Temperature control module and temperature control method

Abstract

The temperature control module comprises a network communication unit for data interaction with an external industrial network, a multi-channel temperature acquisition unit for acquiring a temperature feedback signal of an external heating element, the external heating element being a heating resistance wire in a heating garment, a processing chip unit electrically connected with the network communication unit and the multi-channel temperature acquisition unit, the processing chip unit being configured to execute a proportional-integral-derivative control algorithm according to the temperature feedback signal and generate a control output signal for controlling the external heating element, and a power supply unit for supplying power to the network communication unit, the multi-channel temperature acquisition unit and the processing chip. The temperature control module integrates the network communication unit, the multi-channel temperature acquisition unit, the processing chip unit and the power supply unit, thereby reducing the number of independent modules and saving the space and cost of the temperature control system.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a temperature control module and a temperature control method. Background Technology

[0002] Semiconductor equipment is equipped with numerous gas and vacuum pipelines to transport the various gases required for the process and maintain the vacuum environment of the process chamber. To ensure the stability and repeatability of the process, each section of these gas and vacuum pipelines must be maintained within a set temperature range. Therefore, heating garments are needed to cover the pipelines for heating and temperature control. Heating garments typically consist of heating resistance wires and temperature sensors. The heating resistance wires provide heat input, and the temperature sensors detect the current temperature value. The control system acquires the temperature feedback signal output from the temperature sensor in real time and executes a temperature control algorithm based on the temperature feedback signal to adjust the heating power of the heating resistance wires, thereby achieving closed-loop control of the pipeline temperature.

[0003] As the scale of gas pipelines and vacuum pipelines in semiconductor equipment continues to expand, the number of pipeline sections requiring temperature control continues to increase. Correspondingly, the number of temperature acquisition channels and control loops required also increases, which places higher demands on the integration, communication capabilities, and modularity of temperature control systems.

[0004] Currently, there is still room for improvement in the space and cost of temperature control systems. Summary of the Invention

[0005] The problem solved by the embodiments of the present invention is to provide a temperature control module and method for controlling the temperature of heated clothing in semiconductor devices, which saves space and cost of the temperature control system.

[0006] To address the aforementioned problems, this invention provides a temperature control module for controlling the temperature of heated clothing in a semiconductor device, comprising: a network communication unit for data interaction with an external industrial network; a multi-channel temperature acquisition unit for acquiring temperature feedback signals from an external heating element, wherein the external heating element is a heating resistance wire in the heated clothing; a processing chip unit electrically connected to the network communication unit and the multi-channel temperature acquisition unit, the processing chip unit being configured to execute a proportional-integral-derivative control algorithm based on the temperature feedback signals and generate a control output signal for controlling the external heating element; and a power supply unit for supplying power to the network communication unit, the multi-channel temperature acquisition unit, and the processing chip.

[0007] Optionally, the multi-channel temperature acquisition unit is a multi-channel thermocouple temperature acquisition unit, and the temperature feedback signal is acquired via thermocouples.

[0008] Optionally, the multi-channel temperature acquisition unit is equipped with a first multi-core connector and a second multi-core connector, which are used to provide access interfaces for temperature feedback signals.

[0009] Optionally, the power supply unit includes a 24-volt DC power interface for connecting to an external 24-volt DC power source.

[0010] Optionally, the power supply unit may also include an isolation circuit connected in series on the power supply path between the DC 24V power interface and the multi-channel temperature acquisition unit.

[0011] Optionally, the network communication unit is an industrial Ethernet communication unit, which includes a network input interface and a network output interface. The network input interface is used to receive input data from an external industrial network, and the network output interface is used to send output data to an external industrial network.

[0012] Optionally, the temperature control module also includes a status display unit, which includes a running indicator light and a communication indicator light. The running indicator light is used to indicate the operating status of the temperature control module, and the communication indicator light is used to indicate the communication status of the network communication unit.

[0013] Optionally, the processing chip unit includes a parameter tuning subunit and a control subunit. The parameter tuning subunit is used to tune the parameters of the proportional-integral-derivative (PID) control algorithm according to the temperature feedback signal, and the control subunit is used to execute the PID control algorithm according to the temperature feedback signal and generate a control output signal.

[0014] Optionally, the control output signal is a pulse width modulation signal, which is used to adjust the heating power of the external heating element.

[0015] Optionally, the parameter tuning subunit receives the self-tuning command via the network communication unit, and the control subunit receives the start command via the network communication unit.

