storage component 50, the flow divider 60, and the switching valve 70, respectively.

[0026] The refrigeration system 100 includes a compressor 10, a condenser 20, and an evaporator 30. The circulation system 200 includes a load 80. The circulation system 200 is connected to the evaporator 30 for heat exchange, thereby enabling temperature control of the load 80. Specifically, the compressor 10, condenser 20, and evaporator 30 are connected in sequence. High-temperature and high-pressure refrigerant flows from the outlet of the compressor 10 to the condenser 20. Plant water or other heat exchange media can be introduced into the condenser 20 to exchange heat with the refrigerant, thereby condensing the refrigerant. The condensed refrigerant flows to the evaporator 30. The circulating liquid of the circulation system 200 can exchange heat with the refrigerant flowing through the evaporator 30 to perform cooling or heating.

[0027] like Figure 1 As shown, the refrigeration system 100 also includes a liquid receiver 40 and an electronic expansion valve 15. The liquid receiver 40 is connected between the condenser 20 and the evaporator 30. The low-temperature refrigerant flowing out of the condenser 20 can flow to the liquid receiver 40 for buffering and then flow to the evaporator 30. The electronic expansion valve 15 is located between the condenser 20 and the evaporator 30. Furthermore, the electronic expansion valve 15 is located between the liquid receiver 40 and the evaporator 30. The liquid receiver 40 can store high-pressure liquid refrigerant, balance the system circulation volume, and compensate for liquid level fluctuations caused by load changes.

[0028] In some embodiments of this application, such as Figure 1 As shown, the refrigeration system 100 also includes a bypass pipe 90, one end of which is connected to the outlet of the compressor 10, and the other end of which is connected to the inlet of the evaporator 30; in such cases... Figure 1 In the example shown, the other end of the bypass line 90 is connected between the electronic expansion valve 15 and the evaporator 30. The high-temperature, high-pressure gas flowing out of the compressor 10 outlet can flow through the bypass line 90 to the evaporator 30 and back to the compressor 10. The bypass line 90 not only achieves pressure equalization, but also allows the high-temperature refrigerant discharged from the compressor 10 to flow directly to the evaporator 30 during heating. The evaporator 30 then exchanges heat with the circulating liquid to raise the temperature of the circulating liquid.

[0029] The energy storage component 50 is used for heat and cold storage. It is connected to the circulation system 200. The circulating fluid of the circulation system 200 can store heat or cold through the energy storage component 50, or exchange heat with it to achieve cooling or heating, thereby reducing energy waste and enabling rapid cooling or heating. The energy storage component 50 includes a cold storage unit 52 and a heat storage unit 51. The heat storage unit 51 has a first heat storage channel 511 for heat exchange between the heat storage phase change material and the circulating fluid. The cold storage unit 52 has a first cold storage channel 521 for heat exchange between the cold storage phase change material and the circulating fluid. The circulating fluid of the circulation system 200 can store heat in the heat storage unit 51 or absorb heat to raise its temperature through the first heat storage channel 511, and store cold energy in the cold storage unit 52 or absorb cold to lower its temperature through the first cold storage channel 521. For ease of description, the temperature of the phase change material in the heat accumulator 51 can be simply referred to as the heat storage temperature, and the temperature of the phase change material in the cold accumulator 52 can be simply referred to as the cold storage temperature.

[0030] Specifically, when the load 80 of the circulation system 200 needs to be cooled and the temperature of the circulating fluid is higher than the heat storage temperature, the high-temperature circulating fluid can flow to the first heat storage channel 511 to store heat and reduce heat waste. When the temperature of the circulating fluid drops below the heat storage temperature but above the cold storage temperature, the circulating fluid can flow to the first cold storage channel 521 to absorb the cold energy of the cold accumulator 52 and improve the cooling effect. When the load 80 of the circulation system 200 needs to be heated and the temperature of the circulating fluid is lower than the cold storage temperature, the low-temperature circulating fluid can flow to the first cold storage channel 521 to store cold energy and reduce cold energy waste. When the temperature of the circulating fluid rises above the cold storage temperature, the circulating fluid can flow to the first heat storage channel 511 to absorb the heat of the heat accumulator 51 and achieve rapid heating.

[0031] The inlet of the distributor 60 is connected to the outlet of the load 80, and the outlet of the distributor 60 is connected to the energy storage component 50 and the evaporator 30 respectively. It can proportionally distribute the circulating liquid of the circulation system 200 to the evaporator 30 and the energy storage component 50. That is, the circulating liquid flowing out of the outlet of the load 80 can flow to the evaporator 30 and the energy storage component 50 respectively in proportion. The distribution ratio of the distributor 60 can be dynamically adjusted according to the temperature difference, thereby dynamically adjusting the flow rate of the circulating liquid flowing to the evaporator 30 and the energy storage component 50. This ensures efficient use of the energy storage device during the latent heat of phase change stage (large temperature difference) and gradually reduces dependence during the sensible heat exchange stage (small temperature difference), smoothly transitioning to pure active source (compressor system) control.

[0032] The switching valve 70 is connected to the distributor 60 and the energy storage assembly 50 respectively. The outlet of the switching valve 70 is connected to the first heat storage channel 511 and the first cold storage channel 521 respectively. Thus, the distributor 60 is connected to the energy storage assembly 50 through the switching valve 70. The distributor 60 has one inlet and two outlets, as shown below. Figure 1 The first diversion inlet 61, the first diversion outlet 62, and the second diversion outlet 63 shown are provided. The switching valve 70 has... Figure 1 The diagram shows inlet a, outlet b, and outlet c, where outlet b is connected to the first heat storage channel 511 and outlet c is connected to the first cold storage channel 521. Switching valve 70 can selectively connect to either the first heat storage channel 511 or the first cold storage channel 521, thereby guiding the circulating liquid to the heat accumulator 51 for heat storage or absorption, or to the cold storage accumulator 52 for cold storage or absorption. The connection between switching valve 70 and the heat accumulator 51 or cold storage 52 depends on the operating mode of the semiconductor temperature control device 1000, the comparison between the circulating liquid temperature and the phase change material temperature inside the cold storage 52, and the temperature of the phase change material inside the cold storage 52.

[0033] For example, in the heating cycle, the first heat storage channel 511 is opened when the heat storage temperature is higher than the circulating liquid temperature, and closed when the heat storage temperature is not higher than the circulating liquid temperature. In the cooling sub-condition, the first cold storage channel 521 is opened when the cold storage temperature is lower than the circulating liquid temperature, and closed when the cold storage temperature is not lower than the circulating liquid temperature. As long as the accumulator temperature has a "helping" effect on the circulating liquid (heat accumulator 51 provides heat and cold accumulator 52 absorbs heat), the branch should be opened. Once the temperature difference direction is reversed, the branch should be closed immediately to avoid reverse heat transfer.

