A quick-response temperature control method and device, electronic equipment and storage medium

Abstract

The application discloses a kind of fast response temperature control method, device, electronic equipment and storage medium.Method includes: obtaining current ambient temperature, and the system delay time recorded after heating controlled object, the two groups of heating power and temperature average value corresponding to the same preset identification temperature in the temperature rising process, temperature falling process of controlled object;Based on first-order heat balance differential equation, using the two groups of heating power and temperature average value corresponding to the same preset identification temperature, the system heat capacity and system thermal resistance of controlled object are calculated after eliminating temperature difference term;According to system heat capacity and system delay time, the proportional coefficient, integral coefficient and differential coefficient of PID controller are calculated, and closed-loop control quantity is output;According to system thermal resistance, target temperature and current ambient temperature, the steady-state feedforward power required to maintain target temperature is calculated;Closed-loop control quantity and steady-state feedforward power are superimposed as final output power, and closed-loop temperature control is executed on target temperature.

Description

Technical Field

[0001] This invention relates to the field of power electronic control technology, and in particular to a fast-response temperature control method, device, electronic equipment, and storage medium. Background Technology

[0002] Traditional temperature control methods mostly use proportional-integral-derivative (PID) to regulate temperature. However, the PID parameters of this method need to be tuned separately. Different target temperatures and different loads require retuning, resulting in low production efficiency. Summary of the Invention

[0003] This invention provides a fast-response temperature control method, device, electronic device, and storage medium to solve the problem of low production efficiency caused by the need to tune PID parameters in traditional temperature control methods.

[0004] According to one aspect of the present invention, a fast-response temperature control method is provided, comprising:

[0005] The system acquires the current ambient temperature, the system delay time recorded after heating the controlled object, and the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes of the controlled object.

[0006] Based on the first-order thermal balance differential equation, the system heat capacity and system thermal resistance of the controlled object are calculated by using the two sets of heating power and temperature average values ​​corresponding to the same preset identification temperature, after eliminating the temperature difference term.

[0007] Based on the system heat capacity and the system delay time, calculate the proportional coefficient, integral coefficient, and derivative coefficient of the PID controller, and output the closed-loop control quantity based on the proportional coefficient, the integral coefficient, and the derivative coefficient;

[0008] Calculate the steady-state feedforward power required to maintain the target temperature based on the system thermal resistance, the target temperature, and the current ambient temperature;

[0009] The closed-loop control quantity is superimposed with the steady-state feedforward power to obtain the final output power, which is used to perform closed-loop temperature control on the target temperature.

[0010] Optionally, the system delay time recorded after heating the controlled object, and the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes of the controlled object include:

[0011] Get the current temperature of the controlled object;

[0012] The controlled object is heated, and when the current temperature of the controlled object rises to the preset identification temperature difference, the system delay time is recorded.

[0013] Continue heating the controlled object until the current temperature of the controlled object passes the preset identification temperature, then stop heating. When the current temperature of the controlled object naturally drops and passes the preset identification temperature again, obtain the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes, respectively.

[0014] Optionally, the preset identification temperature difference is 0.3℃; the system delay time is the time interval from the start of heating to the temperature of the controlled object rising to the preset identification temperature difference.

[0015] Optionally, continuing to heat the controlled object specifically involves continuing to heat the controlled object to raise its current temperature by 2°C to 5°C.

[0016] Optionally, based on the first-order thermal equilibrium differential equation, using the average values ​​of two sets of heating power and temperature at the same preset identification temperature, after eliminating the temperature difference term, the system heat capacity and system thermal resistance of the controlled object are calculated, including:

[0017] Based on the first-order thermal equilibrium differential equation, thermal equilibrium equations are established for both heating and cooling states:

[0018] In the formula, For system heat capacity, To preset the heating power corresponding to the identified temperature during the heating process, To preset the average temperature at the identification temperature during the heating process, The current temperature of the controlled object. The current ambient temperature. For system thermal resistance;

[0019] In the formula, To preset the corresponding heating power at the identified temperature during the cooling process after heating stops, The average temperature at the preset identification temperature during the cooling process after heating stops;

[0020] Subtract the two equations to eliminate the temperature difference term. The system heat capacity is derived as follows:

[0021] ;

[0022] Substituting the calculated system heat capacity back into the heat balance equation, the system thermal resistance is derived:

[0023] ;

[0024] Substitute the cooling process The condition = 0 is simplified to obtain the final system heat capacity:

[0025] .