[0016] Accordingly, the present invention also provides a temperature control method for the temperature control module provided by the present invention, comprising: supplying power to a network communication unit, a multi-channel temperature acquisition unit, and a processing chip unit through a power supply unit; receiving input data from an external industrial network through the network communication unit; acquiring temperature feedback signals from an external heating element through the multi-channel temperature acquisition unit; transmitting the temperature feedback signals to the processing chip unit; the processing chip unit executing a proportional-integral-derivative control algorithm based on the temperature feedback signals to generate a control output signal to control the external heating element; and sending the control output signal to the external industrial network through the network communication unit.

[0017] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages: The temperature control module provided in this invention integrates a network communication unit, a multi-channel temperature acquisition unit, a processing chip unit, and a power supply unit into one unit. The multi-channel temperature acquisition unit directly acquires the temperature feedback signal from the external heating element, and the processing chip unit executes a proportional-integral-derivative (PID) control algorithm based on the temperature feedback signal to generate a control output signal for controlling the external heating element. Thus, a complete closed loop of temperature acquisition, control calculation, and external communication is achieved within a single module. Compared with the existing scheme where the temperature acquisition module and the PID control module are set up separately, the temperature control module of this invention integrates the network communication unit, the multi-channel temperature acquisition unit, the processing chip unit, and the power supply unit into one unit, reducing the number of independent modules and saving space and cost of the temperature control system. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the unit structure of a temperature control module for controlling the temperature of heated clothing in a semiconductor device according to an embodiment of the present invention. Figure 2 This is a flowchart of the steps corresponding to one embodiment of the temperature control method of the present invention. Detailed Implementation

[0019] Currently, there is still room for improvement in the space and cost of temperature control systems.

[0020] Specifically, there are currently three main forms of temperature control: The first form uses a combination of an independent proportional-integral-derivative (PID) control algorithm module and an independent thermocouple temperature acquisition module. The PID control algorithm module is responsible for control calculations, while the thermocouple temperature acquisition module is responsible for acquiring the temperature signal of the heated clothing. The two interact with each other via external cables or buses. This solution has a certain degree of modularity and versatility. The second form uses an integrated circuit board to integrate the PID control function and the temperature acquisition function onto a single circuit board. This solution has a high degree of integration. The third form uses a one-to-one control method, that is, each heated clothing is configured with an independent control module. The control modules communicate with the host computer via a bus, and each control module needs to be configured with an independent hardware address.

[0021] In the aforementioned existing technologies, as the number of temperature-controlled piping sections in semiconductor equipment continues to increase, the number of heating garments required also increases, and each of the three approaches reveals its own technical problems. For the first approach, the separate setup of the proportional-integral-derivative (PID) control algorithm module and the thermocouple temperature acquisition module results in a large overall system size, occupying a significant amount of space. Furthermore, the number of modules increases proportionally with the number of heating garments, further exacerbating space constraints and cost issues. For the second approach, although single-board integration is achieved, the integrated circuit board requires customized development for different devices, resulting in poor versatility and the need for specially planned anti-interference areas to ensure accurate temperature acquisition. For the third approach, each heating garment is equipped with an independent control module and requires a separate hardware address, leading to a large number of modules within the system. Each module requires separate communication code, making centralized adjustment and management of PID control algorithm parameters inconvenient. Therefore, in applications with a large number of heating garments, the size and cost of the temperature control system are difficult to control effectively.

[0022] To address the technical problem, this invention provides a temperature control module for controlling the temperature of heated clothing in a semiconductor device, comprising: a network communication unit for data interaction with an external industrial network; a multi-channel temperature acquisition unit for acquiring temperature feedback signals from an external heating element, wherein the external heating element is a heating resistance wire in the heated clothing; a processing chip unit electrically connected to the network communication unit and the multi-channel temperature acquisition unit, the processing chip unit being configured to execute a proportional-integral-derivative control algorithm based on the temperature feedback signals and generate a control output signal for controlling the external heating element; and a power supply unit for supplying power to the network communication unit, the multi-channel temperature acquisition unit, and the processing chip.