[0034] Optionally, both the switching valve 70 and the diverter 60 can be three-way valves, which are simple in structure and easy to install.

[0035] The controller is connected to the circulation system 200, the refrigeration system 100, the energy storage component 50, the distributor 60, and the switching valve 70, respectively. The controller controls the flow ratio of the distributor 60, the connection between the switching valve 70 and the first heat storage channel 511 or the first cold storage channel 521 to perform heat storage or cold storage, and controls the connection between the switching valve 70 and the first heat storage channel 511 or the first cold storage channel 521 to enable the circulation liquid to exchange heat with the heat storage device 51 or the cold storage device 52, so as to absorb cold or heat. Therefore, based on the acquired circulating liquid temperature, target set temperature, heat storage temperature, and cold storage temperature, the controller can control the proportion of the flow splitter 60 to the energy storage component 50 and the evaporator 30, and control the switching valve 70 to perform cold storage or heat storage and cold absorption or heat absorption. This allows the controller to recover the residual heat of the circulating liquid as it cools down from a high temperature to near the heat storage temperature during the cooling phase, and to recover the residual cold of the circulating liquid as it rises from a low temperature to near the cold storage temperature during the warming phase. In the cold storage mode, only a portion of the cold end stores cold, and the remaining cold energy is replenished by the recovery of residual cold from the circulating liquid, reducing the power consumption of the refrigerant circuit. Furthermore, the controller utilizes the energy storage unit to assist in heating and cooling, further reducing the power consumption of the compressor 10.

[0036] In this application, the controller adopts an incremental PID control algorithm, which takes the temperature deviation ΔT as input and continuously adjusts the output of the active source, such as the opening degree of the electronic expansion valve 15 and the power of the heater 4, to replace the traditional fixed temperature difference threshold switching control. The incremental PID has the advantages of small computational load, suitability for real-time operation of embedded controllers, automatic avoidance of integral saturation, and smooth output without step change.

[0037] In some embodiments, the outlet of the load 80 is provided with a first temperature sensor 81, the inlet of the load 80 is provided with a second temperature sensor 82, and the energy storage assembly 50 is provided with a heat storage temperature sensor 513 for detecting the temperature of the phase change material of the heat storage unit 51 and a cold storage temperature sensor 523 for detecting the temperature of the phase change material of the cold storage unit 52. The controller is connected to the first temperature sensor 81, the second temperature sensor 82, the cold storage temperature sensor 523 and the heat storage temperature sensor 513 respectively. Thus, the controller can obtain the load inlet temperature, the load outlet temperature, the heat storage temperature of the heat storage unit 51 and the cold storage temperature of the cold storage unit 52. By processing and calculating the above-mentioned detected temperatures, the controller can determine the working mode of the semiconductor temperature control device 1000 and the energy storage state and temperature difference direction of the heat storage unit 51 and the cold storage unit 52, so as to improve the temperature control rate and save energy and reduce consumption.

[0038] In some embodiments of this application, the circulating fluid temperature includes the load inlet temperature, the load outlet temperature, and the average circulating temperature. The average circulating temperature is the average of the load outlet temperature and the load inlet temperature. The switching valve 70 is connected to the first heat storage channel 511 or the first cold storage channel 521 based on the average circulating temperature, the target set temperature, and the load outlet temperature. The ratio of the distributor 60 is adjusted according to the temperature difference between the cold storage temperature or the heat storage temperature and the load outlet temperature. Thus, by controlling the ratio of the distributor 60 through temperature difference, not only can sufficient energy recovery be ensured without affecting the cooling or heating efficiency, but energy saving and consumption reduction can also be achieved.

[0039] Specifically, the operating mode of the semiconductor temperature control device 1000 is determined by the temperature difference between the target set temperature and the average temperature of the cycle. For example, if heating or cooling is required, heating is required when the temperature difference is greater than zero, and cooling is required when the temperature difference is less than zero.

[0040] The connection between the switching valve 70 and the first cold storage channel 521 or the first heat storage channel 511 is determined based on the magnitude of the load outlet temperature and the heat storage temperature or cold storage temperature. For example, when heating is required and the load outlet temperature is lower than the cold storage temperature, the switching valve 70 is connected to the first cold storage channel 521, and the low-temperature circulating liquid flows to the cold storage accumulator 52 for cold storage. Furthermore, for the outlet opening adjustment of the distributor 60, the outlet opening connected to the switching valve 70 can be adjusted according to the temperature difference between the cold storage temperature and the load outlet temperature. For example, when the temperature difference is within the preset threshold range, the outlet opening α changes linearly proportionally. When the temperature difference reaches above the preset threshold, the outlet opening α takes the preset maximum value.

[0041] When the cold storage 52 is saturated or the load outlet temperature is not lower than the cold storage temperature but lower than the heat storage temperature, the switching valve 70 is connected to the first heat storage channel 511, and the circulating liquid flows to the heat storage 51 to absorb heat and raise the temperature. The outlet opening of the distributor 60 connected to the switching valve 70 can be adjusted according to the temperature difference between the heat storage temperature and the load outlet temperature. For example, when the temperature difference is within the preset threshold range, the outlet opening α changes linearly proportionally. When the temperature difference reaches or exceeds the preset threshold, the outlet opening α takes the preset maximum value.

[0042] When cooling is required, the circulating fluid is at a low temperature. When the load outlet temperature is higher than the heat storage temperature, the switching valve 70 connects to the first heat storage channel 511, and the circulating fluid flows to the heat accumulator 51 to achieve heat storage. When the heat accumulator 51 is saturated or the load outlet temperature is not higher than the heat storage temperature but higher than the cold storage temperature, the switching valve 70 connects to the first cold storage channel 521, and the circulating fluid flows to the cold storage accumulator 52 for cold absorption and cooling. The adjustment of the distributor 60 ratio can refer to the adjustment mode described above for heating, and can be dynamically adjusted according to the temperature difference.