[0026] Optionally, based on the system heat capacity and the system delay time, the proportional coefficient, integral coefficient, and derivative coefficient of the PID controller are calculated, and the closed-loop control quantity is output based on the proportional coefficient, the integral coefficient, and the derivative coefficient, including:

[0027] The proportional, integral, and derivative coefficients of a PID controller are calculated using the following formulas:

[0028] In the formula, This is the proportionality coefficient. The integral coefficient is... These are the differential coefficients;

[0029] The PID controller uses a positional PID algorithm, and its closed-loop control quantity is calculated using the following formula:

[0030] In the formula, for The closed-loop control quantity output by the PID controller at any given time. for Temperature deviation value at any time The sampling period is for Temperature deviation value at any time From - The cumulative sum of temperature deviations from each sampling.

[0031] Optionally, calculating the steady-state feedforward power required to maintain the target temperature based on the system thermal resistance, the target temperature, and the current ambient temperature includes:

[0032] The steady-state feedforward power is calculated using the following formula:

[0033] In the formula, For steady-state feedforward power, The target temperature.

[0034] According to another aspect of the present invention, a fast-response temperature control device is provided, comprising:

[0035] The acquisition module is used to acquire the current ambient temperature, the system delay time recorded after heating the controlled object, and the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes of the controlled object.

[0036] The first calculation module is used to calculate the system heat capacity and system thermal resistance of the controlled object based on the first-order thermal balance differential equation, using two sets of heating power and temperature average values ​​corresponding to the same preset identification temperature, and after eliminating the temperature difference term.

[0037] The second calculation module is used to calculate the proportional coefficient, integral coefficient and derivative coefficient of the PID controller according to the system heat capacity and the system delay time, and output the closed-loop control quantity based on the proportional coefficient, the integral coefficient and the derivative coefficient.

[0038] The third calculation module is used to calculate the steady-state feedforward power required to maintain the target temperature based on the system thermal resistance, the target temperature and the current ambient temperature.

[0039] The control module is used to superimpose the closed-loop control quantity with the steady-state feedforward power as the final output power to perform closed-loop temperature control on the target temperature.

[0040] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0041] At least one processor; and

[0042] A memory communicatively connected to the at least one processor; wherein,

[0043] The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the fast-response temperature control method according to any embodiment of the present invention.

[0044] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the fast-response temperature control method according to any embodiment of the present invention.

[0045] The technical solution provided by this invention, in the process of acquiring the current ambient temperature and the system delay time recorded after heating the controlled object, and the two sets of heating power and temperature average values ​​corresponding to the same preset identification temperature during the heating and cooling processes of the controlled object, first heats the controlled object, and when the current temperature of the controlled object rises to a recognizable temperature rise of 0.3℃, records the system delay time, and then continues to heat the controlled object for 2~5℃, thereby identifying the two sets of heating power and temperature average values ​​corresponding to the same preset identification temperature during the heating and cooling processes of the controlled object. Furthermore, based on the first-order thermal balance differential equation, using the average values ​​of two sets of heating power and temperature at the same preset identification temperature, the system heat capacity and system thermal resistance of the controlled object are calculated after eliminating the temperature difference term. Based on the system heat capacity and system delay time, the proportional, integral, and derivative coefficients of the PID controller are calculated, and the closed-loop control quantity is output based on these coefficients. Based on the system thermal resistance, target temperature, and current ambient temperature, the steady-state feedforward power required to maintain the target temperature is calculated. The closed-loop control quantity and steady-state feedforward power are superimposed to obtain the final output power, which is used to perform closed-loop temperature control of the target temperature. The technical solution provided by this embodiment of the invention requires only one parameter identification process for the same controlled object. When switching to different target temperatures, the already identified system heat capacity, thermal resistance, and delay time are directly called to complete the PID parameter tuning and feedforward power calculation, eliminating the need for repeated identification. Even when changing the controlled object, only one parameter identification process is required. Therefore, the technical solution provided by this embodiment of the invention can effectively improve production efficiency. In addition, when the controlled object has been heated by other means, this method only needs to perform the parameter identification process once. First, the temperature is raised by 0.3℃, and then heated by 2~5℃ to identify the two sets of heating power and temperature average values ​​corresponding to the same preset identification temperature during the heating and cooling process of the controlled object, as well as subsequent steps. This can avoid identification errors caused by residual heat.