[0023] The temperature control module provided in this invention integrates a network communication unit, a multi-channel temperature acquisition unit, a processing chip unit, and a power supply unit into one unit. The multi-channel temperature acquisition unit directly acquires the temperature feedback signal from the external heating element, and the processing chip unit executes a proportional-integral-derivative (PID) control algorithm based on the temperature feedback signal to generate a control output signal for controlling the external heating element. Thus, a complete closed loop of temperature acquisition, control calculation, and external communication is realized within a single module. Compared with the existing scheme where the temperature acquisition module and the PID control module are set up separately, the temperature control module of this invention reduces the number of independent modules, saving system space and cost.

[0024] To make the above-mentioned objects, features and advantages of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0025] in, Figure 1This is a schematic diagram of the unit structure of a temperature control module for controlling the temperature of heated clothing in a semiconductor device according to an embodiment of the present invention.

[0026] The temperature control module for controlling the temperature of heated clothing in semiconductor equipment includes: a network communication unit 106 for data interaction with an external industrial network; a multi-channel temperature acquisition unit 101 for acquiring temperature feedback signals from an external heating element, which is a heating resistance wire in the heated clothing; a processing chip unit 102 electrically connected to the network communication unit 106 and the multi-channel temperature acquisition unit 101, configured to execute a proportional-integral-derivative control algorithm based on the temperature feedback signals and generate a control output signal for controlling the external heating element; and a power supply unit 100 for supplying power to the network communication unit 106, the multi-channel temperature acquisition unit 101, and the processing chip.

[0027] Specifically, the network communication unit 106, the multi-channel temperature acquisition unit 101, the processing chip unit 102, and the power supply unit 100 are integrated into one unit. The multi-channel temperature acquisition unit 101 directly acquires the temperature feedback signal of the external heating element, and the processing chip unit 102 executes the proportional-integral-derivative (PID) control algorithm based on the temperature feedback signal to generate a control output signal for controlling the external heating element. Thus, a complete closed loop of temperature acquisition, control calculation, and external communication is realized in a single module. Compared with the existing scheme where the temperature acquisition module and the PID control module are set up separately, the temperature control module of this invention reduces the number of independent modules, saving system space and cost.

[0028] In this embodiment, the temperature control module is used for temperature control of the heating garment in the semiconductor device, and the external heating element is the heating resistance wire in the heating garment.

[0029] Specifically, the gas lines and vacuum lines of semiconductor equipment are covered with a large number of heating garments. Each heating garment contains a heating resistance wire and a thermocouple for detecting the temperature of the heating resistance wire. By using the temperature control module provided by this invention in conjunction with the heating garment, a single temperature control module can simultaneously achieve closed-loop temperature control of multiple heating garments. This avoids the need to configure a temperature acquisition module and a proportional-integral-derivative control module for each heating garment. In application environments where the internal space of semiconductor equipment is limited, the compact and integrated temperature control module can significantly reduce the installation volume and wiring complexity, while reducing the overall cost of the equipment.

[0030] It should be noted that the network communication unit 106 is used to realize data interaction between the temperature control module and the external industrial network. In the industrial control environment of semiconductor equipment, the external industrial network is usually an industrial Ethernet. The host computer sends commands to the temperature control module and receives the operating data reported by the temperature control module through the industrial Ethernet.

[0031] It should also be noted that the network communication unit 106 serves as the sole communication channel for the temperature control module. All instruction data from the host computer is received through this network communication unit 106 and then transmitted to the processing chip unit 102. All reported data from the processing chip unit 102 is sent to the external industrial network through this network communication unit 106. This centralized network communication architecture means that the temperature control module only needs one network interface to receive all control instructions and output all control output signals. The external industrial network does not need to establish a separate communication link for each external heating element, simplifying the network topology.

[0032] In this embodiment, the network communication unit 106 is an industrial Ethernet communication unit. The industrial Ethernet communication unit includes a network input interface and a network output interface. The network input interface is used to receive input data from an external industrial network, and the network output interface is used to send output data to an external industrial network.

[0033] The separate design of the network input interface and the network output interface allows the temperature control module to be connected in a linear topology to the industrial Ethernet network. It receives data from upstream devices and forwards the data to downstream devices through the network output interface, reducing the number of switch ports occupied and improving the flexibility of device networking. At the same time, the industrial Ethernet communication unit has real-time and reliable data transmission characteristics, ensuring the real-time response of the temperature control module to temperature feedback signals and the rapid output of control output signals, thereby improving the performance of the temperature control module.

[0034] It should be noted that the multi-channel temperature acquisition unit 101 is used to directly acquire the temperature feedback signal of the external heating element.