[0043] In cold storage mode or heat storage mode, when the cold storage accumulator 52 is saturated or the heat storage accumulator 51 is saturated, the cold storage mode or heat storage mode can be exited. For example, when heating is required and the load outlet temperature is lower than the cold storage temperature, if the cold storage accumulator 52 is already saturated, the switching valve 70 is connected to the first heat storage channel 511, and the circulating liquid flows to the heat storage accumulator 51 to absorb heat and raise the temperature, thereby achieving rapid heating and improving the response rate. The same applies to the heat storage mode. When the heat storage accumulator 51 is saturated, the switching valve 70 is not connected to the heat storage accumulator 51.

[0044] Furthermore, during heat or cold storage, when the cold storage unit 52 and the heat storage unit 51 are saturated, the heat or cold storage state can be exited. The switching valve 70 and the distributor 60 are adjusted. During heat or cold absorption, when the heat exchange efficiency of the cold storage unit 52 or the heat storage unit 51 drops to a certain level, the distributor 60 and the switching valve 70 are closed, so that the circulating liquid flows to the evaporator 30 and is used for heating or cooling through the active source, i.e., the compressor system.

[0045] Both the cold storage unit 52 and the heat storage unit 51 may have phase change temperature ranges. These ranges are only used to determine whether the energy storage is saturated and are not directly used to control the connection between the shunt 60 and the cold storage unit 52 or the heat storage unit 51. Heat storage unit 51 saturation corresponds to the heat storage temperature reaching the phase change end temperature, indicating the completion of the preparation mode. Heat storage unit 51 venting corresponds to the heat storage temperature being lower than the phase change start temperature, indicating that latent heat is depleted but sensible heat is still available. Cold storage unit 52 saturation corresponds to the cold storage temperature reaching the phase change end temperature, indicating the completion of the preparation mode and the exit of the cold storage mode. Cold storage unit 52 venting corresponds to the cold storage temperature being higher than the phase change start temperature, indicating that latent heat is depleted but sensible heat is still available.

[0046] In some embodiments, the energy storage component 50 is an integrated bidirectional energy storage device with a compact structure that can reduce the floor space. The shell of the integrated bidirectional energy storage device is provided with a heat storage phase change zone, a thermal insulation layer 53 and a cold end phase change zone in sequence. The heat storage phase change zone is filled with heat storage phase change material to form a heat storage device 51, and the cold storage phase change zone is filled with cold storage phase change material to form a cold storage device 52. The heat storage phase change zone and the cold storage phase change zone are separated by a thermal insulation layer 53 to block heat conduction.

[0047] In some embodiments, the heat storage phase change zone is filled with a phase change material (such as a paraffin / polyol composite) having a suitable phase change temperature and sufficient phase change enthalpy; the cold storage phase change zone is filled with a phase change material (such as an ethylene glycol aqueous solution or salt hydrate composite) having a suitable phase change temperature and sufficient phase change enthalpy. The thermal insulation layer 53 is made of a low thermal conductivity material (such as aerogel) to block heat transfer between the heat accumulator 51 and the cold accumulator 52. It should be noted that the phase change materials of the heat accumulator 51 and the cold storage phase change material can also be other materials, which can be set according to actual needs. For example, the selection of the heat storage phase change material is determined based on the highest target temperature, and the selection of the cold storage phase change material is determined based on the lowest target temperature.

[0048] In some embodiments, the cold accumulator 52 has a second cold storage channel 522, and the heat accumulator 51 has a second heat storage channel 512. The inlet of the second heat storage channel 512 is connected to the outlet of the compressor 10, and the inlet of the second cold storage channel 522 is connected to the outlet of the condenser 20. The outlets of both the second cold storage channel 522 and the second heat storage channel 512 are connected to the inlet of the compressor 10. The second heat storage channel 512 and the second cold storage channel 522 are used to exchange heat with the refrigerant for heat and cold storage. In this way, the high-temperature refrigerant flowing out of the compressor 10 outlet can partially flow to the second heat storage channel 512 to store heat in the heat accumulator 51, and the low-temperature refrigerant condensed by the condenser 20 can partially flow to the second cold storage channel 522 to store cold in the cold accumulator 52. Thus, the cold accumulator 52 and the heat accumulator 51 can not only exchange heat with the circulating liquid for heat and cold storage, but also exchange heat with the refrigerant for heat and cold storage, thereby further improving the energy recovery and utilization rate and achieving energy saving and consumption reduction.

[0049] like Figure 1 As shown, the refrigeration system 100 also includes a liquid receiver 40, which has a liquid storage chamber 401 and an external cooling pipe 402. The inlet and outlet of the liquid storage chamber 401 are connected to the condenser 20 and the evaporator 30, respectively. The two ends of the external cooling pipe 402 are connected to the inlets of the condenser 20 and the compressor 10, respectively. The liquid storage chamber 401 is used to store refrigerant, and the external cooling pipe 402 can be used to cool the liquid storage chamber 401 to condense the gaseous refrigerant in the liquid storage chamber 401 and improve the refrigeration effect of the refrigerant.

[0050] In some examples, the circulation system 200 also includes a mixer 1, which is connected to both the evaporator 30 and the water tank 2 of the circulation system 200. The outlets of the first cold storage channel 521 and the first heat storage channel 511 are both connected to the mixer 1. Thus, the circulating liquid after heat exchange with the evaporator 30, as well as the circulating liquid flowing out of the first heat storage channel 511 and the first cold storage channel 521, can all flow to the mixer 1 for mixing before flowing to the water tank 2. The mixer 1 can mix different circulating liquids to achieve timely temperature uniformity, making the temperature of the circulating liquid flowing to the water tank 2 more stable. Optionally, the mixer 1 is a co-located coupling cavity with spiral guide grooves on the inner wall, which can utilize the inertia of the circulating liquid's own flow to achieve natural mixing.

[0051] like Figure 1 As shown, the circulation system 200 also includes a water tank 2, a circulation pump 3, and a heater 4. The mixer is connected to the water tank 2, and the circulation pump 3 and heater 4 are connected in sequence. The heater 4 can further adjust the temperature of the circulating liquid flowing to the inlet of the load 80 to achieve precise temperature control of the circulating liquid flowing to the load 80. A temperature sensor 21 is provided between the mixer 1 and the water tank 2, which can be used to detect the temperature of the outlet of the mixer 1 and the inlet of the water tank 2. This temperature can be used as a reference parameter for the heating adjustment of the heater 4.