[0046] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 A flowchart of a rapid response temperature control method provided in an embodiment of the present invention;

[0049] Figure 2 A schematic diagram illustrating the principle of a rapid response temperature control method provided in an embodiment of the present invention;

[0050] Figure 3 This is a schematic diagram of a rapid response temperature control device provided in an embodiment of the present invention;

[0051] Figure 4 This is a schematic diagram of an electronic device for a fast-response temperature control method provided in an embodiment of the present invention. Detailed Implementation

[0052] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0053] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0054] Figure 1 The flowchart illustrates a rapid response temperature control method provided in this embodiment of the invention. This embodiment can be applied to a temperature control system that includes a heating unit and a temperature acquisition unit. The method can be executed by a rapid response temperature control device, which can be implemented in hardware and / or software. This device can be configured in any electronic device with communication functions. Figure 2 This is a schematic diagram illustrating the principle of a rapid response temperature control method provided in an embodiment of the present invention. See also... Figure 1 , Figure 2 The method includes:

[0055] S110. Obtain the current ambient temperature, the system delay time recorded after heating the controlled object, and the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes of the controlled object.

[0056] The current ambient temperature refers to the ambient temperature acquired by the temperature acquisition unit after the system is powered on, before the heating unit is activated, and when the controlled object and the external environment are in a thermal equilibrium steady state. The system delay time refers to the time interval recorded after the heating unit outputs heating power, starting from the moment the heating power takes effect, until the controlled object's real-time temperature reaches a preset identifiable temperature rise. The preset identifiable temperature can be pre-set according to requirements.

[0057] Specifically, the system acquires the current temperature of the controlled object; heats the controlled object until its current temperature rises to the preset identification temperature difference, and records the system delay time; continues to heat the controlled object until its current temperature passes the preset identification temperature, and stops heating; and waits for the current temperature of the controlled object to naturally drop and pass the preset identification temperature again, then acquires two sets of heating power and temperature averages corresponding to the same preset identification temperature during the heating and cooling processes, respectively.

[0058] The preset temperature difference can be set in advance according to requirements. For example, the embodiment of the present invention is shown with a preset temperature difference of 0.3℃.

[0059] For example, after the system is powered on, it first collects the current ambient temperature and the current temperature of the controlled object. Assuming the current temperature of the controlled object is 30℃, it then heats the controlled object. When the current temperature of the controlled object rises by 0.3℃ to 30.3℃, the system delay time is recorded. Then, it continues to heat the controlled object for another 2-5℃, assuming the current temperature of the controlled object is 34.3℃ at this point. Since the preset identification temperature is 33℃, heating stops when the current temperature of the controlled object exceeds 33℃. After heating stops, the controlled object begins to cool naturally. When the current temperature of the controlled object naturally drops back and exceeds 33℃ again, two sets of heating power and temperature averages corresponding to 33℃ during the heating and cooling processes are obtained. The temperature average refers to the average of the temperatures exceeding 33℃ during the heating and cooling processes, not a single temperature.

[0060] S120. Based on the first-order thermal balance differential equation, the system heat capacity and system thermal resistance of the controlled object are calculated by using the average values ​​of two sets of heating power and temperature at the same preset identification temperature, after eliminating the temperature difference term.