[0035] It should also be noted that external heating elements refer to heating components outside the temperature control module that work in conjunction with it, such as the heating resistance wire in the heated clothing mentioned above. In the heated clothing temperature control scenario, each external heating element is attached to or adjacent to a temperature sensor. This temperature sensor detects the actual temperature of the external heating element and generates a temperature feedback signal. The temperature feedback signal is input into the temperature control module via the multi-channel temperature acquisition unit 101. The multi-channel temperature acquisition unit 101 digitizes the received multi-channel temperature feedback signals and transmits them to the processing chip unit 102 for execution of the subsequent proportional-integral-derivative control algorithm.

[0036] In this embodiment, the multi-channel temperature acquisition unit 101 is a multi-channel thermocouple temperature acquisition unit, and the temperature feedback signal is acquired via thermocouples.

[0037] Specifically, the thermocouple, as a temperature sensor, converts the temperature of the external heating element into a voltage signal, i.e., a temperature feedback signal. The multi-channel thermocouple temperature acquisition unit includes a compensation circuit and an analog-to-digital conversion circuit to acquire the voltage signals input from multiple thermocouples.

[0038] Using thermocouples as temperature sensors is suitable for the actual operating temperature range of heating clothing in semiconductor equipment, ensuring the accuracy of temperature feedback signals.

[0039] In this embodiment, the multi-channel temperature acquisition unit 101 is equipped with a first multi-core connector and a second multi-core connector, which are used to provide access interfaces for temperature feedback signals.

[0040] Specifically, the multi-core connector is a connector containing multiple conductive terminals, and the signal lines of multiple thermocouples can be connected to the multi-channel temperature acquisition unit 101 through two multi-core connectors respectively.

[0041] It should be noted that by using a first multi-core connector and a second multi-core connector instead of a single multi-core connector, more temperature acquisition channels can be provided within the limited space of the temperature control module. Multiple thermocouples are divided into two groups and connected by the first multi-core connector and the second multi-core connector respectively, which reduces the pin density requirement of a single multi-core connector and improves connection reliability. At the same time, in the actual working environment of semiconductor equipment, the heating garment may be distributed in different areas of the equipment. The two multi-core connectors can be laid out in different areas, making the cable routing more flexible.

[0042] It should also be noted that the pluggable structure of the first and second multi-core connectors makes the connection and disconnection between the thermocouple and the temperature control module simple and quick, facilitating the replacement and maintenance of the heated clothing.

[0043] As an example, the multi-channel thermocouple temperature acquisition unit is configured with 24 temperature acquisition channels.

[0044] Specifically, 24 temperature acquisition channels mean that a single temperature control module can simultaneously connect to 24 thermocouples, corresponding to the acquisition of temperature feedback signals from 24 external heating elements. In semiconductor equipment, each gas pipeline and vacuum pipeline requires independent heating pads for temperature control. A process chamber may involve heating pads for more than ten or even dozens of pipelines. By increasing the number of temperature acquisition channels in a single temperature control module to 24, one temperature control module can cover more heating pads, thereby reducing the total number of temperature control modules required in the same scale of application scenarios, further saving system space and hardware costs.

[0045] As an example, the 24 temperature acquisition channels correspond to the aforementioned first multi-core connector and second multi-core connector. Taking each multi-core connector as carrying 12 temperature acquisition channels as an example, the first multi-core connector and the second multi-core connector symmetrically share the access task of the 24 channels, so that the number of pins of each connector is moderate, and the connection density and connection reliability are also taken into account.

[0046] Specifically, the processing chip unit 102 is the computing component of the temperature control module, and is electrically connected to the network communication unit 106 and the multi-channel temperature acquisition unit 101, respectively. The processing chip unit 102 receives multiple temperature feedback signals from the multi-channel temperature acquisition unit 101, and executes a proportional-integral-derivative control algorithm according to each temperature feedback signal to generate a corresponding control output signal for each external heating element.

[0047] It should be noted that the control output signal is directly used to control the heating power of the external heating element after being output from the processing chip unit 102, thus forming a complete closed-loop control link from temperature acquisition to heating power control.

[0048] In this embodiment, the processing chip unit 102 includes a parameter tuning subunit and a control subunit. The parameter tuning subunit is used to tune the parameters of the proportional-integral-derivative (PID) control algorithm according to the temperature feedback signal, and the control subunit is used to execute the PID control algorithm according to the temperature feedback signal and generate a control output signal.