[0052] In some embodiments of this application, a first control valve 11 is provided between the outlet of the compressor 10 and the second heat storage channel 512, a second control valve 12 is provided between the outlet of the compressor 10 and the condenser 20, a third control valve 13 is provided in the bypass pipeline 90, a fourth control valve 14 is provided between the condenser 20 and the external cooling pipeline 402 of the liquid receiver 40, and a fifth control valve 16 is provided between the liquid receiver 40 and the second cold storage channel 522. The controller is connected to the first control valve 11, the second control valve 12, the third control valve 13, the fourth control valve 14, and the fifth control valve 16 respectively, and controls the opening and closing of each flow path by controlling each control valve.

[0053] This application also discloses a semiconductor temperature control method, which can be applied to the aforementioned semiconductor temperature device 1000. The temperature control method includes acquiring the load inlet temperature, load outlet temperature, and target set temperature of the load 80; determining the operating mode based on the load inlet temperature, load outlet temperature, and target set temperature; controlling the connection between the switching valve 70 and the first cold storage channel 521 or the first heat storage channel 511 based on the operating mode, the load outlet temperature, and the magnitude of the cold storage temperature and heat storage temperature of the energy storage component 50; and adjusting the flow distribution ratio of the distributor 60 based on the temperature difference between the load outlet temperature and the cold storage temperature or the heat storage temperature.

[0054] Therefore, by detecting and calculating the temperature at different locations, the flow ratio of the flow divider 60 is controlled, and the switching valve 70 is connected to the heat accumulator 51 and the cold accumulator 52 to control the direction of the circulating liquid, so as to realize the heat exchange between the circulating liquid and the heat accumulator 51 and the cold accumulator 52, and to achieve rapid cooling of the circulating liquid and recovery of waste heat and waste cold.

[0055] In some embodiments, obtaining the load inlet temperature, load outlet temperature, and target set temperature of load 80, and determining the operating mode based on the load inlet temperature, load outlet temperature, and target set temperature includes: calculating the cycle average temperature based on the load inlet temperature and load outlet temperature, and determining whether cooling or heating is required based on the temperature difference between the target set temperature and the cycle average temperature.

[0056] Specifically, the operating mode of the semiconductor temperature control system is determined by the temperature difference between the target set temperature and the average temperature of the cycle. For example, if heating or cooling is required, heating is required when the temperature difference is greater than zero, and cooling is required when the temperature difference is less than zero.

[0057] In some embodiments, controlling the connection between the switching valve 70 and the first cold storage channel 521 or the first heat storage channel 511 according to the operating mode, the load outlet temperature, and the magnitude of the cold storage temperature or heat storage temperature includes: When the target set temperature is higher than the average temperature of the cycle and heating is required, and the load outlet temperature is lower than the cold storage temperature and the cold storage is not saturated, the switching valve 70 connects the first cold storage channel 521 to perform cold storage; when the load outlet temperature is higher than the cold storage temperature or the cold storage is saturated, and the load outlet temperature is lower than the heat storage temperature, the switching valve 70 connects the first heat storage channel 511 to perform heat absorption. When the target set temperature is lower than the average temperature of the cycle and cooling is required, and the load outlet temperature is higher than the heat storage temperature and the heat storage is not saturated, the switching valve 70 connects to the first heat storage channel 511 to store heat; when the load outlet temperature is lower than the heat storage temperature or the heat storage is saturated, and the load outlet temperature is higher than the cold storage temperature, the switching valve 70 connects to the first cold storage channel 521 to absorb cold.

[0058] The following is combined with Figure 1The example shown describes a semiconductor temperature control device 1000 and its control method according to a specific embodiment of this application.

[0059] In this embodiment, the phase change temperature of the heat storage unit 51 is 60℃~70℃, and its highest phase change temperature is lower than the high-temperature target (90℃). The phase change temperature of the cold storage unit 52 is -15℃~-20℃, and its lowest phase change temperature is higher than the low-temperature target (-20℃). Thus, in both high-temperature heating and low-temperature cooling, the energy storage component 50 can achieve high recovery rates of heat and cold energy from the circulating liquid. Based on the above description of the energy storage component 50's various operating conditions, including heat storage, cold storage, and heat and cold absorption, its main functions and principles are as follows: 1. Ensure the effective realization of bidirectional energy recovery function: During the cooling process, when the circulating liquid cools down from the high-temperature target of 90℃, because the phase change temperature (60℃~70℃) of the heat accumulator 51 is lower than 90℃, the circulating liquid can release heat to the phase change material of the heat accumulator 51 to realize waste heat recovery; during the heating process, when the circulating liquid heats up from the low-temperature target of -20℃, because the phase change temperature (-15℃~-20℃) of the cold accumulator 52 is higher than -20℃, the circulating liquid can release cold to the phase change material of the cold accumulator 52 to realize waste cold recovery. The two together constitute a bidirectional energy recovery system to avoid energy waste.

[0060] 2. Assisted heating and cooling to reduce energy consumption: During the heating cycle (25℃→90℃), the temperature of the heat accumulator 51 (60℃~70℃ after saturation) is lower than the temperature during the heating process of the circulating liquid, and it can continuously release heat to the circulating liquid to assist in heating and reduce the power consumption of the heater 4 and the compressor 10; During the cooling cycle (90℃→-20℃), the temperature of the cold accumulator 52 (-15℃~-20℃ after saturation) is lower than the temperature during the cooling process of the circulating liquid, and it can continuously absorb heat from the circulating liquid to assist in cooling and reduce the load of the compressor 10 by 80%.

[0061] 3. Adhering to the principle of temperature difference control, achieving smooth mode transition: This setting ensures that there is an effective temperature difference between the accumulator and the circulating fluid, which satisfies the control logic that "the direction of the temperature difference determines the branch switch and the size of the temperature difference determines the valve opening". This makes the switching between various modes (such as cooling stage A / B and heating stage C / D) smooth, without reverse heat transfer interference, and avoids temperature fluctuations.

[0062] 4. Energy-saving design adapted to cold storage mode: The cold storage unit 52 is higher than the low temperature target, and can realize the design of "partial cold storage in cold storage mode + residual cold supplementation by circulating liquid". It does not need to directly store cold to saturation in the cold storage unit 52 through refrigerant, reducing the power consumption of the refrigerant circuit and further improving the system energy efficiency.

[0063] 5. Reduce initial energy consumption and decrease energy consumption during energy storage: Under this setting, the phase change temperature of the heat accumulator 51 (60℃~70℃) is much lower than the high-temperature target of 90℃, and the phase change temperature of the cold accumulator 52 (-15℃~-20℃) is higher than the low-temperature target of -20℃. This means that during the initial energy storage, it is not necessary to heat the heat accumulator 51 to 90℃ and cool the cold accumulator 52 to -20℃. It is only necessary to heat the heat accumulator 51 to 60℃~70℃ and cool the cold accumulator 52 to -15℃~-20℃ to reach saturated energy storage. Compared with heating the heat accumulator 51 to a higher temperature and cooling the cold accumulator 52 to a lower temperature, the heating / cooling power consumption during the energy storage stage (such as preparation mode and cold storage mode) can be significantly reduced, avoiding ineffective energy consumption and further optimizing the overall energy consumption structure of the system.