[0061] Specifically, based on the first-order thermal equilibrium differential equation, thermal equilibrium equations are established for both heating and cooling states:

[0062] In the formula, For system heat capacity, To preset the heating power corresponding to the identified temperature during the heating process, To preset the average temperature at the identification temperature during the heating process, The current temperature of the controlled object. The current ambient temperature. For system thermal resistance;

[0063] In the formula, To preset the corresponding heating power at the identified temperature during the cooling process after heating stops, The average temperature at the preset identification temperature during the cooling process after heating stops;

[0064] Subtract the two equations to eliminate the temperature difference term. The system heat capacity is derived as follows:

[0065] ;

[0066] Substituting the calculated system heat capacity back into the heat balance equation, the system thermal resistance is derived:

[0067] ;

[0068] Substitute the cooling process The condition = 0 is simplified to obtain the final system heat capacity:

[0069] .

[0070] The first-order thermal equilibrium differential equation is: ;

[0071] Subtract the two equations to eliminate the temperature difference term The formula is obtained. The system heat capacity can be derived from this formula. .

[0072] Substitute the calculated system heat capacity back into the heat balance equation. In the middle, we obtained

[0073] ;

[0074] Further, we can conclude that:

[0075] ;

[0076] Summarized as follows:

[0077] ;

[0078] The system thermal resistance is derived from the above. ;

[0079] After heating is stopped, =0, so Substituting =0 into the formula ,get:

[0080] ;

[0081] Furthermore, simplification yields the final system heat capacity:

[0082] .

[0083] S130. Calculate the proportional, integral, and derivative coefficients of the PID controller based on the system heat capacity and system delay time, and output the closed-loop control quantity based on the proportional, integral, and derivative coefficients.

[0084] Specifically, the proportional coefficient, integral coefficient, and derivative coefficient of the PID controller are calculated using the following formulas:

[0085] In the formula, This is the proportionality coefficient. The integral coefficient is... These are the differential coefficients;

[0086] The PID controller uses a positional PID algorithm, and its closed-loop control quantity is calculated using the following formula:

[0087] In the formula, for The closed-loop control quantity output by the PID controller at any given time. for Temperature deviation value at any time The sampling period is for Temperature deviation value at any time From - The cumulative sum of temperature deviations from each sampling.

[0088] S140. Calculate the steady-state feedforward power required to maintain the target temperature based on the system thermal resistance, target temperature and current ambient temperature.

[0089] The target temperature can be preset as needed.

[0090] Specifically, the steady-state feedforward power is calculated using the following formula:

[0091] In the formula, For steady-state feedforward power, The target temperature.

[0092] S150: The closed-loop control quantity is superimposed with the steady-state feedforward power to obtain the final output power, and closed-loop temperature control is performed on the target temperature.

[0093] The technical solution provided by this invention, in the process of acquiring the current ambient temperature and the system delay time recorded after heating the controlled object, and the two sets of heating power and temperature average values ​​corresponding to the same preset identification temperature during the heating and cooling processes of the controlled object, first heats the controlled object, and when the current temperature of the controlled object rises to a recognizable temperature rise of 0.3℃, records the system delay time, and then continues to heat the controlled object for 2~5℃, thereby identifying the two sets of heating power and temperature average values ​​corresponding to the same preset identification temperature during the heating and cooling processes of the controlled object. Furthermore, based on the first-order thermal balance differential equation, using the average values ​​of two sets of heating power and temperature at the same preset identification temperature, the system heat capacity and system thermal resistance of the controlled object are calculated after eliminating the temperature difference term. Based on the system heat capacity and system delay time, the proportional, integral, and derivative coefficients of the PID controller are calculated, and the closed-loop control quantity is output based on these coefficients. Based on the system thermal resistance, target temperature, and current ambient temperature, the steady-state feedforward power required to maintain the target temperature is calculated. The closed-loop control quantity and steady-state feedforward power are superimposed to obtain the final output power, which is used to perform closed-loop temperature control of the target temperature. The technical solution provided by this embodiment of the invention requires only one parameter identification process for the same controlled object. When switching to different target temperatures, the already identified system heat capacity, thermal resistance, and delay time are directly called to complete the PID parameter tuning and feedforward power calculation, eliminating the need for repeated identification. Even when changing the controlled object, only one parameter identification process is required. Therefore, the technical solution provided by this embodiment of the invention can effectively improve production efficiency. In addition, when the controlled object has been heated by other means, this method only needs to perform the parameter identification process once. First, the temperature is raised by 0.3℃, and then heated by 2~5℃ to identify the two sets of heating power and temperature average values ​​corresponding to the same preset identification temperature during the heating and cooling process of the controlled object, as well as subsequent steps. This can avoid identification errors caused by residual heat.