[0049] Specifically, the processing chip unit 102 includes a parameter tuning subunit and a control subunit. These two subunits work collaboratively: the control subunit is responsible for continuous proportional-integral-derivative (PID) control calculations during operation, while the parameter tuning subunit dynamically adjusts the parameters of the PID control algorithm based on the actual temperature feedback signal. When the load characteristics of the external heating element of the heated clothing change—for example, due to clothing replacement, pipeline structure changes, or changes in ambient temperature conditions—the parameter tuning subunit can readjust the proportional, integral, and derivative coefficients based on the response characteristics of the temperature feedback signal, ensuring that the PID control algorithm maintains the expected temperature control accuracy under changed operating conditions. This architecture, integrating the parameter tuning subunit and the control subunit within the same processing chip unit 102, allows the temperature control module to automatically complete the tuning of the PID parameters during operation, eliminating the need for operators to manually and repeatedly set the parameters on external debugging equipment. This significantly improves the operability of the temperature control module and its adaptability to different application scenarios.

[0050] In this embodiment, the parameter tuning subunit receives the self-tuning instruction via the network communication unit 106, and the control subunit receives the start instruction via the network communication unit 106.

[0051] It should be noted that the self-tuning command is a command issued by the host computer through an external industrial network to trigger the parameter tuning process. After receiving the self-tuning command, the parameter tuning subunit starts the parameter tuning process and calculates and sets the parameters of the proportional-integral-derivative control algorithm based on the current temperature feedback signal.

[0052] It should also be noted that the start command is a command issued by the host computer to trigger the control subunit to begin executing proportional-integral-derivative (PID) control calculations. After receiving the start command, the control subunit initiates PID control on the specified temperature acquisition channel. The self-tuning command and the start command are distributed to the parameter tuning subunit and the control subunit respectively via the same network communication unit 106, enabling the host computer to independently trigger the parameter tuning process or initiate the PID control process via industrial Ethernet, with the two processes not interfering with each other.

[0053] In this embodiment, the control output signal is a pulse width modulation signal, which is used to adjust the heating power of the external heating element.

[0054] Specifically, the pulse width modulation signal (PWM signal) adjusts the average power output to the external heating element by changing the proportion of high-level time (i.e., duty cycle) within one cycle of the signal. The higher the duty cycle, the higher the average heating power received by the external heating element. The control subunit adjusts the duty cycle of the pulse width modulation signal in real time according to the calculation results of the proportional-integral-derivative control algorithm, so that the actual temperature of the external heating element converges to the set temperature.

[0055] It should be noted that using pulse width modulation signals as control output signals results in high control precision and fast response speed. Furthermore, it is directly compatible with the driving circuits commonly used in heating clothing in semiconductor equipment, eliminating the need for additional digital-to-analog conversion or signal conditioning circuits, thus simplifying the hardware design of the temperature control module.

[0056] Specifically, the power supply unit 100 is used to supply power to the network communication unit 106, the multi-channel temperature acquisition unit 101 and the processing chip unit 102. The power supply unit 100 provides the required operating voltage to each unit inside the temperature control module to ensure that each unit operates normally.

[0057] In this embodiment, the power supply unit 100 includes a DC 24V power interface for connecting an external DC 24V power supply.

[0058] In this embodiment, the power supply unit 100 further includes an isolation circuit, which is connected in series on the power supply path between the DC 24V power interface and the multi-channel temperature acquisition unit 101.

[0059] It should be noted that the isolation circuit electrically isolates the power input from the 24V DC power interface from the power supply of the multi-channel temperature acquisition unit 101, preventing common-mode interference, surges, or ground loop noise that may exist on the external power busbar from being conducted to the multi-channel temperature acquisition unit 101 through the power supply path.

[0060] It should also be noted that the temperature feedback signal output by the thermocouple is a millivolt-level voltage signal, which is extremely sensitive to power supply noise. The isolation circuit can effectively suppress interference coupling from the power supply path, ensuring the accuracy of the temperature feedback signal acquisition. At the same time, the isolation circuit isolates the multi-channel temperature acquisition unit 101 from the network communication unit 106 and the processing chip unit 102, cutting off the potential interference propagation path through the common ground loop, further improving the anti-interference capability and stability of the entire temperature control module.

[0061] In this embodiment, the temperature control module further includes a status display unit 103, which includes a running indicator light and a communication indicator light. The running indicator light is used to indicate the operating status of the temperature control module, and the communication indicator light is used to indicate the communication status of the network communication unit 106.