[0064] The following is for reference. Figure 1 The complete process cycle of the semiconductor temperature control device 1000 shown in the example is described in detail.

[0065] Taking a typical process cycle (standby temperature 25℃ → high-temperature adsorption 90℃ → standby transition 25℃ → low-temperature etching -20℃ → standby warm-up 25℃) as an example, the timing sequence is as follows: In the preparation mode, the heat accumulator 51 is heated to saturation, and the cold accumulator 52 is cooled to saturation, with the circulating fluid stabilizing at the standby temperature. Then, it switches to the first heating cycle, where the circulating fluid rises from the standby temperature to the high-temperature target, utilizing heat release from the heat accumulator 51, compressor 10, and heater 4. After reaching the high-temperature target, it switches to the regenerative mode to maintain a stable high temperature. Next, it switches to the first cooling stage A, where the circulating fluid drops from the high-temperature target to near the phase change temperature of the heat accumulator 51, with the residual heat of the circulating fluid storing heat in the heat accumulator 51 (the distributor 60 simultaneously opens two outlets, with the initial α being a preset maximum value, decreasing linearly as the temperature difference decreases). Then, it switches to the cooling stage B, where the circulating fluid drops from near the phase change temperature of the heat accumulator 51 to the low-temperature target, with the cold accumulator 52 releasing heat and the evaporator 30 providing cooling. Then, it switches to the cold storage mode to maintain the low temperature, with the refrigerant only partially storing heat in the cold accumulator 52 (not reaching saturation), reducing refrigerant consumption. Then, switching to the second heating stage C, the circulating fluid rises from the target low temperature to near the phase change temperature of the cold storage accumulator 52. The residual cooling of the circulating fluid replenishes the cold storage accumulator 52 to saturation, achieving residual cooling recovery and energy saving (the splitter 60 simultaneously conducts two paths, with the initial α being a preset maximum value, decreasing linearly as the temperature difference decreases). Next, switching to the heating stage D, the circulating fluid rises from near the phase change temperature of the cold storage accumulator 52 to the standby temperature, and the heat storage accumulator 51 releases heat. Finally, switching to the regenerative mode stabilizes at the standby temperature.

[0066] Specifically as follows: Mode 1: Preparation Mode (25℃) The goal of the preparation mode is to saturate the heat accumulator 51, the coolant accumulator 52, and the liquid receiver 40 to reach the preset subcooling degree, stabilizing the circulating liquid at the standby temperature. The valve states are as follows: first control valve 11 is fully open, second control valve 12 is fully open, third control valve 13 is closed, electronic expansion valve 15 is adjusted to an appropriate opening to maintain the load inlet temperature at the standby temperature, fourth control valve 14 is closed, fifth control valve 16 is fully open, switching valve 70 is in any state, and the first branch outlet 62 of the distributor 60 is fully open, and the second branch outlet 63 is closed. The exit condition is the duration of the above conditions for a preset time.

[0067] In this mode, the heat storage temperature and cold storage temperature are used to determine whether the heat storage tank 51 and the cold storage tank 52 have reached saturation, the load inlet temperature is used to monitor whether the standby temperature is stable, and the outlet of the liquid storage chamber 401 is equipped with a third temperature control sensor 17 to monitor whether the subcooling of the liquid storage tank 40 meets the standard, so as to ensure that the preparation mode is completed.

[0068] Mode 2: First heating cycle (standby temperature 25℃ → high temperature target 90℃) The first heating cycle is initiated when a heating command is received and ΔT is greater than a preset threshold, where ΔT is the temperature difference between the target set temperature and the average cycle temperature, and the target set temperature is the high-temperature target. At this time, the heat accumulator 51 is saturated, and the cold accumulator 52 is saturated. Since the load outlet temperature is lower than the heat storage temperature, the heat accumulator 51 branch is opened, the switching valve 70 connects to the first heat storage channel, and α is dynamically adjusted according to the temperature difference. At the same time, the compressor 10 circulates and the heater 4 assists in heating. During this stage, the average cycle temperature rises from the standby temperature to the high-temperature target. Because the temperature is always higher than the cold storage temperature, the cold accumulator 52 branch is closed.

[0069] Regarding valve status, the valve status is as follows: First control valve 11 is closed, and second control valve 12 is open. In this case, some refrigerant can be condensed by condenser 20 and stored in receiver 40. This allows excess compressor 10 exhaust gas to be stored in receiver 40, thus achieving energy storage. Alternatively, first control valve 11 is open, and second control valve 12 is closed, allowing some compressor 10 exhaust gas to flow to the second heat storage channel 512 for heat storage. Third control valve 13 is PID-regulated, electronic expansion valve 15 is closed, fourth control valve 14 is closed, fifth control valve 16 is closed, switching valve 70 connects to heat storage tank 51, the second branch outlet 63 of distributor 60 has an opening degree of α, the first branch outlet 62 has an opening degree of 1-α, and heater 4 is PID-regulated. The exit condition is that the load inlet temperature reaches the high-temperature target set temperature.

[0070] In this mode, the load outlet temperature and the heat storage temperature are compared to determine the direction and magnitude of the temperature difference, and the α opening degree is dynamically adjusted; the load inlet temperature is used as the main control target temperature to determine whether the high temperature target has been reached and exit the mode; the cold storage temperature is used to determine the temperature difference between the cold storage 52 temperature and the load outlet temperature to ensure that the cold storage 52 branch is closed.

[0071] Mode 3: First cooling cycle (high temperature target 90℃ → low temperature target -20℃) The first cooling cycle is initiated when a cooling command is received and the target set temperature is the low-temperature target. This process consists of two stages.