[0094] Optionally, the preset temperature difference is 0.3℃; the system delay time is the time interval from the start of heating to the temperature of the controlled object rising to the preset temperature difference.

[0095] Optionally, continuing to heat the controlled object specifically involves continuing to heat the controlled object to raise its current temperature by 2°C to 5°C.

[0096] Figure 3 This is a schematic diagram of a fast-response temperature control device provided in an embodiment of the present invention. See also: Figure 3The device includes an acquisition module 210, a first calculation module 220, a second calculation module 230, a third calculation module 240, and a control module 250.

[0097] The acquisition module 210 is used to acquire the current ambient temperature, the system delay time recorded after heating the controlled object, and the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes of the controlled object.

[0098] The first calculation module 220 is used to calculate the system heat capacity and system thermal resistance of the controlled object based on the first-order thermal balance differential equation, using the average values ​​of two sets of heating power and temperature at the same preset identification temperature, and after eliminating the temperature difference term.

[0099] The second calculation module 230 is used to calculate the proportional coefficient, integral coefficient, and derivative coefficient of the PID controller based on the system heat capacity and system delay time, and output the closed-loop control quantity based on the proportional coefficient, integral coefficient, and derivative coefficient.

[0100] The third calculation module 240 is used to calculate the steady-state feedforward power required to maintain the target temperature based on the system thermal resistance, the target temperature and the current ambient temperature.

[0101] The control module 250 is used to superimpose the closed-loop control quantity with the steady-state feedforward power as the final output power to perform closed-loop temperature control on the target temperature.

[0102] The rapid response temperature control device provided in this embodiment of the invention can execute a rapid response temperature control method provided in any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the method.

[0103] Figure 4 This is a schematic diagram of an electronic device for a rapid response temperature control method provided in an embodiment of the present invention. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0104] like Figure 4As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 and a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded into the RAM 13 from storage unit 18. The RAM 13 can also store various programs and data required for the operation of the electronic device 10. The processor 11, the ROM 12, and the RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0105] Multiple components in electronic device 10 are connected to input / output I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of monitors, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0106] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as a fast-response temperature control method.

[0107] In some embodiments, a fast-response temperature control method may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or mounted on electronic device 10 via read-only memory ROM 12 and / or communication unit 19. When the computer program is loaded into random access memory RAM 13 and executed by processor 11, one or more steps of the fast-response temperature control method described above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform a fast-response temperature control method by any other suitable means.

[0108] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transferring data and instructions to the storage system, the at least one input device, and the at least one output device.

[0109] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0110] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0111] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device for displaying information to a user; and a keyboard and pointing device through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with a user; for example, feedback provided to the user can be any form of sensory feedback; and input from the user can be received in any form.

[0112] The systems and technologies described herein can be implemented in computing systems that include backend components, middleware components, or frontend components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium. Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0113] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through a communication network. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0114] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0115] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A rapid-response temperature control method, characterized in that, include: The system acquires the current ambient temperature, the system delay time recorded after heating the controlled object, and the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes of the controlled object. Based on the first-order thermal balance differential equation, the system heat capacity and system thermal resistance of the controlled object are calculated by using the average values ​​of two sets of heating power and temperature corresponding to the same preset identification temperature, after eliminating the temperature difference term. Based on the system heat capacity and the system delay time, calculate the proportional coefficient, integral coefficient, and derivative coefficient of the PID controller, and output the closed-loop control quantity based on the proportional coefficient, the integral coefficient, and the derivative coefficient; Calculate the steady-state feedforward power required to maintain the target temperature based on the system thermal resistance, the target temperature, and the current ambient temperature; The closed-loop control quantity is superimposed with the steady-state feedforward power to obtain the final output power, which is used to perform closed-loop temperature control on the target temperature.