[0062] Specifically, the status display unit 103 provides visual feedback on the working status of the temperature control module to the operator through the operation indicator and communication indicator.

[0063] The operation indicator light clearly shows whether the temperature control module is powered on and in normal working condition, while the communication indicator light clearly shows whether the network communication unit 106 has established a valid connection with the external industrial network and is exchanging data. In actual working scenarios, when troubleshooting a single temperature control module among many others, operators do not need to check the online status of each module individually through the host computer software. They can quickly locate the faulty module simply by using the status display unit 103, improving the efficiency of equipment debugging and fault diagnosis. Furthermore, the operation indicator light and the communication indicator light independently indicate different functional states, avoiding confusion caused by a single indicator light carrying multiple types of information. This allows operators to accurately determine whether the temperature control module is currently operating normally based on the on / off or flashing status of the operation indicator light, and to accurately determine whether the temperature control module is communicating normally based on the on / off or flashing status of the communication indicator light.

[0064] Accordingly, the present invention also provides a temperature control method for the temperature control module provided by the present invention. Wherein, Figure 2 This is a flowchart of the steps corresponding to one embodiment of the temperature control method of the present invention.

[0065] Step S1: Power is supplied to the network communication unit, the multi-channel temperature acquisition unit, and the processing chip unit through the power supply unit; Step S2: Receive input data from an external industrial network via the network communication unit; Step S3: Acquire the temperature feedback signal of the external heating element through the multi-channel temperature acquisition unit; Step S4: Transmit the temperature feedback signal to the processing chip unit; Step S5: The processing chip unit executes a proportional-integral-derivative control algorithm based on the temperature feedback signal to generate a control output signal to control the external heating element; Step S6: Send control output signals to the external industrial network through the network communication unit.

[0066] To make the above-mentioned objects, features and advantages of the embodiments of the present invention more apparent and understandable, the following description is provided in conjunction with the accompanying drawings. Figure 1 Specific embodiments of the present invention will be described in detail below.

[0067] Step S1: Power is supplied to the network communication unit 106, the multi-channel temperature acquisition unit 101, and the processing chip unit 102 through the power supply unit 100.

[0068] Specifically, step S1 is the initial step in the temperature control method and the basis for all subsequent steps. After the temperature control module is connected to an external 24V DC power supply, the power supply unit 100 begins to provide the required operating voltage to the network communication unit 106, the multi-channel temperature acquisition unit 101, and the processing chip unit 102.

[0069] The power supply unit 100 provides power to the three functional units synchronously and in parallel. That is, after the power supply unit 100 is powered on, the network communication unit 106, the multi-channel temperature acquisition unit 101, and the processing chip unit 102 enter the working state almost simultaneously. At the same time, the isolated power supply provided by the power supply unit 100 to the multi-channel temperature acquisition unit 101 cuts off the transmission path of common-mode interference and ground loop noise that may exist on the external power busbar to the temperature acquisition circuit at the power supply head level, ensuring the acquisition accuracy of the temperature feedback signal in the subsequent step S3.

[0070] Step S2: Receive input data from an external industrial network through the network communication unit 106.

[0071] Step S2 can begin after the power supply unit 100 has completed powering each unit. The input data from the external industrial network includes start commands and self-tuning commands issued by the host computer. This input data is received via the network input interface of the network communication unit 106 and then transmitted to the processing chip unit 102.

[0072] It is important to note that step S2 is not executed only once when the temperature control method is started. Throughout the operation of the temperature control module, the network communication unit 106 continuously monitors data frames on the external industrial network. Once a new instruction is received from the host computer, the instruction data is immediately transmitted to the corresponding subunit within the processing chip unit 102 for processing. For example, during the continuous operation of the closed-loop control cycle formed by steps S3 to S6, the host computer can send a self-tuning instruction for a specified temperature acquisition channel at any time through the external industrial network. Step S2 can complete the receiving action within the current communication cycle when the network communication unit 106 receives the self-tuning instruction and transmit the self-tuning instruction to the parameter tuning subunit in the processing chip unit 102. The parameter tuning subunit then starts the parameter tuning process without affecting the normal operation of other channels that are performing proportional-integral-derivative control. Therefore, it can be seen that the closed-loop control cycle consisting of steps S2 and S3 to S6 is executed in parallel. For this reason, the data receiving action of the network communication unit 106, the acquisition action of the multi-channel temperature acquisition unit 101, and the calculation action of the processing chip unit 102 can be performed simultaneously.