[0072] Stage A: At this stage, the load outlet temperature is higher than the heat storage temperature. The waste heat of the circulating liquid is used to store heat in the heat accumulator 51, while the circulating liquid itself cools down. The distributor 60 simultaneously opens the first branch outlet 62 and the second branch outlet 63, meaning not all flow enters the heat accumulator 51. The second branch outlet 63 selects the first heat storage channel 511 via the switching valve 70, allowing part of the circulating liquid to flow through the heat accumulator 51 and release heat to the heat storage phase change material, achieving waste heat recovery. The first branch outlet 62 directly flows through the evaporator 30 to absorb heat for active cooling. Initially, the temperature difference is large, and the flow rate ratio α is set to the preset maximum value. As the circulating liquid temperature decreases, the temperature difference decreases, and α decreases linearly. When the circulating liquid temperature drops to near the heat storage temperature, α approaches zero, the branch to the heat accumulator 51 is closed, and all flow enters the evaporator 30, transitioning to Stage B. The valve status is as follows: first control valve 11 is closed, second control valve 12 is appropriately opened, third control valve 13 is closed, electronic expansion valve 15 is fully open, fourth control valve 14 is closed, fifth control valve 16 is closed, switching valve 70 is connected to the heat accumulator 51, the opening of the second branch outlet 63 of the distributor 60 is dynamically adjusted as described above, and the opening of the first branch outlet 62 is 1-α. The switching condition for stage A is that the load outlet temperature is equal to the temperature of the heat accumulator 51 or the heat accumulator 51 is saturated.

[0073] In this stage, the temperature difference is determined by comparing the load outlet temperature with the heat storage temperature, and the opening degree of α is dynamically adjusted. The heat storage temperature is also used to determine whether the heat storage tank 51 is saturated, and combined with the average circulating temperature, it is determined whether to switch to stage B.

[0074] Phase B: The average circulating temperature drops below the phase change temperature of the heat accumulator 51, and the heat accumulator 51 can no longer effectively store heat (or has become saturated). The system switches to the cold accumulator 52 to release heat and assist in cooling. Switching valve 70 switches to connect to the first cold storage channel. α is dynamically adjusted based on the temperature difference between the circulating liquid temperature and the cold storage temperature (initially at a preset maximum value). The fourth control valve 14 opens to an appropriate degree to enhance subcooling. This phase is further subdivided into sub-phases: Phase change heat transfer phase: the cold accumulator 52 is in the phase change temperature range, with high heat transfer efficiency and a large dynamic α; Sensible heat transfer phase: the cold accumulator 52 gradually melts, heat transfer efficiency decreases, and the dynamic α gradually decreases; Shutdown phase: the temperature difference approaches zero, α gradually decreases to zero, and finally the cold accumulator 52 branch is shut down. The valve status is as follows: first control valve 11 is closed, second control valve 12 is open, third control valve 13 is closed, electronic expansion valve 15 is adjusted within an appropriate range, fourth control valve 14 is adjusted within an appropriate range, fifth control valve 16 is closed, switching valve 70 is connected to cold storage accumulator 52, the opening of the second branch outlet 63 of the distributor 60 is dynamically adjusted, and the opening of the first branch outlet 62 is 1-α. The exit condition for stage B is that the load inlet temperature reaches the low-temperature target.

[0075] In this stage, the load outlet temperature is compared with the cold storage temperature to determine the temperature difference and the α opening is dynamically adjusted; the load inlet temperature is used to determine whether the low temperature target has been reached and to exit the refrigeration cycle; the heat storage temperature is used to confirm that the heat storage device 51 can no longer effectively store heat and to ensure accurate branch switching.

[0076] Mode 4: Second heating cycle (low temperature target -20℃ → standby temperature 25℃) (warming up) The second heating cycle is activated when a temperature rise command is received after the etching process is completed, with the target set temperature being the standby temperature. This process consists of two stages.

[0077] Stage C: At this stage, the circulating liquid temperature is -20℃, and the cold storage unit 52 is in a partially cold storage state (unsaturated, temperature slightly above -20℃). Utilizing the temperature difference between the circulating liquid and the cold storage unit 52, the circulating liquid releases cold energy into the cold storage unit 52, achieving residual cold recovery. Simultaneously, the cold storage unit 52 is replenished to saturation, eliminating the need to open additional refrigerant branches to supplement cold energy, further saving energy. The distributor 60 simultaneously opens the first branch outlet 62 and the second branch outlet 63, but not all flow enters the cold storage unit 52. The second branch outlet 63 selects the first cold storage channel via the switching valve 70, allowing part of the circulating liquid to flow through the cold storage unit 52 to release cold energy into the phase change material (i.e., the circulating liquid releases cold energy, achieving residual cold recovery); the first branch outlet 62 flows through the evaporator 30 (acting as condenser at this time), where the high-temperature gaseous refrigerant discharged from the compressor 10 releases heat for active heating. Initially, the temperature difference is large, and α is set to the preset maximum value. As the circulating liquid temperature rises, the temperature difference decreases, and α decreases linearly. When the cold storage in the cold accumulator 52 reaches saturation and the circulating liquid temperature rises to near the cold storage temperature, α approaches zero. The cold storage branch 52 is then closed, and all flow enters the evaporator 30, transitioning to stage D. The valve states are as follows: first control valve 11 is closed, second control valve 12 is closed, third control valve 13 is open (heating bypass), electronic expansion valve 15 is closed, fourth control valve 14 is closed, fifth control valve 16 is closed, switching valve 70 is connected to the cold storage in the cold accumulator 52, and the opening α of the second branch outlet 63 of the distributor 60 dynamically changes, while the opening of the first branch outlet 62 is 1-α. The switching condition for stage C is that the cold storage in the cold accumulator 52 reaches saturation and the load outlet temperature equals the cold storage temperature.

[0078] In this stage, the load outlet temperature and the cold storage temperature are compared to determine the temperature difference, and the opening degree of α is dynamically adjusted. The cold storage temperature is used to determine whether the cold storage unit 52 has reached saturation. Combined with the monitored load outlet temperature, it is determined whether to switch to stage D.

[0079] Stage D: When the load outlet temperature is the same as the temperature of the cold accumulator 52, the cold accumulator 52 can no longer effectively store cold, and the process switches to the heat accumulator 51 to release heat and assist in heating. Switching valve 70 switches to connect to the first heat storage channel, and α is dynamically adjusted according to the temperature difference. Simultaneously, compressor 10 and heater 4 assist in heating. The valve states are: first control valve 11 is closed, second control valve 12 is fully open, third control valve 13 is adjusted according to PID, electronic expansion valve 15 is closed, fourth control valve 14 is closed, fifth control valve 16 is closed, switching valve 70 connects to the heat accumulator 51, the second branch outlet 63 of the distributor 60 has an opening of α (dynamic), the first branch outlet 62 has an opening of 1-α, and heater 4 is adjusted according to PID. The exit condition for Stage D is that the load inlet temperature reaches the standby temperature.