2. The method according to claim 1, characterized in that, The system delay time recorded after heating the controlled object, and the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes of the controlled object include: Get the current temperature of the controlled object; The controlled object is heated, and when the current temperature of the controlled object rises to the preset identification temperature difference, the system delay time is recorded. Continue heating the controlled object until the current temperature of the controlled object passes the preset identification temperature, then stop heating. When the current temperature of the controlled object naturally drops and passes the preset identification temperature again, obtain the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes, respectively.

3. The method according to claim 2, characterized in that, The preset temperature difference is 0.3℃; the system delay time is the time interval from the start of heating to the temperature of the controlled object rising to the preset temperature difference.

4. The method according to claim 2, characterized in that, Continuing to heat the controlled object specifically means: continuing to heat the controlled object to raise its current temperature by 2℃~5℃.

5. The method according to claim 1, characterized in that, Based on the first-order thermal equilibrium differential equation, using the average values ​​of two sets of heating power and temperature at the same preset identification temperature, and after eliminating the temperature difference term, the system heat capacity and system thermal resistance of the controlled object are calculated, including: Based on the first-order thermal equilibrium differential equation, thermal equilibrium equations are established for both heating and cooling states: In the formula, For system heat capacity, To preset the heating power corresponding to the identified temperature during the heating process, To preset the average temperature at the identification temperature during the heating process, The current temperature of the controlled object. The current ambient temperature. For system thermal resistance; In the formula, To preset the corresponding heating power at the identified temperature during the cooling process after heating stops, The average temperature at the preset identification temperature during the cooling process after heating stops; Subtract the two equations to eliminate the temperature difference term. The system heat capacity is derived as follows: ； Substituting the calculated system heat capacity back into the heat balance equation, the system thermal resistance is derived: ； Substitute the cooling process The condition = 0 is simplified to obtain the final system heat capacity: 。 6. The method according to claim 1, characterized in that, Based on the system heat capacity and the system delay time, the proportional coefficient, integral coefficient, and derivative coefficient of the PID controller are calculated, and the closed-loop control quantity is output based on the proportional coefficient, the integral coefficient, and the derivative coefficient, including: The proportional, integral, and derivative coefficients of a PID controller are calculated using the following formulas: In the formula, This is the proportionality coefficient. The integral coefficient is... These are the differential coefficients; The PID controller uses a positional PID algorithm, and its closed-loop control quantity is calculated using the following formula: In the formula, for The closed-loop control quantity output by the PID controller at any given time. for Temperature deviation value at any time The sampling period is for Temperature deviation value at any time From - The cumulative sum of temperature deviations from each sampling.

7. The method according to claim 1, characterized in that, Based on the system thermal resistance, the target temperature, and the current ambient temperature, the steady-state feedforward power required to maintain the target temperature is calculated as follows: The steady-state feedforward power is calculated using the following formula: In the formula, For steady-state feedforward power, The target temperature.

8. A rapid-response temperature control device, characterized in that, include: The acquisition module is used to acquire the current ambient temperature, the system delay time recorded after heating the controlled object, and the average values ​​of two sets of heating power and temperature at the same preset identification temperature during the heating and cooling processes of the controlled object. The first calculation module is used to calculate the system heat capacity and system thermal resistance of the controlled object based on the first-order thermal balance differential equation, using two sets of heating power and temperature average values ​​corresponding to the same preset identification temperature, and after eliminating the temperature difference term. The second calculation module is used to calculate the proportional coefficient, integral coefficient and derivative coefficient of the PID controller according to the system heat capacity and the system delay time, and output the closed-loop control quantity based on the proportional coefficient, the integral coefficient and the derivative coefficient. The third calculation module is used to calculate the steady-state feedforward power required to maintain the target temperature based on the system thermal resistance, the target temperature and the current ambient temperature. The control module is used to superimpose the closed-loop control quantity with the steady-state feedforward power as the final output power to perform closed-loop temperature control on the target temperature.

9. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the fast-response temperature control method according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that cause a processor to execute the fast-response temperature control method according to any one of claims 1-7.

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