[0073] In this embodiment, the network communication unit 106 is an industrial Ethernet communication unit, which includes a network input interface and a network output interface. In step S2, input data from the external industrial network is received through the network input interface, while in the subsequent step S6, output data is sent through the network output interface. The network input interface and the network output interface are independent of each other, so that receiving and sending are physically separated. The receiving operation in step S2 and the sending operation in step S6 can be performed simultaneously within the same communication cycle without conflict, thereby improving the communication efficiency between the temperature control module and the external industrial network and ensuring that the real-time reporting of temperature feedback signals and control output signals is not affected by the command receiving process.

[0074] Step S3: Collect the temperature feedback signal of the external heating element through the multi-channel temperature acquisition unit 101.

[0075] The multi-channel temperature acquisition unit 101 acquires temperature signals from the external heating element. Specifically, the temperature sensor attached to or adjacent to the external heating element converts the actual temperature of the external heating element into a temperature feedback signal, which is then connected to the temperature control module via the multi-channel temperature acquisition unit 101.

[0076] The multi-channel temperature acquisition unit 101 synchronously acquires the temperature feedback signals of multiple external heating elements. This means that multiple temperature acquisition channels complete the acquisition of their respective external heating element temperature feedback signals in parallel within the same sampling period, rather than through time-division multiplexing. This synchronous acquisition method ensures that there is no time deviation between the multiple temperature feedback signals acquired at the same moment. When the processing chip unit 102 executes the proportional-integral-derivative control algorithm based on this time-aligned temperature feedback signal in subsequent step S5, the control decisions of each channel are based on the actual system state at the same moment, avoiding the situation where some channels lag due to different sampling times.

[0077] In this embodiment, the multi-channel temperature acquisition unit 101 is equipped with a first multi-core connector and a second multi-core connector. The temperature feedback signals from multiple external heating elements are divided into two groups, which are respectively connected to the multi-channel temperature acquisition unit 101 through the first multi-core connector and the second multi-core connector. The regional access method of the first multi-core connector and the second multi-core connector allows the cables of the external temperature sensors to be flexibly grouped according to the actual layout, reducing the difficulty of wiring.

[0078] As an example, the multi-channel temperature acquisition unit 101 is a multi-channel thermocouple temperature acquisition unit. The temperature feedback signal is acquired via thermocouples, and the multi-channel thermocouple temperature acquisition unit is configured with 24 temperature acquisition channels. During step S3, the 24 temperature acquisition channels simultaneously acquire the temperature feedback signals of the external heating elements detected by each of the 24 thermocouples. A single temperature control module can acquire the temperature status information of the 24 external heating elements in a single acquisition, providing complete temperature input data for the parallel proportional-integral-derivative control of the 24 external heating elements in the subsequent step S5.

[0079] Step S4: Transmit the temperature feedback signal to the processing chip unit 102.

[0080] It should be noted that step S4 is executed immediately after step S3. After the multi-channel temperature acquisition unit 101 completes the acquisition of temperature feedback signals for the sampling period, it transmits the acquired multi-channel temperature feedback signals to the processing chip unit 102 through the electrical connection between the multi-channel temperature acquisition unit 101 and the processing chip unit 102. Since the multi-channel temperature acquisition unit 101 and the processing chip unit 102 are integrated inside the same temperature control module, the signal transmission path between them is short, and there is no need to go through external cables or intermediate connectors. The noise and delay introduced during transmission are minimal, ensuring that the temperature feedback signal maintains the same signal-to-noise ratio and real-time performance as when it is transmitted to the processing chip unit 102.

[0081] The processing chip unit 102 acquires temperature feedback signals through the multi-channel temperature acquisition unit 101, and the processing chip unit 102 can focus on the execution of the proportional-integral-derivative control algorithm.

[0082] It should be noted that the forward loop of the closed-loop control is from step S3 to step S4 and then to step S5, and the reverse loop is from step S5 to the next sampling cycle depending on the thermal response of the external heating element and then to step S3. This cycle continues, and the processing chip unit 102 continuously adjusts the control output signal according to the latest temperature feedback signal, so that the temperature of the external heating element converges and stabilizes at the set temperature.

[0083] Step S5: The processing chip unit 102 executes a proportional-integral-derivative control algorithm based on the temperature feedback signal to generate a control output signal to control the external heating element.