[0080] In this stage, the load outlet temperature is compared with the heat storage temperature to determine the temperature difference and the α opening is dynamically adjusted; the load inlet temperature is used as the main control target temperature to determine whether the standby temperature has been reached and exit the recovery stage; the cold storage temperature is used to confirm that the cold storage unit 52 can no longer effectively store cold and to ensure accurate branch switching.

[0081] Mode 5: Cold Storage Mode -20℃ (Supplementing the energy storage of the cold storage unit 52) During the low-temperature steady-state period, the cold storage unit 52 only performs partial cold storage (not reaching saturation, reserving some cold storage space), without directly storing cold to saturation through refrigerant, thus reducing energy consumption in the refrigerant circuit. At this time, the fifth control valve 16 can be opened to supplement the cold storage unit 52 with the low-temperature refrigerant in the receiver 40. It is not necessary to keep the fifth control valve 16 fully open. The valve opening can be dynamically adjusted according to the cold storage progress of the cold storage unit 52 to supplement the part of the cold released during the refrigeration cycle. The valve status is as follows: the first control valve 11 is closed, the second control valve 12 is appropriately opened, the third control valve 13 is closed, the electronic expansion valve 15 is appropriately opened, the fourth control valve 14 is appropriately fixed, the fifth control valve 16 is dynamically adjusted as needed (not fully open), the switching valve 70 is connected to the cold storage unit 52, the second branch outlet 63 and the first branch outlet 62 of the distributor 60 are each half open, and the heater 4 is adjusted within a small range for antifreeze. The exit condition is when the cold storage accumulator 52 stores cold to a preset partial load (unsaturated) or receives a temperature rise command.

[0082] In this mode, the cold storage temperature is used to monitor the cold storage status of the cold storage unit 52 and determine whether the preset partial load has been reached, serving as the core basis for mode exit; the load inlet temperature is used to monitor the low-temperature steady-state temperature and assist in adjusting the opening degree of the heater 4 to prevent freezing and blockage.

[0083] During the low-temperature steady-state period, if the cold accumulator 52 is not yet saturated, the fifth control valve 16 can be opened to directly store cold in the cold accumulator 52 using the low-temperature refrigerant in the receiver 40, supplementing the cold energy released during the refrigeration cycle. The valve states are as follows: the first control valve 11 is closed, the second control valve 12 is appropriately open, the third control valve 13 is closed, the electronic expansion valve 15 is appropriately open, the fourth control valve 14 is appropriately fixed at its opening, the fifth control valve 16 is fully open, the switching valve 70 connects to the cold accumulator 52, the second branch outlet 63 and the first branch outlet 62 of the distributor 60 are each half-open, and the heater 4 is adjusted within a small range for antifreeze purposes. The shutdown condition is that the cold accumulator 52 is saturated or a heating command is received.

[0084] In this mode, the cold storage temperature is used to monitor the cold storage status of the cold storage unit 52 and determine whether it has reached saturation, serving as the core basis for mode exit. A temperature sensor is installed at the outlet of the second cold storage channel 522 to detect the temperature of the circulating liquid flowing out of the second cold storage channel 522. This circulating liquid temperature is used to monitor the refrigerant temperature at the outlet of the second cold storage channel to prevent refrigerant liquid slugging. The load inlet temperature is used to monitor the low-temperature steady-state temperature and assist in adjusting the opening of the heater 4 to prevent freezing blockage.

[0085] Mode 6: Regenerative / Energy Balance Mode (Stable Temperature) The goal of the regenerative / energy balance mode is high-precision temperature stabilization and smooth transition between modes. Valve states are as follows: first control valve 11 is closed; second control valve 12 is open within a small range; third control valve 13 and electronic expansion valve 15 are mutually exclusive; fourth control valve 14 is closed; fifth control valve 16 is closed; switching valve 70 switches as needed; the distributor 60 is dynamically adjusted (typically α is zero); and heater 4 is fine-tuned using PWM. The exit condition is receiving a new heating / cooling command.

[0086] In this mode, the load outlet temperature and load inlet temperature are used to calculate the average temperature of the cycle and assist in adjusting the temperature deviation ΔT; the heat storage temperature and cold storage temperature are used to determine whether the accumulator temperature can assist in temperature stabilization, and the switching valve 70 is switched as needed to achieve energy recovery and temperature stabilization in tandem.

[0087] The regenerative heating focuses on the recovery and utilization of waste heat and cold within the system, while the energy balance focuses on maintaining stable system temperature. The two work together to achieve the core function of the mode.

[0088] In some embodiments, when switching between the above modes, the valve opening changes linearly within a preset transition time, and the rate of change is equal to (final opening minus initial opening) divided by the transition time.

[0089] At the moment of switching, the valve opening is pre-adjusted according to the target set temperature change rate, with a pre-set advance amount. The collaborative logic of the two is as follows: the target set temperature change rate is used to determine the severity of the temperature change during mode switching, and the advance amount is a fixed proportion. The two work together to achieve a smooth transition during mode switching and avoid temperature overshoot. For example, when switching from regenerative to cooling, the target set temperature change rate is first calculated. If the change is drastic, feedforward compensation for the advance amount is triggered. Based on the normal PID output of the relevant valves in this switching scenario, the valve opening is pre-increased by a certain proportion to offset the temperature lag during cooling switching. If the change rate is gradual, feedforward compensation is not required.

[0090] The switching conditions and transition times between each mode are as follows: In the preparation mode, upon receiving a heating command and when ΔT is greater than the preset threshold, it switches to the first heating cycle; in the first heating cycle, it switches to the regeneration mode when the load inlet temperature reaches the high-temperature target; in the regeneration mode, upon receiving a cooling command, it switches to the first cooling stage A; in cooling stage A, it switches to cooling stage B; in cooling stage B, it switches to cold storage mode when the load inlet temperature reaches the low-temperature target; in cold storage mode, upon receiving a heating command, it switches to the second heating stage C; in heating stage C, it switches to heating stage D; in heating stage D, it switches to regeneration mode when the load inlet temperature reaches the standby temperature. All transition times are preset values.

[0091] Therefore, according to the semiconductor temperature control device 1000 and its temperature control method according to the embodiments of this application, the heating and cooling time is significantly shortened; the steady-state temperature control accuracy is significantly improved; the temperature fluctuation during mode switching is significantly reduced; and the system energy consumption is significantly reduced. The reason for the reduction in energy consumption is that: during the cooling stage, the residual heat of the circulating liquid is recovered from the high temperature to near the phase change temperature of the heat accumulator 51; during the warming stage, the residual cold of the circulating liquid is recovered from the low temperature to near the phase change temperature of the cold accumulator 52; at the same time, in the cold storage mode, the cold accumulator 52 only stores a portion of the cold, and the remaining cold is replenished by the recovery of the residual cold of the circulating liquid, reducing the power consumption of the refrigerant circuit; and by using the accumulator to assist in heating and cooling, the power consumption of the compressor 10 and the heater 4 is further reduced.

[0092] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A semiconductor temperature control device, characterized in that, include: A circulation system and a refrigeration system, wherein the refrigeration system includes a compressor, a condenser and an evaporator, and the circulation system includes a load and is connected to the evaporator for heat exchange; An energy storage component is connected to the circulation system. The energy storage component includes a cold storage unit and a heat storage unit. The cold storage unit has a first cold storage channel, and the heat storage unit has a first heat storage channel. A diverter, the inlet of which is connected to the outlet of the load, and the outlet of which is connected to the energy storage component and the evaporator respectively, so as to proportionally divert the circulating liquid of the circulation system to the evaporator and the energy storage component; A switching valve is connected to the distributor and the energy storage component respectively, and the outlet of the switching valve is connected to the first heat storage channel and the first cold storage channel respectively. The controller is connected to the circulation system, the refrigeration system, the energy storage component, the distributor and the switching valve respectively. The controller controls the flow splitting ratio of the distributor and the connection between the switching valve and the first heat storage channel or the first cold storage channel according to the circulating liquid temperature, the target set temperature, the heat storage temperature of the heat storage device and the cold storage temperature of the cold storage device.

2. The semiconductor temperature control device according to claim 1, characterized in that, The load outlet is equipped with a first temperature sensor, the load inlet is equipped with a second temperature sensor, the energy storage component is equipped with a heat storage temperature sensor for detecting the heat storage temperature of the heat storage unit and a cold storage temperature sensor for detecting the cold storage temperature of the cold storage unit; the controller is connected to the first temperature sensor, the second temperature sensor, the cold storage temperature sensor and the heat storage temperature sensor respectively.

3. The semiconductor temperature control device according to claim 1, characterized in that, The circulating fluid temperature includes the load outlet temperature, the load inlet temperature, and the average circulating temperature. The average circulating temperature is the average of the load inlet temperature and the load outlet temperature. The switching valve is controlled to connect with the first heat storage channel or the first cold storage channel based on the average circulating temperature, the target set temperature, and the load outlet temperature. The ratio of the distributor is adjusted based on the temperature difference between the cold storage temperature or the heat storage temperature and the load outlet temperature.

4. The semiconductor temperature control device according to claim 1, characterized in that, The energy storage component is an integrated bidirectional energy storage device. The shell of the integrated bidirectional energy storage device is provided with a hot-end phase change region, a thermal insulation layer and a cold-end phase change region in sequence. The hot-end phase change region is filled with hot-end phase change material to form the heat storage device, and the cold-end phase change region is filled with cold-end phase change material to form the cold storage device. The thermal insulation layer blocks heat conduction between the hot-end phase change region and the cold-end phase change region.

5. The semiconductor temperature control device according to claim 1, characterized in that, The cold accumulator has a second cold storage channel, and the heat accumulator has a second heat storage channel. The inlet of the second heat storage channel is connected to the outlet of the compressor, and the inlet of the second cold storage channel is connected to the outlet of the condenser. The outlets of both the second cold storage channel and the second heat storage channel are connected to the inlet of the compressor.

6. The semiconductor temperature control device according to claim 1, characterized in that, Both the diverter and the switching valve are three-way valves.

7. The semiconductor temperature control device according to claim 1, characterized in that, The refrigeration system also includes a bypass line, one end of which is connected to the outlet of the compressor, and the other end of which is connected to the inlet of the evaporator.

8. The semiconductor temperature control device according to claim 1, characterized in that, The refrigeration system also includes a liquid receiver, which has a liquid storage chamber and an external cooling pipe. The inlet and outlet of the liquid storage chamber are connected to the condenser and the evaporator, respectively. The two ends of the external cooling pipe are connected to the inlet of the condenser and the compressor, respectively.

9. The semiconductor temperature control device according to claim 1, characterized in that, The circulation system also includes a mixer, which is connected to the evaporator and the water tank of the circulation system respectively. The outlets of the first cold storage channel and the first heat storage channel are both connected to the mixer.

10. A semiconductor temperature control method, said temperature control method being applied to... The semiconductor temperature control device according to claim 1, characterized in that it comprises: The load inlet temperature, load outlet temperature, and target set temperature of the load are obtained, and the operating mode is determined based on the load inlet temperature, load outlet temperature, and target set temperature. Based on the operating mode, the magnitude of the load outlet temperature and the cold storage temperature or the heat storage temperature, the switching valve is controlled to connect with the first cold storage channel or the first heat storage channel, and the flow splitting ratio of the separator is adjusted according to the temperature difference between the load outlet temperature and the cold storage temperature or the heat storage temperature.

11. The temperature control method according to claim 10, characterized in that, The process of obtaining the load inlet temperature, load outlet temperature, and target set temperature of the load, and determining the working mode based on the load inlet temperature, load outlet temperature, and target set temperature includes: calculating the cycle average temperature based on the load inlet temperature and the load outlet temperature, and determining whether cooling or heating is required based on the temperature difference between the target set temperature and the cycle average temperature.

12. The temperature control method according to claim 11, characterized in that, Controlling the connection between the switching valve and the first cold storage channel or the first heat storage channel according to the operating mode, the load outlet temperature, and the magnitude of the cold storage temperature or the heat storage temperature includes: When the target set temperature is greater than the average temperature of the cycle and heating is required, and the load outlet temperature is lower than the cold storage temperature and the cold storage is not saturated, the switching valve connects the first cold storage channel to perform cold storage; when the load outlet temperature is higher than the cold storage temperature or the cold storage is saturated, and the load outlet temperature is lower than the heat storage temperature, the switching valve connects the first heat storage channel to perform heat absorption. When the target set temperature is lower than the average cycle temperature and cooling is required, and the load outlet temperature is higher than the heat storage temperature and the heat storage is not saturated, the switching valve connects the first heat storage channel to perform heat storage; when the load outlet temperature is lower than the heat storage temperature or the heat storage is saturated, and the load outlet temperature is higher than the cold storage temperature, the switching valve connects the first cold storage channel to perform cold absorption.

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