[0084] After receiving multiple temperature feedback signals, the processing chip unit 102 executes a proportional-integral-derivative control algorithm for each temperature feedback signal. That is, it performs proportional, integral and derivative calculations on the control deviation in three dimensions, and synthesizes them to obtain the control quantity required to make the control deviation approach zero, and generates the corresponding control output signal accordingly.

[0085] Specifically, the proportional operation provides an adjustment amount proportional to the current temperature deviation, the integral operation provides an adjustment amount to eliminate steady-state error based on the cumulative temperature deviation over time, and the derivative operation provides an adjustment amount to suppress overshoot based on the changing trend of the temperature deviation. The three adjustment amounts are superimposed to form the final control output signal. After being output from the processing chip unit 102, the control output signal directly acts on the corresponding external heating element, adjusting the heating power of the external heating element so that the actual temperature of the external heating element converges towards the set temperature.

[0086] Step S6: Send control output signals to the external industrial network through the network communication unit 106.

[0087] Specifically, the processing chip unit 102 transmits the control output signal generated in step S5 to the network communication unit 106. The network communication unit 106 sends the control output signal to the external industrial network via its network output interface, so that the host computer connected to the external industrial network can receive and monitor the current status of the control output signal.

[0088] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A temperature control module for controlling the temperature of heated clothing in semiconductor devices, characterized in that, include: A network communication unit for data interaction with external industrial networks; A multi-channel temperature acquisition unit is used to acquire temperature feedback signals from an external heating element, which is the heating resistance wire in the heating garment. The processing chip unit is electrically connected to the network communication unit and the multi-channel temperature acquisition unit, respectively. The processing chip unit is configured to execute a proportional-integral-derivative control algorithm according to the temperature feedback signal and generate a control output signal for controlling the external heating element. The power supply unit is used to supply power to the network communication unit, the multi-channel temperature acquisition unit, and the processing chip.

2. The temperature control module as described in claim 1, characterized in that, The multi-channel temperature acquisition unit is a multi-channel thermocouple temperature acquisition unit, and the temperature feedback signal is acquired via the thermocouple.

3. The temperature control module as described in claim 1, characterized in that, The multi-channel temperature acquisition unit is equipped with a first multi-core connector and a second multi-core connector, which are used to provide access interfaces for the temperature feedback signal.

4. The temperature control module as described in claim 1, characterized in that, The power supply unit includes a 24-volt DC power interface for connecting to an external 24-volt DC power source.

5. The temperature control module as described in claim 4, characterized in that, The power supply unit further includes an isolation circuit, which is connected in series in the power supply path between the DC 24V power interface and the multi-channel temperature acquisition unit.

6. The temperature control module as described in claim 1, characterized in that, The network communication unit is an industrial Ethernet communication unit, which includes a network input interface and a network output interface. The network input interface is used to receive input data from an external industrial network, and the network output interface is used to send output data to an external industrial network.

7. The temperature control module as described in claim 1, characterized in that, The temperature control module also includes a status display unit, which includes a running indicator light and a communication indicator light. The running indicator light is used to indicate the operating status of the temperature control module, and the communication indicator light is used to indicate the communication status of the network communication unit.

8. The temperature control module as described in claim 1, characterized in that, The processing chip unit includes a parameter tuning subunit and a control subunit. The parameter tuning subunit is used to tune the parameters of the proportional-integral-derivative (PID) control algorithm according to the temperature feedback signal. The control subunit is used to execute the PID control algorithm according to the temperature feedback signal and generate the control output signal.

9. The temperature control module as described in claim 8, characterized in that, The control output signal is a pulse width modulation signal, which is used to adjust the heating power of the external heating element.

10. The temperature control module as described in claim 8, characterized in that, The parameter tuning subunit receives a self-tuning command via the network communication unit, and the control subunit receives a start command via the network communication unit.

11. A temperature control method for a temperature control module as described in any one of claims 1 to 10, characterized in that, include: The power supply unit supplies power to the network communication unit, the multi-channel temperature acquisition unit, and the processing chip unit. The network communication unit receives input data from an external industrial network. The temperature feedback signal of the external heating element is acquired through the multi-channel temperature acquisition unit; The temperature feedback signal is transmitted to the processing chip unit; The processing chip unit executes the proportional-integral-derivative control algorithm based on the temperature feedback signal to generate the control output signal, thereby controlling the external heating element; The control output signal is sent to the external industrial network through the network communication unit.

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